JPH02181992A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH02181992A JPH02181992A JP148689A JP148689A JPH02181992A JP H02181992 A JPH02181992 A JP H02181992A JP 148689 A JP148689 A JP 148689A JP 148689 A JP148689 A JP 148689A JP H02181992 A JPH02181992 A JP H02181992A
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- epoxy resin
- foamable
- resin
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 claims abstract description 11
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 11
- 238000007650 screen-printing Methods 0.000 claims abstract description 8
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 8
- 239000000057 synthetic resin Substances 0.000 claims abstract description 8
- 239000005011 phenolic resin Substances 0.000 claims abstract description 3
- 238000007639 printing Methods 0.000 abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical class [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 6
- 239000011347 resin Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 4
- 239000004593 Epoxy Substances 0.000 abstract description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 229920001296 polysiloxane Polymers 0.000 abstract description 3
- 239000004952 Polyamide Substances 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 239000004088 foaming agent Substances 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 abstract description 2
- 229920002647 polyamide Polymers 0.000 abstract description 2
- 239000006260 foam Substances 0.000 description 4
- 238000005187 foaming Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、アナログあるいはデジタル用のプリント配線
板の電磁波シールド層とプリント回路との絶縁に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to insulation between an electromagnetic shielding layer of an analog or digital printed wiring board and a printed circuit.
プリント配線板のデジタル回路用の促進化に伴い、外部
からの電磁波の影響を受けて、０Ｎ−ＯＦＦの誤動作が
起こる等の障害が発生している０これを防止するために
、従来、プリント回路に銅、カーボン等を含有する導電
性ペーストからなる電磁波シールド層が絶縁層を介して
積膚一体化される。該絶縁層には、エポキシ樹脂等の絶
縁性を有する合成樹脂を主成分とする印刷インクがスク
リーン印刷等の方法によって、該プリント回路と該電磁
波シールド層との間に設けられ、絶縁層が形成される。With the promotion of printed wiring boards for digital circuits, problems such as 0N-OFF malfunctions are occurring due to the influence of external electromagnetic waves.To prevent this, conventional printed circuits An electromagnetic shielding layer made of a conductive paste containing copper, carbon, etc. is integrated into the skin via an insulating layer. In the insulating layer, a printing ink mainly composed of a synthetic resin having insulating properties such as epoxy resin is provided between the printed circuit and the electromagnetic shielding layer by a method such as screen printing to form an insulating layer. be done.
しかしながら、従来の技術では、回路自体のインピーダ
ンス特性のため、所定の電気特性を得るためには、該印
刷インクを多数回印刷塗布して厚くする必要があシ、工
程が繁雑になる等の問題を有していた。このほか特に高
周波数を扱うものについてはｉ！！電率が影響し、訪電
率の低い材料を使う必要がある。本発明は、従来の技術
で行われていた多数回！！シによる絶縁層の形成を、ス
クリーン印刷の１回塗り等の簡便な方法で形成して、所
定の電気特性を得ることを目的としている。また従来の
絶縁層を薄くすることを目的としている。However, in the conventional technology, due to the impedance characteristics of the circuit itself, in order to obtain predetermined electrical characteristics, it is necessary to apply the printing ink multiple times to make it thicker, resulting in problems such as complicated processes. It had In addition, i! ! It is affected by electrical conductivity, and it is necessary to use materials with low electrical contact efficiency. The present invention can be done many times with conventional technology! ! The purpose of this invention is to form an insulating layer using a simple method such as one-time screen printing to obtain predetermined electrical characteristics. It also aims to make conventional insulating layers thinner.
〔問題点を解決するための手段、構成〕実施例によって
、上記目的を達成するための本発明の手段、構成を説明
する。[Means and configuration for solving the problems] The means and configuration of the present invention for achieving the above object will be explained with reference to examples.
本発明においては、従来技術にある印刷インクを、印刷
塗布後、発泡するような合成樹脂を主成分とする印刷イ
ンクとし、該印刷インクがスクリーン印刷によってプリ
ント回路上に１回で印刷塗布される。第１図に示すよう
に、例えば、銅箔積層ガラスエポキシプリント回路２に
ビスフェノールＡｍのエポキシ樹脂１００重量部とポリ
アミド系硬化剤３０重量部及びシリコーン系発泡剤１重
量部とを調合してなる発泡倍率３倍の液状の発泡エポキ
シ樹脂が２０μｍの膜厚でスクリーン印刷によって印刷
塗布され、更に５０μの銅含有導電性ペーストからなる
電磁波シールド層が積層され、本発明のプリント配線板
１が得られる。該発泡エポキシ樹脂は、塗布後硬化中に
発泡が促進され、５０μの絶縁層５が形成され、従来方
法の印刷インクの４回塗シで得られた７０μの絶縁層と
同程度の電気特性が得られる。In the present invention, the printing ink in the prior art is replaced with a printing ink whose main component is a synthetic resin that foams after printing, and the printing ink is printed and applied on the printed circuit in one step by screen printing. . As shown in FIG. 1, for example, foaming is produced by mixing 100 parts by weight of a bisphenol Am epoxy resin, 30 parts by weight of a polyamide curing agent, and 1 part by weight of a silicone foaming agent in a copper foil laminated glass epoxy printed circuit 2. A liquid foamed epoxy resin with a magnification of 3 times is applied by screen printing to a thickness of 20 μm, and an electromagnetic shielding layer made of a 50 μm thick copper-containing conductive paste is further laminated to obtain the printed wiring board 1 of the present invention. The foamed epoxy resin promotes foaming during curing after application, forming an insulating layer 5 with a thickness of 50 μm, and has electrical properties comparable to the insulating layer 5 with a thickness of 70 μm obtained by applying four coats of printing ink using the conventional method. can get.
核発泡型合成樹脂には、前記発泡エポキシ樹脂のほか、
例えば、レゾール型フェノール樹脂１００重量部、有機
酸系触媒１重量部、発泡剤１．！ｆｃ部、界面活性剤０
．５重量部とからなる発泡フェノールわ、を脂、ポリエ
ーテルポリオール１００重量部、アミン系触媒０．５重
量部、シリコーン系界面活性剤１重量部、インシアネー
ト系架橋剤５ｏｆｔ部とからなる発泡ウレタン樹脂等の
発泡倍率が１〜２０倍で、発泡後３０〜１００μの発泡
型合成樹脂が使用される。発泡形式は連続発泡体でも良
いが、独立発泡体の方が好ましいものとなる。In addition to the above-mentioned foamed epoxy resin, nuclear foamed synthetic resins include
For example, 100 parts by weight of resol type phenolic resin, 1 part by weight of organic acid catalyst, 1 part by weight of blowing agent. ! fc part, surfactant 0
．． 5 parts by weight of foamed phenol resin, 100 parts by weight of polyether polyol, 0.5 parts by weight of amine catalyst, 1 part by weight of silicone surfactant, and 5 parts of incyanate crosslinking agent. A foamed synthetic resin having a foaming ratio of 1 to 20 times and a thickness of 30 to 100 microns after foaming is used. The foam type may be an open foam, but a closed foam is preferable.
本発明におけるプリント配線板は、上記のように構成さ
れるので、電気特性に優れるばかりでなく、工程の短縮
化が可能となる。更に、絶縁層が発泡型樹脂から形成さ
れるため、該樹脂中の気泡′よって、該発泡樹脂層がソ
リッドの樹脂層と比較して、２０〜５０係程度の誘電基
の樹脂層となり、高周波数域となっても該絶縁層の厚さ
を薄くすることが可能となる。従って、該プリント配線
板が実装が容易でコンパクト化される効果もある。Since the printed wiring board according to the present invention is configured as described above, it not only has excellent electrical properties but also enables shortening of the manufacturing process. Furthermore, since the insulating layer is formed from a foamed resin, the foamed resin layer becomes a resin layer with a dielectric group of about 20 to 50 modulus, compared to a solid resin layer, due to the air bubbles in the resin. Even in the frequency range, it is possible to reduce the thickness of the insulating layer. Therefore, there is an effect that the printed wiring board can be easily mounted and made compact.
