JP3250988B2 - Method for producing resin sheet having filled vias - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a resin sheet having filled vias.

[0002]

2. Description of the Related Art A conventional method for manufacturing a resin sheet having filled vias will be described with reference to FIG. First, an upper die 12 having a punch 10 formed thereon and a lower die (also referred to as a base) having a die hole 14 formed at a position corresponding to the punch 10.
A resin sheet (a resin thin plate such as a polyimide resin sheet or a glass epoxy resin sheet) in which a via is to be formed between the upper mold 12 and the lower mold 16 using a mold having
Are arranged (FIG. 16A).

[0003] Next, the upper die 12 is lowered, and the punch 10 is pierced through a resin sheet 18 and punched. This allows
The punched holes (that is, via holes) 20 are formed of the resin sheet 1.
8 (FIG. 16B). Finally, a metal mask (not shown) having an opening corresponding to the punched hole 20
The conductor paste 22 is pressed into the punched holes 20 of the resin sheet 18 by using a screen printing method using a squeegee (not shown). Thereby, the via 24 filled with the conductor is formed in the resin sheet 18.

A method of manufacturing a semiconductor device using the resin sheet 18 will be described. First, as shown in FIG. 17A, electroless copper plating and then electrolytic copper plating are applied to both surfaces of the resin sheet 18 on which the vias 24 are formed to form the conductor layer 26. In addition, it is also possible to form a conductor layer by a method of bonding a copper foil. Next, the conductor layer 26 is
Patterning is performed by a photolithography method. Thus, on the upper surface of the resin sheet 18, the first pad 28 that contacts the electrode terminal of the semiconductor chip and the first wiring pattern 30 that connects the first pad 28 and the upper end of the via 24 are formed.
To form Similarly, on the lower surface, a second pad 32 for mounting an external connection terminal (solder ball or the like) and a second wiring pattern 34 for simply connecting the second pad 32 and the via 24 are formed (FIG. 9). 17 (b)).

Finally, the semiconductor chip 36 is mounted on the upper surface of the resin sheet 18 (the mounting surface of the semiconductor chip), the electrode pads 38 of the semiconductor chip 36 are electrically connected to the first pads 28, and the resin chip 18 is formed. External connection terminals 40 to be mounted on a mounting board (not shown) are attached to the second pads 32 on the lower surface of the sheet 18. The external connection terminal is, for example, a bump, but may be a pin. Thereby, the semiconductor device 42 using the resin sheet 18 is completed.
(C)). Further, the resin sheet 18 on which the vias 24 are formed may be laminated on a multilayer and formed on a multilayer substrate.

[0006]

However, the above-described conventional via forming method has the following problems. Two separate steps, a step of forming the punched holes 20 and a step of filling the conductive paste 22, are required, and the step of forming a filled via is complicated. In particular, when the conductor paste 22 is pushed in, a jig such as a metal mask or a squeegee is required, which leads to an increase in cost. There is a problem that the amount of the conductive paste 22 pushed into the punched hole 20 is too large or insufficient. In particular, in recent years, the via diameter has been reduced along with the increase in the density of conductive patterns, and the problem that the conductive paste 22 is not sufficiently filled in the punched holes 20 has increased.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method of manufacturing a resin sheet having a filled via that can reliably fill a conductor while simplifying a manufacturing process. It is in.

[0008]

According to the present invention, there is provided a method for manufacturing a resin sheet having a filled via filled with metal inside a via, comprising the steps of: using a mold having a punch and a base having a die hole; A supply step of supplying a resin sheet and a conductive metal sheet on top of each other with the resin sheet as the base side, and a conductive metal sheet by moving the punch relatively toward and away from the base. And a punching step of punching the resin sheet with a small piece of the punched metal sheet and positioning the small piece of the metal sheet in a punched hole of the resin sheet.

[0009] According to the above-described manufacturing method, the punching and the filling of the filled via can be simultaneously performed by one press working, so that the manufacturing process can be simplified and the cost can be reduced.

A step of forming a wiring pattern on one or both surfaces of the resin sheet obtained above, which is electrically connected to the small pieces located in the punched holes, can be performed.

Further, the present invention provides a method for manufacturing a resin sheet having a filled via filled with metal inside a via, the method comprising: using a mold having a punch and a base having a die hole; A step of forming a punched hole, a supplying step of supplying a resin sheet and a conductive metal sheet having the punched hole formed on the base by superposing the resin sheet on the base side and supplying the punch, Punching the conductive metal sheet by moving relatively to and away from the base, and positioning a small piece of the punched metal sheet in a punched hole formed in the resin sheet in advance. And In this method, since the punched holes are formed in the resin sheet in advance, the small pieces can be easily and reliably positioned in the punched holes by the second press.

