JPH1164377A - Lamination-type connector and adaptor device for inspecting circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To permit the formation of a wiring part with a large degree of freedom and to connect the via hole land part of the wiring part of a substrate and the short- circuit part reliably by providing an insulating layer laminated on the substrate in which the wiring part with the via hole land is formed on the upper surface. SOLUTION: This connector is formed of a laminated body of an upper insulating layer 20 laminated on the upper surface of a substrate 10 and a lower insulating layer 30 laminated on the lower surface of the substrate 10. The short-circuit part 23 of the upper insulating layer 20 is formed of a metal post 24 and an intermediary conductor 25, and the upper end of the intermediary conductor 25 is coupled to a connecting electrode 21. The lower insulating electrode 30 is formed on the lower surface of the substrate 10 including a tower-side wiring part 13, and a terminal electrode 31 provided on the tower surface of the lower insulating layer 30 is electrically connected to a via hole land 14 or the lower-side wiring part 13 by a short-circuit part 32. The connecting electrodes 21 are each electrically connected to the terminal electrode 31 via the short-circuit parts 23 and 32 of the upper and lower insulating layer 20 and 30, the upper and lower wiring parts 11 and 13, and a substrate short- circuit part 15.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated connector and an adapter device for inspecting a circuit board provided with the laminated connector.

[0002]

2. Description of the Related Art In general, in a circuit board such as a printed circuit board, as shown in FIG. 21, a functional element region 91 in which functional elements are formed with a high degree of integration is provided at a central portion of a circuit board 90. The functional element region 9
A lead electrode region 93 in which a large number of lead electrodes 92 for one are arranged is formed. At present, with the increase in the degree of integration of the functional element region 91, the number of lead electrodes in the lead electrode region 93 tends to increase and the density tends to increase.

In order to achieve electrical connection between such lead electrodes of a circuit board and other circuit terminals to be connected thereto, conventionally, an anisotropic conductive sheet is interposed on each lead electrode region. Let it be done. The anisotropic conductive sheet has conductivity only in the thickness direction, or has a large number of pressurized conductive portions that show conductivity only in the thickness direction when pressed. Are disclosed, for example, in JP-B-56-48951 and JP-A-51-481.
No. 93393, JP-A-53-147772,
This is known from JP-A-54-146873 and the like.

However, the above-described anisotropic conductive sheet is manufactured as a single product itself and is handled independently, and has a specific positional relationship with respect to a circuit board in an electrical connection operation. It is necessary to hold and fix. However, in the means for achieving the electrical connection of the circuit boards by using independent anisotropic conductive sheets, the arrangement pitch of the lead electrodes on the circuit board to be inspected (hereinafter referred to as “electrode pitch”), that is, each other. There is a problem that as the center-to-center distance between adjacent lead electrodes becomes smaller, it becomes more difficult to position and hold and fix the anisotropic conductive sheet.

[0005] Even if the desired alignment and holding and fixing have been realized, the degree of stress due to thermal expansion and thermal shrinkage is an object of inspection when a thermal history due to a temperature change is received. Because the material constituting the circuit board and the material constituting the anisotropic conductive sheet are different,
There is a problem that a stable connection state is not maintained due to a change in the electrical connection state.

Further, even if a stable connection state can be maintained with respect to a circuit board to be inspected, a circuit having a complicated and fine pattern of electrodes to be inspected, such as a printed circuit board having a high mounting density. Since it is difficult to reliably achieve electrical connection with each of the electrodes to be inspected on the substrate, there is a problem that required inspection cannot be performed sufficiently.

Conventionally, in order to solve the above-described problems, terminal electrodes are arranged on standardized standard grid points on the lower surface, and the electrodes to be inspected of the circuit board to be inspected are arranged on the upper surface. It has been proposed to form an adapter device for circuit board inspection by forming an adapter body provided with corresponding connection electrodes and integrally providing an anisotropic conductive elastomer layer on the upper surface of the adapter body. I have.

According to such a configuration, even when the electrodes to be inspected such as the lead electrodes on the circuit board to be inspected have a minute electrode pitch and a fine, high-density complex pattern. The required electrical connection can be reliably achieved for the circuit board, and a good electrical connection state can be stably maintained against environmental changes such as heat history due to temperature changes, and therefore connection reliability can be improved. Is high,
Thus, there is provided an adapter device for circuit board inspection which is very advantageous in this respect.

[0009]

In such an adapter device for inspecting a circuit board, a pattern corresponding to an electrode to be inspected on a circuit board to be inspected, that is, a complicated pattern having a small electrode pitch is connected. Electrode and, for example, an electrode pitch of 2.54 mm, 1.80 mm or 1.
Since it is necessary to electrically connect terminal electrodes arranged on a standard grid point of 27 mm, the adapter body is connected to a wiring portion of the substrate on a substrate having an appropriate wiring portion on the upper surface. There is used a laminated connector in which insulating layers having short circuits are stacked. In such a multilayer connector, a through-hole method is generally employed as a method for forming a short-circuit portion in an insulating layer. In this through-hole method, a laminate for a connector of a substrate and an insulating layer is formed, and a through-hole is formed in the laminate for the connector in a thickness direction by, for example, a drilling device. In this method, a copper deposit is formed on the inner surface by, for example, a copper plating method.

However, in such a through-hole method, a conductor which is not used as a short-circuit portion is formed on the substrate, and a drill having a high strength, that is, a drill having a large diameter is required in order to form a through-hole penetrating the entire laminate. As a result of the necessity of using a large drill, it is difficult to form a short-circuit portion having a small outer diameter on the insulating layer. In the case where the electrodes to be inspected on the circuit board to be inspected are extremely dense and cannot be formed with a degree of freedom, in order to manufacture a corresponding laminated connector, the number of insulating layers must be reduced. There is a problem that the time and cost required for wiring design and the time and cost required for manufacturing the adapter main body become enormous.

On the other hand, in addition to the through-hole method, a method using a so-called blind via hole (hereinafter, referred to as a "blind via hole method") is known as a method for forming a short-circuit portion in an insulating layer. In the blind via hole method, a drill hole (blind via hole) is formed only in the insulating layer in the connector laminate by, for example, a numerically controlled drilling device, and a metal deposit is formed on the inner surface of the drill hole. It is. However, when a short-circuit portion of an insulating layer is formed at a position directly above a via-hole land in a wiring portion of a substrate by such a blind via hole method, there are the following problems. (1) The drill hole formed in the insulating layer needs to have a depth that reaches the via hole land from the upper surface of the insulating layer and does not penetrate the via hole land. Is about 10 μm, it is extremely difficult to reliably form required drill holes. (2) In order to form the wiring portion of the insulating layer with a large degree of freedom, it is important to form a short-circuit portion having a small outer diameter in the insulating layer. However, a short-circuit portion having a small outer diameter is formed in the insulating layer. Therefore, if a drill hole having an inner diameter smaller than the inner diameter of the via hole land is formed, a short-circuit portion connected to the via hole land is not formed, so that it is difficult to reliably achieve a required interlayer connection.

