JP2002170608A - Anisotropic conductive sheet, manufacturing method of the same, and applied product using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an anisotropic conductive sheet keeping a necessary conductivity for long time, with durability and thermal durability for repeated usage and long life, even when repeatedly used for many times, or when used in an environment of high temperature, and to provide a manufacturing method of the same, and an applied product using the same. SOLUTION: The anisotropic conductive sheet is composed of an elastic polymer substance with the durometer hardness of 20-90 containing conductive particles with magnetic property in the state of orientating in the direction of thickness, and a lubricant or a release agent is applied on the surface of conductive particles. The manufacturing method of the anisotropic conduction sheet is constituted with the process of applying the lubricant or the release agent on the surface of the conductive particles with magnetic property, and the process of forming a sheet forming material layer made of a fluid elastic polymer substance including the conductive particles, which becomes the elastic polymer substance by heat treatment, and the process of applying a magnetic field in the direction of the thickness and applying a heat treatment.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive material which is preferably used as an electrical connection between circuit devices such as electronic parts and a connector in an inspection device for circuit devices such as printed circuit boards and semiconductor integrated circuits. The present invention relates to a sheet, a production method thereof, and an application product thereof.

[0002]

2. Description of the Related Art An anisotropic conductive sheet is a sheet having conductivity only in a thickness direction or a sheet having a pressurized conductive portion which is conductive only in the thickness direction when pressed in the thickness direction. Yes, compact electrical connection can be achieved without using means such as soldering or mechanical fitting, and soft connection is possible by absorbing mechanical shock and strain. Utilizing such features, circuit devices such as printed circuit boards and leadless chip carriers, liquid crystal panels, etc. can be used in fields such as electronic calculators, electronic digital watches, electronic cameras, and computer keyboards. It is widely used as a connector for achieving an electrical connection between the two.

In an electrical inspection of a circuit device such as a printed circuit board or a semiconductor integrated circuit, an electrode to be inspected formed on one surface of a circuit device to be inspected and an electrode formed on the surface of the inspection circuit substrate. In order to achieve electrical connection with the test electrode, an anisotropic conductive sheet is interposed between the test electrode region of the circuit device and the test electrode region of the test circuit board. .

Conventionally, as such an anisotropic conductive sheet, those having various structures are known.
Japanese Patent Application Laid-Open No. 1-93393 discloses an anisotropic conductive sheet obtained by uniformly dispersing metal particles in an elastomer. By distributing unevenly in the elastomer, a number of conductive path forming portions extending in the thickness direction,
An anisotropic conductive sheet having an insulating portion for insulating them from each other is disclosed.
No. 06 discloses an anisotropic conductive sheet in which a step is formed between the surface of a conductive path forming portion and an insulating portion. In these anisotropic conductive sheets, as shown in FIG. 17, the conductive particles P are aligned in a thickness direction in a base material made of an elastic polymer substance E so that a chain C is formed. In addition, it is contained in a state of being integrally adhered to the elastic polymer substance E.

[0005]

However, the conventional anisotropic conductive sheet has the following problems. In the electrical inspection of the circuit device, as shown in FIG. 18, one surface of the anisotropic conductive sheet, for example, one end surface of the conductive path forming portion,
An electrode 91 to be inspected of a circuit device to be inspected (hereinafter, also referred to as a “inspected circuit device”) 90 is brought into contact with the circuit device 90.
The inspection electrode 96 of the inspection circuit board 95 is brought into contact with the other surface of the anisotropic conductive sheet, for example, the other end surface of the conductive path forming portion, and is further pressed in the thickness direction of the anisotropic conductive sheet, thereby forming a cover. Electrical connection between the electrode 91 to be inspected of the inspection circuit device 90 and the inspection electrode 96 of the inspection circuit board 95 is achieved. At this time, in the anisotropic conductive sheet, the elastic polymer material E constituting the base material is pressed in the thickness direction by being sandwiched between the electrode to be inspected of the circuit device to be inspected and the inspection electrode of the inspection circuit board. While being compressed and deformed, the conductive particles P move and the chain C changes from a linear form extending in the thickness direction to a complicated form, and the elastic polymer substance E and the conductive particles P are integrated. Due to the close contact, the peripheral portion of the conductive particles P in the elastic polymer substance E is deformed into a complicated form as the conductive particles P move.

As described above, in the conventional anisotropic conductive sheet, every time the sheet is nipped in the thickness direction, the peripheral portion of the conductive particles P in the elastic polymer material E constituting the base material is Since not only the compressive force in the thickness direction but also a complicated and considerably large stress is applied by the movement of the conductive particles, when used repeatedly, the peripheral portion of the conductive particles P in the elastic polymer substance E deteriorates. As a result, the electrical resistance in the thickness direction increases, so that the required conductivity cannot be maintained, and a long service life cannot be obtained.

In electrical inspection of circuit devices such as a semiconductor integrated circuit and a printed circuit board, tests in a high-temperature environment such as a burn-in test and a heat cycle test are performed in order to develop a potential defect of the circuit device. Is Thus, the elastic polymer substance E constituting the base material of the anisotropic conductive sheet has a large thermal expansion coefficient, and tends to expand significantly when exposed to a high-temperature environment. for that reason,
In a state where the anisotropic conductive sheet is pressed in the thickness direction, that is, in a state where the peripheral portion of the conductive particles P in the elastic polymer material E constituting the base material is deformed into a complicated form, the anisotropic conductive sheet is pressed. When the temperature around is increased, a greater stress is applied to the peripheral portion of the conductive particles P in the elastic polymer substance E. Therefore, if the test under such a high temperature environment is repeatedly performed, Elastic polymer substance E
As a result, the peripheral portion of the conductive particles P deteriorates early, so that the required conductivity is not maintained, and the service life is further shortened.

[0008] The present invention has been made in view of the above circumstances, and a first object of the present invention is to provide a semiconductor device which can be used repeatedly even if it is used many times or under a high temperature environment. An object of the present invention is to provide an anisotropic conductive sheet which can maintain required conductivity for a long period of time, and thus has high durability and thermal durability in repeated use and a long service life. A second object of the present invention is to provide a method capable of producing an anisotropic conductive sheet having high durability and thermal durability in repeated use and a long service life.
A third object of the present invention is to provide an anisotropic conductive sheet that has high durability and thermal durability in repeated use and a long service life, and can perform inspection of a circuit device with high efficiency. Moreover, an object of the present invention is to provide a circuit device inspection adapter in which a good electrical connection state is stably maintained even when a temperature changes. A fourth object of the present invention is to provide a circuit which has an anisotropic conductive sheet which has high durability and thermal durability in repeated use and can obtain a long service life, and which can execute a circuit device inspection with high efficiency. An object of the present invention is to provide a device inspection device. A fifth object of the present invention is to
An object of the present invention is to provide an electronic component mounting structure capable of stably maintaining a good electrical connection state for a long period of time.

[0009]

Means for Solving the Problems The anisotropic conductive sheet of the present invention is an anisotropic conductive sheet in which conductive particles exhibiting magnetism are contained in an elastic polymer material in a state oriented in the thickness direction. The elastic polymer material has a durometer hardness of 2
0 to 90, wherein a lubricant or a release agent is applied to the surface of the conductive particles.

[0010] In the anisotropic conductive sheet of the present invention, the amount of the lubricant or release agent applied to the surface of the conductive particles is determined when the number average particle diameter of the conductive particles is Dn (μm). 10 / Dn with respect to 100 parts by mass of the conductive particles.
It is preferable that it is 150 / Dn mass parts. Also,
In the anisotropic conductive sheet of the present invention, the lubricant or the release agent applied to the surface of the conductive particles preferably contains silicone oil. In the above-described anisotropic conductive sheet, it is preferable that the silicone oil has a fluorine atom in its molecule. In the anisotropic conductive sheet of the present invention, it is preferable that the lubricant or the release agent applied to the surface of the conductive particles is a fluorine-based lubricant or a release agent. Further, the anisotropic conductive sheet of the present invention comprises a plurality of conductive path forming portions each containing a conductive particle densely and extending in the thickness direction, and an insulating portion for insulating these conductive path forming portions from each other. You may have.

[0011] The method for producing an anisotropic conductive sheet of the present invention comprises:
A liquid elastic polymer substance in which a lubricant or a release agent is applied to the surface of the conductive particles exhibiting magnetism, and the conductive particles coated with the lubricant or the release agent become an elastic polymer substance by a curing treatment. Forming a sheet forming material layer dispersed in the material for use, applying a magnetic field to the sheet forming material layer in the thickness direction thereof, and curing the sheet forming material layer. I do.

A circuit device inspection adapter according to the present invention comprises: a circuit board for inspection on which a plurality of electrodes for inspection are formed on a surface of the circuit device to be inspected in accordance with a pattern corresponding to an electrode to be inspected; It is characterized by comprising the above-mentioned anisotropic conductive sheet integrally provided on the surface.

In the circuit device inspection adapter of the present invention, it is preferable that at least a part of each of the inspection electrodes on the inspection circuit board is made of a magnetic material.

The inspection apparatus for a circuit device according to the present invention comprises: an inspection circuit board having a plurality of inspection electrodes formed on a surface of the circuit device to be inspected in accordance with a pattern corresponding to an electrode to be inspected;
It is characterized by comprising the above-described anisotropic conductive sheet interposed between the inspection circuit board and the circuit device.

An electronic component mounting structure according to the present invention is characterized in that the electronic component is electrically connected to a circuit board via the anisotropic conductive sheet.

