JPH04207099A - Multilayer printed-circuit board - Google Patents
Multilayer printed-circuit boardInfo
- Publication number
- JPH04207099A JPH04207099A JP2339654A JP33965490A JPH04207099A JP H04207099 A JPH04207099 A JP H04207099A JP 2339654 A JP2339654 A JP 2339654A JP 33965490 A JP33965490 A JP 33965490A JP H04207099 A JPH04207099 A JP H04207099A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic shield
- circuit board
- layer
- copper foil
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001721 polyimide Polymers 0.000 abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 17
- 239000011889 copper foil Substances 0.000 abstract description 16
- 239000000853 adhesive Substances 0.000 abstract description 12
- 230000001070 adhesive effect Effects 0.000 abstract description 12
- 239000004020 conductor Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 4
- 239000004642 Polyimide Substances 0.000 abstract description 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- -1 acryl Chemical group 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 6
- 230000007257 malfunction Effects 0.000 description 5
- 239000011888 foil Substances 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、コンピュータ周辺機器、通信機器等、高信
韻性が要求される電子機器の配線板等に使用される多層
プリント基板に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a multilayer printed circuit board used as a wiring board for electronic equipment such as computer peripheral equipment and communication equipment that requires high reliability. be.
近年、コンピュータ周辺機器、通信機器等の電子機器の
配線板に使用するプリント基板には、上記機器の信号伝
送速度の高速度化に対応するため、多層フレキシブルプ
リント基板が用いられている。この多層フレキシブルプ
リント基板は、例えば第４図に示すような構造をしてい
る。すなわち、この多層フレキシブルプリント基板ｌは
３層２．３，４からなり、つぎのようにして製造される
。まず、第１層２は、片面銅張りポリイミドフィルム（
ベース用ポリイミドフィルム）８を用い、銅箔張り面に
通常のサブトラクティブ法（銅箔の不要部分をエツチン
グにより溶解除去する）で回路を形成し、その後、両側
の面に接着剤６．１１付きポリイミドフィルム（カバー
レイ用ポリイミドフィルム）５．１２をそれぞれ熱圧着
して構成される。７は導体である。第２層も片面銅張り
ポリイミドフィルム（ベース用ポリイミドフィルム）１
６を用い、上記と同様にして、銅箔張り面に回路を形成
して構成される。１４は導体、１５は接着剤である。第
３層４は両面銅張りポリイミドフィルム（ベース用ポリ
イミドフィルム）２３を用い、上記と同様にして、両面
に回路を形成し、各面の上に接着剤２１．２４付きポリ
イミドフィルム（カバーレイ用ポリイミドフィルム）２
０゜２６を熱圧着して構成される。２２．２５は導体で
ある。上記３層２，３．４の接合は、各層間に貼り合わ
せ用接着シート１３．１９を介在させ熱圧着することに
より行われる。このようにして構成された多層フレキシ
ブルプリント基板１は、スルーホール穴あけし、これに
スルーホールメツキしてスルーホール２７を形成して使
用に供される。ところが、このような使用において多層
フレキシブルプリント基板の層がさらに多くなったり、
また各層の回路に流れる信号量が多くなると、場合によ
り、誤動作を生じる。2. Description of the Related Art In recent years, multilayer flexible printed circuit boards have been used as printed circuit boards for electronic devices such as computer peripherals and communication devices in order to cope with higher signal transmission speeds of the above devices. This multilayer flexible printed circuit board has a structure as shown in FIG. 4, for example. That is, this multilayer flexible printed circuit board 1 consists of three layers 2, 3, and 4, and is manufactured as follows. First, the first layer 2 is a single-sided copper-clad polyimide film (
Using polyimide film (for base) 8, a circuit is formed on the copper foil surface by the usual subtractive method (dissolving and removing unnecessary parts of the copper foil by etching), and then adhesive 6.11 is attached to both sides. Polyimide film (polyimide film for coverlay) 5.12 is constructed by thermocompression bonding, respectively. 7 is a conductor. The second layer is also a single-sided copper-clad polyimide film (base polyimide film) 1
6, and a circuit is formed on the copper foil covered surface in the same manner as above. 14 is a conductor, and 15 is an adhesive. The third layer 4 uses double-sided copper-clad polyimide film (polyimide film for base) 23, circuits are formed on both sides in the same manner as above, and polyimide film (for coverlay) with adhesive 21 and 24 is applied on each surface. polyimide film) 2
It is constructed by thermo-compression bonding 0°26. 22.25 is a conductor. The three layers 2, 3.4 are joined by thermocompression bonding with a bonding adhesive sheet 13.19 interposed between each layer. The multilayer flexible printed circuit board 1 constructed in this manner is put into use by drilling through holes and plating the through holes to form through holes 27. However, in this kind of use, the number of layers in the multilayer flexible printed circuit board increases,
Furthermore, if the amount of signals flowing through the circuits in each layer increases, malfunctions may occur in some cases.
