JPH069288B2 - Circuit board manufacturing method - Google Patents
Circuit board manufacturing methodInfo
- Publication number
- JPH069288B2 JPH069288B2 JP1080989A JP8098989A JPH069288B2 JP H069288 B2 JPH069288 B2 JP H069288B2 JP 1080989 A JP1080989 A JP 1080989A JP 8098989 A JP8098989 A JP 8098989A JP H069288 B2 JPH069288 B2 JP H069288B2
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- printed wiring
- comb
- conductive material
- shaped contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電気回路用基板への電子部品実装方法に関す
るものである。The present invention relates to a method for mounting electronic components on an electric circuit board.
電気回路用基板に、電子部品等の回路部品を取付けるた
めの従来構造としては、例えば特開昭60−４９６９８号
公報に示されるものがある。これは、電子部品を予め取
付けてなる絶縁性基板と、回路が構成されたフレキシブ
ルプリント配線板の双方を用意し、その絶縁性基板とフ
レキシブルプリント配線板とを、次工程で一体的に取付
けて、所望の電気回路用基板を構成するものである。As a conventional structure for mounting circuit components such as electronic components on an electric circuit board, there is, for example, one disclosed in Japanese Patent Laid-Open No. 60-49698. This is done by preparing both an insulating substrate with electronic parts attached beforehand and a flexible printed wiring board with a circuit, and then attaching the insulating substrate and the flexible printed wiring board integrally in the next step. , Which constitutes a desired electric circuit board.
ところが、このような従来の電気回路用基板の構成時に
あつては、絶縁性基板とフレキシブルプリント配線板と
の接続時に、絶縁性基板に予め取付けられていた電子部
品が脱落したり、あるいは絶縁性基板とフレキシブルプ
リント配線板との間で位置ずれが生じて、適正な接続が
できない等の問題があつた。However, when constructing such a conventional electric circuit board, when the insulating board and the flexible printed wiring board are connected, the electronic components previously attached to the insulating board may fall off, or There was a problem that a proper displacement could not be established due to a positional shift between the substrate and the flexible printed wiring board.
またフレキシブルプリント配線板にメンブレンスイツチ
を形成し、さらに回路部品としてＬＥＤを絶縁性基板に
取り付ける場合には、複数のフレキシブルプリント配線
板の相互において、また絶縁性基板とフレキシブルプリ
ント配線板との間で位置ずれが生じて適正な接続ができ
ない他、複数のフレキシブルプリント配線板同志の接続
が困難となる。さらに積層の厚さが増し、ＬＥＤの発光
が識別しにくくなる等の問題があり、実用性に欠けるも
のであつた。In addition, when a membrane switch is formed on the flexible printed wiring board and the LED is mounted on the insulating substrate as a circuit component, the plurality of flexible printed wiring boards are mutually connected or between the insulating substrate and the flexible printed wiring board. Misalignment occurs and proper connection cannot be made, and it becomes difficult to connect a plurality of flexible printed wiring boards. Further, there is a problem that the thickness of the laminated layer is increased and it becomes difficult to identify the light emission of the LED, which is not practical.
