JP2003224356A - Printed wiring board with edge face cut through-hole and electronic component - Google Patents
Printed wiring board with edge face cut through-hole and electronic componentInfo
- Publication number
- JP2003224356A JP2003224356A JP2002018849A JP2002018849A JP2003224356A JP 2003224356 A JP2003224356 A JP 2003224356A JP 2002018849 A JP2002018849 A JP 2002018849A JP 2002018849 A JP2002018849 A JP 2002018849A JP 2003224356 A JP2003224356 A JP 2003224356A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed wiring
- wiring board
- electronic component
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント配線板の
端部に端面カットスルーホールを有するプリント配線板
と、上記プリント配線板上に半導体素子が搭載された電
子部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board having an end face cut-through hole at an end portion of the printed wiring board, and an electronic component having a semiconductor element mounted on the printed wiring board.
【０００２】[0002]
【従来の技術】携帯電話に代表される最近の移動体通信
の小型化に伴い、内蔵される電子部品もさらなる小型化
が要求されている。これら電子部品で、発光素子、受光
素子、半導体回路素子などの電子部品素子をプリント配
線板に搭載するために、素子を接着剤でプリント配線板
に接続し、モールド樹脂でボンディングワイヤと半導体
素子を覆うような、いわゆる電子部品チップがある。こ
れら電子部品チップの中で、先に挙げた電子部品小型化
の要求にともない、半導体素子を搭載するプリント配線
板に端面カットスルーホールを形成する場合がある。2. Description of the Related Art With the recent miniaturization of mobile communication represented by a mobile phone, further miniaturization of built-in electronic parts is required. In order to mount electronic components such as light emitting devices, light receiving devices, and semiconductor circuit devices on the printed wiring board with these electronic components, the elements are connected to the printed wiring board with an adhesive, and the bonding wires and semiconductor elements are connected with the molding resin. There is a so-called electronic component chip that covers. Among these electronic component chips, there are cases where end face cut-through holes are formed in a printed wiring board on which a semiconductor element is mounted, in response to the above-mentioned demand for miniaturization of electronic components.
【０００３】従来の半導体素子を搭載するプリント配線
板について説明する。図３は半導体素子プリント配線板
２の表層に接着剤６を介して半導体素子１を搭載し、ボ
ンディングワイヤ５をランド１１に接続することにより
プリント配線板２と電気的に導通させたものである。こ
の半導体素子１の保護と、ボンディングワイヤ５が他の
導体とのショートを防ぐためにモールド樹脂４を上から
覆う形にすることによって電子部品チップ９を完成させ
ている。図３は上記電子部品チップ９をクリーム半田８
によりマザーボード３上に搭載している状態である。A conventional printed wiring board on which a semiconductor element is mounted will be described. In FIG. 3, the semiconductor element 1 is mounted on the surface layer of the semiconductor element printed wiring board 2 via the adhesive 6, and the bonding wire 5 is connected to the land 11 to electrically connect the printed wiring board 2 with the land 11. . In order to protect the semiconductor element 1 and prevent the bonding wire 5 from short-circuiting with other conductors, the mold resin 4 is covered from above to complete the electronic component chip 9. FIG. 3 shows the electronic component chip 9 with the cream solder 8
Is mounted on the motherboard 3.
