100年12月08日梭正_頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種電路板，尤其涉及一種具有電磁屏蔽及 防水作用之多層電路板。 【先前技術】 [0002] 隨著電子通訊產業之蓬勃發展，手機、筆記本電腦、數 碼相機、個人數位助理等消費性電子產品逐漸成為人們 曰常生活之必備品。由於電子市場競爭曰漸劇烈，為了 能於市場上贏得一席之位，各大廠商對自己之產品不斷 推陳出新，目前，各類電子產品大多朝著小型化、集成 化、多功能化方向發展。軟性電路板（FPCB)由於具有輕 、薄、短、小以及可彎折之特點而被廣泛應甩於消費性 電子產品中。 [0003] 目前，關於FPCB之研究大多傾向於改善或提升fpcb所用 基膜材料之撓折性能《近年來’對於可用於FPCB基媒材 料業界投入了更多之研究，例如，現階段FPCB基膜所常 用之聚醯亞胺材料於日本就掀起過“陣熱潮，參見Elec_ trical Insulation Maganize, Volume 5， Issue 1，Jan.-Feb.，1989 Papers:15-23， “Applications of Polyimide Films to the Electrical and Electronic Industries in Japan” 〇 [0004] 然而，為適應電子產品多功能'化之需求，FPCB之佈線層 數愈來愈多，這樣，相鄰電路板中之線路於電訊號之傳 輸中難免互相幹擾，從而影響FPCB於電子產品中之工作 性能。 表單編號A0101 第3頁/共15頁 1003454143-0 [0005] ί赘明内容】 有鑒於此，提供一種具有電磁屏蔽及防水作用之多層電 路板實屬必要。 _6]卩下以實施例說明__種具有電磁屏蔽及防水作用之多層 電路板8 [_]〜種多層電路板，其包括第—電路板、黏合層及第二電 路板。該第一電路板與第二電路板經過該黏合層結合於 一起。該第—電路板與第二電路板之間設置一具有電磁[Description of the Invention] [0001] The present invention relates to a circuit board, and more particularly to a multilayer circuit board having electromagnetic shielding and waterproofing effects. [Prior Art] [0002] With the rapid development of the electronic communication industry, consumer electronic products such as mobile phones, notebook computers, digital cameras, and personal digital assistants have gradually become essential items for people to live in. As the competition in the electronic market is becoming more and more fierce, in order to win a place in the market, major manufacturers continue to innovate their own products. At present, most of the electronic products are developing in the direction of miniaturization, integration and multi-functionality. Flexible circuit boards (FPCBs) are widely used in consumer electronics due to their light, thin, short, small, and bendable characteristics. [0003] At present, most researches on FPCB tend to improve or improve the flexural properties of base film materials used in fpcb. In recent years, more research has been invested on the industry of FPCB-based media materials, for example, the current FPCB base film. The commonly used polyimine materials have set off a wave of enthusiasm in Japan, see Elec_ trical Insulation Maganize, Volume 5, Issue 1, Jan.-Feb., 1989 Papers: 15-23, “Applications of Polyimide Films to the Electrical And Electronic Industries in Japan” [0004] However, in order to meet the needs of multi-functionalization of electronic products, the number of FPCB wiring layers is increasing, so that the lines in adjacent circuit boards are inevitably mutually in the transmission of electrical signals. Interference, which affects the performance of FPCB in electronic products. Form No. A0101 Page 3 of 15 1003454143-0 [0005] 内容 内容 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 】 多层 多层 多层 多层It is necessary. _6] 卩 以 实施 实施 实施 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ a circuit board, an adhesive layer and a second circuit board. The first circuit board and the second circuit board are coupled together through the adhesive layer. The first circuit board and the second circuit board are provided with an electromagnetic
屏蔽及防水作用之功能層。該具有電磁屏蔽及防水作用 之功此層將第一電路板與第二電路板於該多層電路板之 厚度方向上得以隔離。 種夕層電路板，其包括相鄰之第一電路板與第二電路 板該相鄰之第-電路板與第二電路板之間設置—具有 電磁屏蔽及防水作用之錢層。該具有電磁屏蔽及防水 作用之功能層將第一電路板與第二電路板於該多層電路 板之厚度方向上得以隔離。Functional layer for shielding and waterproofing. The layer having electromagnetic shielding and waterproofing isolates the first circuit board from the second circuit board in the thickness direction of the multilayer circuit board. The circuit board includes an adjacent first circuit board and a second circuit board disposed between the adjacent first circuit board and the second circuit board - a magnetic layer having electromagnetic shielding and waterproof function. The functional layer having electromagnetic shielding and waterproofing isolates the first circuit board from the second circuit board in the thickness direction of the multilayer circuit board.
