JPH08285887A - Jig for semiconductor device inspection - Google Patents

Abstract

PURPOSE: To provide a semiconductor device inspecting-jig which simply, uniformly and effectively connects a probe unit to a printed circuit board and is economically excellent. CONSTITUTION: The semiconductor device inspecting jig comprises a probe unit made of a flexible circuit and having a connecting terminal group 11 which is brought into contact with a semiconductor device, a connecting terminal group 13 which is brought into contact with a connecting unit and a conductor circuit group 12 for connecting the group 11 to the group 13. The jig also comprises the connecting unit made of a rigid printed circuit board and having a connecting terminal group 21 which is brought into contact with the probe unit, a connecting terminal group 23 which is brought into contact with an inspecting unit and a conductor circuit group 22 for connecting the group 21 to the group 23. The jig further comprises an anisotropic conductive resin layer 30 which is brought into electric contact and has repairability between the group 13 of the probe unit and the group 21 of the connecting unit.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of a semiconductor device inspection jig.

[0002]

2. Description of the Related Art In a probe test process, which is one of the main processes in semiconductor device manufacturing, an inspection jig called a probe card or a probe board is used. This jig has a structure in which a probe pin made of tungsten copper, beryllium copper or the like is attached to a predetermined position of a printed wiring board based on a glass fiber cloth epoxy resin or a glass fiber cloth polyimide resin.

However, in the recent trend of semiconductor devices,
The situation is becoming more difficult to handle with pin probing. For example, the increase in operating frequency is
It increases the signal attenuation in the pins, increases the electrical interference between neighboring pins, and exposes noise that interferes with the measurement. In addition, the structure of the pin attachment is essentially not suitable for increasing the density of the inspection pad due to the high integration of the device. The operating frequency is 80 MHz, and the number of pins is 700 to 800, which is considered the limit of pin type probing.
There has been a demand for a probing method that can sufficiently support z-order operating frequencies and 1000 or more inspection pads.

Under such circumstances, a method that has recently attracted attention is bump-type probing developed in the United States, which uses a probe device called a membrane probe, a test membrane or the like. This device is one in which metal bumps, which substitute for pins, are formed on a film base material such as polyimide by making full use of techniques such as photolithography and plating.

On the other hand, as a jig structure for bump type probing, there are a type in which the probe device and the printed wiring board are integrated and a type in which the probe device and the printed wiring board can be separated. The integrated type jig has a simple structure, but it is necessary to manufacture a jig for each sample. On the other hand,
Separable type jigs can be handled by modifying only the probe device.

[0006]

Various methods have been devised for attaching the above-mentioned probe device to a printed wiring board.
According to the method disclosed in U.S. Pat. No. 4,453,795, the connection terminals to be connected are made to face each other and mechanically tightened to achieve an electrical connection. However, it is difficult to make all the connections uniform and in good condition due to uneven height of each connection terminal made of metal, unevenness of the substrate surface, etc. Can not be satisfied. US Pat. No. 5,304,922
This problem is overcome in the method disclosed in Japanese Patent Publication No. 05-232142 (see FIG. 1). The circuit card 50 used here has a protruding contact 51 called a gold dot connecting device, and has an elastomer 53 on the back side thereof. The elastomer 53 pushes out the protruding contact 51 by tightening the screw, and as a result, the connection pad 42 of the test thin film 40, which is the probe device, is pushed out.
The connection with can be made firm and uniform. However, it is unavoidable that the structure becomes large-scale, and there is a disadvantage in economic efficiency. Further, whatever the shape, the protruding contact 51 is inevitably point contact, and there is a concern that the increase in connection resistance may affect the electrical characteristics. As described above, the present situation is that a decisive structure has not yet appeared in the semiconductor device inspection jig for bump type probing.

An object of the present invention is to provide a jig for inspecting a semiconductor device, which is simple, uniform, and reliable for connecting a probe device and a printed wiring board and which is economically excellent.

[0008]

A semiconductor device inspection jig of the present invention comprises a flexible circuit body, and a connection terminal group 11 for contacting the semiconductor device and a connection terminal for contacting the connection device. A probe device including a terminal group 13 and a conductor circuit group 12 for connecting the connection terminal groups 11 and 13;
A connection terminal group 21 made of a rigid printed wiring board for making contact with the probe device, a connection terminal group 23 for making contact with the inspection device, and a conductor circuit group 22 for making connection with the connection terminal groups 21 and 23. It is characterized in that an anisotropic conductive resin layer 30 having repairability for making electrical contact is provided between the connection device including the connection device and the connection terminal group 13 of the probe device and the connection terminal group 21 of the connection device.

