JP2004055514A - Anisotropic conductivity connector, method for manufacturing the same, and inspection device for circuit device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an anisotropic conductivity connector capable of obtaining stable conductivity for a long period even when pressed repeatedly as the occurrence of permanent deformation or deformation by abrasion due to pressure contact with a connected electrode is restricted even with the connected electrode having a projected form, a method for manufacturing that, and an inspecting device for a circuit device provided with the anisotropic conductivity connector. <P>SOLUTION: This anisotropic conductivity connector has an anisotropic conductivity film comprising a plurality of conductive way forming parts extended in a thickness direction to be insulated with insulation parts. The anisotropic conductivity film comprises the lamination of at least two elastic layers formed of high polymer substances having insulation performance. At parts of the elastic layers forming the conductive way forming parts, conductive grains having magnetic performance are contained. Durometer-hardness of the elastic polymer substances in one elastic layer forming the surface of the anisotropic conductive film is set as H<SB>1</SB>, and durometer hardness of the elastic polymer substances in the other is set as H<SB>2</SB>, then H<SB>1</SB>≥30 and H<SB>1</SB>/H<SB>2</SB>≥1.1 are satisfied. <P>COPYRIGHT: (C)2004,JPO

Description

【００６６】
上記表１に示す付加型液状シリコーンゴムの特性は、次のようにして測定したものである。
（１）付加型液状シリコーンゴムの粘度：
Ｂ型粘度計により、２３±２℃における粘度を測定した。
（２）シリコーンゴム硬化物の圧縮永久歪み：
二液型の付加型液状シリコーンゴムにおけるＡ液とＢ液とを等量となる割合で攪拌混合した。次いで、この混合物を金型に流し込み、当該混合物に対して減圧による脱泡処理を行った後、１２０℃、３０分間の条件で硬化処理を行うことにより、厚みが１２．７ｍｍ、直径が２９ｍｍのシリコーンゴム硬化物よりなる円柱体を作製し、この円柱体に対して、２００℃、４時間の条件でポストキュアを行った。このようにして得られた円柱体を試験片として用い、ＪＩＳ　Ｋ　６２４９に準拠して１５０±２℃における圧縮永久歪みを測定した。
（３）シリコーンゴム硬化物の引裂強度：
上記（２）と同様の条件で付加型液状シリコーンゴムの硬化処理およびポストキュアを行うことにより、厚みが２．５ｍｍのシートを作製した。このシートから打ち抜きによってクレセント形の試験片を作製し、ＪＩＳ　Ｋ　６２４９に準拠して２３±２℃における引裂強度を測定した。
（４）シリコーンゴム硬化物のデュロメータ硬さ：
上記（３）と同様にして作製されたシートを５枚重ね合わせ、得られた積重体を試験片として用い、ＪＩＳ　Ｋ　６２４９に準拠して２３±２℃におけるデュロメータＡ硬さを測定した。
【００６７】
〈実施例１〉
（ａ）支持体および金型の作製：
下記の条件に従って、図４に示す構成の支持体および図６に示す構成の異方導電膜成形用の金型を作製した。
〔支持体〕
支持体（７１）は、材質がＳＵＳ３０４、厚みが０．１ｍｍ、開口部（７３）の寸法が１７ｍｍ×１０ｍｍで、四隅に位置決め穴（７２）を有する。
〔金型〕
強磁性体基板（５１，５６）は、材質が鉄で、厚みが６ｍｍである。
強磁性体層（５２，５７）は、材質がニッケルで、直径が０．４５ｍｍ（円形），厚みが０．１ｍｍ，配置ピッチ（中心間距離）が０．８ｍｍ、強磁性体層の数は２８８個（１２個×２４個）である。
非磁性体層（５３，５８）は、材質がドライフィルムレジストを硬化処理したものであり、上型（５０）の非磁性体層（５３）において、部分（５３ａ）の厚みが０．２ｍｍ、部分（５３ｂ）の厚みが０．１ｍｍ、下型（５５）の非磁性体層（５８）の厚みが０．１５ｍｍである。
金型によって形成される成形空間（５９）の縦横の寸法は２０ｍｍ×１３ｍｍである。
【００６８】
（ｂ）成形材料の調製：
付加型液状シリコーンゴム（５）１００重量部に、平均粒子径が３０μｍの導電性粒子６０重量部を添加して混合し、その後、減圧による脱泡処理を施すことにより、第１の成形材料を調製した。以上において、導電性粒子としては、ニッケルよりなる芯粒子に金メッキが施されてなるもの（平均被覆量：芯粒子の重量の２０重量％）を用いた。
また、付加型液状シリコーンゴム（２）１００重量部に、平均粒子径が３０μｍの導電性粒子６０重量部を添加して混合し、その後、減圧による脱泡処理を施すことにより、第２の成形材料を調製した。以上において、導電性粒子としては、ニッケルよりなる芯粒子に金メッキが施されてなるもの（平均被覆量：芯粒子の重量の２０重量％）を用いた。
【００６９】
（ｃ）異方導電膜の形成：
上記の金型の上型（５０）の成形面に、調製した第１の成形材料をスクリーン印刷によって塗布することにより、厚みが０．１ｍｍの第１の成形材料層（６１ａ）を形成した。
また、上記の金型の下型（５５）の成形面上に、厚みが０．１ｍｍのスペーサー（５４ｂ）を位置合わせして配置し、このスペーサー（５４ｂ）上に、上記の支持体（７１）を位置合わせして配置し、更にこの支持体（７１）上に厚みが０．１ｍｍのスペーサー（５４ａ）を位置合わせして配置し、調製した第３の成形材料をスクリーン印刷によって塗布することにより、下型（５５）、スペーサー（５４ａ，５４ｂ）および支持体（７１）によって形成される空間内に、厚みが０．４ｍｍの第２の成形材料層（６１ｂ）を形成した。
そして、上型（５０）に形成された第１の成形材料層（６１ａ）と下型（５５）に形成された第２の成形材料層（６１ｂ）を位置合わせして重ね合わせた。
そして、上型（５０）と下型（５５）の間に形成された各成形材料層に対し、強磁性体層（５２，５７）の間に位置する部分に、電磁石によって厚み方向に２Ｔの磁場を作用させながら、１００℃、１時間の条件で硬化処理を施すことにより、異方導電膜（１０Ａ）を形成した。
以上のようにして、本発明に係る異方導電性コネクター（１０）を製造した。
以下、この異方導電性コネクターを「異方導電性コネクターＢ１」という。
【００７０】
〈実施例２〉
第１の成形材料の調製において、付加型液状シリコーンゴム（５）の代わりに付加型液状シリコーンゴム（４）を用いたこと以外は、実施例１と同様にして異方導電性コネクターを製造した。
以下、この異方導電性コネクターを「異方導電性コネクターＢ２」という。
【００７１】
〈実施例３〉
第２の成形材料の調製において、付加型液状シリコーンゴム（２）の代わりに付加型液状シリコーンゴム（１）を用いたこと以外は、実施例１と同様にして異方導電性コネクターを製造した。
以下、この異方導電性コネクターを「異方導電性コネクターＢ３」という。
【００７２】
〈実施例４〉
第１の成形材料の調製において、付加型液状シリコーンゴム（５）の代わりに付加型液状シリコーンゴム（３）を用いたこと以外は、実施例１と同様にして異方導電性コネクターを製造した。
以下、この異方導電性コネクターを「異方導電性コネクターＢ４」という。
【００７３】
〈実施例５〉
第２の成形材料の調製において、付加型液状シリコーンゴム（２）の代わりに付加型液状シリコーンゴム（３）を用いたこと以外は、実施例１と同様にして異方導電性コネクターを製造した。
以下、この異方導電性コネクターを「異方導電性コネクターＢ５」という。
【００７４】
〈比較例１〉
第２の成形材料の調製において、付加型液状シリコーンゴム（２）の代わりに付加型液状シリコーンゴム（５）を用いたこと以外は、実施例１と同様にして異方導電性コネクターを製造した。
以下、この異方導電性コネクターを「異方導電性コネクターＢ６」という。
【００７５】
〈比較例２〉
第１の成形材料の調製において、付加型液状シリコーンゴム（５）の代わりに付加型液状シリコーンゴム（４）を用い、第２の成形材料の調製において、付加型液状シリコーンゴム（２）の代わりに付加型液状シリコーンゴム（４）を用いたこと以外は、実施例１と同様にして異方導電性コネクターを製造した。
以下、この異方導電性コネクターを「異方導電性コネクターＢ７」という。
【００７６】
〈比較例３〉
第１の成形材料の調製において、付加型液状シリコーンゴム（５）の代わりに付加型液状シリコーンゴム（１）を用い、第２の成形材料の調製において、付加型液状シリコーンゴム（２）の代わりに付加型液状シリコーンゴム（６）を用いたこと以外は、実施例１と同様にして異方導電性コネクターを製造した。
以下、この異方導電性コネクターを「異方導電性コネクターＢ８」という。
【００７７】
〈実施例６〉
付加型液状シリコーンゴム（５）１００重量部に、平均粒子径が３０μｍの導電性粒子６０重量部を添加して混合し、その後、減圧による脱泡処理を施すことにより、第１の成形材料を調製した。以上において、導電性粒子としては、ニッケルよりなる芯粒子に金メッキが施されてなるもの（平均被覆量：芯粒子の重量の２０重量％）を用いた。
付加型液状シリコーンゴム（２）の１００重量部に、平均粒子径が３０μｍの導電性粒子６０重量部を添加して混合し、その後、減圧による脱泡処理を施すことにより、第２の成形材料を調製した。以上において、導電性粒子としては、ニッケルよりなる芯粒子に金メッキが施されてなるもの（平均被覆量：芯粒子の重量の２０重量％）を用いた。
【００７８】
実施例１で作製した金型を用い、図２７に示すように、上型（５０）の凹所（６０）内に、寸法が１３ｍｍ×１３ｍｍ×０．１ｍｍで、中央に９．５ｍｍ×９．５ｍｍの開口部を有するスペーサー（５４ｃ）を配置し、上型（５０）の表面に、調製した第１の成形材料をスクリーン印刷によって塗布することにより、厚みが０．１ｍｍの第１の成形材料層（６１ａ）を形成した。
また、上記の金型の下型（５５）の成形面上に、厚みが０．１ｍｍのスペーサー（５４ｂ）を位置合わせして配置し、このスペーサー（５４ｂ）上に、上記の支持体（７１）を位置合わせして配置し、更にこの支持体（７１）上に厚みが０．１ｍｍのスペーサー（５４ａ）を位置合わせして配置し、調製した第２の成形材料をスクリーン印刷によって塗布することにより、下型（５５）、スペーサー（５４ａ，５４ｂ）および支持体（７１）によって形成される空間内に第２の成形材料を充填し、更に、図２８に示すように、スペーサー（５４ａ）上に、寸法が１８ｍｍ×１８ｍｍ×５ｍｍで、中央に９．５ｍｍ×９．５ｍｍの開口部を有するスペーサー（５４ｄ）を配置し、第２の成形材料を、スクリーン印刷によってスペーサー（５４ｄ）の開口部内に第２の成形材料を充填することにより、最大の厚みが０．８５ｍｍの第２の成形材料層（６１ｂ）を形成した。
そして、上型（５０）に形成された第１の成形材料層（６１ａ）と下型（５５）に形成された第２の成形材料層（６１ｂ）を位置合わせして重ね合わせ、上型（５０）と下型（５５）の間に形成された各成形材料層に対し、強磁性体層（５２，５７）の間に位置する部分に、電磁石によって厚み方向に２Ｔの磁場を作用させながら、１００℃、１時間の条件で硬化処理を施すことにより、異方導電膜（１０Ａ）を形成した。
以上のようにして、本発明に係る異方導電性コネクター（１０）を製造した。
以下、この異方導電性コネクターを「異方導電性コネクターＣ１」という。
【００７９】
〈実施例７〉
第１の成形材料の調製において、付加型液状シリコーンゴム（５）に、導電性粒子と共に平均粒子径が１６．２μｍのダイヤモンドパウダー３０重量部を添加したこと以外は、実施例６と同様にして異方導電性コネクターを製造した。
以下、この異方導電性コネクターを「異方導電性コネクターＣ２」という。
【００８０】
〈実施例８〉
第１の成形材料の調製において、付加型液状シリコーンゴム（５）の代わりに付加型液状シリコーンゴム（３）を用いたこと以外は、実施例６と同様にして異方導電性コネクターを製造した。
以下、この異方導電性コネクターを「異方導電性コネクターＣ３」という。
【００８１】
〈実施例９〉
第１の成形材料の調製において、付加型液状シリコーンゴム（５）の代わりに付加型液状シリコーンゴム（３）を用い、この付加型液状シリコーンゴム（３）に、導電性粒子と共に平均粒子径が１６．２μｍのダイヤモンドパウダー３０重量部を添加したこと以外は、実施例６と同様にして異方導電性コネクターを製造した。
以下、この異方導電性コネクターを「異方導電性コネクターＣ４」という。
【００８２】
〈比較例４〉
第１の成形材料の調製において、付加型液状シリコーンゴム（５）の代わりに付加型液状シリコーンゴム（１）を用い、第２の成形材料の調製において、付加型液状シリコーンゴム（２）の代わりに付加型液状シリコーンゴム（６）を用いたこと以外は、実施例６と同様にして異方導電性コネクターを製造した。
以下、この異方導電性コネクターを「異方導電性コネクターＣ５」という。
【００８３】
〈比較例５〉
