JP6205121B2 - Visibility evaluation method for transparent substrate, positioning method for laminate, and method for manufacturing printed wiring board - Google Patents

Description

  The present invention relates to a visibility evaluation method for a transparent substrate, a positioning method for a laminate, and a method for manufacturing a printed wiring board.

  In a small electronic device such as a smartphone or a tablet PC, a flexible printed wiring board (hereinafter referred to as FPC) is adopted because of easy wiring and light weight. In recent years, with the enhancement of functions of these electronic devices, the signal transmission speed has been increased, and impedance matching has become an important factor in FPC. As a measure for impedance matching with respect to an increase in signal capacity, a resin insulation layer (for example, polyimide) serving as a base of an FPC has been increased in thickness. On the other hand, processing such as bonding to a liquid crystal substrate and mounting of an IC chip is performed on the FPC, but the alignment at this time is the resin insulation remaining after etching the copper foil in the laminate of the copper foil and the resin insulating layer The visibility of the resin insulation layer is important because it is performed through a positioning pattern that is visible through the layer.

  As a method for evaluating the visibility of such a resin insulating layer, in Patent Document 1, an image taken through a resin insulating layer with a CCD camera is observed and evaluated. In Patent Document 2, it is evaluated whether or not a test pattern is distorted in an image taken by a CCD camera from an angle of 30 ° with respect to the horizontal plane of the resin insulating layer to be evaluated.

JP 2003-309336 A JP 2006-001056 A

However, in the case of simply observing an image by observing with a CCD camera as in Patent Document 1, there is a limit to the accuracy of the visibility evaluation. In reality, it is impossible to determine whether or not the provided mark can be visually recognized through the transparent base material, which is problematic in terms of manufacturing cost. The same applies to a method of evaluating whether or not a test pattern is distorted in the image as in Patent Document 2.
The present invention provides a visibility evaluation method for a transparent substrate, a method for positioning a laminate, and a method for producing a printed wiring board, which can efficiently and accurately evaluate the visibility of a transparent substrate.

  As a result of intensive research, the inventors have provided a mark under the transparent base material, photographed through the transparent base material with a photographing means, and a mark drawn in the observation point-lightness graph obtained from the image of the mark portion. Focusing on the brightness curve near the edge and evaluating the brightness curve, the visibility of the transparent substrate is evaluated efficiently and accurately without being affected by the type of transparent substrate and the thickness of the transparent substrate. I found that I can do it.

  The present invention completed on the basis of the above knowledge, in one aspect, a mark is provided under the transparent substrate, the mark is photographed by the photographing means through the transparent substrate, and an image obtained by the photographing is obtained. The observation point-brightness graph is prepared by measuring the brightness at each observation point along a direction perpendicular to the direction in which the observed mark extends. In the observation point-brightness graph, from the end of the mark, the mark It is a method for evaluating the visibility of the transparent base material by a brightness curve generated over a portion having no mark, and a difference between a top average value Bt and a bottom average value Bb of a brightness curve generated from an end portion of the mark to a portion without the mark This is a method for evaluating the visibility of a transparent substrate using ΔB (ΔB = Bt−Bb).

  In one embodiment, the method for evaluating the visibility of a transparent substrate according to the present invention is a difference ΔB (ΔB) between a top average value Bt and a bottom average value Bb of a brightness curve generated from an end portion of the mark to a portion without the mark. = Bt−Bb) is determined to be good when 40 or more.

  In another embodiment of the method for evaluating the visibility of the transparent substrate according to the present invention, the difference ΔB between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end of the mark to the portion without the mark. A case where (ΔB = Bt−Bb) is 50 or more is determined to be good.

In still another embodiment of the method for evaluating the visibility of the transparent substrate according to the present invention, the difference between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end of the mark to the portion without the mark. In the observation point-brightness graph, ΔB (ΔB = Bt−Bb) and the intersection point between the lightness curve and Bt, where t1 is a value indicating the position of the intersection closest to the mark among the lightness curve and Bt intersections. In the depth range from 0.1 to Bt with respect to Bt, when the value indicating the position of the intersection closest to the mark among the intersections of the lightness curve and 0.1ΔB is t2, the following equation (1) Sv defined by
Sv = (ΔB × 0.1) / (t1-t2) (1)
To do.

  In yet another embodiment of the method for evaluating the visibility of the transparent substrate according to the present invention, the image obtained by the imaging is a surface-treated copper foil having at least one surface treated with a thickness from the treated surface side. After laminating both sides of a transparent substrate having a thickness of 25 to 50 μm, the copper foils on both sides are removed by etching, and a printed matter on which a mark is printed is laid under the exposed transparent substrate, and the printed matter is It is the image obtained by image | photographing with an imaging | photography means through a transparent base material.

  In still another embodiment of the method for evaluating visibility according to the present invention, a case where the Sv is 3.5 or more is determined to be good.

  In still another embodiment of the method for evaluating visibility according to the present invention, a case where the Sv is 3.9 or more is determined to be good.

  In another embodiment of the method for evaluating the visibility of the transparent substrate of the present invention, the case where the Sv is 5.0 or more is determined to be good.

  In yet another embodiment of the method for evaluating the visibility of the transparent substrate of the present invention, the surface-treated copper foil is a surface-treated copper foil in which roughened particles are formed on at least one surface by a roughening treatment. is there.

  In another embodiment of the method for evaluating the visibility of the transparent substrate of the present invention, the transparent substrate is a polyimide substrate.

