JP2001283996A - Sheet-like connector and its manufacturing method, electrical equipment connecting device and inspection equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet-like connector which can hold high contact reliability over a long period of time, and can attain electrical connection in the state that a resistance is small enough to a metal electrode of a semiconductor equipment which should be connected, and its manufacturing method, an electrical equipment connection device, and an inspection equipment. SOLUTION: The sheet-like connector is formed of two or more penetration electrical conduction parts, which penetrate and are extended in the thickness direction, in a mutually insulated state; a barrier layer which consists of a diffusion-resistant metal is prepared in the surface of the penetration electrical conduction part which makes contacts oppositely with a metal electrode of an electric equipment which should be connected. Moreover, an edge is formed in a part contacting oppositely of the penetration electrical conduction part, which oppositely contacts with the metal electrode of the electrical equipment which should be connected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sheet-like connector, a method of manufacturing the same, an electric device connecting device, and an inspection device, for example, a BGA (Ball Grid Ar).
The present invention relates to a sheet-like connector suitably used for inspection of high-frequency characteristics of an electric device typified by various circuit devices such as a semiconductor device having a bump-shaped electrode such as a semiconductor device, a manufacturing method thereof, an electric device connecting device, and an inspection device. .

[0002]

2. Description of the Related Art In general, with the miniaturization and high performance of equipment, the number of electrodes of an electric device tends to increase, and the pitch between the electrodes tends to be reduced. Further, for example, an electrical device such as a semiconductor device in which a hemispherical protruding electrode is formed on one surface, such as a BGA, can be mounted on a supporting substrate at a high density, and its importance is increasing.

Conventionally, in the electrical operation inspection of this type of electric device, it is necessary to achieve an electrical connection between a protruding electrode formed on one surface of the electric device to be inspected and a connection electrode of an inspection jig. In addition, an anisotropic conductive sheet-like connector is interposed between the electric device and the inspection jig. Such a sheet-like connector is one in which a plurality of penetrating conductive parts extending through the thickness direction thereof are insulated from each other. For example, the sheet-like connector is formed by forming a penetrating conductive part on a flexible insulating sheet. is there.

FIG. 19 is a cross-sectional view illustrating the configuration of an example of such a sheet-like connector together with a semiconductor device and a test jig, which are a kind of electric device. The sheet-like connector 80 of this example is interposed between the semiconductor device 1 to be inspected and the inspection jig 5, and each protruding electrode 2 made of, for example, a solder alloy of the semiconductor device 1 and the corresponding bump electrode 2 corresponding thereto. This is for electrically connecting the connection electrode 6 of the inspection jig 5. The sheet-like connector 80 is formed by forming an insulating sheet 81 made of, for example, a polyimide resin on a penetrating conductive material made of, for example, copper, which extends in the thickness direction of the insulating sheet 81 according to a pattern corresponding to the pattern of the bump electrodes 2 of the semiconductor device 1. A portion 82 is formed, and the upper and lower surfaces of the through conductive portion 82 are subjected to gold plating to prevent oxidation and corrosion.

However, when an electrical operation test is performed on the semiconductor device 1 using such a sheet-like connector 80, the following problem occurs.

(1) Tin, which is a component of the solder alloy of the protruding electrode 2 of the semiconductor device 1, is a readily diffusible metal, and this tin is applied to the gold in the gold-plated portion of the through conductive portion 82 of the sheet-like connector 80. Because diffusion metal diffusion occurs,
The ability of the gold to prevent oxidation and corrosion is reduced, and as a result, high contact reliability cannot be maintained for a long period of time.

(2) Since a metal oxide film is usually formed on the surface of the bump electrode 2 of the semiconductor device 1, the electrical resistance between the bump electrode 2 and the penetrating conductive portion 82 becomes large. When the semiconductor device 1 is inspected for high-frequency characteristics, since a large current is supplied, a considerable amount of resistance heat is generated, and the heat deteriorates the sheet-like connector 80, resulting in a sufficiently high durability and a sufficiently high resistance. Cannot obtain a long service life. In recent years, for example, “DRDRAM (Direct Rambus Dyn)
Amic Random Access Memory
y)), the demand for semiconductor devices that consume a large amount of current due to high-speed operation is rapidly increasing. However, even when these semiconductor devices are used to inspect high-frequency characteristics, the same applies. There's a problem.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method in which a metal electrode of an electric device to be connected contains an easily diffusible metal. Even in such a case, it is an object of the present invention to provide a sheet-shaped connector that maintains high contact reliability for a long period of time. Another object of the present invention is to provide a sheet-like connector capable of achieving an electrical connection to a metal electrode of an electrical device to be connected with a sufficiently low electrical resistance state. Another object of the present invention is to provide a method capable of easily and reliably manufacturing the above-mentioned sheet-like connector. Yet another object of the invention is to provide a metal electrode of an electrical device to be connected,
Electrical connection can be achieved in a sufficiently small electric resistance state, and high contact reliability can be maintained for a long period of time even when the metal electrode contains a readily diffusible metal. An electrical device connection device is provided. Another object of the present invention is to provide an inspection apparatus that can easily perform inspection with high reliability even in inspection of an electric device that requires a large power supply current.

[0009]

SUMMARY OF THE INVENTION A sheet-like connector of the present invention is a sheet-like connector used for electrical connection with an electric device provided with a metal electrode, and includes a plurality of sheets extending through the thickness thereof. The through conductive portions are formed in a state in which they are insulated from each other, and a barrier layer made of a diffusion-resistant metal is provided on a surface of the through conductive portion that is in contact with a metal electrode of the electric device. .

[0010] The sheet-like connector of the present invention is a sheet-like connector used for electrical connection with an electric device provided with a metal electrode, wherein a plurality of penetrating conductive portions extending through the thickness direction thereof are mutually connected. It is formed in an insulated state, and an edge is formed at a contact portion of the through conductive portion that contacts the metal electrode of the electric device.

