JP2002162430A - Adaptor device for inspecting circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adaptor device for inspecting a circuit board, capable of coping with inspection of a circuit board and which has high wiring flexibility and high degree of integration, easy to manufacture, and capable of economically recovering the function of an anisotropically conductive elastomer layer, when it is worn out. SOLUTION: This device, having a front connector and a backup connector, separable from each other, is inserted between the circuit board and an inspection connection part of a tester to electrically connect the two. The front connector is equipped with an insulating substrate, having an integral anisotropically conductive elastomer layer on its upper surface and connection electrodes on its lower surface, and conductive paths forming parts of the elastomer layer, corresponding to inspected electrodes are connected to the connection electrodes by through-conductive paths. The backup connector is provided with an insulating substrate having inner-surface electrodes on its upper surface, outer-surface electrodes on its lower surface, and through-conductive paths connecting them, and has an integral anisotropically conductive elastomer layer on its upper surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adapter for inspecting a circuit board, such as a printed circuit board, for electrically connecting the circuit board to a tester.

[0002]

2. Description of the Related Art Generally, on the surface of a circuit board such as a printed circuit board, various electronic functional elements and the like are formed with a considerably high degree of integration. Wiring portions for electrically connecting to the electrodes are similarly formed at a high density. Then, for such a circuit board, when the manufacture thereof is completed, in order to confirm that a circuit exhibiting an intended function is completed, an element portion, a wiring portion,
It is necessary to check whether an appropriate portion of the conductive portion such as a lead electrode portion is electrically connected to another predetermined portion or is insulated.

[0003] Inspection of such a circuit board is performed by a tester. In order to execute this, a large number of electrodes to be inspected set in the conductive portion of the circuit board are electrically connected to the test connection section of the tester. And an adapter device is used to achieve this. Various connectors can be used as the adapter device.

However, at present, in a circuit board, a conductive portion such as a functional element has become finer and the degree of integration thereof has been considerably increased. Accordingly, the electrode and wiring density of the connector have also been reduced. It is becoming necessary to increase the resolution to obtain high resolution.
Conventionally, for example, a multilayer wiring type connector has been suitably used. This multilayer wiring type connector has a plurality of insulating layers integrally laminated, a surface electrode corresponding to an electrode to be inspected of a circuit board to be inspected is formed on a surface of the laminated body, and a tester is formed on a rear surface. A back electrode corresponding to the contact of the inspection connection portion is formed, and the front electrode and the back electrode are arranged on the front surface of the laminate of the insulating layer, the back surface, and the in-plane wiring portion disposed between the respective layers and The in-plane wiring sections are electrically connected to each other by through wiring sections that connect each other.

[0005]

However, in a multi-layer wiring type connector, as will be described in detail below, since a plurality of insulating layers are integrated, an electrode or wiring is added in addition to manufacturing reasons. However, there is a problem that the density cannot be made sufficiently high.

For example, as shown in FIG. 4A, in a multilayer wiring type connector 60 having a three-layer structure, a surface insulating layer 61 is provided.
In the case of electrically connecting the surface electrode A formed on the surface of the above to another surface electrode B, the connection wiring may be most simply formed on the surface of the surface insulating layer 61, Usually, a large number of other electrodes or wiring portions are formed on the surface, and these are wiring-prohibited portions on which connection wiring cannot be provided so as to be overlapped therewith. In FIG. 4A, such a wiring prohibition portion N indicated by a black circle is shown.
Represents not only the surface of the surface insulating layer 61 but also the surface insulating layer 61
And the intermediate insulating layer 62, between the intermediate insulating layer 62 and the back surface insulating layer 63, and also on the surface of the back surface insulating layer 63.

In order to bypass the wiring prohibition portion N or to avoid contact with the wiring prohibition portion N and provide the connection wiring, the surface wiring portion S1 and the in-plane wiring portion S2 between the surface insulating layer 61 and the intermediate insulating layer 62 are required. Extending through the in-plane wiring portion S3 between the intermediate insulating layer 62 and the back surface insulating layer 63, the back surface wiring portion S4 on the surface of the back surface insulating layer 63, and the surface insulating layer 61 in the thickness direction. A through wiring portion T1 electrically connecting electrodes or in-plane wiring portions provided on both surfaces of the layer 61 with each other, a similar through wiring portion T2 formed on the intermediate insulating layer 62, and a similar formed on the back surface insulating layer 63 It is necessary to form and arrange the through wiring portion T3 at an appropriate place.

However, the through-hole interconnection Ta of the surface electrode B in the configuration shown in FIG. 4A continuously connects all of the surface insulating layer 61, the intermediate insulating layer 62, and the back surface insulating layer 63 along a straight line. It is a conductive path that penetrates, and this is relatively easy to manufacture because it is only necessary to form a through hole that penetrates the whole continuously and linearly and arrange a conductive material inside by metal plating or the like, On the other hand, the presence of the all-layer through-wiring portion Ta results in the formation of a wiring-prohibited portion at the same point on all the insulating layers. The benefits of this will be greatly diminished.

