JP4163098B2 - Electromagnetic shield type flexible circuit board - Google Patents

Electromagnetic shield type flexible circuit board Download PDF

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Publication number
JP4163098B2
JP4163098B2 JP2003427432A JP2003427432A JP4163098B2 JP 4163098 B2 JP4163098 B2 JP 4163098B2 JP 2003427432 A JP2003427432 A JP 2003427432A JP 2003427432 A JP2003427432 A JP 2003427432A JP 4163098 B2 JP4163098 B2 JP 4163098B2
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Prior art keywords
circuit board
flexible circuit
electromagnetic shield
type flexible
shield type
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JP2005191076A (en
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智 真 也 越
友 聡 住
野 容 史 星
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Nippon Mektron KK
Panasonic Corp
Panasonic Holdings Corp
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Nippon Mektron KK
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2003427432A priority Critical patent/JP4163098B2/en
Priority to KR1020040095738A priority patent/KR100698496B1/en
Priority to TW093138433A priority patent/TW200522858A/en
Priority to CNB2004100816868A priority patent/CN1330227C/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

本発明は、可撓性回路基板の少なくとも一方の面にシールド材を配装してなる、所謂、電磁シールド型可撓性回路基板に関するものであり、より詳細には、シールド材のシールド層と可撓性回路基板のグランド回路部分との電気的接続を安定的に保つ構造に関する。   The present invention relates to a so-called electromagnetic shield type flexible circuit board in which a shield material is arranged on at least one surface of a flexible circuit board, and more specifically, a shield layer of a shield material and The present invention relates to a structure that stably maintains electrical connection with a ground circuit portion of a flexible circuit board.

従来、小型電子機器においては、配線の自由度の高さと基板の薄さなどから可撓性回路基板が多用されている。そして近年、携帯電話やデジタル・ビデオカメラ、デジタル・スチルカメラなどの携帯型小型電子機器においては、高機能化・高性能化が進み、可撓性回路基板の配線密度が高くなる一方、信号の高周波化や部品搭載の高密度化に伴って、可撓性回路基板を電磁シールドすることの要求が多くなってきている。   Conventionally, in a small electronic device, a flexible circuit board is frequently used because of the high degree of freedom of wiring and the thinness of the board. In recent years, in portable small electronic devices such as mobile phones, digital video cameras, and digital still cameras, higher functionality and higher performance have advanced, and the wiring density of flexible circuit boards has increased, while signal As the frequency increases and the density of component mounting increases, there is an increasing demand for electromagnetic shielding of the flexible circuit board.

図５は、従来の電磁シールド型可撓性回路基板の断面構造を示している。この回路基板は、一表面に回路導体１(信号回路１ａ、グランド回路１ｂ)が設けられたベース材２(ベースフィルム２ａ、ベース接着剤層２ｂ)に、回路導体１を保護する表面保護絶縁材層３(可撓性絶縁フィルム３ａ、接着剤層３ｂ)およびシールド材４(可撓性絶縁フィルム４ａ、シールド層４ｂ、導電性接着材層４ｃ)が積層されている。   FIG. 5 shows a cross-sectional structure of a conventional electromagnetic shield type flexible circuit board. This circuit board has a surface protective insulating material for protecting the circuit conductor 1 on a base material 2 (base film 2a, base adhesive layer 2b) provided with a circuit conductor 1 (signal circuit 1a, ground circuit 1b) on one surface. Layer 3 (flexible insulating film 3a, adhesive layer 3b) and shield material 4 (flexible insulating film 4a, shield layer 4b, conductive adhesive layer 4c) are laminated.

そして、表面保護絶縁材層３には接続穴５が設けられており、この接続穴５にシールド材４の導電性接着剤を充填し加圧しながら加熱すると導電性接着剤層が形成される。この導電性接着剤層が、回路導体１のグランド回路部分とシールド材４との導通性を確保している。   The surface protective insulating material layer 3 is provided with a connection hole 5. When the connection hole 5 is filled with the conductive adhesive of the shield material 4 and heated while being pressed, a conductive adhesive layer is formed. This conductive adhesive layer ensures the conductivity between the ground circuit portion of the circuit conductor 1 and the shield material 4.

