JP2007064936A - System and method for inspecting circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a system and a method for inspecting circuit boards and capable of satisfactorily absorbing variations in the height of electrodes to be inspected of circuit boards to be inspected and securing insulation between adjacent inspection electrodes even if the electrodes to be inspected have fine pitches. <P>SOLUTION: When a circuit board 1 to be inspected is further pressed between a first inspection jig 11a and a second inspection jig 11b, local stress concentration is avoided by dispersing pressure concentration to variations in the height of electrodes to be inspected of the circuit board 1 to be inspected (variations in the height of solder-ball electrodes) by the spring elasticity of a first insulating plate 34, a second insulating plate 35, and an intermediate holding plate 36 arranged between the first insulating plate 34 and the second insulating plate 35 in a relay pin unit 31 in addition to the rubber elastic compression of an first anisotropic electrically conductive sheet 71, a second anisotropic electrically conductive sheet 73, a third anisotropic electrically conductive sheet 75, a fourth anisotropic electrically conductive sheet 77, and a fifth anisotropic electrically conductive sheet 42. The intermediate holding plate 36 is bent in the direction of the second insulating plate 35 and bent in the direction of the first insulating plate 34. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  According to the present invention, a circuit board (hereinafter referred to as a “circuit board to be inspected”) to be inspected for electrical inspection is clamped from both sides by a pair of first inspection jig and second inspection jig. The present invention relates to a circuit board inspection apparatus and a circuit board inspection method for inspecting electrical characteristics of a circuit board to be inspected with electrodes formed on both surfaces of the inspection circuit board being electrically connected to a tester.

  A printed circuit board for mounting an integrated circuit or the like is inspected for electrical characteristics in order to confirm that the wiring pattern of the circuit board has a predetermined performance before mounting the integrated circuit or the like.

  As such an inspection apparatus, Patent Document 1 (Japanese Patent Laid-Open No. 6-94768) discloses a circuit board that differs by incorporating an inspection head into an inspection tester having a circuit board transport mechanism and replacing the inspection head portion. As a method for performing the inspection, there is disclosed a method using an inspection jig having a structure in which a metal inspection pin that is in electrical contact with an inspection target electrode of a circuit substrate to be inspected is implanted on the substrate.

  Patent Document 2 (Japanese Patent Laid-Open No. 5-159821) discloses an inspection jig that combines an inspection head having conductive pins, a circuit board for pitch conversion called an off-grid adapter, and an anisotropic conductive sheet. The method used is disclosed.

  However, as in Patent Document 1 (Japanese Patent Laid-Open No. 6-94768), in a method using an inspection jig in which a metal inspection pin is directly brought into contact with an inspection electrode of a circuit board to be inspected, contact with a conductive pin made of metal As a result, the electrodes of the circuit board to be inspected may be damaged.

  In particular, in recent years, circuit boards have been miniaturized and densified, and when inspecting such a printed circuit board, a large pressure is applied because a large number of conductive pins are simultaneously brought into conductive contact with the inspected electrodes of the inspected circuit board. Therefore, it is necessary to pressurize the inspection jig, and the electrode to be inspected is easily damaged.

In such an inspection jig for inspecting a miniaturized and high-density printed circuit board, it is becoming technically difficult to implant a large number of high-density metal pins on the board.
In addition, the manufacturing cost is high, and it is difficult to repair and replace some metal pins when they are damaged.

  On the other hand, as in Patent Document 2 (Japanese Patent Application Laid-Open No. 5-159821), in an inspection jig using an anisotropic conductive sheet, the electrode to be inspected on the circuit board to be inspected is pitch-converted via the anisotropic conductive sheet. Since it comes into contact with the electrodes of the circuit board, there is an advantage that the electrodes to be inspected of the circuit board to be inspected are hardly damaged.

  In addition, since a substrate for pitch conversion is used, inspection pins to be implanted on the substrate can be implanted at a pitch wider than the pitch of the inspected electrode of the circuit substrate to be inspected. There is also an advantage that the manufacturing cost of the inspection jig can be saved without having to plant.

