CN211457541U

CN211457541U - SIG soft and hard circuit board connection structure

Info

Publication number: CN211457541U
Application number: CN201922035777.2U
Authority: CN
Inventors: 朱昀; 小菅正; 邵亚逢; 彭杰; 杨建锋
Original assignee: Kunshan Jianhuang Optoelectronics Technology Co ltd
Current assignee: Kunshan Jianhuang Optoelectronics Technology Co ltd
Priority date: 2019-11-22
Filing date: 2019-11-22
Publication date: 2020-09-08
Anticipated expiration: 2029-11-22

Abstract

The utility model belongs to the technical field of electronic components, a SIG soft and hard circuit board connection structure is related to, including the PCB that has laminating portion down and the FPC that has laminating portion, laminating portion has a plurality of golden fingers down that set up side by side down, it is equipped with a plurality of golden fingers of going up relative with golden finger position down to go up laminating portion, down laminating portion with go up laminating portion and glue the laminating through the welding to make golden finger and last golden finger one-to-one contact down. The soft and hard circuit board has simple manufacturing process and low thickness requirement, but can realize reliable conductive connection, thereby saving the manufacturing time and cost.

Description

SIG soft and hard circuit board connection structure

Technical Field

The utility model relates to an electronic components technical field, in particular to SIG soft and hard circuit board connection structure.

Background

The flexible and rigid circuit board is an electronic component formed by lapping a flexible circuit board (FPC) and a rigid circuit board (PCB). The PCB is convenient to be fixed with a product foundation, and the FPC is used for facilitating connection between the PCBs. The connection joints of electronic components have many different types, but as the density of circuits increases, the connection methods also require thinning. In the past, the connection is realized by adding layers nearly ten times at the joint of the two, and a certain thickness is necessarily added for each layer addition. Therefore, the overall thickness is still large even if each layer is made thin, and moreover, thinning each layer requires a more complicated process, which is time-consuming and costly. Therefore, it is necessary to provide a new connecting structure to solve the above problems.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a SIG flexible printed circuit board connection structure, which can simplify the connection structure of PCB and FPC and obtain a light and thin product at a low manufacturing cost.

The utility model discloses a following technical scheme realizes above-mentioned purpose: the utility model provides a SIG soft or hard circuit board connection structure, includes the PCB that has lower laminating portion and the FPC who has laminating portion, laminating portion has a plurality of golden fingers down that set up side by side down, it is equipped with and goes up golden finger a plurality of relative with golden finger position down to go up laminating portion, laminating portion down with it glues the laminating through the welding to go up laminating portion to under the messenger golden finger and last golden finger one-to-one contact.

Specifically, conductive particles capable of conducting the upper gold finger and the lower gold finger are dispersed in the welding glue.

Further, the material of the conductive particles is tin and nickel.

Specifically, the distance between the upper golden fingers is 0.2mm, and the distance between the lower golden fingers is 0.2 mm.

Adopt above-mentioned technical scheme, the utility model discloses technical scheme's beneficial effect is:

the soft and hard circuit board has simple manufacturing process and low thickness requirement, but can realize reliable conductive connection, thereby saving the manufacturing time and cost.

Drawings

FIG. 1 is a cross-sectional view of a flex-hard wiring board connection structure of SIG according to an embodiment;

FIG. 2 is a partial structural view of a lower bonding part of a PCB;

FIG. 3 is a partial view of the upper bonding portion of the FPC;

fig. 4 is an enlarged sectional view of the connection portion.

Labeled as:

1-PCB, 11-lower joint part, 12-lower golden finger;

2-FPC, 21-upper attaching part, 22-upper golden finger;

3-welding glue;

4-conductive particles.

Detailed Description

The present invention will be described in further detail with reference to specific examples.

Example (b):

as shown in fig. 1 to 3, a SIG flexible-rigid circuit board connection structure includes a PCB1 having a lower attaching portion 11 and an FPC 2 having an upper attaching portion 21, the lower attaching portion 11 has a plurality of lower gold fingers 12 arranged side by side, the upper attaching portion 21 is provided with a plurality of upper gold fingers 22 opposite to the lower gold fingers 12, the lower attaching portion 11 and the upper attaching portion 21 are attached by a solder paste 3, and the lower gold fingers 12 and the upper gold fingers 22 are in one-to-one contact. SIG (solder in glue) is a new way for connecting a flexible circuit board and a hard circuit board with a solder 3 as a core. The solder paste 3 used herein is the solder paste disclosed in CN 108707447A. Since the PCB1 and the FPC 2 are attached face to face, the overall thickness requirement of the connection area is low. The welding glue 3 is non-conductive, can fill the gap between the upper attaching part 21 and the lower attaching part 11, and ensures that the connecting strength of the two sides is more reliable on the premise of ensuring that the golden finger is not transversely conducted. Even under the condition of vibration, the upper golden finger and the lower golden finger are not easy to be dislocated to cause short circuit. The circuit board with the combination of hardness and softness manufactured by the technology only needs two steps of gluing and attaching, the manufacturing process is simple, the thickness requirement is very low, reliable conductive connection can be realized, and the manufacturing time and the manufacturing cost are saved.

As shown in fig. 4, conductive particles 4 capable of conducting the upper gold finger 22 and the lower gold finger 12 are dispersed in the solder paste 3. When the upper bonding part 21 and the lower bonding part 11 are pressed tightly, the upper and lower golden fingers can extrude the welding glue 3 apart, but a conductive path perpendicular to the bonding interface can be formed through the conductive particles 4, and as long as the particle size of the conductive particles 4 is far smaller than the interval of the golden fingers, the conduction of the adjacent golden fingers can not be realized, so that the anisotropic conduction can be realized.

The material of the conductive particles 4 is tin and nickel. Tin and nickel have good conductivity and can ensure low resistance of the connection structure.

The spacing between the upper gold fingers 22 is 0.2mm and the spacing between the lower gold fingers 12 is 0.2 mm. Through the new structural improvement, the gold fingers can especially ensure the conductivity under the condition that the distance between the gold fingers is only 0.2mm, thereby being beneficial to the intensive development requirement of the soft and hard circuit board circuit.

What has been described above are only some embodiments of the invention. For those skilled in the art, without departing from the inventive concept, several modifications and improvements can be made, which are within the scope of the invention.

Claims

1. The utility model provides a SIG soft and hard circuit board connection structure, includes the PCB that has laminating portion down and the FPC that has laminating portion, its characterized in that: laminating portion has a plurality of golden fingers down that set up side by side down, it is equipped with a plurality of golden fingers of going up relative with golden finger position down to go up laminating portion, laminating portion down with it glues the laminating through the welding to go up laminating portion to under the messenger golden finger and last golden finger one-to-one contact.

2. The SIG flex circuit board connection structure of claim 1, characterized in that: conductive particles which can enable the upper golden finger and the lower golden finger to be conducted are dispersed in the welding glue.

3. The SIG flex circuit board connection structure of claim 2, characterized in that: the material of the conductive particles is tin and nickel.

4. The SIG flex circuit board connection structure of claim 1, characterized in that: the distance between the upper golden fingers is 0.2mm, and the distance between the lower golden fingers is 0.2 mm.