JPH09275268A - Method for forming printed wiring sheet - Google Patents
Method for forming printed wiring sheetInfo
- Publication number
- JPH09275268A JPH09275268A JP10631296A JP10631296A JPH09275268A JP H09275268 A JPH09275268 A JP H09275268A JP 10631296 A JP10631296 A JP 10631296A JP 10631296 A JP10631296 A JP 10631296A JP H09275268 A JPH09275268 A JP H09275268A
- Authority
- JP
- Japan
- Prior art keywords
- mesh sheet
- etching resist
- pattern
- sheet
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、各種繊維を編んだ
メッシュシート又は多孔性シートをベースにしたプリン
ト配線シートの成形方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a printed wiring sheet based on a mesh sheet or a porous sheet in which various fibers are knitted.
【0002】[0002]
【従来の技術】従来のプリント配線板は樹脂基板の表面
に薄い銅板を接着し、その表面に感光乳剤を塗布し、露
光・現像エッチングしてパターンを形成した。そして、
表裏面パターンを導通するためにドリルでパターン部分
に孔を開け内面にメッキを施して導通していた。2. Description of the Related Art In a conventional printed wiring board, a thin copper plate is adhered to the surface of a resin substrate, a photosensitive emulsion is coated on the surface, and exposure / development etching is performed to form a pattern. And
In order to make the front and back patterns conductive, a hole was made in the pattern portion with a drill and plating was applied to the inner surface for conduction.
【0003】[0003]
【発明が解決しようとする課題】上記従来技術は樹脂基
板に接着した薄銅板が剥がれ易く、それを防止するため
接着剤を強固にすると導電性が悪くなり、又、ドリルで
孔を開けメッキして導通する作業が極めて面倒で時間を
要するという問題点があった。In the above-mentioned prior art, the thin copper plate adhered to the resin substrate is easily peeled off, and if the adhesive is made strong to prevent it, the conductivity is deteriorated, and a hole is drilled for plating. There is a problem in that the work of conducting electricity is extremely troublesome and takes time.
【0004】[0004]
【課題を解決するための手段】本発明は上記問題点を解
決することを目的とし、化学繊維、金属繊維、天然繊維
等を編んだメッシュシート及び多孔性シートに無電解メ
ッキをし、導通をとり、全面に電気金属メッキをし、平
面なメッキ面にエッチングレジストを形成し、パターン
部以外のメッキを除去し、次いでエッチングレジストを
剥離して導電性パターンを形成する如くしたことを特徴
とする。SUMMARY OF THE INVENTION The present invention is intended to solve the above-mentioned problems, and electroless plating is applied to a mesh sheet and a porous sheet woven of chemical fibers, metal fibers, natural fibers, etc. to conduct electricity. It is characterized in that the entire surface is plated with electrometal, an etching resist is formed on a flat plated surface, plating other than the pattern portion is removed, and then the etching resist is peeled off to form a conductive pattern. .
【0005】[0005]
【発明の実施の形態】本発明の実施の形態を図示した実
施例に基づいて詳細に説明する。1はポリエステル・ナ
イロン等の化学繊維、蛋白質を原料とした溶解性繊維、
絹・木綿等の天然繊維を編んでシート状にしたメッシュ
シート、又は薄板にパンチングドリル・レーザー等で多
孔を形成した多孔性シートである。このメッシュシー
ト、多孔性シート1全体を図2の如く無電解メッキで金
属メッキ2を施す。次いで図6の如き装置により導通を
とり、図3の如く全面に電気銅メッキ3を施す。この平
らなメッキ面にエッチングレジスト4を塗布し、パター
ンを露光・現像して図4の如くエッチングを施し、パタ
ーン部以外の部分の金属メッキを溶解し、次いで図5の
如くエッチングレジスト4を剥離し、銅のパターン5を
有するプリント配線シート6を形成する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described in detail with reference to the illustrated embodiments. 1 is a synthetic fiber such as polyester and nylon, a soluble fiber made from protein,
It is a mesh sheet formed by knitting natural fibers such as silk and cotton into a sheet shape, or a porous sheet in which a thin plate is perforated by a punching drill, laser or the like. The entire mesh sheet and porous sheet 1 are plated with metal 2 by electroless plating as shown in FIG. Then, electrical continuity is established by an apparatus as shown in FIG. 6, and electrolytic copper plating 3 is applied to the entire surface as shown in FIG. Etching resist 4 is applied to this flat plated surface, the pattern is exposed and developed, and etching is performed as shown in FIG. 4 to dissolve the metal plating other than the pattern portion, and then the etching resist 4 is peeled off as shown in FIG. Then, the printed wiring sheet 6 having the copper pattern 5 is formed.
