TW475344B - Sheet for forming a printed circuit board, method for forming a via, and method for making a resin sheet having a filled via - Google Patents

Abstract

The present invention provides a resin sheet with a through hole in the thickness direction, and a resin sheet for forming a printed circuit board formed by inserting a small metal piece into the through hole, and method for manufacturing the resin sheet. The resin sheet is manufactured by sequentially carrying a resin sheet and a conductive metal sheet on a metal mold base formed thereon a dice hole; forming a punched through hole on the conductive metal sheet by punching on the side of the metal sheet, and also forming a punched hole on the resin sheet; and inserting the punched conductive small metal piece of the conductive metal sheet into the through hole formed by punching the resin sheet.

Description

475344 A7--~ -2Z ________ i ^ (i) [Technical field to which the invention belongs] The present invention relates to a sheet for forming a printed circuit board, a method for forming a through hole, and a resin made with a filled via. The method for manufacturing a sheet, and more particularly, the present invention relates to a device for forming a through hole as described above. [Conventional Technology] A method for manufacturing a resin sheet having a conventional buried via hole will be described with reference to Fig. 16. First, a metal mold including a punch i0 upper die and a lower die (also referred to as a base) 16 having a die hole 14 formed at a position corresponding to the punch 10 is used. Between the mold 12 and the lower mold 16, a resin sheet (a thin resin sheet body made of a polyurethane resin sheet, a glass epoxy resin sheet, or the like) to form a via is arranged 18 (see section 16 (a) ). Next, the upper die 12 is lowered, and the punch 10 is penetrated and penetrated on the resin sheet. Thereby, the perforations 20 can be formed on the resin sheet 8 (see FIG. 16 (b)). Dare Queen 'uses a screen printing method that uses a metal mask (not shown) and a squeegee (not shown) with openings corresponding to the perforation 20 to print the conductive paste. (Paste) 22 is squeezed into the perforations 20 of the resin sheet 18. Thereby, the via hole 24 filled with the conductor can be formed on the resin sheet 18. A method for manufacturing a semiconductor device using this resin sheet 18 will be described below. First, as shown in Figure 17 (a), the resin is formed with through holes 24 (please read the precautions on the back before filling in this page) ------ r --- order ----- ---- Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the paper is printed in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 1 311422 4 / W44 V. Description of the invention (2) = 18 of Electroless rhenium is formed on both sides, and then electrolytic copper plating is applied to form the conductor layer 26. Alternatively, a method of attaching a copper box may be used to form a conductive layer. t Guangci 'uses the shadow street to form the pattern of the conductor layer 26. Thereby, the top f) of the semiconductor wafer electrode terminal 28 is contacted with the upper end of the first bonding pad 28 and the through hole 24 to connect the first wiring pattern 30. In the same way, a second wiring pattern 34 is formed below to carry the external connection terminals (tin balls, etc.). The pad 32 is connected to the core and the second wiring pattern 34 at the lower end of the second fresh hole 2 and the through-hole 24 (see the first! Fig. ^ After that, the semiconductor wafer 36 is mounted on the resin sheet Η (semi-connected = the mounting surface) ′ so that the electrode 38 of the semiconductor wafer% is welded to the solder 塾 28 and the resin The lower part of the sheet M is installed on the know pad 32 to install a disciple. Although an example of an external connection terminal is = a pin. W Incheon can also use this to complete its half of the resin sheet 18 17 Figure ⑷). Straight 42 (See Cheng Duo: = Resin sheet 18 with / described through holes 24, sometimes also laminated to form a multilayer substrate. [Problems to be Solved by the Invention] However, in the above-mentioned conventional through hole formation method There are the following steps to form the perforation 20 and the conductor paste 22 °. Become an independent 2 step, and the filling hole formation step ㈣ charge step needs to be repeated, especially in the extrusion operation of the conductor paste 22 Time, + this ^ standard applies to Zhongguanjia Standard (CNS) A4 size coffee X Norwegian meal), and some 311422 A7 V. Description of the invention (3)

: Mold), and it is related to the cost increase V c :, there will be squeeze-in and perforation 2. Inner conductor paste = ― Too much or insufficient problem. In particular, in recent years, the dagger has progressed rapidly with the increase in the density of the conductor pattern, and the conduction in 2 is sometimes caused by the conductor aggregate 2 '"The body slurry 22 such as the watch is unable to fully fill the perforation 20 Accordingly, the purpose of the present invention is to provide a method for manufacturing a wax sheet having buried through holes that can simplify the manufacturing steps and fill the conductors. The object of the present invention is also an object of the present invention. The purpose of the present invention is to provide a method for forming a through hole in a resin sheet to ensure that electrical connection is surely made on the inside of the watch. The present invention also aims to provide a printed circuit board forming method that can surely make electrical connection on the inside of a watch made of resin. Another object of the present invention is to provide a device for forming such a through hole or a buried through hole. [Means for Solving the Problem] The sheet for forming a printed circuit board of the present invention includes a resin sheet, A through-hole is provided in the thickness direction; and a small piece of conductive metal has a shape corresponding to the through-hole inserted into the through-hole. The printed circuit board forming sheet has a through-hole. A conductive chip having a conductive sheet made of a resin sheet having a through hole is introduced, but the metal sheet may be aligned with the surface or back surface formed of the resin sheet, or one or the other of the surface of the resin sheet. It is inserted into the through hole by the conductive metal sheet in the sides of the two sides. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 3 311422 T / JJ juice leaf A7 B7 5 4. Description of the invention (4) The present invention is such a printed thunderbolt. The through holes of the m 4 circuit board forming sheet are formed by a through hole forming method having the following characteristics. That is, it is characterized by using a seed ^ 通 „θ. Use Hengshuo and a metal mold with a base to form a mold hole. On this base, Jiang Xigu 4 * also 丨 placed the tree moon sheet on the base side and placed resin on top of it The sheet is made with a conductive metal kappa and a box sheet, and the punch is subjected to a relative detachment action from the base to penetrate the resin sheet, and a small piece of the punctured conductive metal sheet is used to penetrate the sheet. Resin made while making the beating The small piece of the worn conductive metal sheet is positioned in a perforation formed on a resin sheet; or, it is manufactured by a through-hole forming method having the following characteristics. That is, it is characterized in that a punch and a metal mold having a base for forming a die hole are used, and on this base, a tree-shaped sheet is placed on the base side, and a resin sheet and a resin sheet are placed on top of each other. A thick conductive metal sheet, and the punch performs a relative detachment action on the base to penetrate the resin sheet, and the resin sheet is penetrated by the small sheet of the punctured material of the electrically conductive metal #, and at the same time Insert the punctured one into the punched hole in which the punctured conductive metal sheet is formed on the resin sheet so that at least one of the tip ends of the punctured sheet protrudes from the surface of the tree moon sheet. Small piece of conductive metal sheet. There are various kinds of resin sheets of the present invention having such buried via holes, and resin sheets having such buried via holes can be produced, for example, by the following method. 〆The first method, a method for manufacturing a resin sheet with a buried via hole, is a buried via hole with metal filled in the via hole, which is characterized by: The paper size is applicable to Chinese National Standard (CNS) A4 (210 χ 297 mm) Line staff consumption 311422 4 / W44 A7 V. Description of the invention (5) ^ ~ — Contains the use of a punch and a metal mold with a base forming a die hole. The resin is placed on the base The sheet forming step is provided on the side of the base and overlaps the supply step of supplying the resin sheet and the conductive metal sheet; and) causing the punch to perform a relative separation operation on the base to penetrate the conductive metal sheet, and using the punch The small piece of the worn metal sheet penetrates through the above-mentioned tree-moon-making sheet, and the small piece of the metal sheet is positioned in a punching step in the perforation of the resin sheet. That is, the first aspect of the present invention is roughly described in a method for manufacturing a resin sheet having a buried through hole having a buried through hole filled with metal inside the through hole. A feeding step of a head and a metal mold having a die hole and a base on which the resin sheet is provided on the base side and the resin sheet and the conductive metal sheet are superposedly supplied; and the punch is opposed to the base The disconnection action is to use a piece, and use the small piece of the punctured metal piece to pierce the above-mentioned two systems ", and position the above-mentioned metal piece < the small piece on the resin-made plate" the piercing step in the perforation. If according to the above In the second aspect, the filling operation of opening and filling through holes can be performed at the same time in one pressing process, and the manufacturing steps can be simplified, and the cost can be reduced. One side of the resin sheet obtained above can be performed Or on both sides, a step of forming a wiring pattern for electrically connecting the small pieces located in the aforementioned perforations. The second method is a method for manufacturing a resin sheet with buried vias, which includes filling in the vias. The characteristics of buried vias for metals are applicable to the Chinese National Standard (CNS) A4 specification (21 × X 297) in this paper scale. 5 311422 (Please read the precautions on the back before filling this page)- --l · --- Order --------- Line 1 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 475344 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (6) Yu The method includes the steps of forming a perforation in a desired pattern on a resin sheet using a punch and a metal mold having a base for forming a die hole; the resin sheet is provided on the base side and superimposed on the base to form the above. A step of supplying the punched resin sheet and the conductive metal sheet; and causing the punch to perform a relative detachment operation on the base to penetrate the conductive metal sheet, and positioning the small piece of the punched metal sheet in advance The punching step in the formed punched hole. That is, the third aspect of the present invention is roughly the production of a resin sheet having a buried via hole having a buried via hole filled with metal inside the via hole. The method is characterized by: A step of forming a perforation on a resin sheet with a desired pattern using a punch and a metal mold having a base for forming a die hole; setting the resin sheet on the base side on the base and superimposingly supplying the resin forming the perforation A step of forming a sheet and a conductive metal sheet; and causing the punch to perform a relative separation operation on the base to penetrate the conductive metal sheet, and positioning a small piece of the punctured metal sheet at a previously formed punch. Puncture step in the perforation. According to the second aspect described above, since the perforation is formed on the resin sheet in advance, the second pressing operation can easily and surely position the small piece in the perforation. Third method A method for manufacturing a resin sheet having a buried via hole 'It has a buried via hole filled with metal inside the via hole, and is characterized by including the use of a punch and a base having a die hole. Metal mold, at the bottom ----- 1 -------------- r --- order --------- line (Please read the precautions on the back before (Fill in this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 6 311422 475344 A7