_上述多層電路板之結構中，相鄰電路板之間設置具有電 磁屏蔽及时仙之輕層，這樣，Μ電路板工作過 。中相鄰電路板之線路可得到電磁屏蔽，從而保證電 訊號之傳輸°°f。另外，由於該具有電磁屏蔽及防水作 用之功能層之存在’於電路板之衫製程中，例如表面 々洗、曝細影、化學細、_狀化學财過程中 可有效阻隔相鄰電路板之間水氣渗透現象之產生。 【實施方式】 096145592 表單編號A0101 笫4頁/共15頁 1003454143-0 1362909 100年.12月08日慘正替換頁 [0010] 下面將结合附圖及複數實施例對本技術方案之多層電路 板作進一步之詳細說明。 [0011] 參閱圖1及圖2，本技術方案第一實施例提供一多層電路 板，其通過複數單層電路板壓合形成。於該多層電路板 中，位於最外層之電路板通常為單面板，而位於内層之 電路板可為雙面板，也可為多層板。本實施例涉及一雙 面板100，其包括第一電路板110，第二電路板120以及 黏合層130。將第一電路板110、黏合層130以及第二電 • 路板120依次壓合後便可得到雙面板100。 [0012] 該第一電路板110包括絕緣材料112以及形成於絕緣材料 112上之導電線路111。該第二電路板120包括絕緣材料 122以及形成於絕緣材料122上之導電線路121。 [0013] 該黏合層130包括一黏性基材131及具有電磁屏蔽及防水 作用之功能層132，為描述方便，以下簡稱功能層132。 本實施例中，功能層132採用兼具電磁屏蔽及防水性能之 • 鋁箔。該黏性基材131包括兩個相對之表面133與134， 且表面133與134為平面，該功能層132平行於表面133、 134設置於表面133與134之間，以使得導電線路111與導 電線路121於雙面板100厚度方向上可被功能層132所隔 絕。這樣，雙面板100工作過程中·，導電線路111與導電 線路121彼此之間電訊號傳輸可通過功能層132所阻隔， 以避免電訊號互相幹擾。 [0014] 由於功能層132之設置旨在防止導電線路111與導電線路 121之間電磁幹擾之產生，因此，只要功能層132可將導 096145592 表單编號A0101 第5頁/共15頁 1003454143-0 1362909 100年.12月08日按正替換頁 電線路111與導電線路121於雙面板100之厚度方向上得 以阻隔，功能層132之結構以及其於黏合層130中之位置 不受限制。因此，除上述功能層132設置於表面133與 134之間外，功能層132還可設置於表面133與絕緣材料 112之間，或者功能層132設置於表面134與絕緣材料122 之間。當功能層132設置於絕緣材料112或122與黏合層 130之間時，功能層132為平面結構，以確保第一電路板 110、第二電路板120與黏合層130之間之緊密結合。而 當功能層132設置於黏性基材131中，即，設置於表面 133與表面134之間時，功能層132之結構可為平面結構 ，也可為曲面結構。當功能層132為平面結構時，其厚度 約為3〜25微米，當功能層132為曲面結構時，其平均厚度 約為3〜25微米。本實施例中，功能層132為平面片狀鋁箔 ，其平行於表面133、134設置於黏性基材131中。_ In the above structure of the multi-layer circuit board, a light layer with electromagnetic shielding and a thin layer is disposed between adjacent circuit boards, so that the circuit board has been operated. The lines of adjacent boards can be electromagnetically shielded to ensure the transmission of the signal. In addition, due to the presence of the functional layer having electromagnetic shielding and waterproofing function, it can effectively block adjacent circuit boards in the process of manufacturing the circuit board, such as surface rinsing, exposure, fine chemical, and chemical processing. The occurrence of water vapor penetration. [Embodiment] 096145592 Form No. A0101 笫 4 pages / Total 15 pages 1003454143-0 1362909 100 years. December 08 miserable replacement page [0010] The multi-layer circuit board of the present technical solution will be described below with reference to the accompanying drawings and the plural embodiments. Further details. Referring to FIG. 1 and FIG. 2, the first embodiment of the present technical solution provides a multilayer circuit board which is formed by press-bonding a plurality of single-layer circuit boards. In the multilayer circuit board, the circuit board on the outermost layer is usually a single panel, and the circuit board on the inner layer can be a double panel or a multilayer board. This embodiment relates to a dual panel 100 comprising a first circuit board 110, a second circuit board 120, and an adhesive layer 130. The first circuit board 110, the adhesive layer 130, and the second circuit board 120 are sequentially pressed together to obtain the double panel 