JP4692423B2 - Anisotropic conductive connector, conversion adapter for inspection apparatus, and method for manufacturing anisotropic conductive connector - Google Patents

Description

  The present invention relates to an anisotropic conductive connector provided between an inspection object and an inspection circuit board for electrically connecting the inspection object and the inspection circuit board, and an inspection including the anisotropic conductive connector. The present invention relates to a device conversion adapter and a method for manufacturing an anisotropic conductive connector.

  With the recent downsizing and higher performance of electronic devices, the number of electrodes of inspection objects such as semiconductor elements has increased, and the electrode pitch tends to be finer. Package LSIs having electrodes have become increasingly important because they can reduce the area occupied when mounted on equipment.

  On the other hand, on the inspection apparatus side that performs the electrical inspection of the inspection object, it is increasingly required to reduce the electrode pitch corresponding to the electrode of the inspection object and to securely connect the two. . Therefore, in order to meet such a requirement, an anisotropic conductive connector is interposed between the inspection apparatus side and the inspection object during electrical inspection.

As shown in FIG. 25, this anisotropically conductive connector has conductivity in the thickness direction, and electrically connects the electrode portion 2 of the inspection object 1 and the inspection electrode portion 4 of the circuit board 3 for inspection. An anisotropic conductive film 7 composed of a conductive path forming portion 5 connectable to the conductive path and an insulating portion 6 that insulates the conductive path forming portion 5 from each other, and a support 8 made of a metal plate that supports the anisotropic conductive film 7 It consists of and. And in the area | regions other than the peripheral part of the conductive path formation part 5, while the effective conductive path formation part 9 electrically connected to the electrode part 2 of the test object 1 is formed, An invalid conductive path forming portion 10 that is not electrically connected to the electrode portion 2 of the inspection object 1 is formed at the peripheral portion. By forming the invalid conductive path forming portion 10, an effective conductive path forming portion 9 is formed. Are formed uniformly (see, for example, Patent Documents 1 and 2).
JP 2001-210402 A JP 2004-241377 A

  However, in the conventional technique described above, the conductive particles of the conductive path forming portion 5 generated when the anisotropic conductive film 7 is formed adheres to the circuit board 3 for inspection, and the inspection electrode portion is interposed through the conductive particles. 4 and the ineffective conductive path forming part 10 are electrically connected to each other, a leak current is generated between the inspection electrode part 4 and the ineffective conductive path forming part 10 and the support 8, and there is a possibility that an inspection failure due to a short circuit may occur. there were.

  The present invention has been made to solve the above-described problems, and electrically insulates between the inspection electrode portion of the inspection circuit board and the ineffective conductive path forming portion, and causes inspection failure due to leakage current and short circuit. It is an object of the present invention to provide an anisotropic conductive connector, a conversion adapter for an inspection apparatus, and a method for manufacturing an anisotropic conductive connector.

  In order to achieve the above object, the present invention provides an inspection object having an electrode part and an inspection circuit board having an inspection electrode part, in order to electrically connect and inspect the electrode part of the inspection object, An anisotropic conductive connector provided between an inspection electrode portion of the inspection circuit board and having conductivity in a thickness direction, and the inspection electrode portion of the inspection object and the inspection electrode portion of the inspection circuit board A conductive path forming part that can be electrically connected to each other, and an insulating part that insulates the conductive path forming part from each other, and an electrode of the inspection object is provided in a region other than a peripheral part of the conductive path forming part. An effective conductive path forming portion that is electrically connected to the inspection portion is formed, and an invalid conductive path forming portion that is not electrically connected to the electrode portion of the inspection object is formed at the peripheral portion of the conductive path forming portion. An insulating layer is formed on the surface of the invalid conductive path forming portion. And wherein the Rukoto.

  In the anisotropic conductive connector of the present invention, the effective conductive path forming portion is thicker than the invalid conductive path forming portion, and the effective conductive path forming portion is formed to protrude from the invalid conductive path forming portion. It is good to have.

  Further, the present invention provides an inspection provided in an inspection apparatus that electrically connects an inspection object having an electrode portion and an inspection circuit board having an inspection electrode portion, and performs an electrical inspection on the inspection object. A conversion adapter for an apparatus, wherein the conversion adapter for an inspection apparatus includes the anisotropic conductive connector described above.

  Furthermore, the present invention provides an inspection object substrate having an electrode portion and an inspection circuit board having an inspection electrode portion, which are electrically connected to each other for inspection, and the inspection object electrode portion and the inspection circuit substrate. A method of manufacturing an anisotropic conductive connector provided between the inspection electrode portions of (A) and a molding surface of one of a pair of molds arranged to face each other to form a molding space Forming a first molding material layer thereon and forming a second molding material layer on the molding surface of the other mold; and (B) the first molding material layer and the second molding material. Layers, and by applying a parallel magnetic field in the thickness direction of each molding material layer and curing each molding material layer, the electrode portion of the inspection object and the inspection electrode portion of the inspection circuit board An electrically connectable conductive path forming part and the conductive path forming part are insulated from each other A step of forming an anisotropic conductive film having an insulating portion; and (C) a printing mask having a through hole formed at a position corresponding to the invalid conductive path forming portion formed in the peripheral portion of the conductive path forming portion. Placing on the surface of the anisotropic conductive film and filling the through-hole with a liquid insulating material; and (D) removing the printing mask before the insulating material is cured and heating the insulating material. And a step of curing.

  According to the present invention, the insulating layer formed on the surface of the invalid conductive path forming portion can electrically and reliably insulate between the inspection electrode portion of the inspection circuit board and the invalid conductive path forming portion. Various excellent effects can be obtained, such as generation of leakage current between the inspection electrode portion and the ineffective conductive path forming portion and occurrence of inspection failure due to a short circuit can be prevented.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  First, the conversion adapter for an inspection apparatus according to the present embodiment used in an inspection apparatus that performs an electrical inspection on an inspection object will be described with reference to FIGS. 1 and 2. Here, FIG. 1 is a sectional view showing a conversion adapter for an inspection apparatus, and FIG. 2 is a plan view showing a conversion adapter main body of the conversion adapter for an inspection apparatus.

  The inspection apparatus conversion adapter 11 is configured by fixing a conversion adapter main body 13 on a circuit board 12 with an attachment (not shown) such as a screw. The circuit board 12 includes an electrode portion 14 that is concentrated on the center portion on the front surface side, and an input / output terminal portion 15 that is connected to each electrode portion 14 and protrudes from the back surface side. The input / output terminal unit 15 can be connected to a power supply facility (not shown) of the inspection apparatus. In addition, as this circuit board 12, the thing of various structures, such as a single-sided printed circuit board, a double-sided printed circuit board, and a multilayer printed circuit board, can be used. The circuit board 12 may be any of a flexible board, a rigid board, and a flex / rigid board obtained by combining these.

  The conversion adapter body 13 includes a base member 16 fixed on the circuit board 12, an inspection object holding member 17 that is detachably provided in the base member 16, a lid member 18 that covers the upper surface of the base member 16, and a lid And a pressing member 19 attached to the member 18.