[0016]

According to the anisotropic conductive sheet of the present invention, the surface of the conductive particles is coated with a lubricant or a release agent, so that the conductive particles and the elastic polymer material constituting the base material can be separated. Since the lubricant or the release agent is interposed between the conductive particles and the elastic polymer substance, the conductive particles and the elastic polymer substance do not come into close contact with each other, and become slidable. Therefore, when being pressed in the thickness direction, the peripheral portion of the conductive particles in the elastic polymer material does not deform into a complicated form due to the movement of the conductive particles, and as a result, Since the applied stress is relieved, the required conductivity is maintained for a long period of time even when used repeatedly or when used in a high-temperature environment.

[0017]

Embodiments of the present invention will be described below in detail. <Anisotropic Conductive Sheet> FIG. 1 is a cross-sectional view for explaining the structure of an example of the anisotropic conductive sheet according to the present invention.
The anisotropic conductive sheet 10 is a material in which conductive particles P are contained in a base material made of an elastic polymer material in a state of being oriented so as to be arranged in the thickness direction of the anisotropic conductive sheet 10, When pressed in the thickness direction, a chain of conductive particles P forms a conductive path. In the illustrated example, a plurality of columnar conductive path forming portions 11 each densely filled with the conductive particles P and extending in the thickness direction, and the conductive particles P that insulate the conductive path forming portions 11 from each other are provided. It is constituted by an insulating part 12 which is completely or almost nonexistent. The conductive path forming portions 11 are arranged along the surface according to a pattern corresponding to an electrode to be connected, for example, a pattern of an electrode to be inspected of a circuit device to be inspected, and surround each of these conductive path forming portions 11. An insulating part 12 is formed. In this example, each of the conductive path forming portions 11 is formed so as to protrude from the surface of the insulating portion 12.

In the above description, the thickness of the insulating portion 12 of the anisotropic conductive sheet 10 is 0.03 to 2 mm, particularly 0.04 to 2 mm.
It is preferably 1 mm. Also, the conductive path forming part 11
Of the insulating part 12 from the surface of the insulating part 12
2 is preferably 0.5 to 100% of the thickness, more preferably 1 to 80%, particularly preferably 5 to 50%.
It is. Specifically, the protrusion height is 0.01 to 0.3.
mm, more preferably 0.02 mm.
-0.2 mm, particularly preferably 0.03-0.1 mm. The diameter of the conductive path forming portion 11 is 0.05 to 1 m.
m, particularly preferably 0.1 to 0.5 mm.

The elastic polymer material constituting the base material of the anisotropic conductive sheet 10 has a durometer hardness of 20 to 90, preferably 30 to 70. In the present invention, “durometer hardness” refers to JIS K
Type A based on durometer hardness test of 6253
It is measured by a durometer. When the durometer hardness of the elastic polymer material is less than 20,
When the conductive path forming portion 11 is deformed by being pressed in the thickness direction, the elastic polymer substance cannot hold the conductive particles P, and as a result, a large permanent strain is generated in the conductive path forming portion 11. Therefore, good connection reliability cannot be obtained. On the other hand, when the durometer hardness of the elastic polymer material exceeds 90, when the conductive path forming portion 11 is pressed in the thickness direction, the amount of deformation of the conductive path forming portion 11 in the thickness direction is insufficient. Therefore, good connection reliability cannot be obtained, and connection failure is likely to occur.

As the elastic polymer material constituting the base material of the anisotropic conductive sheet 10, a polymer material having a crosslinked structure is preferable. Various materials can be used as the curable polymer substance material that can be used to obtain the crosslinked polymer substance, and specific examples thereof include polybutadiene rubber, natural rubber, polyisoprene rubber, and styrene- Conjugated diene rubbers such as butadiene copolymer rubber and acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, and block copolymers such as styrene-butadiene-diene block copolymer rubber and styrene-isoprene block copolymer Rubber and hydrogenated products thereof, chloroprene, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, and the like can be given. In the above, when the obtained anisotropic conductive sheet 10 is required to have weather resistance,
It is preferable to use something other than a conjugated diene rubber,
In particular, it is preferable to use silicone rubber from the viewpoint of processability and electrical characteristics.

As the silicone rubber, those obtained by crosslinking or condensing a liquid silicone rubber are preferable. The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10 ⁻¹ sec, and may be any of a condensation type, an addition type, a vinyl group or a hydroxyl group-containing one. Good. Specific examples include dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, and methylphenyl vinyl silicone raw rubber.

Among these, liquid group-containing silicone rubber (vinyl group-containing polydimethylsiloxane)
Is usually obtained by subjecting dimethyldichlorosilane or dimethyldialkoxysilane to hydrolysis and condensation in the presence of dimethylvinylchlorosilane or dimethylvinylalkoxysilane, for example, followed by fractionation by repeated dissolution-precipitation. Also,
The liquid silicone rubber containing a vinyl group at both ends is anionically polymerized with a cyclic siloxane such as octamethylcyclotetrasiloxane in the presence of a catalyst. , The amount of cyclic siloxane and the amount of polymerization terminator). Here, as a catalyst for the anionic polymerization, an alkali such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide or a silanolate solution thereof can be used. The reaction temperature is, for example, 80 to 130 ° C.

On the other hand, a liquid silicone rubber containing hydroxyl groups (hydroxyl group-containing polydimethylsiloxane) is usually prepared by hydrolyzing dimethyldichlorosilane or dimethyldialkoxysilane in the presence of dimethylhydrochlorosilane or dimethylhydroalkoxysilane. And condensation reaction, for example,
It is obtained by performing fractionation by repeating precipitation.
The cyclic siloxane is anionically polymerized in the presence of a catalyst, and a polymerization terminator such as dimethylhydrochlorosilane, methyldihydrochlorosilane or dimethylhydroalkoxysilane is used, and other reaction conditions (for example, the amount of the cyclic siloxane and the polymerization termination) are used. Amount of agent)
Can also be obtained by appropriately selecting Here, as a catalyst for the anionic polymerization, an alkali such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide or a silanolate solution thereof can be used. The reaction temperature is, for example, 80 to 130 ° C.

Such an elastic polymer substance has a molecular weight Mw (refer to a weight average molecular weight in terms of standard polystyrene).
Is preferably 10,000 to 40,000. From the viewpoint of heat resistance of the obtained anisotropic conductive sheet 10, the molecular weight distribution index (weight average molecular weight Mw in terms of standard polystyrene and number average molecular weight Mn in terms of standard polystyrene) are used.
Means the value of the ratio Mw / Mn. ) Is preferably 2 or less.

In the above, the sheet-forming material for obtaining the anisotropic conductive sheet 10 may contain a curing catalyst for curing the material for a polymer substance. As such a curing catalyst, an organic peroxide, a fatty acid azo compound, a hydrosilylation catalyst, or the like can be used. Specific examples of the organic peroxide used as the curing catalyst include benzoyl peroxide, bisdicyclobenzoyl peroxide, dicumyl peroxide, and ditertiary butyl peroxide. Specific examples of the fatty acid azo compound used as the curing catalyst include azobisisobutyronitrile and the like. Specific examples of those which can be used as a catalyst for the hydrosilylation reaction include chloroplatinic acid and salts thereof, a platinum-unsaturated group-containing siloxane complex, a complex of vinylsiloxane and platinum, and platinum and 1,1.
Known examples include a complex with 3-divinyltetramethyldisiloxane, a complex of triorganophosphine or triorganophosphite with platinum, an acetylacetate platinum chelate, and a complex of cyclic diene and platinum. The amount of the curing catalyst used is appropriately selected in consideration of the type of the polymer material, the type of the curing catalyst, and other curing treatment conditions. 15 parts by mass.

The sheet-forming material may contain an inorganic filler such as ordinary silica powder, colloidal silica, airgel silica, and alumina, if necessary. By including such an inorganic filler,
The thixotropy of the sheet forming material is ensured, the viscosity is increased, and the dispersion stability of the conductive particles P is improved, and the strength of the obtained anisotropic conductive sheet 10 is increased. The use amount of such an inorganic filler is not particularly limited, but if it is used in a large amount, it is not preferable because the orientation of the conductive particles P cannot be sufficiently achieved by the magnetic field. The viscosity of the sheet forming material is 100,000 to 100,000 at a temperature of 25 ° C.
It is preferable that it is within the range of 0 cp.

The conductive particles P contained in the base material have a surface coated with a lubricant or a release agent. Here, as the lubricant or the release agent, various substances can be used as long as they have an action of lubricating the elastic polymer substance and the conductive particles P constituting the base material. Silicone oil compositions such as silicone oil, silicone grease in which a thickening agent such as metal soap is blended in silicone oil, silicone oil compounds such as silicone oil compound in which silica fine powder is blended in silicone oil, fluorine-based lubricant or Fluorinated release agent,
Examples of the lubricant include a lubricant mainly composed of an inorganic material such as boron nitride, silica, zirconia, silicon carbide, and graphite, a paraffin wax, and a metal soap. Among these, those containing silicone oil such as silicone oil, silicone grease, and silicone oil compound, fluorine-based lubricants or fluorine-based release agents are preferred, and silicone greases, fluorine-based lubricants or fluorine-based lubricants are more preferred. It is a system release agent, particularly preferably a silicone grease containing a silicone oil having a fluorine atom in the molecule. Further, when silicone oil is used as a lubricant or a release agent, the silicone oil can be sufficiently held on the surface of the conductive particles.
It is preferable to use one having a high kinematic viscosity at 5 ° C. of 10,000 cSt or more. In the case where a low-viscosity silicone oil having a kinematic viscosity at 25 ° C. of less than 100 cSt is used as a lubricant or a release agent, for example, when a sheet forming material is prepared or the sheet forming material is cured in a manufacturing method described later. At this time, the silicone oil applied to the surface of the conductive particles is easily dispersed in the sheet forming material, and therefore, it is difficult to sufficiently hold the silicone oil on the surface of the conductive particles.

