CN1330227C - Electromagnetic masking flexible circuit substrate - Google Patents
Electromagnetic masking flexible circuit substrate Download PDFInfo
- Publication number
- CN1330227C CN1330227C CNB2004100816868A CN200410081686A CN1330227C CN 1330227 C CN1330227 C CN 1330227C CN B2004100816868 A CNB2004100816868 A CN B2004100816868A CN 200410081686 A CN200410081686 A CN 200410081686A CN 1330227 C CN1330227 C CN 1330227C
- Authority
- CN
- China
- Prior art keywords
- flexible circuit
- air vent
- circuit board
- circuit substrate
- vent hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims description 32
- 230000000873 masking effect Effects 0.000 title claims description 21
- 239000000463 material Substances 0.000 claims abstract description 35
- 239000000853 adhesive Substances 0.000 claims abstract description 24
- 230000001070 adhesive effect Effects 0.000 claims abstract description 24
- 230000001681 protective effect Effects 0.000 claims abstract description 24
- 239000012212 insulator Substances 0.000 claims abstract description 22
- 239000004020 conductor Substances 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims description 42
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 239000000155 melt Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004035 construction material Substances 0.000 description 3
- 239000012774 insulation material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The electromagnetic shielding flexible circuit board includes a protective insulator layer 3 provided on the circuit conductor 1 in a flexible circuit board, and a shielding material 4 provided on this protective insulator layer in such a manner that the ground circuit and the shielding material in the circuit conductor are provided on the protective insulator layer and connected by the connecting hole 5 filled with a conductive adhesive. A vent hole H communicating with the outside air and exposing the conductive adhesive with the outside air is provided in the connecting hole. To provide an electromagnetic shielding flexible circuit board which can maintain stably and certainly the connection of the ground circuit of a circuit conductor to a shielding layer.
Description
Technical field
The present invention relates at least one face of flexible circuit board, be equipped with the so-called electromagnetic masking flexible circuit substrate of shielding material, be specifically related to the structure that the earthed circuit in order to stable screen that keeps shielding material and flexible circuit board partly is electrically connected.
Background technology
In traditional miniaturized electronics, high and substrate is thin based on the degree of freedom of wiring etc., and that the factor flexible circuit board obtains is widely-used.In recent years, portable small-sized electronic equipments such as mobile phone, Digital Video, digital camera are being obtained progress aspect multifunction, the high performance, the wiring density of flexible circuit board becomes higher, and on the other hand, along with the high frequencyization of signal and the densification of installation elements have proposed increasing electromagnetic shielding requirement to flexible circuit board.
Fig. 5 represents the cross-section structure of traditional electromagnetic masking flexible circuit substrate.In this circuit substrate; on the base material 2 that is provided with circuit conductor 1 (signal circuit 1a, earthed circuit 1b) on the surface (basilar memebrane 2a, substrate bond layer 2b), stacked surface protection insulation material layer 3 of protective circuit conductor 1 (flexible insulating film 3a, bond layer 3b) and shielding material 4 (flexible insulating film 4a, screen 4b, conductivity layer of adhesive material 4c).
Then, connecting hole 5 is set on surface protection insulation material layer 3, adds the conductivity adhesives of heatshield material 4 on these connecting hole 5 inner edge filling limits, form the conductive adhesive layer.This conductive adhesive layer has been guaranteed the earthed circuit part of circuit conductor 1 and the conduction between the shielding material 4.
In the Japanese kokai publication hei 07-122882 communique, put down in writing the flexible circuit board of the shielding material that uses this subsidiary conductive adhesive.
In this electromagnetic masking flexible circuit substrate, when the conductive adhesive of the shielding material of subsidiary conductive adhesive has sucked moisture, in the melt back operation that circuit element is installed, the moisture that conductive adhesive and dielectric base material and other construction materials suck, and the volatile ingredient of residual micro-organic solvent etc. in the various bond layers between the construction material, through being heated as bubble 6 as shown in Figure 6, thus the unfavorable condition that the earthed circuit part that causes flexible circuit board and screen are peeled off mutually.
In addition, also have this unfavorable condition (not shown): suck in suitably that adopt, earthed circuit 1b upper surface the as required electroplating film and the residual organic principle that cooperates with micro-electroplate liquid etc. also because of the overheated bubble that produces, the earthed circuit that flexible circuit board same as described above occurs is partly and peeling off between the screen.
