JP3227681B2 - Composite flexible printed circuit board - Google Patents
Composite flexible printed circuit boardInfo
- Publication number
- JP3227681B2 JP3227681B2 JP07886193A JP7886193A JP3227681B2 JP 3227681 B2 JP3227681 B2 JP 3227681B2 JP 07886193 A JP07886193 A JP 07886193A JP 7886193 A JP7886193 A JP 7886193A JP 3227681 B2 JP3227681 B2 JP 3227681B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- flexible printed
- composite
- manufactured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Combinations Of Printed Boards (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、フレキシブルフィル
ム上に配線層が形成されている可撓性プリント基板（Ｆ
ＰＣ）に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed circuit board (F) in which a wiring layer is formed on a flexible film.
PC).
【０００２】[0002]
【従来の技術】可撓性プリント基板（ＦＰＣ）は、ポリ
イミド、ポリエステル等のフレキシブルフィルムからな
る絶縁層と銅箔等からなる配線層との積層体であり、各
種電子機器においてリジッドな配線基板を接続する配線
基板として有用なものとなっている。そして、近年の電
子機器の小型化の要請により配線の高密度化、多層化が
進行するのに伴って、可撓性プリント基板に形成する配
線層もファインピッチ化されている。また、電子機器の
種類の多用化に伴って、可撓性プリント基板にも多品種
化が要求されている。2. Description of the Related Art A flexible printed circuit board (FPC) is a laminate of an insulating layer made of a flexible film such as polyimide or polyester and a wiring layer made of a copper foil or the like. It is useful as a wiring board for connection. With the demand for smaller electronic devices in recent years, the wiring layers formed on flexible printed circuit boards have become finer with the progress of higher density and multilayer wiring. In addition, with the diversification of types of electronic devices, a variety of flexible printed circuit boards is required.
【０００３】このような可撓性プリント基板の製造に際
しては、原材料として、一般に、ポリイミド、ポリエス
テル等の有機材料フィルムに接着剤により銅箔をラミネ
ートしたＦＰＣ材料が使用される。そして、可撓性プリ
ント基板の配線層は、ＦＰＣ材料の銅箔を所定形状にパ
ターニングすることにより形成される。この場合、配線
層の形成方法としては、ＦＰＣ材料にエッチングレジス
トをスクリーン印刷して乾燥、硬化させ、エッチング
し、エッチングレジストを剥離するスクリーン印刷法
や、ＦＰＣ材料に感光性ドライフィルムレジストをラミ
ネートして露光し、現像し、エッチングし、レジストを
剥離する写真法などが採用されている。配線層の形成
後、所定形状に外形を打ち抜く外形抜きが行われ、さら
に必要に応じて、可撓性プリント基板の端子部をコネク
タ等に接続する場合に、その端子部の機械的強度を高め
るために、その端子部の裏面に補強板が貼られ、可撓性
プリント基板は製品とされる。In manufacturing such a flexible printed circuit board, an FPC material obtained by laminating a copper foil with an adhesive on an organic material film such as polyimide or polyester is generally used as a raw material. Then, the wiring layer of the flexible printed board is formed by patterning a copper foil of an FPC material into a predetermined shape. In this case, as a method of forming the wiring layer, an etching resist is screen-printed on an FPC material, dried, cured, etched, and a screen printing method of peeling off the etching resist, or a photosensitive dry film resist is laminated on the FPC material. A photo method of exposing, developing, etching, and stripping the resist is employed. After the formation of the wiring layer, the outer shape is punched out in a predetermined shape, and if necessary, when connecting the terminal portion of the flexible printed board to a connector or the like, the mechanical strength of the terminal portion is increased. Therefore, a reinforcing plate is attached to the back surface of the terminal portion, and the flexible printed circuit board is a product.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、可撓性
プリント基板は、上述のようにして製造される工程中に
熱的、化学的、機械的処理を受けて加工歪みをきたし、
製品の歩留まりを向上させることができないという問題
があった。特に、端子部においてはファインピッチの配
線層を、その端子部が接続されることとなる種々のコネ
クター等に応じて精度高く外形抜きすることが要求され
るので、累積ピッチずれや外形抜き精度が問題となり、
欠陥が発生し易い。そのため、このような端子部の欠陥
のために製品全体としても不良品となり、製品の歩留ま
りが低下し、多くの材料ロスが生じることが問題となっ
ていた。However, the flexible printed circuit board is subjected to thermal, chemical, and mechanical treatments during the manufacturing process as described above, resulting in processing distortion.
There has been a problem that the product yield cannot be improved. In particular, in the terminal portion, it is required that the fine-pitch wiring layer be accurately punched out according to various connectors to which the terminal portion is to be connected. Problem
Defects are likely to occur. Therefore, such a defect of the terminal portion causes the entire product to be defective, resulting in a decrease in product yield and a large amount of material loss.
【０００５】この発明は以上のような従来技術の問題点
を解決しようとするものであり、ファインピッチの配線
層を精度高く形成することが要求される端子部を有する
可撓性プリント基板の歩留まりを向上させ、材料ロスを
最小限に抑制することを目的としている。The present invention has been made to solve the above-mentioned problems of the prior art, and has a yield of a flexible printed circuit board having a terminal portion required to form a fine-pitch wiring layer with high accuracy. And to minimize material loss.
【０００６】[0006]
【課題を解決するための手段】この発明者らは、不良箇
所が発生しやすい端子部と、それ以外の回路配線部とを
別個の基板に製造し、両者を一体化させて複合可撓性プ
リント基板を製造することにより上述の目的が達成でき
ることを見出し、この発明を完成させるに至った。Means for Solving the Problems The present inventors manufacture a terminal portion in which a defective portion is likely to occur and a circuit wiring portion other than the terminal portion on separate substrates, and integrate them to form a composite flexible member. It has been found that the above object can be achieved by manufacturing a printed circuit board, and the present invention has been completed.