The amount of the lubricant or mold release agent applied to the surface of the conductive particles is determined by setting the number average particle diameter of the conductive particles to Dn.
(Μm), it is preferably 10 / Dn to 150 / Dn parts by mass, more preferably 15 / Dn to 120 / Dn parts by mass, particularly preferably 20 / parts by mass with respect to 100 parts by mass of the conductive particles. Dn to 100 / Dn parts by mass. In the present invention, the number average particle diameter of the conductive particles,
It is measured by a laser diffraction scattering method. When the application amount of the lubricant or the release agent is too small, the conductive particles P easily adhere to the elastic polymer material constituting the base material integrally, and the durability and the thermal durability in repeated use In some cases, it may be difficult to obtain an anisotropic conductive sheet having a high density. On the other hand, if this percentage is too high,
The resulting anisotropic conductive sheet tends to have a reduced strength, and good durability may not be obtained.

As the conductive particles P, those exhibiting magnetism are used from the viewpoint that they can be easily aligned in the thickness direction of the anisotropic conductive sheet 10 by applying a magnetic field. Specific examples of such conductive particles P include particles of a metal exhibiting magnetism such as nickel, iron, and cobalt, or particles of an alloy thereof, or particles containing these metals, or these particles as core particles, The core particles are gold, silver, palladium, plated with a metal having good conductivity such as rhodium, or inorganic particles or polymer particles such as non-magnetic metal particles or glass beads as core particles. Examples thereof include those obtained by plating a surface of a core particle with a conductive magnetic material such as nickel and cobalt, and those obtained by coating a core particle with both a conductive magnetic material and a metal having good conductivity. Among these, it is preferable to use particles made of a ferromagnetic material, for example, nickel particles as core particles and the surface thereof is plated with a metal having good conductivity, particularly gold. Means for coating the surface of the core particles with the conductive metal is not particularly limited, but may be, for example, chemical plating or electrolytic plating.

When the conductive particles P are formed by coating the surface of a core particle with a conductive metal, the coverage of the conductive metal on the particle surface (from the viewpoint of obtaining good conductivity) is determined. (The ratio of the area covered by the conductive metal to the surface area of the particles) is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.
It is. Further, the coating amount of the conductive metal is 0.5% of the core particles.
To 50% by mass, more preferably 1 to 50% by mass.
To 30% by mass, more preferably 3 to 25% by mass, particularly preferably 4 to 20% by mass. When the conductive metal to be coated is gold, the coating amount is 2.5% of the core particle.
-30% by mass, more preferably 3% by mass.
To 20% by mass, more preferably 3.5 to 17% by mass.

The number average particle diameter Dn of the conductive particles P
Is preferably 1 to 1000 μm, more preferably 2 to 500 μm, and still more preferably 5 to 300 μm.
m, particularly preferably from 10 to 200 μm. Further, the particle size distribution of the conductive particles P, that is, the ratio (Dw / Dn) between the weight average particle size and the number average particle size is preferably 1 to 10, more preferably 1.01 to 7, and still more preferably. Is from 1.05 to 5, particularly preferably from 1.1 to 4. By using the conductive particles P satisfying such conditions, the obtained conductive path forming portion 11 can be easily deformed under pressure, and sufficient electric contact can be obtained between the conductive particles. . The shape of the conductive particles P is not particularly limited.

The water content of the conductive particles P is preferably 5% or less, more preferably 3% or less, further preferably 2% or less, and particularly preferably 1% or less. The use of the conductive particles P satisfying such conditions prevents or suppresses the occurrence of bubbles during the curing treatment of the polymer substance forming material.

The conductive path forming portion 11 preferably contains conductive particles in a volume fraction of 5 to 60%, preferably 8 to 50%, particularly preferably 10 to 40%. If the ratio is less than 5%, the conductive path forming portion 11 having a sufficiently small electric resistance value may not be obtained. On the other hand, when this ratio exceeds 60%, the obtained conductive path forming portion 11 tends to be fragile, and the elasticity required for the conductive path forming portion may not be obtained. The electric resistance in the thickness direction of the conductive path forming portion 11 is:
In a state where the conductive path forming portion 11 is pressed with a load of 10 to 20 gf in the thickness direction, it is preferably 100 mΩ or less.

According to the anisotropic conductive sheet 10 described above, since the lubricant or the release agent is applied to the surface of the conductive particles P, the conductive particles P and the elastic polymer material forming the base material Because there is a lubricant or release agent between
The conductive particles P and the elastic polymer material do not come into close contact with each other, and become slidable. Therefore, when being pressed in the thickness direction, the peripheral portion of the conductive particles P in the elastic polymer material does not deform into a complicated form due to the movement of the conductive particles P. Because the stress applied to the part is relieved, even when used repeatedly or when used in a high temperature environment,
The required conductivity can be maintained for a long time,
Therefore, the durability and thermal durability in repeated use are high, and a long service life can be obtained.

<Method of Manufacturing Anisotropic Conductive Sheet> FIG.
It is explanatory sectional drawing which shows the structure in an example of the metal mold | die which can be used for the manufacturing method of the anisotropic conductive sheet of this invention. This mold includes an upper mold 50 and a lower mold 5 that is a pair with the upper mold 50.
5 are arranged so as to face each other via a frame-shaped spacer 54, and a cavity is formed between the lower surface of the upper die 50 and the upper surface of the lower die 55. In the upper die 50, a ferromagnetic layer portion 52 is formed on the lower surface of the ferromagnetic substrate 51 according to a pattern opposite to the arrangement pattern of the conductive path forming portions 11 of the target anisotropic conductive sheet 10,
A non-magnetic layer portion 53 having a thickness larger than the thickness of the ferromagnetic layer portion 52 is formed at a portion other than the ferromagnetic layer portion 52. On the other hand, in the lower mold 55,
A ferromagnetic layer portion 57 is formed on the upper surface of the ferromagnetic substrate 56 in accordance with the same pattern as the arrangement pattern of the intended conductive path forming portions 11 of the anisotropic conductive sheet 10. Are the ferromagnetic layer portions 5
A non-magnetic layer portion 58 having a thickness larger than the thickness of No. 7 is formed.

As the material forming the ferromagnetic substrates 51 and 56 in each of the upper mold 50 and the lower mold 55, a ferromagnetic metal such as iron, iron-nickel alloy, iron-cobalt alloy, nickel, or cobalt is used. Can be. The ferromagnetic substrates 51 and 56 preferably have a thickness of 0.1 to 50 mm, and have a smooth surface, are chemically degreased, and are mechanically polished. preferable.

The material forming the ferromagnetic layer portions 52 and 57 in each of the upper mold 50 and the lower mold 55 is a ferromagnetic metal such as iron, iron-nickel alloy, iron-cobalt alloy, nickel, and cobalt. Can be used.
The thickness of the ferromagnetic layer portions 52 and 57 is 10 μm.
It is preferable that it is above. If the thickness is less than 10 μm, it is difficult to apply a magnetic field having a sufficient intensity distribution to the sheet forming material layer formed in the mold, and as a result, the sheet forming material layer Since it is difficult to collect conductive particles at a high density in a portion where a conductive path forming portion is to be formed, a sheet having good anisotropic conductivity may not be obtained.

As a material for forming the nonmagnetic layer portions 53 and 58 in each of the upper mold 50 and the lower mold 55, a nonmagnetic metal such as copper, a heat-resistant polymer material, or the like can be used. However, since the nonmagnetic layer portions 53 and 58 can be easily formed by a photolithography technique, it is preferable to use a polymer substance cured by radiation. A photoresist such as a film resist, an epoxy-based liquid resist, or a polyimide-based liquid resist can be used. In addition, the nonmagnetic layer portion 5
The thickness of the ferromagnetic layer portions 52 and 57 is
It is set in accordance with the projected height of the conductive path forming portion 11 of the desired anisotropic conductive sheet 10.

Then, the anisotropic conductive sheet 10 is manufactured using the above-described mold as follows. First, a lubricant or a release agent is applied to the surface of the conductive particles exhibiting magnetism, and the conductive particles to which the lubricant or the release agent is applied are applied to a polymer material which becomes an elastic polymer material by a curing treatment. A fluid, sheet-forming material is prepared by dispersion in the material. In the above, examples of the method of applying a lubricant or a release agent to the surface of the conductive particles include a spray method, a method of mechanically mixing the conductive particles with the lubricant or the release agent, and the like. In these application methods, a method of diluting a lubricant or a release agent with a solvent such as alcohol, applying the diluent to the surface of the conductive particles, and evaporating the solvent can be used as appropriate. According to such a method, a lubricant or a release agent can be uniformly applied to the surface of the conductive particles. In addition, the sheet forming material can be subjected to defoaming treatment under reduced pressure as needed.

As shown in FIG. 3, the sheet forming material thus prepared is injected into a cavity of a mold to form a sheet forming material layer 10A. In the sheet forming material layer 10A, the conductive particles P are in a state of being dispersed in the sheet forming material layer 10A. Next, for example, a pair of electromagnets are arranged on the upper surface of the ferromagnetic substrate 51 in the upper die 50 and the lower surface of the ferromagnetic substrate 56 in the lower die 55, and the electromagnets are operated to form the sheet forming material layer 10A. A parallel magnetic field having an intensity distribution, that is, at a portion 11A to be a conductive path forming portion located between the ferromagnetic layer portion 52 of the upper die 50 and the corresponding ferromagnetic layer portion 57 of the lower die 55 A parallel magnetic field having an intensity greater than that of the other parts
In the thickness direction. As a result, in the sheet forming material layer 10A, as shown in FIG. 4, the conductive particles P dispersed in the sheet forming material layer 10A gather in the portion 11A to be the conductive path forming portion, Orient to align in the thickness direction.