In order to reduce such a problem, FIG.
As shown in (b), it extends from the front surface or the back surface, but does not penetrate through all the insulating layers. Instead, it forms a blind hole as a dead-end blind hole, thereby forming a local layer through wiring. It is also known to form a portion Tb. According to such a configuration, the degree of freedom of wiring is increased as compared with the case where a through hole is formed, but, on the other hand, very precise control is required in a work for accurately forming a blind hole. Therefore, the production is not easy and the production cost is high.

As described above, in the conventional adapter device using the multilayer wiring connector, a sufficient resolution cannot be obtained because a sufficiently large degree of freedom of wiring cannot be obtained. However, there is a problem that a device which cannot sufficiently cope with the above-mentioned problems or has a relatively large degree of freedom of wiring is difficult to manufacture and has a high manufacturing cost.

Further, as an adapter device using a multilayer wiring type connector, an adapter device provided with, for example, an anisotropic conductive elastomer layer on the surface of the connector has been developed so as not to damage an electrode to be inspected of a circuit board to be inspected. However, in such a configuration, if the anisotropic conductive elastomer layer is worn due to the circuit board to be inspected being contacted many times, the entire adapter device must be replaced. There is a problem that it is not economical because it must be done.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a sufficiently large wiring degree of freedom, a high resolution, and a sufficient inspection for a circuit board having a high degree of integration. The present invention provides an adapter device for circuit board inspection which can be easily manufactured, has low manufacturing cost, and can economically recover its function when the anisotropic conductive elastomer layer on the surface is worn. It is in.

[0013]

An adapter device for circuit board inspection according to the present invention is interposed between a circuit board to be inspected and a connection portion for inspection of a tester, and an electrode to be inspected of the circuit board and the tester. A circuit board inspection adapter device for electrically connecting a tester connection portion to a tester, wherein a whole plate-shaped front connector arranged on the circuit board side is stacked so as to be separable from the front connector. An overall plate-shaped backup connector disposed between the front connector and the test connection portion of the tester, wherein the front connector comprises: (a) an insulating substrate having only one layer; b) an insulating substrate (a) which is integrally laminated so as to cover the upper surface thereof, has a conductive path forming portion arranged corresponding to the electrode to be inspected of the circuit board, and has a conductive path forming portion which is in contact with the circuit board. Guidance A conductive elastomer layer, (c) a contact electrode formed on the lower surface of the insulating substrate (a) and arranged at a position of a small reference grid point having a small pitch, and (d) a thickness direction of the insulating substrate (a). A conductive path forming portion of the anisotropic conductive elastomer layer (b) formed by a through hole extending so as to electrically connect a contact electrode to the contact electrode; 1
An insulating substrate having only layers, an inner electrode formed at a position corresponding to the contact electrode (c) of the front connector, and an inner electrode formed at (c) on the upper surface of the insulating substrate. The contact electrode (c) is disposed so as to be integrally laminated so as to cover the upper surface of the insulating substrate (a), and is disposed at a reference grid point position where the contact electrode (c) is pressed in a state where the contact electrode (c) is pressed in the thickness direction. An anisotropic conductive elastomer layer having a conductive path forming portion insulated from each other by an insulating portion and forming a projecting portion projecting from the surface of the insulating portion, and being in contact with a lower surface of the front connector; D) A coarse reference grid point formed on the lower surface of the insulating substrate (a) and having a pitch larger than the pitch of the reference grid points related to the conductive path forming portions in the anisotropic conductive elastomer layer (c). External electrode and And a through conductive path formed by a through hole extending in the thickness direction of the insulating substrate (a) and electrically connecting the inner surface electrode (b) and the outer surface electrode (d). D) is electrically connected to the test connection of the tester. Further, the circuit board inspection adapter device of the present invention is interposed between the circuit board to be inspected and the test connection portion of the tester, and the electrode to be tested of the circuit board and the test connection portion of the tester are connected to each other. A circuit board inspection adapter device for electrically connecting the front connector complex, wherein the front connector complex is configured by stacking a plurality of the front connectors, and the front connector complex is stacked separably from each other, The backup connector arranged between the front connector complex and the test connection portion of the tester, wherein the front connector complex is constituted by a plurality of front connectors each having a different shape or size, Thereby, it is confirmed that the plurality of electrode arrangement surfaces are used for inspection of a circuit board provided at different levels. And butterflies.

[0014]

According to the adapter device for circuit board inspection of the present invention, the front connector can be used even when the electrodes to be inspected of the circuit board to be inspected are fine ones having a fine pitch and a high-density complicated pattern. The required electrical connection of the circuit board to the test connection of the tester can be reliably achieved via the and the backup connector.

Since the front connector and the backup connector are separable from each other, when the anisotropic conductive elastomer layer forming the surface of the front connector is worn out, only the front connector needs to be replaced, and the backup connector can be replaced. Can still be used as is. Further, in each of the front connector and the backup connector, the insulating layer is only one layer made of an insulating substrate, and the through conductive path is formed by through holes. Therefore, the manufacturing is easy and the manufacturing cost is low. Since a low-level and substantially multilayer wiring structure is achieved as a whole, an extremely large degree of freedom of wiring is obtained, and it is possible to sufficiently cope with the inspection of a circuit board with a high degree of integration.

