JP5410338B2 - Conductive connection method to upper and lower layers of conductive circuit board - Google Patents
Conductive connection method to upper and lower layers of conductive circuit board Download PDFInfo
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- JP5410338B2 JP5410338B2 JP2010047203A JP2010047203A JP5410338B2 JP 5410338 B2 JP5410338 B2 JP 5410338B2 JP 2010047203 A JP2010047203 A JP 2010047203A JP 2010047203 A JP2010047203 A JP 2010047203A JP 5410338 B2 JP5410338 B2 JP 5410338B2
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Description
本発明はLSI等の接点部品と導電基板とを一体に結合導通するように、開口部を有する繊維状基材、開口部を持つシート状基材に導電回路を形成し、その導電回路と他の導電回路を金属メッキ等で導電接続をした導電回路基板の上・下層への導電接続法に関するものである。 In the present invention, a conductive circuit is formed on a fibrous base material having an opening and a sheet-like base material having an opening so that the contact parts such as LSI and the conductive substrate are integrally connected. The conductive circuit is connected to the upper and lower layers of a conductive circuit board in which the conductive circuit is conductively connected by metal plating or the like.
従来技術としては、プリント基板等の導電基板とLSI等の多接点部品との接合方法において、化学繊維、金属繊維、天然繊維等を編んだメッシュシート又は多数の微細孔からなる多孔シートに、LSI等の多接点部品の接合部と、プリント基板等の導電基板の導電パターンとを表裏両面で導通するための貫通した導電部を設けて導電シートを形成し、該導電シートを導電基板とLSI等の多接点部品の間に配設し、導電基板の導電パターンとLSI等の接合部とを一体に結合導通するプリント基板等の導電基板とLSI等の多接点部品との接合方法(例えば、特許文献1参照)が存在している。 As a conventional technique, in a method of joining a conductive substrate such as a printed circuit board and a multi-contact part such as LSI, LSI is applied to a mesh sheet knitted with chemical fiber, metal fiber, natural fiber, etc. A conductive sheet is formed by providing a conductive part that penetrates the joint part of a multi-contact part such as a conductive pattern of a conductive substrate such as a printed circuit board on both front and back surfaces, and the conductive sheet is formed on the conductive substrate and the LSI. A method of joining a conductive substrate such as a printed circuit board and a multi-contact component such as an LSI (for example, a patent) Reference 1) exists.
しかしながら、近年電子機器は小型化が進み、プリント基板も携帯電話、デジタルカメラ、パソコンに代表されるように、薄く、屈曲するフレキシブルな導電回路基板が求められている。
また、前記従来技術は、現状では導電接続材(コネクター)は平面状であり、平面で接触させるため、平面全面に金メッキを施さなければならず、金の使用量が多くなり、近年の貴金属の高騰にみられる如く、少しでも金の使用量を減らす必要があるという問題があった。
また、プリント基板での両面回路、多層回路を形成する層間導電接続は現状では、プリント基板に孔を穿設し、その孔にメッキ加工、各層の導電回路にメッキで接続をしている。これでは、メッキのクラックや析出不良が生じ、導電回路基板の上・下層への導電接続法としては問題であった。
本発明は、これらの問題を解決した導電回路基板の上・下層への導電接続法を提供するものである。
However, in recent years, electronic devices have been reduced in size, and printed circuit boards are required to be thin and flexible conductive circuit boards, as represented by mobile phones, digital cameras, and personal computers.
Further, in the conventional technology, the conductive connecting material (connector) is flat in the present state, and since it is brought into contact with the flat surface, the entire surface must be plated with gold, and the amount of gold used is increased. There was a problem that it was necessary to reduce the amount of gold used as much as possible.
Further, interlayer conductive connection for forming a double-sided circuit and a multilayer circuit on a printed circuit board is currently made by forming holes in the printed circuit board, plating the holes, and connecting the conductive circuits of each layer by plating. This causes plating cracks and deposition defects, which is a problem as a conductive connection method to the upper and lower layers of the conductive circuit board.
The present invention provides a conductive connection method to the upper and lower layers of a conductive circuit board that solves these problems.
上記の目的を達成することができる本発明の第1発明は、請求項1に記載された通りの導電回路基板の上・下層への導電接続法であり、次のようなものである。
開口部を持つ繊維状基材に、開口部を有する導電回路を形成し、その開口部を有する導電回路を上下に折り曲げ、上・下層の他の導電回路や電子部品と導電接続する構成である。
A first invention of the present invention capable of achieving the above object is a conductive connection method to the upper and lower layers of a conductive circuit board as described in
A conductive circuit having an opening is formed on a fibrous base material having an opening, the conductive circuit having the opening is bent up and down, and conductively connected to other upper and lower conductive circuits and electronic components. .
上記の目的を達成することができる本発明の第2発明は、請求項2に記載された通りの導電回路基板の上・下層への導電接続法であり、次のようなものである。
開口部を持つシート状基材に開口部を有する導電回路を形成し、その開口部を有する導電回路を上下に折り曲げ、上・下層の他の導電回路や電子部品と導電接続する構成である。
The second invention of the present invention capable of achieving the above object is a conductive connection method to the upper and lower layers of the conductive circuit board as described in
A conductive circuit having an opening is formed on a sheet-like substrate having an opening, the conductive circuit having the opening is bent up and down, and conductively connected to other conductive circuits and electronic components in the upper and lower layers.