Then, in this state, the sheet forming material layer 10A is cured so as to be disposed between the ferromagnetic layer portion 52 of the upper die 50 and the corresponding ferromagnetic layer portion 57 of the lower die 55. The conductive path forming portion 11 in which the conductive particles P are densely filled in the elastic polymer material in a state where the conductive particles P are aligned in the thickness direction, and the elastic polymer material in which the conductive particles P do not exist or hardly exist. The anisotropic conductive sheet 10 shown in FIG.

In the above description, the curing treatment of the sheet forming material layer 10A can be performed with the parallel magnetic field applied, but can also be performed after the parallel magnetic field is stopped. The strength of the parallel magnetic field applied to the sheet forming material 10A is preferably 0.02 to 2T on average. As a means for applying a parallel magnetic field to the sheet forming material layer 10A, a permanent magnet can be used instead of an electromagnet. As a permanent magnet, alnico (Fe-Al-N
(i-Co alloy), ferrite and the like are preferable. The curing treatment of the sheet forming material layer 10A is appropriately selected depending on the material used, but is usually performed by a heat treatment. The specific heating temperature and heating time are appropriately selected in consideration of the type of the material for the polymer substance constituting the sheet forming material layer 10A, the time required for the movement of the conductive particles, and the like.

According to the above-described method for producing an anisotropic conductive sheet, since the lubricant or the release agent is applied to the surface of the conductive particles P, the conductive particles P and the polymer substance in the sheet forming material layer 10A are As a result of the lubricant or the release agent being interposed between the elastic material and the conductive particles P, when the curing treatment of the polymer material is performed in this state, the obtained elastic polymer and the conductive particles P are integrally formed. It can be slid without contact. Therefore, in the obtained anisotropic conductive sheet, when pressed in the thickness direction, the peripheral portion of the conductive particles P in the elastic polymer material is deformed into a complicated shape as the conductive particles P move. Without doing this,
Since the stress applied to the peripheral portion is reduced, the required conductivity can be maintained for a long period of time even when used repeatedly or when used in a high-temperature environment. Therefore, it is possible to manufacture an anisotropic conductive sheet having high durability and thermal durability in repeated use and a long service life.

<Adapter for Inspection of Circuit Device> FIG. 5 is an explanatory sectional view showing the structure of an example of the adapter for inspection of circuit device according to the present invention. This circuit device inspection adapter includes an inspection circuit board 20 formed of a multilayer wiring board,
The inspection circuit board 20 is composed of an anisotropic conductive sheet 30 provided integrally and adhered to the surface of the circuit board 20 for inspection.

On the surface (upper surface in the figure) of the inspection circuit board 20, a plurality of inspection electrodes 21 are arranged in accordance with the pattern corresponding to the electrode to be inspected of the circuit device to be inspected. At least a part of each of the inspection electrodes 21 is made of a magnetic material. Specifically, as shown in FIG. 6, the inspection electrode 21 includes a base layer portion 21A made of, for example, copper, gold, silver, or the like, and a surface layer portion 21 made of a magnetic material.
B and a multilayer structure. The magnetic material for constituting the inspection electrode 21 includes nickel, iron,
Cobalt and alloys containing these elements can be used. The thickness of the portion made of the magnetic material (the surface layer portion 21B in the illustrated example) is, for example, 10 to 500 μm. On the back surface of the inspection circuit board 20, for example, pitches of 0.2 mm, 0.3 mm, 0.45 mm, 0.5 mm,
0.75mm, 0.8mm, 1.06mm, 1.27m
A plurality of terminal electrodes 22 are arranged according to lattice point positions of m, 1.5 mm, 1.8 mm, or 2.54 mm.
1 electrically.

The anisotropic conductive sheet 30 has the same configuration as that of the inspection circuit board 20 except that the surface (the lower surface in the figure) in contact with the surface of the inspection circuit board 20 has a shape corresponding to the shape of the surface of the inspection circuit board 20. It has the same configuration as the anisotropic conductive sheet 10 shown in FIG. The structure of the anisotropic conductive sheet 30 will be described in detail. A plurality of columnar conductive path forming portions 31 each densely filled with conductive particles and extending in the thickness direction are provided. And an insulating portion 32 containing no or almost no conductive particles, and each of the conductive path forming portions 31 is arranged so as to be located on the test electrode 21 of the test circuit board 20. . Further, each of the conductive path forming portions 31 includes an insulating portion 32.
Is formed so as to protrude from the surface (upper surface in the figure) of the first embodiment. The surface of the conductive particles is coated with a lubricant or a release agent.

Such a circuit device inspection adapter is
For example, it can be manufactured as follows. First,
An inspection circuit board 20 made of, for example, a multilayer wiring board as shown in FIG. 7 is prepared. As described above, the inspection circuit board 20 has a plurality of inspection electrodes 21 arranged on the front surface in accordance with a pattern corresponding to the electrode to be inspected of the circuit board to be inspected, and is arranged on the back surface in accordance with the lattice point positions. And at least a part of each of the inspection electrodes 21 is made of a magnetic material, and each of the inspection electrodes 21 is
Are electrically connected to each other. As a method for manufacturing such an inspection circuit board 20, a general method for manufacturing a multilayer wiring board can be applied as it is. The method for forming the inspection electrode 21 at least partly made of a magnetic material is not particularly limited, but as shown in FIG. 6, a multilayer structure having a surface part 21B made of a magnetic material is used. When the inspection electrode 21 is formed, a thin copper layer is formed on the surface of the plate-like base on which the multilayer wiring board is formed, and then the thin copper layer is subjected to photolithography and etching to obtain a base layer. Part 2
1A, and then subjected to photolithography and a plating process such as nickel to form a surface layer portion 2.
The method of forming 1B can be used.

As shown in FIG. 8, a template 40 for forming an anisotropic conductive sheet is prepared. More specifically, the template 40 has a ferromagnetic substrate 41, and one surface of the ferromagnetic substrate 41 is disposed on one surface of the ferromagnetic substrate 41 according to a pattern opposite to the arrangement pattern of the test electrodes 21 of the test circuit board 20. A ferromagnetic layer portion 42 is formed.
A non-magnetic layer portion 43 having a thickness larger than the thickness of the ferromagnetic layer portion 42 is formed at a portion other than the portion 2. The material forming the ferromagnetic substrate 41, the ferromagnetic layer portion 42, and the non-magnetic layer portion 43 in the template 40 includes the ferromagnetic substrates 51 and 56 in the upper die 50 and the lower die 55, respectively. The materials exemplified for the ferromagnetic layer portions 52 and 57 and the nonmagnetic layer portions 53 and 58 can be used.

Then, as shown in FIG. 9, an insulating elastomer layer 30B is formed on the surface (upper surface in the figure) of the template 40. Here, the insulating elastomer layer 30B formed on the surface of the template 40 has adhesiveness on one exposed surface. As a method of forming such an insulating elastomer layer 30B, a method of preparing an insulating elastomer sheet having adhesive properties on both sides and bonding the insulating elastomer sheet to the surface of the template 40, and a method of hardening and elasticity A liquid polymer material that becomes a molecular substance,
A method of applying a material layer for a polymer substance to the surface of the template 40 to form a material layer for the polymer substance, and curing the material layer for the polymer substance to such an extent that adhesiveness on one exposed surface is not lost; Can be.

Next, as shown in FIG. 10, a portion of the insulating elastomer layer 30B corresponding to the region where the test electrodes 21 of the test circuit board 20 are formed, specifically, a template in the insulating elastomer layer 30B. By removing the portion of the template 40 located on the ferromagnetic layer portion 42 and its peripheral region, the ferromagnetic layer portion 42 of the template 40 is removed.
And the space 30S is formed so that the periphery thereof is exposed.
Here, as a method of forming the space 30S in the insulating elastomer layer 30B, a method by laser processing can be preferably used. Examples of a laser device used for laser processing include a carbon dioxide laser device, a YAG laser device, and an excimer laser device.

On the other hand, a lubricant or a release agent is applied to the surface of the conductive particles, and the conductive particles are dispersed in a material for a polymer material which is cured to become an elastic polymer material, thereby forming a sheet. Prepare the material. Then, as shown in FIG. 11, a sheet forming material is filled in a space 30S formed in the insulating elastomer layer 30B, thereby forming a sheet forming material layer 30A in the space 30S. Next, as shown in FIG. 12, the template 40 having the sheet forming material layer 30A and the insulating elastomer layer 30B formed on the surface of the inspection circuit board 20 is placed on the sheet forming material layer 30A and the insulating elastomer layer 30B. And the respective ferromagnetic layer portions 42 are arranged above the corresponding test electrodes 21 of the test circuit board 20 corresponding thereto.