【０００７】すなわち、この発明は、回路配線部が形成
された第１の可撓性プリント基板と該回路配線部の外部
端子となる端子部が形成された第２のプリント基板とが
電気的に接続され、且つ一体化されている複合可撓性プ
リント基板であって、第１の可撓性プリント基板と第２
のプリント基板との接続部の配線パターンピッチより
も、第２のプリント基板の外部端子部の配線パターンピ
ッチの方が狭いことを特徴とする複合可撓性プリント基
板を提供する。That is, according to the present invention, a first flexible printed circuit board on which a circuit wiring portion is formed and a second printed circuit board on which a terminal portion serving as an external terminal of the circuit wiring portion are formed are electrically connected. Connected and integrated composite flexible plug
A lint substrate, comprising a first flexible printed circuit board and a second flexible printed circuit board.
From the wiring pattern pitch of the connection part with the printed circuit board
Also, the wiring pattern pins on the external terminals of the second printed circuit board
The present invention provides a composite flexible printed circuit board having a narrower switch.
【０００８】この発明の複合可撓性プリント基板におい
て、第１の可撓性プリント基板及び第２のプリント基板
の基板材料としては、従来の可撓性プリント基板と同様
に種々のＦＰＣ材料を使用することができ、さらに第２
のプリント基板の基板材料としてはフレキシブルなもの
に限らずリジッドなものも使用することができる。この
ような基板材料を構成する絶縁層や配線層の種類や層数
に特に制限はない。また、この場合、第１の可撓性プリ
ント基板と第２のプリント基板とは同一のＦＰＣ材料か
ら形成してもよいが、必要に応じて異なる種類のＦＰＣ
材料から形成してもよい。例えば、第２のプリント基板
の端子部がコネクターに差込まれて使用される場合、そ
の差込みを容易にし、コネクターとの接続部の強度を大
きくするために、第２のプリント基板の端子部は機械的
強度が大きいことが好ましいが、このためには第２のプ
リント基板を形成するＦＰＣ材料として、第１のプリン
ト基板を形成するＦＰＣ材料よりも絶縁層が厚く、補強
機能を担えるものを使用することが好ましい。[0008] In the composite flexible printed circuit board of the present invention, various FPC materials are used for the first flexible printed circuit board and the second printed circuit board as in the case of the conventional flexible printed circuit board. Can also be a second
The substrate material of the printed circuit board is not limited to a flexible one, but may be a rigid one. There is no particular limitation on the type and number of insulating layers and wiring layers constituting such a substrate material. Also, in this case, the first flexible printed circuit board and the second printed circuit board may be formed from the same FPC material, but different types of FPC materials may be used if necessary.
It may be formed from a material. For example, when the terminal portion of the second printed circuit board is used by being inserted into the connector, the terminal portion of the second printed circuit board is used in order to facilitate the insertion and increase the strength of the connection portion with the connector. Although it is preferable that the mechanical strength is large, an FPC material that forms the second printed circuit board has a thicker insulating layer than that of the FPC material that forms the first printed circuit board and can perform a reinforcing function. Is preferred.
【０００９】第１の可撓性プリント基板及び第２のプリ
ント基板を製造するに際して、それらの配線層は、ＦＰ
Ｃ材料を常法に従ってスクリーン印刷法や写真法等によ
りパターニングして形成することができる。この場合、
第２のプリント基板を第１の可撓性プリント基板の外部
端子として接続できるように、両者の接続部における配
線パターンを整合させる。また、必要に応じて第１の可
撓性プリント基板や第２のプリント基板に切欠部を設
け、両者の配線層が直接重ね合わさるようにしてもよ
く、あるいはスルーホールにより接続されるようにして
もよい。In manufacturing the first flexible printed circuit board and the second printed circuit board, their wiring layers are FP
It can be formed by patterning C material by a screen printing method, a photographic method, or the like according to a conventional method. in this case,
The wiring patterns at the connection portions of both are matched so that the second printed board can be connected as an external terminal of the first flexible printed board. Further, if necessary, a notch may be provided in the first flexible printed board or the second printed board so that both wiring layers may be directly overlapped with each other, or may be connected by a through hole. Is also good.
【００１０】なお、第２のプリント基板の外部端子とな
る端子部においては、配線層は外部端子のパターンに応
じてファインピッチに形成することが必要とされるが、
第１の可撓性プリント基板の配線層には必ずしもそのよ
うにファインピッチに形成することは必要とされない。
したがって、第１の可撓性プリント基板の歩留まりを第
２のプリント基板の歩留まりに比べて高くすることが可
能となる。In a terminal portion serving as an external terminal of the second printed circuit board, the wiring layer needs to be formed at a fine pitch in accordance with the pattern of the external terminal.
The wiring layer of the first flexible printed circuit board is not necessarily required to be formed at such a fine pitch.
Therefore, the yield of the first flexible printed circuit board can be made higher than that of the second flexible printed circuit board.
【００１１】第１の可撓性プリント基板及び第２のプリ
ント基板を電気的に接続して一体化するに際しては、両
者の接続部に異方性導電膜あるいは半田を使用して両者
を接合すればよい。この場合、第１の可撓性プリント基
板と第２のプリント基板との接続部の機械的強度を強化
するため、さらに補強板を積層してもよく、また、表面
に配線層が露出する場合にはその配線層を保護するた
め、さらにカバーレイを積層してもよい。When electrically connecting and integrating the first flexible printed circuit board and the second printed circuit board, the two parts are joined by using an anisotropic conductive film or solder at the connection part. I just need. In this case, in order to strengthen the mechanical strength of the connection portion between the first flexible printed circuit board and the second printed circuit board, a reinforcing plate may be further laminated, and when the wiring layer is exposed on the surface. In order to protect the wiring layer, a coverlay may be further laminated.
