JP3358946B2 - Method of forming conductive bump on wiring board - Google Patents
Method of forming conductive bump on wiring boardInfo
- Publication number
- JP3358946B2 JP3358946B2 JP21890296A JP21890296A JP3358946B2 JP 3358946 B2 JP3358946 B2 JP 3358946B2 JP 21890296 A JP21890296 A JP 21890296A JP 21890296 A JP21890296 A JP 21890296A JP 3358946 B2 JP3358946 B2 JP 3358946B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive bump
- wiring board
- mold
- conductive
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Description
【０００１】[0001]
【発明の属する技術分野】この発明は配線板に他の電気
部品と電気的に加圧接触するための導電バンプを形成す
る方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a conductive bump on a wiring board for making electrical contact with another electric component.
【０００２】[0002]
【従来の技術】従来、例えば配線板に上記導電バンプを
形成する場合、図１Ａに示すように、リード４を有する
配線板１の表面にホトレジスト層２を形成し、該ホトレ
ジスト層２に形成された孔３の内底にリード４の極部を
露出させ、該リード４の露出部表面に孔内において導電
金属（導電バンプ）５を電解にてメッキ成長させ、図１
Ｂに示すように上記ホトレジスト層２を除去する方法
（方法Ａと呼ぶ）や、リードの所定位置に導電ペースト
を印刷して上記導電バンプを形成する方法等が採られて
いた。2. Description of the Related Art Conventionally, for example, when the above-mentioned conductive bumps are formed on a wiring board, as shown in FIG. 1A, a photoresist layer 2 is formed on the surface of a wiring board 1 having leads 4 and formed on the photoresist layer 2. The pole portion of the lead 4 is exposed at the inner bottom of the hole 3 and a conductive metal (conductive bump) 5 is electrolytically plated and grown on the exposed surface of the lead 4 in the hole.
As shown in B, a method of removing the photoresist layer 2 (referred to as method A), a method of forming a conductive bump by printing a conductive paste on a predetermined position of a lead, and the like have been adopted.
【０００３】[0003]
【発明が解決しようとする課題】然しながら、上記方法
では配線板１に導電バンプを形成する個所が制限され
る。即ち、ホトレジスト層を形成でき且つ電解メッキの
ための電源供給の可能な個所となる。一般にホトレジス
ト層は感光性フィルムをラミネート（密着）することで
行なうが、その密着性を向上するため少なくとも配線板
１の導電バンプ形成部分を密着性向上のための酸処理や
表面粗化等の前処理が必要になる。従って、そのプロセ
スも複雑となる。従って又このプロセスを経るため、上
記導電バンプを配線板を含めた電気部品の所定位置に精
度良く設けることが難しい。更に印刷法による導電バン
プ形成では特に高い精度は望めない。即ち上記何れの方
法も導電バンプを均一の大きさにして所要形状（先端が
尖った形状等）を付与することが困難で、バンプの設置
位置と高さ、大きさ等にバラツキを生じ、形状付与の自
由度に欠ける問題を有していた。However, in the above method, the places where the conductive bumps are formed on the wiring board 1 are limited. That is, it is a place where a photoresist layer can be formed and power can be supplied for electrolytic plating. Generally, the photoresist layer is formed by laminating (adhering) a photosensitive film. In order to improve the adhesion, at least a portion of the wiring board 1 where the conductive bumps are to be formed is subjected to acid treatment or surface roughening for improving the adhesion. Processing is required. Therefore, the process becomes complicated. Therefore, since this process is performed, it is difficult to accurately provide the conductive bumps at predetermined positions of electric components including the wiring board. Further, particularly high precision cannot be expected in the formation of conductive bumps by a printing method. In other words, it is difficult to make the conductive bumps uniform in size and to give a required shape (shape with a sharp tip, etc.) by any of the above methods. There was a problem that the degree of freedom of the application was lacking.