In the above-mentioned sheet-like connector, the penetrating conductive portion has a columnar conductive portion and a projecting conductive portion projecting integrally and continuously with the columnar conductive portion. It is preferable that the edge is formed by a vertex of the cone.

In the above sheet connector, when the metal electrode of the electrical device is a hemispherical protruding electrode, an opening having a diameter smaller than the diameter of the protruding electrode is formed at a portion in contact with the penetrating conductive portion. Preferably, an edge is formed by the inner peripheral edge of the opening.

In the above-mentioned sheet-like connector, it is preferable that the penetrating conductive portion is provided with a barrier layer made of a diffusion-resistant metal on the surface of the contact portion. In particular, the diffusion-resistant metal forming the barrier layer is preferably any metal selected from rhodium, palladium, silver, tungsten, and platinum.

Further, in the above-mentioned sheet-like connector, it is preferable that the metal electrode is used for electrical connection with an electrical device containing a readily diffusible metal, and that the metal electrode is electrically connected with an electrical device comprising a semiconductor device. It is preferably used for.

According to the method of manufacturing a sheet-like connector of the present invention, a molding substrate having a recess formed on a molding surface corresponding to a projecting conductive portion of a penetrating conductive portion is prepared, and a metal is provided in the recess of the molding substrate. And forming an insulated layer having through holes corresponding to the columnar conductive portions on the molding surface of the molding substrate obtained by this step, and forming the insulated layer through the insulated layer. By filling a metal in the hole to form a columnar metal body that is integrally continuous with the filler metal body, a sheet-like shape having a protruding conductive part made of the filler metal body and a columnar conductive part made of the columnar metal body The method includes a step of forming a connector composite and a step of removing a molding substrate from the sheet-shaped connector composite.

In the above-described method of manufacturing a sheet-like connector, the recess in the molding substrate is preferably formed by anisotropic etching. In this case, the molding substrate is made of single crystal silicon. Is preferable.

An electric device connecting device according to the present invention is an electric connecting device for an electric device, comprising the above-mentioned sheet-like connector and an anisotropic conductive sheet arranged on one side of the sheet-like connector. It is characterized by comprising.

In the above electrical device connecting apparatus, the anisotropic conductive sheet comprises a plurality of conductive path forming portions extending in the thickness direction thereof and an insulating portion for insulating the conductive path forming portions from each other. On the other hand, it is preferable that the conductive path forming portion is disposed at a position corresponding to the penetrating conductive portion, and in this case, the sheet-like connector is provided integrally with the anisotropic conductive sheet. Is preferred.

An inspection apparatus according to the present invention is an inspection apparatus for an electrical device for performing an electrical operation inspection of an electrical device, and the inspection apparatus includes the above-described electrical device connection device.

[0020]

According to the sheet-like connector of the present invention, since the barrier layer made of the diffusion-resistant metal is provided in the penetrating conductive portion, the metal electrode of the electric device to be connected contains the easily-diffusible metal. Even in such a case, the metal diffusion by the easily diffusible metal can be suppressed, and the characteristics of the penetrating conductive portion become stable, whereby high contact reliability can be maintained for a long period of time.

According to the sheet-like connector of the present invention, since the edge is formed at the contact portion of the through conductive portion, a metal oxide film is formed on the surface of the metal electrode of the electric device to be connected. In addition, the metal oxide film is scratched by the edge, so that the metal oxide film is pierced and the metal electrode and the penetrating conductive portion are brought into contact with each other, so that electrical connection is achieved with a sufficiently small electric resistance state. be able to. Therefore, even when an electrical connection is made to an electric device under a condition where a large current flows, generation of large resistance heat generation can be avoided, and as a result, sufficiently high durability and a sufficiently long service life can be obtained. Can be

According to the method for manufacturing a sheet-like connector of the present invention, the above-mentioned sheet-like connector can be easily and easily manufactured by using a molding substrate in which a recess corresponding to a protruding conductive portion to be manufactured is formed on a molding surface. It can be manufactured reliably. When the recess of the molding substrate is formed by anisotropic etching, a sheet-like connector with high dimensional accuracy can be obtained.

According to the electric device connecting apparatus of the present invention, since the above-mentioned sheet-like connector is provided, the electric connection is made with sufficiently small electric resistance to the metal electrode of the electric device to be connected. In addition, even when the metal electrode contains an easily diffusible metal, high contact reliability can be maintained for a long period of time.

According to the inspection apparatus of the present invention, since the above-described electric device connection device is provided, even in the inspection of an electric device requiring a large power supply current, the inspection can be easily performed with high reliability. it can.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. The sheet-like connector of the present invention is for achieving electrical connection between an electric device such as a semiconductor device having a metal electrode and another electric device, for example, an inspection jig. Here, a semiconductor device which is a kind of electric device to be connected includes, for example, a bare chip LSI such as a flip chip, a package LSI including a BGA, and the like.
It is a module board or a circuit board on which a plurality of multi-chip modules (MCM) are mounted, and is not particularly limited. Further, the metal electrode formed on the lower surface of the semiconductor device, for example, is usually a protruding electrode projecting from the lower surface of the semiconductor device, and has a shape such as a hemispherical shape such as a so-called ball shape, a cylindrical shape, or a prismatic shape. It has been. Hereinafter, a case where the metal electrode of the semiconductor device is a protruding electrode having a hemispherical shape will be described as an example.

FIG. 1 is an explanatory sectional view showing the configuration of the sheet-like connector according to the first embodiment of the present invention, together with a semiconductor device and a test jig which are a kind of electric device. FIG. 2 is a sectional view of FIG. It is the expanded sectional view for description which expanded and showed a part. In this example, a case will be described in which the high frequency characteristics of the semiconductor device 1 connected to the sheet-shaped connector 10 are inspected using the sheet-shaped connector 10. On the lower surface of the semiconductor device 1, there are formed protruding electrodes 2 which are arranged in a grid and contain an easily diffusible metal such as tin, for example, protruding electrodes 2 made of a solder alloy. On the upper surface of the inspection jig 5, a connection electrode 6 formed according to a pattern corresponding to the pattern of the protruding electrode 2 is formed.

