JP2005268378A - Method of manufacturing substrate with incorporated components - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate with incorporated components with which a via diameter can be reduced and a via pitch can be made narrow. <P>SOLUTION: There are prepared first and second double-coated wiring boards 10 and 20 with predetermined electrical components 6, 7 packaged thereon, and a connecting substrate 13 wherein a connecting pin 12 comprised of a predetermined metal is fixed through the predetermined portion of a sheet-like insulated base material 11 by implanting so that its both terminals are protruded from the front surface of the insulated base material 11. The first and second double coated wiring boards 10 and 20 are disposed to each other while confronting their sides where the electrical components 6, 7 are packaged, and the connecting substrate 13 is disposed between the first and second double coated wiring boards 10 and 20. The first and second double coated wiring boards are then adhered with each other using an anisotropic conductive adhesion film 8, and the first and second double coated wiring boards 10 and 20 are electrically connected with each other by the connecting pin 12 of the connecting substrate 13. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method of manufacturing a component-embedded multilayer wiring board that incorporates predetermined components.

Conventionally, this type of component-embedded substrate is produced by various methods.
For example, in the method using the B ² it method, a double-sided wiring board is created and predetermined components are mounted on the double-sided wiring board.

Then, a B ² it substrate is laminated from both sides of the substrate on which this component is mounted, and the layers are connected to each other, and then the outer layer circuit is formed.
Furthermore, after forming a solder resist layer on the circuit pattern of the outer layer, a gold plating process for connection is performed.

On the other hand, in the case of the build-up method, a double-sided wiring board is created and predetermined components are mounted on the double-sided wiring board as in the B ² it method.
And after laminating | stacking the copper foil with resin from the both sides of this board | substrate and drilling with a laser, via plating is given.
Further, after forming an outer layer circuit and forming a solder resist layer on the circuit pattern, a gold plating process for connection is performed.

However, the above-described prior art has various problems.
For example, in the case of the B ² it method, the bump diameter is large and it is difficult to cope with a narrow pitch.
In addition, since it is laminated by sequential lamination, it takes time to complete, and if a defect occurs in the outermost gold plating or solder resist layer, all parts including built-in parts can not be used. .

Furthermore, it is difficult to align the position during molding, and it is difficult to narrow the pitch of the via holes in the build-up layer due to the curing shrinkage of the PP material.
In addition, since the patterns are connected by paste, there is a problem that the conduction resistance is large and the thermal conductivity is low.
Furthermore, since the wiring length for the mounted component is long, it is difficult to increase the signal speed.

On the other hand, in the case of the build-up method, the via hole pitch by the laser beam is large and it is difficult to cope with the narrow pitch.
The build-up method requires via holes, desmearing, and plating after the components are built in, and has more steps than the B ² it method.

Further, since the copper foil with resin cannot absorb the height of the component when laminated on the component, the surface of the outermost layer does not become smooth.
Furthermore, as with the B ² it method, since the sheet size becomes the same as the component mounting, the subsequent board process is difficult, and the wiring length for the mounted component is long, so that it is difficult to increase the signal speed.

  The present invention has been made in order to solve the above-described problems of the prior art, and an object of the present invention is to provide a method for manufacturing a component-embedded substrate capable of reducing the via diameter and the via pitch. It is to provide.

  Another object of the present invention is to provide a method for manufacturing a component-embedded substrate that can be manufactured efficiently and in a short period of time with a small number of processes and that has little loss due to processing failure of the outermost layer portion.

  Furthermore, another object of the present invention is to provide a method for manufacturing a component-embedded substrate having a low conduction resistance and a high thermal conductivity.

  Still another object of the present invention is to provide a method of manufacturing a component-embedded substrate that can shorten the wiring length for a mounted component and increase the signal speed.

