JP4385767B2 - Anisotropic conductive connector, manufacturing method thereof, and circuit device inspection apparatus - Google Patents

Description

  The present invention relates to an anisotropic conductive connector used for inspecting a circuit device such as a semiconductor integrated circuit, a method for manufacturing the same, and an inspection device for a circuit device including the anisotropic conductive connector. The present invention relates to an anisotropic conductive connector that can be suitably used for inspecting a circuit device such as a semiconductor integrated circuit having a protruding electrode, a manufacturing method thereof, and a circuit device inspection device.

  An anisotropic conductive sheet has conductivity only in the thickness direction, or has a pressure conductive area that shows conductivity only in the thickness direction when pressed in the thickness direction. Because it has features such as being able to achieve a compact electrical connection without using means such as mechanical fitting, and being able to make a soft connection by absorbing mechanical shocks and strains, Utilizing such features, for example, in the fields of electronic computers, electronic digital watches, electronic cameras, computer keyboards, etc., electrical connections between circuit devices, such as printed circuit boards, leadless chip carriers, liquid crystal panels, etc. It is widely used as a connector for achieving electrical connection with the like.

  In the electrical inspection of circuit devices such as printed circuit boards and semiconductor integrated circuits, for example, electrodes to be inspected formed on one surface of the circuit device to be inspected and for inspection formed on the surface of the circuit substrate for inspection In order to achieve electrical connection with the electrodes, an anisotropic conductive sheet is interposed as a connector between the electrode region of the circuit device and the inspection electrode region of the circuit board for inspection.

  Conventionally, such an anisotropic conductive sheet is obtained by uniformly dispersing metal particles in an elastomer (see, for example, Patent Document 1), by dispersing a conductive magnetic metal in an elastomer nonuniformly. A plurality of conductive path forming portions extending in the thickness direction and insulating portions that insulate them from each other (see, for example, Patent Document 2), a step between the surface of the conductive path forming portion and the insulating portion There are various types of structures such as those formed with (for example, see Patent Document 3).

In these anisotropic conductive sheets, the conductive elastic particles are contained in an insulating elastic polymer substance so that the conductive particles are aligned in the thickness direction, and a conductive path is formed by a chain of a large number of conductive particles. ing.
Such an anisotropic conductive sheet is made by, for example, injecting a molding material containing conductive particles exhibiting magnetism into a polymer material forming material that is cured to become an elastic polymer material into a molding space of a mold. Thus, a molding material layer can be formed, and a magnetic field can be applied to the molding material layer for curing treatment.

However, in the electrical inspection of a circuit device having a protruding electrode made of a solder alloy such as a solder ball electrode, there are the following problems when a conventional anisotropic conductive sheet is used as a connector.
That is, when electrical inspection is continuously performed for a large number of circuit devices, the operation of pressing the protruding electrodes, which are the electrodes to be inspected of the circuit device to be inspected, against the surface of the anisotropic conductive sheet is repeated many times. As a result, the surface of the anisotropic conductive sheet is subject to permanent deformation due to pressure contact of the protruding electrodes, or deformation due to wear. As the electrical resistance value increases and the electrical resistance value of each conductive path forming portion varies, there is a problem that it becomes difficult to inspect the subsequent circuit device.
In addition, as the conductive particles for constituting the conductive path forming portion, in order to obtain good conductivity, those usually formed with a coating layer made of gold are used. By conducting the electrical inspection continuously, the electrode material (solder alloy) constituting the electrode to be inspected in the circuit device moves to the coating layer of the conductive particles in the anisotropic conductive sheet. As a result of the alteration of the layer, there is a problem that the conductivity of the conductive path forming portion is lowered.

  In order to solve the above problem, in the inspection of a circuit device, a plurality of metal electrode bodies extending in the thickness direction are arranged on an anisotropic conductive sheet and a flexible insulating sheet made of a resin material. A circuit device inspection jig is constituted by the sheet-like connector, and the circuit device to be inspected is brought into contact with the metal electrode body of the sheet-like connector in the circuit device inspection jig and pressed. (See, for example, Patent Document 4).

However, in the circuit device inspection jig described above, when the pitch of the electrodes to be inspected of the circuit device to be inspected is small, that is, when the pitch of the metal electrode body in the sheet-like connector is small, the required for the circuit device It is difficult to achieve electrical connection. More specifically, in a sheet-like connector in which the pitch of the metal electrode bodies is small, the adjacent metal electrode bodies interfere with each other, so that the flexibility between the adjacent metal electrode bodies decreases. Therefore, if the circuit device to be inspected has a low surface accuracy of the substrate, a substrate having a low thickness uniformity, or a device having a large variation in the height of the electrode to be inspected, the circuit device The metal electrode body in the sheet-like connector cannot be reliably brought into contact with all the electrodes to be inspected, and as a result, good electrical connection to the circuit device cannot be obtained.
Further, even if it is possible to achieve a good electrical connection state for all the electrodes to be inspected, it is necessary to press the metal electrode body with a considerably large pressing force to the electrodes to be inspected. The entire inspection apparatus including the pressing mechanism for press-contacting the electrode to be inspected becomes large, the manufacturing cost of the entire inspection apparatus increases, and a considerably large pressing force is applied to the anisotropic conductive sheet. Therefore, there is a problem that the service life of the anisotropic conductive sheet is shortened.

Further, in a test in which a circuit device is inspected in a high temperature environment, such as a burn-in test, the thermal expansion coefficient of the elastic polymer material forming the anisotropic conductive sheet and the heat of the resin material forming the insulating sheet in the sheet-like connector As a result of displacement between the conductive path forming portion of the anisotropic conductive sheet and the metal electrode body of the sheet-like connector due to the difference from the expansion coefficient, a good electrical connection state can be stably maintained. Is difficult.
Further, in the case of configuring a circuit device inspection jig, it is necessary to manufacture a sheet-like connector in addition to manufacturing an anisotropic conductive sheet, and further, fix these in an aligned state. Therefore, the manufacturing cost of the entire apparatus required for inspection increases.

Furthermore, the conventional anisotropic conductive sheet has the following problems.
That is, since the elastic polymer material that forms the anisotropic conductive sheet, such as silicone rubber, has adhesiveness at a high temperature, the anisotropic conductive sheet formed of such an elastic polymer material has a high temperature environment. If the circuit device is left under pressure for a long time under the circuit device, it is easy to adhere to the circuit device. Then, when the projecting electrode is brought into pressure contact with the conductive path forming portion in the anisotropic conductive sheet and the elastic force of the conductive path forming portion is reduced, the circuit device is removed from the anisotropic conductive sheet. The circuit device is not easily peeled off, and therefore, it is not possible to smoothly replace the circuit device that has been inspected with an uninspected circuit device. As a result, the inspection efficiency of the circuit device is lowered. In particular, when the anisotropic conductive sheet adheres to the circuit device with high strength, it becomes difficult to peel the circuit device from the anisotropic conductive sheet without damaging the anisotropic conductive sheet. The anisotropic conductive sheet cannot be used for subsequent inspection.

JP 51-93393 A Japanese Unexamined Patent Publication No. 53-147772 JP-A-61-250906 Japanese Patent Laid-Open No. 7-231019

The present invention has been made based on the circumstances as described above, and the first object thereof is to permanently deform the connection target electrode by pressure contact even if the connection target electrode has a protruding shape. Further, anisotropic conductivity that suppresses deformation due to wear and can provide stable conductivity over a long period of time even when repeatedly pressed, and can prevent or suppress adhesion of the connection object. Is to provide a sex connector.
A second object of the present invention is an anisotropic conductive connector that is preferably used for electrical inspection of a circuit device, and even if the electrode to be inspected in the circuit device has a protruding shape, An object of the present invention is to provide an anisotropic conductive connector in which permanent deformation due to pressure contact and deformation due to wear are suppressed and stable conductivity can be obtained over a long period of time even when repeatedly pressed.
In addition to the second object described above, the third object of the present invention is to prevent or suppress the migration of the electrode material of the electrode to be inspected into conductive particles, and to obtain stable conductivity over a long period of time. Moreover, it is an object of the present invention to provide an anisotropic conductive connector capable of preventing or suppressing adhesion to a circuit device even when used in a state of being pressed against the circuit device in a high temperature environment.
A fourth object of the present invention is to provide a method capable of advantageously manufacturing the anisotropic conductive connector.
A fifth object of the present invention is to provide an inspection device for a circuit device including the anisotropic conductive connector.

An anisotropic conductive connector according to the present invention is an anisotropic conductive connector having an anisotropic conductive film in which a plurality of conductive path forming portions extending in the thickness direction are arranged in a state of being insulated from each other by an insulating portion. And
The anisotropic conductive film is formed of an insulating elastic polymer material, and the conductive path forming portion contains conductive particles exhibiting magnetism. The anisotropic conductive film has a surface layer portion on one side of the anisotropic conductive film. Is characterized by containing a reinforcing material made of an insulating mesh or non-woven fabric.

In the anisotropic conductive connector of the present invention, the reinforcing material is made of a mesh, and the ratio r1 / r2 is 1.5 to 13 when the opening diameter of the mesh is r1 and the average particle diameter of the conductive particles is r2. And the opening diameter of the mesh is preferably 500 μm or less.

  Moreover, in the anisotropic conductive connector of this invention, it is preferable that the support body which supports the peripheral part of an anisotropic conductive film is provided.

  The anisotropic conductive connector of the present invention is interposed between a circuit device to be inspected and a circuit board for inspection, and performs electrical connection between the electrode to be inspected of the circuit device and the inspection electrode of the circuit board. In such an anisotropic conductive connector, a reinforcing layer made of an insulating mesh or non-woven cloth is provided on the surface layer portion of the anisotropic conductive film that contacts the circuit device. It is preferable that the material is contained.

Further, in the above anisotropic conductive connector, it is preferable that the surface layer portion on one side contacting the circuit device in the anisotropic conductive film contains particles that do not exhibit conductivity and magnetism. More preferably, the particles that do not exhibit magnetism are diamond powder.
In the anisotropic conductive connector described above, the anisotropic conductive film is electrically connected to the electrode to be inspected in addition to the conductive path forming portion electrically connected to the electrode to be inspected of the circuit device to be inspected. The conductive path forming portion that is not connected to the electrode may be formed, and the conductive path forming portion that is not electrically connected to the inspected electrode of the circuit device to be inspected is at least the periphery of the anisotropic conductive film supported by the support It may be formed in the part.
In the anisotropic conductive connector, the conductive path forming portions may be arranged at a constant pitch.