The sheet-like connector 10 is interposed between the semiconductor device 1 to be inspected and the inspection jig 5, and the individual protruding electrodes 2 of the semiconductor device 1 and the corresponding inspection jigs 5 is electrically connected to the connection electrode 6.

The sheet-like connector 10 includes a flexible insulating sheet 11 and a protruding electrode 2 of the semiconductor device 1.
The plurality of penetrating conductive portions 12 each extending in the thickness direction of the insulating sheet 11 according to a pattern corresponding to the pattern
Are formed in a mutually insulated state.
In addition, the upper and lower surfaces of each penetrating conductive portion 12 project from the upper and lower surfaces of insulating sheet 11, respectively.

As shown in FIG. 2, the through conductive portion 12
Is a columnar body in which a concave portion 13 having a diameter smaller than the maximum diameter of the protruding electrode 2 is formed on the upper surface thereof.
The through conductive portion 12 has a barrier layer 14 made of a diffusion-resistant metal on the upper and lower surfaces including the concave portion 13.
Are formed, and an edge is formed by the inner peripheral edge of the opening of the concave portion 13 which becomes the contact portion 15 which contacts the protruding electrode 2 of the semiconductor device 1.

The diffusion-resistant metal forming the barrier layer 14 is appropriately selected depending on the kind of the easily-diffusible metal forming the bump electrode 2 of the semiconductor device 1. When the easily-diffusible metal is tin, Rhodium, palladium,
It is any metal selected from silver, tungsten and platinum.

The insulating sheet 1 of the sheet connector 10
The material of 1 is not particularly limited as long as it is an electrically insulating material capable of forming a flexible sheet, and examples thereof include thermosetting resins such as polyimide resin and epoxy resin, polyethylene terephthalate resin, and polybutylene terephthalate resin. Polyester resin, vinyl chloride resin, polystyrene resin, polyacrylonitrile resin, polyethylene resin, polypropylene resin, acrylic resin, polybutadiene resin, thermoplastic resin such as polyphenylene ether, polyphenylene sulfide, polyamide, polyoxymethylene, polybutadiene rubber, natural rubber, poly Isoprene rubber, styrene-butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber, styrene-butadiene block copolymer rubber, and hydrogenation of these conjugated diene polymers Things, silicone rubbers, ethylene - propylene copolymer rubber, urethane rubber, polyester rubber, chloroprene rubber, such as rubber or elastomer such as epichlorohydrin rubber is used. Among these, a thermosetting resin is preferable in terms of heat resistance and dimensional stability, and a polyimide resin is particularly preferable.

Further, the insulating sheet 11 is provided in a range where the flexibility is not impaired or a range where production is not hindered.
For example, a composite insulating sheet including a mesh sheet such as a nylon fiber or an aramid fiber, or a reinforcing sheet such as an aramid nonwoven sheet may be used. Thereby, dimensional stability and strength are improved, and many materials described above can be used.

Nickel, copper, gold, and other metals can be used as the metal material for forming the penetrating conductive portion 12, but it is preferable to use copper from the viewpoint of manufacturing.

Next, a specific method of manufacturing the above-described sheet-like connector 10 will be described. FIG. 3 is an explanatory view schematically showing one example of a method for manufacturing the above-described sheet-like connector 10. First, as shown in FIG. 3A, a sheet including an insulating sheet 21 made of, for example, a polyimide resin, and conductive films 21a and 21b made of, for example, copper formed on the upper and lower surfaces of the insulating sheet 21. As shown in FIG. 3 (b), a sheet-like substrate 20 is prepared, and is etched so as to form a predetermined portion of the upper surface side conductive film 21a of the sheet-like substrate 20, that is, the through conductive portion 1 to be manufactured.
For example, a circular opening 22 is formed at a location corresponding to 2.

Next, as shown in FIG. 3C, the conductive film 21 on the insulating sheet 21 of the sheet-like substrate 20 is formed.
A circular opening 23 communicating with the opening 22a and having the same diameter as the opening 22 is formed by, for example, laser processing.

Next, as shown in FIG.
By plating the upper and lower surfaces of the sheet-like substrate 20 including the inner peripheral surface and the bottom surface of the conductive substrates 2 and 23, the conductive intermediate films 24a and 24 made of a conductive metal such as copper are provided.
4b is formed.

Then, as shown in FIG. 3E, the upper and lower surfaces of the insulating sheet 21 are exposed in a region other than the portion corresponding to the penetrating conductive portion 12 to be manufactured. By performing an etching process on the base 20, a through conductive portion base 12K composed of the conductive films 21a and 21b and the conductive intermediate films 24a and 24b is formed.

Next, as shown in FIG. 3F, a plating resist layer 25 is formed on the upper and lower surfaces of the exposed area of the insulating sheet 21 by appropriate means, and the plating resist layer 25 is interposed. By performing the plating process,
The barrier layer 14 made of a diffusion-resistant metal is formed on the upper and lower surfaces of the through conductive portion base 12K. Thereafter, by removing the plating resist layer 25, the penetrating conductive portion base 12K having the barrier layer 14 provided on the upper surface and the lower surface is provided.
The sheet-like connector 10 shown in FIG.

The sheet connector 10 can also be manufactured by a method as shown in FIG. In this example, as shown in FIG.
1. A sheet-like substrate 20 having an opening 23 formed in FIG.
(C). ), An opening 26 a continuous with the openings 22 and 23 of the sheet-like base 20 is provided on the upper surface thereof.
And a plating resist layer 27b having an opening 26b at a position corresponding to the openings 22 and 23 of the sheet-like substrate 20 on the lower surface.
To form

Next, as shown in FIG. 4B, a plating process is performed via the plating resist layers 27a and 27b, so that conductive upper and lower surfaces of the sheet-like base 20 including the openings 22 and 23 are respectively provided. Films 24a and 24b are formed, and as shown in FIG.
Barrier layer 1 made of diffusion-resistant metal on the surfaces of 4a and 24b
4 is formed.

