JP2973293B2 - Terminal structure of flexible printed circuit board and method of manufacturing the terminal structure - Google Patents
Terminal structure of flexible printed circuit board and method of manufacturing the terminal structureInfo
- Publication number
- JP2973293B2 JP2973293B2 JP8355644A JP35564496A JP2973293B2 JP 2973293 B2 JP2973293 B2 JP 2973293B2 JP 8355644 A JP8355644 A JP 8355644A JP 35564496 A JP35564496 A JP 35564496A JP 2973293 B2 JP2973293 B2 JP 2973293B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- flexible printed
- insulating film
- printed circuit
- metal terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title description 10
- 229910052751 metal Inorganic materials 0.000 claims description 56
- 239000002184 metal Substances 0.000 claims description 56
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 229920001169 thermoplastic Polymers 0.000 claims description 13
- 239000004416 thermosoftening plastic Substances 0.000 claims description 13
- 229920003002 synthetic resin Polymers 0.000 claims description 12
- 239000000057 synthetic resin Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000012943 hotmelt Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 10
- 239000011888 foil Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000005555 metalworking Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Insulated Conductors (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、熱可塑性絶縁フィ
ルム上に導電パターンを形成してなるフレキシブルプリ
ント基板の端子構造及び該端子構造の製造方法に関する
ものである。The present invention relates to a terminal structure of a flexible printed circuit board having a conductive pattern formed on a thermoplastic insulating film, and a method of manufacturing the terminal structure.
【０００２】[0002]
【従来の技術】近年電子機器に使用される電子部品は、
小型化及び薄型化が進んでおり、該電子部品の小型化及
び薄型化を進める上で、フレキシブルプリント基板は空
間の有効利用という点で極めて有用であることから多く
利用されている。2. Description of the Related Art In recent years, electronic components used in electronic devices include:
The miniaturization and thinning of the electronic components have been progressing, and the flexible printed circuit boards have been widely used in promoting the miniaturization and thinning of the electronic components because they are extremely useful in terms of effective use of space.
【０００３】即ちフレキシブルプリント基板は、メンブ
レンスイッチの構成部材として或いはフラットケーブル
の構成部材等に多く利用されている。That is, the flexible printed circuit board is widely used as a component of a membrane switch or a component of a flat cable.
【０００４】上記フレキシブルプリント基板は、所謂絶
縁フィルム上に導電体パターンを形成したものである
が、一般に使用されているフレキシブルプリント基板と
しては下記のようなものがある。The above-mentioned flexible printed circuit board is formed by forming a conductor pattern on a so-called insulating film, and the following are generally used flexible printed circuit boards.
【０００５】ポリイミドフィルムに銅箔又はアルミニ
ウム箔を貼ってなる基板に、エッチング処理等を施して
導電パターンを形成したもの。A substrate in which a copper foil or an aluminum foil is attached to a polyimide film, and a conductive pattern is formed by performing an etching process or the like.
【０００６】ポリエステルの絶縁フィルム上に銀ペー
スト等の導電ペーストをスクリーン印刷して導電パター
ンを形成したもの。A conductive pattern formed by screen-printing a conductive paste such as a silver paste on a polyester insulating film.
【０００７】上記フレキシブルプリント基板の内、は
耐熱性の高いポリイミドフィルムに銅張りを施したもの
をエッチング処理し、導体パターンを形成して製造する
ため価格が非常に高くなるという欠点がある。そこで通
常安価な上記のポリエステルフィルムを用いたものが
使用されている。[0007] Among the above-mentioned flexible printed circuit boards, there is a drawback that the cost is extremely high because a polyimide film having high heat resistance and copper-clad is processed by etching to form a conductor pattern. Therefore, those using the above-mentioned inexpensive polyester film are usually used.
【０００８】上記のポリイミドフィルムを用いたフレ
キシブルプリント基板においては、ポリイミドフィルム
は耐熱性があるから、端子を形成する場合端子部の導電
パターンに端子となる金属端子片を直接半田付けするの
が一般的である。In a flexible printed circuit board using the above-mentioned polyimide film, since the polyimide film has heat resistance, when forming a terminal, it is general to directly solder a metal terminal piece serving as a terminal to a conductive pattern of the terminal portion. It is a target.