  However, in this inspection jig, since it is necessary to create a pitch conversion substrate and an inspection jig in which an inspection pin is implanted for each circuit board to be inspected, the inspection circuit board to be inspected The same number of inspection jigs as a certain printed circuit board are required.

For this reason, in the case where a plurality of printed circuit boards are produced, there is a problem that a plurality of inspection jigs must be held correspondingly.
In particular, in recent years, the product cycle of electronic devices has been shortened, and the production period of printed circuit boards used in products has been shortened. With this, inspection jigs cannot be used for a long time, There is a problem that an inspection jig must be produced each time the production of a printed circuit board is switched.

  As countermeasures against such problems, Patent Document 3 (Japanese Patent Laid-Open No. 7-248350), Patent Document 4 (Japanese Patent Laid-Open No. 8-271469), Patent Document 5 (Japanese Patent Laid-Open No. 8-338858) An inspection apparatus using a so-called universal type inspection jig using a relay pin unit has been proposed.

FIG. 36 is a cross-sectional view of an inspection apparatus using such a universal type inspection jig.
This inspection apparatus includes a pair of first inspection jig 111a and second inspection jig 111b. These inspection jigs include circuit board side connectors 121a and 121b, relay pin units 131a and 131b, and a tester side. Connectors 141a and 141b are provided.

  The circuit board side connectors 121a and 121b have pitch conversion boards 123a and 123b and anisotropic conductive sheets 122a, 122b, 126a and 126b arranged on both sides thereof.

  The relay pin units 131a and 131b have a large number of conductive pins 132a and 132b (for example, 5000 pins) arranged on lattice points at a constant pitch (for example, 2.54 mm pitch), and the conductive pins 132a and 132b can be moved up and down. It has a pair of insulating plates 134a and 134b to support.

  The tester-side connectors 141a and 141b are connector boards that electrically connect the tester and the conductive pins 132a and 132b when the circuit board 101 to be inspected is clamped between the first inspection jig 111a and the second inspection jig 111b. 143a, 143b, anisotropic conductive sheets 142a, 142b disposed on the conductive pins 132a, 132b side of the connector boards 143a, 143b, and base plates 146a, 146b.

  The inspection jig using the relay pin units 131a and 131b replaces the circuit board side connectors 121a and 121b with ones corresponding to the circuit board 101 to be inspected when inspecting printed circuit boards that are different objects to be inspected. The relay pin units 131a and 131b and the tester side connectors 141a and 141b can be used in common.

  By the way, the printed wiring board which is the circuit board 101 to be inspected has been multi-layered and densified. Actually, in the thickness direction, for example, the height variation and the board due to the inspected electrodes 102 and 103 such as solder ball electrodes such as BGA, etc. There is a warping of itself.

  Therefore, in order to achieve electrical connection to the electrodes 102 and 103 to be inspected on the circuit board 101 to be inspected, the first inspection jig 111a and the second inspection jig 111b are pressurized with high pressure. Thus, the circuit board 101 to be inspected is deformed flat, and the electrodes 102 and 103 to be inspected on the first inspection jig 111a side and the second inspection jig 111b side are to cope with the height variation of the electrodes 102 and 103 to be inspected. Follow-up to the height of the is required.

In such a universal type inspection jig, in order to ensure followability to the height of the electrodes 102 and 103 to be inspected, the conductive pins 132a and 132b are followed by movement in the axial direction. Since there is a limit to the amount of movement in the axial direction, the followability may not be good, and a continuity failure may occur and accurate inspection may not be possible.

  Further, in such a universal type inspection jig, the pressing pressure when the circuit board 101 to be inspected is clamped by the first inspection jig 111a and the second inspection jig 111b is anisotropically conductive above and below it. Absorbed by the sheets 122a, 122b, 126a, 126b, 142a, 142b.

Therefore, in order to support the pitch conversion substrates 123a and 123b and disperse the press pressure, it is necessary to dispose the conductive pins 132a and 132b at regular intervals.
Further, since the pressing pressure is received by the conductive pins 132a and 132b, it is necessary to arrange a large number of conductive pins 132a and 132b at regular intervals.