[0016]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIG. 1 schematically shows a configuration of a circuit board inspection adapter device 10 according to an embodiment of the present invention, showing a part of a circuit board 12 to be inspected arranged on an upper side and a tester arranged on a lower side. FIG. 6 is an explanatory cross-sectional view shown together with an inspection connection portion 15. Reference numeral 13 denotes an electrode to be inspected on the circuit board 12.

The adapter device 10 includes a circuit board 12
Side plate-shaped front connector 20
And a backup connector 3 which is disposed in a plate-like shape and is entirely stacked below the front connector 20.
0, which are manufactured independently and stacked so as to be separable from each other.

The front connector 20 has an insulating substrate 21 made of an appropriate resin, and an anisotropic conductive elastomer layer 22 is integrally provided so as to cover the upper surface of the insulating substrate 21. In the anisotropic conductive elastomer layer 22, a conductive path forming portion 23 extending in the thickness direction and electrically insulated from an adjacent one is provided with a pattern corresponding to the electrode 13 to be inspected of the circuit board 12, That is, it is formed in a shape and position according to the pattern opposite to the pattern of the electrode 13 to be inspected and slightly protruding outward. On the lower surface of the insulating substrate 21, the contact electrode 25 is formed at an appropriate position at a small reference grid point having a small pitch.

An upper surface electrode 24 is formed on the upper surface of the insulating substrate 21 so as to be located over the entire region immediately below the conductive path forming portion 23 of the anisotropic conductive elastomer layer 22. An upper surface wiring portion 27 connected to the upper surface electrode 24 is formed. On the lower surface of the insulating substrate 21, a lower surface wiring portion 28 connected to the contact electrode 25 is formed as necessary.

Further, a penetrating conductive path 26 extending through the insulating substrate 21 in the thickness direction is formed, thereby forming a conductive path forming portion 23 of the anisotropic conductive elastomer layer 22 at, for example, a position immediately below the conductive path forming portion 23. Alternatively, the contact electrode 25 existing in the vicinity thereof is electrically connected. In the insulating substrate 21, the position at which the through conductive path 26 is formed is such that the through conductive path 26 is formed between the upper surface electrode 24 and the contact electrode 2.
5, the upper surface wiring portion 27 and the contact electrode 25 are directly connected, the upper surface electrode 24 and the lower surface wiring portion 28 are directly connected, and the upper surface wiring portion 27 is connected.
The position may be any position where the mode and the lower surface wiring portion 28 are directly connected.

The backup connector 30 has an insulating substrate 31 made of an appropriate resin.
Is formed on the upper surface of one or more anisotropic conductive elastomer layers 32 corresponding to the contact electrodes 25 of the front connector 20.
The inner surface electrode 34 is positioned immediately below the conductive path forming portion 33 of FIG.
Are formed, and if necessary, an inner wiring portion 37 connected to the inner electrode 34 is formed.

Further, an anisotropic conductive elastomer layer 32 is laminated and provided integrally so as to cover the entire upper surface of the insulating substrate 31 on which the inner electrode 34 and the inner wiring portion 37 are formed. In the anisotropic conductive elastomer layer 32, a number of conductive path forming portions 33 each extending in the thickness direction and electrically insulated from the adjacent ones are provided with a front connector in a state where the conductive path forming portions 33 are pressed in the thickness direction. At all of the reference grid point positions where the 20 contact electrodes 25 are pressed, the contact electrodes 25 are formed so as to protrude slightly upward.

On the lower surface of the insulating substrate 31, a conductive path is formed in the anisotropic conductive elastomer layer 32 corresponding to the connection contact 16 arranged at the standard grid point position in the test connection section 15 of the tester. An outer surface electrode 35 is provided at a coarse reference grid point position having a pitch larger than the pitch of the reference grid points according to the portion 33.
An external wiring portion 38 connected to the external electrode 35 is formed.

Then, a penetrating conductive path 36 extending through the insulating substrate 31 in the thickness direction is formed, and thereby the inner electrode 34 and the outer electrode 35 are electrically connected. In the insulating substrate 31, the position where the through conductive path 36 is formed is such that the through conductive path 36 directly connects the inner electrode 34 and the outer electrode 35, and the inner wiring portion 37 and the outer electrode 35 are directly connected. To the internal electrode 34 and the external wiring portion 38, and to the internal wiring portion 37 and the external wiring portion 38.

In the above, the material of the insulating substrate 21 of the front connector 20 and the material of the insulating substrate 31 of the backup connector 30 are all preferably heat-resistant materials having high dimensional stability, and various resins may be used. In particular, glass fiber reinforced epoxy resin is most suitable.

