JPH0296389A - Double-side printed circuit board - Google Patents
Double-side printed circuit boardInfo
- Publication number
- JPH0296389A JPH0296389A JP24742588A JP24742588A JPH0296389A JP H0296389 A JPH0296389 A JP H0296389A JP 24742588 A JP24742588 A JP 24742588A JP 24742588 A JP24742588 A JP 24742588A JP H0296389 A JPH0296389 A JP H0296389A
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- conductive paste
- double
- onto
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 230000000149 penetrating effect Effects 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 18
- 239000011889 copper foil Substances 0.000 abstract description 13
- 238000007747 plating Methods 0.000 abstract description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052802 copper Inorganic materials 0.000 abstract description 5
- 239000010949 copper Substances 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 229910052759 nickel Inorganic materials 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000007650 screen-printing Methods 0.000 abstract description 2
- 238000007493 shaping process Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005253 cladding Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、両面プリント回路基板に関するものである。[Detailed description of the invention] [Industrial application field] The present invention relates to double-sided printed circuit boards.
従来の両面プリント回路基板は、絶縁シート（フィルム
状のもの及び板状のものを含む）の両面に銅箔による回
路パターンを形成したものが一般的である。この両面プ
リント回路基板は、絶縁シートの両面に張り付けた銅箔
をパターンエツチングすることにより形成されるが、両
面の回路パターンの導通は、導通させる部分に穴をあけ
、その穴の内面に銅めっきを施して、いわゆるスルーホ
ールを形成することにより得ている。Conventional double-sided printed circuit boards generally have copper foil circuit patterns formed on both sides of an insulating sheet (including film-like and plate-like ones). This double-sided printed circuit board is formed by pattern-etching copper foil pasted on both sides of an insulating sheet, but the conductivity of the circuit patterns on both sides is achieved by drilling holes in the areas to be conductive and copper plating the inner surface of the holes. This is obtained by forming a so-called through hole.
しかし従来の両面プリント回路基板は、その材料である
両面銅張り基板自体が高価である上、スルーホールを形
成するのに穴内面の無電解めっきと、その後の電気めっ
きが必要であり、湿式多工程を経るため製造コストが高
くつく欠点がある。However, with conventional double-sided printed circuit boards, the double-sided copper-clad board itself, which is the material for the double-sided printed circuit board, is expensive, and forming through-holes requires electroless plating on the inner surface of the hole, followed by electroplating, and requires wet multilayer plating. The disadvantage is that the manufacturing cost is high because of the process involved.
本発明は、上記のような従来技術の問題点にルみ、安価
な両面プリント回路基板を提供するもので、その構成は
、絶縁シートの一方の面に金属箔による回路パターンが
形成され、他方の面に導電ペーストによる回路パターン
が形成され、両面の回路パターンは上記絶縁シートおよ
び金属箔を貫通する穴に導電ペーストを詰めて形成した
スルースタッドにより導通しており、上記導電ペースト
による回路パターンの表面には金属めっきが施されてい
ることを特徴とする。The present invention takes into consideration the problems of the prior art as described above and provides an inexpensive double-sided printed circuit board, which has a structure in which a circuit pattern made of metal foil is formed on one side of an insulating sheet, and a circuit pattern made of metal foil is formed on the other side of an insulating sheet. A circuit pattern made of conductive paste is formed on the surface of the board, and the circuit patterns on both sides are electrically connected by through studs formed by filling holes penetrating the insulating sheet and metal foil with conductive paste. It is characterized by metal plating on the surface.
つまり本発明においては、金属箔による回路パターンは
絶縁シートの一方の面だけとし、他方の面は導電ペース
トにより回路パターンを形成することにより、安価な片
面金属箔張付は基板を使用できるようにした。また両面
の回路パターンは、貫通穴に導電ペーストを詰めてスル
ースタッドを形成することにより導通させ、乾式処理に
より簡単に両面導通部が形成できるようにした。さらに
導電ペースト回路パターンの表面には金属めっきを施し
て、金属箔回路パターンと同等の半田付は性をもたせて
いる。In other words, in the present invention, the circuit pattern made of metal foil is formed on only one side of the insulating sheet, and the circuit pattern is formed on the other side with conductive paste, thereby making it possible to use a substrate with inexpensive single-sided metal foil pasting. did. In addition, the circuit patterns on both sides are made conductive by filling the through holes with conductive paste to form through studs, making it possible to easily form conductive parts on both sides by dry processing. Furthermore, the surface of the conductive paste circuit pattern is plated with metal, giving it the same solderability as a metal foil circuit pattern.
