JPH05159821A - Circuit substrate inspection device - Google Patents
Circuit substrate inspection deviceInfo
- Publication number
- JPH05159821A JPH05159821A JP3085726A JP8572691A JPH05159821A JP H05159821 A JPH05159821 A JP H05159821A JP 3085726 A JP3085726 A JP 3085726A JP 8572691 A JP8572691 A JP 8572691A JP H05159821 A JPH05159821 A JP H05159821A
- Authority
- JP
- Japan
- Prior art keywords
- inspection
- circuit board
- electrodes
- grid
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、回路基板検査装置に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board inspection device.
【０００２】[0002]
【従来の技術】従来において、プリント回路基板などの
回路基板の電気的検査においては、例えば図６に示すよ
うな回路基板検査装置が用いられている。この回路基板
検査装置は、検査すべき回路基板１の被検査電極８に対
応するパターンで配列された表面電極91および表面電極
91に電気的に接続された格子状配列の裏面電極92を有し
てなるオフグリッドアダプター90と、規則的に配列さ
れ、オフグリッドアダプター90の裏面電極92の各々と電
気的に接続されるピン型検査電極94を具えてなる検査ヘ
ッド93とを有してなる。同図において、95は仲介ピン、
96は異方導電性シート、98は回路基板１を支持するテー
ブルである。この回路基板１の電気的検査においては、
固有のパターンで配列された被検査電極８の各々がオフ
グリッドアダプター90の裏面電極92の各々と電気的に接
続されることにより、固有の被検査電極配列パターンが
格子状の電極配列パターンに変換され、更に、オフグリ
ッドアダプター90の裏面電極92の各々は、異方導電性シ
ート96および仲介ピン95を介して、ピン型検査電極94の
各々と電気的に接続される。2. Description of the Related Art Conventionally, a circuit board inspection apparatus as shown in FIG. 6, for example, has been used for electrical inspection of a circuit board such as a printed circuit board. This circuit board inspection apparatus includes a surface electrode 91 and a surface electrode arranged in a pattern corresponding to the electrode 8 to be inspected of the circuit board 1 to be inspected.
Off-grid adapters 90 each having a grid-shaped rear surface electrode 92 electrically connected to 91, and pins arranged regularly and electrically connected to each of the rear surface electrodes 92 of the off-grid adapter 90. And a test head 93 comprising a mold test electrode 94. In the figure, 95 is an intermediary pin,
96 is an anisotropic conductive sheet, and 98 is a table that supports the circuit board 1. In the electrical inspection of this circuit board 1,
Each of the electrodes 8 to be inspected arranged in a unique pattern is electrically connected to each of the back electrodes 92 of the off-grid adapter 90, so that the electrode array pattern to be inspected is converted into a grid-like electrode array pattern. Further, each of the back surface electrodes 92 of the off-grid adapter 90 is electrically connected to each of the pin type inspection electrodes 94 via the anisotropic conductive sheet 96 and the intermediary pin 95.
【０００３】従来、部品の大きさなどの要請から、１in
ch2 あたりの電極数が 100程度（以下、本明細書におい
て 100／inch2 程度の電極密度を「標準密度」という）
である回路基板が多用されている。また、現在において
は、装置の小型化の要請に伴って、標準密度回路基板と
同じ電極数であって配列密度の高い回路基板（以下「高
密度回路基板」という）が開発されている。そして、回
路基板の電気的検査に際しては、検査効率の向上および
検査電極の有効利用という観点から、標準密度回路基板
および高密度回路基板の両方の電気的検査に適応可能な
回路基板検査装置が望まれる。Conventionally, it is 1 in because of the demand for the size of parts.
The number of electrodes per ch 2 is about 100 (hereinafter, the electrode density of about 100 / inch 2 in this specification is referred to as “standard density”)
The circuit board which is is often used. Further, at present, a circuit board having the same number of electrodes as the standard density circuit board and a high array density (hereinafter referred to as "high density circuit board") has been developed in response to a demand for miniaturization of the device. Further, in the electrical inspection of the circuit board, a circuit board inspection apparatus adaptable to the electrical inspection of both the standard density circuit board and the high density circuit board is desired from the viewpoint of improving the inspection efficiency and effectively using the inspection electrodes. Be done.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、標準密
度回路基板および高密度回路基板の両方の電気的検査を
同じ回路基板検査装置により行うことは困難である。す
なわち、高密度回路基板の電気的検査においては、高密
度回路基板に対応するオフグリッドアダプターにより、
高密度の被検査電極配列が高密度の格子状電極配列に変
換される。高密度の格子状電極配列は、標準密度の格子
状電極配列よりも電極ピッチが小さいので、検査電極が
標準密度回路基板の電気的検査に適合するものであると
きには、当該検査電極は全ての高密度格子状配列点と電
気的に接続することができない。また、標準密度回路基
板の電気的検査においては、標準密度回路基板に対応す
るオフグリッドアダプターにより、標準密度の被検査電
極配列が標準密度の格子状電極配列に変換される。標準
密度の格子状電極配列が占める領域は、高密度の格子状
電極配列が占める領域よりも広いので、検査電極が高密
度回路基板の電気的検査に適合するものであるときに
は、当該検査電極は全ての標準密度格子状配列点と電気
的に接続することができない。However, it is difficult to perform the electrical inspection of both the standard density circuit board and the high density circuit board by the same circuit board inspection apparatus. That is, in the electrical inspection of the high-density circuit board, the off-grid adapter corresponding to the high-density circuit board,
The high-density inspected electrode array is converted into a high-density grid-shaped electrode array. Since the high-density grid electrode array has a smaller electrode pitch than the standard-density grid electrode array, when the test electrode is suitable for the electrical inspection of the standard-density circuit board, the test electrode has all the high-density electrodes. It cannot be electrically connected to the density grid array points. In the electrical inspection of the standard density circuit board, the off-grid adapter corresponding to the standard density circuit board converts the inspected electrode array having the standard density into the grid electrode array having the standard density. Since the area occupied by the standard-density grid-like electrode array is wider than the area occupied by the high-density grid-like electrode array, when the test electrode is suitable for electrical inspection of a high-density circuit board, the test electrode is It is not possible to make electrical connection with all standard density grid array points.
