JP3670338B2 - Circuit board inspection adapter device - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to a circuit board inspection adapter device used for electrically connecting a circuit board to a tester for the purpose of inspecting a circuit board such as a printed circuit board.
[0002]
[Prior art]
In general, on the surface of a circuit board such as a printed circuit board, various electronic functional elements are formed with a considerably high degree of integration, and each element and each element are electrically connected to the peripheral lead electrode. Wiring portions for connection are similarly formed at a high density. And about such a circuit board, when the manufacture is completed, in order to confirm that the circuit which exhibits an expected function is completed, the element part, the wiring part, the lead electrode in the circuit board It is necessary to check whether an appropriate portion of the conductive portion such as a portion is electrically connected to or insulated from other predetermined portions.
[0003]
Such a circuit board is inspected by a tester. In order to perform this, a large number of electrodes to be inspected set in the conductive part of the circuit board can be electrically connected to the test connection part of the tester. An adapter device is used to achieve this. Various connectors can be used as the adapter device.
[0004]
However, at present, in the circuit board, the conductive parts such as functional elements are becoming finer and the degree of integration is considerably high, and accordingly, the density of the electrodes and wirings in the connector is also increased. For this reason, for example, multilayer wiring connectors have been used favorably for this reason.
This multilayer wiring type connector is formed by integrally laminating a plurality of insulating layers, a surface electrode corresponding to an electrode to be inspected of a circuit board to be inspected is formed on the surface of the laminated body, and a tester is formed on the back surface. Back surface electrodes corresponding to the contacts of the inspection connecting portion are formed, and the front surface electrode and the back surface electrode are arranged on the front surface, the back surface, and the in-plane wiring portion disposed between the respective layers, and The in-plane wiring portions are electrically connected by through wiring portions that connect each other.
[0005]
[Problems to be solved by the invention]
However, in the multilayer wiring type connector, as will be described in detail below, since a plurality of insulating layers are integrated, the density of the electrodes or wirings is sufficiently high for manufacturing reasons. There is a problem that it is not possible.
[0006]
For example, as shown in FIG. 4A, in the case of electrically connecting the surface electrode A formed on the surface of the surface insulating layer 61 and another surface electrode B in the multilayer wiring type connector 60 having a three-layer structure. The connection wiring may be formed on the surface of the surface insulating layer 61 in the simplest case. However, a large number of other electrodes or wiring portions are usually formed on the surface, and these are overlapped on the surface. This is a wiring-prohibited part where connection wiring cannot be provided. In FIG. 4A, such a wiring prohibition site N indicated by a black circle is not only the surface of the surface insulating layer 61, but also between the surface insulating layer 61 and the intermediate insulating layer 62, and between the intermediate insulating layer 62 and It exists between the back surface insulating layer 63 and also on the surface of the back surface insulating layer 63.
[0007]
In order to bypass the wiring-prohibited portion N or avoid contact with it and provide the connection wiring, the surface wiring portion S1, the in-plane wiring portion S2 between the surface insulating layer 61 and the intermediate insulating layer 62, intermediate insulation The in-plane wiring portion S3 between the layer 62 and the back surface insulating layer 63, the back surface wiring portion S4 on the surface of the back surface insulating layer 63, and the surface insulating layer 61 extend through the thickness direction, and the surface insulating layer 61 A through wiring portion T1 that electrically connects electrodes or in-plane wiring portions provided on both surfaces, a similar through wiring portion T2 formed in the intermediate insulating layer 62, and a similar through wiring formed in the back surface insulating layer 63 It is necessary to form and arrange the portion T3 at an appropriate location.
[0008]
However, the all-layer through wiring portion Ta related to the surface electrode B in the configuration of FIG. 4A is a conductive material that continuously penetrates all of the surface insulating layer 61, the intermediate insulating layer 62, and the back surface insulating layer 63 along a straight line. This is a path, and since it is only necessary to form a through hole that penetrates the entire line in a straight line and to arrange a conductive material by metal plating or the like in the inside, it is relatively easy to manufacture, but on the other hand, The presence of the all-layer through-wiring portion Ta results in the formation of a wiring-prohibited portion at the same point in all the insulating layers, so that the degree of freedom of wiring is greatly reduced and the advantage of being a multilayer wiring board type Will be greatly diminished.
[0009]
In order to alleviate such problems, as shown in FIG. 4 (b), it extends from the front surface or the back surface, but does not penetrate all the insulating layers, but is also called a dead-end blind hole as a hole. It is also known to form a local layer through wiring portion Tb by forming a via hole. According to such a configuration, the degree of freedom of wiring is increased as compared with the case of forming a through hole, but on the other hand, very precise control is required in a work for accurately forming a blind hole. Therefore, the production is not easy and the production cost is high.
