JP2009115579A - Probe member, probe card using the probe member and wafer inspection system using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a simple structured probe member, probe card and wafer inspection system, when conducting burn-in test for a wafer of 8 inches or larger, capable of surely providing a good electric conductivity for all conductive parts for electric connection, and further capable of stably maintaining a good electric connection state for a long period of time under repeated usage at a high temperature environment and against environmental changes such as heat history by a temperature change, and capable of easily adjusting and holding-fixing the position against a wafer. <P>SOLUTION: The probe member is configured of a first anisotropically conductive connector and a second anisotropically conductive connector, wherein by supporting these on a frame plate, mutually corresponding electric conductive parts for connection of the first anisotropically conductive connector and the second anisotropically conductive connector are positioned and fixed as an one body. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a probe member used for performing electrical inspection of a plurality of integrated circuits formed on a wafer to be inspected in a wafer state, a probe card using the probe member, and a wafer inspection apparatus using the probe card About.

  In general, in the manufacturing process of a semiconductor integrated circuit device, a large number of integrated circuits are formed on a wafer made of, for example, silicon, and then each of these integrated circuits has a defect by inspecting basic electrical characteristics. A probe test is performed to select the integrated circuit. Next, the semiconductor chip is formed by cutting the wafer, and the semiconductor chip is housed in an appropriate package and sealed. Further, each packaged semiconductor integrated circuit device is subjected to a burn-in test for selecting a semiconductor integrated circuit device having a potential defect by inspecting electrical characteristics in a high temperature environment.

  In such an electrical inspection of an integrated circuit such as a probe test or a burn-in test, a probe member is used to electrically connect each of the electrodes to be inspected in the inspection object to a tester. Such a probe member is composed of an inspection circuit board on which inspection electrodes are formed according to a pattern corresponding to the pattern of the electrode to be inspected, and an anisotropic conductive elastomer sheet disposed on the inspection circuit board. It has been known.

  As such an anisotropic conductive elastomer sheet, those having various structures are conventionally known. For example, Patent Document 1 discloses an anisotropic conductive elastomer sheet obtained by uniformly dispersing metal particles in an elastomer. (Hereinafter, this is referred to as “dispersed anisotropic conductive elastomer sheet”), and Patent Document 2 and the like disclose that the conductive magnetic particles are distributed non-uniformly in the elastomer, thereby increasing the thickness direction. An anisotropic conductive elastomer sheet (hereinafter, referred to as “an unevenly distributed anisotropic conductive elastomer sheet”) in which a large number of conductive portions extending in the direction and insulating portions that insulate them from each other are formed is disclosed. Further, Patent Document 3 discloses an unevenly distributed anisotropic conductive elastomer sheet in which a step is formed between the surface of the conductive portion and the insulating portion.

  And, since the unevenly distributed anisotropic conductive elastomer sheet has a conductive portion formed according to a pattern corresponding to the pattern of the electrode to be inspected of the integrated circuit to be inspected, compared to the dispersed anisotropic conductive elastomer sheet, This is advantageous in that the electrical connection between the electrodes can be achieved with high reliability even for an integrated circuit or the like in which the arrangement pitch of the electrodes to be inspected, that is, the distance between the centers of adjacent electrodes to be inspected is small.

  Such an uneven distribution type anisotropic conductive elastomer sheet needs to be held and fixed with a specific positional relationship with respect to the circuit board for inspection and the inspection object in electrical connection work.

  However, the anisotropic conductive elastomer sheet is flexible and easily deformed, and its handleability is low. Moreover, in recent years, with the downsizing of electrical products or the increase in density of wiring, integrated circuit devices used therein tend to have a higher density due to an increase in the number of electrodes and a further reduction in the arrangement pitch of the electrodes. Therefore, it is becoming difficult to align and hold and fix the unevenly anisotropic anisotropic conductive elastomer sheet when electrically connecting the inspection object to the electrode to be inspected.

  Also, in the burn-in test, even if the required alignment and holding / fixing of the integrated circuit device and the unevenly distributed anisotropic conductive elastomer sheet have been realized, Since the expansion coefficient differs greatly between the material (for example, silicon) constituting the integrated circuit device to be inspected and the material (for example, silicone rubber) constituting the unevenly distributed anisotropic conductive elastomer sheet, the unevenly distributed anisotropic conductivity As a result of displacement between the conductive portion of the conductive elastomer sheet and the electrode to be inspected of the integrated circuit device, there is a problem that the electrical connection state is changed and a stable connection state is not maintained.

  In order to solve such a problem, a metal frame plate having an opening, and an anisotropic conductive sheet disposed at the opening of the frame plate and having a peripheral edge supported by an opening edge of the frame plate An anisotropic conductive connector is proposed (see Patent Document 4).

This anisotropically conductive connector is generally manufactured as follows.
As shown in FIG. 12, a die for forming an anisotropic conductive elastomer sheet comprising an upper die 80 and a lower die 85 paired therewith is prepared, and a frame plate 90 having an opening 91 is provided in the die. A molding material in which conductive particles exhibiting magnetism are dispersed in a polymer substance-forming material that is arranged in alignment and becomes an elastic polymer substance by a curing process is used as an opening 91 of the frame plate 90 and its opening edge. The molding material layer 95 is formed by supplying to the region including Here, the conductive particles P contained in the molding material layer 95 are in a state of being dispersed in the molding material layer 95.

  Each of the upper mold 80 and the lower mold 85 in the mold described above includes a plurality of ferromagnetic layers 81 and 86 formed according to a pattern corresponding to the pattern of the conductive portion of the anisotropic conductive elastomer sheet to be molded, and these The non-magnetic material layers 82 and 87 are formed at locations other than where the ferromagnetic material layers 81 and 86 are formed, and the corresponding ferromagnetic material layers 81 and 86 face each other. Is arranged.

  Then, for example, a pair of electromagnets are disposed on the upper surface of the upper die 80 and the lower surface of the lower die 85 and are operated, whereby the ferromagnetic material layer 81 of the upper die 80 corresponds to the molding material layer 95. In a portion between the lower die 85 and the ferromagnetic layer 86, that is, a portion serving as a conductive portion, a magnetic field having a higher strength than the other portions is applied in the thickness direction of the molding material layer 95. As a result, the conductive particles P dispersed in the molding material layer 95 correspond to the portion of the molding material layer 95 to which a high-intensity magnetic field is applied, that is, the ferromagnetic layer 81 of the upper mold 80. The lower die 85 is gathered at a portion between the lower die 85 and the ferromagnetic layer 86, and is further aligned in the thickness direction. In this state, the molding material layer 95 is cured to insulate the plurality of conductive parts contained in a state in which the conductive particles P are aligned in the thickness direction from each other. An anisotropic conductive elastomer sheet comprising an insulating portion is molded in a state in which the peripheral edge portion is supported by the opening edge portion of the frame plate, whereby an anisotropic conductive connector is manufactured.

  According to such an anisotropic conductive connector, since the anisotropic conductive elastomer sheet is supported on the metal frame plate 90, it is difficult to be deformed and is easy to handle. In the electrical connection work of the integrated circuit device, the alignment and holding and fixing to the integrated circuit device can be easily performed, and the coefficient of thermal expansion is small as a material constituting the frame plate. Since the thermal expansion of the anisotropic conductive sheet is regulated by the frame plate by using the material, the conductive portion of the unevenly anisotropic anisotropic conductive elastomer sheet and the integrated circuit device even when receiving a thermal history due to a temperature change As a result of preventing the positional deviation with respect to the electrode to be inspected, a favorable electrical connection state is stably maintained. However, such a manufacturing method has the following problems.

  That is, when electrical inspection is performed on a wafer in which electrodes to be inspected are arranged at a high density with a small pitch, it is necessary to use anisotropic conductive connectors in which the pitch of the conductive parts is small and the density is arranged at a high density. is there. Thus, in manufacturing such an anisotropic conductive connector, it is naturally necessary to use the upper mold 80 and the lower mold 85 in which the ferromagnetic layers 81 and 86 are arranged at a very small pitch. .