  According to another aspect of the present invention, there is provided a method of positioning a laminate of metal and resin, wherein the laminate of metal and resin has a mark, and the mark is photographed by the photographing means through the resin. Then, for the image obtained by the photographing, the brightness at each observation point is measured along a direction perpendicular to the direction in which the observed mark extends, and an observation point-brightness graph is created. In this method, the laminate is positioned by using the difference ΔB (ΔB = Bt−Bb) between the top average value Bt and the bottom average value Bb of the brightness curve generated over the portion where there is no mark.

  In one embodiment of the method for positioning a laminate according to the present invention, a difference ΔB (ΔB = Bt−) between a top average value Bt and a bottom average value Bb of a brightness curve generated from an end portion of the mark to a portion without the mark. A case where Bb) is 40 or more is determined to be good.

  In another embodiment of the method for positioning a laminate according to the present invention, a difference ΔB (ΔB = ΔB) between a top average value Bt and a bottom average value Bb of a brightness curve generated from an end portion of the mark to a portion without the mark. A case where Bt−Bb) is 50 or more is determined to be good.

In still another embodiment of the method for positioning a laminate according to the present invention, a difference ΔB (ΔB) between a top average value Bt and a bottom average value Bb of a brightness curve generated from an end portion of the mark to a portion without the mark. = Bt−Bb), and in the observation point-lightness graph, t1 is a value indicating the position of the intersection closest to the mark among the intersections of the brightness curve and Bt, and Bt is calculated from the intersection of the brightness curve and Bt. In the depth range up to 0.1ΔB as a reference, when the value indicating the position of the intersection closest to the mark among the intersections of the lightness curve and 0.1ΔB is defined as t2, the following equation (1) is defined. Sv
Sv = (ΔB × 0.1) / (t1-t2) (1)
Is used to detect the position of the mark, and the laminate of the metal and the resin is positioned based on the detected position of the mark.

  According to another aspect of the present invention, there is provided a method for positioning a printed wiring board having an insulating resin plate and a circuit provided on the insulating resin plate, wherein the circuit is photographed by the photographing means over the resin. Taking an image and measuring the brightness at each observation point along the direction perpendicular to the direction in which the observed circuit is stretched for the image obtained by the shooting to produce an observation point-lightness graph, and the end of the circuit The printed wiring board is positioned using the difference ΔB (ΔB = Bt−Bb) between the top average value Bt and the bottom average value Bb of the lightness curve generated from the portion where the circuit is not present.

In one embodiment of the method for positioning a printed wiring board according to the present invention, a difference ΔB (ΔB = Bt) between a top average value Bt and a bottom average value Bb of a brightness curve generated from an end portion of the circuit to a portion without the circuit. -Bb) and the observation point-lightness graph, where t1 is a value indicating the position of the intersection closest to the circuit among the intersections of the lightness curve and Bt, and Bt is used as a reference from the intersection of the lightness curve and Bt. Sv defined by the following equation (1) when the value indicating the position of the intersection closest to the circuit among the intersections of the lightness curve and 0.1ΔB in the depth range up to 0.1ΔB is t2. When,
Sv = (ΔB × 0.1) / (t1-t2) (1)
Is used to detect the position of the circuit, and the printed wiring board is positioned based on the detected position of the circuit.

  According to still another aspect of the present invention, there is provided a printed wiring board including a step of positioning a printed wiring board by the method for positioning a printed wiring board according to the present invention and mounting a component on the positioned printed wiring board. It is a manufacturing method.

  In still another aspect of the present invention, the printed wiring board is positioned by the method for positioning a printed wiring board according to the present invention, the positioned printed wiring board is aligned, and the printed printed circuit board is aligned. It is a manufacturing method of a printed wiring board including the process of mounting parts on a wiring board.

  According to another aspect of the present invention, there is provided a step of positioning a printed wiring board by the method for positioning a printed wiring board according to the present invention and connecting another printed wiring board to the positioned printed wiring board. It is a manufacturing method of a printed wiring board containing.

  In still another aspect of the present invention, the printed wiring board is positioned by the method for positioning a printed wiring board according to the present invention, the positioned printed wiring board is aligned, and the printed printed circuit board is aligned. A printed wiring board manufacturing method including a step of connecting another printed wiring board to the wiring board.

  According to the present invention, the visibility of a transparent substrate can be evaluated efficiently and accurately.

It is a schematic diagram which defines Bt and Bb in case a mark width is about 1.3 mm. It is a schematic diagram which defines Bt and Bb in case a mark width is about 0.3 mm. It is a schematic diagram which defines t1, t2, and Sv. It is a schematic diagram showing the structure of an imaging | photography means and the measuring method of the inclination of a brightness curve in the case of the inclination evaluation of the brightness curve in case the width | variety of a mark is 0.1-0.4 mm. It is a schematic diagram showing the structure of an imaging | photography means and the measuring method of the inclination of a brightness curve in the case of the inclination evaluation of the brightness curve in case the width | variety of a mark is 1.0-2.0 mm.

(Transparent substrate visibility evaluation method)
The method for evaluating the visibility of a transparent substrate according to the present invention provides a mark under the transparent substrate, images the mark with a photographing means through the transparent substrate, and observes an image obtained by the imaging. Further, the brightness at each observation point is measured along a direction perpendicular to the direction in which the mark extends, and an observation point-lightness graph is prepared. In the observation point-lightness graph, the portion where the mark is not present from the end of the mark Is a difference between a top average value Bt and a bottom average value Bb of a lightness curve generated from an end portion of the mark to a portion without the mark. = Bt-Bb).
Conventionally, unless actually produced on the production line, it was impossible to determine whether or not the marks provided for alignment etc. could be seen through the transparent base material, and there was a problem in terms of production cost . However, in the present invention, with such a configuration, it is possible to easily and efficiently evaluate the visibility of the transparent substrate easily and efficiently even in the laboratory alone.