100. [0012] The first circuit board 110 includes an insulating material 112 and a conductive line 111 formed on the insulating material 112. The second circuit board 120 includes an insulating material 122 and a conductive line 121 formed on the insulating material 122. [0013] The adhesive layer 130 includes a viscous substrate 131 and a functional layer 132 having electromagnetic shielding and waterproofing. For convenience of description, the functional layer 132 is hereinafter referred to as hereinafter. In the present embodiment, the functional layer 132 is made of aluminum foil which has both electromagnetic shielding and waterproof properties. The viscous substrate 131 includes two opposing surfaces 133 and 134, and the surfaces 133 and 134 are planar. The functional layer 132 is disposed between the surfaces 133 and 134 parallel to the surfaces 133, 134 such that the conductive traces 111 are electrically conductive. The line 121 can be isolated by the functional layer 132 in the thickness direction of the double panel 100. Thus, during the operation of the dual panel 100, the electrical signal transmission between the conductive line 111 and the conductive line 121 can be blocked by the functional layer 132 to prevent the electrical signals from interfering with each other. [0014] Since the setting of the functional layer 132 is intended to prevent the generation of electromagnetic interference between the conductive line 111 and the conductive line 121, as long as the functional layer 132 can be used to guide the 096145592 form number A0101 page 5 / total 15 pages 1003454143-0 1362909 100. On December 8th, the replacement of the page line 111 and the conductive line 121 is blocked in the thickness direction of the double panel 100, and the structure of the functional layer 132 and its position in the adhesive layer 130 are not limited. Therefore, in addition to the functional layer 132 disposed between the surfaces 133 and 134, the functional layer 132 may be disposed between the surface 133 and the insulating material 112, or the functional layer 132 may be disposed between the surface 134 and the insulating material 122. When the functional layer 132 is disposed between the insulating material 112 or 122 and the adhesive layer 130, the functional layer 132 is a planar structure to ensure a tight bond between the first circuit board 110, the second circuit board 120, and the adhesive layer 130. When the functional layer 132 is disposed in the adhesive substrate 131, that is, between the surface 133 and the surface 134, the structure of the functional layer 132 may be a planar structure or a curved structure. When the functional layer 132 has a planar structure, its thickness is about 3 to 25 μm, and when the functional layer 132 has a curved structure, its average thickness is about 3 to 25 μm. In the present embodiment, the functional layer 132 is a planar sheet-like aluminum foil which is disposed in the adhesive substrate 131 parallel to the surfaces 133 and 134.