【０００４】図３においてスルーホールの開口部には、
モールド樹脂４が流れ込み半導体素子やボンディングワ
イヤが露出したり、マザーボードとの接続不良を起こし
たりする事がないよう絶縁膜や導電体でフタを設けてい
る。しかしこのような仕様であると次のような問題が発
生する。まず、スルーホールの開口部に絶縁性のフタを
設けた場合、スルーホールの直上で半導体素子との電気
的接続ができず他にスペースを設けて接続ランドを形成
しなければならない。また、絶縁性のフタの位置ズレを
考慮してランド径を大きくしなければならない問題があ
る。次にスルーホールの開口部に外層導体でフタを設け
た場合、マザーボードとの接続面側には依然スルーホー
ルの開口部が設けられている分、マザーボードとの接続
有効面積を他の場所に設けなくてはならないため省スペ
ース化が抑制されてしまう。また図２に表すように電子
部品チップをマザーボードに搭載する工程において、マ
ザーボードとの接続面側にスルーホールの開口部がある
と、小型である電子部品チップをマザーボードに置いた
ときに電子部品が立ち上がってしまう不良が実際に問題
になっている。また一方では、スルーホールの小径化に
ともないスルーホール内壁に金属メッキを着ける技術が
難しくなってきており、電気的接続信頼性に問題が出て
きている。In FIG. 3, the opening of the through hole is
A lid is provided with an insulating film or a conductor so that the molding resin 4 does not flow in and the semiconductor element or the bonding wire is exposed or the connection failure with the motherboard does not occur. However, such specifications cause the following problems. First, when an insulating lid is provided at the opening of the through hole, electrical connection with the semiconductor element cannot be made immediately above the through hole, and another space must be provided to form a connection land. There is also a problem that the land diameter must be increased in consideration of the positional deviation of the insulating lid. Next, when a lid is provided on the opening of the through hole with an outer layer conductor, the opening of the through hole is still provided on the connection surface side with the motherboard, so that the effective area for connection with the motherboard is provided in another place. Since it is necessary, space saving is suppressed. Further, as shown in FIG. 2, in the process of mounting the electronic component chip on the motherboard, if there is an opening of the through hole on the connection surface side with the motherboard, the electronic component will be small when the small electronic component chip is placed on the motherboard. The failure to get up is actually a problem. On the other hand, as the diameter of the through hole becomes smaller, it becomes difficult to apply a metal plating to the inner wall of the through hole, and the reliability of electrical connection is becoming a problem.
【０００５】上記のような問題に対して、最近では図５
のようにスルーホール穴内に絶縁樹脂や導電、非導電ペ
ースト１２を充填する方法が考え出されている。しかし
このような仕様であると現在次のような問題が起きてい
る。
１）スルーホール内壁に金属メッキを付与し、その後に
絶縁樹脂や導電、非導電ペーストを穴内に充填しダイシ
ングカットにより端面カットスルーホールを形成した場
合、スルーホールの金属メッキと絶縁樹脂や導電、非導
電ペーストとの境目の密着強度が弱く、剥離を起こすケ
ースがある。
２）充填する絶縁樹脂や導電、非導電ペーストが、成分
に樹脂が含まれているためスルーホールに充填後、端面
スルーホール加工を行なう際に切断面の絶縁樹脂や導
電、非導電ペーストから粉が落ちるため後工程で汚れの
問題が発生する。
３）スルーホールの更なる小径化をしようとする際、印
刷法により充填される絶縁樹脂や導電、非導電ペースト
がスルーホール内に入らなくなり小径化に限界が出てく
る。
４）図４はプリント配線板を、マザーボードとの接続面
側を上にして見た図であるが、ランド内の斜線の部分が
絶縁樹脂や導電、非導電ペーストで充填された場合、マ
ザーボードとの接続有効面積１０を図のようにスルーホ
ール内にかかるように設定した時に、樹脂やペーストで
は接続強度が悪く接続有効面積として充分でない。ま
た、３で挙げたようにスルーホールの小径化を行なうと
樹脂の充填が不充分になり、マザーボードとスルーホー
ル内の部分との間にすきまが生じる。In response to the above problem, recently, FIG.
