JP7019848B1 - Conductive circuit board formed by pressure welding of conductive connection, and its conductive connection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the size of an electronic device in recent years, and a thin and flexible conductive circuit board as represented by a mobile phone, a digital camera and a personal computer is required for a printed circuit board having a circuit formed by plating. SOLUTION: A second conductive circuit for forming a double-sided circuit and a multilayer circuit is provided on a first conductive circuit board integrally formed by entwining a conductive circuit in a gap of a fibrous base material by plating. A second conductive circuit, which is conductively connected and uses the convex portion 10 formed in the circuit of the first conductive circuit board to remove the adhesive 6 around the convex portion 10 and conduct the conductive connection. By pressure-welding, the flowability of the adhesive 6 is used to drop it into the penetrating portion 3 and the recess 5 of the base material, thereby forming an interlayer conductive connection that is entwined with the base material and connects and fixes the conductive circuit. Circuit board. [Selection diagram] FIG. 7

Description

In the present invention, a conductive circuit is formed by plating on a fibrous base material having an opening so as to connect and conduct a circuit and a circuit such as an LSI, a circuit and an electronic component, and a circuit and an electric component, and pressure welding is performed using the conductive circuit. The present invention relates to a conductive circuit board that is conductively connected by means of a wire, and a method of conductive connection thereof.

As a conventional technique, in a method of joining a conductive substrate such as a printed circuit board and a multi-contact component such as an LSI, an LSI may be formed on a mesh sheet woven from chemical fibers, metal fibers, natural fibers, etc. or a porous sheet composed of a large number of micropores. A conductive sheet is formed by providing a penetrating conductive portion for conducting the joint portion of a multi-contact component such as a printed circuit board and the conductive pattern of a conductive substrate such as a printed circuit board on both the front and back surfaces, and the conductive sheet is formed into a conductive substrate and an LSI or the like. A method of joining a conductive substrate such as a printed circuit board and a multi-contact component such as an LSI, which are arranged between the multi-contact components of the above and integrally bond the conductive pattern of the conductive substrate and the joint portion of the LSI or the like by plating. , Patent Document 1) exists.

Japanese Patent No. 2841045 (see the paragraphs {0005} to {0008} and FIGS. 1 to 3 of {0005} to {0008} of {embodiments of the invention} in the column of claims and the column of detailed description of the invention).

However, in recent years, electronic devices have been miniaturized, and printed circuit boards having circuits formed by plating are also required to be thin and flexible conductive circuit boards, as represented by mobile phones, digital cameras, and personal computers.
That is, in order to reduce the weight of electronic devices, there is a demand for a circuit board in which a circuit is formed by plating, which is thin, light, and resistant to bending. That is, there is a demand for a flexible circuit board that can be freely bent over a wide range of angles without peeling of the circuit from the base material.
Further, in the case of the interlayer conductive connection forming the double-sided circuit and the multilayer circuit on the printed circuit board, at present, holes are formed in the printed circuit board, the holes are plated, and the conductive circuits of each layer are connected by plating. This caused cracks in the plating and poor precipitation, which was a problem for the conductive circuit board.
The present invention provides a conductive circuit board in which a conductive connection is formed by pressure welding, which solves these problems, and a conductive connection method thereof.

The first invention of the present invention capable of achieving the above object is a conductive circuit board in which a conductive connection as described in claim 1 is formed by pressure welding, and is as follows.
By growing plating on both the front and back surfaces of a fibrous base material having an opening made of woven cloth or non-woven fabric, a conductive circuit is entwined with the gaps of the fibrous base material to be integrally formed, so that the plating grows and becomes conductive. A second conductive circuit that is conductively connected to form a double-sided circuit or a multi-layer circuit is conductively connected to the first conductive circuit board formed on the circuit, and an adhesive material is attached to the circuit of the first conductive circuit board. The adhesive material is removed around the convex portion by utilizing the convex portion of the texture of the fibrous base material which is applied and formed in the circuit of the first conductive circuit substrate, and the second is conductively connected. By pressing the conductive circuit of the above, the conductive circuit is connected and fixed by being entwined with the base material by dropping it into the gaps, through holes and recesses of the base material by utilizing the fluidity of the adhesive.

