JP2005079129A - Plastic package and its manufacturing process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plastic package capable of arranging a high density conductor wiring pattern capable of dealing with light, thin and small size while using a lead wire for electroplating, and to provide its manufacturing process. <P>SOLUTION: In the plastic package 10 having first conductor wiring patterns 17 being coupled with plated lead wires 16 extending from the dummy parts 12 of a resin substrate 11 to product parts 13, and second conductor wiring patterns 17a not coupled with the plated lead wire 16, a first lead wire 18 for short-circuiting a plurality of second conductor wiring patterns 17a and connecting wires 19 for connecting it without short-circuiting in the way are provided at the product parts 13. It is connected with one or a plurality of first conductor wiring patterns 17 through second lead wires 18a and after the second conductor wiring patterns 17a are applied with an electrolytic plating coating 15 through the first conductor wiring patterns 17, the connecting wires 19 are removed and the plurality of second conductor wiring patterns 17a are disconnected by the removed part 21. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a plastic package for mounting an electronic component such as a semiconductor element and a manufacturing method thereof, and more specifically, a plastic package in which a conductive wiring pattern having a high arrangement density is energized to provide an electrolytic plating film and the manufacturing thereof. Regarding the method.

  In recent years, for example, plastic packages for mounting semiconductor elements have been developed to increase the density of semiconductor elements, increase the number of terminals by increasing the speed, mountability of semiconductor elements, lower costs, lower impedance, and downsizing devices. From the viewpoint of downsizing the outer dimensions, a BGA (Ball Grid Array) type or the like that can increase the arrangement density of the conductor wiring pattern formed on the package is often used.

  As shown in FIG. 5, a conventional BGA type plastic package 50 includes a conductor made of Cu or the like having a large number of bonding pads 54 for connection to a semiconductor element 52 and bonding wires 53 on one surface of a resin substrate 51. A wiring pattern 55 is provided. Further, the plastic package 50 has a conductor wiring pattern 55 provided with a large number of solder ball pads 57 for connecting solder balls 56 of external connection terminals to the other surface of the resin base material 51. The bonding pad 54 and the solder ball pad 57 are connected via a conductor wiring pattern 55 and a through-hole conductor 58. The bonding pads 54 and the solder ball pads 57 are formed by exposing predetermined portions of the conductor wiring pattern 55 of the solder resist film 59 formed on both surfaces of the resin base material 51 including the conductor wiring pattern 55 as openings.

  The bonding pad 54 and the solder ball pad 57 are usually subjected to Ni plating and Au plating (not shown) by an electrolytic plating method in order to improve the bonding property and prevent the surface from being oxidized to improve the solder ball welding property. It has been subjected. As shown in FIG. 6, a large resin base 51 is usually prepared, and a large number of plastic packages 50 are formed there. From the dummy portion 60 around each plastic package 50 to each plastic package 50, a plating tie bar 61, and the conductor wiring pattern 55 of each individual plastic package 50 and the through-hole conductor 58 are extended from the plating tie bar 61. A large number of plated lead wires 62 are provided. The Ni plating and Au plating are energized from the plating tie bar 61 through the plating lead-out wire 62, and a solder resist film 59 (not shown in FIG. 6) is formed by previously covering a portion that does not require plating. First, it is formed on the conductor wiring pattern 55 exposed from the opening of FIG. Each plastic package 50 is formed by being cut from the assembly by a cut line 63. Note that the plating lead wire 62 extending from the dummy portion 60 of the resin base 51 to the product portion has another conductor wiring located on the outer peripheral portion of the product portion as the conductor wiring pattern 55 is in the center portion of the product portion. It is necessary to arrange a plurality of lines between the patterns 55.