【０００９】[0009]
【発明が解決しようとする課題】しかしながら、安価な
ポリエステルフィルムは耐熱性が劣るから端子部の導電
パターンに金属端子片を直接半田付けすることができな
いので、該ポリエステルフィルムの端子部上に金属端子
片の一端をコネクタ等によって機械的に圧接固定する方
法などが用いられてきた。However, since inexpensive polyester films have poor heat resistance, metal terminal pieces cannot be directly soldered to the conductive patterns of the terminal portions. A method of mechanically pressing and fixing one end of a piece with a connector or the like has been used.
【００１０】しかしながら上記方法によってフレキシブ
ルプリント基板の端子部に金属端子片を固定する方法
は、コネクタ自体が大きい空間を占有することになり該
端子部の小型化薄型化が阻害され、またコネクタ自体も
高価であり、さらに該端子部にコネクタを用いて金属端
子片を圧接させる組み立て工程も煩雑であるという問題
点があった。However, the method of fixing a metal terminal piece to a terminal portion of a flexible printed circuit board by the above-described method requires the connector itself to occupy a large space, hindering the miniaturization and thinning of the terminal portion. There is a problem in that it is expensive and the assembly process of pressing the metal terminal pieces into contact with the terminal portion using a connector is also complicated.
【００１１】本発明は上述の点に鑑みてなされたもので
ありその目的は、薄型化が図れ、電気的接続の信頼性が
高く、機械的接続強度が高く、さらにその製造の容易な
フレキシブルプリント基板の端子構造及び該端子構造の
製造方法を提供することにある。The present invention has been made in view of the above points, and has as its object to provide a flexible print which can be made thin, has high reliability of electrical connection, has high mechanical connection strength, and is easy to manufacture. An object of the present invention is to provide a terminal structure of a substrate and a method of manufacturing the terminal structure.
【００１２】[0012]
【課題を解決するための手段】上記問題点を解決するた
め本発明は、熱可塑性合成樹脂からなる絶縁フィルム上
に所定形状の導電パターンを形成してなるフレキシブル
プリント基板と、該フレキシブルプリント基板を構成す
る絶縁フィルムの端子部の導電パターン上に導電性接着
剤層を介して接続され、かつ所定寸法端子部から外部に
突出した金属端子片と、該金属端子片の上から端子部に
載置された前記絶縁フィルムと同質の熱可塑性合成樹脂
の端子固定用フィルムとからなり、前記金属端子片が位
置する部分を除く所定部分の前記絶縁フィルムと前記端
子固定用フィルムとが超音波熱溶着され、該金属端子片
を絶縁フィルムと端子固定用フィルムとの間に挟持固定
することによってフレキシブルプリント基板の端子構造
を構成した。また本発明は、熱可塑性合成樹脂からなる
絶縁フィルム上に所定形状の導電パターンを形成してな
るフレキシブルプリント基板と、金属端子片と、ホット
メルトタイプの導電性接着剤と、前記絶縁フィルムと同
質の熱可塑性合成樹脂からなる端子固定用フィルムとを
用意し、前記フレキシブルプリント基板の端子部の導電
パターン上に前記ホットメルトタイプの導電性接着剤に
よって導電性接着剤層を形成し、その上に前記金属端子
片を端子部から所定寸法外部に突出させた状態で載置す
る工程と、前記金属端子片の上から端子部に前記端子固
定用フィルムを載置する工程と、前記金属端子片が位置
する部分を除く所定部分の前記端子固定用フイルム上に
超音波発射用のホーンを当接してホーンより超音波を発
射することで、絶縁フィルムと端子固定用フィルムのホ
ーンが当接している部分を局部的に超音波熱溶着して金
属端子片を絶縁フィルムと端子固定用フィルムの間に挟
持する工程と、前記導電性接着剤層を加熱して溶かして
金属端子片と端子部の導電パターンとを電気的及び機械
的に接続せしめる工程とによってフレキシブルプリント
基板の端子構造の製造方法を構成した。Means for Solving the Problems The present invention for solving the above problems, a flexible printed circuit board obtained by forming a conductive pattern having a predetermined shape on an insulating film made of a thermoplastic synthetic resin, the flexible printed circuit board Conductive bonding on the conductive pattern of the terminal of the insulating film to be composed
Connected through the agent layer
A protruding metal terminal piece and a terminal portion from above the metal terminal piece
Placed on said composed of a dielectric film and terminal fixing film of homogeneous thermoplastic synthetic resin, and the insulating film of a predetermined portion excluding the portion where the metal terminal pieces are located with the terminal fixing film ultrasonic heat is welded, clamped fixing the metal terminal pieces between the insulating film and the terminal fixing film