In case produce this peeling off, the earthed circuit part of flexible circuit board and the conduction impedance between the screen are increased, and then destroy conducting and be difficult to keep stable shielding properties between the two.
Summary of the invention
The present invention considers above problem and conceives, and its purpose is to provide reliably the earthed circuit part of holding circuit conductor and the electromagnetic masking flexible circuit substrate of the connection between the screen.
In order to reach above-mentioned purpose, the invention provides electromagnetic masking flexible circuit substrate with following feature:
Wherein, on the circuit conductor on the flexible circuit board, protective insulator layer is set; on this protective insulator layer, shielding material is set; between the earthed circuit part and described shielding material on the described circuit conductor; by be located at described insulation protection material layer and filling the connecting hole of conductive adhesive connect, the air vent hole that is communicated with, described conductive adhesive is exposed to atmosphere with atmosphere is set in described connecting hole.
Here, shielding material also can constitute by have the screen that constitutes by metallic film on the surface of heat-resistant plastic film, on this screen the duplexer of stacked conductive adhesive layer.
And, the structure that can adopt air vent hole on the shielding material of subsidiary conductive adhesive, to form, the structure that on flexible circuit board, forms, or the structure that on shielding material that attaches conductive adhesive and flexible circuit board both sides' correspondence position, forms; In addition, the structure in the opening that can adopt its plan position approach to be included in to have formed connecting hole on the protective insulator layer, or have the structure of the cutting plane on the part that leans against the connecting hole that forms in the protective insulator layer; But these structure appropriate combination are used.
According to the present invention,, can prevent the gas that takes place in the melt back operation of protective insulator layer when actual installation and discharge and the situation of generation bubble to the outside owing on the protective insulator layer air vent hole is set.Therefore, can prevent peeling off between the earthed circuit part of flexible circuit board and the screen, but the electromagnetic masking flexible circuit substrate of stable maintenance shielding properties is provided.
Description of drawings
Fig. 1 is the schematic section structure chart of the expression embodiment of the invention 1.
Fig. 2 is the schematic section structure chart of the expression embodiment of the invention 2.
Fig. 3 is the schematic section structure chart of the expression embodiment of the invention 3.
Fig. 4 (a) is the plane graph and the schematic section structure chart of the expression embodiment of the invention 4 (b).
Fig. 5 is the schematic section structure chart of the traditional electromagnetic masking flexible circuit substrate of expression.
Fig. 6 is the schematic section structure chart of the situation behind the melt back of the traditional electromagnetic masking flexible circuit substrate of expression.
Embodiment
Below, describe with regard to embodiments of the present invention referring to figs. 1 through Fig. 4.
Embodiment 1
Fig. 1 is the schematic section structure chart of the electromagnetic masking flexible circuit substrate of the expression embodiment of the invention 1; on the base material 2 that is provided with circuit conductor 1 on the one surface; the protective insulator layer 3 of protective circuit conductor 1 is set, and then stacked again shielding material 4.Then, on protective insulator layer 3, the connecting hole 5 that leads to circuit conductor 1 is set.
In the present embodiment; on the base material 2 that constitutes by flexible insulation basilar memebrane 2a such as polyimide film and substrate adhesives 2b; be provided with the circuit conductor of forming by signal circuit 1a that forms by the Copper Foil etch processes and earthed circuit 1b 1, and signal circuit 1a and above the earthed circuit 1b setting have the protective insulator layer 3 of the connecting hole 5 that leads to earthed circuit 1b.Protective insulator layer 3 forms by flexible insulating film 3a such as the bonding polyimides of bond layer 3b.
In addition; above the protective insulator layer 3; form the conductive shielding layer 4b that is made of metallic film on the surface of the flexible insulating film 4a of polyimide film or polyphenylene sulfide film etc., the formation method of metallic film is known method such as the sputtering method of metals such as aluminium, copper or silver or vapour deposition method.Then, the shielding material 4 that the bonding conductive adhesive layer 4c that is made of the adhesive resin of the electroconductive stuffing that contains metal or carbon etc. forms on the surface of conductive shield 4b again.Thus, earthed circuit layer 1b that forms on the flexible circuit board and conductive shielding layer 4b are electrically connected by the conductive adhesive 4c of filling in connecting hole 5.