【００１２】[0012]
【作用】この発明の複合可撓性プリント基板によれば、
不良発生率が低い回路配線部を有する第１の可撓性プリ
ント基板と、不良発生率が高い端子部を有する第２のプ
リント基板とを別個の基板として製造し、両者を接続し
て一体化させることにより製造できるので、仮に端子部
を有する第２のプリント基板に不良品が発生しても、良
好に製造された回路配線部を有する第１の可撓性プリン
ト基板までロスすることがない。したがって、製品全体
としての歩留まりを向上させることが可能となる。According to the composite flexible printed circuit board of the present invention,
A first flexible printed circuit board having a circuit wiring portion having a low failure rate and a second printed circuit board having a terminal portion having a high failure rate are manufactured as separate substrates, and the two are connected and integrated. Therefore, even if a defective product is generated on the second printed circuit board having the terminal portion, no loss occurs to the first flexible printed circuit board having the well-manufactured circuit wiring portion. . Therefore, it is possible to improve the yield as a whole product.
【００１３】また、端子部は接続するコネクター等の種
類に応じて種々の配線パターンや外形に形成することが
必要とされるが、一般に、コネクターのある種のものは
種々の電子機器に共通して使用される。したがって、こ
の発明によれば、回路配線部を有する第１の可撓性プリ
ント基板とは別個に、端子部を有する第２のプリント基
板のみをコネクター等の種類に応じて製造しておき、そ
のような第２のプリント基板を第１の可撓性プリント基
板に対して適宜組み合わせることにより所期の可撓性プ
リント基板を製造できるので、多品種の可撓性プリント
基板を製造する場合の製造効率を向上させることが可能
となる。Further, it is necessary to form the terminal portion into various wiring patterns and external shapes according to the type of the connector or the like to be connected. In general, a certain type of connector is common to various electronic devices. Used. Therefore, according to the present invention, separately from the first flexible printed circuit board having the circuit wiring section, only the second printed circuit board having the terminal section is manufactured in accordance with the type of the connector or the like, and The desired flexible printed circuit board can be manufactured by appropriately combining such a second printed circuit board with the first flexible printed circuit board. Efficiency can be improved.
【００１４】[0014]
【実施例】以下、この発明の実施例を図面に基づいて具
体的に説明する。なお、各図中、同一符号は同一または
同等の要素を表している。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be specifically described below with reference to the drawings. In each drawing, the same reference numerals represent the same or equivalent elements.
【００１５】実施例１ 外部端子が両面スプリング式コネクターに接続される複
合可撓性プリント基板を、第１の可撓性プリント基板と
第２のプリント基板とから次のように製造した。Example 1 A composite flexible printed circuit board having external terminals connected to a double-sided spring connector was manufactured from a first flexible printed circuit board and a second printed circuit board as follows.
【００１６】（第１の可撓性プリント基板の製造）図１
（ａ(i) ）に示したように、第１の可撓性プリント基板
１０のＦＰＣ材料として、銅箔（厚さ３５μｍ）１１と
ポリイミドフィルム（厚さ２５μｍ）１２とが接着剤
（厚さ２０μｍ）１３を介して積層されているＦＰＣ材
料（ソニーケミカル（株）製、ＣＫ１−０３０２Ａ）１
４を使用し、その銅箔１１に写真法で０．５ｍｍピッチ
の配線層を形成した。(Manufacture of First Flexible Printed Circuit Board) FIG.
As shown in (a (i)), as an FPC material of the first flexible printed circuit board 10, a copper foil (thickness of 35 μm) 11 and a polyimide film (thickness of 25 μm) 12 are bonded with an adhesive (thickness). FPC material (CK1-0302A, manufactured by Sony Chemical Co., Ltd.)
Using No. 4, a wiring layer having a 0.5 mm pitch was formed on the copper foil 11 by a photographic method.
【００１７】次に、同図（ａ(ii)）に示したように、第
２のプリント基板との接続部１０ａを除き、その配線層
上にカバーレイとして、ポリイミドフィルム（厚さ２５
μｍ）１５と接着剤（厚さ２０μｍ）１６からなるフィ
ルム（ソニーケミカル（株）製、ＣＦＫ−２）１７を熱
圧着（１６０℃、２０ｋｇ／ｃｍ２、３０分）し、さら
に接続部１０ａに半田メッキ層（厚さ５μｍ）１８を形
成した。なお、このような接続部には半田メッキに代え
て、金メッキを施してもよい。Next, as shown in FIG. 1 (a (ii)), a polyimide film (thickness 25 mm) is formed as a coverlay on the wiring layer except for the connection portion 10a with the second printed circuit board.
μm) 15 and an adhesive (thickness 20 μm) 16 (CFK-2, manufactured by Sony Chemical Co., Ltd.) 17 is thermocompression-bonded (160 ° C., 20 kg / cm 2 , 30 minutes), and further connected to the connection part 10a. A solder plating layer (thickness: 5 μm) 18 was formed. Note that gold plating may be applied to such a connection portion instead of solder plating.