Thus, the terminal structure of the flexible printed circuit board was formed. Further, the present invention provides a flexible printed circuit board formed by forming a conductive pattern of a predetermined shape on an insulating film made of a thermoplastic synthetic resin, a metal terminal piece, a hot-melt type conductive adhesive, and the same material as the insulating film. Prepare a terminal fixing film made of a thermoplastic synthetic resin of the above, on the conductive pattern of the terminal portion of the flexible printed board on the hot melt type conductive adhesive
Therefore, a conductive adhesive layer is formed, and the metal terminal piece is placed on the conductive adhesive layer in such a manner that the metal terminal piece protrudes outside a predetermined dimension from the terminal portion .
That step and a step of placing the terminal fixing film to the terminal portions from above of the metal terminal pieces to said terminal fixing on the film of a predetermined portion excluding the portion where the metal terminal pieces are located
Ultrasonic waves are emitted from the horn by contacting the horn for ultrasonic emission
The film between the insulating film and the terminal fixing film.
A step of locally ultrasonically welding a portion in contact with the electrode to sandwich the metal terminal piece between the insulating film and the terminal fixing film, and heating the conductive adhesive layer. Melting and melting the metal terminal piece and the conductive pattern of the terminal portion electrically and mechanically to form a method for manufacturing a terminal structure of a flexible printed circuit board.
【００１３】[0013]
【発明の実施の形態】以下、本発明の一実施例を図面に
基づいて説明する。第１図は本発明に係るフレキシブル
プリント基板の端子構造を示す図で、同図（ａ）は一部
平面図、同図（ｂ）は同図（ａ）のＡ−Ａ線上断面拡大
矢視図、同図（ｃ）は同図（ａ）のＢ−Ｂ線上断面拡大
矢視図、同図（ｄ）は同図（ｃ）のＤ部分の拡大図であ
る。また、第２図はフレキシブルプリント基板の製造方
法を説明するための図、第３図は金属端子片、第４図は
端子固定用フィルムを示す平面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a view showing a terminal structure of a flexible printed circuit board according to the present invention. FIG. 1 (a) is a partial plan view, and FIG. 1 (b) is an enlarged cross-sectional view taken along line AA of FIG. FIG. 3C is an enlarged cross-sectional view taken along the line BB in FIG. 3A, and FIG. 3D is an enlarged view of a portion D in FIG. 3C. FIG. 2 is a view for explaining a method of manufacturing a flexible printed circuit board, FIG. 3 is a plan view showing a metal terminal piece, and FIG. 4 is a plan view showing a terminal fixing film.
【００１４】第２図に示すように、フレキシブルプリン
ト基板１１は、ポリエステル等の熱可塑性合成樹脂の絶
縁フィルム１２上に銅又はアルミニウム等の金属箔１３
ａを接着剤で接着し、次に、該金属箔１３ａをエッチン
グ処理して、導電パターン１３を形成する。このエッチ
ング処理の方法としては、例えば金属箔１３ａ上に形成
する導電パターン１３の形状に炭素ペーストを塗布し、
該炭素ペーストが塗布されない部分を化学的処理により
除去して、導電パターン１３を形成する。As shown in FIG. 2, a flexible printed circuit board 11 is provided on an insulating film 12 of a thermoplastic synthetic resin such as polyester on a metal foil 13 such as copper or aluminum.
a is adhered with an adhesive, and then the metal foil 13a is etched to form the conductive pattern 13. As a method of this etching treatment, for example, a carbon paste is applied to the shape of the conductive pattern 13 formed on the metal foil 13a,
A portion to which the carbon paste is not applied is removed by a chemical treatment to form a conductive pattern 13.
