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JPH06160433A - Probe for inspecting circuit board and its manufacture - Google Patents

Probe for inspecting circuit board and its manufacture

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Publication number
JPH06160433A
JPH06160433A JP30914392A JP30914392A JPH06160433A JP H06160433 A JPH06160433 A JP H06160433A JP 30914392 A JP30914392 A JP 30914392A JP 30914392 A JP30914392 A JP 30914392A JP H06160433 A JPH06160433 A JP H06160433A
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JP
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Patent type
Prior art keywords
probe
circuit
material
board
bumps
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP30914392A
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Japanese (ja)
Inventor
Takahiko Iwaki
Teruaki Takamune
隆彦 岩城
瑩暁 高宗
Original Assignee
Matsushita Electric Ind Co Ltd
松下電器産業株式会社
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Abstract

PURPOSE: To provide a probe for inspection which can efficiently inspect high- density circuit board for disconnection or short-circuiting of foil.
CONSTITUTION: The title probe 10 is constituted of a multilayered flexible circuit board 12 which is formed by sticking a plurality of flexible circuit boards 12 respectively provided with both-surface bumps 13 and patterns of foil 11 to each other by heating and pressurizing with hot-fusing films 14 in between. Therefore, the intervals between contacts become extremely short, because the intervals approach the diameters of the bumps 13, and the bumps 13 can be brought into contact with a material to be inspected in an excellent state when the probe 10 is pressed against the material even when the material has an uneven thickness, because the probe 10 has flexibility.
COPYRIGHT: (C)1994,JPO&Japio

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は、実装する電子部品が小さく、また実装するLSIなどの端子ピッチが小さい高密度の回路基板の箔の断線や短絡の検出に適した回路基板検査用プローブおよびその製造方法に関する。 The present invention relates to an electronic component to be mounted is small, the circuit board inspection probe and terminal pitch is suitable for detection of foil breakage or short circuit of small dense circuit board such as a LSI that implements As a method for manufacturing.

【0002】 [0002]

【従来の技術】以下に従来の回路基板検査用プローブについて説明する。 BACKGROUND ART A conventional circuit board testing probe will be described below. 図9はその回路基板検査用プローブの要部断面図であり、従来は保持板1と保持板2とで保持された検査プローブの接触ピン3を回路基板4の箔5に接触させて、箔5の断線や短絡を電気的導通の有無によって検出していた。 Figure 9 is a fragmentary cross-sectional view of the circuit board inspection probe, and conventionally by contacting the contact pin 3 of the test probe held by the holding plate 1 and the holding plate 2 to the foil 5 of the circuit board 4, the foil 5 of disconnection or short circuit has been detected by the presence or absence of electrical conduction.

【0003】しかしながら近年、部品実装が高密度化してきており、それにともなって回路基板4の箔5の密集度も非常に高くなってきている。 However in recent years, the component mounting has been densified, it has also density of the foil 5 of the circuit board 4 becomes extremely high accordingly. そのために箔5が細くなりつつあるとともに、部品の電極端子間の間隔も小さくなってきており、それにともなって接触ピン3の保持間隔も小さくなり、かつ接触ピン3は細くなってきている。 With the foil 5 is becoming thinner in order that the spacing between the parts of the electrode terminals is also becoming smaller, the holding distance of the contact pin 3 is also reduced along with it, and the contact pins 3 are becoming thinner. この結果、接触ピン3が細くなって曲がりやすくなるという問題を生じているとともに、保持板1、2の孔加工を精度よく行うのが困難となるという問題もある。 As a result, the occurring a problem that the contact pin 3 easily bent tapered, there is a problem that to do hole drilling of the holding plate 2 precisely is difficult.

【0004】なお、検査プローブは、ソケットチューブ6および被覆付きの撚線7とからなるソケットと、接触ピン3,コイルばね8およびピンチューブ9からなるプランジャーとにより構成されている。 [0004] Incidentally, the test probe is composed of a socket consisting of a socket tube 6 and cables with stranded 7 for the contact pins 3, the plunger consisting of a coil spring 8 and pin tubes 9.