However, when such an upper mold 80 and lower mold 85 are used to form the elastic anisotropic conductive film 95 by curing the molding material layer 95 as described above, each of the upper mold 80 and the lower mold 85 is used. In FIG. 12, since the separation distance between the adjacent ferromagnetic layers 81 and 86 is small, as shown in FIG. 12, from a certain ferromagnetic layer 81a in the upper mold 80 to the corresponding lower ferromagnetic layer 85 in the lower mold 85. Not only in the direction toward the body layer 86a (indicated by the arrow X), but, for example, from the ferromagnetic layer 81a of the upper mold 80 toward the ferromagnetic layer 86b adjacent to the corresponding ferromagnetic layer 86a of the lower mold 85. Direction (indicated by arrow Y),
Alternatively, the magnetic field also acts in the direction from the ferromagnetic layer 81 b of the upper mold 80 toward the ferromagnetic layer 86 a adjacent to the corresponding ferromagnetic layer 86 b of the lower mold 85. Therefore, in the molding material layer 95, it is difficult to gather the conductive particles P in a portion located between the ferromagnetic layer 81a of the upper mold 80 and the corresponding ferromagnetic layer 86a of the lower mold 85. For example, the conductive particles also gather at a portion located between the ferromagnetic layer 81a of the upper mold 80 and the ferromagnetic layer 86b of the lower mold 85, and the conductive particles P are formed into the molding material layer. As a result, it becomes difficult to obtain an anisotropic conductive connector having a desired conductive portion and insulating portion.

  As a method of solving this problem and obtaining an anisotropic conductive connector having a good insulation resistance between the conductive parts, the thickness difference of X and Y in FIG. 12 is reduced by reducing the thickness of the anisotropic conductive sheet. Can be increased.

However, by reducing the thickness of the anisotropic conductive sheet, the following new problems arise.
That is, in the anisotropic conductive sheet having a small thickness, the ability to absorb the variation in height level in each of the electrodes to be connected to achieve electrical connection to each of the electrodes, that is, the unevenness absorption capacity There is a problem that is low.
Specifically, the unevenness absorbing ability of the anisotropic conductive sheet is about 20% of the thickness of the anisotropic conductive sheet. For example, in the anisotropic conductive sheet having a thickness of 100 μm, the height level of the electrode Stable electrical connection can be achieved even for a connection object having a variation of about 20 μm, but a stable electrical connection is achieved for a connection object having a height variation of about 40 μm. The problem is that you can't.

  By the way, in a probe test performed on an integrated circuit formed on a wafer, conventionally, for example, a wafer is divided into a plurality of areas where, for example, 16 or 32 integrated circuits are formed, and this wafer is divided. A method is adopted in which a probe test is collectively performed on all integrated circuits formed in an area, and a probe test is sequentially performed on integrated circuits formed in other areas.

  In recent years, in order to improve the inspection efficiency and reduce the inspection cost, for example, 64, 124, or all of the integrated circuits are collectively subjected to a probe test among a large number of integrated circuits formed on the wafer. It is requested.

On the other hand, in the burn-in test, the integrated circuit device to be inspected is very small and inconvenient to handle. Therefore, it is long to perform electrical inspection of many integrated circuit devices individually. Time is required, which leads to a considerably high inspection cost. For these reasons, a WLBI (Wafer Level Burn-in) test has been proposed in which a burn-in test of a large number of integrated circuits formed on a wafer is performed in a wafer state.

  However, if the wafer to be inspected is a large one having a diameter of, for example, 8 inches or more and the number of electrodes to be inspected is, for example, 5000 or more, particularly 10,000 or more, the wafer to be inspected in each integrated circuit. Since the pitch of the inspection electrodes is extremely small, there are the following problems when the above anisotropic conductive connector is applied as a probe member for a probe test or a WLBI test.

  That is, in order to inspect a wafer having a diameter of, for example, 8 inches (about 20 cm), it is necessary to use an anisotropic conductive connector having an anisotropic conductive elastomer sheet having a diameter of about 8 inches. However, such an anisotropic conductive elastomer sheet has a large overall area, but each conductive part is fine, and the ratio of the area of the conductive part surface to the anisotropic conductive elastomer sheet surface is small. Therefore, it is extremely difficult to reliably manufacture the anisotropic conductive elastomer sheet.

  Further, since the conductive portions to be formed are fine and have a very small pitch, it is difficult to reliably manufacture an anisotropic conductive elastomer sheet having a required insulating property between adjacent conductive portions. This is considered to be due to the following reasons. That is, coarse particles having a particle size substantially larger than the average particle size are mixed in the conductive particles used for obtaining the anisotropic conductive elastomer sheet. Therefore, when a magnetic field is applied to the molding material layer for obtaining the anisotropic conductive elastomer sheet, the coarse particles are not reliably accommodated in a portion to be a conductive portion in the molding material layer, and become a conductive portion. It gathers in a state straddling both the power part and the part to be the insulating part. As a result, the electrical resistance value between the obtained conductive part and the conductive part adjacent to the conductive part decreases, and as a result, it becomes difficult to ensure sufficient insulation between these conductive parts.

In order to solve such problems, it is conceivable to use conductive particles having a small average particle diameter. However, when such conductive particles are used, there are the following problems.
If the anisotropic conductive elastomer sheet has the same thickness, the smaller the particle diameter of the conductive particles used, the smaller the number of conductive particles arranged in the thickness direction of the anisotropic conductive elastomer sheet, that is, one conductive As the number of conductive particles forming the path increases and the total contact resistance between the conductive particles in one conductive path increases, it is difficult to form a conductive part having high conductivity. It becomes.

  In addition, when a magnetic field is applied to the molding material layer for obtaining the anisotropic conductive elastomer sheet, the smaller the particle diameter, the harder it is to move, so the insulating portion in the molding material layer As a result, a large amount of conductive particles remain in the portion to become, eventually, it is difficult to ensure sufficient insulation between the conductive portions, and the conductive particles are not sufficiently collected in the portions that become the conductive portions, It becomes difficult to form a conductive portion having desired conductivity.

The conductive particles in the anisotropic conductive elastomer sheet are generally formed by forming a coating layer made of a highly conductive metal such as gold on the surface of core particles made of a ferromagnetic material such as nickel. Is used. In the WLBI test, the anisotropic conductive elastomer sheet has a conductive portion sandwiched between the electrode to be inspected on the wafer to be inspected and the inspection electrode on the inspection circuit board. It is exposed to high temperature environment. However, when the anisotropic conductive elastomer sheet is repeatedly used under such severe conditions, a highly conductive metal such as gold in which the ferromagnetic material constituting the core particle in the conductive particle forms a coating layer. Since it moves in, the electroconductivity in the surface of the said electroconductive particle falls, As a result, the contact resistance between electroconductive particles increases. This phenomenon remarkably occurs because the smaller the particle diameter of the conductive particles, the smaller the thickness of the coating layer. Thus, when using conductive particles with a small particle diameter, when repeatedly used in a high temperature environment, the conductivity on the surface of the conductive particles is reduced, and between the conductive particles in the formed conductive path. Since the sum of the contact resistance is remarkably increased, the required conductivity cannot be maintained.

Further, when the above anisotropic conductive connector is used as a probe member for the WLBI test, there are the following problems.
The linear thermal expansion coefficient of the material constituting the wafer, such as silicon, is about 3.3 × 10 ⁻⁶ / K, while the material constituting the anisotropic conductive elastomer sheet, such as silicone rubber, is 2.2. It is about × 10 ^-4 / K. Therefore, for example, at 25 ° C., when each of the wafer having a diameter of 20 cm and the anisotropic conductive elastomer sheet is heated from 20 ° C. to 120 ° C., the change in the diameter of the wafer is theoretically 0.0066 cm. However, the change in the diameter of the anisotropically conductive elastomer sheet reaches 0.44 cm.

  Thus, when a large difference occurs in the absolute amount of thermal expansion in the plane direction between the wafer and the anisotropic conductive elastomer sheet, the peripheral portion of the anisotropic conductive elastomer sheet is expressed as the linear thermal expansion coefficient of the wafer. Even when the frame plate having the same linear thermal expansion coefficient is fixed, it is extremely difficult to prevent the positional deviation between the electrode to be inspected in the wafer and the conductive portion in the anisotropic conductive elastomer sheet when performing the WLBI test. is there.

  As a probe member for the WLBI test, for example, an anisotropic conductive elastomer sheet is fixed on a circuit board for inspection made of ceramics having a linear thermal expansion coefficient equivalent to that of a wafer. Is known (for example, Patent Document 5).

  That is, in the probe member disclosed in Patent Document 5, a flexible anisotropic conductive elastomer sheet (flexible substrate) is placed between a ceramic circuit board for inspection (wiring substrate) and a rigid ring made of ceramics or the like. The flexible anisotropically conductive elastomer sheets are arranged and supported by screws in such a manner that they are supported by a rigid circuit board for inspection.

  And in patent document 5, in order to prevent a movement and position shift of an anisotropically conductive elastomer sheet | seat, a convex part is provided in the lower surface of a rigid ring, and a concave groove is provided in the upper surface of the circuit board for a test | inspection. The anisotropic conductive elastomer sheet is surely positioned between the rigid ring 4 and the circuit board for inspection by screwing together after being fitted to each other.