  The base member 16 has a lid member support shaft 20 fixed horizontally at a base end portion, a locking projection portion 21 formed at a distal end portion, and an opening 22 formed therein. In addition, on both sides of the base member 16, a notch portion 23 is formed so as to face the opening 22, and a holding member fixing shaft whose outer surface is threaded at the center of each notch portion 23. 24 is erected vertically. Furthermore, conversion adapter main body mounting holes 25 are formed at the four corners of the base member 16, respectively, and the mounting tool can be inserted into these conversion adapter main body mounting holes 25. Then, the fixture is provided on the lower surface side of the circuit board 12 through the conversion adapter main body attachment hole 25 and an attachment hole (not shown) formed in the circuit board 12 corresponding to the attachment hole 25. The conversion adapter main body 13 is fixed onto the circuit board 12 by being screwed into the metal plate 37.

  The inspection object holding member 17 includes a plate-like main body portion 26 having a shape that can be loosely fitted in the opening 22 of the base member 16, and support pieces 27 that protrude horizontally on both sides of the plate-like main body portion 26. Has been. Each support piece 27 is formed with a holding member fixing hole 28. The holding member fixing shaft 28 is inserted into the holding member fixing hole 28, and the holding member 27 is placed on the notch 23. The inspection object holding member 17 is fixed to the base member 16 by screwing a fixture (not shown) to the fixed shaft 24.

  An opening 30 is formed in the center of the plate-shaped main body portion 26 via a rectangular annular step portion 29, and each inspection object is directed from the inner peripheral side surface of the step portion 29 toward the opening 30. The support part 31 extends horizontally. Then, the inspection object 33 is held in a space 32 surrounded by the tip of each inspection object support portion 31, and the space 32 is provided at the tip of each inspection object support portion 31. The inclined surface 34 is inclined downward. An electrode part 101 (see FIGS. 22 and 23) is formed on the inspection object 33 so as to project in a hemispherical shape.

  An anisotropic conductive connector support shaft 35 protrudes vertically downward from the lower surface side of the plate-shaped main body 26 at a position facing the opening 30 so that the anisotropic conductive connector support shaft 35 is different from the anisotropic conductive connector support shaft 35. The electrically conductive connector 36 is supported. On the other hand, a support groove (not shown) is formed at a position corresponding to the anisotropic conductive connector support shaft 35 of the circuit board 12 so as to sandwich the electrode portion 14. The lower end of the conductive connector support shaft 35 can be fitted. As a result, the anisotropic conductive connector 36 supported by the anisotropic conductive connector support shaft 35 is interposed between the inspection object 33 held by the electronic member holding member 17 and the inspection electrode portion 14 of the circuit board 12. In this state, it is held in the conversion adapter 11. The details of the anisotropic conductive connector 36 will be described later.

  The lid member 18 is pivotally provided on the lid member support shaft 20 so that the upper surface of the base member 16 can be opened and closed. The lid member 18 is biased by a torsion coil spring 38 provided around the lid member support shaft 20 in a direction to open the upper surface of the base member 16 (in the direction of the arrow in FIG. 1). When the base end surface 39 of 18 contacts the base end 40 of the base member 16, the rotation of the lid member 18 in the same direction is restricted.

  In addition, a hook member 42 is pivotally provided at the distal end portion of the lid member 18 via a hook member support shaft 41, and the hook member 42 is forwardly moved by a torsion coil spring 43 provided around the hook member support shaft 41 ( It is urged in the clockwise direction in FIG. The hook member 42 includes a knob portion 44 that protrudes forward and a locking portion 45 that is formed in a hook shape at the bottom at the lower end, and the locking portion 45 is engaged with and disengaged from the locking projection 21. It is possible. Further, the lid member 18 is formed with a concave portion 46 from the lower surface side, and further, a pressing member support hole 47 is formed in the center of the concave portion 46 in the vertical direction, and the upper end portion of the pressing member support hole 47 is contracted. The stopper portion 48 is formed with a diameter.

  The pressing member 19 includes a supporting member 49 that is loosely fitted in the pressing member support hole 47 and a pressing main body member 51 that is provided around the lower end portion 50 of the supporting member 49. The support member 49 is configured by forming a flange portion 53 slightly below the center portion of the round bar-shaped portion 52, and a flat screw 54 is screwed into the upper end of the round bar-shaped portion 52, so that the stopper portion 48 and the flange portion 53 are connected. By providing the compression coil spring 55 around the support member 49 therebetween, the pressing member 19 can be expanded and contracted in the vertical direction with respect to the lid member 18.

  The pressing body member 51 has a support shaft fixing portion 57 narrower than the base portion 56 projecting in a step shape on the lower surface of the flat rectangular parallelepiped base portion 56, and is wider than the support shaft fixing portion 57 on the lower surface of the support shaft fixing portion 57. A narrow pressing portion 58 is further projected in a step shape. The base portion 56 is formed with a first recess 59 into which the flange portion 53 can be loosely fitted. The lower end portion 50 of the support member 49 is loosely extended from the base portion 56 to the support shaft fixing portion 57 at the center of the first recess 59. The 2nd recessed part 60 is formed so that it can fit. In addition, a pressing body member support shaft 61 is fixed to the support shaft fixing portion 57 so as to cross the second recess 60 horizontally, and the lower end portion 50 of the supporting member 49 is pivoted on the pressing body member support shaft 61. ing.

  Next, the anisotropic conductive connector 36 according to the embodiment of the present invention will be described in detail with reference to FIGS. 3 is a plan view showing the anisotropic conductive connector, FIG. 4 is a rear view showing the anisotropic conductive connector, FIG. 5 is a cross-sectional view taken along the line AA in FIGS. 3 and 4, and FIG. FIG. 7 is a partially enlarged cross-sectional view, FIG. 7 is a plan view showing a support for an anisotropic conductive connector, and FIG.

  The anisotropic conductive connector 36 includes a rectangular anisotropic conductive film 65 and a rectangular metal plate-like support 66 that supports the anisotropic conductive film 65.

  7 and 8, a rectangular opening 67 having a size smaller than that of the anisotropic conductive film 65 is formed at the center position of the support 66, and positioning is performed at each of the four corner positions. A hole 68 is formed. The anisotropic conductive film 65 is disposed in the opening 67 of the support 66, and the peripheral portion of the anisotropic conductive film 65 is fixed to the support 66, so that the anisotropic conductive film 65 is supported by the support 66. Has been.

  The anisotropic conductive film 65 includes a plurality of cylindrical conductive path forming portions 69 each extending in the thickness direction, and an insulating portion 70 made of an insulating elastic polymer material that insulates the conductive path forming portions 69 from each other. It is comprised by. The portion of the anisotropic conductive film 65 where the conductive path forming portion 69 is formed contains conductive particles (not shown) exhibiting magnetism.