そこで、本発明者は、上記誤動作を生じる原因について
、鋭意研究を重ねた結果、上記誤動作は、多層フレキシ
ブルプリント基板１のある層を流れる磁力線が他の層に
悪影響を及ぼすために生起することをつきとめた。これ
を防止するため、本発明者は、多層フレキシブルプリン
ト基板１の各層間に、第５図に示すような、金属箔から
なる磁気シールド層３１を設けることを着想した。これ
により、上記磁力線による悪影響を防止し誤動作を無く
すことが可能になる。しかしながら、実際の製造工程に
おいて、多層フレキシブルプリント基板１に、フクレ異
常が場合によって生じるという問題が生じ、この解決が
強く求められている。Therefore, as a result of extensive research into the causes of the above-mentioned malfunctions, the inventors of the present invention have found that the above-mentioned malfunctions occur because lines of magnetic force flowing through one layer of the multilayer flexible printed circuit board 1 have an adverse effect on other layers. I found out. In order to prevent this, the inventor of the present invention came up with the idea of providing a magnetic shield layer 31 made of metal foil as shown in FIG. 5 between each layer of the multilayer flexible printed circuit board 1. This makes it possible to prevent the adverse effects of the magnetic lines of force and eliminate malfunctions. However, in the actual manufacturing process, a problem arises in which blistering abnormalities occur in the multilayer flexible printed circuit board 1 in some cases, and a solution to this problem is strongly desired.
本発明者は、この要請に応えるためさらに研究を重ねた
結果、上記フクレ異常は、製造の際、各層に生じるガス
（主として接着剤から生じるアウトガス）が、上記金属
箔磁気シールド層３１によって遮断され外部へ逃げられ
な（なる結果、フクレが生じることをつき止めた。As a result of further research in response to this request, the inventor of the present invention found that the above blistering abnormality is caused by the fact that gas generated in each layer (mainly outgas generated from the adhesive) during manufacturing is blocked by the metal foil magnetic shielding layer 31. I found out that if you can't escape to the outside, you'll get blisters.
この発明は、このような事情に鑑みなされたもので、上
記磁気シールド層のフクレを無くすことができる多層プ
リント基板の提供をその目的とする。The present invention was made in view of the above circumstances, and an object of the present invention is to provide a multilayer printed circuit board that can eliminate blistering of the magnetic shield layer.
上記目的を達成するため、この発明の多層プリント基板
は、多層プリント基板の各層間を磁気シールドする磁気
シールド層にガス透過部を形成するという構成をとる。In order to achieve the above object, the multilayer printed circuit board of the present invention has a configuration in which a gas permeable portion is formed in a magnetic shield layer that magnetically shields between each layer of the multilayer printed circuit board.
すなわち、この発明の多層プリント基板は、多層プリン
ト基板の各層間を磁気シールドする磁気シールド層にガ
ス透過部を形成している。したがって、部品実装時の半
田付は工程において、半田付は時の高温により、接着剤
等からアウトガスが発生しても、このアウトガスは磁気
シールド層のガス透過部を通って外部に逃げる。このた
め、従来例のように磁気シールド層がフクレるという問
題は生じない。That is, in the multilayer printed circuit board of the present invention, the gas permeable portion is formed in the magnetic shield layer that provides magnetic shielding between each layer of the multilayer printed circuit board. Therefore, even if outgas is generated from the adhesive or the like due to the high temperature during soldering during component mounting, this outgas escapes to the outside through the gas permeable portion of the magnetic shield layer. Therefore, the problem of the magnetic shield layer blistering unlike the conventional example does not occur.