Further, according to the present invention, in a method of manufacturing a resin sheet having a filled via filled with metal inside a via, a mold having a punch and a base having a die hole is used, and a conductor is provided on one side of the base. A supply step of supplying a resin sheet having a layer formed thereon and a conductive metal sheet in an overlapping manner with the resin sheet serving as a base side, and conducting the contact by moving the punch relatively toward and away from the base. Punching a conductive metal sheet, punching the resin sheet with a small piece of the punched metal sheet, and positioning the small piece of the metal sheet in a punched hole of the resin sheet by contacting the small piece of the metal sheet with the conductor layer. It is characterized by. A resin sheet with a filled via having a conductor layer on one side can be easily manufactured.

Further, according to the present invention, in a method for manufacturing a resin sheet having a filled via filled with metal inside the via, a conductive layer is formed on one surface using a mold having a punch and a base having a die hole. Forming a punched hole in a required pattern in the resin sheet, and supplying the resin sheet having the punched hole formed on the base and a conductive metal sheet by overlapping the resin sheet on the base side. And a punching step of punching the conductive metal sheet by moving the punch relatively to and away from the base, and inserting a small piece of the punched metal sheet into a punched hole previously formed in the resin sheet. And a punching step of positioning the layer in contact with the layer. A resin sheet with a filled via having a conductor layer on one side can be easily and reliably manufactured.

Further, according to the present invention, in a method of manufacturing a resin sheet having a filled via filled with metal inside the via, a mold having a punch and a base having a die hole is used, and a conductor is provided on both sides of the base on the base. A supply step of supplying a resin sheet having a layer formed thereon and a conductive metal sheet in an overlapping manner with the resin sheet serving as a base side, and conducting the contact by moving the punch relatively toward and away from the base. Punching a conductive metal sheet, punching the resin sheet with a small piece of the punched metal sheet, and positioning the small piece of the metal sheet in a punched hole of the resin sheet by contacting the two conductive layers. It is characterized by: A resin sheet with filled vias having conductor layers on both surfaces can be easily manufactured.

Further, according to the present invention, in a method for manufacturing a resin sheet having a filled via filled with metal inside the via, a conductive layer is formed on both surfaces by using a mold having a punch and a base having a die hole. Forming a punched hole in a required pattern in the resin sheet, and supplying the resin sheet having the punched hole formed on the base and a conductive metal sheet by overlapping the resin sheet on the base side. And a punching step of punching the conductive metal sheet by moving the punch relatively toward and away from the base, and inserting the small pieces of the punched metal sheet into punched holes formed in the resin sheet in advance. And a punching step of contacting and positioning the conductive layer. A resin sheet with filled vias having conductor layers on both surfaces can be easily and reliably manufactured.

According to the present invention, in a method of manufacturing a resin sheet having a filled via filled with metal inside a via, a mold having a punch and a base having a die hole is used, and a resin sheet is formed on the base. And a conductive metal sheet that is thicker than the resin sheet, and a supply step of supplying the conductive sheet in a superposed manner with the resin sheet as a base side, and a conductive step in which the punch is relatively moved toward and away from the base. A punching step of punching a metal sheet, punching the resin sheet with a small piece of the punched metal sheet, and positioning a small piece of the metal sheet in a punched hole of the resin sheet such that a tip of the metal sheet protrudes outward from the punched hole. And is characterized by including. Since the filled vias protrude to the outside of the sheet, it is possible to easily manufacture a resin sheet that can use the protruded filled via portions as external connection terminals.

Further, according to the present invention, in a method for manufacturing a resin sheet having a filled via filled with metal inside the via, a mold having a punch and a base having a die hole is formed on the resin sheet in a required pattern. A step of forming a punched hole, and supplying a resin sheet having the punched hole formed on the base and a conductive metal sheet thicker than the resin sheet by overlapping the resin sheet with the base side. And punching a conductive metal sheet by moving the punch relatively to and from the base, and punching a small piece of the punched metal sheet into a punched hole formed in advance in the resin sheet. And a punching step of projecting outward from the hole. A resin sheet having a filled via projecting outward from the sheet can be manufactured more easily and reliably.

According to the present invention, in a method of manufacturing a resin sheet having a filled via filled with metal inside a via, a mold having a punch and a base having a die hole is used, and a conductor is provided on one side of the base. A supplying step in which a resin sheet having a layer formed thereon and a conductive metal sheet thicker than the resin sheet are superimposed and supplied with the resin sheet as a base side, and the punch is moved relative to the base. Punching the conductive metal sheet by moving to and away from the metal sheet, punching the resin sheet with a small piece of the punched metal sheet, and bringing the small piece of the metal sheet into contact with the conductor layer in a punched hole of the resin sheet; And a punching step of positioning the tip so as to project outside the punching hole. A resin sheet having a conductor layer formed on one surface and having a filled via can be easily provided.

Further, according to the present invention, in a method for manufacturing a resin sheet having a filled via filled with metal inside the via, a conductive layer is formed on one surface by using a mold having a punch and a base having a die hole. Forming a punched hole in a required pattern on the resin sheet, and forming a resin sheet having the punched hole formed on the base and a conductive metal sheet thicker than the resin sheet, using the resin sheet as a base. A supply process in which the side is supplied in an overlapping manner;
Punching a conductive metal sheet by moving the punch relatively to and away from the base, and bringing the small piece of the punched metal sheet into contact with the conductor layer in a punched hole formed in advance in the resin sheet. And a punching step of positioning the tip so as to protrude outside the punching hole. A conductor layer is formed on one side,
In addition, a resin sheet having filled vias can be provided more easily and reliably.