  In the illustrated example, an effective conductive path in which a plurality of conductive path forming portions 69 formed in a region other than the peripheral portion of the anisotropic conductive film 65 are electrically connected to the electrode portion 101 of the inspection object 33. What is formed at the peripheral edge portion of the anisotropic conductive film 65 as the forming portion 71 is an invalid conductive path forming portion 72 that is not electrically connected to the electrode portion 101 of the inspection object 33, and forms an effective conductive path. The part 71 is arranged according to a pattern corresponding to the pattern of the electrode part 101 of the inspection object 33. The effective conductive path forming portion 71 is thicker than the reactive conductive path forming portion 72, and the effective conductive path forming portion 71 is formed so as to protrude from the invalid conductive path forming portion 72. Furthermore, an insulating layer 131 is formed on the surface of the invalid conductive path forming portion 72, and the insulating layer 131 is preferably formed of silicon rubber.

  On the other hand, the insulating portion 70 is integrally formed so as to surround the periphery of each conductive path forming portion 69, whereby all the conductive path forming portions 69 are insulated from each other by the insulating portion 70. It has become.

  One surface of the anisotropic conductive film 65 forms a flat surface, and the other surface has a protruding portion in which the surface of the portion forming the conductive path forming portion 69 protrudes from the surface of the portion forming the insulating portion 70. 69a is formed. Further, the surface layer portion on one surface of the anisotropic conductive film 65 contains a reinforcing material (not shown) made of an insulating mesh or a nonwoven fabric. In contrast, the other surface of the anisotropic conductive film 65 does not contain the reinforcing material.

  By including such a reinforcing material in the anisotropic conductive film 65, even when repeatedly pressed by the electrode portion 101 of the inspection object 33, the deformation of the conductive path forming portion 69 is further suppressed. More stable conductivity can be obtained.

  As the elastic polymer material forming the anisotropic conductive film 65, a polymer material having a crosslinked structure is preferable. Various materials can be used as the curable polymer substance-forming material that can be used to obtain such an elastic polymer substance. Specific examples thereof include polybutadiene rubber, natural rubber, and polyisoprene rubber. Conjugated diene rubbers such as styrene-butadiene copolymer rubber and acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof; styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer rubber, etc. Examples include block copolymer rubbers and hydrogenated products thereof; chloroprene rubber, urethane rubber, polyester rubber, epichlorohydrin rubber, silicon rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, and the like.

In the above, when weather resistance is required for the anisotropic conductive film 65, it is preferable to use a material other than the conjugated diene rubber, and in particular, from the viewpoint of molding processability and electrical characteristics, it is preferable to use silicon rubber. preferable. As the silicon rubber, those obtained by crosslinking or condensing liquid silicon rubber are preferable. The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10 ⁻¹ sec, and may be any of a condensation type, an addition type, a vinyl group or a hydroxyl group. Good. Specific examples include dimethyl silicon raw rubber, methyl vinyl silicon raw rubber, methyl phenyl vinyl silicon raw rubber, and the like.

  The silicon rubber preferably has a molecular weight Mw (referred to as a standard polystyrene equivalent weight average molecular weight; the same shall apply hereinafter) of 10,000 to 40,000. Moreover, since favorable heat resistance is obtained in the obtained conductive path formation part 69, it says the value of molecular weight distribution index (ratio Mw / Mn of standard polystyrene conversion weight average molecular weight Mw and standard polystyrene conversion number average molecular weight Mn). The same shall apply hereinafter) is preferably 2 or less.

  As the conductive particles contained in the conductive path forming part 69 in the anisotropic conductive film 65, the conductive particles exhibiting magnetism are used because the particles can be easily oriented by a method described later. Specific examples of such conductive particles include particles of metal having magnetism such as iron, cobalt, nickel, particles of these alloys, particles containing these metals, or these particles as core particles, The core particles are formed by plating the surface of the core particles with a metal having good conductivity such as gold, silver, palladium, rhodium, or non-magnetic metal particles or inorganic particles such as glass beads or polymer particles. The surface of the particles may be plated with a conductive magnetic metal such as nickel or cobalt.

  Among these, it is preferable to use nickel particles as core particles and the surfaces thereof plated with gold having good conductivity.

  The means for coating the surface of the core particles with the conductive metal is not particularly limited, and for example, chemical plating or electrolytic plating, sputtering, vapor deposition and the like are used.

  When using conductive particles coated with a conductive metal on the surface of the core particles, good conductivity can be obtained. Therefore, the conductive metal coverage on the particle surface (conductivity with respect to the surface area of the core particles). The ratio of the covering area of the conductive metal) is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.

  Further, the coating amount of the conductive metal is preferably 0.5 to 50% by mass of the core particle, more preferably 2 to 30% by mass, further preferably 3 to 25% by mass, and particularly preferably 4 to 20%. % By mass. When the conductive metal to be coated is gold, the coating amount is preferably 0.5 to 30% by mass of the core particles, more preferably 2 to 20% by mass, and further preferably 3 to 15%. % By mass.

  Moreover, it is preferable that the particle diameter of electroconductive particle is 1-100 micrometers, More preferably, it is 2-50 micrometers, More preferably, it is 3-30 micrometers, Most preferably, it is 4-20 micrometers. Moreover, it is preferable that the particle diameter distribution (Dw / Dn) of electroconductive particle is 1-10, More preferably, it is 1.01-7, More preferably, it is 1.05-5, Most preferably, it is 1.1- 4.

  By using the conductive particles satisfying such conditions, the obtained conductive path forming part 69 can be easily deformed under pressure, and the conductive path forming part 69 has sufficient electrical conductivity between the conductive particles. Contact is obtained.

  The shape of the conductive particles is not particularly limited, but is spherical, star-shaped, or secondary in which they are aggregated in that they can be easily dispersed in the polymer material-forming material. Particles are preferred.

  In addition, a conductive particle whose surface is treated with a coupling agent such as a silane coupling agent or a lubricant can be appropriately used. By treating the particle surface with a coupling agent or a lubricant, the durability of the anisotropic conductive connector 36 is improved.

  Such conductive particles are preferably used in a volume ratio of 5 to 60%, more preferably 7 to 50%, based on the polymer substance-forming material. When this ratio is less than 5%, the conductive path forming portion 69 having a sufficiently small electric resistance value may not be obtained. On the other hand, when this ratio exceeds 60%, the obtained conductive path forming portion 69 is likely to be fragile, and the elasticity required for the conductive path forming portion 69 may not be obtained.

  As the conductive particles used in the conductive path forming portion 69, those having a surface covered with gold are preferable. For example, the electrode portion 101 of the inspection object 33 is made of a solder alloy containing lead. In the conductive path forming portion 69, the conductive particles contained on the side in contact with the electrode of the inspection object made of the solder alloy are rhodium, palladium, ruthenium, tungsten, molybdenum, platinum, iridium, silver, and these. It is preferable that it is coated with a diffusion-resistant metal selected from an alloy containing, thereby preventing the lead component from diffusing into the coating layer of the conductive particles.