第１の成形材料の調製において、付加型液状シリコーンゴム（５）の代わりに付加型液状シリコーンゴム（１）を用い、更に、この付加型液状シリコーンゴム（３）に、導電性粒子と共に平均粒子径が１６．２μｍのダイヤモンドパウダー３０重量部を添加し、第２の成形材料の調製において、付加型液状シリコーンゴム（２）の代わりに付加型液状シリコーンゴム（６）を用いたこと以外は、実施例６と同様にして異方導電性コネクターを製造した。
以下、この異方導電性コネクターを「異方導電性コネクターＣ６」という。
【００８４】
〔異方導電性コネクターの評価〕
実施例１〜９および比較例１〜５に係る異方導電性コネクターについて、その性能評価を以下のようにして行った。
実施例１〜５および比較例１〜３に係る異方導電性コネクターＢ１〜Ｂ８を評価するために、図２９および図３０に示すようなテスト用の回路装置３を用意した。
このテスト用の回路装置３は、直径が０．４ｍｍで、高さが０．３ｍｍのハンダボール電極２（材質：６４半田）を合計で７２個有するものであり、それぞれ３６個のハンダボール電極２が配置されてなる２つの電極群が形成され、各電極群においては、１８個のハンダボール電極２が０．８ｍｍのピッチで直線状に並ぶ列が合計で２列形成されており、これらのハンダボール電極のうち２個ずつが、回路装置３内の配線８によって互いに電気的接続されている。回路装置３内の配線数は合計で３６である。
【００８５】
また、実施例６〜９および比較例４〜５に係る異方導電性コネクターＣ１〜Ｃ６を評価するために、図３１および図３２に示すようなテスト用の回路装置３を用意した。
このテスト用の回路装置３は、直径が０．４ｍｍで、高さが０．３ｍｍのハンダボール電極２（材質：６４半田）を合計で３２個有するものであり、それぞれ１６個のハンダボール電極２が配置されてなる２つの電極群が形成され、各電極群においては、８個のハンダボール電極２が０．８ｍｍのピッチで直線状に並ぶ列が合計で２列形成されており、これらのハンダボール電極のうち２個ずつが、回路装置３内の配線８によって互いに電気的接続されている。回路装置３内の配線数は合計で１６である。
【００８６】
そして、テスト用の回路装置の各々を用いて、実施例１〜９および比較例１〜５に係る異方導電性コネクターの評価を、以下のようにして行った。
【００８７】
《繰り返し耐久性》
図３３に示すように、異方導電性コネクター１０における支持体７１の位置決め穴に、検査用回路基板５のガイドピン９を挿通させることにより、当該異方導電性コネクター１０を検査用回路基板５上に位置決めして配置し、この異方導電性コネクター１０上に、テスト用の回路装置３を配置し、これらを加圧治具（図示せず）によって固定し、この状態で、恒温槽７内に配置した。
次いで、恒温槽７内の温度を１００℃に設定し、加圧治具によって、異方導電性コネクター１０における異方導電膜１０Ａの導電路形成部１１の歪み率が３０％（加圧時における導電路形成部の厚みが０．３５ｍｍ）となるように、５秒／ストロークの加圧サイクルで加圧を繰り返しながら、異方導電性コネクター１０、テスト用の回路装置３並びに検査用回路基板５の検査用電極６およびその配線（図示省略）を介して互いに電気的に接続された、検査用回路基板５の外部端子（図示省略）間に、直流電源１１５および定電流制御装置１１６によって、１０ｍＡの直流電流を常時印加し、電圧計１１０によって、加圧時における検査用回路基板５の外部端子間の電圧を測定した。
【００８８】
このようにして測定された電圧の値（Ｖ）をＶ_１とし、印加した直流電流をＩ_１（＝１０ｍＡ）として、下記の数式により、電気抵抗値Ｒ_１を求めた。
ここで、電気抵抗値Ｒ_１には、２つの導電路形成部の電気抵抗値の他に、テスト用の回路装置３の電極間の電気抵抗値および検査用回路基板の外部端子間の電気抵抗値が含まれている。
そして、電気抵抗値Ｒ_１が２Ωより大きくなると、実際上、回路装置の電気的検査が困難となることから、電気抵抗値Ｒ_１が２Ωより大きくなるまで、電圧の測定を継続した。但し、加圧動作は、合計で１０万回行なった。その結果を表２に示す。
【００８９】
【数１】
Ｒ_１＝Ｖ_１／Ｉ_１
【００９０】
更に、実施例６〜９および比較例４〜５に係る異方導電性コネクターに関しては、異方導電性コネクターとテスト用の回路基板との間に、下記の条件に従って作製された図２０に示す構成の加圧力緩和フレームを配置したこと以外は、上記と同様にして電気抵抗値Ｒ_１を求めた。その結果を表２に示す。
加圧力緩和フレームは、寸法が２４ｍｍ×３０ｍｍ×１ｍｍの矩形の板状のものであって、開口部（７３）の寸法が２０ｍｍ×２０ｍｍで、板バネ部（６７）の寸法が５ｍｍ×９ｍｍ×１ｍｍで、板バネ部（６７）の先端の突出高さが３ｍｍであり、四隅に位置決め穴（７２）を有する。
【００９１】
これらの試験が終了した後、各異方導電性コネクターについて、導電路形成部の変形状態および導電性粒子への電極物質の移行状態を、下記の基準により評価した。その結果を表３に示す。
導電路形成部の変形状態：
導電路形成部の表面を目視により観察し、ほとんど変形が生じていない場合を○、微細な変形が認められる場合を△、大きな変形が認められる場合を×として評価した。
導電性粒子への電極物質の移行状態：
導電路形成部中の導電性粒子の色を目視により観察し、変色がほとんどない場合を○、僅かに灰色に変色した場合を△、ほとんど灰色または黒色に変色した場合を×として評価した。
【００９２】
《回路基板への接着性》
実施例１〜９および比較例１〜５に係る異方導電性コネクターをそれぞれ１００個用意し、これらの異方導電性コネクターについて、上記の繰り返し耐久性試験と同様にして加圧試験を行い、その後、テスト用の回路装置に対する異方導電膜の接着状態を調べ、接着したものの数が、３０％未満である場合を○、３０〜７０％の場合を△、７０％を超える場合を×として評価した。その結果を表３に示す。
【００９３】
【表２】

【００９４】
【表３】

【００９５】
【発明の効果】
本発明の異方導電性コネクターによれば、異方導電膜の表面を形成する弾性層のうち一方の弾性層を構成する弾性高分子物質のデュロメータ硬さが３０以上であるため、接続対象電極が突起状のものであっても、当該接続対象電極の圧接による永久的な変形や、磨耗による変形が生じることを抑制することができる。しかも、他方の弾性層を構成する弾性高分子物質のデュロメータ硬さが、前記一方の弾性層を構成する弾性高分子物質よりも十分に低いものであるため、導電路形成部が加圧されることにより、所要の導電性を確実に得ることができる。従って、接続対象電極によって繰り返して押圧されても、長期間にわたって安定した導電性を得ることができる。
【００９６】
また、前記一方の弾性層に導電性および磁性を示さない粒子が含有されることにより、当該一方の弾性層の硬度が増加するため、接続対象電極の圧接による永久的な変形や、磨耗による変形が生じることを一層抑制することができ、電極物質が異方導電膜における導電性粒子に移行することが防止または抑制されるため、長期間にわたって一層安定した導電性を得ることができ、しかも、高温環境下において回路装置に圧接された状態で使用した場合にも、当該回路装置に接着することを防止または抑制することができる。
【００９７】
本発明の異方導電性コネクターの製造方法によれば、一方の型の成形面に形成された成形材料層と、他方の型の成形面に形成された成形材料層とを積重し、この状態で各成形材料層を硬化処理するため、それぞれ硬度が異なる２つ以上の弾性層が一体的に積層されてなる異方導電膜を有する異方導電性コネクターを有利にかつ確実に製造することができる。
【００９８】
本発明の回路装置の検査装置によれば、上記の異方導電性コネクターを具えてなるため、被検査電極が突起状のものであっても、当該被検査電極の圧接による永久的な変形や、磨耗による変形が生じることが抑制されるので、多数の回路装置について連続して検査を行なった場合でも、長期間にわたって安定した導電性を得ることができる。
また、本発明の回路装置の検査装置によれば、上記の異方導電性コネクターの他に、シート状コネクターを用いることなしに、回路装置の電気的検査を行うことができ、シート状コネクターを用いない場合には、異方導電性コネクターとシート状コネクターとの位置合わせが不要となるため、温度変化によるシート状コネクターと異方導電性コネクターとの位置ずれの問題を回避することができ、しかも、検査装置の構成が容易である。
また、検査対象である回路装置と異方導電性コネクターとの間に加圧力緩和フレームを設けることにより、異方導電性コネクターの異方導電膜に対する被検査電極の加圧力が緩和されるので、より長期間にわたって安定した導電性を得ることができる。
また、加圧力緩和フレームとして、バネ弾性またはゴム弾性を有するものを用いることにより、被検査電極によって異方導電膜に加わる衝撃の大きさを低下させることができるので、異方導電膜の破損またはその他の故障を防止または抑制することができると共に、異方導電膜に対する加圧力が解除されたときには、当該加圧力緩和フレームのバネ弾性によって、回路装置が異方導電性膜から容易に離脱するので、検査が終了した回路装置を未検査の回路装置に交換する作業を円滑に行なうことができ、その結果、回路装置の検査効率の向上を図ることができる。
【図面の簡単な説明】
【図１】本発明の異方導電性コネクターの一例を示す平面図である。
【図２】図１に示す異方導電性コネクターのＡ−Ａ断面図である。
【図３】図１に示す異方導電性コネクターの一部を拡大して示す説明用断面図である。
【図４】図１に示す異方導電性コネクターにおける支持体の平面図である。
【図５】図４に示す支持体のＢ−Ｂ断面図である。
【図６】異方導電膜成形用の金型の一例における構成を示す説明用断面図である。
【図７】下型の成形面上に、スペーサーおよび支持体が配置された状態を示す説明用断面図である。
【図８】上型の成形面に第１の成形材料層が形成され、下型の成形面上に第２の成形材料層が形成された状態を示す説明用断面図である。
【図９】第１の成形材料層め第２の成形材料層とが積層された状態を示す説明用断面図である。
【図１０】異方導電膜が形成された状態を示す説明用断面図である。
【図１１】本発明の回路装置の検査装置の一例における構成を回路装置と共に示す説明図である。
【図１２】本発明の回路装置の検査装置の一例における構成を他の回路装置と共に示す説明図である。
【図１３】異方導電膜の第１の変形例を示す説明用断面図である。
【図１４】異方導電膜の第２の変形例を示す説明用断面図である。
【図１５】異方導電膜の第３の変形例を示す説明用断面図である。
【図１６】異方導電膜の第４の変形例を示す説明用断面図である。
【図１７】異方導電膜の第５の変形例を示す説明用断面図である。
【図１８】異方導電膜の第６の変形例を示す説明用断面図である。
【図１９】異方導電膜の第７の変形例を示す説明用断面図である。
【図２０】加圧力緩和フレームを具えた検査装置の第１の例における構成を示す説明図である。
【図２１】加圧力緩和フレームを示す説明図であり，（ａ）は平面図、（ｂ）は側面図である。
【図２２】図２０に示す検査装置において、回路装置が加圧された状態を示す説明図である。
【図２３】加圧力緩和フレームを具えた検査装置の第２の例における構成を示す説明図である。
【図２４】加圧力緩和フレームを具えた検査装置の第３の例における要部の構成を示す説明図である。
【図２５】加圧力緩和フレームを具えた検査装置の第４の例における要部の構成を示す説明図である。
【図２６】加圧力緩和フレームを具えた検査装置の第５の例における要部の構成を示す説明図である。
【図２７】実施例６において、上型の成形面に第１の成形材料層が形成され、下型の成形面上に第２の成形材料が塗布された状態を示す説明用断面図である。
【図２８】実施例６において、下型の成形面上に第２の成形材料層が形成された状態を示す説明用断面図である。
【図２９】実施例で使用したテスト用の回路装置の平面図である。
【図３０】実施例で使用したテスト用の回路装置の側面図である。
【図３１】実施例で使用した他のテスト用の回路装置の平面図である。
【図３２】実施例で使用した他のテスト用の回路装置の側面図である。
【図３３】実施例で使用した繰り返し耐久性の試験装置の概略の構成を示す説明図である。
【図３４】異方導電膜の第８の変形例を示す説明用断面図である。
【図３５】異方導電膜の第９の変形例を示す説明用断面図である。
【図３６】異方導電膜の第１０の変形例を示す説明用断面図である。
【符号の説明】
１　回路装置
２　ハンダボール電極
３　テスト用の回路装置
５　検査用回路基板
６　検査用電極
７　恒温槽
８　配線
９　ガイドピン
１０　　異方導電性コネクター
１０Ａ　異方導電膜
１０Ｂ　一方の弾性層
１０Ｃ　他方の弾性層
１０Ｄ　中間弾性層
１１　　導電路形成部
１１ａ　突出部分
１２　　有効導電路形成部
１３　　無効導電路形成部
１５　　絶縁部
１６　　凹部
１７　　貫通孔
５０　　上型
５１　　強磁性体基板
５２　　強磁性体層
５３　　非磁性体層
５４ａ，５４ｂ，５４ｃ，５４ｄ　スペーサー
５５　　下型
５６　　強磁性体基板
５７　　強磁性体層
５７ａ　凹部空間
５８　　非磁性体層
５９　　成形空間
６０　　凹部
６１ａ　第１の成形材料層
６１ｂ　第２の成形材料層
６５　　加圧力緩和フレーム
６６　　開口部
６７　　板バネ部
６８　　位置決め穴
７１　　支持体
７２　　位置決め穴
７３　　開口部
８０Ｂ，８０Ｃ，８０Ｄ　補強材
１１０　電圧計
１１５　直流電源
１１６　定電流制御装置[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to, for example, an anisotropically conductive connector used for inspection of a circuit device such as a semiconductor integrated circuit, a method for manufacturing the same, and an inspection device for a circuit device provided with the anisotropically conductive connector. TECHNICAL FIELD The present invention relates to an anisotropic conductive connector which can be suitably used for inspection of a circuit device such as a semiconductor integrated circuit having the same, a method for manufacturing the same, and an inspection device for a circuit device.