The anisotropic conductive elastomer layer 32 of the backup connector 30 is formed integrally with or adhered to the surface of the insulating substrate 31. As shown in FIG. 2, the anisotropic conductive elastomer layer 32 is adjacent to a large number of conductive path forming portions 33 each of which is formed by densely filling conductive particles P in an insulating elastic polymer substance E. The components are insulated from each other by the insulating portion 40. In each of the conductive path forming portions 33, the conductive particles P are oriented so as to be arranged in the thickness direction, and a conductive path extending in the thickness direction is formed. The conductive path forming part 33 may be a pressurized conductive part in which a conductive path is formed by reducing a resistance value when compressed and compressed in the thickness direction. On the other hand, the insulating portion 40 does not form a conductive path in the thickness direction even when pressed.

In the illustrated example, on the outer surface of the anisotropic conductive elastomer layer 32, the conductive path forming portion 33 forms a projecting portion projecting from the surface of the insulating portion 40. According to such a configuration, the anisotropic conductive elastomer layer 32
When the material is pressed in the thickness direction, the degree of compression is
Since the conductive path is larger in the conductive path forming portion 33, a conductive path having a sufficiently low resistance value is reliably formed, thereby making it possible to reduce the degree of change in the resistance value with respect to a change or change in the pressing force. As a result, the anisotropic conductive elastomer layer 3
Even if the pressing force applied to 2 is not uniform, the intended electrical connection can be reliably achieved.

Projection height h of the projecting portion of the conductive path forming portion 33
Is the total thickness t of the anisotropic conductive elastomer layer 32 (t = h +
d and d are the thickness of the insulating part 40. ) Is preferably 8% or more. Further, the anisotropic conductive elastomer layer 32
Is 300% or less of the electrode pitch p defined as the distance between the centers of the conductive path forming portions 33, that is, t ≦ 3p
It is preferable that By satisfying such a condition, even when the pressing force applied to the conductive path forming section 33 changes, the change in conductivity of the conductive path forming section 33 due to the change is sufficiently suppressed. is there.

It is not always necessary that the entire surface of the projecting portion of the conductive path forming portion 33 has conductivity. For example, a portion of the projecting portion where no conductive path is formed at 20% or less of the electrode pitch exists at the periphery. May be. Further, it is preferable that the minimum value of the separation distance r between the adjacent conductive path forming portions 33 is 10% or more of the width R of the conductive path forming portion 33. By satisfying such conditions, it is possible to sufficiently avoid the possibility that the adjacent conductive path forming portions 33 are electrically contacted with each other due to lateral displacement when the protrusion is deformed by being pressed. can do. In the above example,
The planar shape of the conductive path forming portion 33 can be a circle having a required area or any other appropriate shape.

The conductive particles P in the conductive path forming portion 33 include, for example, particles of a metal exhibiting magnetism such as nickel, iron, and cobalt, or particles of an alloy thereof, or gold, silver, palladium, rhodium, or the like. And those obtained by plating inorganic particles such as nonmagnetic metal particles or glass beads or polymer particles with a conductive magnetic material such as nickel or cobalt.

The particle size of the conductive particles is 3 to 20 so that the conductive path forming portion 33 can be easily deformed under pressure and sufficient electrical contact can be obtained between the conductive particles in the conductive path forming portion 33.
It is preferably 0 μm, particularly preferably 10 to 100 μm.

As the insulating and elastic polymer material E constituting the conductive path forming portion 33, a polymer material having a crosslinked structure is preferable. Examples of curable polymer materials that can be used to obtain a crosslinked polymer include silicone rubber, polybutadiene, natural rubber, polyisoprene, styrene-butadiene copolymer rubber, and acrylonitrile-butadiene copolymer rubber. , Ethylene-propylene copolymer rubber, urethane rubber, polyester rubber, chloroprene rubber, epichlorohydrin rubber, and soft liquid epoxy resin.

Specifically, a material for a polymer substance which is in a liquid state before the curing treatment and which is integrated with the insulating substrate 31 while maintaining a close contact state or an adhesion state after the curing treatment is preferable. From such a viewpoint, suitable materials for polymer substances include liquid silicone rubber, liquid urethane rubber, and soft liquid epoxy resin. An additive such as a silane coupling agent or a titanium coupling agent can be added to the polymer substance material in order to improve the adhesion of the anisotropic conductive elastomer layer 32 to the insulating substrate 31.

As a material for forming the insulating portion 40, the same or different material as the polymer for forming the conductive path forming portion 33 can be used. Alternatively, one that is integrated with the insulating substrate 31 while maintaining the adhesive state is used.

The anisotropic conductive elastomer layer 22 of the front connector 20 is also formed integrally with or adhered to the surface of the insulating substrate 21. The anisotropic conductive elastomer layer 22 is basically as described above, except that the position and the planar shape of the conductive path forming portion 23 are the position and the shape corresponding to the electrode 13 to be inspected of the circuit board 12. The backup connector 30 may have the same configuration as the anisotropic conductive elastomer layer 32 of the backup connector 30.

