JP5377588B2 - Conductive circuit board with openings - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that a circuit is peeled when a conductive circuit is formed with a film material as a base material in a conventional technique. <P>SOLUTION: A conductive circuit 4 is integrally formed by growth of plating on a fibrous substrate 1 having an opening 2 which is made from woven cloth or nonwoven cloth or on the flat surface of a porous sheet containing many both-surface penetrating fine holes 3, while the conductive circuit 4 is entangled with a gap 2 of the fibrous substrate 1 or the penetrating fine holes 3 of the porous sheet. Dislocation of intersection of the fibrous substrate 1 caused by expansion/contraction action due to expansion/contraction deformation of the fibrous substrate 1 or the porous sheet, or deformation of the holes 3 of the porous sheet are utilized to form an opening 10 on a circuit at the same time with the gap 2 or the opening 3 of the fibrous substrate 1 or the porous sheet. <P>COPYRIGHT: (C)2013,JPO&amp;INPIT

Description

  The present invention relates to a fibrous base material having an opening so as to couple and conduct contact parts such as an LSI, and a conductive circuit board having an opening for forming a conductive circuit on a porous sheet and conducting conductive connection using the conductive circuit. Is.

  As a conventional technique, in a method of joining a conductive substrate such as a printed circuit board and a multi-contact part such as LSI, LSI is applied to a mesh sheet knitted with chemical fiber, metal fiber, natural fiber, etc. A conductive sheet is formed by providing a conductive part that penetrates the joint part of a multi-contact part such as a conductive pattern of a conductive substrate such as a printed circuit board on both front and back surfaces, and the conductive sheet is formed on the conductive substrate and the LSI. A method of joining a conductive substrate such as a printed circuit board and a multi-contact component such as an LSI (for example, a patent) Reference 1) exists.

Japanese Patent No. 2841045 (refer to the paragraphs {0005} to {0008} of {DETAILED DESCRIPTION OF THE INVENTION} in the column of “Claims” and “Detailed Description of the Invention” and FIGS. 1 to 3)

However, in recent years, electronic devices have been reduced in size, and printed circuit boards are required to be thin and flexible conductive circuit boards, as represented by mobile phones, digital cameras, and personal computers.
That is, there is a need for a circuit board that is lighter in electronic equipment, thinner, lighter, and more resistant to bending. That is, there is a need for a flexible circuit board that eliminates circuit peeling from a substrate and can be freely bent at a wide range of angles.
Furthermore, an opening that penetrates both the base material and the circuit board is formed.Using this opening, heat dissipation performance is improved, and the circuit is entangled with the opening of the base material that has a light lighting function. If it is mounted, it will be a strong mounting and an elastic circuit can be realized.
By using this method to make the projections of the meshes on the surface of the circuit and plating the noble metal only on the projections, the amount of noble metal used can be reduced. A double-sided through hole with an opening is used, one side is used as a noble metal contact circuit on a plane, and the other side is used as a conductive circuit.
Further, interlayer conductive connection for forming a double-sided circuit and a multilayer circuit on a printed circuit board is currently made by forming holes in the printed circuit board, plating the holes, and connecting the conductive circuits of each layer by plating. This causes plating cracks and deposition defects, which is a problem for a conductive circuit board.
The present invention provides a conductive circuit board having an opening that solves these problems.

A first invention of the present invention capable of achieving the above object is a conductive circuit board having an opening as described in claim 1, and is as follows.
By plating grown on the front surface of the porous sheet having a woven fabric or fibrous substrate having an opening comprising a non-woven fabric, or multiple sided through micropores, the conductive circuit of the fibrous substrate gap or of perforated sheet, by forming integrally twine into the through micropores, is configured to have the opening in the conductive circuit itself formed on the conductive circuit on the plating grows.