  For this reason, when forming the insulating plates 134a and 134b having through holes of 10,000 or more at a pitch of 0.75 mm, for example, corresponding to the miniaturization of the electrodes of the circuit board 101 to be inspected, the thickness of the insulating plates 134a and 134b If the thickness of the insulating plate 134 is thin, the strength becomes low, and it may be cracked when bent. Therefore, it is necessary to increase the thickness of the insulating plates 134a and 134b.

  However, when the diameter of the through hole to be formed becomes as fine as, for example, about 0.5 mm, and the thickness of the insulating plates 134a and 134b is 5 mm or more, when the through hole is to be formed by a single drilling process, Due to the strength of the blades, the drill blades are broken or broken, and the processing of the insulating plate often fails.

For this reason, the insulating plate is processed by drilling from one side of the insulating plate to about half the thickness and further drilling the same portion from the other side to form a through hole.
However, in this case, drilling work twice as many as the number of through holes formed in the insulating plate is required, and the machining process becomes complicated. In addition, with such a universal type inspection jig, the anisotropic conductive material constituting the circuit board side connector is required. The conductive sheets 122a and 122b are composed of a plurality of conductive path forming portions extending in the thickness direction and insulating portions that insulate these conductive path forming portions from each other, and the conductive particles are contained only in the conductive path forming portions. An unevenly distributed anisotropic conductive sheet in which the conductive path forming portion protrudes on one side of the sheet is used, which is unevenly distributed in the direction.

  This anisotropic conductive sheet deteriorates the conductive path formation part (increase in resistance value) due to repeated use in inspection, and when replacing the anisotropic conductive sheet, the pitch conversion with the anisotropic conductive sheet is performed each time it is replaced. It is necessary to align the circuit board with the circuit board connector and the circuit board side connector and the relay pin unit. This alignment work is complicated and causes a reduction in inspection efficiency.

  In addition, when a plurality of circuit boards are continuously inspected using an anisotropic conductive sheet having a minute pitch such that the electrodes of the circuit board are 200 μm or less, the anisotropic conductivity is obtained by repeatedly contacting the circuit board. Sheet misalignment is likely to occur.

  Then, the conductive path forming part of the anisotropic conductive sheet and the electrode position of the circuit board do not coincide with each other, and an excellent electrical connection cannot be obtained, so an excessive resistance value is measured and should be judged as a good product originally. The printed circuit board is likely to be erroneously determined as a defective product.

In addition, when obtaining an unevenly anisotropic anisotropic conductive sheet for inspecting a circuit board in which the electrodes to be inspected are arranged at a narrow pitch such that the distance between the electrodes to be inspected is 100 μm or less, adjacent conductive paths are formed. It is necessary to form so that the width | variety of the insulation part which mutually insulates between parts may be 100 micrometers or less.

  However, in the method of manufacturing a sheet by mold forming as disclosed in Patent Document 6 (Japanese Patent Laid-Open No. 3-196416), an insulating portion having a thickness of 100 μm or less is caused by the influence of a magnetic field action with an adjacent mold magnetic pole. Formation is difficult.

For this reason, the distance between the electrodes of the circuit board that can be inspected was about 80 to 100 μm.
In addition, an unevenly distributed anisotropic conductive sheet for inspecting a circuit board having a separation distance of electrodes to be inspected of 50 μm or less is substantially not obtained because it is extremely difficult to mold with a mold. .

  On the other hand, in a dispersed anisotropic conductive sheet in which conductive particles are arranged in the thickness direction and uniformly dispersed in the plane direction, high resolution can be obtained by reducing the thickness, so that the thickness is set to about 30 μm, As a resolution, it is possible to inspect a circuit board in which the distance between electrodes to be inspected is 50 μm or less.

  However, a thin dispersion-type anisotropic conductive sheet having a thickness of about 30 μm is one of the characteristics of the anisotropic conductive sheet, which is the absorption of mechanical shock due to the elasticity of the sheet body and the electric contact caused by soft contact between the electrodes. The ability to configure a global connection is almost lost.