【0005】 [0005]

【発明が解決しようとする課題】すなわち、上記従来構成の回路基板検査用プローブでは、接触ピン3の間隔をさらに小さくすることは寸法上困難であり、また接触ピン3の曲がり、保持板1,2の孔加工などのために高精度で接触ピン3を組み立てるのが困難であるという問題を有していた。 [0007] That is, in the conventional configuration of a circuit board inspection probe, it is difficult on the size to further reduce the distance between the contact pins 3 and bending of the contact pins 3, the holding plate 1, to assemble the contact pins 3 with high accuracy has been a problem that it is difficult for such second hole processing.

【0006】本発明は上記問題を解決するもので、高密度の回路基板の検査を能率よく行うことのできる回路基板検査用プローブとその製造方法を提供することを目的とするものである。 [0006] The present invention is intended to solve the above problems, it is an object to provide a probe and a manufacturing method thereof for a circuit board inspection can be performed with good efficiency the inspection of high density of the circuit board.

【0007】 [0007]

【課題を解決するための手段】上記問題を解決するために、本発明の回路基板検査用プローブは、片面に箔が形成されたフレキシブル配線基板に複数のバンプを貫通させて両面に形成し、複数の前記フレキシブル配線基板をバンプ同士が接触するように接着用シート材を介して積層したものである。 In order to solve the above problems SUMMARY OF THE INVENTION The circuit board inspection probe of the present invention, the flexible wiring board foil formed on one side by penetrating the plurality of bumps formed on both sides, a plurality of said flexible wiring board in which bumps are laminated via an adhesive sheet in contact.

【0008】また、本発明の回路基板検査用プローブの製造方法は、以下の(1)〜(8)に示す工程を有するものである。 [0008] The manufacturing method of circuit board inspection probe of the present invention has the steps shown in the following (1) to (8). (1)未加工で片面箔のフレキシブル回路基板の必要箇所に箔を残して孔を形成する。 (1) leaving the foil in necessary portions of the flexible circuit board of a single-sided foil raw forming pores. (2)形成した孔に導体のメッキをほどこし、フレキシブル配線基板の箔がない側にバンプを形成する。 (2) subjecting the plating conductor forming the hole, to form a bump on the side there is no foil of the flexible wiring board. (3)箔にエッチングをほどこし、必要なパターンを形成する。 (3) foil subjected to etching to form a required pattern. (4)フレキシブル配線基板のバンプのない面におけるパターンの無い箇所にメッキをほどこしてバンプを形成する。 (4) by plating in a pattern-free portion of the bump-free surface of the flexible wiring board to form a bump. (5)上記(1)〜(4)に示す工程を複数のフレキシブル配線基板について実施する。 (5) above (1) performed for a plurality of flexible wiring board the steps shown to (4). (6)接着用シート材としての熱融着性フィルムに必要箇所に孔をあけ、複数の熱融着性フィルムについて実施する。 (6) a hole in the necessary positions on the heat-welding film as an adhesive sheet material, carried out on a plurality of heat-fusible film. (7)上記(1)〜(5)により加工した複数のフレキシブル回路基板の間に、各々必要な位置決めを行いながら、熱融着性フィルムの孔にフレキシブル回路基板のバンプが入るように熱融着性フィルムを挟んで重ねる。 (7) above (1) to between the plurality of the flexible circuit board which is processed by (5), respectively while the necessary positioning, heat as bumps of the flexible circuit board to enter the pores of the heat-sealing film superimposed across the wear-resistant film. (8)これらの熱融着性フィルムを介して積層された複数のフレキシブル回路基板同士を加熱加圧を行って接合する。 (8) joined by performing a plurality of flexible circuit boards to heat and pressure laminated through these heat-fusible film.

【0009】 [0009]

【作用】上記構成によって、電極の回路基板の箔への接触点間隔は、バンプの直径に近い値になるので、極めて小さくなり、安定して高い接触点位置精度を確保できる。 The [action] above structure, the contact point interval to the foil of the circuit board electrodes, since a value close to the diameter of the bump, becomes extremely small, can ensure a stable high contact point position accuracy. また、複数のフレキシブル配線基板を接着用シート材を介して積層した構成であり、可撓性を有するため、 Further, a structure in which laminated via an adhesive sheet material a plurality of flexible wiring board, since a flexible,
検査対象となる被検査回路基板や箔などの厚みにむらが生じていた場合でもこの回路基板検査用プローブを被検査回路基板に押し付けることにより検査対象箇所にバンプを良好に接触させることができる。 It can be good contact bumps on the inspection target portion by pressing the circuit board inspection probe even if the irregularity in thickness, such as the circuit board to be inspected or foil to be inspected has occurred in the circuit board to be inspected. さらに、フレキシブル配線基板を複数積層しているため、バンプに導通する印刷配線を引き出しやすく、検査対象箇所が多数有る場合にも対応できる。 Furthermore, since the flexible wiring board are stacked, easily pull out the printed circuit to be electrically connected to the bump, even if the inspection target portion there is a large number can handle.