A second invention of the present invention capable of achieving the above object is a conductive circuit board having an opening as described in claim 2, and is as follows.
In addition to the invention of claim 1, prior Symbol opening on the front surface of the porous sheet having a woven fabric or fibrous substrate having an opening comprising a non-woven fabric, or multiple sided through fine holes or through-fine, A conductive circuit having an opening formed integrally with a hole, and other contacts and electronic components are conductively connected. Further , there is no conductive circuit , and other fibrous base material or porous sheet opening. In addition, other contact points and electronic components are connected and fixed by being entangled with the gaps and holes of the fibrous base material or the porous sheet.

A third invention of the present invention capable of achieving the above object is a conductive circuit board having an opening as defined in claim 3 and is as follows.
In addition to the invention described in claim 1 , a part of the conductive circuit is left, an insulating layer is formed, and another conductive circuit is formed by plating on both sides so as to cover the insulating layer. In this configuration, a conductive portion is formed for conducting the conductive circuit with another conductive circuit formed on both surfaces thereof.

A fourth invention of the present invention capable of achieving the above object is a conductive circuit board having an opening as described in claim 4, and is as follows.
The conductive circuit board having an opening according to claim 1, wherein the conductive circuit having the opening is partially cut together with the fibrous base material or the porous sheet to form the fibrous base material or the porous sheet. In this configuration, a three-dimensional circuit is formed by three-dimensionally overlapping a conductive circuit having an opening with other contacts and electronic components.

A fifth invention of the present invention capable of achieving the above object is a conductive circuit board having an opening as described in claim 5, and is as follows.
The conductive circuit according to any one of claims 1 to 4, wherein the opening is used as a fixing reinforcing frame for holding and fixing the conductive circuit board formed by being entangled with the gap or hole of the fibrous base material or the porous sheet. This is a configuration in which a reinforcing frame is formed so as to surround the conductive circuit with four sides .

Since the conductive circuit board according to the present invention has the configuration as described above, the following effects can be obtained.
(1) A conductive circuit is formed by entangled with a fibrous base material having an opening made of woven or non-woven fabric, or an opening of a porous sheet having a large number of through holes on both sides, that is, a gap or a through hole in the porous sheet. Therefore, the circuit is very unlikely to be peeled off as compared with the case where a conductive circuit is formed on a simple film material.
(2) Since the base material is a fibrous base material having an opening, or a porous sheet having double-sided through-holes, it has flexibility, followability and flexibility, so that the range of use of the conductive circuit board is widened. is there.
(3) Since the base of the conductive circuit board has an opening when the conductive circuit board is connected to a component or the like, connected to circuits or other types of circuits, or connected with solder, Since the connection is formed by being entangled with the opening of the base material, it can be connected strongly.
(4) Since the substrate has an opening, the contact area with air is large, and the heat dissipation is excellent.
(5) Since an opening is formed in a conductive circuit formed by entwining a conductive circuit using an opening of a transparent fibrous base material or a transparent perforated sheet, it is also applied to a solar cell so that the circuit can be illuminated. Condensation function is enhanced because of passing.
(6) When connecting a conductive circuit formed on a substrate and another conductive circuit, even when plating is used, connection plating and each conductive circuit are all entangled through the opening of the substrate, so that it is strong. Close contact connection is possible.