The second invention of the present invention capable of achieving the above object is a conductive circuit board in which a conductive connection as described in claim 2 is formed by pressure welding, and is as follows.
In addition to the invention according to claim 1, the second conductive circuit board is replaced with a planar conductive circuit board and is pressure-welded and connected via an adhesive.

A third aspect of the present invention capable of achieving the above object is a conductive circuit board in which a conductive connection as described in claim 3 is formed by pressure welding, and is as follows.
In addition to the invention according to claim 1, the second conductive circuit board is replaced with terminals of electronic parts and electric parts, and is pressure-welded and connected via an adhesive.

A fourth aspect of the present invention capable of achieving the above object is a conductive connection method in which a conductive connection as described in claim 4 is formed by pressure welding, and is as follows.
By growing plating on both the front and back surfaces of a fibrous base material having an opening made of woven fabric or non-woven fabric, a conductive circuit is entwined with the gaps of the fibrous base material to be integrally formed, so that the plating grows and becomes conductive. An adhesive material is applied to the first conductive circuit board formed on the circuit so as to cover the entire circuit of the first conductive circuit board, and the second conductive circuit board, or an electronic component or an electric component from above. By placing and pressing from the top, the viscosity and fluidity of the adhesive can be improved by making surface contact at multiple points with the convex parts of the intersections formed in the texture of the mesh of the fibrous substrate. By utilizing it, the adhesive material is removed from the convex part while covering the circuit, and the removed adhesive material wraps around the through hole, the concave part where the through hole is filled, and each fiber of the mesh. , The first conductive circuit board and the second conductive circuit board, electronic parts, and electric parts are pressure-welded and connected by an adhesive material.

Since the conductive circuit board in which the conductive connection according to the present invention is formed by pressure welding has the configuration as described above, the effects described below can be obtained.
(1) A conductive connection is firmly formed between the first conductive circuit board and the second conductive circuit board by making maximum use of the openings of the fibrous base material having the openings made of woven fabric or non-woven fabric, that is, the gaps. Will be done.
(2) A substrate formed of a fibrous substrate having an opening as a substrate has flexibility, followability, and flexibility, so that the range of use of the conductive circuit board is widened.
(3) No solder is required to connect the conductive circuit board to the conductive circuit board, the conductive circuit board to the components, etc., or to connect the circuits to each other or to other types of circuits. It is possible to make a strong connection with just one.
(4) When connecting a conductive circuit formed on a base material to another conductive circuit, the adhesive material is entangled through the opening of the base material simply by using an adhesive material and pressing it, so it is strong. Close contact connection is possible.

It is a schematic enlarged plan view which shows the state which has the opening which formed the circuit in the mesh base material in the case of thin plating in 1st Example of this invention. It is a schematic enlarged front view which shows the base material which is 1st Example of this invention. FIG. 3 is a schematic enlarged plan view showing a state in which a circuit is formed in a mesh base material in a state where an opening shown in FIG. 1 is embedded in a mesh base material in the case of thick plating, which is the second embodiment of the present invention. It is a schematic enlarged front view which shows the base material which is the 2nd Example of this invention. It is a schematic enlarged normal cross-sectional view which shows the state cut by the line (a) of FIG. 1 in the 1st Example of this invention. FIG. 3 is a schematic enlarged normal cross-sectional view showing a state of being cut along the line B in FIG. 3 in the second embodiment of the present invention. It is schematic explanatory drawing explaining the state which the 2nd conductive circuit board and the electronic component are conductively connected to the 1st conductive circuit board which is 1st Embodiment of this invention. It is a schematic normal cross-sectional view showing a state in which a second conductive circuit board and a terminal portion of an electronic component or an electric component are pressed together with an adhesive to be conductively connected to the first conductive circuit board which is the first embodiment of the present invention. be. Conductivity in which a second conductive circuit board, a third conductive circuit board, and terminal portions of electronic parts and electric parts are pressure-welded and fixed to a first conductive circuit board, which is the first embodiment of the present invention, via an adhesive material. It is a schematic explanatory drawing which shows the state to connect.