V. Description of the invention (7) The step of supplying a resin sheet with a conductive layer formed on one side and a conductive metal sheet on the base with a resin sheet on the base side; and making the punches oppose the base The disconnection action is to penetrate the conductive metal sheet, and use the small piece of the broken metal sheet to penetrate the resin sheet, and to make the small sheet of the metal sheet contact the conductor layer and locate the perforation of the resin sheet. Breakdown step inside. That is, the third aspect of the present invention is roughly a manufacturing method of a resin sheet having a buried through hole having a buried through hole filled with metal inside the through hole, which is characterized by including, using A step of supplying a punch and a metal mold having a base for forming a die hole on the base to overlap and supply a resin sheet and a conductive metal sheet having a conductive layer formed on one side thereof; and The punch performs a relative separation operation on the base to penetrate the conductive metal sheet, and the resin sheet is penetrated by a small piece of the punctured metal sheet, and the small piece of the metal sheet contacts the conductor layer and is located at A punching step in the punching of the resin sheet. According to the third aspect, it is possible to easily manufacture a resin sheet with a buried via hole having a conductor layer on one side. 'Y 苐 Four methods, a method for manufacturing a resin sheet with a buried via hole' is a buried via hole filled with metal inside the via hole, and is characterized by including, using a punch, and having a forming die. The metal mold of the base of the hole is a step of forming a perforation in a desired pattern on a resin sheet having a conductor layer formed on one side; the resin sheet is set on the base side and overlapped to form the paper. This paper is applicable to China Standard (CNS) A4 Specification (210 X 297 mm) Ί ίλλα ^ (Please read the note on the back? Matters before filling out this page) t Order --------- Line 1 Intellectual Property Office Staff, Ministry of Economic Affairs Printed by Consumer Cooperative 475344 A7

V. Description of the invention (8) The supply steps of the resin sheet and the conductive metal sheet having the above-mentioned perforation, and the relative punching action of the punch to the base to penetrate the conductive metal sheet, and make the punched A punching step in which a small piece of the worn metal sheet contacts the conductor layer and is located in a perforation formed in the resin sheet in advance. That is, the fourth aspect of the present invention is roughly a manufacturing method of a resin sheet having a buried through hole having a buried through hole filled with metal inside the through hole, and is characterized by including, using A punch and a metal mold having a base for forming a die hole, forming a perforation in a desired pattern on a resin sheet having a conductive layer formed on one side thereof; and placing the resin sheet on the base side to overlap the supply A step of supplying the perforated resin sheet and the conductive metal sheet; and causing the punch to perform a relative detachment operation on the base to penetrate the conductive metal sheet, and a small piece of the punctured metal sheet A punching step that contacts the conductor layer and is located in a punched hole formed in the resin sheet in advance. According to the fourth sample, it is possible to easily and reliably manufacture a resin sheet having a buried via hole having a conductor layer on one side. Fifth it method, a method for manufacturing a resin sheet having a buried via hole, is a buried via hole filled with metal inside the via hole, and is characterized by including the use of a punch and a forming die. A metal die for a hole base, on which a resin sheet is provided on the base side to overlap and supply the resin sheet and the conductive metal sheet having a conductive layer formed on both sides; and the punch is applied to the base. The relative disconnection action to penetrate through the guide f, please read the precautions on the back before filling in this page) ----- r --- Order --------- line one Intellectual Property Bureau of the Ministry of Economic Affairs employee consumption The paper size printed by the cooperative is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) 8 311422 475344 A7 5: Description of the invention (9) Polycrystalline metal sheet, and punctured by small pieces of metal sheet The punching step of making the resin sheet, and bringing the small piece of the metal sheet into contact with the two conductor layers and located in the perforation of the resin sheet. Λ That is, the fifth aspect of the present invention is roughly a manufacturing method of a resin sheet having a buried through hole having a buried through hole filled with metal inside the through hole, and is characterized by including: , Using a punch and a metal mold having a die hole, a base, and a resin sheet provided on the base side, and a supply step of supplying a resin sheet and a conductive metal sheet having a conductive layer formed on both sides. ; And making the punch perform relative detaching action on the base to penetrate the conductive metal sheet, and use the small piece of the broken metal sheet to penetrate the resin sheet, and bring the small piece of the metal sheet into contact with the two A punching step of the conductive layer and located in the punched holes of the resin sheet. According to the fifth aspect, it is possible to easily manufacture a resin sheet having a buried via hole having a conductive layer on both sides. The sixth method, a manufacturing method of a resin sheet having a buried via hole, is a buried via hole filled with a metal inside the via hole, which is characterized by including, using a punch, and having a forming die. The metal mold of the base of the hole is a step of forming a perforation in a desired pattern on a resin sheet having a conductive layer formed on both sides; the resin sheet is set on the base and the resin on which the perforation is formed is superimposed and supplied. The steps of making the sheet and the supply of the conductive metal sheet; and the relative punching action of the punch to the base to penetrate the guide (please read the precautions on the back before filling this page) ----- r-- -Order --------- Line 1 Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 9 311422 475344 A7 V. Description of the invention (10) An electric metal sheet, and a puncture step of contacting the small piece of the punctured metal sheet with the two conductor layers and located in the perforation formed in the resin sheet in advance, that is, the sixth aspect of the present invention , Roughly tied to the inside of the through hole The method for manufacturing a resin-made sheet having a through-hole filled with a metal-filled through-hole is characterized in that it includes a metal die using a punch and a base having a die hole formed on both sides. A step of forming a perforation in a desired pattern on a resin sheet of a conductor layer; a step of supplying a resin sheet on the base on the base side to overlap and supply the resin sheet and the conductive metal sheet on which the perforation is formed; and Causing the punch to perform a relative separation operation on the base to penetrate the conductive metal sheet, and contact a small piece of the punctured metal sheet with the two conductor layers and be located in a perforation formed in the resin sheet in advance; Step through. According to the third aspect, it is possible to easily and reliably manufacture a resin sheet having a buried via hole with a conductive layer on both sides. The seventh method is a method for manufacturing a resin sheet with a buried via hole, which comprises a buried via hole filled with metal inside the via hole, and is characterized in that it includes: using a punch; A metal mold of a base, on which a resin sheet is provided on the base side, and a step of supplying the resin sheet and a conductive metal sheet thicker than the resin sheet is superposedly supplied; and the punch is opposed to the base To remove the conductive metal M, and use the small piece of the broken metal piece to penetrate the resin sheet, and make the small piece of the metal piece protrude out of the perforation with its front end (please read the back first) (Please note this page before filling in this page) ------ ^ ---- Order --------- A paper printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economy applies the Chinese National Standard (CNS) A4 size (210 X 297 mm) 10 311422 4 / W44 Printed by A7 of the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives. V. The method of (11) is located in the punching step of the resin sheet. That is, the seventh aspect of the present invention is roughly a manufacturing method of a resin sheet having a buried through hole having a buried through hole filled with metal inside the through hole, which is characterized in that: A step of supplying a resin sheet and a conductive metal sheet that is thicker than the resin sheet by using a punch and a metal mold having a base forming a die hole on the base to set the resin sheet on the base side; And making the punch perform a relative separation operation on the base to penetrate the conductive metal sheet, and use the small piece of the broken metal sheet to penetrate the resin sheet, and make the small piece of the metal sheet protrude at the front end thereof. The punching step is located outside the punching hole in the punching hole of the resin sheet. According to the seventh aspect, since the buried through-holes protrude beyond the resin sheet, the resin-made sheet using the protruding through-hole portions as external connection terminals can be easily manufactured. The eighth method, a method for manufacturing a resin sheet having a buried through hole, is a buried through hole having a metal filled in the inside of the through hole, which is characterized by including, using a punch, and having a die hole. The metal mold of the base is formed with the above-mentioned perforation on the resin sheet in a desired pattern. The resin sheet is provided on the base on the base side and overlapped with the resin sheet forming the perforation and the resin sheet. A step of supplying a thick conductive metal sheet; and causing the punch to perform a relative detachment operation on the base to penetrate the conductive metal sheet, and to cause a small piece of the penetrated metal sheet to protrude with its leading end.- ------------ r --- IT --------- line · (Please read the note on the back first? Matters before filling out this page) This paper size applies to Chinese national standards (CNS) A4 specification (210 X 297 mm) 11 311422 475344 Printed by A7, Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (12) ~ The way of the outside of the perforation is located in the pre-formed perforation in the upper hole step. ^ < Percussion, that is, the eighth aspect of the present invention is roughly a method of manufacturing a resin sheet having a through-hole having a through-hole having a through-hole filled with metal inside the through-hole. The method comprises the steps of forming the above-mentioned perforation on a resin sheet in a desired pattern using a punch and a metal cymbal having a base for forming a die hole. The resin sheet is placed on the base side and overlapped and supplied. Forming the perforated resin sheet and the step of supplying the conductive metal sheet thicker than the resin sheet; and causing the punch to perform a relative separation operation on the base to penetrate the conductive metal sheet and cause the metal sheet to be punched. The small piece of the punched metal sheet is located in a punching step formed in advance in the punched hole of the resin sheet in such a manner that the front end protrudes outside the punched hole. According to the eighth aspect described above, it is possible to more easily and surely manufacture a resin sheet having a buried through hole protruding from the outside of the resin sheet. The ninth method, a method for manufacturing a resin sheet with a buried via hole, is a buried via hole filled with metal inside the via hole, which is characterized by including, using a punch, and having a die hole. A step of supplying a metal mold of a base on which the resin sheet is provided on the base side and overlappingly supplying a resin sheet having a conductive layer formed on one side and a conductive metal sheet thicker than the resin sheet; and The punch performs a relative separation operation on the base to penetrate the conductive metal sheet, and uses the small piece of the broken metal sheet to penetrate the resin sheet, and brings the small piece of the metal sheet into contact with the conductive layer, and The former I * ---------- r --- order --------- line · C Please read the notes on the back before filling in this page) This paper size applies to Chinese national standards (CNS) A4 size (210 X 297 mm) 12 311422 475344 A7 B7 V. Description of the invention (13) A punching step in which the end protrudes beyond the outside of the perforation is located in the perforation of the resin sheet. That is, the ninth aspect of the present invention is roughly a manufacturing method of a resin sheet having a buried via hole filled with metal inside the via hole, which is characterized by including, using a punch, and forming A metal mold of a base of a die hole, on which a resin sheet is provided on the base side to overlap and supply a resin sheet having a conductive layer formed on one side and a conductive metal sheet thicker than the resin sheet; And making the punch perform a relative detachment operation on the base to penetrate the conductive metal sheet, and using a small piece of the broken metal sheet to punch the resin sheet, and bringing the small piece of the metal sheet into contact with the conductor layer And a piercing step located in the perforation of the resin sheet in such a manner that the front end protrudes outside the perforation. According to the above-mentioned aspect: more easily and surely, a resin sheet having buried through holes protruding outside the resin sheet can be easily and surely manufactured. The tenth method, a method for manufacturing a resin sheet having a buried through hole, is a buried through hole having a metal filled in the through hole, which is characterized by including a punch, and a base having a die hole. Step of forming a perforation in a desired pattern on a resin sheet having a conductor layer formed on one side; a resin sheet is provided on the base on the base side and the resin sheet having the above-mentioned perforations and The supply step of the conductive metal sheet thicker than the resin sheet; and the relative punching action of the punch to the base to penetrate the guide (please read the precautions on the back before filling this page) --- --- ^ ---- Order --------- Line 1 Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is printed in accordance with China National Standard (CNS) A4 (210 X 297 mm) 13 311422 475344 A7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of Invention (M) Electrical metal sheet, and the small piece of the punctured metal sheet contacting the above-mentioned conductor layer, and the front end of the metal sheet protrudes outside the punched hole Way Playing the perforations in the above-described resin sheet is penetrated step. That is, the tenth aspect of the present invention is a method for manufacturing a resin sheet having a buried through hole having a metal filled inside the through hole, and is characterized in that it includes a punch, and a forming die. The metal mold of the base of the hole is formed with a perforation step in a desired pattern on a resin sheet with a conductive layer formed on the surface; the resin sheet is set on the base side to overlap the supply shape or the resin with the above-mentioned perforation. A step of supplying a sheet and a conductive coating sheet that is thicker than the resin sheet; and the relative punching operation of the punch to the base to penetrate the conductive metal sheet and make the penetrated metal sheet Four of them contact the above-mentioned conductor layer, and are located in a punching step formed in the above-mentioned perforation of the resin sheet so that the front end protrudes outside the perforation. According to the tenth aspect, it is possible to more easily manufacture a resin sheet having a conductor layer formed on one side and a buried through hole. ^ In the present invention, it is also possible to form a through hole in advance on a thin resin sheet, or to form a through hole by punching through a small piece of conductor. A conductive layer may be arranged on the-:: side or both sides of the resin film. In addition, when a conductor layer is formed on both sides of the resin film to the y side and if necessary, a resin sheet having a conductive metal sheet formed on the surface of the conductor layer can be formed to be equivalent. Or thicker than it. The surface or double-sided wax sheet of the present invention with a buried through hole is characterized in that it includes a resin sheet: a: itching in the center; a through hole in the degree direction and formed on at least one surface There is a conductive body sound. ______ layer and a conductive metal piece are inserted in the M-sheet scale suitable financial country (CNS) A4l ^ i () χ Norwegian (please read the precautions on the back before filling this page) --------- Line 1 14 311422 J44