[0010]
As described above, in the adapter device using the conventional multi-layer wiring type connector, a sufficiently large wiring degree of freedom cannot be obtained, so that sufficient resolution cannot be obtained, and as a result, sufficient for inspection of a circuit board having a high degree of integration. However, there is a problem that it is difficult to manufacture and the manufacturing cost is high if it is not possible to cope with it, or a relatively large degree of wiring freedom is obtained.
[0011]
In addition, as an adapter device using a multilayer wiring type connector, a device in which an anisotropic conductive elastomer layer is provided on the surface of the connector has been developed so that the inspected electrode of the circuit board to be inspected is not damaged. In such a configuration, when the anisotropic conductive elastomer layer is worn out due to contact of the circuit board to be inspected many times, the entire adapter device must be replaced. There is a problem that it is not economical.
[0012]
The present invention solves the above-described problems, and its purpose is to sufficiently cope with the inspection of a circuit board having a high degree of freedom, a high resolution, and a high degree of integration. Another object of the present invention is to provide an adapter device for inspecting a circuit board that can be manufactured easily and at a low manufacturing cost, and can economically recover its function when the anisotropic conductive elastomer layer on the surface is worn. .
[0013]
[Means for Solving the Problems]
  The adapter device for circuit board inspection according to the present invention is interposed between the circuit board to be inspected and the test connection portion of the tester, and electrically connects the test electrode of the circuit board and the test connection portion of the tester. Circuit board inspection adapter device,
  Arranged on the circuit board sideA front connector complex formed by stacking a plurality of plate-like front connectors, and the front connector complexStacked separately from each other,Front connector complexAnd a whole plate-like backup connector disposed between the test connection part of the tester and
  Front connectorEach ofIs
  (A) an insulating substrate having only one layer;
  (B) An insulating substrate (a) is integrally laminated so as to cover the upper surface, and has a conductive path forming portion arranged corresponding to the inspected electrode of the circuit board, and is in contact with the circuit board. An anisotropic conductive elastomer layer;
  (C) a contact electrode formed on the lower surface of the insulating substrate (a) and disposed at the position of a small reference lattice point with a small pitch;
  (D) a through conductive path electrically connecting the conductive path forming part of the anisotropic conductive elastomer layer (b) and the contact electrode, which is formed by a through hole so as to extend in the thickness direction of the insulating substrate (a);
With
  The backup connector is
  (A) an insulating substrate having only one layer;
  (B) On the upper surface of the insulating substrate (a),Contact electrode on the underside of the front connector complexAn inner surface electrode formed at a position corresponding to
  (C) Provided by being integrally laminated so as to cover the upper surface of the insulating substrate (a) on which the inner surface electrode is formedReference grid point position corresponding to the contact electrode on the lower surface of the front connector complexAnd having a conductive path forming part that forms a protruding part that is insulated from each other and protrudes from the surface of the insulating part.Front connector complexAn anisotropic conductive elastomer layer in contact with the lower surface of
  (D) According to the conductive path forming portion in the anisotropic conductive elastomer layer (c) formed on the lower surface of the insulating substrate (a).Reference grid pointOuter surface electrodes arranged at coarse reference grid point positions with a pitch larger than the pitch of
  (E) a through conductive path electrically connecting the inner surface electrode (b) and the outer surface electrode (d) formed by a through hole so as to extend in the thickness direction of the insulating substrate (a);
With
  The outer surface electrode (d) is electrically connected to the test connection of the testerIs,
  The front connector composite is composed of a plurality of front connectors each having a different shape or size, and is used for inspecting a circuit board in which a plurality of electrode arrangement surfaces are provided at different levels.It is characterized by that.
[0016]
【Example】
  Hereinafter, the present invention will be specifically described with reference to the drawings.
  FIG.Reference exampleFIG. 4 is a cross-sectional view for explaining the outline of the configuration of the circuit board inspection adapter device 10 together with a part of the circuit board 12 to be inspected disposed on the upper side and the test connection portion 15 of the tester disposed on the lower side. is there. Reference numeral 13 denotes an electrode to be inspected on the circuit board 12.
[0017]
The adapter device 10 includes an entire plate-like front connector 20 disposed on the circuit board 12 side, and an entire plate-shaped backup connector 30 disposed so as to be stacked below the front connector 20. These are manufactured independently and are stacked so as to be separable from each other.
[0018]
The front connector 20 has an insulating substrate 21 made of an appropriate resin.ofAn anisotropic conductive elastomer layer 22 is laminated and provided integrally so as to cover the upper surface. The anisotropic conductive elastomer layer 22 has a pattern corresponding to the electrodes 13 to be inspected on the circuit board 12, each having a conductive path forming portion 23 extending in the thickness direction and electrically insulated from adjacent ones. That is, it is formed in a shape and position according to a pattern opposite to the pattern of the electrode to be inspected 13 and slightly protruding outward. On the lower surface of the insulative substrate 21, contact electrodes 25 are formed at appropriate positions at small reference lattice points with a small pitch.