Then, on the connecting hole 5 that this earthed circuit layer 1b and conductive shielding layer 4b are electrically connected, whole construction materials that formation will be positioned at this position penetrate into the goods profile and the air vent hole H that is connected with atmosphere.
The electromagnetic masking flexible circuit substrate of this structure, the gas that produces in the melt back operation when circuit element is installed just can be rejected to the outside from air vent hole H, therefore, earthed circuit layer 1b goes up and just do not have the bubble generation, just can not cause peeling off between earthed circuit layer 1b and the screen 4b.
The electromagnetic masking flexible circuit substrate of this structure can obtain by operation as described below.At first, prepare to have the flexible circuit board that exposes the surface protection insulation material layer 3 that is formed with connecting hole 5 for a part that makes earthed circuit 1b.Then, from protective insulator layer 3, the shielding material 4 of bonding subsidiary conductive adhesive on earthed circuit 1b covers connecting hole 5.Then, by forming air vent hole H, base material 2, circuit conductor 1, protective insulator layer 3 and shielding material 4 are connected with conventional processing method such as the punching of metal die or boring.
On the earthed circuit 1b of flexible circuit board of the present invention, can form suitable electroplating film (not shown) in case of necessity.Also can be like this among the following embodiment.
Fig. 2 is the constructed profile of the expression embodiment of the invention 2.The difference of this embodiment and the foregoing description 1 is: air vent hole H only forms in a side of the shielding material 4 that attaches conductive adhesive.In this structure, the air scavenge that takes place in the melt back operation in the time of also circuit element being installed is to outside, makes not produce bubble on the earthed circuit layer 1b.
And, in order to obtain this structure, adopted the operation of the shielding material 4 of the bonding subsidiary conductive adhesive that has been pre-formed air vent hole H, even conductive adhesive 4c flows in the air vent hole H and its part is stopped up when bonding, the also function of induced damage resistive air vent hole H not.Then, same as described above, the gas that takes place in the melt back operation when circuit element is installed can be rejected to the outside through air vent hole H, therefore, can prevent because of bubble cause peel off.
Fig. 3 is the schematic section structure chart of the expression embodiment of the invention 3.The difference of this embodiment and the above embodiments 1,2 is: air vent hole H is formed at base material 2 sides, promptly is formed on dielectric base material 2, earthed circuit 1b and the earthed circuit layer 1b that constitutes flexible circuit board.
In this structure, the gas that takes place in the melt back operation when circuit element is installed also can be discharged through air vent hole H, therefore, can not produce bubble on the earthed circuit layer 1b.
And,, for example can adopt the flexible circuit board that will be pre-formed air vent hole H to bond to operation on the shielding material 4 of subsidiary conductive adhesive in order to obtain this structure.Carry out this when bonding, cause its part to stop up even there is conductive adhesive 4c to flow to air vent hole H, the gas that takes place in melt back operation when circuit element is installed still can be rejected to the outside through air vent hole H, therefore, can prevent the generation of bubble as above-mentioned and peels off.
Shown in embodiment 1 to 3,, as previously mentioned, except adopting boring, also can adopt methods such as mould Punching Technology in order to discharge the upward air vent hole H of the gas of generation of conductive adhesive 4c; If adopt the die-cut method of mould, then the cross sectional shape of air vent hole H just is not only limited to circle, and can suitably select Long Circle, ellipse, rectangle, polygon etc. for use.
In addition; among the embodiment 1 to 3; air vent hole H is included in the interior hole of opening of the connecting hole 5 that forms in the protective insulator layer; even the part of the connecting hole 5 that forms in the last protective insulator layer 3 is only leaned in its cross section; the gas that takes place in the melt back operation in the time of also circuit element being installed is discharged to the outside, thereby prevents the generation of bubble and peel off.
Fig. 4 (a) and (b) are the plane graph of the expression embodiment of the invention 4 and the simple profile that dissects along the A-A line of Fig. 4 (a).
Among this embodiment, shown in Fig. 4 (a), form oblong air vent hole LH in the mode on the part that leans against the connecting hole 5 that forms in the protective insulator layer 3.Here, shown in Fig. 4 (b), show the structure of cutting whole layer, but with the above embodiments 2,3, can adopt equally on the shielding material of subsidiary conductive adhesive, to form oblong air vent hole, and the structure that on flexible circuit board, forms oblong air vent hole.