特許文献１には、この種の導電性接着剤付シールド材を使用した可撓性回路基板が記載されている。
特開平07-122882号公報 Patent Document 1 describes a flexible circuit board using a shield material with this type of conductive adhesive.
Japanese Unexamined Patent Publication No. 07-122882

このような電磁シールド型可撓性回路基板においては、導電性接着剤付シールド材の導電性接着剤が吸湿している場合等においては、回路部品実装の際のリフロー工程において、導電性接着剤や絶縁ベース材、その他構成部材が吸湿した水分、および構成部材間の各種接着剤層に残留する微量な有機溶剤等の揮発成分が、加熱によって気泡６となり、図６に示すように、可撓性回路基板のグランド回路部分とシールド層とを剥離させるという不具合を生じる事がある。   In such an electromagnetic shield type flexible circuit board, when the conductive adhesive of the shielding material with the conductive adhesive absorbs moisture, the conductive adhesive is used in the reflow process when mounting the circuit components. And insulating base material, moisture absorbed by other constituent members, and volatile components such as trace amounts of organic solvent remaining in various adhesive layers between the constituent members become bubbles 6 by heating, and as shown in FIG. May cause a problem that the ground circuit portion of the conductive circuit board and the shield layer are peeled off.

また、図示されていないが、必要に応じて適宜採用されるグランド回路１bの上面のめっき皮膜に吸着されて残留する、微量なめっき液に配合される有機成分等からも過熱によりガスが発生して気泡となり、上記同様に可撓性回路基板のグランド回路部分とシールド層とを剥離させるという不具合を生じる事がある。   Although not shown in the figure, gas is also generated by overheating from organic components blended in a very small amount of the plating solution that remains adsorbed on the plating film on the upper surface of the ground circuit 1b that is appropriately adopted as necessary. In the same manner as described above, the ground circuit portion of the flexible circuit board and the shield layer may be peeled off.

このような剥離が生じると、可撓性回路基板のグランド回路部分とシールド層との導通抵抗を増加させ、更には、これら両者間の電気的導通を破壊させ、安定的なシールド性能を維持できなくなるという問題を生じる。   When such peeling occurs, the conduction resistance between the ground circuit portion of the flexible circuit board and the shield layer is increased, and further, the electrical conduction between the two is destroyed, and stable shielding performance can be maintained. The problem of disappearing.

本発明は上述の点を考慮してなされたもので、回路導体のグランド回路部分とシールド層との接続を安定かつ確実に維持することができる電磁シールド型可撓性回路基板を提供することを目的とする。   The present invention has been made in view of the above points, and provides an electromagnetic shield type flexible circuit board capable of stably and reliably maintaining the connection between the ground circuit portion of the circuit conductor and the shield layer. Objective.

上記目的達成のため、本発明では、
可撓性回路基板における回路導体上に保護絶縁材層が設けられ、この保護絶縁材層上にシールド材が設けられ、前記回路導体におけるグランド回路部分と前記シールド材とが、前記保護絶縁材層に設けられて導電性接着剤が充填された接続穴により接続されてなる電磁シールド型可撓性回路基板において、
前記接続穴に、外気に連通しており前記導電性接着剤と前記グランド回路部分との境界部分を外気に曝す通気穴が設けられたことを特徴とする電磁シールド型可撓性回路基板、
を提供する。 In order to achieve the above object, in the present invention,
A protective insulating material layer is provided on a circuit conductor in the flexible circuit board, a shield material is provided on the protective insulating material layer, and the ground circuit portion and the shielding material in the circuit conductor are provided in the protective insulating material layer. In the electromagnetic shield type flexible circuit board connected to the connecting hole filled with the conductive adhesive provided in
An electromagnetic shield type flexible circuit board, wherein the connection hole is provided with a vent hole communicating with outside air and exposing a boundary portion between the conductive adhesive and the ground circuit portion to the outside air,
I will provide a.