By growing the plating on both the front and back surfaces of the fibrous base material having an opening made of woven cloth or non-woven fabric, the conductive circuit is entwined with the gaps of the fibrous base material and integrally formed, so that the plating grows and becomes conductive. A second conductive circuit having a conductive connection for forming a double-sided circuit and a multi-layer circuit is conductively connected to a first conductive circuit board formed on the circuit, and is formed in the circuit of the first conductive circuit board. The convex portion is used to remove the adhesive material around the convex portion and conduct conductive connection. By pressing the second conductive circuit, the adhesive material has fluidity in the gaps, through holes, and concave portions of the base material. It is a conductive circuit board formed by pressure welding to connect and fix a conductive circuit by entwining an adhesive material with a base material by dropping it by using.

Generally, a woven fabric or a non-woven fabric is considered as the fibrous base material, and as the material, glass fiber, chemical fiber such as polyester, carbon fiber, imide film, polyester film and the like are adopted.
Then, in the formation of the conductive circuit, the plating is grown so as to be entangled with the base material 1 through the mesh-like fibrous base material 1 having the penetration portion 3, that is, the penetration portion 3 and the gaps of the base material 1, and penetrates. A material that forms a conductive sheet having a portion 3 can be adopted.

As shown in FIGS. 1 and 2, a conductive circuit is formed by growing plating on both the front and back surfaces of a fibrous base material 1 having a penetration portion 3 of a conductive sheet 2 formed by thin plating made of woven / knitted fabric or non-woven fabric. It is integrally formed by being entwined with the penetrating portion 3 of the mesh-like fibrous base material 1 using a fiber as a base material.
Here, the first embodiment of the present invention will be described with reference to FIGS. 1, 2, and 5.
As described above, the conductive sheet 2 formed by thin plating having the penetration portion 3 in which the circuit is formed by plating on the mesh of the woven fiber base material 1 is bonded to the conductive sheet in which the circuit is formed by plating on another mesh. The viscosity and fluidity of the adhesive 6 are utilized by pressure contacting the adhesive material 6 in order to make surface contact through 6 and to make surface contact with the portion of the convex portion 10 at multiple points by utilizing the unevenness of the intersection of the mesh texture. Then, while covering the circuit, the adhesive 6 enters the penetrating portion 3 so as to wrap around the mesh, and at the same time, the adhesive 6 flows into the other gap 11 and is fixed. In this phenomenon, the adhesive material 6 at the convex portion 10 generated at the intersection of the textures of the mesh is washed away by pressure contact, and only the convex portion 10 is in a state where the adhesive material 6 is absent and can be conductively connected. Is.
That is, the adhesive material 6 washed away from the convex portion 10 wraps around each fiber of the mesh and is entangled, and at the same time, the adhesive material 6 enters the back surface side through the penetrating portion 3, which is extremely difficult. It can be firmly connected and fixed by surface contact. FIG. 5 is disclosed as a reference diagram for explaining this phenomenon.