Further, the visibility evaluation method of the transparent substrate of the present invention is to provide a mark under the transparent substrate, photograph the mark with the photographing means through the transparent substrate, and for the image obtained by the photographing, The observation point-brightness graph is prepared by measuring the brightness at each observation point along a direction perpendicular to the direction in which the observed mark extends. In the observation point-brightness graph, the mark extends from the end of the mark. It is a method of evaluating the visibility of the transparent substrate by the slope of the brightness curve that occurs over a portion that does not exist, and the top average value Bt and the bottom average value Bb of the brightness curve that occurs from the end of the mark to the portion where there is no mark In the difference ΔB (ΔB = Bt−Bb) and the observation point-lightness graph, the value indicating the position of the intersection closest to the mark among the intersections of the lightness curve and Bt is defined as t1. In the depth range from the intersection of the intensity curve and Bt to 0.1 ΔB with reference to Bt, the value indicating the position of the intersection closest to the mark among the intersections of the brightness curve and 0.1 ΔB is t2. Sv defined by the following formula (1):
Sv = (ΔB × 0.1) / (t1-t2) (1)
You may evaluate the visibility of a transparent base material using.
According to such a configuration, the visibility of the transparent substrate can be more accurately evaluated with ease and efficiency even in the laboratory alone.

Furthermore, the visibility evaluation method of the transparent base material of the present invention is a method in which at least one surface treated surface-treated copper foil is bonded to both surfaces of a transparent base material having a thickness of 25 to 50 μm from the treated surface side. The copper foil on both sides is removed by etching, and a printed matter on which a mark is printed is laid under the exposed transparent base material, and the printed matter is photographed by photographing means through the transparent base material, and obtained by the photographing. For each image, the brightness at each observation point is measured along a direction perpendicular to the direction in which the observed mark extends, and an observation point-lightness graph is created. Is a method of evaluating the visibility of the transparent substrate by the slope of the brightness curve generated from the portion where there is no mark, the brightness curve generated from the end of the mark to the portion where there is no mark The difference ΔB (ΔB = Bt−Bb) between the top average value Bt and the bottom average value Bb and the position of the intersection closest to the mark among the intersections of the lightness curve and Bt in the observation point-lightness graph. The value shown is t1, and in the depth range from the intersection of the lightness curve and Bt to 0.1ΔB with reference to Bt, the position of the intersection closest to the mark is shown among the intersections of the lightness curve and 0.1ΔB. When the value is t2, Sv defined by the following equation (1):
Sv = (ΔB × 0.1) / (t1-t2) (1)
You may evaluate the visibility of the transparent base material performed using.
According to such a configuration, the visibility of the transparent substrate can be more accurately evaluated with ease and efficiency even in the laboratory alone.

  The transparent base material to be evaluated in the present invention is not particularly limited, and may be a resin base material such as glass or polyimide as long as it is transparent. In the present invention, the term “transparent” includes light transparency. The surface-treated copper foil may be a surface-treated copper foil in which roughened particles are formed on at least one surface by a roughening treatment or the like. In addition, the mark in the present invention may be a mark printed on a printed matter such as paper, may be a copper wiring, and may take any form as long as it is a mark serving as a mark. The mark may be a printed material, a metal, an inorganic material, an organic material, or any mark. If the mark is in the form of a line, it is easy to create an observation point-lightness graph by measuring the lightness of each observation point along the direction crossing the observed mark for an image obtained by photographing. .

Further, in the method for evaluating the visibility based on the Sv value and the ΔB value, a difference ΔB (ΔB = ΔB = ΔB) between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end portion of the mark to the portion without the mark. Bt−Bb) is 40 or more, and in the observation point-brightness graph, the value indicating the position of the intersection closest to the mark among the intersections of the brightness curve and Bt is t1, and the Bt from the intersection of the brightness curve and Bt In the depth range up to 0.1ΔB, tv is the value indicating the position of the intersection closest to the mark among the intersections of the lightness curve and 0.1ΔB, and Sv is 3.5 or more. The case may be determined to be good.
It is more preferable to determine that the visibility is good when Sv is 3.9 or more, preferably 5.0 or more, more preferably 5.5 or more. The upper limit of Sv is not particularly limited, but is, for example, 70 or less, 30 or less, 15 or less, or 10 or less.
ΔB (ΔB = Bt−Bb) is preferably 50 or more. The upper limit of ΔB is not particularly limited, but is, for example, 100 or less, 80 or less, or 70 or less. According to such an evaluation method, it becomes possible to efficiently and more accurately evaluate the visibility of the transparent substrate.

