CN212086599U - One-input-multiple-output novel process and novel structure circuit board - Google Patents
One-input-multiple-output novel process and novel structure circuit board Download PDFInfo
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- CN212086599U CN212086599U CN202021024230.9U CN202021024230U CN212086599U CN 212086599 U CN212086599 U CN 212086599U CN 202021024230 U CN202021024230 U CN 202021024230U CN 212086599 U CN212086599 U CN 212086599U
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- circuit board
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Abstract
The invention discloses a new-process and new-structure circuit board with one inlet and multiple outlets, which comprises a PCB (printed circuit board), wherein a first bonding pad and a second bonding pad are welded on the surface of the PCB, an anode main wire is welded at one end of the surface of the first bonding pad, an anode branch wire is welded at the other end of the surface of the first bonding pad, a cathode main wire is welded at one end of the surface of the second bonding pad, and a cathode branch wire is welded at the other end of the surface of the second bonding pad Poor contact and short circuit.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a circuit board with a new process and a new structure, wherein the circuit board has one input and multiple outputs.
Background
The PCB, which is called a printed circuit board in chinese, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing.
The module line that uses one to advance many plays in the existing market, the mode of connection that basically adopts the line wiring, is connected a thread with many branch lines, and such circuit connection mode can be because the electric wire is short and not good processing when the electric wire links to each other, does not well make the electric wire side by side, makes positive and negative power cord all connect on same circuit board surface simultaneously, but after the welding is accomplished, because the size of circuit board is restricted to lead to the phenomenon of the too little high pressure short circuit and contact failure that produces in space.
Disclosure of Invention
The invention aims to provide a novel-process and novel-structure circuit board with one input and multiple outputs, so as to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a new technology new construction circuit board of one advances many plays, includes the PCB board, the skin weld of PCB board has first pad and second pad, the welding of the surface one end of first pad has anodal thread, the welding of the surface other end of first pad has anodal branch line, the welding of the surface one end of second pad has negative pole thread, the welding of the surface other end of second pad has negative pole branch line.
Preferably, the first bonding pad and the second bonding pad are in a convex shape, so that the positions of the welding main line and the branch line are conveniently distinguished, the surface of the PCB is small, and the space is saved.
Preferably, the welding positions of the positive branch line and the negative branch line correspond to each other, so that the plurality of positive and negative branch lines are more conveniently fixed together.
Preferably, the surfaces of the positive main line and the negative main line are sleeved with first insulating sleeves, the surfaces of the positive branch line and the negative branch line are sleeved with second insulating sleeves, and the first insulating layer and the second insulating layer protect the wires.
Compared with the prior art, the invention has the beneficial effects that: the invention sets a circuit board connection mode which is convenient for the connection of the main line and the branch line on the basis of the original circuit board, mainly adopts the mode that the two sides of the same circuit board are respectively provided with a bonding pad, and respectively welds the main line and the branch lines on the same bonding pad, so that the main line is connected with the branch lines, and adopts the mode of separately welding the positive electrode and the negative electrode, so that the connection mode of the electric wires is simple, the electric wires can be easily arranged side by side, the process is better processed and more attractive, and simultaneously, the separate welding mode can eliminate the high-voltage and poor-contact short circuit phenomenon caused by the space reduction of the circuit board due to the mode.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a side view of the overall structure of the present invention;
fig. 3 is a front view of the overall structure of the present invention.
In the figure: 1-a PCB board; 2-a first pad; 3-a second pad; 4-a positive main line; 5-a positive branch line; 6-negative main line; 7-a negative branch line; 8-a first insulating sleeve; 9-second insulating sleeve.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a new technology new construction circuit board of one advances many plays, includes PCB board 1, and the surface welding of PCB board 1 has first pad 2 and second pad 3, and the welding of the surface one end of first pad 2 has anodal thread 4, and the welding of the surface other end of first pad 2 has anodal branch line 5, and the welding of the surface one end of second pad 3 has negative pole thread 6, and the welding of the surface other end of second pad 3 has negative pole branch line 7.
The first pad 2 and the second pad 3 are shaped like "bumps".
The welding positions of the positive branch line 5 and the negative branch line 7 correspond to each other.
The surfaces of the positive main line 4 and the negative main line 6 are sleeved with a first insulating sleeve 8, and the surfaces of the positive branch line 5 and the negative branch line 7 are sleeved with a second insulating sleeve 9.
The working principle is as follows: firstly, a first bonding pad 2 and a second bonding pad 3 are respectively welded on the two sides of a PCB 1, then an anode main wire 4 is welded on the upper part of the surface of the first bonding pad 2, then an anode branch wire 5 is welded on the lower part of the surface of the first bonding pad 2, the last step is repeated on the reverse side, and then the anode main wire 4, the cathode main wire 6, the anode branch wire 5 and the cathode branch wire 7 are respectively connected together through a first insulating sleeve 8 and a second insulating sleeve 9, so that the connection of the main wire and the branch wires is completed, the connection mode is simple, and the processing is convenient.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. The utility model provides a new technology new construction circuit board of one advances many plays, includes PCB board (1), its characterized in that: the surface welding of PCB board (1) has first pad (2) and second pad (3), the welding of the surperficial one end of first pad (2) has anodal thread (4), the welding of the surperficial other end of first pad (2) has anodal branch line (5), the welding of the surperficial one end of second pad (3) has negative pole thread (6), the welding of the surperficial other end of second pad (3) has negative pole branch line (7).
2. The circuit board of claim 1, wherein the structure of the circuit board comprises: the first bonding pad (2) and the second bonding pad (3) are in a convex shape.
3. The circuit board of claim 1, wherein the structure of the circuit board comprises: the welding positions of the positive branch line (5) and the negative branch line (7) correspond to each other.
4. The circuit board of claim 1, wherein the structure of the circuit board comprises: the surfaces of the positive main line (4) and the negative main line (6) are sleeved with first insulating sleeves (8), and the surfaces of the positive branch line (5) and the negative branch line (7) are sleeved with second insulating sleeves (9).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021024230.9U CN212086599U (en) | 2020-06-04 | 2020-06-04 | One-input-multiple-output novel process and novel structure circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202021024230.9U CN212086599U (en) | 2020-06-04 | 2020-06-04 | One-input-multiple-output novel process and novel structure circuit board |
Publications (1)
Publication Number | Publication Date |
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CN212086599U true CN212086599U (en) | 2020-12-04 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202021024230.9U Active CN212086599U (en) | 2020-06-04 | 2020-06-04 | One-input-multiple-output novel process and novel structure circuit board |
Country Status (1)
Country | Link |
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CN (1) | CN212086599U (en) |
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2020
- 2020-06-04 CN CN202021024230.9U patent/CN212086599U/en active Active
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Legal Events
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GR01 | Patent grant | ||
CP02 | Change in the address of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: Building 16, area 1, Xiangshang Industrial Park, Shaoyang Economic Development Zone, Shaoyang City, Hunan Province, 422000 Patentee after: Hunan Strapdown New Energy Technology Co.,Ltd. Address before: 422000 building 16, area 1, Xiangshang Industrial Park, Shaoyang Economic Development Zone, Beita District, Shaoyang City, Hunan Province Patentee before: Hunan Strapdown New Energy Technology Co.,Ltd. |