【０００５】一方、従来の回路基板検査装置において
は、検査ヘッドの構造が複雑であり、そのため装置を十
分に小型化できず、また装置の製造コストの上昇を招い
ていた。On the other hand, in the conventional circuit board inspection apparatus, the structure of the inspection head is complicated, so that the apparatus cannot be downsized sufficiently and the manufacturing cost of the apparatus is increased.
【０００６】更に、従来においては、回路基板の検査時
に全ての被検査電極に均一な加圧力を与えることが困難
であり、接触不良により確実な検査が行われず、あるい
は一部の被検査電極に応力が集中して電極間に介在する
異方導電性ゴムシートの寿命を著しく縮めたり、応力集
中が激しい場合には異方導電性ゴムシートを破損させ
る、などの問題があり、実用的な回路基板検査装置を製
作することは困難であった。特に厚みの不均一な回路基
板や反りのある回路基板を検査する場合には顕著であっ
た。Further, conventionally, it is difficult to apply uniform pressure to all the electrodes to be inspected when inspecting a circuit board, and reliable inspection cannot be performed due to poor contact, or some electrodes to be inspected. There is a problem that the stress is concentrated and the life of the anisotropic conductive rubber sheet interposed between the electrodes is significantly shortened, or the stress is concentrated, the anisotropic conductive rubber sheet is damaged. It was difficult to manufacture a board inspection device. This was particularly noticeable when inspecting a circuit board having a non-uniform thickness or a warped circuit board.
【０００７】本発明は、以上のような事情に基づいてな
されたものであって、本発明の第１の目的は、標準密度
回路基板および高密度回路基板の両方の電気的検査に適
応可能な回路基板検査装置を提供することにある。The present invention has been made based on the above circumstances, and the first object of the present invention is applicable to electrical inspection of both standard density circuit boards and high density circuit boards. It is to provide a circuit board inspection device.
【０００８】本発明の第２の目的は、検査ヘッドの構造
が単純で、スペース効率に優れた回路基板検査装置を提
供することにある。A second object of the present invention is to provide a circuit board inspection apparatus having a simple inspection head structure and excellent space efficiency.
【０００９】本発明の第３の目的は、検査時において一
部の被検査電極への応力集中を回避し、全ての被検査電
極へ均一な加圧力を付与することができる回路基板検査
装置を提供することにある。A third object of the present invention is to provide a circuit board inspection apparatus capable of avoiding stress concentration on a part of the electrodes to be inspected at the time of inspection and applying uniform pressure to all the electrodes to be inspected. To provide.
【００１０】[0010]
【課題を解決するための手段】本発明の回路基板検査装
置は、検査すべき回路基板の被検査電極に対応するパタ
ーンで配列された表面電極および当該表面電極に電気的
に接続された格子状配列の裏面電極を有してなるオフグ
リッドアダプターと、規則的に配列され、前記オフグリ
ッドアダプターの裏面電極の各々と電気的に接続される
検査電極を具えてなる検査ヘッドと、前記オフグリッド
アダプターと前記検査ヘッドの間に、異方導電性シート
を介して設けられるグリッド変換ボードとを有してな
り、前記グリッド変換ボードにおける検査ヘッドに対向
する面には、当該検査ヘッドの検査電極の配列パターン
に対応するパターンの検査ヘッド接続電極が設けられ、
前記グリッド変換ボードにおけるオフグリッドアダプタ
ーに対向する面には、前記検査ヘッド接続電極の各々と
電気的に接続された標準格子配列電極が設けられた標準
密度回路基板検査領域が設定されると共に、当該標準密
度回路基板検査領域において、更に追加配列電極が設け
られた高密度回路基板検査領域が設定され、前記追加配
列電極の各々は、標準密度回路基板検査領域に配列され
た標準格子配列電極に電気的に接続された検査ヘッド接
続電極の適宜のものに電気的に接続されていることを特
徴とする。SUMMARY OF THE INVENTION A circuit board inspection apparatus of the present invention comprises a surface electrode arranged in a pattern corresponding to an electrode to be inspected on a circuit board to be inspected, and a grid pattern electrically connected to the surface electrode. An off-grid adapter having an array of back electrodes, a test head regularly arrayed, and test electrodes each electrically connected to each of the back electrodes of the off-grid adapter, and the off-grid adapter And a grid conversion board provided via an anisotropic conductive sheet between the inspection head and the inspection head, and a surface of the grid conversion board facing the inspection head has an array of inspection electrodes of the inspection head. An inspection head connection electrode of a pattern corresponding to the pattern is provided,
A standard density circuit board inspection area provided with standard grid array electrodes electrically connected to each of the inspection head connection electrodes is set on a surface of the grid conversion board facing the off-grid adapter, and In the standard density circuit board inspection area, a high density circuit board inspection area provided with an additional array electrode is set, and each of the additional array electrodes is electrically connected to a standard grid array electrode arranged in the standard density circuit board inspection area. Electrically connected to an appropriate one of the inspection head connection electrodes that are electrically connected.
【００１１】本発明の第２の目的は、回路基板の検査に
用いられる回路基板検査装置であって、被検査電極を検
査する手段として、当該被検査電極に対向するように配
列された表面電極およびこの表面電極に電気的に接続さ
れた格子状配列の裏面電極を具えてなるオフグリッドア
ダプターと、検査ヘッドとを有してなり、前記検査ヘッ
ドは、前記オフグリッドアダプターの裏面電極に対応す
るパターン配列の検査電極を具えてなる多層板と、前記
検査電極の各々と電気的に接続されて適宜の位置に配置
されたスキャナとよりなる多層板方式検査ヘッドである
ことを特徴とする回路基板検査装置によって達成され
る。A second object of the present invention is a circuit board inspecting apparatus used for inspecting a circuit board, wherein the surface electrodes arranged to face the inspected electrode as means for inspecting the inspected electrode. And an off-grid adapter comprising a grid-shaped back electrode electrically connected to the front electrode, and an inspection head, the inspection head corresponding to the back electrode of the off-grid adapter. A circuit board, which is a multi-layer board type inspection head comprising a multi-layer board having test electrodes in a pattern arrangement and a scanner electrically connected to each of the test electrodes and arranged at an appropriate position. Achieved by inspection equipment.