[0019]
Further, an upper surface electrode 24 is formed on the upper surface of the insulating substrate 21 so as to be located in the entire region immediately below the conductive path forming portion 23 of the anisotropic conductive elastomer layer 22. An upper surface wiring portion 27 connected to 24 is formed. Further, a lower surface wiring portion 28 connected to the contact electrode 25 is formed on the lower surface of the insulating substrate 21 as necessary.
[0020]
Then, a through conductive path 26 extending through the insulating substrate 21 in the thickness direction is formed, whereby the conductive path forming portion 23 of the anisotropic conductive elastomer layer 22 and, for example, a position immediately below or near the conductive path forming portion 23 are formed. The contact electrode 25 existing at the position is electrically connected.
In the insulating substrate 21, the through conductive path 26 is formed at a position where the through conductive path 26 directly connects the upper surface electrode 24 and the contact electrode 25, and directly connects the upper surface wiring portion 27 and the contact electrode 25. The position may be any of the aspect in which the upper surface electrode 24 and the lower surface wiring portion 28 are directly connected, and the upper surface wiring portion 27 and the lower surface wiring portion 28 are directly connected.
[0021]
The backup connector 30 has an insulating substrate 31 made of an appropriate resin, and one or more anisotropic conductive elastomer layers 32 corresponding to the contact electrodes 25 of the front connector 20 are formed on the upper surface of the insulating substrate 31. An inner surface electrode 34 is formed so as to be located immediately below the conductive path forming portion 33, and an inner surface wiring portion 37 connected to the inner surface electrode 34 is formed as necessary.
[0022]
  Further, an anisotropic conductive elastomer layer 32 is laminated and provided integrally so as to cover the entire upper surface of the insulating substrate 31 on which the inner surface electrode 34 and the inner surface wiring portion 37 are formed. The anisotropic conductive elastomer layer 32 includes a plurality of conductive path forming portions 33 that extend in the thickness direction and are electrically insulated from adjacent ones. Lattice pointReference grid point position corresponding toAll of these are formed so as to protrude slightly upward.
[0023]
  In addition, on the lower surface of the insulating substrate 31, the conductive path forming portion 33 in the anisotropic conductive elastomer layer 32 corresponds to the connection contact 16 disposed at the standard lattice point position in the test connection portion 15 of the tester. AffectReference grid pointAn outer surface electrode 35 is provided at a coarse reference grid point position having a pitch larger than that of the first electrode, and an outer surface wiring portion 38 connected to the outer surface electrode 35 is formed as necessary.
[0024]
A through conductive path 36 extending through the insulating substrate 31 in the thickness direction is formed, whereby the inner surface electrode 34 and the outer surface electrode 35 are electrically connected.
In the insulating substrate 31, the through conductive path 36 is formed at a position where the through conductive path 36 directly connects the inner surface electrode 34 and the outer surface electrode 35, and directly connects the inner surface wiring portion 37 and the outer surface electrode 35. Any position may be employed, such as a mode in which the inner surface electrode 34 and the outer surface wiring portion 38 are directly connected, and a mode in which the inner surface wiring portion 37 and the outer surface wiring portion 38 are directly connected.
[0025]
In the above, it is preferable that the insulating substrate 21 of the front connector 20 and the insulating substrate 31 of the backup connector 30 are both heat-resistant materials having high dimensional stability, and various resins can be used. In particular, a glass fiber reinforced epoxy resin is most suitable.
[0026]
The anisotropic conductive elastomer layer 32 of the backup connector 30 is formed in a state of being bonded or closely adhered to the surface of the insulating substrate 31. As shown in FIG. 2, the anisotropic conductive elastomer layer 32 is adjacent to a large number of conductive path forming portions 33 each formed by closely packing conductive particles P in an insulating elastic polymer substance E. The objects are insulated from each other by the insulating portion 40. In each conductive path forming portion 33, the conductive particles P are oriented so as to be aligned in the thickness direction, and a conductive path extending in the thickness direction is formed. The conductive path forming part 33 may be a pressurized conductive part in which a resistance value is reduced to form a conductive path when pressed and compressed in the thickness direction. On the other hand, in the insulating portion 40, a conductive path is not formed in the thickness direction even when pressed.
[0027]
In the illustrated example, the conductive path forming portion 33 forms a protruding portion protruding from the surface of the insulating portion 40 on the outer surface of the anisotropic conductive elastomer layer 32.
According to such a configuration, when the anisotropic conductive elastomer layer 32 is pressed in the thickness direction, the degree of compression is greater in the conductive path forming portion 33 than in the insulating portion 40, and thus the conductivity having a sufficiently low resistance value. As a result, the path is reliably formed, and the degree of change in the resistance value can be reduced with respect to the change or fluctuation in the applied pressure. As a result, the applied pressure acting on the anisotropic conductive elastomer layer 32 is not increased. Even if it is uniform, the desired electrical connection can be reliably achieved.