  However, even in the means for fixing the peripheral portion of the anisotropic conductive elastomer sheet with a screw or the like, the electrode to be inspected on the wafer and the conductive portion on the anisotropic conductive elastomer sheet for the same reason as the means for fixing to the frame plate described above. It is extremely difficult to prevent misalignment between the two. Furthermore, it is complicated to provide convex portions and concave grooves.

Moreover, in patent document 5, the bump by which gold plating was given is provided on the anisotropic conductive elastomer sheet. However, when the gold-plated bump electrode comes into contact with the pad electrode of the wafer, the particles of the gold-plated layer move to the pad electrode side. As a result, the electric resistance value of the bump electrode increases and the required conductivity is maintained. There was a problem that I could not.
JP 51-93393 A Japanese Patent Laid-Open No. 53-147772 JP-A-61-250906 Japanese Patent Laid-Open No. 11-40224 Japanese Patent Laid-Open No. 7-231019

  The present invention has been made based on the circumstances as described above, is not easily deformed, has good handleability, can be easily aligned and held and fixed to the wafer to be inspected, and Even when the wafer has a large area of 8 inches or more and the pitch of the integrated circuit formed is small, for example, when conducting a burn-in test, all conductive parts for connection have good conductivity. Can be reliably obtained, and insulation between adjacent conductive parts for connection can be reliably obtained. Furthermore, even when used repeatedly in a high temperature environment, it is further resistant to environmental changes such as thermal history due to temperature changes. Another object of the present invention is to provide a probe member that can stably maintain a good electrical connection state over a long period of time and has a simple structure.

  Another object of the present invention is to provide a probe card using the probe member and a wafer inspection apparatus using the probe card.

The probe member of the present invention is
A first anisotropic conductive connector disposed on the inspection circuit substrate side and a second anisotropic conductive connector disposed on the wafer side;
The first anisotropic conductive connector is
Corresponding to the electrode region where the inspected electrode of the integrated circuit is arranged, a frame plate in which a plurality of anisotropic conductive film arrangement holes are formed in the thickness direction, respectively,
A plurality of connection conductive portions disposed in the anisotropic conductive film disposition holes of the frame plate and supported by projecting to the periphery of the anisotropic conductive film disposition holes, and between the connection conductive portions And having a plurality of elastic anisotropic conductive films provided with insulating parts to insulate,
The second anisotropic conductive connector is
Corresponding to the electrode region where the inspected electrode of the integrated circuit is arranged, a frame plate in which a plurality of anisotropic conductive film arrangement holes are formed in the thickness direction,
A plurality of connection conductive portions 22 disposed in the anisotropic conductive film disposition holes of the frame plate and supported by projecting to the periphery of the anisotropic conductive film disposition holes, and between the connection conductive portions And having a plurality of elastic anisotropic conductive films provided with an insulating portion for insulating
The connecting conductive portions corresponding to each other of the first anisotropic conductive connector and the second anisotropic conductive connector are positioned and fixed integrally.

  Further, in the present invention, the first anisotropic conductive connector has conductive particles formed by coating the surface of the core particles made of nickel with a highly conductive metal such as gold oriented in the thickness direction. It is preferable that a plurality of conductive portions for connection and an insulating portion that insulates between the conductive portions for connection are configured.

  Furthermore, in the present invention, the second anisotropic conductive connector has conductive particles formed by coating the surface of the core particles made of nickel with a diffusion-resistant metal oriented at a high density in the thickness direction. It is preferable that a plurality of conductive portions for connection and an insulating portion that insulates between the conductive portions for connection are configured.

In the present invention, the diffusion-resistant metal is preferably rhodium.
In the present invention, the first anisotropic conductive film and the second anisotropic conductive film are formed of elastic polymer materials having different hardnesses, and the durometer hardness of the first anisotropic conductive connector is set to H. _{1 When} the durometer hardness of the second anisotropic conductive connector is H ₂ ,
Condition (1): H ₂ ≧ 30
Condition (2): H ₂ / H ₁ ≧ 1.1
Is preferably satisfied.

  Furthermore, in the present invention, the probe member according to any one of the above is configured so that an electrical inspection of a plurality of integrated circuits formed on the wafer is performed between the wafer and the inspection circuit board in a wafer state. It is characterized by being arranged between the circuit board for inspection.

Furthermore, the probe card according to the present invention is a probe card used for electrical inspection of an integrated circuit formed on a wafer to be inspected,
An inspection circuit board on the surface of which an inspection electrode corresponding to the inspection target electrode of the integrated circuit of the wafer to be inspected is formed;
The probe member according to any one of the above is provided on the circuit board for inspection.

  A wafer inspection apparatus according to the present invention includes the probe card described above.

  In the probe member of the present invention, the first anisotropic conductive connector and the second anisotropic conductive connector, which are individually molded, are manufactured by positioning the connecting conductive portions and fixing them together. Therefore, the total thickness of the anisotropic conductive sheet of the probe member is about twice that of the anisotropic conductive sheet of each anisotropic conductive connector.

In the molding of each anisotropically conductive connector, the conductive portions can maintain high electrical insulation by designing the anisotropic conductive sheet to have a small thickness.
Furthermore, since each elastic anisotropic conductive film is supported by the frame plate, the probe member according to the present invention is difficult to be deformed and has good handleability.

  In addition, each elastic anisotropic conductive film is always fixed to the frame plate within the temperature range from room temperature to the temperature at the time of inspection, so it is heated at the time of inspection by matching the thermal expansion coefficients of the frame plate and the wafer. There is no misalignment.

  Moreover, about all the conductive parts for connection formed conductively, favorable electroconductivity is obtained and sufficient insulation can be reliably obtained between the adjacent conductive parts for connection. Further, by previously forming positioning marks (for example, holes) in the frame plate, the wafer can be easily aligned with the integrated circuit.

  In the probe member according to the present invention, the elastic anisotropic conductive film of the first anisotropic conductive connector and the elastic anisotropic conductive film of the second anisotropic conductive connector are equal in thermal expansion coefficient of the wafer to be inspected. If this is adopted, a good electrical connection state can be stably maintained.

  In addition, according to the probe member of the present invention, the peripheral portion of the connecting conductive portion protrudes and is fixed to the peripheral portion of the anisotropic conductive film disposition hole formed in the frame plate, so that the wafer to be inspected In the electrical connection operation, the wafer can be easily aligned and held and fixed.

Each of the holes for arranging the anisotropic conductive film of the frame plate is formed corresponding to an electrode region where the inspection target electrode of the integrated circuit is formed on the wafer to be inspected. Since the elastic anisotropic conductive film disposed in each of the holes may have a small area, it is easy to form individual elastic anisotropic conductive films. In addition, the elastic anisotropic conductive film with a small area has a small amount of thermal expansion in the surface direction of the elastic anisotropic conductive film even when it receives a thermal history. By using the one having a small diameter, the thermal expansion in the surface direction of the elastic anisotropic conductive film is reliably regulated by the frame plate. Therefore, even when the WLBI test is performed on a large-area wafer, a good electrical connection state can be stably maintained.

  Furthermore, according to the probe member of the present invention, the connection reliability to each electrode to be inspected is high, and required conductivity can be maintained over a long period of time even when used repeatedly in a high temperature environment.

  Further, in the second anisotropic conductive connector disposed facing the wafer side, the conductive particles coated with the diffusion-resistant metal are oriented at a high density so that the conductive particle coating layer is formed. There is little change in quality and there is little decrease in the conductivity of the conductive part for connection. Also, the elastic polymer material of the second anisotropic conductive connector containing conductive particles having a surface coated with a diffusion-resistant metal is harder than the elastic polymer material of the first anisotropic conductive connector. Since the value of the height is high, even when the inspection of the electronic component is repeated, the deformation is small, and the decrease in conductivity due to the deformation of the probe member is also small.

  Further, according to the probe member of the present invention, since a flexible membrane sheet is not necessary, alignment with the flexible membrane sheet is unnecessary, and the position of the membrane sheet due to temperature change as in the case of using the membrane sheet is not required. There is no deviation.

  Furthermore, since the elastic conductive film of the probe member has elasticity, even if the electrodes to be inspected of the electronic circuit component have variations in height, good electrical connection to the integrated circuit can be achieved with a small pressure. And high inspection durability can be obtained.

  According to the probe card and the wafer inspection apparatus according to the present invention, since the electrical connection to the integrated circuit of the wafer to be inspected is achieved through the probe member, the pitch of the electrodes to be inspected is small. Even if it is, it is easy to align and hold and fix the wafer, and the connection reliability to each electrode to be inspected is high, and even if it is used repeatedly in a high temperature environment, the required electrical inspection can be performed. It can be executed stably over a long period of time.