ここで、シールド材は、耐熱性プラスチックフィルムの表面に金属薄膜からなるシールド層を有し、このシールド層に導電性接着剤層が積層された積層体として構成されてもよい。   Here, the shield material may have a shield layer made of a metal thin film on the surface of the heat resistant plastic film, and may be configured as a laminate in which a conductive adhesive layer is laminated on the shield layer.

また、通気穴は、導電性接着剤付シールド材に形成されている構成、可撓性回路基板に形成されている構成、導電性接着剤付シールド材および可撓性回路基板双方の対応する位置に形成されている構成の何れでもよく、更に、平面位置は、保護絶縁材層に形成された接続穴の開口内に含まれる構成、保護絶縁材層に形成された接続穴の一部に掛かる切断面を有する構成の何れでもよく、これら各構成を適宜組み合わせて用いる事ができる。   Also, the vents are configured in the shield material with conductive adhesive, the configuration formed in the flexible circuit board, and the corresponding positions of both the shield material with conductive adhesive and the flexible circuit board. In addition, the planar position depends on the configuration included in the opening of the connection hole formed in the protective insulating material layer and a part of the connection hole formed in the protective insulating material layer. Any structure having a cut surface may be used, and these structures can be used in appropriate combination.

本発明によれば、保護絶縁材層に通気穴が設けられているため、保護絶縁材層を実装する際のリフロー工程において発生する気体を外部に開放して気泡の発生を防止できる。このため、可撓性回路基板のグランド回路部分とシールド層との剥離を防止でき、シールド性能を安定的に維持する電磁シールド型可撓性回路基板を提供することができる。   According to the present invention, since the vent hole is provided in the protective insulating material layer, the gas generated in the reflow process when the protective insulating material layer is mounted can be released to the outside to prevent the generation of bubbles. For this reason, peeling between the ground circuit portion of the flexible circuit board and the shield layer can be prevented, and an electromagnetic shield type flexible circuit board that maintains stable shielding performance can be provided.

以下、図１ないし図４を参照して本発明の実施の形態を説明する。   Hereinafter, embodiments of the present invention will be described with reference to FIGS.

図１は、本発明の第１の実施例を示す電磁シールド型可撓性回路基板の概念的断面構成図であり、一表面に回路導体１が設けられたベース材２上に、回路導体１を保護する保護絶縁材層３が設けられ、さらにシールド材４が積層されている。そして、保護絶縁材層３には、回路導体１に達する接続穴５が設けられている。   FIG. 1 is a conceptual cross-sectional configuration diagram of an electromagnetic shield type flexible circuit board showing a first embodiment of the present invention. A circuit conductor 1 is formed on a base material 2 provided with a circuit conductor 1 on one surface. A protective insulating material layer 3 is provided, and a shield material 4 is further laminated. The protective insulating material layer 3 is provided with a connection hole 5 that reaches the circuit conductor 1.

この実施例においては、ポリイミドフィルム等の可撓性絶縁ベースフィルム２ａとベース接着剤層２ｂとからなるベース材２上に、銅箔に対するエッチング処理によって形成された信号回路１ａとグランド回路１ｂとからなる回路導体１を有すると共に、信号回路１ａおよびグランド回路１ｂの上面には、グランド回路１ｂに達する接続穴５を持った保護絶縁材層３が設けられている。保護絶縁材層３は、ポリイミド等の可撓性絶縁フィルム３ａが接着剤層３ｂで接着されて形成されている。   In this embodiment, a signal circuit 1a and a ground circuit 1b formed by etching a copper foil on a base material 2 made of a flexible insulating base film 2a such as a polyimide film and a base adhesive layer 2b. A protective insulating material layer 3 having a connection hole 5 reaching the ground circuit 1b is provided on the upper surfaces of the signal circuit 1a and the ground circuit 1b. The protective insulating material layer 3 is formed by bonding a flexible insulating film 3a such as polyimide with an adhesive layer 3b.