As a method for wiring the plated lead lines, a method of performing automatic wiring design using an automatic wiring design system for CAD (Computer Aidet Design) has been proposed (for example, see Patent Document 1).
JP2002-149734

However, the conventional plastic package and the manufacturing method thereof as described above have the following problems.
(1) In order to form plating lead lines on all conductor wiring patterns, a plurality of plating lead lines are arranged between the conductor wiring patterns on the outer periphery of the package as the conductor wiring pattern provided at the center of the package is obtained. Therefore, the external dimensions of the package are inevitably increased, and it is not possible to deal with packages that are required to be light and thin. Also, the plating lead lines for the solder ball pads near the center of the package have predetermined dimensions for the distance between adjacent solder ball pads. A conductor needs to be connected to a plated lead wire provided on the resin base material of another layer, and the thickness of the package becomes large due to the multi-layered resin base material, which is not suitable for a package that is required to be light and thin.
(2) The plated lead wire is necessary for electrolytic plating. As a method for eliminating the plated lead wire, a method of forming a plating film by electroless plating is conceivable. However, since the electroless plating cannot secure a sufficient film thickness, the adhesive strength of the solder balls as the external connection terminals is lowered.
(3) When an automatic wiring design system is used for wiring design, if the wiring design becomes impossible as a result, time and man-hours are wasted, and the cost of the plastic package is increased.
The present invention has been made in view of such circumstances, and a plastic package capable of arranging a high-density conductor wiring pattern that can be used for lightening, thinning, and shortening of the package while using a plating lead wire for electrolytic plating, and a manufacturing method thereof The purpose is to provide.

A plastic package according to the present invention that meets the above-described object is provided with a first conductor wiring pattern that is connected to a plating lead line for forming an electrolytic plating film extending from a dummy part of a resin base material to a product part, and a plating lead line A plastic package having a second conductor wiring pattern that is not connected, wherein a first lead line and a first lead line for short-circuiting a plurality of second conductor wiring patterns are provided in the middle of the product portion. In addition, a connecting line for connection without short-circuiting is provided, and the connecting line and one or a plurality of first conductor wiring patterns are connected via the second lead line, and the first lead via the plating lead line An electroplating film is applied to the conductor wiring pattern, and one or more first conductor wiring patterns, second lead lines, connecting lines, and first lead lines are provided. After through to line electrolytic plating film on the second conductive wiring pattern has been applied, the connecting line is deleted with a deletion portion between the plurality of the second conductor wiring pattern is disconnected.
Here, in the plastic package, it is preferable that the deletion part is formed by a recessed hole or a through hole formed by deleting the resin base material into a slit shape.
In addition, the plastic package may be filled with a resin at the deleted portion.

  A method for manufacturing a plastic package according to the present invention in accordance with the above object includes a first conductor wiring pattern connected to a plating lead wire for forming an electrolytic plating film extending from a dummy portion of a resin base material to a product portion, and plating. A method of manufacturing a plastic package in which an electrolytic plating film is formed on a second conductor wiring pattern that is not connected to a lead wire, wherein each of the second conductor wiring patterns is short-circuited in order to short-circuit a plurality of second conductor wiring patterns. In addition to providing a first lead line that extends, each of the first lead lines is provided with a linear connecting line that is independently connected without being short-circuited on the way, and one or a plurality of first connecting lines are provided on the connecting line. A step of connecting a second lead line extending from the conductor wiring pattern, and one or more of the first conductor wiring patterns connected to the plating lead line A step of forming a step of performing electroless plating film to the second conductor wiring pattern, is removed by drilling a connecting line to the slit shape, the second conductor wiring pattern electrically independent.

The plastic package according to claim 1 is a plastic package having a first conductor wiring pattern connected to the plating lead line and a second conductor wiring pattern not connected to the plating lead line, A first lead wire for short-circuiting a plurality of second conductor wiring patterns, and a connecting wire for connecting the first lead wire without short-circuiting in the middle are provided, and the connecting wire and one or more The first conductor wiring pattern is connected via the second lead line, the first conductor wiring pattern is coated with the electrolytic plating film via the plating lead line, and one or more first conductor wiring patterns After the electrolytic plating film is applied to the second conductor wiring pattern via the second lead wire, the connecting wire, and the first lead wire, the connecting wire is deleted. Since the second conductor wiring pattern near the center portion of the product portion extends from the dummy portion of the resin base material because the second conductor wiring pattern in the vicinity of the center portion of the product portion has a deleted portion that is disconnected between the plurality of second conductor wiring patterns. Therefore, the arrangement density of the conductor wiring pattern can be increased, and a plastic package made of high-density wiring that is light and thin can be provided.
In particular, the plastic package according to claim 2 is formed by a recess or a through hole formed by deleting the resin base material into a slit shape, so that the connecting line is reliably removed, and each conductor It is possible to provide a light, thin and small plastic package having a high-density wiring in which the wiring pattern is electrically independent.
In the plastic package according to claim 3, since the deleted portion is filled with resin, the thin and small size of the highly reliable high-density wiring that protects the conductor wiring pattern exposed in the cross section of the deleted portion from the atmosphere. Can provide plastic package.