V. Description of the invention (is, the penetrating hole has a shape corresponding to the penetrating hole. The conductive metal piece is described, preferably a solder piece, a copper piece, a steel mouth gold piece, and a metal plated with a plated surface. At least one type of metal sheet in the group consisting of sheets of tin layer. In the present invention, the resin sheet is preferably a sheet made of an insulating resin, and the resin sheet used in the present invention The preferred one is selected from the group consisting of polyimide, polyacetate, polypropylene, polyphenylene sulfide, and polyvinylidene diene: ethylene-vinyl alcohol copolymer, glass fiber reinforced epoxy, and double melamine trimorph resin. It is formed by at least one type of insulating resin in the formed group. [Brief description of the drawings] (a) to (d) of FIG. 1 are explanatory diagrams showing the steps of the first embodiment. FIG. 2 is a diagram showing A schematic plan view of a manufactured resin sheet having a through hole filled therein. FIG. 3 is a cross-sectional explanatory view showing another embodiment of the metal mold. FIG. 4 is an explanation showing the positional relationship between the pressing protrusion of the metal mold and the small piece. Fig. 5 (a) to (c) show An explanatory diagram of the steps of the second embodiment. Figs. 6 (a) and (b) are explanatory diagrams showing the steps of the third embodiment. Figs. 7 (a) to (c) are diagrams of the fourth embodiment. An explanatory diagram of the steps. (A) to (d) of FIG. 8 are explanatory diagrams showing the steps of the fifth embodiment. (A) and (b) of FIG. 9 are explanatory diagrams of the steps of the sixth embodiment. Fig. 10 (a) and (b) are explanatory diagrams showing the steps of the seventh embodiment. Fig. 11 is an explanatory diagram of a semiconductor device using a protruding portion of a buried via as an external connection terminal. Main I item, please write this page again, refer to II, order I, IIII, house 4 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives, and printed on paper standards applicable to China National Standard (CNS) A4 size coffee x 297 public ^) 15 311422 475344 A7 V. Invention (16) Figures 12 (a) and (b) are explanatory diagrams showing the steps of the eighth embodiment. 13 (a) and (b) are explanatory diagrams showing the steps of the ninth embodiment. 14 (a) and 14 (b) are explanatory diagrams showing the steps of the tenth embodiment. Fig. 15 is an explanatory diagram of a state where the head of the landfill via is crushed. / FIGS. 16 (a) to (c) are explanatory diagrams showing a conventional method for forming a buried via hole. 17 (a) to (c) are explanatory diagrams showing the structure of a semiconductor device. [Embodiments of the Invention] The preferred embodiments and drawings of the method and apparatus for manufacturing a sheet for forming a printed circuit board according to the present invention, a through-hole forming method, and a resin sheet having buried through-holes are described below. Detailed description. (First embodiment) Fig. 1 is a first embodiment showing the manufacturing steps of a resin sheet having a through hole to be buried. A metal mold including an upper die 12 with a punch 10 and a lower die (base) 16 with a die hole 14 formed at a position corresponding to the punch 10 is used. Then, as shown in FIG. 1 (a), the resin sheet 18 is placed on the base 16 and overlapped on the base 16 so that the resin sheet 18 is the same as or slightly thicker than the resin sheet 18. The flexible metal sheet 44 is supplied onto the lower mold 16. Shuyueyue Production 18, you can use polyimide, polyester, polypropylene, polyphenylene sulfide, polyvinylidene chloride, ethylene-vinyl alcohol copolymer, glass fiber reinforced epoxy or double melamine triple farming resin Production, etc. As the conductive metal sheet 44 ', a sheet having a tin plating layer formed on a tin sheet, a steel sheet, a copper alloy sheet, or a metal sheet can be used. Secondly, as shown in Figure 1 (b), lower the upper mold 12 and use the punch paper. The paper size applies the Chinese National Standard (CNS) A4 rule ^ (210 X 297 mm) 311422 (please read the back first) Please note this page before filling in this page) -i I-^ ---- Order ------ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 16 V. Description of Invention (Π) Break through conductive metal Sheet 44 and resin sheet 18. At this time, the stroke of the upper die 12 can be controlled to lower at the lower end of the punch 10 to a position substantially consistent with the bottom of the conductive metal sheet 44 without lowering it to that position. the above. In addition, although the punch 10 penetrates the conductive metal sheet 44, it does not reach the Shuyuechi sheet 18. However, the resin sheet J 8 can be penetrated by the punch 10, and f is penetrated by the conductive metal sheet 46 pushed downward by the punch 10❿, and punched ( Through hole) 20, ^ J piece 46 will stay (located) within the punched hole 20. Therefore, the punched holes μ can form the buried through holes 24 formed by filling the small pieces 46. Next, as shown in FIG. 1 (c), the upper die 12 is raised. > By removing the conductive metal sheet 44, a person can form a resin sheet 18 having a buried through hole 24 filled with a small sheet 46 as shown in Fig. 1 (d). That is, as described above, a resin sheet having a through-hole in the thickness direction and a through-hole formed in the resin sheet can be obtained by overlapping the resin-made sheet with the conductive metal sheet and pre-tapping. A sheet for forming a printed circuit board having a conductive metal sheet in the form of approximately through holes is inserted therein. v In addition, as long as the upper mold 12 and the lower mold 16 are subjected to a relative separation action p, the lower mold 16 may be driven, that is, the upper mold η and the lower mold 16 may be driven. Here, since the thickness of the conductive metal # 44 is approximately the same as the thickness of the resin sheet i 8, the upper end of the buried through hole 24 formed by the small piece 46 of the conductive metal sheet 44 on the resin sheet 18. With the bottom, roughly

Size of this paper _ t _ Home Fresh (CNS) A4 Lin (2iG X-— lillrllF — — — 11 (Please read the precautions on the back before filling this page) Order --------- Line One Ministry of Economy Intellectual Property Bureau Employees' Clothing Cooperative Printed Clothes 311422 A7

The upper and lower surfaces of the resin sheet 18 are cut into a sheet shape. In addition, in practice, the front end (lower end) of the through-hole 24 filled with the resin sheet 18 due to the resistance of the small sheet 46 will be rounded. When the Tada 1 * raw metal sheet 44 is a flexible metal sheet such as solder, there is a tendency that it is slightly crushed during press work. Therefore, the conductive metal sheet 44 is thicker than the resin sheet 18. The buried through hole 24 can also be adjusted above and below the resin sheet 18 when crushed. The surface is roughly cut. Please read the notes on the back before completing this page

As described above, according to this embodiment, compared with the conventional method of printing conductive paste = to form the through-hole 24, in this embodiment, the punch 46 is forcedly used while forming the punching hole 20, so that the small piece 46 is located here. The perforation 20 is performed, so that the conductor chip 46 can be easily and surely filled (filled) in the perforation 20.

