JP2005260012A - Method for manufacturing double-sided wiring board and multilayer wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a double-sided wiring board and a multilayer wiring board which can cope with turning into fine pitch, and in which conduction resistance is small and thermal conductivity is large. <P>SOLUTION: The manufacturing method is provided with a process, wherein penetration fixing of a pin 2 for connection which is formed of oxygen-free rolling cooper is performed on a predetermined portion of an insulating adhesion substrate 1 of sheet-like, by using an in plant method so that both ends project from surfaces of the insulating adhesion substrate 1; a process, wherein pushing lamination of a metal foil 4, which consists of a rolling copper foil is performed from both surface sides of the insulating adhesion substrate 1 and the metal foil 4 and the pin 2 for connection are connected electrically; and a process of pattern-treating the metal foil 4. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a double-sided wiring board and a multilayer wiring board.

In recent years, multilayer substrates have been created by various build-up methods as described below.
For example, in the B ² it method, a conductive paste bump is formed on a copper foil by printing, and the bump is passed through an insulating substrate, and then the copper foil is laminated to electrically connect the copper foils. . And after performing the pattern process of copper foil, it multilayers by repeating the process mentioned above.

  In the ALIVH method, a conductive paste is filled in via holes formed in an insulating base material by laser light, and then copper foils are laminated from both surfaces of the insulating base material to electrically connect the copper foils. And after performing the pattern process of copper foil, it multilayers by repeating the process mentioned above.

  Further, in the NMBI method, after a copper-nickel-copper laminated substrate is etched to form a copper bump, the exposed nickel is peeled off and the copper bump is penetrated through the insulating substrate. Then, after crushing the copper bumps, the copper foils are laminated to electrically connect the copper foils. Furthermore, after performing the pattern process of copper foil, it repeats and multi-layers by repeating the process mentioned above.

However, the above-described prior art has various problems.
For example, in the case of the B ² it method, the bump diameter is large and it is difficult to cope with a fine pitch, and it is difficult to penetrate the polyimide of the bump, so it cannot be applied to a flexible substrate. There is a problem that the conduction resistance is large and the thermal conductivity is low because of the connection between them.

On the other hand, in the case of the ALIVH method, the pitch of the via holes by the laser beam is large and it is difficult to cope with the fine pitch, and it is predicted that it is difficult to apply to the flexible substrate due to the difficulty of filling the paste, and B ² it Like the method, there are problems of conduction resistance and thermal conductivity. Furthermore, the ALIVH method has a problem that the number of steps is high and the cost is high because a laser is used.

  In the case of the NMBI method, the pitch of the bumps by etching is large and it is difficult to cope with the fine pitch, and it is difficult to polish the bumps, so the yield is low, and it is difficult to apply to a flexible substrate. Furthermore, the NMBI method has a problem in that the cost is high because the number of steps is large and the base material itself is expensive.

  The present invention has been made in order to solve the problems of the prior art, and the object of the present invention is to cope with fine pitch, low conduction resistance, and low thermal conductivity. An object of the present invention is to provide a method for manufacturing a large double-sided wiring board and a multilayer wiring board.

  Another object of the present invention is to provide a method for manufacturing a double-sided wiring board and a multilayer wiring board that can be applied to a flexible substrate without requiring a special material and having a small number of steps. .