  The conductive particles having a surface coated with a diffusion-resistant metal are, for example, a chemical plating or electrolytic plating method, a sputtering method, a vapor deposition method on the surface of a core particle made of nickel, iron, cobalt, or an alloy thereof. For example, it can be formed by coating a diffusion-resistant metal.

As the mesh or the nonwoven fabric constituting the reinforcing material contained on one surface of the anisotropic conductive film 65, those formed of organic fibers can be preferably used. Examples of such organic fibers include fluorine resin fibers such as polytetrafluoroethylene fibers, aramid fibers, polyethylene fibers, polyarylate fibers, nylon fibers, and polyester fibers. Moreover, as an organic fiber, the linear thermal expansion coefficient is equal to or close to the linear thermal expansion coefficient of the material forming the connection object, specifically, the linear thermal expansion coefficient is 30 × 10 ⁻⁶ to ⁻⁵ × 10. ⁻⁶ / K, especially 10 × 10 ⁻⁶ to −3 × 10 ⁻⁶ / K, the thermal expansion of the anisotropic conductive film 65 is suppressed, and the thermal history due to the temperature change is received. Even in this case, a good electrical connection state with respect to the connection object can be stably maintained. Moreover, as an organic fiber, it is preferable to use the thing whose diameter is 10-200 micrometers.

  The mesh constituting the reinforcing material is preferably such that the ratio r1 / r2 is 1.5 or more, where r1 is the opening diameter of the mesh and r2 is the average particle diameter of the conductive particles used. Preferably it is 2 or more, more preferably 3 or more, particularly preferably 4 or more. When this ratio r1 / r2 is too small, in the manufacturing method described later, the conductive particles are difficult to be oriented in the thickness direction, so that it may be difficult to obtain a conductive path forming portion having a small electric resistance value. is there.

  The mesh opening diameter r1 is preferably 500 μm or less, more preferably 400 μm or less, and particularly preferably 300 μm or less. If the opening diameter r1 is excessive, it may be difficult to obtain an anisotropic conductive connector having high durability. As the non-woven fabric constituting the reinforcing material, it is preferable to use a non-woven fabric produced by a wet papermaking technique using the short fibers of the organic fibers as a raw material.

  Furthermore, the thickness of the reinforcing material is preferably 10 to 70% of the thickness of the anisotropic conductive film 65 to be formed, specifically, the thickness is preferably 50 to 500 μm, more preferably 80. ˜400 μm. Here, the thickness of the reinforcing material is a value measured by a micrometer.

  Furthermore, the reinforcing material is appropriately selected in consideration of easiness of impregnation with a liquid polymer material-forming material, which will be described later, and the balance between flexibility and dimensional stability. Is preferably 25 to 75%, more preferably 30 to 60%.

  In addition, the conductive particle coating can be composed of a plurality of metal layers. When coating a diffusion-resistant metal, for example, the outermost layer is a layer made of a diffusion-resistant metal such as rhodium, and the inner coating is formed. The layer is preferably a layer made of gold having good conductivity.

Further, the coating amount of the diffusion-resistant metal is a ratio that is preferably 5 to 40%, more preferably 10 to 30% in terms of mass fraction with respect to the conductive particles. As a material constituting the support 71, a material having a linear thermal expansion coefficient of 3 × 10 ⁻⁵ / K or less is preferably used, more preferably 2 × 10 ⁻⁵ to 1 × 10 ⁻⁶ / K, particularly preferably. Is 6 × 10 ⁻⁶ to 1 × 10 ⁻⁶ / K.

  As a specific material, a metal material or a non-metal material is used. As the metal material, gold, silver, copper, iron, nickel, cobalt, or an alloy thereof can be used.

  Non-metallic materials include polyimide resin, polyester resin, polyaramid resin, polyamide resin and other high mechanical strength materials, glass fiber reinforced epoxy resin, glass fiber reinforced polyester resin, glass fiber reinforced polyimide resin, etc. A composite resin material in which an inorganic material such as silica, alumina, boron nitride or the like is mixed as a filler to a resin material, an epoxy resin, etc. can be used. However, a polyimide resin, a glass fiber reinforced epoxy is used because of its low thermal expansion coefficient. A composite resin material such as a resin or a composite resin material such as an epoxy resin mixed with boron nitride as a filler is preferable.

  Next, a method for manufacturing the anisotropic conductive connector 36 according to the embodiment of the present invention will be described with reference to FIGS. Here, FIG. 9 is a cross-sectional view showing a mold for forming an anisotropic conductive film, FIG. 10 is a cross-sectional view showing a state in which a spacer and a support are disposed on the molding surface of the lower mold, and FIG. Sectional drawing which shows the state in which the 1st molding material layer was formed in the surface, and the 2nd molding material layer was formed on the molding surface of a lower mold | type, FIG. 12 is a 1st molding material layer and a 2nd molding material FIG. 13 is a sectional view showing a state where an anisotropic conductive film is formed, and FIG. 14 is a sectional view showing a state where the formed anisotropic conductive film is taken out from a mold. 15 is a plan view showing a printing mask for forming an insulating layer, FIG. 16 is a cross-sectional view showing the printing mask, and FIG. 17 shows a state in which the printing mask is arranged opposite to the anisotropic conductive connector. 18 is a sectional view showing a state where a printing mask is placed on an anisotropic conductive connector, and FIG. FIG. 20 is a cross-sectional view showing a state where a liquid insulating material is filled in a through hole of a mask, FIG. 20 is a cross-sectional view showing a state where a liquid insulating material is filled in a through hole of a printing mask, and FIG. 21 is an anisotropic conductive material. It is sectional drawing which shows the state in which the insulating layer was formed in the connector.

  The mold is configured by arranging an upper mold 73 and a lower mold 74 that is paired with the upper mold 73 so as to face each other, and a molding surface (lower surface in FIG. 9) of the upper mold 73 and a molding surface of the lower mold 74 (FIG. 9, a molding space 75 is formed between the upper surface and the upper surface 9.

  In the upper mold 73, the ferromagnetic layer 77 is formed on the surface (the lower surface in FIG. 9) of the ferromagnetic substrate 76 according to the arrangement pattern corresponding to the pattern of the conductive path forming portion 69 in the target anisotropic conductive connector 36. A nonmagnetic material layer 78 having a thickness substantially the same as the thickness of the ferromagnetic material layer 77 is formed at portions other than the ferromagnetic material layer 77 formed.

  On the other hand, in the lower die 74, the ferromagnetic layer 80 is formed on the surface of the ferromagnetic substrate 79 (upper surface in FIG. 9) according to a pattern corresponding to the pattern of the conductive path forming portion 69 in the target anisotropic conductive connector 36. A nonmagnetic layer 81 having a thickness larger than the thickness of the ferromagnetic layer 80 is formed at portions other than the ferromagnetic layer 80. The nonmagnetic layer 81 and the ferromagnetic layer 80 are formed. Is formed on the molding surface of the lower die 74 to form a recessed space 80a for forming the protruding portion 69a.