I In addition, in the first figure, for the convenience of explanation, although there are punches ^ 〇 and die holes 1 * on the upper die and lower die 16, but 疋 can actually be It is a structure consisting of only several jin of through-holes filled in the resin sheet 18, and if this structure is formed, the landfill can be formed on the resin sheet 丨 8 in a single pressing operation of a metal mold. Through holes, which can shorten the formation time of buried through holes. FIG. 2 is a plan view showing an example of a resin sheet i 8 having a buried via hole 24 which is not manufactured. By using a longer one of the resin sheet 18 and the conductive metal sheet 44 and using a metal mold ', it is possible to continuously manufacture the buried vias 24 to form a desired pattern.

Printed on a paper ruler of the Ministry of Economic Affairs of the Intellectual Property Cooperative of the National Standard (CNS) A4 (21G X 297 mm) 18 311422 π / inch leaf A7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (L9) Shuyueyue Production 18. The component number 19 is a hole for positioning and feeding. The resin sheet 18 having the buried via hole 24 manufactured by this manufacturing method can be used as various electrical materials. For example, a conductor layer is formed on one surface of the resin sheet 18, and this body layer is etched to form a wiring pattern (not shown) for electrically filling the through-hole 24. The resin sheet 18 forming the wiring pattern is used as it is, for example, as a flexible printed circuit board (Fpc) without any change. In addition, if a plurality of layers are laminated while obtaining the conduction between the wiring patterns while filling the via holes, the resin sheet 18 forming the wiring pattern can be manufactured on a multilayer wiring board (not shown). Of course, by the same method as the conventional example shown in FIG. 17 (a), the conductive layer% can be formed by the electric ore method on both sides of the resin sheet 18, or the conductive layer 26 can be formed by attaching a metal box. This conductor layer% is engraved to form the first solder pad 28, the second pad 32, the first-wiring pattern 30, and the "wiring pattern 34 on both sides, and the outer surface is mounted while the semiconductor wafer is mounted" P The connection end + 40 can form a semiconductor device 42. Fig. 3 is a schematic cross-sectional view showing another embodiment of a metal mold for manufacturing. In this metal mold, 'the pressure plate 15 is provided on the upper mold 12. The pressure plate 15 is The spring is used to suspend it from the movable plate u, and is guided by the guide post center P17) to freely move the movable plate 11. The pressure plate 15 is provided with a hole through which the punch 10 can pass. 21, and there are four pressing protrusions 23 around this hole 21. When the upper mold ^^, the conductive metal sheet 44 receives the pressing protrusions 23 This paper size is applicable to the country of China ^ X 297 public director) 19 311422 (Please read first Zhuyin on the back? Please fill in this page for more information.)-· 丨 丨 h 丨 — 丨 Order ---- I 11 I One 475344 A7 One B7 _ Five Description of the invention (20) the pressing will be earlier than the punch 10, and the metal piece 44 can be penetrated by the punch 10 when the upper die 12 is lowered. Thus, 'the pressing portion 23 of the metal piece 44 is pressed by the pressing protrusion 23 in advance. In the state, the punch 10 is used to penetrate the metal sheet 44, thereby suppressing the extension of the metal sheet 44 when punching, and there is an advantage that the volume of the small sheet 46 can be ensured within a required amount. That is, when When the metal piece 44 is a soft metal such as solder, elongation may occur during breakdown, and the small piece 46 may be thin, but the elongation may be prevented by pressing the protrusion 23 against the periphery. FIG. 4 shows the pressing protrusion The model diagram of the positional relationship between 23 and the small piece 46 is that the pressing piece 13 is pressed around the small piece 46 by pressing the protrusions 13 everywhere, but it is of course not limited to this. The metal mold illustrated above is formed by integrating the base and the punch. An example of a metal mold, but in the present invention, the metal mold does not necessarily have a punch and a base, and a conductive mold composed of a metal mold having a base for forming a die hole and a punch designed independently of the metal mold may also be used. A small piece is inserted into a through hole to open a device. In this device, the punch and the die hole formed on the base jointly form a perforation on the conductive metal sheet, and at the same time, the conductive metal is penetrated by pressing down more It is also possible to form a through hole in the resin sheet. However, the lower end of the punch is controlled to stop on the surface of the resin sheet, so the small piece of the conductive metal sheet that is penetrated can be pressed in It is held in the resin sheet in a state of being formed in the through hole formed on the resin sheet. The small metal sheet is conductive, so when a wiring pattern is formed on the surface and back of the resin sheet, it is introduced here Conductivity in the through hole This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) --------- Order-- ------- Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs of the Qin Dynasty311312 475344 A7

5. Description of the invention (21) Small metal pieces can be electrically connected to form circuits on the front and back of the resin sheet. / (Second Embodiment) Fig. 5 shows a second embodiment. In this embodiment, although the metal mold illustrated in Fig. I or Fig. 3 is also used, the illustration of the metal mold is omitted. The resin sheet 18 or the conductive metal sheet 44 used can be made of the same material as the first embodiment. Also. In the third embodiment to be described later, the same may be used for the metal mold, the resin sheet 18, and the conductive metal sheet 44. In this embodiment, as shown in FIG. 5 (a), only the resin sheet 18 is first supplied into the metal mold, and a punched hole 20 is formed in the resin sheet is. Second, as shown in FIG. 5 (b) As shown, the conductive metal sheet 44 is supplied on the resin sheet 18 with the resin sheet 18 forming the perforations 20 stopped at the same position, and the upper mold 12 is lowered again to penetrate the metal sheet 44. The punched piece 46 is pressed into the perforation 20. In this way, as shown in Fig. 5 (c), a resin sheet 18 having a buried through hole 24 formed can be obtained. Of course, this resin sheet 18 can also be used for the same purpose as above. In this embodiment, since the perforation 20 'is formed on the resin sheet 18 in advance, the second pressing of the metal sheet 44 is performed. Excessive force is not applied to the metal sheet 44 when it is stretched or crushed (please read the note on the back? Matters before filling out this page) ------ ^ ---- Order-- --- I --- Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, this paper is printed in accordance with China National Standard (CNS) A4 (210 X 297 mm) 21 311422 475344 A7 — B7 V. Description of the invention (22 ) Through the small piece 46 (filling the through hole 24), and the metal can be densely filled in the punched hole 20. This is particularly effective when the metal sheet 44 is a flexible metal sheet such as solder. / (Third Embodiment) Fig. 6 shows the third embodiment. In this embodiment, a resin sheet 18 is used in which a single layer of steel foil or the like is formed. As shown in FIG. 6 (a), in a state where the metal sheet 44 is superposed on the conductive layer 26 of the resin sheet 18, the resin sheet i 8 is placed on the lower side] < y # 〃 镆 U side and supplied to In the metal mold. Then, the upper mold 12 is lowered to penetrate the metal sheet 44, and the conductive sheet 26 and the resin sheet 18 are penetrated by the penetrated small sheet 46, and the small sheet 46 stays in the punched hole 20, as in the sixth (b) As shown in the figure, a resin sheet 18 having buried vias 2 4 (small pieces 4 6) can be obtained. Since the conductive layer 26 is thinner, the conductive layer 26 and the resin sheet 18 can be penetrated even if the small piece 46 is a soft metal such as solder. The conductive layer 26 is in contact with the buried via 24 and is electrically connected. The conductive layer 26 is processed into a desired pattern in a short time to form a resin sheet 18 (not shown) having a wiring pattern for electrically filling and filling the through hole 24. This resin sheet 18 can be used alone as a circuit board such as FPC, or it can be laminated and used as a multilayer circuit board. J (Fourth Embodiment) Fig. 7 shows a fourth embodiment. In this embodiment, as shown in Figure 7 (a), it is the same as the second embodiment (please read the note 3 on the back before filling in this page) Intellectual Property Bureau Employees' Cooperatives Printed Garment Paper Size Applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) 22 311422 344 344 A7 B7