【００１２】本発明の第３の目的は、検査すべき回路基
板を挟んで対向配置された一対の検査ヘッドを有してな
り、少なくとも一方の検査ヘッドがピン型検査電極を具
えてなるピン方式検査ヘッドである回路基板検査装置で
あって、一方の検査ヘッドが高い剛性を有し、他方の検
査ヘッドが可撓性を有していることを特徴とする回路基
板検査装置によって達成される。A third object of the present invention is to provide a pin system having a pair of inspection heads opposed to each other with a circuit board to be inspected therebetween, and at least one inspection head having a pin type inspection electrode. A circuit board inspection apparatus which is an inspection head, wherein one inspection head has high rigidity and the other inspection head has flexibility.
【００１３】[0013]
【作用】主に高密度回路基板の電気的検査に用いられる
追加配列電極の各々は、主に標準密度回路基板の電気的
検査に用いられる標準密度回路基板検査領域に配列され
た標準格子配列電極に電気的に接続された検査ヘッド接
続電極の適宜のものに電気的に接続されているので、標
準密度回路基板の検査および高密度回路基板の検査を共
通の検査電極によって行なうことができ、標準密度回路
基板および高密度回路基板の両方の電気的検査に適応が
可能となって、検査効率が高まると共に検査電極の有効
利用が図れる。Each of the additional array electrodes mainly used for electrical inspection of the high density circuit board is a standard grid array electrode arrayed in the standard density circuit board inspection area mainly used for electrical inspection of the standard density circuit board. Since it is electrically connected to the appropriate one of the inspection head connecting electrodes electrically connected to the standard inspection circuit, the inspection of the standard density circuit board and the inspection of the high density circuit board can be performed by the common inspection electrode. It is possible to adapt to the electrical inspection of both the high density circuit board and the high density circuit board, the inspection efficiency is enhanced, and the inspection electrodes can be effectively used.
【００１４】被検査電極を検査する手段として、多層板
方式検査ヘッドを用いているので、検査ヘッドの構造が
単純で軽量なものとなり、生産性も大きく向上する。更
に、多層板内において電気配線がなされているため、ス
キャナの配置が制限されず、多層板の適宜の位置に配置
することができる。従って、例えば多層板の横側に配置
した場合には、多層板の真下部分にスペースが確保され
て他の装置などを組み込むことが可能になる。Since the multi-layer plate type inspection head is used as the means for inspecting the electrode to be inspected, the structure of the inspection head is simple and lightweight, and the productivity is greatly improved. Further, since the electric wiring is formed in the multilayer board, the arrangement of the scanner is not limited, and the scanner can be arranged at an appropriate position. Therefore, for example, when it is arranged on the side of the multi-layer board, a space is secured under the multi-layer board, and it becomes possible to incorporate other devices.
【００１５】一方の検査ヘッドが高い剛性を有し、他方
の検査ヘッドが可撓性を有しているので、回路基板に厚
みの不均一な箇所や反りがある場合でも、可撓性を有し
ている他方の検査ヘッドがこれに追従することにより、
全ての被検査電極に均一で確実な加圧力を与えることが
できる。また、不必要な加圧力を与えることがないの
で、特定の被検査電極に応力が集中することがなく、電
極間に介在する異方導電性ゴムシートなどの寿命を縮め
たり、破損させたりすることはない。Since one of the inspection heads has high rigidity and the other inspection head has flexibility, it has flexibility even when the circuit board has an uneven thickness portion or a warp. By the other inspection head doing the following,
A uniform and reliable pressure can be applied to all the electrodes to be inspected. Moreover, since unnecessary pressure is not applied, stress is not concentrated on a specific electrode to be inspected, and the life of anisotropic conductive rubber sheet or the like interposed between electrodes is shortened or damaged. There is no such thing.
【００１６】[0016]
【実施例】以下、本発明の実施例を図面に基づいて説明
する。図１は、本発明の回路基板検査装置の一例を示す
断面図である。図１に示すように、本実施例の回路基板
検査装置は、検査すべき回路基板１の被検査電極（図示
せず）に対向するように配列された表面電極（図示せ
ず）および表面電極に電気的に接続された格子状配列の
裏面電極21を有してなるオフグリッドアダプター20と、
規則的に配列され、オフグリッドアダプター20の裏面電
極21の各々と電気的に接続されるピン型検査電極51、ピ
ン型検査電極51を保持してなる、例えば厚さ30mmのエポ
キシ樹脂よりなる剛性基板52およびピン型検査電極51と
電気的に接続されたスキャナー部53よりなる検査ヘッド
50（以下「ピン方式検査ヘッド50」という）と、オフグ
リッドアダプター20とピン方式検査ヘッド50の間に設け
られたグリッド変換ボード40とを有してなる。同図にお
いて、99は回路基板１を支持するテーブル、10は回路基
板１とオフグリッドアダプター20の間に介在する異方導
電性シートである。30は第１の異方導電性ゴムシートで
あり、この第１の異方導電性ゴムシート30は、複数の突
出する導電部31が相互に絶縁部32によって絶縁された状
態で配列されている。第１の異方導電性ゴムシート30の
導電部31の配列パターンは、グリッド変換ボード40の下
面に設けられた、後述する標準格子配列電極46および追
加配列電極47の配列パターンにより決定される。33は第
２の異方導電性ゴムシートであり、この第２の異方導電
性ゴムシート33は、複数の突出する導電部34が相互に絶
縁部35によって絶縁された状態で配列されており、導電
部34の配列パターンはピン型検査電極51の配列パターン
と同一である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing an example of a circuit board inspection apparatus of the present invention. As shown in FIG. 1, the circuit board inspection apparatus according to the present embodiment includes a surface electrode (not shown) and a surface electrode arranged so as to face an electrode (not shown) to be inspected of the circuit board 1 to be inspected. An off-grid adapter 20 having a back electrode 21 in a grid array electrically connected to
A pin type inspection electrode 51 which is regularly arranged and electrically connected to each of the back surface electrodes 21 of the off-grid adapter 20, and a pin type inspection electrode 51 which holds, for example, a rigidity made of an epoxy resin having a thickness of 30 mm. An inspection head including a scanner portion 53 electrically connected to the substrate 52 and the pin-type inspection electrode 51.
50 (hereinafter referred to as "pin method inspection head 50") and a grid conversion board 40 provided between the off-grid adapter 20 and the pin method inspection head 50. In the figure, 99 is a table for supporting the circuit board 1, and 10 is an anisotropic conductive sheet interposed between the circuit board 1 and the off-grid adapter 20. Reference numeral 30 denotes a first anisotropic conductive rubber sheet, and the first anisotropic conductive rubber sheet 30 is arranged in a state in which a plurality of protruding conductive portions 31 are insulated from each other by an insulating portion 32. .. The array pattern of the conductive portions 31 of the first anisotropic conductive rubber sheet 30 is determined by the array pattern of standard grid array electrodes 46 and additional array electrodes 47, which will be described later, provided on the lower surface of the grid conversion board 40. Reference numeral 33 is a second anisotropic conductive rubber sheet, and the second anisotropic conductive rubber sheet 33 is arranged such that a plurality of protruding conductive portions 34 are insulated from each other by an insulating portion 35. The array pattern of the conductive portions 34 is the same as the array pattern of the pin type inspection electrodes 51.
【００１７】グリッド変換ボード40におけるピン方式検
査ヘッド50に対向する上面41には、ピン方式検査ヘッド
50のピン型検査電極51の配列パターンに対応するパター
ンの検査ヘッド接続電極43が設けられている。一方、グ
リッド変換ボード40におけるオフグリッドアダプター20
に対向する下面42には、検査ヘッド接続電極43の各々と
電気的に接続された標準格子配列電極46が設けられた標
準密度回路基板検査領域44（以下「標準密度検査領域4
4」ともいう）が設定されると共に、この標準密度検査
領域44の一部において、更に追加配列電極47が設けられ
た高密度回路基板検査領域45（以下「高密度検査領域4
5」ともいう）が設定されおり、追加配列電極47の各々
は、高密度検査領域45以外の標準密度検査領域44（以下
「周辺領域44Ａ」ともいう）に配列された標準格子配列
電極46（46Ａ）に電気的に接続された検査ヘッド接続電
極43（43Ａ）の適宜のものに電気的に接続されている。
このとき複数の追加配列電極47を一つの検査ヘッド接続
電極43（43Ａ）に接続することも可能である。このよう
な高密度検査領域45は標準密度検査領域44内に複数設定
したり、標準密度検査領域44の全面に設定することも可
能である。本発明におけるグリッド変換ボード40では、
追加配列電極47を検査ヘッド接続電極43に接続するとき
に、当該追加配列電極47に近接した標準格子配列電極46
が接続されている検査ヘッド接続電極43に接続すると、
十分な機能を発揮できない場合も有り得るため、追加配
列電極47と検査ヘッド接続電極43の接続パターンを決定
するときには、検査ヘッド50の構成および回路基板１の
大きさ、電極数、電極密度などを考慮にいれることが肝
要である。図２は、グリッド変換ボード40における電極
配列状態の一例を示す正面図であり、追加配列電極47の
各々は隣接する標準格子配列電極46の中間位置に設けら
れている。隣接する標準格子配列電極46間のピッチＰは
例えば2.54mmであり、検査電極の配列数に対応する検査
ヘッド接続電極43の数は、例えば153720(315×488)であ
る。On the upper surface 41 of the grid conversion board 40 facing the pin type inspection head 50, a pin type inspection head is provided.
An inspection head connection electrode 43 having a pattern corresponding to the arrangement pattern of the 50 pin type inspection electrodes 51 is provided. On the other hand, off-grid adapter 20 in grid conversion board 40
A standard density circuit board inspection area 44 (hereinafter referred to as “standard density inspection area 4”) provided with a standard grid array electrode 46 electrically connected to each of the inspection head connection electrodes 43 on the lower surface 42 facing the
(Also referred to as “4”) and a high density circuit board inspection area 45 (hereinafter referred to as “high density inspection area 4”) in which a part of the standard density inspection area 44 is provided with an additional array electrode 47.
5 ”) is set, and each of the additional array electrodes 47 is arranged in a standard grid array electrode 46 (hereinafter also referred to as“ peripheral area 44A ”) other than the high density inspection area 45 (hereinafter also referred to as“ peripheral area 44A ”). 46A) is electrically connected to an appropriate one of the inspection head connection electrodes 43 (43A) electrically connected to 46A).
At this time, it is also possible to connect a plurality of additional array electrodes 47 to one inspection head connecting electrode 43 (43A). It is possible to set a plurality of such high-density inspection areas 45 in the standard-density inspection area 44, or to set them all over the standard-density inspection area 44. In the grid conversion board 40 in the present invention,
When the additional array electrode 47 is connected to the inspection head connecting electrode 43, the standard grid array electrode 46 close to the additional array electrode 47.
When connected to the inspection head connection electrode 43 to which is connected,
Since it may not be possible to exert a sufficient function, the configuration of the inspection head 50, the size of the circuit board 1, the number of electrodes, the electrode density, etc. are taken into consideration when determining the connection pattern of the additional array electrode 47 and the inspection head connection electrode 43. It is essential to enter FIG. 2 is a front view showing an example of an electrode arrangement state in the grid conversion board 40, and each additional arrangement electrode 47 is provided at an intermediate position between the adjacent standard lattice arrangement electrodes 46. The pitch P between the adjacent standard grid array electrodes 46 is, for example, 2.54 mm, and the number of the test head connecting electrodes 43 corresponding to the number of arrayed test electrodes is, for example, 153720 (315 × 488).
【００１８】固有のパターンで配列された回路基板１の
被検査電極の各々は、オフグリッドアダプター20の裏面
電極21の各々と電気的に接続されることにより、固有の
被検査電極配列パターンが格子状の電極配列パターンに
変換される。図３および図４は、本実施例の回路基板検
査装置の要部を示す断面図であり、同図においては、回
路基板を支持するテーブル、第２の異方導電性ゴムシー
トおよび検査ヘッドは省略されている。図３に示す回路
基板２は標準密度回路基板であり、回路基板２の被検査
電極３の配列は、被検査電極３に対向するように配列さ
れた表面電極23および表面電極23に電気的に接続された
格子状配列の裏面電極24を有してなる標準密度回路基板
に対応するオフグリッドアダプター22によって標準密度
の格子状配列に変換される。そして、オフグリッドアダ
プター22の裏面電極24は、第１の異方導電性ゴムシート
30を介して、グリッド変換ボード40の下面42の標準密度
検査領域44に配列された標準格子配列電極46に電気的に
接続される。これにより、被検査電極３の全てがグリッ
ド変換ボード40の上面41の検査ヘッド接続電極43の各々
に電気的に接続されることになる。図４に示す回路基板
４は高密度回路基板であり、高密度回路基板４の被検査
電極５の配列は、被検査電極５に対向するように配列さ
れた表面電極26および表面電極26に電気的に接続された
格子状配列の裏面電極27を有してなる高密度回路基板に
対応するオフグリッドアダプター25によって高密度の格
子状配列に変換される。そして、オフグリッドアダプタ
ー25の裏面電極27は、第１の異方導電性ゴムシート30を
介して、グリッド変換ボード40の下面42の高密度検査領
域45に配列された標準格子配列電極46または追加配列電
極47の適宜のものに電気的に接続される。これにより、
被検査電極５の全てがグリッド変換ボード40の上面41の
検査ヘッド接続電極43の各々に電気的に接続されること
になる。グリッド変換ボード40において、主に高密度回
路基板４の検査に用いられる追加配列電極47の各々は、
主に標準密度回路基板２の検査に用いられる周辺領域44
Ａに配列された標準格子配列電極46Ａに電気的に接続さ
れた検査ヘッド接続電極43Ａの適宜のものに電気的に接
続されているので、標準密度回路基板２の検査および高
密度回路基板４の検査を共通の検査電極によって行なう
ことができ、標準密度回路基板２および高密度回路基板
４の両方の電気的検査に適応が可能となって、検査効率
が高まると共に検査電極の有効利用が図れる。Each of the electrodes to be inspected of the circuit board 1 arranged in a unique pattern is electrically connected to each of the back electrodes 21 of the off-grid adapter 20, so that the pattern of the inspected electrodes to be inspected is unique. It is converted into a circular electrode array pattern. 3 and 4 are cross-sectional views showing the main part of the circuit board inspection apparatus of this embodiment, in which the table supporting the circuit board, the second anisotropic conductive rubber sheet and the inspection head are shown. Omitted. The circuit board 2 shown in FIG. 3 is a standard density circuit board, and the electrodes 3 to be inspected on the circuit board 2 are electrically connected to the surface electrodes 23 and the surface electrodes 23 arranged to face the electrodes 3 to be inspected. The off-grid adapter 22 corresponding to the standard density circuit board having the connected back surface electrodes 24 in the grid array is converted into the grid array of the standard density. The back electrode 24 of the off-grid adapter 22 is the first anisotropic conductive rubber sheet.
It is electrically connected to the standard grid array electrode 46 arrayed in the standard density inspection region 44 on the lower surface 42 of the grid conversion board 40 via 30. As a result, all the electrodes 3 to be inspected are electrically connected to the respective inspection head connecting electrodes 43 on the upper surface 41 of the grid conversion board 40. The circuit board 4 shown in FIG. 4 is a high-density circuit board, and the electrodes 5 to be inspected on the high-density circuit board 4 are electrically connected to the surface electrodes 26 and the surface electrodes 26 arranged to face the electrodes 5 to be inspected. It is converted into a high-density grid-like array by an off-grid adapter 25 corresponding to a high-density circuit board having rear-surface electrodes 27 in a grid-like array that are electrically connected. Then, the back surface electrode 27 of the off-grid adapter 25 is a standard grid array electrode 46 or an additional electrode arrayed in the high-density inspection area 45 of the lower surface 42 of the grid conversion board 40 via the first anisotropic conductive rubber sheet 30. It is electrically connected to an appropriate one of the array electrodes 47. This allows
All of the electrodes 5 to be inspected are electrically connected to each of the inspection head connecting electrodes 43 on the upper surface 41 of the grid conversion board 40. In the grid conversion board 40, each of the additional array electrodes 47 mainly used for the inspection of the high-density circuit board 4 is
Peripheral area 44 mainly used for inspection of standard density circuit board 2
It is electrically connected to an appropriate one of the inspection head connecting electrodes 43A electrically connected to the standard grid array electrode 46A arranged in A, so that the inspection of the standard density circuit board 2 and the high density circuit board 4 are performed. The inspection can be performed by a common inspection electrode, and it is possible to adapt to the electrical inspection of both the standard density circuit board 2 and the high density circuit board 4, so that the inspection efficiency is improved and the inspection electrode can be effectively used.
【００１９】図５は、上下両面に被検査電極を有する回
路基板６の検査に用いられる回路基板検査装置の一例を
示す断面図である。同図において、回路基板６より上部
の構成は図１に示すものと同一である。この回路基板検
査装置は、検査すべき回路基板６の下面の被検査電極７
に対向するように配列された表面電極71および表面電極
71に電気的に接続された格子状配列の裏面電極72を有し
てなる第２のオフグリッドアダプター70と、第２のオフ
グリッドアダプター70の裏面電極72と同一のパターン配
列の検査電極81を具えてなる可撓性の多層板よりなるグ
リッド配線ボード82、グリッド配線ボード82の下面中央
部に設けられた、例えばスポンジよりなる緩衝部83およ
びグリッド配線ボード82の下面左右端部に設けられた検
査電極81の各々と電気的に接続されたスキャナー部84よ
りなる検査ヘッド80（以下「多層板方式検査ヘッド80」
という）と、多層板方式検査ヘッド80の下方に設けられ
たプレス装置（図示せず）とを有してなる。同図におい
て、60は回路基板６と第２のオフグリッドアダプター70
の間に介在する異方導電性シート、36は第３の異方導電
性ゴムシートであり、この第３の異方導電性ゴムシート
36は複数の突出する導電部37が相互に絶縁部38によって
絶縁された状態で配列されており、導電部37の配列パタ
ーンは第２のオフグリッドアダプター70の裏面電極72の
配列パターンおよび多層板方式検査ヘッド80の検査電極
81の配列パターンにより決定される。この例の回路基板
検査装置により回路基板６の電気的検査を行う場合にお
いて、可撓性を有するグリッド配線ボード82はプレス装
置により、例えば上に凸に湾曲するよう押圧される。こ
れにより、各電極間の電気的接続、特に剛性基板52に保
持されたピン型検査電極51とグリッド変換ボード40の検
査ヘッド接続電極43との電気的接続が確実かつ全体的に
均一なものとなり、検査精度が一層高いものとなる。FIG. 5 is a sectional view showing an example of a circuit board inspecting apparatus used for inspecting a circuit board 6 having electrodes to be inspected on both upper and lower surfaces. In the figure, the configuration above the circuit board 6 is the same as that shown in FIG. This circuit board inspecting device includes electrodes 7 to be inspected on the lower surface of a circuit board 6 to be inspected.