【００１８】（第２のプリント基板の製造）図１（ｂ
(i) ）に示したように、第２のプリント基板２０のＦＰ
Ｃ材料として、銅箔（厚さ１８μｍ）２１とポリイミド
フィルム（厚さ２５μｍ）２２とが接着剤（厚さ２０μ
ｍ）２３を介して積層されているＦＰＣ材料（ソニーケ
ミカル（株）製、ＣＫ１−０３０２Ａ）２４を使用し、
その銅箔２１の第１の可撓性プリント基板との接続部２
０ａに写真法で０．５ｍｍピッチの配線層を形成し、同
様に銅箔２１のコネクターとの接続部２０ｂに０．３ｍ
ｍピッチの配線層を形成した。(Manufacture of Second Printed Circuit Board) FIG.
As shown in (i)), the FP of the second printed circuit board 20 is used.
As a C material, a copper foil (thickness: 18 μm) 21 and a polyimide film (thickness: 25 μm) 22 are bonded with an adhesive (thickness: 20 μm)
m) Using FPC material (CK1-0302A, manufactured by Sony Chemical Co., Ltd.) 24 laminated through 23,
Connection part 2 of the copper foil 21 with the first flexible printed circuit board
A wiring layer having a pitch of 0.5 mm is formed by a photographic method on 0a.
An m-pitch wiring layer was formed.
【００１９】次に、同図（ｂ(ii)）に示したように、こ
のように形成した第２のプリント基板の配線層の第１の
可撓性プリント基板との接続部２０ａ及びコネクターと
の接続部２０ｂ上に半田メッキ層（厚さ５μｍ）２５
ａ、２５ｂをそれぞれ形成した。Next, as shown in FIG. 2 (b (ii)), the connection portion 20a of the wiring layer of the second printed circuit board formed in this manner with the first flexible printed circuit board and the connector are formed. Plated layer (thickness: 5 μm) 25 on the connecting portion 20b
a and 25b were respectively formed.
【００２０】また、コネクターとの接続強度を向上させ
るために、補強板としてガラスエポキシ板（厚さ０．２
ｍｍ）２６を、アクリル樹脂系粘着テープ（ソニーケミ
カル（株）製、Ｔ４１００）を使用して配線層と反対側
の面に貼合わせた。なお、この補強板として、ガラスエ
ポキシ板に代えてＰＥＴ板（厚さ１８８μｍ）（東レ
（株）製、ルミラー＃１８８）を使用したものも同様に
製造した。In order to improve the connection strength with the connector, a glass epoxy plate (with a thickness of 0.2
mm) 26 was bonded to the surface on the side opposite to the wiring layer using an acrylic resin-based adhesive tape (T4100, manufactured by Sony Chemical Co., Ltd.). A reinforcing plate using a PET plate (thickness: 188 μm) (Lumirror # 188, manufactured by Toray Industries, Inc.) instead of the glass epoxy plate was similarly manufactured.
【００２１】（第１の可撓性プリント基板と第２のプリ
ント基板との接続）図１（ｃ）に示したように、第１の
可撓性プリント基板１０と第２のプリント基板２０と
を、それらの基板の接続部１０ａ、２０ａを対向させ、
それらの間に異方性導電膜（ソニーケミカル（株）製、
ＣＰ３１３１）３１を挟んで積層し、熱圧着（１７０
℃、４０ｋｇ／ｃｍ２、２０秒）して接続した。(Connection between First Flexible Printed Circuit Board and Second Printed Circuit Board) As shown in FIG. 1C, the first flexible printed circuit board 10 and the second printed circuit board 20 are connected to each other. With the connecting portions 10a and 20a of those substrates facing each other,
Anisotropic conductive film (Sony Chemical Co., Ltd.)
CP3131) 31 and laminated by thermocompression bonding (170
° C, 40 kg / cm 2 , 20 seconds).
【００２２】さらに、この接続部を補強するために、同
図（ｃ）のようにポリイミドフィルム（厚さ２５μｍ）
（東レ（株）製、カプトン）３２をアクリル樹脂系粘着
テープ（ソニーケミカル（株）製、Ｔ４１００）３３を
使用して貼合わせた。なお、このような接続部の補強は
省略してもよい。Further, in order to reinforce this connection, a polyimide film (25 μm thick) as shown in FIG.
(Kapton, manufactured by Toray Industries, Inc.) 32 was bonded using an acrylic resin-based adhesive tape (T4100, manufactured by Sony Chemical Co., Ltd.) 33. In addition, such reinforcement of the connection part may be omitted.
【００２３】こうして得られた複合可撓性プリント基板
は、その外部端子部が両面スプリング式コネクターに嵌
合して良好な導通が得られた。The thus obtained composite flexible printed circuit board had good external conduction because its external terminals were fitted into a double-sided spring-type connector.
【００２４】実施例２ 外部端子が両面スプリング式コネクターに接続される複
合可撓性プリント基板を、第１の可撓性プリント基板と
第２のプリント基板とから次のように製造した。Example 2 A composite flexible printed board having external terminals connected to a double-sided spring connector was manufactured from a first flexible printed board and a second printed board as follows.
【００２５】即ち、第１の可撓性プリント基板１０を図
２に示したように実施例１と同様に製造した。That is, a first flexible printed circuit board 10 was manufactured in the same manner as in Example 1 as shown in FIG.