V. Description of the invention (23) = Same, first, the resin-made sheet having the conductive layer 26 formed on one side is “supplied into a metal mold to form a perforation on the resin-made sheet j 8. Next, as in (7) b) As shown in the figure, the metal sheet 44 is supplied on the resin sheet 18 and is pressed to penetrate the metal sheet 44 to press the punctured small piece 46 into the punched hole 20 of the resin sheet 18. As shown in FIG. 7 (c), it is possible to easily manufacture a resin sheet 18 having a buried through hole 24 (small piece 46) similar to the third embodiment. In this embodiment, since the resin sheet 18 is also made in advance, A perforation 20 is formed on the sheet j 8, and the small piece 46 of the metal sheet 44 penetrated by the second pressing process is pressed into the perforation 20, so the small piece 46 is hardly deformed and can be located in the perforation 20 Therefore, the connection between the buried via 24 and the conductive layer 26 can be ensured well. (Fifth Embodiment) Fig. 8 shows a fifth embodiment. In this embodiment, a resin having the conductive layer 26 formed on both sides is used. Sheet 18. As shown in FIG. 8 (a), the resin sheet 18 is made of resin with the metal sheet 44 superposed thereon. 18 is provided on the lower mold 16 side and supplied into the metal mold. Next, press processing is performed in the same manner as described above to penetrate the metal sheet 44. The penetrated small sheet 46 penetrates the two conductive layers 26 and the resin sheet 1 8 , And the small piece 46 will stay in the perforation 20, as shown in FIG. 8 (b), so that a resin sheet 18 having a buried through hole 24 (small piece 46) can be obtained. The buried through hole 24 series In contact with the two conductive layers. (Please read the precautions on the back before filling out this page) ------ ^ ---- Order --------- · Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs The printed paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 23 311422 475344 A7 -... · B7 V. Description of the invention (24) '--- By etching the two conductive layers 26 If you have the desired wiring pattern, you can use it as a circuit board or semiconductor device. (Please read the precautions on the back before filling in this page.) In addition, as described above, there may be buried front holes (small pieces) at the front end. There are several circles on the (lower end) side, and the connection with the conductive layer 26 may be incomplete as shown in FIG. 8 (C). In this case, as shown in FIG. As shown in Fig. 8 (d), it is preferable to insert a wedge-shaped punch (not shown) into the head with a circular shape and push the head outwards to obtain the same accuracy as the conductive layer 26. Connection 1 (Sixth Embodiment) Fig. 9 shows a sixth embodiment. As shown in Fig. 9 (a), this resin sheet 18 is first supplied into a mold to form a resin sheet 18. A perforation 20 is formed on the top. Next, as shown in FIG. 9 (b), a metal sheet 44 is supplied on the resin sheet 18 and pressed to penetrate the metal sheet 44 to press the punctured sheet 46 into Inside the perforation 20 of the resin sheet 18. With this, it is possible to easily manufacture the resin sheet 18 having the buried through hole 24 (the small piece 46) similar to the fifth embodiment shown in Fig. 8 (b). Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In this embodiment, because the perforation 20 is also formed on the resin sheet 18 in advance, and the metal penetrated by the second pressing process is pressed into the perforation 20 The small piece 46 of the piece 44 can be located in the perforation 20 with little deformation of the small piece 46. Therefore, the connection between the buried via hole 24 and the two conductive layers 26 can be well ensured. υ (Seventh Embodiment) Fig. 10 shows a seventh embodiment. The characteristic point of this embodiment is that the size of the guide paper on the base 16 is in accordance with the Chinese National Standard (CNS) A4 (210 X 297 mm) 24 311422 344 A7 __B7 V. Description of the invention (25 Electrical properties The thickness 胄 d2 of the metal sheet is set to be thicker than the thickness of the resin sheet. A resin # 18 and conductive gold are superimposed on the base 16. 44. The upper die 12 is lowered to use the punch 1. () Break through the conductive 44 and the resin sheet 18. The lower end of the metal sheet punch 10 will drop to a position that is approximately consistent with the conductive metal sheet 44 ζΛ, and it will be controlled not to fall above this position. Μ The small piece 46 of the punctured metal sheet 44 is used to penetrate the resin sheet. In this embodiment, since the metal sheet 44 is thicker than the resin sheet 18, as shown in FIG. 10 (a), it is The small piece 46 of the perforated metal sheet 44 is positioned in the perforation 20 of the resin sheet 18 in a state where its lower end protrudes from the perforation 20 (a state protruding below the resin sheet 18). As shown in FIG. 10 (b), the lower end will protrude from the small piece 46 of the resin sheet 18, and at the same time, it can be formed The resin-made sheet for filling the through-hole 24 formed by the small piece 46 whose upper end is aligned with the upper surface of the resin-made sheet ^^. The use of the resin in which the through-hole 24 is formed according to this manufacturing method will be described with reference to FIG. 11. In the case of manufacturing a semiconductor device by making a sheet 18. By making the formation position of the punched hole 20 and the position of the external connection terminal 40 in advance, the conductive metal sheet protruding from the punched hole 20 of the resin sheet 18 can be formed. The lower end of the small piece 46 is used as an external connection terminal 40. On the upper side of the resin sheet 18, a wiring pattern 30 including a pad 28 connected to the upper end of the buried via hole 24 is formed, and can be soldered. Pad 28 (Please read the precautions on the back before filling this page) ------ r --- Order --------- Line: Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 25 311422 475344 A7 —__ B7 V. Description of the invention (26) The semiconductor wafer 36 is mounted and used as a semiconductor device. Since it is not necessary to make the film in resin A wiring pattern or bump is formed on the lower side of 18 Therefore, the manufacturing steps can be simplified. The lower end of the small piece 46 of the conductive metal sheet protruding from the perforation 20 of the resin sheet 18 is formed at the center of the lower end face when the perforation 20 is formed on the resin sheet i 8. A curved shape protruding from the periphery. Therefore, when used as an external connection terminal as in this embodiment, and when soldering and mounting on a mounting substrate, it can easily perform automatic alignment based on solder, and It is also possible to mount it in the correct position. In this way, the resin sheet i 8 having the buried via hole 24 in this embodiment can be used as a substrate material of the circuit board which is the outermost layer mounted on the mounting substrate side. (Eighth Embodiment) Fig. 12 shows an eighth embodiment. In the seventh embodiment, as shown in FIG. 12 (a), the resin sheet 18 is first supplied into a mold to form a punched hole 20 in the resin sheet 18. Next, as shown in FIG. 12 (b), the resin sheet 18 is supplied with a metal sheet 44 which is thicker than the resin sheet 18, and is pressed to penetrate the metal sheet 44 so as to be penetrated. The small piece 46 is pressed into the punched hole 20 of the resin sheet i 8. At this time, as in the case shown in FIG. 10 (b), a resin sheet J 8 having a buried through hole 24 with a tip protruding below the punched hole 20 can be manufactured. In this embodiment, the size of the paper is pre-formed on the resin sheet 18. The size of this paper is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling in this page) Order --------- Line 1 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 311422 26 475344 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 V. Description of the invention (27. Hole 20, so you can fill in The buried via 24 is easily and surely located in the punched hole 20. y (Ninth Embodiment) Fig. 13 shows a ninth embodiment. In this embodiment, a conductive layer 26 such as a copper foil is formed on one side. Resin sheet 18. As shown in FIG. 13 (a), the resin sheet 18 is made of the resin sheet 18 in a state where a metal sheet 44 having a thickness thicker than that of the resin sheet 18 is superimposed. The sheet 18 is provided on the side of the lower mold 16 and is supplied into the metal mold. Then, the upper mold 12 is lowered to penetrate the metal sheet 44, and the conductive layer 26 ′ resin sheet 18 can be penetrated according to the small sheet 46 which has been penetrated. , And by leaving the small piece 46 in this perforation 20, as shown in Figure 13 (b), you can get A resin sheet 18 having a buried via hole 24 (small piece 46) is obtained. Since the conductive layer 26 is thin, the conductive layer 26 and the resin sheet 18 can be penetrated even if the small piece 46 is a soft metal such as solder. The layer 26 is in contact with the landfill via 24 to form conductivity. The front end (lower end) of the landfill via 24 protrudes below the resin sheet 18. The conductive layer 26 # is engraved into a desired pattern. That is, a resin sheet 8 (not shown) having a wiring pattern for electrically connecting and filling the through-holes 24 can be formed. This resin sheet 18 can also be used as the substrate material on the surface layer of the circuit board that is shaken to the mounting substrate side. Use. 7 (10th embodiment) Figure 14 shows the 10th embodiment. (Please read the precautions on the back before filling out this page) # 订 --------- Line 1 paper size applies China National Standard (CNS) A4 specification (210 X 297 mm) 27 311422 475344 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 V. Description of the invention (28) In this embodiment, as shown in Figure 14 (a) The resin sheet 18 having the conductive layer 26 formed on one side is first supplied to a metal In the mold, a perforation 20 is formed on the resin sheet 18. Next, as shown in FIG. 14 (b), a metal sheet 44 having a thickness larger than that of the resin sheet 18 is supplied to the resin sheet 18. Pressing is performed to penetrate the metal sheet 44 to press the punctured small piece 46 into the punched hole 20 of the resin sheet 18. By doing so, that is, the same as FIG. 13 (b), the front end protrusion can be easily manufactured. A resin sheet 18 having a through hole 24 (small sheet 46) buried below the tree sheet 18 is produced. In this embodiment, since the punch holes 20 are also formed in the resin sheet 18 in advance, and The small piece 46 of the metal sheet 44 penetrated by the second pressing process is pressed into the perforation 20, so that the small piece 46 is hardly deformed and can be located in the perforation 20. Therefore, the connection between the buried via 24 and the conductive layer 26 can be well ensured. In addition, in Figs. 10, 12, and 13, as shown in Fig. 15, by burying the buried through hole 24 to expand the head outward into an umbrella shape, the puncture 20 can be stopped. Or can obtain more realistic connection with the conductive layer. Although the above describes various aspects of the preferred embodiment of the present invention, the resin sheet produced by the present invention can also be used as a resin sheet having a through hole filled with heat, such as a through hole. use. In the method of the present invention, # 右 彡 T is used to sequentially place a resin sheet and a conductive metal on a base formed with a die hole, a metal sheet, and a punch through both at the same time, and simultaneously Punctured by the punctured conductive _- S ^ S metal sheet and inserted into this paper size applicable to National Standards T (CNS) A4 specifications' ⑽χ 297 public τ 311422 (Please read the precautions on the back first (Fill in this page again.) #I 丨 丨 卜 — 丨 Order --------- line 1 28 / JJ44 5B7 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives, Invention Description (29): On the resin sheet The method of penetrating the hole, so in this case, since the sheet is pressed down by the small piece of the conductive metal sheet that is penetrated, that is, L τ teeth, so the lower end of the punch, as long as the conductive metal sheet is penetrated Just stop on the surface of ^. On the other hand, as long as a through-hole is formed in the resin sheet in advance, and a punch is added on the conductive metal sheet, the small sheet penetrated by the conductive metal sheet will be written in advance in the original state. The resin sheet is formed in the through-holes, so it is unlikely to be damaged. In this case, it is advantageous if the above-mentioned device can be used by forming a through-hole fl '' in advance on the base sheet. Therefore, it is better to have a stop position control mechanism for controlling the stop position of the punch in the above device on the surface (first stop position) of the resin sheet, and for controlling the penetration of the resin sheet to A stop position control mechanism is formed at the stop position (second stop position) of the through hole. Furthermore, when a sheet for forming a printed circuit board manufactured by the method of the present invention is formed on a resin sheet with a conductive metal sheet protruding from the surface thereof, an insulating layer may be interposed therebetween by compression bonding. There is a printed circuit board that protrudes the conductive metal sheet in this way, so that the conductive metal sheet is electrically connected to the printed circuit board laminated through the insulating layer. That is, by using such a printed circuit board of the present invention, it is possible to produce a multilayer printed circuit board by handing it over and making it easier. [Effects of the Invention] As described above, according to the present invention, the filling operation of the opening and the filling of the through-hole can be performed at the same time in one house process, and the manufacturing steps can be simplified, and the cost can be reduced. ° 'Or, if a perforation is formed on the resin sheet in advance, the Chinese paper standard (CNS) A4 (210 X 297 mm) can be used for this paper size 311422