The adapter device having the above-described configuration is configured such that the front connector 2 is mounted on the backup connector 30.
The circuit board 12 to be inspected is located on the upper surface side of the anisotropic conductive elastomer layer 22 of the front connector 20 and the tester is inspected on the lower surface side of the backup connector 30 in a state where the 0s are positioned and stacked. It is arranged so that the connection part 15 for use may be located. Then, the front connector 20 and the backup connector 30 are pressed between the circuit board 12 and the test connection portion 15 of the tester in the thickness direction (vertical direction in FIG. 1) by appropriate pressing means. You.

In such a state, the circuit board 12
The electrode 13 to be inspected is pressed by the conductive path forming portion 23 of the anisotropic conductive elastomer layer 22 of the front connector 20, thereby being electrically connected to the contact electrode 25 via the through conductive path 26. Become. At the same time, the contact electrode 25 of the front connector 20 is pressed by the conductive path forming portion 33 of the anisotropic conductive elastomer layer 32 of the backup connector 30, whereby the contact electrode 25 is connected to the external electrode 35 via the inner electrode 34 and the through conductive path 36. It is in a state of being electrically connected. Then, the outer surface electrode 35 is brought into contact with the test connection portion 15 of the tester to be electrically connected.

As a result, the electrode 13 to be inspected on the circuit board 12
Is electrically connected to the test connection portion 15 of the tester by the adapter device 10 including the front connector 20 and the backup connector 30, and in this state, the electrode 13 to be tested on the circuit board 12 is An inspection of the electrical connection state is performed by a tester. At this time, the electrode 13 to be inspected on the circuit board 12
Since the anisotropically conductive elastomer layer 22 which is flexible and rich in elasticity is directly in contact with the surface where is located, the surfaces of the electrodes 13 to be inspected and the circuit board 12 are not damaged.

In the adapter device having the above configuration,
Front connector 20 and backup connector 30
Are formed independently of each other, so that both surfaces of the insulating substrate in each of them can be used as the wiring portion forming surface. That is, in the example of FIG. 1, the upper wiring portion 27 and the lower wiring portion 28 can be formed on the insulating substrate 21 of the front connector 20, and the inner wiring portion 37 and the outer wiring portion 37 can be formed on the insulating substrate 31 of the backup connector 30. The wiring part 38 can be formed.

Further, in each of the insulating substrates 21 and 31, in order to form the through conductive path 26 and the through conductive path 36, a hole penetrating through each of the insulating substrates 21 and 31 is formed. Therefore, it is not necessary to form a through-hole that continuously and linearly penetrates all of the plurality of stacked insulating layers, and thus it is possible to obtain a large degree of freedom in wiring, and The whole is easy to manufacture and the cost is low.

This becomes clearer when, for example, the adapter device of the above embodiment is compared with the configuration of FIG. That is, in the adapter device of the above embodiment, the surfaces that can be used as the wiring portion forming surfaces are both surfaces of each of the insulating substrates 21 and 31, that is, a total of four surfaces. It is sufficient to simply form a hole that penetrates one insulating substrate. On the other hand, in the example of FIG. 4, the surface that can be used as the wiring portion forming surface is the surface of the surface insulating layer 61, the inner surfaces of the surface insulating layer 61 and the intermediate insulating layer 62, and the intermediate insulating layer 62 and the back surface insulating layer 6.
3 and the surface of the backside insulating layer 63 in total, it is necessary to form a through hole extending continuously through all of the plurality of insulating substrates, or a blind hole in a dead end shape. Must be formed.

In the backup connector 30, the position of the conductive path forming portion 33 of the anisotropic conductive elastomer layer 32 is determined by the contact electrode 2 of the front connector 20.
5 is set as a reference grid point position to be pressed, and the position of the outer surface electrode 35 is set as a coarse reference grid point position larger than the pitch of the reference grid points related to the conductive path forming portion 33. Even if the arrangement of the electrodes 13 to be inspected on the substrate 12 is fine and dense, it is possible to easily achieve a state where each of the electrodes 13 is electrically connected to the inspection connection portion 15 of the tester without fail. High resolution and high reliability are obtained.

In a specific example of the adapter device having the above configuration, the pitch of the fine reference grid points related to the contact electrode 25 is 0.2 mm, and the pitch of the coarse reference grid points related to the outer electrode 35 is 2.54 mm. , These can be set or changed freely.

Further, when the inspection is performed a number of times, the anisotropic conductive elastomer layer 22 of the front connector 20 to which the circuit board is repeatedly contacted and pressed is gradually worn, but the front connector 20 is not backed up. Because it is configured to be separable from the connector 30, there is no need to replace the entire adapter device,
If only the front connector 20 is replaced, the backup connector 30 can be used as it is, so that the function of the initial adapter device can be economically restored.

The front connector and the backup connector in the adapter device of the present invention both have a single insulating substrate as a base and are not integrally laminated with other insulating substrates. With a very small possibility of causing deformation, always high flatness and high dimensional stability can be obtained, and both having an anisotropic conductive elastomer layer,
A plurality of elastomer layers are interposed between the circuit board to be inspected and the test connection part of the tester. As a result, the surface direction of the circuit board, the front connector and the backup connector, the test connection part of the tester, etc. Dimensional displacement can be sufficiently absorbed, so that a good clamping state can be achieved between the circuit board and the test connection of the tester. Inspection can be performed.