The present invention has been made in view of the above circumstances, and a first object of the present invention is to provide a laminated connector used for inspection of a circuit board, and which is used for a circuit board to be inspected. The electrode to be inspected such as a lead electrode
Even when the electrode pitch is minute and the pattern is fine and has a complicated pattern of high density, the wiring portion can be easily formed with a large degree of freedom. An object of the present invention is to provide a laminated connector that can reliably achieve connection of an insulating layer to a short-circuit portion. A second object of the present invention is to provide a method for testing an electrode to be inspected, such as a lead electrode, on a circuit board to be inspected, in which the electrode pitch is minute, and the electrode has a fine, high-density complex pattern. The required electrical connection for the circuit board can be reliably achieved, and a good electrical connection state can be stably maintained against environmental changes such as heat history due to temperature changes, and thus connection reliability is high. Another object of the present invention is to provide a circuit board inspection adapter device that can be advantageously and reliably manufactured.

[0013]

According to the present invention, there is provided a laminated connector comprising: a substrate having a wiring portion having a via hole land formed on an upper surface; and at least one substrate provided on the substrate including the wiring portion. An insulating layer, wherein the insulating layer has a short-circuit portion connected to a via-hole land in a wiring portion of the substrate and extending through the insulating layer in a thickness direction thereof. Is constituted by a metal post provided so as to protrude upward from a via hole land in a wiring portion of the substrate, and an intermediate conductor extending downward from an upper surface of the insulating layer and joined to an upper portion of the metal post. It is characterized by having.

A first step of forming a wiring portion having a via hole land on the upper surface of the substrate, and then forming a metal post so as to protrude upward from the via hole land of the wiring portion; Forming a second step of forming an insulating layer on the upper surface of the substrate including the wiring portion and the metal post, and forming a hole having a depth reaching the metal post at a position where the metal post is formed in the insulating layer. Forming a mediating conductor inside the hole to form a short-circuit portion connected to the via-hole land of the wiring portion and extending through the insulating layer in the thickness direction thereof. It can be manufactured by a method.

A circuit board inspection adapter device according to the present invention is a circuit interposed between a circuit board to be inspected and an electrical inspection device for electrically connecting an electrode to be inspected of the circuit board to the electrical inspection device. An adapter device for inspecting a board, comprising: an adapter body having terminal electrodes arranged on lattice points on a lower surface and having connection electrodes corresponding to electrodes to be inspected on a circuit board to be inspected on an upper surface; The adapter body is provided with an anisotropic conductive elastomer layer integrally provided on the upper surface, the adapter body includes the above-described laminated connector, and a short-circuit portion formed on the insulating layer is provided on the connection electrode. It is electrically connected, and the wiring portion of the substrate is electrically connected to the terminal electrode.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. FIG. 1 is an explanatory cross-sectional view showing a configuration of an example of the multilayer connector of the present invention, FIG. 2 is a partial plan view showing an arrangement state of each part of the multilayer connector, and FIG. It is explanatory sectional drawing which expands and shows a part of connector. As shown in FIG. 1, the laminated connector includes a substrate 10, an upper insulating layer 20 provided on the upper surface of the substrate 10, and a lower insulating layer provided on the lower surface of the substrate 10. It is constituted by a laminate with the layer 30. The material of the substrate 10 is preferably a plate-like body made of a heat-resistant material having high dimensional stability, and various insulating resins can be used. In particular, a glass fiber reinforced epoxy resin is most suitable. The upper insulating layer 20 and the lower insulating layer 30 are formed of, for example, a thermosetting resin sheet provided by thermocompression bonding. This thermosetting resin sheet is preferably made of a heat-resistant resin having high dimensional stability, and various resin sheets can be used, but a glass fiber reinforced epoxy prepreg resin sheet, a polyimide prepreg resin sheet, an epoxy prepreg resin Sheets are preferred.

On the upper surface of the substrate 10, an upper wiring portion 11 having an appropriate pattern having, for example, a circular via hole land 12 is formed. On the lower surface of the substrate 10, for example, an appropriate pattern having a circular via hole land 14 is formed. A lower wiring portion 13 is formed, and the upper wiring portion 11 and the lower wiring portion 13 are electrically connected to each other by, for example, a cylindrical substrate short-circuit portion 15 extending through the substrate 10 in the thickness direction. I have. The substrate short-circuit portion 15 is connected to the upper wiring portion 1.
It is formed at a position directly below the first via hole land 12, at a position just above the via hole land 14 of the lower wiring portion 13, and at an appropriate position between the upper wiring portion 11 and the lower wiring portion 13. Here, the “via hole land” means a land formed on the via hole, that is, a land formed on the substrate short-circuit portion.

An upper insulating layer 20 is formed on the upper surface of the substrate 10 including the upper wiring section 11. On the upper surface of the upper insulating layer 20, a connection electrode 21 is formed at a position corresponding to a pattern of an electrode to be inspected (not shown) on a circuit board to be inspected so as to protrude from the upper surface. An upper surface wiring portion 22 having an appropriate pattern is formed. The upper insulating layer 20 is provided with, for example, a cylindrical short-circuit portion 23 extending through the thickness direction thereof. The upper end of the short-circuit portion 23 is connected to the connection electrode 21 directly or via the upper surface wiring portion 22, while the lower end of the short-circuit portion 23 is connected to the via hole land 12 of the upper wiring portion 11 or the upper wiring portion 11. The connection electrode 21 is thereby electrically connected to the upper wiring portion 11.

As shown in FIG. 3, the short-circuit portion 23 of the upper insulating layer 20 is formed at an appropriate position of the via hole land 12 and the upper wiring portion 11 of the upper wiring portion 11 and above the upper wiring portion 11. A metal post 24 having a cylindrical shape formed so as to protrude, and a metal post 24 that extends downward from the upper surface of the upper insulating layer 20 and is joined to the upper portion of the metal post 24 and that is larger than the inner diameter of the cylindrical hole 24H of the metal post 24. It is composed of a cylindrical intermediate conductor 25 having a diameter, and the upper end of the intermediate conductor 25 is connected to the connection electrode 21 directly or via a top wiring portion (not shown).

A lower insulating layer 30 is formed on the lower surface of the substrate 10 including the lower wiring portion 13. The lower surface of the lower insulating layer 30 has a terminal electrode 3 electrically connected to an electrical inspection apparatus, that is, an inspection tester by appropriate means.
The terminal electrodes 31 are provided on the lattice points, and the terminal electrodes 31 are formed by, for example, cylindrical short-circuit portions 32 extending through the lower insulating layer 30 in the thickness direction thereof, thereby forming the lower wiring portions 13 of the substrate 10. Of the via hole land 14 or the lower wiring portion 13. The distance between the lattice points of the terminal electrode 31, that is, the terminal electrode 31
The electrode pitch is not particularly limited, and may be an appropriate size according to various conditions. For example, the electrode pitch is 2.54 mm, 1.8 mm, or 1.27 mm.

Each of the connection electrodes 21 includes a short-circuit portion 23 (intermediate conductor 25 and metal post 24) of the upper insulating layer 20, an upper wiring portion 11, a substrate short-circuit portion 15, a lower wiring portion 13, It is electrically connected to the terminal electrode 31 via the short-circuit portion 32 of the lower insulating layer 30. The upper wiring portion 11 and lower wiring portion 13 of the substrate 10 and the upper wiring portion 22 of the upper insulating layer 20 are the same as those in FIG.
Of course, any of them can be formed to extend in a direction intersecting the paper surface, and FIG. 2 shows such a state.