  Ferromagnetic metals such as iron, iron-nickel alloy, iron-cobalt alloy, nickel, and cobalt can be used as materials constituting the ferromagnetic substrates 76 and 79 in each of the upper mold 73 and the lower mold 74. The ferromagnetic substrates 76 and 79 preferably have a thickness of 0.1 to 50 mm, have a smooth surface, are chemically degreased, and are mechanically polished. preferable.

  In addition, as a material constituting the ferromagnetic layers 77 and 80 in each of the upper mold 73 and the lower mold 74, ferromagnetic metals such as iron, iron-nickel alloy, iron-cobalt alloy, nickel, and cobalt are used. it can. The ferromagnetic layers 77 and 80 preferably have a thickness of 10 μm or more. When this thickness is less than 10 μm, it becomes difficult to cause a magnetic field having a sufficient strength distribution to act on the molding material layer formed in the mold, and as a result, a conductive path in the molding material layer. Since it becomes difficult to gather conductive particles at a high density at a portion to be the formation portion 69, a good anisotropic conductive connector 36 may not be obtained.

  Further, as the material constituting the nonmagnetic layers 78 and 81 in each of the upper mold 73 and the lower mold 74, a nonmagnetic metal such as copper, a heat-resistant polymer substance, or the like can be used. It is preferable to use a polymer substance cured by radiation in that the nonmagnetic layers 78 and 81 can be easily formed by the above method. Examples of the material include acrylic dry film resists and epoxy-based materials. A photoresist such as a liquid resist or a polyimide liquid resist can be used.

  Further, the thickness of the non-magnetic layer 81 in the lower die 74 is set according to the protruding height of the protruding portion 69 a to be formed and the thickness of the ferromagnetic layer 80.

  Using such a mold, for example, the anisotropic conductive connector 36 is manufactured as follows.

  First, as shown in FIG. 10, frame-like spacers 82 a and 82 b and a support body 66 having an opening 67 and a positioning hole 68 as shown in FIGS. 7 and 8 are prepared. A lower spacer 74 is fixedly disposed at a predetermined position via a frame-shaped spacer 82 b, and a frame-shaped spacer 82 a is further disposed on the upper mold 73. On the other hand, a paste-like molding material is prepared by dispersing conductive particles exhibiting magnetism in a curable polymer substance-forming material.

  Next, as shown in FIG. 11, the molding material is filled in the space formed by the spacer 82 a on the molding surface of the upper mold 73 to form the first molding material layer 83 a, while the molding material is The second molding material layer 83b is formed by filling the space formed by the lower mold 74, the spacer 82b, and the support 66.

  Then, as shown in FIG. 12, the first mold material layer 83a is laminated on the second mold material layer 83b by positioning the upper mold 73 on the support 66 and arranging it. Next, by operating electromagnets (not shown) disposed on the upper surface of the ferromagnetic substrate 76 in the upper mold 73 and the lower surface of the ferromagnetic substrate 70 in the lower mold 74, a parallel magnetic field having an intensity distribution, that is, A parallel magnetic field having a large strength between the ferromagnetic layer 77 of the upper mold 73 and the corresponding ferromagnetic layer 80 of the lower mold 74 is applied to the first molding material layer 83a and the second molding material layer 83b. Act in the thickness direction. As a result, in the first molding material layer 83a and the second molding material layer 83b, the conductive particles dispersed in each molding material layer are transferred to each ferromagnetic layer 77 of the upper mold 73 and the same. They are gathered at a portion to be the conductive path forming portion 69 located between the corresponding lower die 74 and the ferromagnetic layer 80, and are aligned in the thickness direction of the respective molding material layers.

  Then, in this state, by curing each molding material layer, as shown in FIG. 13, the conductive path is packed tightly in a state in which the conductive particles are aligned in the thickness direction in the elastic polymer substance. An anisotropic conductive film having a forming portion 69 and an insulating portion 70 made of an insulating elastic polymer material formed so as to surround the conductive path forming portion 69 and having no or almost no conductive particles. 65 is formed.

  Next, as shown in FIG. 14, the anisotropic conductive film 65 fixed to the support 66 is taken out from the mold, and as shown in FIG. 17, the printing mask 132 is opposed above the surface of the anisotropic conductive film 65. And place it. As shown in FIGS. 15 and 16, the printing mask 132 has a rectangular shape, and a recess 133 is formed at a position corresponding to the effective conductive path forming portion 71 at the center. A through hole 134 is formed at a position corresponding to the invalid conductive path forming portion 72 on the outer peripheral portion.

  As shown in FIG. 18, when the printing mask 132 is placed on the surface of the anisotropic conductive film 65, the protruding portion 69 a of the effective conductive path forming portion 71 is accommodated in the concave portion 13 and the invalid conductive path forming portion 72. A through hole 134 is disposed above the. Therefore, as shown in FIG. 19, the through-hole 134 is filled with liquid silicon rubber 136 from above, and the silicon rubber 136 protruding from the printing mask 132 is removed by the squeegee 135.

  Then, as shown in FIG. 20, the printing mask 132 is removed before the silicone rubber 136 is cured in a state where the through-hole 134 is filled with the liquid silicone rubber 136. Then, as shown in FIG. 21, the silicon rubber 136 flows and spreads around, and becomes lower than the protruding portion 69a of the effective conductive path forming portion 71. In this state, the silicon rubber 136 is heated and cured, and the invalid conductive An insulating layer 131 is formed on the surface of the path forming portion 72.

  In the above, the curing treatment of each molding material layer can be performed in a state where the parallel magnetic field is applied, but can also be performed after the operation of the parallel magnetic field is stopped. The intensity of the parallel magnetic field applied to each molding material layer is preferably such that the average is 20,000 to 1,000,000 μT.

  Further, as a means for applying a parallel magnetic field to each molding material layer, a permanent magnet can be used instead of an electromagnet. The permanent magnet is preferably made of alnico (Fe—Al—Ni—Co alloy), ferrite, or the like in that a parallel magnetic field strength in the above range can be obtained.

  The curing treatment of each molding material layer is appropriately selected depending on the material used, but is usually performed by heat treatment. The specific heating temperature and heating time are appropriately selected in consideration of the type of polymer substance forming material constituting the molding material layer, the time required to move the conductive particles, and the like.

  Next, a method of inspecting the inspection object 33 using the above-described inspection apparatus conversion adapter 11 will be described with reference to FIGS. Here, FIG.22 and FIG.23 is sectional drawing which shows the effect | action of the conversion adapter for inspection apparatuses which concerns on embodiment of this invention.

  First, the inspection object 33 is placed in the inspection object holding member 17 with the lid member 18 of the conversion adapter main body 13 being opened. The inspection object 33 is guided into the space 32 at a predetermined position by the inclined surface 34 of each inspection object support portion 31 and set on the anisotropic conductive connector 36.