Thereafter, as shown in FIG. 4D, the plating resist layers 27a and 27b are removed, and the conductive film 2
By removing the exposed areas 1a and 21b by etching, the sheet-like connector 10 shown in FIG. 2 is manufactured.

The sheet-like connector 10 is used for electrical connection between the protruding electrode 2 of the semiconductor device 1 and the corresponding connection electrode 6 of the inspection jig 5 as follows. As shown in FIG. 1, a sheet-like connector 10 is arranged and fixed on the upper surface of the inspection jig 5 such that the lower surface of the penetrating conductive portion 12 is located on the corresponding connection electrode 6 of the inspection jig 5. I do. The semiconductor device 1 to be electrically connected to the inspection jig 5 is placed on the upper surface of the sheet-like connector 10.
The protruding electrode 2 is arranged so as to be positioned on the corresponding penetrating conductive portion 12, and the semiconductor device 1 is pressed downward against the inspection jig 5 while holding the state, thereby clamping the penetrating conductive portion 12. , The top of the lower end of the protruding electrode 2 enters the recess 13 of the through conductive portion 12, thereby
2 contacts the protruding electrode 2 while the edge of the contact portion 15 scratches the metal oxide film formed on the surface of the protruding electrode 2. As a result, electrical connection between the protruding electrode 2 and the connection electrode 6 is achieved via the through conductive portion 12, and an inspection of the high-frequency characteristics of the semiconductor device 1 is performed in this state.

The sheet-like connector 1 configured as described above
According to No. 0, since the barrier layer 14 made of the diffusion-resistant metal is provided on the upper surface and the lower surface of the through conductive portion 12, the bump electrode 2 of the semiconductor device 1 to be connected contains the easily diffused metal. Even in such a case, metal diffusion by the easily diffusible metal can be reliably suppressed, and
High contact reliability can be maintained for a long time. Further, since the insulating sheet 11 of the sheet-shaped connector 10 has flexibility, mechanical shock and strain can be absorbed in the electrical connection with the semiconductor device 1. Furthermore, sheet-like connector 1
According to No. 0, since an edge is formed at the contact portion 15 of the through conductive portion 12, even when a metal oxide film is formed on the surface of the bump electrode 2 of the semiconductor device 1 to be connected. When the metal oxide film is scratched by the edge, the metal oxide film is pierced and the protruding electrode 2 and the penetrating conductive portion 12 are brought into contact with each other, thereby achieving an electrical connection with a sufficiently low electric resistance state. be able to. Therefore,
In the inspection of high-frequency characteristics in which a large current flows, generation of large resistance heating can be avoided even in the state of electrical connection with the semiconductor device 1, and as a result, sufficiently high durability and sufficiently long service life can be obtained. Can be

FIG. 5 is an enlarged cross-sectional view illustrating the configuration of the sheet-like connector according to the second embodiment of the present invention together with a semiconductor device which is a kind of electric device. In the sheet-like connector 30 in this example, a penetrating conductive portion 32 extending in the thickness direction of the insulating sheet 31 is formed on the insulating sheet 31 according to a pattern corresponding to the pattern of the bump electrodes 2 of the semiconductor device 1. , Each through conductive portion 32
Are projected from the upper and lower surfaces of the insulating sheet 31, respectively.

The penetrating conductive portion 32 is formed as a columnar conductive portion 32.
1 and a plurality of protruding conductive portions 322 that protrude integrally with the columnar conductive portion 321. The protruding conductive portion 322 is, for example, a pyramid such as a quadrangular pyramid. The upper surface of the projecting conductive portion 322 and the columnar conductive portion 321
A barrier layer 33 made of a diffusion-resistant metal is formed on the lower surface of the semiconductor device 1, and an edge is formed by the apex of the upper end of the protruding conductive portion 322 serving as the contact portion 34 that contacts the protruding electrode 2 of the semiconductor device 1. ing.

The sheet-like connector 3 having the above configuration
According to No. 0, since the barrier layer 33 is provided, metal diffusion can be surely suppressed, and since the edge is formed, the surface of the bump electrode 2 of the semiconductor device 1 to be connected can be prevented. The metal oxide film is scratched by the edge, and an electrical connection can be achieved with a sufficiently low electrical resistance state.

Next, a method for manufacturing the above-described sheet-like connector 30 will be described. First, as shown in FIG. 6, a protective film 40a made of, for example, silicon dioxide is formed on the upper and lower surfaces.
A plate-shaped molding substrate 40 made of single crystal silicon on which the protective film 40a is formed is formed on the surfaces of the protective films 40a and 40b of the molding substrate 40, as shown in FIG. , 40b are etched to form resist films 41a and 41b. Then, a plurality of openings 42 each having a rectangular planar shape are formed in the resist film 41a in accordance with a pattern corresponding to the arrangement pattern of the protruding conductive portions 322 to be manufactured by a photolithography technique.

Next, as shown in FIG.
By etching the protective film 40a through 1a, an opening 43 communicating with the opening 42 of the resist film 41a is formed in the protective film 40a on the upper surface of the molding substrate 40. Then, as shown in FIG. 9, the resist films 41a, 41
After removing 1b, an anisotropic etching is performed through the opening 43 of the protective film 40a to form an inverted quadrangular pyramid-shaped recess 44 in the upper surface of the molding substrate 40.

In the above, as the molding substrate 40,
It is preferable to use the silicon wafer as it is or after processing it into an appropriate shape. This allows
By performing anisotropic etching on the molding substrate 40, the shape of the recess formed becomes suitable, and
The dimensions of all recesses will be equal. Protective film 40
As an etchant for etching a and 40b, hydrofluoric acid or the like can be used. Molding substrate 40
As an etchant for anisotropically etching
Potassium hydroxide, ethylene diamine, or the like can be used. The conditions for anisotropic etching of the molding substrate 40, such as the processing temperature and the processing time, are appropriately set in accordance with the type of the etchant, the depth of the recess 44 to be formed, and the like. 60-85 ° C.