Here, “top average value Bt of the lightness curve”, “bottom average value Bb of the lightness curve”, and “t1”, “t2”, and “Sv” described later will be described with reference to the drawings. For the “bottom average value Bb of the lightness curve”, the width of the mark is increased (for example, the width of the mark is 0.7 mm or more, for example, 0.8 mm or more, for example, 5 mm or less, 4 mm or less, for example, about 1.3 mm). And the mark width is reduced (for example, the mark width is 0.01 mm or more, 0.05 mm or more, 0.1 mm or more, 0.8 mm or less, 0.7 mm or less, 0.00 mm or less). Since the definition is different from that of 6 mm or less, for example, 0.3 mm, each case will be described.
FIG. 1 is a schematic diagram for defining Bt and Bb when the mark width is increased (about 1.3 mm). The “mark” in FIG. 1 indicates a line-like mark (width of about 1.3 mm) of the printed matter observed in an image obtained by photographing with the CCD camera. A curve drawn so as to overlap the mark indicates a brightness curve generated from the end of the mark to a portion without the mark in the observation point-lightness graph. As shown in FIG. 1, the “top average value Bt of the lightness curve” is the average of lightness when measured at 5 locations (total 10 locations on both sides) at 30 μm intervals from positions 100 μm away from the end positions on both sides of the mark. Indicates the value. The “bottom average value Bb of the lightness curve” indicates an average value of lightness when 11 positions are measured at intervals of 100 μm from a position inside 100 μm from the end position of the mark. Note that the interval between observation points for measuring the average value of the brightness can be appropriately selected in the range of 1 μm to 500 μm depending on the shape of the brightness curve. In order to avoid the bias of the observation points, it is preferable that the intervals between the observation points are substantially equal or equal. Note that the intervals between the observation points do not have to be substantially equal and may not be equal. Further, it is considered that the wider the measurement interval, the more the influence of a specific observation point can be eliminated and the error due to the observation point can be reduced.
FIGS. 2A and 2B are schematic diagrams for defining Bt and Bb when the mark width is about 0.3 mm. When the width of the mark is about 0.3 mm, the bottom is the same as in the case of a V-shaped brightness curve as shown in FIG. 2A and the case of about 1.3 mm as shown in FIG. May result in a lightness curve having In either case, the “top average value Bt of the lightness curve” is 5 points (at both sides) at 30 μm intervals from the positions 50 μm away from the end positions on both sides of the mark, as in the case where the mark width is about 1.3 mm. The total value of brightness when measured is shown. On the other hand, the “bottom average value Bb of the lightness curve” indicates the minimum value of lightness at the tip of the V-shaped valley when the lightness curve is V-shaped as shown in FIG. When it has the bottom of (b), the value of the center part of about 0.3 mm is shown. Note that the interval between observation points for measuring the average value of the brightness can be appropriately selected in the range of 1 μm to 500 μm depending on the shape of the brightness curve. In order to avoid the bias of the observation points, it is preferable that the intervals between the observation points are substantially equal or equal. Note that the intervals between the observation points may not be substantially equal, and may not be equal. Further, it is considered that the wider the measurement interval, the more the influence of a specific observation point can be eliminated and the error due to the observation point can be reduced.
FIG. 3 is a schematic diagram that defines t1, t2, and Sv. “T1 (pixel × 0.1)” is a value indicating an intersection point closest to the line-shaped mark among intersection points of the lightness curve and Bt and a position of the intersection point (value on the horizontal axis of the observation point-lightness graph) ). “T2 (pixel × 0.1)” is the line-shaped mark among the intersections of the lightness curve and 0.1ΔB in the depth range from the intersection of the lightness curve and Bt to 0.1ΔB with reference to Bt. And the value (the value on the horizontal axis of the observation point-brightness graph) indicating the position of the intersection closest to. At this time, regarding the slope of the brightness curve indicated by the line connecting t1 and t2, Sv (gradation / pixel × 0.1) calculated by 0.1 ΔB in the y-axis direction and (t1−t2) in the x-axis direction. ). One pixel on the horizontal axis corresponds to a length of 10 μm. Further, Sv is measured on both sides of the mark, and a small value is adopted. Further, when the shape of the lightness curve is unstable and there are a plurality of the “intersections between the lightness curve and Bt”, the intersection closest to the mark is adopted.
In the image taken by the photographing means, the brightness is high in the portion where the mark is not attached, but the brightness decreases as soon as the end of the mark is reached. If the visibility of the transparent substrate is good, such a lowered state of brightness is clearly observed. On the other hand, if the visibility of the transparent base material is poor, the brightness does not suddenly drop from “high” to “low” in the vicinity of the edge of the mark, but the decrease state becomes gradual and the brightness decrease state is not good. It becomes clear.
Based on such knowledge, the present invention is based on the observation point-brightness graph obtained from the image of the mark portion taken by the photographing means over the transparent substrate, for example, with a printed matter with a mark placed on the transparent substrate. The inclination of the lightness curve near the edge of the mark drawn in is evaluated. More specifically, a mark is provided under the transparent base material, the mark is photographed by photographing means through the transparent base material, and an image obtained by the photographing is perpendicular to the direction in which the observed mark extends. The lightness at each observation point is measured along a certain direction to produce an observation point-lightness graph, and the transparent base is formed by a lightness curve generated from an end of the mark to a portion without the mark in the observation point-lightness graph. This is a method for evaluating the visibility of a material, using a difference ΔB (ΔB = Bt−Bb) between a top average value Bt and a bottom average value Bb of a brightness curve generated from an end portion of the mark to a portion without the mark. Evaluation makes it possible to accurately evaluate the visibility of the transparent substrate. According to such a configuration, the boundary between the mark and the non-mark portion becomes clearer, the positioning accuracy is improved, the error due to the mark image recognition is reduced, and the alignment can be performed more accurately.

(Laminate positioning method)
A method for positioning the laminate of the metal and resin of the present invention will be described. First, a laminate of metal and resin is prepared. The form of the laminate of the metal and the resin is not particularly limited as long as it is configured by bonding the metal to the resin. As a specific example of the laminate of the metal and resin of the present invention, copper or the like is used on at least one surface of a resin such as polyimide, which is used to electrically connect the main body substrate and the attached circuit board, and the circuit board. In an electronic device composed of a flexible printed circuit board on which metal wiring is formed, there is a laminate produced by accurately positioning the flexible printed circuit board and crimping it to the wiring ends of the main circuit board and the attached circuit board. It is done. That is, in this case, the laminate is a laminate in which the wiring end portions of the flexible printed circuit board and the main body substrate are bonded together by pressure bonding, or the wiring edge portions of the flexible printed circuit board and the circuit board are bonded together by pressure bonding. It becomes a laminated body. The laminate has a mark formed of a part of the metal wiring and a separate material. The position of the mark is not particularly limited as long as it can be photographed by photographing means such as a CCD camera through the resin constituting the laminate.