The state which formed the conductive circuit with an opening part along the opening part of a base material in the base material which has an opening part which is the 1st Example of this invention is shown, (a) is a schematic plan view, (b) FIG. 2 is an enlarged schematic front sectional view taken along line AA in FIG. Conductive circuit in which an anisotropic conductive circuit is formed so that a conductive circuit such as a contact can be formed on both the front and back surfaces of the substrate according to the second embodiment of the present invention and used as a flexible contact for inspection. It is a schematic front sectional view showing a substrate. By dividing the conductive circuit according to the third embodiment of the present invention, it is possible to increase the surface area, cope with a large current, and further increase the contact surface with the air. It is a front sectional view. In a conductive circuit board according to a fourth embodiment of the present invention, an electrode of a solar cell capable of transmitting light is formed using an opening of a base material and an opening of a conductive circuit, and the electrodes are provided facing each other. It is a general | schematic front sectional view which shows the conductive circuit board which can be. 5 is a conductive circuit board on which a frame (frame for holding and fixing a circuit board) is formed according to a fifth embodiment of the present invention, in which (a) is a plastic frame and is a schematic front section showing a state in which a BGA solder ball is in conductive contact Figure, (b) is a schematic front sectional view showing a state where the solder is melted and conductively connected so as to be entangled with the opening of the substrate, (c) is a frame formed by plating, and the contact is plated by the substrate. It is a general | schematic front sectional view which shows the state which is formed in the front and back, and contacts an upper and lower contact by expansion-contraction of the opening part of a base material. It is a schematic explanatory drawing which shows the state which formed the opening part in the conductive circuit through the opening part of the base material which is the 6th Example of this invention, and also formed the cutting part. It is a schematic explanatory drawing which shows the state which connects another metal member, ie, a conductive member, using an opening part to the conductive circuit board which is the 7th Example of this invention. FIG. 5C shows a modification of FIG. 5C in the fifth embodiment of the present invention, where FIG. 5A is a schematic plan view, and FIG. 5B is a schematic front view cut along the line BB in FIG. It is sectional drawing. Eighth Embodiment der Ru one aspect of the present invention, the conductive circuit having openings for example on the upper surface, the other surface is an Overview Once the perspective view shows the state of forming another conductive circuit, for example on the lower surface. It is a general | schematic front sectional view which shows the state which provides an insulating layer in a part of base material of the electrically conductive circuit board which has an opening part which is 9th Example of this invention, and forms an electrically conductive circuit so that this insulating layer may be covered. It is a schematic perspective view which shows the conductive circuit board which employ | adopted the porous sheet which has many double-sided through-holes which are the base materials which are the 10th Example of this invention.

By plating grown on the front surface of the porous sheet having a woven fabric or fibrous substrate having an opening comprising a non-woven fabric, or multiple sided through micropores, the conductive circuit of the fibrous substrate gap or of perforated sheet, by forming integrally twine into the through micropores is a conductive circuit board with openings have a opening in the conductive circuit itself formed on the conductive circuit on the plating grows.

In general, a woven fabric and a non-woven fabric are considered as the fibrous base material, and as the material, chemical fibers such as glass fiber and polyester, carbon fiber, imide film, polyester film and the like are employed. Also, a porous sheet having a large number of fine holes penetrating both sides can be employed.
The conductive circuit 4 is formed by forming the fibrous base material 1 having the openings 2 and the openings 2 of the fibrous base material on the porous sheet having a large number of double-sided through-holes 3, that is, the gaps of the base material 1. Alternatively, it is possible to adopt a method in which plating is grown so as to be entangled with the base material 1 through the fine holes 3 of the porous sheet and the conductive circuit 4 having the opening 10 is formed.
In addition, the conductive connection of parts includes solder connection, ultrasonic metal connection, pressure welding, plating connection, connection with conductive paste, connection with conductive adhesive, fixed connection with metal eyelet, screw connection Conductive connection is possible by press-contacting the contacts with silver or tin plating and diffusion bonding.