  For this reason, when connecting a circuit board to be inspected having a plurality of electrodes to be inspected having a large number of height variations to the inspection apparatus, a large number of electrodes to be inspected can be connected simultaneously due to a decrease in the step absorption capacity of the anisotropic conductive sheet. It becomes difficult.

For example, in a circuit board on which a large number of electrodes are formed by plating, the variation in electrode height is about 20 μm.
In the dispersive anisotropic conductive sheet, the compression ratio that can stably achieve conduction when compressed in the thickness direction is about 20% or less.

  For example, if the compression exceeds 20%, the electrical conduction in the lateral direction is increased and the anisotropy of conduction is impaired, and permanent deformation of the elastomer as the base material occurs, making repeated use difficult.

For this reason, when inspecting a circuit board having an electrode including a height variation of about 20 μm, it is necessary to use a dispersed anisotropic conductive sheet having a thickness of 100 μm or more.
However, when a dispersed anisotropic conductive sheet having a thickness of 100 μm or more is used, it becomes substantially impossible to inspect a small circuit board having an electrode to be inspected of 50 μm or less.

  Furthermore, the dispersion-type anisotropic conductive sheet having a small thickness has a low ability to absorb mechanical shock because the elasticity of the sheet body is low, and when conducting repeated circuit board inspection using a circuit board inspection adapter, anisotropic conductive sheet is used. The dispersive anisotropic conductive sheet has to be replaced frequently and quickly, and the replacement work becomes complicated, and the inspection efficiency of the circuit board is lowered.

  From the above, in the circuit board inspection adapter using the anisotropic conductive sheet for inspecting a circuit board having an electrode to be inspected of 50 μm or less, the adapter that satisfies all of the resolution, the step absorption ability, and the repeated use durability It was not obtained.

Further, in the case of performing a four-terminal inspection in order to detect a potential electrical defect of the circuit board with high accuracy, two inspection electrodes (voltages) of the inspection circuit board with respect to one inspection electrode of the circuit board to be inspected. (For current and current) are connected, and the distance between the test electrodes forming a pair of the test circuit boards is reduced.

  For example, when the pitch between the electrodes to be inspected of the circuit board to be inspected is 200 μm, the diameter of the electrodes to be inspected is about 100 μm, and two inspection electrodes of the circuit board for inspection are provided for the electrodes to be inspected having a diameter of about 100 μm. Since they are connected, the separation distance between the inspection electrodes of the inspection circuit board can be provided only about 30 to 40 μm.

  As described above, conventional unevenly distributed anisotropic conductive sheets and distributed anisotropic conductive sheets have resolution, step absorption capacity, and cushioning properties for inspection devices that inspect circuit boards having a large number of electrodes to be inspected. However, a durable and sufficient performance was not obtained.

  In the circuit board inspection apparatus shown in FIG. 37, the current supply probes PA and PD and voltage measurement are performed on each of the two electrodes 202 and 204 to be inspected electrically connected to each other on the circuit board 200 to be inspected. The probe PB, PC is pressed and brought into contact, and in this state, current is supplied from the power supply device 206 between the current supply probes PA, PD, and the voltage signal detected by the voltage measurement probes PB, PC at this time Is processed by the electric signal processing device 208 to adopt a four-terminal method for obtaining the magnitude of the electric resistance between the electrodes 202 and 204 to be inspected.

  However, in this method, the current supply probes PA and PD and the voltage measurement probes PB and PC must be brought into contact with the electrodes 202 and 204 to be inspected with a considerably large pressing force, and the probe is made of metal. In addition, since the tip is pointed, the surface of the electrodes 202 and 204 to be inspected is damaged by pressing the probe, and the circuit board cannot be used. End up.

  Under such circumstances, the measurement of electrical resistance cannot be performed for all circuit boards as products, and it must be a so-called sampling inspection. Therefore, the yield of products cannot be increased after all.