つぎに、この発明を実施例にもとづいて詳細に説明する
。Next, the present invention will be explained in detail based on examples.
第１図はこの発明の一実施例を示す断面図である０図に
おいて、ｌは３層フレキシブルプリント基板である。こ
の３層フレキシブルプリント基板１は、各層間に、丸孔
２８付きの銅箔製磁気シールド層１０．１８を形成して
いる以外は、第４図の３層フレキシブルプリント基板１
と同様な構造になっており、略同様にして製造される。FIG. 1 is a sectional view showing an embodiment of the present invention. In FIG. 0, l represents a three-layer flexible printed circuit board. This three-layer flexible printed circuit board 1 is the same as the three-layer flexible printed circuit board 1 shown in FIG.
It has a similar structure and is manufactured in substantially the same way.
上記磁気シールド層１０．１８（第２図参照）の形成に
ついてより詳しく説明すると、第１層２の磁気シールド
層１０はつぎのようにして形成される。すなわち、両面
銅張りポリイミドフィルム（ベース用ポリイミドフィル
ム）５の一方の銅箔張り面に通常のサブトラクティブ法
で配線回路を形成し、他方の面の銅箔には、６箇所に丸
孔２８をあける。この丸孔２８が形成された銅箔が磁気
シールド層１０となる。また、第２層３の磁気シールド
層１８はつぎのようにして形成される。すなわち、両面
銅張りポリイミドフィルム（ベース用ポリイミドフィル
ム）１６を用い、上記と同様に、一方の銅箔面に配線回
路を形成し、他方の銅箔面に丸孔２８を形成する。この
丸孔２８が形成された銅箔が磁気シールド層１８となる
。９，１７は接着剤である。To explain in more detail the formation of the magnetic shield layer 10.18 (see FIG. 2), the magnetic shield layer 10 of the first layer 2 is formed as follows. That is, a wiring circuit is formed on one copper-clad side of the double-sided copper-clad polyimide film (base polyimide film) 5 by a normal subtractive method, and round holes 28 are formed at six locations in the copper foil on the other side. Open. The copper foil in which the round holes 28 are formed becomes the magnetic shield layer 10. Further, the magnetic shield layer 18 of the second layer 3 is formed as follows. That is, using a double-sided copper-clad polyimide film (base polyimide film) 16, a wiring circuit is formed on one copper foil surface and a round hole 28 is formed on the other copper foil surface in the same manner as described above. The copper foil in which the round holes 28 are formed becomes the magnetic shield layer 18. 9 and 17 are adhesives.
また、上記実施例では、ポリイミドフィルムとして、厚
み１０〜１２５μｍのポリイミドフィルム（商品名Ｋａ
ｐｔｏｎ、東し・デュポン社製、商品名Ａｐｉｃａｌ、
鐘淵化学社製、商品名Ｕｐ１１ｅｘ、宇部興産社製のい
ずれか）を用い、導体および磁気シールドシートとして
、厚み５〜７０μｍの銅箔を用い、接着剤として、厚み
５〜１００μｍのアクリル系、エポキシ−ゴム系および
ポリイミド系の接着剤を用いている。Further, in the above example, a polyimide film (trade name: Ka
pton, manufactured by Azuma DuPont, product name Apical,
A copper foil with a thickness of 5 to 70 μm was used as the conductor and magnetic shield sheet, and an acrylic adhesive with a thickness of 5 to 100 μm was used as the adhesive. Epoxy-rubber and polyimide adhesives are used.
上記実施例により得られた３層フレキシブルプリント基
板と、第５図に示す磁気シールド層を設けた３層フレキ
シブルプリント基板１（対照例）とを、半田付けして２
６０°Ｃに加熱して、上記膨れの発生の有無を調べた。The three-layer flexible printed circuit board obtained in the above example and the three-layer flexible printed circuit board 1 (control example) provided with the magnetic shield layer shown in FIG. 5 are soldered together.
The sample was heated to 60°C, and the presence or absence of the above-mentioned blistering was examined.