Surface electrode 71 and surface electrode arranged to face each other
A second off-grid adapter 70 having a grid-shaped rear surface electrode 72 electrically connected to 71, and an inspection electrode 81 having the same pattern arrangement as the rear surface electrode 72 of the second off-grid adapter 70. A grid wiring board 82 made of a flexible multi-layered board, a buffer portion 83 made of, for example, a sponge provided at the center of the bottom surface of the grid wiring board 82, and provided at the left and right ends of the bottom surface of the grid wiring board 82. An inspection head 80 (hereinafter referred to as a “multilayer plate type inspection head 80”) including a scanner unit 84 electrically connected to each of the inspection electrodes 81.
And a pressing device (not shown) provided below the multi-layer plate type inspection head 80. In the figure, 60 is the circuit board 6 and the second off-grid adapter 70.
Is an anisotropic conductive sheet, and 36 is a third anisotropic conductive rubber sheet. This third anisotropic conductive rubber sheet
The plurality of protruding conductive parts 37 are arranged in a state in which they are insulated from each other by the insulating part 38. The conductive part 37 has an arrangement pattern of the rear surface electrodes 72 of the second off-grid adapter 70 and a multilayer plate. Inspection electrode of method inspection head 80
Determined by 81 sequence patterns. When the circuit board inspecting apparatus of this example is used to electrically inspect the circuit board 6, the flexible grid wiring board 82 is pressed by the pressing apparatus so as to be curved upward, for example. As a result, the electrical connection between the respective electrodes, particularly the electrical connection between the pin-type inspection electrode 51 held on the rigid substrate 52 and the inspection head connection electrode 43 of the grid conversion board 40 becomes reliable and entirely uniform. , The inspection accuracy will be higher.
【００２０】[0020]
【発明の効果】請求項１の発明によれば、標準密度回路
基板の検査および高密度回路基板の検査を共通の検査電
極によって行なうことができるので、標準密度回路基板
および高密度回路基板の両方の電気的検査に適応が可能
となって、検査効率が高まると共に検査電極の有効利用
が図れて経済的にも有利である。According to the first aspect of the present invention, the standard density circuit board and the high density circuit board can be inspected by a common inspection electrode. Therefore, both the standard density circuit board and the high density circuit board can be inspected. It is also economically advantageous because the inspection efficiency can be improved and the inspection electrodes can be effectively used.
【００２１】請求項２の発明によれば、検査ヘッドの構
造が単純で軽量なものとなり、生産性も大きく向上す
る。更に、多層板内において電気配線がなされているた
め、スキャナの配置が制限されずに適宜の位置に配置す
ることができ、スペース効率に優れたものとなる。ま
た、多層板にグリッド変換機能を持たせるように配線を
設けることも可能であり、これにより、オフグリッドア
ダプターの裏面のピッチが微細である場合でも対応する
ことができる。According to the second aspect of the invention, the structure of the inspection head is simple and lightweight, and the productivity is greatly improved. Furthermore, since the electric wiring is formed in the multilayer board, the scanner can be arranged at an appropriate position without being restricted, and the space efficiency is excellent. It is also possible to provide wiring so that the multi-layer board has a grid conversion function, and this makes it possible to deal with even a fine pitch on the back surface of the off-grid adapter.
【００２２】請求項３の発明によれば、全ての被検査電
極に均一で確実な加圧力を与えることができる。また、
特定の被検査電極に応力が集中することがないので、電
極間に介在する異方導電性ゴムシートなどを破損させる
ことがなく、装置の長寿命化を図ることができる。According to the third aspect of the invention, it is possible to apply a uniform and reliable pressing force to all the electrodes to be inspected. Also,
Since stress does not concentrate on a specific electrode to be inspected, the anisotropic conductive rubber sheet or the like interposed between the electrodes is not damaged and the life of the device can be extended.
【図１】本発明の回路基板検査装置の一例を示す断面図
である。FIG. 1 is a sectional view showing an example of a circuit board inspection apparatus of the present invention.
【図２】グリッド変換ボードにおける電極配列状態の一
例を示す正面図である。FIG. 2 is a front view showing an example of an electrode arrangement state on a grid conversion board.
【図３】本発明の一実施例の回路基板検査装置の要部を
示す断面図である。FIG. 3 is a sectional view showing a main part of a circuit board inspection apparatus according to an embodiment of the present invention.
【図４】本発明の一実施例の回路基板検査装置の要部を
示す断面図である。FIG. 4 is a sectional view showing a main part of a circuit board inspection apparatus according to an embodiment of the present invention.
【図５】上下両面に被検査電極を有する回路基板の検査
に用いられる回路基板検査装置の一例を示す断面図であ
る。FIG. 5 is a cross-sectional view showing an example of a circuit board inspection device used for inspecting a circuit board having electrodes to be inspected on both upper and lower surfaces.
【図６】従来の回路基板検査装置の一例を示す断面図で
ある。FIG. 6 is a cross-sectional view showing an example of a conventional circuit board inspection device.