[0002]
[Prior art]
The anisotropic conductive sheet is a sheet having conductivity only in the thickness direction, or a sheet having a pressurized conductive portion which shows conductivity only in the thickness direction when pressed in the thickness direction, and is formed by soldering or mechanically. It has features such as being able to achieve a compact electrical connection without using means such as a mating connection, and being able to absorb mechanical shocks and strains and making a soft connection. Utilizing such features, for example, in the fields of electronic calculators, electronic digital watches, electronic cameras, computer keyboards, etc., electrical connections between circuit devices, such as printed circuit boards, leadless chip carriers, liquid crystal panels, etc. It is widely used as an anisotropic conductive connector for achieving electrical connection with the connector.
[0003]
In an electrical inspection of a circuit device such as a printed circuit board or a semiconductor integrated circuit, for example, an electrode to be inspected formed on one surface of a circuit device to be inspected and an inspection electrode formed on the surface of the inspection circuit board are used. In order to achieve electrical connection with the electrodes, an anisotropic conductive sheet is interposed as a connector between the electrode region of the circuit device and the inspection electrode region of the inspection circuit board.
[0004]
Conventionally, as such an anisotropic conductive sheet, a sheet obtained by uniformly dispersing metal particles in an elastomer (see, for example, Patent Document 1) and a method in which a conductive magnetic metal is non-uniformly dispersed in an elastomer. A multiplicity of conductive path forming portions extending in the thickness direction and an insulating portion that insulates them from each other (see, for example, Patent Document 2), and a step between the surface of the conductive path forming portion and the insulating portion. Are known (for example, see Patent Document 3).
[0005]
In these anisotropic conductive sheets, conductive particles are contained in an insulating elastic polymer substance in a state of being aligned in the thickness direction, and a conductive path is formed by a chain of a large number of conductive particles. ing.
Such an anisotropic conductive sheet is formed by, for example, injecting a molding material in which a conductive material having magnetism is contained in a polymer material forming material which is cured into an elastic polymer material into a molding space of a mold. Then, a molding material layer is formed, and a magnetic field is applied to the molding material layer to perform a hardening treatment.
[0006]
However, for example, in a case where a conventional anisotropic conductive sheet is used as a connector in an electrical inspection of a circuit device having a protruding electrode made of a solder alloy, there are the following problems.
That is, the operation of pressing the protruding electrode, which is the electrode to be inspected, of the circuit device to be inspected against the surface of the conductive path forming portion in the anisotropic conductive sheet is repeated, thereby forming the conductive path in the anisotropic conductive sheet. On the surface of the portion, permanent deformation due to pressure contact of the protruding electrodes and deformation due to wear occur, so that the electric resistance value of the conductive path forming portion in the anisotropic conductive sheet increases, and each conductive path forming portion However, there is a problem that the subsequent inspection of the circuit device becomes difficult due to the variation in the electric resistance of the circuit device.
Further, as the conductive particles for forming the conductive path forming portion, those having a coating layer made of gold are usually used in order to obtain good conductivity. , The electrode material (solder alloy) constituting the electrode to be inspected in the circuit device is transferred to the coating layer of the conductive particles in the anisotropic conductive sheet. As a result of the deterioration of the layer, there is a problem that the conductivity of the conductive path forming portion is reduced.
[0007]
In order to solve the above-mentioned problem, in the inspection of a circuit device, a plurality of metal electrode bodies extending through the anisotropic conductive sheet and a flexible insulating sheet made of a resin material in the thickness direction thereof are arranged. The jig for circuit device inspection is constituted by the sheet-like connector, and the electrode to be inspected is brought into contact with the metal electrode body of the sheet-like connector in the jig for circuit device inspection and pressed, thereby forming a circuit device to be inspected. (See, for example, Patent Document 4).
[0008]
However, in the circuit device inspection jig described above, when the pitch of the electrodes to be inspected of the circuit device to be inspected is small, that is, when the pitch of the metal electrode body in the sheet-like connector is small, the required circuit device is required. It is difficult to achieve an electrical connection. More specifically, in a sheet-like connector in which the pitch of the metal electrode bodies is small, adjacent metal electrode bodies interfere with each other, so that flexibility between adjacent metal electrode bodies is reduced. Therefore, when the circuit device to be inspected has a low surface accuracy of the substrate, a low uniformity of the thickness of the substrate, or a device having a large variation in the height of the electrode to be inspected, In this case, the metal electrode body of the sheet-like connector cannot be reliably brought into contact with all the electrodes to be inspected, and as a result, good electrical connection to the circuit device cannot be obtained.
Further, even if a good electrical connection state can be achieved for all the electrodes to be inspected, a considerably large pressing force is required, and therefore, the entire inspection apparatus becomes large, The manufacturing cost of the entire device increases.
[0009]
Further, when the inspection of the circuit device is performed in a high-temperature environment, the thermal expansion coefficient of the elastic polymer material forming the anisotropic conductive sheet and the thermal expansion coefficient of the resin material forming the insulating sheet in the sheet-like connector are determined. As a result, a positional shift occurs between the conductive path forming portion of the anisotropic conductive sheet and the metal electrode body of the sheet-shaped connector, and it is difficult to stably maintain a good electrical connection state. is there.
Further, when configuring a jig for inspecting a circuit device, it is necessary to produce a sheet-like connector in addition to producing an anisotropic conductive sheet, and further, they are fixed in a state where they are aligned. This increases the manufacturing cost of the inspection jig.
[0010]
Further, the conventional anisotropic conductive sheet has the following problem.
That is, since the elastic polymer material forming the anisotropic conductive sheet, for example, silicone rubber, has an adhesive property at a high temperature, the anisotropic conductive sheet may be left under pressure in a high-temperature environment by a circuit device for a long time. If left unattended, the circuit device adheres to the circuit device, and as a result, the work of replacing the circuit device that has been inspected with the untested circuit device cannot be performed smoothly. As a result, the inspection efficiency of the circuit device decreases. I do. In particular, when the anisotropic conductive sheet adheres to the circuit device with a large strength, it is difficult to peel off the anisotropic conductive sheet from the circuit device without damaging the anisotropic conductive sheet. Cannot be subjected to subsequent inspections.
[0011]
[Patent Document 1]
JP-A-51-93393
[Patent Document 2]
JP-A-53-147772
[Patent Document 3]
JP-A-61-250906
[Patent Document 4]
JP-A-7-231019
[0012]
[Problems to be solved by the invention]
The present invention has been made in view of the above circumstances, and a first object of the present invention is to provide a method for permanently deforming a connection target electrode by pressing the connection target electrode even if the connection target electrode has a projection shape. It is another object of the present invention to provide an anisotropic conductive connector in which deformation due to wear is suppressed and stable conductivity can be obtained for a long period of time even when repeatedly pressed.
A second object of the present invention is an anisotropically conductive connector suitably used for electrical inspection of a circuit device, and even if the electrode to be inspected in the circuit device has a projecting shape, It is an object of the present invention to provide an anisotropic conductive connector in which permanent deformation due to pressure welding and deformation due to wear are suppressed, and stable conductivity can be obtained for a long period of time even when repeatedly pressed.
A third object of the present invention, in addition to the above-mentioned second object, is that the electrode material of the electrode to be inspected is prevented or suppressed from migrating to the conductive particles, and stable conductivity is obtained over a long period of time. In addition, an object of the present invention is to provide an anisotropic conductive connector that can prevent or suppress adhesion to a circuit device even when used while being pressed against the circuit device in a high-temperature environment.
A fourth object of the present invention is to provide a method capable of advantageously producing the above-described anisotropic conductive connector.
A fifth object of the present invention is to provide an inspection device for a circuit device provided with the anisotropic conductive connector described above.
[0013]
[Means for Solving the Problems]
The anisotropic conductive connector of the present invention is an anisotropic conductive connector having an anisotropic conductive film in which a plurality of conductive path forming portions each extending in a thickness direction are arranged in a state in which they are insulated from each other by an insulating portion. hand,
The anisotropic conductive film is formed by integrally laminating at least two elastic layers, each of which is formed of an insulating elastic polymer material. Each of these elastic layers forms a conductive path forming portion. Contains a conductive particle exhibiting magnetism, and has a durometer hardness of H of an elastic polymer material constituting one of the elastic layers forming the surface of the anisotropic conductive film.₁And the durometer hardness of the elastic polymer material constituting the other elastic layer is H₂Where the following conditions (1) and (2) are satisfied.
Condition (1): H₁≧ 30
Condition (2): H₁/ H₂≧ 1.1
[0014]
In the anisotropic conductive connector of the present invention, it is preferable that the following condition (3) is satisfied.
Condition (3): 15 ≦ H₂≤55
Further, in the anisotropic conductive connector of the present invention, it is preferable that a support for supporting a peripheral portion of the anisotropic conductive film is provided.
[0015]
The anisotropic conductive connector of the present invention is interposed between a circuit device to be inspected and a circuit board for inspection, and electrically connects an electrode to be inspected of the circuit device and an inspection electrode of the circuit board. It is suitable as an anisotropic conductive connector for such, in such an anisotropic conductive connector, the elastic polymer substance forming the elastic layer in contact with the circuit device in the anisotropic conductive film, the durometer hardness is the above H in the conditions (1) and (2)₁Is preferably satisfied.
[0016]
In the anisotropically conductive connector described above, it is preferable that the elastic layer in contact with the electrode to be inspected in the anisotropically conductive film contains particles exhibiting no conductivity or magnetism. Is more preferably a diamond powder.
In the anisotropic conductive connector described above, the anisotropic conductive film includes an electrically conductive path forming portion electrically connected to the electrode to be inspected of the circuit device to be inspected, and an electrically conductive path formed on the electrode to be inspected. A conductive path forming portion that is not connected to the circuit device may be formed, and the conductive path forming portion that is not electrically connected to the electrode to be inspected of the circuit device to be inspected may be formed at least on the periphery of the anisotropic conductive film supported by the support. It may be formed in a part.
In the anisotropic conductive connector described above, the conductive path forming portions may be arranged at a constant pitch.
[0017]
The method for producing an anisotropically conductive connector according to the present invention includes an anisotropically conductive film having an anisotropically conductive film in which a plurality of conductive path forming portions each extending in a thickness direction are arranged in a state in which they are insulated from each other by an insulating portion. A method of manufacturing a connector, comprising:
Prepare a mold for forming an anisotropic conductive film in which a molding space is formed by a pair of molds,
On the molding surface of one mold, a paste-like molding material layer containing conductive particles exhibiting magnetism in the polymer substance-forming material is formed, and on the molding surface of the other mold, the polymer substance is formed. Forming material contains conductive particles, forming at least one or more paste-like molding material layer,
The molding material layer formed on the molding surface of the one mold and the molding material layer formed on the molding surface of the other mold are stacked, and then, in the thickness direction of each molding material layer, the strength distribution is increased. Having a step of forming an anisotropic conductive film by applying a magnetic field having the same, and curing each molding material layer,
The durometer hardness of the elastic polymer material obtained by curing the polymer material forming material in the molding material layer formed on the molding surface of the one mold is H.₁The durometer hardness of the elastic polymer material obtained by curing the polymer material forming material in the molding material layer formed on the molding surface of the other mold is H.₂Where the following conditions (1) and (2) are satisfied.
Condition (1): H₁≧ 30
Condition (2): H₁/ H₂≧ 1.1
[0018]
An inspection device for a circuit device of the present invention includes an inspection circuit board having an inspection electrode arranged corresponding to an electrode to be inspected of a circuit device to be inspected,
The above anisotropic conductive connector arranged on the inspection circuit board and
It is characterized by comprising.
[0019]
In the inspection device for a circuit device according to the present invention, the pressure reducing frame for reducing the pressure of the electrode to be inspected with respect to the anisotropic conductive film of the anisotropic conductive connector includes a circuit device to be inspected and the anisotropic conductive connector. It is preferable that the pressurizing force reducing frame has spring elasticity or rubber elasticity.
[0020]
[Action]
According to the anisotropic conductive connector having the above-described configuration, the durometer hardness of the elastic polymer material forming one of the elastic layers forming the surface of the anisotropic conductive film is 30 or more. Even if the electrode has a protruding shape, permanent deformation due to pressure contact of the connection target electrode and deformation due to wear are suppressed. Moreover, since the durometer hardness of the elastic polymer material forming the other elastic layer is sufficiently lower than that of the elastic polymer material forming the one elastic layer, the conductive path forming portion is pressed. This ensures that the required conductivity is obtained. Therefore, even if repeatedly pressed by the connection target electrode, stable conductivity can be obtained for a long period of time.
Further, according to the configuration in which the one elastic layer contains particles that do not exhibit conductivity and magnetism, the hardness of the one elastic layer is increased, so that permanent deformation due to pressure welding of the connection target electrode or The deformation due to abrasion is further suppressed, and the electrode material is prevented or suppressed from migrating to the conductive particles in the anisotropic conductive film, so that more stable conductivity is obtained over a long period of time, and Even when used in a state of being pressed against a circuit device under a high-temperature environment, adhesion to the circuit device is prevented or suppressed.
[0021]
According to the method of manufacturing an anisotropic conductive connector described above, the molding material layer formed on the molding surface of one mold and the molding material layer formed on the molding surface of the other mold are stacked. In order to harden each molding material layer, it is possible to advantageously and reliably manufacture an anisotropic conductive connector having an anisotropic conductive film in which two or more elastic layers having different hardnesses are integrally laminated. it can.
