JP2008263036A - Rigid wiring board with shield layer and its manufacturing method - Google Patents

Rigid wiring board with shield layer and its manufacturing method Download PDF

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Publication number
JP2008263036A
JP2008263036A JP2007104199A JP2007104199A JP2008263036A JP 2008263036 A JP2008263036 A JP 2008263036A JP 2007104199 A JP2007104199 A JP 2007104199A JP 2007104199 A JP2007104199 A JP 2007104199A JP 2008263036 A JP2008263036 A JP 2008263036A
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Prior art keywords
wiring board
layer
rigid wiring
shield
surface mounting
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Kenichiro Sugimoto
健一郎 杉本
Kazuhiro Hashimoto
和博 橋本
Shohei Morimoto
昌平 森元
Tokinori Kawakami
斉徳 川上
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Tatsuta System Electronics Co Ltd
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Tatsuta System Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact and thin rigid wiring board with a shield layer and its manufacturing method of which the manufacturing process is simple. <P>SOLUTION: The rigid wiring board 1 with the shield layer is sequentially equipped with an insulating film layer 5 and a shield film layer 9 on the upper surface and/or the lower surface of a rigid wiring board 6 having a printed circuit 3 including at least a ground land 3c, a land 3b for surface mounting, and a signal line 3a, and a solder mask layer 4 on a rigid insulating board member 2, wherein the shield film layer 9 is constituted by sticking the shield film layer 9 having an adhesive film layer 7 and a metal layer 8 so that the adhesive layer 7 contacts the upper surface and/or the lower surface of the rigid wiring board 6, and is constituted by opening at least the top of the land 3b for surface mounting of the printed circuit 3 of the rigid wiring board 6 so as to be capable of connecting to the terminal 10b of an electronic component 10 for surface mounting. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、コンピュータ、通信機器、プリンター、携帯電話機、ビデオカメラなどの装置内等に用いられるプリント配線板等をシールドするシールド層を用いて製造されたシールド層付リジッド配線基板及びその製造方法に関するものである。   The present invention relates to a rigid wiring board with a shield layer manufactured using a shield layer that shields a printed wiring board used in a device such as a computer, a communication device, a printer, a mobile phone, and a video camera, and a method for manufacturing the same. Is.

リジッド配線基板には、従来から、特許文献１のようなシールド層が塗布されたプリント配線基板が知られている。このシールド層は、印刷及び硬化からなる繰り返し工程が必要である。また、近年の電子機器の軽量化、小型化、薄型化、高機能化に伴って、プリント配線基板の設置スペースの狭小化が進み、電子機器に組み込まれるプリント配線基板には、配線の高密度化及び基板の薄型化が求められている。そこで、電子部品をリジッド配線基板に表面実装することによって、配線密度の高密度化を図ることができるが、シールド層が厚いため、電子部品を表面実装すると小型化及び薄型化できないという問題がある。   Conventionally, a printed wiring board to which a shield layer as described in Patent Document 1 is applied is known as a rigid wiring board. This shield layer requires a repeated process consisting of printing and curing. In addition, with the recent reduction in weight, size, thickness, and functionality of electronic devices, the installation space for printed wiring boards has been reduced, and printed wiring boards incorporated in electronic devices have a high wiring density. There is a demand for reduction in thickness and substrate thickness. Therefore, it is possible to increase the wiring density by surface mounting the electronic component on the rigid wiring board. However, since the shield layer is thick, there is a problem that the electronic component cannot be reduced in size and thickness if it is surface mounted. .

一方、可撓性が要求される接続用の配線板としては、例えば、特許文献２のようなフレキシブル基板に薄いシールド層が設けられたものがある。しかし、特許文献２のようなフレキシブル配線板は接続用部品であり、電子部品の実装に用いられていなかった。   On the other hand, as a wiring board for connection that requires flexibility, for example, there is one in which a thin shield layer is provided on a flexible substrate as in Patent Document 2. However, the flexible wiring board as disclosed in Patent Document 2 is a connection component and has not been used for mounting electronic components.