Next, as shown in FIG. 10, a plating resist layer 45 having an opening 46 is formed on the upper surface of the concave portion 44 of the molding substrate 40 by an appropriate means. By performing a plating process, a barrier layer 47 made of, for example, a diffusion-resistant metal such as rhodium or palladium is formed on the inner surface of the recess 44, and then a filling made of a metal material such as copper is formed on the barrier layer 47. A first intermediate layer 49 filled in the metal body 48 and the opening 46 is formed.

Thereafter, as shown in FIG. 11, an insulating layer 50 made of a thermosetting resin such as polyimide is formed on the first layer.
Are stacked on the upper surface of the plating resist layer 45 including the intermediate layer 49 of FIG.
Is cured, and is integrally laminated on the first intermediate layer 49.

Next, as shown in FIG. 12, a through hole 51 is formed in the insulating layer 50 at a position where a through conductive portion is to be formed.
The first intermediate layer 49 is formed by, for example, laser processing so that the upper surface other than the peripheral portion is exposed, and as shown in FIG. Then, a base layer 52 made of the same metal material as the metal material (copper) forming the filling metal body 48 and the first intermediate layer 49 is formed.

Next, as shown in FIG.
A second intermediate layer 55 integrated with the base layer 52 is formed by forming a plating resist layer 53 having an opening 54 on the upper surface of the insulating layer 50 and performing plating through the plating resist layer 53. Thus, a columnar metal body 56 including the first intermediate layer 49, the base layer 52, and the second intermediate layer 55 is formed. By further forming a barrier layer 57 made of a diffusion-resistant metal such as rhodium or palladium on the second intermediate layer 55,
On the upper surface of the molding substrate 40, a sheet-like connector composite 30A integrated therewith is formed.

Then, as shown in FIG. 15, the molding substrate 40 is peeled off from the sheet-like connector composite 30A, and the plating resist layers 45 and 53 are removed, thereby obtaining the structure shown in FIG.
Is manufactured.

According to the above method, the molding substrate 4
The sheet-like connector 30 having the protruding conductive portion 322 formed of a cone having a shape corresponding to the inner surface shape of the zero recess 44 can be easily and reliably manufactured. Further, by forming the concave portion 44 of the molding substrate 40 by anisotropic etching, the sheet-like connector 30 having a suitable quadrangular pyramid shape and having a protruding conductive portion 322 with high dimensional accuracy is provided.
Is obtained.

As described above, the first aspect of the sheet-like connector of the present invention
The second embodiment and the second embodiment and the respective manufacturing methods have been described, but the present invention is not limited to this, and various changes can be made. In the sheet-like connector of the present invention, the upper surface and the lower surface of the through conductive portion may be located at the same level as the upper surface and the lower surface of the insulating sheet. Further, in the second embodiment of the sheet-shaped connector of the present invention, the case where the projecting conductive portion 322 of the through conductive portion 32 has a quadrangular pyramid shape has been described. However, in the present invention, for example, pyramids other than the quadrangular pyramid, It may be a cone. In the method for manufacturing a sheet-like connector of the present invention, a nickel-plated layer and a gold-plated layer may be interposed, if necessary, in order to improve the adhesion between the barrier layer and the intermediate layer.

FIG. 16 is an explanatory sectional view showing the structure of an example of the electric device connecting apparatus of the present invention, together with a semiconductor device and an inspection jig which are a kind of electric device. The electrical device connection device of this example is a semiconductor device 1 to be inspected.
This is used when the electrical operation inspection is performed, and is constituted by the above-mentioned sheet-like connector 10 and the anisotropic conductive sheet 60.

The anisotropic conductive sheet 60 may be electrically conductive as a whole in the thickness direction or partially electrically conductive in the thickness direction. A plurality of conductive path forming portions 61 extending in the direction, and insulating portions 62 that insulate the conductive path forming portions 61 from each other are provided. The conductive path forming portions 61 correspond to the patterns of the bump electrodes 2 of the semiconductor device 1. They are arranged according to a pattern. In this case, the conductive path forming portions 61 are arranged in the surface direction of the anisotropic conductive sheet 60 according to the position corresponding to the lower surface of each through conductive portion 12 of the sheet connector 10. Then, to the conductive path forming portion 61 of the anisotropic conductive sheet 60, the corresponding connection electrode 6 of the inspection jig 5 (see FIG. 1) is electrically connected.

The conductive path forming portion 61 of the anisotropic conductive sheet 60 is formed by orienting conductive particles in an insulating elastic polymer material in a state of being arranged in the thickness direction. That is, in the anisotropic conductive sheet 60, the conductive particles are oriented in the insulating portion 62 made of the elastic polymer material in a state where the conductive particles are aligned in the thickness direction of the sheet, and the plurality of conductive path forming portions 61 are formed. In particular, the conductive path forming portion 61
It is preferable that the conductive path is formed by reducing the resistance value when pressed and compressed in the thickness direction.

In the anisotropic conductive sheet 60, the conductive path forming portion 61 may be formed such that the upper surface and the lower surface thereof slightly protrude from the upper surface and the lower surface of the insulating portion 62, as shown in the figure. Although preferred, the present invention is not limited to this. For example, the upper and lower surfaces of the conductive path forming portion may be arranged on the same plane as the upper and lower surfaces of the insulating portion.

The conductive path forming portion 61 of the anisotropic conductive sheet 60
As the conductive particles constituting, for example, nickel, iron,
Metal particles showing magnetism such as cobalt or particles of these alloys or particles containing these metals, or these particles as core particles, the surface of the core particles gold, silver,
Palladium, those plated with a metal having good conductivity such as rhodium, or inorganic particles or polymer particles such as non-magnetic metal particles or glass beads as core particles, on the surface of the core particles, nickel, cobalt or the like Examples of the conductive material include those plated with a conductive magnetic material.
Among them, it is preferable to use nickel particles as core particles, the surfaces of which are plated with a metal having good conductivity such as gold or silver.