１ 回路基板 ２ 回路基板 ３ 被検査電極 ４ 回路基板 ５ 被検査電極 ６ 回路基板 ７ 被検査電極 ８ 被検査電極 10 異方導電性シート 20 オフグリッドアダプター 21 裏面電極 22 オフグリッドアダプター 23 表面電極 24 裏面電極 25 オフグリッドアダプター 26 表面電極 27 裏面電極 30 第１の異方導電性ゴムシート 31 導電部 32 絶縁部 33 第２の異方導電性ゴムシート 34 導電部 35 絶縁部 36 第３の異方導電性ゴムシート 37 導電部 38 絶縁部 40 グリッド変換ボード 41 上面 42 下面 43 検査ヘッド接続電極 43Ａ 周辺領域にある標準格子配列電極に接続された検
査ヘッド接続電極 44 標準密度回路基板検査領域 44Ａ 周辺領域 45 高密度回路基板検査領域 46 標準格子配列電極 46Ａ 周辺領域にある標準格子配列電極 47 追加配列電極 50 ピン方式検査ヘッド 51 ピン型検査電極 52 剛性基板 53 スキャナー部 60 異方導電性シート 70 第２のオフグリッドアダプター 71 表面電極 72 裏面電極 80 多層板方式検査ヘッド 81 検査電極 82 グリッド配線ボード 83 緩衝部 84 スキャナー部 90 オフグリッドアダプター 91 表面電極 92 裏面電極 93 検査ヘッド 94 ピン型検査電極 95 仲介ピン 96 異方導電性シート 99 テーブル1 circuit board 2 circuit board 3 inspected electrode 4 circuit board 5 inspected electrode 6 circuit board 7 inspected electrode 8 inspected electrode 10 anisotropic conductive sheet 20 off-grid adapter 21 back electrode 22 off-grid adapter 23 front-side electrode 24 back-side Electrode 25 Off-grid adapter 26 Front electrode 27 Back electrode 30 First anisotropic conductive rubber sheet 31 Conductive part 32 Insulating part 33 Second anisotropic conductive rubber sheet 34 Conductive part 35 Insulating part 36 Third anisotropic conductive Rubber sheet 37 Conductive part 38 Insulating part 40 Grid conversion board 41 Upper surface 42 Lower surface 43 Inspection head connection electrode 43A Inspection head connection electrode connected to standard grid array electrode in the peripheral area 44 Standard density circuit board inspection area 44A Peripheral area 45 High density circuit board inspection area 46 Standard grid array electrode 46A Standard grid array electrode in the peripheral area 47 Additional array electrode 50 Pin type inspection head 51 Pin type inspection Electrode 52 Rigid substrate 53 Scanner section 60 Anisotropic conductive sheet 70 Second off-grid adapter 71 Front electrode 72 Backside electrode 80 Multi-layer board type inspection head 81 Inspection electrode 82 Grid wiring board 83 Buffer section 84 Scanner section 90 Off-grid adapter 91 Front surface electrode 92 Back surface electrode 93 Inspection head 94 Pin type inspection electrode 95 Mediation pin 96 Anisotropic conductive sheet 99 Table
Claims (3)
するパターンで配列された表面電極および当該表面電極
に電気的に接続された格子状配列の裏面電極を有してな
るオフグリッドアダプターと、 規則的に配列され、前記オフグリッドアダプターの裏面
電極の各々と電気的に接続される検査電極を具えてなる
検査ヘッドと、 前記オフグリッドアダプターと前記検査ヘッドの間に、
異方導電性シートを介して設けられるグリッド変換ボー
ドとを有してなり、 前記グリッド変換ボードにおける検査ヘッドに対向する
面には、当該検査ヘッドの検査電極の配列パターンに対
応するパターンの検査ヘッド接続電極が設けられ、 前記グリッド変換ボードにおけるオフグリッドアダプタ
ーに対向する面には、前記検査ヘッド接続電極の各々と
電気的に接続された標準格子配列電極が設けられた標準
密度回路基板検査領域が設定されると共に、当該標準密
度回路基板検査領域において、更に追加配列電極が設け
られた高密度回路基板検査領域が設定され、 前記追加配列電極の各々は、標準密度回路基板検査領域
に配列された標準格子配列電極に電気的に接続された検
査ヘッド接続電極の適宜のものに電気的に接続されてい
ることを特徴とする回路基板検査装置。1. An off-grid adapter having front electrodes arranged in a pattern corresponding to electrodes to be inspected of a circuit board to be inspected and back electrodes in a grid array electrically connected to the front electrodes. An inspection head that is regularly arranged and that includes an inspection electrode electrically connected to each of the back electrodes of the off-grid adapter, and between the off-grid adapter and the inspection head,
A grid conversion board provided via an anisotropically conductive sheet, and a surface of the grid conversion board facing the inspection head has an inspection head having a pattern corresponding to an array pattern of inspection electrodes of the inspection head. A connection electrode is provided, and a standard density circuit board inspection region provided with a standard grid array electrode electrically connected to each of the inspection head connection electrodes is provided on a surface of the grid conversion board facing the off-grid adapter. The high density circuit board inspection area provided with additional array electrodes is set in the standard density circuit board inspection area, and each of the additional array electrodes is arranged in the standard density circuit board inspection area. It is electrically connected to an appropriate one of the inspection head connecting electrodes electrically connected to the standard grid array electrode. Circuit board inspection apparatus for a.
査装置であって、 被検査電極を検査する手段として、当該被検査電極に対
向するように配列された表面電極およびこの表面電極に
電気的に接続された格子状配列の裏面電極を具えてなる
オフグリッドアダプターと、検査ヘッドとを有してな
り、 前記検査ヘッドは、前記オフグリッドアダプターの裏面
電極に対応するパターン配列の検査電極を具えてなる多
層板と、前記検査電極の各々と電気的に接続されて適宜
の位置に配置されたスキャナとよりなる多層板方式検査
ヘッドであることを特徴とする回路基板検査装置。2. A circuit board inspecting apparatus used for inspecting a circuit board, wherein as means for inspecting an electrode to be inspected, a surface electrode arranged so as to oppose the electrode to be inspected, and the surface electrode electrically An off-grid adapter having a grid-shaped array of back electrodes connected to each other, and an inspection head, wherein the inspection head has a pattern of test electrodes corresponding to the back electrodes of the off-grid adapter. A circuit board inspecting device comprising a multi-layered board type inspection head comprising a multi-layered board obtained by the above and a scanner electrically connected to each of the inspection electrodes and arranged at an appropriate position.