[0020] The manufacturing method of a resin sheet having the filled vias of the present invention, as the conductive metal sheet, solder sheet, copper sheet, or using a sheet of solder plating layer is formed on the surface of the metal. In the method for producing a resin sheet having a fill <br/> de vias of the present invention, as the resin sheet, a polyimide sheet made.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the method for producing a resin sheet having filled vias according to the present invention will be described below in detail with reference to the accompanying drawings. (First Embodiment) FIG. 1 shows a first embodiment of a process for manufacturing a resin sheet having filled vias. A mold having an upper mold 12 in which the punch 10 is formed and a lower mold (base) 16 in which a die hole 14 is formed in a position corresponding to the punch 10 is used. Then, as shown in FIG. 1A, a resin sheet 18 and a conductive metal sheet 44 having the same thickness as the resin sheet 18 or slightly thicker than the resin sheet 18 are placed on the base 16. It is supplied to the lower mold 16 by being superposed on the mold 16 side.

As the resin sheet 18, a polyimide sheet is used. As the conductive metal sheet 44, a solder sheet, a copper sheet, or a sheet formed by forming a solder plating layer on a metal sheet is used.

Next, the upper die 12 is lowered, and the conductive metal sheet 44 and the resin sheet 18 are punched with the punch 10 as shown in FIG. At this time, the stroke of the upper die 12 is controlled such that the lower end of the punch 10 is lowered to a position substantially coincident with the lower surface of the conductive metal sheet 44, and is not further lowered. That is, the punch 10 penetrates the conductive metal sheet 44 but does not reach the resin sheet 18. However, the resin sheet 18 is punched by the punch 10 and is punched by the small pieces 46 of the conductive metal sheet 44 pushed downward by the punch 10 to form punched holes (vias) 20 and at the same time 46 remains in the punched hole 20 (located). Thus, the filled via 24 is formed by filling the punched hole 20 with the small pieces 46.

Next, as shown in FIG.
To rise. Next, by removing the conductive metal sheet 44, the resin sheet 18 having the filled vias 24 filled with the small pieces 46 as shown in FIG. The upper mold 12 and the lower mold 16 may be relatively moved toward and away from each other. That is, the lower die 16 may be driven, or both the upper die 12 and the lower die 16 may be driven.

Here, since the thickness of the conductive metal sheet 44 and the thickness of the resin sheet 18 are substantially the same, the filled via 24 formed by the small pieces 46 of the conductive metal sheet 44 is added to the resin sheet 18. Of the resin sheet 18 are substantially flush with the upper and lower surfaces of the resin sheet 18. Note that in practice,
The filled via 24 has a slightly rounded tip (lower end) due to resistance applied when the small piece 46 punches the resin sheet 18. When the conductive metal sheet 44 is a soft metal sheet such as a solder, it tends to be slightly crushed during press working. Therefore, the conductive metal sheet 44 is slightly thicker than the resin sheet 18 and is adjusted so that the filled vias 24 are substantially flush with the upper and lower surfaces of the resin sheet 18 when crushed. Good to do.

As described above, according to the present embodiment, unlike the conventional method of forming the filled vias 24 by printing the conductive paste, the small pieces 46 are forcibly formed by the punch 10 simultaneously with the formation of the punched holes 20. Is positioned in the punched hole 20, it is possible to easily and reliably fill (fill) the small piece 46 as a conductor in the punched hole 20.

In FIG. 1, for the sake of explanation, one punch 10 and one die hole 14 are formed in each of the upper mold 12 and the lower mold 16; It is also possible to adopt a configuration in which the number of filled vias formed in the resin sheet 18 is formed by a single press operation of the mold. Filled via formation time can be reduced.

FIG. 2 is a plan view showing an example of the resin sheet 18 having the filled vias 24 manufactured. By using a long sheet for the resin sheet 18 and the conductive metal sheet 44 and using a progressive die, the resin sheet 18 in which the filled vias 24 of a required pattern are formed can be continuously manufactured. Reference numeral 19 denotes a positioning and feeding hole.

The resin sheet 18 having the filled vias 24 manufactured by this manufacturing method can be used as various electric materials. For example, a conductor layer is formed on one surface of the resin sheet 18 and the conductor layer is etched to form a wiring pattern electrically connected to the filled via 24 (not shown). The resin sheet 18 having the wiring pattern formed thereon can be used as it is, for example, as a flexible printed circuit board (FPC). If a plurality of resin sheets 18 on which the wiring patterns are formed are stacked while conducting between the wiring patterns by filled vias, a multilayer wiring board can be manufactured (not shown).

Of course, the conductor layer 26 is formed on both surfaces of the resin sheet 18 by plating or by attaching a metal foil in the same manner as in the conventional example shown in FIG. Etching, first on both sides
The semiconductor device 42 can be obtained by forming the pad 28, the second pad 32, the first wiring pattern 30, and the second wiring pattern 34, mounting the semiconductor chip 36, and attaching the external connection terminal 40.