[0022]
According to the circuit device inspection device, since the anisotropic conductive connector is provided, even if the electrode to be inspected has a projecting shape, permanent deformation due to pressure contact of the electrode to be inspected, Since deformation caused by wear is suppressed, stable conductivity can be obtained over a long period of time even when a large number of circuit devices are continuously tested.
Further, in the inspection device of the present invention, in addition to the above-described anisotropically conductive connector, it is not necessary to use a sheet-like connector, so that the alignment between the anisotropically conductive connector and the sheet-like connector is unnecessary. In addition, it is possible to avoid the problem of misalignment between the sheet-like connector and the anisotropic conductive connector due to a change in temperature, and the configuration of the inspection device is easy.
In addition, by providing a pressing force relaxation frame between the circuit device to be inspected and the anisotropic conductive connector, the pressing force of the electrode to be inspected against the anisotropic conductive film of the anisotropic conductive connector is reduced. Stable conductivity can be obtained for a longer period.
In addition, by using a frame having spring elasticity or rubber elasticity as the pressing force relaxing frame, the magnitude of the impact applied to the anisotropic conductive film by the electrode to be inspected can be reduced. Other failures can be prevented or suppressed, and when the pressing force on the anisotropic conductive film is released, the circuit device is easily separated from the anisotropic conductive film by the spring elasticity of the pressing force relaxing frame. In addition, the operation of replacing a circuit device that has been inspected with a circuit device that has not been inspected can be performed smoothly, and as a result, the inspection efficiency of the circuit device can be improved.
[0023]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail.
FIGS. 1, 2 and 3 are explanatory views showing the configuration of an example of the anisotropic conductive connector of the present invention. FIG. 1 is a plan view, FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1, and FIG. It is a partial expanded sectional view. The anisotropic conductive connector 10 includes a rectangular anisotropic conductive film 10A and a rectangular plate-like support 71 that supports the anisotropic conductive film 10A, and is formed in a sheet shape as a whole.
As shown in FIGS. 4 and 5, a rectangular opening 73 having a size smaller than the anisotropic conductive film 10A is formed at the center of the support 71, and a positioning hole 72 is formed at each of the four corners. Is formed. The anisotropic conductive film 10A is supported by the support 71 by disposing the anisotropic conductive film 10A in the opening 73 of the support 71 and fixing the peripheral edge of the anisotropic conductive film 10A to the support 71.
[0024]
The anisotropic conductive film 10 </ b> A in the anisotropic conductive connector 10 has a plurality of cylindrical conductive path forming portions 11 extending in the thickness direction, and an insulating high elasticity insulating the conductive path forming portions 11 from each other. And an insulating portion 15 made of a molecular substance.
Further, the anisotropic conductive film 10A is formed by integrally laminating two elastic layers 10B and 10C each formed of an insulating elastic polymer material, and a conductive path in each of the elastic layers 10B and 10C. The portion where the formation portion 11 is formed contains conductive particles (not shown) exhibiting magnetism.
[0025]
In the illustrated example, one of the plurality of conductive path forming portions 11 formed in a region other than the peripheral portion of the anisotropic conductive film 10A serves as a connection target electrode, for example, an electrode to be inspected in the circuit device 1 to be inspected. The effective conductive path forming part 12 to be electrically connected is formed, and the one formed at the peripheral edge of the anisotropic conductive part 10A is the ineffective conductive path forming part 13 not electrically connected to the connection target electrode. The effective conductive path forming section 12 is arranged according to a pattern corresponding to the pattern of the connection target electrode.
On the other hand, the insulating portions 15 are integrally formed so as to surround the individual conductive path forming portions 11, so that all the conductive path forming portions 11 are in a state in which they are insulated from each other by the insulating portions 15. Have been.
[0026]
The surface of one elastic layer 10B of the elastic layers 10B and 10C forming the surface of the anisotropic conductive film 10A is flat, and the conductive path forming portion 11 is formed on the other elastic layer 10C. A protruding portion 11a is formed in which the surface of the portion protrudes from the surface of the portion forming the insulating portion 15.
Also, one of the elastic layers 10B and 10C forming the surface of the anisotropic conductive film 10A contains particles exhibiting no magnetism or conductivity (hereinafter, referred to as “non-magnetic insulating particles”). Have been.
[0027]
The durometer hardness H of the elastic polymer material forming one of the elastic layers 10B of the elastic layers 10B and 10C forming the surface of the anisotropic conductive film 10A is used.₁(Hereinafter, “hardness H₁" ) Is 30 or more, preferably 40 or more, and the durometer hardness H of the elastic polymer material constituting the other elastic layer (elastic layer 10C in the illustrated example) is set.₂(Hereinafter, “hardness H₂" ) For hardness H₁Ratio H₁/ H₂(Hereinafter simply referred to as “ratio H₁/ H₂" ) Is 1.1 or more, preferably 1.2 or more, more preferably 1.3 or more.
Hardness H₁Is too small, repeated use results in an early increase in the electrical resistance value of the conductive path forming portion, so that high repetition durability cannot be obtained.
Also, the ratio H₁/ H₂Is too small, it is difficult to form a conductive path forming portion having a low electric resistance value.
[0028]
Also, hardness H₁Is preferably 70 or less, more preferably 65 or less. Hardness H₁Is too large, a conductive path forming portion having high conductivity may not be obtained.
Also, the ratio H₁/ H₂Is preferably 3.5 or less, more preferably 3 or less. Ratio H₁/ H₂Is too large, the hardness H₁And hardness H₂It may be difficult to set both to optimal values.
Furthermore, hardness H₂Is preferably from 15 to 55, and more preferably from 20 to 50. Hardness H₂Is too small, high repetition durability may not be obtained. On the other hand, hardness H₂Is too large, a conductive path forming portion having high conductivity may not be obtained.
[0029]
When the thickness of one elastic layer 10B is α and the thickness of the other elastic layer 10C is β, the value of the ratio α / β is preferably 0.05 to 1, and more preferably 0.1. -0.7. If one of the elastic layers 10B is too thick, a conductive path forming portion having high conductivity may not be obtained. If the thickness of one elastic layer 10B is too small, high repetition durability may not be obtained.
[0030]
As the elastic polymer material forming each of the elastic layers 10B and 10C in the anisotropic conductive film 10A, a polymer material having a crosslinked structure is preferable. Various materials can be used as the curable polymer substance forming material that can be used to obtain such an elastic polymer substance, and specific examples thereof include polybutadiene rubber, natural rubber, and polyisoprene rubber. Conjugated diene rubbers such as styrene-butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer and other blocks Copolymer rubbers and hydrogenated products thereof, chloroprene, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber and the like can be mentioned.
In the above, when the obtained anisotropic conductive connector 10 is required to have weather resistance, it is preferable to use a material other than the conjugated diene rubber. In particular, from the viewpoint of moldability and electrical characteristics, silicone rubber is used. Preferably, it is used.
[0031]
As the silicone rubber, one obtained by crosslinking or condensing a liquid silicone rubber is preferable. Liquid silicone rubber has a viscosity of 10^-110 seconds⁵Poises or less are preferable, and any of condensation type, addition type, and those containing a vinyl group or a hydroxyl group may be used. Specifically, dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, methyl phenyl vinyl silicone raw rubber and the like can be mentioned.
The silicon rubber preferably has a molecular weight Mw (weight average molecular weight in terms of standard polystyrene; the same applies hereinafter) of 10,000 to 40,000. In addition, since good heat resistance is obtained in the obtained conductive path forming portion 11, the molecular weight distribution index (refers to the value of the ratio Mw / Mn of the weight average molecular weight Mw in terms of standard polystyrene and the number average molecular weight Mn in terms of standard polystyrene). The same applies to the following.).
[0032]
As the conductive particles contained in the conductive path forming portion 11 of the anisotropic conductive film 10A, conductive particles exhibiting magnetism are used because the particles can be easily oriented by a method described later. Specific examples of such conductive particles include iron, cobalt, particles of a metal having magnetism such as nickel, particles of an alloy thereof, or particles containing these metals, or these particles as core particles. The surface of the core particles is plated with a metal having good conductivity such as gold, silver, palladium, rhodium, or inorganic particles or polymer particles such as non-magnetic metal particles or glass beads as core particles. Particles obtained by plating the surface of a particle with a conductive magnetic metal such as nickel or cobalt may be used.
Among these, it is preferable to use nickel particles as core particles whose surfaces are plated with gold having good conductivity.
Means for coating the surface of the core particles with a conductive metal is not particularly limited, and for example, chemical plating or electrolytic plating, sputtering, vapor deposition, or the like is used.
[0033]
When the conductive particles are formed by coating the surface of a core particle with a conductive metal, good conductivity can be obtained. Therefore, the coverage of the conductive metal on the particle surface (based on the surface area of the core particle) The ratio of the area covered with the conductive metal) is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.
Further, the coating amount of the conductive metal is preferably 0.5 to 50% by mass of the core particles, more preferably 2 to 30% by mass, further preferably 3 to 25% by mass, and particularly preferably 4 to 20% by mass. % By mass. When the conductive metal to be coated is gold, the coating amount is preferably 0.5 to 30% by mass of the core particles, more preferably 2 to 20% by mass, and further preferably 3 to 15% by mass. % By mass.
[0034]
Further, the particle diameter of the conductive particles is preferably 1 to 100 μm, more preferably 2 to 50 μm, further preferably 3 to 30 μm, and particularly preferably 4 to 20 μm.
Further, the particle size distribution (Dw / Dn) of the conductive particles is preferably 1 to 10, more preferably 1.01 to 7, further preferably 1.05 to 5, and particularly preferably 1.1 to 1. 4.
By using the conductive particles satisfying such conditions, the obtained conductive path forming portion 11 can be easily deformed under pressure, and the conductive path forming portion 11 has a sufficient electric power between the conductive particles. Contact is obtained.
In addition, the shape of the conductive particles is not particularly limited. However, spherical particles, star-shaped particles, or secondary particles in which these particles are aggregated can be easily dispersed in a polymer substance forming material. It is preferably a particle.
In addition, a conductive particle whose surface is treated with a coupling agent such as a silane coupling agent or a lubricant can be used as appropriate. By treating the particle surface with a coupling agent or a lubricant, the durability of the anisotropic conductive connector is improved.
[0035]
It is preferable that such conductive particles are used in a ratio of 5 to 60%, preferably 7 to 50% in volume fraction with respect to the polymer substance-forming material. If the ratio is less than 5%, the conductive path forming portion 11 having a sufficiently small electric resistance value may not be obtained. On the other hand, when the ratio exceeds 60%, the obtained conductive path forming portion 11 tends to be fragile, and the elasticity required for the conductive path forming portion 11 may not be obtained.
[0036]
As the conductive particles used for the conductive path forming portion 11, those having a surface coated with gold are preferable, but an electrode to be connected, for example, an electrode to be inspected of a circuit device to be inspected is made of a solder alloy containing lead. In this case, the conductive particles contained in one elastic layer 10B in contact with the electrode to be inspected made of the solder alloy include rhodium, palladium, ruthenium, tungsten, molybdenum, platinum, iridium, silver, and the like. It is preferable that the lead component is coated with a diffusion-resistant metal selected from alloys containing, so that the lead component can be prevented from diffusing into the coating layer of the conductive particles.
[0037]
The conductive particles having a surface coated with a diffusion-resistant metal are, for example, a chemical plating or electrolytic plating method, a sputtering method, and a vapor deposition method on the surface of a core particle made of nickel, iron, cobalt, or an alloy thereof. It can be formed by coating a diffusion-resistant metal with, for example, a metal.
Further, the coating amount of the diffusion-resistant metal is preferably 5 to 40%, more preferably 10 to 30% by mass fraction with respect to the conductive particles.
[0038]
As the nonmagnetic insulating particles contained in one elastic layer 10B, diamond powder, glass powder, ceramic powder, ordinary silica powder, colloidal silica, airgel silica, alumina, and the like can be used. Diamond powder is preferred.
By including such non-magnetic insulating particles in one elastic layer 10B, the hardness of the one elastic layer 10B is further increased, high repetition durability is obtained, and a lead component constituting the electrode to be inspected. Can be suppressed from diffusing into the coating layer of the conductive particles, and furthermore, the sticking of the anisotropic conductive film 10A to the circuit device to be inspected can be suppressed.
[0039]
The particle diameter of the non-magnetic insulating particles is preferably 0.1 to 50 μm, more preferably 0.5 to 40 μm, and still more preferably 1 to 30 μm. If the particle size is too small, it is difficult to sufficiently impart the effect of suppressing permanent deformation or deformation due to wear to one of the obtained elastic layers 10B. When a large amount of nonmagnetic insulating particles having an excessively small particle diameter are used, the fluidity of the molding material for obtaining the one elastic layer 10B is reduced. Orientation may be difficult.
On the other hand, when the particle diameter is excessive, the presence of the nonmagnetic insulating particles in the conductive path forming section 11 may make it difficult to obtain the conductive path forming section 11 having a low electric resistance value. is there.
[0040]
The use amount of the nonmagnetic insulating particles is not particularly limited, but if the use amount of the nonmagnetic insulating particles is small, there is no increase in the hardness of one of the obtained elastic layers 10B. If the amount of the nonmagnetic insulating particles is large, the orientation of the conductive particles due to the magnetic field cannot be sufficiently achieved in the manufacturing method described below, which is not preferable. The practical use amount of the non-magnetic insulating particles is 5 to 90 parts by weight based on 100 parts by weight of the elastic polymer material constituting one elastic layer 10B.
[0041]
The material constituting the support 71 has a linear thermal expansion coefficient of 3 × 10^-5/ K or less, more preferably 2 × 10^-5~ 1 × 10^-6/ K, particularly preferably 6 × 10^-6~ 1 × 10^-6/ K.