The method for manufacturing an anisotropic conductive connector according to the present invention includes an anisotropic conductive film having an anisotropic conductive film in which a plurality of conductive path forming portions each extending in the thickness direction are disposed in a state of being insulated from each other by an insulating portion. A method of manufacturing a connector comprising:
Prepare a mold for forming an anisotropic conductive film in which a molding space is formed by a pair of molds,
On the molding surface of one mold, a reinforcing material made of an insulating mesh or non-woven fabric and conductive particles showing magnetism are contained in a liquid polymer material-forming material that is cured to become an elastic polymer material. Forming a molding material layer, and forming a molding material layer containing conductive particles in a liquid polymer substance forming material which is cured to become an elastic polymer substance on the molding surface of the other mold;
The molding material layer formed on the molding surface of the one mold and the molding material layer formed on the molding surface of the other mold are stacked, and then the strength distribution is increased in the thickness direction of each molding material layer. The method has a step of forming an anisotropic conductive film by applying a magnetic field to the molding material and curing the molding material layers.

An inspection apparatus for a circuit device according to the present invention includes an inspection circuit board having an inspection electrode arranged corresponding to an inspection target electrode of a circuit device to be inspected,
It comprises the above-mentioned anisotropic conductive connector disposed on the circuit board for inspection.

  In the inspection apparatus for a circuit device according to the present invention, the pressure relief frame for relaxing the pressure applied to the electrode to be inspected against the anisotropic conductive film of the anisotropic conductive connector includes the circuit device to be inspected and the anisotropic conductive connector. It is preferable that the pressure-relieving frame is one having spring elasticity or rubber elasticity.

According to the anisotropic conductive connector of the present invention, the surface layer portion on one side of the anisotropic conductive film contains a reinforcing material made of an insulating mesh or non-woven fabric, so that the connection target electrode has a protruding shape. Even so, it is possible to suppress the permanent deformation due to the pressure contact of the connection target electrode and the deformation due to wear. Moreover, since the reinforcing material is not present in the portion other than the surface layer portion on the one surface side in the anisotropic conductive film, the elastic polymer material that forms the anisotropic conductive film when the conductive path forming portion is pressurized. As a result of sufficiently exhibiting its own elasticity, the required conductivity can be reliably obtained. Therefore, even when repeatedly pressed by the connection target electrode, stable conductivity can be obtained over a long period of time.
Further, since the permanent deformation due to the pressure contact of the connection target electrode in the conductive path forming portion is small and the elastic force is stably maintained for a long period of time, it is possible to reliably prevent or suppress the connection target body from adhering. it can.

  In addition, the inclusion of particles that do not exhibit conductivity and magnetism in the surface layer portion of the one surface increases the hardness of the surface layer portion of the one surface side. Therefore, permanent deformation due to pressure contact of the connection target electrode, deformation due to wear Can be further suppressed, and since it is prevented or suppressed that the electrode material migrates to the conductive particles in the anisotropic conductive film, more stable conductivity can be obtained over a long period of time, In addition, in the electrical inspection of a circuit device, even when used in a state of being pressed against the circuit device in a high temperature environment, it is possible to more reliably prevent or suppress adhesion to the circuit device.

  According to the anisotropic conductive connector manufacturing method of the present invention, a molding material layer containing a reinforcing material formed on the molding surface of one mold, and a molding material layer formed on the molding surface of the other mold, In order to cure each molding material layer in this state, an anisotropic conductive connector having an anisotropic conductive film containing a reinforcing material only in the surface layer portion on one side is advantageously and reliably manufactured. be able to.

According to the circuit device inspection apparatus of the present invention, since the anisotropic conductive connector is provided, even if the electrode to be inspected is a protrusion, permanent deformation due to the pressure contact of the electrode to be inspected or Since deformation due to wear is suppressed, even when a large number of circuit devices are continuously inspected, stable conductivity can be obtained over a long period of time, and the anisotropic conductive connector has a circuit device. Can be reliably prevented or suppressed.
Further, according to the inspection apparatus for a circuit device of the present invention, it is not necessary to use a sheet-like connector in addition to the anisotropic conductive connector described above, so that the alignment between the anisotropic conductive connector and the sheet-like connector is achieved. Can be avoided, the problem of misalignment between the sheet-like connector and the anisotropic conductive connector due to temperature change can be avoided, and the configuration of the inspection apparatus is easy.
In addition, by providing a pressure relief frame between the circuit device to be inspected and the anisotropic conductive connector, the pressure of the electrode to be inspected against the anisotropic conductive film of the anisotropic conductive connector is relaxed. Stable conductivity can be obtained over a longer period.
Moreover, since the magnitude of the impact applied to the anisotropic conductive film by the electrode to be inspected can be reduced by using a spring pressure or rubber elasticity as the pressure relief frame, the anisotropic conductive film can be damaged or Other failures can be prevented or suppressed, and when the applied pressure to the anisotropic conductive film is released, the circuit device is easily detached from the anisotropic conductive film by the spring elasticity of the applied pressure relaxation frame. Therefore, it is possible to smoothly replace the circuit device that has been inspected with an uninspected circuit device. As a result, the inspection efficiency of the circuit device can be improved.

Hereinafter, embodiments of the present invention will be described in detail.
1, 2, and 3 are explanatory views showing the configuration of an example of the anisotropic conductive connector according to the present invention, FIG. 1 is a plan view, FIG. 2 is a cross-sectional view taken along the line AA in FIG. It is a partial expanded sectional view. The anisotropic conductive connector 10 includes a rectangular anisotropic conductive film 10A and a rectangular plate-like support 71 that supports the anisotropic conductive film 10A, and is formed in a sheet shape as a whole.
As shown in FIGS. 4 and 5, a rectangular opening 73 having a size smaller than the anisotropic conductive film 10 </ b> A is formed at the center position of the support 71, and positioning holes 72 are formed at the four corner positions. Is formed. The anisotropic conductive film 10 </ b> A is disposed in the opening 73 of the support 71, and the peripheral edge of the anisotropic conductive film 10 </ b> A is fixed to the support 71, thereby being supported by the support 71.

An anisotropic conductive film 10A in the anisotropic conductive connector 10 includes a plurality of columnar conductive path forming portions 11 extending in the thickness direction and insulating portions 15 that insulate the conductive path forming portions 11 from each other. Has been.
Further, the anisotropic conductive film 10A is entirely formed of an insulating elastic polymer material, and the conductive path forming portion 11 is oriented such that magnetic conductive particles (not shown) are aligned in the thickness direction. It is contained in. On the other hand, the insulating part 15 contains no or almost no conductive particles.
Further, a reinforcing material (not shown) made of an insulating mesh or non-woven fabric is provided on a surface layer portion (hereinafter referred to as “one surface side surface layer portion”) 10B on one side (upper surface side in the drawing) of the anisotropic conductive film 10A. Contained. On the other hand, a portion (hereinafter also referred to as “another layer portion”) 10C other than the one-surface-side surface portion 10B in the anisotropic conductive film 10A has no reinforcing material.

In the illustrated example, among the plurality of conductive path forming portions 11, those formed in regions other than the peripheral portion in the anisotropic conductive film 10 </ b> A serve as connection target electrodes, for example, inspection target electrodes in the circuit device 1 to be inspected. The effective conductive path forming unit 12 is electrically connected, and the one formed on the peripheral edge of the anisotropic conductive unit 10A is the invalid conductive path forming unit 13 that is not electrically connected to the connection target electrode. The effective conductive path forming portion 12 is arranged according to a pattern corresponding to the pattern of the connection target electrode.
On the other hand, the insulating part 15 is integrally formed so as to surround the periphery of each conductive path forming part 11, whereby all the conductive path forming parts 11 are insulated from each other by the insulating part 15. Has been.

In the anisotropic conductive connector 10 of this example, one surface of the anisotropic conductive film 10A, that is, the surface of the one surface side surface layer portion 10B is a flat surface, while a conductive path is formed on the other surface of the anisotropic conductive film 10A. A protruding portion 11 a is formed in which the surface of the portion 11 protrudes from the surface of the insulating portion 15.
Further, the one surface side surface layer portion 10B of the anisotropic conductive film 10A contains particles that do not exhibit magnetism and conductivity (hereinafter referred to as “nonmagnetic insulating particles”).

  The elastic polymer material forming the anisotropic conductive film 10A preferably has a durometer A hardness of 15 to 70, more preferably 25 to 65. When the durometer A hardness is too small, high repetition durability may not be obtained. On the other hand, when the durometer A hardness is excessive, a conductive path forming part having high conductivity may not be obtained.

  As the elastic polymer material forming the anisotropic conductive film 10A, a polymer material having a crosslinked structure is preferable. Various materials can be used as the curable polymer substance-forming material that can be used to obtain such an elastic polymer substance. Specific examples thereof include polybutadiene rubber, natural rubber, and polyisoprene rubber. , Conjugated diene rubbers such as styrene-butadiene copolymer rubber and acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, blocks such as styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer, etc. Examples thereof include copolymer rubber and hydrogenated products thereof, chloroprene, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, and ethylene-propylene-diene copolymer rubber. In the above, when weather resistance is required for the anisotropically conductive connector 10 to be obtained, it is preferable to use one other than the conjugated diene rubber, and in particular, from the viewpoint of molding processability and electrical characteristics, silicone rubber is preferably used. It is preferable to use it.

As the silicone rubber, those obtained by crosslinking or condensing liquid silicone rubber are preferable. The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10 ⁻¹ sec, and may be any of a condensation type, an addition type, a vinyl group or a hydroxyl group. Good. Specific examples include dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, methyl phenyl vinyl silicone raw rubber, and the like.
The silicone rubber preferably has a molecular weight Mw (referred to as a standard polystyrene-converted weight average molecular weight; the same shall apply hereinafter) of 10,000 to 40,000. Moreover, since favorable heat resistance is acquired in the obtained conductive path formation part 11, it says the value of molecular weight distribution index (ratio Mw / Mn of standard polystyrene conversion weight average molecular weight Mw and standard polystyrene conversion number average molecular weight Mn). The same shall apply hereinafter) is preferably 2 or less.

As the conductive particles contained in the conductive path forming part 11 in the anisotropic conductive film 10A, conductive particles exhibiting magnetism are used because the particles can be easily oriented by a method described later. Specific examples of such conductive particles include particles of metal having magnetism such as iron, cobalt, nickel, particles of these alloys, particles containing these metals, or these particles as core particles, The core particles are formed by plating the surface of the core particles with a metal having good conductivity such as gold, silver, palladium, rhodium, or non-magnetic metal particles or inorganic particles such as glass beads or polymer particles. The surface of the particles may be plated with a conductive magnetic metal such as nickel or cobalt.
Among these, it is preferable to use nickel particles as core particles and the surfaces thereof plated with gold having good conductivity.
The means for coating the surface of the core particles with the conductive metal is not particularly limited, and for example, chemical plating or electrolytic plating, sputtering, vapor deposition or the like is used.