【００２６】また、第２のプリント基板２０の製造に際
しては、まず、銅箔（厚さ１８μｍ）（日鉱グールド
（株）製、ＪＴＣ箔）２１とポリイミドフィルム（厚さ
１２５μｍ）（東レ（株）製、カプトン）２２とをアク
リル／エポキシ系接着剤（特公昭６０−１７３９７号公
報）２３を使用して積層し、第２のプリント基板２０の
ＦＰＣ材料を製造した。そして、このＦＰＣ材料を使用
して製造する以外は実施例１と同様に第２のプリント基
板を製造し、さらに第１の可撓性プリント基板と第２の
プリント基板を積層して複合可撓性プリント基板３０を
製造した。ただし、実施例１で使用した第２のプリント
基板に比べて、この実施例の第２のプリント基板はＦＰ
Ｃ材料を構成するポリイミドフィルム２２は厚いので、
第２のプリント基板にさらにガラスエポキシ板を貼り合
わせることはしなかった。In manufacturing the second printed circuit board 20, first, a copper foil (18 μm thick) (JTC foil manufactured by Nikko Gould Co., Ltd.) 21 and a polyimide film (125 μm thick) (Toray Industries, Inc.) Manufactured by Kapton Co., Ltd.) and an acrylic / epoxy adhesive (Japanese Patent Publication No. 60-17397) 23 to produce an FPC material for the second printed circuit board 20. Then, a second printed circuit board is manufactured in the same manner as in Example 1 except that the FPC material is used, and a first flexible printed circuit board and a second printed circuit board are laminated to form a composite flexible printed circuit board. The flexible printed circuit board 30 was manufactured. However, compared to the second printed circuit board used in the first embodiment, the second printed circuit board of this embodiment is FP
Since the polyimide film 22 constituting the C material is thick,
No glass epoxy plate was further bonded to the second printed circuit board.
【００２７】こうして得られた複合可撓性プリント基板
３０は、その外部端子部が両面スプリング式コネクター
に嵌合して良好な導通が得られた。In the composite flexible printed circuit board 30 thus obtained, the external terminals were fitted to the double-sided spring type connector, and good conduction was obtained.
【００２８】実施例３ 外部端子が片面スプリング式コネクターに接続される複
合可撓性プリント基板を、第１の可撓性プリント基板と
第２のプリント基板とから次のように製造した。Example 3 A composite flexible printed circuit board having external terminals connected to a single-sided spring type connector was manufactured from a first flexible printed circuit board and a second printed circuit board as follows.
【００２９】即ち、第１の可撓性プリント基板１０を図
３（ａ）に示したように実施例１と同様に製造した。That is, the first flexible printed circuit board 10 was manufactured in the same manner as in Example 1 as shown in FIG.
【００３０】また、第２のプリント基板２０の製造に際
しては、まず、図３（ｂ(i) ）に示したように、銅箔
（厚さ３５μｍ）２１とポリイミドフィルム（厚さ１２
５μｍ）（東レ（株）製、カプトン）２２とをアクリル
／エポキシ系接着剤（特公昭６０−１７３９７号公報）
２３を使用して積層し、第２のプリント基板２０のＦＰ
Ｃ材料２４を製造した。この場合、アクリル／エポキシ
系接着剤２３の乾燥膜厚が２０μｍとなるようにした。In manufacturing the second printed circuit board 20, first, as shown in FIG. 3 (b (i)), a copper foil (thickness 35 μm) 21 and a polyimide film (thickness 12
5 μm) (Kapton, manufactured by Toray Industries, Inc.) 22 and an acrylic / epoxy adhesive (Japanese Patent Publication No. Sho 60-17397).
23 and the FP of the second printed circuit board 20.
C material 24 was produced. In this case, the dry film thickness of the acrylic / epoxy adhesive 23 was set to 20 μm.
【００３１】このＦＰＣ材料２４に対して、実施例１と
同様に配線層を形成し、その配線層上に同図（ｂ(ii)）
に示したように、カバーレイとして、ポリイミドフィル
ム（厚さ２５μｍ）１５と接着剤（厚さ２０μｍ）１６
からなるフィルム（ソニーケミカル（株）製、ＣＦＫ−
２）１７を、コネクターとの接続部２０ｂを除いて熱圧
着した。A wiring layer is formed on the FPC material 24 in the same manner as in the first embodiment, and the wiring layer is formed on the wiring layer as shown in FIG.
As shown in the above, as a coverlay, a polyimide film (thickness: 25 μm) 15 and an adhesive (thickness: 20 μm) 16
Film made by Sony Chemical Co., Ltd., CFK-
2) 17 was thermocompression bonded except for the connector 20b.
【００３２】次いで、同図（ｂ(iii) ）に示したよう
に、第１の可撓性プリント基板との接続部２０ａのポリ
イミドフィルム２２をＫＯＨ溶液（ｐＨ１２〜１３）で
エッチングして除去し、さらにその部分のアクリル／エ
ポキシ系接着剤２３をメチルエチルケトンにより除去し
た。Next, as shown in FIG. 3B, the polyimide film 22 at the connection portion 20a with the first flexible printed circuit board is removed by etching with a KOH solution (pH 12 to 13). Further, the acrylic / epoxy adhesive 23 in that portion was removed with methyl ethyl ketone.
【００３３】そして同図（ｂ(iv)）に示したように、配
線層の第１の可撓性プリント基板との接続部２０ａ及び
コネクターとの接続部２０ｂ上にそれぞれ半田メッキ層
（厚さ５μｍ）２５ａ、２５ｂを形成した。Then, as shown in FIG. 4B, a solder plating layer (thickness) is formed on the connecting portion 20a of the wiring layer with the first flexible printed circuit board and the connecting portion 20b of the wiring layer with the connector. 5 μm) 25a and 25b were formed.
【００３４】こうして得た第１の可撓性プリント基板１
０と第２のプリント基板２０とを、図３（ｃ）に示した
ように、それらの基板の接続部１０ａ、２０ａを対向さ
せ、実施例１と同様の異方性導電膜３１を使用して熱圧
着により接続した。First flexible printed circuit board 1 thus obtained
As shown in FIG. 3C, the second printed circuit board 20 is connected to the connection portions 10a and 20a of the printed circuit board 20 using the same anisotropic conductive film 31 as in the first embodiment. And connected by thermocompression bonding.