【０００４】[0004]
【課題を解決するための手段】本発明は配線板のリード
表面に加圧接触用の導電バンプを形成する方法であっ
て、上記導電バンプを配置すべき位置と大きさと形状を
付与した凹所を有する導電金属板から成る型を用い、該
型の表面を上記凹所と対応する多数の孔を有するメッキ
レジスト層で覆い、上記凹所内で導電バンプをメッキ成
長により成形すると共に、該導電バンプを上記メッキレ
ジスト層の孔で制限しつつ該孔内に達する高さにメッキ
成長せしめ、上記メッキレジスト層を除去して上記型の
凹所の開口部から突出する導電バンプを成形する。SUMMARY OF THE INVENTION The present invention relates to a method of forming a conductive bump for pressure contact on a lead surface of a wiring board, comprising a recess having a position, a size and a shape where the conductive bump is to be arranged. The surface of the mold is covered with a plating resist layer having a number of holes corresponding to the recesses, and a conductive bump is formed in the recess by plating growth. Is grown by plating to a height that reaches the inside of the hole while limiting the hole with the plating resist layer, and the plating resist layer is removed to form a conductive bump projecting from the opening of the concave portion of the mold.
【０００５】そして上記型の表面に上記配線板を重ね、
該重合面に加圧力と加熱を与えて上記導電バンプを上記
突出部を以って上記配線板のリード表面に融着し、上記
型の離脱により上記リード表面への導電バンプの転着を
図る。[0005] Then, the wiring board is placed on the surface of the mold,
The conductive bump is fused to the lead surface of the wiring board through the protrusion by applying pressure and heat to the superposed surface, and the conductive bump is transferred to the lead surface by releasing the mold. .
【０００６】上記導電バンプを必要とする配線板はリー
ドフレームや配線回路基板である。リードフレームはフ
レキシブルな絶縁シート、例えば合成樹脂フィルムの表
面に多数のリードが微小ピッチで並列して延在してお
り、このリード端を液晶部品の電極に加圧接触させ、検
査装置と接続する接続媒体として用いられる。The wiring board requiring the conductive bump is a lead frame or a wiring circuit board. The lead frame has a large number of leads extending in parallel at a fine pitch on the surface of a flexible insulating sheet, for example, a synthetic resin film. The lead ends are brought into pressure contact with the electrodes of the liquid crystal component, and connected to an inspection device. Used as a connection medium.
【０００７】上記リードフレームにおけるリード端に上
記導電バンプを形成し、この導電バンプを以って電極に
対する加圧接触力を向上せしめる。[0007] The conductive bump is formed on the lead end of the lead frame, and the pressure contact force to the electrode is improved by using the conductive bump.
【０００８】[0008]
【発明の実施の形態】最初に上記導電バンプをメッキ成
長により形成する例を図２に基いて説明する。図２Ａに
示すように、導電金属板１ａの表面に、該表面で開口す
る凹所１ｂを多数形成したバンプ成形型１を準備する。
この型１は例えばステンレススチールから成る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First, an example in which the conductive bumps are formed by plating growth will be described with reference to FIG. As shown in FIG. 2A, a bump forming die 1 having a large number of recesses 1b opened on the surface of a conductive metal plate 1a is prepared.
The mold 1 is made of, for example, stainless steel.
【０００９】上記バンプ成形型１の表面をメッキレジス
ト層２で覆い、該メッキレジスト層２には上記凹所１ｂ
と対応する多数の孔２ａを形成する。The surface of the bump mold 1 is covered with a plating resist layer 2, and the plating resist layer 2 has the recess 1b.
And a large number of holes 2a corresponding to are formed.
【００１０】次で図２Ｂに示すように、上記凹所１ｂ内
において導電金属をメッキ成長させ、該メッキ成長され
た導電金属により凹所１ｂの形状に応じた導電バンプ３
を成形する。Next, as shown in FIG. 2B, a conductive metal is plated and grown in the recess 1b, and the conductive bump 3 corresponding to the shape of the recess 1b is formed by the plated and grown conductive metal.
Is molded.
【００１１】この導電バンプ３は図２Ｂに示すように、
メッキレジスト層２の孔２ａで制限しつつ、該孔２ａ内
に達する高さにメッキ成長せしめる。The conductive bumps 3 are, as shown in FIG.
While being restricted by the holes 2a of the plating resist layer 2, plating is grown to a height reaching the inside of the holes 2a.