When using conductive particles whose core particles are coated with a conductive metal, good conductivity can be obtained, so that the conductive metal coverage on the particle surface (relative to the surface area of the core particles). The ratio of the conductive metal coating area) is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.
Further, the coating amount of the conductive metal is preferably 0.5 to 50% by mass of the core particle, more preferably 2 to 30% by mass, further preferably 3 to 25% by mass, and particularly preferably 4 to 20%. % By mass. When the conductive metal to be coated is gold, the coating amount is preferably 0.5 to 30% by mass of the core particles, more preferably 2 to 20% by mass, and further preferably 3 to 15%. % By mass.

Moreover, it is preferable that the particle diameter of electroconductive particle is 1-100 micrometers, More preferably, it is 2-50 micrometers, More preferably, it is 3-30 micrometers, Most preferably, it is 4-20 micrometers.
Moreover, it is preferable that the particle diameter distribution (Dw / Dn) of electroconductive particle is 1-10, More preferably, it is 1.01-7, More preferably, it is 1.05-5, Most preferably, it is 1.1- 4.
By using the conductive particles satisfying such conditions, the obtained conductive path forming portion 11 is easily deformed under pressure, and sufficient electric power is provided between the conductive particles in the conductive path forming portion 11. Contact is obtained.
The shape of the conductive particles is not particularly limited, but is spherical, star-shaped, or secondary in which they are aggregated in that they can be easily dispersed in the polymer material-forming material. Particles are preferred.
In addition, a conductive particle whose surface is treated with a coupling agent such as a silane coupling agent or a lubricant can be appropriately used. By treating the particle surface with a coupling agent or a lubricant, the durability of the anisotropically conductive connector is improved.

  Such conductive particles are preferably used at a volume ratio of 5 to 60%, preferably 7 to 50%, based on the polymer substance-forming material. When this ratio is less than 5%, the conductive path forming portion 11 having a sufficiently small electric resistance value may not be obtained. On the other hand, when this ratio exceeds 60%, the obtained conductive path forming part 11 tends to be fragile, and the elasticity required for the conductive path forming part 11 may not be obtained.

  As the conductive particles used for the conductive path forming portion 11, those having a surface covered with gold are preferable. However, the connection target electrode, for example, the inspection target electrode of the circuit device to be inspected is made of a lead alloy containing lead. The conductive particles contained in the one surface side surface layer portion 10B in contact with the electrode to be inspected made of the solder alloy are rhodium, palladium, ruthenium, tungsten, molybdenum, platinum, iridium, silver and the like. It is preferable that it is coated with a diffusion-resistant metal selected from an alloy containing, thereby preventing the lead component from diffusing into the coating layer of the conductive particles.

The conductive particles having a surface coated with a diffusion-resistant metal are, for example, a chemical plating or electrolytic plating method, a sputtering method, a vapor deposition method on the surface of a core particle made of nickel, iron, cobalt, or an alloy thereof. For example, it can be formed by coating a diffusion-resistant metal.
Moreover, it is preferable that the coating amount of a diffusion-resistant metal is a ratio of 5 to 40%, preferably 10 to 30% by mass fraction with respect to the conductive particles.

As the mesh or the nonwoven fabric constituting the reinforcing material contained in the one-surface-side surface layer portion 10B in the anisotropic conductive film 10A, those formed of organic fibers can be preferably used.
Examples of such organic fibers include fluorine resin fibers such as polytetrafluoroethylene fibers, aramid fibers, polyethylene fibers, polyarylate fibers, nylon fibers, and polyester fibers.
Moreover, as an organic fiber, the linear thermal expansion coefficient is equal to or close to the linear thermal expansion coefficient of the material forming the connection object, specifically, the linear thermal expansion coefficient is 30 × 10 ⁻⁶ to ⁻⁵ × 10. ^-6 / K, especially 10 × 10 ⁻⁶ to −3 × 10 ⁻⁶ / K, the thermal expansion of the anisotropic conductive film 10A is suppressed, and the thermal history due to the temperature change was received. Even in this case, a good electrical connection state with respect to the connection object can be stably maintained.
Moreover, as an organic fiber, it is preferable to use the thing whose diameter is 10-200 micrometers.

As the mesh constituting the reinforcing material, the ratio r1 / r2 is preferably 1.5 or more, more preferably when the opening diameter of the mesh is r1 and the average particle diameter of the conductive particles used is r2. Is 2 or more, more preferably 3 or more, and particularly preferably 4 or more. When this ratio r1 / r2 is too small, in the manufacturing method described later, the conductive particles are difficult to be oriented in the thickness direction, so that it may be difficult to obtain a conductive path forming portion having a small electric resistance value. is there.
The mesh opening diameter r1 is preferably 500 μm or less, more preferably 400 μm or less, and particularly preferably 300 μm or less. If the opening diameter r1 is excessive, it may be difficult to obtain an anisotropic conductive connector having high durability.
As the non-woven fabric constituting the reinforcing material, it is preferable to use a non-woven fabric produced by a wet papermaking technique using the short fibers of the organic fibers as a raw material.
Further, the thickness of the reinforcing material is preferably 10 to 70% of the thickness of the anisotropic conductive film 10A to be formed, specifically, the thickness is preferably 50 to 500 μm, more preferably 80 to 400 μm. Here, the thickness of the reinforcing material is a value measured by a micrometer.
Further, the reinforcing material is appropriately selected in consideration of easiness of impregnation with a liquid polymer material forming material, which will be described later, and the balance between flexibility and dimensional stability. The opening ratio (void ratio) is 25. It is preferable to use ˜75%, more preferably 30 to 60%.

As the nonmagnetic insulating particles contained in the one surface side surface layer portion 10B in the anisotropic conductive film 10A, diamond powder, glass powder, ceramic powder, ordinary silica powder, colloidal silica, airgel silica, alumina, or the like can be used. Of these, diamond powder is preferred.
By including such non-magnetic insulating particles in the one-surface-side surface layer portion 10B, the hardness of the one-surface-side surface layer portion 10B is further increased, high repetition durability is obtained, and a lead component constituting the electrode to be inspected Can be prevented from diffusing with respect to the coating layer in the conductive particles, and further, the adhesion of the anisotropic conductive film 10A to the circuit device to be inspected can be suppressed.

The particle diameter of the nonmagnetic insulating particles is preferably 0.1 to 50 μm, more preferably 0.5 to 40 μm, and still more preferably 1 to 30 μm. When this particle diameter is too small, it is difficult to sufficiently impart an effect of suppressing permanent deformation or deformation due to wear to the obtained one-surface-side surface layer portion 10B. In addition, if a large amount of non-magnetic insulating particles having an excessively small particle diameter is used, the fluidity of the molding material for obtaining the one-surface-side surface layer portion 10B is lowered. It may be difficult to align.
On the other hand, when the particle diameter is excessive, it is difficult to obtain the conductive path forming portion 11 having a low electric resistance value because the nonmagnetic insulating particles are present in the conductive path forming portion 11. is there.

  The amount of the non-magnetic insulating particles used is not particularly limited, but if the amount used is small, the hardness of the one surface side surface layer portion 10B cannot be increased. In the manufacturing method, the orientation of the conductive particles by the magnetic field cannot be sufficiently achieved, which is not preferable. The practical use amount of the nonmagnetic insulating particles is 5 to 90 parts by weight with respect to 100 parts by weight of the elastic polymer material constituting the one surface side surface layer part 10B.

As a material constituting the support 71, a material having a linear thermal expansion coefficient of 3 × 10 ⁻⁵ / K or less is preferably used, more preferably 2 × 10 ⁻⁵ to 1 × 10 ⁻⁶ / K, particularly preferably. Is 6 × 10 ⁻⁶ to 1 × 10 ⁻⁶ / K.
As such a material, a metal material or a non-metal material can be used.
As the metal material, gold, silver, copper, iron, nickel, cobalt, or an alloy thereof can be used.
Nonmetallic materials include resin materials with high mechanical strength such as polyimide resin, polyester resin, polyaramid resin, polyamide resin, fibers such as glass fiber reinforced epoxy resin, glass fiber reinforced polyester resin, glass fiber reinforced polyimide resin, etc. Composite resin materials such as reinforced resin materials, epoxy resins, etc. mixed with inorganic materials such as silica, alumina, and boron nitride as fillers can be used. A fiber reinforced resin material such as an epoxy resin and a composite resin material such as an epoxy resin mixed with boron nitride as a filler are preferable.

According to the anisotropic conductive connector 10 described above, the surface layer portion 10B on the one surface side of the anisotropic conductive film 10A contains the reinforcing material made of an insulating mesh or a nonwoven fabric. Even if it is a thing, it can suppress that the permanent deformation | transformation by the press-contact of the said connection object electrode and the deformation | transformation by abrasion arise. Moreover, in the other layer portion 10C of the anisotropic conductive film 10A, since the reinforcing material does not exist, the elastic polymer material that forms the anisotropic conductive film 10A when the conductive path forming portion 11 is pressurized. As a result of sufficiently exhibiting its own elasticity, the required conductivity can be reliably obtained. Therefore, even when repeatedly pressed by the connection target electrode, stable conductivity can be obtained over a long period of time.
Further, since the permanent deformation due to the pressure contact of the connection target electrode in the conductive path forming portion 11 is small and the elastic force is stably maintained over a long period of time, it is possible to reliably prevent or suppress the connection target body from adhering. Can do.

  Further, since the one surface side surface layer portion 10B of the anisotropic conductive film 10A contains non-magnetic insulating particles, the hardness of the one surface side surface layer portion 10B increases, so that the surface of the anisotropic conductive film 10B becomes permanent due to the pressure contact of the connection target electrode. Further deformation, and deformation due to wear can be further suppressed, and further, since the electrode material is prevented or suppressed from being transferred to the conductive particles, more stable conductivity can be obtained over a long period of time. In addition, in the electrical inspection of a circuit device, even when used in a state of being pressed against the circuit device in a high temperature environment, it is possible to more reliably prevent or suppress adhesion to the circuit device.

Such an anisotropic conductive connector 10 can be manufactured as follows, for example.
FIG. 6 is an explanatory cross-sectional view showing the configuration of an example of a mold used for manufacturing the anisotropic conductive connector of the present invention. This mold is configured such that an upper mold 50 and a lower mold 55 paired with the upper mold 50 are arranged so as to face each other, and a molding surface (lower surface in FIG. 6) of the upper mold 50 and a molding surface of the lower mold 55 (FIG. 6, a molding space 59 is formed between the upper surface and the upper surface.
In the upper mold 50, the ferromagnetic layer 52 is formed on the surface (lower surface in FIG. 6) of the ferromagnetic substrate 51 according to the arrangement pattern corresponding to the pattern of the conductive path forming portion 11 in the target anisotropic conductive connector 10. At portions other than the ferromagnetic layer 52 formed, a portion 53b (hereinafter simply referred to as “portion 53b”) having a thickness substantially the same as the thickness of the ferromagnetic layer 52 and the ferromagnetic material are provided. A nonmagnetic layer 53 is formed which has a portion 53a (hereinafter simply referred to as “portion 53a”) having a thickness larger than the thickness of the layer 52, and between the portion 53a and the portion 53b in the nonmagnetic layer 53. A recess 60 is formed on the surface of the upper mold 50 due to the formation of the step.