FIG. 3 is a schematic sectional view showing another example of the manufacturing die. In this mold, the holding plate 15 is attached to the upper mold 12.
Is provided. The holding plate 15 is hung on the movable plate 11 by a spring 13 and is guided by a guide pole 17 so as to be able to contact and separate from the movable plate 11. Holding plate 1
5 is provided with a hole 21 through which the punch 10 can pass. Four pressing protrusions 23 are provided around the hole 21.

When the upper die 12 is lowered, the conductive metal sheet 44 is pressed by the pressing projections 23 before the punch 10. When the upper die 12 is further lowered, the metal sheet 44 is punched by the punch 10. As described above, by punching the metal sheet 44 by the punch 10 in a state where the periphery of the punched portion of the metal sheet 44 is pressed by the pressing projections 23 in advance, the extension of the metal sheet 4 at the time of punching can be suppressed. There is an advantage that the required volume can be secured. That is, when the metal sheet 44 is made of a soft metal such as solder, elongation occurs at the time of punching, and the small pieces 46 may become thin. However, elongation can be prevented by pressing the periphery with the pressing projections 23. FIG. 4 schematically shows the positional relationship between the holding projection 23 and the small piece 46, and the periphery of the small piece 46 is pressed by the four holding projections 23. However, the present invention is not limited to this.

(Second Embodiment) FIG. 5 shows a second embodiment. Also in this embodiment, the mold illustrated in FIG. 1 or 3 is used, but illustration of the mold is omitted. The resin sheet 18 and the conductive metal sheet 44 to be used may be of the same material as in the first embodiment. It should be noted that even in the third embodiment and below, a mold and a resin sheet 1 will be described.
8. The same conductive metal sheet 44 can be used.

In the present embodiment, as shown in FIG. 5A, first, only the resin sheet 18 is supplied into a mold, and a punched hole 20 is formed in the resin sheet 18. Then FIG.
As shown in (b), the conductive metal sheet 44 is supplied onto the resin sheet 18 while keeping the resin sheet 18 in which the punched holes 20 are formed at the same position, and the upper die 12 is lowered again so that the metal sheet is lowered. Punched 44, small piece 46 punched out
Is pushed into the punched hole 20. In this way, as shown in FIG. 5C, a resin sheet 18 on which the filled vias 24 are formed can be obtained.

This resin sheet 18 can of course be used for the same applications as described above. In the present embodiment, the punched holes 20 are formed in the resin sheet 18 in advance, so that the second press for punching the metal sheet 44 does not apply an excessive force to the metal sheet 44, and the small pieces 46 hardly expand or collapse. (Filled via 24), and the punched hole 20 can be densely filled with metal. This is particularly effective when the metal sheet 44 is a soft metal sheet such as solder.

(Third Embodiment) FIG. 6 shows a third embodiment. In the present embodiment, a resin sheet 18 having a conductive layer 26 such as a copper foil formed on one surface is used. FIG.
As shown in (a), the conductive layer 2 of the resin sheet 18 is formed.
In a state where the metal sheet 44 is superimposed on the resin sheet 6, the resin sheet 18 is supplied into the mold with the lower mold 16 side. Then, the upper die 12 is lowered to punch out the metal sheet 44, and the conductive layer 26 and the resin sheet 1 are
8 is punched out, and the small pieces 46 stop in the punched holes 20, so that as shown in FIG.
The resin sheet 18 having the vias 24 (small pieces 46) can be obtained. Since the conductive layer 26 is thin, even if the small piece 46 is a soft metal such as solder, the conductive layer 2
6. The resin sheet 18 can be punched.

The conductive layer 26 is in electrical contact with the filled via 24 and is electrically conductive. The conductive layer 26 can be etched into a required pattern to form a resin sheet 18 having a wiring pattern that is electrically connected to the filled via 24 (not shown). This resin sheet 18 is F
In addition to being used as a circuit board for a PC or the like, a plurality of sheets can be laminated and used as a multilayer circuit board.

(Fourth Embodiment) FIG. 7 shows a fourth embodiment. In the present embodiment, as shown in FIG. 7A, first, a resin sheet 18 having a conductive layer 26 formed on one side is supplied into a mold in the same manner as in the second embodiment. Then, a punched hole 20 is formed in the resin sheet 18. Next, as shown in FIG. 7B, the metal sheet 44 is supplied onto the resin sheet 18, the metal sheet 44 is punched by pressing, and the punched small pieces 46 are pressed into the punched holes 20 of the resin sheet 18. It is.

As a result, as shown in FIG. 7C, the filled vias 24 (small pieces 4) are similar to those of the third embodiment.
The resin sheet 18 having the condition 6) can be easily manufactured. Also in the present embodiment, a punched hole 20 is formed in the resin sheet 18 in advance, and a small piece 46 of the metal sheet 44 punched by the second press working in the punched hole 20.
, The small piece 46 can be positioned in the punched hole 20 with almost no deformation. Therefore, good connection between the filled via 24 and the conductive layer 26 can be ensured.