【００３５】得られた複合可撓性プリント基板３０は、
その外部端子部が片面スプリング式コネクターに嵌合し
て良好な導通が得られた。The obtained composite flexible printed circuit board 30 is
The external terminals were fitted into the single-sided spring type connector, and good conduction was obtained.
【００３６】実施例４ 外部端子が片面スプリング式コネクターに接続される複
合可撓性プリント基板を、第１の可撓性プリント基板と
第２のプリント基板とから次のように製造した。Example 4 A composite flexible printed circuit board having external terminals connected to a single-sided spring type connector was manufactured from a first flexible printed circuit board and a second printed circuit board as follows.
【００３７】即ち、第１の可撓性プリント基板１０を図
４（ａ）に示したように実施例１と同様に製造した。That is, the first flexible printed circuit board 10 was manufactured in the same manner as in Example 1 as shown in FIG.
【００３８】また、第２のプリント基板２０の製造に際
しては、まず、図４（ｂ(i) ）に示したように、そのＦ
ＰＣ材料として、銅箔（厚さ３５μｍ）２１にアクリル
／エポキシ系接着剤（特公昭６０−１７３９７号公報）
２３を乾燥膜厚が２０μｍとなるように塗布してポリイ
ミドフィルム（厚さ７５μｍ）（東レ（株）製、カプト
ン）２２をラミネートし、さらにこのポリイミドフィル
ム（厚さ７５μｍ）２２上に同様の接着剤を塗布して銅
箔（厚さ３５μｍ）を積層し、両面銅張り積層板を製造
した。When manufacturing the second printed circuit board 20, first, as shown in FIG. 4 (b (i)), the F
As a PC material, an acrylic / epoxy adhesive is applied to a copper foil (thickness: 35 μm) 21 (Japanese Patent Publication No. 60-17397).
23 is applied so as to have a dry film thickness of 20 μm, a polyimide film (thickness 75 μm) (manufactured by Toray Industries, Inc., Kapton) 22 is laminated, and the same adhesion is performed on this polyimide film (thickness 75 μm) 22. The agent was applied and a copper foil (thickness: 35 μm) was laminated to produce a double-sided copper-clad laminate.
【００３９】次に、同図（ｂ(ii)）に示したように、こ
の両面銅張り積層板にＮＣドリルで孔を開け、スルーホ
ール銅メッキＳｈをして両面の銅箔を導通させた。そし
て、両面にドライフィルムレジストをラミネートしてパ
ターニングする他は実施例１と同様にして配線層を形成
し、さらに同図（ｂ(iii) ）に示したように、この両面
の配線層の第１の可撓性プリント基板との接続部２０ａ
及びコネクターとの接続部２０ｂを除いて、カバーレイ
として、ポリイミドフィルム（厚さ２５μｍ）１５と接
着剤（厚さ２０μｍ）１６からなるフィルム（ソニーケ
ミカル（株）製、ＣＦＫ−２）１７を熱圧着した。ま
た、第１の可撓性プリント基板との接続部２０ａの配線
層上に半田メッキ層（厚さ５μｍ）２５ａを形成し、同
様にコネクターとの接続部２０ｂの配線層上にも半田メ
ッキ層（厚さ５μｍ）２５ｂを形成した。Next, as shown in FIG. 2B, holes were drilled in the double-sided copper-clad laminate with an NC drill, and through-hole copper plating Sh was applied to make the copper foil on both sides conductive. . Then, a wiring layer is formed in the same manner as in Example 1 except that a dry film resist is laminated and patterned on both surfaces, and further, as shown in FIG. Connection part 20a with flexible printed circuit board 1
Except for the connection part 20b with the connector, a film (CFK-2, manufactured by Sony Chemical Co., Ltd.) 17 composed of a polyimide film (thickness 25 μm) 15 and an adhesive (thickness 20 μm) 16 is heated as a coverlay. Crimped. Further, a solder plating layer (thickness: 5 μm) 25a is formed on the wiring layer of the connection portion 20a with the first flexible printed circuit board, and the solder plating layer is similarly formed on the wiring layer of the connection portion 20b with the connector. (Thickness: 5 μm) 25b was formed.
【００４０】こうして得た第１の可撓性プリント基板１
０と第２のプリント基板２０とを、図４（ｃ）に示した
ように、それらの基板の接続部１０ａ、２０ａを対向さ
せ、実施例１と同様の異方性導電膜３１を使用して熱圧
着により接続した。The first flexible printed circuit board 1 thus obtained
As shown in FIG. 4C, the first printed circuit board 20 and the second printed circuit board 20 face the connecting portions 10a and 20a of the printed circuit board 20 and use the same anisotropic conductive film 31 as in the first embodiment. And connected by thermocompression bonding.
【００４１】得られた複合可撓性プリント基板３０は、
その外部端子部が片面スプリング式コネクターに嵌合し
て良好な導通が得られた。The obtained composite flexible printed circuit board 30 is
The external terminals were fitted into the single-sided spring type connector, and good conduction was obtained.
【００４２】実施例５ 外部端子が片面スプリング式コネクターに接続される複
合可撓性プリント基板を、第１の可撓性プリント基板と
第２のプリント基板とから次のように製造した。Example 5 A composite flexible printed circuit board having external terminals connected to a single-sided spring connector was manufactured from a first flexible printed circuit board and a second printed circuit board as follows.