Hereinafter, embodiments of the present invention will be described in detail.
1A and 1B show a probe member 10 according to an embodiment of the present invention. FIG. 1A is a plan view, and FIG. 1B is an enlarged view in the XX direction of FIG. It is sectional drawing. FIG. 2 is an enlarged plan view showing a part of the anisotropic conductive connector shown in FIG. FIG. 3 is an enlarged cross-sectional view showing a part of the anisotropic conductive connector shown in FIG. FIG. 4 is an explanatory cross-sectional view showing the elastic anisotropic conductive film shown in FIG.

The probe member 10 is preferably used for performing electrical inspection of each integrated circuit on a wafer of 8 inches or the like on which a plurality of integrated circuits are formed in a batch in the state of the wafer.
The probe member 10 is formed in a disk shape in plan view, and is composed of a laminated body of a first anisotropic conductive connector 10A and a second anisotropic conductive connector 10B.

  Each of the first anisotropic conductive connector 10A and the second anisotropic conductive connector 10B has a frame plate 14 that penetrates in the thickness direction and has a plurality of rectangular anisotropic conductive film arrangement holes 15 formed therein. ing. Specifically, the frame plate 14 is made of a material having appropriate rigidity such as a metal plate or a ceramic plate.

A large number of rectangular anisotropic conductive film disposing holes 15 formed in the frame plate 14 are formed corresponding to electrode regions where electrodes to be inspected are disposed in all integrated circuits formed on a wafer to be inspected. ing. In each of the anisotropic conductive film placement holes 15 of the frame plate 14, as shown in an enlarged view in FIG. 3, an elastic anisotropic conductive film 20 having conductivity in the thickness direction is provided in the frame plate 14. The anisotropic conductive film 20 is disposed in a state of being supported by the peripheral portion of the anisotropic conductive film disposing hole 15 and independent of the adjacent elastic anisotropic conductive film 20.

  As will be described later, the elastic polymer materials of the elastic anisotropic conductive film 20 of the first anisotropic conductive connector 10A and the elastic anisotropic conductive film 20 of the second anisotropic conductive connector 10B have different hardnesses. Yes. That is, the second anisotropic conductive connector 10B is harder than the first anisotropic conductive connector 10A.

As shown in FIG. 1A, the frame plate 14 is formed with positioning holes 16 for positioning the wafer to be inspected and the circuit board for inspection.
The second anisotropic conductive connector 10B is disposed so as to face the wafer to be inspected.

  As shown in FIG. 2, the elastic polymer material constituting each of the elastic anisotropic conductive films 20 of the first anisotropic conductive connector 10A and the second anisotropic conductive connector 10B has a thickness direction (in FIG. A plurality of connecting conductive portions 22 extending in a vertical direction) and insulating portions 23 formed around each of the connecting conductive portions 22 and insulating each of the connecting conductive portions 22 from each other. Yes. The connecting conductive portion 22 is arranged according to a pattern corresponding to the pattern of the electrode to be inspected in the integrated circuit formed on the wafer to be inspected, and is electrically connected to the electrode to be inspected in the inspection of the wafer It is. As described above, since the elastic conductive film of the probe member has elasticity, even if the electrodes to be inspected of the electronic circuit component vary in height, a good electrical connection to the integrated circuit can be achieved with a small pressure. And high inspection durability can be obtained.

  A supported portion 25 made of an elastic polymer material is integrally and continuously formed on the periphery of the anisotropic conductive film arranging hole 15 formed in the frame plate 14. Specifically, the supported portion 25 in this example is formed in a bifurcated shape as shown in an enlarged view in FIG. 3, and grips the peripheral portion of the anisotropic conductive film arrangement hole 15 in the frame plate 14. It is fixed and supported in such a close contact state.

  In the connecting anisotropic conductive film 20 of each of the first anisotropic conductive connector 10A and the second anisotropic conductive connector 10B, the conductive particles 22 exhibiting magnetism are aligned so as to be aligned in the thickness direction. It is contained densely. On the other hand, the insulating part 23 contains no or almost no conductive particles P.

Further, as shown in FIG. 3, on both surfaces of the elastic anisotropic conductive film 20, the connecting conductive portion 22 and its peripheral portion protrude from the other surface to form a protruding portion 24.
Although the thickness of each frame board 14 changes with the materials, it is preferable that it is 25-600 micrometers, More preferably, it is 40-400 micrometers.

  If this thickness is less than 25 μm, the strength required for use cannot be obtained, the durability tends to be low, and the rigidity sufficient to maintain the shape of the frame plate 14 cannot be obtained. The handleability is low. On the other hand, when the thickness exceeds 600 μm, the elastic anisotropic conductive film 20 formed in the anisotropic conductive film disposing hole 15 becomes excessively thick, and good conductivity in the connecting conductive portion 22 is obtained. And it may be difficult to obtain insulation between adjacent conductive portions 22 for connection.

The shape and size in the surface direction of the anisotropic conductive film disposing hole 15 of the frame plate 14 are designed according to the size, pitch, and pattern of the electrodes to be inspected of the wafer to be inspected.
The material constituting the frame plate 14 is not particularly limited as long as the frame plate 14 is not easily deformed and has a rigidity that allows the shape of the frame plate 14 to be stably maintained. Various materials such as a resin material can be used. When the frame plate 14 is made of, for example, a metal material, an insulating coating may be formed on the surface of the frame plate 14.

  Specific examples of the metal material constituting the frame plate 14 include metals such as iron, copper, nickel, chromium, cobalt, magnesium, manganese, molybdenum, indium, lead, palladium, titanium, tungsten, aluminum, gold, platinum, and silver. Or the alloy or alloy steel which combined 2 or more types of these is mentioned.

Specific examples of the resin material constituting the frame plate 14 include a liquid crystal polymer and a polyimide resin.
Further, the frame plate 14 is at least around the hole 15 for arranging the anisotropic conductive film in that the conductive particles P can be easily contained in the supported portion 25 of the elastic anisotropic conductive film 20 by a method described later. It is preferable that the portion, that is, the portion that supports the elastic anisotropic conductive film 20 exhibits magnetism, specifically, that the saturation magnetization thereof is 0.1 Wb / m ² or more. From an easy point, it is preferable that the entire frame plate 14 is made of a magnetic material.

  Specific examples of the magnetic body constituting the frame plate 14 include iron, nickel, cobalt, alloys of these magnetic metals, alloys of these magnetic metals and other metals, or alloy steels.

When an anisotropic conductive connector is used for the WLBI test, it is preferable to use a material having a linear thermal expansion coefficient of 3 × 10 ⁻⁵ / K or less as the material constituting the frame plate 14, more preferably. −1 × 10 ⁻⁷ to 1 × 10 ⁻⁵ / K, particularly preferably 1 × 10 ⁻⁶ to 8 × 10 ⁻⁶ / K.

  Specific examples of such materials include Invar type alloys such as Invar, Elinvar type alloys such as Elinvar, magnetic metal alloys such as Super Invar, Kovar, and 42 alloy, or alloy steel.

  The total thickness of the elastic anisotropic conductive film 20 (in the illustrated example, the thickness of the connecting conductive portion 22) is preferably 50 to 2000 μm, more preferably 70 to 1000 μm, and particularly preferably 80 to 500 μm. If this thickness is 50 μm or more, the elastic anisotropic conductive film 20 having sufficient strength can be obtained reliably. On the other hand, if the thickness is 2000 μm or less, the connecting conductive portion 22 having the required conductive characteristics can be obtained with certainty.

  As for the protrusion height of the protrusion part 24, it is preferable that the sum total is 10% or more of the thickness in the said protrusion part 24, More preferably, it is 20% or more. By forming the protruding portion 24 having such a protruding height, the connecting conductive portion 22 is sufficiently compressed with a small applied pressure, so that good conductivity can be reliably obtained.

  Further, the protrusion height of the protrusion 24 is preferably 100% or less of the shortest width or diameter of the protrusion 24, and more preferably 70% or less. By forming the projecting portion 24 having such a projecting height, the projecting portion 24 is not buckled when pressed, and thus the desired conductivity can be obtained with certainty.

  In addition, the thickness of the supported portion 25 (one thickness of the bifurcated portion in the illustrated example) is preferably 5 to 250 μm, more preferably 10 to 150 μm, and particularly preferably 15 to 100 μm.