以下、本発明の実施例を図面を参照して詳細に説明する
。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
図−１は本発明の一実施例に係る両面プリント回路基板
の要部を示す断面図である。図において、１は厚さ５０
μｍ程度のポリエチレンテレフタレートフィルム等から
なる絶縁フィルムであり、この絶縁フィルムｌの一方の
面には接着剤２を介して厚さ１８〜３５μｍ程度の銅箔
による回路パターン３が形成されており、他方の面には
導電ペースト（銅ペーストが好ましい）による回路パタ
ーン４が形成されている１両面の回路パターン３・４は
、絶縁フィルム１および銅箔回路パターン３を貫通する
穴に導電ペーストを詰めて形成したスルースタッド５に
より導通させである。また導電ペースト回路パターン４
の表面には銅またはニッケル等のめっき６が施されてい
る。FIG. 1 is a sectional view showing essential parts of a double-sided printed circuit board according to an embodiment of the present invention. In the figure, 1 is the thickness of 50
It is an insulating film made of polyethylene terephthalate film or the like with a thickness of about 18 to 35 μm, and a circuit pattern 3 made of copper foil with a thickness of about 18 to 35 μm is formed on one side of the insulating film 1 via an adhesive 2, and on the other side. A circuit pattern 4 made of conductive paste (preferably copper paste) is formed on the surface of the circuit pattern 3 and 4 on both sides. The formed through stud 5 provides electrical continuity. Also conductive paste circuit pattern 4
A plating 6 of copper, nickel, etc. is applied to the surface of the plate.
このような両面プリント回路基板は次のようにして製造
することができる。Such a double-sided printed circuit board can be manufactured as follows.
まず図−２に示すように、絶縁フィルム１の片面に接着
剤２により銅箔３ａを張り付けてなる片面銅張り基板を
用い、両面の回路パターンを導通させる箇所に穴９を形
成する。First, as shown in FIG. 2, a single-sided copper-clad board made of an insulating film 1 and a copper foil 3a pasted on one side with an adhesive 2 is used, and holes 9 are formed at locations where the circuit patterns on both sides are to be electrically conductive.
次いで穴９内に図−３に示すように導電ペーストを詰め
てスルースタッド５を形成する。Next, as shown in FIG. 3, the holes 9 are filled with conductive paste to form the through studs 5.
次いで図−４に示すように絶縁フィルム】の他方の面に
導電ペーストをスクリーン印刷して回路パターン４を形
成すると共に、Ｒｆｆ３３ａ側の面にマスキングフィル
ム１０をラミネートする。そしてこの状態で銅箔３ａを
陰極として電気めっきを行い、導電ペースト回路パター
ン４・の表面に銅またはニッケル等の金属めっき６を形
成する。金属めっき６は電気めっきにより形成できるた
め極めて効率的である。Next, as shown in FIG. 4, a conductive paste is screen printed on the other surface of the insulating film to form a circuit pattern 4, and a masking film 10 is laminated on the surface on the Rff 33a side. In this state, electroplating is performed using the copper foil 3a as a cathode to form a metal plating 6 of copper or nickel on the surface of the conductive paste circuit pattern 4. The metal plating 6 can be formed by electroplating, which is extremely efficient.
その後、マスキングフィルム１０を剥離し、その面に図
−５に示すようにエツチングレジスト１１をパターン印
刷した後、銅箔３ａをエツチングし、ｗ４箔回路パター
ン３を形成する。このあと、エツチングレジスト１１を
除去すれば図−１のような両面プリント回路基板が得ら
れる。Thereafter, the masking film 10 is peeled off, and an etching resist 11 is pattern-printed on the surface as shown in FIG. 5, and then the copper foil 3a is etched to form a W4 foil circuit pattern 3. Thereafter, by removing the etching resist 11, a double-sided printed circuit board as shown in FIG. 1 is obtained.
なお図−４の段階で、マスキングフィルムの代わりに図
−６に示すようにめっきレジスト１２をパターン印刷し
、銅箔３ａの露出部分に耐エツチング性を有する金属め
っきにニッケル、半田など）１３を施した後、めっきレ
ジスト１２を剥離し、エツチングを行えば、図−７に示
すように銅箔回路パターン３およびスルースタッド５の
表面に金属めっき１３が施された両面プリント回路基板
を得ることができる。この金属めっき１３は図示のよう
にスルースタッド５の表面からその周囲の銅箔回路パタ
ーン３の表面に跨がるように形成することが好ましく、
このようにすれば、銅箔回路パターン３とスルースタッ
ド５との電気的導通状態がより安定する。In the step shown in Fig. 4, a plating resist 12 is pattern-printed as shown in Fig. 6 instead of the masking film, and the exposed portion of the copper foil 3a is coated with etching-resistant metal plating (nickel, solder, etc.) 13. After applying, by peeling off the plating resist 12 and performing etching, it is possible to obtain a double-sided printed circuit board in which the metal plating 13 is applied to the surfaces of the copper foil circuit pattern 3 and the through studs 5, as shown in FIG. can. This metal plating 13 is preferably formed so as to span from the surface of the through stud 5 to the surface of the surrounding copper foil circuit pattern 3, as shown in the figure.