更に、保護絶縁材層３の上面には、ポリイミドフィルムやポリフェニレンサルファイドフィルム等の可撓性絶縁フィルム４ａの一表面に、アルミニウム、銅又は銀等の金属をスパッタ法や蒸着法等の既知の薄膜形成手法で形成された金属薄膜からなる導電シールド層４ｂが形成され、更に導電性シールド層４ｂの表面には、金属やカーボンなどの導電性フィラーを含有する接着性樹脂で構成される導電性接着剤層４ｃが形成されてなるシールド材４が接着される。これにより、可撓性回路基板に形成されたグランド回路層１ｂおよび導電シールド層４ｂが、接続穴５に充填された導電性接着剤４ｃにより電気的に接続される。   Furthermore, on the upper surface of the protective insulating material layer 3, a known thin film such as a sputtering method or a vapor deposition method is used on one surface of a flexible insulating film 4a such as a polyimide film or a polyphenylene sulfide film, and a metal such as aluminum, copper or silver. A conductive shield layer 4b made of a metal thin film formed by the forming method is formed, and a conductive bond composed of an adhesive resin containing a conductive filler such as metal or carbon is further formed on the surface of the conductive shield layer 4b. The shield material 4 formed with the agent layer 4c is bonded. As a result, the ground circuit layer 1 b and the conductive shield layer 4 b formed on the flexible circuit board are electrically connected by the conductive adhesive 4 c filled in the connection holes 5.

そして、このグランド回路層１ｂと導電シールド層４ｂとを電気的に導通している接続穴５には、この部位に位置する全構成部材を貫通して外気に連通する通気穴Ｈが形成されている。   The connection hole 5 that electrically connects the ground circuit layer 1b and the conductive shield layer 4b is formed with a vent hole H that penetrates all the constituent members located at this portion and communicates with the outside air. Yes.

このような構成の電磁シールド型可撓性回路基板は、回路部品搭載時のリフロー工程において発生する気体を、通気穴Ｈを通じて外部に放出する事ができるので、グランド回路層１ｂ上に気泡を生じる事が無く、グランド回路層１ｂとシールド層４ｂとの剥離を引き起こす事が無くなる。   Since the electromagnetic shield type flexible circuit board having such a configuration can release the gas generated in the reflow process at the time of circuit component mounting to the outside through the vent hole H, bubbles are generated on the ground circuit layer 1b. There is nothing, and the ground circuit layer 1b and the shield layer 4b are not peeled off.

このような構成の電磁シールド型可撓性回路基板は、次のような工程により得ることができる。まず、グランド回路１ｂの一部が露出するように接続穴５が形成された表面保護絶縁材層３を有する可撓性回路基板を用意する。次いで、保護絶縁材層３上から、グランド回路１ｂ上に、接続穴５を覆うように導電性接着剤付のシールド材４を接着する。そして、金型による打ち抜き加工や、ドリル加工等の通常の加工手法により、ベース材２、回路導体１、保護絶縁材層３およびシールド材４を貫通するように通気穴Ｈを形成する。   The electromagnetic shield type flexible circuit board having such a configuration can be obtained by the following process. First, a flexible circuit board having a surface protective insulating material layer 3 in which connection holes 5 are formed so that a part of the ground circuit 1b is exposed is prepared. Next, the shield material 4 with a conductive adhesive is bonded from the protective insulating material layer 3 to the ground circuit 1 b so as to cover the connection hole 5. Then, the vent hole H is formed so as to penetrate the base material 2, the circuit conductor 1, the protective insulating material layer 3, and the shield material 4 by a normal processing technique such as punching with a mold or drilling.