As described above, a method of filling the through hole with the insulating resin, the conductive or non-conductive paste 12 has been devised. However, the following problems are currently occurring with such specifications. 1) When metal plating is applied to the inner wall of the through hole, and then an insulating resin, conductive or non-conductive paste is filled into the hole and an end face cut through hole is formed by dicing cut, the metal plating of the through hole and the insulating resin or conductive, In some cases, the adhesion strength at the boundary with the non-conductive paste is weak and peeling may occur. 2) Since the insulating resin, conductive or non-conductive paste to be filled contains resin as a component, after the through hole is filled, powder is obtained from the insulating resin, conductive or non-conductive paste on the cut surface when processing the end face through hole. As a result, the problem of contamination occurs in the subsequent process. 3) When it is attempted to further reduce the diameter of the through hole, the insulating resin and the conductive or non-conductive paste filled by the printing method do not enter the through hole, and there is a limit to the diameter reduction. 4) FIG. 4 is a view of the printed wiring board with the connection surface side with the mother board facing up. If the shaded area in the land is filled with insulating resin, conductive or non-conductive paste, When the connection effective area 10 is set so as to cover the inside of the through hole as shown in the figure, the connection strength is poor and the connection effective area is not sufficient with resin or paste. Further, as described in 3, when the diameter of the through hole is reduced, the resin is insufficiently filled, and a gap is generated between the motherboard and the portion inside the through hole.
【０００６】[0006]
【発明が解決しようとする課題】上記のような問題を踏
まえ本発明では、プリント配線板上に接着剤を介して半
導体素子が搭載され、該プリント配線板のランドと半導
体素子とをボンディングワイヤで接続しモールド樹脂で
封止されている電子部品において、スルーホールの接続
信頼性を向上させ、マザーボードとの接続強度を高める
と同時に省スペース化を実現することができるプリント
配線板及び電子部品を提供する。In view of the above problems, in the present invention, a semiconductor element is mounted on a printed wiring board via an adhesive, and the land of the printed wiring board and the semiconductor element are bonded by a bonding wire. We provide printed wiring boards and electronic components that can improve the connection reliability of through-holes, enhance the connection strength with the motherboard, and at the same time save space in electronic components that are connected and sealed with mold resin. To do.
【０００７】[0007]
【課題を解決するための手段】第一の発明は、少なくと
も表裏に形成される配線回路と、該配線回路を接続する
スルーホールとを備えたプリント配線板であって、該ス
ルーホールは、金属メッキが充填され、且つ該プリント
配線板の端部に位置するスルーホールが、該プリント配
線板の外形形状に対して端面形状に切断加工されている
プリント配線板である。第二の発明は、少なくとも表裏
に形成される配線回路と、該配線回路を接続するスルー
ホールとを備えたプリント配線板であって、該スルーホ
ールは、金属メッキが充填され、該プリント配線板上に
接着剤を介して半導体素子が搭載され、該プリント配線
板のランドと半導体素子をボンディングワイヤで接続
し、モールド樹脂で封止後、該プリント配線板の外形形
状に対して端面形状に切断加工されている電子部品であ
る。A first aspect of the present invention is a printed wiring board having a wiring circuit formed on at least front and back surfaces and a through hole connecting the wiring circuit, wherein the through hole is made of metal. The printed wiring board is filled with plating, and the through holes located at the end portions of the printed wiring board are cut into an end face shape with respect to the outer shape of the printed wiring board. A second invention is a printed wiring board comprising a wiring circuit formed on at least front and back surfaces and a through hole connecting the wiring circuit, wherein the through hole is filled with metal plating. A semiconductor element is mounted on the top with an adhesive, the land of the printed wiring board and the semiconductor element are connected by a bonding wire, sealed with a mold resin, and then cut into an end face shape with respect to the outer shape of the printed wiring board. It is an electronic component that is being processed.
【０００８】[0008]
【発明の実施の形態】本発明の実施の形態を説明するに
あたって、図１を中心に本発明の特徴を説明する。尚、
図２、図３、図４を含めて同様の部位に関しては同じ符
号をつけた。BEST MODE FOR CARRYING OUT THE INVENTION In describing the embodiments of the present invention, the features of the present invention will be described mainly with reference to FIG. still,
The same parts as those in FIGS. 2, 3 and 4 are designated by the same reference numerals.