特開平１−１７５２９２号公報JP-A-1-175292 特開２０００−２６９６３２号公報JP 2000-269632 A

そこで、本発明は、製造工程が簡易であり、小型且つ薄型のシールド層付リジッド配線基板及びその製造方法を提供する。   Therefore, the present invention provides a rigid wiring board with a shield layer having a simple and simple manufacturing process and a method for manufacturing the same.

課題を解決するための手段及び効果Means and effects for solving the problems

（１）本発明のシールド層付リジッド配線基板は、リジッド絶縁基材上に、少なくともグランドランド、表面実装用ランド及び信号線を含むプリント回路とソルダーマスク層とを有するリジッド配線基板の上面及び／又は下面に、絶縁フィルム層及びシールドフィルム層を順次具備するシールド層付リジッド配線基板において、前記シールドフィルム層は、接着剤層及び金属層を有するシールドフィルムを、前記リジッド配線基板の上面及び／又は下面に前記接着剤層が接するように貼り合わせて成り、前記リジッド配線基板のプリント回路の少なくとも前記表面実装用ランド上は、表面実装用電子部品の端子と接続できるように開口してなることを特徴とする。 (1) A rigid wiring board with a shield layer according to the present invention has an upper surface of a rigid wiring board having a printed circuit including at least a ground land, a surface mounting land and a signal line, and a solder mask layer on a rigid insulating base, and / or Alternatively, in the rigid wiring board with a shield layer that sequentially includes an insulating film layer and a shield film layer on the lower surface, the shield film layer includes a shield film having an adhesive layer and a metal layer, and an upper surface of the rigid wiring board and / or The adhesive layer is attached so that the adhesive layer is in contact with the lower surface, and at least the surface mounting land of the printed circuit of the rigid wiring board is open so as to be connected to the terminal of the surface mounting electronic component. Features.

上記（１）の構成によれば、シールド層がシールドフィルムであるため、製造工程が簡易なシールド層付リジッド配線基板を提供することができる。また、シールドフィルムが薄いため、従来のシールド層に比べて薄く、接続ランド上の開口部が浅くなり、シールド層付リジッド配線基板の小型化及び薄型化を図ることができる。   According to the configuration of (1) above, since the shield layer is a shield film, it is possible to provide a rigid wiring board with a shield layer with a simple manufacturing process. Further, since the shield film is thin, the shield film is thinner than the conventional shield layer, the opening on the connection land is shallow, and the rigid wiring board with the shield layer can be reduced in size and thickness.

また、前記リジッド配線基板の絶縁フィルム層は、発泡絶縁体からなることが好ましい。   The insulating film layer of the rigid wiring board is preferably made of a foamed insulator.

上記（２）の構成によれば、リジッド配線基板の絶縁フィルム層を発泡絶縁体としているため、絶縁フィルム層の誘電率が低く、金属層と信号線との間の静電容量が小さくなり、クロストークが小さくなる。   According to the configuration of (2) above, since the insulating film layer of the rigid wiring board is a foamed insulator, the dielectric constant of the insulating film layer is low, and the electrostatic capacity between the metal layer and the signal line is reduced. Crosstalk is reduced.

（３）本発明のシールド層付リジッド配線基板の製造方法は、リジッド絶縁基板上に、少なくともグランドランド、表面実装用ランド、信号線を含むプリント回路とソルダーマスク層とを形成してリジッド配線基板を形成するリジッド配線基板形成工程と、絶縁フィルムに表面実装用開口部を穿設する工程と、金属層の片面に接着剤層を設けてシールドフィルムを形成し、表面実装用開口部を穿設する工程と、前記リジッド配線基板の上面及び／又は下面に、前記絶縁フィルム及び前記シールドフィルムをその表面実装用開口部が、前記リジッド配線基板の表面実装用ランド上に位置するように載置し、加圧・加熱して接着させる工程とを含むことを特徴とする。 (3) A method for manufacturing a rigid wiring board with a shield layer according to the present invention includes forming a printed circuit including at least a ground land, a surface mounting land, a signal line, and a solder mask layer on a rigid insulating board, and a rigid wiring board. Forming a rigid wiring board, forming a surface mounting opening in an insulating film, forming a shield film by providing an adhesive layer on one side of the metal layer, and forming a surface mounting opening And placing the insulating film and the shield film on the upper surface and / or lower surface of the rigid wiring board so that the surface mounting opening is positioned on the surface mounting land of the rigid wiring board. And a step of bonding by pressurization and heating.