【００１２】次に図２Ｃに示すように、上記図２Ｂのメ
ッキレジスト層２を除去して、型１の凹所１ｂ内に該凹
所を満たしつつ、その開口面において露出する導電バン
プ３を成形し（図示の例においては凹所１ｂの開口面か
ら突出する導電バンプ３が成形される）、このようにメ
ッキレジスト層２を除去した後図２Ｄの工程を行う。Next, as shown in FIG. 2C, the plating resist layer 2 shown in FIG. 2B is removed, and the conductive bump 3 exposed at the opening surface is filled in the recess 1b of the mold 1 while filling the recess. After forming (in the example shown, the conductive bumps 3 protruding from the opening surfaces of the recesses 1b), the plating resist layer 2 is removed in this way, and then the step of FIG. 2D is performed.
【００１３】次で図２Ｄに示すように、上記型１の表面
に配線板４を重ね、重合面に加圧力を与えつつ加熱し、
上記導電バンプ３を配線板４のリード４ａに融着し、図
２Ｅに示すように型１を離脱する。よって導電バンプ３
を配線板４のリード４ａに転着する。Next, as shown in FIG. 2D, a wiring board 4 is placed on the surface of the mold 1 and heated while applying pressure to the superposed surface.
The conductive bumps 3 are fused to the leads 4a of the wiring board 4, and the mold 1 is released as shown in FIG. 2E. Therefore, the conductive bump 3
Is transferred to the lead 4a of the wiring board 4.
【００１４】図２Ｃにおける加圧と加熱は、図２Ｄ′に
示すようにヒータ５を内蔵するヒータブロック６を形成
し、該ヒータブロック６を配線板２の上面に重ねて、型
１の表面に重ねられた同配線板２を型１に向け加圧しつ
つ、ヒータ５により加熱することにより上記導電バンプ
３を配線板４のリード４ａの表面に融着し、転着する。Pressing and heating in FIG. 2C are performed by forming a heater block 6 having a built-in heater 5 as shown in FIG. 2D ', and superimposing the heater block 6 on the upper surface of the wiring board 2 so as to cover the surface of the mold 1. The conductive bumps 3 are fused to the surfaces of the leads 4a of the wiring board 4 by being heated by the heater 5 while the stacked wiring boards 2 are pressed toward the mold 1, and transferred.
【００１５】上記配線板４のリード４ａの表面には予め
ハンダ１１を設置し、このハンダ１１を上記加熱により
溶融しつつ導電バンプ３をリード４ａに融着する方法を
採ることができる。又導電バンプ側に半田メッキを行い
リード４ａに融着する方法を採ることもできる。又型１
の凹所１ｂから導電バンプ３を離反し易くする手段とし
て、換言すると型１の凹所１ｂから配線板４の導体部へ
の転着を容易にする手段として、上記凹所１ｂの内表面
に型１を形成する金属による金属酸化被膜１２を形成し
て置く。この金属酸化被膜１２によって導電バンプ３は
型１から離反し易くなり、配線板４への転着が確実にな
される。或いは凹所１ｂの内面にテフロン等の離型剤を
コートし、同様な効果を得ることができる。A method can be adopted in which solder 11 is previously provided on the surface of the lead 4a of the wiring board 4, and the conductive bump 3 is fused to the lead 4a while the solder 11 is melted by the heating. Alternatively, a method of performing solder plating on the conductive bump side and fusing it to the lead 4a may be adopted. Mold 1
As means for facilitating separation of the conductive bumps 3 from the recesses 1b of the mold 1, in other words, as means for facilitating transfer from the recesses 1b of the mold 1 to the conductors of the wiring board 4, the inner surface of the recess 1b is provided. A metal oxide film 12 of the metal forming the mold 1 is formed and placed. The conductive bump 3 is easily separated from the mold 1 by the metal oxide film 12, and the transfer to the wiring board 4 is reliably performed. Alternatively, the same effect can be obtained by coating the inner surface of the recess 1b with a release agent such as Teflon.
【００１６】斯くして図２Ｅに示すように、配線板４の
表面に形成されたリード４ａの表面に導電バンプ３を突
出部を以って強固に付着し、この導電バンプ３を相手側
電気部品との加圧接触に供する。上記配線板４とはリー
ドフレーム又は配線回路基板の何れかである。Thus, as shown in FIG. 2E, the conductive bump 3 is firmly attached to the surface of the lead 4a formed on the surface of the wiring board 4 with a protruding portion. Provide pressure contact with parts. The wiring board 4 is either a lead frame or a wiring circuit board.