【０００９】本発明を図１を用いて説明する。半導体素
子１は下部に接着剤６を介してプリント配線板２と接続
されている。プリント配線板２は、両面板以上の多層板
であれば層数に限定されることはない。上記半導体素子
１はボンディングワイヤ５をプリント配線板２の表層導
体のランド１１に電気的に接続している。上記半導体素
子１を保護するため、またボンディングワイヤ５が他の
導体とショートする事を防ぐためにモールド樹脂４が上
記半導体素子１及びボンディングワイヤ５を覆ってい
る。そしてレーザー加工により非貫通スルーホールを形
成し、前記非貫通スルーホール内に銅メッキ７を充填す
ることにより上層導体と下層導体を電気的に接続してい
る。上記非貫通スルーホールは貫通スルーホールでも構
わない。また、プリント配線板の端面のスルーホール
は、ダイシングカットにより端面カットスルーホールに
加工されている。なお、端面角部の端面カットスルーホ
ールは、仕様によって２分の１の半円状であったり、４
分の１の円弧状であっても構わない。図１は電子部品チ
ップ９の下層導体をクリーム半田８を介してマザーボー
ド３と電気的に接続している。The present invention will be described with reference to FIG. The semiconductor element 1 is connected to the printed wiring board 2 at the bottom via an adhesive 6. The printed wiring board 2 is not limited to the number of layers as long as it is a multi-layer board having two or more double-sided boards. In the semiconductor element 1, the bonding wire 5 is electrically connected to the land 11 of the surface layer conductor of the printed wiring board 2. A mold resin 4 covers the semiconductor element 1 and the bonding wire 5 in order to protect the semiconductor element 1 and to prevent the bonding wire 5 from short-circuiting with another conductor. Then, a non-through through hole is formed by laser processing, and copper plating 7 is filled in the non-through through hole to electrically connect the upper layer conductor and the lower layer conductor. The non-through through holes may be through through holes. Further, the through holes on the end faces of the printed wiring board are processed into end face cut through holes by dicing cutting. Depending on the specifications, the end face cut-through holes at the corners of the end face may have a half-circle shape, or 4
It may be a half arc shape. In FIG. 1, the lower layer conductor of the electronic component chip 9 is electrically connected to the mother board 3 via the cream solder 8.
【００１０】本発明における非貫通スルーホールあるい
は貫通スルーホールは、レーザー加工により形成するの
が望ましい。レーザーの種類は特に限定しない。また上
層、下層のどちらかから穴あけ加工をしても構わない
が、表層のランドを小径化する上で、下層から炭酸ガス
レーザーにて表層銅箔および絶縁層を一度で同時に穴あ
けを行なうのが好ましい。スルーホール内は無電解メッ
キだけで充填するかスルーホール底辺の銅箔を片側電極
として電解メッキを行ない充填するかのどちらかの方法
を採用するか、無電解メッキをスルーホール内壁に付け
た後に電解メッキを施して穴内を充填するか、いずれか
の方法を採用し得る。無電解メッキ及び電解メッキは銅
メッキで行なう。上記のレーザー加工を行なうことによ
って、今までのドリル穴あけによって０．３mm程度の穴
径、０．６mm程度のランド径までしか形成できなかった
スルーホールが０．１mm程度の穴径、０．３mm程度のラ
ンド径まで形成が可能になり、高密度配線化が実現でき
る。The non-penetrating through hole or the penetrating through hole in the present invention is preferably formed by laser processing. The type of laser is not particularly limited. Although it is permissible to carry out drilling from either the upper layer or the lower layer, in order to reduce the diameter of the land on the surface layer, it is preferable to drill the surface copper foil and insulating layer from the lower layer at the same time with a carbon dioxide laser. preferable. Either use only electroless plating to fill the inside of the through hole, or perform electrolytic plating using the copper foil at the bottom of the through hole as an electrode on one side, or after applying electroless plating to the inner wall of the through hole. Either electrolytic plating may be performed to fill the inside of the hole, or either method may be adopted. Electroless plating and electrolytic plating are performed by copper plating. By performing the above laser processing, the through hole that could only be formed with a hole diameter of about 0.3 mm and a land diameter of about 0.6 mm by drilling until now has a hole diameter of about 0.1 mm, 0.3 mm. It is possible to form up to a land diameter of about a degree, and high density wiring can be realized.