れた一対の検査ヘッドを有してなり、 少なくとも一方の検査ヘッドがピン型検査電極を具えて
なるピン方式検査ヘッドである回路基板検査装置であっ
て、 一方の検査ヘッドが高い剛性を有し、他方の検査ヘッド
が可撓性を有していることを特徴とする回路基板検査装
置。3. A circuit board inspection, comprising a pair of inspection heads arranged to face each other with a circuit board to be inspected therebetween, at least one inspection head being a pin type inspection head having pin type inspection electrodes. A circuit board inspection device, wherein one inspection head has high rigidity and the other inspection head has flexibility.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03085726A JP3092191B2 (en) | 1991-03-27 | 1991-03-27 | Circuit board inspection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03085726A JP3092191B2 (en) | 1991-03-27 | 1991-03-27 | Circuit board inspection equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05159821A true JPH05159821A (en) | 1993-06-25 |
| JP3092191B2 JP3092191B2 (en) | 2000-09-25 |
Family
ID=13866854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03085726A Expired - Lifetime JP3092191B2 (en) | 1991-03-27 | 1991-03-27 | Circuit board inspection equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3092191B2 (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08285917A (en) * | 1995-04-19 | 1996-11-01 | Japan Synthetic Rubber Co Ltd | Adaptor device for inspection of circuit board |
| JPH0992365A (en) * | 1995-09-28 | 1997-04-04 | Japan Synthetic Rubber Co Ltd | Pitch changing connector, its manufacture, and connector device |
| JPH09223860A (en) * | 1996-02-16 | 1997-08-26 | Japan Synthetic Rubber Co Ltd | Circuit board device for inspection |
| JPH10197591A (en) * | 1997-01-09 | 1998-07-31 | Jsr Corp | Circuit board inspection device |
| JP2000067953A (en) * | 1994-11-15 | 2000-03-03 | Formfactor Inc | Probe card assembly and kit, and method for using them |
| JP2000081458A (en) * | 1998-09-07 | 2000-03-21 | Jsr Corp | Circuit board device for inspection |
| JP2000156253A (en) * | 1998-09-16 | 2000-06-06 | Jsr Corp | Stacked connector device and inspection device for circuit board |
| JP2000206169A (en) * | 1999-01-11 | 2000-07-28 | Hioki Ee Corp | Apparatus for inspecting circuit board |
| JP2002162430A (en) * | 2001-08-24 | 2002-06-07 | Jsr Corp | Adaptor device for inspecting circuit board |
| JP2006318923A (en) * | 2006-06-16 | 2006-11-24 | Jsr Corp | Conductive rubber sheet, connector using it, electrical inspection jig for circuit board, and manufacturing method of conductive rubber sheet |
| JP2007064936A (en) * | 2005-09-02 | 2007-03-15 | Jsr Corp | System and method for inspecting circuit board |
| JP2007064937A (en) * | 2005-09-02 | 2007-03-15 | Jsr Corp | System and method for inspecting circuit board |
| JP2007165391A (en) * | 2005-12-09 | 2007-06-28 | Tsutomu Takahashi | Printed board inspection apparatus and grid conversion board therefor |
| JPWO2006009070A1 (en) * | 2004-07-15 | 2008-05-01 | Jsr株式会社 | Relay board and circuit board side connector |
| JP2011507212A (en) * | 2007-12-18 | 2011-03-03 | アール アンド ディー サーキッツ インコーポレイテッド | Separable electrical connector using isotropic conductive elastomeric interconnect media |
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|---|---|---|---|---|
| JP4863130B2 (en) | 2009-05-22 | 2012-01-25 | 山一電機株式会社 | Board connector, semiconductor device socket including the same, cable connector, and board-to-board connector |
-
1991
- 1991-03-27 JP JP03085726A patent/JP3092191B2/en not_active Expired - Lifetime
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000067953A (en) * | 1994-11-15 | 2000-03-03 | Formfactor Inc | Probe card assembly and kit, and method for using them |
| JPH08285917A (en) * | 1995-04-19 | 1996-11-01 | Japan Synthetic Rubber Co Ltd | Adaptor device for inspection of circuit board |
| JPH0992365A (en) * | 1995-09-28 | 1997-04-04 | Japan Synthetic Rubber Co Ltd | Pitch changing connector, its manufacture, and connector device |
| JPH09223860A (en) * | 1996-02-16 | 1997-08-26 | Japan Synthetic Rubber Co Ltd | Circuit board device for inspection |
| JPH10197591A (en) * | 1997-01-09 | 1998-07-31 | Jsr Corp | Circuit board inspection device |
| JP2000081458A (en) * | 1998-09-07 | 2000-03-21 | Jsr Corp | Circuit board device for inspection |
| JP2000156253A (en) * | 1998-09-16 | 2000-06-06 | Jsr Corp | Stacked connector device and inspection device for circuit board |
| JP2000206169A (en) * | 1999-01-11 | 2000-07-28 | Hioki Ee Corp | Apparatus for inspecting circuit board |
| JP2002162430A (en) * | 2001-08-24 | 2002-06-07 | Jsr Corp | Adaptor device for inspecting circuit board |
| JPWO2006009070A1 (en) * | 2004-07-15 | 2008-05-01 | Jsr株式会社 | Relay board and circuit board side connector |
| US7489147B2 (en) | 2004-07-15 | 2009-02-10 | Jsr Corporation | Inspection equipment of circuit board and inspection method of circuit board |
| JP2007064936A (en) * | 2005-09-02 | 2007-03-15 | Jsr Corp | System and method for inspecting circuit board |
| JP2007064937A (en) * | 2005-09-02 | 2007-03-15 | Jsr Corp | System and method for inspecting circuit board |
| JP2007165391A (en) * | 2005-12-09 | 2007-06-28 | Tsutomu Takahashi | Printed board inspection apparatus and grid conversion board therefor |
| JP2006318923A (en) * | 2006-06-16 | 2006-11-24 | Jsr Corp | Conductive rubber sheet, connector using it, electrical inspection jig for circuit board, and manufacturing method of conductive rubber sheet |
| JP2011507212A (en) * | 2007-12-18 | 2011-03-03 | アール アンド ディー サーキッツ インコーポレイテッド | Separable electrical connector using isotropic conductive elastomeric interconnect media |
| JP2014106205A (en) * | 2012-11-29 | 2014-06-09 | Advantest Corp | Probe device and test device |
| KR101456253B1 (en) * | 2012-11-29 | 2014-11-04 | 가부시키가이샤 어드밴티스트 | Probe apparatus and test apparatus |
| TWI486591B (en) * | 2012-11-29 | 2015-06-01 | Advantest Corp | Probe device and test device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3092191B2 (en) | 2000-09-25 |
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