  5. The method of manufacturing a plastic package according to claim 4, wherein an electrolytic plating film is formed on the first conductor wiring pattern connected to the plating lead line and the second conductor wiring pattern not connected to the plating lead line. In addition, a first lead line extending from each of the second conductor wiring patterns is provided, and a linear connecting line that connects each of the first lead lines independently without short-circuiting is provided. In addition, a step of connecting a second lead line extending from one or a plurality of first conductor wiring patterns to the connecting line, and one or a plurality of first conductor wiring patterns connected to the plating lead line A step of applying an electrolytic plating film to the second conductor wiring pattern; and a second conductor wiring pattern which is electrically independent by drilling and removing the connecting wire in a slit shape. Therefore, it is possible to form the electrolytic plating film easily by energizing the second conductor wiring pattern near the center of the package without using a special manufacturing method. It is possible to provide a method for manufacturing a light, thin and small plastic package made of high-density wiring that can be manufactured.

Subsequently, the best mode for carrying out the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.
1A and 1B are a plan view and a partially enlarged longitudinal sectional view of a plastic package according to an embodiment of the present invention, respectively, and FIGS. 2A and 2B are views of the plastic package, respectively. 3A to 3C are explanatory diagrams of other modified examples of the plastic package, and FIGS. 4A to 4D are explanatory diagrams of a method for manufacturing the plastic package. is there.

  As shown in FIGS. 1A and 1B, a plastic package 10 according to an embodiment of the present invention includes a large panel-shaped resin substrate 11 having a plurality of dummy portions 12 around it, Each of the dummy portions 12 is cut and removed to form individual product portions 13. The plastic package 10 is connected to a product portion 13 with a plating lead wire 16 for forming an electrolytic plating film 15 extending from a plating tie bar 14 formed on a dummy portion 12 before cutting the resin base material 11. The conductor wiring pattern 17 is provided. Further, the plastic package 10 has a second conductor wiring pattern 17 a that is not connected to the plated lead wire 16 near the center of the product portion 13. In the vicinity of the center portion of the product portion 13, the first lead wire 18 for electrically short-circuiting the plurality of second conductor wiring patterns 17 a and the first lead wire 18 are not short-circuited in the middle. A connecting line 19 for connection is provided. One or more first conductor wiring patterns 17 are connected to the connecting line 19 via the second lead line 18a. Then, a first conductor wiring pattern 17 and a second portion of a desired portion exposed from the opening of the solder resist film 20 by energizing the plating lead wire 16 through the plating tie bar 14 of the package immersed in the plating bath. An electroplating film 15 made of Ni plating and Au plating is applied to the conductor wiring pattern 17a. After that, the plastic package 10 is provided with a deletion portion 21 for deleting the connecting wire 19 by cutting or the like so that the plurality of second conductor wiring patterns 17a are disconnected. The plastic package 10 is electrically connected between the patterns formed on both sides via the through-hole conductors 22.

  As shown in FIG. 2 (A), the plastic package 10 is formed by scraping up to the inner part of the resin base material 11 in the part where the connecting line 19 formed in the vicinity of the center part of the product part 13 is deleted. It is preferable to have a slit-like recess hole 21a. Alternatively, as shown in FIG. 2 (B), the plastic package 10 is formed by completely cutting out the resin base material 11 in a portion where the connecting wire 19 formed near the center of the product portion 13 is removed. It is preferable to have such a slit-shaped through hole 21b.

  Further, as shown in FIG. 3A, the plastic package 10 is substantially similar to the solder resist film 20 in the deleted portion 21 from which the connecting line 19 formed in the vicinity of the center portion of the product portion 13 is deleted. It is preferable that the resin 23 made of the above member is filled. Alternatively, as shown in FIGS. 3 (B) and 3 (C), even when the deletion portion 21 is a slit-like recess hole 21a or a slit-like through hole 21b, the recess hole 21a or the through hole 21b includes The resin 23 is preferably filled.