上記（３）の構成によれば、シールドフィルム層の形成工程が、シールドフィルムをリジッド配線基板上の開口部に合わせ加熱・加圧して接着させるものである。従って、従来のペースト印刷層に要した印刷及び硬化の繰り返し工程が必要とならず、簡易なシールド層付リジッド配線基板の製造方法を提供することができる。   According to the configuration of (3) above, in the shield film layer forming step, the shield film is bonded to the opening on the rigid wiring substrate by heating and pressing. Therefore, it is possible to provide a simple method for manufacturing a rigid wiring board with a shield layer without the need for repeated printing and curing steps required for a conventional paste print layer.

以下、図面を参照しつつ、本発明の実施形態に係るシールド層付リジッド配線基板について説明する。図１は、本発明の実施形態に係るシールド層付リジッド配線基板１の断面図である。図１において、シールド層付リジッド配線基板１は、リジッド配線基板６と、絶縁フィルム層５と、シールドフィルム９とからなる。   Hereinafter, a rigid wiring board with a shield layer according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view of a rigid wiring board 1 with a shield layer according to an embodiment of the present invention. In FIG. 1, a rigid wiring board 1 with a shield layer includes a rigid wiring board 6, an insulating film layer 5, and a shield film 9.

リジッド配線基板６は、リジッド基板２と、リジッド基板２上のプリント回路３と、プリント回路３にはんだが付着するのを防ぐソルダーマスク層４とからなる。また、シールドフィルム９は、金属層８の片面に導電性接着層７を設けてなる。   The rigid wiring board 6 includes a rigid board 2, a printed circuit 3 on the rigid board 2, and a solder mask layer 4 that prevents solder from adhering to the printed circuit 3. The shield film 9 is formed by providing a conductive adhesive layer 7 on one side of the metal layer 8.

リジッド配線基板６において、リジッド基板２は、ガラスエポキシ基板や紙フェノール基板からなる。   In the rigid wiring board 6, the rigid board 2 is made of a glass epoxy board or a paper phenol board.

プリント回路３は、信号線３ａ、表面実装用ランド３ｂ及びグランドランド３ｃからなる。ここで、表面実装用ランド３ｂの上面３ｂｓ及びグランドランド３ｃの一部の上面３ｃｓが、露出されている構成とする。   The printed circuit 3 includes a signal line 3a, a surface mounting land 3b, and a ground land 3c. Here, the upper surface 3bs of the surface mounting land 3b and a part of the upper surface 3cs of the ground land 3c are exposed.

ソルダーマスク層４は、ポリイミド、ガラスエポキシ、液晶ポリマー、エンジニアリングプラスチックス等の絶縁樹脂であることが好ましいが、これらに限られず、絶縁性材料であればよい。   The solder mask layer 4 is preferably an insulating resin such as polyimide, glass epoxy, liquid crystal polymer, and engineering plastics, but is not limited thereto and may be an insulating material.

絶縁フィルム層５は、エンジニアリングプラスチックからなる樹脂と充填剤とを混合してプレス成形したものである。例えば、ポリプロピレン、架橋ポリエチレン、ポリエステル、ポリベンツイミダゾール、ポリイミド、ポリイミドアミド、ポリエーテルイミド、ポリフェニレンサルファイド（ＰＰＳ）などが挙げられる。   The insulating film layer 5 is obtained by press-molding a resin made of engineering plastic and a filler. For example, polypropylene, crosslinked polyethylene, polyester, polybenzimidazole, polyimide, polyimide amide, polyether imide, polyphenylene sulfide (PPS), and the like can be given.