I

I 475344 A7 B7_ 5. Description of the invention (30) Second, the pressing operation can easily and surely position the small piece in the perforation V [Explanation of the component number] 10 punch 14 die hole 16 base (lower die) 18 resin sheet 20 Punch hole 24 Fill the through hole (through hole) 44 Conductive metal sheet 46 Small piece (please read the precautions on the back before filling this page) # Order --------- Line-Staff of Intellectual Property Bureau, Ministry of Economic Affairs The paper size printed by the consumer cooperative is applicable to China National Standard (CNS) A4 (210 X 297 mm) 30 311422

Claims (1)

44 75 H3; Simplified Patent Application No. 89108240 ;; Revised Application Scope-| ^ (December 12, 1990: Printed by the Staff Welfare Committee of the Central Bureau of the Ministry of Economic Affairs 1. A printed circuit board forming sheet, which Features include: a resin sheet with a through-hole in the thickness direction; and a conductive metal sheet with a shape corresponding to the through-hole inserted into the through-hole. 2. A printed circuit such as the first item in the scope of patent application The sheet for forming a board, wherein the above-mentioned conductive metal sheet is inserted into the through-hole so as to be aligned with the surface of the resin sheet. 3. The sheet for forming a printed circuit board according to item 1 of the patent application, wherein the above-mentioned conductive metal The small piece is more protruded than the at least one surface formed by the resin piece. 4. The sheet for forming a printed circuit board according to item 1 of the patent application scope, wherein the conductive metal small piece contains a material selected from the group consisting of a solder piece, A metal or a composite metal penetrated by at least one of the metal sheets in the group consisting of a copper sheet, a copper alloy sheet, and a sheet having a tin plating layer formed on the surface of the metal. The sheet for forming a printed circuit board according to item 1, wherein the resin sheet is formed of an insulating resin. 6. The sheet for forming a printed circuit board according to item 5 of the patent application scope, wherein the resin sheet is selected From the group consisting of polyimide, polyester, polypropylene, polyphenylene sulfide, polyvinylidene oxide, ethylene-vinyl alcohol copolymer, glass fiber reinforced epoxy, and double trimer resin It is formed by at least one kind of insulating resin. 7 · —A method for forming a through hole, which is characterized by using a punch and forming the paper X ^ Applicable to China National Standard (CNS) A4 specification (210X 297 voice) " " " " 311422 475344 Year 5: ι * 31 Ten, see you on one side The metal mold of the base of the die hole, on the base, the resin sheet is provided on the base side, and the resin sheet and the conductive metal sheet are superposedly placed, and the punch is subjected to phase-to-pair separation from the base. The action is to break through the Shuyuezhi sheet, and use the small piece of the punctured conductive metal sheet to penetrate the resin sheet, while positioning the small piece of the punctured conductive metal sheet to be formed on the resin sheet. On the inside. 8. The through-hole forming method according to item 7 of the scope of patent application, wherein the punch is integrally formed on a metal mold having a base for forming a die hole. 9. The through-hole forming method according to item 7 of the patent application scope, wherein the resin sheet is made of an insulating resin. 10. The method for forming a through hole according to item 9 of the scope of the patent application, wherein the above-mentioned tree month sheet is selected from polyimide, polyester, polypropylene, polyphenylene sulfide, polyvinylidene chloride, It is formed of at least one kind of insulating resin in the group consisting of acetamidine-vinyl alcohol copolymer, glass fiber-reinforced cycloemulsion, and bis-dimeramine di-D-polyene resin. Printed by U.S. Welfare Committee of the Central Bureau of Standards of the Ministry of Economic Affairs, such as the method of forming a through hole in the scope of patent application No. 7, wherein the conductive metal sheet is formed on a surface selected from the group consisting of solder sheet, copper sheet, copper alloy sheet and metal At least one type of metal sheet in the group consisting of sheets having a layer of mineral tin. 12. A method for forming a through hole, characterized in that a punch and a metal mold having a base for forming a die hole are used, and on the base, the resin sheet is set on the base side and the resin sheet and the resin sheet are placed on top of each other. A conductive metal sheet thicker than the resin sheet, and the punch performs a relative separation operation on the base to penetrate the resin sheet, and a small piece of the punctured conductive metal sheet is used to penetrate the resin sheet. It is made of resin, and at the same time, the punctured conductive gold 311422 is applied to the paper size of China National Standard (CNS) A4 (210 X 297). 1- glaze; small piece of tJ _ H3 metal sheet is formed in resin In the perforation on the sheet, at least one of the tip end portions of the sheet is inserted from the surface of the resin sheet so that a small sheet of the punctured electrical metal sheet is inserted. 13. The method for forming a through hole according to item 12 of the application, wherein the weighing head is integrally formed on a metal mold having a base for forming a die hole. 14. The method for forming a through hole according to item 12 of the application, wherein the resin sheet is made of an insulating resin. 15. The method for forming through holes according to item 12 of the scope of the application, wherein the above-mentioned tree month sheet is selected from the group consisting of polyimide, polyacetate, polypropylene, polyphenylene sulfide, polyvinylidene oxide, and ethylene. _ Formed of at least one insulating resin in the group consisting of vinyl alcohol copolymer, glass fiber reinforced epoxy, and bismelamine dioxane wax. 16. The method for forming a through hole according to item 12 of the application, wherein the conductive metal sheet is a group selected from the group consisting of a solder sheet, a steel sheet, a steel alloy sheet, and a sheet having a tin plating layer formed on the surface of the metal. Formed from at least one metal sheet in the group. 17 · —A method for manufacturing a resin sheet with a buried via hole, which has a buried via hole filled with metal inside the via hole, and is characterized by including: printed by a staff welfare committee of the Central Standards Bureau of the Ministry of Economic Affairs A feeding step of a head and a metal mold having a base forming a die hole on which the resin sheet is set on the base side and the resin sheet and the conductive gold eyebrow sheet are superposedly supplied; and the punch is applied to the base The opposite action is to break through the conductive metal sheet, and use the small piece of the broken metal sheet to penetrate the resin sheet, and position the small piece of the metal sheet in the punch hole of the resin sheet. Wear steps. ^ Paper recognition applies to Zhongguanxu Zun (CNS) A4 specification (210X 297 male fJ 3 311422 Λ 〇,, ——------- ~ .-- ----- --_ ^ 18 · For example, the scope of the patent application for the manufacturing method Gan Shi,., On the resin sheet with buried through holes | Punch system-the body is formed on a metal die with a base forming a die hole. The method for making a resin sheet with a buried through hole in item 17 of the patent application, which states that the above-mentioned Shuteng sheet is made of an insulating resin. A method for producing a wax sheet from which 'the' resin sheet is selected from the group consisting of polyimide, polyimide, polypropylene, polyphenylene sulfide, polyvinylidene oxide, ethylene-vinyl alcohol copolymer, and glass The fiber-reinforced epoxy and the double melamine triple farming resin are formed of at least one insulating resin. 21. The method for manufacturing a resin sheet with buried through holes as claimed in item 17 of the application, wherein the conductive metal sheet is formed on a surface selected from the group consisting of a solder sheet, a copper sheet, a copper alloy sheet, and a metal. Formed by at least one metal sheet in a group or group of tin-plated sheets. Printed by the Staff Welfare Committee of the Central Bureau of Standards of the Ministry of Economic Affairs 22 · The manufacturing method of a resin sheet with a buried through hole, such as in the scope of application for item 17, which includes a small piece of electrical connection located in the above-mentioned perforation and perforation A step of forming a wiring pattern on both sides of the resin sheet. 23 · —A method for manufacturing a resin sheet with a buried through hole, which has a buried through hole filled with metal inside the through hole, and is characterized by including: using a punch, and a base having a die hole. A step of forming a perforation in a desired pattern on a resin sheet by a metal mold; a step of forming a resin sheet on the base on the base side and supplying the resin sheet and the conductive metal sheet forming the perforated sheet in an overlapping manner The standard is applicable to China National Standard (CNS) A 4 specification (210 X 297 public love) 4 311422 475344 Η3 T. Qing ΣΐΙ step; and the punching step for causing the punch to perform a relative detachment action on the base to penetrate the conductive metal sheet, and positioning the small piece of the punched metal sheet in the pre-formed perforation 24 · For example, a method for manufacturing a resin sheet with a buried through hole in the scope of patent application No. 23, wherein the above-mentioned punch is integrally formed on a metal mold having a base for forming a die hole. Manufacturing method of resin sheet with buried through holes' wherein, the above resin sheet is made of insulating resin. It is printed by the Staff Welfare Committee of the Central Bureau of Standards in the Ministry of Economic Affairs. A method for manufacturing a resin sheet with buried holes, wherein the resin sheet is selected from the group consisting of polyimide, polyacetate, polypropylene, polyphenylene sulfide, polyvinylidene oxide, ethylene-vinyl alcohol copolymer, Glass fiber reinforced epoxy and double melamine triple farming resin formed of at least one of the insulating resins in the group 27. Such as the application for the scope of the patent application No. 23 with a landfill through-hole resin sheet A method for producing 'wherein the conductive metal sheet to based solder sheet copper, a copper alloy sheet and the surface of a metal selected from the group formed of tin-plated layer with a sheet constituted of at least one metal in the formed sheet. 28. The method for manufacturing a resin sheet with buried through holes as claimed in item 23 of the scope of patent application, which includes forming a wiring pattern on a small piece electrically connected to the above-mentioned hole and perforation formed on the resin sheet. Step scales on both sides. 29.—A method for manufacturing a resin sheet with a buried via hole, which has a buried via hole filled with metal inside the via, and is characterized by including: 311422 475344 A punch and a metal mold having a base for forming a die hole are provided on the base, and a resin sheet is provided on the base side to overlap and supply a single-side formed guide with a step of supplying the resin sheet and the conductive metal sheet in a layer. ; And making the punch perform relative detaching action on the base to penetrate the conductive metal sheet, and use the small piece of the broken metal sheet to penetrate the resin sheet, and make the small piece of the metal sheet contact the conductor Layer and positioned in the punching step of the perforation of the resin sheet. 30. The method for manufacturing a resin sheet with buried vias according to item 29 of the patent application scope, further comprising an etching step of forming the conductor layer into a desired wiring pattern. 