The probe device may be provided with a rigid insulating support 14 and may also be provided with a rigid insulating support 15 including the connection terminal group 13 and a part of the conductor circuit group 12.

The layer of the connection device, which is located directly below the connection terminal group 21 and is located at a distance of at least 1 mm, can be composed of only an insulator without a conductor circuit. However, the term “directly below” does not indicate a direction based on the absolute coordinate system, but indicates that it is an inner layer side direction from an arbitrary layer of interest. For example, in FIG. 2, immediately below the connection terminal group 21 of the connection device 20 means the direction of the connection terminal group 20,
It does not indicate the downward direction of the drawing, that is, the direction of the anisotropic conductive resin layer 30.

[0011]

The jig for inspecting a semiconductor device of the present invention is divided into a probe device and a connecting device, and the connection is made by an anisotropic conductive resin layer having repairability. Therefore, it is possible to adapt to the sample type by remodeling only the probe device, and its structure is extremely simple. Further, since the terminals are connected by surface contact, increase in connection resistance can be avoided. The anisotropic conductive resin layer provided in this jig is the result of pressurizing and heating and curing the anisotropic conductive adhesive disposed between the opposing connection terminal groups when connecting the probe device and connecting device. is there. Generally, a resin shrinks in volume when it is cured. When the probe device is composed of an extremely thin flexible circuit body, undesired phenomena such as waviness and wrinkles may occur due to the curing shrinkage. In the semiconductor device inspection jig according to the second and third aspects of the invention, the probe device is provided with a rigid insulating support, and such a phenomenon can be prevented. In the step of connecting the probe device and the connection device, a pressure / heating jig is pressed from the probe device side to cure the anisotropic conductive adhesive. In order to complete this process in a shorter time and without excessive heating, it is essential to prevent heat dissipation as much as possible and to intensively heat the anisotropic conductive adhesive. According to a fourth aspect of the present invention, there is provided a semiconductor device inspecting jig, which has at least one portion directly below a connecting terminal of a connecting device.
Since there is no conductor circuit that is a good conductor of heat within the distance of mm, it is possible to prevent the dissipation of heat and heat the anisotropic conductive adhesive in a concentrated manner.

[0012]

2 and 3 are sectional views of an embodiment of a semiconductor device inspection jig and a probe device according to the present invention. However, other terminal groups, conductor circuit groups, various parts, mounting holes,
The fixing device and the like are omitted for simplification. The probe device 10 is a copper-clad film MCF-50 for flexible circuit boards.
001 (Hitachi Chemical Co., Ltd., trade name)
Copper plating and various processes such as photolithography were performed to collectively form the connection terminal groups 11 and 13 and the conductor circuit group 12. The probe device 10 does not specify the number of conductor circuit layers, the shape, or the like. Normally, it has a two-layer disc shape, but may have three conductor circuit layers, for example, when a large number of inspection pads are provided at high density. Further, a solid or mesh ground layer for adjusting the characteristic impedance may be partially provided.
As the substrate of the probe device 10, in addition to the above-mentioned products, various types such as Kapton (DuPont, trade name), Upilex (Ube Industries, trade name), Apical (Kanebuchi Chemical Co., Ltd., trade name) Copper clad film for circuit boards can be used. In plating, in addition to copper, a metal thin film of nickel, gold, solder or the like may be formed if necessary. The connection terminal group 11 is formed by various methods such as a method of forming bumps by etching using a metal foil having a three-layer structure of carrier copper / nickel / phosphorus intermediate layer / circuit copper layer, a plating bump method, and a transfer bump method. Can be formed by any method. However, in order to make contact with all the inspection pads uniformly and accurately, it is necessary to pay sufficient attention to the accuracy of their dimensions and positions. It is desirable that the copper foil circuit group 12 has a wiring design in which electric characteristics are sufficiently taken into consideration. The shape and size of the connection terminal 13 are not particularly specified, and a through-hole pad can also be used. The rigid insulating supports 14 and 15 are made of general glass fiber cloth polyimide resin or epoxy resin plate, and are formed on the back surface side of the connection terminal group 11. The size, shape, formation position and the like can be set arbitrarily. A spindle (not shown) extended from a height adjusting device (not shown) composed of a micrometer head or the like arranged in a fixing device (not shown) is brought into contact with the support 14 to raise the height of the connection terminal group 11. Adjustments can also be made. Further, the supports 14 and 15 may be provided with screw holes (not shown) for supporting and fixing. Adhesive sheet AS-2250 (Hitachi Chemical Co., Ltd.,
Product name), Kapton KJ (DuPont, product name),
Adhesive sheets for flexible circuit boards that are available as Upilex ADH (trade name of Ube Industries, Ltd.) and the like are preferable. The connection device 20 is composed of a multi-wire wiring board (Hitachi Chemical Co., Ltd., trade name) which is a discrete wire wiring board exhibiting electrically excellent characteristics. Connection device 20
Does not specify the manufacturing method, the number of conductor circuit layers, and the shape. Although a multilayer printed wiring board other than the discrete wire wiring board can be used, in any case, it is important that the circuit design is sufficiently considered in terms of electrical characteristics in view of the fact that it is used for inspection of semiconductor devices. Usually, in order to perform the alignment between the connection terminal 11 and the inspection pad of the sample, a peep hole 24 having a diameter smaller than that of the probe device is provided at the center thereof. Further, a screw hole (not shown) for supporting and fixing may be provided. Connection terminals 21, 2
No. 3 does not prescribe the shape and size of the device. The anisotropic conductive resin layer 30 having repairability was formed by an anisotropic conductive film Anisolum AC-2052 for metal electrodes (Hitachi Chemical Co., Ltd., trade name). In addition to this product, Anisolm AC-7144 (Hitachi Chemical Co., Ltd., trade name) can be used.