この結果を下表に示す。同表から明らかなように、得ら
れた３層フレキシブルプリント基板をそのままの状態（
加湿状態）で半田付けした場合には、対照例ではフクレ
が生じたが、上記実施例では上記フクレは生じなかった
。また、得られた３層フレキシブルプリント基板を乾燥
した後、半田付けした場合には、両者ともに上記膨れは
生じなかった。The results are shown in the table below. As is clear from the table, the obtained 3-layer flexible printed circuit board was used as it was (
When soldering was performed in a humidified state, blistering occurred in the control example, but no blistering occurred in the above-mentioned example. Further, when the obtained three-layer flexible printed circuit board was dried and then soldered, the above-mentioned bulge did not occur in either case.
（以下余白）
なお、上記実施例では、磁気シールド層１０゜１８に丸
穴２８をあけているが、丸穴に限るものではなく、角穴
であってもよく、また、孔をあけるかわりに、ガス透過
膜を設けてもよい。(Left below) In the above embodiment, a round hole 28 is made in the magnetic shielding layer 10°18, but the hole is not limited to a round hole, and may be a square hole. , a gas permeable membrane may be provided.
また、導体および磁気シールド層は銅箔に限るものでは
なく、アルミ箔、その他の金属箔で形成してもよい。Further, the conductor and the magnetic shield layer are not limited to copper foil, and may be formed of aluminum foil or other metal foil.
第３図にはこの発明の他の実施例が示されている。この
実施例では、第１層および第２層がリジッドプリント基
板で、第３層がフレキシブルプリント基板で構成されて
いる。それ以外の部分は、上記実施例と同様の構造であ
り、同様の作用効果を奏する。Another embodiment of the invention is shown in FIG. In this embodiment, the first layer and the second layer are made up of rigid printed circuit boards, and the third layer is made up of a flexible printed board. The other parts have the same structure as the above embodiment, and produce the same effects.
〔発明の効果］
以上のように、この発明の多層プリント基板は、多層プ
リント基板の各層間を磁気シールドし、かつ磁気シール
ド層にガス透過部を形成している、したがって、ある層
で生起した磁力線が他層に悪影響を与えることにもとづ
いて誤動作を防止することができ、しかも各層間に溜ま
るガスを、上記ガス透過部を通し樹脂部から外部へ逃が
しうる、その結果、ガスにもとづくフクレが生じない。[Effects of the Invention] As described above, the multilayer printed circuit board of the present invention provides magnetic shielding between each layer of the multilayer printed circuit board, and forms a gas permeable portion in the magnetic shield layer. It is possible to prevent malfunctions due to magnetic lines of force having an adverse effect on other layers, and moreover, the gas that accumulates between each layer can be released from the resin part to the outside through the gas permeable part.As a result, blisters caused by gas can be prevented. Does not occur.
すなわち、部品実装時の半田付は工程等において、各層
の接着剤等からアウトガスが発生しても、このアウトガ
スは磁気シールド層のガス透過部を通って外部に逃げる
。このため、ガスにもとづく異常フクレが生じない。That is, even if outgas is generated from the adhesive of each layer during the soldering process during component mounting, this outgas escapes to the outside through the gas permeable portion of the magnetic shield layer. Therefore, abnormal blisters caused by gas do not occur.
第１図はこの発明の一実施例を示す断面図、第２図は磁
気シールド層の説明図、第３図は他の実施例の多層プリ
ント基板の平面図、第４図は従来例の多層プリント基板
の断面図、第５図はその磁気シールド層の説明図である
。
１・・・多層フレキシブルプリント基板 １０゜１８
・・・磁気シールド層
特許出願人 日東電工株式会社Fig. 1 is a sectional view showing one embodiment of the present invention, Fig. 2 is an explanatory diagram of a magnetic shield layer, Fig. 3 is a plan view of a multilayer printed circuit board of another embodiment, and Fig. 4 is a multilayer printed circuit board of a conventional example. FIG. 5, a cross-sectional view of the printed circuit board, is an explanatory diagram of its magnetic shield layer. 1...Multilayer flexible printed circuit board 10°18
...Magnetic shielding layer patent applicant Nitto Denko Corporation
Claims (2)
気シールド層にガス透過部を形成したことを特徴とする
多層プリント基板。(1) A multilayer printed circuit board characterized in that a gas permeable portion is formed in a magnetic shield layer that magnetically shields between each layer of the multilayer printed circuit board.