Thereafter, an electromagnet or a permanent magnet is arranged on the back surface of the template 40 and the back surface of the inspection circuit board 20, and a parallel magnetic field is applied in the thickness direction of the sheet forming material layer 30A. At this time, since the ferromagnetic layer portion 42 of the template 40 and the inspection electrode 21 of the inspection circuit board 20 are made of a magnetic material, they function as magnetic poles. Therefore, in the portion between the ferromagnetic layer portion 42 of the template 40 and the test electrode 21 of the test circuit board 20 in the sheet forming material layer 30A, that is, the portion serving as the conductive path forming portion, A higher intensity parallel magnetic field acts. As a result, in the sheet-forming material layer 30A, the conductive particles exhibiting magnetism dispersed in the sheet-forming material layer 30A are aggregated in the conductive portion forming portion and further oriented so as to be arranged in the thickness direction. . Then, the sheet forming material layer 30A and the insulating elastomer layer 30B are cured while the parallel magnetic field is applied or after the operation of the parallel magnetic field is stopped, so that the plurality of conductive path forming portions 31 extending in the thickness direction are formed. An anisotropic conductive sheet 30 composed of an insulating member 32 for insulating the circuit board from each other is integrally formed on the surface of the circuit board 20 for inspection, so that the adapter for circuit device inspection having the configuration shown in FIG. 5 is manufactured. Is done. In the above, the intensity of the parallel magnetic field applied to the sheet forming material layer 30A, the sheet forming material layer 30A and the insulating elastomer layer 30
The conditions for the curing treatment of B are the same as those for the method of manufacturing the anisotropic conductive sheet 10 described above.

According to such a circuit device inspection adapter, since the anisotropic conductive sheet 30 has high durability in repeated use and high thermal durability and has a long service life, the circuit device inspection can be performed with high efficiency. Can be executed, and the inspection cost can be reduced.

The surface layer portion 21 B of the test electrode 21 on the test circuit board 20 is made of a magnetic material. When the anisotropic conductive sheet 30 is formed on the upper surface of the test circuit board 20, When a parallel magnetic field is applied to the forming material layer 30A in the thickness direction, the surface layer portion 21B of the inspection electrode 21 made of a magnetic material acts as a magnetic pole. The lines of magnetic force considerably larger than the position are concentrated. Thereby, even if the arrangement pitch of the inspection electrodes 21 is extremely small, the conductive particles gather at the position above the inspection electrodes 21 and are further oriented in the thickness direction.
An intended anisotropic conductive sheet 30 having a plurality of conductive path forming portions 31 arranged on the inspection electrode 21 and insulated from each other by the insulating portion 22 can be formed. Accordingly, even when the electrodes to be inspected of the circuit device to be inspected have a minute arrangement pitch and a fine and high-density complicated pattern, the electrodes to be inspected and the inspection circuit board 20 are not required.
Required electrical connection with the test electrode can be reliably achieved.

Further, since the anisotropic conductive sheet 30 is provided integrally on the inspection circuit board 20, the thermal expansion of the anisotropic conductive sheet 30 when the circuit device inspection adapter is heated. Is suppressed by the inspection circuit board 20. Therefore, in tests such as a heat cycle test and a burn-in test, a good electrical connection state is stably maintained even with a temperature change.

<Inspection Apparatus for Circuit Device> FIG. 13 is an explanatory cross-sectional view showing the configuration of the main part of an example of the inspection apparatus for circuit devices according to the present invention. In this figure, reference numeral 20 denotes a circuit board for inspection, and a plurality of inspection electrodes 21 are formed on its surface (the upper surface in the figure) in accordance with a pattern corresponding to the electrode 2 to be inspected of the circuit device 1 to be inspected. . An anisotropic conductive sheet 10 having the configuration shown in FIG. 1 is arranged on the surface of the inspection circuit board 20, and is fixed by appropriate means (not shown). Specifically, the anisotropic conductive sheet 1
0 has a plurality of conductive path forming portions 11 formed according to a pattern corresponding to the electrode 2 to be tested of the circuit device 1 to be tested, and each of the conductive path forming portions 11 corresponds to the corresponding one of the test circuit boards 20. Are arranged so as to be located on the inspection electrode 21. Here, the circuit device under test 1 to be tested is
Examples thereof include wafers, semiconductor chips, packages such as BGA and CSP, electronic components such as modules such as MCM, printed circuit boards such as single-sided printed circuit boards, double-sided printed circuit boards, and multilayer printed circuit boards.

In such an inspection apparatus, for example, the inspection circuit board 20 is moved in a direction approaching the inspection target circuit device 1 or the inspection target circuit device 1 is moved in a direction approaching the inspection circuit substrate 20. By being moved, the anisotropic conductive sheet 10 is pressed by the circuit device under test 1 and the circuit board 20 for inspection, and as a result, the conductive sheet 10 passes through the conductive path forming portion 11 of the anisotropic conductive sheet 10. Inspection electrode 2 of inspection target circuit device 1 and inspection circuit board 20
Electrical connection with the inspection electrode 21 is achieved. In this state, or in a state where the environmental temperature is raised to a predetermined temperature, for example, 150 ° C. in order to develop a potential defect in the circuit device 1 to be inspected,
The required electrical inspection is carried out for.

According to such an inspection apparatus, since the anisotropic conductive sheet 10 has high durability in repeated use and high thermal durability and has a long service life, the anisotropic conductive sheet 10 can be used. Replacement less frequently,
As a result, the inspection of the circuit device can be executed with high efficiency.

FIG. 14 is an explanatory diagram showing the configuration of another example of the circuit device inspection apparatus according to the present invention. This inspection apparatus performs an electrical inspection of a circuit board 5 to be inspected having electrodes 6 and 7 formed on both sides, and a holder 8 for holding the circuit board 5 to be inspected in an inspection execution region R. The holder 8 is provided with positioning pins 9 for arranging the circuit substrate 5 to be inspected at an appropriate position in the inspection execution region R. Above the inspection execution region R,
An upper-side adapter 35a and an upper-side inspection head 60a having a configuration as shown in FIG. 5 are arranged in this order from below, and an upper-side support plate 66a is arranged above the upper-side inspection head 60a. The upper side inspection head 60a
The support 64a is fixed to the support plate 66a. On the other hand, below the inspection execution region R, a lower adapter 35b and a lower inspection head 60 having a configuration as shown in FIG.
b are arranged in this order from the top, and further below the lower inspection head 60b, a lower support plate 66b is arranged. The lower inspection head 60b is fixed to the support plate 66b by a support column 64b. I have.

The upper inspection head 60a is composed of a plate-like electrode device 61a and an elastic anisotropic conductive sheet 65a fixed and arranged on the lower surface of the electrode device 61a. The electrode device 61a has on its lower surface a plurality of connection electrodes 62a arranged at lattice points at the same pitch as the terminal electrodes 22 of the upper adapter 35a, and each of these connection electrodes 62a is a wire wiring. 63a
Is electrically connected to a connector 67a provided on the upper support plate 66a.
It is electrically connected to a test circuit (not shown) of the tester via a. The lower inspection head 60b includes a plate-shaped electrode device 61b and an elastic anisotropic conductive sheet 65b fixed and disposed on the upper surface of the electrode device 61b. The electrode device 61b has on its upper surface a plurality of connection electrodes 62b arranged at lattice points at the same pitch as the terminal electrodes 22 of the lower adapter 35b, and each of these connection electrodes 62b is a wire wiring. The connector 63b is electrically connected to a connector 67b provided on the lower support plate 66b, and is further electrically connected to a test circuit (not shown) of the tester via the connector 67b.

The anisotropic conductive sheets 65a and 65b in the upper inspection head 60a and the lower inspection head 60b.
Are formed with a conductive path forming portion for forming a conductive path only in the thickness direction. As such anisotropic conductive sheets 65a and 65b, those in which each conductive path forming portion is formed so as to protrude in the thickness direction on at least one surface are preferable in terms of exhibiting high electrical contact stability.

In such a circuit device inspection apparatus, the circuit board 5 to be inspected is held in the inspection execution region R by the holder 8, and in this state, the upper support plate 66a and the lower support plate 66b Are moved in a direction approaching the circuit board 5 to be inspected, the circuit board 5 to be inspected is clamped by the upper adapter 35a and the lower adapter 35b. In this state, the electrode 6 to be inspected on the upper surface of the circuit board 5 to be inspected is
Is electrically connected to the inspection electrode 21 of the upper adapter 35a via the conductive path forming portion 31 of the anisotropic conductive sheet 30. The terminal electrode 22 of the upper adapter 35a is Electrode device 61 via sheet 65a
a is electrically connected to the connection electrode 62a. On the other hand, the electrode 7 to be inspected on the lower surface of the circuit board 5 to be inspected is
It is electrically connected to the inspection electrode 21 of the lower adapter 35b via the conductive path forming portion 31 of the anisotropic conductive sheet 30, and the terminal electrode 22 of the lower adapter 35b is
Is electrically connected to the connection electrode 62b of the electrode device 61b via the anisotropic conductive sheet 65b.

In this manner, each of the electrodes 6 and 7 on both the upper and lower surfaces of the circuit board 5 to be inspected is connected to the connection electrode 62a and the lower inspection head 60b of the electrode device 61a in the upper inspection head 60a. Is electrically connected to each of the connection electrodes 62b of the electrode device 61b, thereby achieving a state of being electrically connected to the test circuit of the tester. In this state, a required electrical test is performed.

According to the above-described circuit board inspection apparatus, the upper adapter 35a and the lower adapter 35b having the anisotropic conductive sheet 30 having high durability and thermal durability in repeated use are provided. Inspection of the circuit device can be executed with high efficiency, and the inspection cost can be reduced. Further, in the upper adapter 35a and the lower adapter 35b, the anisotropic conductive sheet 30 is provided integrally on the inspection circuit board 20, so that the thermal expansion of the anisotropic conductive sheet 30 reduces the thermal expansion of the inspection circuit board. 20. Therefore, a favorable electrical connection state is stably maintained even with a temperature change.

