CN208337627U - A kind of circuit board assemblies and mobile terminal - Google Patents
A kind of circuit board assemblies and mobile terminal Download PDFInfo
- Publication number
- CN208337627U CN208337627U CN201820607679.4U CN201820607679U CN208337627U CN 208337627 U CN208337627 U CN 208337627U CN 201820607679 U CN201820607679 U CN 201820607679U CN 208337627 U CN208337627 U CN 208337627U
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- circuit board
- pad
- bur
- glue film
- utility
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Abstract
The utility model embodiment provides a kind of circuit board assemblies and mobile terminal, is related to technical field of electronic equipment.The utility model embodiment on the pad of first circuit board by being arranged multiple bur structures, glue film is set between the pad of first circuit board and the pad of second circuit board, multiple bur structures on the pad of first circuit board are pierced through into glue film, to realize the electrical connection of first circuit board and second circuit board.Due to eliminating the external connector construction such as connectors and socket connector, the connection between glue film two circuit boards of realization, the thickness of the circuit board assemblies after reducing connection only are pierced through by multiple bur structures.
Description
Technical field
The utility model relates to technical field of electronic equipment more particularly to a kind of circuit board assemblies and mobile terminal.
Background technique
As mobile terminal constantly develops to frivolous direction, circuit board also gradually develops to filament micropore, two circuit boards
Thickness after connection is also required to constantly reduce.
Currently, the connection between two kinds of structures realization plates and plate is generallyd use, as shown in Figure 1, the first is in the first electricity
It is provided with spliced eye 13 on road plate 11 and second circuit board 12, is inserted into inserting for two circuit boards respectively by connectors 14
It connects in hole 13, then realizes the connection of first circuit board 11 and second circuit board 12 by wave-soldering；As shown in Fig. 2, second is
The base 24 of socket connector is welded on by SMT (Surface Mount Technology, surface installation technique) technique
On the pad 23 of first circuit board 21, the male seat 25 of socket connector is welded on to the weldering of second circuit board 22 by SMT technique
On disk, finally the base of socket connector 24 and the male seat of socket connector 25 are fastened, realize first circuit board 21 and second
The connection of circuit board 22.
But for realizing two kinds of connection structures between plate and plate, the thickness of connectors and socket connector is remote
Greater than the thickness of circuit board, the connection thickness between circuit board can not be dropped to it is ultimate attainment so that two circuit boards after connection
Thickness is larger.
Utility model content
The utility model embodiment provides a kind of circuit board assemblies and mobile terminal, to solve to pass through plug connection at present
Device or socket connector connect two circuit boards, so that the problem that the thickness of two circuit boards after connection is larger.
In order to solve the above-mentioned technical problem, the utility model embodiment provides a kind of circuit board assemblies, comprising: the first electricity
It is provided with pad on road plate and second circuit board, the first circuit board and the second circuit board, in first circuit
Multiple bur structures are provided on the pad of plate；
Glue film, first electricity are provided between the pad of the first circuit board and the pad of the second circuit board
The multiple bur structure on the pad of road plate pierces through the glue film, so that the first circuit board and the second circuit board
Electrical connection；Wherein, the thickness of the glue film is consistent with the height of the bur structure.
The utility model embodiment additionally provides a kind of mobile terminal, including above-mentioned circuit board assemblies.
In the utility model embodiment, by the way that multiple bur structures are arranged on the pad of first circuit board, first
Glue film is set between the pad of circuit board and the pad of second circuit board, by multiple bur structures on the pad of first circuit board
Glue film is pierced through, to realize the electrical connection of first circuit board and second circuit board.Connect due to eliminating connectors and socket
The external connector construction such as device is connect, only pierces through the connection between glue film two circuit boards of realization, drop by multiple bur structures
The thickness of circuit board assemblies after low connection.
Detailed description of the invention
Fig. 1 shows a kind of structural schematic diagram of existing circuit board assemblies；
Fig. 2 shows the structural schematic diagrams of existing another circuit board assemblies；
Fig. 3 shows a kind of structural schematic diagram of circuit board assemblies of the utility model embodiment；
Fig. 4 shows the decomposition texture schematic diagram of the circuit board assemblies of the utility model embodiment；
Fig. 5 shows the structural schematic diagram of another circuit board assemblies of the utility model embodiment；
Fig. 6 shows a kind of one of the schematic diagram of formation bur structure of the utility model embodiment；
Fig. 7 shows the two of the schematic diagram of a kind of formation bur structure of the utility model embodiment；
Fig. 8 shows the three of the schematic diagram of a kind of formation bur structure of the utility model embodiment；
Fig. 9 shows the four of the schematic diagram of a kind of formation bur structure of the utility model embodiment；
Figure 10 shows the five of the schematic diagram of a kind of formation bur structure of the utility model embodiment；
Figure 11 shows the six of the schematic diagram of a kind of formation bur structure of the utility model embodiment；
Figure 12 shows the seven of the schematic diagram of a kind of formation bur structure of the utility model embodiment；
Figure 13 shows another schematic diagram for forming bur structure of the utility model embodiment.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
It clearly and completely describes, it is clear that the embodiments are a part of the embodiments of the present invention, rather than whole implementation
Example.Based on the embodiments of the present invention, those of ordinary skill in the art are obtained without creative efforts
The every other embodiment obtained, fall within the protection scope of the utility model.