【0006】[0006]
【発明の効果】本発明によると、化学繊維、金属繊維、
天然繊維等を編んだメッシュシート及び多孔性シートに
無電解メッキをし、導通をとり、全面に電気金属メッキ
をし、平面なメッキ面にエッチングレジストを形成し、
パターン部以外のメッキを除去し、次いでエッチングレ
ジストを剥離して導電性パターンを形成する如くしてい
るので、本発明方法により形成されたプリント配線シー
トは、メッシュシート又は多孔性シートに電気導通性部
材が入り込み離れ難く強度な両面導通スイッチが得ら
れ、数枚重合した場合、従来のように孔開けしてメッキ
するような複雑な手数を必要とせず、プリント配線シー
ト自体が通気性なので、孔の位置合せをして金属ペース
ト10を埋め込めばよく極めて簡単である。又、本発明
プリント配線シートは柔軟であるので、従来のように配
設場所の形状に応じてプリント配線基板を形成する必要
なく、配線場所の形状に応じて丸めて配線できるので配
線のためのスペースも極めて少く配線が容易である。According to the present invention, chemical fibers, metal fibers,
Electroless plating is applied to a mesh sheet and porous sheet woven of natural fibers, etc. to establish continuity, electrometal plating is performed on the entire surface, and an etching resist is formed on a flat plated surface.
Since the plating except the pattern portion is removed and then the etching resist is peeled off to form a conductive pattern, the printed wiring sheet formed by the method of the present invention is electrically conductive to the mesh sheet or the porous sheet. A strong double-sided conduction switch is obtained in which the members do not easily enter and separate, and when several sheets are polymerized, there is no need for the complicated procedure of perforating and plating as in the past, and the printed wiring sheet itself is breathable, so It is extremely simple if the metal paste 10 is embedded by aligning the positions. Further, since the printed wiring sheet of the present invention is flexible, it is not necessary to form a printed wiring board according to the shape of the installation place as in the prior art, and the wiring can be rolled according to the shape of the wiring place. There is very little space and wiring is easy.
【0007】又、蛋白質繊維等の酸・アルカリ溶液で溶
ける繊維からなるメッシュ体を使用すれば、光透過を必
要とする部分の繊維を溶かすことができるので、ガラス
板に貼着するだけでパターンのガラス基板が形成でき、
ファックス等に用いると光透過性基板を簡単に製作でき
るという効果を有する。又、パターン以外の部分は通気
性があるので放熱性がよくプリント配線シートに取り付
けた部品を冷却し損傷を防止できる。又、メッシュシー
ト、多孔性シートなので液が通り抜けできるので図5の
如く片面からの電気接点で両面のメッキができる。又、
孔開け工程がなく、多層の導通が金属ペーストの埋込み
ででき、又、導通ペーストで多層の導通ができるので1
000×2000mmという大判サイズのプリント配線
シートの製作が可能である。Further, if a mesh body made of fibers such as protein fibers that can be dissolved in an acid / alkali solution is used, the fibers in the portion that requires light transmission can be melted, so that the pattern can be obtained by simply sticking it on a glass plate. Glass substrate can be formed,
When used in a fax machine or the like, it has an effect that a light-transmissive substrate can be easily manufactured. Further, since the parts other than the pattern have air permeability, the heat dissipation is good and the parts attached to the printed wiring sheet can be cooled to prevent damage. Further, since it is a mesh sheet or a porous sheet, liquid can pass through it, so that both sides can be plated with an electric contact from one side as shown in FIG. or,
Since there is no hole punching process, multi-layer conduction can be achieved by embedding a metal paste, and the conduction paste enables multi-layer conduction.
It is possible to produce a large size printed wiring sheet of 000 x 2000 mm.
【図1】メッシュシートの断面図である。FIG. 1 is a cross-sectional view of a mesh sheet.
【図2】図1のメッシュシートに無電解メッキを施した
断面図である。2 is a cross-sectional view of the mesh sheet of FIG. 1 with electroless plating.
【図3】図2のメッキシートに電気金属メッキを施した
断面図である。FIG. 3 is a cross-sectional view of the plated sheet of FIG. 2 plated with an electric metal.
【図4】図3にエッチングレジストを塗布し、パターン
を露光・現像した断面図である。FIG. 4 is a cross-sectional view in which an etching resist is applied to FIG. 3 and a pattern is exposed and developed.
【図5】図4のエッチングレジストを剥離したプリント
配線シート断面図である。5 is a cross-sectional view of the printed wiring sheet from which the etching resist of FIG. 4 has been peeled off.
【図6】図3の電気金属メッキを施す装置の要部切断正
面図である。FIG. 6 is a cutaway front view of an essential part of the apparatus for applying the electrometal plating of FIG.
1 メッシュシート又は多孔性シート 2 無電解メッキ層 3 電気銅メッキ層 4 エッチングレジスト 5 銅パターン 6 プリント配線シート 1 mesh sheet or porous sheet 2 electroless plating layer 3 electrolytic copper plating layer 4 etching resist 5 copper pattern 6 printed wiring sheet
Claims (1)
だメッシュシート及び多孔性シートに無電解メッキを
し、導通をとり、全面に電気金属メッキをし、平面なメ
ッキ面にエッチングレジストを形成し、パターン部以外
のメッキを除去し、次いでエッチングレジストを剥離し
て導電性パターンを形成する如くしたプリント配線シー
ト成形方法。1. A mesh sheet and a porous sheet woven of chemical fibers, metal fibers, natural fibers, etc. are electrolessly plated to establish continuity, electroplating is performed on the entire surface, and an etching resist is applied to a flat plated surface. A method for forming a printed wiring sheet, which comprises forming and removing plating other than the pattern portion, and then removing the etching resist to form a conductive pattern.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10631296A JPH09275268A (en) | 1996-04-03 | 1996-04-03 | Method for forming printed wiring sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10631296A JPH09275268A (en) | 1996-04-03 | 1996-04-03 | Method for forming printed wiring sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH09275268A true JPH09275268A (en) | 1997-10-21 |
Family
ID=14430479
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10631296A Pending JPH09275268A (en) | 1996-04-03 | 1996-04-03 | Method for forming printed wiring sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH09275268A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6465742B1 (en) | 1999-09-16 | 2002-10-15 | Kabushiki Kaisha Toshiba | Three dimensional structure and method of manufacturing the same |
-
1996
- 1996-04-03 JP JP10631296A patent/JPH09275268A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6465742B1 (en) | 1999-09-16 | 2002-10-15 | Kabushiki Kaisha Toshiba | Three dimensional structure and method of manufacturing the same |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR20040075595A (en) | Method for manufacturing double side a flexible printed circuit board | |
KR20120007909A (en) | Printed wiring board manufacturing method | |
JPH09275267A (en) | Method for forming printed wiring sheet | |
KR101201948B1 (en) | The printed circuit board manufacturing method | |
JPH09275268A (en) | Method for forming printed wiring sheet | |
JPH09283877A (en) | Printed conducting sheet | |
KR101241070B1 (en) | The printed circuit board manufacturing method | |
CN108697009B (en) | Method for manufacturing printed circuit board and printed circuit board | |
JP2006140216A (en) | Double-sided circuit board and its manufacturing method | |
JP4137279B2 (en) | Printed wiring board and manufacturing method thereof | |
CN210042390U (en) | Double-sided flexible circuit board of upper and lower layers of conductive silver paste | |
US3532801A (en) | Method and apparatus for fabricating laminated circuit boards | |
JPH05299816A (en) | Manufacture of wiring board | |
JPH09307216A (en) | Manufacture of wiring board, and wiring board | |
JP4350922B2 (en) | Manufacturing method of double-sided flexible circuit board | |
JPH09283897A (en) | Bonding method of conductor board of printed board and the like and multicontact component of lsi and the like | |
JP4150464B2 (en) | Two-metal tape carrier package and its manufacturing method | |
CA2177708A1 (en) | Method of making a printed circuit board | |
JP3826651B2 (en) | Wiring board manufacturing method | |
JPH0194695A (en) | Manufacture of conductive circuit board | |
JP2000156557A (en) | Manufacture of wiring member | |
JPH10190183A (en) | Manufacture of printed circuit board having plated resistor | |
JPS62156898A (en) | Manufacture of through-hole printed wiring board | |
EP0365169A1 (en) | Method of producing a printed wiring board | |
JPH0296389A (en) | Double-side printed circuit board |