シールドフィルム９において、導電性接着剤層７は、金属、カーボン等の導電性フィラーを含有する接着性樹脂で構成される。なお、接着剤層７は、導電性接着剤層又は異方性接着剤層のいずれであってもよい。   In the shield film 9, the conductive adhesive layer 7 is made of an adhesive resin containing a conductive filler such as metal or carbon. The adhesive layer 7 may be either a conductive adhesive layer or an anisotropic adhesive layer.

金属フィラーとしては、銀、銅、ニッケル、ハンダ、アルミ及び銅粉に銀メッキを施した銀コート銅フィラー、さらには樹脂ボールやガラスビーズ等に金属メッキを施したフィラー又はこれらのフィラーの混合体が用いられる。   Examples of the metal filler include silver-coated copper filler obtained by silver-plating silver, copper, nickel, solder, aluminum, and copper powder, and fillers obtained by metal-plating resin balls and glass beads, or a mixture of these fillers. Is used.

金属層８は、アルミニウム、銅、銀、金などの金属材料から形成される、金属箔と金属薄膜から構成される。   The metal layer 8 is comprised from the metal foil and metal thin film which are formed from metal materials, such as aluminum, copper, silver, and gold.

次に、本実施形態にかかるシールド層付リジッド配線基板１を製造するに際し、表面実装用ランド３ｂの上面を露出させる方法を説明する。ソルダーマスク層４及び絶縁フィルム層５の表面実装用ランド３ｂ上及びグランドランド３ｃ上を露出させ、開口部Ａ及び開口部Ｂを形成しておく。シールドフィルム９は、開口部を設けた後、リジッド配線基板６上の開口部Ａに位置合わせをして、加熱・加圧して接着させる。ここで、シールドフィルム９を接着させる際、接着剤層７が、ソルダーマスク層４及び絶縁フィルム層５の開口部Ｂに充填され、グランドランド３ｃの上面３ｃｓと接触するので、シールドフィルム９の金属層８とグランドランド３ｃとが電気的に接続されている。なお、本実施形態において、シールドフィルム９は、金属層８上に保護用カバーフィルムを有しないものとしたが、保護用カバーフィルム（図示せず）を有する場合は、保護用のカバーフィルムを含めてシールドフィルム９を開口し、開口部Ａを形成するものとする。   Next, a method of exposing the upper surface of the surface mounting land 3b when manufacturing the rigid wiring board with shield layer 1 according to the present embodiment will be described. An opening A and an opening B are formed by exposing the surface mounting land 3b and the ground land 3c of the solder mask layer 4 and the insulating film layer 5. After providing the opening, the shield film 9 is aligned with the opening A on the rigid wiring substrate 6 and bonded by heating and pressing. Here, when the shield film 9 is bonded, the adhesive layer 7 fills the opening B of the solder mask layer 4 and the insulating film layer 5 and comes into contact with the upper surface 3cs of the ground land 3c. The layer 8 and the ground land 3c are electrically connected. In the present embodiment, the shield film 9 does not have a protective cover film on the metal layer 8, but when it has a protective cover film (not shown), the protective film is included. The shield film 9 is opened to form the opening A.

次に、本実施形態のシールド層付リジッド配線基板１への表面実装用電子部品１０の実装について説明する。図示しない実装機によって、電子部品１０の接続端子１０ｂ上に設けられたはんだ１１を、シールド層付リジッド配線基板１の表面実装用ランド３ｂ上に当接するように載置し、加熱することによりはんだ１１が溶接して電子部品１０が表面実装用ランド３ｂに接続される。   Next, mounting of the electronic component 10 for surface mounting on the rigid wiring board 1 with a shield layer according to the present embodiment will be described. The solder 11 provided on the connection terminal 10b of the electronic component 10 is placed in contact with the surface mounting land 3b of the rigid wiring board 1 with the shield layer by a mounting machine (not shown) and heated to heat the solder. 11 is welded to connect the electronic component 10 to the surface mounting land 3b.