In order to achieve the above object, the invention according to claim 1 is for connecting a plurality of double-sided wiring boards on which predetermined electrical components are mounted, and a predetermined portion of a sheet-like insulating substrate made of a predetermined metal. Preparing a connection board through which pins are fixed so that both ends thereof protrude from the surface of the insulating base, and arranging the plurality of double-sided wiring boards facing the side on which the electrical component is mounted, The connection boards are arranged between a plurality of double-sided wiring boards, and the double-sided wiring boards are bonded together using a predetermined adhesive, and the double-sided wiring boards are electrically connected to each other by connection pins of the connecting board. It is a manufacturing method of the component built-in board | substrate which has the process connected to.
According to a second aspect of the present invention, in the first aspect of the invention, the double-sided wiring board has a connecting pin made of a predetermined metal at a predetermined portion of a sheet-like insulating adhesive base, and both ends thereof are the insulating properties. The metal foil and the connection pins are electrically connected by pressing and laminating a predetermined metal foil from both sides of the insulating adhesive base material so as to protrude from the surface of the adhesive base material, and the metal It is formed by a process including a process of patterning a foil and mounting a predetermined electrical component on the substrate.
According to a third aspect of the present invention, in the first or second aspect of the present invention, the insulating base of the connection board is provided with a housing notch for housing the electrical component. Is.
The invention according to claim 4 is the invention according to any one of claims 1 to 3, wherein the connection pins of the connection substrate are fixed to the insulating base material by an implant method.
The invention according to claim 5 is the invention according to any one of claims 2 to 4, wherein the connection pin of the double-sided wiring board is fixed to the insulating adhesive base material by an implant method.
The invention according to claim 6 is the invention according to any one of claims 1 to 5, wherein the insulating adhesive base material of the double-sided wiring board is made of a material for a rigid board.
The invention according to claim 7 is the invention according to any one of claims 1 to 6, wherein the insulating adhesive base material of the double-sided wiring board is made of a material for a flexible substrate.
The invention according to claim 8 is the invention according to any one of claims 1 to 7, wherein the insulating substrate of the connection substrate is made of a cured material.
The invention according to claim 9 is the anisotropic conductive adhesive film according to any one of claims 1 to 8, wherein the predetermined adhesive is an anisotropic conductive adhesive film in which conductive particles are dispersed in an insulating adhesive. Is.

  In the case of the present invention, a plurality of double-sided wiring boards on which predetermined electrical components are mounted are arranged so that the sides on which the electrical components are mounted face each other, and a connection made of a predetermined metal on a predetermined portion of a sheet-like insulating substrate A connection board having through holes fixed so that both ends of the pins protrude from the surface of the insulating base material, the connection board is arranged between a plurality of double-sided wiring boards, and a predetermined adhesive is used to Since the double-sided wiring boards are electrically connected to each other by the connection pins of the connection boards, the wiring patterns of the respective layers are formed in parallel until the electrical parts are mounted. Therefore, the component-embedded substrate can be manufactured efficiently and in a short period of time.

  Further, according to the present invention, it is possible to significantly improve the yield by bonding and connecting only good double-sided wiring boards after component mounting.

  Furthermore, in the present invention, since no connection paste is used, the conduction resistance can be reduced and the thermal conductivity can be increased.

  Furthermore, since the present invention is to fix the connecting pin to the insulating adhesive base material, the number of steps is small, no special material is required, and the present invention is applicable to both a rigid substrate and a flexible substrate. be able to.

  In addition, according to the present invention, multilayering is performed not by a substrate molding process but by adhesion (bonding), so that highly accurate alignment can be performed and a narrow via pitch can be achieved.

  Furthermore, according to the present invention, since the sheet size is obtained after the component is built in, there is an effect that the board can be easily created.

  In the present invention, the double-sided wiring board is fixed by penetrating a connecting pin made of a predetermined metal at a predetermined portion of the sheet-like insulating adhesive base so that both ends thereof protrude from the surface of the insulating adhesive base. , Pressing and laminating a predetermined metal foil from both sides of the insulating adhesive base material to electrically connect the metal foil and the connection pin, patterning the metal foil, and predetermined electric power on the substrate In the case of being formed by a process including a part mounting process, the via diameter and via pitch can be made smaller without depending on the bump diameter, via hole pitch, and the like as in the prior art.

  In addition, according to the present invention, since a via can be formed immediately below or directly above an embedded electrical component, it is possible to shorten the wiring length and increase the signal speed.

  On the other hand, in the present invention, when the insulating base of the connection substrate is provided with a housing cutout for housing the electrical component, the thickness of the insulating base is increased to increase the thickness. It is possible to reliably incorporate high-quality electrical components.

  Further, in the present invention, if the connection pins of the double-sided wiring board or connection board are penetrated and fixed to the insulating adhesive base material by an implant method, the pin is accurately and surely disposed at a predetermined portion of the insulating adhesive base material. It becomes possible to do.

  Furthermore, in the present invention, when the insulating substrate of the connection substrate is made of a cured material, there is no curing shrinkage during bonding, and a further narrower via pitch can be achieved.