In an actual configuration, the electrical connection between the connection electrode 21 and the terminal electrode 31 may be achieved in a manner according to the purpose of inspecting the circuit board. Therefore, it is not always necessary to connect all the connection electrodes 21 and the terminal electrodes 31 in a one-to-one correspondence, and the connection electrodes 21 and the upper surface wiring section 2
2. Various required connection states for the upper wiring portion 11, the lower wiring portion 13, and the terminal electrode 31 can be realized. For example, connecting the connection electrodes 21 using the upper surface wiring portion 22, connecting the plurality of connection electrodes 21 to one upper wiring portion 11 in common, and connecting one connection electrode 21 to the plurality of connection electrodes 21. The connection to the upper side wiring portion 11 at the same time and others are possible.

The laminated connector having such a structure is as follows.
(1) After forming the upper side wiring portion 11 having the via hole land 12 on the upper surface of the substrate 10, the upper side wiring portion 1
A first step of forming a metal post 24 so as to protrude upward from one via hole land 12, and (2) a second step of forming an upper insulating layer 20 on the upper surface of the substrate 10 including the upper wiring portion 11 and the metal post 24. In two steps, (3) a hole having a depth reaching the metal post 24 is formed in the upper insulating layer 20 at a position where the metal post 24 is formed, and a mediating conductor 25 is formed inside the hole. Thereby, it is manufactured through the third step of forming a short-circuit portion 23 connected to the via-hole land 12 of the upper wiring portion 11 and extending through the upper insulating layer 20 in the thickness direction thereof.

The details of the first to third steps are as follows. First step: In the first step, finally, as shown in FIG. 6, the upper wiring portion 11 having the via hole land 12 on the upper surface of the substrate 10, and the via hole land 12 and the upper portion of the upper wiring portion 11 A metal post 24 is formed so as to protrude upward from an appropriate portion of the side wiring portion 11, a substrate short-circuit portion 15 extending through the substrate 10 in the thickness direction is formed, and a via hole is formed on the lower surface of the substrate 10. This is a step of forming the lower wiring portion 13 having the land 14.

More specifically, as shown in FIG. 4, a flat insulating substrate 10 made of a hard resin provided with thin metal layers 11A and 13A made of, for example, copper is laminated on both sides. As shown in FIG. 5, the substrate 10 is mounted on the substrate 10 by, for example, a numerically controlled drilling device.
A hole 15H for forming a substrate short-circuit portion penetrating in the thickness direction is formed. Next, as shown in FIG. 6, the substrate 10 is subjected to electroless copper plating and electrolytic copper plating,
A copper deposit is formed on the inner surface of the hole 15H for forming a substrate short-circuit portion, thereby forming a cylindrical substrate short-circuit portion 15 extending through the substrate 10 in the thickness direction. In addition, the thin metal layer 11A on the upper surface of the substrate 10 is subjected to photolithography and etching to remove a part of the thin metal layer 11A. The upper wiring portion 11 is formed according to the pattern.

Further, as shown in FIG. 7 in an enlarged manner, photolithography and electrolytic copper plating are performed on the via hole lands 12 of the upper wiring portion 11 and appropriate portions of the upper wiring portion 11 on the upper surface of the substrate 10. By the above method, a metal post 24 made of a metal deposit in the form of a small cylindrical column is formed. The height of this metal post 24 is
It is preferably smaller than the thickness of a thermosetting resin sheet to be described later, specifically, 20 to 100 μm, and more preferably 10 μm or more than the thickness of the upper wiring portion 11 and the via hole land 12. If the height of the metal post 24 is not more than 10 μm than the thickness of the upper wiring portion 11 and the via hole land 12, it may be difficult to reliably form a required conductor drill hole described later. . Meanwhile, metal post 24
When the height exceeds 100 μm, it is necessary to use a thermosetting resin sheet having a considerably large thickness, and therefore, the thickness of the formed insulating layer becomes large, and as a result, the entire laminated connector obtained is obtained. Is undesirably large. Further, the inner diameter of the cylindrical hole 24H of the metal post 24 is preferably 80 μm or less,
This makes it possible to reduce the inner diameter of the intermediate conductor drill hole described later, and as a result, it is possible to form a short-circuit portion having a small outer diameter in the insulating layer, thereby forming the wiring portion of the upper insulating layer. , A greater degree of freedom is obtained.

On the other hand, by subjecting the thin metal layer 13A on the lower surface of the substrate 10 to photolithography and etching to remove a part thereof, a desired portion having the via hole land 14 connected to the substrate short-circuit portion 15 is obtained. The lower wiring portion 13 is formed according to a pattern according to the mode.

Second step: This second step is to form an upper insulating layer 20 on the upper surface of the substrate 10 including the upper wiring portion 11 and the metal posts 24, as shown in FIG. A thin metal layer 21A for forming a connection electrode and an upper wiring portion is formed on the upper surface of the upper insulating layer 20, and further, on the lower surface of the substrate 10 including the lower wiring portion 13,
The lower insulating layer 30 is formed and the lower insulating layer 30 is formed.
Is a step of forming a thin metal layer 31A for forming a terminal electrode on the lower surface of the substrate.

More specifically, as shown in FIG. 8, a thermosetting resin sheet 20A in which through holes 23A having a diameter compatible with the metal posts 24 are formed at corresponding positions in advance is overlaid on the upper surface of the substrate 10. Metal post 24 is through hole 2
3A, and the metal foil 21B is overlaid on the upper surface of the thermosetting resin sheet 20A. On the other hand, a thermosetting resin sheet 30A is placed on the lower surface of the substrate 10, and a metal foil 31B is placed on the lower surface of the thermosetting resin sheet 30A. Then, in this state, the thermosetting resin sheet 20A and the thermosetting resin sheet 30A are cured by, for example, thermocompression bonding by a vacuum press method, and the upper surface and the lower surface of the substrate 10 are integrally formed as an adhered surface. And a metal foil 21B is integrally attached to the upper surface of the thermosetting resin sheet 20A, and a metal foil 31B is attached to the lower surface of the thermosetting resin sheet 30A.
Are integrally attached, whereby, as shown in FIG.
A pressure-bonded laminate 1A in which the metal thin layer 21A, the upper insulating layer 20, the substrate 10, the lower insulating layer 30, and the metal thin layer 31A are stacked in this order is formed. At this time, the through holes 23A formed in the thermosetting resin sheet 20A are closed by thermocompression as shown in FIG.
As a result, the upper end surface of the metal post 24 is
0 is covered.

In the above, as a means for forming the upper insulating layer 20 and the lower insulating layer 30, a thermocompression bonding means for pressing the thermosetting resin sheets 20A, 30A to the surface to be adhered under heating is used. However, this makes it possible to reliably form a required insulating layer having a uniform thickness very easily as compared with, for example, a method of applying and drying an insulating resin layer forming liquid. Thermosetting resin sheet 20
As A, it is necessary to use a material having a sufficient thickness so that the metal post 24 does not penetrate the sheet at the time of thermocompression bonding. Specifically, the thickness of the formed insulating layer is, for example, 20 to 100 μm. Is preferably used. Further, the metal thin layer 21 is formed by thermocompression bonding.
It is preferable that the thickness of the metal foils 21B and 31B for forming A and 31A be, for example, 9 to 35 μm.