【００１５】なお、金属箔１３ａの形成は、絶縁フィル
ム１２の上に真空蒸着等により形成してもよい。The metal foil 13a may be formed on the insulating film 12 by vacuum evaporation or the like.
【００１６】本発明に係るフレキシブルプリント基板の
端子構造は、第１図（ａ）乃至（ｄ）に示すように、絶
縁フィルム１２の端子部１４に形成された導電パターン
１３上に、ホットメルトタイプの導電性接着剤層１６を
形成して金属端子片１７を載置し、その上からポリエス
テル等の絶縁フィルム１２と同質の熱可塑性合成樹脂材
の端子固定用フィルム１８を載置し、該端子部１４の金
属端子片１７の位置する部分以外の所定部分に絶縁フィ
ルム１２と端子固定用フィルム１８の溶着部１９を形成
して金属端子片１７を絶縁フィルム１２と端子固定用フ
ィルム１８の間に挟み込む。その後導電性接着剤層１６
を溶かし金属端子片１７と端子部１４の導電パターン１
３とを接続する。以下、上記フレキシブル基板の端子構
造の製造方法を詳細に説明する。As shown in FIGS. 1 (a) to 1 (d), a terminal structure of a flexible printed board according to the present invention is formed on a conductive pattern 13 formed on a terminal portion 14 of an insulating film 12 by a hot melt type. And a metal terminal strip 17 is placed thereon, and a terminal fixing film 18 of a thermoplastic synthetic resin material of the same quality as the insulating film 12 such as polyester is placed thereon. A welding portion 19 of the insulating film 12 and the terminal fixing film 18 is formed on a predetermined portion of the portion 14 other than the portion where the metal terminal piece 17 is located, and the metal terminal piece 17 is placed between the insulating film 12 and the terminal fixing film 18. Pinch it. Then, the conductive adhesive layer 16
Of the metal terminal strip 17 and the conductive pattern 1 of the terminal portion 14
3 is connected. Hereinafter, a method for manufacturing the terminal structure of the flexible substrate will be described in detail.
【００１７】金属端子片１７は、第３図に示すように板
金加工で複数の金属端子片１７を基材２０と一体的に形
成する。金属端子片１７の両側縁には複数の凸部１７ａ
が形成されている。なお、上記例の該凸部１７ａは金属
端子片１７の両側縁に複数個形成したが片側縁でも良
く、又凸部の個数も複数である必要がなく一個でもよ
い。As shown in FIG. 3, a plurality of metal terminal pieces 17 are formed integrally with the base material 20 by sheet metal working. A plurality of protrusions 17a are provided on both side edges of the metal terminal piece 17.
Are formed. In the above example, a plurality of convex portions 17a are formed on both side edges of the metal terminal piece 17, but may be one side edge, and the number of convex portions need not be plural, and may be one.
【００１８】端子固定用フィルム１８は第４図に示すよ
うに、ポリエステル等の絶縁フィルム１２と同質の熱可
塑性合成樹脂材のフィルムでその幅寸法ｌ1はフレキシ
ブルプリント基板１１の幅寸法ｌ3と略等しく、その長
さ寸法ｌ2はフレキシブルプリント基板１１の端子部１
４の長さ寸法ｌ4より若干大きく形成されている。な
お、固定端子用フィルム１８の寸法は上記寸法に限定さ
れるものではなく、例えば幅寸法ｌ1を上記以上大きく
し絶縁フィルム１２と端子固定用フィルム１８を溶着
後、端子部１４をはみ出た部分を切断除去してもよい。As shown in FIG. 4, the terminal fixing film 18 is made of a thermoplastic synthetic resin material of the same quality as the insulating film 12 of polyester or the like, and its width l 1 is equal to the width l 3 of the flexible printed board 11. The length l 2 is substantially equal to that of the terminal 1 of the flexible printed circuit board 11.
4 is slightly larger than the length l 4 of the. Note that the dimensions of the fixed terminal film 18 are not limited to the above dimensions. For example, the width dimension l 1 is made larger than the above, the insulating film 12 and the terminal fixing film 18 are welded, and then the portion of the terminal portion 14 protruding. May be cut and removed.