  Furthermore, in the present invention, when an anisotropic conductive adhesive film in which conductive particles are dispersed in an insulating adhesive is used as the predetermined adhesive, a low conduction resistance and a high adhesion reliability in connecting double-sided wiring boards are used. It becomes possible to ensure the sex.

Embodiments of a method for manufacturing a component-embedded substrate according to the present invention will be described below in detail with reference to the drawings.
In the present embodiment, a case where a component-embedded substrate having a four-layer wiring pattern is manufactured will be described as an example.

FIGS. 1A to 1G are cross-sectional views showing a process of creating a first double-sided substrate corresponding to the first layer and the second layer of the present embodiment.
Here, first, as shown in FIG. 1A, a sheet-like insulating adhesive substrate 1 is prepared.

  In the case of the present invention, as the insulating adhesive substrate 1, either a prepreg for a rigid substrate or a resin substrate for a flexible substrate can be used.

  In this case, as the flexible substrate, either an uncured or a resin substrate with an adhesive can be used. For example, a substrate made of thermoplastic polyimide, thermoplastic liquid crystal polyester, or the like can be suitably used.

  In the present invention, the thickness of the insulating adhesive substrate 1 is not particularly limited, but it is preferable to use a thickness of 10 μm to 5 mm.

  Next, as shown in FIG. 1 (b), the connection member 3 is created by arranging and fixing a metal connection pin 2 at a predetermined portion of the insulating adhesive substrate 1.

  In this case, the cylindrical connection pin 2 is penetrated in the thickness direction of the insulating adhesive base material 1 by a known implant method (for example, see Japanese Patent Application Laid-Open No. 2003-197692), and both ends of the connection pin 2 are It protrudes from the surface of the insulating adhesive substrate 1.

  In the case of the present invention, the material of the connecting pin 2 is not particularly limited, but from the viewpoint of ensuring conduction reliability, it is preferable to use a material softer than the electrolytic copper foil described later, and a particularly preferable material is none. It consists of oxygen-rolled copper (oxygen-free copper processed by rolling).

In this specification, “oxygen-free copper” is defined in JIS C1011 and JIS C1020 (OFC, chemical component → Cu: 99.995 wt% O ₂ : 0.0003 wt%) and JIS C1100. Tough pitch copper (TPC, chemical component → Cu: 99.95 wt% O ₂ : 0.035 wt%) is also included.

  In this case, from the viewpoint of improving the conduction reliability, it is preferable to use those specified in JIS C1011 and JIS C1020.

  Moreover, although it does not specifically limit about the height which the both ends of the pin 2 for a connection protrudes from the surface of the insulating adhesive base material 1, From a viewpoint of ensuring conduction | electrical_connection reliability, from the thickness of the metal foil 4 mentioned later It is preferable that the thickness is thin, and specifically, 3 to 10 μm is preferable.

  And as shown in FIG.1 (c) (d), metal foil 4 is positioned and laminated | stacked from the both surfaces side of the insulating adhesive base material 1 of the connection member 3, and thermocompression bonding is performed with a predetermined pressure and temperature. Thus, the opposing metal foil 4 and the connection pin 2 are electrically connected to each other.

  In the case of the present invention, the type of the metal foil 4 is not particularly limited, but from the viewpoint of ensuring conduction reliability, it is preferable to use a material other than the oxygen-free copper described above, for example, an electrolytic copper foil.

  The thickness of the metal foil 4 is not particularly limited, but it is preferable to use a metal foil having a thickness of 8 to 70 μm from the viewpoint of ensuring conduction reliability.

  Further, as shown in FIG. 1E, pattern processing of each metal foil 4 is performed by a known lithography method to form first and second wiring (circuit) patterns 41 and.

  Thereafter, as shown in FIG. 1F, a solder resist layer is formed by a predetermined process, and then a gold plating process is performed on the surface of the first wiring pattern 41 as an outer layer.

  Furthermore, as shown in FIG. 1G, a predetermined electrical component 6 is mounted on the connection terminal portion of the second wiring pattern 42. As a result, the intended first double-sided wiring board 10 is obtained.

  FIGS. 2A to 2G are cross-sectional views showing a process of creating a second double-sided wiring board corresponding to the third layer and the fourth layer in the present embodiment.