(Fifth Embodiment) FIG. 8 shows a fifth embodiment. In the present embodiment, a resin sheet 18 having conductive layers 26 formed on both surfaces is used. As shown in FIG. 8A, the resin sheet 18 is supplied into the mold with the metal sheet 44 superposed on the resin sheet 18 with the lower die 16 side. Next, the metal sheet 44 is stamped out by press working as described above. The punched small piece 46 punches out both conductive layers 26 and the resin sheet 18, and the small piece 46
Is stopped in the punched hole 20, and as shown in FIG.
As shown. The resin sheet 18 having the filled vias 24 (small pieces 46) can be obtained.

The filled via 24 is in contact with both conductive layers 26. By etching both conductive layers 26 into a required wiring pattern, it can be used as a circuit board or a semiconductor device. In this case, as described above, the tip (lower end) side of the filled via (small piece) 24 is slightly rounded, and the connection with the conductive layer 26 may be incomplete as shown in FIG. 8C. In this case, FIG.
As shown in (d), it is preferable that a wedge-shaped punch (not shown) is driven into a rounded head and the head is pushed outward to secure the connection with the conductive layer 26.

(Sixth Embodiment) FIG. 9 shows a sixth embodiment. Also in the present embodiment, a resin sheet 18 having conductive layers 26 formed on both surfaces is used. As shown in FIG. 9A, first, the resin sheet 18 is supplied into a mold,
A punched hole 20 is formed in the resin sheet 18. Next, as shown in FIG. 9B, the metal sheet 44 is supplied onto the resin sheet 18, the metal sheet 44 is punched by pressing, and the punched small pieces 46 are pressed into the punched holes 20 of the resin sheet 18. It is.

Thus, the resin sheet 18 having the filled vias 24 (small pieces 46) similar to the fifth embodiment shown in FIG. 8B can be easily manufactured. Also in the present embodiment, the punched holes 20 are formed in the resin sheet 18 in advance, and the small pieces 46 of the metal sheet 44 punched by the second press working are pressed into the punched holes 20. Can be located in the punched hole 20 with almost no deformation. Therefore, a good connection between the filled via 24 and the two conductive layers 26 can be ensured.

(Seventh Embodiment) FIG. 10 shows a seventh embodiment.
Is shown. The feature of this embodiment is that
D of the conductive metal sheet placed on the _TwoThe resin sheet
Thickness D₁The point is that it is thicker. Base 16
The resin sheet 18 and the conductive metal sheet 44 are superposed on each other.
The upper mold 12 is lowered, and the conductive metal sheet is
44 is punched out of the resin sheet 18 with the punch 10. Pong
The lower end of the cable 10 substantially coincides with the lower surface of the conductive metal sheet 44.
Control to a lower position and not to lower any further.
You.

A small piece 46 of the punched metal sheet 44
Punches out the resin sheet 18. In the present embodiment, since the metal sheet 44 is sufficiently thicker than the resin sheet 18,
As shown in FIG. 10A, small pieces 46 of the punched metal sheet 44 are inserted into the punched holes 20 of the resin sheet 18.
Are positioned in a state where the lower end protrudes from the punching hole 20 (a state where the lower end protrudes from the lower surface of the resin sheet 18). Therefore, as shown in FIG. 10B, the resin sheet having the filled via 24 whose lower end protrudes from the lower surface of the resin sheet 18 and whose upper end is formed of a small piece 46 substantially flush with the upper surface of the resin sheet 18. 18 is possible.

According to this manufacturing method, the filled via 24
A case where a semiconductor device is manufactured using the resin sheet 18 on which is formed will be described with reference to FIG. By setting the formation position of the punched hole 20 in advance to the formation position of the external connection terminal 40, the small piece 46 of the conductive metal sheet protruding from the punched hole 20 of the resin sheet 18 is formed.
Can be used as the external connection terminal 40. A wiring pattern 30 including a pad 28 connected to the upper end of the filled via 24 is formed on the upper surface side of the resin sheet 18, and a semiconductor chip 36 is mounted on the pad 28 to be used as a semiconductor device.

Since it is not necessary to form a wiring pattern or a bump on the lower surface side of the resin sheet 18, the manufacturing process can be simplified. When forming the punched hole 20 in the resin sheet 18, the lower end of the small piece 46 of the conductive metal sheet protruding from the punched hole 20 of the resin sheet 18 has a lower end surface protruding at the center than the peripheral edge portion. It is formed in a curved shape. For this reason, when used as an external connection terminal as in the present embodiment and soldered and mounted on a mounting board,
There is also a merit that the self-alignment by the solder is easily performed and the semiconductor device can be mounted at an accurate position. As described above, the resin sheet 18 having the filled vias 24 in the present embodiment can be used as a substrate material of the outermost layer on the mounting side of the circuit board on the mounting board.

