JPH09275267A - Method for forming printed wiring sheet - Google Patents

Method for forming printed wiring sheet

Info

Publication number
JPH09275267A
JPH09275267A JP10631196A JP10631196A JPH09275267A JP H09275267 A JPH09275267 A JP H09275267A JP 10631196 A JP10631196 A JP 10631196A JP 10631196 A JP10631196 A JP 10631196A JP H09275267 A JPH09275267 A JP H09275267A
Authority
JP
Japan
Prior art keywords
pattern
mesh sheet
metal
plating resist
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10631196A
Other languages
Japanese (ja)
Inventor
Katsuya Hiroshige
勝也 広繁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP10631196A priority Critical patent/JPH09275267A/en
Publication of JPH09275267A publication Critical patent/JPH09275267A/en
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent an electrically conductive member from getting in a mesh sheet by a method wherein the mesh sheet woven from chemical fiber, metal fiber, or natural fiber is turned electrically conductive by electroless plating, plating resist is applied, a pattern is plated with megtal, and then the resist is separated off for the formation of a conductive pattern. SOLUTION: A mesh sheet 1 woven from chemical fiber such as polyester, nylon or the like, soluble fiber made from protein, or natural fiber such as silk or cotton is electrossly plated with metal, plating resist 3 is applied onto all the surface of the mesh sheet 1, a pattern is provided onto the plating resist 3, and the plating resist 3 is exposed to light and developed. The plating resist 3 is melted at a pattern 4 irradiated with no light, and the plating resist 3 is left unmelted on the residual part irradiated with light. Then, the mesh sheet 1 is electroplated with metal, whereby a conductive pattern 5 is formed on the pattern 4 of the mesh sheet 1 electrolessly plated with metal. When the resist 3 is separated off, a printed wiring sheet 6 provided with the conductive pattern 5 can be obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、各種繊維を編んだ
メッシュシート又は多孔性シートをベースにしたプリン
ト配線シートの成形方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a printed wiring sheet based on a mesh sheet or a porous sheet in which various fibers are knitted.

【0002】[0002]

【従来の技術】従来のプリント配線板は樹脂基板の表面
に薄い銅板を接着し、その表面に感光乳剤を塗布し、露
光・現像エッチングしてパターンを形成した。そして、
表裏面パターンを導通するためにドリルでパターン部分
に孔を開け内面にメッキを施して導通していた。
2. Description of the Related Art In a conventional printed wiring board, a thin copper plate is adhered to the surface of a resin substrate, a photosensitive emulsion is coated on the surface, and exposure / development etching is performed to form a pattern. And
In order to make the front and back patterns conductive, a hole was made in the pattern portion with a drill and plating was applied to the inner surface for conduction.

【0003】[0003]

【発明が解決しようとする課題】上記従来技術は樹脂基
板に接着した薄銅板が剥がれ易く、それを防止するため
接着剤を強固にすると導電性が悪くなり、又、ドリルで
孔を開けメッキして導通する作業が極めて面倒で時間を
要するという問題点があった。
In the above-mentioned prior art, the thin copper plate adhered to the resin substrate is easily peeled off, and if the adhesive is made strong to prevent it, the conductivity is deteriorated, and a hole is drilled for plating. There is a problem in that the work of conducting electricity is extremely troublesome and takes time.

【0004】[0004]

【課題を解決するための手段】本発明は上記問題点を解
決することを目的とし、化学繊維、金属繊維、天然繊維
等を編んだメッシュシート及び多孔性シート全面に無電
解メッキし、導通をとり、メッキレジストを形成し、パ
ターン部に金属メッキをし、レジストを剥離して導電性
パターンを形成する如くしたことを特徴とする。
SUMMARY OF THE INVENTION The present invention aims to solve the above problems, and electrolessly plating the entire surface of a mesh sheet or porous sheet woven with chemical fibers, metal fibers, natural fibers, etc. It is characterized in that a plating resist is formed, the pattern portion is metal-plated, and the resist is peeled off to form a conductive pattern.

【0005】[0005]

【発明の実施の形態】本発明の実施の形態を図示した実
施例に基づいて詳細に説明する。1はポリエステル・ナ
イロン等の化学繊維、蛋白質を原料とした溶解性繊維、
絹・木綿等の天然繊維を編んでシート状にしたメッシュ
シート、又は薄板にパンチングドリル・レーザー等で多
孔を形成した多孔性シートである。このメッシュシー
ト、多孔性シート全体を図2の如く無電解金属メッキ2
を施す。次いで図3の如く全面にメッキレジスト3を塗
布し、パターンを露光・現像する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described in detail with reference to the illustrated embodiments. 1 is a synthetic fiber such as polyester and nylon, a soluble fiber made from protein,
It is a mesh sheet formed by knitting natural fibers such as silk and cotton into a sheet shape, or a porous sheet in which a thin plate is perforated by a punching drill, laser or the like. As shown in Fig. 2, electroless metal plating 2
Give. Next, as shown in FIG. 3, the plating resist 3 is applied to the entire surface, and the pattern is exposed and developed.