【0010】また、上記製造方法により上記構成の回路基板検査用プローブを良好に製造することができる。 Further, it is possible to satisfactorily produce the circuit probe board inspection of the structure by the manufacturing method.

【0011】 [0011]

【実施例】以下、本発明の一実施例について図面を参照しながら説明する。 EXAMPLES Hereinafter, with reference to the accompanying drawings, an embodiment of the present invention. 図1に示すように、回路基板検査用プローブ10は、片面に箔11が形成されたフレキシブル配線基板12に複数のバンプ13を貫通させて両面に形成し、複数のフレキシブル配線基板12をバンプ13 As shown in FIG. 1, a circuit board inspection probe 10, the flexible wiring board 12 which foil 11 is formed on one side by penetrating the plurality of bumps 13 formed on both sides, a plurality of flexible wiring board 12 bump 13
同士が接触するように接着用シート材としての熱融着性フィルム14を介して積層して構成されている。 Each other which are laminated via a heat-welding film 14 as an adhesive sheet material to contact. つまり、熱融着性フィルム14が介装された多層のフレキシブル配線基板12において、フレキシブル配線基板12 That is, in the multilayer flexible wiring board 12 of the heat-fusible film 14 is interposed, flexible wiring board 12
のランドに導体のバンプ13を形成し、このバンプ13 Land forming a bump 13 conductors, the bump 13
に導通させたビアホール15またはスルーホール16および導体ラインによって、他のフレキシブル配線基板1 By conduction is allowed via holes 15 or the through-hole 16 and the conductor lines, the other flexible wiring board 1
2に検査対象箇所に接触するバンプ13に導通する箔1 Foil 1 which conducts the bump 13 in contact with the test object location 2
1を引き出した構成とされている。 It has a configuration in which the drawer 1.

【0012】次に、図1〜図7に基づいて回路基板検査用プローブ10の製造方法について説明する。 [0012] Next, a method for manufacturing the circuit board inspection probe 10 on the basis of FIGS. 1-7. 図2は本発明の一実施例に係る回路基板検査用プローブ10の製造方法における第一工程加工完了後のフレキシブル回路基板12の断面図である。 Figure 2 is a cross-sectional view of the flexible circuit board 12 of the first step after the completion of machining in the manufacturing method of the circuit board inspection probe 10 according to an embodiment of the present invention. この第一工程においては、ポリイミドフィルムのベースに銅箔を張ったフレキシブル回路基板12に箔11を残して孔17を形成する。 In this first step, the flexible circuit board 12 strung copper foil to the base of the polyimide film, leaving the foil 11 to form a hole 17.

【0013】図3は第二工程加工完了後のフレキシブル回路基板12の断面図である。 [0013] FIG. 3 is a cross-sectional view of the flexible circuit board 12 after the second step working completed. この第二工程では、第一工程で加工された孔17にニッケルおよび金などの導体メッキをほどこしてバンプ13を形成する。 In the second step, subjected to conductive plating, such as nickel and gold to form the bumps 13 into holes 17 which are machined in the first step.

【0014】図4は第三工程加工完了後のフレキシブル回路基板12の断面図である。 [0014] FIG. 4 is a sectional view of the flexible circuit board 12 after the third step working completed. この第三工程では、第二工程で形成されたバンプ13の反対面にエッチングにより箔パターンを形成する。 In the third step, by etching the opposite surface of the bump 13 formed in the second step to form the foil pattern.

【0015】図5は第四工程加工完了後のフレキシブル回路基板12の断面図である。 [0015] FIG. 5 is a sectional view of the flexible circuit board 12 after the fourth step working completed. この第四工程ではフレキシブル回路基板12の箔パターンが形成された面で、箔パターンが孔17にニッケルおよび金などのメッキをほどこしてバンプ13を形成する。 In this aspect the foil pattern of the flexible circuit board 12 are formed in the fourth step, the foil pattern to form bumps 13 by plating, such as nickel and gold in the hole 17.