  Next, when the lid member 18 is rotated against the urging force of the torsion coil spring 38 and the upper surface of the base member 16 is covered with the lid member 18, the latching portion 45 of the hook member 42 is latched to the latching protrusion 21. This locked state is held by the urging force of the torsion coil spring 43. At this time, the pressing member 19 moves downward as the lid member 18 rotates, and the pressing portion 58 is guided into the space 32 by the inclined surface 34 of each inspection object support portion 31. Then, the inspection object 33 is pressed. At this time, since the compression coil spring 55 is compressed between the stopper portion 48 and the flange portion 53, the inspection object 33 presses the anisotropic conductive connector 36 with a predetermined pressure corresponding to the compression amount of the compression coil spring 55. To do. Accordingly, the electrode portion 101 of the inspection object 33 and the electrode portion 14 of the circuit board 12 are held in an electrically conductive state with the conductive path forming portion 69 of the anisotropic conductive connector 36 interposed therebetween.

  In this state, when a current is applied to the circuit board 12 from a power supply facility (not shown) on the inspection apparatus side, a current is also applied to the inspection object 33 via the anisotropic conductive connector 36 and the electrode portion 101, thereby A predetermined electrical inspection can be performed on the inspection object 33.

  At this time, even if the conductive material such as the conductive particles of the conductive path forming portion 69 generated when the anisotropic conductive film 65 is formed adheres to the test circuit board 12, the test circuit board 12. Since the insulating layer 131 electrically insulates between the test electrode part 14 and the invalid conductive path forming part 72, a leak current may flow between the test electrode part 14 and the invalid conductive path forming part 72. There is no risk of inspection failures due to short circuits.

  Further, since the insulating layer 131 is formed so as to be lower than the protruding portion 69a of the effective conductive path forming portion 71, the insulating layer 131 comes into contact with the inspection circuit board 12 to thereby check the effective conductive path forming portion 71 and the inspection. Contact with the electrode part 124 is not hindered. Accordingly, during the electrical inspection described above, the effective conductive path forming portion 71 reliably contacts the inspection electrode portion 124 of the inspection circuit board 121, so that the electrical inspection can be performed smoothly and reliably.

(A) Production of support and mold:
According to the following conditions, a support having the structure shown in FIG. 7 and a mold for forming an anisotropic conductive film having the structure shown in FIG. 9 were produced.
[Support]
The support 66 is made of SUS304, has a thickness of 0.2 mm, and an opening 67 has a size of 18.5 mm × 18.5 mm, and has positioning holes 68 at four corners.
〔Mold〕
The ferromagnetic substrates 76 and 79 are made of iron and have a thickness of 6 mm.
The ferromagnetic layer 77 in the upper mold 73 is made of nickel, has a diameter of 0.3 mm (circular), a thickness of 0.1 mm, an arrangement pitch (center-to-center distance) of 0.5 mm, and the number of ferromagnetic layers is 1600 (40 × 40).

  The non-magnetic layer 78 is made of a dry film resist that is hardened and has a thickness of 0.1 mm.

  The ferromagnetic layer 80 in the lower die 79 is made of nickel, has a diameter of 0.3 mm (circular), a thickness of 0.1 mm, an arrangement pitch (center-to-center distance) of 0.5 mm, and an arrangement pitch (center-to-center). The distance) is 0.5 mm, and the number of ferromagnetic layers is 1296 (36 × 36).

  The ferromagnetic layer 84 is made of nickel, has a diameter of 0.3 mm (circular), a thickness of 0.15 mm, an arrangement pitch (center-to-center distance) of 0.5 mm, and 2 outside the ferromagnetic layer 80. The number of ferromagnetic layers arranged in a row is 304.

The nonmagnetic layer 81 is made of a dry film resist that is hardened and has a thickness of 0.15 mm.
(B) Preparation of molding material:
A first molding material was prepared by adding 60 parts by weight of conductive particles having an average particle diameter of 35 μm to 100 parts by weight of addition-type liquid silicone rubber, followed by defoaming treatment under reduced pressure. In the above, as the conductive particles, those obtained by applying gold plating to the core particles made of nickel (average coating amount: 15% by weight of the weight of the core particles) were used.

In the above, the addition-type liquid silicone rubber used is a two-component type composed of a liquid A and a liquid B each having a viscosity of 250 Pa · S, and the cured product has a compression set of 5% and a durometer A hardness. Of 32 and tear strength of 25 kN / m were used.
(C) Formation of anisotropic conductive film:
A spacer 82a having a thickness of 0.225 mm and an opening of 22 mm × 22 mm is aligned and placed on the molding surface of the upper mold 73 of the above-described mold, and the prepared molding material is applied by screen printing, A first molding material layer 83a having a thickness of 0.225 mm was formed.

  A spacer 82b having a thickness of 0.225 mm and an opening of 220 mm × 220 mm is positioned and arranged on the molding surface of the lower mold 74 of the above-described mold, and the support 66 is positioned on the spacer 82b. The second molding material having a thickness of 0.425 mm is formed in the space formed by the lower mold 74, the spacers 82a and 82b and the support 66 by applying the molding material prepared by screen printing by screen printing. Layer 83b was formed.

  Then, the first molding material layer 83a formed on the upper mold 73 and the second molding material layer 83b formed on the lower mold 74 were aligned and overlapped. Then, for each molding material layer formed between the upper mold 73 and the lower mold 74, a 2T magnetic field is applied in the thickness direction by an electromagnet to a portion located between the ferromagnetic layers 77 and 80, An anisotropic conductive film 65 was formed by performing a curing process at 100 ° C. for 1 hour.

  The anisotropic conductive connector was manufactured as described above.

Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector A1”.
(D) Formation of insulating layer:
[Mask for printing]
The printing mask 132 is made of SUS304, has a thickness of 0.1 mm, an outer diameter of 24 mm × 24 mm, and has a recess 133 at the center of which is 18 mm long × 18 mm wide and 0.05 mm deep, A through-hole 134 having a width of 0.8 mm is formed on the outer periphery of the recess so as to be 0.2 mm away from the recess. (See FIGS. 15 and 16)
As shown in FIG. 17, a printing mask 132 is disposed oppositely above the surface of the anisotropic conductive film 65 of the anisotropic conductive connector A <b> 1, and the printing mask 132 is placed on the effective conductive path of the anisotropic conductive film 65. The projecting portion 69 a of the forming portion 71 was accommodated in the recess 133, and the invalid conductive path forming portion 72 was laminated so as to be accommodated in the through hole 134.

  Then, as shown in FIG. 19, liquid silicon rubber 136 was filled into the through-hole 134 of the printing mask 132 from above, and the silicon rubber 136 protruding from the printing mask 132 was removed with the squeegee 135.

  In the above, the addition-type liquid silicone rubber used is a two-component type composed of a liquid A and a liquid B each having a viscosity of 250 Pa · S, and the cured product has a compression set of 5% and a durometer A hardness. Of 32 and tear strength of 25 kN / m were used.

  Next, the printing mask 132 was removed and left at room temperature for 10 minutes to allow the silicon rubber 136 to flow and spread around.