  On the other hand, in the lower die 55, the ferromagnetic layer 57 is formed on the surface of the ferromagnetic substrate 56 (upper surface in FIG. 6) according to a pattern corresponding to the pattern of the conductive path forming portion 11 in the target anisotropic conductive connector 10. And a nonmagnetic layer 58 having a thickness larger than the thickness of the ferromagnetic layer 57 is formed at locations other than the ferromagnetic layer 57. The nonmagnetic layer 58 and the ferromagnetic layer Since a step is formed between the lower mold 55 and the lower mold 55, a recess 57a for forming the protruding portion 11a of the anisotropic conductive film 10A is formed on the molding surface of the lower mold 55.

  Ferromagnetic metals such as iron, iron-nickel alloy, iron-cobalt alloy, nickel, and cobalt can be used as materials constituting the ferromagnetic substrates 51 and 56 in each of the upper mold 50 and the lower mold 55. The ferromagnetic substrates 51 and 56 preferably have a thickness of 0.1 to 50 mm, have a smooth surface, are chemically degreased, and are mechanically polished. preferable.

  In addition, as a material constituting the ferromagnetic layers 52 and 57 in each of the upper mold 50 and the lower mold 55, a ferromagnetic metal such as iron, iron-nickel alloy, iron-cobalt alloy, nickel, or cobalt is used. it can. The ferromagnetic layers 52 and 57 preferably have a thickness of 10 μm or more. When this thickness is less than 10 μm, it becomes difficult to cause a magnetic field having a sufficient strength distribution to act on the molding material layer formed in the mold, and as a result, a conductive path in the molding material layer. Since it becomes difficult to gather the conductive particles at a high density in the portion to be the formation portion 11, a good anisotropic conductive connector may not be obtained.

In addition, as the material constituting the nonmagnetic layers 53 and 58 in each of the upper mold 50 and the lower mold 55, a nonmagnetic metal such as copper, a heat-resistant polymer substance, or the like can be used. It is preferable to use a polymer material cured by radiation in that the nonmagnetic layers 53 and 58 can be easily formed by the above method. Examples of the material include acrylic dry film resists and epoxy-based materials. A photoresist such as a liquid resist or a polyimide liquid resist can be used.
In addition, the thickness of the nonmagnetic layer 58 in the lower die 55 is set according to the protruding height of the protruding portion 11 a to be formed and the thickness of the ferromagnetic layer 57.

Using the above mold, for example, the anisotropic conductive connector 10 is manufactured as follows. First, as shown in FIGS. 4 and 5, frame-like spacers 54a and 54b having an opening at the center position, and a support 71 having an opening 73 and a positioning hole 72 are prepared. As shown in FIG. 7, the frame-shaped spacer 54 a is fixedly disposed at a predetermined position of the lower mold 55 via the frame-shaped spacer 54 b, and the frame-shaped spacer 54 a is further disposed on the support 71.
On the other hand, a paste for forming the one-surface-side surface layer portion 10B by dispersing conductive particles and nonmagnetic insulating particles exhibiting magnetism in a liquid polymer material-forming material that is cured to become an elastic polymer material. In order to form the other layer portion 10C by preparing a first molding material in the form of a magnetic material and dispersing conductive particles exhibiting magnetism in a polymer material-forming material that is cured to become an elastic polymer material A paste-like second molding material is prepared.
Next, as shown in FIG. 8, a sheet-like reinforcing material H made of an insulating mesh or nonwoven fabric is disposed in a recess 60 (see FIG. 6) on the molding surface of the upper mold 50, and further, in the recess 60. As shown in FIG. 9, the first molding material is filled with conductive particles showing magnetism, nonmagnetic insulating particles, and a reinforcing material, as shown in FIG. The material layer 61a is formed, while the second molding material is filled in the space formed by the lower mold 55, the spacers 54a and 54b, and the support 71, thereby exhibiting magnetism in the polymer material forming material. A second molding material layer 61b containing conductive particles is formed.
And as shown in FIG. 10, the 1st molding material layer 61a is stacked on the 2nd molding material layer 61b by aligning and arrange | positioning the upper mold | type 50 on the spacer 54a.

  Next, by operating electromagnets (not shown) disposed on the upper surface of the ferromagnetic substrate 51 in the upper mold 50 and the lower surface of the ferromagnetic substrate 56 in the lower mold 55, a parallel magnetic field having an intensity distribution, that is, the upper A parallel magnetic field having a high strength is applied between the ferromagnetic layer 52 of the mold 50 and the ferromagnetic layer 57 of the lower mold 55 corresponding to the thickness of the first molding material layer 61a and the second molding material layer 61b. Act in the direction. As a result, in the first molding material layer 61a and the second molding material layer 61b, the conductive particles dispersed in each molding material layer are transferred to each ferromagnetic layer 52 of the upper mold 50 and the same. They are gathered at the portion to be the conductive path forming portion 11 located between the corresponding lower layer 55 and the ferromagnetic layer 57, and are aligned so as to be aligned in the thickness direction of each molding material layer.

  In this state, by curing each molding material layer, as shown in FIG. 11, the conductive path is densely packed in a state in which the conductive particles are aligned in the thickness direction in the elastic polymer substance. Forming part 11 and insulating part 15 made of an insulating elastic polymer material formed so as to surround the periphery of conductive path forming part 11 and having no or almost no conductive particles. An anisotropic conductive film 10A containing a reinforcing material and nonmagnetic insulating particles is formed on the surface layer portion 10B, whereby the anisotropic conductive connector 10 having the configuration shown in FIGS. 1 to 3 is manufactured.

In the above, the curing treatment of each molding material layer can be performed in a state where the parallel magnetic field is applied, but can also be performed after the operation of the parallel magnetic field is stopped.
The intensity of the parallel magnetic field applied to each molding material layer is preferably such that the average is 20,000 to 1,000,000 μT.
Further, as a means for applying a parallel magnetic field to each molding material layer, a permanent magnet can be used instead of an electromagnet. The permanent magnet is preferably made of alnico (Fe—Al—Ni—Co alloy), ferrite, or the like in that a parallel magnetic field strength in the above range can be obtained.
The curing treatment of each molding material layer is appropriately selected depending on the material used, but is usually performed by heat treatment. The specific heating temperature and heating time are appropriately selected in consideration of the type of polymer substance forming material constituting the molding material layer, the time required to move the conductive particles, and the like.

According to such a manufacturing method, the first molding material layer 61a containing the reinforcing material formed on the molding surface of the upper mold 50 and the second molding material layer formed on the molding surface of the lower mold 55 are formed. In order to cure each molding material layer in this state, the anisotropic conductive connector 10 having the anisotropic conductive film 10A in which the reinforcing material is contained only in the surface layer portion 10B is advantageously and It can be manufactured reliably.

FIG. 12 is an explanatory diagram showing an outline of the configuration of an example of the circuit device inspection apparatus according to the present invention.
This circuit device inspection apparatus is provided with an inspection circuit board 5 having guide pins 9. On the surface of the inspection circuit board 9 (upper surface in FIG. 1), the inspection electrode 6 is formed according to a pattern corresponding to the pattern of the hemispherical solder ball electrode 2 in the circuit device 1 to be inspected.
An anisotropic conductive connector 10 having the configuration shown in FIGS. 1 to 3 is disposed on the surface of the inspection circuit board 5. Specifically, the conductive path is formed in the anisotropic conductive film 10A by inserting the guide pins 9 into the positioning holes 72 (see FIGS. 1 to 3) formed in the support 71 in the anisotropic conductive connector 10. The anisotropic conductive connector 10 is fixed on the surface of the inspection circuit board 5 with the portion 11 positioned so as to be positioned on the inspection electrode 6.

  In such a circuit device inspection device, the circuit device 1 is disposed on the anisotropic conductive connector 10 so that the solder ball electrode 2 is positioned on the conductive path forming portion 11, and in this state, for example, the circuit device By pressing 1 in the direction approaching the inspection circuit board 5, each of the conductive path forming portions 11 in the anisotropic conductive connector 10 is sandwiched between the solder ball electrode 2 and the inspection electrode 6. As a result, electrical connection between each solder ball electrode 2 of the circuit device 1 and each inspection electrode 6 of the circuit board 5 for inspection is achieved, and the circuit device 1 is inspected in this inspection state.

According to the circuit device inspection apparatus described above, since the anisotropic conductive connector 10 is provided, even if the electrode to be inspected is a protruding solder ball electrode 2, the difference is caused by the pressure contact of the electrode to be inspected. Since permanent deformation or deformation due to wear is suppressed in the conductive film 10A, even when a large number of circuit devices 1 are continuously inspected, stable conductivity can be obtained over a long period of time. In addition, the circuit device 1 can be reliably prevented or suppressed from adhering to the anisotropic conductive film 10A.
Further, the non-magnetic insulating particles are contained in the surface layer portion 10B of the anisotropic conductive film 10A of the anisotropic conductive connector 10 that contacts the circuit device 1, so that the electrode material of the electrode 2 to be inspected is conductive. Therefore, even when used in a state of being pressed against the circuit device 1 in a high temperature environment, the circuit device can be obtained. It is possible to more reliably prevent or suppress the adhesion of 1 to the anisotropic conductive film 10A.
Further, since it is not necessary to use a sheet-like connector in addition to the anisotropic conductive connector 10, there is no need to align the anisotropic conductive connector 10 and the sheet-like connector. The problem of misalignment with the anisotropic conductive connector 10 can be avoided, and the configuration of the inspection apparatus is easy.