In order to achieve the above object, the invention according to claim 1 is characterized in that a connecting pin made of a predetermined metal is provided at a predetermined portion of a sheet-like insulating adhesive base at both ends thereof. A step of penetrating and fixing so as to protrude from the surface, a step of pressing and laminating a predetermined metal foil from both sides of the insulating adhesive base material, and electrically connecting the metal foil and the connection pin, and the metal foil The method of manufacturing a double-sided wiring board having a pattern processing step.
According to a second aspect of the invention, in the first aspect of the invention, the connecting pin is made of a material softer than the metal foil.
According to a third aspect of the present invention, in the first or second aspect of the present invention, the connection pin is made of oxygen-free rolled copper.
According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, the insulating adhesive base material is made of a material for a rigid substrate.
The invention according to claim 5 is the invention according to any one of claims 1 to 3, wherein the insulating adhesive base material is made of a material for a flexible substrate.
A sixth aspect of the invention is characterized in that, in the invention of any one of the first to fifth aspects, the connecting pin is fixed by penetration to the insulating adhesive base material by an implant method.
According to a seventh aspect of the present invention, there is provided a wiring board serving as a core on which a predetermined wiring pattern is formed, and a metal connection pin at a predetermined portion of a sheet-like insulating adhesive base, the both ends of which are insulatively bonded. The connection member arranged and fixed so as to protrude from the surface of the base material and a predetermined metal foil are stacked and pressed to electrically connect the wiring pattern of the wiring board and the connection pin of the connection member and the metal. A method for manufacturing a multilayer wiring board, wherein the step of electrically connecting a foil and a connection pin of the connection member and the step of patterning the metal foil are performed a predetermined number of times.
The invention according to claim 8 is the invention according to claim 7, characterized in that the double-sided wiring board manufactured according to any one of claims 1 to 6 is used as the wiring board to be the core.
The invention according to claim 9 is the invention according to any one of claims 7 or 8, wherein the connection member and the metal foil are sequentially pressed and laminated from both sides of the wiring substrate serving as the core. A step of electrically connecting the wiring pattern of the substrate and the connection pin of the connection member and electrically connecting the metal foil and the connection pin of the connection member, and a step of patterning the metal foil are predetermined. It is characterized by performing the number of times.
According to a tenth aspect of the present invention, between the plurality of wiring boards on which a predetermined wiring pattern is formed, a metal connecting pin is provided at a predetermined portion of a sheet-like insulating adhesive base material, and both ends thereof are insulative. It is characterized by having a step of electrically connecting the wiring pattern of the wiring board and the connection pins of the connection member by interposing and pressing the connection member arranged and fixed so as to protrude from the surface of the adhesive substrate. A method for manufacturing a multilayer wiring board.
According to an eleventh aspect of the present invention, a metal connection pin is provided at a predetermined portion of a sheet-like insulating base between a plurality of wiring boards on which a predetermined wiring pattern is formed, and both ends of the insulating base A connection member arranged and fixed so as to protrude from the surface of the material is interposed, the wiring board and the connection member are laminated and bonded using a predetermined adhesive, and the wiring pattern of the wiring board and the connection member are connected. A method for manufacturing a multilayer wiring board, comprising the step of electrically connecting pins.
The invention described in claim 12 is characterized in that, in the invention described in claim 11, an anisotropic conductive adhesive containing conductive particles during the insulating bonding is used as the wiring adhesive.
A thirteenth aspect of the present invention is the invention according to any one of the ninth to twelfth aspects, wherein the double-sided wiring board manufactured according to any one of the first to sixth aspects is used as the wiring board. Is.

  In the case of the double-sided wiring board of the present invention, a connecting pin made of a predetermined metal is penetrated and fixed so that both ends protrude from the surface of the insulating adhesive base material in a predetermined part of the sheet-like insulating adhesive base material, Because the metal foil was pressed and laminated on both sides of the insulating adhesive base material to electrically connect the metal foil and the connecting pins, it was caused by the bump diameter and via hole pitch as in the prior art. The difficulty in making fine pitch can be solved.

  In the present invention, since no connection paste is used, the conduction resistance can be reduced and the thermal conductivity can be increased.

  Furthermore, since the present invention penetrates and fixes the connecting pin to the insulating adhesive base material, the number of steps is small, no special material is required, and it can be applied to either a rigid board or a flexible board. Can do.

  On the other hand, in the present invention, if the connecting pin is penetrated and fixed to the insulating adhesive base material by an implant method, it can be accurately and surely disposed at a predetermined portion of the insulating adhesive base material.

  Further, in the present invention, when the connecting pin is made of a material softer than the metal foil, the connecting pin is deformed and closely adhered to the metal foil at the time of connection, so that the bonding by metal bonding becomes stronger. .

  In particular, when a copper foil is used as the metal foil, the connection reliability after connection can be further enhanced by using a connection pin made of oxygen-free rolled copper.