  As shown in FIGS. 2A to 2G, in the present embodiment, a predetermined electrical component 7 is mounted by performing the same process using the same material as that of the first double-sided wiring board. The obtained second wiring board piece 20 is obtained.

FIGS. 3A to 3C are cross-sectional views showing a process of creating a connection substrate in the present embodiment.
As shown in FIG. 3A, first, a sheet-like insulating substrate 11 is prepared.
In the case of the present invention, it is preferable to use a cured base material as the insulating base material 11 from the viewpoint of ensuring processing accuracy in drilling or the like.

  In addition, the thickness of the insulating base material 11 is not particularly limited, but it is preferable to use a material having a thickness of 100 μm to 2 mm from the viewpoint of securing a storage space for the built-in electronic component.

  And as shown in FIG.3 (b), the metal connection pin 12 is arrange | positioned and fixed to the predetermined site | part of the insulating adhesive base material 11 by the above-mentioned implant method, and the connection member 13 is created.

  In the case of the present invention, the height at which both ends of the connecting pin 12 protrude from the surface of the insulating base material 1 is not particularly limited. However, the viewpoint of ensuring conduction reliability and a space for housing the built-in electronic component. Is preferably 3 to 100 μm.

  Further, as shown in FIG. 3 (c), for example, a portion between the connection pins 12 of the insulating base material 11 is partially cut out to form an accommodation cut-out portion 11a, whereby a target connection substrate 13 is formed. Get.

4A and 4B are cross-sectional views illustrating the final process of the present embodiment.
As shown in FIG. 4A, in the present embodiment, the first double-sided wiring board 10 obtained by the method shown in FIGS. 1A to 1G and the above-described FIGS. The second double-sided wiring board 20 obtained by the method shown in (g), the connection board 13 obtained by the above-described FIGS. 3A to 3C, and conductive particles are contained in the insulating adhesive. An anisotropic conductive adhesive film 8 is prepared.

  4B, the anisotropic conductive adhesive film 8 is sandwiched between the first double-sided wiring board 10 and the connection board 13 and between the second double-sided wiring board 20 and the connection board 13, respectively. These are stacked and thermocompression bonded at a predetermined pressure and temperature, whereby the second wiring pattern 42 of the first double-sided wiring board 10 and the third wiring pattern 43 of the second double-sided wiring board 20 are Are bonded and fixed, and are electrically connected through the connection pins 2 of the connection substrate 13 and the conductive particles of the anisotropic conductive adhesive film 8, respectively. Thereby, the target component-embedded substrate 50 is obtained.

  As described above, according to the present embodiment, the first and second double-sided wiring boards 10 and 20 created by the implant method are arranged so that the sides on which the electrical components 6 and 7 are mounted face each other. Because the connection substrate 13 created by the implant method is disposed between the first and second double-sided wiring substrates 10 and 20 and is bonded using the anisotropic conductive adhesive film 8 and is electrically connected. Thus, a component-embedded substrate having a small via diameter and via pitch can be provided without depending on the bump diameter or via hole pitch as in the prior art (via diameter of about 60 μm, via pitch of about 200 μm).

  In particular, in the present embodiment, multilayering is performed by bonding (bonding) instead of the substrate molding process, so that highly accurate alignment can be performed and a narrow via pitch can be achieved.

  Further, according to the present embodiment, since the wiring patterns 41 to 44 of each layer can be formed in parallel until the electrical components 6 and 7 are mounted, the component built-in substrate 50 can be efficiently created in a short period of time. it can.

  In addition, according to the present embodiment, since only the good first and second double-sided wiring boards 10 and 20 after component mounting can be bonded and connected, the yield can be greatly improved.

  Furthermore, in this embodiment, since no connection paste is used, the conduction resistance is low and the thermal conductivity is high.

  Furthermore, according to the present embodiment, since the sheet size is obtained after the components are built in, there is an effect that the board can be easily created.

  In addition, according to the present embodiment, a via can be formed immediately below or directly above the built-in electrical components 6 and 7, so that the wiring length can be shortened to increase the signal speed.

  On the other hand, in this embodiment, since the accommodation notch 11a is provided in the insulating base material 11 of the connection substrate 13, the height of the insulating base material 11 is increased by increasing the thickness. Even the electrical components 6 and 7 can be reliably incorporated.

  Furthermore, in this embodiment, when the insulating base material 11 of the connection substrate 13 is made of a cured material, there is almost no curing shrinkage at the time of bonding. It becomes possible.

