JPH10190158A - Rigid flexible printed wiring board and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a rigid flexible printed wiring board having a connection terminal at a low cost. SOLUTION: A connection terminal 10 has a layered structure in which a core material 18 is stuck to the upper surface of a base film 12 carrying a conductor circuit 14a on its lower surface with an adhesive layer 15. In a rigid section 30, the adhesive layer 15, the core material 18, and an insulating layer 32 are provided on the upper surface of the base film 12. On the other hand, an adhesive layer 16, a core material 19, and an insulating layer 33 are provided on the lower surface of the base film 12. The adhesive layers 15 and 16 of the terminal 10 and rigid section 30 are made of the same material and the core materials 18 and 19 of the terminal 10 and rigid section 30 are also made of the same material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reinforcing plate for a connector connecting portion of a rigid / flex printed circuit board.

[0002]

2. Description of the Related Art Conventionally, printed wiring boards are provided with connection terminals for connecting to electronic components and electronic equipment, and the connection terminals are inserted into connectors of the electronic components and electronic equipment. The connection terminals of such a printed wiring board are required to have a certain degree of hardness in order to be inserted into a connector. Therefore, the connection terminals are provided with sufficient hardness by bonding a reinforcing plate made of an acrylic resin or the like with an adhesive to the surface opposite to the surface on which the circuit is formed of copper foil.

[0003]

However, according to such a step of additionally bonding a reinforcing plate, a process of forming and bonding the reinforcing plate is required in addition to a normal laminating step and the like, so that the manufacturing cost is high. Had become a factor.

An object of the present invention is to solve the above-mentioned problems, and to provide an inexpensive method for manufacturing a rigid-flex printed wiring board having connection terminals and a reinforcing plate in a flex portion.

[0005]

According to the present invention, there is provided a rigid rigid body.
The flex printed wiring board is a rigid flex printed wiring board having a connection terminal connected to a connector of an electronic component or an electronic device, and corresponds to a flex portion via an adhesive layer on at least one surface of a base film. The core material, which is a continuous sheet having openings to be formed, is laminated and subjected to external processing to form connection terminals and rigid portions.

For example, a core material is used as a reinforcing plate for connection terminals, and a rigid portion and connection terminals are connected only by a base film and an adhesive layer.

Further, the rigid-flex printed wiring board according to the present invention has a core material included in a layer structure of a connection terminal connected to a connector of an electronic component or an electronic device, and a core material included in a layer structure of a rigid portion. The material is a member made of the same material.

A method for manufacturing a rigid-flex printed wiring board according to the present invention is a method for manufacturing a rigid-flex printed wiring board having a terminal portion provided with a connection terminal connected to a connector of an electronic component or an electronic device. And a step of arranging a semi-cured adhesive layer on both sides except for the connection terminals on the base film provided with the conductor circuits on both surfaces and the connection terminals on one surface of the terminal portion, A step of laminating the formed core material on a portion excluding the flex portion and the connection terminal.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a connection terminal portion of the printed wiring board of the present embodiment, and FIG.
It is arrow sectional drawing. 1 and 2, the connection terminal 10 has a layer structure in which a core material 18 is laminated via an adhesive layer 15 on an upper surface of a base film 12 provided with a copper foil layer 14a as a connection terminal circuit on the lower surface. doing. In this specification, the “core material” refers to a base material provided with at least one insulating layer and at least one conductive layer. Due to the core material 18 being laminated, the connection terminal 10 has sufficient hardness to connect to the connector of the electronic component. Flex part 2
Numeral 0 is a portion composed of the base film 12, the adhesive layers 15 and 16, and has flexibility.

In the rigid portion 30, a conductive circuit 14b is formed by etching the copper foil layer 14 on both sides of the base film 12, and further, an adhesive layer 15 is formed on the upper surface, and an adhesive layer 16 is formed on the lower surface. It is laminated.
A core material 18 is laminated on the upper surface of the adhesive layer 15, and an insulating layer 32 is provided on the upper surface of the core material 18. An IVH (interstitial via hole) 50 is provided in the core material 18. On the other hand, a core material 19 is laminated on the lower surface of the adhesive layer 16, and an insulating layer 33 is provided on the lower surface of the core material 19. The core material 19 includes the core material 1
An IVH 60 is provided like the IVH 50 of FIG.
Further, in the vicinity of the IVHs 50 and 60, through through holes 70 penetrating through the respective layers of the rigid portion 30 are provided.
The insulating layer 32 is a solder resist for the IVH 50 and the through hole 70, and the insulating layer 33 is a solder resist for the IVH 60 and the through hole 70.

