JPH0388175U - - Google Patents

Info

Publication number
JPH0388175U
JPH0388175U JP14791989U JP14791989U JPH0388175U JP H0388175 U JPH0388175 U JP H0388175U JP 14791989 U JP14791989 U JP 14791989U JP 14791989 U JP14791989 U JP 14791989U JP H0388175 U JPH0388175 U JP H0388175U
Authority
JP
Japan
Prior art keywords
contact
board
contact member
bonding part
shot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14791989U
Other languages
Japanese (ja)
Other versions
JP2577525Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989147919U priority Critical patent/JP2577525Y2/en
Publication of JPH0388175U publication Critical patent/JPH0388175U/ja
Application granted granted Critical
Publication of JP2577525Y2 publication Critical patent/JP2577525Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１〜４図は、本考案の実施例を示し、第１図
は概略構成図、第２図ａ，ｂは使用状態を説明す
るための構成図、第３図は基板の斜視図、第４図
は第３図の断面図、第５図は従来方式による概略
構成図である。 １……ＩＣ基板（ＰＧＡ基板）、２……基板押
さえ機構、３……接触部材位置調整・上下動機構
、４……シヨートオープン検査機、５……検査部
、６ａ……基板押さえ板、６ｂ……基板押さえシ
リンダ、７……キヤビテイ部、８……ワイヤボン
デイング部、９……内部配線、１０……リード、
１１……接触部材、１２……シリンダー、１３…
…ロツド、１４……上方突出部、１６……プロー
ブ、１７……検査機本体、２０……Ｘステージ、
２１……Ｙステージ、２２……内面鏡、２３……
鏡出入用シリンダ、２４，２５……カメラ、２６
……位置決め装置、２７……制御装置、２８……
モータ。 1 to 4 show an embodiment of the present invention, in which FIG. 1 is a schematic configuration diagram, FIGS. 2a and 2b are configuration diagrams for explaining usage conditions, and FIG. 4 is a sectional view of FIG. 3, and FIG. 5 is a schematic diagram of the conventional system. 1... IC board (PGA board), 2... Board holding mechanism, 3... Contact member position adjustment/vertical movement mechanism, 4... Short open inspection machine, 5... Inspection section, 6a... Board holding plate , 6b... Board holding cylinder, 7... Cavity part, 8... Wire bonding part, 9... Internal wiring, 10... Lead,
11...Contact member, 12...Cylinder, 13...
...Rod, 14...Upper protrusion, 16...Probe, 17...Inspection machine body, 20...X stage,
21...Y stage, 22...inner mirror, 23...
Mirror entry/exit cylinder, 24, 25...Camera, 26
...Positioning device, 27...Control device, 28...
motor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ＰＧＡ基板等のＩＣ基板のボンデイング部と当
接する導電性柔軟材よりなる接触部材と、該ＩＣ
基板より導出するリードに接続して該リードの良
・不良状態を検出するためのシヨートオープン検
査機と、上記接触部材をボンデイング部に接触状
態または非接触状態とするボンデイング部シヨー
ト手段とを有し、該接触部材のボンデイング部へ
の接触状態と非接触状態で上記シヨートオープン
検査機によりＩＣ基板の内部配線とリードの良・
不良状態を検査できるようにしたシヨート・オー
プン検査装置において、上記ＩＣ基板のキヤビテ
イ部と、上記接触部材との位置関係を相対的に調
整するための位置調整手段を設け、該位置調整手
段により上記接触部材の位置補正を行えるように
したことを特徴とするシヨート・オープン検査装
置。 A contact member made of a conductive flexible material that comes into contact with a bonding part of an IC board such as a PGA board, and the IC board.
A shot open inspection device connects to a lead led out from a substrate to detect whether the lead is good or bad, and a bonding part shot means brings the contact member into contact or non-contact with the bonding part. Then, check whether the internal wiring and leads of the IC board are good or not using the shot open inspection machine while the contact member is in contact with the bonding part and in a non-contact state.
In a shot open inspection device capable of inspecting a defective state, a position adjustment means is provided for relatively adjusting the positional relationship between the cavity portion of the IC board and the contact member, and the position adjustment means allows the above-mentioned contact member to be inspected. A shot open inspection device characterized by being able to correct the position of a contact member.
JP1989147919U 1989-12-23 1989-12-23 Short / open inspection equipment Expired - Lifetime JP2577525Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989147919U JP2577525Y2 (en) 1989-12-23 1989-12-23 Short / open inspection equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989147919U JP2577525Y2 (en) 1989-12-23 1989-12-23 Short / open inspection equipment

Publications (2)

Publication Number Publication Date
JPH0388175U true JPH0388175U (en) 1991-09-09
JP2577525Y2 JP2577525Y2 (en) 1998-07-30

Family

ID=31694390

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989147919U Expired - Lifetime JP2577525Y2 (en) 1989-12-23 1989-12-23 Short / open inspection equipment

Country Status (1)

Country Link
JP (1) JP2577525Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002162430A (en) * 2001-08-24 2002-06-07 Jsr Corp Adaptor device for inspecting circuit board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4849473A (en) * 1971-10-22 1973-07-12
JPS5441171U (en) * 1977-08-26 1979-03-19
JPS63275200A (en) * 1987-05-07 1988-11-11 Fujitsu Ltd Method of positioning for multi-terminal component

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4849473A (en) * 1971-10-22 1973-07-12
JPS5441171U (en) * 1977-08-26 1979-03-19
JPS63275200A (en) * 1987-05-07 1988-11-11 Fujitsu Ltd Method of positioning for multi-terminal component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002162430A (en) * 2001-08-24 2002-06-07 Jsr Corp Adaptor device for inspecting circuit board

Also Published As

Publication number Publication date
JP2577525Y2 (en) 1998-07-30

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