In the present invention, it is possible to add various changes without being limited to the above embodiment.
(1) When the anisotropic conductive connector 10 of the present invention is used for an electrical inspection of a circuit device, the inspected electrode of the circuit device to be inspected is not limited to a hemispherical solder ball electrode. It may be a flat electrode.
(2) In the anisotropic conductive connector of the present invention, it is not essential to provide a support, and it may be composed only of an anisotropic conductive film.
(3) It is not essential for the one-surface-side surface layer portion 10B of the anisotropic conductive film 10A to contain nonmagnetic insulating particles.
(4) When the anisotropic conductive connector 10 of the present invention is used for electrical inspection of a circuit device, the anisotropic conductive film may be integrally bonded to the inspection circuit board. According to such a configuration, it is possible to reliably prevent the positional deviation between the anisotropic conductive film and the inspection circuit board.
Such an anisotropic conductive connector uses a metal mold for manufacturing the anisotropic conductive connector having a board placement space area in which the circuit board for inspection 5 can be placed in the molding space. The circuit board for inspection is placed in the space area for board placement in the molding space of the mold, and in this state, for example, the molding material is injected into the molding space and cured, so that it can be manufactured.
(5) In the method for manufacturing the anisotropic conductive connector of the present invention, the target anisotropic conductive film is formed by stacking the conductive path forming portion with the first molding material layer and the second molding material layer. In order to form a molding material layer having a shape corresponding to the shape of the first, the anisotropic conductive connector having desired characteristics is obtained by using different types of materials as the first molding material and the second molding material. be able to. Specifically, in addition to the configuration in which layer portions having different types of conductive particles are stacked as described above, for example, the configuration in which layer portions having different particle diameters or conductive particle content rates are stacked is used. A conductive path forming part with a controlled degree of conductivity can be formed, and a conductive path forming part with a controlled elastic property can be formed by laminating layers having different types of elastic polymer materials. It is possible to form.
Further, the anisotropic conductive connector of the present invention can also be manufactured by the method for manufacturing an anisotropic conductive connector described in Japanese Patent Application Laid-Open Nos. 2003-77962 and 2003-123869.

(6) The anisotropic conductive connector according to the present invention is configured such that the conductive path forming portions are arranged at a constant pitch, and a part of the conductive path forming portions are electrically connected to the electrode to be inspected. Other conductive path forming portions may be ineffective conductive path forming portions that are not electrically connected to the electrode to be inspected. More specifically, as shown in FIG. 13, as the circuit device 1 to be inspected, lattice point positions with a constant pitch, such as CSP (Chip Scale Package) and TSOP (Thin Small Outline Package), are used. Among them, there is a configuration in which the electrodes to be inspected are arranged only at some positions. In the anisotropic conductive connector 10 for inspecting such a circuit device 1, the conductive path forming portion 11 has the electrodes to be inspected. The conductive path forming portion 11 located at a position corresponding to the electrode to be inspected is set as an effective conductive path forming portion, and the other conductive path forming portions 11 are ineffective conductive paths. It may be a forming part.
According to the anisotropic conductive connector 10 having such a configuration, when the anisotropic conductive connector 10 is manufactured, the ferromagnetic layer of the mold is arranged at a constant pitch, so that a magnetic field is applied to the molding material layer. When applied, the conductive particles can be efficiently assembled and oriented at a predetermined position, and thereby, the density of the conductive particles becomes uniform in each of the obtained conductive path forming portions. An anisotropic conductive connector having a small difference in resistance value between the respective conductive path forming portions can be obtained.

(7) The specific shape and structure of the anisotropic conductive film can be variously changed.
For example, as shown in FIG. 14, the anisotropic conductive film 10 </ b> A may have a concave portion 16 on the surface in contact with the electrode to be inspected of the circuit device to be inspected at the center thereof.
Further, as shown in FIG. 15, the anisotropic conductive film 10 </ b> A may have a through hole 17 at the center thereof.
Further, as shown in FIG. 16, the anisotropic conductive film 10A has no conductive path forming portion 11 formed in the peripheral portion supported by the support 71, and the conductive path forming portion is formed only in a region other than the peripheral portion. may be those 11 are formed, all of these conductive path-forming parts 11 may be effective conducting path forming portion.
As shown in FIG. 17, the anisotropic conductive film 10 </ b> A may be one in which an invalid conductive path forming portion 13 is formed between the effective conductive path forming portion 12 and the peripheral portion.
Further, as shown in FIG. 18, in the anisotropic conductive film 10A, the other layer portion 10C has a surface layer portion on the other surface side (hereinafter referred to as “other surface side surface portion”) 10D and the other surface side surface layer. The portion 10D may be composed of an intermediate layer portion 10E formed of a different type of elastic polymer material, or may have a plurality of intermediate layer portions each formed of a different type of elastic polymer material. There may be.
Further, as shown in FIG. 19, the anisotropic conductive film 10 </ b> A may have a flat both surfaces.
Further, as shown in FIG. 20, the anisotropic conductive film 10 </ b> A may have a protruding portion 11 a where the surface of the conductive path forming portion 11 protrudes from the surface of the insulating portion 15 on both surfaces thereof.

(8) In the circuit device inspection apparatus of the present invention, as shown in FIG. 21, the pressure applied to the electrode to be inspected (solder ball electrode 2) against the anisotropic conductive film 10A of the anisotropic conductive connector 10 is relaxed. The pressure relaxation frame 65 may be disposed between the circuit device 1 to be inspected and the anisotropic conductive connector 10.
As shown in FIG. 22, the pressure relief frame 65 has a rectangular plate shape as a whole, and has an inspected electrode of the circuit device 1 to be inspected and an anisotropic conductive connector 10 at the center. A substantially rectangular opening 66 for contacting the conductive path forming portion 11 is formed, and a leaf spring portion 67 is obliquely upward inward from the periphery of the opening 66 at each of the four peripheral edges of the opening 66. Are integrally formed so as to protrude. In the illustrated example, the pressure relief frame 65 has an opening 66 larger in size than the anisotropic conductive film 10 </ b> A in the anisotropic conductive connector 10, and only the tip portion of the leaf spring portion 67 is anisotropically conductive. It arrange | positions so that it may be located in the upper position of the peripheral part of film | membrane 10A. Further, the height of the tip of the leaf spring portion 67 is set so that the electrode to be inspected of the circuit device 1 does not contact the anisotropic conductive film 10A when the tip of the leaf spring portion 67 contacts the circuit device 1. ing. Further, positioning holes 68 through which the guide pins of the circuit board for inspection 5 are inserted are formed at the four corner positions of the pressure relief frame 65.

According to the circuit device inspection apparatus having such a configuration, for example, the circuit device 1 is pressed against the leaf spring portion 67 of the pressure relief frame 65 by pressing the circuit device 1 in a direction approaching the inspection circuit board 5. Then, the applied pressure of the electrode to be inspected against the anisotropic conductive film 10 </ b> A of the anisotropic conductive connector 10 is relieved by the spring elasticity of the leaf spring portion 67. Further, as shown in FIG. 23, in a state where the leaf spring portion 67 of the pressure relief frame 65 is in pressure contact with the peripheral portion of the anisotropic conductive film 10A of the anisotropic conductive connector 10, the anisotropic conductive film 10A Due to the rubber elasticity, the applied pressure of the electrode to be inspected against the anisotropic conductive film 10A is further relaxed. Therefore, the conductive path forming portion 11 of the anisotropic conductive film 10A can obtain stable conductivity over a longer period.
Further, since the elasticity of the leaf spring portion 67 of the pressure relief frame 65 can reduce the magnitude of impact applied to the anisotropic conductive film 10A by the electrode to be inspected (solder ball electrode 2), the anisotropic conductive film. 10A can be prevented or suppressed, and when the applied pressure to the anisotropic conductive film 10A is released, the spring elasticity of the leaf spring portion 67 of the applied pressure relaxation frame 65 causes the circuit device 1. Can be easily separated from the anisotropic conductive film 10A, so that the work of replacing the circuit device 1 that has been inspected with an uninspected circuit device can be smoothly performed, and as a result, the inspection efficiency of the circuit device can be improved. Can be planned.

(9) The pressure relief frame is not limited to that shown in FIG.
For example, as shown in FIG. 24, the pressure relief frame 65 may have a size of the opening 66 larger than the size of the anisotropic conductive film 10 </ b> A in the anisotropic conductive connector 10.
Further, as shown in FIG. 25, the pressure relief frame 65 has a size of the opening 66 larger than the size of the anisotropic conductive film 10A in the anisotropic conductive connector 10 and the tip of the leaf spring portion 67 is a support body. 71 may be arranged so as to be positioned above the exposed portion of 71, and the electrode to be inspected (solder) for the anisotropic conductive film 10A of the anisotropic conductive connector 10 only by the spring elasticity of the leaf spring portion 67. The applied pressure of the ball electrode 2) is relieved.
Further, as shown in FIG. 26, the pressure relief frame 65 may be made of a rubber sheet. According to such a configuration, the anisotropic conductive connector is formed by the rubber elasticity of the pressure relief frame 65. The applied pressure of the electrode to be inspected (solder ball electrode 2) against the 10 anisotropic conductive films 10A is alleviated.
In addition, as shown in FIG. 27, the pressure relief frame 65 may be a plate-like member having neither spring elasticity nor rubber elasticity. By selecting an appropriate thickness, it is possible to adjust the pressure applied to the electrode to be inspected (solder ball electrode 2) against the anisotropic conductive film 10A of the anisotropic conductive connector 10.

  Hereinafter, specific examples of the present invention will be described, but the present invention is not limited to the following examples.

[Additional liquid silicone rubber]
In the following Examples and Comparative Examples, the addition-type liquid silicone rubber is a two-component type in which the viscosity of the liquid A is 500 Pa · s and the viscosity of the liquid B is 500 Pa · s, A strain having a strain of 6%, a durometer A hardness of 42, and a tear strength of 30 kN / m was used.

The characteristics of the addition type liquid silicone rubber are measured as follows.
(1) Viscosity of addition-type liquid silicone rubber:
The viscosity at 23 ± 2 ° C. was measured with a B-type viscometer.
(2) Compression set of cured silicone rubber:
The liquid A and the liquid B in the two-pack type addition type liquid silicone rubber were stirred and mixed at an equal ratio. Next, after pouring this mixture into a mold and subjecting the mixture to defoaming treatment under reduced pressure, a curing treatment is performed under the conditions of 120 ° C. and 30 minutes, so that the thickness is 12.7 mm and the diameter is 29 mm. A cylindrical body made of a cured silicone rubber was prepared, and post-curing was performed on the cylindrical body at 200 ° C. for 4 hours. The cylindrical body thus obtained was used as a test piece, and compression set at 150 ± 2 ° C. was measured in accordance with JIS K 6249.
(3) Tear strength of cured silicone rubber:
A sheet having a thickness of 2.5 mm was produced by curing the addition-type liquid silicone rubber and post-curing under the same conditions as in (2) above. A crescent-shaped test piece was produced by punching from this sheet, and the tear strength at 23 ± 2 ° C. was measured according to JIS K 6249.
(4) Durometer A hardness:
Five sheets produced in the same manner as in the above (3) were superposed, and the obtained stack was used as a test piece, and the durometer A hardness at 23 ± 2 ° C. was measured according to JIS K 6249.

