JPH02118275U - - Google Patents
Info
- Publication number
- JPH02118275U JPH02118275U JP2643189U JP2643189U JPH02118275U JP H02118275 U JPH02118275 U JP H02118275U JP 2643189 U JP2643189 U JP 2643189U JP 2643189 U JP2643189 U JP 2643189U JP H02118275 U JPH02118275 U JP H02118275U
- Authority
- JP
- Japan
- Prior art keywords
- contact
- board
- bonding part
- shot
- open inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 claims description 6
- 230000002950 deficient Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 1
Description
第１〜４図は、本考案の実施例を示し、第１図
概略構成図、第２図ａ，ｂは使用状態を説明する
ための構成図、第３図は基板の斜視図、第４図は
第３図の断面図、第５図は従来方式による概略構
成図である。
１……ＩＣ基板（ＰＧＡ基板）、２……基板移
送機構、３……接触部材上下動機構、４……シヨ
ートオープン検査機、５……検査部、６ａ……コ
ンベア、６ｂ……基板脱着部、７……キヤビテイ
部、８……ワイヤボンデイング部、９……内部配
線、１０……リード、１１……接触部材、１２…
…シリンダー、１３……ロツド、１４……下方突
出部、１５……基板押さえ部材、１６……プロー
ブ、１７……検査機本体。
1 to 4 show an embodiment of the present invention, FIG. 1 is a schematic configuration diagram, FIGS. 2 a and b are configuration diagrams for explaining the usage state, FIG. The figure is a sectional view of FIG. 3, and FIG. 5 is a schematic diagram of the conventional system. DESCRIPTION OF SYMBOLS 1... IC board (PGA board), 2... Board transfer mechanism, 3... Contact member vertical movement mechanism, 4... Shoot open inspection machine, 5... Inspection section, 6a... Conveyor, 6b... Board Detachable part, 7... Cavity part, 8... Wire bonding part, 9... Internal wiring, 10... Lead, 11... Contact member, 12...
... cylinder, 13 ... rod, 14 ... downward protrusion, 15 ... board holding member, 16 ... probe, 17 ... inspection machine body.
Claims (1)
接する導電性柔軟材よりなる接触部材と、該ＩＣ
基板より導出するリードに接続して該リードの良
・不良状態を検出するためのシヨートオープン検
査機と、上記接触部材をボンデイング部に接触状
態または非接触状態とするボンデイング部シヨー
ト手段とを有し、該接触部材のボンデイング部へ
の接触状態と非接触状態で上記シヨートオープン
検査機によりＩＣ基板の内部配線とリードの良・
不良状態を検査できるようにしたことを特徴とす
るシヨート・オープン検査装置。 A contact member made of a conductive flexible material that comes into contact with a bonding part of an IC board such as a PGA board, and the IC board.
A shot open inspection device connects to a lead led out from a substrate to detect whether the lead is good or bad, and a bonding part shot means brings the contact member into contact or non-contact with the bonding part. Then, check whether the internal wiring and leads of the IC board are good or not using the shot open inspection machine while the contact member is in contact with the bonding part and in a non-contact state.
A shot open inspection device characterized by being able to inspect defective conditions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2643189U JPH02118275U (en) | 1989-03-07 | 1989-03-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2643189U JPH02118275U (en) | 1989-03-07 | 1989-03-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02118275U true JPH02118275U (en) | 1990-09-21 |
Family
ID=31248047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2643189U Pending JPH02118275U (en) | 1989-03-07 | 1989-03-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02118275U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002162430A (en) * | 2001-08-24 | 2002-06-07 | Jsr Corp | Adaptor device for inspecting circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56110060A (en) * | 1980-02-06 | 1981-09-01 | Nec Corp | Inspecting method and device for base plate of circuit |
-
1989
- 1989-03-07 JP JP2643189U patent/JPH02118275U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56110060A (en) * | 1980-02-06 | 1981-09-01 | Nec Corp | Inspecting method and device for base plate of circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002162430A (en) * | 2001-08-24 | 2002-06-07 | Jsr Corp | Adaptor device for inspecting circuit board |
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