The anisotropic conductive elastomer layers 22 and 3
2 are formed integrally with the insulating substrates 21 and 31, so that the anisotropic conductive elastomer layers 22 and 3 are protected against environmental changes such as heat history due to temperature changes.
There is no displacement such as displacement between the insulating substrate 2 and the insulating substrates 21 and 31.

In the present invention, the anisotropic conductive elastomer layer of the front connector is not limited to the one in which each conductive path forming portion is formed so as to protrude from the periphery thereof, and has a flat surface. It may be something. Further, in the front connector and the backup connector, it is not essential that both anisotropic conductive elastomer layers have basically the same configuration, and each has an appropriate configuration depending on the purpose. be able to.

The embodiment of the present invention has been described above. However, in the present invention, the thickness between the front connector 20 and the backup connector 30 or between the backup connector 30 and the test connection portion of the tester is determined. A suitable anisotropic conductive connector having a conductive path in the direction, for example, a connector having the same configuration as the front connector 20 or the backup connector 30 may be additionally provided. In this case, the electrode pitch of each connector may be changed. By appropriately setting, it is possible to obtain a higher resolution.

The circuit board to be inspected by the adapter device of the present invention is not particularly limited, and an electrical inspection can be performed on electrodes to be inspected on various circuit boards. Further, the tester and the inspection connection portion are not particularly limited as long as the adapter device of the present invention can be clamped between the tester and the circuit board. Also, the test connection part of the tester does not need to be provided integrally with the tester body,
It may be of an independent configuration electrically connected to the tester.

In the present invention, a plurality of front connectors each having a different shape or size are stacked to form a front connector composite, so that a plurality of electrode arrangement surfaces are provided at different levels as in a so-called dug-out circuit board. The circuit board provided with is also an inspection target.

FIG. 5 is an explanatory perspective view showing the basic structure of the dug-out circuit board, and FIG. 6 is a sectional view for explaining the arrangement and wiring of the integrated circuit chips in the dug-out circuit board of FIG. The digging circuit board 70 in the illustrated example includes:
The whole is, for example, a rectangular plate-shaped multilayer wiring board, and a first rectangular recess 71A having a dimension smaller than the outer dimension of the circuit board 70 is formed in a central region of one surface thereof. As a result, the region remaining on the one surface forms a rectangular frame-shaped first electrode placement surface 70A surrounding the opening of the first recess 71A.

The first recess 71A has a bottom surface formed with a planar rectangular second recess 71B having a size smaller than that of the first recess 71A in a central region thereof.
A rectangular frame-shaped second electrode placement surface 70B is formed in the outer peripheral region. Further, a third rectangular concave portion 71C having a smaller dimension is similarly formed on the bottom surface of the second concave portion 71B to form a rectangular frame-shaped third electrode disposing surface 70C. Have been. A rectangular central through hole 72 smaller than the size of the third recess 71C is formed on the bottom surface of the third recess 71C,
The chip placement step 73 in the form of a rectangular frame is left and formed.

In the dug-out circuit board 70 having such a structure, as shown in FIG. 6, a so-called naked integrated circuit chip 80 is arranged and fixed on the step surface of the chip arrangement step 73, and A predetermined number of electrodes 80 are connected via a suitable wiring 75 to a total of three electrode placement surfaces 70A.
To 70C, and are electrically connected to the corresponding terminal electrodes 76A to 76C formed on any of 70C to 70C.

Therefore, in the buried circuit board 70,
The electrode arrangement surface to be formed on one surface is divided into a plurality (three in the illustrated example) of surface portions, each of which surrounds the integrated circuit chip 80 at a different level in a stepwise manner. For this reason, by forming the dug-out circuit board 70 as a multilayer wiring board, the desired electrical connection is reliably established by the wiring 75 to the electrodes of the fine and high-density integrated circuit chip 80. Can be achieved.

However, in such a buried circuit board 70, since a plurality of electrode arrangement surfaces are provided at different levels in the thickness direction of the substrate, the electrodes to be inspected arranged on one plane are provided. In a normal circuit board inspection device that is configured to be in contact with the electrode, it is possible to realize a state in which the inspection connection portion is electrically connected to all the electrodes to be inspected on all electrode arrangement surfaces simultaneously or simultaneously. Very difficult. For this reason, actually, it is necessary to perform the inspection for each electrode arrangement surface, and as a result, there is a problem that the efficiency of the inspection is extremely low.

However, according to the present invention, as described in detail below, even a dug-out circuit board can be used as a circuit board to be inspected, and a desired inspection can be performed very easily. An inspection adapter device can be constructed.

FIG. 3 is a cross-sectional view for explaining an example of the circuit board inspection adapter device of the present invention configured to be applicable to the inspection of a dug circuit board. In FIG.
The dug-out circuit board 70 is shown with each of the electrode placement surfaces 70A-70C facing downward, and each of these
The electrodes to be inspected 77A to 77C are formed to slightly protrude.