Further, the supported portion 25 is not necessarily formed in a bifurcated shape, and may be fixed to only one surface of the frame plate 14.
(Case 10266 added)
In addition, the cured silicone rubbers forming the elastic anisotropic conductive films 20 of the first anisotropic conductive connector 10A and the second anisotropic conductive connector 10B have different hardnesses. That is,
When the durometer hardness of the first anisotropic conductive connector is H ₁ and the durometer hardness of the second anisotropic conductive connector is H ₂ ,
Condition (1): H ₂ ≧ 30
Condition (2): H ₂ / H ₁ ≧ 1.1
Hardness satisfying the above is used.

The hardness H ₂ of the second anisotropic conductive film 20 in the second anisotropic conductive connector 10B is 3
It is 0 or more, preferably 40 or more. The ratio H ₂ / H ₁ is 1.1 or more, preferably 1.2 or more, more preferably 1.3 or more. When the hardness H ₂ is too small, if it is used repeatedly, the electrical resistance value of the conductive path forming portion increases at an early stage, so that high repeated durability cannot be obtained. In addition, when H ₂ / H ₁ is too small, it is difficult to form a conductive path forming portion having a low electrical resistance value.

Further, the hardness H ₂ is preferably 70 or less, and more preferably 65 or less.
When the hardness H ₂ is excessive, a conductive path forming part having high conductivity may not be obtained. The ratio H ₂ / H ₁ is preferably 3.5 or less, more preferably 3 or less. If the ratio H ₂ / H ₁ is excessive, it may be difficult to set both the hardness H ₂ and the hardness H ₁ to optimum values.

Further, the hardness H ₁ is preferably 15 to 55, more preferably from 20 to 50. When the hardness H ₁ is too small, high repeatability may not be obtained. on the other hand,
When the hardness H ₁ is excessive, a conductive path forming part having high conductivity may not be obtained.

Here, the durometer A hardness of the cured silicone rubber can be measured by a method based on JIS K 6249.
Specific examples of the elastic polymer material forming the elastic anisotropic conductive film 20 of the first anisotropic conductive connector 10A and the second anisotropic conductive connector 10B include polybutadiene rubber, natural rubber, polyisoprene rubber, Conjugated diene rubbers such as styrene-butadiene copolymer rubber and acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, block copolymers such as styrene-butadiene-diene block copolymer rubber and styrene-isoprene block copolymer. Examples thereof include polymer rubber and hydrogenated products thereof, chloroprene, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber and the like.

In the above, when weather resistance is required for the elastic anisotropic conductive film 20 to be obtained, it is preferable to use a material other than the conjugated diene rubber. In particular, from the viewpoint of molding processability and electrical characteristics, silicone rubber is preferably used. It is preferable to use it.
As the silicone rubber, those obtained by crosslinking or condensing liquid silicone rubber are preferable. The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10 ⁻¹ sec, and may be any of a condensation type, an addition type, a vinyl group or a hydroxyl group. Good. Specific examples include dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, methyl phenyl vinyl silicone raw rubber, and the like.

  The silicone rubber preferably has a molecular weight Mw (referred to as a standard polystyrene-converted weight average molecular weight; the same shall apply hereinafter) of 10,000 to 40,000. Moreover, since favorable heat resistance is obtained for the conductive part 22 for connection obtained, the molecular weight distribution index (the value of the ratio Mw / Mn between the standard polystyrene equivalent weight average molecular weight Mw and the standard polystyrene equivalent number average molecular weight Mn is referred to. The same shall apply hereinafter) is preferably 2 or less.

  Further, the shape of the conductive particles P is not particularly limited, but spherical particles, star-shaped particles, or agglomerated particles 2 can be easily dispersed in the polymer substance-forming material. It is preferable that it is a lump with secondary particles.

  Here, the core particles of the conductive particles P contained in the elastic anisotropic conductive film 20 of the first anisotropic conductive connector 10A and the second anisotropic conductive connector 10B can be formed from the same material. . However, the material of the plating layer on the surface is different.

  That is, in the conductive particles P contained in the elastic anisotropic conductive film 20 of the first anisotropic conductive connector 10A, the core particles such as nickel are coated with a highly conductive metal. In the connector 10B, core particles such as nickel are coated with a diffusion-resistant metal.

Here, “highly conductive metal” refers to a metal having an electrical conductivity at 0 ° C. of 5 × 10 ⁶ Ω ⁻¹ m ⁻¹ or more.
Specific examples of the material constituting the magnetic core particles include iron, nickel, cobalt, and alloys thereof. Of these, nickel is preferable.

If the saturation magnetization is 0.1 Wb / m ² or more, the conductive particles P can be easily moved in the molding material layer for forming the elastic anisotropic conductive film 20 by the method described later. Thereby, the electroconductive particle P can be reliably moved to the part used as the connection conductive part in the said molding material layer, and the chain | strand of the electroconductive particle P can be formed.

  Gold, silver, platinum, chromium, and the like can be used as the highly conductive metal that coats the magnetic core particles. Among these, gold is used because it is chemically stable and has high conductivity. preferable.

  On the other hand, as the diffusion-resistant metal that covers the surface of the magnetic core particles contained in the anisotropic conductive film 20 of the second anisotropic conductive connector 10B, rhodium, palladium, ruthenium, tungsten, platinum, iridium, silver, and the like Although alloys containing these can be exemplified, rhodium is preferable among them. These diffusion resistant metals can be formed by chemical plating or electrolytic plating, sputtering, vapor deposition or the like. Moreover, it is preferable that the coating amount of a diffusion-resistant metal is a ratio of 5 to 40%, preferably 10 to 30% by mass fraction with respect to the conductive particles.

  The moisture content of the conductive particles P is preferably 5% or less, more preferably 3% or less, still more preferably 2% or less, and particularly preferably 1% or less. By using the conductive particles P satisfying such conditions, bubbles are prevented or suppressed from occurring in the molding material layer when the molding material layer is cured in the manufacturing method described later.

Such conductive particles P can be obtained, for example, by the following method.
First, the ferromagnetic material is made into particles by a conventional method or commercially available ferromagnetic particles are prepared, and the particles are subjected to classification treatment as necessary.

Here, the particle classification process can be performed by a classification device such as an air classification device or a sonic sieving device.
Specific conditions for the classification treatment are appropriately set according to the number average particle diameter of the target magnetic core particles, the type of the classification device, and the like.

  Next, the surface of the magnetic core particle is treated with an acid, and further, for example, washed with pure water to remove impurities such as dirt, foreign matter, and oxide film present on the surface of the magnetic core particle. By coating the surface of the particles with a highly conductive metal or a diffusion resistant metal, conductive particles exhibiting magnetism can be obtained.

Here, hydrochloric acid etc. can be mentioned as an acid used in order to process the surface of a magnetic core particle.
As a method for coating the surface of the magnetic core particles with the highly conductive metal, an electroless plating method, a displacement plating method, or the like can be used, but the method is not limited to these methods.

  The method of producing conductive particles by the electroless plating method or the displacement plating method will be described. First, a slurry is prepared by adding acid-treated and washed magnetic core particles to the plating solution, and the slurry is stirred. Then, electroless plating or displacement plating of the magnetic core particles is performed. Next, the particles in the slurry are separated from the plating solution, and then the particles are washed with pure water, for example, to obtain conductive particles in which the surface of the magnetic core particles is coated with a highly conductive metal.

  In addition, after a base plating layer is formed on the surface of the magnetic core particles to form a base plating layer, a plating layer made of a highly conductive metal may be formed on the surface of the base plating layer. The method of forming the base plating layer and the plating layer formed on the surface thereof is not particularly limited, but the base plating layer is formed on the surface of the magnetic core particles by the electroless plating method, and then the base plating layer is formed by the displacement plating method. It is preferable to form a plating layer made of a highly conductive metal on the surface of the plating layer.

The plating solution used for electroless plating or displacement plating is not particularly limited, and various commercially available products can be used.
On the other hand, the conductive particles having a surface coated with a diffusion-resistant metal are, for example, the surface of core particles made of nickel, iron, cobalt, or an alloy thereof, for example, chemical plating or electrolytic plating, sputtering It can be formed by coating a diffusion-resistant metal by a method, a vapor deposition method or the like. Moreover, it is preferable that the coating amount of a diffusion-resistant metal is a ratio of 5 to 40%, preferably 10 to 30% by mass fraction with respect to the conductive particles.
The conductive particles obtained in this way are subjected to a classification treatment in order to have the above-mentioned particle size and particle size distribution.

  As a classification device for performing the classification treatment of the conductive particles, those exemplified as the classification device used for the classification treatment of the magnetic core particles can be used, but it is preferable to use at least an air classification device. By conducting the conductive particles using an air classifier, the conductive particles having the above-described particle size and particle size distribution can be obtained with certainty.