As a specific material, a metal material or a nonmetal material is used.
As the metal material, gold, silver, copper, iron, nickel, cobalt, or an alloy thereof can be used.
Non-metallic materials include resin materials with high mechanical strength such as polyimide resin, polyester resin, polyaramid resin, and polyamide resin, glass fiber reinforced epoxy resin, glass fiber reinforced polyester resin, and glass fiber reinforced polyimide resin. A composite resin material in which an inorganic material such as silica, alumina, boron nitride, or the like is mixed as a filler in a resin material, an epoxy resin, or the like can be used. However, polyimide resins, glass fiber reinforced epoxy resins, and the like have a small coefficient of thermal expansion. A composite resin material such as a resin, or a composite resin material such as an epoxy resin mixed with boron nitride as a filler is preferable.
[0042]
According to the anisotropically conductive connector 10 described above, the durometer hardness of the elastic polymer substance constituting one of the elastic layers 10B of the elastic layers forming the surface of the anisotropic conductive film 10A is 30 or more. Even if the target electrode has a projection shape, it is possible to suppress permanent deformation due to pressure contact of the connection target electrode and deformation due to wear. In addition, since the durometer hardness of the elastic polymer material forming the other elastic layer 10C is sufficiently lower than that of the elastic polymer material forming the one elastic layer 10B, the conductive path forming portion 11 is pressurized. By doing so, the required conductivity is reliably obtained. Therefore, even if repeatedly pressed by the connection target electrode, stable conductivity can be obtained for a long period of time.
In addition, since the one elastic layer 10B contains non-magnetic insulating particles, the hardness of the one elastic layer 10B increases, causing permanent deformation or abrasion due to pressure welding of the connection target electrode. Deformation can be further suppressed, and furthermore, since the electrode material is prevented or suppressed from migrating to the conductive particles, more stable conductivity can be obtained over a long period of time, and in a high temperature environment. Even when used while being pressed against a circuit device, it is possible to prevent or suppress adhesion to the circuit device.
[0043]
Such an anisotropic conductive connector 10 can be manufactured, for example, as follows.
FIG. 6 is an explanatory cross-sectional view showing a configuration of an example of a mold used for manufacturing the anisotropic conductive connector of the present invention. This mold is configured such that an upper mold 50 and a lower mold 55 to be paired with the upper mold 50 are arranged so as to face each other, and the molding surface of the upper mold 50 (the lower surface in FIG. 6) and the molding surface of the lower mold 55 (FIG. 6 at the upper surface).
In the upper die 50, a ferromagnetic layer 52 is formed on the surface (the lower surface in FIG. 6) of the ferromagnetic substrate 51 in accordance with the arrangement pattern corresponding to the pattern of the conductive path forming portion 11 in the target anisotropic conductive connector 10. A portion 53b having a thickness substantially equal to the thickness of the ferromagnetic material layer 52 (hereinafter, simply referred to as a "portion 53b") and a portion other than the ferromagnetic material layer 52 are formed. The non-magnetic layer 53 is formed of a portion 53 a having a thickness larger than the thickness of the layer 52 (hereinafter, simply referred to as “portion 53 a”), and a portion between the portion 53 a and the portion 53 b in the non-magnetic layer 53 is formed. A recess 60 is formed on the surface of the upper die 50 due to the formation of a step.
[0044]
On the other hand, in the lower die 55, the ferromagnetic layer 57 is formed on the surface (the upper surface in FIG. 6) of the ferromagnetic substrate 56 according to the pattern corresponding to the pattern of the conductive path forming portion 11 in the target anisotropic conductive connector 10. A non-magnetic layer 58 having a thickness larger than the thickness of the ferromagnetic layer 57 is formed in a portion other than the ferromagnetic layer 57. By forming a step between the lower mold 55 and the lower mold 55, a concave space 57 a for forming the protruding portion 11 a is formed on the molding surface of the lower mold 55.
[0045]
As a material forming the ferromagnetic substrates 51 and 56 in each of the upper mold 50 and the lower mold 55, a ferromagnetic metal such as iron, an iron-nickel alloy, an iron-cobalt alloy, nickel, and cobalt can be used. The ferromagnetic substrates 51 and 56 preferably have a thickness of 0.1 to 50 mm, and have a smooth surface, are chemically degreased, and are mechanically polished. preferable.
[0046]
Further, as a material forming the ferromagnetic layers 52 and 57 in each of the upper mold 50 and the lower mold 55, a ferromagnetic metal such as iron, an iron-nickel alloy, an iron-cobalt alloy, nickel, and cobalt may be used. it can. The ferromagnetic layers 52 and 57 preferably have a thickness of 10 μm or more. If the thickness is less than 10 μm, it is difficult to apply a magnetic field having a sufficient intensity distribution to the molding material layer formed in the mold. As a result, the conductive path in the molding material layer becomes difficult. Since it is difficult to aggregate the conductive particles at a high density in a portion to be the forming portion 11, a good anisotropic conductive connector may not be obtained.
[0047]
Further, as a material forming the nonmagnetic layers 53 and 58 in each of the upper mold 50 and the lower mold 55, a nonmagnetic metal such as copper, a heat-resistant polymer substance, or the like can be used. It is preferable to use a polymer material cured by radiation, since the nonmagnetic material layers 53 and 58 can be easily formed by the above method. Examples of the material include an acrylic dry film resist and an epoxy material. And a photoresist such as a polyimide-based liquid resist.
The thickness of the nonmagnetic layer 58 in the lower mold 55 is set according to the height of the protrusion 11 a to be formed and the thickness of the ferromagnetic layer 57.
[0048]
Using the above-described mold, the anisotropic conductive connector 10 is manufactured, for example, as follows.
First, as shown in FIG. 7, frame-shaped spacers 54a and 54b and a support 71 having an opening 73 and a positioning hole 72 as shown in FIGS. 4 and 5 are prepared. Is fixedly arranged at a predetermined position of the lower mold 55 via a frame-shaped spacer 54b, and a frame-shaped spacer 54a is further arranged on the support 71.
On the other hand, by dispersing conductive particles and non-magnetic insulating particles exhibiting magnetism in a curable polymer material forming material, a paste-like first molding material for forming the elastic layer 10B is prepared. At the same time, a paste-like second molding material for forming the elastic layer 10C is prepared by dispersing conductive particles exhibiting magnetism in the curable polymer substance forming material. Here, as the polymer material forming material used for the first molding material, the elastic polymer material obtained by curing is the hardness H described above.₁Is satisfied, the polymer material forming material used for the second molding material is such that the elastic polymer material obtained by curing has the hardness H described above.₂It satisfies the condition of
Next, as shown in FIG. 8, the first molding material is filled in a concave portion 60 (see FIG. 6) on the molding surface of the upper mold 50 to form a first molding material layer 61a. The second molding material is filled in the space formed by the lower mold 55, the spacers 54a and 54b, and the support 71, thereby forming the second molding material layer 61b.
Then, as shown in FIG. 9, the first molding material layer 61a is laminated on the second molding material layer 61b by arranging the upper mold 50 on the spacer 54a.
[0049]
Next, by operating electromagnets (not shown) disposed on the upper surface of the ferromagnetic substrate 51 in the upper die 50 and the lower surface of the ferromagnetic substrate 56 in the lower die 55, a parallel magnetic field having an intensity distribution, Between the ferromagnetic layer 52 of the mold 50 and the corresponding ferromagnetic layer 57 of the lower mold 55, a parallel magnetic field having a large intensity is applied to the thicknesses of the first molding material layer 61a and the second molding material layer 61b. Act in the direction. As a result, in the first molding material layer 61a and the second molding material layer 61b, the conductive particles dispersed in each molding material layer are separated from the respective ferromagnetic layers 52 of the upper die 50 by They are gathered in a portion to be the conductive path forming portion 11 located between the corresponding lower mold 55 and the ferromagnetic layer 57 and are oriented so as to be arranged in the thickness direction of each molding material layer.
[0050]
Then, in this state, by curing each molding material layer, as shown in FIG. 10, conductive paths densely filled in a state where conductive particles are aligned in the elastic polymer material so as to be aligned in the thickness direction. Forming portions 11 and insulating portions 15 made of an insulating elastic polymer material formed so as to surround the periphery of the conductive path forming portions 11 and having no or almost no conductive particles. An anisotropic conductive film 10A is formed by integrally laminating two elastic layers 10B and 10C formed of an elastic elastic polymer material, thereby forming an anisotropic conductive film having the configuration shown in FIGS. The connector 10 is manufactured.
[0051]
In the above, the curing treatment of each molding material layer can be performed in a state where the parallel magnetic field is applied, but can also be performed after the operation of the parallel magnetic field is stopped.
The strength of the parallel magnetic field applied to each molding material layer is preferably 20,000 to 1,000,000 μT on average.
Further, as means for applying a parallel magnetic field to each molding material layer, a permanent magnet can be used instead of an electromagnet. As the permanent magnet, those made of alnico (Fe-Al-Ni-Co-based alloy), ferrite, and the like are preferable in that a parallel magnetic field strength within the above range can be obtained.
The curing treatment of each molding material layer is appropriately selected depending on the material used, but is usually performed by a heat treatment. The specific heating temperature and heating time are appropriately selected in consideration of the type of the polymer material forming material constituting the molding material layer, the time required for the movement of the conductive particles, and the like.
[0052]
According to such a manufacturing method, the first molding material layer 61a formed on the molding surface of the upper mold 50 and the second molding material layer 61b formed on the molding surface of the lower mold 55 are stacked. In this state, since each molding material layer is cured, the anisotropic conductive connector 10 having the anisotropic conductive film 10A in which two or more elastic layers having different hardnesses are integrally laminated is advantageously and reliably formed. Can be manufactured.
[0053]
FIG. 11 is an explanatory view schematically showing the configuration of an example of the circuit device inspection apparatus according to the present invention.
The inspection device for this circuit device is provided with an inspection circuit board 5 having guide pins 9. An inspection electrode 6 is formed on the surface (upper surface in FIG. 1) of the inspection circuit board 9 according to a pattern corresponding to the pattern of the hemispherical solder ball electrodes 2 of the circuit device 1 to be inspected.
An anisotropic conductive connector 10 having the configuration shown in FIGS. 1 to 3 is arranged on the surface of the inspection circuit board 5. More specifically, the guide pins 9 are inserted into positioning holes 72 (see FIGS. 1 to 3) formed in the support 71 of the anisotropic conductive connector 10 to form conductive paths in the anisotropic conductive film 10A. The anisotropic conductive connector 10 is fixed on the surface of the test circuit board 5 with the portion 11 positioned so as to be positioned on the test electrode 6.
[0054]
In such an inspection device for a circuit device, the circuit device 1 is arranged on the anisotropic conductive connector 10 so that the solder ball electrode 2 is located on the conductive path forming portion 11. 1 is pressed in a direction approaching the circuit board 5 for inspection, so that each of the conductive path forming portions 11 in the anisotropic conductive connector 10 is in a state of being pressed by the solder ball electrode 2 and the electrode 6 for inspection. As a result, electrical connection between each solder ball electrode 2 of the circuit device 1 and each test electrode 6 of the test circuit board 5 is achieved, and the test of the circuit device 1 is performed in this test state.
[0055]
According to the circuit device inspection apparatus described above, since the above-described anisotropic conductive connector 10 is provided, even if the electrode to be inspected is the protruding solder ball electrode 2, it is deformed by the pressure contact of the electrode to be inspected. Since permanent deformation and deformation due to abrasion are suppressed in the conductive film 10A, stable conductivity can be obtained for a long period of time even when a large number of circuit devices 1 are continuously tested. .
Further, since the one elastic layer 10B of the anisotropic conductive film 10A in the anisotropic conductive connector 10 contains non-magnetic insulating particles, the electrode material of the solder ball electrode 2 is transferred to the conductive particles. Is prevented or suppressed, more stable conductivity is obtained for a long period of time, and even when used in a state where the circuit device 1 is pressed against the circuit device 1 in a high-temperature environment, adhesion to the circuit device 1 can be prevented. Can be prevented or suppressed.
In addition, since the anisotropic conductive connector 10 suppresses permanent deformation due to pressure contact with the electrode to be inspected and deformation due to abrasion, a sheet other than the anisotropic conductive connector 10 is used. The electrical inspection of the circuit device can be performed without using the connector.
When the sheet-like connector is not used, it is not necessary to align the anisotropically conductive connector 10 and the sheet-like connector, and there is a problem of displacement between the sheet-like connector and the anisotropically conductive connector 10 due to a temperature change. Can be avoided, and the configuration of the inspection apparatus is easy.
[0056]
In the present invention, various changes can be made without being limited to the above embodiment.
(1) When the anisotropic conductive connector 10 of the present invention is used for electrical inspection of a circuit device, the electrode to be inspected of the circuit device to be inspected is not limited to a hemispherical solder ball electrode. It may be a flat electrode.
(2) It is not essential to provide a support, and it may be composed of only an anisotropic conductive film.
(3) When the anisotropically conductive connector 10 of the present invention is used for electrical inspection of a circuit device, the anisotropically conductive film may be integrally bonded to the inspection circuit board. According to such a configuration, the displacement between the anisotropic conductive film and the inspection circuit board can be reliably prevented.
Such an anisotropically conductive connector uses a die having a board placement space area in which a test circuit board 5 can be placed in a molding space as a mold for manufacturing the anisotropically conductive connector. It can be manufactured by arranging a circuit board for inspection in a space region for arranging a substrate in a molding space of a mold, and in this state, for example, injecting a molding material into the molding space and performing a curing treatment.