As the insulating and elastic polymer constituting the insulating portion 62 of the anisotropic conductive sheet 60, a polymer having a crosslinked structure is preferable. As a material for a polymer substance that can be used to obtain a polymer substance having a crosslinked structure, various materials can be used, and specific examples thereof include polybutadiene rubber, natural rubber, polyisoprene rubber, and styrene- Conjugated diene rubbers such as butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, block copolymer rubbers such as styrene-butadiene block copolymer rubber and hydrogenated products thereof, silicone rubber , Fluoro rubber, silicone modified fluoro rubber, ethylene-propylene copolymer rubber, urethane rubber, polyester rubber,
Chloroprene rubber, epichlorohydrin rubber and the like can be mentioned. In the above, it is preferable to use silicone rubber and silicone-modified fluororubber from the viewpoint of moldability and electrical properties.

The anisotropic conductive sheet 60 described above can be manufactured, for example, by the following method. First,
A sheet-forming material is prepared by dispersing conductive particles in a polymer material that is cured to become an elastic polymer material.

The sheet-forming material may contain a curing catalyst for curing the polymer material. As such a curing catalyst, an organic peroxide, a fatty acid azo compound, a hydrosilylation catalyst, or the like can be used. Specific examples of the organic peroxide used as the curing catalyst include benzoyl peroxide, bisdicyclobenzoyl peroxide, dicumyl peroxide, and ditertiary butyl peroxide. Specific examples of the fatty acid azo compound used as a curing catalyst include azobisisobutyronitrile. Specific examples of the catalyst which can be used as a catalyst for the hydrosilylation reaction include chloroplatinic acid and salts thereof, a siloxane complex containing a platinum-unsaturated group, a complex of vinylsiloxane and platinum, and platinum and 1,3-divinyltetramethyldisiloxane. And a complex of triorganophosphine or phosphite with platinum, acetylacetate platinum chelate, and a complex of cyclic diene and platinum. The amount of the curing catalyst to be used is appropriately selected in consideration of the type of the polymer material, the type of the curing catalyst, and other curing treatment conditions. 15 parts by mass.

Next, as shown in FIG. 17, the sheet forming material is processed in a mold 70 to form a sheet forming material layer 60A. In this mold 70, one mold plate 71 and another mold plate 72 are arranged in parallel and opposed to each other, and an electromagnet 73 and an electromagnet 73 are provided on the upper surface of one mold plate 71 and the lower surface of the other mold plate 72. 74, one template 71 and the other template 7
2, a frame-shaped plate-like spacer 75 having a thickness equivalent to the thickness of the desired anisotropic conductive sheet 60 is provided. In one template 71, a ferromagnetic material portion M is formed on the lower surface of a plate-like base material 71a made of a ferromagnetic material in accordance with a pattern opposite to the intended arrangement pattern of the conductive path forming portions 61. A non-magnetic portion N is formed in a portion other than the ferromagnetic portion M. The surface of the nonmagnetic portion N is formed so as to protrude from the surface of the ferromagnetic portion M. In the other template 72, a ferromagnetic material portion M is formed on the upper surface of a plate-shaped base material 72a made of a ferromagnetic material in accordance with the same pattern as the arrangement pattern of the target conductive path forming portions 61. A non-magnetic portion N is formed in a portion other than the ferromagnetic portion M.
The surface of the nonmagnetic portion N is formed so as to protrude from the surface of the ferromagnetic portion M.

The material forming the ferromagnetic material portion M in each of the one template 71 and the other template 72 is as follows.
Iron, nickel, cobalt, or an alloy thereof can be used. In addition, as a material forming the nonmagnetic portion N in each of the one mold plate 71 and the other mold plate 72, a nonmagnetic metal such as copper, a heat-resistant resin such as polyimide, or the like can be used.

By operating the electromagnets 73 and 74, a parallel magnetic field acts in the direction from the ferromagnetic portion M of one template 71 to the corresponding ferromagnetic portion M of the other template 72. I do. As a result, in the sheet forming material layer 60A, the conductive magnetic material particles dispersed in the sheet forming material layer 60A become the ferromagnetic portion M of one template 71 and the other template corresponding thereto. 72, and are more preferably aligned in the thickness direction of the sheet forming material layer 60A. Then, in this state, the sheet forming material layer 60
By hardening A, as shown in FIG. 18, a conductive magnetic material is formed between the ferromagnetic material portion M of one template 71 and the corresponding ferromagnetic material portion M of the other template 72. A conductive path forming portion 61 densely filled with body particles is formed, and an insulating portion 62 having no or almost no conductive magnetic particles is formed around the conductive path forming portion 61 to form an anisotropic conductive sheet 60.

In the above description, the curing treatment of the sheet forming material layer 60A can be performed with the parallel magnetic field applied, but can also be performed after the parallel magnetic field is stopped. It is preferable that the intensity of the parallel magnetic field applied to the sheet forming material layer 60 </ b> A be 200 to 10000 gauss on average. As a means for applying a parallel magnetic field, a permanent magnet can be used instead of an electromagnet. As such a permanent magnet, alnico (Fe-Al-Ni) is used in that a parallel magnetic field strength within the above range can be obtained.
-Co-based alloy), ferrite and the like.

The curing treatment of the sheet forming material layer 60A is appropriately selected depending on the material to be used, but is usually performed by a heating treatment. The sheet forming material layer 60 is heated.
When the curing treatment of A is performed, a heater may be provided for the electromagnets 73 and 74. The specific heating temperature and heating time are appropriately selected in consideration of the type of the material for the polymer substance constituting the sheet forming material layer 60A, the time required for the movement of the conductive magnetic particles, and the like.