  Thereafter, the anisotropic conductive connector A1 on which the silicon rubber 136 was printed was subjected to a curing process at 100 ° C. for 1 hour to form the insulating layer 131.

  As described above, the anisotropic conductive connector 36 according to the present invention was manufactured.

Hereinafter, this anisotropic conductive connector is referred to as “anisotropic conductive connector B1”.
<Evaluation of anisotropic conductive connector>
The anisotropic conductive connector B1 (Example 1) in which the insulating layer 131 according to the present invention is formed and the anisotropic conductive connector A1 (Comparative Example 1) in which the insulating layer 131 is not formed are as follows. And evaluated.

  In order to evaluate the anisotropic conductive connectors according to Example 1 and Comparative Example 1, as shown in FIGS. 24 to 27, an inspection device 141, a test object 142 for testing, and a circuit board 143 for testing were prepared.

  This test object 142 has a diameter of 0.3 mm and a height of 0.2 mm of solder ball electrodes 144 (material: 64 solder) at a pitch of 0.5 mm for a total of 1296 rows and 36 rows and 36 rows. The two solder ball electrodes 144 in different columns and rows are electrically connected to each other by the wiring 145 in the inspection object 142 (see FIG. 25).

  Further, the inspection circuit board 143 has a total of 1600 inspection electrodes 146 having a diameter of 0.3 mm in a length of 40 rows and a width of 40 rows at a pitch of 0.5 mm, and 40 in the same vertical direction are one. They are connected by one wiring 147, and 40 lines of wiring are arranged in parallel in the horizontal direction (see FIG. 26).

  As shown in FIG. 27, the anisotropic conductive connector 36 is inserted into the positioning hole of the support 66 in the anisotropic conductive connector 36 by inserting the guide pins 148 of the test circuit board 143 into the test circuit board 143. The test object 142 for testing is placed on the anisotropic conductive connector 36, and these are placed on the anisotropic conductive connector 36 by a pressurizing jig (not shown). The conductive path forming part 69 of the conductive film 65 is pressurized so that the distortion rate is 30% (the thickness of the conductive path forming part during pressurization is 0.35 mm). External terminals (not shown) of the inspection circuit board 143 electrically connected to each other through the object 142 and the inspection electrode 146 of the inspection circuit board 143 and wiring (not shown). ), A 10 mA DC current is applied by a DC power source (not shown) and a constant current control device (not shown), and between external terminals of the circuit board 143 for inspection at the time of pressurization by a voltmeter (not shown) Were sequentially measured.

  In the measurement, a current is applied to an external terminal connected to one wiring of the circuit board 143 for inspection, a voltage is measured for each of the external terminals connected to the remaining 35 wirings, and then the external terminals to which current is applied are sequentially applied. It changed and the voltage was measured about each circuit of the test target object 142 for a test.

  As a result of the above evaluation, the anisotropic conductive connector B1 in which the insulating layer 131 according to the present invention was formed was able to measure the voltage for all the circuits of the test circuit device.

  On the other hand, in the anisotropic conductive connector A1 in which the insulating layer 131 according to the comparative example 1 is not formed, an electrical short circuit occurs via the invalid conductive path forming portion 72 and the support 66 during voltage measurement, and a specific test is performed. Most of the voltage measurements on the wiring of the circuit devices could not be performed.

  In addition, in this invention, it is not limited to said embodiment, For example, various changes can be added as follows.

  (1) The anisotropic conductive connector 36 is not necessarily provided with the support 66, and the anisotropic conductive connector 36 may be composed of only the anisotropic conductive film 65.

  (2) A lubricant may be applied to the upper surface or both surfaces of the anisotropic conductive connector 36. By applying the lubricant, it is possible to improve the durability of the anisotropic conductive connector 36 at the time of electrical inspection.

  (3) In the anisotropic conductive connector 36, the conductive path forming portions 69 are arranged at a constant pitch, and a part of the conductive path forming portions 69 is electrically connected to the electrode portion 101 of the inspection object 33. The path forming unit 71 may be another ineffective conductive path forming unit 72 that is not electrically connected to the electrode unit 101 of the inspection object 33. More specifically, as the inspection object 33, for example, an electrode part is provided only at a part of the lattice point positions at a constant pitch, such as CSP (Chip Scale Package) and TSOP (Thin Small Outline Package). There is a configuration in which a certain solder ball electrode is arranged. In such an anisotropic conductive connector 36 used for performing an electrical inspection on the inspection object 33, the conductive path forming portion 69 has an inspection object. The conductive path forming portions 69 arranged according to the lattice point positions of substantially the same pitch as the 33 electrode portions 101 and corresponding to the electrode portions serve as effective conductive path forming portions, and other conductive path forming portions. 69 may be an invalid conductive path forming portion.

  According to the anisotropic conductive connector 36 having such a configuration, when the anisotropic conductive connector 36 is manufactured, the ferromagnetic layers of the mold are arranged at a constant pitch, so that a magnetic field acts on the molding material layer. When this is done, the conductive particles can be efficiently assembled and oriented at a predetermined position, whereby the density of the conductive particles becomes uniform in each of the obtained conductive path forming portions 69. The anisotropic conductive connector 36 having a small difference in resistance value between the conductive path forming portions 69 can be obtained.

  (4) The anisotropic conductive film 65 may have a form in which the conductive path forming portion 69 and the insulating portion 70 are not provided and the conductive particles are dispersed in the plane direction and oriented in the thickness direction. Such an anisotropic conductive film can be manufactured by the method etc. which were shown by patent publication 2003-77560.

  (5) The inspection object 33 is not particularly limited and various objects can be used. For example, a transistor, a diode, a relay, a switch, an IC chip or an LSI chip, or a package thereof, or an MCM (Multi Chip Module) Active parts consisting of semiconductor devices, resistors, capacitors, crystal resonators, speakers, microphones, transformers (coils), passive components such as inductance, TFT liquid crystal display panels, STN liquid crystal display panels, plasma display panels, electroluminescence Examples include display panels such as panels, wafers on which circuits are formed, and wafers that have been diced.

  (6) The application of the anisotropic conductive connector 36 according to the present invention is not limited to the inspection by the inspection apparatus provided with the conversion adapter 11 described above. For example, as shown in FIG. The anisotropic conductive connector 36 is positioned and arranged on the inspection circuit board 121 by inserting the guide pins 122 of the inspection circuit board 121 into the positioning holes of the support 66 of the anisotropic conductive connector 36, and On the anisotropic conductive connector 36, the inspection object 33 provided with the solder ball electrode portion 128 may be arranged to perform durability inspection.