【0016】図6は第五工程加工完了後の熱融着性フィルム14の断面図である。 [0016] FIG. 6 is a sectional view of a heat-fusible film 14 after the fifth step working completed. この第五工程では、ポリエチレンナフタレートからなる熱融着性フィルム14に、第一〜第四工程で形成したバンプ13の箇所に孔あけ加工を行う。 In the fifth step, the heat-welding film 14 made of polyethylene naphthalate, performing drilling in locations of the bump 13 formed in the first to fourth steps. 図6において、18は熱融着性フィルム14にあけられた孔である。 6, 18 is a hole drilled in the heat-sealing film 14.

【0017】図1は第六工程加工完了後の多層フレキシブル回路基板であり、つまり回路基板検査用プローブ1 [0017] Figure 1 is a multilayer flexible circuit board after the sixth step working completed, i.e. the circuit board inspection probe 1
0の断面図である。 0 is a sectional view of the. この第六工程では、熱融着性フィルム14を間にはさんで位置決めして重ねられたフレキシブル回路基板12を加熱加圧を行って積層している。 In the sixth step, and laminating the flexible circuit board 12 superimposed by interposing at positioned between the heat-fusible film 14 by heating under pressure. これにより、所定のバンプ13同士が当接されて導通されている。 Thus, given the bumps 13 to each other are conductively been abutment.

【0018】なお、本実施例においては、熱融着性フィルム14としてポリエチレンナフタレートフィルムを一例として使用したが、他の熱融着性フィルム、たとえばポリエーテルイミド、ポリエーテルスルフォンなどでもよい。 [0018] In the present embodiment has been used as an example polyethylene naphthalate film as a heat-fusible film 14, other heat-fusible film, for example, polyetherimide, or the like may be polyether sulfone.

【0019】図8は、第一〜第六工程で製造された回路基板検査用プローブ10の使用状況を示す断面図である。 [0019] FIG. 8 is a sectional view showing the usage of the circuit board inspection probe 10 manufactured by the first to sixth steps. ここで、20は被検査回路基板、21は被検査回路基板20の上に形成された箔、22は加圧板、23はゴム、24は台である。 Here, 20 circuit board to be inspected, the foil formed on the circuit board to be inspected 20 21, 22 pressing plate, 23 rubber, 24 a trapezoidal.

【0020】この回路基板検査プローブ10の動作を図8を参照しながら説明する。 [0020] be described with reference to FIG. 8 the operation of the circuit board inspection probe 10. 被検査回路基板20の箔2 Of the circuit board to be inspected 20 foil 2
1に、上面下面各々に回路基板検査用プローブ10のバンプ13を位置合わせして、加圧板22を下げる。 1, to align the bumps 13 of the circuit board inspection probe 10 on top and bottom surfaces, respectively, lowering the pressure plate 22. これによってバンプ13と被検査回路基板20の箔21とが接触して電気的導通が行われてバンプ13からビアホール15,スルーホール16(図1参照)およびフレキシブル回路基板12の箔11を経由して外部に引っ張り出されて測定部に接続され、被検査回路基板20の箔21 This way the foil 11 of the bump 13 and the via hole 15 from the foil 21 and is performed electrical continuity contact bumps 13 of the circuit board to be inspected 20, the through hole 16 (see FIG. 1) and the flexible circuit board 12 connected to the measuring unit is pulled to the outside Te, the circuit board to be inspected 20 foil 21
の断線、短絡を測定する。 Disconnection of, to measure the short-circuit.

【0021】これにより、被検査回路基板20の箔21 [0021] Thus, the circuit board to be inspected 20 foil 21
への接触点間隔は、バンプ13の直径に近い値になるので、極めて小さくなり、安定して高い接触点位置精度を確保できる。 Contact point interval to, since a value close to the diameter of the bump 13, becomes extremely small, can ensure a stable high contact point position accuracy. また、回路基板検査プローブ10が可撓性を有するため、被検査回路基板20や箔21などの厚みにむらが生じていた場合でもこの回路基板検査用プローブ10を被検査回路基板20の箔21に押し付けることにより検査対象箇所にバンプ13を良好に接触させることができる。 The circuit for board inspection probe 10 is flexible, foil circuit board to be inspected 20 and the foil 21 to be inspected of the circuit board inspection probe 10 even when the irregularity has occurred in the thickness circuit board 20, such as 21 the bumps 13 to the inspection target portion can be good contact by pressing on. さらに、フレキシブル配線基板12を複数積層しているため、バンプ13に導通する印刷配線を引き出しやすくなり、検査対象箇所が多数有る場合にも対応できる。 Furthermore, since the flexible wiring board 12 are stacked, easily pull out the printed circuit to be electrically connected to the bump 13, it is possible to cope when the inspection target portion are numerous.