【００１９】そして上記フレキシブルプリント基板１１
の端子部１４の導電パターン１３にホットメルトタイプ
の導電性接着剤を印刷して導電性接着剤層１６を形成す
ると共に、該導電性接着剤層１６を加熱乾燥させる。The flexible printed circuit board 11
A hot-melt type conductive adhesive is printed on the conductive pattern 13 of the terminal portion 14 to form a conductive adhesive layer 16 and the conductive adhesive layer 16 is dried by heating.
【００２０】次に、第５図に示すように金属製の台２１
の上に端子部１４の導電パターン１３に導電性接着剤層
１６を形成した絶縁フィルム１２を載置し、該導電パタ
ーン１３の上に前記基材２０と一体的に形成された金属
端子片１７を載置し、さらにその上に端子固定用フィル
ム１８を載置する。この状態で超音波発射用のホーン２
２を端子固定用フィルム１８に載置する。ここでホーン
２２の先端は図示するように、端子部１４の金属端子片
１７が位置する部分以外の端子固定用フィルム１８上に
当るように凸部２２ａが形成されており、該凸部２２ａ
を金属端子片１７が位置する部分以外の端子固定用フィ
ルム１８上に当接し、ホーン２２より超音波を発射し、
凸部２２ａの位置する部分の絶縁フィルム１２と端子固
定用フィルム１８が超音波加熱により局部的に溶融す
る。ここで絶縁フィルム１２と端子固定用フィルム１８
は熱可塑性合成樹脂からなるフィルムであるから、両者
は溶着する。これにより第１図（ａ）に示すように端子
部１４の金属端子片１７が位置する部分以外の所定位置
に溶着部１９が形成されると共に、ホーン２２の凹部が
位置する端子固定用フィルム１８も溶融し、その冷却に
よる収縮力により金属端子片１７が絶縁フィルム１２と
端子固定用フィルム１８の間に強固に挟持されることに
なる。この時金属端子片１７の両縁に形成された凸部１
７ａは上記溶着部１９に係合するから、金属端子片１７
を引っ張っても金属端子片１７は容易に脱着しない。Next, as shown in FIG.
The insulating film 12 in which the conductive adhesive layer 16 is formed on the conductive pattern 13 of the terminal portion 14 is mounted on the conductive pattern 13, and the metal terminal piece 17 formed integrally with the base material 20 on the conductive pattern 13. Is mounted, and a terminal fixing film 18 is further mounted thereon. In this state, horn 2 for ultrasonic emission
2 is placed on the terminal fixing film 18. Here, as shown in the drawing, the tip of the horn 22 is formed with a convex portion 22a so as to hit the terminal fixing film 18 other than the portion where the metal terminal piece 17 of the terminal portion 14 is located.
Abuts on the terminal fixing film 18 other than the portion where the metal terminal piece 17 is located, emits ultrasonic waves from the horn 22,
The insulating film 12 and the terminal fixing film 18 at the portion where the convex portion 22a is located are locally melted by ultrasonic heating. Here, the insulating film 12 and the terminal fixing film 18
Is a film made of a thermoplastic synthetic resin, and both are welded. Thus, as shown in FIG. 1 (a), a welded portion 19 is formed at a predetermined position other than the portion where the metal terminal piece 17 of the terminal portion 14 is located, and the terminal fixing film 18 at which the concave portion of the horn 22 is located. The metal terminal piece 17 is firmly held between the insulating film 12 and the terminal fixing film 18 by the shrinkage due to the cooling. At this time, the protrusions 1 formed on both edges of the metal terminal piece 17 are formed.
7a is engaged with the welding portion 19, so that the metal terminal piece 17
Is not easily detached.