[0015] 另外，於實際應用中，功能層132之厚度與黏合層130之 厚度有關，而黏合層130之厚度根據所要黏結之第一電路 板110 '第二電路板120之厚度確定。例如實際應用中， 該功能層132之厚度可大於或等於3roi l(lmi 1約等於 25. 4微米）。 [0016] 參閱圖3及圖4，本技術方案第二實施例提供一多層電路 板200，其通過第二黏合層240將雙面板20與覆銅基板 250壓合於一起而形成。該雙面板20由第一電路板210、 第一黏合層230以及第二電路板220依次壓合所得到。雙 面板20與第一實施例中之雙面板100結構基本相同，不同 之處在於：形成於第一黏合層230中之第一功能層232為 096145592 表單编號A0101 第6頁/共15頁 1003454143-0 1362909 100年.12月08日梭正替換頁 波浪狀結構。該第二黏合層240與第一實施例中之黏合層 130結構相同，即，第二黏合層240之基材中設置有平面 、结構之第二功能層242。該覆銅基板250包括絕緣層252 及銅層251。第一功能層232、第二功能層242之材質均 採用具有電磁屏蔽及防水性能之材料，例如銘箔。 [0017]對於多層電路板200來說，第二功能層242可將雙面板20 之第二電路板22〇與覆銅基板250於多層電路板200之厚 度方向上得進行電磁隔離，具體地，當覆銅基板250之銅 層251進行線路製作後，第二功能層242可使第二電路板 220之線路與覆銅基板250之銅層251所形成之線路達到 電磁阻隔之目之。另外，於利用化學蝕刻法對覆銅基板 250之銅層251進行線路製作之過程中，通常需要將多層 電路板200浸入化學蝕刻液中，由於第一功能層232、第 二功能層242之存在，可防止第一電路板21〇、第二電路 板220以及覆銅基板250之間水氣滲透現象之發生。 [0018]可理解，上述實施例之多層電路板，可為軟性電路板， 也可為硬性電路板，或者為軟硬結合之電路板。於上述 各類多層電路板之結構中，相鄰電路板之間可設置至少 一層功能層，甩以將相鄰線路所可能產生之電磁幹擾得 以屏蔽。於製作多層電路板時，功能層可設置於黏合層 中，黏合層用於間隔相鄰電路板並將複數電路板黏結於 一起，於利用壓合機將複數電路板與黏合層壓合後，功 能層便存在於相鄰電路板之間。另外，功能層可作為一 單獨之膜層，利用黏合層將功能層之兩個相對之表面分 別與兩個電路板壓合，從而功能層便可設置於相鄰電路 1(>〇3454143-〇 096145592 表單編號A0101 第7頁/共15頁 1362909 100年12月08日修正替換頁 板之間。此外，設置於多層電路板各相鄰電路板之間之 功能層之結構可相同，亦可不同。 [0019] 上述多層電路板之結構中，相鄰電路板之間設置具有電 磁屏蔽及防水作用之功能層，這樣，多層電路板工作過 程中，相鄰電路板之線路可得到電磁屏蔽，從而保證電 訊號之傳輸品質。另外，由於該具有電磁屏蔽及防水作 用之功能層之存在，於電路板之濕法製程中，例如表面 清洗 '曝光顯影、化學蝕刻、電鍍以及化學鍍等過程中 ，可有效之阻隔多層電路板中相鄰電路板之間水氣滲透 現象之產生。[0015] In addition, in practical applications, the thickness of the functional layer 132 is related to the thickness of the adhesive layer 130, and the thickness of the adhesive layer 130 is determined according to the thickness of the second circuit board 120 of the first circuit board 110' to be bonded. For example, in practical applications, the thickness of the functional layer 132 can be greater than or equal to 3 roi l (lmi 1 is approximately equal to 25. 4 microns). Referring to FIG. 3 and FIG. 4, a second embodiment of the present invention provides a multilayer circuit board 200 formed by pressing a double-sided panel 20 and a copper-clad substrate 250 together by a second adhesive layer 240. The double panel 20 is obtained by sequentially pressing the first circuit board 210, the first adhesive layer 230, and the second circuit board 220. The double panel 20 has substantially the same structure as the double panel 100 in the first embodiment, except that the first functional layer 232 formed in the first adhesive layer 230 is 096145592. Form No. A0101 Page 6 / Total 15 Page 1003454143 -0 1362909 100 years. On December 08, the shuttle is replacing the wavy structure of the page. The second adhesive layer 240 has the same structure as the adhesive layer 130 of the first embodiment, that is, the second adhesive layer 240 is provided with a planar, structural second functional layer 242 in the substrate. The copper clad substrate 250 includes an insulating layer 252 and a copper layer 251. The materials of the first functional layer 232 and the second functional layer 242 are all made of materials having electromagnetic shielding and waterproof properties, such as a foil. [0017] For the multi-layer circuit board 200, the second functional layer 242 can electromagnetically isolate the second circuit board 22 of the double-panel 20 from the copper-clad substrate 250 in the thickness direction of the multi-layer circuit board 200. Specifically, After the copper layer 251 of the copper clad substrate 250 is fabricated, the second functional layer 242 can make the line formed by the second circuit board 220 and the copper layer 251 of the copper clad substrate 250 reach the electromagnetic barrier. In addition, in the process of fabricating the copper layer 251 of the copper-clad substrate 250 by chemical etching, it is generally required to immerse the multilayer circuit board 200 in the chemical etching solution due to the presence of the first functional layer 232 and the second functional layer 242. The occurrence of moisture permeation between the first circuit board 21, the second circuit board 220, and the copper clad substrate 250 can be prevented. [0018] It can be understood that the