(4) In the method of manufacturing an anisotropic conductive connector according to the present invention, the conductive path forming portion can be formed by a laminate of layer portions having different characteristics from each other. Can be obtained. Specifically, in addition to the configuration in which the layer portions having different types of conductive particles are stacked as described above, for example, the configuration in which the layer portions in which the particle diameter of the conductive particles or the content ratio of the conductive particles are different is stacked. In addition, a conductive path forming part having a controlled degree of conductivity can be formed, and a conductive path having a controlled elastic characteristic at the protruding part is formed by laminating layers of different types of elastic polymer substances. It is possible to form a forming part.
The anisotropically conductive connector of the present invention can also be manufactured by the method for manufacturing an anisotropically conductive connector described in Japanese Patent Application Nos. 2001-262550 and 2001-313324.
[0057]
(5) In the anisotropic conductive connector of the present invention, the conductive path forming portions are arranged at a constant pitch, and a part of the conductive path forming portions is an effective conductive path forming portion electrically connected to the electrode to be inspected. Alternatively, the other conductive path forming portion may be an ineffective conductive path forming portion that is not electrically connected to the electrode to be inspected.
More specifically, as shown in FIG. 12, as the circuit device 1 to be inspected, a lattice point position having a fixed pitch, such as CSP (Chip \ Scale \ Package) or TSOP (Thin \ Small \ Outline \ Package), is used. Among them, there is a configuration in which a solder ball electrode 2 which is an electrode to be inspected is arranged only at a part of positions. In an anisotropic conductive connector 10 for inspecting such a circuit device 1, a conductive path is formed. The portions 11 are arranged in accordance with lattice point positions having substantially the same pitch as the electrodes to be inspected, the conductive path forming portions 11 at positions corresponding to the electrodes to be inspected are defined as effective conductive path forming portions, and other conductive path forming portions are formed. The portion 11 may be an invalid conductive path forming portion.
According to the anisotropically conductive connector 10 having such a configuration, in the manufacture of the anisotropically conductive connector 10, a magnetic field is applied to the molding material layer by arranging the ferromagnetic layers of the mold at a constant pitch. When actuated, the conductive particles can be efficiently gathered and aligned at predetermined positions, and in each of the obtained conductive path forming portions, the density of the conductive particles becomes uniform. In addition, it is possible to obtain an anisotropic conductive connector having a small difference in resistance between the conductive path forming portions.
[0058]
(6) The specific shape and structure of the anisotropic conductive film can be variously changed.
For example, as shown in FIG. 13, the anisotropic conductive film 10 </ b> A may have a concave portion 16 at a center portion thereof on a surface in contact with an electrode to be inspected of a circuit device to be inspected.
Further, as shown in FIG. 14, the anisotropic conductive film 10A may have a through hole 17 at the center.
As shown in FIG. 15, the anisotropic conductive film 10 </ b> A does not have the conductive path forming portion 11 formed on the peripheral portion supported by the support 71, and has the conductive path forming portion only in a region other than the peripheral portion. 11 may be formed, and all of these conductive path forming portions 11 may be effective conductive path forming portions.
As shown in FIG. 16, the anisotropic conductive film 10A may have an ineffective conductive path forming portion 13 formed between the effective conductive path forming portion 12 and a peripheral portion.
As shown in FIG. 17, the anisotropic conductive film 10A has a three-layer structure having an intermediate elastic layer 10D between one elastic layer 10B and the other elastic layer 10C, each of which forms a surface. Or a configuration having four or more layers.
Further, as shown in FIG. 18, the anisotropic conductive film 10A may have a flat surface on both sides.
As shown in FIG. 19, the anisotropic conductive film 10 </ b> A has the surface where the conductive path forming portion 11 is formed on both the one elastic layer 10 </ b> B and the other elastic layer 10 </ b> C forming the surface. The protruding portion 11a protruding from the surface of the portion forming the portion 15 may be formed.
[0059]
(7) In the anisotropic conductive connector of the present invention, at least one of the elastic layers forming the anisotropic conductive film may contain a reinforcing material. As such a reinforcing material, a material made of a mesh or a nonwoven fabric can be suitably used.
By including such a reinforcing material in at least one of the elastic layers forming the anisotropic conductive film, the deformation of the conductive path forming portion is further suppressed even when repeatedly pressed by the connection target electrode. Further, a more stable conductivity can be obtained over a long period of time.
Here, as the mesh or the nonwoven fabric forming the reinforcing material, a mesh or nonwoven fabric formed of organic fibers can be suitably used. Examples of such organic fibers include fluororesin fibers such as polytetrafluoroethylene fibers, aramid fibers, polyethylene fibers, polyarylate fibers, nylon fibers, and polyester fibers.
Organic fibers having a coefficient of linear thermal expansion equal to or close to the coefficient of linear thermal expansion of the material forming the connection object, specifically having a coefficient of linear thermal expansion of 30 × 10^-6~ -5 × 10^-6/ K, especially 10 × 10^-6~ -3 × 10^-6/ K is used, the thermal expansion of the anisotropic conductive film is suppressed, so that even when a thermal history due to a temperature change is received, a good electrical connection state to the connection target is stably maintained. can do.
It is preferable to use organic fibers having a diameter of 10 to 200 μm.
Specific examples of such an anisotropic conductive connector are shown in FIG. 34, FIG. 35 and FIG.
More specifically, the anisotropic conductive connector shown in FIG. 34 has a three-layer structure in which an intermediate elastic layer 10D is formed between one elastic layer 10B and the other elastic layer 10C, each of which forms a surface. It has an anisotropic conductive film 10A, and one elastic layer 10B in the anisotropic conductive film 10A contains a reinforcing material 80B made of a mesh or a nonwoven fabric.
The anisotropically conductive connector shown in FIG. 35 has a three-layered anisotropically conductive film in which an intermediate elastic layer 10D is formed between one elastic layer 10B and the other elastic layer 10C, each of which forms a surface. 10A, wherein the intermediate elastic layer 10D of the anisotropic conductive film 10A contains a reinforcing material 80D made of a mesh or a nonwoven fabric.
The anisotropic conductive connector shown in FIG. 36 has a three-layer anisotropic conductive film in which an intermediate elastic layer 10D is formed between one elastic layer 10B and the other elastic layer 10C, each of which forms a surface. 10A, wherein the other elastic layer 10C in the anisotropic conductive film 10A contains a reinforcing material 80C made of a mesh or a nonwoven fabric.
[0060]
(8) In the inspection apparatus for a circuit device according to the present invention, as shown in FIG. 20, the pressure applied to the solder ball electrode 2 as the electrode to be inspected with respect to the anisotropic conductive film 10A of the anisotropic conductive connector 10 is reduced. The pressure relief frame 65 may be arranged between the circuit device 1 to be inspected and the anisotropic conductive connector 10.
As shown in FIG. 21, the pressing force relaxing frame 65 has a rectangular plate shape as a whole, and has, in the center thereof, the electrode to be inspected of the circuit device 1 to be inspected and the anisotropic conductive connector 10. A substantially rectangular opening 66 for making contact with the conductive path forming portion 11 is formed, and a plate spring portion 67 is obliquely upwardly inward from the periphery of the opening 66 at each of four peripheral edges of the opening 66. And are formed integrally so as to protrude therefrom. In the illustrated example, the pressure reducing frame 65 is configured such that the size of the opening 66 is larger than the size of the anisotropic conductive film 10 </ b> A in the anisotropically conductive connector 10, and only the distal end portion of the leaf spring 67 is anisotropically conductive. It is arranged so as to be located above the periphery of the film 10A. The height of the tip of the leaf spring portion 67 is set such that when the tip of the leaf spring portion 67 contacts the circuit device 1, the electrode to be inspected of the circuit device 1 does not contact the anisotropic conductive film 10A. ing. Further, at each of the four corner positions of the pressing force relaxing frame 65, a positioning hole 68 through which the guide pin of the inspection circuit board 5 is inserted is formed.
[0061]
According to the inspection device for a circuit device having such a configuration, for example, the circuit device 1 is pressed against the leaf spring portion 67 of the pressing force relaxing frame 65 by pressing the circuit device 1 in a direction approaching the inspection circuit board 5. Then, due to the spring elasticity of the plate spring portion 67, the pressing force of the solder ball electrode 2, which is the electrode to be inspected, on the anisotropic conductive film 10A of the anisotropic conductive connector 10 is reduced. Further, as shown in FIG. 22, in a state where the leaf spring portion 67 of the pressing force relaxing frame 65 is pressed against the peripheral edge of the anisotropic conductive film 10A of the anisotropic conductive connector 10, the anisotropic conductive film 10A Due to the rubber elasticity, the pressing force of the electrode to be inspected on the anisotropic conductive film 10A is further reduced. Therefore, the conductive path forming portion 11 of the anisotropic conductive film 10A can have stable conductivity over a longer period.
Further, the magnitude of the impact applied to the anisotropic conductive film 10A by the electrode to be inspected can be reduced by the spring elasticity of the plate spring portion 67 of the pressing force relaxing frame 65, so that the damage of the anisotropic conductive film 10A or other Failure can be prevented or suppressed, and when the pressing force applied to the anisotropic conductive film 10A is released, the circuit device 1 is caused to have an anisotropic conductive film by the spring elasticity of the plate spring portion 67 of the pressing force reducing frame 65. Since the circuit device 1 is easily separated from the circuit device 10A, the operation of replacing the circuit device 1 for which inspection has been completed with a circuit device which has not been inspected can be performed smoothly, and as a result, the inspection efficiency of the circuit device can be improved.
[0062]
(9) The pressing force relaxing frame is not limited to the one shown in FIG.
For example, as shown in FIG. 23, in the pressing force relaxing frame 65, the size of the opening 66 may be larger than the size of the anisotropic conductive film 10 </ b> A in the anisotropic conductive connector 10.
Further, as shown in FIG. 24, the pressurizing force reducing frame 65 has a size of the opening 66 larger than a size of the anisotropic conductive film 10A in the anisotropic conductive connector 10 and a tip of the leaf spring portion 67 supporting the supporting member. The anisotropically conductive connector 10 may be an electrode to be inspected with respect to the anisotropically conductive film 10 </ b> A of the anisotropically conductive connector 10 only by the spring elasticity of the leaf spring portion 67. The pressing force of the solder ball electrode 2 is reduced.
Further, as shown in FIG. 25, the pressing force relaxing frame 65 may be made of a rubber sheet. According to such a configuration, the rubber elasticity of the pressing force relaxing frame 65 causes the anisotropic conductive connector The pressing force of the solder ball electrode 2, which is the electrode to be inspected, on the ten anisotropic conductive films 10A is reduced.
Further, as shown in FIG. 26, the pressing force relaxing frame 65 may be a plate-shaped member having neither spring elasticity nor rubber elasticity. By selecting an appropriate thickness, it is possible to adjust the pressing force of the solder ball electrode 2, which is the electrode to be inspected, on the anisotropic conductive film 10A of the anisotropic conductive connector 10.
(10) In the circuit device inspection apparatus of the present invention, a flexible insulating sheet made of a resin material is pierced in the thickness direction between the anisotropic conductive connector 10 and the circuit device 1 to be inspected. A sheet-like connector in which a plurality of extending metal electrode bodies are arranged may be arranged.
According to such a configuration, the electrical connection between the conductive path forming portion 11 of the anisotropic conductive film 10A and the electrode to be inspected of the circuit device is achieved via the metal electrode body of the sheet connector, and the electrode to be inspected is Since there is no contact with the conductive path forming portion 11, it is possible to reliably prevent the electrode material of the electrode to be inspected from migrating to the conductive particles of the conductive path forming portion.
In a configuration having a sheet-like connector, the sheet-like connector can be provided integrally with the anisotropic conductive film 10 </ b> A of the anisotropic conductive connector 10.
Examples of the method of integrally providing the sheet-like connector on the anisotropic conductive film 10A include a method of arranging the sheet-like connector in a mold and curing the molding material layer when forming the anisotropic conductive film 10A; A method of bonding the conductive film 10A and the sheet-like connector with an adhesive or the like can be used.
[0063]
【Example】
Hereinafter, specific examples of the present invention will be described, but the present invention is not limited to the following examples.
[0064]
(Addition type liquid silicone rubber)
In the following Examples and Comparative Examples, a two-pack type having the properties shown in Table 1 below was used as the addition-type liquid silicone rubber.
[0065]
[Table 1]

[0066]
The properties of the addition type liquid silicone rubber shown in Table 1 above were measured as follows.
(1) Viscosity of addition type liquid silicone rubber:
The viscosity at 23 ± 2 ° C. was measured with a B-type viscometer.
(2) Compression set of cured silicone rubber:
The liquid A and the liquid B in the two-part addition type liquid silicone rubber were stirred and mixed at an equal ratio. Next, the mixture was poured into a mold, and the mixture was subjected to a defoaming treatment under reduced pressure, and then subjected to a curing treatment at 120 ° C. for 30 minutes, so that the mixture had a thickness of 12.7 mm and a diameter of 29 mm. A cylinder made of a cured silicone rubber was produced, and post-curing was performed on the cylinder at 200 ° C. for 4 hours. Using the thus obtained cylinder as a test piece, the compression set at 150 ± 2 ° C. was measured in accordance with JIS @ K # 6249.
(3) Tear strength of cured silicone rubber:
By subjecting the addition type liquid silicone rubber to a curing treatment and post-curing under the same conditions as in (2) above, a sheet having a thickness of 2.5 mm was produced. A crescent-shaped test piece was prepared from the sheet by punching, and the tear strength at 23 ± 2 ° C. was measured in accordance with JIS K6249.
(4) Durometer hardness of cured silicone rubber:
Five sheets prepared in the same manner as in the above (3) were stacked, and the obtained stack was used as a test piece, and the durometer A hardness at 23 ± 2 ° C. was measured according to JIS @ K6249.
[0067]
<Example 1>
(A) Preparation of support and mold:
Under the following conditions, a support having a configuration shown in FIG. 4 and a mold for forming an anisotropic conductive film having a configuration shown in FIG. 6 were produced.