本発明は、かかることに鑑みてなされたもので、電子部
品１が挿入される埋設孔４を設けられた絶縁性基板３
に、電子部品１に設けられているリード２に接続される
回路パターン５およびメンブレンスイツチ６を構成する
クシ形接点部７をそれぞれ第１の折り曲げ部９ａを境に
同一面上に配して連なる第１、第２のフレキシブルプリ
ント配線板１０ａ、１０ｂを絶縁基性基板３に回路パタ
ーン５およびクシ形接点部７が外側に向くよう第１の折
り曲げ部９ａより折り曲げて、第１、第２のフレキシブ
ルプリント配線板１０ａ、１０ｂを巻回し、添着し、し
かる後にリード２と回路パターン５とを半田付けにより
接続し、さらにクシ形接点部７に接続して導通するメン
ブレンスイツチ６を形成するようクシ形接点部７に対応
する位置にカーボン接点等からなる導電材８を配した透
明プラスチック材で構成される表面操作板１１を添着す
ることにより、表面操作板１１の操作側より電子部品１
として設けられたＬＥＤの発光が明確に識別できるよう
にしたものである。また電子部品１が挿入される埋設孔
４を設けられた絶縁性基板３に、電子部品１に設けられ
ているリード２に接続される回路パターン５およびメン
ブレンスイツチ６を構成するクシ形接点部７、クシ形接
点部７に接触して導通させる導電材８をそれぞれ第１、
第２の折り曲げ部９ａ、 ９ｂを境に、クシ形接点部７
を中央部にして同一面上にそれぞれ配して連なり透明プ
ラスチック材で構成される第１、第２、第３のフレキシ
ブルプリント配線板１０ａ、 １０ｂ、１０ｃを、絶縁
性基板３に回路パターン５およびクシ形接点部７が外側
に向くよう第１の折り曲げ部９ａより折り曲げて第１、
第２のフレキシブルプリント配線板１０ａ、 １０ｂを
巻回し、添着さらに第２の折り曲げ部９ｂより導電材８
が内側に向くよう第３のフレキシブルプリント配線板１
０ｃを折り曲げクシ形接点部７と導電材８とが対向する
よう添着し、しかる後にリード２と回路パターン５とを
半田付けりより接続し、導電材８を配した第３のフレキ
シブルプリント配線板１０ｃの表面の操作側より電子部
品として設けられたＬＥＤの発光が明確に識別できるよ
うにしたものである。さらにまた表面操作板１１あるい
は第３のフレキシブルプリント配線板１０ｃのＬＥＤ１
２の実装部に対応する部位および導電材８の周辺を除き
シールドするものである。The present invention has been made in view of the above circumstances, and is an insulating substrate 3 provided with a buried hole 4 into which the electronic component 1 is inserted.
In addition, the circuit pattern 5 connected to the lead 2 provided in the electronic component 1 and the comb-shaped contact portion 7 forming the membrane switch 6 are arranged on the same plane with the first bent portion 9a as a boundary. The first and second flexible printed wiring boards 10a and 10b are bent on the insulating base substrate 3 from the first bent portion 9a so that the circuit pattern 5 and the comb-shaped contact portion 7 face outward. The flexible printed wiring boards 10a, 10b are wound and attached, and then the leads 2 and the circuit pattern 5 are connected by soldering, and further connected to the comb-shaped contact portion 7 to form a membrane switch 6 for conduction. By attaching a surface operation plate 11 made of a transparent plastic material in which a conductive material 8 made of a carbon contact or the like is arranged at a position corresponding to the shape contact portion 7, Electrons from the operating side of the operation plate 11 Parts 1
The light emission of the LED provided as is clearly identified. In addition, the insulating substrate 3 provided with the embedded hole 4 into which the electronic component 1 is inserted has a comb-shaped contact portion 7 constituting the circuit pattern 5 and the membrane switch 6 connected to the lead 2 provided in the electronic component 1. , The conductive material 8 which comes into contact with the comb-shaped contact portion 7 to conduct electricity,
With the second bent portions 9a, 9b as a boundary, the comb-shaped contact portion 7
The first, second, and third flexible printed wiring boards 10a, 10b, and 10c, which are made of transparent plastic material and are arranged continuously on the same plane with the central part of the circuit pattern 5 and the circuit pattern 5 and the insulating substrate 3, respectively. Bend from the first bent portion 9a so that the comb-shaped contact portion 7 faces outward,
The second flexible printed wiring boards 10a and 10b are wound and attached, and the conductive material 8 is attached from the second bent portion 9b.
The third flexible printed wiring board 1 so that the inside faces
0c is attached so that the bent comb-shaped contact portion 7 and the conductive material 8 face each other, and then the lead 2 and the circuit pattern 5 are connected by soldering, and the conductive material 8 is arranged on the third flexible printed wiring board. Light emitted from an LED provided as an electronic component can be clearly identified from the operation side of the surface of 10c. Furthermore, the LED 1 of the surface operation board 11 or the third flexible printed wiring board 10c
The shield is provided except for the portion corresponding to the mounting portion 2 and the periphery of the conductive material 8.