31. The method for manufacturing a resin sheet having a buried through hole according to item 29 of the application, wherein the punch is integrally formed on a metal mold having a base for forming a die hole. 32. The method for manufacturing a resin sheet having a buried through hole according to item 29 of the application, wherein the resin sheet is made of an insulating resin. Printed by the Staff Welfare Committee of the Central Bureau of Standards of the Ministry of Economic Affairs 33. Manufacturing method of resin sheet with buried through-holes, such as the scope of application for patent No. 32, wherein the above resin sheet is selected from the group consisting of polyimide and polyimide That is, it is formed of at least one insulating resin in the group consisting of propylene, polyphenylene sulfide, polyvinylidene oxide, ethylene-vinyl alcohol copolymer, glass fiber reinforced epoxy, and double melamine triple farming resin. 34. A method for manufacturing a resin sheet having a buried via hole as described in claim 29 of the patent scope, wherein the conductive metal sheet is formed on a surface selected from the group consisting of a solder sheet, a copper sheet, a steel alloy sheet, and a metal. A group consisting of sheets of tinned layer is formed by at least one metal sheet. This paper is τguan miscellaneous standard (CNS) A4 size (2K) χ tear male ----- 6 311422 475344 correction > t ^, * Mi! 35 · A method for manufacturing a resin sheet with a buried through hole, as described in the scope of patent application No. 29, which includes forming a wiring pattern on a small piece electrically connected to the above-mentioned perforation and perforation in the above resin. Steps on both sides of the production. 36 · —A method for manufacturing a resin sheet with a buried through hole, which has a buried through hole filled with metal inside the through hole, and is characterized by including the use of a punch and a base having a die hole. A metal mold is formed in a desired pattern on a resin sheet having a conductive layer formed on its surface. The steps are described below. The resin sheet is placed on the base side and overlapped with a plurality of resin sheets on which the perforations are formed. Provide multiple steps with the conductive metal sheet; and make the punch perform the relative detachment action on the base to hand the conductive metal sheet, and contact the small piece of the punctured metal sheet with the conductive layer and position it at The punching step of the perforated household previously formed on the resin sheet. 37. For example, a resin sheet with a buried through hole in the scope of application for patent No. 36, the H3 manufacturing method printed by the Staff Welfare Committee of the Central Standards Bureau of the Ministry of Economic Affairs, which contains Carved steps and disadvantages. 38. In the method for manufacturing a resin sheet with a buried through hole according to item 36 of the patent application, its f, the punch is integrally formed on a metal mold having a base for forming a die hole. 39. For the method for manufacturing a resin sheet with a buried through hole, as described in item 36 of the scope of patent application, the resin sheet is made of an insulating resin. 0 7 311422 He Shengsheng, Ben, 'Where' of the resin sheet with buried through-holes claiming item 39 of the patent scope is selected from the group consisting of polyimide, poly9 propylene, polyphenylene sulfide, At least one kind of insulating resin in the group consisting of polyvinylidene oxide, ethylene-vinyl alcohol / polymer, glass fiber reinforced epoxy, and double melamine triple farming resin. 41. ^ The method for manufacturing a resin sheet with a buried via hole in item 36 of the applied research patent, wherein the conductive metal sheet is formed on a surface selected from the group consisting of a solder sheet, a copper sigma gold sheet, and a metal. At least one metal sheet in the group consisting of the tin-plated sheet. 42. The method for manufacturing a resin sheet with a buried via hole according to item 36 of the scope of patent application, which comprises forming a wiring pattern on a small piece electrically connected to the inside of the above-mentioned perforation and perforation on the above-mentioned resin sheet. Steps on both sides. A method for manufacturing a resin sheet with a buried via hole, which has a buried via hole filled with metal inside the via hole, and is characterized by including: printed punches for use by the Staff Welfare Committee of the Central Standards Bureau of the Ministry of Economic Affairs, and A metal mold having a base for forming a die hole, on which a resin sheet is provided on the base side to overlap and supply a scale of a tree-shaped sheet having a conductive layer formed on both sides thereof and a conductive metal sheet; and The punch performs a relative separating operation on the base to penetrate the conductive metal sheet, and uses the small piece of the broken metal sheet to penetrate the resin sheet, and makes the small piece of the metal sheet contact the two conductive layers and locate the same. A punching step in the punching of the resin sheet. 44. The method for manufacturing a resin sheet with buried vias according to item 43 of the scope of patent application, which includes an etching step of forming the above-mentioned two conductor layers into a desired wiring pattern. This paper size is applicable to Chinese National Standard (C N S) A 4 specification (210 X 297 public meetings) 8 311422 h month 丨 Hiqi 45. The method of making a resin sheet with a buried through hole as described in the patent application No. 43, wherein the punch is integrally formed on a metal mold having a base for forming a die hole. 46. If the method for manufacturing a resin sheet with a buried through hole is applied to item 43 of the scope of the patent application, Gan ▲ »Wherein, the above-mentioned resin sheet is formed of an insulating resin. 47. The method for manufacturing a resin sheet with buried through holes as described in item 46 of the patent scope, wherein the resin sheet is selected from the group consisting of polyimide, polyδθ polypropylene, polyphenylsulfide, and polyimide. At least one kind of insulating resin in the group consisting of digas ethylene, ethylene-vinyl alcohol copolymer, glass fiber reinforced epoxy, and bis-triazine tri-resin resin. 48. The method for manufacturing a resin sheet with buried through holes according to item 43 of the scope of the patent application, wherein the conductive metal sheet is formed by plating on a surface selected from the group consisting of a solder sheet, a copper sheet, a steel alloy sheet, and a metal. At least one type of metal sheet in the group consisting of sheets of tin layer. Printed by the Staff Welfare Committee of the Central Standards Bureau of the Ministry of Economic Affairs 49, such as the method of manufacturing a resin sheet with a buried through hole in the scope of patent application No. 43, which includes a small piece of electrical connection located in the above-mentioned perforation and perforation A step of forming a wiring pattern on both sides of the resin sheet. 50 · —A method for manufacturing a resin sheet with a buried through-hole, which has a buried through-hole filled with metal inside the through-hole, and is characterized by including: the use of a punch and a base with a die hole A metal mold is a step of forming a perforation in a desired pattern on a resin sheet having a conductor layer formed on both sides; the resin sheet is set on the base side and overlapped to supply the paper. The Chinese standard (CNS) A applies 4 specifications (210 X 297 public love) 9 311422 44 H3 Supply step of forming the resin sheet and the conductive metal sheet with the above-mentioned perforations; and causing the above-mentioned punch to perform a relative separating operation on the base to penetrate the conductivity A punching step in which a small piece of the punched metal sheet contacts the two conductor layers and is located in a punched hole formed in the resin sheet in advance. 51. The method for manufacturing a resin sheet with buried and buried vias according to item 50 of the scope of patent application, which includes the step of engraving the above-mentioned two conductor layers into a desired wiring pattern. 52. The method for manufacturing a resin sheet having a buried through hole according to item 50 of the application for patent, wherein the punch is integrally formed on a metal mold having a base for forming a die hole. 53. The method for manufacturing a resin sheet having a buried through hole according to item 50 of the application, wherein the resin sheet is made of an insulating resin. Printed by a member of the Central Standards Bureau of the Ministry of Economic Affairs and the Welfare Committee. 54. A method for manufacturing a resin sheet with buried through holes such as 53 in the scope of the patent application. , Polypropylene, polystyrene sulfide, polyvinylidene oxide, ethylene-vinyl alcohol copolymer, glass fiber reinforced epoxy, and double trimer resin . 55. For example, a method for manufacturing a resin sheet with a buried through hole such as in the scope of application for a patent No. 50, wherein the conductive metal sheet is formed on a surface selected from the group consisting of a solder sheet, a steel sheet, a steel alloy sheet, and a metal. At least one metal sheet in the group consisting of the tin-plated sheet. This paper is a Chinese standard (CNS) A4 specification (210X297). Please use the paper 50% of the patent scope of the resin sheet with landfill through-hole reflex oil by mm 丄 nr ft-丨 ------ -----------------10 311422 475344 H3 manufacturing method, which includes the step 57 of forming a wiring pattern on a small piece electrically connected to the inside of the above-mentioned perforation and perforation on both sides of the above-mentioned resin-made sheet. The manufacturing method includes a buried through hole filled with metal inside the through hole, and is characterized by comprising: using a punch and a metal mold having a base for forming a die hole, and setting a resin sheet on the base. A step of supplying a resin sheet and a conductive metal sheet that is thicker than the resin sheet on the base side; and making the punch perform a relative separation operation on the base to penetrate the conductive metal sheet, A small piece of the punctured metal sheet penetrates the above-mentioned wax-making sheet, and the small piece of the metal sheet is positioned in a punching step of the resin sheet in such a manner that the front end thereof protrudes outside the punched sheet. 5 8. The method for manufacturing a resin sheet with a buried through hole according to item 57 of the scope of patent application, wherein a wiring pattern including a non-protruding side for electrically connecting a small piece located in the perforation is formed on the resin The steps on one side of the film are mixed. 59. The method for printing and manufacturing the employee welfare committee of the Central Standards Bureau of the Ministry of Economic Affairs, such as a resin sheet with a buried through hole according to item 57 of the scope of patent application, includes an etching step of forming the above-mentioned two conductor layers into a desired wiring pattern. . 60. For example, the method for manufacturing a resin sheet with a buried through hole in item 57 of the scope of application for a patent, wherein the punch is integrally formed on a metal mold having a base for forming a die hole. 61. The method for manufacturing a resin sheet with a buried through hole according to item 57 of the scope of the patent application, wherein the above-mentioned resin sheet is made of an insulating resin. The paper is applicable from the National Standard for Standards (CNS) A4. (21GX 297 public love)-11 311422 Cheng. 62. The method for manufacturing a resin sheet with a buried through hole according to item 61 of the application, wherein the resin sheet is selected from the group consisting of polyimide, poly'polypropylene, polyphenylene sulfide, and polyimide At least one kind of insulating resin in the group consisting of digas ethylene, ethylene-vinyl alcohol copolymer, glass fiber reinforced epoxy, and double melamine triple farming resin. 