(Support)
The support (71) is made of SUS304, has a thickness of 0.1 mm, an opening (73) of 17 mm × 10 mm, and has positioning holes (72) at four corners.
〔Mold〕
The ferromagnetic substrate (51, 56) is made of iron and has a thickness of 6 mm.
The ferromagnetic layers (52, 57) are made of nickel, have a diameter of 0.45 mm (circular), a thickness of 0.1 mm, an arrangement pitch (center-to-center distance) of 0.8 mm, and have a number of ferromagnetic layers of The number is 288 (12 × 24).
The non-magnetic layer (53, 58) is made of a hardened dry film resist, and the non-magnetic layer (53) of the upper mold (50) has a portion (53a) having a thickness of 0.2 mm. The thickness of the portion (53b) is 0.1 mm, and the thickness of the nonmagnetic layer (58) of the lower mold (55) is 0.15 mm.
The vertical and horizontal dimensions of the molding space (59) formed by the mold are 20 mm × 13 mm.
[0068]
(B) Preparation of molding material:
To 100 parts by weight of the addition type liquid silicone rubber (5), 60 parts by weight of conductive particles having an average particle diameter of 30 μm are added and mixed, and then the first molding material is subjected to defoaming treatment under reduced pressure. Prepared. In the above, as the conductive particles, those obtained by applying gold plating to core particles made of nickel (average coating amount: 20% by weight of the weight of the core particles) were used.
Also, 60 parts by weight of conductive particles having an average particle diameter of 30 μm are added to 100 parts by weight of the addition-type liquid silicone rubber (2), mixed, and then subjected to a defoaming treatment under reduced pressure, thereby performing the second molding. Materials were prepared. In the above, as the conductive particles, those obtained by applying gold plating to core particles made of nickel (average coating amount: 20% by weight of the weight of the core particles) were used.
[0069]
(C) Formation of anisotropic conductive film:
The first molding material thus prepared was applied to the molding surface of the upper mold (50) by screen printing to form a first molding material layer (61a) having a thickness of 0.1 mm.
Further, a spacer (54b) having a thickness of 0.1 mm is positioned and arranged on the molding surface of the lower mold (55) of the mold, and the support (71) is placed on the spacer (54b). ), And a spacer (54a) having a thickness of 0.1 mm is aligned and disposed on the support (71), and the prepared third molding material is applied by screen printing. As a result, a second molding material layer (61b) having a thickness of 0.4 mm was formed in the space formed by the lower mold (55), the spacers (54a, 54b), and the support (71).
Then, the first molding material layer (61a) formed on the upper mold (50) and the second molding material layer (61b) formed on the lower mold (55) were aligned and overlapped.
Then, for each molding material layer formed between the upper mold (50) and the lower mold (55), a portion of 2T in the thickness direction is placed between the ferromagnetic layers (52, 57) in the thickness direction by an electromagnet. The anisotropic conductive film (10A) was formed by performing a curing treatment at 100 ° C. for one hour while applying a magnetic field.
As described above, the anisotropic conductive connector (10) according to the present invention was manufactured.
Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector B1”.
[0070]
<Example 2>
An anisotropic conductive connector was manufactured in the same manner as in Example 1 except that in the preparation of the first molding material, the addition type liquid silicone rubber (4) was used instead of the addition type liquid silicone rubber (5). .
Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector B2”.
[0071]
<Example 3>
An anisotropic conductive connector was manufactured in the same manner as in Example 1 except that in the preparation of the second molding material, the addition type liquid silicone rubber (1) was used instead of the addition type liquid silicone rubber (2). .
Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector B3”.
[0072]
<Example 4>
An anisotropic conductive connector was manufactured in the same manner as in Example 1 except that in the preparation of the first molding material, the additional liquid silicone rubber (3) was used instead of the additional liquid silicone rubber (5). .
Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector B4”.
[0073]
<Example 5>
An anisotropic conductive connector was manufactured in the same manner as in Example 1 except that in the preparation of the second molding material, the addition type liquid silicone rubber (3) was used instead of the addition type liquid silicone rubber (2). .
Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector B5”.
[0074]
<Comparative Example 1>
An anisotropic conductive connector was manufactured in the same manner as in Example 1 except that in the preparation of the second molding material, the addition type liquid silicone rubber (5) was used instead of the addition type liquid silicone rubber (2). .
Hereinafter, this anisotropically conductive connector is referred to as “anisotropically conductive connector B6”.
[0075]
<Comparative Example 2>
In the preparation of the first molding material, the addition type liquid silicone rubber (4) was used instead of the addition type liquid silicone rubber (5), and in the preparation of the second molding material, the addition type liquid silicone rubber (2) was used instead. An anisotropic conductive connector was manufactured in the same manner as in Example 1 except that the addition type liquid silicone rubber (4) was used.
Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector B7”.
[0076]
<Comparative Example 3>
In the preparation of the first molding material, the addition-type liquid silicone rubber (1) is used instead of the addition-type liquid silicone rubber (5), and in the preparation of the second molding material, the addition-type liquid silicone rubber (2) is used. An anisotropic conductive connector was manufactured in the same manner as in Example 1 except that the addition type liquid silicone rubber (6) was used.
Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector B8”.
[0077]
<Example 6>
To 100 parts by weight of the addition type liquid silicone rubber (5), 60 parts by weight of conductive particles having an average particle diameter of 30 μm are added and mixed, and then the first molding material is subjected to defoaming treatment under reduced pressure. Prepared. Above, as the conductive particles, those obtained by applying gold plating to core particles made of nickel (average coating amount: 20% by weight of the weight of the core particles) were used.
To 100 parts by weight of the addition-type liquid silicone rubber (2), 60 parts by weight of conductive particles having an average particle diameter of 30 μm are added and mixed, and then subjected to a defoaming treatment under reduced pressure, thereby forming a second molding material. Was prepared. Above, as the conductive particles, those obtained by applying gold plating to core particles made of nickel (average coating amount: 20% by weight of the weight of the core particles) were used.
[0078]
As shown in FIG. 27, using the mold manufactured in Example 1, the dimensions are 13 mm × 13 mm × 0.1 mm, and the center is 9.5 mm × 9 in the recess (60) of the upper mold (50). A first molding material having a thickness of 0.1 mm is formed by disposing a spacer (54c) having an opening of 0.5 mm and applying the prepared first molding material to the surface of the upper mold (50) by screen printing. A material layer (61a) was formed.
Further, a spacer (54b) having a thickness of 0.1 mm is positioned and arranged on the molding surface of the lower mold (55) of the mold, and the support (71) is placed on the spacer (54b). ), And a spacer (54a) having a thickness of 0.1 mm is further aligned on the support (71), and the prepared second molding material is applied by screen printing. Thereby, the space formed by the lower mold (55), the spacers (54a, 54b) and the support (71) is filled with the second molding material, and further, as shown in FIG. 28, on the spacer (54a). A spacer (54d) having dimensions of 18 mm x 18 mm x 5 mm and having a central opening of 9.5 mm x 9.5 mm is arranged, and the second molding material is applied to the spacer (54d) by screen printing. By filling the second molding material into the opening, the maximum thickness was formed the second molding material layer of 0.85mm and (61b).
Then, the first molding material layer (61a) formed on the upper mold (50) and the second molding material layer (61b) formed on the lower mold (55) are aligned and overlapped, and the upper mold ( With respect to each molding material layer formed between the lower mold (50) and the lower mold (55), a magnetic field of 2T is applied in a thickness direction by an electromagnet to a portion located between the ferromagnetic layers (52, 57). An anisotropic conductive film (10A) was formed by performing a curing treatment at 100 ° C. for 1 hour.
As described above, the anisotropic conductive connector (10) according to the present invention was manufactured.
Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector C1”.
[0079]
<Example 7>
In the preparation of the first molding material, in the same manner as in Example 6, except that 30 parts by weight of diamond powder having an average particle diameter of 16.2 μm was added to the addition-type liquid silicone rubber (5) together with the conductive particles. An anisotropic conductive connector was manufactured.
Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector C2”.
[0080]
<Example 8>
An anisotropic conductive connector was manufactured in the same manner as in Example 6, except that in the preparation of the first molding material, the addition type liquid silicone rubber (3) was used instead of the addition type liquid silicone rubber (5). .
Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector C3”.
[0081]
<Example 9>
In the preparation of the first molding material, an addition type liquid silicone rubber (3) is used instead of the addition type liquid silicone rubber (5), and the addition type liquid silicone rubber (3) has an average particle diameter together with conductive particles. An anisotropic conductive connector was produced in the same manner as in Example 6, except that 30 parts by weight of 16.2 μm diamond powder was added.
Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector C4”.
[0082]
<Comparative Example 4>
In the preparation of the first molding material, the addition-type liquid silicone rubber (1) is used instead of the addition-type liquid silicone rubber (5), and in the preparation of the second molding material, the addition-type liquid silicone rubber (2) is used. An anisotropic conductive connector was manufactured in the same manner as in Example 6, except that the addition type liquid silicone rubber (6) was used.
Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector C5”.
[0083]
<Comparative Example 5>
In the preparation of the first molding material, the addition-type liquid silicone rubber (1) was used instead of the addition-type liquid silicone rubber (5), and the addition-type liquid silicone rubber (3) was further added with the conductive particles and the average particles. Except that 30 parts by weight of a diamond powder having a diameter of 16.2 μm were added, and an additional liquid silicone rubber (6) was used instead of the additional liquid silicone rubber (2) in the preparation of the second molding material. An anisotropic conductive connector was manufactured in the same manner as in Example 6.
Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector C6”.
[0084]
[Evaluation of anisotropic conductive connectors]
The performance evaluation of the anisotropic conductive connectors according to Examples 1 to 9 and Comparative Examples 1 to 5 was performed as follows.
In order to evaluate the anisotropic conductive connectors B1 to B8 according to Examples 1 to 5 and Comparative Examples 1 to 3, test circuit devices 3 as shown in FIGS. 29 and 30 were prepared.
The test circuit device 3 has a total of 72 solder ball electrodes 2 (material: 64 solder) having a diameter of 0.4 mm and a height of 0.3 mm, and each of the solder ball electrodes 2 has 36 solder ball electrodes. 2 are formed. In each of the electrode groups, a total of two rows in which 18 solder ball electrodes 2 are linearly arranged at a pitch of 0.8 mm are formed. Of the solder ball electrodes are electrically connected to each other by wiring 8 in the circuit device 3. The total number of wirings in the circuit device 3 is 36.
[0085]
Further, in order to evaluate the anisotropic conductive connectors C1 to C6 according to Examples 6 to 9 and Comparative Examples 4 and 5, test circuit devices 3 as shown in FIGS. 31 and 32 were prepared.
The test circuit device 3 has a total of 32 solder ball electrodes 2 (material: 64 solder) having a diameter of 0.4 mm and a height of 0.3 mm, and each of the solder ball electrodes 2 has 16 solder ball electrodes. 2 are formed. In each electrode group, a total of two rows in which eight solder ball electrodes 2 are linearly arranged at a pitch of 0.8 mm are formed. Of the solder ball electrodes are electrically connected to each other by wiring 8 in the circuit device 3. The total number of wirings in the circuit device 3 is 16.
[0086]
Then, the anisotropic conductive connectors according to Examples 1 to 9 and Comparative Examples 1 to 5 were evaluated using each of the test circuit devices as follows.
[0087]
《Repeat durability》
As shown in FIG. 33, the guide pins 9 of the test circuit board 5 are inserted into the positioning holes of the support 71 of the anisotropic conductive connector 10 so that the anisotropic conductive connector 10 is connected to the test circuit board 5. The circuit device 3 for testing is placed on the anisotropic conductive connector 10 and fixed by a pressing jig (not shown). Placed within.
Next, the temperature in the thermostatic bath 7 is set to 100 ° C., and the strain rate of the conductive path forming portion 11 of the anisotropic conductive film 10A in the anisotropic conductive connector 10 is 30% by the pressurizing jig. The anisotropic conductive connector 10, the test circuit device 3, and the inspection circuit board 5 are repeatedly pressed so as to have a thickness of the conductive path forming portion of 0.35 mm) at a pressure cycle of 5 seconds / stroke. Between the external electrode (not shown) of the test circuit board 5 electrically connected to each other via the test electrode 6 and its wiring (not shown) by the DC power supply 115 and the constant current controller 116. Was applied at all times, and the voltage between the external terminals of the inspection circuit board 5 during pressurization was measured by the voltmeter 110.
[0088]
The voltage value (V) measured in this manner is expressed as V₁And the applied DC current is I₁(= 10 mA), the electric resistance R₁I asked.
Here, the electric resistance value R₁Includes the electric resistance between the electrodes of the test circuit device 3 and the electric resistance between the external terminals of the test circuit board, in addition to the electric resistance of the two conductive path forming portions.
And the electric resistance value R₁Is larger than 2Ω, it is practically difficult to conduct an electrical inspection of the circuit device.₁The voltage measurement was continued until was greater than 2Ω. However, the pressing operation was performed 100,000 times in total. Table 2 shows the results.
[0089]
(Equation 1)
R₁= V₁/ I₁
[0090]
Further, the anisotropic conductive connectors according to Examples 6 to 9 and Comparative Examples 4 and 5 are shown in FIG. 20 manufactured between the anisotropic conductive connector and the test circuit board under the following conditions. Electric resistance R₁I asked. Table 2 shows the results.
The pressing force relaxing frame is a rectangular plate having a size of 24 mm × 30 mm × 1 mm, an opening (73) having a size of 20 mm × 20 mm, and a plate spring (67) having a size of 5 mm × 9 mm ×. 1 mm, the protruding height of the tip of the leaf spring part (67) is 3 mm, and it has positioning holes (72) at four corners.