【００２１】上記の如く絶縁フィルム１２の端子部１４
に端子固定用フィルム１８を溶着し、金属端子片１７を
固定したものを第６図に示すように台２３の上に載置
し、その上から所定温度に加熱した加熱コテ２４を当圧
させると導電性接着剤層１６のホットメルトタイプの導
電性接着剤が溶け、金属端子片１７と端子部１４の導電
パターン１３とが電気的及び機械的に接続されると共
に、隣接する端子間は既に溶着された絶縁フィルム１２
と端子固定用フィルム１８により隔離されているため、
金属端子片１７と１７は導電性接着剤により短絡される
ことがない。As described above, the terminal portion 14 of the insulating film 12
The terminal fixing film 18 is welded to the metal terminal pieces 17 and the metal terminal pieces 17 are fixed on the base 23 as shown in FIG. 6, and a heating iron 24 heated to a predetermined temperature is pressed against the base 23. And the hot-melt type conductive adhesive of the conductive adhesive layer 16 is melted, and the metal terminal strip 17 and the conductive pattern 13 of the terminal portion 14 are electrically and mechanically connected. Welded insulation film 12
And the terminal fixing film 18,
The metal terminal pieces 17 and 17 are not short-circuited by the conductive adhesive.
【００２２】最後に、金属端子片１７を第３図のＥ−Ｅ
線上で切断し、基材２０を除去する。これにより金属端
子片１７はそれぞれ個々に分離され、その先端が絶縁フ
ィルム１２の端子部１４より所定寸法外部に突出した構
造の本発明に係るフレキシブルプリント基板の端子構造
が完成する。Finally, the metal terminal piece 17 is connected to the EE of FIG.
Cutting is performed on the line, and the substrate 20 is removed. Thereby, the metal terminal strips 17 are individually separated from each other, and the terminal structure of the flexible printed circuit board according to the present invention having the structure in which the tip protrudes outside the terminal section 14 of the insulating film 12 by a predetermined dimension is completed.
【００２３】なお、上記例では導電性接着剤層１６を端
子部１４の導電パターン１３の上だけに形成したが、導
電性接着剤層を金属端子片１７の導電パターン１３に接
続する部分にも形成し、上記の如くこれら導電性接着剤
層のホットメルトタイプ導電性接着剤を溶かすようにす
れば接着強度はより強力となる。In the above example, the conductive adhesive layer 16 is formed only on the conductive pattern 13 of the terminal portion 14. However, the conductive adhesive layer 16 is also formed on the portion of the metal terminal piece 17 connected to the conductive pattern 13. If formed, the hot melt type conductive adhesive of these conductive adhesive layers is dissolved as described above, so that the bonding strength becomes stronger.
【００２４】また、金属端子片１７の縁部に形成する凸
部１７ａは溶着部１９に係合し、引っ張り強度を増加さ
せる作用を有するが、この凸部１７ａは必ずしも必要な
ものではなく、引っ張り強度をある程度犠牲にすればな
くてもよい。とくに、金属端子片１７と導電パターン１
３の間をホットメルトタイプの導電性接着剤で接続する
場合は、凸部１７ａを形成しなくとも引っ張り強度はそ
れ程犠牲にならない。The convex portion 17a formed on the edge of the metal terminal piece 17 engages with the welded portion 19 to increase the tensile strength. However, the convex portion 17a is not always necessary. The strength need not be sacrificed to some extent. In particular, the metal terminal strip 17 and the conductive pattern 1
In the case where the connection between the members 3 is made by a hot-melt type conductive adhesive, the tensile strength is not sacrificed so much without forming the projections 17a.
【００２５】[0025]
【００２６】上記のように導電パターン１３は、金属箔
１３ａをエッチング処理にて所定形状に形成したもので
あるから、銀ペースト等の導電ペーストを印刷して導電
体パターンを形成した場合に比較して、その導電率が良
く、従って電流容量を大きくできる。As described above, since the conductive pattern 13 is formed by etching the metal foil 13a into a predetermined shape, it is compared with a case where a conductive pattern is formed by printing a conductive paste such as a silver paste. As a result, the conductivity is good, so that the current capacity can be increased.
【００２７】[0027]
【発明の効果】以上説明したように本発明によれば、端
子部の小型化薄型化が図れるにもかかわらず、その機械
的強度を強くでき、また電気的接続の信頼性を高くでき
るばかりか、安価であり、さらにその製造も容易且つ確
実に行えるという優れた効果を奏する。As described above, according to the present invention, not only the mechanical strength and the reliability of the electrical connection can be enhanced, but the terminal can be reduced in size and thickness. It is advantageous in that it is inexpensive and can be manufactured easily and reliably.