Then, a backup spacer 82 having a thickness equal to the depth of the third through hole 71C is provided in the central through hole 72, and the third indent 71C is provided in the third indent 71C.
A simulation chip 83 having a shape conforming to the above is arranged. 77D is a ground electrode connected to an integrated circuit chip to be arranged later.

In the second recess 71B of the dug-out circuit board 70, a third front connector 20C having a shape conforming to the second recess 71B is arranged. The central area is the simulation chip 83
And the outer peripheral region faces the third electrode arrangement surface 70C. In the first recess 71A, there is provided a second shape having a shape conforming to the first recess 71A.
Are arranged such that the central region of the second front connector 20B faces the third front connector 20C and the outer peripheral region faces the second electrode placement surface 70B. Furthermore, this second
Front connector 20B and first electrode arrangement surface 70
A first front connector 20A is disposed on the outer surface side of the first front connector 20A, and a central region of the first front connector 20A faces the second front connector 20B, and an outer peripheral region faces the first electrode placement surface 70A. It is said.

Then, the first front connector 20A
A backup connector 30 is arranged on the outer surface of the tester, and the test connection 15 of the tester is arranged through the backup connector 30. 90 is an elastic body for pressing.

The first front connector 20A to the third front connector 20C have the same basic configuration as the above-described front connector, and include an insulating substrate and an anisotropic conductive member integrally provided therewith. The conductive path forming portion is formed in the outer peripheral region of the anisotropic conductive elastomer layer in a pattern corresponding to a corresponding electrode to be inspected. That is, the electrode 77A to be inspected on the first electrode arrangement surface 70A in the outer peripheral region of the first front connector 20A, the electrode 77B to be inspected on the second electrode arrangement surface 70B in the outer peripheral region of the second front connector 20B, And the third front connector 20C
The electrodes 77 to be inspected on the third electrode arrangement surface 70C
A conductive path forming portion is provided in a pattern that matches C.

According to such a configuration, in a state where the entirety is pressed via the pressing elastic body 90 or the like, the third front connector 20C directly contacts the third electrode arrangement surface 70C in the outer peripheral region. The electrode to be inspected 77C
, And eventually functions as the above-described front connector with respect to the electrode to be inspected 77C. Also, the second front connector 20B
Is in direct contact with the second electrode placement surface 70B in its outer peripheral region and elastically comes into contact with the electrode under test 77B, and ultimately functions as a front connector with respect to the electrode under test 77B. At the same time, it functions as a backup connector for the third front connector 20C. Further, similarly, the first front connector 20A is directly in contact with the first electrode arrangement surface 70A in the outer peripheral region and elastically contacts the electrode 77A to be inspected.
A functions as a front connector to A, and simultaneously functions as a backup connector to the second front connector 20B.

As described above, according to the above-described adapter device for circuit board inspection, the circuit board to be inspected having the electrodes to be inspected provided on the plurality of electrode placement surfaces located at different levels from each other can be used. By stacking and arranging a plurality of front connectors, it is possible to obtain a state in which at least a part of the front surface of any of the front connectors is directly in contact with any of the electrode arrangement surfaces. On the other hand, the state in which the intended electrical connection has been achieved can be realized reliably and very easily.
That is, when a so-called dug circuit board is used as a circuit board to be inspected, the number of steps, the height, the shape, and the like of the dug circuit board vary, but according to the configuration of the present invention, The number of front connectors and their respective shapes are appropriately selected according to the condition of the circuit board to be inspected, and the front connector composite is constructed by combining them so as to stack them, thereby ensuring the circuit to be inspected. It is possible to construct a circuit board inspection adapter device having a contact surface corresponding to the electrode arrangement surface of the board.

[0064]

According to the adapter device for circuit board inspection of the present invention, even when the electrodes to be inspected of the circuit board to be inspected are fine ones having a fine pitch and a high-density complicated pattern, The required electrical connection of the circuit board to the test connection of the tester can be reliably achieved via the front connector and the backup connector.

According to the adapter device for inspecting a circuit board of the present invention, the front connector and the backup connector can be separated from each other, so that when the anisotropic conductive elastomer layer forming the surface of the front connector is worn out. In this case, only the front connector needs to be replaced, and the backup connector can be used continuously, so that the initial function can be economically restored. Further, in each of the front connector and the backup connector, the insulating layer is only one layer made of an insulating substrate, and the through conductive path is formed by a through hole. Moreover, since a multilayer wiring structure is substantially achieved as a whole, an extremely large degree of freedom of wiring is obtained, and it is possible to sufficiently cope with the inspection of a circuit board with a high degree of integration.

Further, by stacking a plurality of front connectors each having a different shape or size to form a front connector composite, a plurality of electrode arrangement surfaces are provided at different levels as in a so-called digging circuit board. The circuit board that is in use can also be inspected.