(Eighth Embodiment) FIG. 12 shows an eighth embodiment. In the present embodiment, in the seventh embodiment, as shown in FIG. 12A, first, a resin sheet 18 is supplied into a mold, and a punched hole 20 is formed in the resin sheet 18. . Next, as shown in FIG. 12 (b), a metal sheet 44 thicker than the resin sheet 18 is supplied onto the resin sheet 18, and the metal sheet 44 is punched by press working, and the punched small pieces are formed. 46 is pushed into the punched hole 20 of the resin sheet 18.

Also in this case, similarly to the case shown in FIG. 10B, a resin sheet 18 having a filled via 24 whose tip projects below the punched hole 20 can be manufactured. In this embodiment, since the punched hole 20 is formed in the resin sheet 18 in advance, the filled via 24 (the small piece 4) is formed.
6) can be easily and reliably positioned in the punched hole 20.

(Ninth Embodiment) FIG. 13 shows a ninth embodiment. In the present embodiment, a resin sheet 18 having a conductive layer 26 such as a copper foil formed on one surface is used. FIG.
As shown in (a), the conductive layer 2 of the resin sheet 18 is formed.
In a state where a metal sheet 44 having a thickness sufficiently larger than the resin sheet 18 is superimposed on the resin sheet 6, the resin sheet 18 is supplied into the mold with the lower mold 16 side. Then, the upper die 12 is lowered and the metal sheet 44 is punched, and the conductive layer 26 and the resin sheet 18 are punched by the punched small pieces 46, and the small pieces 46 are stopped in the punched holes 20, and as shown in FIG. As shown in FIG.
The resin sheet 18 having the (small pieces 46) can be obtained. Since the conductive layer 26 is thin, the conductive layer 26 and the resin sheet 18 can be punched out even if the small piece 46 is a soft metal such as solder.

The conductive layer 26 is in electrical contact with the filled via 24 and is electrically conductive. The tip (lower end) of the filled via 24 protrudes below the sheet. The conductive layer 26 can be etched into a required pattern to form a resin sheet 18 having a wiring pattern that is electrically connected to the filled via 24 (not shown). This resin sheet 18 can also be used as the substrate material of the outermost layer on the mounting side of the circuit board on the mounting board.

(Tenth Embodiment) FIG. 14 shows a tenth embodiment. In this embodiment, as shown in FIG. 14A, first, a resin sheet 18 having a conductive layer 26 formed on one side is supplied into a mold, and a punched hole 20 is formed in the resin sheet 18. I do. Next, as shown in FIG. 14B, a metal sheet 44 having a thickness sufficiently larger than that of the resin sheet 18 is supplied onto the resin sheet 18, and the metal sheet 44 is punched by press working.
Is pressed into the punched hole 20 of the resin sheet 18.

As a result, as in FIG. 13B, the filled vias 24 (small pieces 4) whose tips protrude below the sheet are provided.
The resin sheet 18 having the condition 6) can be easily manufactured. Also in the present embodiment, a punched hole 20 is formed in the resin sheet 18 in advance, and a small piece 46 of the metal sheet 44 punched by the second press working in the punched hole 20.
, The small piece 46 can be positioned in the punched hole 20 with almost no deformation. Therefore, good connection between the filled via 24 and the conductive layer 26 can be ensured.

In FIG. 10, FIG. 12, and FIG. 13, both the heads of the filled via 24 are crushed as shown in FIG. It is also preferable to prevent the wire from coming off from the surface and to make the connection with the conductive layer more secure.

As described above, various preferred embodiments of the present invention have been described.
It can also be used as a resin sheet having a filled via that transfers heat like a thermal via.

[0056]

As described above, according to the present invention, punching and filling of filled vias can be simultaneously performed by one press working, so that the manufacturing process can be simplified and the cost can be reduced.
Alternatively, if a punched hole is formed in the resin sheet in advance, the small piece can be easily and reliably positioned in the punched hole by the second press.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a process of a first embodiment.

FIG. 2 is a plan view schematically showing a manufactured resin sheet with filled vias.

FIG. 3 is an explanatory sectional view showing another embodiment of a mold.

FIG. 4 is an explanatory diagram showing a positional relationship between a pressing protrusion of a mold and a small piece.

FIG. 5 is an explanatory diagram illustrating a process according to a second embodiment.

FIG. 6 is an explanatory diagram illustrating a process according to a third embodiment.

FIG. 7 is an explanatory view showing a process according to a fourth embodiment.

FIG. 8 is an explanatory view showing a step of the fifth embodiment.

FIG. 9 is an explanatory view showing a step of the sixth embodiment.

FIG. 10 is an explanatory view showing a step of the seventh embodiment.

FIG. 11 is an explanatory diagram of a semiconductor device using a projected portion of a filled via as an external connection terminal.

FIG. 12 is an explanatory view showing a step of the eighth embodiment.

FIG. 13 is an explanatory view showing a step of the ninth embodiment.

FIG. 14 is an explanatory view showing a step of the tenth embodiment.

FIG. 15 is an explanatory diagram of a state where the head of a filled via is crushed.

FIG. 16 is an explanatory diagram showing a conventional filled via forming method.