以下本発明を図面に示す実施例に基づいて詳細に説明す
る。Hereinafter, the present invention will be described in detail based on the embodiments shown in the drawings.
第１図において３はベークライト又はガラスス、ＥＰ等
からなり、しかも実装される電子部品１の厚さに等しい
か、それよりやや大なる厚さの絶縁性基板であつて、こ
の絶縁性基板３の上面には、両面粘着テープ２０を介し
てポリエステルフィルム２１を貼り合せ、次いでそのポ
リエステルフィルム２１の表面には接着剤層２２を介し
てセパレータ２３の添着する。かくして得られた絶縁性
基板３の所望位置に電子部品（チップ部品）１を埋設す
るための埋設孔４を第２図に示すように穿設する。埋設
孔４を穿設した板材の下面、即ち絶縁性基板３の下面に
は、第３図に示すようにその上面に添設したと同様の両
面粘着テープ２０′を介してポリエステルフィルム２
１′を貼り合せ、次に第３図に示す埋設孔４内に、リー
ド２を予め整形されている電子部品１を内装し、この電
子部品１を両面粘着テープ２０′の粘着面に粘着させ固
定する。次に第５図に示すように上記絶縁性基板３の上
面側に添着されているセパレータ２３を剥離した後、そ
の接着剤層２２の面に、予め作成されいる専用のフレキ
シブルプリント配線板１０を接着する。その専用フレキ
シブルプリント配線板１０は、第６図、第７図に示す如
く、フレキシブルプリント配線作製工程に基づいて所定
の回路を形成する回路パターン５は、これら回路パター
ン５に接続され、かつ電子部品１のリード２と接続し得
るランド１３を一端に形成している。このランド１３に
は、リード２が貫通されるリード用孔１４が設けられて
いる。また第６図においてはフレキシブルプリント配線
板に、切り込みを入れる等、中央が二つに折れ曲がり易
ように形成された第１の折り曲げ部９ａが設けられてお
り、この折り曲げ部９ａを介して、第１のフレキシブル
プリント配線板１０ａ、第２のフレキシブルプリント配
線板10bが一体に形成され、第１のフレキシブルプリン
ト配線板１０ａ、第２のフレキシブルプリント配線板１
０ｂの一シート面に回路パターン５が形成されている。
第２のフレキシブルプリント配線板10bにはクシ形接点
部７、回路パターン５を電源等に接続する接続部１９が
設けられている。クシ形接点部７は、二本の導線が互い
にクシ形に入り組んだ状態で近接されているもので、双
方同時にカーボン接点等からなる導電材８が接触するこ
とにより開成される。In FIG. 1, reference numeral 3 denotes an insulating substrate made of bakelite, glass, EP or the like and having a thickness equal to or slightly larger than the thickness of the electronic component 1 to be mounted. A polyester film 21 is attached to the upper surface via a double-sided adhesive tape 20, and then a separator 23 is attached to the surface of the polyester film 21 via an adhesive layer 22. An embedding hole 4 for embedding the electronic component (chip component) 1 is formed at a desired position of the insulating substrate 3 thus obtained as shown in FIG. On the lower surface of the plate material having the buried holes 4, that is, the lower surface of the insulating substrate 3, the polyester film 2 is provided through a double-sided adhesive tape 20 'similar to that attached to the upper surface thereof as shown in FIG.