Such an electrical device connecting device is formed as follows by connecting the projecting electrode 2 of the semiconductor device 1 and the connection formed on the upper surface of the inspection jig 5 according to the pattern corresponding to the pattern of the projecting electrode 2. It is used for electrical connection with the electrode 6. As shown in FIG. 16, an anisotropic conductive sheet 60 is arranged on the upper surface of the inspection jig 5 such that the lower surface of the conductive path forming portion 61 is located on the corresponding connection electrode 6 of the inspection jig 5. And fix the sheet-like connector 10 on the anisotropic conductive sheet 60 with the penetrating conductive portion 1.
2 are arranged and fixed such that the lower surface of the second 2 is located on the corresponding conductive path forming portion 61. The semiconductor device 1 to be electrically connected to the inspection jig 5 is provided on the upper surface of the sheet-like connector 10.
Are arranged such that the protruding electrodes 2 are located on the corresponding through conductive portions 12, and the semiconductor device 1 is maintained in that state.
Is pressed downward against the inspection jig 5 to pinch the penetrating conductive part 12, so that the top of the lower end of the projecting electrode 2 enters the recess 13 of the penetrating conductive part 12, whereby the penetrating conductive part 12 is The edge of the contact portion 15 contacts the bump electrode 2 while scratching the metal oxide film formed on the surface of the bump electrode 2. As a result, the through conductive portion 12
Electrical connection between the protruding electrode 2 and the connection electrode 6 is achieved via the conductive path forming portion 51, and an inspection of the high-frequency characteristics of the semiconductor device 1 is performed in this state.

According to the electric device connecting device having the above-described configuration, since the sheet-like connector 10 is provided, the electric connection between the protruding electrodes 2 of the semiconductor device 1 to be connected to the electric device in a sufficiently small electric resistance state. Connection can be achieved, and high contact reliability can be maintained for a long period of time even when the protruding electrode 2 contains an easily diffusible metal.

Further, according to the inspection apparatus provided with such an electric device connection device, even in the inspection of the semiconductor device 1 requiring a large power supply current, the inspection can be easily performed with high reliability. .

[0073]

As described above, according to the sheet-like connector of the present invention, since the penetration conductive portion is provided with the barrier layer made of the diffusion-resistant metal, the metal electrode of the electric device to be connected can be used. Even in the case of containing a readily diffusible metal, the metal diffusion by the easily diffusible metal can be suppressed, and the characteristics of the penetrating conductive portion become stable, thereby providing high contact reliability for a long period of time. Sex can be maintained.

According to the sheet-like connector of the present invention, since the edge is formed at the contacting part of the through conductive portion, the metal oxide film is formed on the surface of the metal electrode of the electric device to be connected. In addition, the metal oxide film is scratched by the edge, so that the metal oxide film is pierced and the metal electrode and the penetrating conductive portion are brought into contact with each other, so that electrical connection is achieved with a sufficiently small electric resistance state. be able to. Therefore, even when an electrical connection is made to an electric device under a condition where a large current flows, generation of large resistance heat generation can be avoided, and as a result, sufficiently high durability and a sufficiently long service life can be obtained. Can be

According to the method for manufacturing a sheet-like connector of the present invention, the above-mentioned sheet-like connector can be easily and easily manufactured by using a molding substrate in which a recess corresponding to a protruding conductive portion to be manufactured is formed on a molding surface. It can be manufactured reliably. When the recess of the molding substrate is formed by anisotropic etching, a sheet-like connector with high dimensional accuracy can be obtained.

According to the electric device connecting apparatus of the present invention, since the above-mentioned sheet-like connector is provided, the electric connection is made with sufficiently small electric resistance to the metal electrode of the electric device to be connected. In addition, even when the metal electrode contains an easily diffusible metal, high contact reliability can be maintained for a long period of time.

According to the inspection apparatus of the present invention, since the above-described electric device connection device is provided, even in the inspection of an electric device requiring a large power supply current, the inspection can be easily performed with high reliability. it can.

[Brief description of the drawings]

FIG. 1 is an explanatory cross-sectional view showing a configuration of a sheet-like connector according to a first embodiment of the present invention, together with a semiconductor device and a test jig, which are a kind of electric device.

FIG. 2 is an enlarged sectional view for explanation showing a part of FIG. 1 in an enlarged manner.

3 (a) to 3 (f) are explanatory views showing one example of a method of manufacturing the sheet-like connector of the example of FIG. 1 in the order of steps.

FIGS. 4A to 4D are explanatory views showing another example of the method of manufacturing the sheet-like connector of the example of FIG. 1 in the order of steps.

FIG. 5 is an enlarged cross-sectional view illustrating the configuration of a sheet-like connector according to a second embodiment of the present invention together with a semiconductor device which is a type of electric device.

6 to 15 are views showing a method of manufacturing the sheet-like connector of the example of FIG. 5 in the order of steps.
It is explanatory sectional drawing which shows the structure in an example of the shaping | molding board | substrate which formed the protective film on both surfaces.

FIG. 7 is an explanatory sectional view showing a state where a resist film is formed on a protective film.

FIG. 8 is an explanatory cross-sectional view showing a state in which an opening is formed in a protective film.

FIG. 9 is an explanatory sectional view showing a state in which a recess is formed in a molding substrate.

FIG. 10 is an explanatory cross-sectional view showing a process in which a plating process is performed on a recess of a molding substrate.

FIG. 11 is an explanatory sectional view showing a step in which an insulating layer is laminated on a molding substrate.

FIG. 12 is an explanatory cross-sectional view showing a step in which a through hole is formed in an insulating layer.

FIG. 13 is an explanatory cross-sectional view showing a step of plating a through hole of an insulating layer.

FIG. 14 is an explanatory cross-sectional view showing a step of forming a sheet-like connector composite on a molding substrate.

FIG. 15 is an explanatory cross-sectional view showing a step of peeling the sheet-shaped connector composite from the molding substrate.

FIG. 16 is an explanatory cross-sectional view showing a configuration of an example of the electric device connecting apparatus of the present invention, together with a semiconductor device which is a kind of electric device and an inspection jig.