The thermosetting resin sheet 20A needs to be overlapped with the through-hole 23A formed therein and the metal post 34 being aligned with each other. This can be easily achieved by the position adjusting means. In addition, when a thermosetting resin sheet of an appropriate material is used, it is not essential that a through hole corresponding to the metal post 24 be formed in advance.

The temperature for thermocompression bonding the thermosetting resin sheets 20A, 30A and the metal foils 21B, 31B depends on the material of the thermosetting resin sheets 20A, 30A.
It is necessary that the temperature is not lower than the temperature at which the thermosetting resin sheet softens and becomes adhesive, and is usually 80 to 250 ° C.
Preferably, it can be set to about 140 to 200 ° C.
The pressing pressure in this thermocompression bonding step is, for example, at most 5
About 50 kg / cm 2, preferably 20-40 k
g / cm2. In this thermocompression bonding step, thermocompression bonding can be performed under an atmosphere of normal pressure.
It is preferable to use a so-called vacuum press method in a reduced pressure atmosphere of about 100 Pa, preferably about 10 to 50 Pa. In this case, it is effectively prevented that air bubbles are trapped between the thermosetting resin sheet and the adherend surface. Is done.

Third step: In the third step, as shown in FIG. 13, the intermediary conductor 25 extending downward from the upper surface of the upper insulating layer 20 and joined to the upper part of the metal post 24 is finally formed. By the formation, the upper end is electrically connected to the thin metal layer 21 formed on the upper surface of the upper insulating layer 20, and the lower end is connected to the via hole land 12 of the upper wiring portion 11 or the upper wiring. A short-circuit portion 23 electrically connected to an appropriate portion of the portion 11 is formed, and the lower end of the short-circuit portion 23 is electrically connected to the thin metal layer 31A formed on the lower surface of the lower insulating layer 30. This is a step of forming a short-circuit portion 32 that is connected and has an upper end electrically connected to a via hole land 14 of the lower wiring portion 13 or an appropriate portion of the lower wiring portion 13.

Specifically, as shown in FIG. 11, the above-mentioned crimped laminated body 1A is placed on the above-mentioned crimped laminated body 1A from the upper surface of the crimped laminated body 1A at a position where the metal post 24 is formed, as shown in FIG. A conductor forming drill hole 25H reaching the metal post 24 is formed, and at the position related to the lower wiring portion 13 (the position where the via hole land 14 is formed and other appropriate positions), the crimped laminate is formed. A drill hole 32H for forming a short-circuit portion that reaches the lower wiring portion 13 from the lower surface of 1A is formed.

In the above description, the conductor forming drill hole 25
The depth of H may be such that it reaches metal post 24 and does not penetrate upper wiring portion 11 and via hole land 12, so that the allowable depth of conductor forming drill hole 25H to be formed is allowed. Since the range is large, the error range of the depth of the hole formed by the numerically controlled drilling device can be sufficiently covered, and as a result, the required conductor forming drill hole 25H can be reliably formed. .
Also, the inner diameter of the conductor forming drill hole 25H is larger than the inner diameter of the cylindrical hole 24H in the metal post 24, so that the required electrical connection of the formed intermediate conductor is achieved. It is not particularly limited as long as it is, for example, 0.03 to 0.5 mm, preferably 0.05 to 0.5 mm.
It is about 0.15 mm. The inner diameter of the short hole forming drill hole 32H is, for example, 0.15 mm.

Next, by performing a plating treatment such as an electroless copper plating method or an electrolytic copper plating method on the above-mentioned pressure-bonded laminate 1A, as shown in FIG.
5H, a copper deposit is formed on the inner surface of the inner conductor 5H, thereby forming a cylindrical intermediate conductor 2 extending in the thickness direction of the upper insulating layer 20.
5, the post metal 24 and the intermediary conductor 2
5 is formed. on the other hand,
By the above plating process, the short hole forming drill hole 32H
Is formed on the inner surface of the cylindrical short-circuit portion 32 extending through the lower insulating layer 30 in the thickness direction.
Is formed.

As described above, as shown in FIG.
The upper insulating layer 20 has a thin metal layer 2 formed on its upper surface.
1 and a short-circuit portion 23 electrically connected to the upper wiring portion 11 of the substrate 10, and the lower insulating layer 30 has a thin metal layer 31 </ b> A formed on the lower surface thereof and a lower portion of the substrate 10. The short-circuit portion 32 electrically connected to the side wiring portion 13 is formed.

Fourth step: In the fourth step, finally, as shown in FIG.
The connection electrode 21 electrically connected to the via hole land 12 of the upper wiring portion 11 or an appropriate portion of the upper wiring portion 11 is formed, and the lower insulating layer 3 is formed.
This is a step of forming the terminal electrode 31 electrically connected to the via hole land 14 of the lower wiring portion 13 or an appropriate portion of the lower wiring portion 13 on the lower surface of the substrate 10.

More specifically, the thin metal layer 21A on the upper surface of the pressure-bonded laminate 1A is subjected to photolithography and etching to remove a part of the thin metal layer 21A.
As shown in (1), a connection electrode base layer 21C and a top wiring portion 22 are formed in a pattern corresponding to the electrode to be inspected of the circuit board to be inspected. This connection electrode base layer 21C is
Via the short-circuit portion 23 or the via-hole land 1 of the upper-side wiring portion 11 of the substrate 10 via the upper surface wiring portion 22.
2 or in a state where it is electrically connected to an appropriate portion of the upper wiring portion 11. Then, as shown in FIG. 15, a required connection electrode 21 is formed by depositing a metal on the upper surface of the connection electrode base layer 21C by, for example, a plating method to increase the thickness as a metal layer. .

The thin metal layer 3 on the lower surface of the lower insulating layer 30
By performing photolithography and etching on 1A, the terminal electrodes 31 arranged on the lattice points are formed in a state of being connected to the short-circuit portions 32. The electrode pitch of the terminal electrode 31 is, for example, 2.54 mm,
1.8 mm or 1.27 mm.

In the above description, it may be desired to individually increase the thickness of the metal layer forming the connection electrode 21 or the upper wiring portion 22. For example, the connection electrode 21
Is, from the relationship with the function of the elastomer layer 40 described below,
It is preferable that the projection further protrudes from the surface wiring layer by 20 μm or more. In such a case, for example, a photoresist film having a thickness corresponding to the thickness to be increased is formed, and the same patterning is performed on the photoresist film to form a hole exposing the surface of the metal layer. Then, a metal is filled and deposited on the surface of the metal layer by a plating method or the like, and then the photoresist film may be removed. By such a method, for example, it is easy to form the connection electrode 21 in an expected state protruding from the surface.

The fourth step, that is, the upper insulating layer 20
The step of forming the connection electrode 21 and the upper surface wiring portion 22 on the upper surface and forming the terminal electrode 31 on the lower surface of the lower insulating layer 30 does not need to be provided independently. Alternatively, it can be performed in the third step.

In this manner, the substrate 10 and the substrate 1
0 and a lower insulating layer 30 stacked on the lower surface of the substrate 10 and a connecting electrode 2 on each of the upper and lower surfaces.
1 and the terminal electrode 31, and the connection electrode 21 is composed of the short-circuit portion 23 (the intermediary conductor 25 and the metal post 24), the upper wiring portion 11 including the via-hole land 12, the substrate short-circuit portion 23, and the via-hole land 14. Terminal electrode 31 via the lower wiring portion 13 and the short-circuit portion 32 including
A laminated connector electrically connected to the connector is manufactured.