The strength of the spring, which is the elastic force of the fibrous base material 1 made of woven fabric or non-woven fabric, is selected by the fiber thickness, diameter and material of the fibrous base material 1 and the size of the opening, that is, the mesh size. To do.
Conventionally, the contact bumps and the conductive circuit are formed on a single mesh with a single cloth, so that the conductive circuit hinders the spring property of the cloth. The material of this embodiment focuses on elasticity, can improve the contact with the object to be inspected, and the wiring circuit can form a conductive circuit with a separate material.
As shown in FIGS. 1 and 11, a conductive substrate is formed by growing a plating on the plane of a fibrous base material 1 having an opening 2 made of a woven fabric or a non-woven fabric, or a porous sheet having many double-sided through-holes 3. Intersection of the fibrous base material 1 formed by entangled with the gap 2 of the fibrous base material 1 or the through micropores 3 of the porous sheet and stretched by the elastic deformation of the fibrous base material 1 or the porous sheet Of the fibrous base material 1 or the opening of the gap 2 and the fine hole 3 of the porous sheet and the opening 10 formed on the circuit using the displacement of the fine hole 3 of the porous sheet. A conductive circuit is entangled with the openings 2 or the fine holes 3 on the plane of the circuit board, the fibrous base material 1 having the openings 2 made of a woven fabric or a non-woven fabric, or a porous sheet having a large number of double-sided through-holes 3. It said conductive circuit has been formed integrally with Te Min or forming the opening 10, the fibrous base material 1 does not exist other than that of the conductive circuit or the porous sheet of the opening of the fine holes 3, the fibrous base material 1 and another contact or electronic components, or porous, The conductive circuit board according to claim 1, wherein the conductive circuit board shown in Fig. 2 is connected and fixed alternately on the front and back of the base material 1 such as a fiber. By forming 4, the conductive circuit board having high flexibility and good flexibility performance combined with the opening 10. As shown in FIG. 7, a fibrous base material 1 made of a woven fabric or a non-woven fabric, or a conductive circuit having openings of fine holes 3 on the plane of the porous sheet, a gap 2 of the fibrous base material 1, and fine holes 3 of the porous sheet. A conductive circuit board in which a protruding portion 7 is formed by entwining a resin in a conductive circuit having the opening 10 and the protruding portion 7 formed by entanglement with the resin is covered with metal plating, As shown in FIG. 3, the present invention increases the surface area by dividing the conductive circuit, can be a large current circuit, and further has a large contact surface with air, so that a circuit with a high heat dissipation effect can be obtained. .
As shown in FIG. 4, by using the opening 2 of the base material 1 and the opening 10 of the conductive circuit 4 in the conductive circuit board, the solar cell electrode is formed on one side when used for the solar cell. By forming the other electrode so as to face each other, light can be transmitted using the opening, and the conductive circuit board can be applied to the solar cell.
Further, as shown in FIG. 5, in the conductive circuit according to claims 1 to 4, (a) is an example in which the opening 2 is electrically connected to another electronic member or the like by soldering. (B) uses the base material 1 having the opening 2 to form a conductive circuit 4, covers the conductive circuit 4 with a resin as an insulating layer 9, and performs plating to cover the resin, It is an Example which carries out conductive connection with an electronic component. (C) is for a conductive circuit having an opening 10 as a reinforcing frame 8 for holding and fixing the conductive circuit board formed by entwining the fibrous base material 1 or the gap 2 and the fine hole 3 of the porous sheet. The conductive circuit board having the reinforcing frame 8 formed so as to surround from the four sides, the one shown in FIG. 6 is further cut into the opening 10 of the conductive circuit 4 formed around the opening 2 of the fibrous base material 1 6 is an embodiment in which the cutting portion 6 is conductively connected to another member, for example, the contact 5. 7 is replaced with the contact 5 shown in FIG. 6 by using the cut portion of the notch 6 to insert another metal member having the protruding portion 7 into the notch 6 so that the conductive connection with the other members is achieved. This is an example. FIG. 8 shows an embodiment in which the periphery of the conductive circuit board shown in FIG. 5C is reinforced and fixed by a reinforcing frame 8 (frame). As shown in FIG. 9, the conductive circuit having the opening 2 is formed on the upper surface of the base material 1 made of woven fabric, nonwoven fabric or porous sheet, and the other circuit (especially the opening 2 is formed on the lower surface). Part of the conductive circuit having the opening 10 formed through the gap 2 and the hole 3 of the fibrous base material 1 or the porous sheet as shown in FIG. An insulating layer 9 is formed on the surface, and another conductive circuit 4 is formed by plating on both sides so as to cover the insulating layer 9, and the other conductive circuits formed on both sides are electrically connected to the conductive circuit. Therefore, it is possible to obtain a conductive circuit board provided in a conductive circuit having a conductive portion for the purpose.
FIG. 11 shows an embodiment in which a porous sheet having a large number of double-sided through-holes 3 as a base material is employed, and a conductive circuit 4 having an opening is formed by being entangled with the fine holes 3.
In the present invention, a circuit 4 and a contact 5 can be formed as a prepreg as an upper and lower interlayer connection with a fibrous base material 1 having a single opening 2, thereby forming separate circuits on the upper and lower surfaces. In addition, by forming the opening 2 of the base material 1 also on the circuit, a more flexible circuit, and by cutting and removing the fibers of the opening 10 on the circuit, other members can be connected and three-dimensional. By making the shape, the contact with the contact can be improved.
The conductive circuit board of the present invention can be used in what is called a component-embedded board in which a plurality of layers of conductive circuit boards are stacked, a space for storing components is provided between the stacks, and components are inserted into the space.
In addition, using both sides as contacts, electrical inspection of a fine circuit as an anisotropic conductive circuit as shown in FIG. 2, and use of an opening as shown in FIG. 6 as a connecting part for conductively connecting other members Used as
The conductive circuit 4 formed on the fibrous base material 1 having the opening 2 made of woven fabric or nonwoven fabric or on the porous sheet having a large number of double-sided through-holes 3 is mainly formed by plating. Of course, it can also be formed by an etching method or a transfer method.
Further, since the plating is grown simultaneously on both sides of the porous sheet with a large number of fine pores on both sides, the growth on both sides is achieved on both sides than the plating growth on one side in the conventional plating. Thick copper can be formed on a thick copper circuit board of micron to 500 micron with a plating time halved (for example, 200 micron plating can provide a thickness of 400 microns on both sides). By using the opening as a through hole, a thick copper substrate that does not require drilling can be obtained.
Furthermore, the woven fabric employs a fabric formed by weaving fibers having a thickness of 20 to 200 microns, or arranged into a nonwoven fabric. Further, weaving by changing the material and shape of warp and weft may be considered. In addition, the main type of plating is copper plating, but it is also possible to form a circuit by nickel, tin, silver / gold plating.