Embodiment one
Referring to Fig. 3, a kind of structural schematic diagram of circuit board assemblies of the utility model embodiment is shown, Fig. 4 is circuit
The decomposition texture schematic diagram of board group part.
The utility model embodiment provides a kind of circuit board assemblies, comprising: first circuit board 31 and second circuit board 32,
It is provided with pad on first circuit board 31 and second circuit board 32, such as the pad 331 and second in Fig. 3 on first circuit board 31
Pad 332 on circuit board 32 is provided with multiple bur structures 34 on the pad 331 of first circuit board 31；In the first circuit
Glue film 35 is provided between the pad 331 of plate 31 and the pad 332 of second circuit board 32, on the pad 331 of first circuit board 31
Multiple bur structures 34 pierce through glue film 35 so that first circuit board 31 is electrically connected with second circuit board 32；Wherein, glue film 35
Thickness is consistent with the height of bur structure 34.
Firstly, pad 331 is arranged on first circuit board 31, pad 332 is set on second circuit board 32, weldering can be used
The mode connect is realized, then, multiple bur structures 34 is formed on the pad 331 of first circuit board 31, finally, using glue film 35
It is bonded the pad 331 of first circuit board 31 and the pad 332 of second circuit board 32, in pressing first circuit board 31 and second circuit
During plate 32, multiple bur structures 34 on the pad 331 of first circuit board 31 pierce through glue film 35, and and second circuit board
32 electrical connections, to realize the electrical connection of first circuit board 31 and second circuit board 32.
Wherein, the thickness of glue film 35 is consistent with the height of bur structure 34, by by the thickness of glue film 35 and bur structure
34 height is arranged to unanimously, and the bur structure 34 on first circuit board 31 is just passed through glue film 35 and is electrically connected with second circuit board 32
It connects, while guaranteeing that glue film 35 can be bonded first circuit board 31 and second circuit board 32.
The utility model connector construction external by removal connectors and socket connector etc., only by multiple
Bur structure pierces through the connection between glue film two circuit boards of realization, the thickness of the circuit board assemblies after reducing connection；Meanwhile
With high costs due to connector itself, then the utility model no longer uses connectors and socket connector, can be significantly
Reduce link cost；In addition, the utility model using process for pressing replace wave-soldering or SMT technique, reduce processing cost and
Process complexity.
It should be noted that the disk 332 on pad 331 and second circuit board 32 on first circuit board 31 can be " gold
Finger " pad, " golden finger " pad generally have it is gold-plated, contact sensitivity it is very high, certainly, in the utility model embodiment
Pad other kinds of pad can also be used, the utility model embodiment is without limitation.
Referring to Fig. 5, the structural schematic diagram of another circuit board assemblies of the utility model embodiment is shown.
In the utility model embodiment, multiple bur structures 34 are provided on the pad 332 of second circuit board 32, the
Multiple bur structures 34 on the pad 332 of two circuit boards 32 pierce through glue film 35, and are electrically connected with first circuit board 31, and first
Any one bur structure 34 in any one bur structure 34 and second circuit board 32 on circuit board 31, which misplaces, arranges.
That is, orthographic projection of multiple bur structures 34 on second circuit board 32 on first circuit board 31, with
Multiple 34 regions of bur structure on two circuit boards 32 are not overlapped.
Wherein, staggered mode can be as shown in figure 5, bur structure 34 and second circuit on first circuit board 31
Bur structure 34 on plate 32 alternates arrangement, so that the electrical joint of first circuit board 31 and second circuit board 32 is more
It is more, improve the electric conductivity between first circuit board 31 and second circuit board 32；It can also be in the pad 331 of first circuit board 31
Left-half form multiple bur structures 34, form multiple bur knots in the right half part of the pad 332 of second circuit board 32
Structure 34, certainly, also using other arrangement modes.
Wherein, glue film 35 is that thermosetting film or pressure-sensitive glue film are made when glue film 35 is thermosetting film by heating
It obtains glue film 35 to be bonded first circuit board 31 and second circuit board 32, when glue film 35 is pressure-sensitive glue film, passes through pressing
So that first circuit board 31 and second circuit board 32 are bonded by glue film 35.
Referring to Fig. 6 to Figure 12, a kind of schematic diagram of formation bur structure of the utility model embodiment is shown.