上記の目的を達成することができる本発明の第3発明は、請求項3に記載された通りの導電回路基板の上・下層への導電接続法であり、次のようなものである。
開口部を持つ繊維状基材に開口部を有する導電回路を形成し、その開口部を有する導電回路を上下に折り曲げて、上・下層の他の導電回路や電子部品と導電接続し、さらにその開口部を有する繊維状基材の開口部を筐体や、他の基板に固定して導電接続する構成である。
A third invention of the present invention capable of achieving the above object is a conductive connection method to the upper and lower layers of a conductive circuit board as described in
A conductive circuit having an opening is formed on a fibrous base material having an opening, the conductive circuit having the opening is bent up and down, and conductively connected to other conductive circuits and electronic components in upper and lower layers, and further In this configuration, the opening of the fibrous base material having the opening is fixed to a housing or another substrate for conductive connection.
上記の目的を達成することができる本発明の第4発明は、請求項4に記載された通りの導電回路基板の上・下層への導電接続法であり、次のようなものである。
請求項3に記載の発明に加えて、導電接続において、絶縁性固定剤を導電回路基板の開口部を利用して絡ませて他の基板や筐体に固定する構成である。
A fourth invention of the present invention capable of achieving the above object is a conductive connection method to the upper and lower layers of a conductive circuit board as described in
In addition to the invention described in
本発明に係る導電回路基板の上・下層への導電接続法は、上記説明のような構成を有するので、以下に記載する効果を奏する。
(1)プリント基板での両面回路、多層回路を形成する層間導電接続を行う上で、開口部をもつ繊維状基材や、開口部を持つシート状基材に開口部を有する導電回路を形成し、その導電回路を延長し形成しておくことにより、上・下に折り曲げることで確実にそして簡単に各層と導電接続をすることができる。
(2)開口部を持つ繊維状基材や、開口部を持つシート状基材に開口部を有する導電回路を形成するので、回路として空気との接触面積が大きくなるので、放熱機能を高めるものである。
(3)開口部を有する導電回路になるので、引き伸ばして開口部を菱型にすることで、回路延長することができるものである。
Since the conductive connection method to the upper and lower layers of the conductive circuit board according to the present invention has the configuration as described above, the following effects can be obtained.
(1) Forming a fibrous base material having an opening or a conductive circuit having an opening on a sheet-like base material having an opening when performing double-sided circuit or multilayer circuit connection on a printed circuit board By extending and forming the conductive circuit, it is possible to reliably and easily make conductive connection with each layer by bending up and down.
(2) Since a conductive substrate having an opening is formed on a fibrous base material having an opening or a sheet-like substrate having an opening, the area of contact with air as a circuit is increased, so that the heat dissipation function is enhanced. It is.
(3) Since the conductive circuit has an opening, the circuit can be extended by stretching and making the opening a diamond shape.
開口部を持つ繊維状基材や、開口部を持つシート状基材に、開口部を有する導電回路を形成し、その開口部を有する導電回路を上下に折り曲げ、上・下層の他の導電回路や電子部品と導電接続する導電回路基板の上・下層への導電接続法である。 A conductive circuit having an opening is formed on a fibrous base material having an opening or a sheet-like substrate having an opening, and the conductive circuit having the opening is bent up and down to form another conductive circuit on the upper and lower layers. And a conductive connection method to the upper and lower layers of a conductive circuit board that is conductively connected to an electronic component.
一般的に開口部を持つ繊維状基材としては、織布、不織布、微細な開口部を持つシート、フィルムが考えられ、材料としては、ガラス繊維、ポリエステル等の化学繊維、カーボン繊維、イミドフィルム、ポリエステルフィルム等が採用される。
そして、導電回路の形成は、開口部を有する繊維状基材や、開口部を持つシート状基材上にメッキで形成したり、金属板上でメッキにより形成したメッキ回路を剥離して得られた導電回路、銅箔をエッチングして形成した導電回路等が採用できる。
また、導電性接続としては、ハンダ接続、金属の超音波接続、圧接、メッキでの接続、導電ペーストでの接続、導電接着剤での接続、金属製ハトメでの固定接続、ネジ止め接続、接点を銀、錫メッキで圧接し拡散接合することにより導電性接続が可能である。
In general, as the fibrous base material having an opening, woven fabric, non-woven fabric, sheet or film having a fine opening can be considered, and the materials include chemical fibers such as glass fiber and polyester, carbon fiber, and imide film. A polyester film or the like is employed.
The conductive circuit is formed by plating a fibrous base material having openings or a sheet-like base material having openings, or by peeling a plating circuit formed by plating on a metal plate. A conductive circuit formed by etching a copper foil or the like can be employed.