  Then, a wiring board (particularly a double-sided wiring board manufactured by the above-described method) serving as a core on which a predetermined wiring pattern is formed, and a metal connection pin at a predetermined portion of the sheet-like insulating adhesive base material A connection member arranged and fixed so that both ends thereof protrude from the surface of the insulating adhesive base material and a predetermined metal foil are stacked and pressed, and the connection pin of the wiring board and the connection pin of the connection member are electrically connected. By connecting the metal foil and the connecting pin of the connecting member electrically and the process of patterning the metal foil a predetermined number of times, it is possible to cope with a fine pitch. It is possible to efficiently manufacture rigid and flexible multilayer wiring boards that have low conduction resistance and high thermal conductivity.

  Further, in this case, the connection member and the metal foil are sequentially pressed and laminated from both sides of the wiring board serving as the core, and the wiring pattern of the wiring board and the connection pins of the connection member are electrically connected and the metal If the process of electrically connecting the foil and the connection pin of the connection member and the process of patterning the metal foil are performed a predetermined number of times, it is possible to cope with fine pitch and the conduction resistance is small. In addition, a rigid and flexible multilayer wiring board having a high thermal conductivity can be manufactured more efficiently.

  Furthermore, in the present invention, a metal is applied to a predetermined portion of a sheet-like insulating adhesive base material between a plurality of wiring boards (particularly, a double-sided wiring board manufactured by the above-described method) on which a predetermined wiring pattern is formed. A connection pin made of metal is laminated and pressed with a connection member arranged and fixed so that both ends thereof protrude from the surface of the insulating adhesive base, and a wiring pattern of the wiring board and a connection pin of the connection member Since the wiring patterns of each layer can be formed in parallel by electrically connecting each other, it is possible to increase the number of layers more efficiently and to improve the yield by using only non-defective wiring boards. Is possible.

  On the other hand, a metal connection pin is provided at a predetermined portion of a sheet-like insulating base material between a plurality of wiring boards (in particular, a double-sided wiring board manufactured by the above-described method) on which a predetermined wiring pattern is formed. A connection member arranged and fixed so that both ends protrude from the surface of the insulating base material are interposed, and for example, the wiring substrate and the connection member are laminated and bonded using an anisotropic conductive adhesive, and the wiring pattern of the wiring substrate Even when the connection pins of the connection members are electrically connected to each other, the wiring patterns of the respective layers can be formed in parallel, so that multilayering can be performed more efficiently and only non-defective wiring boards can be formed. The yield can be improved by using.

According to the present invention, it is possible to manufacture a double-sided wiring board and a multilayer wiring board that can cope with a fine pitch, have low conduction resistance, and high thermal conductivity.
Further, according to the present invention, it is possible to manufacture a double-sided wiring board and a multilayer wiring board that have a small number of steps and do not require a special material and can be applied to a flexible board.

Hereinafter, embodiments of a method for manufacturing a double-sided wiring board and a multilayer wiring board according to the present invention will be described in detail with reference to the drawings.
1A to 1E are cross-sectional views showing the steps of an embodiment of a method for manufacturing a double-sided wiring board according to the present invention.

  In the present embodiment, as shown in FIG. 1A, first, a sheet-like insulating adhesive substrate 1 is prepared.

  In the case of the present invention, as the insulating adhesive substrate 1, either a prepreg for a rigid substrate or a resin substrate for a flexible substrate can be used.

  In this case, as the flexible substrate, either an uncured or a resin substrate with an adhesive can be used. For example, a substrate made of thermoplastic polyimide, thermoplastic liquid crystal polyester, or the like can be suitably used.

  In the present invention, the thickness of the insulating adhesive substrate 1 is not particularly limited, but it is preferable to use a thickness of 10 μm to 5 mm.

  Next, as shown in FIG. 1 (b), the connection member 3 is created by arranging and fixing a metal connection pin 2 at a predetermined portion of the insulating adhesive substrate 1.

  In this case, the cylindrical connection pin 2 is penetrated in the thickness direction of the insulating adhesive base material 1 by a known implant method (for example, see Japanese Patent Application Laid-Open No. 2003-197692), and both ends of the connection pin 2 are It protrudes from the surface of the insulating adhesive substrate 1.