As shown in fig. 6, pad 331 is provided on first circuit board 31, on the garbage area 41 on first circuit board 31
Lead 42 is set, pad 331 is connected by lead 42；As shown in fig. 7, then attaching route on first circuit board 31 forms institute
The dry film 43 used, the dry film 43 extend to garbage area 41；As shown in figure 8, using exposure technology in the corresponding region of pad 331
Form multiple windowing A；Salient point 44 is formed as shown in figure 9, being electroplated at multiple windowing A using electroplating technology, wherein plating is formed
The material of salient point 44 can be with copper or other metal materials；As shown in Figure 10, by dry film 43 remaining on first circuit board 31
Carry out demoulding processing；As shown in figure 11, the etching of salient point 44 is formed by bur structure 34 using microetch carving technology；It finally reduces useless
Expect area 41, obtains structure as shown in figure 12.
Referring to Fig.1 3, show another schematic diagram for forming bur structure of the utility model embodiment.
As shown in figure 13, conductive paste 52 is put on the pad 331 of first circuit board 31 by dispenser 51, conductive paste 52 is solid
Bur structure 34 is formed after change, conductive paste 52 can be silver paste or copper slurry etc..
Wherein, the shape of bur structure 34 is taper, can be cone, triangular pyramid, pyramid shape etc., bur structure
The shape in 34 faces contacted with pad 331 can be circle, rectangle, triangle etc., but portion of the bur structure 34 far from pad 331
Position, the i.e. top of bur structure 34, cannot be arranged to plane, if when the top of bur structure 34 is plane, electric by first
Multiple bur structures 34 on the pad 331 of road plate 31 pierce through glue film 35, and when being electrically connected with second circuit board 32, in bur knot
There can be glue film 35 between structure 34 and second circuit board 32, and then influence leading between first circuit board 31 and second circuit board 32
Electrically.
Bur structure 34 is that copper bur structure or silver-colored bur structure, the i.e. material of bur structure 34 can be copper or silver, when
So also using other metal materials such as gold.
In the utility model embodiment, the pad (pad 331 and second circuit board on first circuit board 31 in such as Fig. 3
Pad 332 on 32) and bur structure 34 on be all covered at least one layer of anti-oxidation metal film layer.
By being surface-treated to pad 331, pad 332 and bur structure 34, mainly in pad 331, pad 332
One layer of nickel metal film layer is first plated with the surface of bur structure 34, then plates one layer of golden metallic diaphragm, prevents pad 331,332 and of pad
34 oxidation corrosion of bur structure, after being surface-treated, by multiple bur structures 34 on the pad 331 of first circuit board 31
Glue film 35 is pierced through, and is electrically connected with second circuit board 32.
In the utility model embodiment, the pad 331 of first circuit board 31 and the pad 332 of second circuit board 32 are one
It is a or multiple, one or more pads 331 can be set on first circuit board 31, second according to actual process requirements
One or more pads 332, the pad 331 of first circuit board 31 and the pad of second circuit board 32 are also provided on circuit board 32
Determines according to actual conditions, the utility model embodiment is without limitation for 332 quantity.
Wherein, first circuit board 31 be rigid circuit board or flexible circuit board, second circuit board 32 be rigid circuit board or
Flexible circuit board.
That is, second circuit board 32 can be rigid circuit board or soft when first circuit board 31 is rigid circuit board
Property circuit board, when first circuit board 31 is flexible circuit board, second circuit board 32 or rigid circuit board or flexible circuit
Plate.
In the utility model embodiment, by the way that multiple bur structures are arranged on the pad of first circuit board, first
Glue film is set between the pad of circuit board and the pad of second circuit board, by multiple bur structures on the pad of first circuit board
Glue film is pierced through, to realize the electrical connection of first circuit board and second circuit board.Connect due to eliminating connectors and socket
The external connector construction such as device is connect, only pierces through the connection between glue film two circuit boards of realization, drop by multiple bur structures
The thickness of circuit board assemblies after low connection.
Embodiment two
The utility model embodiment additionally provides a kind of mobile terminal, which includes circuit board assemblies, the circuit
Board group part includes first circuit board 31 and second circuit board 32, is provided with weldering on first circuit board 31 and second circuit board 32
Disk is provided with multiple bur structures 34 on the pad 331 of first circuit board 31；In the pad 331 of first circuit board 31 and
Glue film 35 is provided between the pad 332 of two circuit boards 32, multiple bur structures 34 thorn on the pad 331 of first circuit board 31
Glue film 35 is worn, so that first circuit board 31 is electrically connected with second circuit board 32；Wherein, the thickness of glue film 35 and bur structure 34
Height is consistent.