その際、シールドフィルム９が従来のペースト印刷層に比べて薄いため、接続ランド上の開口部が浅くなり（例えば、特許文献１の例では、９０μｍの厚さが５０μｍの厚さになる。）、シールド層付リジッド配線基板１の小型化及び薄型化を図ることができる。また、上記シールド層付リジッド配線基板１は、シールドフィルム９をリジッド配線基板６上の開口部Ａに合わせて加熱・加圧して接着して、製造されるため、製造工程が簡易となり、電子部品の表面実装が簡易なシールド層付リジッド配線基板１を提供することができる。さらに、絶縁フィルム層５を発泡絶縁体とすると、絶縁フィルム層５からなる絶縁層の誘電率が低く、金属層８と信号線３ａとの間の静電容量が小さくなり、クロストークが小さくなる。   At that time, since the shield film 9 is thinner than the conventional paste printing layer, the opening on the connection land becomes shallow (for example, in the example of Patent Document 1, the thickness of 90 μm is 50 μm). Further, the rigid wiring board 1 with the shield layer can be reduced in size and thickness. Further, since the rigid wiring board 1 with a shield layer is manufactured by heating and pressurizing and bonding the shield film 9 to the opening A on the rigid wiring board 6, the manufacturing process is simplified, and the electronic component It is possible to provide a rigid wiring board 1 with a shield layer that can be easily surface-mounted. Furthermore, when the insulating film layer 5 is a foamed insulator, the dielectric constant of the insulating layer made of the insulating film layer 5 is low, the capacitance between the metal layer 8 and the signal line 3a is reduced, and the crosstalk is reduced. .

なお、本発明は、特許請求の範囲を逸脱しない範囲で設計変更できるものであり、上記実施形態に限定されるものではない。例えば、シールドフィルム層は、リジッド配線基板の片面又は両面に設けられていてもよく、また、リジッド配線基板は多層基板であってもよい。さらに、シールド層を筐体等に接続してグランドをとる場合は、接着剤層７は導電性でなくてもよい。   The present invention can be modified in design without departing from the scope of the claims, and is not limited to the above embodiment. For example, the shield film layer may be provided on one side or both sides of a rigid wiring board, and the rigid wiring board may be a multilayer board. Furthermore, when the shield layer is connected to a housing or the like and grounded, the adhesive layer 7 may not be conductive.

本発明の第１実施形態に係るシールド層付リジッド配線基板の断面図である。It is sectional drawing of the rigid wiring board with a shield layer which concerns on 1st Embodiment of this invention.

符号の説明Explanation of symbols

１ シールド層付リジッド配線基板
２ リジッド基板
３ プリント回路
３ａ 信号線
３ｂ 表面実装用ランド
３ｃ グランドランド
４ ソルダーマスク層
５ 絶縁フィルム層
６ リジッド配線基板
７ 接着剤層
８ 金属層
９ シールドフィルム
１０ 電子部品
１０ａ 電子部品本体
１０ｂ 電子部品の端子
１１ はんだ DESCRIPTION OF SYMBOLS 1 Rigid wiring board with shield layer 2 Rigid board 3 Printed circuit 3a Signal line 3b Surface mounting land 3c Ground land 4 Solder mask layer 5 Insulating film layer 6 Rigid wiring board 7 Adhesive layer 8 Metal layer 9 Shield film 10 Electronic component 10a Electronic component body 10b Electronic component terminal 11 Solder

Claims (3)