FIG. 17 is an explanatory diagram illustrating a configuration of a semiconductor device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 punch 14 die hole 16 base (lower die) 18 resin sheet 20 punched hole 24 filled via 44 conductive metal sheet 46 small piece

────────────────────────────────────────────────── ─── Continuation of the front page Examiner Takashi Nakagawa (56) References JP-A-6-291434 (JP, A) JP-A-2-190298 (JP, A) JP-A 9-199632 (JP, A) JP-A-62-52999 (JP, A) JP-A-60-134495 (JP, A) JP-A-8-222838 (JP, A) JP-A-9-293950 (JP, A) JP-B-46-31566 (JP, A) JP, B1) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 1/11 H05K 3/40-3/42 H05K 3/00 H05K 3/46 B26F 1/00

Claims (22)

(57) [Claims] 1. A filled metal filled with metal inside a via.
In a method for manufacturing a resin sheet having vias, a mold having a punch and a base having a die hole is used, and a polyimide sheet , a solder sheet, a copper sheet, and a solder plating layer formed on the surface are formed on the base. a conductive metal sheet selected from the group consisting of metal sheets, a supply step of supplying superimposed directly to the polyimide sheet to the base side, and the punch is relatively against Hanaredo to the base conductivity Punching a conductive metal sheet, punching the polyimide sheet with a small piece of the punched conductive metal sheet, and positioning the small piece of the conductive metal sheet in a punched hole of the polyimide sheet. Of manufacturing a resin sheet having filled vias. 2. The resin having a filled via according to claim 1, further comprising a step of forming a wiring pattern electrically connected to a small piece located in the punched hole on one side of the polyimide sheet. Sheet manufacturing method. 3. The resin having filled vias according to claim 1, further comprising a step of forming a wiring pattern electrically connected to small pieces located in the punched holes on both surfaces of the polyimide sheet. Sheet manufacturing method. 4. A field-filled metal filled inside of a via.
In a method of manufacturing a resin sheet having vias, a step of forming punched holes in a polyimide sheet in a required pattern using a mold having a punch and a base having die holes, and forming the punched holes on the base Made of polyimide
A sheet , a conductive sheet selected from the group consisting of a solder sheet, a copper sheet and a metal sheet having a surface formed with a solder plating layer, a supply step of directly superimposing and supplying the polyimide sheet as a base side; Punching by punching the conductive metal sheet by moving the punch relatively to and away from the base and positioning a small piece of the punched conductive metal sheet in a punched hole formed in the polyimide sheet in advance; method for producing a resin sheet having the filled vias, which comprises a step. 5. The resin having a filled via according to claim 4, further comprising a step of forming a wiring pattern for electrically connecting to a small piece located in the punched hole on one surface of the polyimide sheet. Sheet manufacturing method. 6. The resin having filled vias according to claim 4, further comprising a step of forming a wiring pattern electrically connected to small pieces located in the punched holes on both sides of the polyimide sheet. Sheet manufacturing method. 7. A field filled with metal inside a via.
A method of manufacturing a resin sheet having vias, comprising: using a mold having a punch and a base having a die hole, forming a polyimide on one side of a conductive layer on the base.
The manufactured sheet, solder sheet, the conductive metal sheet selected from copper sheet and the group consisting of a metal sheet solder plating layer formed on the surface, a supply step of supplying by superimposing polyimide sheet directly in the base side The punch is punched out of the conductive metal sheet by moving the punch relatively to and away from the base, and the polyimide sheet is punched by a small piece of the punched conductive metal sheet. A step of punching a small piece of a conductive metal sheet in contact with the conductor layer and positioning the small piece of the conductive metal sheet in the conductive layer. 8. The method according to claim 7 , further comprising an etching step of forming the conductor layer into a required wiring pattern.
A method for producing a resin sheet having a filled via. 9. A field-filled metal filled metal.
In a method for manufacturing a resin sheet having vias, using a mold having a punch and a base having a die hole, forming a punched hole in a required pattern on a polyimide sheet having a conductor layer formed on one side; Polyimide with the punched hole formed on it
The manufactured sheet, solder sheet, the conductive metal sheet selected from copper sheet and the group consisting of a metal sheet solder plating layer formed on the surface, a supply step of supplying by superimposing polyimide sheet directly in the base side Punching the conductive metal sheet by moving the punch relatively to and away from the base, and punching a small piece of the punched conductive metal sheet into the punched hole formed in the polyimide sheet in the conductive layer; And a punching step of contacting and positioning the resin sheet. 10. An etching step for forming the conductor layer into a required wiring pattern.
A method for producing a resin sheet having the filled via according to the above. 11. A method of manufacturing a resin sheet having a filled via filled with metal inside a via, comprising: using a mold having a punch and a base having a die hole, forming conductor layers on both sides of the base. Polyimide