[0028]
Of the conductive path forming part 33The protrusion height h of the protrusion is preferably 8% or more of the total thickness t of the anisotropic conductive elastomer layer 32 (t = h + d, where d is the thickness of the insulating portion 40). The total thickness t of the anisotropic conductive elastomer layer 32 is preferably 300% or less of the electrode pitch p defined as the distance between the centers of the conductive path forming portions 33, that is, t ≦ 3p. By satisfying such a condition, even when the pressure applied to the conductive path forming portion 33 changes, the change in the conductivity of the conductive path forming portion 33 is suppressed sufficiently small. is there.
[0029]
Of the conductive path forming part 33It is not always necessary that the entire surface of the protruding portion has conductivity. For example, a conductive path non-forming portion of 20% or less of the electrode pitch may exist on the periphery of the protruding portion.
Further, the minimum value of the separation distance r between the adjacent conductive path forming portions 33 is preferably 10% or more of the width R of the conductive path forming portions 33. By satisfying such a condition, it is possible to sufficiently avoid the possibility that the adjacent conductive path forming portions 33 are in electrical contact with each other due to a lateral displacement when the protruding portion is deformed by being pressurized. can do.
In the above example, the planar shape of the conductive path forming portion 33 can be a circular shape having a required area, or any other appropriate shape.
[0030]
As the conductive particles P in the conductive path forming portion 33, for example, metal particles showing magnetism such as nickel, iron and cobalt or particles of these alloys, or plating such as gold, silver, palladium and rhodium is applied to these particles. Examples thereof include those obtained by coating, inorganic particles such as non-magnetic metal particles or glass beads, or polymer particles plated with a conductive magnetic material such as nickel or cobalt.
[0031]
The particle diameter of the conductive particles is 3 to 200 μm so as to facilitate pressure deformation of the conductive path forming portion 33 and to obtain sufficient electrical contact between the conductive particles in the conductive path forming portion 33. Particularly preferred is 10 to 100 μm.
[0032]
As the insulating and elastic polymer substance E constituting the conductive path forming portion 33, a polymer substance having a crosslinked structure is preferable. Examples of the curable polymer material that can be used to obtain a crosslinked polymer material include silicone rubber, polybutadiene, natural rubber, polyisoprene, styrene-butadiene copolymer rubber, and acrylonitrile-butadiene copolymer rubber. , Ethylene-propylene copolymer rubber, urethane rubber, polyester rubber, chloroprene rubber, epichlorohydrin rubber, soft liquid epoxy resin, and the like.
[0033]
Specifically, a polymer material that is in a liquid state before the curing process and is integrated with the insulating substrate 31 while being in close contact with or in an adhesive state after the curing process is preferable. From such a viewpoint, examples of suitable materials for polymer substances include liquid silicone rubber, liquid urethane rubber, and soft liquid epoxy resin. In order to improve the adhesion of the anisotropic conductive elastomer layer 32 to the insulating substrate 31, an additive such as a silane coupling agent or a titanium coupling agent can be added to the polymer material.
[0034]
The material constituting the insulating portion 40 may be the same as or different from the polymer substance constituting the conductive path forming portion 33. Similarly, the insulating substrate 31 and the insulating substrate 31 are in close contact or bonded after the curing process. That is integrated with the insulating substrate 31 is used.
[0035]
The anisotropic conductive elastomer layer 22 of the front connector 20 is also formed in a state of being bonded or adhered integrally to the surface of the insulating substrate 21. The anisotropic conductive elastomer layer 22 is basically as described above, except that the position and the planar shape of the conductive path forming portion 23 are the positions and shapes corresponding to the electrodes 13 to be inspected of the circuit board 12. The anisotropic conductive elastomer layer 32 of the backup connector 30 can have the same configuration.
[0036]
The adapter device configured as described above is an inspection target on the upper surface side of the anisotropic conductive elastomer layer 22 of the front connector 20 in a state where the front connectors 20 are positioned and stacked on the backup connector 30. The circuit board 12 is positioned, and the tester inspection connection portion 15 is positioned on the lower surface side of the backup connector 30. The front connector 20 and the backup connector 30 are clamped in the thickness direction (vertical direction in FIG. 1) between the circuit board 12 and the test connection portion 15 of the tester by appropriate clamping means. The
[0037]
In such a state, the electrode 13 to be inspected of the circuit board 12 is pressed against the conductive path forming portion 23 of the anisotropic conductive elastomer layer 22 in the front connector 20, thereby causing the contact electrode to pass through the through conductive path 26. 25 to be electrically connected. At the same time, the contact electrode 25 of the front connector 20 is pressed against the conductive path forming portion 33 of the anisotropic conductive elastomer layer 32 of the backup connector 30, thereby causing the outer electrode 35 to pass through the inner surface electrode 34 and the through conductive path 36. It is in an electrically connected state. The outer surface electrode 35 is in contact with and electrically connected to the test connection 15 of the tester.