Next, a method for manufacturing the plastic package 10 according to an embodiment of the present invention will be described with reference to FIGS.
For the resin base material 11, for example, a resin excellent in high heat resistance, dielectric characteristics, insulating characteristics, and workability such as BT resin (resin mainly composed of bismaleimide triazine) and epoxy resin is used. Cu foil is stuck on both surfaces of 11. As shown in FIG. 4 (A), through holes for forming through-hole conductors 22 are formed in resin base material 11 having Cu foil pasted on both surfaces, and electroless Cu is formed on both surfaces and the wall surfaces of the through holes. Plating and electrolytic Cu plating are performed to form a Cu layer 24 made of a Cu foil and a Cu plating film on both sides, and a through-hole conductor 22 made of a Cu plating film in the through hole. The method of directly plating the resin surface with electroless Cu plating can be performed chemically in a strong alkali bath using formalin as a reducing agent after applying a catalyst such as palladium to the resin surface. In addition, in the electrolytic Cu plating, for example, a current is applied in a plating bath such as copper sulfate or pyrophosphoric acid to form an electrolytic Cu plating film on the surface of the electroless Cu plating film. Next, a photosensitive dry film is spread on both surfaces of the resin base material 11 on which the Cu layer is formed, exposed to contact with a pattern mask, and a pattern opposite to the desired pattern is opened by photolithography. An etching resist film 25 to be a part is formed.

  Next, as shown in FIG. 4B, an etching solution such as a ferric chloride solution or a cupric chloride solution is used for the Cu layer 24 exposed from the opening of the etching resist film 25, for example. Etching is performed to remove the Cu layer 24. The first conductor that extends from the dummy portion 12 of the resin substrate 11 to the product portion 13 and is connected to the plated lead wire 16 is formed on the lower surface side of the resin substrate 11 that has been removed by removing the dry film, for example. A wiring pattern 17 is formed. At the same time, a second conductor wiring pattern 17 a that is not connected to the plated lead wire 16 is formed on the lower surface side of the resin base material 11. In order to short-circuit a plurality of second conductor wiring patterns 17a, the second conductor wiring pattern 17a is provided with a first lead line 18 extending from the second conductor wiring pattern 17a, and Each of the one lead wires 18 is provided with a linear connecting wire 19 that is independently connected without being short-circuited in the middle. In addition, the connecting wire 19 is connected to a second lead wire 18 a extending from one or a plurality of first conductor wiring patterns 17.

  Next, as shown in FIG. 4 (C), on both surfaces of the resin base material 11, necessary portions of all the conductor wiring patterns including the first conductor wiring pattern 17 and the second conductor wiring pattern 17a are opened. The solder resist film 20 is formed by screen printing or photolithography to fill the via hole conductor 22 at the same time. Next, the resin base material 11 is immersed in a Ni plating bath such as a watt bath or a sulfamic acid bath, and an opening portion of the solder resist film 20 is obtained by electroplating through a plating lead wire 16 through the plating tie bar 14. A Ni plating film is applied on the conductor wiring pattern exposed from Further, the resin base material 11 is immersed in a plating bath such as an Au plating bath or an Au alloy plating bath, and the surface of the Ni plating film is subjected to Au plating by electroplating through the plating lead wire 16 via the plating tie bar 14. Apply the coating. As a result, an electrolytic plating film 15 composed of a Ni plating film and an Au plating film is formed on the conductor wiring pattern exposed from the opening of the solder resist film 20. The Ni plating film may be an alloy plating film containing Co or the like.

  Here, the second conductor wiring pattern 17 a exposed from the opening of the solder resist film 20 is energized through one or more of the first conductor wiring patterns 17 connected to the plating lead lines 16 to be electroplated. 15 is given. The portion of the conductor wiring pattern exposed from the opening of the solder resist film 20 is, for example, a wire bond pad for bonding wire connection with a semiconductor element mounted on a package, or an external connection terminal connection such as a solder ball. Or a ball pad. In forming the solder resist film 20, the connecting line 19 may be exposed from the opening of the solder resist film 20. In this case, the work can be easily performed in the deletion of the connecting line 19 performed later. Further, the connecting wire 19 may be covered with a solder resist film 20. In this case, the expensive electrolytic plating film 15 of Ni plating or Au plating can be saved.

