JP3040682U - Printed circuit - Google Patents

Abstract

(57) Abstract: In a printed circuit, a terminal portion or a connecting portion with another printed circuit is formed by a conductor thin plate integrated with a circuit pattern in the same step as the formation of the circuit pattern. SOLUTION: A semi-cured thermosetting resin sheet 2 is laid on one surface of a conductor thin plate 1 leaving a portion 11 to be a terminal portion of a circuit and / or a portion 10 to be connected to another circuit. The connection portion between the circuit pattern P and the terminal portion and / or another circuit is simultaneously formed on the conductor thin plate by etching, and then the resin sheet portion is fitted around the terminal portion and / or the connection portion and the thickness of the conductor thin plate. The semi-finished product after the etching process is fitted into the spacer 5 described above, and the resin sheet is cured by pressurizing and heating from above and below, and the surface of the pattern P of the conductor thin plate is flush with the surface of the resin sheet 2. Then, the terminal portion 11 and / or the connecting portion 10 were brought out of this resin sheet.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a printed circuit in which a terminal portion and the like are integrally formed with a circuit pattern by a thin conductor plate.

[0002]

[Prior art]

 Normally, in a printed circuit, terminals and connections to other circuits are made separately from the circuit pattern of the printed circuit, and these are soldered to the printed circuit. As a result, the assembly work of the electric device using the printed circuit becomes complicated, and the soldered part may cause trouble. For this reason, a circuit pattern is punched out from a thin conductor plate, and this is pasted onto a board.The terminals and other circuit connections are integrally punched from the same conductor as these circuit patterns. A method has been proposed.

[0003]

[Problems to be solved by the device]

 The above-described method of punching and forming the circuit pattern and the terminal portion from the same thin conductor plate has the following problems. 1. Since a die for punching is used, the equipment cost is high, and it is not possible to make an arbitrarily precise circuit pattern due to the limit of the die manufacturing technology. 2. It is necessary to provide a connecting portion around the entire circuit pattern in order to prevent the circuit patterns from being separated when the circuit patterns are punched out. That is, since the circuit pattern is punched out from the base material larger than the entire circuit pattern, leaving the peripheral portion, the process of adhering the circuit pattern to the substrate and then removing unnecessary peripheral portions is involved, and material loss is caused. Also increases.

[0004]

[Means for Solving the Problems]

 The printed circuit is embedded in the circuit board so that the surface of the printed circuit board and the surface of the printed circuit pattern are on the same surface. The printed circuit's terminals or the connection with other circuits is the circuit pattern of the printed circuit. It was formed by etching together with the circuit pattern from the same thin conductor plate as above, and was formed so as to project from the peripheral edge of the circuit board.

[0005]

[Embodiment of the invention]

 FIG. 1 shows an example of an embodiment of the present invention. This figure shows the shapes of the intermediate stages of the manufacturing process until the printed circuit of the present invention is completed. In FIG. 1, reference numeral 1 denotes a conductor thin plate which constitutes a printed circuit, and in this example, Ni having a thickness of 0.2 mm is used. This conductor thin plate may be Cu. A suitable thickness is 0.08 to 0.2 mm. A part of this thin conductor plate directly serves as the terminal portion 11 and serves as a connecting portion 10 between the two printed circuits a and b. The thickness of the conductor thin plate 1 is determined by the strength requirement of the terminal portion and the joint portion, and this strength requirement manufactures the electric device more than when the electric device incorporating the printed circuit is used. At this time, it depends on what kind of force the printed circuit receives (during movement from step to step, attachment to a jig, etc.). 2 is an epoxy resin sheet that serves as a circuit board, and has a glass cloth backing 3 on its back surface. 4 is a resist, 5 is a spacer, and 6 is a release paper. A resin sheet 2 lined with a glass cloth 3 has a semi-cured surface on which a conductor thin plate 1 is adhered, a resist layer 4 is provided thereon, and a circuit pattern P is formed by etching (A and B in FIG. 1). Here, at the terminal portion 11 and the connecting portion 10 of the circuit, the conductor thin plate 1 is exposed outside the resin sheet 2, and the back surface of this portion is also coated with a resist.