And in this embodiment, the gas that takes place in the melt back operation in the time of circuit element can being installed is discharged to the outside from the cross section C that is affixed by connecting hole 5, can prevent the generation of bubble and peels off.
The structure example of having represented die-cut Long Circle hole among Fig. 4 even cross section C is the die-cut end face of goods profile of flexible circuit board, also can obtain the effect identical with the embodiment of Fig. 4.
And among the embodiment 1 to 4, having represented has the structure of substrate bond layer 2b between signal circuit 1a or earthed circuit 1b and flexible insulation basilar memebrane 2a, but also can adopt the so-called adhesive-free type copper film layer pressing plate without substrate bond layer 2b.
Also have, not only have in the so-called two sides type flexible circuit board of signal circuit 1a or earthed circuit 1b, can suitably adopt the present invention in the same manner, can on Mulitilayer circuit board, adopt the present invention too with the various embodiments described above on the two sides of flexible insulation basilar memebrane 2a.
Industrial utilizability
According to flexible circuit board of the present invention, can reduce in recent years a large amount of by the consumer In the pocket telephone that uses, the substrate of connection liquid crystal display part and operand keyboard section The flexible circuit board at the turnover position of main body substrate is the out of order situation of substrate in use. And, can reduce in DV, the digital camera connect CCD imaging apparatus semiconductor and The flexible circuit board of the main body substrate of equipment control part substrate in use breaks down Reason.
Claims (8)
1. electromagnetic masking flexible circuit substrate; wherein; on the circuit conductor on the described flexible circuit board protective insulator layer is set; on this protective insulator layer, shielding material is set; between earthed circuit on described circuit conductor part and the described shielding material by be located at described protective insulator layer and filling the connecting hole of conductive adhesive be connected, it is characterized in that:
Be provided with the air vent hole that is communicated with atmosphere and described conductive adhesive and described earthed circuit portion boundary partly is exposed to atmosphere in the described connecting hole.
2. electromagnetic masking flexible circuit substrate as claimed in claim 1 is characterized in that:
Described shielding material forms flexible insulating film, be located at lip-deep metallic film of this film and the duplexer of stacked conductive adhesive layer on this metallic film.
3. electromagnetic masking flexible circuit substrate as claimed in claim 2 is characterized in that:
Be pre-formed described air vent hole in the described shielding material of described duplexer.
4. electromagnetic masking flexible circuit substrate as claimed in claim 1 is characterized in that:
Described air vent hole almost parallel ground on the thickness direction of described flexible circuit board forms.
5. electromagnetic masking flexible circuit substrate as claimed in claim 1 is characterized in that:
Described air vent hole is located at and described circuit conductor is sandwiched in therebetween correspondence position on described conductive adhesive layer and the described flexible circuit board, and on the thickness direction of described flexible circuit board almost parallel.
6. electromagnetic masking flexible circuit substrate as claimed in claim 1 is characterized in that:
Described air vent hole is positioned at described connecting hole.
7. electromagnetic masking flexible circuit substrate as claimed in claim 1 is characterized in that:
The part of described air vent hole is positioned at described connecting hole.