<Example 1>
(A) Production of support and mold:
According to the structure shown in FIG. 4, the support body of the following specification was produced, and the metal mold | die for anisotropic conductive film shaping | molding of the following specification was produced according to the structure shown in FIG.
[Support]
The support (71) is made of SUS304, has a thickness of 0.1 mm, the opening (73) has a size of 17 mm × 10 mm, and has positioning holes (72) at four corners.
〔Mold〕
The ferromagnetic substrate (51, 56) of each of the upper die (50) and the lower die (55) is made of iron and has a thickness of 6 mm.
Each of the ferromagnetic layers (52, 57) of the upper die (50) and the lower die (55) is made of nickel, has a diameter of 0.45 mm (circular), a thickness of 0.1 mm, and an arrangement pitch (between the centers). The distance) is 0.8 mm, and the number of ferromagnetic layers is 288 (12 × 24).
The non-magnetic layer (53, 58) of each of the upper mold (50) and the lower mold (55) is formed by curing a dry film resist, and the non-magnetic layer (53) of the upper mold (50). ), The thickness of the portion (53a) is 0.3 mm, the thickness of the portion (53b) is 0.1 mm, and the thickness of the nonmagnetic layer (58) of the lower die (55) is 0.15 mm.
The vertical and horizontal dimensions of the molding space (59) formed by the mold are 20 mm × 13 mm.

(B) Preparation of molding material:
A molding material for forming an anisotropic conductive film is obtained by adding 60 parts by weight of conductive particles having an average particle diameter of 30 μm to 100 parts by weight of addition-type liquid silicone rubber, and then performing defoaming treatment under reduced pressure. Was prepared. In the above, as the conductive particles, those obtained by applying gold plating to the core particles made of nickel (average coating amount: 20% by weight of the weight of the core particles) were used.

(C) Formation of anisotropic conductive film:
A mesh (thickness: 0.2 mm, opening diameter: 210 μm, opening ratio: 46.0%) formed of polytetrafluoroethylene fiber (fiber diameter: 100 μm) on the molding surface of the upper mold (50) of the above mold The sheet-shaped reinforcing material is disposed, and the prepared molding material is applied by screen printing, so that the liquid addition type silicone rubber contains the conductive particles and the reinforcing material. A 2 mm first molding material layer (61a) was formed.
Further, on the molding surface of the lower mold (55) of the above-mentioned mold, a spacer (54b) having a thickness of 0.1 mm having a rectangular opening having a vertical and horizontal dimension of 20 mm × 13 mm is aligned and arranged, The support (71) is positioned and arranged on the spacer (54b), and the thickness having a rectangular opening having a vertical and horizontal dimension of 20 mm × 13 mm on the support (71) is 0. By aligning and placing a 1 mm spacer (54a) and applying the prepared third molding material by screen printing, by the lower mold (55), spacers (54a, 54b) and the support (71) In the space to be formed, the second molding material layer (61b) having a thickness of 0.3 mm at the portion located on the non-magnetic layer (58), in which conductive particles are contained in the liquid addition type silicone rubber. ) Formed.
Then, the first molding material layer (61a) formed on the upper mold (50) and the second molding material layer (61b) formed on the lower mold (55) were aligned and overlapped.
Then, with respect to each molding material layer formed between the upper mold (50) and the lower mold (55), 2T is formed in the thickness direction by an electromagnet in a portion located between the ferromagnetic layers (52, 57). An anisotropic conductive film (10A) was formed by applying a curing treatment at 100 ° C. for 1 hour while applying a magnetic field of.
As described above, the anisotropic conductive connector (10) according to the present invention was manufactured. The anisotropic conductive film (10A) in the anisotropic conductive connector (10) thus obtained is a rectangle having a vertical and horizontal dimension of 20 mm × 13 mm, the thickness of the conductive path forming part (11) is 0.55 mm, and the insulating part (15 ) Has a thickness of 0.5 mm, and has 288 (12 × 24) conductive path forming portions (11). Each conductive path forming portion (11) has a diameter of 0.45 mm, a conductive path forming portion ( 11) is an arrangement pitch (center distance) of 0.8 mm. The ratio r1 / r2 between the opening diameter of the mesh and the average particle diameter of the conductive particles is 7.
Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector A1”.

<Comparative example 1>
An anisotropic conductive connector was manufactured in the same manner as in Example 1 except that the reinforcing material was not disposed on the molding surface of the upper mold (50). The anisotropic conductive film (10A) in the anisotropic conductive connector (10) thus obtained is a rectangle having a vertical and horizontal dimension of 20 mm × 13 mm, the thickness of the conductive path forming part (11) is 0.55 mm, and the insulating part (15 ) Has a thickness of 0.5 mm, and has 288 (12 × 24) conductive path forming portions (11). Each conductive path forming portion (11) has a diameter of 0.45 mm, a conductive path forming portion ( 11) is an arrangement pitch (center distance) of 0.8 mm.
Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector B1”.

[Evaluation of anisotropic conductive connector]
The performance evaluation of the anisotropic conductive connector A1 according to Example 1 and the anisotropic conductive connector B1 according to Comparative Example 1 was performed as follows.
In order to evaluate the anisotropic conductive connector A1 according to Example 1 and the anisotropic conductive connector B1 according to Comparative Example 1, a test circuit device 3 as shown in FIGS. 28 and 29 was prepared.
This test circuit device 3 has a total of 72 solder ball electrodes 2 (material: 64 solder) having a diameter of 0.4 mm and a height of 0.3 mm, each having 36 solder ball electrodes. 2 are formed, and in each electrode group, 18 solder ball electrodes 2 are formed in a total of 2 rows arranged in a straight line at a pitch of 0.8 mm. Two of the solder ball electrodes 2 are electrically connected to each other by the wiring 8 in the circuit device 3. The total number of wires in the circuit device 3 is 36.
Then, using such a test circuit device, the anisotropic conductive connector A1 according to Example 1 and the anisotropic conductive connector B1 according to Comparative Example 1 were evaluated as follows.

《Repeated durability》
As shown in FIG. 30, the anisotropic conductive connector 10 is inserted into the positioning hole of the support 71 in the anisotropic conductive connector 10 by inserting the guide pin 9 of the inspection circuit board 5 into the inspection circuit board 5. The test circuit device 3 is arranged on the anisotropic conductive connector 10 and fixed by a pressurizing jig (not shown). In this state, the thermostat 7 Placed in.
Next, the temperature in the thermostatic chamber 7 is set to 100 ° C., and the strain rate of the conductive path forming portion 11 of the anisotropic conductive film 10A in the anisotropic conductive connector 10 is 30% (at the time of pressurization) by the pressurizing jig. The anisotropic conductive connector 10, the test circuit device 3, and the test circuit board 5 are repeatedly pressed with a pressurization cycle of 5 seconds / stroke so that the thickness of the conductive path forming portion is 0.4 mm). 10 mA by a DC power supply 115 and a constant current control device 116 between external terminals (not shown) of the circuit board 5 for inspection, which are electrically connected to each other via the inspection electrodes 6 and their wirings (not shown). Was constantly applied, and the voltmeter 110 measured the voltage across the external terminals of the test circuit board 5 during pressurization.

The voltage value thus measured (V) is V ₁ , the applied direct current is I ₁ (= 0.01 A), and the electrical resistance value R ₁ (Ω) is expressed by the formula: R ₁ = V ₁ / I ₁ .
Here, in addition to the electrical resistance values of the two conductive path forming portions, the electrical resistance value R ₁ includes the electrical resistance value between the electrodes of the test circuit device 3 and the electrical resistance between the external terminals of the test circuit board. Contains a value.
When the electric resistance value R ₁ becomes larger than 2Ω, it becomes practically difficult to electrically inspect the circuit device. Therefore, the voltage measurement was continued until the electric resistance value R ₁ became larger than 2Ω. However, the pressurizing operation was performed 100,000 times in total. The results are shown in Table 1.

After these tests were completed, the deformation state of the conductive path forming portion and the state of migration of the electrode material to the conductive particles were evaluated for each anisotropic conductive connector according to the following criteria. The results are shown in Table 2.
Deformation state of conductive path forming part:
The surface of the conductive path forming portion was visually observed and evaluated as ◯ when almost no deformation occurred, Δ when fine deformation was recognized, and x when large deformation was recognized.
Transition state of electrode material to conductive particles:
The color of the conductive particles in the conductive path forming part was visually observed and evaluated as ◯ when there was almost no discoloration, Δ when slightly discolored to gray, and x when discolored almost gray or black.

<< Adhesion to circuit board >>
100 anisotropically conductive connectors A1 according to Example 1 and 100 anisotropically conductive connectors B1 according to Comparative Example 1 were prepared, respectively, and these anisotropically conductive connectors were subjected to the same test as in the above repeated durability test. A pressure test is performed, and then the state of adhesion of the anisotropic conductive film to the circuit device for testing is examined. When the number of bonded films is less than 30%, ○, when 30 to 70%, Δ, and 70% When exceeding, it evaluated as x. The results are shown in Table 2.

  As is apparent from the results of Tables 1 and 2, according to the anisotropic conductive connector A1 according to Example 1, even when repeatedly pressed by the circuit device, permanent deformation due to the pressure contact of the circuit device, It was confirmed that deformation due to wear was suppressed, stable conductivity was obtained over a long period of time, and adhesion of the circuit device was reliably prevented or suppressed.

<Example 2>
(A) Production of support and mold:
According to the configuration shown in FIG. 4, a support having the following specifications is manufactured, and the non-magnetic layer of the upper mold has a uniform thickness, and no recess is formed on the surface of the upper mold. Except for the above, a mold for forming an anisotropic conductive film having the following specifications was produced according to the configuration shown in FIG.
[Support]
The support (71) has a material of SUS304, a thickness of 0.15 mm, an opening (73) of 17 mm × 10 mm, and positioning holes (72) at four corners.
〔Mold〕
The ferromagnetic substrate (51, 56) of each of the upper die (50) and the lower die (55) is made of iron and has a thickness of 6 mm.
Each of the ferromagnetic layers (52, 57) of the upper die (50) and the lower die (55) is made of nickel, has a diameter of 0.45 mm (circular), a thickness of 0.1 mm, and an arrangement pitch (between the centers). The distance) is 0.8 mm, and the number of ferromagnetic layers is 288 (12 × 24).
The non-magnetic layer (53, 58) of each of the upper mold (50) and the lower mold (55) is formed by curing a dry film resist, and the non-magnetic layer (53) of the upper mold (50). ) Is 0.1 mm, and the non-magnetic layer (58) of the lower die (55) is 0.15 mm.
The vertical and horizontal dimensions of the molding space (59) formed by the mold are 20 mm × 13 mm.

(B) Preparation of molding material:
A molding material for forming an anisotropic conductive film is obtained by adding 60 parts by weight of conductive particles having an average particle diameter of 30 μm to 100 parts by weight of addition-type liquid silicone rubber, and then performing defoaming treatment under reduced pressure. Was prepared. In the above, as the conductive particles, those obtained by applying gold plating to the core particles made of nickel (average coating amount: 20% by weight of the weight of the core particles) were used.