Next, the second embodiment of the present invention will be described with reference to FIGS. 3, 4, and 6.
Similar to the first embodiment, a conductive sheet having a circuit formed by plating on another mesh is brought into surface contact with a conductive sheet 5 having a recess in which a penetration portion 3 formed by thick plating is filled with an adhesive material 6. By using the unevenness of the intersection of the textures of the mesh and pressing to make surface contact with the portion of the convex portion 10 at multiple points, the viscosity and fluidity of the adhesive 6 are used to cover the circuit. The adhesive 6 flows into the recess 5 filled in the penetrating portion 3 and is fixed. In this phenomenon, when another conductive sheet is conductively connected to the conductive sheet 4 formed by thick plating by pressure contact, the adhesive 6 at the convex portion 10 generated at the intersection of the textures of the mesh is washed away, and the adhesive material 6 is washed away. Only the portion of the convex portion 10 has no adhesive material 6, and due to the viscosity and fluidity of the adhesive material 6, the adhesive material 6 meshes in the concave portion 5 in which the penetration portion 3 formed by thick plating is buried while covering the circuit. Enters in a wraparound manner, and at the same time flows into another gap 11 and is fixed. In this phenomenon, the adhesive material 6 at the convex portion 10 generated at the intersection of the textures of the mesh is washed away by pressure contact, and only the convex portion 10 becomes free of the adhesive material 6 and can be electrically connected. Is.
That is, the adhesive material 6 washed away from the convex portion 10 wraps around each fiber of the mesh and is entangled, and at the same time, enters the concave portion 5, and further, the gap 11 of the texture around the circuit and the penetrating portion. It is possible to enter into 3 and fix the conductive contact connection extremely firmly by surface contact. FIG. 6 is disclosed as a reference diagram for explaining this phenomenon.

Next, a specific embodiment will be described with reference to FIG. 7.
As shown from above, the adhesive 6 applied from above to the conductive sheet 2 in which a circuit is formed by thin plating on the mesh 1 using the woven fabric fibers shown in FIGS. 1, 2, and 5 described above as a base material. By pressing one or more electronic components 7 against the conductive sheet 2, the adhesive material 6 of the convex portion 10 at the intersection of the textures of the conductive sheet 2 has viscosity and fluidity, so that the plated portion of the convex portion 10 is exposed. Since the remaining adhesive 6 passes through the penetrating portion 3 and wraps around the back surface portion while covering the circuit as shown by the arrow 12, the remaining adhesive material 6 can be conductively connected to the electronic component 7 of the conductive sheet 2 in the conductive circuit. ..

Further, another embodiment will be described with reference to FIG.
Similar to the embodiment shown in FIG. 7, the adhesive 6 applied to the conductive sheet 2 formed by thin plating on the mesh 1 using the woven fabric fibers shown in FIGS. 1, 2, and 5 described above as a base material. By pressing the electronic component 7 and the electrical component 8 against the conductive sheet 2 as shown from above, the adhesive 6 at the convex portion 10 at the intersection of the textures of the conductive sheet 2 has viscosity and fluidity. While showing the plated portion of the convex portion 10, the remaining adhesive 6 is bonded from the lower part as shown in the figure in the case of the electronic component 7 and from the upper part of the terminal of the electric component 8 in the case of the electric component 8 as shown by the arrow 13. Since the material 6 is applied, it passes through the penetrating portion 3 of the conductive sheet 2 while covering the circuit, and wraps around the front surface portion and the back surface portion. Therefore, the terminals of the electronic component 7 and the electric component 8 are connected to the conductive circuit. Can be conductively connected to.

Next, other possible examples will be described with reference to FIG.
In addition to the examples shown in FIGS. 7 and 8, the upper and lower conductive sheets 2 formed by thin plating on the mesh 1 using the woven fabric fibers shown in FIGS. 1, 2 and 5 described above as a base material. An example is shown in which a conductive substrate 9 and an electronic component 7 or an electric component 8 are conductively connected to each other on both sides. By pressing the conductive substrate 9 with the electronic component 7 and the electric component 8, the adhesive material 6 of the convex portion 10 at the intersection of the textures of the conductive sheet 2 has a plated portion, as shown in FIGS. 7 and 8. Since the remaining adhesive 6 wraps around the back surface while covering the circuit, the conductive circuit can be conductively connected to the flat plate conductive substrate 9, the electronic component 7, and the electrical component 8.
The first conductive circuit formed in the fibrous base material 1 having the opening 2 made of a woven fabric and a non-woven fabric is mainly formed by plating, but of course, it can also be formed by an etching method or a transfer method.
As an example, although the description has been made by using a woven mesh base material, other base materials can also be used. Needless to say, it is also possible to use a non-woven fabric formed by weaving fibers having a thickness of 20 microns to 200 microns to form a cloth or cutting the fibers and arranging them side by side.
The first conductive circuit board may be woven by changing the material and shape of the warp and weft. The main type of plating is copper plating, but it is also possible to form a circuit with nickel, tin, silver / gold plating.