[0038]
As a result, the state in which the electrode 13 to be inspected of the circuit board 12 is electrically connected to the test connection 15 of the tester by the adapter device 10 including the front connector 20 and the backup connector 30 is realized. The test of the electrical connection state of the inspected electrode 13 on the circuit board 12 is performed by a tester.
At this time, since the anisotropically conductive elastomer layer 22 that is flexible and elastic is directly in contact with the surface of the circuit board 12 where the electrode 13 to be inspected is located, the electrode 13 to be inspected and the circuit board 12. The surface will not be damaged.
[0039]
In the adapter device having the above-described configuration, the front connector 20 and the backup connector 30 are configured as being independent from each other. Therefore, both surfaces of the insulating substrate in each of them can be used as the wiring portion forming surface. it can. That is, in the example of FIG. 1, the upper surface wiring portion 27 and the lower surface wiring portion 28 can be formed on the insulating substrate 21 of the front connector 20, and the inner surface wiring portion 37 and the outer surface are formed on the insulating substrate 31 of the backup connector 30. The wiring part 38 can be formed.
[0040]
Moreover, in each of the insulating substrates 21 and 31, in order to form the through conductive path 26 and the through conductive path 36, a hole penetrating each of the insulating substrates 21 and 31 is formed and used. Therefore, it is not necessary to form a through hole that penetrates all of the stacked insulating layers in a straight line continuously, and therefore, it is possible to obtain a large degree of freedom of wiring and to manufacture the whole. Is easy and low in cost.
[0041]
  For example, thisReference exampleThis adapter device becomes more apparent when compared with the configuration of FIG. That is, the aboveReference exampleIn this adapter device, the surfaces that can be used as the wiring portion forming surfaces are both surfaces of each of the insulating substrates 21 and 31 in total, and a total of four surfaces. It is sufficient to form a hole that penetrates the insulating substrate.
  On the other hand, in the example of FIG. 4, the surfaces that can be used as the wiring portion forming surface are the surface of the surface insulating layer 61, the inner surfaces of the surface insulating layer 61 and the intermediate insulating layer 62, and the intermediate insulating layer 62 and the back insulating layer 63. However, it is necessary to form through holes that continuously extend all of the plurality of insulating substrates, or to form a blind blind hole. It is necessary to form.
[0042]
  Further, in the backup connector 30, the position of the conductive path forming portion 33 of the anisotropic conductive elastomer layer 32 is a minute reference lattice point related to the contact electrode 25 of the front connector 20.Corresponded toThe position of the outer surface electrode 35 is related to the conductive path forming portion 33 as well as the reference lattice point position.Reference grid pointTherefore, even if the arrangement of the electrodes 13 to be inspected on the circuit board 12 is fine and dense, each of them is surely connected to the test connection 15 of the tester. Connected state can be easily achieved, so that high resolution and high reliability can be obtained.
[0043]
  In a specific example of the adapter device having the above configuration, the pitch of the small reference lattice points related to the contact electrode 25 is0.2 mm, outer electrode 35The pitch of the coarse reference lattice points is 2.54 mm, but these can be freely set or changed.
[0044]
Further, when the inspection is performed many times, the anisotropic conductive elastomer layer 22 of the front connector 20 that is repeatedly brought into contact with and pressed against the circuit board gradually wears out. Since it is configured to be separable, it is not necessary to replace the entire adapter device, and if only the front connector 20 is replaced, the backup connector 30 can be used as it is, so the function of the initial adapter device can be restored economically. Can be made.
[0045]
  Of the above reference exampleThe front connector and the backup connector in the adapter device both have a single insulating substrate as a base and are not laminated with other insulating substrates, which may cause deformation such as warping. In addition to being able to obtain high flatness and high dimensional stability at all times, each of them has an anisotropic conductive elastomer layer, so that a plurality of elastomers are provided between the circuit board to be inspected and the test connection part of the tester. As a result, the circuit board, the front connector, the backup connector, the inspection connector of the tester, etc. can sufficiently absorb the displacement in the surface direction. A good clamping condition can be achieved with this inspection connection part. From also, it is possible to perform the desired inspection with high reliability.
[0046]
Further, since the anisotropic conductive elastomer layers 22 and 32 are both formed integrally with the insulating substrates 21 and 31, the anisotropic conductive layers are also resistant to environmental changes such as thermal history due to temperature changes. There is no displacement such as displacement between the conductive elastomer layers 22 and 32 and the insulating substrates 21 and 31.
[0047]
  In the aboveThe anisotropic conductive elastomer layer of the front connector is not limited to one in which each of the conductive path forming portions protrudes from the periphery thereof, and may have a flat surface. .