本発明における可撓性回路基板のグランド回路１b上面には、図示していないが、必要に応じて適宜めっき皮膜が形成される。以後の実施例においても同様である。   Although not shown, a plating film is appropriately formed on the upper surface of the ground circuit 1b of the flexible circuit board according to the present invention. The same applies to the following embodiments.

図２は、本発明の第２の実施例を示す概念的な断面構成図である。この実施例においては、前記実施例１と異なり、通気穴Ｈは、導電性接着剤付のシールド材４の側のみに形成されている。このような構成においても、回路部品搭載時のリフロー工程において発生する気体を、通気穴Ｈを通じて外部に放出する事ができるので、グランド回路層１ｂの上に気泡を生じる事が無い。   FIG. 2 is a conceptual cross-sectional configuration diagram showing a second embodiment of the present invention. In this embodiment, unlike the first embodiment, the vent hole H is formed only on the side of the shield material 4 with the conductive adhesive. Even in such a configuration, the gas generated in the reflow process when the circuit component is mounted can be released to the outside through the vent hole H, so that no bubbles are generated on the ground circuit layer 1b.

また、このような構成を得るためには、予め通気穴Ｈが形成された導電性接着剤付のシールド材４を接着する工程が採用されるが、その接着の際、導電性接着剤４ｃが、通気穴Ｈ内に流れ出してこれを一部塞ぐ構成となっても通気穴Ｈの機能が損なわれるものではない。そして、前述と同様に、回路部品搭載時のリフロー工程において発生する気体を、通気穴Ｈを通じて外部に放出する事ができるので気泡の発生と剥離を防止することができる。   Further, in order to obtain such a configuration, a process of adhering the shield material 4 with the conductive adhesive in which the vent holes H are formed in advance is adopted. In the bonding, the conductive adhesive 4c is used. The function of the vent hole H is not impaired even if it is configured to flow into the vent hole H and partially block it. As described above, since the gas generated in the reflow process when the circuit component is mounted can be discharged to the outside through the vent hole H, the generation and separation of bubbles can be prevented.

図３は、本発明の第３の実施例を示す概念的な断面構成図である。この実施例では、前記実施例１，２と異なり、通気穴Ｈがベース材２側つまり可撓性回路基板を構成する絶縁ベース材２、グランド回路１ｂおよびグランド回路層１ｂに形成されている。   FIG. 3 is a conceptual cross-sectional view showing a third embodiment of the present invention. In this embodiment, unlike the first and second embodiments, the vent holes H are formed on the base material 2 side, that is, the insulating base material 2 constituting the flexible circuit board, the ground circuit 1b and the ground circuit layer 1b.

このような構成においても、回路部品搭載時のリフロー工程において発生する気体を、通気穴Ｈを通じて外部に放出する事ができるので、グランド回路層１ｂ上に気泡を生じる事が無い。   Even in such a configuration, the gas generated in the reflow process when the circuit component is mounted can be discharged to the outside through the vent hole H, so that no bubbles are generated on the ground circuit layer 1b.

また、このような構成を得るためには、例えば、予め通気穴Ｈが形成された可撓性回路基板に導電性接着剤付シールド材４を接着する工程が採用される。その接着の際、導電性接着剤４ｃが、通気穴Ｈ内に流れ出してこれを一部塞ぐ構成となっても、回路部品搭載時のリフロー工程において発生する気体を、通気穴Ｈを通じて外部に放出する事ができるので、気泡の発生と剥離を防止できる事は前述の通りである。   In order to obtain such a configuration, for example, a process of adhering the shield material 4 with the conductive adhesive to the flexible circuit board in which the vent holes H are previously formed is employed. At the time of bonding, even if the conductive adhesive 4c flows into the vent hole H and partially closes it, the gas generated in the reflow process when mounting circuit components is released to the outside through the vent hole H. As described above, the generation and separation of bubbles can be prevented.

