JP2004055514A5

JP2004055514A5 -

Info

Publication number: JP2004055514A5
Application number: JP2003030784A
Authority: JP
Filing date: 2003-02-07
Publication date: 2005-07-21

Claims

An anisotropic conductive connector having an anisotropic conductive film in which a plurality of conductive path forming portions each extending in the thickness direction are arranged in a state of being insulated from each other by an insulating portion,
The anisotropic conductive film is formed by integrally laminating at least two elastic layers, each of which is formed of an insulating elastic polymer material. Contains conductive particles exhibiting magnetism, and the durometer hardness of the elastic polymer material constituting one elastic layer among the elastic layers forming the surface of the anisotropic conductive film is H ₁ , An anisotropic conductive connector characterized by satisfying the following condition (1) and condition (2) when the durometer hardness of the elastic polymer material constituting the elastic layer is H ₂ .
Condition (1): H ₁ ≧ 30
Condition (2): H ₁ / H ₂ ≧ 1.1

The anisotropic conductive connector according to claim 1, wherein the following condition (3) is satisfied.
Condition (3): 15 ≦ H ₂ ≦ 55

The anisotropic conductive connector according to claim 1, wherein a support body that supports a peripheral portion of the anisotropic conductive film is provided.

An anisotropic conductive connector interposed between a circuit device to be inspected and a circuit board for inspection for electrically connecting an electrode to be inspected of the circuit device and an inspection electrode of the circuit board. ,
The elastic polymer material forming the elastic layer in contact with the circuit device in the anisotropic conductive film has a durometer hardness satisfying H ₁ in the conditions (1) and (2). The anisotropically conductive connector according to any one of claims 1 to 3.

5. The anisotropic conductive connector according to claim 4, wherein the elastic layer in contact with the electrode to be inspected in the anisotropic conductive film contains particles that do not exhibit conductivity and magnetism.

6. The anisotropic conductive connector according to claim 5, wherein the particles that do not exhibit conductivity and magnetism are diamond powder.

The anisotropic conductive film has a conductive path forming portion that is not electrically connected to the electrode to be inspected, in addition to a conductive path forming portion that is electrically connected to the electrode to be inspected of the circuit device to be inspected. The anisotropic conductive connector according to claim 3, wherein the anisotropic conductive connector is provided.

8. The conductive path forming portion that is not electrically connected to the electrode to be inspected of the circuit device to be inspected is formed at least at the peripheral portion of the anisotropic conductive film supported by the support. Anisotropic conductive connector as described.

The anisotropic conductive connector according to claim 7 or 8, wherein the conductive path forming portions are arranged at a constant pitch.

The anisotropic conductive connector according to claim 1, wherein a reinforcing material is contained in at least one of the elastic layers forming the anisotropic conductive film.

In the anisotropic conductive film, an intermediate elastic layer is formed between one elastic layer and the other elastic layer, each of which forms a surface. The one elastic layer, the other elastic layer, and the intermediate elastic layer The anisotropic conductive connector according to claim 1, wherein a reinforcing material is contained in any one of the layers.

The anisotropic conductive connector according to claim 10 or 11, wherein the reinforcing material is made of mesh or non-woven fabric.

The anisotropic conductive connector according to claim 12, wherein the mesh or the nonwoven fabric is formed of an organic fiber.

Organic fiber has a linear thermal expansion coefficient of 30 × 10 ^-6-6 ~ -5x10 ^-6-6 The anisotropic conductive connector according to claim 13, which is / K.

A plurality of conductive path forming portions extending in the thickness direction are mutually connected by an insulating portion. A method of manufacturing an anisotropic conductive connector having an anisotropic conductive film disposed in an insulated state,
Prepare a mold for forming an anisotropic conductive film in which a molding space is formed by a pair of molds,
A paste-like molding material layer is formed on the molding surface of one mold, and the polymer substance-forming material contains conductive particles exhibiting magnetism, and the polymer substance is formed on the molding surface of the other mold. Forming at least one paste-form molding material layer containing conductive particles in the forming material;
The molding material layer formed on the molding surface of the one mold and the molding material layer formed on the molding surface of the other mold are stacked, and then the strength distribution is increased in the thickness direction of each molding material layer. A step of forming an anisotropic conductive film by applying a magnetic field and curing each molding material layer,
The durometer hardness of the elastic polymer material obtained by curing the polymer material forming material in the molding material layer formed on the molding surface of the one mold is H _{1 1} And the durometer hardness of the elastic polymer material obtained by curing the polymer material forming material in the molding material layer formed on the molding surface of the other mold is H _{2 2} The following method (1) and condition (2) are satisfied:
Condition (1): H _{1 1} ≧ 30
Condition (2): H _{1 1} / H _{2 2} ≧ 1.1

An inspection circuit board having inspection electrodes arranged corresponding to the electrodes to be inspected of the circuit device to be inspected;
The anisotropic conductive connector according to claim 3, wherein the anisotropic conductive connector is disposed on the circuit board for inspection.
An inspection apparatus for circuit devices, comprising:

A pressure relief frame that relaxes the pressure of the electrode to be inspected on the anisotropic conductive film of the anisotropic conductive connector is disposed between the circuit device to be inspected and the anisotropic conductive connector. The circuit device inspection device according to claim 16.

18. The circuit device inspection apparatus according to claim 17, wherein the pressure relief frame has spring elasticity or rubber elasticity.