The manufactured sheet, solder sheet, the conductive metal sheet selected from copper sheet and the group consisting of a metal sheet solder plating layer formed on the surface, a supply step of supplying by superimposing polyimide sheet directly in the base side The punch is punched out of the conductive metal sheet by moving the punch relatively to and away from the base, and the polyimide sheet is punched by a small piece of the punched conductive metal sheet. Punching a small piece of a conductive metal sheet into contact with the two conductor layers. 12. The method for manufacturing a resin sheet having filled vias according to claim 11, further comprising an etching step of forming said conductor layers into a required wiring pattern. 13. A method of manufacturing a resin sheet having a filled via filled with metal inside a via, the method comprising: using a mold having a punch and a base having a die hole, and forming a conductive layer on both surfaces using polyimide. Forming a punched hole in a sheet with a required pattern; and a polyimide having the punched hole formed on the base.
The manufactured sheet, solder sheet, the conductive metal sheet selected from copper sheet and the group consisting of a metal sheet solder plating layer formed on the surface, a supply step of supplying by superimposing polyimide sheet directly in the base side The punch is punched out of the conductive metal sheet by moving the punch relatively to and away from the base, and a small piece of the punched conductive metal sheet is inserted into a punched hole formed in advance in the polyimide sheet. And a punching step of contacting and positioning the substrate.
A method for producing a resin sheet having vias. 14. The method for manufacturing a resin sheet having filled vias according to claim 13, further comprising an etching step of forming said conductor layers into a required wiring pattern. 15. A method for producing a resin sheet having a filled via filled with metal inside a via, comprising: using a mold having a punch and a base having a die hole, forming a polyimide sheet on the base; A conductive metal sheet selected from the group consisting of a solder sheet thicker than a resin sheet, a copper sheet, and a metal sheet having a solder plating layer formed on the surface, is supplied by directly superimposing the polyimide sheet on the base side. And punching a conductive metal sheet by moving the punch relatively to and away from the base, punching out the polyimide sheet with small pieces of the punched conductive metal sheet, and punching holes in the polyimide sheet . Punching a small piece of the conductive metal sheet so that the tip protrudes outward of the punching hole. Method for producing a resin sheet having the filled vias, wherein the door. 16. Before polyimide wiring pattern electrically connected to the non-projecting side pieces located within said punched hole
The method for producing a resin sheet having filled vias according to claim 15, further comprising a step of forming the resin sheet on one side of the sheet. 17. A method for manufacturing a resin sheet having a filled via filled with metal inside a via, comprising: using a mold having a punch and a base having a die hole, forming punched holes in a polyimide sheet in a required pattern. Forming, and a polyimide made by forming the punched hole on the base
The sheet, the polyimide-made thick solder sheet than the sheet, the conductive metal sheet selected from the group consisting of a metal sheet solder plating layer is formed on the copper sheet and the surface, superimposed polyimide sheet directly in the base side A supply step of supplying the punched sheet, the punch is punched out of the conductive metal sheet by moving the punch relatively to and away from the base, and a small piece of the punched conductive metal sheet is formed in advance on the polyimide sheet . A step of positioning the punched hole such that the tip protrudes outward of the punched hole. 18. The method of claim 17, wherein a wiring pattern electrically connected to the non-projecting side pieces located within said punched holes polyimide
Method for producing a resin sheet having the filled vias according to claim 17, comprising the step of forming on one surface of the de-made sheet. 19. A method for manufacturing a resin sheet having a filled via filled with metal inside a via, comprising: using a mold having a punch and a base having a die hole, forming a conductor layer on one surface of the base. Polyimide
The manufactured sheet, thick solder sheet than the polyimide sheet, a conductive metal sheet selected from the group consisting of a metal sheet solder plating layer is formed on the copper sheet and the surface, superimposed polyimide sheet directly in the base side a supplying step of supplying the combined, said punch relatively tangent Hanaredo is not stamped conductive metal sheet to the base, the punched-out conductive metal sheet piece punched the polyimide sheet, the polyimide A step of bringing a small piece of the conductive metal sheet into contact with the conductor layer in a punched hole of a sheet made of a metal sheet, and positioning the tip so as to project outside the punched hole. A method for producing a resin sheet having: 20. The method according to claim 1, further comprising an etching step of forming the conductor layer into a required wiring pattern.
10. A method for producing a resin sheet having filled vias according to claim 9. 21. Filled metal inside the vias are met
A method of manufacturing a resin sheet having vias , using a mold having a punch and a base having a die hole, forming punched holes in a required pattern on a polyimide sheet having a conductor layer formed on one surface; Polyimide with the punched hole formed on the base
The manufactured sheet, thick solder sheet than the polyimide sheet, a conductive metal sheet selected from the group consisting of a metal sheet solder plating layer is formed on the copper sheet and the surface, superimposed polyimide sheet directly in the base side A supply step of supplying the punched sheet, the punch is punched out of the conductive metal sheet by moving the punch relatively to and away from the base, and a small piece of the punched conductive metal sheet is formed in advance on the polyimide sheet . A punching step of contacting the punched hole with the conductor layer and positioning a tip of the punched hole so as to protrude outward from the punched hole. 22. An etching step for forming the conductor layer into a required wiring pattern.
A method for producing a resin sheet having a filled via according to claim 1.