【００１１】因に、本発明によって可能となった省スペ
ース化の実際例を表１に示す。該表１は従来品の端面カ
ットスルーホール付き基板と本発明の端面カットスルー
ホール付き基板において、穴径、ランド径の違い、また
実装有効面積をスルーホール直上にまで拡大できたこと
により発生した特定のシート寸法における取り数の違い
を表したものである。レーザーで小径スルーホールを形
成し、銅メッキを穴内に充填して実装有効面積を広げた
ことにより、電子部品の外形寸法を小さくすることがで
き、シートにおける製品取り数が３０％向上した。本発
明は上記のような省スペース化に加え、品質の安定した
プリント配線板及び電子部品を得ることができる。Table 1 shows a practical example of space saving made possible by the present invention. Table 1 is generated due to the difference in hole diameter and land diameter between the conventional board with end face cut-through hole and the board with end face cut-through hole of the present invention, and the effective mounting area being expanded to just above the through hole. It shows the difference in the number of sheets taken in a specific sheet size. By forming a small-diameter through hole with a laser and filling the hole with copper plating to increase the effective mounting area, the external dimensions of the electronic component can be reduced, and the number of products to be taken on the sheet is improved by 30%. INDUSTRIAL APPLICABILITY In addition to the above space saving, the present invention can provide a printed wiring board and an electronic component with stable quality.
【００１２】[0012]
【表１】 [Table 1]
【００１３】[0013]
【発明の効果】本発明のプリント配線板及び電子部品に
よれば、メッキ法でスルーホール内が充填されているた
め、絶縁樹脂、導電あるいは非導電ペーストを印刷法に
より充填する方法では不可能な小径スルーホールに充填
することができ、かつ電気的な接続信頼性を確保でき
る。しかも、スルーホールの半導体素子搭載側の開口部
に、絶縁膜あるいは外層導体でフタをする場合と違い、
マザーボードとの接続側にスルーホールの開口部がない
ため、マザーボード上に電子部品チップを載せた際に電
子部品チップが立ち上がってしまう問題がなくなる。加
えて、端面カットスルーホールの内壁に金属メッキを施
したときに発生する、金属メッキと絶縁樹脂、導電ある
いは非導電ペーストとの境目で少なくとも一部が剥離す
るような問題がなくなる。更に絶縁樹脂、導電あるいは
非導電ペーストの際に発生した、ダイシングカットの際
の充填物からのカスの発生の問題も解消される。According to the printed wiring board and the electronic component of the present invention, since the through holes are filled by the plating method, it is impossible by the method of filling the insulating resin, the conductive or non-conductive paste by the printing method. It is possible to fill small-diameter through holes and ensure electrical connection reliability. Moreover, unlike the case where the opening of the through hole on the semiconductor element mounting side is covered with the insulating film or the outer layer conductor,
Since there is no through-hole opening on the connection side with the motherboard, there is no problem that the electronic component chip rises when the electronic component chip is placed on the motherboard. In addition, there is no problem of peeling at least a part at the boundary between the metal plating and the insulating resin, conductive or non-conductive paste, which occurs when metal plating is applied to the inner wall of the end face cut-through hole. Further, the problem of the generation of dust from the filling material at the time of dicing cutting, which occurs when the insulating resin, the conductive or non-conductive paste, is solved.
【００１４】特に、本発明において、スルーホールがメ
ッキで接地面と平坦になるように充填されたものは、マ
ザーボードとの接続の際に接続有効面積として利用でき
る。しかもメッキなので絶縁樹脂、導電あるいは非導電
ペーストがスルーホール内に充填されている条件よりも
マザーボードとの接続強度が向上する。In particular, in the present invention, the through hole filled with plating so as to be flat with the ground plane can be used as a connection effective area when connecting to the mother board. Moreover, since the plating is performed, the connection strength with the motherboard is improved as compared with the condition in which the through holes are filled with the insulating resin and the conductive or non-conductive paste.