【0022】なお、上記実施例に記載された第五工程において、熱融着性フィルム14に孔18をあけ、さらに、図7に示すようにその孔18に印刷法により低温硬化型の導電ペースト19、たとえば銀ペーストや銅ペーストを充填して乾燥を行ってもよい。 [0022] Incidentally, in the fifth step described above in Example, a hole 18 in the heat-fusible film 14, further, low-temperature curing type conductive paste by a printing method on the hole 18 as shown in FIG. 7 19, drying may be performed by filling for example, silver paste or copper paste. これは、導電ペースト19を使用しないで、積層しても問題無いが、接続の信頼度を上げるために導電ペーストを使用したものである。 This, without using conductive paste 19, although no problem be laminated is obtained by using the conductive paste in order to increase the reliability of the connection. その他の手順は上記実施例と同様である。 Other procedures are the same as in the above embodiment.

【0023】 [0023]

【発明の効果】以上のように本発明によれば、片面に箔が形成されたフレキシブル配線基板に複数のバンプを貫通させて形成し、複数の前記フレキシブル配線基板をバンプ同士が接触するように接着用シート材を介して積層することにより、電極の回路基板の箔への接触点間隔は、バンプの直径に近い値になるので、極めて小さくなり、安定して高い接触点位置精度を確保できる。 According to the present invention as described above, according to the present invention, formed by penetrating the plurality of bumps on the flexible wiring board foil on one side is formed, a plurality of the flexible wiring board as the bumps come into contact with each other by laminated via an adhesive sheet material, the contact point interval to the foil of the circuit board electrodes, since a value close to the diameter of the bump, becomes extremely small, it can ensure a stable high contact point position precision . また、 Also,
複数の前記フレキシブル配線基板を接着用シート材を介して積層した構成であり、可撓性を有するため、検査対象となる被検査回路基板や箔などの厚みにむらが生じていた場合でもこの回路基板検査用プローブを被検査回路基板に押し付けることにより検査対象箇所にバンプを良好に接触させることができる。 And a plurality of said flexible wiring board is formed by laminating via an adhesive sheet material, because of its flexibility, even if the irregularity has occurred in the thickness of such circuit board to be inspected or foil to be inspected this circuit the bumps in the inspection target portion by pressing the probe substrate inspection circuit board to be inspected can be good contact. さらに、フレキシブル配線基板を複数積層しているため、バンプに導通する印刷配線を引き出しやすく、検査対象箇所が多数有る場合にも対応できる。 Furthermore, since the flexible wiring board are stacked, easily pull out the printed circuit to be electrically connected to the bump, even if the inspection target portion there is a large number can handle.

【0024】また、バンプ同士の接触部に導電ペーストを充填することにより、回路基板検査用プローブの信頼性を向上させることができる。 Further, by filling the conductive paste to the contact portion of the bumps, it is possible to improve the reliability of the circuit board inspection probe. また、未加工で片面箔のフレキシブル回路基板の必要箇所に箔を残して孔を形成し、形成した孔に導体のメッキをほどこし、フレキシブル配線基板の箔がない側にバンプを形成し、箔にエッチングをほどこし、必要なパターンを形成し、フレキシブル配線基板のバンプのない面におけるパターンの無い箇所にメッキをほどこしてバンプを形成し、接着用シート材としての熱融着性フィルムに必要箇所に孔をあけ、複数のフレキシブル回路基板の間に、各々必要な位置決めを行いながら、熱融着性フィルムの孔にフレキシブル回路基板のバンプが入るように熱融着性フィルムを挟んで重ね、これらの熱融着性フィルムを介して積層された複数のフレキシブル回路基板同士を加熱加圧を行って接合することにより、上記構成の回路基板検査用プロ Further, the hole is formed by leaving the foil in necessary portions of the flexible circuit board of a single-sided foil raw, subjected to plating of the formed hole in the conductor, to form a bump on the side there is no foil of the flexible wiring board, the foil subjected to etching to form a required pattern, to form a bump by plating a pattern-free portion of the bump-free surface of the flexible wiring board, the hole in the necessary positions on the heat-welding film as an adhesive sheet material the open, between a plurality of flexible circuit boards, respectively while the necessary positioning, overlapping across the heat-fusible film as bumps of the flexible circuit board to enter the pores of the heat-fusible film, these heat by joining by heating under pressure a plurality of flexible circuit boards which are laminated through the fusion-bondable film, pro circuit board inspection of the structure ブを良好に製造することができる。 It can be satisfactorily produce drive.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の一実施例に係る回路基板検査用プローブの断面図 Sectional view of a circuit board inspection probe according to an embodiment of the present invention; FIG