<Electronic Component Mounting Structure> FIG. 15 is an explanatory view showing the structure of an example of an electronic component mounting structure according to the present invention. In this electronic component mounting structure, the electronic component 71 is disposed on the circuit board 73 via the anisotropic conductive sheet 10 having the configuration shown in FIG. It is fixed by the fixing member 75 in a state of being pressed by the circuit board 73,
The electrodes 72 of the electronic component 71 are connected to the electrodes 74 of the circuit board 73 by the conductive path forming portions (not shown) of the anisotropic conductive sheet 10.
Is electrically connected to

The electronic component 71 is not particularly limited, and various electronic components can be used.
Diode, relay, switch, IC chip or L
SI chips or their packages or MCM (M
Active components including semiconductor devices such as multi-chip modules, passive components such as resistors, capacitors, crystal oscillators, speakers, microphones, transformers (coils), inductors, TFT-type liquid crystal display panels, and STs
Display panels such as an N-type liquid crystal display panel, a plasma display panel, and an electroluminescence panel are exemplified. As the circuit board 73, those having various structures such as a single-sided printed circuit board, a double-sided printed circuit board, and a multilayer printed circuit board can be used. Further, the circuit board 73 may be any of a flexible board, a rigid board, and a flex-rigid board combining these.

As a material constituting the flexible substrate, polyimide, polyamide, polyester, polysulfone, or the like can be used. Examples of the material forming the rigid substrate include composite resin materials such as glass fiber reinforced epoxy resin, glass fiber reinforced phenol resin, glass fiber reinforced polyimide resin, and glass fiber reinforced bismaleimide triazine resin, silicon dioxide, and alumina. Ceramic materials can be used.

Electrode 72 of electronic component 71 and circuit board 7
Examples of the material of the third electrode 74 include gold, silver, copper, nickel, palladium, carbon, aluminum, ITO, and the like. The thickness of the electrode 72 of the electronic component 71 and the thickness of the electrode 74 of the circuit board 73 are 0.1 to 10 respectively.
It is preferably 0 μm. The width of the electrode 72 of the electronic component 71 and the width of the electrode 74 of the circuit board 73 are 1 to 50.
It is preferably 0 μm.

According to the electronic component mounting structure described above, the electronic component 71 is connected to the circuit board 73 via the anisotropic conductive sheet 10 having high durability and thermal durability in repeated use.
, It is possible to stably maintain a good electrical connection state for a long period of time. Such an electronic component mounting structure can be suitably applied to a mounting structure of a printed circuit board and an electronic component in fields such as an electronic calculator, an electronic digital clock, an electronic camera, and a computer keyboard.

The present invention is not limited to the above embodiment, and various changes can be made. (1) As shown in FIG. 16, an anisotropic conductive sheet 10 with a support whose peripheral edge is supported by a frame-plate-like support 15
Can be configured. Such an anisotropic conductive sheet 10 is a mold for manufacturing the anisotropic conductive sheet, which has a space region for supporting member placement in which a support member 15 can be arranged in a cavity, and is used as the mold. In this state, the support 15 is arranged in the support arrangement space region in the cavity, and in this state, as described above, the sheet forming material is injected and cured, whereby the substrate 15 can be manufactured.

(2) It is not essential in the present invention that the conductive path forming portion 11 is formed so as to protrude from the surface of the insulating portion 12, and the anisotropic conductive sheet 10 has a flat surface. You may. (3) A so-called dispersion type or non-uniform type anisotropic conductive sheet in which conductive particles are contained in a substrate in a state of being uniformly distributed in a plane direction can be formed.

[0072]

EXAMPLES Examples of the present invention will be specifically described below, but the present invention is not limited to these examples. In the following examples, the number average particle diameter of the particles was measured by a laser diffraction scattering method, and the durometer hardness of the cured rubber was determined using a type A durometer based on a durometer hardness test of JIS K6253. Measured.

<Example 1> [Preparation of sheet-forming material] Conductive particles (number-average) in which nickel particles having a number-average particle diameter of 30 µm were plated with gold in an amount of 8% by mass based on the mass thereof. Particle size 30μ
m) was prepared, and a lubricant in an amount of 5 parts by mass with respect to 100 parts by mass of the conductive particles was applied to the surface of the conductive particles. Here, as the lubricant, a silicone grease “FG721” (manufactured by Shin-Etsu Chemical Co., Ltd.) containing silicone oil having fluorine in the molecule was used.
Next, 9 parts by mass of the conductive particles coated with the lubricant were added to 100 parts by mass of the addition type liquid silicone rubber “KE2000-40” (manufactured by Shin-Etsu Chemical Co., Ltd., and the durometer hardness of the cured rubber was 40). Then, by performing a defoaming treatment under reduced pressure on this mixture,
A sheet forming material was prepared.

[Preparation of Mold for Manufacturing Anisotropic Conductive Sheet] Except for having a space region for arranging the support in the cavity, basically according to the configuration shown in FIG.
A mold for producing an anisotropic conductive sheet was prepared. Ferromagnetic substrate: material: iron, thickness: 6 mm, ferromagnetic layer portion: material: nickel, thickness: 0.15 m
m, diameter; 0.4 mm, pitch (center-to-center distance); 0.8 m
m, non-magnetic material layer part: material; epoxy resin, thickness; 0.2 m
m, spacer thickness; 0.3mm

[Production of an anisotropic conductive sheet] A frame-plate-shaped anisotropic conductive sheet support made of stainless steel having a thickness of 0.3 mm is provided in the space region for disposing the support in the cavity of the mold. Placed. Next, the prepared sheet forming material was injected into the cavity of the mold, and a defoaming process was performed under reduced pressure to form a sheet forming material layer in the mold. And, for the sheet forming material layer,
While applying a parallel magnetic field of 2T in the thickness direction by an electromagnet, the sheet-forming material layer is cured at 100 ° C. for 1 hour, and after the mold is released from the mold, the sheet is cured.
By performing post cure at 0 ° C for 1 hour,
An anisotropic conductive sheet with a support having a plurality of conductive path forming portions extending in the thickness direction and insulating portions for insulating these conductive path forming portions from each other was manufactured. In the obtained anisotropic conductive sheet, the conductive path forming portion having an outer diameter of 0.4 mm has a diameter of 0.4 mm.
It is arranged at grid points of 12 rows and 9 columns at a pitch of 8 mm, the thickness of the insulating portion is 0.3 mm, the thickness of the conductive path forming section is 0.4 mm, and the conductive path forming section Are formed so as to protrude from both surfaces of the insulating portion (each protrusion height is 0.05 mm).
The ratio of the conductive particles in the conductive path forming portion was 30% by volume.

Example 2 Silicone grease “FG7”
21 "instead of a silicone grease containing a silicone oil having no fluorine in the molecule" G50
1 "(manufactured by Shin-Etsu Chemical Co., Ltd.) as a lubricant,
Anisotropically conductive sheet with a support in the same manner as in Example 1 except that a lubricant in an amount of 2.5 parts by mass with respect to 100 parts by mass of the conductive particles was applied to the surface of the conductive particles. Was manufactured. The dimensions of the conductive path forming portion and the insulating portion of the obtained anisotropic conductive sheet are the same as those of the anisotropic conductive sheet according to Example 1. Was 30%.

Example 3 Silicone grease "FG7"
21), a fluorine-based release agent “DAIFREE” (manufactured by Daikin Industries, Ltd.) is used as a release agent, and the surface of the conductive particles is 2.5 parts per 100 parts by mass of the conductive particles.
An anisotropic conductive sheet with a support was manufactured in the same manner as in Example 1 except that the amount of the releasing agent to be used in parts by mass was applied. The dimensions of the conductive path forming portion and the insulating portion of the obtained anisotropic conductive sheet are the same as those of the anisotropic conductive sheet according to Example 1. Was 30%.

Example 4 Silicone grease “FG7”
21 ”instead of 300,000 cS kinematic viscosity at 25 ° C
Using silicone oil “KF96H” (available from Shin-Etsu Chemical Co., Ltd.) as a lubricant, apply a lubricant in an amount of 2.5 parts by mass to 100 parts by mass of the conductive particles on the surface of the conductive particles. Except that, an anisotropic conductive sheet with a support was manufactured in the same manner as in Example 1. The dimensions of the conductive path forming portion and the insulating portion of the obtained anisotropic conductive sheet are the same as those of the anisotropic conductive sheet according to Example 1, and the ratio of the conductive particles in the conductive path forming portion is expressed as a volume fraction. 3 in
It was 0%.

Comparative Example 1 An anisotropic conductive sheet with a support was produced in the same manner as in Example 1 except that no lubricant was applied to the surface of the conductive particles. The dimensions of the conductive path forming portion and the insulating portion of the obtained anisotropic conductive sheet are the same as those of the anisotropic conductive sheet according to Example 1. Was 30%.

<Comparative Example 2> Instead of the addition type liquid silicone rubber "KE2000-40", the addition type liquid silicone rubber "KE2000-20" (manufactured by Shin-Etsu Chemical Co., Ltd., having a durometer hardness of 18 after curing). A) An anisotropic conductive sheet with a support was produced in the same manner as in Example 1 except that (1) was used. The dimensions of the conductive path forming portion and the insulating portion of the obtained anisotropic conductive sheet are the same as those of the anisotropic conductive sheet according to Example 1. Was 30%.

Reference Example 1 Silicone grease “FG7”
"KF96L" having a kinematic viscosity of 2 cSt at 25 ° C. instead of “21” (manufactured by Shin-Etsu Chemical Co., Ltd.)
Anisotropic with support in the same manner as in Example 1 except that the lubricant was applied to the surface of the conductive particles in an amount of 2.5 parts by mass with respect to 100 parts by mass of the conductive particles. A conductive sheet was manufactured. The dimensions of the conductive path forming portion and the insulating portion of the obtained anisotropic conductive sheet are the same as those of the anisotropic conductive sheet according to Example 1. Was 30%.