According to such a laminated connector, the short-circuit portion 23 of the upper insulating layer 20 protrudes upward from the via hole land 12 of the upper wiring portion 11 or an appropriate portion of the upper wiring portion 11 on the substrate 10. And an intermediate conductor 25 extending downward from the upper surface of the upper insulating layer 20 and joined to the upper portion of the metal post 24, and a through hole penetrating the entire multilayer connector. Since it is not based on holes, the upper wiring portion 11 and the lower wiring portion 13 of the substrate 10 can be easily formed with a large degree of freedom. Also,
The mediating conductor 25 can be provided inside the upper insulating layer 20 by forming a conductor drill hole 25H in the upper insulating layer 20. The depth of the conductor drill hole 25H reaches the metal post 24, and The conductor drilling hole 25H to be formed is not limited as long as it does not penetrate the upper wiring portion 11.
The depth tolerance of the hole is large, so that the error range of the depth of the hole formed by the numerically controlled drilling device can be sufficiently covered. As a result, the required conductor forming drill hole 35 can be surely formed. Since it is formed, the via hole land 12 of the upper wiring portion 11 and the short-circuit portion 23 connected to an appropriate portion of the upper wiring portion 11 on the substrate 10 can be reliably formed. Further, the outer diameter of the intermediary conductor 25 needs to be larger than the cylindrical hole 24H of the metal post 24, but it is possible to form the metal post 24 in which the inner diameter of the cylindrical hole 24 is considerably small. This allows
Since the intermediate conductor 25 having a small outer diameter can be formed, the upper surface wiring portion 22 of the upper insulating layer 20 can be formed with a large degree of freedom.

Next, the circuit board inspection adapter device of the present invention will be described. FIG. 16 is an explanatory cross-sectional view illustrating a configuration of an example of the adapter device for circuit board inspection of the present invention. The adapter device for circuit board inspection includes an adapter body 1 and an anisotropic conductive elastomer layer (hereinafter, simply referred to as “elastomer layer”) 40 provided on the upper surface of the adapter body 1.

More specifically, the adapter body 1
Is composed of a laminated connector having the configuration shown in FIG. 1, and an elastomer layer 40 is integrally formed on the surface of the adapter body 1 in a state of being adhered or adhered thereto. As shown in FIG. 17, this elastomer layer 40 has a state in which a large number of conductive portions 41 in which conductive particles P are densely filled in an insulating elastic polymer substance E are located on the connection electrodes 21. And the adjacent conductive portions 41 are insulated from each other by the insulating portion 42. In each conductive portion 41, the conductive particles P are oriented so as to be arranged in the thickness direction, and a conductive path extending in the thickness direction is formed. The conductive portion 41 may be a pressurized conductive portion in which a conductive path is formed by reducing the resistance value when compressed in the thickness direction and compressed. On the other hand, the insulating portion 42 does not form a conductive path in the thickness direction even when pressed.

In the conductive portion 41 of the elastomer layer 40, the filling rate of the conductive particles P is preferably 10% by volume or more, particularly preferably 15% by volume or more. In the case where the conductive portion is a pressurized conductive portion, when the filling rate of the conductive particles is high, it is preferable in that the intended electrical connection can be reliably achieved even when the pressing force is small. However, when the electrode pitch of the connection electrode 21 is reduced, sufficient insulation between adjacent conductive portions may not be ensured, and therefore, the filling rate of the conductive particles 41 in the conductive portion 41 is 40% by volume or less. It is preferred that

In the adapter device for circuit board inspection having such a configuration, the elastomer layer 40 is integrally formed on the upper surface thereof, and the connection electrode 2 on the upper surface is further formed.
Since the conductive portion 41 of the elastomer layer 40 is disposed on the first electrode 1, there is no need to perform positioning and holding and fixing of the elastomer layer 40 at the time of an electrical connection operation, so that the electrode pitch in the lead electrode region is very small. In some cases, the required electrical connections can be reliably achieved.
Further, since the elastomer layer 40 is integrated with the adapter main body 1, a good electrical connection state is stably maintained even with environmental changes such as heat history due to a temperature change, and therefore always high connection reliability is obtained. be able to.

In the illustrated example, the elastomer layer 40
, The conductive portion 41 forms a protruding portion that protrudes from the surface of the insulating portion 42. According to such an example,
Since the degree of compression by pressurization is larger in the conductive portion 41 than in the insulating portion 42, a conductive path having a sufficiently low resistance value is reliably formed in the conductive portion 41. Can be reduced, and as a result, even if the pressing force applied to the elastomer layer 40 is not uniform, it is possible to prevent the occurrence of variations in conductivity between the conductive portions 41.

When the conductive portion 41 forms a protrusion as described above, the protrusion height h of the protrusion is the total thickness t of the elastomer layer 40 (t = h + d, and d is the thickness of the insulating portion 42). Is preferably 8% or more. The total thickness t of the elastomer layer 40 is preferably 300% or less of the electrode pitch p defined as the center-to-center distance of the connection electrode 21, that is, t ≦ 3p. When such a condition is satisfied, even when the pressure applied to the elastomer layer 40 changes, the change in the conductivity of the conductive portion 41 due to the change is sufficiently small.

When the conductive portion 41 forms a projection, it is not always necessary that the entire surface of the projection has conductivity. For example, the periphery of the projection has a conductivity of 20% or less of the electrode pitch. A road non-forming portion may be present. Further, it is preferable that the minimum value of the separation distance r between the adjacent conductive portions 41 is 10% or more of the width R of the conductive portion 41. By satisfying such conditions, it is possible to sufficiently avoid the possibility that the adjacent conductive portions 41 electrically contact each other due to lateral displacement when the protrusion is deformed by being pressed. Can be. In the above example, the planar shape of the conductive portion 41 can be a rectangular shape having the same width as the connection electrode 21, but can be a circular shape having a necessary area or any other appropriate shape.

The conductive particles of the conductive portion 41 include, for example, particles of a metal exhibiting magnetism such as nickel, iron, and cobalt, or particles of an alloy thereof, or gold,
Those plated with silver, palladium, rhodium, etc.
Inorganic particles such as non-magnetic metal particles or glass beads or polymer particles plated with a conductive magnetic material such as nickel or cobalt can be used. In the method described below, nickel, iron, or conductive magnetic particles made of an alloy thereof are used,
Further, gold-plated particles can be preferably used in terms of electrical characteristics such as low contact resistance. Further, particles composed of a conductive superparamagnetic material can be preferably used because they do not show magnetic hysteresis.

The particle size of the conductive particles is preferably 3 to 200 μm so that the conductive portion 41 can be easily deformed under pressure and sufficient electrical contact can be obtained between the conductive particles in the conductive portion 41. Preferably, it is particularly preferably 10 to 100 μm.