  In this durability inspection, a predetermined load is applied to the inspection object 33 by a pressurizing jig (not shown) in a state where the anisotropic conductive connector 36 is disposed in the thermostatic bath 123, and during the pressurization, A constant current is repeatedly applied to measure the electric resistance value, and the pressurization cycle is repeated to evaluate the anisotropic conductive connector. The measurement of the electrical resistance value at this time is electrically connected to each other via the anisotropic conductive connector 36, the inspection object 33, the inspection electrode portion 124 of the inspection circuit board 121 and its wiring (not shown). In addition, while the DC power source 125 and the constant current control device 126 are constantly applying a DC current between the external terminals (not shown) of the inspection circuit board 121, the inspection circuit board 121 during pressurization is applied by the voltmeter 127. This is done by measuring the voltage between the external terminals.

It is sectional drawing which shows the conversion adapter for inspection apparatuses which concerns on embodiment of this invention. It is a top view which shows the conversion adapter main body of the conversion adapter for inspection apparatuses which concerns on embodiment of this invention. It is a top view which shows the anisotropically conductive connector which concerns on embodiment of this invention. It is a rear view which shows the anisotropically conductive connector which concerns on embodiment of this invention. It is AA sectional drawing of FIG.3 and FIG.4. It is a partial expanded sectional view of FIG. It is a top view which shows the support body of the anisotropically conductive connector which concerns on embodiment of this invention. It is BB sectional drawing of FIG. It is sectional drawing which shows the metal mold | die for anisotropically conductive film shaping | molding of the anisotropically conductive connector which concerns on embodiment of this invention. In embodiment of this invention, it is sectional drawing which shows the state which has arrange | positioned the spacer and the support body on the molding surface of the lower mold | type. In embodiment of this invention, it is sectional drawing which shows the state in which the 1st molding material layer was formed on the molding surface of an upper mold | type, and the 2nd molding material layer was formed on the molding surface of a lower mold | type. In embodiment of this invention, it is sectional drawing which shows the state by which the 1st molding material layer and the 2nd molding material layer were laminated | stacked. In embodiment of this invention, it is sectional drawing which shows the state in which the anisotropic conductive film was formed. It is sectional drawing which shows the state which took out the anisotropic conductive film formed in embodiment of this invention from the metal mold | die. It is a top view which shows the mask for printing for the insulating layer shaping | molding of the anisotropically conductive connector which concerns on embodiment of this invention. It is sectional drawing which shows the mask for printing for the insulating layer shaping | molding of the anisotropically conductive connector which concerns on embodiment of this invention. It is sectional drawing which shows the state which made the mask for printing face the anisotropically conductive connector which concerns on embodiment of this invention. It is sectional drawing which shows the state which mounted the mask for printing in the anisotropically conductive connector which concerns on embodiment of this invention. It is sectional drawing which shows the state which has filled the through-hole of the printing mask for the insulating layer shaping | molding of the anisotropically conductive connector which concerns on embodiment of this invention with the liquid insulating material. It is sectional drawing which shows the state which filled the through-hole of the printing mask for insulating layer shaping | molding of the anisotropically conductive connector which concerns on embodiment of this invention with the liquid insulating material. It is sectional drawing which shows the state which formed the insulating layer in the anisotropically conductive connector which concerns on embodiment of this invention. It is sectional drawing which shows the effect | action of the conversion adapter for inspection apparatuses provided with the anisotropically conductive connector which concerns on embodiment of this invention. It is sectional drawing which shows the effect | action of the conversion adapter for inspection apparatuses provided with the anisotropically conductive connector which concerns on embodiment of this invention. It is explanatory drawing which shows the inspection apparatus in Example 1 of this invention. It is a top view which shows the arrangement | sequence of the solder hole electrode of a test object in the inspection apparatus of FIG. It is a top view which shows the arrangement | sequence of the test | inspection electrode of the circuit board for a test | inspection in the test | inspection apparatus of FIG. It is explanatory drawing which shows the effect | action of the test | inspection apparatus in Example 1 of this invention. It is explanatory drawing which shows another example of the test | inspection apparatus provided with the anisotropically conductive connector which concerns on embodiment of this invention. It is sectional drawing which shows the conversion adapter for test | inspection apparatuses provided with the conventional anisotropically conductive connector.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Inspection apparatus conversion adapter 12 Circuit board 14 Electrode part 33 Test object 36 Anisotropic conductive connector 65 Anisotropic conductive film 69 Conductive path formation part 70 Insulation part 71 Effective conductive path formation part 72 Invalid conductive path formation part 73 Upper mold | type 74 Lower mold 75 Molding space 83a First molding material layer 83b Second molding material layer 101 Electrode portion 121 Circuit board for inspection 124 Inspection electrode portion 131 Insulating layer 132 Mask for printing 134 Through hole 136 Insulating material

Claims (4)

In order to electrically connect and inspect an inspection object having an electrode part and an inspection circuit board having an inspection electrode part, an electrode part of the inspection object and an inspection electrode part of the inspection circuit board An anisotropic conductive connector provided between
A conductive path forming part having conductivity in the thickness direction and capable of electrically connecting the electrode part of the inspection object and the inspection electrode part of the circuit board for inspection, and the conductive path forming part are insulated from each other An effective conductive path forming part that is electrically connected to the electrode part of the inspection object is formed in a region other than the peripheral part of the conductive path forming part, and the conductive path forming part The invalid conductive path forming part that is not electrically connected to the electrode part of the object to be inspected is formed in the peripheral part of the test object, and an insulating layer is formed on the surface of the invalid conductive path forming part. Characteristic anisotropic conductive connector. 2. The anisotropic conductivity according to claim 1, wherein the effective conductive path forming portion is thicker than the reactive conductive path forming portion, and the effective conductive path forming portion is formed so as to protrude from the reactive conductive path forming portion. connector. An inspection apparatus conversion adapter provided in an inspection apparatus that electrically connects an inspection object having an electrode part and an inspection circuit board having an inspection electrode part to perform an electrical inspection on the inspection object. And
The inspection adapter conversion adapter includes the anisotropic conductive connector according to claim 1 or 2. In order to electrically connect and inspect an inspection object having an electrode part and an inspection circuit board having an inspection electrode part, an electrode part of the inspection object and an inspection electrode part of the inspection circuit board A method for manufacturing an anisotropically conductive connector provided between,
(A) A first molding material layer is formed on the molding surface of one of the pair of molds that are arranged to face each other and form a molding space, and the first molding material layer is formed on the molding surface of the other mold. Forming a molding material layer of 2;
(B) The inspection is performed by laminating the first molding material layer and the second molding material layer, applying a parallel magnetic field in the thickness direction of each molding material layer, and curing each molding material layer. An anisotropic conductive film is formed having a conductive path forming portion that can electrically connect the electrode portion of the object and the inspection electrode portion of the circuit board for inspection, and an insulating portion that insulates the conductive path forming portion from each other And a process of
(C) A printing mask having a through hole formed at a position corresponding to the ineffective conductive path forming portion formed at the peripheral edge of the conductive path forming portion is placed on the surface of the anisotropic conductive film, and the through Filling the holes with a liquid insulating material;
(D) removing the printing mask before the insulating material is cured, heating the insulating material, and curing the insulating material;
A method for manufacturing an anisotropically conductive connector, comprising:

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