multi-layer circuit board of the above embodiment may be a flexible circuit board, a hard circuit board, or a hard and soft circuit board. In the structure of the above various types of multi-layer circuit boards, at least one functional layer may be disposed between adjacent circuit boards to shield electromagnetic interference generated by adjacent lines. When the multi-layer circuit board is fabricated, the functional layer may be disposed in the adhesive layer, and the adhesive layer is used for spacing adjacent circuit boards and bonding the plurality of circuit boards together, and laminating the plurality of circuit boards and the bonding layers by using a press machine. The functional layer exists between adjacent boards. In addition, the functional layer can be used as a separate film layer, and the opposite surfaces of the functional layer are respectively pressed with the two circuit boards by the adhesive layer, so that the functional layer can be disposed in the adjacent circuit 1 (>〇3454143- 〇096145592 Form No. A0101 Page 7 of 15 1362909 Revised between the replacement page boards on December 8, 100. In addition, the functional layers disposed between adjacent boards of the multilayer circuit board may have the same structure. [0019] In the structure of the above multi-layer circuit board, a functional layer having electromagnetic shielding and waterproof function is disposed between adjacent circuit boards, so that the circuit of the adjacent circuit board can be electromagnetically shielded during the operation of the multi-layer circuit board. Therefore, the transmission quality of the electric signal is ensured. In addition, due to the existence of the functional layer having electromagnetic shielding and waterproofing, in the wet process of the circuit board, such as surface cleaning, exposure development, chemical etching, electroplating, and electroless plating, etc. It can effectively block the water and gas permeation phenomenon between adjacent circuit boards in a multi-layer circuit board.
[0020} [0021] [0022] [0023] 綜上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本技術方案第一實施例之多層電路板壓合前之拆分 結構示意圖。 圖2係本技術方案第一實施例之多層電路板壓合後之結構 示意圖。 圖3係本技術方案第二實施例之多層電路板壓合前之拆分 結構示意圖。 圖4係本技術方案第二實施例之多層電路板壓合後之結構 示意圖。 096145592 表單编號A0101 第8頁/共15頁 1003454143-0 [0024] 1362909[0022] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the split structure of a multilayer circuit board according to a first embodiment of the present invention before being pressed. Fig. 2 is a schematic view showing the structure of a multilayer circuit board according to a first embodiment of the present technical solution. Fig. 3 is a schematic view showing the split structure of the multilayer circuit board of the second embodiment of the present invention before being pressed. Fig. 4 is a structural schematic view showing the multilayer circuit board of the second embodiment of the present invention after being pressed. 096145592 Form No. A0101 Page 8 of 15 1003454143-0 [0024] 1362909
【主要元件符號說明】 [0025] 雙面板：20 ，100 [0026] 第一電路板 :110 ， 210 [0027] 導電線路： 111 ， 121 [0028] 絕緣材料： 112 ， 122 [0029] 第二電路板 :120 ， 220 [0030] 黏合層：13 0 [0031] 黏性基材： 131 [0032] 功能層：132 [0033] 表面：133 ，134 [0034] 多層電路板 ：200 [0035] 第一黏合層 ：230 [0036] 第一功能層 ：232 [0037] 第二黏合層 ：240 [0038] 第二功能層 ：242 [0039] 覆銅基板： 250 [0040] 銅層：251 [0041] 絕緣層：252 096145592 表單編號A0101 第9頁/共15頁 100年12月08日核正替换頁 1003454143-0[Main component symbol description] [0025] Double panel: 20, 100 [0026] First circuit board: 110, 210 [0027] Conductive line: 111, 121 [0028] Insulation material: 112, 122 [0029] Second circuit Plate: 120, 220 [0030] Adhesive layer: 13 0 [0031] Adhesive substrate: 131 [0032] Functional layer: 132 [0033] Surface: 133, 134 [0034] Multilayer circuit board: 200 [0035] First Adhesive layer: 230 [0036] First functional layer: 232 [0037] Second adhesive layer: 240 [0038] Second functional layer: 242 [0039] Copper-clad substrate: 250 [0040] Copper layer: 251 [0041] Insulation Layer: 252 096145592 Form No. A0101 Page 9 / Total 15 Pages December 08, 100 Nuclear Replacement Page 1003454143-0