シブルプリント基板で構成した請求項（１）記載の多層
プリント基板。(2) The multilayer printed circuit board according to claim 1, wherein at least one layer of the multilayer printed circuit board is made of a flexible printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2339654A JPH04207099A (en) | 1990-11-30 | 1990-11-30 | Multilayer printed-circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2339654A JPH04207099A (en) | 1990-11-30 | 1990-11-30 | Multilayer printed-circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04207099A true JPH04207099A (en) | 1992-07-29 |
Family
ID=18329546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2339654A Pending JPH04207099A (en) | 1990-11-30 | 1990-11-30 | Multilayer printed-circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04207099A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1359676A1 (en) * | 2001-02-06 | 2003-11-05 | NEC Corporation | Portable telephone |
| JP2005191076A (en) * | 2003-12-24 | 2005-07-14 | Nippon Mektron Ltd | Electromagnetic shielding flexible circuit board |
| JP2007095978A (en) * | 2005-09-29 | 2007-04-12 | Dainippon Printing Co Ltd | Magnetic shield material and motor package |
| WO2016035630A1 (en) * | 2014-09-03 | 2016-03-10 | 株式会社村田製作所 | Embedded component substrate and substrate flaw detection method |
-
1990
- 1990-11-30 JP JP2339654A patent/JPH04207099A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1359676A1 (en) * | 2001-02-06 | 2003-11-05 | NEC Corporation | Portable telephone |
| EP1359676A4 (en) * | 2001-02-06 | 2005-04-13 | Nec Corp | Portable telephone |
| US7142817B2 (en) | 2001-02-06 | 2006-11-28 | Nec Corporation | Portable telephone |
| JP2005191076A (en) * | 2003-12-24 | 2005-07-14 | Nippon Mektron Ltd | Electromagnetic shielding flexible circuit board |
| JP2007095978A (en) * | 2005-09-29 | 2007-04-12 | Dainippon Printing Co Ltd | Magnetic shield material and motor package |
| WO2016035630A1 (en) * | 2014-09-03 | 2016-03-10 | 株式会社村田製作所 | Embedded component substrate and substrate flaw detection method |
| JPWO2016035630A1 (en) * | 2014-09-03 | 2017-04-27 | 株式会社村田製作所 | Component built-in board and board inspection method |
| US10338031B2 (en) | 2014-09-03 | 2019-07-02 | Murata Manufacturing Co., Ltd. | Component-embedded substrate and substrate flaw detecting method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100704919B1 (en) | Coreless substrate and manufacturing method thereof | |
| US9860978B1 (en) | Rigid-flex board structure | |
| US20060258053A1 (en) | Method for manufacturing electronic component-embedded printed circuit board | |
| KR20160099934A (en) | Rigid-flexible printed circuit board and method for manufacturing the same | |
| JP2005268505A (en) | Multilayer wiring board and its manufacturing method | |
| JP2002158445A (en) | Rigid-flexible printed wiring board and its manufacturing method | |
| JP3224889B2 (en) | Printed wiring board and its manufacturing method | |
| JPH04207099A (en) | Multilayer printed-circuit board | |
| WO2007116622A1 (en) | Multilayer circuit board having cable portion and method for manufacturing same | |
| KR101077430B1 (en) | Fabricating Method of Rigid-Flexible substrate | |
| JP2009044124A (en) | Multi-layer printed circuit board and method for manufacturing the same | |
| JPH05145205A (en) | Flexible circuit board with electromagnetic shielding layer and its manufacture | |
| JPH05327227A (en) | Blind hole and its production | |
| KR102193046B1 (en) | Making method of Printed circuit board | |
| TWI755556B (en) | Carrier substrate and printed circuit board fabricated using the same | |
| KR100632564B1 (en) | Rigid-flexible printed circuit board and method for manufacturing the same | |
| JP3237416B2 (en) | Inner layer circuit board and multilayer printed copper-clad laminate using the inner layer circuit board | |
| JPH06216533A (en) | Production of printed wiring board | |
| JPH0541580A (en) | Multilayer circuit board | |
| JPH03285382A (en) | Printed wiring board | |
| CN112543545A (en) | Circuit board and manufacturing method thereof | |
| JP5312831B2 (en) | Method for manufacturing printed wiring board | |
| JP3535509B2 (en) | Manufacturing method of printed wiring board | |
| JPH1154871A (en) | Printed circuit board and its manufacture | |
| JPH10190158A (en) | Rigid flexible printed wiring board and its manufacture |