  Next, as shown in FIG. 4 (D), the connecting wire 19 is removed from the resin base material 11 in a slit shape along the connecting wire 19 from the resin base material 11 with a router machine or the like. The deletion unit 21 is formed. Thereby, the second conductor wiring pattern 17a becomes a pattern electrically independent from each other, and thus the plastic package 10 is manufactured. The deleted portion 21 may be formed by cutting to the inside of the resin base material 11 so as to be in the state of the recessed hole 21a, or by cutting the entire resin base material 11 to penetrate. You may cut and form so that it may be in the state of the hole 21b. In addition, the cutting part 21 (including the recessed hole 21a and the through hole 21b) is formed by filling a resin 23 made of a solder resist paste substantially equivalent to the solder resist film 20 by screen printing or the like and curing it. Also good.

  The plurality of plastic packages 10 formed on the resin base 11 are cut and removed from the dummy portion 12 to produce a plastic package 10 made of individual pieces. Alternatively, in the plurality of plastic packages 10 formed on the resin base material 11, electronic parts such as semiconductor elements are mounted in the respective plastic packages 10 in this state, and the electronic parts are hermetically sealed, and then the dummy portion 12. May be cut and removed to produce a plastic package 10 on which electronic components made of individual pieces are mounted.

  In the present invention, a plastic package on which a highly integrated semiconductor element is mounted can be reduced in size, thickness, and size. As an application example, an electronic device mounted with a semiconductor element and required to be downsized, for example, a portable device. It can be applied to telephones and notebook computers.

(A), (B) is the top view of the plastic package which concerns on one embodiment of this invention, respectively, and a partial expanded longitudinal sectional view. (A), (B) is explanatory drawing of the modification of the plastic package, respectively. (A)-(C) are explanatory drawings of the other modification of the plastic package, respectively. (A)-(D) are explanatory drawings of the manufacturing method of the plastic package, respectively. It is explanatory drawing of the conventional plastic package. It is explanatory drawing of the plastic package and its manufacturing method.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10: Plastic package, 11: Resin base material, 12: Dummy part, 13: Product part, 14: Plating tie bar, 15: Electrolytic plating film, 16: Plating lead wire, 17: 1st conductor wiring pattern, 17a: 1st 2 conductor wiring patterns, 18: first lead wire, 18a: second lead wire, 19: connecting wire, 20: solder resist film, 21: deleted portion, 21a: recessed hole, 21b: through hole, 22: Through-hole conductor, 23: resin, 24: Cu layer, 25: etching resist film

Claims (4)

A plastic having a first conductor wiring pattern connected to a plating lead wire for forming an electrolytic plating film extending from a dummy portion of a resin base material to a product portion, and a second conductor wiring pattern not connected to the plating lead wire A package,
A first lead wire for short-circuiting a plurality of the second conductor wiring patterns and a connecting wire for connecting the first lead wires without being short-circuited in the middle are provided at the center of the product portion. In addition, the connecting wire and one or a plurality of the first conductor wiring patterns are connected via a second lead wire, and the electrolytic plating film is applied to the first conductor wiring pattern via the plating lead wire. And the electrolytic plating film is applied to the second conductor wiring pattern via the one or more first conductor wiring patterns, the second lead lines, the connecting lines, and the first lead lines. A plastic package, comprising: a deletion portion in which the connecting line is deleted and a plurality of the second conductor wiring patterns are disconnected after being applied.   2. The plastic package according to claim 1, wherein the deletion portion is formed by a recessed hole or a through hole formed by deleting the resin base material into a slit shape. 3.   3. The plastic package according to claim 1, wherein the deleted portion is filled with a resin. Electrolytic plating is applied to a first conductor wiring pattern connected to a plating lead wire for forming an electrolytic plating film extending from a dummy portion of a resin base material to a product portion, and a second conductor wiring pattern not connected to the plating lead wire. A method of manufacturing a plastic package for forming a film,
In order to short-circuit a plurality of the second conductor wiring patterns, a first lead line extending from each of the second conductor wiring patterns is provided, and each of the first lead lines is not short-circuited in the middle. A step of providing a linear connecting line that is independently connected to each other, and connecting a second lead line extending from one or a plurality of the first conductor wiring patterns to the connecting line;
Applying the electrolytic plating film to the second conductor wiring pattern via one or more of the first conductor wiring patterns connected to the plating lead lines;
A method of manufacturing a plastic package, comprising the step of forming the second conductor wiring pattern that is electrically independent by drilling and removing the connecting wire in a slit shape.

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