  Furthermore, in the present embodiment, the first and second double-sided wiring boards 10 and 20 and the connection board 13 are connected and fixed using the anisotropic conductive adhesive film 8, so that the first and second Low conduction resistance and high adhesion reliability in the connection of the double-sided wiring boards 10 and 20 can be ensured.

The present invention is not limited to the above-described embodiment, and various changes can be made.
For example, in the above-described embodiment, a four-layer component-embedded board is created using two double-sided wiring boards, but the present invention is not limited to this, and six or more double-sided wiring boards are used. It is also possible to create a component-embedded substrate having more than one layer.
In this case, each double-sided wiring board can be connected and fixed together.

  Further, in the above-described embodiment, the electrical component is mounted on each double-sided wiring board, but a double-sided wiring board on which no electrical component is mounted may be included.

  Furthermore, the present invention can be applied not only to a rigid substrate or a flexible substrate, but also to a multilayer wiring substrate in which a rigid substrate and a flexible substrate are mixed.

  Furthermore, it is also possible to use a double-sided wiring board by a normal process instead of the double-sided wiring board by the above-described implant method.

  Furthermore, instead of the anisotropic conductive adhesive film, a paste-like anisotropic conductive adhesive or an insulating adhesive (film) containing no conductive particles in the insulating adhesive can be used.

(A)-(g): It is sectional drawing which shows the process of producing the 1st double-sided board | substrate corresponding to the 1st layer and 2nd layer of embodiment of this invention. (A)-(g): It is sectional drawing which shows the process of producing the 2nd double-sided wiring board corresponding to the 3rd layer and 4th layer in the embodiment. (A)-(c): It is sectional drawing which shows the process of producing the board | substrate for a connection in the embodiment. (A) (b): It is sectional drawing which shows the last process of the embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulating adhesive base material 2 ... Connection pin 3 ... Connection member 4 ... Metal foil 6, 7 Electrical component 8 ... Anisotropic conductive adhesive film 10 ... 1st double-sided wiring board 11 ... Insulating base material 12 ... Connection Pin 20 ... Second double-sided wiring board 41, 42, 43, 44 ... Wiring pattern

Claims (9)

A plurality of double-sided wiring boards on which predetermined electrical components are mounted, and a connecting pin made of a predetermined metal at a predetermined portion of the sheet-like insulating base so that both ends thereof protrude from the surface of the insulating base Prepare the connection board fixed through,
The plurality of double-sided wiring boards are arranged with the side on which the electrical component is mounted facing each other,
The connection boards are arranged between the plurality of double-sided wiring boards, and the double-sided wiring boards are bonded together using a predetermined adhesive, and the double-sided wiring boards are electrically connected to each other by connection pins of the connecting board. Of manufacturing a component-embedded substrate, which includes a step of automatically connecting.   The double-sided wiring board is fixed to a predetermined portion of a sheet-like insulating adhesive base material by connecting and fixing a connecting pin made of a predetermined metal so that both ends protrude from the surface of the insulating adhesive base material. A metal foil is pressed and laminated from both sides of the insulating adhesive base material, the metal foil and the connection pins are electrically connected, the metal foil is patterned, and predetermined electrical components are mounted on the substrate 2. The method for manufacturing a component-embedded board according to claim 1, wherein the component-embedded board is formed by a process including a process of performing the process.   The manufacturing method of the double-sided wiring board of any one of Claim 1 or 2 with which the accommodation notch part for accommodating the said electrical component is provided in the insulating base material of the said board | substrate for a connection.   The method for manufacturing a double-sided wiring board according to any one of claims 1 to 3, wherein the connection pins of the connection board are fixed to the insulating base material by an implant method.   5. The method for manufacturing a component-embedded board according to claim 2, wherein the connection pins of the double-sided wiring board are fixed to the insulating adhesive base material by an implant method.   The method for manufacturing a double-sided wiring board according to claim 1, wherein the insulating adhesive base material of the double-sided wiring board is made of a material for a rigid board.   The method for manufacturing a double-sided wiring board according to claim 1, wherein the insulating adhesive base material of the double-sided wiring board is made of a material for a flexible board.   The method for manufacturing a double-sided wiring board according to claim 1, wherein the insulating base material of the connection board is made of a cured material.   The method for producing a double-sided wiring board according to any one of claims 1 to 8, wherein the predetermined adhesive is an anisotropic conductive adhesive film in which conductive particles are dispersed in an insulating adhesive.

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