  Further, in the front connector and the backup connector, it is not essential that the anisotropic conductive elastomer layers of the both have basically the same configuration, and those having an appropriate configuration are used for each purpose. be able to.
[0048]
  In the above reference example,An appropriate anisotropic conductive connector having a conductive path in the thickness direction between the front connector 20 and the backup connector 30 or between the backup connector 30 and the test connection portion of the tester, such as the front connector 20 or the backup. A connector having the same configuration as that of the connector 30 can be additionally provided. In this case, it is possible to obtain a higher resolution by appropriately setting the electrode pitch of each connector.
[0049]
  Adapter device of the present inventionThe tester used and the inspection connectionIt is not specifically limited, What is necessary is just to be able to pinch the adapter apparatus of this invention between circuit boards. Moreover, the test connection portion for the tester does not need to be provided integrally with the tester body, and may be an independent configuration electrically connected to the tester.
[0050]
  The adapter device of the present invention isA circuit board having a plurality of electrode arrangement surfaces at different levels, such as a so-called digging circuit board, by stacking a plurality of front connectors each having a different shape or size to form a front connector composite.Are subject to inspection.
[0051]
FIG. 5 is a perspective view for explaining the basic configuration of the digging circuit board, and FIG. 6 is a sectional view for explaining the arrangement and wiring of the integrated circuit chip in the digging circuit board of FIG.
The engraved circuit board 70 in the illustrated example is a rectangular multi-layer wiring board as a whole, for example, and the first area of the planar rectangle having a size smaller than the outer dimension of the circuit board 70 is formed in the central region of one surface. As a result, a rectangular frame-shaped first electrode arrangement surface 70A surrounding the opening of the first recess 71A is formed by the region remaining on the one surface.
[0052]
On the bottom surface of the first recess 71A, a planar rectangular second recess 71B having a size smaller than the size of the first recess 71A is formed in the central region, so that a rectangular frame is formed in the outer peripheral region. The second electrode arrangement surface 70B having a shape is left behind. Further, a third rectangular recess 71C having a smaller size is formed on the bottom surface of the second recess 71B in the same manner, thereby forming a rectangular electrode-shaped third electrode arrangement surface 70C. Has been.
Then, a rectangular central through hole 72 smaller than the dimension of the third recess 71C is formed on the bottom surface of the third recess 71C, thereby leaving a rectangular frame-shaped chip arrangement step 73. Is formed.
[0053]
In the engraved circuit board 70 having such a configuration, as shown in FIG. 6, a so-called bare integrated circuit chip 80 is arranged and fixed on the step surface of the chip arrangement stage 73, and the predetermined number of the integrated circuit chip 80 is determined. These electrodes are electrically connected to corresponding terminal electrodes 76A to 76C formed on any one of a total of three electrode arrangement surfaces 70A to 70C through appropriate wires 75.
[0054]
Accordingly, in the digging circuit board 70, the electrode arrangement surface to be formed on one surface is divided into a plurality of (three in the illustrated example) surface portions, which are integrated circuit chips at different levels in steps. 80 is surrounded. For this reason, by forming the digging circuit board 70 as a multilayer wiring board, it is possible to reliably connect the electrodes of the integrated circuit chip 80 having fine and high arrangement density by the wiring 75. Can be achieved.
[0055]
However, since the plurality of electrode arrangement surfaces are provided at different levels in the thickness direction of the substrate, such an engraved circuit board 70 is in contact with the electrode to be inspected arranged on one plane. In a normal circuit board inspection apparatus configured as described above, it is very difficult to realize a state in which the inspection connection portions are electrically connected to the electrodes to be inspected on all electrode arrangement surfaces simultaneously or simultaneously. It is. Therefore, in practice, it is necessary to perform an inspection for each electrode arrangement surface, and as a result, there is a problem that the inspection efficiency is extremely low.
[0056]
However, according to the present invention, as will be described in detail below, a circuit board inspection adapter that can perform a desired inspection very easily with respect to an engraved circuit board as a circuit board to be inspected. A device can be constructed.
[0057]
FIG. 3 is an explanatory cross-sectional view showing an example of the circuit board inspection adapter device of the present invention configured to be applicable to inspection of an engraved circuit board. In FIG. 3, the digging circuit board 70 is shown in a state in which the electrode arrangement surfaces 70A to 70C face downward, and the electrodes to be inspected 77A to 77C are formed so as to slightly protrude from each of them. Has been.
[0058]
A backup spacer 82 having a thickness equivalent to the depth is disposed in the central through hole 72, and fits in the third recess 71C in the third recess 71C.Have shapeA simulated chip 83 is arranged. Reference numeral 77D denotes a ground electrode connected to an integrated circuit chip disposed later.