第１図は、本発明の発泡型合成樹脂を用いた絶縁層を有
するプリント配線板の構成断面図である。
１・・・プリント配線板
２・・・プリント回路
３・・・ガラスエポキシ絶縁板
４・・・銅箔
５・・・発泡型合成樹脂の絶縁層
６・・・電磁波シールド層
第１図
特許出願人 アイカニ業株式会社
ｇ産１とセ未デご毎二ネ土
東洋通１自機＃：、戊公礼FIG. 1 is a cross-sectional view of a printed wiring board having an insulating layer using the foamed synthetic resin of the present invention. 1...Printed wiring board 2...Printed circuit 3...Glass epoxy insulating board 4...Copper foil 5...Insulating layer of foamed synthetic resin 6...Electromagnetic shielding layer Figure 1 Patent application Person Aikanigyo Co., Ltd. G SAN 1 and SEMI DE Gomai 2 Ne Satoshi Toyodori 1 Machine #:, Bo Gongrei
Claims (1)
２との間に設けられる絶縁層が、発泡エポキシ樹脂、発
泡フェノール樹脂等の発泡型合成樹脂のスクリーン印刷
によって設けられていることを特徴とするプリント配線
板。Printed wiring characterized in that the insulating layer provided between the electromagnetic shielding layer 6 of the printed wiring board and the printed circuit 2 is provided by screen printing of a foamed synthetic resin such as foamed epoxy resin or foamed phenol resin. Board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP148689A JPH02181992A (en) | 1989-01-07 | 1989-01-07 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP148689A JPH02181992A (en) | 1989-01-07 | 1989-01-07 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02181992A true JPH02181992A (en) | 1990-07-16 |
Family
ID=11502770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP148689A Pending JPH02181992A (en) | 1989-01-07 | 1989-01-07 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02181992A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008263036A (en) * | 2007-04-11 | 2008-10-30 | Tatsuta System Electronics Kk | Rigid wiring board with shield layer and its manufacturing method |
| JP2012164929A (en) * | 2011-02-09 | 2012-08-30 | Showa Aircraft Ind Co Ltd | High conductivity printed wiring board, and method of manufacturing same |
| JP2012227556A (en) * | 2012-08-20 | 2012-11-15 | Tatsuta Electric Wire & Cable Co Ltd | Rigid wiring substrate with shield layer, and manufacturing method of the same |
| JP2015050195A (en) * | 2013-08-29 | 2015-03-16 | 富士通株式会社 | Method of manufacturing laminated substrate |
| CN109515020A (en) * | 2017-09-18 | 2019-03-26 | 云谷（固安）科技有限公司 | Inkjet printing methods |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS625592A (en) * | 1985-07-02 | 1987-01-12 | 株式会社東芝 | Cooker |
| JPS6260298A (en) * | 1985-09-10 | 1987-03-16 | 凸版印刷株式会社 | Shielding method for printed board |
-
1989
- 1989-01-07 JP JP148689A patent/JPH02181992A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS625592A (en) * | 1985-07-02 | 1987-01-12 | 株式会社東芝 | Cooker |
| JPS6260298A (en) * | 1985-09-10 | 1987-03-16 | 凸版印刷株式会社 | Shielding method for printed board |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008263036A (en) * | 2007-04-11 | 2008-10-30 | Tatsuta System Electronics Kk | Rigid wiring board with shield layer and its manufacturing method |
| JP2012164929A (en) * | 2011-02-09 | 2012-08-30 | Showa Aircraft Ind Co Ltd | High conductivity printed wiring board, and method of manufacturing same |
| JP2012227556A (en) * | 2012-08-20 | 2012-11-15 | Tatsuta Electric Wire & Cable Co Ltd | Rigid wiring substrate with shield layer, and manufacturing method of the same |
| JP2015050195A (en) * | 2013-08-29 | 2015-03-16 | 富士通株式会社 | Method of manufacturing laminated substrate |
| CN109515020A (en) * | 2017-09-18 | 2019-03-26 | 云谷（固安）科技有限公司 | Inkjet printing methods |
| CN109515020B (en) * | 2017-09-18 | 2021-03-23 | 云谷（固安）科技有限公司 | Ink jet printing method |
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