In order to solve such a problem, conventionally, an inspection apparatus in which a connecting member that contacts an electrode to be inspected is made of a conductive elastomer has been proposed.
In Patent Document 7 (Japanese Patent Laid-Open No. 9-26446), an elastic connection member made of conductive rubber having conductive particles bound by an elastomer is disposed separately for a current supply electrode and a voltage measurement electrode. An inspection apparatus is disclosed.

  Further, Patent Document 8 (Japanese Patent Laid-Open No. 2000-74965) discloses a different electrode provided so as to be in contact with both surfaces of a current supply electrode and a voltage measurement electrode that are electrically connected to the same electrode to be inspected. An inspection apparatus having a common elastic connecting member made of a conductive elastomer is disclosed.

  Further, Patent Document 9 (Japanese Patent Laid-Open No. 2000-241485) discloses an elastic circuit comprising a test circuit board having a plurality of test electrodes formed on the surface and a conductive elastomer provided on the surface of the test circuit board. A connection member, and in a state where the electrode to be inspected is electrically connected to the plurality of inspection electrodes through the connection member, two of the inspection electrodes are selected, one of which is a current supply electrode, An inspection apparatus for measuring electric resistance using the other as a voltage measuring electrode is disclosed.

  According to such an inspection apparatus, the current connection electrode and the voltage measurement electrode are brought into contact with the electrode to be inspected of the circuit board to be inspected via the elastic connection member, thereby achieving electrical connection. Therefore, the electric resistance can be measured without damaging the electrode to be inspected.

However, when the electrical resistance between the electrodes is measured by the inspection apparatus having the configurations of Patent Document 7 and Patent Document 8, there are the following problems.
In recent years, in a circuit board, in order to obtain a high degree of integration, the size and pitch of electrodes or the distance between electrodes tend to be small.

  That is, in the inspection apparatus having the configurations of Patent Document 7 and Patent Document 8, each of the electrodes to be inspected on the circuit board to be measured whose electric resistance is to be measured is connected to the current supply electrode and the voltage measurement via the elastic connection member. Both electrodes must be electrically connected simultaneously.

  Therefore, in the inspection apparatus for measuring the electrical resistance of the circuit board to be inspected in which small-sized inspected electrodes are arranged at high density, this inspected corresponding to each of the small-sized inspected electrodes. Forming a current supply electrode and a voltage measurement electrode in a state of being separated from each other in a region equivalent to or smaller than the region occupied by the electrode, that is, for supplying a current having a size smaller than that of the electrode to be inspected It is necessary to form the electrode and the voltage measuring electrode in a state of being separated by a very small distance.

  Further, as a method for manufacturing a circuit board, in order to improve productivity, a circuit board connected body in which a plurality of circuit boards are connected by a single board material is manufactured, and each circuit board in the circuit board connected body in that state is manufactured. A method of manufacturing a plurality of separated circuit boards by collectively performing electrical inspections on and then cutting the circuit board connector is adopted.

  And, the circuit board assembly to be inspected has a considerably large area, and the number of electrodes to be inspected is very large, especially when manufacturing a multilayer circuit board, the number of steps in the manufacturing process is large. Since the number of times of receiving the heat history by the heat treatment is large, the electrode to be inspected is often formed in a state of being displaced from the initial arrangement position.

  In the case where the electrical resistance of the circuit board to be inspected formed in such a shifted state is measured by the inspection apparatus having the configuration of Patent Document 7 and Patent Document 8, each of the electrodes to be inspected is supplied with a current supply electrode. It is extremely difficult to electrically connect both the voltage measuring electrode and the voltage measuring electrode simultaneously.

  As a specific example, as shown in FIG. 38, when measuring the electrical resistance of the electrode 300 to be inspected having a diameter L of 300 μm, the current supply electrode 302 electrically connected to the electrode 300 to be inspected and the voltage measurement The separation distance D of the working electrode 304 is about 150 μm.