As the insulating and elastic polymer constituting the conductive portion 41, a polymer having a crosslinked structure is preferable. Examples of curable polymer materials that can be used to obtain a crosslinked polymer include silicone rubber, polybutadiene, natural rubber, polyisoprene, styrene-butadiene copolymer rubber, and acrylonitrile-butadiene copolymer rubber. , Ethylene-propylene copolymer rubber, urethane rubber, polyester rubber, chloroprene rubber, epichlorohydrin rubber, and soft liquid epoxy resin. Specifically, a material for a polymer substance which is in a liquid state before the curing treatment and is integrated with the upper surface of the adapter body 1 while keeping the adhesion state or the adhesion state after the curing treatment is preferable. From such a viewpoint, examples of the material for a polymer substance suitable for the present invention include liquid silicone rubber, liquid urethane rubber, and soft liquid epoxy resin. Materials for polymer substances include
Additives such as a silane coupling agent and a titanium coupling agent can be added to improve the adhesiveness to the upper surface of the adapter body 1.

As a material for forming the insulating portion 42, the same or different material as the polymer material for forming the conductive portion 41 can be used. One that is integrated with the adapter body 1 while maintaining the adhesive state is used.

By forming such an insulating portion,
Since the integrality of the elastomer layer itself and its integrality with the adapter main body are reliably increased, the strength of the entire adapter device is increased, and therefore, excellent durability against repeated compression can be obtained.

In the adapter device for circuit board inspection having the above-described configuration, the circuit board to be inspected is disposed on the upper surface, the electrode to be inspected of the circuit board is brought into contact with the connection electrode 21, and the lower surface of the lower surface of the connection device 21 The terminal electrode 31 is connected to the tester via an appropriate connection means, and is further pressurized so as to be compressed in the thickness direction. In this state,
The conductive portion 41 of the elastomer layer 40 of the adapter device is brought into a conductive state, whereby a required electrical connection between the electrode under test and the tester is achieved.

The above-mentioned adapter device for circuit board inspection comprises:
For example, it is manufactured by providing the elastomer layer 40 on the upper surface of the adapter body 1 as follows. First, an elastomer material made of a fluid mixture is prepared by dispersing conductive magnetic particles in a polymer material that becomes an insulating elastic polymer material by curing treatment, and as shown in FIG. The elastomer material is applied to the upper surface of the adapter body 1 to form an elastomer material layer 50, which is arranged in the cavity of the mold.

The dies are provided with upper dies 5 each constituting an electromagnet.
1 and a lower die 52, and the upper die 51 has a connection electrode 2
A magnetic pole plate 53 having a flat lower surface is provided, which is composed of a ferromagnetic portion M (shown by oblique lines) having a pattern corresponding to No. 1 and a nonmagnetic portion N other than the ferromagnetic portion. The flat lower surface of the plate 53 is separated from the surface of the elastomeric material layer 50 so that the gap G is formed. In addition,
18 and 19, details of the adapter main body 1 are omitted except for the connection electrode 21.

In this state, the electromagnets of the upper die 51 and the lower die 52 are operated, whereby a parallel magnetic field in the thickness direction of the adapter body 1 is applied. As a result, in the portion of the elastomer material layer 50 located on the connection electrode 21, a stronger parallel magnetic field is applied in the thickness direction than in other portions, and by the parallel magnetic field having this distribution,
As shown in FIG. 19, the conductive magnetic particles in the elastomer material layer 50 are gathered in a portion located on the connection electrode 21 by the magnetic force of the ferromagnetic portion M and further oriented in the thickness direction.

However, at this time, the elastomer material layer 5
Since the gap G exists on the surface side of the polymer material 0, the polymer material also moves by the moving and gathering of the conductive magnetic particles. Are raised, and a protruding conductive portion 41 is formed. Therefore, the thickness t1 of the formed insulating portion 42 is smaller than the initial thickness t0 of the elastomer material layer 50. After the parallel magnetic field is applied or after the parallel magnetic field is removed, the elastomer layer 40 including the conductive portion 41 and the insulating portion 42 forming the protrusion is integrally formed on the adapter body 1 by performing a curing process. The adapter device is manufactured.

As shown in FIG. 20, as the magnetic pole plate 53, the upper die 51 includes a ferromagnetic portion M of a pattern corresponding to the connection electrode 21 and a non-magnetic portion N other than the ferromagnetic portion M. The magnetic pole plate 55 in a state where the ferromagnetic portion M protrudes below the non-magnetic portion N on the lower surface of the magnetic head may be used. Further, it is also possible to use a magnetic pole plate that is entirely made of a ferromagnetic material and has a pattern portion corresponding to the connection electrode 21 protruding downward from other portions. Also in these cases, a stronger parallel magnetic field is applied to the elastomer material layer 50 in the region of the connection electrode 21.

Further, the upper mold 5 is kept under the parallel magnetic field.
A mold having a variable distance between the lower mold 1 and the lower mold 52 is used.
1 is disposed immediately above the elastomer material layer 50, and the gap between the upper mold 51 and the lower mold 52 is gradually widened while applying a parallel magnetic field, thereby causing the elastomer material layer 50 to protrude. You can do it too.

In the present invention, it is not essential that the conductive portion 41 of the elastomer layer 40 protrudes from the insulating portion 42, and the elastomer portion 40 may have a flat surface. In such a case, the processing may be performed without forming the gap G by using, for example, a mold having the configuration shown in FIG.

The thickness of the elastomer material layer 50 is, for example, 0.1 to 3 mm. This elastomer material layer 50
In order to facilitate the movement of the conductive magnetic particles, the material for the polymer substance has a viscosity at 25 ° C. of 10 4 to 10 under the condition of a strain rate of 10 1 sec -1.
It is preferably about 7 centipoise. The curing treatment of the elastomer material layer 50 is preferably performed in a state where the parallel magnetic field is applied, but may be performed after stopping the operation of the parallel magnetic field.

The ferromagnetic portion M of the pole plate 53 is made of iron,
A ferromagnetic material such as nickel, and a non-magnetic material portion N
Can be formed of a nonmagnetic metal such as copper, a heat-resistant resin such as polyimide, or an air layer. The strength of the parallel magnetic field applied to the elastomer material layer 50 is preferably such that the average of the cavity of the mold is 200 to 20,000 gauss.

The curing treatment is appropriately selected depending on the material used, but is usually performed by heat treatment. The specific heating temperature and heating time depend on the elastomer material layer 50.
The material is appropriately selected in consideration of the type of the polymer material, the time required for the movement of the conductive magnetic particles, and the like. For example, when the material for a polymer substance is a room-temperature-curable silicone rubber, the curing treatment is performed at room temperature for about 24 hours, at 40 ° C. for about 2 hours, and at 80 ° C. for about 30 minutes.

As described above, according to an example of the present invention,
In the present invention, at least one insulating layer is provided on a substrate having a via hole land and a substrate short-circuit portion extending through the via hole land in the thickness direction,
A short-circuit portion extending through the insulating layer in the thickness direction thereof is formed, and the short-circuit portion is constituted by a metal post and an intermediary conductor bonded to the upper end thereof. It is. Therefore, the above illustrated example:
Although one insulating layer is provided on the substrate, in the present invention, two or more insulating layers may be provided. In this case, the above-described first to third steps are insulated. By repeating the number of times corresponding to the number of layers, the laminated connector can be manufactured.

[0069]

Hereinafter, embodiments of the present invention will be described.
The present invention is not limited to these examples.

Example 1 (1) Production of Laminated Connector First Step: Each thin copper metal layer (11A, 9 μm thick)
13A) is prepared by laminating on both surfaces of a substrate (10) made of a glass fiber reinforced epoxy resin having a thickness of 0.5 mm, and cut into a rectangular shape having a length of 330 mm and a width of 500 mm. Drilling device "ND-2J-18"
(Hitachi Seiko Co., Ltd.), each inner diameter is 0.15mm
(FIG. 4 and FIG. 5).

Next, a cylindrical substrate short-circuit portion (15) is formed in the substrate short-circuit portion forming hole (15H) by copper plating, and the thin metal layer (11A) on the upper surface of the substrate 10 is subjected to photolithography. By performing the etching process, an upper wiring portion (11) having a via hole land (12) connected to the substrate short-circuit portion (15) was formed on the upper surface. Then, the via hole land (1) of the upper side wiring portion (11) formed on the upper surface of the substrate (10) is formed.
2) At a predetermined portion of the upper wiring portion (11), a projection height from the upper wiring portion (11) is 20 μm, an outer diameter is 0.30 mm, and a cylindrical hole is formed by photolithography and electrolytic copper plating. A cylindrical metal post (24) having an inner diameter of (24H) of 50 μm was formed. On the other hand, the substrate (1
By performing photolithography and etching on the thin metal layer (13A) on the lower surface of (0), the via hole land (1) connected to the substrate short-circuit portion (15) is formed.
A lower side wiring portion (13) having 4) was formed (see FIGS. 6 and 7).

Second step: thermosetting resin sheet (20A)
NC at the position corresponding to the metal post (24)
A 0.35 mm diameter through-hole (2
3A) to form the thermosetting resin sheet (20A)
Is positioned on the upper surface of the substrate (10) after the through hole (23A) is aligned with the metal post (24).
A metal foil (21B) is arranged on the upper surface of the thermosetting resin sheet (20A), and the thermosetting resin sheet (3
0A) on the lower surface of the substrate (10), and further, a metal foil (31B) on the lower surface of the thermosetting resin sheet (30A).
And a vacuum press machine “MHPCV-200-75”
0 "(manufactured by Meiki Seisakusho) under a reduced pressure atmosphere of 10 Pa at a maximum press pressure of 40 kg / cm ² and a maximum temperature of 180 ° C. for 2 hours, followed by thermocompression bonding.
Compression lamination in which an upper insulating layer (20) and a metal foil layer (21A) are laminated on an upper surface of a substrate (10), and a lower insulating layer (30) and a thin metal layer (31A) are laminated on a lower surface of the substrate (10). A body (1A) was formed (see FIGS. 8 to 10). In the above, as the thermosetting resin sheet (20A, 30A), a glass fiber reinforced prepreg “National Multi R1661” manufactured by Matsushita Electric Works, thickness 60 μm) is used, and as the metal foil (21B, 31B), the thickness is 70 μm. A 9 μm-thick peelable electrolytic copper foil “Peelable Copper Foil” (Furukawa Electric Co., Ltd.) formed on the supporting copper foil was used.

Third step: Biaxial drilling machine "ND-2"
J-18 "(manufactured by Hitachi Seiko Co., Ltd.) for forming a conductor having a depth of 50 μm and an inner diameter of 100 μm at the position where the metal post (24) was formed on the upper surface of the pressure-bonded laminate (1A). In addition to forming a drill hole (25H), a pitch of 1.1 is formed at a position where the via hole land (14) of the lower wiring portion (13) is formed on the lower surface of the crimped laminate (1A) and at other predetermined positions. Drill holes (32H) for forming short-circuit portions each having a depth of 50 μm and an inner diameter of 150 μm were formed so as to be arranged on a lattice point of 27 mm (see FIG. 11).

Next, the above-mentioned pressure-bonded laminate 1A is subjected to electroless copper plating and further to electrolytic copper plating, so that a cylindrical intermediate member made of a copper deposit is formed in the conductor forming drill hole 25H. Forming a short-circuit portion (23) formed by joining the metal post (24) and the intermediary conductor (25), and forming the short-circuit portion forming drill hole (32H). Then, a cylindrical short-circuit portion (32) made of a copper deposit was formed (see FIGS. 12 and 13).

Fourth step: The thin metal layer (21A) on the upper surface of the above-mentioned pressure-bonded laminate (1A) is subjected to photolithography and etching to remove a part of the thin metal layer (21A). A connection electrode base layer (21C) and a top wiring portion (22) having a pattern corresponding to the electrode to be inspected on the circuit board were formed (see FIG. 14).

Further, a 50 μm-thick photoresist film “HK350” (manufactured by Hitachi Chemical Co., Ltd.) is provided on the upper surface of the pressure-bonded laminate (1A), and this is processed by photolithography to inspect the circuit board to be inspected. The connection electrode (21) having a protrusion height of 50 μm by removing according to the pattern corresponding to the electrode, filling the hole thus formed with copper metal by a copper plating method, and then peeling off the photoresist film. Was formed, and each connection electrode (22) was plated with gold having a thickness of 2 μm. On the other hand, a crimped laminate (1A)
The metal thin layer (31) on the lower surface of the lower insulating layer (30) in
A) was subjected to photolithography and etching to form terminal electrodes (31) arranged on 1.27 mm lattice points, thereby producing a multilayer connector (see FIG. 15).

The connection electrodes of the laminated connector obtained by the above method had a size of each electrode of 0.25 mm.
And an electrode group having a 0.35 mm diameter circular electrode pitch of 0.3 mm, and each electrode having a diameter of 0.45 m.
m and an electrode group having an electrode pitch of 0.6 mm.

(2) Manufacture of Adapter Device Using the above-mentioned laminated connector as an adapter body,
An elastomer was formed on the upper surface of the adapter body as follows. Average particle size 2 for room temperature curable urethane rubber
An elastomer material was prepared by mixing conductive magnetic particles of 6 μm nickel at a ratio of 15% by volume, and this was applied to the surface of the adapter body. It processed according to the method using a metal mold. That is, a gap of 0.03 mm is formed between the lower surface of the ferromagnetic material portion M and the elastomer material layer using the magnetic pole plate 55 in which the ferromagnetic material portion M protrudes 0.1 mm from the nonmagnetic material portion N on the lower surface. In this state, the elastomer material layer is raised by applying a parallel magnetic field.
The elastomer layer having a thickness t of the conductive portion of 0.3 mm, a thickness d of the insulating portion of 0.27 mm, and a protrusion ratio (t−d) / t of the conductive portion of 10% is obtained. Was formed, thereby producing an adapter device for circuit board inspection.

EXPERIMENTAL EXAMPLE 1 With respect to the above adapter device, a common conductive plate was arranged on the lower surface side of the substrate by using a resistance measuring device "Milliohm High Tester" (manufactured by Hioki Electric Co., Ltd.), and all terminal electrodes were short-circuited. The electrical resistance between the conductive plate and each connection electrode was measured using a probe pin. As a result, it was confirmed that the electric resistance value of all the connection electrodes was as extremely small as 30 mΩ or less, and that the electric connection between the terminal electrode to be connected and the connection electrode was sufficiently achieved. Was.

Experimental Example 2 Further, regarding the adapter device, the electric resistance between adjacent connection electrodes to be insulated from each other was measured using a probe pin, using the same resistance measuring device as described above. In addition, the electric resistance value was as very large as 2 MΩ or more, and it was confirmed that a sufficient insulating state was achieved.

[0081]

According to the multilayer connector of the present invention, the short-circuit portion of the insulating layer is formed by a metal post provided so as to protrude upward from the via-hole land of the wiring portion on the substrate.
It is composed of an intermediary conductor extending downward from the upper surface of the insulating layer and joined to the upper part of the metal post, and is not formed by a through hole penetrating the entire multilayer connector. It can be formed easily with a large degree of freedom. Also, the mediating conductor is
Holes can be formed in the insulating layer and provided inside,
The depth of the hole is not limited as long as it reaches the metal post and does not penetrate the wiring portion. Therefore, since the allowable range of the depth of the hole to be formed is large, it is formed by a numerically controlled drilling device. The error range of the depth of the hole can be sufficiently covered, and as a result, the required hole is reliably formed, so that the connection between the via hole land of the wiring portion of the substrate and the short-circuit portion is reliably achieved. be able to. Further, by forming the metal post having a considerably small inner diameter of the cylindrical hole, a middle conductor having a small outer diameter can be formed, so that the wiring portion of the insulating layer can be formed with a large degree of freedom.

In the adapter device for circuit board inspection of the present invention, in the basic configuration, connection electrodes arranged corresponding to the electrodes to be inspected of the circuit board to be inspected are formed on the upper surface of the adapter body. Terminal electrodes arranged at lattice points are formed on the lower surface, and the adapter body is provided with the above-mentioned laminated connector, and an anisotropic conductive elastomer layer is integrally formed on the upper surface of the adapter body. Since the electrode to be inspected of the circuit board to be inspected has a fine electrode pitch and a fine and high-density complicated pattern, the required An electrical connection can be reliably achieved, and a good electrical connection state is stably maintained against environmental changes such as a heat history due to a temperature change. -Reliability can be obtained, moreover, formation of the adapter body having a desired wiring configuration is extremely easy, thus it can be very advantageously and reliably produced.

[Brief description of the drawings]

FIG. 1 is an explanatory cross-sectional view showing a configuration of an example of a laminated connector of the present invention.

FIG. 2 is a partial plan view for explaining an arrangement state of each part in an example of the laminated connector of the present invention.

FIG. 3 is an enlarged cross-sectional view for explaining the multilayer connector in FIG.

FIG. 4 is a cross-sectional view for explaining a substrate material used in the method of manufacturing a multilayer connector according to the present invention.

FIG. 5 is an explanatory sectional view showing a state in which a substrate short-circuit portion forming hole is formed in the substrate.

FIG. 6 is an explanatory cross-sectional view showing a state in which an upper wiring portion having a via hole land, a metal post, a substrate short-circuit portion, and a lower wiring portion having a via hole land are formed on a substrate.

FIG. 7 is an explanatory sectional view showing a part of the substrate in FIG. 6 in an enlarged manner.

FIG. 8 is an explanatory cross-sectional view showing an arrangement state of members forming a pressure-bonded laminate.

FIG. 9 is an explanatory cross-sectional view showing a state where a pressure-bonded laminate is formed. .

FIG. 10 is an explanatory sectional view showing a part of the pressure-bonded laminate in FIG. 9 in an enlarged manner.

FIG. 11 is an explanatory cross-sectional view showing a state in which a conductor drill hole and a short-circuit portion forming drill hole are formed in the crimped laminate.

FIG. 12 is an explanatory cross-sectional view showing a state in which a mediating conductor is formed inside a conductor drill hole and a short-circuit portion is formed inside a short-circuit portion forming drill hole.

FIG. 13 is an explanatory cross-sectional view showing a state where a short-circuit portion is formed in an upper insulating layer in the pressure-bonded laminate.

FIG. 14 is an explanatory cross-sectional view showing a state in which a connection electrode base layer and an upper surface wiring portion are formed on the upper surface of the pressure-bonded laminate.

FIG. 15 shows a connection electrode formed on the upper surface of the pressure-bonded laminate,
It is sectional drawing for description of the laminated connector completed by forming the terminal electrode on the lower surface of a crimp laminated body.

FIG. 16 is an explanatory cross-sectional view showing a configuration of an example of the adapter device for circuit board inspection of the present invention.

FIG. 17 is an enlarged cross-sectional view for explaining an elastomer layer portion in an example of the adapter device for circuit board inspection of the present invention.

FIG. 18 is an explanatory cross-sectional view showing a state where the adapter body on which the elastomer material layer is formed is set in a mold.

FIG. 19 is an explanatory sectional view showing a state where a parallel magnetic field is applied in FIG. 18;

FIG. 20 is an explanatory sectional view showing another example of a mold used for forming an elastomer layer.

FIG. 21 is an explanatory diagram showing an arrangement of an example of a printed circuit board.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Adapter main body 1A Compression laminated body 10 Substrate 11 Upper wiring part 11A Metal thin layer 12 Via hole land 13 Lower wiring part 13A Metal thin layer 14 Via hole land 15 Substrate short circuit part 15H Hole for substrate short circuit part 20 Upper insulating layer 20A Heat Curable resin sheet 21 Connection electrode 21A Thin metal layer 21B Metal foil 21C Connection electrode base layer 22 Top wiring part 23 Short circuit part 23A Through hole 24 Metal post 24H Cylindrical hole 25 Mediating conductor 25H Conductor forming drill hole 30 Lower part Insulating layer 30A Thermosetting resin sheet 31 Terminal electrode 31A Thin metal layer 31B Metal foil 32 Short-circuit part 32H Drill hole for short-circuit part formation 40 Anisotropic conductive elastomer layer 41 Conductive part 42 Insulating part E Elastomeric material P Conductive particles Reference Signs List 50 elastomer material layer 51 upper mold 52 lower mold M ferromagnetic material Part N Non-magnetic material part 53 Magnetic pole plate G Gap 55 Magnetic pole plate 90 Circuit board 91 Functional element area 92 Lead electrode 93 Lead electrode area

Claims (2)

[Claims] 1. A semiconductor device comprising: a substrate having a wiring portion having a via hole land formed on an upper surface; and at least one insulating layer provided in a stacked manner on the substrate including the wiring portion. Is formed with a short-circuit portion connected to the via-hole land in the wiring portion of the substrate and extending through the insulating layer in the thickness direction thereof, and the short-circuit portion is located above the via-hole land in the wiring portion of the substrate. A multilayer connector comprising: a metal post provided so as to protrude therefrom; and an intermediate conductor extending downward from an upper surface of the insulating layer and joined to an upper portion of the metal post. 2. A circuit board inspection adapter device interposed between an inspection target circuit board and an electrical inspection device for electrically connecting an electrode to be inspected of the circuit board and the electrical inspection device, With terminal electrodes arranged on lattice points on the lower surface,
An adapter body having a connection electrode corresponding to an electrode to be inspected of a circuit board to be inspected on an upper surface, and an anisotropic conductive elastomer layer provided integrally on an upper surface of the adapter body, wherein the adapter body is A short-circuit portion formed on the insulating layer, comprising the laminated connector according to claim 1,
An adapter device for circuit board inspection, wherein the adapter device is electrically connected to the connection electrode, and a wiring portion of the substrate is electrically connected to the terminal electrode.