8. electromagnetic masking flexible circuit substrate as claimed in claim 1 is characterized in that:
Described connecting hole penetrates into the goods profile of described flexible circuit board.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003427432A JP4163098B2 (en) | 2003-12-24 | 2003-12-24 | Electromagnetic shield type flexible circuit board |
| JP427432/03 | 2003-12-24 | ||
| JP427432/2003 | 2003-12-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1638618A CN1638618A (en) | 2005-07-13 |
| CN1330227C true CN1330227C (en) | 2007-08-01 |
Family
ID=34786710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100816868A Expired - Fee Related CN1330227C (en) | 2003-12-24 | 2004-12-24 | Electromagnetic masking flexible circuit substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4163098B2 (en) |
| KR (1) | KR100698496B1 (en) |
| CN (1) | CN1330227C (en) |
| TW (1) | TW200522858A (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100640659B1 (en) * | 2005-08-01 | 2006-11-01 | 삼성전자주식회사 | Flexible printed circuit and method for manufacturing the same |
| KR100737098B1 (en) * | 2006-03-16 | 2007-07-06 | 엘지이노텍 주식회사 | Shield device of electromagnetic inteference and production progress thereof |
| JP4852442B2 (en) * | 2007-02-15 | 2012-01-11 | 日本オプネクスト株式会社 | Optical transmission module |
| JP5161617B2 (en) | 2008-03-03 | 2013-03-13 | 日本メクトロン株式会社 | Flexible circuit board and manufacturing method thereof |
| JP5487477B2 (en) * | 2012-08-20 | 2014-05-07 | タツタ電線株式会社 | Rigid wiring board with shield layer and manufacturing method thereof |
| CN204377241U (en) * | 2013-10-24 | 2015-06-03 | 信越聚合物株式会社 | Electromagnetic shielding film |
| TWI653031B (en) | 2016-03-28 | 2019-03-11 | 鉅旺生技股份有限公司 | Wireless pressure sensor |
| CN108738226B (en) * | 2018-05-04 | 2020-11-13 | 华显光电技术（惠州）有限公司 | Flexible circuit board structure, backlight assembly and mobile terminal |
| CN110691500B (en) * | 2018-07-06 | 2024-04-26 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN113766095B (en) * | 2020-06-04 | 2023-08-15 | 三赢科技（深圳）有限公司 | Camera module and electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06224587A (en) * | 1993-01-27 | 1994-08-12 | Nippon Mektron Ltd | Flexible circuit substrate having shielding layer |
| JPH08125380A (en) * | 1994-10-19 | 1996-05-17 | Sumitomo Electric Ind Ltd | Shielded flexible wiring-board and manufacturing method thereof |
| JP2002033556A (en) * | 2000-07-18 | 2002-01-31 | Nippon Mektron Ltd | Flexible circuit board |
| CN1391429A (en) * | 2001-06-07 | 2003-01-15 | 明碁电通股份有限公司 | Process for preparing flexible circuit board |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0363969U (en) * | 1989-10-25 | 1991-06-21 | ||
| JPH04207099A (en) * | 1990-11-30 | 1992-07-29 | Nitto Denko Corp | Multilayer printed-circuit board |
| JPH05326644A (en) * | 1992-05-19 | 1993-12-10 | Hitachi Cable Ltd | Double side wired film carrier and manufacture thereof |
| JP3191517B2 (en) * | 1993-08-04 | 2001-07-23 | 富士ゼロックス株式会社 | Flexible printed wiring board shielding device |
| JPH11214805A (en) * | 1998-01-20 | 1999-08-06 | Sony Corp | Flexible printed wiring board |
| JP2000269632A (en) * | 1999-03-17 | 2000-09-29 | Tatsuta Electric Wire & Cable Co Ltd | Shield flexible printed wiring board, manufacture thereof and reinforcing shield film therefor |
| JP2003007769A (en) * | 2001-06-26 | 2003-01-10 | Toshiba Corp | Mounting structure for semiconductor chip |
-
2003
- 2003-12-24 JP JP2003427432A patent/JP4163098B2/en not_active Expired - Fee Related
-
2004
- 2004-11-22 KR KR1020040095738A patent/KR100698496B1/en not_active IP Right Cessation
- 2004-12-10 TW TW093138433A patent/TW200522858A/en not_active IP Right Cessation
- 2004-12-24 CN CNB2004100816868A patent/CN1330227C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06224587A (en) * | 1993-01-27 | 1994-08-12 | Nippon Mektron Ltd | Flexible circuit substrate having shielding layer |
| JPH08125380A (en) * | 1994-10-19 | 1996-05-17 | Sumitomo Electric Ind Ltd | Shielded flexible wiring-board and manufacturing method thereof |
| JP2002033556A (en) * | 2000-07-18 | 2002-01-31 | Nippon Mektron Ltd | Flexible circuit board |
| CN1391429A (en) * | 2001-06-07 | 2003-01-15 | 明碁电通股份有限公司 | Process for preparing flexible circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4163098B2 (en) | 2008-10-08 |
| TW200522858A (en) | 2005-07-01 |
| KR20050065291A (en) | 2005-06-29 |
| JP2005191076A (en) | 2005-07-14 |
| TWI378764B (en) | 2012-12-01 |
| KR100698496B1 (en) | 2007-03-23 |
| CN1638618A (en) | 2005-07-13 |
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| JP2011254114A (en) | Electronic device |
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