前記実施例１乃至３に示した、導電性接着剤４ｃに発生する気体を放出するための通気穴Ｈは、前述の通り、ドリル加工による他、型による打ち抜き加工等の手法も適宜採用可能であって、この型による打ち抜き手法によれば、通気穴Ｈの断面形状は円に限られず、長円、楕円、矩形、多角形等を適宜採用できる。   As described above, the vent hole H for releasing the gas generated in the conductive adhesive 4c shown in the first to third embodiments can be appropriately employed not only by drilling but also by a die punching method. Thus, according to the punching method using this mold, the cross-sectional shape of the vent hole H is not limited to a circle, and an oval, an ellipse, a rectangle, a polygon, or the like can be appropriately employed.

また、実施例１ないし３においては、通気穴Ｈは保護絶縁材層３に形成された接続穴５の開口内に含まれる穴であるが、保護絶縁材層３に形成された接続穴５の一部に掛かる切断面を有するように構成しても、回路部品搭載時のリフロー工程において発生する気体を外部に放出することができて、気泡の発生と剥離を防止できる。 Further, in Examples 1 to 3 , the vent hole H is a hole included in the opening of the connection hole 5 formed in the protective insulating material layer 3, but the connection hole 5 formed in the protective insulating material layer 3 Even if it is configured to have a partly cut surface, the gas generated in the reflow process when the circuit component is mounted can be released to the outside, and the generation and separation of bubbles can be prevented.

図４(a),(b)は、本発明の実施例４を示す平面図、及び図４(a)のＡ−Ａ線に沿って切断した概略断面図である。   4 (a) and 4 (b) are a plan view showing Example 4 of the present invention and a schematic cross-sectional view cut along the line AA in FIG. 4 (a).

この実施例においては、図４(a)に示すように、保護絶縁材層３に形成された接続穴５に一部が掛かるように、長円形状の通気穴ＬＨが形成されている。ここでは、図４(b)に示すように、全層を切り欠いた構成例を示してあるが、前記実施例２，３に示した構成と同様に、導電性接着剤付のシールド材に長円形状の通気穴を形成する事、及び可撓性回路基板に長円形状の通気穴を形成する事もまた、同様に採用可能である。   In this embodiment, as shown in FIG. 4A, an oval vent hole LH is formed so that a part of the connection hole 5 is formed in the protective insulating material layer 3. Here, as shown in FIG. 4 (b), a configuration example in which all layers are cut out is shown. However, in the same manner as the configurations shown in Examples 2 and 3, the shield material with a conductive adhesive is used. It is also possible to form an oval vent hole and to form an oval vent hole in the flexible circuit board.

そして、この実施例においては、回路部品搭載時のリフロー工程において発生する気体を、接続穴５に掛かる切断面Ｃから、回路部品搭載時のリフロー工程において発生する気体を外部に放出する事ができて、気泡の発生と剥離を防止することができる。   In this embodiment, the gas generated in the reflow process when the circuit component is mounted can be released from the cut surface C applied to the connection hole 5 to the outside. Thus, the generation and separation of bubbles can be prevented.

図４においては、長円形状に打ち抜いた構成例を示しているが、切断面Ｃは可撓性回路基板の製品外形打ち抜き端面であっても、図４の実施例と同様の効果を奏する。   Although FIG. 4 shows a configuration example punched into an oval shape, the same effect as the embodiment of FIG. 4 can be obtained even if the cut surface C is a product outer shape punching end surface of a flexible circuit board.

また、前記実施例１ないし４においては、信号回路１ａやグランド回路１ｂと、可撓性絶縁ベースフィルム２ａとの間にベース接着剤層２ｂを有する構成が示されているが、ベース接着剤層２ｂを用いない、所謂、無接着剤型銅張積層板を用いて構成する事もできる。   In the first to fourth embodiments, the base adhesive layer 2b is shown between the signal circuit 1a and the ground circuit 1b and the flexible insulating base film 2a. It is also possible to use a so-called non-adhesive copper-clad laminate without using 2b.