In a kind of preferred embodiment of the utility model, it is provided on the pad 332 of second circuit board 32 multiple prominent
Structure 34 is pierced, multiple bur structures 34 on the pad 332 of second circuit board 32 pierce through glue film 35, and electric with first circuit board 31
Connection, and any one bur structure 34 on first circuit board 31 and any one bur structure 34 on second circuit board 32
Dislocation arrangement.
In the utility model embodiment, glue film 35 is thermosetting film or pressure-sensitive glue film；The shape of bur structure 34 is
Taper can be cone, triangular pyramid, pyramid shape etc.；Bur structure 34 is copper bur structure or silver-colored bur structure.
In the utility model embodiment, at least one layer of anti-oxidation metal film layer is all covered on pad and bur structure 34；
The pad 331 of first circuit board 31 and the pad 332 of second circuit board 32 are one or more.
Wherein, first circuit board 31 be rigid circuit board or flexible circuit board, second circuit board 32 be rigid circuit board or
Flexible circuit board.
Mobile terminal in the utility model embodiment can be mobile phone, tablet computer, handheld device, e-book reading
Device etc..
It include circuit board assemblies in the mobile terminal of the utility model embodiment, by being set on the pad of first circuit board
Multiple bur structures are set, glue film is set between the pad of first circuit board and the pad of second circuit board, by first circuit board
Pad on multiple bur structures pierce through glue film, to realize the electrical connection of first circuit board and second circuit board.Due to going
In addition to the external connector construction such as connectors and socket connector, glue film only is pierced through by multiple bur structures and realizes two
Connection between a circuit board, the thickness of the circuit board assemblies after reducing connection.
Although the preferred embodiment of the utility model embodiment has been described, those skilled in the art are once learnt
Basic creative concept, then additional changes and modifications can be made to these embodiments.So appended claims are intended to solve
It is interpreted as including preferred embodiment and all change and modification for falling into the utility model embodiment range.
Finally, it is to be noted that, herein, the terms "include", "comprise" or its any other variant are intended to
Cover non-exclusive inclusion, so that including that process, method, article or the terminal device of a series of elements not only include
Those elements, but also including other elements that are not explicitly listed, or further include for this process, method, article or
The intrinsic element of person's terminal device.In the absence of more restrictions, the element limited by sentence "including a ...",
Be not precluded is including that there is also other identical elements in the process, method of the element, article or terminal device.
Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to
In this, anyone skilled in the art within the technical scope disclosed by the utility model, can readily occur in variation
Or replacement, it should be covered within the scope of the utility model.Therefore, the protection scope of the utility model should be wanted with right
Subject to the protection scope asked.
Claims (9)
1. a kind of circuit board assemblies characterized by comprising first circuit board and second circuit board, the first circuit board and
It is provided with pad on the second circuit board, multiple bur structures are provided on the pad of the first circuit board；
Glue film, the first circuit board are provided between the pad of the first circuit board and the pad of the second circuit board
Pad on the multiple bur structure pierce through the glue film so that the first circuit board is electrically connected with the second circuit board
It connects；Wherein, the thickness of the glue film is consistent with the height of the bur structure.
2. circuit board assemblies according to claim 1, which is characterized in that be provided on the pad of the second circuit board
Multiple bur structures, multiple bur structures on the pad of the second circuit board pierce through the glue film, and with first electricity
The electrical connection of road plate, and any one bur structure on the first circuit board and any one on the second circuit board are prominent
Pierce structure dislocation arrangement.
3. circuit board assemblies according to claim 1, which is characterized in that the glue film is thermosetting film or pressure-sensitive glue
Film.
4. circuit board assemblies according to claim 1, which is characterized in that the shape of the bur structure is taper.
5. circuit board assemblies according to claim 1, which is characterized in that the bur structure is that copper bur structure or silver are prominent
Pierce structure.
6. circuit board assemblies according to claim 1, which is characterized in that covered in the pad and the bur structure
There is at least one layer of anti-oxidation metal film layer.
7. circuit board assemblies according to claim 1, which is characterized in that the pad of the first circuit board and described second
The pad of circuit board is one or more.
8. circuit board assemblies according to claim 1, which is characterized in that the first circuit board is rigid circuit board or soft
Property circuit board, the second circuit board be rigid circuit board or flexible circuit board.
9. a kind of mobile terminal, which is characterized in that including circuit board assemblies such as of any of claims 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820607679.4U CN208337627U (en) | 2018-04-25 | 2018-04-25 | A kind of circuit board assemblies and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820607679.4U CN208337627U (en) | 2018-04-25 | 2018-04-25 | A kind of circuit board assemblies and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208337627U true CN208337627U (en) | 2019-01-04 |
Family
ID=64779074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820607679.4U Active CN208337627U (en) | 2018-04-25 | 2018-04-25 | A kind of circuit board assemblies and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208337627U (en) |
-
2018
- 2018-04-25 CN CN201820607679.4U patent/CN208337627U/en active Active
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