As described above, in the case of this embodiment, a printed circuit can be formed in a form in which two printed circuits are connected by the connecting portion 10. The reason why the circuit is divided into two parts in this way is that the printed circuit can be installed along the two corners of the inside of the casing of the electric device. When providing a printed circuit together, two circuits were made separately, and the connection part was connected by soldering or the flexible printed circuit was used. After forming the circuit pattern of the printed circuit obtained as described above, as shown in FIG. 1C, this printed circuit is put into the spacer 5 of the stainless plate, and the release paper 6 is applied to the upper and lower surfaces of the printed circuit, The semi-cured resin sheet 2 is cured by heating and pressing. The spacer 5 is a stainless steel plate having a thickness of a printed circuit, that is, a thickness of the resin sheet 2 and a thickness of the conductor thin plate 1, and in the case of this embodiment, a window 60 having a size capable of accommodating two circuits, 61 is punched out, and the terminal portion 11 and the connecting portion 10 are exposed outside the window. Where the spacer 5 contacts the terminals and joints outside the windows 60 and 61, the thickness of the conductor thin plate 1 (0.2 mm in this example) is marked 51. Although heating and pressurization are performed in this manner, a heating temperature of about 180 ° is suitable.

When the resin sheet is completely hardened in this way, as shown in FIG. 1D, the layer of the resin sheet 2 enters between the circuit patterns, and the circuit pattern is exposed in the layer of the resin sheet 2 with its surface exposed. It will be buried in the. When the printed circuit is taken out from the spacer 5 here, a printed circuit as shown in FIG. 1D is obtained. An insulating layer 7 is formed by printing on the surface of this printed circuit except for the important points, and where the insulating layer is not attached, the exposed circuit pattern is solder paste for connecting parts according to the purpose. 9 is printed, and the adhesive 8 for temporarily attaching the parts is printed on the place where the circuit parts should be attached (FIG. 1E).

FIG. 2 shows a finished product of the printed circuit obtained as described above. Reference numeral 12 denotes a circuit component which is adhered to a printed circuit board, melts solder glue, and is connected to a circuit. The terminal portion 11 is bent and held by an insulator holder 13, and the holder 13 is attached to the casing of the electric device. The holder 13 is provided with a groove 13a for accommodating each conductor of the terminal portion 11 in advance, and the positions of the terminal portions are fixed to each other. FIG. 3 shows a state in which the printed circuit is housed in the housing 14 of the electric device. The printed circuit is bent at the connecting portion 10, and two printed circuits a and b are provided along two surfaces of the housing 14 that directly intersect with each other, that is, a bottom surface and a rear surface.

[0009]

EFFECTS OF THE INVENTION The printed circuit of the present invention has the above-described configuration, and the resin sheet is attached only to the circuit portion of the conductor thin plate, and the portion not attached to the resin sheet is used for the terminal portion of the circuit or the plurality of circuits. Since the connecting parts are used, these parts are prepared separately from the printed circuit and are attached to the printed circuit by soldering, etc., which simplifies the manufacturing process and eliminates electrical connections. The reliability of the device has been improved, and it has not been said that a large amount of capital investment such as a die and the generation of a cut-off portion are required when the terminal part is integrally formed with the circuit pattern by the circuit pattern punching method. It is possible to supply printed circuits at a very low cost.

[Brief description of the drawings]

FIG. 1 is a diagram showing an embodiment of the present invention in the order of manufacturing steps.

FIG. 2 is a perspective view of the printed circuit finished product.

FIG. 3 is a perspective view showing a state in which the printed circuit is incorporated in a housing of an electric device.

[Explanation of reference numerals] 1 conductor thin plate 2 resin sheet 3 glass cloth 4 resist 5 spacer 6 release paper 7 insulating layer 8 adhesive material 9 solder glue 10 connecting portion 11 terminal portion 12 circuit component 13 holder 14 housing of electric device

Claims (1)

[Utility model registration claims] 1. The surface of the circuit board of the resin sheet and the surface of the circuit pattern of the printed circuit are flush with each other, and the terminal portion of the printed circuit and / or the connecting portion with other circuits are the circuit patterns. It is formed by etching together with the circuit pattern from the same thin conductor plate as
A printed circuit characterized in that it is formed so as to protrude from the peripheral edge of the circuit board.