Moreover, the electroconductive particle P may be processed with coupling agents, such as a silane coupling agent, as needed. By treating the surface of the conductive particles P with a coupling agent, the adhesiveness between the conductive particles P and the elastic polymer substance is increased, and as a result, the obtained elastic anisotropic conductive film 20 is repeatedly formed. Durability in use is high.

The content ratio of the conductive particles P in the connecting conductive portion 22 is preferably 10 to 60%, preferably 15 to 50% in terms of volume fraction.
Here, it is preferable that the content ratio of the conductive particles in the connection conductive portion 22 is higher in the second anisotropic conductive connector 10B than in the first anisotropic conductive connector 10A. That is, if the conductive particles coated with the diffusion-resistant metal are oriented at a high density, the coating layer of the conductive particles is less altered and the conductivity of the conductive portion for connection is less reduced. Further, higher rigidity can be imparted to the second anisotropic conductive connector 10B side.

  When the proportion of the conductive particles is less than 10%, the connection conductive portion 22 having a sufficiently small electric resistance value may not be obtained. On the other hand, when this ratio exceeds 60%, the obtained conductive part 22 for connection tends to be fragile, and the elasticity required for the conductive part 22 for connection may not be obtained.

  Moreover, although the content rate of the electroconductive particle P in the to-be-supported part 25 changes with content rates of the electroconductive particle in the molding material for forming the elastic anisotropic conductive film 20, it is for the connection in the elastic anisotropic conductive film 20 The content ratio of the conductive particles in the molding material is that the conductive portion 22 for connection located on the outermost side of the conductive portion 22 is reliably prevented from containing an excessive amount of the conductive particles P. The volume fraction is preferably 30% or less in that the supported portion 25 having sufficient strength is obtained.

Each of the anisotropic conductive connectors 10A and 10B can be manufactured, for example, as follows.
First, a frame plate 14 made of a magnetic metal in which a large number of anisotropic conductive film placement holes 15 are formed corresponding to a pattern of an electrode region in which an electrode to be inspected of an integrated circuit is formed on a wafer to be inspected is manufactured. . Here, as a method of forming the anisotropic conductive film arranging hole 15 of the frame plate 14, for example, an etching method or the like can be used.

  Next, a conductive paste composition is prepared in which conductive particles exhibiting magnetism are dispersed in addition-type liquid silicone rubber. Then, as shown in FIG. 5, a mold 60 for forming an elastic anisotropic conductive film is prepared, and an elastic anisotropic conductive film is formed on each molding surface of the upper mold 61 and the lower mold 65 of the mold 60. As a molding material, the above-mentioned conductive paste composition is applied according to a required pattern, that is, an arrangement pattern of the elastic anisotropic conductive film to be formed, thereby forming the molding material layer 20A.

Here, the metal mold 60 will be specifically described. The metal mold 60 is configured such that an upper mold 61 and a lower mold 65 paired with the upper mold 61 are arranged to face each other.
In the upper mold 61, as shown in an enlarged view in FIG. 6, the ferromagnetic layer is formed on the lower surface of the substrate 62 according to a pattern symmetrical to the arrangement pattern of the connecting conductive portions 22 of the elastic anisotropic conductive film 20 to be molded. 63 is formed, and a nonmagnetic layer 64 is formed at a portion other than the ferromagnetic layer 63, and a molding surface is formed by the ferromagnetic layer 63 and the nonmagnetic layer 64. Further, a recess 64 a is formed on the molding surface of the upper mold 61 corresponding to the protruding portion 24 in the elastic anisotropic conductive film 20 to be molded.

On the other hand, in the lower die 65, a ferromagnetic layer 67 is formed on the upper surface of the substrate 66 in accordance with the same pattern as the arrangement pattern of the connecting conductive portions 22 of the elastic anisotropic conductive film 20 to be formed. A nonmagnetic layer 68 is formed at a place other than the layer 67, and a molding surface is formed by the ferromagnetic layer 67 and the nonmagnetic layer 68. Further, a recess 68 a is formed on the molding surface of the lower mold 65 corresponding to the protruding portion 24 in the elastic anisotropic conductive film 20 to be molded.

  The substrates 62 and 66 in each of the upper die 61 and the lower die 65 are preferably made of a ferromagnetic material. Specific examples of such a ferromagnetic material include iron, iron-nickel alloy, iron-cobalt. Examples include ferromagnetic metals such as alloys, nickel, and cobalt. The substrates 62 and 66 preferably have a thickness of 0.1 to 50 mm, have a smooth surface, are chemically degreased, and are mechanically polished.

  In addition, as a material constituting the ferromagnetic layers 63 and 67 in each of the upper die 61 and the lower die 65, a ferromagnetic metal such as iron, iron-nickel alloy, iron-cobalt alloy, nickel, or cobalt may be used. it can. The ferromagnetic layers 63 and 67 preferably have a thickness of 10 μm or more. If the thickness is 10 μm or more, a magnetic field having a sufficient intensity distribution can be applied to the molding material layer 20A. As a result, the conductive material 22 is electrically connected to the portion of the molding material layer 20A that becomes the connection conductive portion 22. The conductive particles 22 can be gathered at high density, and the conductive portion 22 for connection having good conductivity can be obtained.

  In addition, as the material constituting the nonmagnetic layers 64 and 68 in each of the upper mold 61 and the lower mold 65, a nonmagnetic metal such as copper, a high-molecular substance having heat resistance, or the like can be used. In view of the fact that the nonmagnetic layers 64 and 68 can be easily formed by this method, a polymer substance cured by radiation can be preferably used. Examples of the material include acrylic dry film resists and epoxy. A photoresist such as a liquid resist or a polyimide liquid resist can be used.

  As a method of applying the molding material to the molding surfaces of the upper mold 61 and the lower mold 65, it is preferable to use a screen printing method. According to such a method, it is easy to apply the molding material according to a required pattern, and an appropriate amount of the molding material can be applied.

  Next, as shown in FIG. 7, the frame plate 14 is positioned and arranged on the molding surface of the lower mold 65 on which the molding material layer 20 </ b> A is formed via the spacer 69 a, and on the frame plate 14. The upper die 61 on which the molding material layer 20A is formed is aligned and arranged via the spacer 69b, and further, these are overlapped to form the upper die 61 and the lower die 65 as shown in FIG. In the meantime, a molding material layer 20A having a desired form (form of the elastic anisotropic conductive film 20 to be formed) is formed. In this molding material layer 20A, as shown in FIG. 9, the conductive particles P are contained in a state of being dispersed throughout the molding material layer 20A.

  Thus, by disposing the spacers 69a and 69b between the frame plate 14 and the upper mold 61 and the lower mold 65, the elastic anisotropic conductive film 20 having a desired form can be formed, and the adjacent elastic films Since the anisotropic conductive films are prevented from being connected to each other, a large number of elastic anisotropic conductive films 20 that are independent of each other can be reliably formed.

After that, for example, a pair of electromagnets are disposed on the upper surface of the substrate 62 in the upper mold 61 and the lower surface of the substrate 66 in the lower mold 65 and are operated, whereby the upper mold 61 and the lower mold 65 are made of the ferromagnetic layers 63 and 67. Therefore, a magnetic field having a stronger intensity than the peripheral region is formed between the ferromagnetic layer 63 of the upper die 61 and the corresponding ferromagnetic layer 67 of the lower die 65. As a result, in the molding material layer 20A, the conductive particles P dispersed in the molding material layer 20A are, as shown in FIG. 10, the ferromagnetic layer 63 of the upper die 61 and the lower die corresponding thereto. The conductive layers 22 are connected to 65 ferromagnetic layers 67 and are aligned to be aligned in the thickness direction. In the above, since the frame plate 14 is made of a magnetic metal, a magnetic field having a larger intensity than that of the upper die 61 and the lower die 65 and the frame plate 14 is formed. As a result, the frame plate in the molding material layer 20A. The conductive particles P above and below 14 are not gathered between the ferromagnetic layer 63 of the upper die 61 and the ferromagnetic layer 67 of the lower die 65 and are held above and below the frame plate 14. Will remain.

  In this state, by curing the molding material layer 20A, a plurality of connection conductive portions 22 that are contained in a state in which the conductive particles P are aligned in the thickness direction in the elastic polymer substance, A functional part arranged in a state of being insulated from each other by an insulating part 23 made of a polymer elastic material with no or almost no conductive particles P, and continuously formed integrally around the functional part; An elastic anisotropic conductive film 20 including a supported portion 25 in which conductive particles P are contained in an elastic polymer material is provided in the peripheral portion of the anisotropic conductive film arrangement hole 15 of the frame plate 14. 25 is formed in a fixed state.