<Reference Example 2> A support was provided in the same manner as in Example 1 except that a lubricant was applied to the surface of the conductive particles in an amount of 20 parts by mass with respect to 100 parts by mass of the conductive particles. Was manufactured. The dimensions of the conductive path forming portion and the insulating portion of the obtained anisotropic conductive sheet are the same as those of the anisotropic conductive sheet according to Example 1. Was 30%.

[Evaluation of Anisotropic Conductive Sheet]
4. With respect to the anisotropic conductive sheets according to Comparative Examples 1 and 2 and Reference Examples 1 and 2, durability and thermal durability in repeated use were evaluated as follows.

(1) Durability in repeated use: 15 rows 1 on a surface of an insulating substrate made of BT resin having a thickness of 0.5 mm in accordance with grid point positions with a pitch of 0.8 mm.
Arranged in 5 rows, height 20μm, outer diameter 0.25m
One of the evaluation circuit boards having a protruding electrode made of m.m. , An outer diameter of 0.3 m is arranged on an insulating substrate made of BT resin having a thickness of 0.5 mm in a matrix of 20 rows and 20 columns in accordance with lattice point positions of 0.8 mm.
the other evaluation circuit board having a planar electrode made of gold of m, and having a lead electrode electrically connected to each of the planar electrodes by printed wiring on a peripheral portion of one surface of the insulating substrate; Was prepared, and an anisotropic conductive sheet was arranged between the one evaluation circuit board and the other evaluation circuit board so that the conductive path forming portion was located between the protruding electrode and the plane electrode. Then, under a temperature environment of 130 ° C., one of the evaluation circuit boards and the other evaluation circuit board squeeze the anisotropic conductive sheet so that the load applied per conductive path forming portion is 10 gf, In this state, the electric resistance of each of the conductive path forming portions was measured by the four-terminal method, and thereafter, the load applied to the conductive path forming portion was set to 0 gf. This operation was repeated as one cycle, and the number of cycles until the value of the electric resistance of any of the conductive path forming portions exceeded 1Ω (this is referred to as “the number of repeated durability”) was measured. Table 1 shows the initial electric resistance (electric resistance value measured at the first cycle) and the number of repetition endurance of the conductive path forming portion in the anisotropic conductive sheet.

(2) Thermal durability: using one of the evaluation circuit boards and the other evaluation circuit board used in (1) above, the one evaluation circuit board and the other evaluation circuit board were used. In between, the anisotropic conductive sheet is disposed such that the conductive path forming portion is located between the protruding electrode and the flat electrode, and the load applied to the anisotropic conductive sheet per conductive path forming portion is 10 gf. It was squeezed. Then, in this state, after holding at 25 ° C. for 1 hour in a constant temperature bath controlled by a temperature control program, the initial electric resistance at 25 ° C. of each of the conductive path forming portions is measured by a four-terminal method, After holding at 150 ° C. for 2 hours, the initial electric resistance at 150 ° C. of each of the conductive path forming portions was measured by a four-terminal method. Thereafter, an operation of holding at 25 ° C. for 1 hour and then holding at 150 ° C. for 2 hours (this is referred to as one cycle) is repeated, and each time one cycle is completed, the electric resistance of each conductive path forming portion is measured. Then, the number of cycles until the value of the electric resistance of any of the conductive path forming portions exceeded 1Ω (this is referred to as “the number of thermal endurance”) was measured. The results are shown in Table 1.

[0086]

[Table 1]

As is clear from the results in Table 1, Example 1
According to the anisotropic conductive sheets according to Nos. 1 to 4, the increase in the electric resistance of the conductive path forming portion is small in both cases of repeated use in a normal temperature environment and long time use in a high temperature environment. It was confirmed that both the durability and the thermal durability were high and a long service life was obtained.

<Example 5> [Preparation of test circuit board] A test circuit board having the following test electrodes and terminal electrodes was prepared according to the structure shown in FIGS. (1) Test electrode: electrode diameter: 150 μm, pitch: 50
0 μm, base layer material; copper, base layer thickness 30 μ
m, material of surface portion; nickel, thickness of surface portion; 70
μm, number of electrodes: 512, (2) terminal electrode: electrode diameter; 500 μm, pitch: 800
μm, material: copper, number of electrodes: 512,

[Preparation of Sheet-Forming Material] A nickel particle having a number average particle diameter of 20 μm was coated on the surface at 8% by mass of its mass.
The conductive particles (number-average particle diameter 20 μm) on which the gold plating is applied are prepared in an amount of 2.5 parts by mass with respect to 100 parts by mass of the conductive particles on the surface of the conductive particles. Lubricant was applied. Here, as the lubricant, a silicone grease “FG721” (manufactured by Shin-Etsu Chemical Co., Ltd.) containing silicone oil having fluorine in the molecule was used. Next, 8 parts by mass of the conductive particles coated with the lubricant were added to the addition type liquid silicone rubber “KE200”.
0-40 "(manufactured by Shin-Etsu Chemical Co., Ltd., the durometer hardness of the cured rubber is 40), and mixed with 100 parts by mass. A sheet forming material was prepared.

[Preparation of Template for Forming Anisotropic Conductive Sheet] A template for forming an anisotropic conductive sheet was prepared according to the configuration shown in FIG. 8 under the following conditions. Ferromagnetic substrate: material: iron, thickness: 6 mm, ferromagnetic layer portion: material: nickel, thickness: 0.05 m
m, diameter; 0.15 mm, pitch (center-to-center distance); 0.5
mm, non-magnetic layer part: material; epoxy resin, thickness; 0.11
mm,

[Manufacture of Adapter for Inspection of Circuit Device] On the surface of the above-mentioned template, a thickness of 150 μm having an adhesive property on both surfaces is provided.
m of the insulating elastomer sheet were adhered to form an insulating elastomer layer. Thereafter, a portion of the insulating elastomer layer located on the ferromagnetic layer portion of the template and on the peripheral region thereof is removed by a carbon dioxide laser device, so that the insulating elastomer layer is provided with the ferromagnetic material of the template. A space was formed so that the body layer portion and its periphery were exposed. Then, the prepared sheet-forming material was filled into the space formed in the insulating elastomer layer by a screen printing method to form a sheet-forming material layer. Next, on the surface of the circuit board for inspection, a template on which the sheet forming material layer and the insulating elastomer layer are formed,
The sheet forming material layer and the insulating elastomer layer were arranged so as to be in contact with the surfaces thereof and each of the ferromagnetic layer portions was positioned above each of the corresponding test electrodes of the test circuit board. Then, while applying a parallel magnetic field of 0.7 T in the thickness direction by an electromagnet to the sheet forming material layer, the sheet forming material layer is subjected to a curing treatment at 100 ° C. for 1 hour. After releasing the mold, post-curing is performed at 150 ° C. for one hour to form a plurality of conductive path forming portions extending in the thickness direction on the surface of the inspection circuit board. Then, an anisotropic conductive sheet having an insulating portion for insulation was integrally formed, thereby producing a circuit device inspection adapter. The outer diameter of the conductive path forming portion of the anisotropic conductive sheet in the obtained circuit device inspection adapter device is 0.15 m.
m, the pitch is 0.5 mm, the protrusion height from the surface of the insulating part is 58 μm, the thickness of the insulating part is 150 μm,
The ratio of the conductive particles in the conductive path forming portion was 30% by volume.

Comparative Example 3 A circuit device inspection adapter was manufactured in the same manner as in Example 5, except that no lubricant was applied to the surface of the conductive particles. The dimensions of the conductive path forming part and the insulating part of the anisotropic conductive sheet in the obtained adapter for circuit device inspection are the same as those of the adapter for circuit device inspection according to Example 5, and the size of the conductive particles in the conductive path forming part. The ratio was 30% by volume.

Comparative Example 4 A titanium coupling agent was used in an amount of 0.3 parts by mass with respect to 100 parts by mass of the additional liquid silicone rubber in the sheet forming material without applying a lubricant to the surface of the conductive particles. A circuit device inspection adapter was manufactured in the same manner as in Example 5, except that was added. The dimensions of the conductive path forming part and the insulating part of the anisotropic conductive sheet in the obtained adapter for circuit device inspection are the same as those of the adapter for circuit device inspection according to Example 5, and the size of the conductive particles in the conductive path forming part. The ratio was 30% by volume.

Comparative Example 5 Instead of the addition type liquid silicone rubber "KE2000-40", the addition type liquid silicone rubber "KE2000-20" (manufactured by Shin-Etsu Chemical Co., Ltd., having a durometer hardness of 18 after curing). ) Was manufactured in the same manner as in Example 5 except that (1) was used. The dimensions of the conductive path forming part and the insulating part of the anisotropic conductive sheet in the obtained adapter for circuit device inspection are the same as those of the adapter for circuit device inspection according to Example 5, and the size of the conductive particles in the conductive path forming part. The ratio was 30% by volume.

Reference Example 3 A circuit device inspection was performed in the same manner as in Example 5, except that a lubricant was applied to the surface of the conductive particles in an amount of 20 parts by mass with respect to 100 parts by mass of the conductive particles. Adapters were manufactured. The dimensions of the conductive path forming part and the insulating part of the anisotropic conductive sheet in the obtained adapter for circuit device inspection are the same as those of the adapter for circuit device inspection according to Example 5, and the size of the conductive particles in the conductive path forming part. The ratio was 30% by volume.