1'is attached, and then an electronic component 1 having leads 2 preshaped is placed inside a buried hole 4 shown in FIG. 3, and the electronic component 1 is adhered to the adhesive surface of a double-sided adhesive tape 20 '. Fix it. Next, as shown in FIG. 5, after the separator 23 attached to the upper surface side of the insulating substrate 3 is peeled off, a dedicated flexible printed wiring board 10 prepared in advance is provided on the surface of the adhesive layer 22. To glue. As shown in FIG. 6 and FIG. 7, the dedicated flexible printed wiring board 10 has a circuit pattern 5 which forms a predetermined circuit based on the flexible printed wiring manufacturing process, and is connected to these circuit patterns 5 and electronic parts. A land 13 that can be connected to the lead 2 of No. 1 is formed at one end. The land 13 is provided with a lead hole 14 through which the lead 2 penetrates. Further, in FIG. 6, the flexible printed wiring board is provided with a first bent portion 9a which is formed so as to be easily bent in two at the center such as a cut is made, and the first bent portion 9a is formed through this bent portion 9a. The first flexible printed wiring board 10a and the second flexible printed wiring board 10b are integrally formed, and the first flexible printed wiring board 10a and the second flexible printed wiring board 1 are formed.
The circuit pattern 5 is formed on one sheet surface of 0b.
The second flexible printed wiring board 10b is provided with a comb-shaped contact portion 7 and a connecting portion 19 for connecting the circuit pattern 5 to a power source or the like. The comb-shaped contact portion 7 is formed by two conductive wires that are close to each other in a comb shape and are in contact with each other, and a conductive material 8 made of a carbon contact or the like is simultaneously brought into contact with each other.
第１のフレキシブルプリント配線板１０ａにはＬＥＤ１
２のリード２を接続するべく貫通されるリード用孔１４
を設けたランド１３が回路パターン５に接続されてい
る。LED1 is provided on the first flexible printed wiring board 10a.
Lead hole 14 through which the lead 2 of 2 is connected
The land 13 provided with is connected to the circuit pattern 5.
この第１のフレキシブルプリント配線板１０ａ、第２の
フレキシブルプリント配線板１０ｂを、上記の絶縁性基
板３上に接着する場合、回路パターン５が絶縁性基板３
より外方に向くようにして、まず第２のフレキシブルプ
リント配線板１０ｂを絶縁性基板３に両面粘着テープ２
０を介して粘着する。つぎに絶縁性基板３に設けられた
埋設孔４に、ＬＥＤ１２の発光面より挿入埋設固定す
る。他にリード２が下方に付いた電子部品１についても
同様である。しかる後第１のフレキシブルプリント配線
板１０ａを絶縁性基板３に巻回し、第１のフレキシブル
プリント配線板１０ａのランド１３に設けられたリード
用孔１４にリード２の先端を貫通させる。ランド１３上
に低融点のクリーム半田１５を印刷手段等により塗布し
た後、所定の加熱処理によつてクリーム半田１５を溶融
して回路パターン５と電子部品１および電子部品１のリ
ード２とを電気的に接続する。さらに第１のフレキシブ
ルプリント配線板１０ａの表面には、クシ形接点部７に
対応する位置に操作用孔３１を設けた操作用スペーサー
３２を介して透明プラスチック材で構成された表面操作
板１１を接着する。表面操作板１１のクシ形接点部７に
対峙する位置にはカーボン等の導電材８が印刷されてお
り、クシ形接点部７と共にメンブレンスイツチ６を形成
する。また、表面操作板１１、操作用スペーサー３２に
おいて、ＬＥＤ１２の埋設孔４に対峙する位置はＬＥＤ
１２の発光が表面操作板１１の表面より認識できるよう
に透明に構成されるものである。When the first flexible printed wiring board 10a and the second flexible printed wiring board 10b are bonded onto the insulating substrate 3, the circuit pattern 5 is the insulating substrate 3
First, the second flexible printed wiring board 10b is attached to the insulating substrate 3 so that the double-sided adhesive tape 2 faces outward.