In addition to the specific examples described above, not only the adhesive is applied to both the front and back surfaces of the conductive sheet, but also the adhesive is applied to the back surfaces of the electric and electronic parts without applying the adhesive to the conductive sheet. The same action and effect can be obtained by pressure-contacting the conductive sheet.
In addition, interlayer conductive connection is made via a conductive sheet in which a conductive circuit is formed by the growth of plating on both the front and back surfaces of a fibrous base material having openings made of woven fabric or non-woven fabric separately prepared at the conductive connection points and component connection points. Needless to say, it is okay to do so.
That is, the technique of the present invention can electrically connect electronic parts and electric parts to a conductive sheet with an adhesive without fixing by conventional soldering.

Any substrate that is conductively bonded by pressure-welding a second or third conductive circuit board, an electronic component, or an electric component to a first conductive circuit board such as a printed circuit board with an adhesive material can be applied to various conductive circuit boards. be able to.
It can also be applied to conductively connect the ends of motor windings and condenser windings.

1 ... Fibrous base material 2 ... Conductive sheet formed by thin plating 3 ... Penetration part 4 ... Conductive sheet formed by thick plating 5 ... By thick plating Recessed portion in which the formed penetration portion is buried 6 ... Adhesive material 7 ... Electronic component 8 ... Electrical component 9 ... Other conductive substrate 10 ... Convex portion 11 ...・ Gap 12 ・ ・ ・ ・ Arrow

Claims (4)

By growing plating on both the front and back surfaces of a fibrous base material having an opening made of woven cloth or non-woven fabric, a conductive circuit is entwined with the gaps of the fibrous base material to be integrally formed, so that the plating grows and becomes conductive. A second conductive circuit that is conductively connected to form a double-sided circuit or a multi-layer circuit is conductively connected to the first conductive circuit board formed on the circuit, and an adhesive material is attached to the circuit of the first conductive circuit board. The adhesive material is removed around the convex portion by utilizing the convex portion of the texture of the fibrous base material which is applied and formed in the circuit of the first conductive circuit substrate, and the second is conductively connected. By pressing the conductive circuit of the above, the conductive circuit is connected and fixed by being entwined with the base material by dropping it into the gaps, through holes and recesses of the base material using the fluidity of the adhesive. A conductive circuit board formed by pressure welding. The conductive circuit board in which the conductive connection according to claim 1 is formed by pressure welding, wherein the second conductive circuit board is replaced with a planar conductive circuit board and pressure-welded to be connected via an adhesive. The conductive circuit board in which the conductive connection according to claim 1 is formed by pressure welding, wherein the second conductive circuit board is replaced with a terminal of an electronic component or an electric component and is pressure-welded and connected via an adhesive material. By growing plating on both the front and back surfaces of a fibrous base material having an opening made of woven fabric or non-woven fabric, a conductive circuit is entwined with the gaps of the fibrous base material to be integrally formed, so that the plating grows and becomes conductive. An adhesive material is applied to the first conductive circuit board formed on the circuit so as to cover the entire circuit of the first conductive circuit board, and the second conductive circuit board, or an electronic component or an electric component from above. By placing and pressing from the top, the viscosity and fluidity of the adhesive can be improved by making surface contact at multiple points with the convex parts of the intersections formed in the texture of the mesh of the fibrous substrate. By utilizing it, the adhesive material is removed from the convex part while covering the circuit, and the removed adhesive material wraps around the through hole, the concave part where the through hole is filled, and each fiber of the mesh. , A conductive connection method for a conductive connection circuit for forming a conductive connection by pressure welding, wherein the first conductive circuit board and the second conductive circuit board, electronic components, and electric components are pressure-welded to each other by pressure welding.

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