【0006】光の当らなかったパターン部4はメッキレ
ジストが溶融し、光の当った部分にのみメッキレジスト
3が残る。次いで図6の如き装置により電気金属メッキ
をすると、図4の如くパターン部のメッシュシート、多
孔性シート1は無電解金属メッキされているので、その
上に更に電解金属メッキされ導電性パターン5が形成さ
れる。次いでメッキレジスト3を剥離し導電性パターン
5を有するプリント配線シート6が形成される。
In the pattern portion 4 which is not exposed to light, the plating resist is melted, and the plating resist 3 remains only in the exposed portion. Next, when electroplating is performed with an apparatus as shown in FIG. 6, since the mesh sheet and the porous sheet 1 of the pattern portion are electroless metal plated as shown in FIG. 4, the conductive pattern 5 is further electroplated with metal. It is formed. Then, the plating resist 3 is peeled off to form a printed wiring sheet 6 having a conductive pattern 5.

【0007】[0007]

【発明の効果】本発明によると、化学繊維、金属繊維、
天然繊維等を編んだメッシュシート及び多孔性シート全
面に無電解メッキし、導通をとり、メッキレジストを形
成し、パターン部に金属メッキをし、レジストを剥離し
て導電性パターンを形成する如くしているので、本発明
方法により形成されたプリント配線シートは、メッシュ
シート又は多孔性シートに電気導通性部材が入り込み離
れ難く強度な両面導通スイッチが得られ、数枚重合した
場合、従来のように孔開けしてメッキするような複雑な
手数を必要とせず、プリント配線シート自体が通気性な
ので図3の如く、孔の位置合せをして金属ペースト10
を埋め込めばよく極めて簡単である。又、本発明プリン
ト配線シートは柔軟であるので、従来のように配設場所
の形状に応じてプリント配線基板を形成する必要なく、
図4の如く配線場所の形状に応じて丸めて配線できるの
で配線のためのスペースも極めて少く配線が容易であ
る。
According to the present invention, chemical fibers, metal fibers,
The whole surface of the mesh sheet and porous sheet woven with natural fibers etc. is electrolessly plated to establish continuity, a plating resist is formed, the pattern part is metal-plated, and the resist is peeled off to form a conductive pattern. Therefore, the printed wiring sheet formed by the method of the present invention is a mesh sheet or porous sheet to obtain a strong double-sided conduction switch in which the electrically conductive member is difficult to enter and separate, and when several sheets are polymerized, as in the conventional case. Since the printed wiring sheet itself is breathable without requiring complicated steps such as drilling and plating, the holes are aligned and the metal paste 10 is formed as shown in FIG.
It is very easy if you embed. Further, since the printed wiring sheet of the present invention is flexible, it is not necessary to form the printed wiring board according to the shape of the installation place as in the conventional case,
As shown in FIG. 4, since the wiring can be rolled according to the shape of the wiring place, the space for wiring is extremely small and wiring is easy.

【0008】又、蛋白質繊維等の酸・アルカリ溶液で溶
ける繊維からなるメッシュ体を使用すれば、光透過を必
要とする部分の繊維を溶かすことができるので、ガラス
板に貼着するだけでパターンのガラス基板が形成でき、
ファックス等に用いると光透過性基板を簡単に製作でき
るという効果を有する。又、パターン以外の部分は通気
性があるので放熱性がよくプリント配線シートに取り付
けた部品を冷却し損傷を防止できる。又、メッシュシー
ト、多孔性シートなので液が通り抜けできるので図5の
如く片面からの電気接点で両面のメッキができる。又、
銅板を使用していないのでエッチングを使用する必要が
なく作業が簡単である。又、孔開け工程がなく、多層の
導通が金属ペーストの埋込みででき、又、導通ペースト
で多層の導通ができるので1000×2000mmとい
う大判サイズのプリント配線シートの製作が可能であ
る。
[0008] Further, if a mesh body made of fibers that can be dissolved in an acid / alkali solution such as protein fibers is used, the fibers in the portion that requires light transmission can be melted, so that the pattern can be obtained by simply sticking it on a glass plate. Glass substrate can be formed,
When used in a fax machine or the like, it has an effect that a light-transmissive substrate can be easily manufactured. Further, since the parts other than the pattern have air permeability, the heat dissipation is good and the parts attached to the printed wiring sheet can be cooled to prevent damage. Further, since it is a mesh sheet or a porous sheet, liquid can pass through it, so that both sides can be plated with an electric contact from one side as shown in FIG. or,
Since no copper plate is used, there is no need to use etching and the work is simple. Further, since there is no hole forming step, multi-layer conduction can be performed by embedding a metal paste, and since multi-layer conduction can be performed with the conduction paste, a large-sized printed wiring sheet of 1000 × 2000 mm can be manufactured.