63. The method of manufacturing a resin sheet with a buried via hole according to item 57 of the scope of the patent application, wherein the conductive metal sheet is formed by plating on a surface selected from the group consisting of a solder sheet, a steel sheet, a steel alloy sheet, and a metal. The tin layer is formed of at least one metal sheet of the group t. 64. The method for manufacturing a resin sheet with a buried through hole according to item 57 of the scope of patent application, which includes forming a wiring pattern on a small piece electrically connected to the inside of the above-mentioned perforation and perforation on the above-mentioned resin sheet. Steps on both sides. 65 · A method for manufacturing a resin sheet with a buried through hole, which has a buried through hole filled with metal inside the through hole, and is characterized by including: using a punch and a metal having a base forming a die hole Step of forming the above-mentioned perforation in a desired pattern on a resin sheet; the Employee Welfare Committee of the Central Standards Bureau of the Ministry of Economic Affairs printed on the above-mentioned base and placed the resin sheet on the side of the base and superimposedly supplied the resin-made sheet forming the above-mentioned perforation. A step of supplying a conductive metal sheet that is thicker than the resin sheet; and the opposite punching operation of the punch to the base to penetrate the conductive metal sheet, and the small piece of the penetrated metal sheet to The front end is protruded outside the perforation so as to be positioned in a punching step formed in advance in the perforation of the resin sheet. Mna Laihan CNS M4 specification 29X 29_ " ~, year I v month B day amendment supplement H3 system 2 patent method 65, a method of manufacturing a resin sheet with a buried through hole, including: A step of forming a wiring pattern for electrically connecting the non-large-outside side of the sheet inside the perforation on one surface of the resin sheet. For example, the method and method of the resin sheet with buried vias in the 65th patent application range includes an etching step of forming the above-mentioned two conductor layers into a desired wiring pattern. ] It is stated that the method of manufacturing a resin sheet with a buried through hole in Item 65 of the patent, wherein the punch is integrally formed on a metal mold having a base for forming a die hole. = Manufacturing method of a resin sheet having a buried via hole in claim 65 of the patent scope ', wherein the above-mentioned resin sheet is made of an insulating resin. 〇. = The method for making resin sheet with buried through holes in item 69 of Shenyan's patent scope ', wherein the resin sheet is selected from the group consisting of polyimide, polypropylene, and polyphenylene sulfide. At least one kind of insulating resin in the group consisting of polyvinylidene oxide, ethylene-vinyl alcohol copolymer, glass fiber reinforced epoxy, and double melamine triple farming resin. Printed by the Staff Welfare Committee of the Central Standards Bureau of the Ministry of Economic Affairs 71 · If the method of manufacturing a resin sheet with buried through holes is applied in the scope of patent application No. 65 ', wherein the conductive metal sheet is selected from the group consisting of solder sheet, copper sheet At least one type of metal sheet in the group consisting of a steel alloy sheet and a sheet having a tin plating layer formed on the surface of the metal. 72. If the method of manufacturing a resin sheet with buried through holes such as item 65 in the scope of the patent application, its order includes the wiring pattern on the small piece of electrical connection located in the above-mentioned perforation and perforation ~ 1 · 1 is formed on the above Resin-made double-sided paper is applicable to China National Magic Standard (Cns) A4 specification (210X 297) 311422 475344 Step 73. A method for manufacturing a resin sheet with a buried through hole, which has a buried through hole filled with metal inside the through hole, which is characterized by: using a punch, and having a die hole. A step of supplying a metal mold of a base on which the resin sheet is provided on the base side and overlappingly supplying a resin sheet having a conductive layer formed on one side and a conductive metal sheet thicker than the resin sheet; and The punch performs a relative separation operation on the base to penetrate the conductive metal sheet, and uses the small piece of the broken metal sheet to penetrate the resin sheet, and makes the small piece of the metal sheet contact the conductor layer, and The punching step of the front end protruding beyond the punching hole is located in the punching hole of the resin sheet. 74. The method for manufacturing a resin sheet with a buried via hole according to item 73 of the scope of patent application, which includes an engraving step of forming the above-mentioned two conductor layers into a desired wiring pattern. 7 5. The method for manufacturing a resin sheet with a buried through hole as described in item 73 of the patent application, wherein the punch is formed on a metal mold having a base for forming a die hole. Printed by the Staff Welfare Committee of the Central Bureau of Standards of the Ministry of Economic Affairs 76. A method of manufacturing a resin sheet with buried through holes, such as in the scope of patent application No. 73, wherein the resin sheet is made of an insulating resin. 77. The method for manufacturing a resin sheet with a buried through hole according to item 76 of the application, wherein the resin sheet is selected from the group consisting of polyimide, polyimide, polypropylene, polyphenylene sulfide, Polyvinylidene oxide, ethylene-ethylene year correction ---- L_H3_ is formed by at least one insulating resin in the group. 78. The method for manufacturing a resin sheet with a buried through hole as described in the scope of patent application No. 73, wherein the conductive metal sheet is formed with a surface selected from the group consisting of a solder sheet, a copper sheet, a copper alloy sheet, and a metal. At least one type of metal sheet in the group consisting of sheets of tin layer. 79. A method for manufacturing a resin sheet having a buried through hole according to item 73 of the scope of application for a patent, wherein the method includes forming a wiring pattern for electrically connecting a small piece located in the above-mentioned perforation and perforation on the above-mentioned resin sheet. Steps on both sides. 80 · —A method for manufacturing a resin sheet with a buried through hole, which has a buried through hole filled with metal inside the through hole, which is characterized by including the use of a punch 'and a base for forming a die hole Step for forming a perforation in a desired pattern on a resin sheet having a conductive layer formed on one side; a wax sheet is set on the base and the resin made with the above-mentioned perforation is re-examined A step of supplying a sheet and a conductive metal sheet which is thicker than the resin sheet; and printed by the Staff Welfare Committee of the Central Standards Bureau of the Ministry of Economic Affairs to make the above-mentioned punches move away from the base to penetrate the conductive metal sheet, The punching step of causing the small piece of the punctured metal sheet to contact the above-mentioned conductor layer and being located in the punching hole formed in advance in the resin sheet in such a manner that the front end protrudes outside the punching hole. 81. The method for manufacturing a resin sheet with buried vias according to item 80 of the scope of patent application, which includes an etching step of forming the above-mentioned two conductor layers into a desired wiring pattern. 82. If the scope of the patent application is No. 80, a resin-made paper with a through hole for landfilling is suitable for use (cN s) A4 specification (2 w X 297) · -------- -15 311422 Manufacturing method, wherein the punch is integrally formed on a metal mold having a base forming a die hole β 83. The manufacturing method of a resin sheet with a buried through hole, such as the scope of patent application No. 80, wherein The above-mentioned resin sheet is made of insulating wax. 84. For example, the method for manufacturing a resin-made sheet with a buried through hole in the patent application No. 83, wherein the above-mentioned resin sheet is selected from polyimide , Polyester, polypropylene, polyphenylene sulfide, polyvinylidene oxide, ethylene-vinyl alcohol copolymer, glass woven reinforced epoxy, and double melamine triple farming resin made of at least one insulating resin. 85. For example, a method for manufacturing a resin sheet with buried through holes such as the scope of application for patent No. 80, wherein the conductive metal sheet is formed by plating on a surface selected from the group consisting of a solder sheet, a copper sheet, a steel alloy sheet, and a metal. Of the group of tin layers One less metal sheet is formed. 86. For example, a method for manufacturing a resin sheet with a buried through hole such as in the scope of patent application No. 80, which includes a wiring pattern including an electrical connection on a small piece located in the above-mentioned perforation and perforation formed in the above tree wax Steps on both sides of the sheet. Printed by the Staff Welfare Committee of the Central Standards Bureau of the Ministry of Economic Affairs 87 · —A resin sheet with buried through holes, which is characterized in that it includes: a resin sheet that has through holes in the thickness direction and is formed on at least one surface There is a conductor layer; and a small piece of conductive metal is inserted into the through hole and has a shape slightly corresponding to the through hole. 88. The resin sheet having a buried through hole according to item 87 of the application for a patent, wherein the conductive metal sheet is inserted into the through hole in line with the surface of the resin sheet. This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X 297 issued) 16 311422 475344 VH1 amended and supplemented i H3 89. For example, the resin sheet with buried through holes in the 87th scope of the patent application, where the above conductive The small piece of flexible metal is more prominent than the inserter on at least one surface formed by the resin sheet. 90. A resin sheet having a buried via hole as set forth in the scope of patent application No. 87, wherein the above-mentioned conductive metal sheet contains a tin plating layer formed on a surface selected from the group consisting of a solder sheet, a copper sheet, a copper alloy sheet, and a metal. A metal or composite metal penetrated by at least one of the metal pieces in the group of pieces. 91. A resin sheet having a buried via hole as set forth in claim 87, wherein the above-mentioned resin sheet is made of an insulating resin. 92. A resin sheet having a buried through hole according to item 91 of the application, wherein the above-mentioned resin sheet is selected from the group consisting of polyimide, polyacetate, polypropylene, polyphenylene sulfide, and polyvinylidene dichloride. It is formed of at least one insulating resin in the group consisting of ethylene, ethylene-vinyl alcohol copolymer, glass-woven reinforced epoxy, and double melamine triple farming resin. Printed by the Staff Welfare Committee of the Central Standards Bureau of the Ministry of Economic Affairs of the People's Republic of China. A type of conductive metal sheet inserting through-hole forming device, which includes: a metal mold with a base with a mold hole formed; and a punch provided between the mold and the mold. The corresponding position of the hole, and the upper limit of the base is relatively moved, and the resin sheet and the conductive metal sheet are sequentially placed on the base, and the punch can be formed by making the punch relatively close to the base. It is arranged on the conductive metal sheet, and the position of the punch is controlled to stop the punch at a position where the punctured conductive metal sheet can be inserted into a perforation formed on a resin sheet. . 94. For example, if a conductive metal piece of the scope of application for a patent is inserted into a through-hole forming device, t, the base on which the die hole is formed is a lower die of the metal die, and the punch is formed to form a lower die of the metal die. Relative separation 311422 17 This paper size applies to China National Standard (CNS) A4 (210 X 297 public love)