[0059]
In the second recess 71B of the digging circuit board 70, a third front connector 20C having a shape that fits the second recess 71B is arranged, and a central region of the third front connector 20C is formed. While facing the simulation chip 83, the outer peripheral region is in a state facing the third electrode arrangement surface 70C.
In addition, a second front connector 20B having a shape that fits the first recess 71A is disposed in the first recess 71A, and the central region of the second front connector 20B is the third front connector. While facing the connector 20C, the outer peripheral region faces the second electrode arrangement surface 70B.
Further, the first front connector 20A is arranged on the outer surface side of the second front connector 20B and the first electrode arrangement surface 70A, and the central region of the first front connector 20A faces the second front connector 20B. At the same time, the outer peripheral region faces the first electrode arrangement surface 70A.
[0060]
A backup connector 30 is arranged on the outer surface side of the first front connector 20A, and a tester inspection connecting portion 15 is arranged therethrough. Reference numeral 90 denotes a pressing elastic body.
[0061]
The first front connector 20A to the third front connector 20C have a basic configuration similar to that of the above-described front connector, and an insulating substrate and an anisotropic conductive elastomer layer provided integrally therewith. In the anisotropic conductive elastomer layer, a conductive path forming portion is formed in the outer peripheral region with a pattern that matches the corresponding electrode to be inspected. That is, the outer peripheral region of the first front connector 20A has an electrode to be inspected 77A on the first electrode arrangement surface 70A, and the outer peripheral region of the second front connector 20B has an electrode to be inspected 77B on the second electrode arrangement surface 70B. In addition, a conductive path forming portion is provided in an outer peripheral region of the third front connector 20C in a pattern that coincides with the electrode 77C to be inspected on the third electrode arrangement surface 70C.
[0062]
According to such a configuration, the third front connector 20C is in direct contact with the third electrode arrangement surface 70C in the outer peripheral region in a state where the entirety is pressed through the pressing elastic body 90 or the like. The test electrode 77C is elastically brought into contact, and eventually the function as the above-described front connector is exhibited with respect to the test electrode 77C.
Further, the second front connector 20B is in direct contact with the second electrode arrangement surface 70B in its outer peripheral region and elastically contacts the electrode 77B to be inspected, and eventually the front connector 20B is in front of the electrode 77B to be inspected. In addition to exhibiting a function as a connector, it simultaneously functions as a backup connector for the third front connector 20C.
Further, similarly, the first front connector 20A is also in direct contact with the first electrode arrangement surface 70A in the outer peripheral region and elastically contacts the electrode to be inspected 77A. In addition to exhibiting the function as a front connector, it simultaneously functions as a backup connector for the second front connector 20B.
[0063]
As described above, according to the above-described circuit board inspection adapter device, a plurality of fronts are also provided for a circuit board to be inspected in which electrodes to be inspected are provided on a plurality of electrode arrangement surfaces located at different levels. By stacking the connectors, it is possible to obtain a state in which at least a part of the front surface of any front connector is in direct contact with any electrode placement surface. It is possible to reliably and very easily realize the state in which the electrical connection is achieved.
That is, when a so-called digging circuit board is used as a circuit board to be inspected, the number of steps, the height, and the shape of the digging circuit board vary, but according to the configuration of the present invention, Corresponding to the state of the circuit board to be inspected, the number of front connectors and the shape of each of them are appropriately selected and combined so that these are stacked, so that the circuit to be inspected can be surely A circuit board inspection adapter device having a contact surface corresponding to the electrode arrangement surface of the substrate can be constructed.
[0064]
【The invention's effect】
  Reference exampleAccording to this circuit board inspection adapter device, even if the electrodes to be inspected on the circuit board to be inspected are fine with a high-density complicated pattern with a small pitch, the front connector and the backup connector are used. Thus, the required electrical connection of the circuit board to the test connection of the tester can be reliably achieved.
[0065]
  Also, for reference examplesAccording to the circuit board inspection adapter device, since the front connector and the backup connector can be separated from each other, when the anisotropic conductive elastomer layer forming the surface of the front connector is worn, only the front connector should be replaced. The backup connector can still be used continuously, so that the initial function can be restored economically.
  Further, in both of the front connector and the backup connector, since the insulating layer is only one layer of the insulating substrate and the through conductive path is formed by the through hole, the manufacturing is easy and the manufacturing cost is low. Moreover, since a multilayer wiring structure is substantially achieved as a whole, a very large degree of wiring freedom can be obtained, and it can sufficiently cope with inspection of a circuit board having a high degree of integration.
[0066]
  And according to the circuit board inspection adapter device of the present invention,By stacking a plurality of front connectors each having a different shape or size to form a front connector composite, a plurality of electrode arrangement surfaces are provided at different levels as in a so-called engraved circuit board.Circuit boardIt can be the subject of inspection.