Also, the conductive connection includes solder connection, ultrasonic metal connection, pressure contact, plating connection, connection with conductive paste, connection with conductive adhesive, fixed connection with metal eyelet, screw connection, contact Can be conductively connected by pressure welding with silver and tin plating and diffusion bonding.
次に、図面に基づいてさらに具体的な実施例を詳細に説明する。
図1は、開口部を有する繊維状基材1にメッキにて形成した導電回路2と開口部のある導電回路3を形成し、この開口部のある導電回路3を下層の他の導電回路5に導電接続した状態を示したもので、メッキにて形成した導電回路2の部分と他の導電回路5の間には絶縁層4を介在させ、開口部のある導電回路3と他の導電回路5との間は絶縁層4を取り除き、開口部のある導電回路3を下方に加圧して折り曲げ、他の導電回路5と導電接続する実施例を示したものである。
Next, specific examples will be described in detail with reference to the drawings.
In FIG. 1, a
図2に示すものは、筐体19に多層回路を固定した実施例である。
開口部のある繊維状基材1にメッキにて形成した導電回路2、9と、開口部のある導電回路3を形成し、下方の他の導電回路5と導電接続する上で、基材1に絡めてハンダにより導電接続したものである。4は図1と同様に絶縁層である。
さらに、導電回路2、3の形成されていない開口部のある繊維状基材6を介して、絶縁性固定剤で開口部を絡めて筐体19に固定した実施例である。
FIG. 2 shows an embodiment in which a multilayer circuit is fixed to the
Furthermore, in this embodiment, the openings are entangled with an insulating fixing agent via the
図3に示すものは、図1、図2において説明したものと同様に、多層導電回路を導電接続するもので、一部電子部品11を接続したり、切断部12を利用して、下方の導電回路5と導電接続した実施例である。
図4に示したものは、本発明の下方にある他の導電回路5に円柱15の、例えば銅メッキされた導電部に本発明の導電回路基板を導電接続した実施例である。
図5に示したものは、開口部を有する繊維状基材1に換えて、開口部を有するフィルム状基材の実施例である。
図6に示したものは、開口部を持つ繊維状基材1に開口部を有する導電回路3を形成し、その開口部を有する導電回路3を多層にした実施例である。
図7に示したものは、開口部を持つ繊維状基材1に開口部を有する導電回路3を形成し、その導電回路3を絶縁性固定剤で固定し、開口部のある回路を引き伸ばして開口部を菱型にすることで、回路延長16した実施例である。
図8に示したものは、金属ハトメ20により導電接続固定した実施例である。
As shown in FIGS. 1 and 2, the one shown in FIG. 3 is a conductive connection of a multilayer conductive circuit. A part of the
FIG. 4 shows an embodiment in which the conductive circuit board of the present invention is conductively connected to a conductive portion of a
What was shown in FIG. 5 is the Example of the film-form base material which has an opening part instead of the
FIG. 6 shows an embodiment in which a
In the structure shown in FIG. 7, a
FIG. 8 shows an embodiment in which the conductive connection is fixed by the
プリント基板等の導電回路基板とLSI等の接点部品との導電接合する基板であれば各種応用することができる。 Various substrates can be applied as long as they are conductively bonded to a conductive circuit board such as a printed circuit board and contact parts such as an LSI.
1・・・・開口部を有する繊維状基材
2・・・・メッキ等により形成した導電回路
3・・・・開口部のある導電回路
4・・・・絶縁層
5・・・・他の導電回路
6・・・・開口部のある繊維
7・・・・導電回路上の開口部
8・・・・開口部を有するフィルム状基材
9・・・・導電回路
10・・・・ハンダにより基材に絡めて形成した導電接続
11・・・・電子部品
12・・・・繊維状基材に形成した切断部
13・・・・導電回路の開口部に絡めて固定剤で固定した部分
14・・・・回路上の開口部にメッキを充填して導電円柱に接続した部分
15・・・・導電円柱
16・・・・引き伸ばした延長回路
17・・・・導電接着剤
18・・・・補助導電回路
19・・・・筐体
20・・・・金属ハトメ
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JP2010047203A JP5410338B2 (en) | 2010-03-03 | 2010-03-03 | Conductive connection method to upper and lower layers of conductive circuit board |
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JP5410338B2 true JP5410338B2 (en) | 2014-02-05 |
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JP6048719B2 (en) * | 2012-01-31 | 2016-12-21 | 住友電工プリントサーキット株式会社 | Printed wiring board and method for manufacturing the printed wiring board |
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JPS54159664A (en) * | 1978-06-07 | 1979-12-17 | Shin Kobe Electric Machinery | Method of producing printed circuit board |
JPH09275267A (en) * | 1996-04-03 | 1997-10-21 | Katsuya Hiroshige | Method for forming printed wiring sheet |
JP2001308540A (en) * | 2000-04-21 | 2001-11-02 | Shinko Electric Ind Co Ltd | Multilayer wiring board and method for manufacturing the same |
JP2004039455A (en) * | 2002-07-03 | 2004-02-05 | Seiji Kagawa | Metal deposition conductive thin film with conductive hole, and its manufacturing method and application |
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