  In the case of the present invention, the material of the connecting pin 2 is not particularly limited, but from the viewpoint of ensuring conduction reliability, it is preferable to use a material softer than the electrolytic copper foil described later, and a particularly preferable material is none. It consists of oxygen-rolled copper (oxygen-free copper processed by rolling).

In this specification, “oxygen-free copper” is defined in JIS C1011 and JIS C1020 (OFC, chemical component → Cu: 99.995 wt% O ₂ : 0.0003 wt%) and JIS C1100. Tough pitch copper (TPC, chemical component → Cu: 99.95 wt% O ₂ : 0.035 wt%) is also included.

  In this case, from the viewpoint of improving the conduction reliability, it is preferable to use those specified in JIS C1011 and JIS C1020.

  Moreover, although it does not specifically limit about the height which the both ends of the pin 2 for a connection protrudes from the surface of the insulating adhesive base material 1, From a viewpoint of ensuring conduction | electrical_connection reliability, from the thickness of the metal foil 4 mentioned later It is preferable that the thickness is thin, and specifically, 3 to 10 μm is preferable.

  And as shown in FIG.1 (c) (d), metal foil 4 is positioned and laminated | stacked from the both surfaces side of the insulating adhesive base material 1 of the connection member 3, and thermocompression bonding is performed with a predetermined pressure and temperature. Thus, the opposing metal foil 4 and the connection pin 2 are electrically connected to each other.

  In the case of the present invention, the type of the metal foil 4 is not particularly limited, but from the viewpoint of ensuring conduction reliability, it is preferable to use a material other than the oxygen-free copper described above, for example, an electrolytic copper foil.

  In the present invention, the thickness of the metal foil 4 is not particularly limited, but from the viewpoint of ensuring conduction reliability, it is preferable to use a metal foil having a thickness of 8 to 70 μm.

  Further, as shown in FIG. 1E, each metal foil 4 is subjected to pattern processing by a known lithography method to form predetermined wiring (circuit) patterns 4a. Thereby, the intended double-sided wiring board 10 is obtained.

  As described above, according to the double-sided wiring board 10 of the present embodiment, the connection pins 2 made of, for example, oxygen-free rolled copper are provided at predetermined portions of the sheet-like insulating adhesive base 1 at both ends. The metal foil 4 is pressed and laminated on both surfaces of the insulating adhesive base material 1 of the connection member 3 so as to protrude from the surface of the material 1 so as to electrically connect the metal foil 4 and the connection pin 2. Therefore, it is possible to solve the difficulty in achieving a fine pitch due to the bump diameter and via hole pitch as in the prior art.

  In the present embodiment, since no connection paste is used, the conduction resistance can be reduced and the thermal conductivity can be increased.

  Further, since the present embodiment is merely for fixing the connecting pin 2 to the insulating adhesive base material 1 through a small number of steps, no special material is required, and a rigid substrate and a flexible substrate can be used. It can be applied to both.

  Further, in the present embodiment, since the connecting pin 2 is fixed to the insulating adhesive base material 1 by the implant method, the connecting pin 2 can be accurately and surely disposed at a predetermined portion of the insulating adhesive base material 1. .

  In particular, as in the above-described embodiment, the connection pin 2 is made of oxygen-free rolled copper, which is softer than the electrolytic copper foil, so that the connection pin 2 is deformed and closely adhered to the metal foil 4 at the time of connection. Thus, strong bonding by metal bonding is performed, and thereby high conduction reliability after connection can be achieved.

2A to 2D are cross-sectional views showing the steps of an embodiment of a method for manufacturing a multilayer wiring board according to the present invention.
As shown in FIG. 2A, in the present embodiment, a double-sided wiring board 10 obtained by the method shown in FIGS. 1A to 1E is prepared.

  2B and 2C, the connection member 3 obtained by the above-described implant method and the insulating adhesive base material 4 are sequentially positioned and laminated from both sides of the double-sided wiring board 10. Then, by performing thermocompression bonding at a predetermined pressure and temperature, the wiring patterns 42 and 43 facing the connection pins 2 are electrically connected to each other.