Stick through 0. Next, the LED 12 is inserted, embedded and fixed in the embedded hole 4 provided in the insulating substrate 3 from the light emitting surface of the LED 12. The same applies to the electronic component 1 having the lead 2 attached to the lower side. Then, the first flexible printed wiring board 10a is wound around the insulating substrate 3, and the tip of the lead 2 is passed through the lead hole 14 provided in the land 13 of the first flexible printed wiring board 10a. After the low melting point cream solder 15 is applied to the land 13 by a printing means or the like, the cream solder 15 is melted by a predetermined heat treatment to electrically connect the circuit pattern 5 and the electronic component 1 and the leads 2 of the electronic component 1 to each other. Connect to each other. Further, on the surface of the first flexible printed wiring board 10a, a surface operation plate 11 made of a transparent plastic material is provided via an operation spacer 32 having an operation hole 31 at a position corresponding to the comb-shaped contact portion 7. To glue. A conductive material 8 such as carbon is printed at a position facing the comb-shaped contact portion 7 of the surface operation plate 11 to form the membrane switch 6 together with the comb-shaped contact portion 7. Further, in the surface operation plate 11 and the operation spacer 32, the position facing the embedded hole 4 of the LED 12 is the LED.
The light emission of 12 is transparent so that it can be recognized from the surface of the surface operation plate 11.
第８図は、第６図、第７図において説明された表面操作
板１１を第３のフレキシブルプリント配線板１０ｃとし
て、第１、第２のフレキシブルプリント配線板１０ａ、
１０ｂとを一体に形成された場合のフレキシブルプリ
ント配線板の展開説明図である。記号９ｂは第２の折り
曲げ部を示し、第１の折り曲げ部９ａとは反対に折り曲
げられる。導電材８はクシ形接点部７と第２の折り曲げ
部9bに対してほぼ線対称となる位置に設けられ、クシ形
接点部７に対峙する位置に操作用孔３１を設けた操作用
スペーサー３２を挾持するようにさらに第３のフレキシ
ブルプリント配線板１０ｃの印刷面を内側とするように
折り曲げる。第１、第２のフレキシブルプリント配線板
１０ａ、 １０ｂについては第６図、第７図において説
明した場合と全く同じであることから説明を省略する。FIG. 8 shows the first and second flexible printed wiring boards 10a, in which the surface operation board 11 described in FIGS. 6 and 7 is used as a third flexible printed wiring board 10c.
FIG. 10 is a development explanatory diagram of the flexible printed wiring board when integrally formed with 10b. The symbol 9b indicates the second bent portion, which is bent in the opposite direction to the first bent portion 9a. The conductive material 8 is provided at a position that is substantially line-symmetrical to the comb-shaped contact portion 7 and the second bent portion 9b, and the operation spacer 32 is provided with an operation hole 31 at a position facing the comb-shaped contact portion 7. Is further bent so that the printed surface of the third flexible printed wiring board 10c is placed inside. Since the first and second flexible printed wiring boards 10a and 10b are exactly the same as those described in FIGS. 6 and 7, the description thereof will be omitted.
第３のフレキシブルプリント配線板１０ｃにおいて３３
はＬＥＤ１２の発光面となるべく透明に構成されたＬＥ
Ｄ窓を示す。また第８図において記号３４はカーボン等
を印刷したシールド材で回路パターン５を介して接地さ
れるべく設けられており、第９図の組立図で示されるよ
うに、第１、第２、第３のフレキシブルプリント配線板
１０ａ、１０ｂ、１０ｃを第１、第２の折り曲げ部９
ａ、９ｂで折り曲げが時にＬＥＤ１２の実装部に対応す
る部位と、メンブレンスイツチ６を構成する導電材８の
周辺を除いて印刷されている。33 in the third flexible printed wiring board 10c
Is an LE that is made as transparent as the light emitting surface of the LED 12.
The D window is shown. Further, in FIG. 8, reference numeral 34 is a shield material printed with carbon or the like and is provided so as to be grounded through the circuit pattern 5, and as shown in the assembly view of FIG. The flexible printed wiring boards 10a, 10b, 10c of No. 3 are connected to the first and second bent portions 9
The folds are printed at points a and 9b except the part corresponding to the mounting part of the LED 12 and the periphery of the conductive material 8 forming the membrane switch 6.