(C) Formation of anisotropic conductive film:
A spacer (54a) having a thickness of 0.2 mm in which a rectangular opening having a vertical and horizontal dimension of 20 mm × 13 mm is formed on the molding surface of the upper mold (50) of the above mold is positioned and arranged, Sheet-like reinforcement made of mesh (thickness: 0.115 mm, opening diameter: 184 μm, opening ratio: 52%) formed of polyarylate-based composite fibers (fiber diameter: 70 μm) in the opening of the spacer (54a) A first molding material having a thickness of 0.2 mm, in which conductive particles and a reinforcing material are contained in the liquid addition-type silicone rubber by arranging the material and further applying the prepared molding material by screen printing Layer (61a) was formed.
In addition, a spacer (54b) having a thickness of 0.15 mm in which a rectangular opening having a vertical and horizontal dimension of 20 mm × 13 mm is formed on the molding surface of the lower mold (55) of the above-mentioned mold is aligned and disposed. Then, the support (71) is positioned and arranged on the spacer (54b), and the prepared molding material is applied by screen printing, whereby the lower die (55), the spacer (54b) and the support are arranged. In a space formed by the body (71), a second portion having a thickness of 0.3 mm in a portion located on the nonmagnetic layer (58), in which conductive particles are contained in the liquid addition type silicone rubber. A molding material layer (61b) was formed.
Then, the first molding material layer (61a) formed on the upper mold (50) and the second molding material layer (61b) formed on the lower mold (55) were aligned and overlapped.
Then, with respect to each molding material layer formed between the upper mold (50) and the lower mold (55), 2T is formed in the thickness direction by an electromagnet in a portion located between the ferromagnetic layers (52, 57). An anisotropic conductive film (10A) was formed by applying a curing treatment at 100 ° C. for 1 hour while applying a magnetic field of.
As described above, the anisotropic conductive connector (10) according to the present invention was manufactured. The anisotropic conductive film (10A) in the anisotropic conductive connector (10) thus obtained is a rectangle having a vertical and horizontal dimension of 20 mm × 13 mm, the thickness of the conductive path forming part (11) is 0.55 mm, and the insulating part (12 ) Has a thickness of 0.5 mm, and has 288 (12 × 24) conductive path forming portions (11). Each conductive path forming portion (11) has a diameter of 0.45 mm, a conductive path forming portion ( 11) is an arrangement pitch (center distance) of 0.8 mm. The ratio r1 / r2 between the opening diameter of the mesh and the average particle diameter of the conductive particles is 6.13.
Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector C1”.

<Example 3>
The spacer (54a) disposed on the molding surface of the upper mold (50) is changed to a thickness of 0.1 mm, and the spacer (54b) disposed on the molding surface of the lower mold (55) is 0.1 mm in thickness. An anisotropic conductive connector (10) according to the present invention was produced in the same manner as in Example 2 except that the anisotropic conductive connector (10) was changed. The anisotropic conductive film (10A) in the anisotropic conductive connector (10) thus obtained is a rectangle having a vertical and horizontal dimension of 20 mm × 13 mm, the thickness of the conductive path forming part (11) is 0.40 mm, and the insulating part (12 ) Has a thickness of 0.35 mm, and has 288 (12 × 24) conductive path forming portions (11). Each conductive path forming portion (11) has a diameter of 0.45 mm, a conductive path forming portion ( 11) is an arrangement pitch (center distance) of 0.8 mm. The ratio r1 / r2 between the opening diameter of the mesh and the average particle diameter of the conductive particles is 6.13.
Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector C2”.

<Example 4>
Except that the reinforcing material was changed to a sheet-like material made of a mesh (thickness: 0.19 mm, opening diameter: 408 μm, opening ratio: 65%) formed of polyarylate-based composite fibers (fiber diameter: 100 μm). In the same manner as in Example 2, an anisotropic conductive connector (10) according to the present invention was produced. The anisotropic conductive film (10A) in the anisotropic conductive connector (10) thus obtained is a rectangle having a vertical and horizontal dimension of 20 mm × 13 mm, the thickness of the conductive path forming part (11) is 0.55 mm, and the insulating part (12 ) Having a thickness of 0.40 mm, 288 (12 × 24) conductive path forming portions (11), each conductive path forming portion (11) having a diameter of 0.45 mm, 11) is an arrangement pitch (center distance) of 0.8 mm. The ratio r1 / r2 between the opening diameter of the mesh and the average particle diameter of the conductive particles is 13.6.
Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector C3”.

<Comparative example 2>
An anisotropic conductive connector was manufactured in the same manner as in Example 2 except that no reinforcing material was disposed on the molding surface of the upper mold (50). The anisotropic conductive film in the obtained anisotropic conductive connector has a rectangular shape with vertical and horizontal dimensions of 20 mm × 13 mm, a conductive path forming portion thickness of 0.55 mm, and an insulating portion thickness of 0.50 mm, and 288 pieces ( 12 × 24) conductive path forming portions, each conductive path forming portion has a diameter of 0.45 mm, and the conductive path forming portions are disposed at a pitch (center distance) of 0.8 mm.
Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector D1”.

<Comparative Example 3>
An anisotropic conductive connector was manufactured in the same manner as in Example 3 except that no reinforcing material was disposed on the molding surface of the upper mold (50). The anisotropic conductive film in the obtained anisotropic conductive connector has a rectangular shape with a vertical and horizontal dimension of 20 mm × 13 mm, a conductive path forming portion thickness of 0.40 mm, an insulating portion thickness of 0.35 mm, and 288 pieces ( 12 × 24) conductive path forming portions, each conductive path forming portion has a diameter of 0.45 mm, and the conductive path forming portions are disposed at a pitch (center distance) of 0.8 mm.
Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector D2”.

[Evaluation of anisotropic conductive connector]
The anisotropic conductive connectors C1 to C3 according to Examples 2 to 4 and the anisotropic conductive connectors D1 to D2 according to Comparative Examples 2 to 3 were evaluated as follows.
In order to evaluate the anisotropic conductive connectors C1 to C3 according to Examples 2 to 4 and the anisotropic conductive connectors D1 to D2 according to Comparative Examples 2 to 3, a test circuit as shown in FIGS. 28 and 29 is used. Apparatus 3 was prepared.
This test circuit device 3 has a total of 72 solder ball electrodes 2 (material: 64 solder) having a diameter of 0.4 mm and a height of 0.3 mm, each having 36 solder ball electrodes. 2 are formed, and in each electrode group, 18 solder ball electrodes 2 are formed in a total of 2 rows arranged in a straight line at a pitch of 0.8 mm. Two of the solder ball electrodes are electrically connected to each other by the wiring 8 in the circuit device 3. The total number of wires in the circuit device 3 is 36.
And evaluation of the anisotropically conductive connectors D1 to D2 according to Examples 2 to 4 and the anisotropically conductive connectors D1 to D2 according to Comparative Examples 2 to 3 using the test circuit device is as follows. I went as follows.

<Initial characteristics>
As shown in FIG. 30, the anisotropic conductive connector 10 is inserted into the positioning hole of the support 71 in the anisotropic conductive connector 10 by inserting the guide pin 9 of the inspection circuit board 5 into the inspection circuit board 5. The test circuit device 3 is placed on the anisotropic conductive connector 10 and is placed at a room temperature at room temperature using a pressure jig (not shown). The pressure was fixed with a load of about 60 g per conductive path forming portion. Then, the anisotropic conductive connector 10, the test circuit device 3, the test electrode 6 of the test circuit board 5, and the test circuit board 5 electrically connected to each other via the wiring (not shown) thereof. A 10 mA DC current is constantly applied between external terminals (not shown) by the DC power supply 115 and the constant current control device 116, and the voltage between the external terminals of the circuit board 5 for inspection during pressurization is applied by the voltmeter 110. It was measured.
The voltage value thus measured (V) is V ₁ , the applied direct current is I ₁ (= 0.01 A), and the electrical resistance value R ₁ (Ω) is expressed by the formula: R ₁ = V ₁ / I ₁ . The results are shown in Table 3.

  As is clear from the results in Table 3, the anisotropic conductive connectors C1 to C3 according to Examples 2 to 4 are anisotropic conductive according to Comparative Examples 2 to 3 in which no reinforcing material is contained in the anisotropic conductive film. It was confirmed to have good conductivity equivalent to the connectors D1 to D2.

《Repeated durability》
As shown in FIG. 30, the anisotropic conductive connector 10 is inserted into the positioning hole of the support 71 in the anisotropic conductive connector 10 by inserting the guide pin 9 of the inspection circuit board 5 into the inspection circuit board 5. The test circuit device 3 is arranged on the anisotropic conductive connector 10 and fixed by a pressurizing jig (not shown). In this state, the thermostat 7 Placed in.
Next, for the anisotropic conductive connector according to Example 2, Example 4 and Comparative Example 2, the temperature in the thermostatic chamber 7 is set to 125 ° C., and the pressurizing cycle is 5 seconds / stroke by the pressurizing jig. The load is 4.5 kg (the load per conductive path forming portion is about 60 g), and the anisotropic conductive connector according to Example 3 and Comparative Example 3 is a load of 3.0 kg (per conductive path forming portion). While repeating the pressurization under the condition of a load of about 40 g), it is electrically connected to each other through the anisotropic conductive connector 10, the test circuit device 3, the test electrode 6 of the test circuit board 5, and the wiring (not shown). A 10 mA DC current is always applied between externally connected external terminals (not shown) of the inspection circuit board 5 by a DC power source 115 and a constant current control device 116, and a voltmeter 110 is used for pressurization. The voltage between the external terminals of the testing circuit board 5 which delivers measured.

The voltage value thus measured (V) is V ₁ , the applied direct current is I ₁ (= 0.01 A), and the electrical resistance value R ₁ (Ω) is expressed by the formula: R ₁ = V ₁ / I ₁ .
Here, in addition to the electrical resistance values of the two conductive path forming portions, the electrical resistance value R ₁ includes the electrical resistance value between the electrodes of the test circuit device 3 and the electrical resistance between the external terminals of the test circuit board. Contains a value.
And the frequency | count of pressurization until electrical resistance value R1 exceeded ₁ ohm was measured. The results are shown in Table 4.

After the durability test was completed, the surface of the conductive path forming portion of each anisotropic conductive connector was visually observed.
As a result, for the anisotropic conductive connectors C1 to C3 according to Examples 2 to 3, the deformation of the conductive path forming portion is hardly deformed, and the conductive particles are held in the conductive path forming portion. It was confirmed that
Further, in the anisotropic conductive connector C3 according to Example 4, a depression is formed in the surface layer portion of a part of the conductive path forming portion, and conductive particles are formed in the surface layer portion of the insulating portion around the formed depression. Existed.
Moreover, about the anisotropically conductive connectors D1-D2 which concern on Comparative Examples 2-3, the hollow is formed in the surface layer part of the conductive path formation part, and it is electroconductive in the surface layer part of the insulation part around the formed hollow. Particles were present. This is because, as a result of repeated pressurization by the protruding electrodes, the surface layer portion of the conductive path forming portion is worn, and as a result, the conductive particles contained in the surface layer portion are scattered around and the circuit device for testing It is presumed that the conductive particles are pushed into the surface layer portion of the insulating portion by being pressed by the pressure.
As is clear from the above results, according to the anisotropic conductive connectors C1 to C3 according to Examples 2 to 4, even when the conductive path forming portion is repeatedly pressed by the protruding electrode, the pressure contact of the protruding electrode It has been confirmed that permanent deformation due to or deformation due to wear is suppressed, and that stable conductivity can be obtained over a long period of time.