In this way, the electrical continuity between the copper foil circuit pattern 3 and the through stud 5 becomes more stable.
以上説明したように本発明によれば、金属箔による回路
パターンは絶縁シートの片面だけに形成されているので
、安価な片面金属箔張付は基板を使用することができ、
また他方の面の回路パターンと両面導通部は導電ペース
トにより形成されているので、通常のスクリーン印刷と
加熱により簡単に低コストで形成することができる。さ
らに導電ペースト回路パターンの表面には金属めっきが
施されているので、半田付は性も良好である。したがっ
て全体として安価で、半田付は性も従来の両面プリント
回路基板と同等の両面プリント回路基板が得られる利点
がある。As explained above, according to the present invention, the circuit pattern made of metal foil is formed only on one side of the insulating sheet, so a substrate can be used for inexpensive single-sided metal foil cladding.
Further, since the circuit pattern on the other side and the double-sided conductive portion are formed of conductive paste, they can be easily formed at low cost by ordinary screen printing and heating. Furthermore, since the surface of the conductive paste circuit pattern is metal plated, it has good soldering properties. Therefore, there is an advantage that a double-sided printed circuit board can be obtained which is inexpensive overall and has the same soldering properties as conventional double-sided printed circuit boards.
図−１は本発明の一実施例に係る両面プリント回路基板
の要部を示す断面図、図−２ないし図−５は同回路基板
を製造する方法の一例を工程順に示す断面図、図−６な
いし図−７は本発明に係る両面プリント回路基板を製造
する方法の他の例を示す断面図である。
１：絶縁フィルム、２：接着剤、３：銅箔回路パターン
、４：導電ペースト回路パターン、５ニスルースタツド
、６：金属めっき。
５スルースタツド
図−４FIG. 1 is a cross-sectional view showing essential parts of a double-sided printed circuit board according to an embodiment of the present invention, and FIGS. 6 to 7 are cross-sectional views showing other examples of the method for manufacturing a double-sided printed circuit board according to the present invention. 1: Insulating film, 2: Adhesive, 3: Copper foil circuit pattern, 4: Conductive paste circuit pattern, 5: Varnish stud, 6: Metal plating. 5-through stud diagram-4
Claims (1)
ンが形成され、他方の面に導電ペーストによる回路パタ
ーンが形成され、両面の回路パターンは上記絶縁シート
および金属箔を貫通する穴に導電ペーストを詰めて形成
したスルースタッドにより導通しており、上記導電ペー
ストによる回路パターンの表面には金属めっきが施され
ていることを特徴とする両面プリント回路基板。1. A circuit pattern made of metal foil is formed on one side of the insulating sheet, a circuit pattern made of conductive paste is formed on the other side, and the circuit pattern on both sides is formed by filling the holes penetrating the insulating sheet and metal foil with conductive paste. A double-sided printed circuit board, characterized in that the formed through studs provide electrical continuity, and the surface of the circuit pattern made of the conductive paste is plated with metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24742588A JPH0296389A (en) | 1988-10-03 | 1988-10-03 | Double-side printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24742588A JPH0296389A (en) | 1988-10-03 | 1988-10-03 | Double-side printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0296389A true JPH0296389A (en) | 1990-04-09 |
Family
ID=17163247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24742588A Pending JPH0296389A (en) | 1988-10-03 | 1988-10-03 | Double-side printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0296389A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5106593A (en) * | 1989-12-22 | 1992-04-21 | Shin-Etsu Handotai Co., Ltd. | Apparatus for producing czochralski-grown single crystals |
| WO2002052908A1 (en) * | 2000-12-22 | 2002-07-04 | Hitachi Chemical Co., Ltd. | Printed wiring board and method of manufacturing the same |
| KR20020088593A (en) * | 2001-05-18 | 2002-11-29 | 주식회사 씨엠이 | Process for preparing printed circuit board by using conductive paste composition |
-
1988
- 1988-10-03 JP JP24742588A patent/JPH0296389A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5106593A (en) * | 1989-12-22 | 1992-04-21 | Shin-Etsu Handotai Co., Ltd. | Apparatus for producing czochralski-grown single crystals |
| WO2002052908A1 (en) * | 2000-12-22 | 2002-07-04 | Hitachi Chemical Co., Ltd. | Printed wiring board and method of manufacturing the same |
| KR20020088593A (en) * | 2001-05-18 | 2002-11-29 | 주식회사 씨엠이 | Process for preparing printed circuit board by using conductive paste composition |
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