【００１７】図３Ａ、Ｂに示すように、上記リードフレ
ーム７は可撓性を有する絶縁シート、例えば合成樹脂フ
ィルムの表面に微小ピッチで並列して延在する多数のリ
ード７ａを有し、図２の方法によって該リード７ａの端
部表面に上記導電バンプ３を強固に結合せしめる。As shown in FIGS. 3A and 3B, the lead frame 7 has a large number of leads 7a extending in parallel at a fine pitch on the surface of a flexible insulating sheet, for example, a synthetic resin film. By the method 2, the conductive bumps 3 are firmly bonded to the end surfaces of the leads 7a.
【００１８】上記リードフレーム７は図３Ｂに示すよう
に、液晶部品８の電極８ａに加圧接触して検査装置等と
の接触媒体として機能し、上記導電バンプ３は液晶部品
等の接触対象との加圧接触手段となる。As shown in FIG. 3B, the lead frame 7 comes into pressure contact with the electrode 8a of the liquid crystal component 8 to function as a contact medium with an inspection device or the like. Of pressure contact.
【００１９】図３Ｂにおいて、９は上記フレキシブルリ
ードフレームの端部を液晶部品８等の接触対象に押圧す
る押え治具であり、該押え治具９の加圧により、リード
フレーム７の端部を撓ませつつ、上記導電バンプ３を電
極８ａに加圧接触せしめる。In FIG. 3B, reference numeral 9 denotes a pressing jig for pressing the end of the flexible lead frame against a contact object such as the liquid crystal component 8. The pressing jig 9 presses the end of the lead frame 7. While bending, the conductive bump 3 is brought into pressure contact with the electrode 8a.
【００２０】又上記配線板４が電気回路を形成した配線
回路基板である場合には、電気回路を形成するリード表
面の導電バンプ３は上記リードフレーム７と同様、相手
側電気部品との加圧接触に供される。When the wiring board 4 is a wiring circuit board on which an electric circuit is formed, the conductive bumps 3 on the surface of the lead forming the electric circuit are pressed against the mating electric component similarly to the lead frame 7. Provided for contact.
【００２１】上記の通り型１はバンプの成形型と転写板
としての機能を有する。As described above, the mold 1 has a function as a bump mold and a transfer plate.
【００２２】上記型１に形成された凹所１ｂはバンプ３
に先端が尖った形状を付与する。或いは凹所１ｂによっ
てバンプ３を台形又は半球形に成形したり、これらバン
プ３の表面に突起を形成することが可能である。The recess 1b formed in the mold 1 has bumps 3
To the tip. Alternatively, the bumps 3 can be formed into a trapezoidal or hemispherical shape by the recesses 1b, or projections can be formed on the surfaces of the bumps 3.
【００２３】[0023]
【発明の効果】本発明によれば、配線板のリードの所定
位置に均一な導電バンプを高精度に付有せしめることが
できる。According to the present invention, a uniform conductive bump can be provided at a predetermined position of a lead of a wiring board with high precision.
【００２４】上記導電バンプの形状や位置、高さ、大き
さ等は型の凹所によって適正に定まり、又適用目的に応
じた形状を自由に与えることができる。The shape, position, height, size, and the like of the conductive bump are properly determined by the concave portions of the mold, and the shape can be freely given according to the purpose of application.
【００２５】又配線板におけるリードの微小ピッチ化に
有効に対処でき、微小ピッチの多数の導電バンプを一括
して簡単に付有せしめることができ、コストダウンを達
成できる。Also, it is possible to effectively cope with the miniaturization of the leads in the wiring board, and it is possible to easily provide a large number of conductive bumps having a fine pitch in a lump, thereby achieving a cost reduction.
【図１】Ａ，Ｂは従来の配線板に導電バンプを付有せし
める例を工程順に示す断面図。FIGS. 1A and 1B are cross-sectional views showing an example of attaching a conductive bump to a conventional wiring board in the order of steps.
【図２】Ａ乃至Ｅは本発明におけるメッキ成長によって
成形した導電バンプを配線板に付有せしめる例を工程順
に説明する断面図。FIGS. 2A to 2E are cross-sectional views illustrating an example of attaching a conductive bump formed by plating growth to a wiring board according to the present invention in the order of steps.
【図３】Ａは導電バンプを付有させたリードフレームの
斜視図、Ｂは該リードフレームと液晶部品の加圧接触状
態を示す断面図。FIG. 3A is a perspective view of a lead frame provided with conductive bumps, and FIG. 3B is a cross-sectional view showing a state of pressure contact between the lead frame and a liquid crystal component.