【図2】同回路基板検査用プローブの製造方法における第一工程を示す断面図 Sectional view showing a first step in Figure 2. The process of the circuit board inspection probe

【図3】同回路基板検査用プローブの製造方法における第二工程を示す断面図 Sectional view showing a second step in FIG. 3 method for manufacturing the circuit board inspection probe

【図4】同回路基板検査用プローブの製造方法における第三工程を示す断面図 Sectional view showing a third step in FIG. 4. The method of the circuit board inspection probe

【図5】同回路基板検査用プローブの製造方法における第四工程を示す断面図 Cross-sectional view illustrating a fourth step in Figure 5. The method of the circuit board inspection probe

【図6】同回路基板検査用プローブの製造方法における第五工程を示す断面図 Cross-sectional view illustrating a fifth step in FIG. 6 method for manufacturing the circuit board inspection probe

【図7】同回路基板検査用プローブの使用例の断面図 7 is a cross-sectional view of examples of using the same circuit board inspection probe

【図8】本発明の回路基板検査用プローブの製造方法の他の実施例を示す断面図 Sectional view showing another embodiment of a method of manufacturing a circuit board inspection probe of the present invention; FIG

【図9】従来の回路基板検査用プローブの断面図 Figure 9 is a cross-sectional view of a conventional circuit board inspection probe

【符号の説明】 DESCRIPTION OF SYMBOLS

10 回路基板検査用プローブ 11 箔 12 フレキシブル配線基板 13 バンプ 14 熱融着性フィルム(接着用シート材) 17,18 孔 19 導電ペースト 10 circuit board inspection probe 11 foil 12 flexible wiring board 13 bumps 14 heat fusible film (adhesive sheet) 17, 18 holes 19 conductive paste