もちろん第７図における表面操作板１１のクシ形接点部
７と対峙する面を第３のフレキシブルプリント配線板１
０ｃと同様にカーボン等を印刷し、接地されている回路
パターン５と導通することにより第９図におけると同じ
ようにシールド材として用いることができる。Of course, the surface of the surface operation plate 11 facing the comb-shaped contact portion 7 in FIG.
By printing carbon or the like in the same manner as 0c and conducting it to the grounded circuit pattern 5, it can be used as a shield material in the same manner as in FIG.
本発明の回路基板の製造方法によれば、回路基板のベー
スとなる絶縁性基板３内に埋設孔４もしくは埋設用凹部
を設けて、電子部品１を埋設し、次いでその絶縁性基板
３に、ＬＥＤ１２等電子部品１に設けられているリード
２に接続される回路パターン５を形成してなる第１、第
２、さらに第３のフレキシブルプリント配線板１０ａ、
１０ｂ、１０ｃを巻回し、添着し、しかる後そのリード
２と回路パターン５とを接続するもので、ＬＥＤ１２を
含む電子部品１の安定保持が高められ、電子部品１の脱
落による回路不良、あるいは接触不良等の事故を未然に
防止し、信頼性、安定性に優れた回路基板が提供でき
る。さらにＬＥＤ１２の発光面を第２のフレキシブルプ
リント配線板１０ｂの側に設けられた両面粘着テープに
添着固定ることにより、メンブレンスイツチ６の操作面
側から点灯を識別しやすくなる。According to the method of manufacturing a circuit board of the present invention, the embedded hole 4 or the recessed portion for embedding is provided in the insulating substrate 3 serving as the base of the circuit board to embed the electronic component 1, and then to the insulating substrate 3. First, second, and third flexible printed wiring boards 10a formed by forming a circuit pattern 5 connected to leads 2 provided in an electronic component 1 such as an LED 12;
10b and 10c are wound and attached, and then the lead 2 and the circuit pattern 5 are connected to each other, so that stable holding of the electronic component 1 including the LED 12 is enhanced, and circuit failure or contact due to detachment of the electronic component 1 occurs. It is possible to provide a circuit board that prevents accidents such as defects and has excellent reliability and stability. Further, by attaching and fixing the light emitting surface of the LED 12 to the double-sided adhesive tape provided on the second flexible printed wiring board 10b side, it becomes easy to identify lighting from the operation surface side of the membrane switch 6.
また第３のフレキシブルプリント配線板１０ｃあるいは
表面操作板１１にシールド材３４を塗布することにより
電波シールド効果をもたせることができる。Further, by applying the shield material 34 to the third flexible printed wiring board 10c or the surface operation board 11, a radio wave shielding effect can be provided.
さらに本発明による回路基板は、フレキシブルプリント
配線板の枚数を減らせること、電子部品１の半田付け作
業前の仮固定で作業能率を向上させることなど従来の製
品に対したコストダウンが可能であつて経済性も高めら
れるなどの効果がある。Further, the circuit board according to the present invention can reduce the number of flexible printed wiring boards, and can improve work efficiency by temporarily fixing the electronic component 1 before soldering work. It also has the effect of improving economic efficiency.