１ 型 １ａ 導電金属板 １ｂ 凹所 ２ メッキレジスト層 ３ 導電バンプ ４ 配線板 ４ａ リード ７ リードフレーム Reference Signs List 1 mold 1a conductive metal plate 1b recess 2 plating resist layer 3 conductive bump 4 wiring board 4a lead 7 lead frame
───────────────────────────────────────────────────── フロントページの続き (72)発明者 奥野 敏雄 神奈川県横浜市港北区綱島東４丁目８番 29号 株式会社双晶テック内 (56)参考文献 特開 昭63−45888（ＪＰ，Ａ) 特開 昭63−45891（ＪＰ，Ａ) 特開 平３−73549（ＪＰ，Ａ) 特開 平４−101371（ＪＰ，Ａ) 特開 平５−325669（ＪＰ，Ａ) 特開 平３−211741（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 3/34 505 ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Toshio Okuno 4-29, Tsunashimahigashi, Kohoku-ku, Yokohama-shi, Kanagawa Pref. JP-A-63-45891 (JP, A) JP-A-3-73549 (JP, A) JP-A-4-101371 (JP, A) JP-A-5-325669 (JP, A) JP-A-3-211741 (JP, A) (58) Field surveyed (Int. Cl. 7 , DB name) H05K 3/34 505
Claims (1)
ンプを形成する方法であって、表面で開口する多数の凹
所を有する導電金属板から成る型を用い、該型の表面を
上記凹所と対応する多数の孔を有するメッキレジスト層
で覆い、上記凹所内で導電バンプをメッキ成長により成
形すると共に、該導電バンプを上記メッキレジスト層の
孔で制限しつつ該孔内に達する高さにメッキ成長せし
め、上記メッキレジスト層を除去して上記型の凹所の開
口部から突出する導電バンプを成形し、該型の表面に配
線板を重ね、該重合面に加圧力と加熱を与えて上記導電
バンプを上記突出部を以って上記配線板のリード表面に
融着し、上記型を離脱して上記リード表面へ導電バンプ
を転着することを特徴とする配線板に導電バンプを形成
する方法。1. A conductive bar for pressure contact with a lead surface of a wiring board.
A method of forming a pump, using a mold consisting of a conductive metal plate having a number of recesses opening on the surface, covering the surface of the mold with a plating resist layer having a number of holes corresponding to the recesses, A conductive bump is formed in the recess by plating growth, and the conductive bump is grown by plating to a height reaching the inside of the hole while limiting the conductive bump with the hole in the plating resist layer. A conductive bump protruding from the opening of the recess is formed and disposed on the surface of the mold.
A wire plate is overlaid, a pressure and heat are applied to the overlapped surface, and the conductive bump is fused to the lead surface of the wiring board through the protrusion, the mold is released, and the conductive bump is applied to the lead surface.
A method of forming a conductive bump of the wiring board, characterized by transferred onto.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21890296A JP3358946B2 (en) | 1996-08-20 | 1996-08-20 | Method of forming conductive bump on wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21890296A JP3358946B2 (en) | 1996-08-20 | 1996-08-20 | Method of forming conductive bump on wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1065322A JPH1065322A (en) | 1998-03-06 |
| JP3358946B2 true JP3358946B2 (en) | 2002-12-24 |
Family
ID=16727110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21890296A Expired - Fee Related JP3358946B2 (en) | 1996-08-20 | 1996-08-20 | Method of forming conductive bump on wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3358946B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003059971A (en) * | 2001-08-20 | 2003-02-28 | Nec Kansai Ltd | Wiring board and manufacturing method therefor, and semiconductor device |
| JP4793690B2 (en) * | 2006-09-29 | 2011-10-12 | 大日本印刷株式会社 | Method for forming conductive bump |
| WO2013153578A1 (en) * | 2012-04-12 | 2013-10-17 | 株式会社Ｌｅａｐ | Method for manufacturing electroformed component |
| CN111634008A (en) * | 2020-05-30 | 2020-09-08 | 江苏冠之星管道系统有限公司 | Hot melting assembly arrangement method for heating wire of plastic electric melting pipe fitting |
-
1996
- 1996-08-20 JP JP21890296A patent/JP3358946B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1065322A (en) | 1998-03-06 |
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