【図面の簡単な説明】[Brief description of drawings]

【図1】メッシュシートの断面図である。FIG. 1 is a cross-sectional view of a mesh sheet.

【図2】図1のメッシュシート全面に無電解メッキを施
した断面図である。
FIG. 2 is a cross-sectional view in which electroless plating is performed on the entire surface of the mesh sheet of FIG.

【図3】図2にメッキレジストを塗布しパターンを露光
・現像した断面図である。
FIG. 3 is a cross-sectional view in which a plating resist is applied to FIG. 2 and a pattern is exposed and developed.

【図4】図3に電気金属メッキを施した断面図である。FIG. 4 is a sectional view of FIG. 3 with electro-metal plating.

【図5】図4のメッキレジストを剥離して形成したプリ
ント配線シート断面図である。
5 is a cross-sectional view of a printed wiring sheet formed by peeling off the plating resist of FIG.

【図6】図5の電気メッキを施す装置の要部切断正面図
である。
FIG. 6 is a front view of a main part of the apparatus for performing electroplating shown in FIG.

【符号の説明】[Explanation of symbols]

1 メッシュシート又は多孔性シート 2 無電解金属メッキ層 3 メッキレジスト層 4 パターン部 5 パターン部の電気金属メッキ層 6 プリント配線シート 1 mesh sheet or porous sheet 2 electroless metal plating layer 3 plating resist layer 4 pattern part 5 electro metal plating layer of pattern part 6 printed wiring sheet

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 化学繊維、金属繊維、天然繊維等を編ん
だメッシュシート及び多孔性シート全面に無電解メッキ
し、導通をとり、メッキレジストを形成し、パターン部
に金属メッキをし、レジストを剥離して導電性パターン
を形成する如くしたプリント配線シート成形方法。
1. A surface of a mesh sheet and a porous sheet woven of chemical fibers, metal fibers, natural fibers, etc. is electrolessly plated to establish conduction, a plating resist is formed, and a pattern portion is metal-plated to form a resist. A method for forming a printed wiring sheet, which comprises peeling to form a conductive pattern.
JP10631196A 1996-04-03 1996-04-03 Method for forming printed wiring sheet Pending JPH09275267A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10631196A JPH09275267A (en) 1996-04-03 1996-04-03 Method for forming printed wiring sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10631196A JPH09275267A (en) 1996-04-03 1996-04-03 Method for forming printed wiring sheet

Publications (1)

Publication Number Publication Date
JPH09275267A true JPH09275267A (en) 1997-10-21

Family

ID=14430453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10631196A Pending JPH09275267A (en) 1996-04-03 1996-04-03 Method for forming printed wiring sheet

Country Status (1)

Country Link
JP (1) JPH09275267A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6465742B1 (en) 1999-09-16 2002-10-15 Kabushiki Kaisha Toshiba Three dimensional structure and method of manufacturing the same
JP2002314208A (en) * 2001-04-18 2002-10-25 Asahi Kasei Corp Electronic component and its manufacturing method
JP2011181854A (en) * 2010-03-03 2011-09-15 Sagami Shokai:Kk Conductive connecting method to upper and lower layers of conductive circuit board
JP2022128555A (en) * 2021-02-23 2022-09-02 勝也 広繁 Conductive circuit board forming conductive connection by pressure welding and conductive connection method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6465742B1 (en) 1999-09-16 2002-10-15 Kabushiki Kaisha Toshiba Three dimensional structure and method of manufacturing the same
JP2002314208A (en) * 2001-04-18 2002-10-25 Asahi Kasei Corp Electronic component and its manufacturing method
JP2011181854A (en) * 2010-03-03 2011-09-15 Sagami Shokai:Kk Conductive connecting method to upper and lower layers of conductive circuit board
JP2022128555A (en) * 2021-02-23 2022-09-02 勝也 広繁 Conductive circuit board forming conductive connection by pressure welding and conductive connection method thereof

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