[Brief description of the drawings]

FIG. 1 is an explanatory cross-sectional view schematically showing a configuration of a circuit board inspection adapter device according to one embodiment of the present invention, together with a part of a circuit board to be inspected and an inspection connection portion of a tester.

FIG. 2 is an enlarged cross-sectional view for explaining an example of an anisotropic conductive elastomer layer portion in the adapter device of FIG.

FIG. 3 is an explanatory diagram showing a configuration of a circuit board inspection adapter device according to the present invention, in which a front connector complex is formed by a plurality of front connectors, which is suitable for a case where a dug-out circuit board is used as a circuit board to be inspected. It is sectional drawing.

4A and 4B are explanatory views of a multilayer wiring type connector, in which (a) has a through hole formed and (b) has a blind hole formed.

FIG. 5 is an explanatory perspective view showing a basic configuration of a dug-out circuit board.

6 is a cross-sectional view for explaining the arrangement and wiring of integrated circuit chips on the dug-out circuit board of FIG. 5;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Adapter device 12 Circuit board 13 Electrode under test 15 Inspection connection part 20 Front connector 20A First front connector 20B Second front connector 20C Third front connector 21 Insulating substrate 22 Anisotropic conductive elastomer layer 23 Conductive path Forming part 24 Upper electrode 25 Contact electrode 26 Through conductive path 27 Upper wiring part 28 Lower wiring part 30 Backup connector 31 Insulating substrate 32 Anisotropic conductive elastomer layer 33 Conducting path forming part 34 Inner electrode 16 Connection contact 35 Outer electrode 36 Penetration conductive path 37 Inner surface wiring part 38 Outer surface wiring part 40 Insulating part P Conductive particle E Polymer substance 60 Multilayer wiring type connector 61 Surface insulating layer A, B Surface electrode 62 Intermediate insulating layer 63 Back insulating layer N No wiring prohibited area S1 Surface Wiring part S2, S3 In-plane distribution Line part S4 Back wiring part T1, T2, T3 Through wiring part Ta All-layer through wiring part Tb Local-layer through wiring part 70 Digged circuit board 70A First electrode placement surface 70B Second electrode placement surface 70C Third electrode placement surface 71A First recess 71B Second recess 71C Third recess 72 Central through hole 73 Chip arrangement step 75 Wires 76A to 76C
Terminal electrodes 77A to 77C Electrodes to be inspected 77D Ground electrode 80 Integrated circuit chip 82 Backup spacer 83 Simulated chip 90 Elastic body for pressing

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G01R 31/28 E

Claims (2)

[Claims] 1. A circuit board interposed between a circuit board to be tested and a test connection of a tester, and electrically connecting an electrode to be tested on the circuit board and a test connection of the tester. An inspection adapter device, which is a plate-shaped front connector disposed on the circuit board side, is stacked separably with the front connector, and is disposed between the front connector and a test connection portion of the tester. The front connector includes a plate-shaped backup connector, and the front connector includes: (a) an insulating substrate having only one layer; and (b) an integrated substrate covering the upper surface of the insulating substrate (a). An anisotropic conductive elastomer layer having a conductive path forming portion provided in a laminated manner and corresponding to the electrode to be inspected on the circuit board and in contact with the circuit board; ) And (d) an anisotropic conductive elastomer layer (b) formed by through holes extending in the thickness direction of the insulating substrate (a). ), A through conductive path for electrically connecting the conductive path forming portion and the contact electrode, wherein the backup connector comprises: (a) an insulating substrate having only one layer; and (b) an insulating substrate (a). A) an inner surface electrode formed at a position corresponding to the contact electrode (c) of the front connector on the upper surface of (a); and (c) an upper surface of the insulating substrate (a) on which the inner surface electrode is formed. Provided at a reference grid point where the contact electrode (c) is pressed in a state where the contact electrode is pressed in the thickness direction. Protruding protrusion And (d) the anisotropically conductive elastomer layer formed on the lower surface of the insulating substrate (a) and having an electrically conductive path forming portion for forming An outer electrode disposed at a coarse reference grid point having a pitch larger than the pitch of the reference grid points related to the conductive path forming portions in the elastomer layer (c); and (e) extending in the thickness direction of the insulating substrate (a). A through conductive path formed by a through hole for electrically connecting the inner surface electrode (b) and the outer surface electrode (d), wherein the outer surface electrode (d) is electrically connected to a test connection portion of the tester. An adapter device for inspecting a circuit board, wherein the adapter device is connected to a device. 2. A circuit board interposed between a circuit board to be inspected and a test connection part of the tester, and electrically connecting an electrode to be tested of the circuit board and the test connection part of the tester. An inspection adapter device, comprising: a front connector complex formed by stacking a plurality of front connectors according to claim 1; and a front connector complex that is separably stacked with the front connector complex. The backup connector according to claim 1, which is disposed between the body and the test connection part of the tester, wherein the front connector complex is constituted by a plurality of front connectors each having a different shape or size. Wherein the plurality of electrode arrangement surfaces are provided at different levels for use in inspection of a circuit board. Coater apparatus.