In this way, the first anisotropic conductive connector 10A and the second anisotropic conductive connector 10B are manufactured.
Then, the first anisotropic conductive connector 10A and the second anisotropic conductive connector 10B align the corresponding connecting conductive portions 22 and are integrally fixed with an adhesive, solder, solvent, or the like. Is done. The fixing between the first anisotropic conductive connector 10A and the second anisotropic conductive connector 10B is performed at the support frame 14 portion.

  In the above, it is preferable that the strength of the external magnetic field applied to the portion to be the connecting conductive portion 22 and the portion to be the supported portion 25 in the molding material layer 20A is 0.1 to 2.5 Tesla on average.

  The curing treatment of the molding material layer 20A is appropriately selected depending on the material used, but is usually performed by heat treatment. When the molding material layer 20A is cured by heating, a heater may be provided in the electromagnet. The specific heating temperature and heating time are appropriately selected in consideration of the type of polymer substance forming material constituting the molding material layer 20A, the time required for the movement of the conductive particles P, and the like.

  According to the anisotropic conductive connector, the number average particle size of the conductive particles P is in a specific range in relation to the shortest width of the connecting conductive portion 22, and the coefficient of variation of the particle size is 50% or less. Therefore, the conductive particles P have an appropriate particle diameter for forming the connection conductive portion 22. Therefore, when the elastic anisotropic conductive film 20 is formed, when a magnetic field is applied to the molding material layer 20A, a large amount of the conductive particles P may remain in the portion to be the insulating portion 23 in the molding material layer 20A. In addition, a required amount of the conductive particles P can be gathered in a state of being accommodated in a portion to be the conductive portion 22 for connection, and the number of conductive particles P arranged in the thickness direction can be reduced. . As a result, with respect to all the connecting conductive portions 22 to be formed, good conductivity can be obtained, and sufficient insulation can be reliably obtained between the adjacent connecting conductive portions 22. Moreover, since a coating layer having an appropriate thickness can be formed on the conductive particles P, it is possible to suppress a decrease in conductivity on the surface of the conductive particles P even when the conductive particles P are repeatedly used in a high temperature environment. As a result, the total contact resistance between the conductive particles P in the conductive path formed in the connecting conductive portion 22 does not significantly increase, and the required conductivity can be maintained over a long period of time.

  The elastic anisotropic conductive film 20 has a supported portion 25 formed on the periphery of the functional portion having the connecting conductive portion 22, and the supported portion 25 is formed in the anisotropic conductive film disposing hole of the frame plate 14. Since it is fixed to the periphery of 15, it is difficult to be deformed and is easy to handle, and in the electrical connection work with the wafer to be inspected, the wafer can be easily aligned and held and fixed.

Further, each of the anisotropic conductive film arranging holes 15 of the frame plate 14 is formed corresponding to an electrode region in which an inspection target electrode of the integrated circuit is formed on the wafer to be inspected, and the anisotropic conductive film Since the elastic anisotropic conductive film 20 disposed in each of the placement holes 15 may have a small area, it is easy to form the individual elastic anisotropic conductive films 20. Moreover, the elastic anisotropic conductive film 20 having a small area has a small absolute amount of thermal expansion in the surface direction of the elastic anisotropic conductive film 20 even when it receives a thermal history. By using the one having a small thermal expansion coefficient, the thermal expansion in the surface direction of the elastic anisotropic conductive film 20 is reliably regulated by the frame plate. Therefore, even when the WLBI test is performed on a large-area wafer, a good electrical connection state can be stably maintained.

  Further, in the anisotropic conductive connector described above, in forming the elastic anisotropic conductive film 20, for example, a magnetic field is applied to a portion that becomes the supported portion 25 in the molding material layer 20 </ b> A so that the conductive particles P are applied to the portion. Since it is obtained by performing the curing process of the molding material layer 20A in a state where it exists, the portion that becomes the supported portion 25 in the molding material layer 20A, that is, the periphery of the hole 15 for arranging the anisotropic conductive film in the frame plate 14 The conductive particles P existing in the portions located above and below the portions do not collect in the portions to be the connection conductive portions 22, and as a result, the connection conductive portions 22 in the elastic anisotropic conductive film 20 obtained as a result. It is prevented that an excessive amount of the conductive particles P is contained in the connecting conductive portion 22 located on the outermost side. Therefore, since it is not necessary to reduce the content of the conductive particles P in the molding material layer 20A, good electrical conductivity can be reliably obtained for all the connecting conductive portions 22 of the elastic anisotropic conductive film 20 and adjacent to each other. Insulating property with the connecting conductive portion 22 is reliably obtained.

  Furthermore, the elastic anisotropic conductive film 20 of the second anisotropic conductive connector 10B disposed on the wafer 6 side contains high-density conductive particles P and that of the first anisotropic conductive connector 10A. Compared with high hardness, deformation hardly occurs, handling property is good and alignment is good.

  Further, as shown in FIG. 1, since the positioning hole 16 is formed in the frame plate 14, the alignment with respect to the wafer to be inspected or the circuit board for inspection can be easily performed.

Further, if an air circulation hole is formed in the frame plate 14, in the wafer inspection apparatus described later, when a device using a decompression method is used as a means for pressing the probe member, anisotropic conduction is performed when the inside of the chamber is decompressed. The air existing between the conductive connector and the inspection circuit board is exhausted through the air circulation hole of the frame plate 14, and thereby the anisotropic conductive connector and the inspection circuit board can be securely adhered to each other. Therefore, the required electrical connection can be reliably achieved.
[Wafer inspection equipment]
FIG. 11 is an explanatory sectional view showing an outline of an example of a wafer inspection apparatus using the probe member according to the present invention. The wafer inspection apparatus 200 is for performing electrical inspection of a plurality of integrated circuits formed on the wafer in the state of the wafer.

  A wafer inspection apparatus shown in FIG. 11 includes a probe card 100 having a probe member 10 that electrically connects each of the electrodes to be inspected 7 of the wafer 6 to be inspected and a tester, and a wafer inspection including the probe card 100. Device 200 is shown.

  The probe card 100 is composed of the probe member 10 and the inspection circuit board 1, and electrodes are formed on the inspection circuit board 30 according to a pattern corresponding to the integrated circuit of the wafer 6 to be inspected. Yes.

In this probe member 10, as shown in FIG. 1, a plurality of inspection electrodes 31 are formed on the surface (lower surface in the figure) according to a pattern corresponding to the pattern of the electrode 7 to be inspected on the wafer 6 to be inspected. A circuit board 30 is provided. On the surface of the inspection circuit board 30, the probe member 10 having the configuration shown in FIG. 1 is provided, and the first anisotropic conductive portion connector 10 A is provided for each of the inspection electrodes 31 of the inspection circuit board 30. The wafer mounting table 4 on which the wafer 6 to be inspected is mounted is provided on the lower surface of the second anisotropic conductive portion connector 10B. The pressure plate 3 and the wafer mounting table 4 A heater 5 is connected to each.

  As a substrate material constituting the inspection circuit board 30, various conventionally known substrate materials can be used. Specific examples thereof include a glass fiber reinforced epoxy resin, a glass fiber reinforced phenol resin, and a glass fiber reinforced type. Examples thereof include composite resin materials such as polyimide resin and glass fiber reinforced bismaleimide triazine resin, and ceramic materials such as glass, silicon dioxide, and alumina.

  Further, when configuring a wafer inspection apparatus for performing the WLBI test, it is preferable that the linear expansion coefficient of the substrate material forming the inspection circuit board 30 is the same linear thermal expansion coefficient as that of the frame plate 14.

The substrate material constituting the inspection circuit board 30 preferably has a linear thermal expansion coefficient of 3 × 10 ⁻⁵ / K or less, more preferably 1 × 10 ⁻⁷ to 1 × 10 ⁻⁵ / K, Particularly preferably, it is 1 × 10 ^{−6 to} 6 × 10 ⁻⁶ / K.

Specific examples of such a substrate material include Pyrex (registered trademark) glass, quartz glass, alumina, beryllia, silicon carbide, aluminum nitride, and boron nitride.
In such an electrical inspection apparatus 200, the wafer 6 to be inspected is placed on the wafer mounting table 4, and then the probe member 10 is pressed downward by the pressure plate 3, thereby causing the second difference. The conductive particles of the one-way connector 10B come into contact with each of the electrodes 7 to be inspected in the integrated circuit of the wafer 6. Thereby, each of the electrodes 7 to be inspected on the wafer 6 is pressurized. In this state, each of the connecting conductive portions 22 in the elastic anisotropic conductive film 20 of the first anisotropic conductive connector 10A of the probe member 10 is clamped by the test electrode 31 of the test circuit board 30 and is thus in the thickness direction. As a result, a conductive path is formed in the connecting conductive portion 22 in the thickness direction. As a result, the electrical connection between the electrode 7 to be inspected on the wafer 6 and the inspection electrode 31 on the circuit board 30 for inspection is performed. Connection is achieved. Here, since the elastic anisotropic conductive film 20 of the second anisotropic conductive connector 10B in the probe member 10 has high hardness, a good electrical connection state can be stably maintained.