  Further, as shown in FIG. 2D, pattern processing of the upper and lower metal foils 4 is performed by a known lithography method to form predetermined wiring patterns 41 and 44, respectively. As a result, the target multilayer wiring board 20 is obtained.

  In addition, a multilayer wiring board can be obtained by performing the above-mentioned process a predetermined number of times.

  As described above, according to the present embodiment, it is possible to cope with fine pitches, and it is possible to efficiently manufacture rigid and flexible multilayer wiring boards with low conduction resistance and high thermal conductivity. Become.

  FIGS. 3A and 3B are cross-sectional views showing the steps of another embodiment of the method for manufacturing a multilayer wiring board according to the present invention. And detailed description thereof is omitted.

  As shown in FIG. 3A, in the present embodiment, two double-sided wiring boards 10A and 10B obtained by the method shown in FIGS. 1A to 1E and the above-described implant method are used. The obtained connecting member 3 is prepared.

  And as shown in FIG.3 (b), by laminating | stacking the connection member 3 between the two double-sided wiring boards 10A and 10B, and performing thermocompression bonding with a predetermined pressure and temperature, the wiring pattern 42, The connection pins 2 facing the terminal 43 are electrically connected to each other.

  According to the present embodiment having such a process, in addition to the above-described effects, the wiring patterns 41 and 42 and the wiring patterns 43 and 44 of the respective layers can be formed in parallel, so that multilayering can be performed more efficiently. In addition, the yield can be improved by using only the non-defective wiring board. Since other configurations and operational effects are the same as those of the above-described embodiment, detailed description thereof is omitted.

  4 (a) and 4 (b) are cross-sectional views showing steps of still another embodiment of the method for manufacturing a multilayer wiring board according to the present invention. Reference numerals are assigned and detailed description thereof is omitted.

  As shown in FIG. 4A, in the present embodiment, two double-sided wiring boards 10A and 10B obtained by the method shown in FIGS. 1A to 1E and the above-described implant method are used. An anisotropic conductive adhesive film 5 containing conductive particles in the obtained connecting member 3 and an insulating adhesive is prepared.

  In the case of the present embodiment, it is preferable to use a cured base material as the insulating base material 3a constituting the connection member 3 from the viewpoint of ensuring processing accuracy in drilling or the like.

  And as shown in FIG.4 (b), these are laminated | stacked on both sides of the anisotropic conductive adhesive film 5 between the double-sided wiring board 10A and the connection member 3, and the double-sided wiring board 10B and the connection member 3, respectively. By performing thermocompression bonding with pressure and temperature, the connection pins 2 facing the wiring patterns 42 and 43 are electrically connected to each other through conductive particles.

  According to the present embodiment having such a process, in addition to the above-described effects, the wiring patterns 41 and 42 and the wiring patterns 43 and 44 of the respective layers can be formed in parallel, so that multilayering can be performed more efficiently. In addition, the yield can be improved by using only the non-defective wiring board.

  Moreover, since multilayering is performed by the anisotropic conductive adhesive film 5, there is also an effect of improving connection reliability. Since other configurations and operational effects are the same as those of the above-described embodiment, detailed description thereof is omitted.

The present invention is not limited to the above-described embodiment, and various changes can be made.
For example, in the embodiment shown in FIG. 1, build-up is performed on both sides of the wiring board serving as the core, but the present invention is not limited to this, and build-up is performed on one side of the wiring board serving as the core. Is also possible.

  Further, the present invention can be applied not only to a rigid substrate or a flexible substrate, but also to a multilayer wiring substrate in which a rigid substrate and a flexible substrate are mixed.

  Further, in the embodiment shown in FIG. 3 and FIG. 4, it is possible to use a wiring board by a normal process instead of the double-sided wiring board according to the present invention.

  Furthermore, in the embodiment shown in FIG. 4, it is also possible to use an insulating adhesive (film) that does not contain conductive particles in the insulating adhesive, instead of the anisotropic conductive adhesive film.

  In addition, in the above-described embodiment, an integrally formed connection pin is used. However, the present invention is not limited to this. For example, the center portion is harder than the metal foil and the tip portion is softer than the metal foil. It is also possible to use connection pins laminated in such a manner.