【００１５】また、特に本発明において、スルーホール
がレーザー加工で形成されたものは、穴径、ランド径が
小さいため、プリント配線板の外形寸法を小さくでき
る。また、外形寸法が従来と同じ場合には配線を引き回
すスペースが増えることにより、高密度実装が可能にな
る。In particular, in the present invention, the through hole formed by laser processing has a small hole diameter and a small land diameter, so that the external dimensions of the printed wiring board can be reduced. Further, when the external dimensions are the same as the conventional ones, the space for routing the wiring increases, which enables high-density mounting.
【図面の簡単な説明】[Brief description of drawings]
【図１】マザーボード上に本発明のプリント配線板が半
導体素子を搭載している状態で接続されている断面図。FIG. 1 is a cross-sectional view in which a printed wiring board of the present invention is connected to a mother board with a semiconductor element mounted thereon.
【図２】従来電子部品チップがマザーボード上で立ち上
がっている断面図。FIG. 2 is a cross-sectional view of a conventional electronic component chip standing up on a motherboard.
【図３】マザーボード上に従来のプリント配線板が半導
体素子を搭載している状態で接続されている断面図。FIG. 3 is a cross-sectional view in which a conventional printed wiring board is connected with a semiconductor element mounted on a mother board.
【図４】マザーボードとの接続面を上にして見た本発明
のプリント配線板の斜視図。FIG. 4 is a perspective view of the printed wiring board of the present invention with the connection surface to the mother board facing upward.
【図５】マザーボード上に従来のプリント配線板が半導
体素子を搭載している状態で接続されている断面図。FIG. 5 is a cross-sectional view in which a conventional printed wiring board is connected to a mother board on which a semiconductor element is mounted.
１：半導体素子 ２：プリント配線板 ３：マザーボード ４：モールド樹脂 ５：ボンディングワイヤ ６：接着剤 ７：銅メッキ部分 ８：クリーム半田 ９：電子部品チップ 10：接続有効面積 11：導体ランド 12：充填物 1: Semiconductor element 2: Printed wiring board 3: Motherboard 4: Mold resin 5: Bonding wire 6: Adhesive 7: Copper plating part 8: Cream solder 9: Electronic component chip 10: Effective connection area 11: Conductor land 12: Filling material
Claims (4)
と、該配線回路を接続するスルーホールとを備えたプリ
ント配線板であって、該スルーホールは、金属メッキが
充填され、且つ該プリント配線板の端部に位置する該ス
ルーホールが、該プリント配線板の外形形状に対して端
面形状に切断加工されていることを特徴とするプリント
配線板。1. A printed wiring board comprising a wiring circuit formed on at least front and back surfaces and a through hole connecting the wiring circuit, wherein the through hole is filled with metal plating and the printed wiring board is provided. The printed wiring board, wherein the through hole located at the end of the printed wiring board is cut into an end face shape with respect to the outer shape of the printed wiring board.
るようにメッキで充填されていることを特徴とする請求
項１記載のプリント配線板。2. The printed wiring board according to claim 1, wherein the through hole is filled with plating so as to be flat with the ground plane.
り形成されたものであることを特徴とする請求項１又は
２記載のプリント配線板。3. The printed wiring board according to claim 1, wherein the through hole is formed by laser processing.