  However, as shown in FIGS. 39A and 39B, in the alignment of the circuit board to be inspected, the position of the electrode 300 to be inspected with respect to the current supply electrode 302 and the voltage measuring electrode 304 is as shown in FIG. When the current supply electrode 302 and the voltage measurement electrode 304 are displaced from each other by 75 μm in the direction in which the current supply electrode 302 and the voltage measurement electrode 304 are arranged, electrical connection between one of the current supply electrode 302 and the voltage measurement electrode 304 and the electrode 300 to be inspected is established. Not achieved and electrical resistance measurements cannot be made.

  In order to solve such a problem, it is conceivable to reduce the distance D between the current supply electrode 302 and the voltage measurement electrode 304 (for example, 100 μm or less), but it is extremely difficult to manufacture such an inspection apparatus. It is.

On the other hand, according to the inspection apparatus of Patent Document 9 (Japanese Patent Application Laid-Open No. 2000-241485), it is unnecessary to form a current supply electrode and a voltage measurement electrode corresponding to each of the electrodes to be inspected. Even if the circuit board to be inspected whose electrical resistance is to be measured has a large area and a large number of electrodes to be inspected, and small inspected electrodes are arranged at high density, The tolerance for misalignment is large, and the inspection apparatus can be easily manufactured.

However, since such an inspection apparatus is a measurement apparatus based on the pseudo four-terminal method, the measurement error range is large.
Therefore, it is difficult to measure the electrical resistance of a circuit board having a low electrical resistance between the electrodes with high accuracy.

  In order to solve such a problem, in Patent Document 10 (Japanese Patent Laid-Open No. 2003-322665), a plurality of connection electrodes including a core electrode and a ring electrode provided on the surface of the insulating substrate so as to surround the core electrode. A circuit board side connector in which a pair is formed has been proposed.

  According to such a circuit board-side connector, if alignment is performed so that at least a part of the core electrode is positioned on the electrode to be inspected in the circuit board whose electrical resistance is to be measured, the ring is formed on the electrode to be inspected. At least a part of the electrode is positioned.

  Therefore, even if the circuit board has a large number of small electrodes to be inspected with a large area, electrical connection of both the core electrode and the ring electrode to the electrode to be inspected can be reliably achieved. Further, by using one of the ring-shaped electrodes as a current supply electrode and the other as a voltage measuring electrode, the electrical resistance of the circuit board can be reliably measured with high accuracy.

However, such a circuit board-side connector has a complicated overall structure and is difficult to manufacture with a high yield.
JP-A-6-94768 Japanese Patent Laid-Open No. 5-159821 JP 7-248350 A Japanese Patent Application Laid-Open No. 8-271469 JP-A-8-338858 Japanese Patent Laid-Open No. 3-196416 JP-A-9-26446 JP 2000-74965 A JP 2000-241485 A JP 2003-322665 A

  In view of such a current situation, the present invention provides a required electric power for a circuit board to be inspected even if the circuit board to be inspected has a large area and a large number of electrodes to be inspected having a small size. Circuit board inspection apparatus using a circuit board-side connector, which can reliably achieve electrical connection, can reliably measure electrical resistance with high accuracy, and can be manufactured at a low cost, and An object of the present invention is to provide a circuit board inspection method.

  Also, a circuit board capable of carrying out an accurate inspection with good followability to the height and no poor conduction even with respect to the height variation of the inspected electrode of the circuit board to be inspected. It is an object of the present invention to provide an inspection apparatus and a circuit board inspection method.

  It is another object of the present invention to provide a circuit board inspection apparatus and a circuit board inspection method in which stress concentration at the time of inspection with respect to an anisotropic conductive sheet is well dispersed and excellent in repeated use durability.

  In addition, there is provided a circuit board inspection apparatus that eliminates the need for arranging conductive pins at regular intervals, reduces the drilling work of drilling through holes in the insulating plate holding the conductive pins, and can reduce costs. The purpose is to do.

  In addition, a circuit board inspection apparatus and circuit board that can be inspected with high resolution, absorbs a step due to an electrode to be inspected of a circuit board to be inspected, and has excellent durability for repeated use of an anisotropic conductive sheet. The purpose is to provide an inspection method.