  Thereafter, the wafer 6 is heated to a predetermined temperature by the heater 5 via the wafer mounting table 4 and the pressure plate 3, and in this state, a required electrical inspection is performed on each of the plurality of integrated circuits on the wafer 6. Is done.

  According to such a wafer inspection apparatus 200, the probe card 100 is configured by fixing the inspection circuit substrate 30 to the probe member 10 having appropriate rigidity described above, and the inspection target is interposed via the probe card 100. Since the electrical connection of the wafer 6 to the electrode 7 to be inspected is achieved, even if the pitch of the electrode 7 to be inspected is small, the wafer 6 can be easily aligned and held and fixed. In addition, the connection conductive portion 22 of the elastic anisotropic conductive film 20 in each anisotropic conductive connector 10A, 10B has good conductivity, and insulation between adjacent connection conductive portions 22 is sufficiently ensured. Therefore, high connection reliability for each electrode to be inspected can be obtained. Furthermore, even when used repeatedly in a high temperature environment, the required electrical inspection can be stably performed over a long period of time.

Further, each elastic anisotropic conductive film 20 in the anisotropic conductive connectors 2A and 2B has a small area, and even when it receives a thermal history, heat in the surface direction of the elastic anisotropic conductive film 20 is present. Since the absolute amount of expansion is small, thermal expansion in the surface direction of the elastic anisotropic conductive film 20 is reliably regulated by the frame plate by using a material having a small linear thermal expansion coefficient as a material constituting the frame plate 14. Therefore, even when the WLBI test is performed on a large-area wafer, a good electrical connection state can be stably maintained.

  According to the present invention, a flexible so-called membrane is not required. Further, since the conductive particles P of the second anisotropic conductive connector 10B that are in contact with the electrode 7 to be inspected on the wafer 6 are covered with a diffusion-resistant metal, the electrode 7 to be inspected is formed on the conductive particle P. When the electrode material to be transferred moves, there is little alteration of the coating layer. Therefore, there is little decrease in conductivity.

  Further, the elastic anisotropic conductive film 20 on the second anisotropic conductive connector side 10B side is harder than the elastic anisotropic conductive film 20 on the first anisotropic conductive connector 10A side, and further, the frame plate 14 and the elastic anisotropic conductive film 20 have elasticity, so that even if the electrodes to be inspected have variations in height, good electrical connection to the integrated circuit can be achieved with a small pressure. It is possible to achieve high inspection durability.

  Further, if the conductive particles contained in the elastic anisotropic conductive film 20 of the second anisotropic conductive connector 10B are contained at a higher density than the conductive particles on the first anisotropic conductive connector 10A side, the second The rigidity on the anisotropic conductive connector side can be increased.

  According to such an inspection apparatus 200, a flexible membrane film is unnecessary, and the probe member is supported by the support frame, so that the handling property is good and the positioning is easy.

FIG. 1A is a plan view according to an embodiment of the probe member of the present invention, and FIG. 1B is a partially enlarged cross-sectional view in the direction of the line AA in FIG. FIG. 2 is an enlarged plan view showing a part of the elastic anisotropic conductive film in the anisotropic conductive connector constituting the probe member shown in FIG. FIG. 3 is an enlarged cross-sectional view showing a part of the anisotropic conductive connector shown in FIG. It is sectional drawing for description which expands and shows the elastic anisotropic conductive film in the probe member shown to FIG. 1 (A), (B). It is sectional drawing for description which shows the state by which the molding material was apply | coated to the metal mold | die for elastic anisotropic conductive film formation, and the molding material layer was formed. It is sectional drawing for description which expands and shows the one part the metal mold | die for elastic anisotropic conductive molding. It is sectional drawing for description which shows the state by which the frame board was arrange | positioned through the spacer between the upper mold | type and lower mold | type of the metal mold | die shown in FIG. It is sectional drawing for description which shows the state by which the molding material layer of the target form was formed between the upper mold | type and lower mold | type of metal mold | die. It is sectional drawing for description which expands and shows the molding material layer shown in FIG. It is sectional drawing for description which shows the state in which the magnetic field which has intensity distribution in the thickness direction was formed in the molding material layer shown in FIG. It is sectional drawing for description which shows the structure in an example of the wafer inspection apparatus using the probe member which concerns on this invention. In the process of manufacturing the conventional anisotropically conductive connector, it is sectional drawing for description which shows the state by which the frame board was arrange | positioned in a metal mold | die and the molding material layer was formed.

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 Pressure plate 4 Wafer mounting base 5 Heater 6 Wafer 4 Wafer mounting base 7 Electrode to be inspected 10 Probe member 10A First anisotropic conductive connector 10B Second anisotropic conductive connector 14 Frame plate 15 Hole for anisotropic conductive film arrangement DESCRIPTION OF SYMBOLS 16 Positioning hole 20 Elastic anisotropic conductive film 20A Molding material layer 22 Connecting conductive part 23 Insulating part 24 Protruding part 25 Supported part 30 Circuit board for inspection 31 Inspection electrode 60 Mold 61 Upper mold 62 Substrate 63 Ferromagnetic layer 64 Nonmagnetic layer 64a Recess 65 Lower mold 66 Substrate 67 Ferromagnetic layer 68 Nonmagnetic layer 68a Recess 69a Spacer 69b Spacer 100 Probe card 200 Wafer inspection device P Conductive particle

Claims (8)

It is composed of a laminate of a first anisotropic conductive connector disposed on the inspection circuit board side and a second anisotropic conductive connector disposed on the wafer side,
The first anisotropic conductive connector is
Corresponding to the electrode region where the inspected electrode of the integrated circuit is arranged, a frame plate in which a plurality of anisotropic conductive film arrangement holes are formed in the thickness direction, respectively,
A plurality of connection conductive portions disposed in the anisotropic conductive film disposition holes of the frame plate and supported by projecting to the periphery of the anisotropic conductive film disposition holes, and between the connection conductive portions And having a plurality of elastic anisotropic conductive films provided with insulating parts to insulate,
The second anisotropic conductive connector is
Corresponding to the electrode region where the inspected electrode of the integrated circuit is arranged, a frame plate in which a plurality of anisotropic conductive film arrangement holes are formed in the thickness direction,
A plurality of connection conductive portions disposed in the anisotropic conductive film disposition holes of the frame plate and supported by projecting to the periphery of the anisotropic conductive film disposition holes, and between the connection conductive portions And having a plurality of elastic anisotropic conductive films provided with insulating portions to insulate,
A probe member, wherein the connecting conductive portions corresponding to each other of the first anisotropic conductive connector and the second anisotropic conductive connector are positioned and fixed integrally.   In the first anisotropic conductive connector, conductive particles formed by coating the surface of nickel core particles with a highly conductive metal such as gold are oriented in the thickness direction, so that a plurality of conductive materials for connection are provided. The probe member according to claim 1, further comprising: an insulating portion that insulates the connecting conductive portions from each other.   In the second anisotropic conductive connector, conductive particles formed by coating the surface of nickel core particles with a diffusion-resistant metal are oriented at a high density in the thickness direction, so that a plurality of conductive materials for connection are provided. The probe member according to claim 1, further comprising: an insulating portion that insulates the connecting conductive portions from each other.   The probe member according to claim 3, wherein the diffusion-resistant metal is rhodium. The first anisotropic conductive film and the second anisotropic conductive film are formed of elastic polymer materials having different hardnesses, respectively, and the durometer hardness of the first anisotropic conductive connector is H ₁ ,
When the durometer hardness of the anisotropically conductive connector was H _2, a probe member according to claim 1, characterized by satisfying the following condition (1) and condition (2).
Condition (1): H ₂ ≧ 30
Condition (2): H ₂ / H ₁ ≧ 1.1   The probe member according to any one of claims 1 to 5 is configured to perform electrical inspection of a plurality of integrated circuits formed on a wafer with a circuit board for inspection in a wafer state. A probe member disposed between an inspection circuit board and the circuit board for inspection. A probe card used for electrical inspection of an integrated circuit formed on a wafer to be inspected,
An inspection circuit board on the surface of which an inspection electrode corresponding to the inspection target electrode of the integrated circuit of the wafer to be inspected is formed;
The probe card provided with the probe member in any one of Claims 1-6 arrange | positioned on the said circuit board for a test | inspection.   A wafer inspection apparatus comprising the probe card according to claim 7.

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