(A)-(e): It is sectional drawing which shows the process of embodiment of the manufacturing method of the double-sided wiring board based on this invention. (A)-(d): It is sectional drawing which shows the process of embodiment of the manufacturing method of the multilayer wiring board based on this invention. (A) (b): It is sectional drawing which shows the process of other embodiment of the manufacturing method of the multilayer wiring board based on this invention. (A) (b): It is sectional drawing which shows the process of other embodiment of the manufacturing method of the multilayer wiring board based on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulating adhesive base material 2 ... Connection pin 3 ... Connection member 3a ... Insulating base material 4 ... Metal foil 5 ... Anisotropic conductive adhesive film 10 ... Double-sided wiring board 41, 42, 43, 44 ... Wiring pattern

Claims (13)

A step of fixing the connecting pins made of a predetermined metal to predetermined portions of the sheet-like insulating adhesive base so that both ends thereof protrude from the surface of the insulating adhesive base, and
A step of pressing and laminating a predetermined metal foil from both sides of the insulating adhesive base material to electrically connect the metal foil and the connection pin;
And a step of patterning the metal foil. A method for manufacturing a double-sided wiring board.   The method for manufacturing a double-sided wiring board according to claim 1, wherein the connection pin is made of a material softer than the metal foil.   The method for manufacturing a double-sided wiring board according to claim 1, wherein the connection pin is made of oxygen-free rolled copper.   The method for manufacturing a double-sided wiring board according to any one of claims 1 to 3, wherein the insulating adhesive base is made of a material for a rigid board.   The method for manufacturing a double-sided wiring board according to any one of claims 1 to 3, wherein the insulating adhesive base material is made of a material for a flexible substrate.   6. The method for manufacturing a double-sided wiring board according to claim 1, wherein the connecting pin is fixed to the insulating adhesive base material by an implant method. A wiring board serving as a core on which a predetermined wiring pattern is formed, and metal connection pins at predetermined portions of the sheet-like insulating adhesive base so that both ends thereof protrude from the surface of the insulating adhesive base And connecting and fixing the connection member arranged and fixed to the predetermined metal foil to electrically connect the wiring pattern of the wiring board and the connection pin of the connection member and for connecting the metal foil and the connection member Electrically connecting the pins;
A method of manufacturing a multilayer wiring board, wherein the step of patterning the metal foil is performed a predetermined number of times.   8. The method of manufacturing a multilayer wiring board according to claim 7, wherein the double-sided wiring board manufactured according to any one of claims 1 to 6 is used as the core wiring board. The connection member and the metal foil are sequentially pressed and laminated from both sides of the wiring board serving as the core, and the wiring pattern of the wiring board and the connection pins of the connection member are electrically connected and the metal foil and Electrically connecting the connection pins of the connection member;
9. The method of manufacturing a multilayer wiring board according to claim 7, wherein the step of patterning the metal foil is performed a predetermined number of times.   Between a plurality of wiring boards on which a predetermined wiring pattern is formed, metal connection pins protrude from the surface of the insulating adhesive base at predetermined portions of the sheet-like insulating adhesive base. A method of manufacturing a multilayer wiring board, comprising the steps of laminating and pressing the connection members arranged and fixed in this manner to electrically connect the wiring pattern of the wiring board and the connection pins of the connection member .   Between a plurality of wiring boards on which a predetermined wiring pattern is formed, metal connection pins are protruded from the surface of the insulating base material at predetermined portions of the sheet-like insulating base material. A step of interposing a connection member fixedly arranged, laminating and bonding the wiring board and the connection member using a predetermined adhesive, and electrically connecting a wiring pattern of the wiring board and a connection pin of the connection member A method for producing a multilayer wiring board, comprising:   The method for manufacturing a multilayer wiring board according to claim 11, wherein an anisotropic conductive adhesive containing conductive particles during insulating bonding is used as the wiring adhesive.   The method for manufacturing a multilayer wiring board according to any one of claims 9 to 12, wherein the double-sided wiring board manufactured according to any one of claims 1 to 6 is used as the wiring board.

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