[Evaluation of Circuit Device Inspection Adapter] Using the circuit device inspection adapters according to Example 5, Comparative Examples 3 to 5, and Reference Example 3, an inspection device having a configuration shown in FIG. 14 was manufactured. On the other hand, a circuit board to be inspected having 512 electrodes to be inspected on both sides and having a solder resist having a thickness of 38 μm was prepared. Here, the dimensions of the electrode to be inspected are 200 μm in diameter, 30 μm in thickness, and 500 μm in pitch. Then, the circuit board to be inspected is held in the inspection execution area of the above-described inspection apparatus, and the load applied to each of the electrodes to be inspected by the upper adapter and the lower adapter is 25%.
In this state, the electric resistance between each of the test electrodes of the upper adapter and each of the test electrodes of the lower test adapter is measured by a tester while a current of 20 mA is supplied. Thereafter, the load applied to the electrode to be inspected was set to 0 gf. This operation was repeated as one cycle, and the number of cycles until the value of the electric resistance exceeded 300 kΩ was measured for any of the test electrodes. The results are shown in Table 2 above.

[0097]

[Table 2]

As is clear from the results in Table 2, Example 5
According to the adapter for circuit device inspection according to the above, it was confirmed that when repeatedly used, the increase in electric resistance was small, the durability in repeated use was high, and a long service life was obtained.

[0099]

As described above, according to the anisotropic conductive sheet of the present invention, the required conductive property can be maintained for a long period of time even when it is repeatedly used many times or when it is used in a high temperature environment. Therefore, durability and thermal durability in repeated use are high, and a long service life is obtained. According to the production method of the present invention, it is possible to produce an anisotropic conductive sheet having high durability and thermal durability in repeated use and a long service life.

According to the adapter for inspecting a circuit device of the present invention, since the anisotropic conductive sheet having high durability in repeated use and high thermal durability and a long service life can be obtained, the inspection of the circuit device in the inspection is difficult. The frequency of replacing the circuit device inspection adapter is reduced, and as a result, the circuit device inspection can be performed with high efficiency.
Since the anisotropic conductive sheet is provided integrally with the inspection circuit board, a favorable electrical connection state is stably maintained even with a temperature change. According to the inspection apparatus for a circuit device of the present invention, since the anisotropic conductive sheet having high durability and thermal durability in repeated use and a long service life is obtained, the frequency of replacing the anisotropic conductive sheet is high. And the inspection can be performed with high efficiency. ADVANTAGE OF THE INVENTION According to the electronic component mounting structure of this invention, a favorable electrical connection state is stably maintained over a long period of time.

[Brief description of the drawings]

FIG. 1 is an explanatory sectional view showing a configuration of an example of an anisotropic conductive sheet of the present invention.

FIG. 2 is an explanatory cross-sectional view showing a configuration of an example of a mold used for manufacturing the anisotropic conductive sheet of the present invention.

FIG. 3 is an explanatory sectional view showing a state in which a sheet forming material layer is formed in the mold shown in FIG. 2;

FIG. 4 is an explanatory cross-sectional view showing a state where conductive particles in a sheet forming material layer are gathered in a portion to be a conductive path forming portion in the sheet forming material layer.

FIG. 5 is an explanatory cross-sectional view showing a configuration of an example of the circuit device inspection adapter of the present invention.

FIG. 6 is an explanatory sectional view showing an inspection electrode on an inspection circuit board in an enlarged manner.

FIG. 7 is an explanatory sectional view showing a circuit board for inspection.

FIG. 8 is an explanatory cross-sectional view illustrating a configuration of an example of a template used for forming an anisotropic conductive sheet.

FIG. 9 is an explanatory sectional view showing a state in which an insulating elastomer layer is formed on the surface of a template.

FIG. 10 is an explanatory sectional view showing a state in which a space is formed in the insulating elastomer layer.

FIG. 11 is an explanatory cross-sectional view showing a state in which a sheet forming material layer is formed in a space formed in the insulating elastomer layer.

FIG. 12 is an explanatory cross-sectional view showing a state where a template on which an insulating elastomer layer and a sheet forming material layer are formed is arranged on the surface of a circuit board for inspection.

FIG. 13 is an explanatory cross-sectional view showing a configuration of a main part in an example of the circuit device inspection device of the present invention.

FIG. 14 is an explanatory cross-sectional view showing the configuration of another example of the circuit device inspection device of the present invention.

FIG. 15 is an explanatory sectional view showing a configuration of an example of an electronic component mounting structure of the present invention.

FIG. 16 is an explanatory cross-sectional view showing a configuration of an example of an anisotropic conductive sheet according to the present invention having a support.

FIG. 17 is an explanatory sectional view schematically showing a state of conductive particles in a conventional anisotropic conductive sheet.

FIG. 18 is an explanatory cross-sectional view schematically showing a state of conductive particles when the anisotropic conductive sheet shown in FIG. 17 is pressed in the thickness direction.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 circuit device to be inspected 2 electrode to be inspected 5 circuit substrate to be inspected 6, 7 electrode to be inspected 8 holder 9 positioning pin 10 anisotropic conductive sheet 10A sheet forming material layer 11 conductive path forming part 11A part to be a conductive path forming part DESCRIPTION OF SYMBOLS 12 Insulation part 15 Support body 20 Inspection circuit board 21 Inspection electrode 21A Surface part 21B Base layer part 22 Terminal electrode 23 Internal wiring part 30 Anisotropic conductive sheet 30A Sheet forming material layer 30B Insulating elastomer layer 30S Space 31 Conducting path formation Part 32 Insulating part 35a Upper adapter 35b Lower adapter 40 Template 41 Ferromagnetic substrate 42 Ferromagnetic layer 43 Nonmagnetic layer 50 Upper die 51 Ferromagnetic substrate 52 Ferromagnetic layer 53 Nonmagnetic Layer portion 54 Spacer 55 Lower mold 56 Ferromagnetic substrate 57 Ferromagnetic layer portion 58 Non-magnetic Layer portion 60a Upper inspection head 60b Lower inspection head 61a, 61b Electrode device 62a, 62b Connection electrode 63a, 63b Wire wiring 64a, 64b Post 65a, 65b Anisotropic conductive sheet 66a Upper support plate 66b Lower support plate 67a, 67b Connector 71 Electronic component 72 Electrode 73 Circuit board 74 Electrode 75 Fixing member 90 Circuit device 91 Inspection electrode 95 Inspection circuit board 96 Inspection electrode C Chain E Elastomeric polymer P Conductive particle R Inspection execution area

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Naofumi Yasuda 2-11-24 Tsukiji, Chuo-ku, Tokyo Inside JSR Co., Ltd. (72) Inventor Daisuke Yamada 289-1 Saruta, Hidaka-shi, Saitama FSR term in the SS Microtech (reference) 5E051 CA03 5G307 HA02 HB03 HC02

Claims (11)

[Claims] 1. An anisotropic conductive sheet in which conductive particles exhibiting magnetism are contained in an elastic polymer substance in a state oriented in a thickness direction, wherein the elastic polymer substance has a durometer hardness of 20 to 90. An anisotropic conductive sheet, wherein a lubricant or a release agent is applied to a surface of the conductive particles. 2. The coating amount of a lubricant or a release agent applied to the surface of the conductive particles is determined by setting the number average particle diameter of the conductive particles to D.
2. The anisotropic conductive sheet according to claim 1, wherein n (μm) is 10 / Dn to 150 / Dn parts by mass with respect to 100 parts by mass of the conductive particles. 3. The anisotropically conductive sheet according to claim 1, wherein the lubricant or the release agent applied to the surface of the conductive particles contains silicone oil. . 4. The anisotropically conductive sheet according to claim 3, wherein the silicone oil has a fluorine atom in its molecule. 5. The anisotropic conductive material according to claim 1, wherein the lubricant or the release agent applied to the surface of the conductive particles is a fluorine-based lubricant or a release agent. Sheet. 6. A semiconductor device comprising: a plurality of conductive path forming portions each densely containing conductive particles and each extending in a thickness direction; and an insulating portion for insulating these conductive path forming portions from each other. An anisotropic conductive sheet according to any one of claims 1 to 5. 7. A lubricant or a release agent is applied to the surface of the conductive particles exhibiting magnetism, and the conductive particles to which the lubricant or the release agent is applied are converted into an elastic polymer substance by a curing treatment. Forming a sheet-forming material layer dispersed in the material for an elastic polymer substance, applying a magnetic field to the sheet-forming material layer in the thickness direction thereof, and curing the sheet-forming material layer. A method for producing an anisotropic conductive sheet, comprising: 8. A circuit board for inspection on which a plurality of electrodes for inspection are formed in accordance with a pattern corresponding to an electrode to be inspected of a circuit device to be inspected on the surface, and a circuit board integrally provided on the surface of the circuit board for inspection. An adapter for inspecting a circuit device, comprising: the anisotropic conductive sheet according to claim 1. 9. The circuit device inspection adapter according to claim 8, wherein each of the inspection electrodes on the inspection circuit board is at least partially formed of a magnetic material. 10. A circuit board for inspection on which a plurality of electrodes for inspection are formed in accordance with a pattern corresponding to an electrode to be inspected of a circuit device to be inspected on a surface, and an inspection circuit board interposed between the circuit board for inspection and the circuit device. An inspection apparatus for a circuit device, comprising: an anisotropic conductive sheet according to any one of claims 1 to 6. 11. An electronic component mounting structure, wherein an electronic component is electrically connected to a circuit board via the anisotropic conductive sheet according to claim 1.