【００４３】即ち、第１の可撓性プリント基板１０を図
５（ａ）に示したように実施例１と同様に製造した。That is, the first flexible printed circuit board 10 was manufactured in the same manner as in Example 1 as shown in FIG.
【００４４】また、第２のプリント基板２０の製造に際
しては、まず、図５（ｂ(i) ）に示したように、そのＦ
ＰＣ材料として、ガラスエポキシ板（厚さ０．２ｍｍ）
２６の両面に銅箔（厚さ３５μｍ）２１をアクリル／エ
ポキシ系接着剤（特公昭６０−１７３９７号公報）２３
を使用して積層し、両面銅張り積層板を製造した。When manufacturing the second printed circuit board 20, first, as shown in FIG. 5 (b (i)), the F
Glass epoxy plate (0.2mm thick) as PC material
26, a copper foil (thickness: 35 μm) 21 is coated on both sides with an acrylic / epoxy adhesive (Japanese Patent Publication No. 60-17397).
To produce a double-sided copper-clad laminate.
【００４５】次に、同図（ｂ(ii)）に示したように、こ
の両面銅張り積層板にＮＣドリルで孔を開け、スルーホ
ール銅メッキＳｈをして両面の銅箔を導通させた。そし
て、両面にドライフィルムレジストをラミネートしてパ
ターニングする他は実施例１と同様にして配線層を形成
し、さらに同図（ｂ(iii) ）に示したように、この両面
の配線層の第１の可撓性プリント基板との接続部２０ａ
及びコネクターとの接続部２０ｂを除いて、ソルダーレ
ジスト（タムラ化研（株）製、ＳＲ２９Ｇ）２７を乾燥
膜厚が１５μｍとなるように塗布し、さらに、配線層の
第１の可撓性プリント基板との接続部２０ａ及びコネク
ターとの接続部２０ｂ上にそれぞれ半田メッキ層（厚さ
５μｍ）２５ａ、２５ｂを形成した。Next, as shown in FIG. 4B, holes were drilled in the double-sided copper-clad laminate with an NC drill, and through-hole copper plating Sh was applied to make the copper foil on both sides conductive. . Then, a wiring layer is formed in the same manner as in Example 1 except that a dry film resist is laminated and patterned on both sides, and as shown in FIG. Connection part 20a with flexible printed circuit board 1
A solder resist (SR29G, manufactured by Tamura Kaken Co., Ltd.) 27 is applied so as to have a dry film thickness of 15 μm except for the connection portion 20b with the connector, and a first flexible print of the wiring layer is further formed. Solder plating layers (thickness: 5 μm) 25a and 25b were formed on the connection part 20a to the board and the connection part 20b to the connector, respectively.
【００４６】こうして得た第１の可撓性プリント基板１
０と第２のプリント基板２０とを、図５（ｃ）に示した
ように、それらの基板の接続部１０ａ、２０ａを対向さ
せ、実施例１と同様の異方性導電膜３１を使用して熱圧
着により接続した。The first flexible printed circuit board 1 thus obtained
As shown in FIG. 5C, the second printed circuit board 20 and the connection portions 10a and 20a of the two printed circuit boards 20 are opposed to each other, and the same anisotropic conductive film 31 as in the first embodiment is used. And connected by thermocompression bonding.
【００４７】得られた複合可撓性プリント基板３０は、
その外部端子部が片面スプリング式コネクターに嵌合し
て良好な導通が得られた。The obtained composite flexible printed circuit board 30 is
The external terminals were fitted into the single-sided spring type connector, and good conduction was obtained.
【００４８】以上、実施例によりこの発明を具体的に説
明したが、この他にもこの発明は種々の態様をとること
ができる。例えば、複合可撓性プリント基板における外
部端子の形成面や位置を、その外部端子が接続されるコ
ネクターに適合させるために、第２のプリント基板を適
宜折り曲げてもよい。Although the present invention has been described in detail with reference to the embodiments, the present invention may take various other forms. For example, the second printed circuit board may be appropriately bent so that the formation surface or position of the external terminal on the composite flexible printed circuit board matches the connector to which the external terminal is connected.
【００４９】[0049]
【発明の効果】この発明によれば、可撓性プリント基板
にファインピッチの配線層を精度高く形成することが要
求される場合でも、製造の歩留まりを向上させ、材料ロ
スを最小限に抑制することが可能となる。According to the present invention, even when a fine-pitch wiring layer is required to be formed on a flexible printed circuit board with high precision, the production yield is improved and material loss is minimized. It becomes possible.
【図１】実施例の複合可撓性プリント基板の説明図であ
る。FIG. 1 is an explanatory diagram of a composite flexible printed circuit board according to an example.
【図２】実施例の複合可撓性プリント基板の説明図であ
る。FIG. 2 is an explanatory diagram of a composite flexible printed circuit board according to an example.
【図３】実施例の複合可撓性プリント基板の説明図であ
る。FIG. 3 is an explanatory diagram of a composite flexible printed circuit board according to an example.
【図４】実施例の複合可撓性プリント基板の説明図であ
る。FIG. 4 is an explanatory diagram of a composite flexible printed circuit board according to an example.
【図５】実施例の複合可撓性プリント基板の説明図であ
る。FIG. 5 is an explanatory diagram of a composite flexible printed circuit board of an example.