  Various substrates can be applied as long as they are conductively bonded to a conductive circuit board such as a printed circuit board and contact parts such as an LSI.

1... Base material 2... Opening (gap) of base material
3 ... Fine hole 4 ... Conductive circuit 5 ... Contact 6 ... Cut 7 ... Projection 8 ... Reinforcement frame (frame)
9 ... Insulating layer 10 ... Opening of conductive circuit

Claims (5)

By plating grown on the front surface of the porous sheet having a woven fabric or fibrous substrate having an opening comprising a non-woven fabric, or multiple sided through micropores, the conductive circuit of the fibrous substrate gap or of perforated sheet, by forming twine into the through micropores integrally, electrically conductive circuit board having an opening portion, characterized in that said plating has closed an opening in the conductive circuit itself is formed on the conductive circuit grown. Fibrous substrate having an opening formed of a woven or nonwoven fabric, or multiple sided through fine pre Symbol opening on the front surface of the porous sheet having pores or through micropores entwined with integrally formed with openings, Conductive connection between a conductive circuit having a portion and another contact or electronic component, and another contact or electronic component is formed in a fibrous form in an opening of another fibrous base material or porous sheet that does not have a conductive circuit. 2. The conductive circuit board with an opening according to claim 1, wherein the conductive circuit board is connected and fixed by being entangled with a gap or a hole of the base material or the porous sheet . A part of the conductive circuit is left, an insulating layer is formed, and another conductive circuit is formed by plating on both sides so as to cover the insulating layer, and the other conductive circuit formed on both sides The conductive circuit board with an opening according to claim 1, wherein a conductive portion is formed for conducting the conductive circuit and the conductive circuit. The conductive circuit board having an opening according to claim 1, wherein the conductive circuit having the opening is partially cut together with the fibrous base material or the porous sheet to form the fibrous base material or the porous sheet. A conductive circuit board having an opening, wherein a three-dimensional circuit is formed by three-dimensionally overlapping a conductive circuit having an opening with another contact and electronic components. The conductive circuit according to any one of claims 1 to 4, wherein the opening is used as a fixing reinforcing frame for holding and fixing the conductive circuit board formed by being entangled with the gap or hole of the fibrous base material or the porous sheet. A conductive circuit board having an opening, wherein a reinforcing frame is formed so as to surround the conductive circuit with four sides .

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