In the laminated body thus prepared, the above-mentioned mark is photographed by the photographing means through the resin, and the image obtained by the photographing is observed for each observation point along the direction perpendicular to the direction in which the observed mark extends. Is measured to produce an observation point-brightness graph, and the difference ΔB (ΔB = Bt−Bb) between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end of the mark to the portion without the mark. ) Is used to detect the position of the mark, and the laminate of the metal and the resin is positioned based on the detected position of the mark.
Sv = (ΔB × 0.1) / (t1-t2) (1)
Further, for the image obtained by the photographing, the brightness at each observation point is measured along a direction perpendicular to the direction in which the observed mark extends, and an observation point-brightness graph is created. The difference ΔB (ΔB = Bt−Bb) between the top average value Bt and the bottom average value Bb of the lightness curve that occurs over the portion where there is no mark, and the intersection of the lightness curve and Bt in the observation point-lightness graph, The value indicating the position of the intersection closest to the mark is t1, and in the depth range from the intersection of the lightness curve and Bt to 0.1ΔB with reference to Bt, the intersection of the lightness curve and 0.1ΔB When the value indicating the position of the intersection closest to the mark is t2, Sv defined by the following equation (1):
Sv = (ΔB × 0.1) / (t1-t2) (1)
May be used to detect the position of the mark and position the laminate of metal and resin based on the detected position of the mark.
The definitions of Bt, Bb, t1, and t2 are as described in the above-described transparent substrate visibility evaluation method. According to such a positioning method, the boundary between the mark and the non-mark part is more clearly defined. Thus, positioning accuracy is improved, errors due to mark image recognition are reduced, and alignment can be performed more accurately. For example, when ΔB or ΔB and Sv are equal to or greater than a predetermined value, the position detection device can determine that the mark is present at the position. Specifically, for example, when the determination is made only with ΔB, ΔB is 40 or more, or when the determination is made with the ΔB value and the Sv value, when ΔB is 40 or more and Sv is 3.5 or more. A device that detects the position can determine that the mark is present at the position. If such a printed wiring board positioning method is used, the printed wiring board can be positioned more accurately. Therefore, when one printed wiring board and another printed wiring board are connected, it is considered that the connection failure is reduced and the yield is improved. In addition, the positioning method according to the embodiment of the present invention includes soldering, connection via an anisotropic conductive film (ACF), connection via an anisotropic conductive paste (ACP), and connection via an anisotropic conductive paste (Aisotropic Conductive Paste, ACP). Or, when connecting one printed wiring board and another printed wiring board in a known connection method such as connection through a conductive adhesive, or when mounting a component on one printed wiring board. be able to.

  A method for positioning a printed wiring board according to the present invention is a method for positioning a printed wiring board having an insulating resin plate and a circuit provided on the insulating resin plate, wherein the circuit is photographed through the resin. Take an image, and measure the brightness at each observation point along the direction perpendicular to the direction in which the observed circuit extends, and create an observation point-brightness graph. The position of the circuit is detected using the difference ΔB (ΔB = Bt−Bb) between the top average value Bt and the bottom average value Bb of the lightness curve generated over the non-existing portion, and based on the detected circuit position, the printed circuit board Position it.

Further, the method for positioning a printed wiring board according to the present invention is a method for positioning a printed wiring board having an insulating resin plate and a circuit provided on the insulating resin plate, the circuit passing through the resin. For the image obtained by the photographing means, the brightness at each observation point is measured along the direction perpendicular to the direction in which the observed circuit extends, and an observation point-lightness graph is created, and the end of the circuit The difference ΔB (ΔB = Bt−Bb) between the top average value Bt and the bottom average value Bb of the lightness curve generated from the point where no circuit is present, and the intersection of the lightness curve and Bt in the observation point-lightness graph, In the depth range from the intersection of the lightness curve and Bt to 0.1ΔB with reference to Bt, the value indicating the position of the intersection closest to is t1, and the circuit includes the intersection of the lightness curve and 0.1ΔB in the depth range. most A value indicating a position of an intersection are in when the t2, and Sv is defined by the following formula (1),
Sv = (ΔB × 0.1) / (t1-t2) (1)
The position of the circuit may be detected by using and the printed wiring board may be positioned based on the detected position of the circuit.
If such a printed wiring board positioning method is used, the printed wiring board can be positioned more accurately. Therefore, when one printed wiring board and another printed wiring board are connected, it is considered that the connection failure is reduced and the yield is improved.

The printed wiring board may be manufactured by positioning the printed wiring board by the method for positioning the printed wiring board according to the present invention and mounting components on the positioned printed wiring board. Furthermore, the printed wiring board is positioned by the positioning method of the present invention, the positioned printed wiring board is aligned, and a component is mounted on the aligned printed wiring board to produce the printed wiring board. May be. Thereby, components, such as an electronic component, can be mounted | worn in the exact position of a printed wiring board.
Further, the printed wiring board may be manufactured by positioning the printed wiring board by connecting the other printed wiring board to the positioned printed wiring board by the method of positioning the printed wiring board of the present invention. . Further, the printed wiring board is positioned by the positioning method of the present invention, the positioned printed wiring board is aligned, and another printed wiring board is connected to the aligned printed wiring board. A printed wiring board may be manufactured. Thereby, another printed wiring board can be connected to an accurate position on the printed wiring board to be connected. Here, the “connection” may be an electrical connection (for example, soldering), or may be a connection using an adhesive or the like, which is not an electrical connection.
In the present invention, the “printed wiring board” includes a printed wiring board and a printed board on which components are mounted.