更に、信号回路１ａやグランド回路１ｂを可撓性絶縁ベースフィルム２ａの両面に有する、所謂、両面型可撓性回路基板においても、上記各実施例と同様に適宜採用する事が可能であるのみならず、多層回路基板においても、同様に採用可能である。   Further, in the so-called double-sided flexible circuit board having the signal circuit 1a and the ground circuit 1b on both surfaces of the flexible insulating base film 2a, it is only possible to adopt the same as in the above embodiments. However, it can be similarly applied to a multilayer circuit board.

(産業上の利用可能性)
本発明による可撓性回路基板は、近年、多数消費されている携帯電話において、液晶表示部の基板と操作テンキー部の本体基板とを接続するヒンジ部位の可撓性回路基板に使用して基板の不具合原因の低減に寄与することができる。また、デジタル・ビデオカメラやデジタル・スチルカメラにおいても、ＣＣＤカメラ素子半導体と機器制御部の本体基板とを接続する可撓性回路基板に使用して基板の不具合原因の低減に寄与することができる。 (Industrial applicability)
The flexible circuit board according to the present invention is used as a flexible circuit board at a hinge portion for connecting a liquid crystal display board and a main board of an operation numeric keypad in a mobile phone which has been consumed in large numbers in recent years. It is possible to contribute to the reduction of the cause of defects. Also in digital video cameras and digital still cameras, it can be used as a flexible circuit board that connects the CCD camera element semiconductor and the main body board of the device control unit, thereby contributing to a reduction in the causes of board defects. .

本発明の実施例１を示す概念的な断面構成図。1 is a conceptual cross-sectional configuration diagram illustrating Example 1 of the present invention. 本発明の実施例２を示す概念的な断面構成図。The conceptual cross-sectional block diagram which shows Example 2 of this invention. 本発明の実施例３を示す概念的な断面構成図。The conceptual cross-sectional block diagram which shows Example 3 of this invention. 本発明の実施例４を示す概念的な断面構成図。The conceptual cross-sectional block diagram which shows Example 4 of this invention. 従来の電磁シールド型可撓性回路基板を示す概念的な断面構成図。The conceptual cross-sectional block diagram which shows the conventional electromagnetic shielding type flexible circuit board. 従来の電磁シールド型可撓性回路基板のリフロー実施後を示す概念的な断面構成図。The conceptual cross-section block diagram which shows after reflow implementation of the conventional electromagnetic shielding type flexible circuit board.

符号の説明Explanation of symbols

１ 回路導体
１ａ 信号回路
１ｂ グランド回路
２ ベース材
２ａ ベースフィルム
２ｂ ベース接着剤層
３ 保護絶縁材層
３ａ 可撓性絶縁フィルム
３ｂ 接着剤層
４ シールド材
４ａ 可撓性絶縁フィルム
４ｂ シールド層
４ｃ 導電性接着剤層
５ 接続穴
６ 気泡
Ｈ 通気穴
ＬＨ 長穴
Ｃ 切断面 DESCRIPTION OF SYMBOLS 1 Circuit conductor 1a Signal circuit 1b Ground circuit 2 Base material 2a Base film 2b Base adhesive layer 3 Protective insulating material layer 3a Flexible insulating film 3b Adhesive layer 4 Shielding material 4a Flexible insulating film 4b Shield layer 4c Conductivity Adhesive layer 5 Connection hole 6 Air bubble H Vent hole LH Long hole C Cut surface

Claims (8)

可撓性回路基板における回路導体上に保護絶縁材層が設けられ、この保護絶縁材層上にシールド材が設けられ、前記回路導体におけるグランド回路部分と前記シールド材とが、前記保護絶縁材層に設けられて導電性接着剤が充填された接続穴により接続されてなる電磁シールド型可撓性回路基板において、
前記接続穴に、外気に連通しており前記導電性接着剤と前記グランド回路部分との境界部分を外気に曝す通気穴が設けられたことを特徴とする電磁シールド型可撓性回路基板。 A protective insulating material layer is provided on a circuit conductor in the flexible circuit board, a shield material is provided on the protective insulating material layer, and a ground circuit portion and the shielding material in the circuit conductor are provided in the protective insulating material layer. In the electromagnetic shield type flexible circuit board that is connected to the connecting hole filled with the conductive adhesive provided in
An electromagnetic shield type flexible circuit board, wherein the connection hole is provided with a vent hole communicating with the outside air and exposing a boundary portion between the conductive adhesive and the ground circuit portion to the outside air. 請求項１記載の電磁シールド型可撓性回路基板において、
前記シールド材は、耐熱性プラスチックフィルムと、このフィルムの少なくとも一表面に設けられた金属薄膜と、この金属薄膜上に積層された導電性接着剤層との積層体として形成されることを特徴とする電磁シールド型可撓性回路基板。 The electromagnetic shield type flexible circuit board according to claim 1,
The shield material is formed as a laminate of a heat-resistant plastic film, a metal thin film provided on at least one surface of the film, and a conductive adhesive layer laminated on the metal thin film. Electromagnetic shield type flexible circuit board. 請求項２記載の電磁シールド型可撓性回路基板において、
前記積層体は、前記導電性接着剤層に前記通気穴が予め形成されたものであることを特徴とする電磁シールド型可撓性回路基板。 In the electromagnetic shield type flexible circuit board according to claim 2,
The electromagnetic shield type flexible circuit board, wherein the laminated body is one in which the vent hole is previously formed in the conductive adhesive layer. 請求項１記載の電磁シールド型可撓性回路基板において、
前記通気穴は、前記可撓性回路基板に形成されていることを特徴とする電磁シールド型可撓性回路基板。 The electromagnetic shield type flexible circuit board according to claim 1,
The electromagnetic shield type flexible circuit board, wherein the vent hole is formed in the flexible circuit board. 請求項１記載の電磁シールド型可撓性回路基板において、
前記通気穴は、前記導電性接着剤層および前記可撓性回路基板における前記回路導体を挟んで対応する位置に設けられたことを特徴とする電磁シールド型可撓性回路基板。 The electromagnetic shield type flexible circuit board according to claim 1,
The electromagnetic shield type flexible circuit board, wherein the vent hole is provided at a position corresponding to the circuit conductor in the conductive adhesive layer and the flexible circuit board. 請求項１記載の電磁シールド型可撓性回路基板において、
前記通気穴は、前記接続穴内に位置することを特徴とする電磁シールド型可撓性回路基板。 The electromagnetic shield type flexible circuit board according to claim 1,
The electromagnetic shield type flexible circuit board, wherein the vent hole is located in the connection hole. 請求項1記載の電磁シールド型可撓性回路基板において、
前記通気穴は、一部が前記接続穴内にあることを特徴とする電磁シールド型可撓性回路基板。 In the electromagnetic shield type flexible circuit board according to claim 1,
An electromagnetic shield type flexible circuit board, wherein the vent hole is partially inside the connection hole. 請求項1記載の電磁シールド型可撓性回路基板において、
前記接続穴は、前記可撓性回路基板の製品外形に掛かることを特徴とする電磁シールド型可撓性回路基板。 In the electromagnetic shield type flexible circuit board according to claim 1,
The electromagnetic shield type flexible circuit board, wherein the connection hole is applied to a product outer shape of the flexible circuit board.
JP2003427432A 2003-12-24 2003-12-24 Electromagnetic shield type flexible circuit board Expired - Fee Related JP4163098B2 (en)

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KR1020040095738A KR100698496B1 (en) 2003-12-24 2004-11-22 Electronic Shield Type Flexible Circuit Board
TW093138433A TW200522858A (en) 2003-12-24 2004-12-10 Electromagnetic masking flexible circuit substrate
CNB2004100816868A CN1330227C (en) 2003-12-24 2004-12-24 Electromagnetic masking flexible circuit substrate

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