リジッド絶縁基材上に、少なくともグランドランド、表面実装用ランド及び信号線を含むプリント回路とソルダーマスク層とを有するリジッド配線基板の上面及び／又は下面に、絶縁フィルム層及びシールドフィルム層を順次具備するシールド層付リジッド配線基板において、
前記シールドフィルム層は、接着剤層及び金属層を有するシールドフィルムを、前記リジッド配線基板の上面及び／又は下面に前記接着剤層が接するように貼り合わせて成り、
前記リジッド配線基板のプリント回路の少なくとも前記表面実装用ランド上は、表面実装用電子部品の端子と接続できるように開口してなることを特徴とするシールド層付リジッド配線基板。 An insulating film layer and a shield film layer are sequentially provided on the upper and / or lower surface of a rigid wiring board having a printed circuit including at least a ground land, a surface mounting land and a signal line, and a solder mask layer on a rigid insulating base. In the rigid wiring board with shield layer
The shield film layer is formed by bonding a shield film having an adhesive layer and a metal layer so that the adhesive layer is in contact with the upper surface and / or the lower surface of the rigid wiring board,
A rigid wiring board with a shield layer, wherein at least the surface mounting land of the printed circuit of the rigid wiring board is opened so as to be connected to a terminal of a surface mounting electronic component. 前記リジッド配線基板の前記絶縁フィルム層は、発泡絶縁体からなることを特徴とする請求項１に記載のシールド層付リジッド配線基板。   The rigid wiring board with a shield layer according to claim 1, wherein the insulating film layer of the rigid wiring board is made of a foamed insulator. リジッド絶縁基板上に、少なくともグランドランド、表面実装用ランド、信号線を含むプリント回路とソルダーマスク層とを形成してリジッド配線基板を形成するリジッド配線基板形成工程と、
絶縁フィルムに表面実装用開口部を穿設する工程と、
金属層の片面に接着剤層を設けてシールドフィルムを形成し、表面実装用開口部を穿設する工程と、
前記リジッド配線基板の上面及び／又は下面に、前記絶縁フィルム及び前記シールドフィルムをその表面実装用開口部が、前記リジッド配線基板の表面実装用ランド上に位置するように載置し、加圧・加熱して接着させる工程とを含むことを特徴とするシールド層付リジッド配線基板の製造方法。






















A rigid wiring board forming step for forming a rigid wiring board by forming a printed circuit and a solder mask layer including at least a ground land, a surface mounting land, and a signal line on the rigid insulating board;
Drilling a surface mounting opening in an insulating film;
Forming a shield film by providing an adhesive layer on one side of the metal layer, and forming a surface mounting opening;
The insulating film and the shield film are placed on the upper surface and / or the lower surface of the rigid wiring board so that the surface mounting opening is positioned on the surface mounting land of the rigid wiring board. The manufacturing method of the rigid wiring board with a shield layer characterized by including the process to heat and adhere.






















JP2007104199A 2007-04-11 2007-04-11 Rigid wiring board with shield layer and its manufacturing method Pending JP2008263036A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5975195B1 (en) * 2014-10-03 2016-08-23 Dic株式会社 SHIELD FILM, SHIELD PRINTED WIRING BOARD AND METHOD FOR PRODUCING THEM
JP2019204934A (en) * 2018-05-25 2019-11-28 株式会社Ｆｐｃコネクト Wiring board and method for manufacturing the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02181992A (en) * 1989-01-07 1990-07-16 Aica Kogyo Co Ltd Printed wiring board
JPH08125380A (en) * 1994-10-19 1996-05-17 Sumitomo Electric Ind Ltd Shielded flexible wiring-board and manufacturing method thereof
JP2005175185A (en) * 2003-12-11 2005-06-30 Maruwa Seisakusho:Kk Flexible wiring board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02181992A (en) * 1989-01-07 1990-07-16 Aica Kogyo Co Ltd Printed wiring board
JPH08125380A (en) * 1994-10-19 1996-05-17 Sumitomo Electric Ind Ltd Shielded flexible wiring-board and manufacturing method thereof
JP2005175185A (en) * 2003-12-11 2005-06-30 Maruwa Seisakusho:Kk Flexible wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5975195B1 (en) * 2014-10-03 2016-08-23 Dic株式会社 SHIELD FILM, SHIELD PRINTED WIRING BOARD AND METHOD FOR PRODUCING THEM
JP2019204934A (en) * 2018-05-25 2019-11-28 株式会社Ｆｐｃコネクト Wiring board and method for manufacturing the same

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