<Reference Example 1>
Except that the reinforcing material was changed to a sheet-like material made of a mesh (thickness: 0.052 mm, opening diameter: 72 μm, opening ratio: 50%) formed of polyarylate-based composite fibers (fiber diameter: 30 μm) In the same manner as in Example 2, an anisotropic conductive connector (10) according to the present invention was produced. The anisotropic conductive film (10A) in the anisotropic conductive connector (10) thus obtained is a rectangle having a vertical and horizontal dimension of 20 mm × 13 mm, the thickness of the conductive path forming part (11) is 0.55 mm, and the insulating part (12 ) Has a thickness of 0.40 mm, and has 288 (12 × 24) conductive path forming portions (11). Each conductive path forming portion (11) has a diameter of 0.45 mm, a conductive path forming portion ( 11) is an arrangement pitch (center distance) of 0.8 mm. The ratio r1 / r2 between the mesh opening diameter and the average particle diameter of the conductive particles is 2.4.
The initial characteristics of the anisotropic conductive connector were measured in the same manner as in Example 2. As a result, the minimum value of the electric resistance R ₁ was 0.20Ω, the maximum value was 2.56Ω, and the average value was 0.75Ω. .

<Reference Example 2>
Except that the reinforcing material was changed to a sheet-like material made of a mesh (thickness: 0.073 mm, opening diameter: 114 μm, opening ratio: 51%) formed of polyarylate-based composite fibers (fiber diameter: 45 μm). In the same manner as in Example 2, an anisotropic conductive connector (10) according to the present invention was produced. The anisotropic conductive film (10A) in the anisotropic conductive connector (10) thus obtained is a rectangle having a vertical and horizontal dimension of 20 mm × 13 mm, the thickness of the conductive path forming part (11) is 0.55 mm, and the insulating part (12 ) Having a thickness of 0.40 mm, 288 (12 × 24) conductive path forming portions (11), each conductive path forming portion (11) having a diameter of 0.45 mm, 11) is an arrangement pitch (center distance) of 0.8 mm. The ratio r1 / r2 between the opening diameter of the mesh and the average particle diameter of the conductive particles is 3.8.
The initial characteristics of the anisotropic conductive connector was measured in the same manner as in Example 2, the minimum value of the electric resistance value R ₁ is 0.15Omu, the maximum value 3.15Omu, the average value was 0.88Ω .

It is a top view which shows an example of the anisotropically conductive connector of this invention. It is AA sectional drawing of the anisotropically conductive connector shown in FIG. It is sectional drawing for description which expands and shows a part of anisotropic conductive connector shown in FIG. It is a top view of the support body in the anisotropically conductive connector shown in FIG. It is BB sectional drawing of the support body shown in FIG. It is sectional drawing for description which shows the structure in an example of the metal mold | die for anisotropic conductive film shaping | molding. It is sectional drawing for description which shows the state by which the spacer and the support body are arrange | positioned on the molding surface of a lower mold | type. FIG. 3 is an explanatory cross-sectional view showing a state in which a first molding material layer is formed on a molding surface of an upper mold and a second molding material layer is formed on a molding surface of a lower mold. It is sectional drawing for description which shows the state by which the reinforcing material has been arrange | positioned on the molding surface of an upper mold | type. It is sectional drawing for description which shows the state by which the 1st molding material layer and the 2nd molding material layer were laminated | stacked. It is sectional drawing for description which shows the state in which the anisotropic conductive film was formed. It is explanatory drawing which shows the structure in an example of the inspection apparatus of the circuit apparatus of this invention with a circuit apparatus. It is explanatory drawing which shows the structure in an example of the inspection apparatus of the circuit apparatus of this invention with another circuit apparatus. It is sectional drawing for description which shows the 1st modification of an anisotropic conductive film. It is sectional drawing for description which shows the 2nd modification of an anisotropic conductive film. It is sectional drawing for description which shows the 3rd modification of an anisotropic conductive film. It is sectional drawing for description which shows the 4th modification of an anisotropic conductive film. It is sectional drawing for description which shows the 5th modification of an anisotropic conductive film. It is sectional drawing for description which shows the 6th modification of an anisotropic conductive film. It is sectional drawing for description which shows the 7th modification of an anisotropic conductive film. It is explanatory drawing which shows the structure in the 1st example of the test | inspection apparatus provided with the pressurization pressure relaxation flame | frame. It is explanatory drawing which shows a pressurization pressure relaxation flame | frame, (a) is a top view, (b) is a side view. In the inspection apparatus shown in FIG. 21, it is explanatory drawing which shows the state by which the circuit apparatus was pressurized. It is explanatory drawing which shows the structure in the 2nd example of the test | inspection apparatus provided with the pressurization pressure relaxation flame | frame. It is explanatory drawing which shows the structure of the principal part in the 3rd example of the test | inspection apparatus provided with the applied pressure relaxation frame. It is explanatory drawing which shows the structure of the principal part in the 4th example of the test | inspection apparatus provided with the applied pressure relaxation frame. It is explanatory drawing which shows the structure of the principal part in the 5th example of the test | inspection apparatus provided with the pressurization pressure relaxation flame | frame. It is a top view of the circuit apparatus for a test used in the Example. It is a side view of the circuit device for a test used in the example. It is explanatory drawing which shows the structure of the outline of the testing apparatus of the repetition durability used in the Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit device 2 Solder ball electrode 3 Test circuit device 5 Inspection circuit board 6 Inspection electrode 7 Thermostatic chamber 8 Wiring 9 Guide pin 10 Anisotropic conductive connector 10A Anisotropic conductive film 10B One side surface layer portion 10C Other layers Portion 10D Other side surface layer portion 10E Intermediate layer portion 11 Conductive path forming portion 11a Protruding portion 12 Effective conductive path forming portion 13 Invalid conductive path forming portion 15 Insulating portion 16 Recess 17 Through hole 50 Upper mold 51 Ferromagnetic substrate 52 Ferromagnetic Body layer 53 Nonmagnetic layers 53a and 53b Nonmagnetic layer portions 54a and 54b Spacer 55 Lower die 56 Ferromagnetic substrate 57 Ferromagnetic layer 57a Recess 58 Nonmagnetic layer 59 Molding space 60 Recess 61a First molding Material layer 61b Second molding material layer 65 Pressure relief frame 66 Opening 67 Leaf spring part 68 Positioning hole 71 Support 72 Positioning hole 73 Opening 1 10 Voltmeter 115 DC power supply 116 Constant current control device

Claims (13)

An anisotropic conductive connector having an anisotropic conductive film arranged in a state where a plurality of conductive path forming portions extending in the thickness direction are insulated from each other by an insulating portion,
The anisotropic conductive film is formed of an insulating elastic polymer material, and the conductive path forming portion contains conductive particles exhibiting magnetism. The anisotropic conductive film has a surface layer portion on one side of the anisotropic conductive film. Is an anisotropic conductive connector characterized by containing a reinforcing material made of an insulating mesh or non-woven fabric. When the reinforcing material is made of a mesh, the opening diameter of the mesh is r1, and the average particle diameter of the conductive particles is r2, the ratio r1 / r2 is 1.5 to 13.6, and the mesh is opened. The anisotropic conductive connector according to claim 1, wherein the diameter is 500 μm or less . The anisotropic conductive connector according to claim 1, wherein a support for supporting a peripheral portion of the anisotropic conductive film is provided. An anisotropic conductive connector interposed between a circuit device to be inspected and a circuit board for inspection to electrically connect an inspected electrode of the circuit device and an inspection electrode of the circuit board. ,
4. A reinforcing material made of an insulating mesh or a non-woven cloth is contained in a surface layer portion of one side of the anisotropic conductive film that contacts a circuit device. Anisotropic conductive connector as described. 5. The anisotropic conductive connector according to claim 4, wherein particles that do not exhibit conductivity and magnetism are contained in a surface layer portion on one side of the anisotropic conductive film that contacts the circuit device. 6. The anisotropic conductive connector according to claim 5, wherein the particles that do not exhibit conductivity and magnetism are diamond powder. The anisotropic conductive film has a conductive path forming portion that is not electrically connected to the electrode to be inspected, in addition to a conductive path forming portion that is electrically connected to the electrode to be inspected of the circuit device to be inspected. The anisotropic conductive connector according to claim 4, wherein the anisotropic conductive connector is provided. 8. The conductive path forming portion that is not electrically connected to the electrode to be inspected of the circuit device to be inspected is formed at least on the peripheral portion of the anisotropic conductive film supported by the support. Anisotropic conductive connector as described. The anisotropic conductive connector according to claim 7 or 8, wherein the conductive path forming portions are arranged at a constant pitch. A method of manufacturing an anisotropic conductive connector having an anisotropic conductive film in which a plurality of conductive path forming portions each extending in the thickness direction are arranged in a state of being insulated from each other by an insulating portion,
Prepare a mold for forming an anisotropic conductive film in which a molding space is formed by a pair of molds,
On the molding surface of one mold, a reinforcing material made of an insulating mesh or non-woven fabric and conductive particles showing magnetism are contained in a liquid polymer material-forming material that is cured to become an elastic polymer material. Forming a molding material layer, and forming a molding material layer containing conductive particles in a liquid polymer substance forming material which is cured to become an elastic polymer substance on the molding surface of the other mold;
The molding material layer formed on the molding surface of the one mold and the molding material layer formed on the molding surface of the other mold are stacked, and then the strength distribution is increased in the thickness direction of each molding material layer. A method for producing an anisotropic conductive connector, comprising: a step of forming an anisotropic conductive film by applying a magnetic field to the molding material layer and curing each molding material layer. An inspection circuit board having inspection electrodes arranged corresponding to the electrodes to be inspected of the circuit device to be inspected;
An anisotropic conductive connector according to any one of claims 4 to 9 disposed on the circuit board for inspection;
An inspection apparatus for circuit devices, comprising: A pressure relief frame that relaxes the pressure of the electrode to be inspected on the anisotropic conductive film of the anisotropic conductive connector is disposed between the circuit device to be inspected and the anisotropic conductive connector. The circuit device inspection device according to claim 11. 13. The circuit device inspection apparatus according to claim 12, wherein the pressure relief frame has spring elasticity or rubber elasticity.

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