１０ 第１の可撓性プリント基板 １０ａ 第２のプリント基板との接続部 １１ 銅箔 １２ ポリイミドフィルム １３ 接着剤 １４ ＦＰＣ材料 １７ カバーレイ １８ 半田メッキ層 ２０ 第２のプリント基板 ２０ａ 第１の可撓性プリント基板との接続部 ２０ｂ コネクターとの接続部 ２１ 銅箔 ２２ ポリイミドフィルム ２３ 接着剤 ２４ ＦＰＣ材料 ２５ａ、２５ｂ 半田メッキ層 ２６ ガラスエポキシ板 ３０ 複合可撓性プリント基板 DESCRIPTION OF SYMBOLS 10 1st flexible printed circuit board 10a Connection part with 2nd printed circuit board 11 Copper foil 12 Polyimide film 13 Adhesive 14 FPC material 17 Coverlay 18 Solder plating layer 20 2nd printed circuit board 20a 1st flexible Connection part with flexible printed circuit board 20b Connection part with connector 21 Copper foil 22 Polyimide film 23 Adhesive 24 FPC material 25a, 25b Solder plating layer 26 Glass epoxy plate 30 Composite flexible printed circuit board
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 1/14 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H05K 1/14
Claims (5)
リント基板と該回路配線部の外部端子となる端子部が形
成された第２のプリント基板とが電気的に接続され、且
つ一体化されている複合可撓性プリント基板であって、
第１の可撓性プリント基板と第２のプリント基板との接
続部の配線パターンピッチよりも、第２のプリント基板
の外部端子部の配線パターンピッチの方が狭いことを特
徴とする複合可撓性プリント基板。1. A first flexible printed circuit board on which a circuit wiring section is formed and a second printed circuit board on which a terminal section serving as an external terminal of the circuit wiring section are formed, and An integrated composite flexible printed circuit board,
Contact between the first flexible printed circuit board and the second printed circuit board
The second printed circuit board is larger than the wiring pattern pitch of the connecting portion.
Wherein the wiring pattern pitch of the external terminal portion is narrower .
が、第１の可撓性プリント基板を形成する絶縁層よりも
厚い請求項１記載の複合可撓性プリント基板。2. The composite flexible printed circuit board according to claim 1, wherein the insulating layer forming the second printed circuit board is thicker than the insulating layer forming the first flexible printed circuit board.
ント基板とが異方性導電膜により接続されている請求項
１記載の複合可撓性プリント基板。3. The composite flexible printed circuit board according to claim 1, wherein the first flexible printed circuit board and the second printed circuit board are connected by an anisotropic conductive film.
項１〜３のいずれかに記載の複合可撓性プリント基板。Item 4. The composite flexible printed circuit board according to any one of Items 1 to 3.
撓性プリント基板の第２のプリント基板の外部端子を、External terminals of the second printed circuit board of the flexible printed circuit board,
コネクタに差し込むことを特徴とするコネクタの接続方Connector connection method characterized by being inserted into the connector
法。Law.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07886193A JP3227681B2 (en) | 1993-03-12 | 1993-03-12 | Composite flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07886193A JP3227681B2 (en) | 1993-03-12 | 1993-03-12 | Composite flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06268348A JPH06268348A (en) | 1994-09-22 |
| JP3227681B2 true JP3227681B2 (en) | 2001-11-12 |
Family
ID=13673615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP07886193A Expired - Lifetime JP3227681B2 (en) | 1993-03-12 | 1993-03-12 | Composite flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3227681B2 (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000065888A1 (en) * | 1999-04-22 | 2000-11-02 | Rohm Co., Ltd. | Circuit board, battery pack, and method of manufacturing circuit board |
| EP1085788A3 (en) * | 1999-09-14 | 2003-01-02 | Seiko Epson Corporation | Composite flexible wiring board, method of manufacturing the same, electro-optical device, and electronic equipment |
| JP2004266238A (en) * | 2003-01-09 | 2004-09-24 | Sony Chem Corp | Composite wiring board and substrate element piece |
| JP2004266236A (en) * | 2003-01-09 | 2004-09-24 | Sony Chem Corp | Substrate constituent piece and composite wiring board using the piece |
| JP2006245514A (en) * | 2005-03-07 | 2006-09-14 | Hitachi Media Electoronics Co Ltd | Connection method for flexible substrates |
| JP4955970B2 (en) * | 2005-09-20 | 2012-06-20 | 住友電気工業株式会社 | Flexible printed wiring board and manufacturing method thereof |
| JP2007207782A (en) * | 2006-01-30 | 2007-08-16 | Fujikura Ltd | Composite flexible printed wiring board |
| JP2008147380A (en) * | 2006-12-08 | 2008-06-26 | Sumitomo Electric Ind Ltd | Connection structure and connection method of printed wiring board |
| JP4653726B2 (en) * | 2006-12-08 | 2011-03-16 | 住友電気工業株式会社 | Flexible wiring board connection structure and flexible wiring board connection method |
| JP5196303B2 (en) * | 2008-07-17 | 2013-05-15 | 株式会社リコー | Connection part structure of flexible printed circuit board and flexible flat cable, liquid droplet ejection head and image recording apparatus using the same |
| JP2011243895A (en) * | 2010-05-21 | 2011-12-01 | Sumitomo Electric Printed Circuit Inc | Connection structure of printed wiring board, wiring board connector, and electronic apparatus |
| JP2012160765A (en) * | 2012-05-28 | 2012-08-23 | Sumitomo Electric Ind Ltd | Flexible printed wiring board and manufacturing method thereof |
| JP5743040B2 (en) | 2013-05-13 | 2015-07-01 | 株式会社村田製作所 | Flexible circuit board and method for manufacturing flexible circuit board |
| WO2022123996A1 (en) * | 2020-12-07 | 2022-06-16 | 山下マテリアル株式会社 | Flexible multi-layer substrate, and manufacturing method therefor |
-
1993
- 1993-03-12 JP JP07886193A patent/JP3227681B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06268348A (en) | 1994-09-22 |
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