FIG. 17 and FIG. 18 are views showing a method of manufacturing an anisotropic conductive sheet constituting an electric device connecting apparatus, and show a state in which a parallel magnetic field is applied to a sheet forming material layer. It is explanatory sectional drawing which shows.

FIG. 18 is an explanatory sectional view showing a state where an anisotropic conductive sheet is formed.

FIG. 19 is an explanatory cross-sectional view showing a configuration of an example of a conventional sheet-like connector together with a semiconductor device and an inspection jig which are a kind of electric device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Protruding electrode 5 Inspection jig 6 Connection electrode 10, 30 Sheet connector 30A Sheet connector composite 11, 31 Insulating sheet 12, 32 Penetrating conductive part 321 Column conductive part 322 Projecting conductive part 12K Penetrating conductive part base DESCRIPTION OF SYMBOLS 13 Concavity 14, 33 Barrier layer 15, 34 Contact part 20 Sheet-shaped base 21 Insulating sheet 21a, 21b Conductive film 22, 23 Opening 24a, 24b Conductive intermediate film 25 Plating resist layer 26a, 26b Opening 27a, 27b Plating resist layer 40 Molding substrate 40a, 40b Protective film 41a, 41b Resist film 42, 43 Opening 44 Recess 45, 53 Plating resist layer 46, 54 Opening 47, 57 Barrier layer 48 Filled metal body 49 First intermediate layer Reference Signs List 50 insulating layer 51 through hole 52 base layer 55 second Interlayer 56 Columnar metal body 60 Anisotropic conductive sheet 60A Sheet forming material layer 61 Conductive path forming part 62 Insulating part 70 Mold 71 One mold plate 72 The other mold plate 71a, 72a Base material 73, 74 Electromagnet 75 Spacer 80 Sheet-shaped connector 81 Insulating sheet 82 Penetrating conductive part M Ferromagnetic part N Non-magnetic part

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/32 H01R 107: 00 // H01R 107: 00 23/02 DEF term (Reference) 2G003 AA07 AG01 AG12 2G011 AA01 AA15 AB06 AC31 AD01 AE22 AF07 5E023 AA04 AA05 BB01 BB18 DD26 EE01 EE09 EE17 EE18 EE23 EE33 FF07 GG17 HH08 HH24 HH28 5E051 BA06 BB02 CA03 5E319 AA03 CC05 CC04

Claims (15)

[Claims] 1. A sheet-like connector used for electrical connection with an electric device provided with a metal electrode, wherein a plurality of penetrating conductive portions extending through the thickness direction thereof are formed in a mutually insulated state. A sheet-like connector, characterized in that a barrier layer made of a diffusion-resistant metal is provided on a surface of a penetrating conductive portion that is in contact with a metal electrode of the electric device. 2. A sheet-like connector used for electrical connection with an electric device provided with a metal electrode, wherein a plurality of penetrating conductive portions extending through the thickness direction thereof are formed in a mutually insulated state. A sheet-like connector, characterized in that an edge is formed at a contact portion of the penetrating conductive portion that contacts the metal electrode of the electric device. 3. The penetrating conductive portion has a columnar conductive portion and a protruding conductive portion protruding integrally with the columnar conductive portion, and the protruding conductive portion is a cone. The sheet-like connector according to claim 2, wherein an edge is formed by the apex. 4. When the metal electrode of the electric device is a protruding electrode having a hemispherical shape, an opening smaller in diameter than the diameter of the protruding electrode is formed at a contact portion of the penetrating conductive portion, and an inner peripheral edge of the opening is formed. The sheet-like connector according to claim 2, wherein an edge is formed by: 5. The sheet-shaped member according to claim 2, wherein a barrier layer made of a diffusion-resistant metal is provided on the surface of the contact portion of the through conductive portion. connector. 6. The sheet according to claim 1, wherein the diffusion-resistant metal forming the barrier layer is any metal selected from rhodium, palladium, silver, tungsten and platinum. Connector. 7. The sheet-like connector according to claim 1, wherein the metal electrode is used for electrical connection with an electric device containing a readily diffusible metal. 8. The semiconductor device according to claim 1, which is used for electrical connection with an electric device comprising a semiconductor device.
The sheet-like connector according to any one of the above. 9. The method of manufacturing a sheet-like connector according to claim 3, further comprising: preparing a molding substrate in which a recess corresponding to the projecting conductive portion of the through conductive portion is formed on a molding surface; A step of filling a metal in the recess of the substrate to form a filled metal body, and forming an insulating layer having a through hole corresponding to the columnar conductive portion on the molding surface of the molding substrate obtained by this step. ,
By filling a metal into the through-hole of the insulating layer to form a columnar metal body that is integrally continuous with the filler metal body, a protruding conductive portion composed of the filler metal body and a columnar shape composed of the columnar metal body are formed. A method for producing a sheet-like connector, comprising: a step of forming a sheet-like connector composite having a conductive portion; and a step of removing a molding substrate from the sheet-like connector composite. 10. The method according to claim 9, wherein the recesses in the molding substrate are formed by anisotropic etching. 11. The method according to claim 10, wherein the molding substrate is made of single-crystal silicon. 12. An electrical connection device for an electrical device, comprising: the sheet-like connector according to claim 1; and an anisotropically conductive member disposed on one surface of the sheet-like connector. An electrical device connection device, comprising: a conductive sheet. 13. The anisotropic conductive sheet includes a plurality of conductive path forming portions extending in a thickness direction thereof and an insulating portion for insulating the conductive path forming portions from each other. 13. The conductive path forming portion is arranged at a position corresponding to the portion.
An electrical device connection device according to claim 1. 14. The electrical device connection device according to claim 13, wherein the sheet-like connector is provided integrally with the anisotropic conductive sheet. 15. An inspection apparatus for an electrical device for inspecting an electrical operation of an electrical device, comprising: the electrical device connection device according to claim 12. apparatus.