[0013]

The jig for semiconductor device inspection according to the invention of claim 1 is provided with the anisotropic conductive resin layer having repairability, so that the probe device and the connection device can be separated from each other and have an extremely simple structure. Becomes Further, since the terminals are connected by surface contact, increase in connection resistance can be avoided. In the semiconductor device inspection jig according to the second and third aspects of the present invention, the probe device is provided with a rigid insulating support, and it is possible to prevent development such as waviness and wrinkles occurring in the probe device. A jig for inspecting a semiconductor device according to the invention of claim 4 is
Since there is no conductor circuit that is a good conductor of heat within a distance of at least 1 mm directly below the connection terminal for connecting the probe device of the connection device, heat dissipation is prevented and the anisotropic conductive adhesive is heated intensively. As a result, this step can be completed in a shorter time and without excessive heating.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a conventional example.

FIG. 2 is a simplified sectional view showing an embodiment of the present invention.

FIG. 3 is a simplified sectional view showing another embodiment of the present invention.

[Explanation of symbols]

10: Probe device 40: Test thin film 11: Connection terminal group 11 41: Thin film trace 12: Conductor circuit group 12 42: Connection pad 13: Connection terminal group 13 43: Rigid insulating thin film annular body 14: Rigid insulating support 14 15: Rigid insulating support 15 50: Circuit card 51: Protruding contact 20: Connection device 52: Circuit card trace 21: Connection terminal group 21 53: Elastomer 22: Conductor circuit group 22 54: Dielectric layer 23: Connection terminal group 23 24: Peep hole 30: Anisotropic conductive resin layer having repairability

Claims (4)

[Claims] 1. A connection terminal group 11 made of a flexible circuit body for making contact with a semiconductor device, a connection terminal group 13 for making contact with a connection device, and connection terminals 11 and 13 for connection. A probe device having a conductor circuit group 12 for performing, a connection terminal group 21 made of a rigid printed wiring board for making contact with the probe device, a connection terminal group 23 for making contact with the inspection device, and a connection terminal group. A connection device having a conductor circuit group 22 for connecting 21 and 23, and a repairing device for electrical contact between the connection terminal group 13 of the probe device and the connection terminal group 21 of the connection device. A jig for inspecting a semiconductor device, comprising a unidirectional conductive resin layer 30. 2. The jig for inspecting a semiconductor device according to claim 1, wherein the probe device includes a rigid insulating support 14. 3. The semiconductor device inspection apparatus according to claim 1, wherein the probe device includes a rigid insulating support 15 having a connection terminal group 13 and a part of the conductor circuit group 12. jig. 4. The layer of the connection device, which is located immediately below the connection terminal group 21 and is located at a distance of at least 1 mm, has no conductor circuit and is composed only of an insulator. The semiconductor device inspection jig according to any one of the above.