【図１】本発明に係るフレキシブルプリント基板の端子
構造を示す図で、同図（ａ）は一部平面図、同図（ｂ）
は同図（ａ）のＡ−Ａ線上断面拡大矢視図、同図（ｃ）
は同図（ａ）のＢ−Ｂ線上断面拡大矢視図、同図（ｄ）
は同図（ｃ）のＤ部分の拡大図である。FIG. 1 is a view showing a terminal structure of a flexible printed board according to the present invention, wherein FIG. 1 (a) is a partial plan view and FIG.
Is an enlarged cross-sectional view taken along the line AA in FIG.
Is an enlarged cross-sectional view taken along the line BB in FIG.
FIG. 4 is an enlarged view of a portion D in FIG.
【図２】フレキシブルプリント基板の製造方法を説明す
るための図である。FIG. 2 is a diagram for explaining a method of manufacturing a flexible printed circuit board.
【図３】金属端子片を示す平面図である。FIG. 3 is a plan view showing a metal terminal piece.
【図４】端子固定用フィルムを示す平面図である。FIG. 4 is a plan view showing a terminal fixing film.
【図５】フレキシブルプリント基板の端子構造の製造方
法を説明するための図である。FIG. 5 is a diagram illustrating a method for manufacturing a terminal structure of a flexible printed circuit board.
【図６】フレキシブルプリント基板の端子構造の製造方
法を説明するための図である。FIG. 6 is a diagram illustrating a method for manufacturing a terminal structure of a flexible printed circuit board.
１１ フレキシブルプリント基板 １２ 絶縁フィルム １３ 導電パターン １４ 端子部 １５ 絶縁被膜 １６ 導電性接着剤層 １７ 金属端子片 １８ 端子固定用フィルム １９ 溶着部 DESCRIPTION OF SYMBOLS 11 Flexible printed circuit board 12 Insulating film 13 Conductive pattern 14 Terminal part 15 Insulating coating 16 Conductive adhesive layer 17 Metal terminal piece 18 Terminal fixing film 19 Welding part
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H01R 9/00 - 9/09 H01R 7/08 H05K 1/11 - 1/14 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) H01R 9/00-9/09 H01R 7/08 H05K 1/11-1/14
Claims (2)
上に所定形状の導電パターンを形成してなるフレキシブ
ルプリント基板と、 該フレキシブルプリント基板を構成する絶縁フィルムの
端子部の導電パターン上に導電性接着剤層を介して接続
され、かつ所定寸法端子部から外部に突出した金属端子
片と、 該金属端子片の上から端子部に載置された前記絶縁フィ
ルムと同質の熱可塑性合成樹脂の端子固定用フィルムと
からなり、 前記金属端子片が位置する部分を除く所定部分の前記絶
縁フィルムと前記端子固定用フィルムとが超音波熱溶着
され、該金属端子片を絶縁フィルムと端子固定用フィル
ムとの間に挟持固定してなることを特徴とするフレキシ
ブルプリント基板の端子構造。1. A flexible printed circuit board obtained by forming a conductive pattern having a predetermined shape on an insulating film made of a thermoplastic synthetic resin, electrically conductive on the conductive pattern of the terminal portion of the insulating film constituting the flexible printed circuit board bonded Connect via agent layer
Metal terminal
A strip, and the terminal fixing film of a thermoplastic synthetic resin of the insulating film and the same quality, which is placed on the terminal portions from the top of the metal terminal pieces
A predetermined portion of the insulating film and the terminal fixing film except for a portion where the metal terminal piece is located are ultrasonically heat-welded.
Is, the terminal structure of a flexible printed circuit board, characterized by comprising sandwiched and fixed between the said metal terminal pieces insulating film and the terminal fixing film.