[0091]
After these tests were completed, the deformed state of the conductive path forming portion and the state of the transfer of the electrode substance to the conductive particles were evaluated for each anisotropic conductive connector according to the following criteria. Table 3 shows the results.
Deformed state of conductive path forming part:
The surface of the conductive path forming portion was visually observed, and a case where little deformation occurred was evaluated as ○, a case where fine deformation was recognized as Δ, and a case where large deformation was recognized as x.
Migration state of electrode substance to conductive particles:
The color of the conductive particles in the conductive path forming portion was visually observed, and the evaluation was evaluated as ○ when little discoloration occurred, Δ when slightly discolored gray, and X when discolored almost gray or black.
[0092]
《Adhesion to circuit board》
100 anisotropic conductive connectors according to Examples 1 to 9 and Comparative Examples 1 to 5 were prepared, and a pressure test was performed on these anisotropic conductive connectors in the same manner as in the above-described repetition durability test. Thereafter, the state of adhesion of the anisotropic conductive film to the test circuit device is examined. The case where the number of the bonded anisotropic conductive films is less than 30% is indicated by ○, the case of 30 to 70% is indicated by Δ, and the case of exceeding 70% is indicated by ×. evaluated. Table 3 shows the results.
[0093]
[Table 2]

[0094]
[Table 3]

[0095]
【The invention's effect】
According to the anisotropic conductive connector of the present invention, since the durometer hardness of the elastic polymer material constituting one of the elastic layers forming the surface of the anisotropic conductive film is 30 or more, the connection target electrode Even if is a protrusion, permanent deformation due to pressure contact of the connection target electrode and deformation due to wear can be suppressed. Moreover, since the durometer hardness of the elastic polymer material forming the other elastic layer is sufficiently lower than that of the elastic polymer material forming the one elastic layer, the conductive path forming portion is pressed. Thereby, required conductivity can be reliably obtained. Therefore, even if repeatedly pressed by the connection target electrode, stable conductivity can be obtained for a long period of time.
[0096]
Also, since the one elastic layer contains particles that do not exhibit conductivity and magnetism, the hardness of the one elastic layer increases, so that permanent deformation due to pressure welding of the connection target electrode or deformation due to wear is caused. Can be further suppressed, and since the electrode material is prevented or suppressed from migrating to the conductive particles in the anisotropic conductive film, more stable conductivity can be obtained for a long period of time, and Even when used in a state of being pressed against a circuit device under a high-temperature environment, it is possible to prevent or suppress adhesion to the circuit device.
[0097]
According to the method for manufacturing an anisotropic conductive connector of the present invention, the molding material layer formed on the molding surface of one mold and the molding material layer formed on the molding surface of the other mold are stacked. Advantageously and reliably manufacturing an anisotropically conductive connector having an anisotropically conductive film in which two or more elastic layers having different hardnesses are integrally laminated, since each molding material layer is cured in a state. Can be.
[0098]
According to the circuit device inspection apparatus of the present invention, since the above-described anisotropic conductive connector is provided, even if the electrode to be inspected has a protruding shape, permanent deformation due to pressure contact of the electrode to be inspected can be prevented. In addition, since deformation due to wear is suppressed, stable conductivity can be obtained for a long period of time even when a large number of circuit devices are continuously tested.
Further, according to the inspection apparatus for a circuit device of the present invention, in addition to the anisotropic conductive connector described above, the electrical inspection of the circuit device can be performed without using a sheet-like connector. When not used, since the alignment between the anisotropically conductive connector and the sheet-like connector is unnecessary, it is possible to avoid the problem of misalignment between the sheet-like connector and the anisotropically conductive connector due to a temperature change, Moreover, the configuration of the inspection device is easy.
In addition, by providing a pressing force relaxation frame between the circuit device to be inspected and the anisotropic conductive connector, the pressing force of the electrode to be inspected against the anisotropic conductive film of the anisotropic conductive connector is reduced. Stable conductivity can be obtained for a longer period.
In addition, by using a frame having spring elasticity or rubber elasticity as the pressing force relaxing frame, the magnitude of the impact applied to the anisotropic conductive film by the electrode to be inspected can be reduced. Other failures can be prevented or suppressed, and when the pressing force on the anisotropic conductive film is released, the circuit device is easily separated from the anisotropic conductive film by the spring elasticity of the pressing force relaxing frame. In addition, the operation of replacing a circuit device that has been inspected with a circuit device that has not been inspected can be performed smoothly, and as a result, the inspection efficiency of the circuit device can be improved.
[Brief description of the drawings]
FIG. 1 is a plan view showing an example of the anisotropic conductive connector of the present invention.
FIG. 2 is a sectional view of the anisotropic conductive connector shown in FIG.
FIG. 3 is an explanatory sectional view showing a part of the anisotropic conductive connector shown in FIG. 1 in an enlarged manner.
FIG. 4 is a plan view of a support in the anisotropic conductive connector shown in FIG.
5 is a cross-sectional view of the support shown in FIG. 4, taken along line BB.
FIG. 6 is an explanatory cross-sectional view illustrating a configuration of an example of a mold for forming an anisotropic conductive film.
FIG. 7 is an explanatory sectional view showing a state in which a spacer and a support are arranged on a molding surface of a lower mold.
FIG. 8 is an explanatory sectional view showing a state in which a first molding material layer is formed on a molding surface of an upper mold and a second molding material layer is formed on a molding surface of a lower mold.
FIG. 9 is an explanatory sectional view showing a state in which a first molding material layer and a second molding material layer are laminated.
FIG. 10 is an explanatory sectional view showing a state in which an anisotropic conductive film is formed.
FIG. 11 is an explanatory diagram showing a configuration of an example of a circuit device inspection apparatus of the present invention together with a circuit device.
FIG. 12 is an explanatory diagram showing a configuration of an example of a circuit device inspection apparatus of the present invention together with other circuit devices.
FIG. 13 is an explanatory cross-sectional view showing a first modified example of the anisotropic conductive film.
FIG. 14 is an explanatory cross-sectional view showing a second modification of the anisotropic conductive film.
FIG. 15 is an explanatory cross-sectional view showing a third modification of the anisotropic conductive film.
FIG. 16 is an explanatory sectional view showing a fourth modification of the anisotropic conductive film.
FIG. 17 is an explanatory cross-sectional view showing a fifth modification of the anisotropic conductive film.
FIG. 18 is an explanatory sectional view showing a sixth modification of the anisotropic conductive film.
FIG. 19 is an explanatory sectional view showing a seventh modification of the anisotropic conductive film.
FIG. 20 is an explanatory diagram showing a configuration of a first example of an inspection device including a pressing force relaxing frame.
FIGS. 21A and 21B are explanatory views showing a pressing force relaxing frame, wherein FIG. 21A is a plan view and FIG. 21B is a side view.
FIG. 22 is an explanatory diagram showing a state where the circuit device is pressurized in the inspection device shown in FIG. 20;
FIG. 23 is an explanatory diagram showing a configuration of a second example of the inspection device including the pressing force relaxing frame.
FIG. 24 is an explanatory diagram showing a configuration of a main part in a third example of the inspection device including the pressing force relaxing frame.
FIG. 25 is an explanatory diagram showing a configuration of a main part in a fourth example of the inspection device including the pressing force relaxing frame.
FIG. 26 is an explanatory diagram showing a configuration of a main part in a fifth example of the inspection device including the pressing force relaxing frame.
FIG. 27 is an explanatory cross-sectional view showing a state in which a first molding material layer is formed on a molding surface of an upper mold and a second molding material is applied on a molding surface of a lower mold in Example 6. .
FIG. 28 is an explanatory cross-sectional view showing a state where a second molding material layer is formed on the molding surface of the lower die in Example 6.
FIG. 29 is a plan view of a test circuit device used in the example.
FIG. 30 is a side view of a test circuit device used in the example.
FIG. 31 is a plan view of another test circuit device used in the example.
FIG. 32 is a side view of another test circuit device used in the example.
FIG. 33 is an explanatory view showing a schematic configuration of a test apparatus for repeated durability used in Examples.
FIG. 34 is an explanatory sectional view showing an eighth modification of the anisotropic conductive film.
FIG. 35 is an explanatory sectional view showing a ninth modification of the anisotropic conductive film.
FIG. 36 is an explanatory sectional view showing a tenth modified example of the anisotropic conductive film.
[Explanation of symbols]
1 Circuit device
2 Solder ball electrode
3) Circuit device for test
5 Inspection circuit board
6 Inspection electrode
7 constant temperature bath
8 wiring
9 guide pin
10mm anisotropic conductive connector
10A anisotropic conductive film
10B One elastic layer
10C @ the other elastic layer
10D intermediate elastic layer
11 Conduction path forming part
11a Projection
12 Effective conductive path forming part
13 invalid conductive path forming part
15 insulation
16 recess
17mm through hole
50mm upper type
51 ferromagnetic substrate
52 ferromagnetic layer
53 non-magnetic layer
54a, 54b, 54c, 54d spacer
55 ° lower mold
56 ferromagnetic substrate
57 ° ferromagnetic layer
57a Concave space
58 ° non-magnetic layer
59 molding space
60 ° recess
61a first molding material layer
61b second molding material layer
65 pressure relief frame
66 ° opening
67mm leaf spring
68 positioning hole
71 support
72 positioning hole
73 ° opening
80B, 80C, 80D reinforcing material
110 ° voltmeter
115 DC power supply
116 ° constant current controller

Claims (13)

An anisotropically conductive connector having an anisotropically conductive film, wherein a plurality of conductive path forming portions each extending in a thickness direction are arranged in a state insulated from each other by an insulating portion,
The anisotropic conductive film is formed by integrally laminating at least two elastic layers, each of which is formed of an insulating elastic polymer material. Each of these elastic layers forms a conductive path forming portion. , the conductive particles exhibiting magnetism are contained, the durometer hardness of the elastic polymeric substance forming one of the elastic layer of the elastic layer that forms the surface of the anisotropically conductive film and H _1, the other when the durometer hardness of the elastic polymeric substance forming the elastic layer was H _2, the anisotropic conductive connector and satisfies the following condition (1) and condition (2).
Condition (1): H ₁ ≧ 30
Condition (2): H ₁ / H ₂ ≧ 1.1 The anisotropic conductive connector according to claim 1, wherein the following condition (3) is satisfied.
Condition (3): 15 ≦ H ₂ ≦ 55 The anisotropically conductive connector according to claim 1 or 2, further comprising a support for supporting a peripheral portion of the anisotropically conductive film. An anisotropic conductive connector interposed between a circuit device to be inspected and a circuit board for inspection for electrically connecting an electrode to be inspected of the circuit device and an inspection electrode of the circuit board, ,
Elastic polymeric substance forming the elastic layer in contact with the circuit device in the anisotropically conductive film is claimed, characterized in that the durometer hardness is achieved, thereby satisfying the H ₁ under the condition (1) and Condition (2) The anisotropic conductive connector according to any one of claims 1 to 3. The anisotropically conductive connector according to claim 4, wherein the elastic layer in the anisotropically conductive film that comes into contact with the electrode to be inspected contains particles that do not exhibit conductivity and magnetism. The anisotropically conductive connector according to claim 5, wherein the particles having no conductivity and magnetism are diamond powder. In the anisotropic conductive film, a conductive path forming portion that is not electrically connected to the electrode to be inspected is formed in addition to the conductive path forming portion that is electrically connected to the electrode to be inspected of the circuit device to be inspected. The anisotropic conductive connector according to any one of claims 3 to 6, wherein: 8. The method according to claim 7, wherein the conductive path forming portion that is not electrically connected to the electrode to be inspected of the circuit device to be inspected is formed at least at a peripheral portion of the anisotropic conductive film supported by the support. An anisotropic conductive connector as described. 9. The anisotropically conductive connector according to claim 7, wherein the conductive path forming portions are arranged at a constant pitch. A method for manufacturing an anisotropic conductive connector having an anisotropic conductive film, wherein a plurality of conductive path forming portions each extending in a thickness direction are arranged in a state insulated from each other by an insulating portion,
Prepare a mold for forming an anisotropic conductive film in which a molding space is formed by a pair of molds,
On the molding surface of one mold, a paste-like molding material layer containing conductive particles exhibiting magnetism in the polymer substance-forming material is formed, and on the molding surface of the other mold, the polymer substance is formed. Forming material contains conductive particles, forming at least one or more paste-like molding material layer,
The molding material layer formed on the molding surface of the one mold and the molding material layer formed on the molding surface of the other mold are stacked, and then, in the thickness direction of each molding material layer, the strength distribution is increased. Having a step of forming an anisotropic conductive film by applying a magnetic field having the same, and curing each molding material layer,
The durometer hardness of the elastic polymeric substance obtained by curing the polymeric substance-forming material in the molding material layer formed on the molding surface of the one mold and H _1, are formed on the molding surface of the other mold when the durometer hardness of the elastic polymeric substance obtained by curing the polymeric substance-forming material in the molding material layers was with H ₂ was, and satisfies the following condition (1) and condition (2) A method for manufacturing an anisotropic conductive connector.
Condition (1): H ₁ ≧ 30
Condition (2): H ₁ / H ₂ ≧ 1.1 An inspection circuit board having an inspection electrode arranged corresponding to an electrode to be inspected of a circuit device to be inspected,
10. An inspection apparatus for a circuit device, comprising: the anisotropic conductive connector according to claim 3 disposed on the inspection circuit board. The pressure-relief frame for relieving the pressure of the electrode to be inspected with respect to the anisotropic conductive film of the anisotropic conductive connector is disposed between the circuit device to be inspected and the anisotropic conductive connector. The circuit device inspection apparatus according to claim 11, wherein The inspection apparatus for a circuit device according to claim 12, wherein the pressing force relaxing frame has spring elasticity or rubber elasticity.

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