  In the method for evaluating the visibility of the transparent substrate and the method for positioning the laminate according to the present invention, the mark may be a printed material, a metal, an inorganic material, or an organic material. It may be any mark as long as it serves as a mark.

The positioning method according to the embodiment of the present invention may include a step of moving a laminated body (including a laminated body of copper and resin and a printed wiring board). In the moving process, for example, it may be moved by a conveyor such as a belt conveyor or a chain conveyor, may be moved by a moving device equipped with an arm mechanism, or may be moved by floating a laminate using gas. The moving device may be moved by a moving means, such as a moving device or moving means (including a roller or a bearing) that moves a laminated body by rotating an object such as a substantially cylindrical shape, a moving device or moving means that uses hydraulic pressure as a power source, Moving devices and moving means powered by air pressure, moving devices and moving means powered by motors, gantry moving linear guide stages, gantry moving air guide stages, stacked linear guide stages, linear motor drive stages, etc. It may be moved by a moving device or moving means having a stage. Moreover, you may perform the movement process by a well-known moving means.
The positioning method according to the embodiment of the present invention may be used for a surface mounter or a chip mounter.
Moreover, the printed wiring board which has the circuit provided on the resin board and the said resin board may be sufficient as the laminated body of the said metal and resin positioned in this invention. In that case, the mark may be the circuit.

  In the present invention, “positioning” includes “detecting the position of a mark or an object”. In the present invention, “alignment” includes “after detecting the position of a mark or object, moving the mark or object to a predetermined position based on the detected position”.

As Examples A1 to 30 and Examples B1 to 14, various copper foils were prepared, and plating treatment was performed on one surface under the conditions described in Table 1 as a roughening treatment.
After performing the above-mentioned roughening plating treatment, the plating treatment for forming the following heat-resistant layer and antirust layer was carried out for Examples A1 to 10, 12 to 27, and Examples B3, 4, 6, and 9 to 14. .
The conditions for forming the heat-resistant layer 1 are shown below.
Liquid composition: Nickel 5-20 g / L, cobalt 1-8 g / L
pH: 2-3
Liquid temperature: 40-60 degreeC
Current density: 5 to 20 A / dm ²
Coulomb amount: 10-20 As / dm ²
A heat-resistant layer 2 was formed on the copper foil provided with the heat-resistant layer 1. For Examples B5, 7, and 8, the rough plating treatment was not performed, and the heat-resistant layer 2 was directly formed on the prepared copper foil. The conditions for forming the heat-resistant layer 2 are shown below.
Liquid composition: nickel 2-30 g / L, zinc 2-30 g / L
pH: 3-4
Liquid temperature: 30-50 degreeC
Current density: 1 to ^{2 A} / dm ²
Coulomb amount: 1-2 As / dm ²
On the copper foil which gave the said heat-resistant layers 1 and 2, the antirust layer was further formed. The conditions for forming the rust preventive layer are shown below.
Liquid composition: potassium dichromate 1-10 g / L, zinc 0-5 g / L
pH: 3-4
Liquid temperature: 50-60 degreeC
Current density: 0 to ^{2 A} / dm ² (for immersion chromate treatment)
Coulomb amount: 0 to ^{2 As} / dm ² (for immersion chromate treatment)
On the copper foil which gave the said heat-resistant layers 1 and 2 and a rust prevention layer, the weathering layer was further formed. The formation conditions are shown below.
As a silane coupling agent having an amino group, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane (Example A17, 24-27), N-2- (aminoethyl) -3-aminopropyltri Ethoxysilane (Examples A1 to 16), N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane (Examples A18, 28, 29), 3-aminopropyltrimethoxysilane (Example A19), 3 -Aminopropyltriethoxysilane (Examples A20, 21), 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine (Example A22), N-phenyl-3-aminopropyltrimethoxysilane In (Example A23), coating and drying were performed to form a weather-resistant layer. These silane coupling agents can be used in combination of two or more. Similarly, in Examples B1 to 15, coating and drying were performed with N-2- (aminoethyl) -3-aminopropyltrimethoxysilane to form a weather resistant layer.

In addition, the rolled copper foil was manufactured as follows. After manufacturing the copper ingot of the composition shown in Table 2 and performing hot rolling, annealing and cold rolling of a continuous annealing line at 300 to 800 ° C. were repeated to obtain a rolled sheet having a thickness of 1 to 2 mm. This rolled sheet was annealed in a continuous annealing line at 300 to 800 ° C. and recrystallized, and finally cold-rolled to the thickness shown in Table 2 to obtain a copper foil. “Tough pitch copper” in the “Type” column of Table 2 indicates tough pitch copper standardized in JIS H3100 C1100, and “Oxygen-free copper” indicates oxygen-free copper standardized in JIS H3100 C1020. “Tough pitch copper + Ag: 100 ppm” means that 100 mass ppm of Ag is added to tough pitch copper.
The electrolytic copper foil used was an electrolytic copper foil HLP foil manufactured by JX Nippon Mining & Metals. When electrolytic polishing or chemical polishing was performed, the plate thickness after electrolytic polishing or chemical polishing was described.
Table 2 lists the points of the copper foil preparation process before the surface treatment. “High gloss rolling” means that the final cold rolling (cold rolling after the final recrystallization annealing) was performed at the value of the oil film equivalent. “Normal rolling” means that the final cold rolling (cold rolling after the final recrystallization annealing) was performed at the oil film equivalent value described. “Chemical polishing” and “electropolishing” mean the following conditions.
“Chemical polishing” was performed using an etching solution of 1 to 3% by mass of H ₂ SO ₄ , 0.05 to 0.15% by mass of H ₂ O ₂ , and the remaining water, and the polishing time was 1 hour.
“Electropolishing” is a condition of phosphoric acid 67% + sulfuric acid 10% + water 23%, voltage 10 V / cm ² , and the time shown in Table 2 (when electrolytic polishing for 10 seconds is performed, the polishing amount is 1-2 μm ).