上に所定形状の導電パターンを形成してなるフレキシブ
ルプリント基板と、金属端子片と、ホットメルトタイプ
の導電性接着剤と、前記絶縁フィルムと同質の熱可塑性
合成樹脂からなる端子固定用フィルムとを用意し、 前記フレキシブルプリント基板の端子部の導電パターン
上に前記ホットメルトタイプの導電性接着剤によって導
電性接着剤層を形成し、その上に前記金属端子片を端子
部から所定寸法外部に突出させた状態で載置する工程
と、 前記金属端子片の上から端子部に前記端子固定用フィル
ムを載置する工程と、 前記金属端子片が位置する部分を除く所定部分の前記端
子固定用フイルム上に超音波発射用のホーンを当接して
ホーンより超音波を発射することで、絶縁フィルムと端
子固定用フィルムのホーンが当接している部分を局部的
に超音波熱溶着して金属端子片を絶縁フィルムと端子固
定用フィルムの間に挟持する工程と、 前記導電性接着剤層を加熱して溶かして金属端子片と端
子部の導電パターンとを電気的及び機械的に接続せしめ
る工程とを具備することを特徴とするフレキシブルプリ
ント基板の端子構造の製造方法。2. A flexible printed circuit board having a conductive pattern of a predetermined shape formed on an insulating film made of a thermoplastic synthetic resin, a metal terminal strip, a hot-melt type conductive adhesive, and the same material as the insulating film. A terminal fixing film made of a thermoplastic synthetic resin is prepared, and the conductive fixing adhesive is applied on the conductive pattern of the terminal portion of the flexible printed board by the hot melt type conductive adhesive.
Forming an electrically-conductive adhesive layer, and placing the metal terminal piece thereon in a state of protruding outside a predetermined dimension from the terminal part; and mounting the terminal fixing film on the terminal part from above the metal terminal piece. Placing, and the end of the predetermined portion excluding the portion where the metal terminal piece is located
Contact the horn for ultrasonic emission on the child fixing film
By emitting ultrasonic waves from the horn, the insulation film and the edge
The area where the horn of the child fixing film is in contact
A step of sandwiching the metal terminal piece between the insulating film and the terminal fixing film by ultrasonic thermal welding to the substrate; and heating and melting the conductive adhesive layer to electrically connect the metal terminal piece and the conductive pattern of the terminal portion. And a step of mechanically and mechanically connecting the terminal structure of the flexible printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8355644A JP2973293B2 (en) | 1996-12-24 | 1996-12-24 | Terminal structure of flexible printed circuit board and method of manufacturing the terminal structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8355644A JP2973293B2 (en) | 1996-12-24 | 1996-12-24 | Terminal structure of flexible printed circuit board and method of manufacturing the terminal structure |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63071239A Division JPH0821441B2 (en) | 1988-03-25 | 1988-03-25 | Flexible printed circuit board terminal structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09320662A JPH09320662A (en) | 1997-12-12 |
| JP2973293B2 true JP2973293B2 (en) | 1999-11-08 |
Family
ID=18445034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8355644A Expired - Lifetime JP2973293B2 (en) | 1996-12-24 | 1996-12-24 | Terminal structure of flexible printed circuit board and method of manufacturing the terminal structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2973293B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6449836B1 (en) | 1999-07-30 | 2002-09-17 | Denso Corporation | Method for interconnecting printed circuit boards and interconnection structure |
| US6598780B2 (en) | 1999-12-24 | 2003-07-29 | Denso Corporation | Method of connecting circuit boards |
| US6601754B2 (en) | 1999-12-24 | 2003-08-05 | Denso Corporation | Method of connecting circuit boards |
| US6527162B2 (en) | 2000-08-04 | 2003-03-04 | Denso Corporation | Connecting method and connecting structure of printed circuit boards |
| JP2003100371A (en) | 2001-09-19 | 2003-04-04 | Matsushita Electric Ind Co Ltd | Wiring board with terminal |
| JP2015233125A (en) * | 2014-05-13 | 2015-12-24 | Ａｍテクノワークス株式会社 | Structure for connecting flexible substrates with each other, method of connecting flexible substrates with each other, connection member for flexible substrate, structure for connecting flexible display substrates with each other, and method of connecting flexible display substrates with each other |
-
1996
- 1996-12-24 JP JP8355644A patent/JP2973293B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09320662A (en) | 1997-12-12 |
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