The same reference numerals in FIGS. 1 and 2 denote the same members. That is, the base film 12 is a single sheet that connects the connection terminals 10, the flex portion 20, and the rigid portion 30. The adhesive layer 15 in the connection terminal 10, the flex portion 20, and the rigid portion 30 is a single layer, and the adhesive layer 16 in the flex portion 20, the rigid portion 30 is also a single layer. The core member 18 in the connection terminal 10 and the core member 18 in the rigid portion 30 are the same members.

Next, a manufacturing process of the rigid / flex printed circuit board according to the present embodiment will be described with reference to FIGS. In FIG. 3, copper foil layers 14 are provided on both surfaces of the base film 12. The copper foil layer 14 is etched to provide conductor circuits 14a and 14b as shown in FIG. In FIG. 4, a conductor circuit 14a is a conductor circuit serving as a connection circuit for connection terminals.

A conductor circuit 14 is provided on the base film 12 shown in FIG.
An adhesive layer is provided on all sides except a. FIG. 5 is a cross-sectional view at the stage when an adhesive layer is provided on the base film 12. An adhesive layer 15 is provided on the upper surface of the base film 12, and an adhesive layer 16 is provided on the lower surface except for the conductor circuit 14a.

Next, a core member 18 having an opening 18a and a core member 19 having an opening 19a as described later.
A circuit is formed on the base film 12 and the core material 18,
19 are collectively laminated. FIG. 6 is an exploded cross-sectional view showing a layer structure when the core members 18 and 19 and the base film 12 are laminated, and FIG. 7 is a cross-sectional view showing a layer structure of a laminate formed by batch lamination. The core member 18 has an opening 18a, and further includes a through hole 51, a conductor circuit 5
2 are provided. Similarly, a through-hole 61 and a conductor circuit 62 are provided in the core member 19. As shown in FIG. 6, a core material 18 is disposed on the upper surface of the base film 12 such that the surface on which the conductive circuit 52 is formed is in contact with the base film 12, and the core material 19 is disposed on the lower surface of the base film 12 with a conductor. The surface on which the circuit 62 is formed is the base film 1
2 so as to abut. After the batch lamination, the adhesive layers provided on both surfaces of the base film 12 flow into the through holes 51 and 61, respectively, as shown in FIG.

Next, as shown in FIG.
The adhesive layer overflowing from 1 and 61 is polished and removed, and each layer of the laminate is inserted to form a hole 71 constituting a through-hole 70.

Next, as shown in FIG. 9, copper plating 80 is applied to the rigid portion 30, and as shown in FIG. 10, a circuit is formed on the outermost layer of the laminate to form IVHs 50 and 60 and through-holes 70. By forming the insulating layers 32 and 33, which are solder resists, in portions where soldering is unnecessary in the outermost layer of the laminate of FIG. 10, a laminate having the same layer structure as that shown in FIG. 2 can be obtained.

The laminate thus obtained is subjected to an outer shape processing. FIG. 11 is a perspective view showing the core members 18 and 19 before the outer shape processing is performed in the manufacturing process of the printed wiring board of the present embodiment. The core member 18 has an opening 18a. Further, as described above, the insulating layer 32 is provided on a portion to be a rigid portion on the upper surface side,
The base film 12 is provided on the lower surface via an adhesive layer 15 (see FIG. 2). The core material 19 has an opening 19a.
The opening 19a is provided in the opening 1 of the core material 18.
8a and a size corresponding to the connection terminal forming portion 18b. Further, as described above, the base film 12 is provided on the upper surface side with the adhesive layer 16 interposed therebetween, and the insulating layer 33 is provided on the lower portion side to be a rigid portion (see FIG. 2). The outer shape processing is performed on such a core material 18, 1
9 is performed so as to obtain a printed wiring board having a shape shown by a dotted line on the surface of FIG.