Various evaluation was performed as follows about each sample of the Example produced as mentioned above.
(1) Inclination of brightness curve Copper foil was bonded to both sides of a polyimide film (Kaneka thickness 25 μm, 50 μm, Toray DuPont thickness 50 μm), and the copper foil was removed by etching (ferric chloride aqueous solution) to remove the sample film. Produced. Subsequently, a printed material on which a line-shaped black mark was printed was laid under the sample film, and the printed material was photographed with a CCD camera through the sample film. The width of the mark used here was 0.1 to 0.4 mm. Next, in the observation point-brightness graph prepared by measuring the lightness of each observation point along the direction perpendicular to the direction in which the observed line-shaped mark extends, for an image obtained by photographing with a computer, The brightness curve generated from the end of the mark to the portion without the mark, and ΔB and t1, t2, and Sv were measured. FIG. 4 is a schematic diagram showing the configuration of the photographing means used and the method of measuring the slope of the brightness curve used at this time.
Further, ΔB, t1, t2, and Sv are shown in FIG. 3, and were measured by the following photographing means. Note that the horizontal axis of FIG. 3 indicates position information of the observation point, and one pixel on the horizontal axis corresponds to a length of 10 μm.
The photographing means includes a CCD camera, a stage (white) on which a polyimide substrate is placed with a marked paper underneath, an illumination power source for irradiating light onto the photographing portion of the polyimide substrate, and a paper with a mark to be photographed. A transporter (not shown) for transporting the evaluation polyimide substrate placed below onto the stage is provided. The main specifications of the photographing means are as follows:
・ Photographing means: Nireco Corporation sheet inspection device Mujken
CCD camera: 8192 pixels (160 MHz), 1024 gradation digital (10 bits)
・ Power supply for lighting: High-frequency lighting power supply (power supply unit x 2)
・ Lighting: Fluorescent lamp (30W)
For the lightness shown in FIG. 4, 0 means “black”, lightness 255 means “white”, and the gray level from “black” to “white” (black and white shading, gray scale) Is divided into 256 gradations for display.
In addition, since the width of the used mark was as small as 0.1 to 0.4 mm, the produced brightness curve has a V shape as shown in FIG. 2 (a) or a bottom as shown in FIG. 2 (b). It became V type which has.

(2) Visibility (resin transparency);
The copper foil was bonded to both surfaces of a polyimide film (Kaneka thickness 25 μm, 50 μm, Toray DuPont thickness 50 μm), and the copper foil was removed by etching (ferric chloride aqueous solution) to prepare a sample film. In addition, about the copper foil which performed the roughening process, the surface which roughened the copper foil was bonded together to the above-mentioned polyimide film, and the above-mentioned sample film was produced. A printed material (black circle with a diameter of 6 cm) was attached to one surface of the obtained resin layer, and the visibility of the printed material was judged from the opposite surface through the resin layer. “◎” indicates that the outline of the black circle of the printed material is clear when the length is 90% or more of the circumference, and “Clear” indicates that the outline of the black circle is clear when the length is 80% or more and less than 90% of the circumference. “O” (passed above), a black circle with a clear outline of 0 to less than 80% of the circumference and a broken outline were evaluated as “x” (failed).

(3) Yield The copper foil was bonded to both sides of a polyimide film (Kaneka thickness 25 μm, 50 μm, Toray DuPont thickness 50 μm), the copper foil was etched (ferric chloride aqueous solution), and L / S was 30 μm / 30 μm. An FPC with a circuit width of was prepared. In addition, about the copper foil which performed the roughening process, the surface which roughened the copper foil was bonded together to the above-mentioned polyimide film. After that, an attempt was made to detect a 20 μm × 20 μm square mark with a CCD camera through polyimide. “◎” when 9 times or more out of 10 times can be detected, “◯” when 7 to 8 times can be detected, “△” when 6 times can be detected, and when 5 times or less can be detected. Is “×”.
The conditions and evaluation of each test are shown in Tables 1-5.

(Evaluation results)
With respect to the polyimide base materials of the examples, the visibility could be easily and accurately evaluated at the laboratory level without actually producing them on the production line.
Moreover, when the same test as the said Example was done using the mark with a width | variety as large as 1.0-2.0 mm instead of the said example, the figure with the bottom part shown in FIG. 1 as a lightness curve was obtained. FIG. 5 is a schematic diagram showing the configuration of the photographing means and the method of measuring the slope of the brightness curve when evaluating the slope of the brightness curve when the mark width is 1.0 to 2.0 mm. In this case as well, the same results as in the above example were obtained, and as in the above example, the visibility of the polyimide base material was evaluated easily and accurately at the laboratory level without actually manufacturing it on the manufacturing line. We were able to.

Claims (20)

A mark is provided under the transparent substrate, and the mark is photographed by the photographing means through the transparent substrate,
For the image obtained by the photographing, an observation point-brightness graph is prepared by measuring the brightness for each observation point along the direction perpendicular to the direction in which the observed mark extends,
In the observation point-lightness graph, it is a method for evaluating the visibility of the transparent substrate by a lightness curve generated from an end portion of the mark to a portion without the mark,
A method for evaluating the visibility of a transparent substrate using a difference ΔB (ΔB = Bt−Bb) between a top average value Bt and a bottom average value Bb of a brightness curve generated from an end portion of the mark to a portion without the mark .   2. A case in which a difference ΔB (ΔB = Bt−Bb) between a top average value Bt and a bottom average value Bb of a brightness curve generated from an end portion of the mark to a portion without the mark is 40 or more is determined as good. The method described in 1.   3. A case where a difference ΔB (ΔB = Bt−Bb) between a top average value Bt and a bottom average value Bb of a lightness curve generated from an end portion of the mark to a portion without the mark is determined to be 50 or more. The method described in 1. A difference ΔB (ΔB = Bt−Bb) between a top average value Bt and a bottom average value Bb of a brightness curve generated from an end portion of the mark to a portion without the mark;
In the observation point-lightness graph, the value indicating the position of the intersection closest to the mark among the intersections of the lightness curve and Bt is t1, and from the intersection of the lightness curve and Bt to 0.1 ΔB based on Bt. Sv defined by the following equation (1) when the value indicating the position of the intersection closest to the mark among the intersections of the lightness curve and 0.1 ΔB in the depth range is t2.
Sv = (ΔB × 0.1) / (t1-t2) (1)
The method in any one of Claims 1-3 performed using. The method according to claim 4, wherein the case where the Sv is 3.5 or more is determined to be good. The method according to claim 5, wherein the case where the Sv is 3.9 or more is determined to be good. The method according to claim 6, wherein the case where the Sv is 5.0 or more is determined to be good. The image obtained by the shooting is
After the surface-treated copper foil treated on at least one surface was bonded to both surfaces of a transparent substrate having a thickness of 25 to 50 μm from the treated surface side, the copper foil on both surfaces was removed by etching, and a mark was printed. printed materials, laying under the exposed the transparent substrate, the method according to any one of claims 1 to 7, wherein the printed matter is an image obtained by photographing by the photographing means to the transparent substrate over. The method according to claim 8 , wherein the surface-treated copper foil is a surface-treated copper foil in which roughened particles are formed on at least one surface by a roughening treatment.   The method according to claim 1, wherein the transparent substrate is a polyimide substrate. A method for positioning a laminate of metal and resin,
The metal and resin laminate has a mark,
The mark is photographed by the photographing means through the resin,
For the image obtained by the photographing, an observation point-brightness graph is prepared by measuring the brightness for each observation point along the direction perpendicular to the direction in which the observed mark extends,
A method of positioning a laminate using a difference ΔB (ΔB = Bt−Bb) between a top average value Bt and a bottom average value Bb of a brightness curve generated from an end portion of the mark to a portion without the mark.   12. The case where a difference ΔB (ΔB = Bt−Bb) between a top average value Bt and a bottom average value Bb of a brightness curve generated from an end portion of the mark to a portion without the mark is determined to be 40 or more is determined to be good. The method described in 1.   13. A case where a difference ΔB (ΔB = Bt−Bb) between a top average value Bt and a bottom average value Bb of a lightness curve generated from an end portion of the mark to a portion without the mark is determined to be 50 or more is determined as good. The method described in 1. A difference ΔB (ΔB = Bt−Bb) between a top average value Bt and a bottom average value Bb of a brightness curve generated from an end portion of the mark to a portion without the mark;
In the observation point-lightness graph, the value indicating the position of the intersection closest to the mark among the intersections of the lightness curve and Bt is t1, and from the intersection of the lightness curve and Bt to 0.1 ΔB based on Bt. Sv defined by the following equation (1) when the value indicating the position of the intersection closest to the mark among the intersections of the lightness curve and 0.1 ΔB in the depth range is t2.
Sv = (ΔB × 0.1) / (t1-t2) (1)
14. The method according to claim 11, wherein the position of the mark is detected by using and a laminated body of a metal and a resin is positioned based on the detected position of the mark. A method of positioning a printed wiring board having an insulating resin plate and a circuit provided on the insulating resin plate,
The circuit is photographed by the photographing means through the resin,
For the image obtained by the photographing, the brightness of each observation point is measured along the direction perpendicular to the direction in which the observed circuit extends, and an observation point-lightness graph is created.
A method of positioning a printed wiring board using a difference ΔB (ΔB = Bt−Bb) between a top average value Bt and a bottom average value Bb of a brightness curve generated from an end portion of the circuit to a portion without the circuit. A difference ΔB (ΔB = Bt−Bb) between a top average value Bt and a bottom average value Bb of a brightness curve generated from an end portion of the circuit to a portion without the circuit,
In the observation point-lightness graph, the value indicating the position of the intersection closest to the circuit among the intersections of the lightness curve and Bt is t1, and from the intersection of the lightness curve and Bt to 0.1 ΔB based on Bt. Sv defined by the following equation (1) when the value indicating the position of the intersection closest to the circuit among the intersections of the lightness curve and 0.1 ΔB in the depth range is t2.
Sv = (ΔB × 0.1) / (t1-t2) (1)
The method according to claim 15, wherein the position of the circuit is detected by using the position of the printed circuit board, and the printed wiring board is positioned based on the detected position of the circuit.   A method for manufacturing a printed wiring board, comprising the steps of positioning the printed wiring board according to the method for positioning a printed wiring board according to claim 15 or 16, and mounting a component on the positioned printed wiring board.   The method of positioning a printed wiring board according to claim 15 or 16, positioning the printed wiring board, aligning the positioned printed wiring board, and placing a component on the aligned printed wiring board. A method of manufacturing a printed wiring board including a step of mounting.   A method for positioning a printed wiring board according to claim 15 or 16, comprising the steps of positioning the printed wiring board and connecting another printed wiring board to the positioned printed wiring board. Production method.   The printed wiring board is positioned by the method for positioning a printed wiring board according to claim 15 or 16, the positioned printed wiring board is aligned, and the aligned printed wiring board is further aligned. A method of manufacturing a printed wiring board, including a step of connecting two printed wiring boards.