【図面の簡単な説明】 第１図乃至第５図は本発明よりなる回路基板の製作工程
を示した断面説明図。 第６図は本発明にかかるフレキシブルプリント配線板の
展開説明図、第７図は、本発明にかかるフレキシブルプ
リント配線板の組立状態横断面図。 第８図は本発明にかかるフレキシブルプリント配線板の
他の実施例展開説明図、第９図は同組立状態横断面図を
示す。 １…電子部品 ２…リード ３…絶縁性基板 ４…埋設孔 ５…回路パターン ６…メンブレンスイツチ ９ａ、 ９ｂ…折り曲げ部 １０ａ、 １０ｂ、 １０ｃ…フレキシブルプリント配
線板 １１…表面操作板 １２…ＬＥＤ ３４…シールド材BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 to FIG. 5 are cross-sectional explanatory views showing a manufacturing process of a circuit board according to the present invention. FIG. 6 is a development explanatory view of the flexible printed wiring board according to the present invention, and FIG. 7 is an assembled cross-sectional view of the flexible printed wiring board according to the present invention. FIG. 8 is a development explanatory view of another embodiment of the flexible printed wiring board according to the present invention, and FIG. 9 is a transverse sectional view of the same in an assembled state. DESCRIPTION OF SYMBOLS 1 ... Electronic component 2 ... Lead 3 ... Insulating substrate 4 ... Buried hole 5 ... Circuit pattern 6 ... Membrane switch 9a, 9b ... Bent part 10a, 10b, 10c ... Flexible printed wiring board 11 ... Surface operation board 12 ... LED 34 ... Shield material
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 3/20 Ｚ 7511−4Ｅ 3/36 Ａ 7047−4Ｅ 9/00 Ｒ 7128−4Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI Technical display location H05K 3/20 Z 7511-4E 3/36 A 7047-4E 9/00 R 7128-4E
Claims (4)
用凹部を設けられた電気回路用基板となる絶縁性基板
に、上記電子部品に設けられているリードに接続される
回路パターンおよびメンブレンスイッチを構成するクシ
形接点部をそれぞれ第１の折り曲げ部を境に同一面上反
対側に配して連なる第１、第２のフレキシブルプリント
配線板を、前記した絶縁性基板に前記した回路パターン
およびクシ形接点部が外側に向くよう第１の折り曲げ部
より折り曲げて第１、第２のフレキシブルプリント配線
板を巻回し、添着し、しかる後に、前記したリードと回
路パターンとを半田付けにより接続し、さらに前記した
クシ形接点部に接触して導通するメンブレンスイッチを
形成するようクシ形接点部に対応する位置にカーボン接
点等からなる導電材を配した透明プラスチック材で構成
される表面操作板を添着することにより表面操作板の操
作側より電子部品として設けられたＬＥＤの発光が明確
に識別できるようにしたことを特徴とする回路基板の製
造方法。1. A circuit pattern and a membrane switch connected to a lead provided in the electronic component on an insulating substrate which is an electric circuit substrate provided with a buried hole or a recess for burying the electronic component. The first and second flexible printed wiring boards, in which the comb-shaped contact portions constituting the above are arranged on the same side and opposite sides on the same plane with the first bent portion as a boundary, are connected to the insulating substrate, and the circuit pattern and The first and second flexible printed wiring boards are wound and attached by bending from the first bent portion so that the comb-shaped contact portion faces outward, and then the leads and the circuit pattern are connected by soldering. And a conductive material made of carbon contact or the like at a position corresponding to the comb-shaped contact portion so as to form a membrane switch that contacts the comb-shaped contact portion to conduct electricity. Manufacture of a circuit board characterized in that the light emission of an LED provided as an electronic component can be clearly identified from the operation side of the surface operation plate by attaching the surface operation plate composed of the arranged transparent plastic material. Method.