1 and 2 by this outer shape processing.
The printed wiring board having the connection terminal 10, the flex portion 20, and the rigid portion 30 shown in FIG. That is, the connection terminal 10 includes a connection terminal configuration portion 18b (see FIG. 11) near the opening 18a in the core material 18, and the adhesive layer 1
5, a portion corresponding to the connection terminal forming portion 18b of the core material 18, and the base film 12 having the connection terminal forming portion 1
8b and a conductor circuit 14a (see FIG. 2) formed on the lower surface of the portion corresponding to the connection terminal forming portion 18b. Further, a portion corresponding to the opening 18a of the core material 18 in the base film 12, the adhesive layers 15 and 16 becomes the flex portion 20, and the rigid portion 30
Is the base film 12, the adhesive layers 15, 16, the core material 1
8, 19, and insulating layers 32 and 33.

As described above, according to the present embodiment, in manufacturing the connection terminal portion, it is only necessary to perform a normal process of laminating and forming an outer shape for forming a rigid portion. There is no need to perform another step.
Therefore, the manufacturing cost can be reduced.

Although the rigid-flex printed circuit board of the present embodiment has six layers of conductor circuits, the present invention is not limited to this, and the rigid-flex printed circuit board is not limited to this. A layer of a conductor circuit may be formed.

[0021]

As described above, according to the present invention, a rigid / flex printed circuit board having connection terminals for connecting to connectors of electronic components can be manufactured at low cost.

[Brief description of the drawings]

FIG. 1 is a perspective view of a portion near a connection terminal of a rigid / flex printed circuit board according to the present invention.

FIG. 2 is a cross-sectional view illustrating a layer structure of a portion near a connection terminal of the rigid-flex printed wiring board of the present invention.

FIG. 3 is a cross-sectional view showing a layer structure of a base film used for a rigid / flex printed circuit board of the present invention.

FIG. 4 is a cross-sectional view at a stage where a conductive circuit is formed on a base film.

FIG. 5 is a cross-sectional view of a stage where adhesive layers are provided on both surfaces of a base film.

FIG. 6 is an exploded cross-sectional view showing a positional relationship when laminating a core material and a base film.

FIG. 7 is a cross-sectional view of a stage where a laminated body is obtained by laminating a core material and a base film all at once.

FIG. 8 is a cross-sectional view at a stage where holes forming a through-hole are formed in the laminate.

FIG. 9 is a cross-sectional view of a stage where copper plating has been applied to the laminate.

FIG. 10 is a cross-sectional view of a stage where a circuit is formed on the outermost layer of the laminate.

FIG. 11 is a perspective view of a core material which is a continuous sheet having an opening.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Connection terminal 20 Flex part 30 Rigid part 12 Base film 15, 16 Adhesive layer 18, 19 Core material 32, 33 Insulating layer

Claims (5)

[Claims] An opening corresponding to the flex portion on at least one surface of a base film via an adhesive layer in a rigid-flex printed wiring board having connection terminals connected to a connector of an electronic component or an electronic device. A rigid / flex-printed wiring board characterized in that a core material, which is a continuous sheet having a portion, is laminated and subjected to an outer shape processing to form the connection terminal and the rigid portion. 2. The rigid / flex printed wiring board according to claim 1, wherein the core material is used as a reinforcing plate for the connection terminal. 3. The rigid / flex printed wiring board according to claim 2, wherein said rigid portion and said connection terminal are connected only by said base film and said adhesive layer. 4. A core material included in a layer structure of a connection terminal connected to a connector of an electronic component or an electronic device and a core material included in a layer structure of a rigid portion are members made of the same material. Rigid flex printed wiring board characterized by the following. 5. A method for manufacturing a rigid / flex printed circuit board having a terminal portion provided with a connection terminal connected to a connector of an electronic component or an electronic device, wherein a conductor circuit is provided on both surfaces and A step of arranging a semi-cured adhesive layer on both surfaces except for the connection terminals on a base film provided with the connection terminals on one surface of the terminal portion, and a core material excluding the flex portion and the connection terminals; A method for manufacturing a rigid-flex printed wiring board, comprising: