JP2000243489A - Wiring board forming material, plate-shaped connector and its manufacture, and adaptor device for circuit device inspection - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board forming material allowing pass-through short-circuit parts with a small outer diameter to be formed therein if the entire thickness is large, enabling high-density wiring parts to be formed with great flexibility, and reduced in manufacturing costs, and provide a plate-shaped connector using the same wiring board forming material as well as its manufacturing method, and an adaptor device for circuit device inspection. SOLUTION: This wiring board forming material is equipped with an insulating substrate 10, an upper-side insulation layer 20 integrally layered with an upper surface of the insulating substrate 10, and an under-side insulation layer 30 integrally layered with an under surface of the insulating substrate 10, and the insulating substrate 10 has a multiplicity of conductive short-circuit parts 11 for relay regularly arranged and extending through the insulating substrate 10 in the thickness direction thereof.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a wiring board forming material,
The present invention relates to a plate-shaped connector, a method for manufacturing the same, and an adapter device for circuit device inspection.

[0002]

2. Description of the Related Art In the manufacture of a circuit device such as a printed circuit board or a semiconductor integrated circuit, it is necessary to inspect a circuit of the obtained circuit device with a tester in order to confirm that the circuit has a required performance. . In order to perform an electrical inspection of such a circuit device, a circuit device to be inspected is set on a tester, and a test target electrode of the circuit device is electrically connected to a test electrode of the tester. It is necessary to realize.

[0003] There are several known methods for electrically connecting a test electrode of a circuit device to a test electrode of a tester, one of which is to use an adapter. This adapter has, on one surface, a connection electrode arranged corresponding to an electrode to be inspected of a circuit device to be inspected, and, on the other surface, a pitch of 2.times. Corresponding to an inspection electrode of a tester. 54mm, 1.8m
It is composed of a plate-like connector having terminal electrodes arranged at standard lattice point positions of m or 1.27 mm.
In this plate-shaped connector, a wiring portion is formed on one or both surfaces thereof, and a penetrating short-circuit portion extending through the plate-shaped connector in the thickness direction thereof is formed. The connection electrode is electrically connected to the terminal electrode.

[0004] Since such a plate-like connector is pressurized when connected to a circuit device, it is required to have a high strength capable of withstanding this pressing force. A thick wiring board is used.

On the other hand, in a circuit device to be inspected, the number of electrodes increases as the function and capacity of a semiconductor integrated circuit increase, and the arrangement pitch of electrodes, that is, the center-to-center distance between adjacent electrodes decreases. The density tends to increase, and the same applies to a printed circuit board for mounting such a semiconductor integrated circuit. Therefore, in a plate-like connector used as an adapter for inspecting these circuit devices, it is required to form a high-density wiring portion and connection electrodes.

[0006]

However, when a plate-like connector having a large thickness and a high-density wiring portion is formed, there are the following problems. In general, a through-hole method is used as a method for forming a through short-circuit portion in a plate-like connector. In this through-hole method, a short-circuit portion forming hole penetrating in the thickness direction is formed in a plate-shaped body constituting a plate-shaped connector, and the plate-shaped body is plated to form a metal on the inner surface of the short-circuit portion-formed hole. This is a method of forming a through short-circuit portion by forming a deposit of.
A numerically controlled drilling device is used for forming the short-circuit portion forming hole, for example. However, since it is necessary to use a high-strength drill, that is, a drill with a large diameter, in order to form a hole for forming a short-circuit portion in a thick plate-shaped body, it is necessary to form a short-circuit portion with a small outer diameter. Can not. Therefore, the area of the surface of the plate-like body which can be used for forming the wiring portion is reduced, and as a result, it is difficult to form a high-density wiring portion with a high degree of freedom.

On the other hand, as another method of forming a through short-circuit portion, a method using a so-called blind via hole (hereinafter, referred to as a "blind via hole method") is known. In the blind via hole method, (a) for example, a short-circuit portion extending through the insulating substrate in a thickness direction thereof is formed by a through-hole method, and (b) insulating layers are formed on both surfaces of the insulating substrate. (C) A drill hole (blind via hole) is formed in each of the insulating layers in the laminate by, for example, a numerically controlled drilling device to reach a through short-circuit portion of the insulating substrate. Then, a plating process is performed on the laminate to form a metal deposit on the inner surface of the drill hole, thereby forming a short-circuit portion extending through the insulating layer in the thickness direction thereof, thereby forming an insulating layer. This is a method for forming a through short-circuit portion formed by connecting the short-circuit portions of the conductive substrate and the insulating layer. According to such a blind via hole method, since a thin insulating substrate and an insulating layer can be used, a through short-circuit portion having a small outer diameter can be formed. However, in the blind via-hole method, a large number of steps are required as described above, so that the cost required for manufacturing the plate-shaped connector becomes large.

The present invention has been made in view of the above circumstances, and a first object of the present invention is to form a through short-circuit portion having a small outer diameter even if the overall thickness is large. Accordingly, it is an object of the present invention to provide a wiring board forming material capable of forming a high-density wiring portion with a large degree of freedom and obtaining a wiring board with low manufacturing cost.

A second object of the present invention is to provide a plate-shaped connector which has a thick short-circuit portion with a small outer diameter and a high-density wiring portion with a large degree of freedom. is there. A third object of the present invention is to provide a method capable of producing the above-mentioned plate-like connector in a simple process at a lower cost and advantageously.

A fourth object of the present invention is to provide a circuit device to be inspected, in which electrodes to be inspected such as lead electrodes have a fine electrode pitch and a fine and high-density complicated pattern. The required electrical connection can be reliably achieved for the circuit device, and a good electrical connection state can be stably maintained against environmental changes such as heat history due to temperature changes, and therefore, connection reliability can be improved. It is an object of the present invention to provide a high circuit device inspection adapter device.

[0011]

According to the present invention, there is provided a wiring board forming material comprising: an insulating substrate; an upper insulating layer integrally laminated on the upper surface of the insulating substrate; and a lower surface of the insulating substrate. A plurality of electrically conductive relay short-circuit portions, which are regularly arranged and extend through the insulating substrate in the thickness direction thereof. It is characterized by having.

[0012] In the wiring board forming material of the present invention, it is preferable that the relay short-circuit portions in the insulating substrate are arranged in accordance with lattice point positions. In addition, it is preferable that relay lands connected to both ends of the relay short-circuit portion are formed on the upper surface and the lower surface of the insulating substrate so as to correspond to each of the relay short-circuit portions. Further, it is preferable that a thin metal layer is integrally laminated on an upper surface of the upper insulating layer and a lower surface of the lower insulating layer.

[0013] The plate-like connector of the present invention comprises an insulating substrate,
A laminate having an upper insulating layer integrally laminated on the upper surface of the insulating substrate and a lower insulating layer integrally laminated on the lower surface of the insulating substrate; and a laminate formed on the upper surface of the laminate. One of the electrodes, the other electrode formed on the lower surface of the laminate, and a short-circuit penetrating portion extending through the upper insulating layer, the insulating substrate, and the lower insulating layer in the thickness direction thereof. Wherein the one electrode is a plate-like connector electrically connected to the other electrode via at least the through short-circuit portion, wherein the insulating substrate is regularly arranged, It has a number of relay short-circuit portions extending through the insulating substrate in the thickness direction thereof, and the penetrating short-circuit portion is a specific relay short-circuit portion selected from the multiple relay short-circuit portions of the insulating substrate. , Just above this particular transit short Formed on the upper insulating layer, an upper short-circuit portion extending through the upper insulating layer in the thickness direction thereof, and formed on the lower insulating layer immediately below the specific relay short-circuit portion, A plurality of lower short-circuit portions extending through the lower insulating layer in the thickness direction thereof are electrically connected to each other.

In the method for manufacturing a plate-like connector of the present invention, the above-mentioned material for forming a wiring board is prepared, and the upper insulating layer in the material for forming a wiring board is selected from a number of relay short-circuit portions on an insulating substrate. A short-circuit portion forming hole penetrating the upper insulating layer in the thickness direction thereof is formed directly above the specific relay short-circuit portion, and the lower insulating layer is provided with the lower portion immediately below the specific relay short-circuit portion. Forming a short-circuit portion forming hole penetrating the side insulating layer in the thickness direction thereof, and electrically connecting to the specific relay short-circuit portion to the short-circuit portion forming hole formed in the upper side insulating layer. Forming the upper short-circuit portion, and forming the lower short-circuit portion electrically connected to the specific relay short-circuit portion in the short-circuit portion forming hole formed in the lower insulating layer. , Upper insulating layer, insulating substrate and Characterized by having a step of forming a through short portion extending through the lower-side insulating layer in the thickness direction.

The adapter device for inspecting a circuit device of the present invention is an adapter device for inspecting a circuit device which is interposed between a circuit device to be inspected and an electrical inspection device and electrically connects electrodes of the circuit device. Has a connection electrode arranged on one side corresponding to the electrode to be inspected of the circuit device to be inspected,
An adapter body having terminal electrodes arranged on the other surface according to lattice point positions, and an anisotropic conductive elastomer layer integrally provided on one surface of the adapter body, wherein the adapter body is according to claim 5. Characterized by a plate-like connector of

[0016]

According to the above-mentioned wiring board forming material, the short-circuit portions extending through the upper insulating layer and the lower insulating layer in the thickness direction are provided immediately above and immediately below the relay short-circuit portion on the insulating substrate. By forming, a penetrating short-circuit portion extending through the entire wiring board forming material in the thickness direction thereof is formed. That is, in the formation of the through short circuit,
Since the short-circuit portion forming hole penetrating in the thickness direction may be formed only in the upper insulating layer and the lower insulating layer, even if the thickness of the entire wiring board forming material is large, the wiring board forming material Thus, a short-circuit short-circuit portion having a small outer diameter can be easily formed. Moreover, since a large number of relay short-circuit portions are regularly arranged on the insulating substrate, an appropriate relay short-circuit portion is selected from these, and the selected specific relay short-circuit portion is used. As a result, a through short-circuit portion can be formed. Therefore, high-density wiring portions can be formed on the upper and lower surfaces of the wiring board forming material with a large degree of freedom. Further, by standardizing the arrangement of the relay short-circuit portions, it is possible to mass-produce the wiring board forming material, and as a result, to obtain a wiring board with low manufacturing cost.

[0017]

Embodiments of the present invention will be described below in detail. FIG. 1 is an explanatory cross-sectional view showing a configuration of an example of a wiring board forming material of the present invention. This wiring board forming material has an insulating substrate 10.
The upper insulating layer 20 is provided integrally on the upper surface of
A lower insulating layer 30 is integrally provided on the lower surface of the insulating substrate 10, and a thin metal layer 25, a lower metal layer 25 and a lower insulating layer 30 are provided on the upper surface of the upper insulating layer 20 and the lower surface of the lower insulating layer 30, respectively.
35 are provided integrally.

The material of the insulating substrate 10 is preferably a plate made of a heat-resistant material having high dimensional stability, and various insulating resins can be used. Glass fiber reinforced epoxy resin is optimal. Each of the upper insulating layer 20 and the lower insulating layer 30 is preferably formed of a thermosetting resin sheet cured by thermocompression bonding. Such a thermosetting resin sheet is preferably made of a heat-resistant resin having high dimensional stability, and various resin sheets can be used, and a glass fiber reinforced epoxy prepreg sheet or a polyimide prepreg resin sheet is used. preferable. As a material for forming the thin metal layers 25 and 35, it is preferable to use a material that can be easily etched, and specific examples thereof include copper, aluminum, and nickel.

As shown in FIG. 2 in an enlarged manner, the insulating substrate 10 has a large number of conductive relay short-circuit portions 11 formed by via holes extending through the insulating substrate 10 in the thickness direction. The relay short-circuit portions are provided on the upper and lower surfaces of the insulating substrate 10 so as to correspond to each of the relay short-circuit portions 11. 11 are provided with metal relay lands 12 and 13 connected to the upper and lower ends, respectively.

The outer diameter of the relay short-circuit portion 11 is 50-300.
μm is preferred. The outer diameter of the insulating substrate 10 is 5
It is practically difficult to form the relay short-circuit portion 11 having a diameter of less than 0 μm.
In the case where the relay short-circuit portion 11 exceeding m is formed, it is necessary to set the arrangement pitch of the relay short-circuit portion 11 to be large, so that the upper surface of the upper insulating layer 20 or the lower surface of the lower insulating layer 30 is required. In addition, it is difficult to form a wiring portion with a large degree of freedom. The outer diameter of the relay lands 12, 13 is preferably 80 to 500 μm.

In this example, the relay short-circuit portions 11 are arranged according to lattice point positions. When the relay short-circuit portions 11 are arranged according to the lattice point positions in this way, the arrangement pitch is 0.05 to 1 mm, particularly 0.08 to 0.
It is preferably 6 mm. This arrangement pitch is 0.0
If it is less than 5 mm, the adjacent relay short-circuit portion 11
The relay short-circuit portion 1
When a wiring portion formed on the upper surface of the upper insulating layer 20 and a wiring portion formed on the lower surface of the lower insulating layer 30 are connected via 1, a defective short circuit may occur between the wiring portions. .
On the other hand, when the arrangement pitch exceeds 1 mm, the number of relay short-circuit portions 11 per unit area is small, so that the upper surface of the upper insulating layer 20 or the lower surface of the lower insulating layer 30
It becomes difficult to form a wiring portion with a large degree of freedom.

The thickness of the insulating substrate 10 is 100 to 120.
It is preferably 0 μm. If the thickness is less than 100 μm, it may be difficult to form a highly rigid wiring board. On the other hand, this thickness is 1200 μm
When it exceeds, it may be difficult to form the relay short-circuit portion 11 having a small outer diameter. Upper insulating layer 20
The thickness of the lower insulating layer 30 is preferably 20 to 200 μm. If the thickness is less than 20 μm, it may be difficult to form a highly rigid wiring board. On the other hand, if the thickness exceeds 200 μm, it becomes difficult to form a short-circuit portion having a small outer diameter in the upper insulating layer 20 and the lower insulating layer 30. As a result, the upper surface and the lower It becomes difficult to form a wiring portion on the lower surface of the side insulating layer 30 with a large degree of freedom. The thickness of the thin metal layers 25 and 35 is, for example, 9 to 35 μm.
It is preferred that

The above-mentioned wiring board forming material can be manufactured as follows. First, as shown in FIG. 3, a flat insulating substrate 1 made of a hard resin and provided with thin metal layers 12A and 13A made of, for example, copper on both surfaces.
0, and the insulating substrate 10 is arranged on the insulating substrate 10 according to the lattice point positions as shown in FIG.
Through holes 11H penetrating in the thickness direction
To form Next, as shown in FIG. 5, the insulating substrate 10 is subjected to electroless copper plating and electric field copper plating to form a copper deposit on each inner surface of the short-circuit portion forming hole 11H. A relay short-circuit portion 11 extending through the insulating substrate 10 in the thickness direction thereof is formed. And
By performing photolithography and etching on the thin metal layers 12A and 13A on the upper and lower surfaces of the insulating substrate 10 to remove a part thereof, as shown in FIG. On each of the lower surfaces, a relay land 12 connected to the relay short-circuit portion 11 is provided.
And 13 are formed.

In the above, as means for forming the short-circuit portion forming hole 11H in the insulating substrate 10, a numerically controlled drilling device, a laser processing device, or the like can be cited. It is preferable to use a laser processing device in that it can be used. When forming the short-circuit portion forming hole 11H by a laser processing apparatus, the thin metal layer 12A, 13A is subjected to photolithography and etching beforehand to form the short-circuit portion forming hole 1H in the thin metal layer 12A, 13A.
It is preferable that an opening is formed at a position where 1H is formed, and the insulating substrate 10 is irradiated with laser light through the opening. According to such a method, the thin metal layers 12A, 1A are formed by photolithography and etching.
It is possible to form a small diameter opening in 3A,
In addition, the insulating substrate 10 has thin metal layers 12A and 13A.
Since the hole 11H for forming a short-circuit portion having a diameter corresponding to the opening formed in the hole is formed, a required hole 11H for forming a short-circuit portion having a small diameter can be easily formed. Further, by irradiating both the upper surface and the lower surface of the insulating substrate 10 with the laser beam, the insulating substrate 10 is provided with the short-circuit portion forming hole 1.
Preferably, 1H is formed. According to such a method, it is possible to form the short-circuit portion forming hole 11H having a uniform diameter along the thickness direction of the insulating substrate 10.

Next, as shown in FIG.
A thermosetting resin sheet 20A for forming an upper-side insulating layer is disposed on the upper surface of the thermosetting resin sheet 20A, and a metal foil 2 for forming a thin metal layer is formed on the upper surface of the thermosetting resin sheet 20A.
5A is arranged. On the other hand, a thermosetting resin sheet 30A for forming a lower insulating layer is arranged on the lower surface of the insulating substrate 10, and a thin metal layer is formed on the upper surface of the thermosetting resin sheet 30A. The metal foil 35A is arranged. Then, by performing thermocompression treatment in this state, the thermosetting resin sheet 20A and the thermosetting resin sheet 30A are cured, and are integrally attached with the upper surface and the lower surface of the insulating substrate 10 as the attachment surfaces. Further, a metal foil 25A is integrally attached to the upper surface of the thermosetting resin sheet 20A, and a metal foil 35A is integrally attached to the lower surface of the thermosetting resin sheet 30A. Thin layer 2
5, a wiring board forming material in which the upper insulating layer 20, the insulating substrate 10, the lower insulating layer 30, and the thin metal layer 35 are integrally laminated in this order is obtained.

In the above, as a means for forming the upper insulating layer 20 and the lower insulating layer 30, there is a thermocompression bonding means for pressing the thermosetting resin sheets 20A, 30A to the surface to be adhered under heating. However, compared to a method in which an insulating resin layer forming liquid is applied and dried, for example, a required insulating layer having a uniform thickness can be reliably formed. Although the temperature for performing the thermocompression bonding depends on the material of the thermosetting resin sheets 20A and 30A, the temperature of the thermosetting resin sheets 20A and 30A is not limited.
It is necessary that the temperature is higher than the temperature at which A softens and becomes adhesive, and is usually 80 to 250 ° C., preferably 140 to 2 ° C.
It can be about 00 ° C. The press pressure for performing thermocompression bonding is, for example, about 5 to 50 kg / cm ^{2 at the} maximum, and preferably about ²⁰ to 40 kg / cm ² . This thermocompression bonding treatment can be performed under normal pressure atmosphere, but in practice, it is preferably performed by a so-called vacuum press method under a reduced pressure atmosphere of, for example, 5 to 100 Pa, preferably about 10 to 50 Pa. Are formed between the thermosetting resin sheets 20A, 30A and the insulating substrate 10 and between the thermosetting resin sheets 20A, 30A and the metal foil 25.
A bubble is effectively prevented from being trapped between A and 35A.

According to the wiring board forming material as described above, the upper insulating layer 20 and the lower insulating layer 30 are located directly above and immediately below the relay short-circuiting portion 11 in the insulating substrate 10.
By forming a short-circuit portion extending in the thickness direction in each of the above, a penetrating short-circuit portion extending through the wiring board forming material in the thickness direction is formed. That is, in forming the penetration short-circuited portion, only the upper-side insulating layer 20 and the lower-side insulating layer 30 need to form the short-circuited portion forming hole penetrating in the thickness direction thereof. Even in this case, it is possible to easily form a penetrating short-circuit portion having a small outer diameter in the wiring board forming material. Moreover, since a large number of relay short-circuit portions 11 are regularly arranged on the insulating substrate 10, an appropriate relay short-circuit portion 11 is selected from these, and the selected specific relay short-circuit portion 11 is selected. Part 1
1 can be used to form a through-short circuit. Therefore, high-density wiring portions can be formed on the upper and lower surfaces of the wiring board forming material with a large degree of freedom. Further, by standardizing the arrangement pattern and arrangement pitch of the relay short-circuit portions 11 on the insulating substrate 10, mass production of the wiring board forming material becomes possible, and as a result, the wiring board can be manufactured at low cost. it can.

On the upper and lower surfaces of the insulating substrate 10, relay lands 12, 13 connected to both ends of the relay short-circuit portion 11 are formed corresponding to each of the relay short-circuit portions 11. Therefore, the relay short-circuit portion 11 and the upper insulating layer 2
Electrical connection with the short-circuit portion formed in the lower and lower insulating layers 30 can be reliably achieved.

Since the thin metal layers 25 and 35 are integrally laminated on the upper surface of the upper insulating layer 20 and the lower surface of the lower insulating layer 30, By performing photolithography and etching, wiring portions can be formed on the upper surface of the upper insulating layer 20 and the lower surface of the lower insulating layer 30.

The material for forming a wiring board of the present invention is not limited to the above-described structure, and various modifications can be made. For example, as long as the relay short-circuit portions 11 on the insulating substrate 10 are regularly arranged, the arrangement is not limited to the arrangement according to the lattice point positions, and various arrangement patterns can be adopted.

The relay lands 12, 13 provided on the upper and lower surfaces of the insulating substrate 10 are not essential in the present invention. However, in order to reliably achieve the electrical connection between the relay short-circuit portion 11 and the short-circuit portions formed in the upper insulating layer and the lower insulating layer, the relay lands 12,
13 is preferably provided.

Further, relay posts protruding from the relay lands 12 and 13 may be formed on the upper and lower surfaces of the insulating substrate 10. Such relay posts are:
Photolithography and plating are applied to the upper and lower surfaces of the insulating substrate 10 to perform the relay land 1.
It can be formed by depositing a metal on 2 and 13.

The thin metal layers 25 and 35 provided on the upper surface of the upper insulating layer 20 and the lower surface of the lower insulating layer 30 are provided.
Is not essential in the present invention. Thin metal layer 2
In the wiring board forming material having neither 5 nor 35, the wiring portion can be formed by, for example, an additive method.

<Plate Connector> FIG. 8 is a cross-sectional view for illustrating the structure of an example of the plate connector of the present invention. The plate connector in this example is an object to be inspected in, for example, an electrical inspection of a circuit device. This is used as an adapter for electrically connecting the electrode to be inspected of the circuit device and the inspection electrode of the tester.

This plate-like connector is connected to the insulating substrate 10.
And an upper insulating layer 20 integrally laminated on the upper surface of the insulating substrate 10 and a lower insulating layer 30 integrally laminated on the lower surface of the insulating substrate 10. I have. Upper surface of this laminate, that is, upper insulating layer 2
A plurality of connection electrodes 21 are formed on the upper surface of the test device 0 in correspondence with the electrodes to be inspected of the circuit device to be inspected. A plurality of terminal electrodes 31 corresponding to the lattice points are formed. In addition, this plate-shaped connector has a penetration short-circuit portion 1 extending through the upper insulating layer 20, the insulating substrate 10, and the lower insulating layer 30 in the thickness direction thereof.
The connection electrode 21 is electrically connected to the through short-circuit portion 15 directly or via the upper wiring portion 22, and the terminal electrode 31 is directly or via the lower wiring portion 32. And are electrically connected.

As described above, in the plate-like connector shown in FIG. 8, the connection electrodes 21 formed on the upper surface of the upper insulating layer 20 are connected via the upper wiring portion 22, the short-circuit short-circuit portion 15, and the lower wiring portion 32. And is electrically connected to a terminal electrode 31 formed on the lower surface of the lower insulating layer 30. In an actual configuration, the electrical connection between the connection electrode 21 and the terminal electrode 31 may be achieved in a manner according to the purpose of inspection of the circuit device. Therefore, all connection electrodes 21 and terminal electrodes 3
1 does not have to be connected in a one-to-one correspondence,
Various connection states can be realized. For example, it is possible to electrically connect the connection electrodes 21 using the upper surface wiring portion 22, connect a plurality of connection electrodes 21 to one lower surface wiring portion 32 in common, and the like. It is needless to say that the upper wiring portion 22 and the lower wiring portion 32 can both be formed in FIGS. 8 and 9 so as to extend in a direction intersecting the paper surface.

As shown in FIG. 9 in an enlarged manner, a large number of conductive relay short-circuit portions 11 are formed in the insulating substrate 10 by via holes extending through the insulating substrate 10 in the thickness direction. The insulating substrate 10 is provided in a state where the insulating substrate 10 is regularly arranged in accordance with, for example, lattice point positions. The upper and lower surfaces of the insulating substrate 10 correspond to the relay short-circuit portions 11. Metal relay lands 1 connected to the upper and lower ends of the relay short-circuit portion 11
2, 13 are provided.

The upper-side insulating layer 20 includes an upper-side short-circuit portion 23 extending through the upper-side insulating layer 20 in the thickness direction.
Is formed immediately above a specific relay short-circuit portion 11 selected from a number of relay short-circuit portions 11 on the insulating substrate 10, while the lower insulating layer 30 is provided with the lower insulating layer 30. Lower short-circuit portion 3 extending through the thickness direction
3 is formed at a position directly below the specific relay short-circuit portion 11. The upper short-circuiting portion 23 is connected to the relay land 12.
Is electrically connected to a specific relay short-circuit portion 11 through
The lower short-circuit portion 33 is electrically connected to a specific relay short-circuit portion 11 via the relay land 13, whereby the upper insulating layer 20, the insulating substrate 10 and the lower insulating layer 30 are separated from each other. Penetrating short-circuit part 1 extending through in the thickness direction
5 are configured.

The above-mentioned plate-like connector can be manufactured using the above-mentioned wiring board forming material as follows.
First, a wiring board forming material as shown in FIG. 1 is prepared, and as shown in FIG. 10, a specific relay selected from a number of relay short-circuit portions 11 in the insulating substrate 10 as shown in FIG. Immediately above the short-circuit portion 11, a thin metal layer 25
And a short-circuit portion forming hole 23H penetrating the upper insulating layer 20 in the thickness direction thereof, and the metal thin layer 35 and the lower insulating layer 30 are formed in the thickness direction just below the specific relay short-circuit portion 11. Hole 3 for forming a short circuit part penetrating through
3H is formed.

Means for forming the short-circuit portion forming holes 23H and 33H include a numerical control type drilling device and a laser processing device. The short-circuit portion forming holes 23H and 33H having a small inner diameter are formed. It is preferable to use a laser processing device from the viewpoint that the laser processing device can be used. When the holes 23H and 33H for forming short-circuit portions are formed by a laser processing apparatus, short-circuit portions are formed in the thin metal layers 25 and 35 by performing photolithography and etching on the thin metal layers 25 and 35 in advance. Holes 23H, 3
It is preferable that an opening is formed at a position where 3H is formed, and that the upper insulating layer 20 and the lower insulating layer 30 are irradiated with laser light through the opening. According to such a method, it is possible to form small-diameter openings in the thin metal layers 25 and 35 by photolithography and etching, and furthermore, the upper insulating layer 20 and the lower insulating layer 30 Short holes 23H having a diameter corresponding to the openings formed in the thin metal layers 25 and 35,
Since 33H is formed, required short-circuit-portion forming holes 23H and 33H having a small diameter can be easily formed.

Next, the short-circuit portion forming holes 23H, 33H
The wiring board forming material on which is formed is subjected to electroless copper plating and electric field copper plating to form short-circuit portion forming holes 23H, 3H.
By forming a copper deposit on the inner surface of 3H, FIG.
As shown in FIG. 5, an upper short-circuit portion 23 is formed by a via hole extending through the upper insulating layer 20 in the thickness direction thereof and electrically connected to the relay short-circuit portion 11 via the relay land 12. At the same time, a lower short-circuit portion 33 is formed, which is electrically connected to the relay short-circuit portion 11 via the relay land 13 and extends through the lower insulating layer 30 in the thickness direction thereof. And the upper insulating layer 2
A penetrating short-circuit portion 15 extending through the insulating substrate 10 and the lower insulating layer 30 in the thickness direction thereof is formed.

Thereafter, photolithography and etching are performed on the thin metal layers 25 and 35 to remove a part of the thin metal layers 25 and 35, thereby forming an upper surface wiring portion on the upper surface of the upper insulating layer 20, as shown in FIG. 22 and the connection electrode base layer 21A are formed, and the lower surface wiring portion 32 and the terminal electrode base layer 31A are formed on the lower surface of the lower insulating layer 30.

Then, with respect to the upper surface of the upper insulating layer 20,
The connection electrode 21 having a required thickness is formed by depositing metal on the connection electrode base layer 21A by performing photolithography and plating. On the other hand, by performing photolithography and plating on the lower surface of the lower insulating layer 30 to deposit metal on the terminal electrode base layer 31A, the terminal electrode 31 having a required thickness is formed.

According to the plate-like connector as described above, the insulating substrate 10, the upper insulating layer 20, and the lower insulating layer 3
0, the relay short-circuit portion 11 of the insulating substrate 10 and the upper short-circuit portion 2 of the upper insulating layer 20.
3 and the lower short-circuit portion 30 of the lower insulating layer 30 are electrically connected to form the through-short circuit portion 15. A short-circuit portion may be formed in each of the side insulating layer 20 and the lower insulating layer 30, and it is not necessary to form a through-hole penetrating the entire stacked body. The through short-circuit portion 15 having a small outer diameter can be easily formed. Moreover, the insulating substrate 10
Since a large number of relay short-circuit portions 11 are regularly arranged, a proper relay short-circuit portion 11 used for the penetration short-circuit portion 15 can be selected from these. Therefore, the upper wiring section 22 and the lower wiring section 3
2 can be designed with a large degree of freedom. Further, by using the above-mentioned wiring board forming material as a material for forming the wiring board constituting the plate-like connector, the above-mentioned plate-like connector can be advantageously manufactured in a simple process at a lower cost.

<Adapter device for circuit device inspection> FIG.
1 is an explanatory cross-sectional view showing a configuration of an example of a circuit device inspection adapter device of the present invention. The adapter device for inspecting a circuit device includes an adapter body 1 and an anisotropic conductive elastomer layer (hereinafter, also simply referred to as “elastomer layer”) 40 provided on the upper surface of the adapter body 1. .

More specifically, the adapter body 1
Is composed of a plate-like connector having the configuration shown in FIG. 8, and an elastomer layer 40 is integrally formed on the upper surface of the adapter body 1 in a state of being adhered or adhered thereto. As shown in FIG. 14, the elastomer layer 40 has a large number of conductive portions 41 in which conductive particles P are densely filled in an insulating elastic polymer substance E on the connection electrodes 21 of the adapter body 1. In the positioned state, adjacent conductive portions 41 are insulated from each other by an insulating portion 42. In each conductive portion 41, the conductive particles P are oriented so as to be arranged in the thickness direction, and a conductive path extending in the thickness direction is formed. When the conductive portion 41 is pressed and compressed in the thickness direction, the resistance decreases and a conductive path is formed.
It may be a pressurized conductive part. On the other hand, the insulating portion 42
No conductive path is formed in the thickness direction even when pressed.

In the conductive portion 41 of the elastomer layer 40, the filling rate of the conductive particles P is preferably 10% by volume or more, particularly preferably 15% by volume or more. In the case where the conductive portion is a pressurized conductive portion, when the filling rate of the conductive particles is high, it is preferable in that the intended electrical connection can be reliably achieved even when the pressing force is small. However, when the electrode pitch of the connection electrode 21 is reduced, sufficient insulation between adjacent conductive portions may not be ensured, and therefore, the filling rate of the conductive particles 41 in the conductive portion 41 is 40% by volume or less. It is preferred that

In the adapter device for circuit board inspection having such a configuration, since the adapter body 1 is constituted by the above-described plate-like connector, a high-density wiring portion can be formed in the adapter body 1. Moreover, the elastomer layer 40 is integrally formed on the upper surface of the adapter main body 1, and the connection electrode 2 of the adapter main body 1 is further formed.
Since the conductive portion 41 of the elastomer layer 40 is disposed on the first substrate 1, there is no need to perform positioning and holding and fixing of the elastomer layer 40 at the time of an electrical connection operation. Even when the electrode pitch of the electrodes is minute, required electrical connection can be reliably achieved.

Further, since the elastomer layer 40 is integral with the adapter main body 1, a good electrical connection state is stably maintained even when the environment changes such as a heat history due to a temperature change, and therefore the connection reliability is always high. Sex can be obtained.

In the illustrated example, the elastomer layer 40
, The conductive portion 41 forms a protruding portion that protrudes from the surface of the insulating portion 42. According to such an example,
Since the degree of compression by pressurization is larger in the conductive portion 41 than in the insulating portion 42, a conductive path having a sufficiently low resistance value is reliably formed in the conductive portion 41. Can be reduced, and as a result, even if the pressing force applied to the elastomer layer 40 is not uniform, it is possible to prevent the occurrence of variations in conductivity between the conductive portions 41.

When the conductive portion 41 forms a protrusion as described above, the protrusion height h of the protrusion is the total thickness t of the elastomer layer 40 (t = h + d, and d is the thickness of the insulating portion 42). Is preferably 8% or more. The total thickness t of the elastomer layer 40 is preferably 300% or less of the electrode pitch p defined as the center-to-center distance of the connection electrode 21, that is, t ≦ 3p. When such a condition is satisfied, even when the pressure applied to the elastomer layer 40 changes, the change in the conductivity of the conductive portion 41 due to the change is sufficiently small.

When the conductive portion 41 forms a projecting portion, it is not always necessary that the entire surface of the projecting portion has conductivity. A road non-forming portion may be present. Further, it is preferable that the minimum value of the separation distance r between the adjacent conductive portions 41 is 10% or more of the width R of the conductive portion 41. By satisfying such conditions, it is possible to sufficiently avoid the possibility that the adjacent conductive portions 41 electrically contact each other due to lateral displacement when the protrusion is deformed by being pressed. Can be. In the above example, the planar shape of the conductive portion 41 can be a rectangular shape having the same width as the connection electrode 21, but can be a circular shape having a necessary area or any other appropriate shape.

As the conductive particles of the conductive portion 41, for example, particles of a metal exhibiting magnetism such as nickel, iron, and cobalt, or particles of an alloy thereof, or gold,
Those plated with silver, palladium, rhodium, etc.
Inorganic particles such as non-magnetic metal particles or glass beads or polymer particles plated with a conductive magnetic material such as nickel or cobalt can be used.

In the method described below, nickel, iron,
Alternatively, conductive magnetic particles made of an alloy thereof or the like are used, and gold-plated particles can be preferably used in terms of electrical characteristics such as low contact resistance. Further, particles composed of a conductive superparamagnetic material can be preferably used because they do not show magnetic hysteresis.

The particle size of the conductive particles is preferably 3 to 200 μm so that the conductive portion 41 can be easily deformed under pressure and sufficient electrical contact can be obtained between the conductive particles in the conductive portion 41. Preferably, it is particularly preferably 10 to 100 μm.

As the insulating and elastic polymer constituting the conductive portion 41, a polymer having a crosslinked structure is preferable. Examples of curable polymer materials that can be used to obtain a crosslinked polymer include silicone rubber, polybutadiene, natural rubber, polyisoprene, styrene-butadiene copolymer rubber, and acrylonitrile-butadiene copolymer rubber. , Ethylene-propylene copolymer rubber, urethane rubber, polyester rubber, chloroprene rubber, epichlorohydrin rubber, and soft liquid epoxy resin.

Specifically, a material for a polymer substance which is in a liquid state before the hardening treatment and is integrated with the adapter body 1 while maintaining a close contact state or an adhesive state after the hardening treatment is preferable. From such a viewpoint, examples of the material for a polymer substance suitable for the present invention include liquid silicone rubber, liquid urethane rubber, and soft liquid epoxy resin.
Additives such as a silane coupling agent and a titanium coupling agent can be added to the polymer material in order to improve the adhesion to the adapter body 1.

As the material for forming the insulating portion 42, the same or different material as the polymer material for forming the conductive portion 41 can be used. And the one that is integrated with the adapter body 1 is used.

By forming such an insulating portion,
Since the integrality of the elastomer layer itself and its integrality with the adapter main body are reliably increased, the strength of the entire adapter device is increased, and therefore, excellent durability against repeated compression can be obtained.

In the adapter device having the above structure, the circuit device to be inspected is disposed on the upper surface, the electrode to be inspected of the circuit device is brought into contact with the conductive portion 41 of the elastomer layer 40, and the terminal on the lower surface is provided. The electrode 31 is connected to the tester via an appropriate connection means, and the whole is pressurized so as to be compressed in the thickness direction. In this state, the conductive portion 41 of the elastomer layer 40 of the adapter device is used.
Is brought into a conductive state, whereby required electrical connection between the electrode under test and the tester is achieved.

The above-mentioned adapter device for circuit device inspection comprises:
For example, it is manufactured by providing the elastomer layer 40 on the upper surface of the adapter body 1 as follows. First, an elastomer material made of a fluid mixture is prepared by dispersing conductive magnetic particles in a polymer material that becomes an insulating elastic polymer material by curing treatment, and as shown in FIG. The elastomer material is applied to the upper surface of the adapter body 1 to form the elastomer material layer 45, which is arranged in the cavity of the mold 50.

The mold 50 includes an upper mold 51 and a lower mold 52, each of which forms an electromagnet. The upper mold 51 has a ferromagnetic portion (a hatched portion) in a pattern corresponding to the connection electrode 21. Shown) M, and the other non-magnetic portion N
A magnetic pole plate 53 having a flat lower surface is provided, and the flat lower surface of the magnetic pole plate 53 is separated from the surface of the elastomeric material layer 45 to form a gap G.
15 and 16, the connection electrode 21
Except for the details, the details of the adapter body 1 are omitted.

In this state, the electromagnets of the upper die 51 and the lower die 52 are operated, whereby a parallel magnetic field in the thickness direction of the adapter body 1 is applied. As a result, in the portion of the elastomeric material layer 45 located on the connection electrode 21, a stronger parallel magnetic field is applied in the thickness direction than in the other portions. As shown in (1), the conductive magnetic material particles in the elastomer material layer 45 are gathered in a portion located on the connection electrode 21 by the magnetic force of the ferromagnetic material portion M and further oriented in the thickness direction.

However, at this time, since the gap G is present on the surface side of the elastomer material layer 45, the polymer material is also moved by the moving and gathering of the conductive magnetic particles. The upper surface of the material for a polymer substance in the upper portion is raised, and a protruding conductive portion 41 is formed. Accordingly, the thickness t1 of the insulating portion 42 to be formed becomes smaller than the thickness t ₀ of the initial elastomeric material layer 45. After the parallel magnetic field is applied or after the parallel magnetic field is removed, the elastomer layer 40 including the conductive portion 41 and the insulating portion 42 forming the protrusion is integrally formed on the adapter body 1 by performing a curing process. The adapter device is manufactured.

As shown in FIG. 17, the upper plate 51 is composed of a ferromagnetic portion M of a pattern corresponding to the connection electrode 21 and a non-magnetic portion N other than the upper plate 51, as shown in FIG. The magnetic pole plate 55 in a state where the ferromagnetic portion M protrudes below the non-magnetic portion N on the lower surface of the magnetic head may be used. Further, it is also possible to use a magnetic pole plate that is entirely made of a ferromagnetic material and has a pattern portion corresponding to the connection electrode 21 protruding downward from other portions. Also in these cases, a stronger parallel magnetic field is applied to the elastomer material layer 45 in the region of the connection electrode 21.

Further, the upper die 5 is kept under the parallel magnetic field.
A mold having a variable distance between the lower mold 1 and the lower mold 52 is used.
1 is disposed immediately above the elastomer material layer 45, and while a parallel magnetic field is applied, the distance between the upper mold 51 and the lower mold 52 is gradually increased, thereby causing the elastomer material layer 45 to protrude. Can also be performed.

In the present invention, it is not essential that the conductive portion 41 of the elastomer layer 40 protrude from the insulating portion 42, and the elastomer portion 40 may have a flat surface. In such a case, for example, the processing may be performed without forming the gap G by using the mold 50 having the configuration shown in FIG.

The thickness of the elastomer material layer 45 is, for example, 0.1 to 3 mm. This material layer for elastomer 4
The polymer material for ^{No. 5} has a viscosity at 25 ° C. of 10 ⁴ to ^{1 at} a strain rate of 10 ¹ sec ^-1 so that the conductive magnetic particles can be easily moved.
Is preferably about 0 ⁷ centipoise. The curing treatment of the elastomeric material layer 45 is preferably performed while the parallel magnetic field is applied, but may be performed after the application of the parallel magnetic field is stopped.

The ferromagnetic portion M of the pole plate 53 is made of iron,
A ferromagnetic material such as nickel, and a non-magnetic material portion N
Can be formed of a nonmagnetic metal such as copper, a heat-resistant resin such as polyimide, or an air layer. The intensity of the parallel magnetic field applied to the elastomer material layer 45 is preferably such that the average of the cavity of the mold is 200 to 20,000 gauss.

The curing treatment is appropriately selected depending on the material used, but is usually carried out by heat treatment. The specific heating temperature and heating time depend on the material layer 4 for the elastomer.
5 is appropriately selected in consideration of the type of the material for a polymer substance, the time required for the movement of the conductive magnetic particles, and the like. For example,
When the polymer material is a room temperature-curable silicone rubber, the curing treatment is performed at room temperature for about 24 hours, at 40 ° C. for about 2 hours, and at 80 ° C. for about 30 minutes.

[0071]

According to the wiring board forming material of the present invention, since a large number of relay short-circuit portions are formed on the insulating substrate, in forming the penetration short-circuit portion, the position immediately above and immediately below the relay short-circuit portion are formed. At the position, only the upper insulating layer and the lower insulating layer need to be formed with a hole for forming a short-circuit portion penetrating in the thickness direction thereof. A short-circuit short-circuit portion having a small outer diameter can be easily formed on the plate forming material. Moreover, since a large number of relay short-circuit portions are regularly arranged on the insulating substrate, an appropriate relay short-circuit portion is selected from these, and the selected specific relay short-circuit portion is used. As a result, a through short-circuit portion can be formed. Therefore, high-density wiring portions can be formed on the upper and lower surfaces of the wiring board forming material with a large degree of freedom. Further, by standardizing the arrangement pattern and arrangement pitch of the relay short-circuit portions on the insulating substrate, it is possible to mass-produce the wiring board forming material, and as a result, it is possible to manufacture the wiring board at low cost.

According to the structure in which the relay lands connected to both ends of the relay short-circuit portion are provided on the upper surface and the lower surface of the insulating substrate corresponding to each of the relay short-circuit portions, respectively. Electrical connection with short-circuit portions formed in the upper insulating layer and the lower insulating layer can be reliably achieved. According to the configuration in which the thin metal layers are integrally laminated on the upper surface of the upper insulating layer and the lower surface of the lower insulating layer, by performing photolithography and etching on these thin metal layers, Wiring portions can be formed on the upper surface of the side insulating layer and the lower surface of the lower insulating layer.

According to the plate-shaped connector of the present invention, it is constituted by a laminate having an insulating substrate, an upper insulating layer and a lower insulating layer, and a relay short-circuit portion of the insulating substrate;
Since the upper short-circuited portion of the upper insulating layer and the lower short-circuited portion of the lower insulating layer are electrically connected to each other to form the through short-circuited portion, the insulating short-circuit portion is formed in the formation of the through-hole shorted portion. What is necessary is just to form a short-circuit part in each of a board | substrate, an upper side insulating layer, and a lower side insulating layer, and since it becomes unnecessary to form the through-hole penetrating these whole, the thickness of the whole laminated body is one. In addition, a short-circuit short-circuit portion having a small outer diameter can be easily formed. Moreover, since a large number of relay short-circuit portions are regularly arranged on the insulating substrate, it is possible to select an appropriate one from these as a specific relay short-circuit portion used for the through short-circuit portion. it can. Therefore, the wiring section can be designed with a large degree of freedom. According to the method for manufacturing a plate-shaped connector of the present invention, the above-described plate-shaped connector can be advantageously manufactured in a simple process at a lower cost.

According to the adapter device for circuit device inspection of the present invention, a high-density wiring portion can be formed on the adapter body, and the adapter body is provided integrally with the anisotropic conductive elastomer layer. Therefore, the electrode to be inspected of the circuit device to be inspected has a minute electrode pitch,
In addition, even in the case of a fine and high-density complex pattern, it is possible to reliably achieve the required electrical connection of the circuit device, and to withstand environmental changes such as heat history due to temperature changes. Also, a good electrical connection state is stably maintained, and therefore, high connection reliability can be obtained.

[Brief description of the drawings]

FIG. 1 is an explanatory cross-sectional view illustrating a configuration of an example of a wiring board forming material of the present invention.

FIG. 2 is an explanatory sectional view showing a part of the wiring board forming material shown in FIG. 2 in an enlarged manner.

FIG. 3 is an explanatory cross-sectional view showing an example of a substrate material used for manufacturing the wiring board forming material of the present invention.

FIG. 4 is an explanatory cross-sectional view showing a state in which a short-circuit portion forming hole is formed in an insulating substrate.

FIG. 5 is an explanatory cross-sectional view showing a state in which a relay short-circuit portion is formed on an insulating substrate.

FIG. 6 is an explanatory cross-sectional view showing a state in which relay lands are formed on upper and lower surfaces of an insulating substrate.

FIG. 7 is an explanatory cross-sectional view showing a state where an insulating substrate, a thermosetting resin sheet, and a metal foil have been subjected to a thermocompression bonding process.

FIG. 8 is an explanatory cross-sectional view illustrating a configuration of an example of the plate-shaped connector of the present invention.

9 is an explanatory sectional view showing a part of the plate-like connector shown in FIG. 8 in an enlarged manner.

10 is an explanatory cross-sectional view showing a state where holes for short-circuit portions are formed in the upper insulating layer and the lower insulating layer in the wiring board forming material shown in FIG. 1;

FIG. 11 is an explanatory cross-sectional view showing a state in which an upper short-circuit portion is formed in an upper insulating layer and a lower short-circuit portion is formed in a lower insulating layer.

FIG. 12 is an explanatory cross-sectional view showing a state in which an upper wiring portion and a connection electrode base layer are formed on an upper surface of an upper insulating layer, and a lower wiring portion and a terminal electrode base layer are formed on a lower surface of a lower insulating layer. .

FIG. 13 is an explanatory cross-sectional view showing a configuration of an example of the adapter device for circuit device inspection of the present invention.

14 is an explanatory cross-sectional view showing, on an enlarged scale, an elastomer layer of the circuit device inspection adapter device in FIG.

FIG. 15 is an explanatory cross-sectional view showing a state in which the adapter main body on which the elastomer material layer is formed is set in a mold.

FIG. 16 is an explanatory sectional view showing a state where a parallel magnetic field is applied in FIG. 13;

FIG. 17 is an explanatory sectional view showing another example of a mold used for forming an elastomer layer.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Adapter main body 10 Insulating board 11 Relay short-circuit part 11H Short-circuit part formation hole 12,13 Relay land 12A, 13A Metal thin layer 15 Penetration short-circuit part 20 Upper insulating layer 20A Thermosetting resin sheet 21 Connection electrode 21A Connection electrode base layer 22 Upper surface wiring part 23 Upper short-circuit part 23H Short-circuit part hole 25 Metal thin layer 25A Metal foil 30 Lower insulating layer 30A Thermosetting resin sheet 31 Terminal electrode 31A Terminal electrode base layer 32 Lower wiring part 33 Lower part Side short-circuit part 33H Short-circuit part hole 35 Metal thin layer 35A Metal foil 40 Anisotropic conductive elastomer layer 41 Conductive part 42 Insulating part E Elastic high molecular substance P Conductive particle 45 Elastomer material layer 50 Mold 51 Upper mold 52 Lower die M Ferromagnetic part N Non-magnetic part 53 Magnetic pole plate G Gap 54 Magnetic pole plate

Claims (7)

[Claims] An insulating substrate, an upper insulating layer integrally laminated on an upper surface of the insulating substrate, and a lower insulating layer integrally laminated on a lower surface of the insulating substrate. A wiring board forming material, wherein the insulating substrate has a large number of conductive relay short-circuit portions that are regularly arranged and extend through the insulating substrate in the thickness direction thereof. 2. The wiring board forming material according to claim 1, wherein the relay short-circuit portions in the insulating substrate are arranged in accordance with lattice point positions. 3. A relay land connected to both ends of the relay short-circuit portion corresponding to each of the relay short-circuit portions on the upper surface and the lower surface of the insulating substrate. The wiring board forming material according to claim 1 or 2. 4. The method according to claim 1, wherein a thin metal layer is integrally laminated on an upper surface of the upper insulating layer and a lower surface of the lower insulating layer. Wiring board forming material. 5. A laminate comprising: an insulating substrate; an upper insulating layer integrally laminated on an upper surface of the insulating substrate; and a lower insulating layer integrally laminated on a lower surface of the insulating substrate; One electrode formed on the upper surface of the laminate, the other electrode formed on the lower surface of the laminate, and penetrating the upper insulating layer, the insulating substrate, and the lower insulating layer in the thickness direction thereof. Wherein the one electrode is a plate-like connector electrically connected to the other electrode via at least the through short-circuit portion, wherein the insulating substrate is Has a large number of relay short-circuit portions that are regularly arranged and extend through the insulating substrate in the thickness direction thereof, and the through short-circuit portion is selected from a large number of relay short-circuit portions of the insulating substrate. Specific relay short-circuit An upper-side short-circuit portion formed on the upper-side insulating layer immediately above a fixed relay-use short-circuit portion and extending through the upper-side insulating layer in the thickness direction thereof, and directly below the specific relay-use short-circuit portion. A plate-like structure formed by being electrically connected to a plurality of lower-side short-circuit portions formed on the lower-side insulating layer and extending through the lower-side insulating layer in the thickness direction thereof. connector. 6. The wiring board forming material according to claim 1, wherein the upper insulating layer of the wiring board forming material is selected from a number of relay short-circuit portions of an insulating substrate. Immediately above the specific relay short-circuit portion, a short-circuit portion forming hole that penetrates the upper insulating layer in the thickness direction thereof is formed, and in the lower insulating layer, immediately below the specific relay short-circuit portion. A short-circuit portion forming hole penetrating the lower insulating layer in the thickness direction thereof is formed, and a short-circuit portion forming hole formed in the upper insulating layer is electrically connected to the specific relay short-circuit portion. A connected upper short-circuit portion is formed, and a lower short-circuit portion electrically connected to the specific relay short-circuit portion is formed in the short-circuit portion forming hole formed in the lower insulating layer. By doing so, the upper insulating layer, the insulating substrate and Method for producing a plate-like connector, characterized in that it comprises a step of forming a through shorting portion a part-side insulating layer extending through in a thickness direction. 7. An adapter device for circuit device inspection interposed between a circuit device to be inspected and an electrical inspection device and electrically connecting electrodes of the circuit device, the adapter device for the circuit device to be inspected on one side. An adapter body having a connection electrode arranged corresponding to the test electrode and having a terminal electrode arranged on the other surface according to the lattice point position, and an anisotropically conductive material integrally provided on one surface of the adapter body An adapter device for circuit device inspection, comprising: an elastomer layer; and the adapter body comprising the plate-shaped connector according to claim 5.