[Brief description of the drawings]
[Figure 1]Reference exampleIt is sectional drawing for description which shows the outline of a structure of the adapter apparatus for circuit board inspection with a part of circuit board to be examined, and the test | inspection connection part of a tester.
FIG. 2 is an enlarged sectional view for explaining an example of an anisotropic conductive elastomer layer portion in the adapter device of FIG. 1;
FIG. 3 is an explanatory diagram showing a configuration of an adapter device for circuit board inspection according to the present invention in which a front connector composite is constituted by a plurality of front connectors, which is suitable when an indented circuit board is a circuit board to be inspected. It is sectional drawing.
FIG. 4 is an explanatory diagram of a multilayer wiring type connector, in which (a) shows a through hole and (b) shows a blind hole.
FIG. 5 is an explanatory perspective view showing a basic configuration of an engraved circuit board.
6 is a cross-sectional view for explaining the arrangement and wiring of integrated circuit chips on the engraved circuit board of FIG. 5. FIG.
[Explanation of symbols]
10 Adapter device 12 Circuit board
13 Inspected electrode 15 Connection for inspection
20 Front connector 20A First front connector
20B Second front connector 20C Third front connector
21 Insulating substrate 22 Anisotropic conductive elastomer layer
23 Conducting path forming part 24 Upper surface electrode
25 Contact electrode 26 Through-passage
27 Upper surface wiring portion 28 Lower surface wiring portion
30 Backup connector 31 Insulating board
32 Anisotropic conductive elastomer layer 33 Conductive path forming part
34 Inner electrode 16 Contact for connection
35 External electrode 36 Through conductive path
37 Internal wiring 38 External wiring
40 Insulating part P Conductive particle
E Polymeric material 60 Multilayer wiring type connector
61 Surface insulation layer A, B Surface electrode
62 Intermediate insulating layer 63 Back insulating layer
N Wiring prohibited part S1 Surface wiring part
S2, S3 In-plane wiring part S4 Back wiring part
T1, T2, T3 Through wiring part Ta All layer through wiring part
Tb Local layer through wiring part 70 Dimmed circuit board
70A First electrode arrangement surface 70B Second electrode arrangement surface
70C Third electrode arrangement surface 71A First recess
71B second recess 71C third recess
72 Central through hole 73 Chip placement step
75 Wiring 76A-76C Terminal electrode
77A-77C Electrode to be inspected 77D Ground electrode
80 integrated circuit chip 82 backup spacer
83 Simulated chip 90 Elastic body for pressing

Claims (1)

A circuit board inspection adapter device that is inserted between a circuit board to be inspected and an inspection connection part of a tester, and electrically connects an electrode to be inspected of the circuit board and an inspection connection part of the tester. There,
Are arranged on the circuit board side, the whole front connectors complexes plurality of plate-shaped front connector is configured by stacking, this front connector complex and are mutually separably stacked, the front connector complex And a whole plate-like backup connector disposed between the test connection part of the tester and
Each of the front connectors is
(A) an insulating substrate having only one layer;
(B) An insulating substrate (a) is integrally laminated so as to cover the upper surface, and has a conductive path forming portion arranged corresponding to the inspected electrode of the circuit board, and is in contact with the circuit board. An anisotropic conductive elastomer layer;
(C) a contact electrode formed on the lower surface of the insulating substrate (a) and disposed at the position of a small reference lattice point with a small pitch;
(D) a through conductive path electrically connecting the conductive path forming part of the anisotropic conductive elastomer layer (b) and the contact electrode, which is formed by a through hole so as to extend in the thickness direction of the insulating substrate (a); With
The backup connector is
(A) an insulating substrate having only one layer;
(B) On the upper surface of the insulating substrate (A), an inner surface electrode formed at a position corresponding to the contact electrode on the lower surface of the front connector complex;
(C) It is integrally laminated so as to cover the upper surface of the insulating substrate (a) on which the inner surface electrode is formed, and is disposed at a reference lattice point position corresponding to the contact electrode on the lower surface of the front connector complex . An anisotropic conductive elastomer layer that is insulated from each other and has a conductive path forming portion that forms a protruding portion that protrudes from the surface of the insulating portion, and is in contact with the lower surface of the front connector complex;
(D) Arranged at coarse reference grid point positions having a pitch larger than the pitch of the reference grid points related to the conductive path forming portion in the anisotropic conductive elastomer layer (c) formed on the lower surface of the insulating substrate (a). An outer surface electrode,
(E) comprising a through conductive path electrically connecting the inner surface electrode (b) and the outer surface electrode (d) formed by a through hole so as to extend in the thickness direction of the insulating substrate (a);
The outer surface electrode (d) is electrically connected to the test connection of the tester ,
A circuit board inspection characterized in that the front connector composite is composed of a plurality of front connectors each having a different shape or size, and is used for inspection of a circuit board provided with a plurality of electrode arrangement surfaces at different levels. Adapter device.

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