と、該配線回路を接続するスルーホールとを備えたプリ
ント配線板であって、該スルーホールは、金属メッキが
充填され、該プリント配線板上に接着剤を介して半導体
素子が搭載され、該プリント配線板のランドと半導体素
子をボンディングワイヤで接続し、モールド樹脂で封止
後、該プリント配線板の外形形状に対して端面形状に切
断加工されていることを特徴とする電子部品。4. A printed wiring board comprising a wiring circuit formed on at least front and back surfaces and a through hole connecting the wiring circuit, wherein the through hole is filled with metal plating, and the printed wiring board is provided with a through hole. A semiconductor element is mounted on the board with an adhesive, the land of the printed wiring board and the semiconductor element are connected with a bonding wire, sealed with a mold resin, and then cut into an end face shape with respect to the outer shape of the printed wiring board. Electronic parts characterized by being used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002018849A JP2003224356A (en) | 2002-01-28 | 2002-01-28 | Printed wiring board with edge face cut through-hole and electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002018849A JP2003224356A (en) | 2002-01-28 | 2002-01-28 | Printed wiring board with edge face cut through-hole and electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003224356A true JP2003224356A (en) | 2003-08-08 |
Family
ID=27743050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002018849A Pending JP2003224356A (en) | 2002-01-28 | 2002-01-28 | Printed wiring board with edge face cut through-hole and electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003224356A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005129904A (en) * | 2003-09-29 | 2005-05-19 | Sanyo Electric Co Ltd | Semiconductor device and method of manufacturing the same |
| JP2008004660A (en) * | 2006-06-21 | 2008-01-10 | Tanaka Kikinzoku Kogyo Kk | Cut wiring board with blind hole, and its manufacturing method |
| JP2011198798A (en) * | 2010-03-17 | 2011-10-06 | Hitachi Chem Co Ltd | Printed wiring board and semiconductor package using the same |
-
2002
- 2002-01-28 JP JP2002018849A patent/JP2003224356A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005129904A (en) * | 2003-09-29 | 2005-05-19 | Sanyo Electric Co Ltd | Semiconductor device and method of manufacturing the same |
| JP2008004660A (en) * | 2006-06-21 | 2008-01-10 | Tanaka Kikinzoku Kogyo Kk | Cut wiring board with blind hole, and its manufacturing method |
| JP2011198798A (en) * | 2010-03-17 | 2011-10-06 | Hitachi Chem Co Ltd | Printed wiring board and semiconductor package using the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5100081B2 (en) | Electronic component-mounted multilayer wiring board and manufacturing method thereof | |
| JP4178880B2 (en) | Module parts | |
| JP2010080968A (en) | Method of manufacturing module component | |
| CN108882500B (en) | Flexible circuit board and manufacturing method thereof | |
| JP3664045B2 (en) | Manufacturing method of semiconductor device | |
| JP5539453B2 (en) | Electronic component-mounted multilayer wiring board and manufacturing method thereof | |
| JP2000012773A (en) | Semiconductor device and its manufacture | |
| JP2003224356A (en) | Printed wiring board with edge face cut through-hole and electronic component | |
| US20050074924A1 (en) | Circuitized substrate, method of making same and information handling system using same | |
| JP2784524B2 (en) | Multilayer electronic component mounting substrate and method of manufacturing the same | |
| JP2003283086A (en) | Wiring board, manufacturing method of the wiring board and electronic component using the wiring board | |
| JP4388410B2 (en) | Multiple wiring board | |
| JP2005079129A (en) | Plastic package and its manufacturing process | |
| JP2000183488A (en) | Hybrid module | |
| KR20150030066A (en) | Printed circuit board | |
| JP2784523B2 (en) | Substrate for mounting electronic components | |
| JPH0513963A (en) | Electronic component mounting board | |
| JPH01183196A (en) | Manufacture of multilayer printed wiring board device | |
| CN113170569B (en) | Circuit board with heat dissipation structure and manufacturing method thereof | |
| JP2006005035A (en) | Ceramic package assembly for storing electronic component and ceramic package | |
| JP2784521B2 (en) | Multilayer electronic component tower mounting substrate and method of manufacturing the same | |
| JP2005116909A (en) | Electronic device and wiring board used therefor | |
| JP2002171041A (en) | Printed wiring board, electronic component and method for manufacturing them | |
| JPH05315778A (en) | Electronic parts mounting board provided with heat sink | |
| JP2001274530A (en) | Printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20041202 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20041202 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060915 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060926 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061102 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20070410 |