用凹部を設けられた電気回路用基板となる絶縁性基板
に、上記電子部品に設けられているリードに接続される
回路パターンおよびメンブレンスイッチを構成するクシ
形接点部、該クシ形接点部に接触して導通させるカーボ
ン接点等からなる導電材をそれぞれ第１、第２の折り曲
げ部を境に、クシ形接点部を中央部にして同一面上にそ
れぞれ配して連なり透明プラスチック材で構成される第
１、第２、第３のフレキシブルプリント配線板を、前記
した絶縁性基板に前記した回路パターンおよびクシ形接
点部が外側に向くよう第１の折り曲げ部より折り曲げて
第１、第２のフレキシブルプリント配線板を巻回し、添
着さらに前記した第２の折り曲げ部より前記した導電材
が内側に向くよう第３のフレキシブルプリント配線板を
折り曲げ、クシ形接点部と導電材とが対向するよう添着
し、しかる後に前記したリードと回路パターンとを半田
付けにより接続し、導電材を配した第３のフレキシブル
プリント配線板の表面の操作側より電子部品として設け
られたＬＥＤの発光が明確に見えるようにしたことを特
徴とする回路基板の製造方法。2. A circuit pattern and a membrane switch, which are connected to leads provided in the electronic component, on an insulating substrate serving as an electric circuit substrate provided with a buried hole or a recess for burying the electronic component. The comb-shaped contact portion and the conductive material composed of a carbon contact or the like which contacts the comb-shaped contact portion to conduct electricity are the same, with the comb-shaped contact portion being the central portion with the first and second bent portions as boundaries. The first, second, and third flexible printed wiring boards which are respectively arranged on the surface and are continuous and made of a transparent plastic material are arranged such that the circuit pattern and the comb-shaped contact portion on the insulating substrate face outward. The first and second flexible printed wiring boards are wound by being bent from the first bent portion, and are attached so that the electrically conductive material faces inward from the second bent portion. The flexible printed wiring board is bent, the comb-shaped contact portion and the conductive material are attached so as to face each other, and then the lead and the circuit pattern are connected by soldering, and the third flexible printed wiring is provided with the conductive material. A method for manufacturing a circuit board, wherein the light emission of an LED provided as an electronic component is clearly visible from the operating side of the surface of the board.
作板の、ＬＥＤの実装部を対応する部位および前記した
導電材の周辺を除きカーボン印刷をし、第１又は第２の
フレキシブルプリント配線板に形成されるグランド用配
線パターンに半田付けしシールドすることを特徴とする
回路基板の製造方法。3. A device according to claim 1, wherein a conductive material is arranged and a surface operation plate made of a transparent plastic material is provided at a portion corresponding to an LED mounting portion and the periphery of the conductive material. Except for carbon printing, soldering and shielding to a ground wiring pattern formed on the first or second flexible printed wiring board to shield the circuit board.
ＥＤの実装部に対応する部位および前記した導電材の周
辺を除きカーボン印刷をし、グランド用配線パターンに
導通しシールドされたことを特徴とする回路基板の製造
方法。4. The L of the third flexible printed wiring board according to claim 3, wherein a conductive material is arranged.
A method for manufacturing a circuit board, wherein carbon printing is performed except for a portion corresponding to a mounting portion of the ED and the periphery of the above-described conductive material, and the carbon wiring is conducted and shielded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1080989A JPH069288B2 (en) | 1989-03-31 | 1989-03-31 | Circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1080989A JPH069288B2 (en) | 1989-03-31 | 1989-03-31 | Circuit board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02260597A JPH02260597A (en) | 1990-10-23 |
| JPH069288B2 true JPH069288B2 (en) | 1994-02-02 |
Family
ID=13733910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1080989A Expired - Lifetime JPH069288B2 (en) | 1989-03-31 | 1989-03-31 | Circuit board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH069288B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2584659Y2 (en) * | 1991-03-25 | 1998-11-05 | シャープ株式会社 | Input device for electronic equipment |
| JP2001298217A (en) * | 2000-04-13 | 2001-10-26 | Sumitomo Electric Ind Ltd | Optical module |
| JP4886581B2 (en) * | 2007-04-18 | 2012-02-29 | 日東電工株式会社 | Wiring circuit board and fuel cell |
| JP6205121B2 (en) * | 2012-09-14 | 2017-09-27 | Ｊｘ金属株式会社 | Visibility evaluation method for transparent substrate, positioning method for laminate, and method for manufacturing printed wiring board |
| JP6205120B2 (en) * | 2012-10-12 | 2017-09-27 | Ｊｘ金属株式会社 | Visibility evaluation apparatus for transparent base material, visibility evaluation program for transparent base material and computer-readable recording medium on which it is recorded, laminated body positioning device, laminated body positioning program, and computer on which it is recorded Readable recording medium and printed wiring board manufacturing method |
-
1989
- 1989-03-31 JP JP1080989A patent/JPH069288B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02260597A (en) | 1990-10-23 |
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