Claims (4)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 片面に箔が形成されたフレキシブル配線基板に複数のバンプを貫通させて両面に形成し、複数の前記フレキシブル配線基板をバンプ同士が接触するように接着用シート材を介して積層した回路基板検査用プローブ。 1. A by through a plurality of bumps on the flexible wiring board foil formed on one side are formed on both sides, a plurality of the flexible wiring substrate through the adhesive sheet material as the bumps come into contact with each other stacked circuit board inspection probe.
  2. 【請求項2】 バンプ同士の接触部に導電ペーストが充填されてなる請求項1記載の回路基板検査用プローブ。 2. A method according to claim 1 circuit board inspection probe according to the conductive paste to the contact portion of the bumps is filled.
  3. 【請求項3】 以下の(1)〜(8)に示す工程を有する回路基板検査用プローブの製造方法。 Wherein the following (1) to method of manufacturing a circuit board inspection probe having the steps shown in (8). (1)未加工で片面箔のフレキシブル回路基板の必要箇所に箔を残して孔を形成する。 (1) leaving the foil in necessary portions of the flexible circuit board of a single-sided foil raw forming pores. (2)形成した孔に導体のメッキをほどこし、フレキシブル配線基板の箔がない側にバンプを形成する。 (2) subjecting the plating conductor forming the hole, to form a bump on the side there is no foil of the flexible wiring board. (3)箔にエッチングをほどこし、必要なパターンを形成する。 (3) foil subjected to etching to form a required pattern. (4)フレキシブル配線基板のバンプのない面におけるパターンの無い箇所にメッキをほどこしてバンプを形成する。 (4) by plating in a pattern-free portion of the bump-free surface of the flexible wiring board to form a bump. (5)上記(1)〜(4)に示す工程を複数のフレキシブル配線基板について実施する。 (5) above (1) performed for a plurality of flexible wiring board the steps shown to (4). (6)接着用シート材としての熱融着性フィルムに必要箇所に孔をあけ、複数の熱融着性フィルムについて実施する。 (6) a hole in the necessary positions on the heat-welding film as an adhesive sheet material, carried out on a plurality of heat-fusible film. (7)上記(1)〜(5)により加工した複数のフレキシブル回路基板の間に、各々必要な位置決めを行いながら、熱融着性フィルムの孔にフレキシブル回路基板のバンプが入るように熱融着性フィルムを挟んで重ねる。 (7) above (1) to between the plurality of the flexible circuit board which is processed by (5), respectively while the necessary positioning, heat as bumps of the flexible circuit board to enter the pores of the heat-sealing film superimposed across the wear-resistant film. (8)これらの熱融着性フィルムを介して積層された複数のフレキシブル回路基板同士を加熱加圧を行って接合する。 (8) joined by performing a plurality of flexible circuit boards to heat and pressure laminated through these heat-fusible film.
  4. 【請求項4】 熱融着性フィルムに形成した孔に低温硬化型導電ペーストを充填し、この低温硬化型導電ペーストを介してフレキシブル配線基板のバンプ同士を接触させて複数のフレキシブル回路基板同士を接合する請求項3記載の回路基板検査用プローブの製造方法。 4. filled with low-temperature curing type conductive paste in the hole formed in the heat-sealing film, a plurality of flexible circuit boards are brought into contact with bumps of the flexible wiring board through the low-temperature curing type conductive paste 3. method of manufacturing a circuit board inspection probe according joining.
JP30914392A 1992-11-19 1992-11-19 Probe for inspecting circuit board and its manufacture Pending JPH06160433A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30914392A JPH06160433A (en) 1992-11-19 1992-11-19 Probe for inspecting circuit board and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30914392A JPH06160433A (en) 1992-11-19 1992-11-19 Probe for inspecting circuit board and its manufacture

Publications (1)

Publication Number Publication Date
JPH06160433A true true JPH06160433A (en) 1994-06-07

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ID=17989431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30914392A Pending JPH06160433A (en) 1992-11-19 1992-11-19 Probe for inspecting circuit board and its manufacture

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Country Link
JP (1) JPH06160433A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6664625B2 (en) 2002-03-05 2003-12-16 Fujitsu Limited Mounting structure of a semiconductor device
KR100754086B1 (en) * 2006-01-26 2007-08-31 삼성전기주식회사 Probe Card and Method of Fabrication thereof
JP2007292781A (en) * 2007-06-25 2007-11-08 Hoya Corp Contact board and components thereof
KR101365769B1 (en) * 2013-08-27 2014-02-20 (주)메가일렉트로닉스 Manufacturing method of probecard
JP2014074706A (en) * 2012-09-14 2014-04-24 Jx Nippon Mining & Metals Corp Visibility evaluation method for transparent base material, positioning method for laminate and manufacturing method for printed circuit board
JP2014095680A (en) * 2012-10-12 2014-05-22 Jx Nippon Mining & Metals Corp Transparent base material visibility evaluation device, transparent base material visibility evaluation program, computer readable recording medium having transparent base material visibility evaluation program recorded, laminated body positioning device, laminated body positioning program, computer readable recording medium having the same recorded and printed wiring board manufacturing method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6664625B2 (en) 2002-03-05 2003-12-16 Fujitsu Limited Mounting structure of a semiconductor device
KR100754086B1 (en) * 2006-01-26 2007-08-31 삼성전기주식회사 Probe Card and Method of Fabrication thereof
JP2007292781A (en) * 2007-06-25 2007-11-08 Hoya Corp Contact board and components thereof
JP2014074706A (en) * 2012-09-14 2014-04-24 Jx Nippon Mining & Metals Corp Visibility evaluation method for transparent base material, positioning method for laminate and manufacturing method for printed circuit board
JP2014095680A (en) * 2012-10-12 2014-05-22 Jx Nippon Mining & Metals Corp Transparent base material visibility evaluation device, transparent base material visibility evaluation program, computer readable recording medium having transparent base material visibility evaluation program recorded, laminated body positioning device, laminated body positioning program, computer readable recording medium having the same recorded and printed wiring board manufacturing method
KR101365769B1 (en) * 2013-08-27 2014-02-20 (주)메가일렉트로닉스 Manufacturing method of probecard

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