The present invention was invented in order to achieve the problems and objects in the prior art as described above,
The circuit board inspection apparatus according to the present invention includes:
A circuit board inspection apparatus that performs an electrical inspection by sandwiching both surfaces of a circuit board to be inspected between a pair of first inspection jigs and a second inspection jig.
The first inspection jig and the second inspection jig are respectively
A first anisotropic conductive sheet;
A pitch converting substrate that is disposed on the circuit board side to be inspected of the first anisotropic conductive sheet and converts the electrode pitch between one surface side and the other surface side of the substrate;
A second anisotropic conductive sheet disposed on the circuit board side to be inspected of the pitch conversion board;
Insulating having a test core electrode electrically connected to the ring electrode and a connection core electrode electrically connected to the relay electrode, disposed on the circuit board side to be inspected of the second anisotropic conductive sheet A relay board made of a support sheet;
A third anisotropic conductive sheet disposed on the inspected circuit board side of the relay board and having a plurality of through holes according to a pattern corresponding to the inspected electrode of the inspected circuit board whose electrical resistance is to be measured;
The third anisotropically conductive sheet has a plurality of through holes on the side of the circuit board to be inspected according to a pattern corresponding to the electrode to be inspected of the circuit board to be measured for electrical resistance, and surrounds the through hole. A flexible electrode sheet having a plurality of the ring-shaped electrodes formed thereon and the relay electrodes electrically connected to the ring-shaped electrodes on the back surface;
A fourth anisotropic conductive sheet provided on the inspected circuit board side of the electrode sheet;
A circuit board-side connector with
A plurality of conductive pins arranged at a constant pitch;
An insulating plate that supports the conductive pin so as to be movable up and down;
A relay pin unit with
A connector board for electrically connecting the tester and the relay pin unit;
A fifth anisotropic conductive sheet disposed on the relay pin unit side of the connector board;
A base plate disposed on the side opposite to the relay pin unit of the connector board;
A tester side connector with
It is comprised from these.

Further, the circuit board inspection apparatus of the present invention comprises:
The inspection core electrode and the connection core electrode in the relay board of the circuit board side connector,
It is provided to be movable in the thickness direction of the insulating support sheet.

Further, the circuit board inspection apparatus of the present invention comprises:
The circuit board side connector is
Each of the electrodes to be inspected on both sides of the circuit board to be inspected can be measured by simultaneously electrically connecting the ring electrode of the electrode sheet and the core electrode for inspection of the relay board on the circuit board side connector. State,
In this measurable state, one of the inspection core electrode and the ring-shaped electrode electrically connected to one designated electrode to be inspected is used as a current supply electrode, and the other is used as a voltage measurement electrode. By using, the measurement of the electrical resistance concerning one designated said to-be-inspected electrode is performed, It is characterized by the above-mentioned.

Further, the circuit board inspection apparatus of the present invention comprises:
The relay pin unit is
A plurality of the conductive pins arranged at a predetermined pitch; and
A pair of spaced apart first and second insulating plates for supporting the conductive pins movably in the axial direction;
An intermediate holding plate disposed between the first insulating plate and the second insulating plate;
A first support pin disposed between the first insulating plate and the intermediate holding plate;
A second support pin disposed between the second insulating plate and the intermediate holding plate;
It is comprised from these.

Further, the circuit board inspection apparatus of the present invention comprises:
The relay pin unit is
A first contact support position of the first support pin with respect to the intermediate holding plate;
A second contact support position of the second support pin with respect to the intermediate holding plate;
The intermediate holding plate is disposed at a different position on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate.

Further, the circuit board inspection apparatus of the present invention comprises:
When sandwiching both surfaces of the circuit board to be inspected between the inspection jigs by the pair of first inspection jig and the second inspection jig,
The intermediate holding plate bends in the direction of the second insulating plate around the first contact support position of the first support pin with respect to the intermediate holding plate, and
The intermediate holding plate is configured to bend in the direction of the first insulating plate around a second contact support position of the second support pin with respect to the intermediate holding plate.

Further, the circuit board inspection apparatus of the present invention comprises:
The first contact support position of the first support pin with respect to the intermediate holding plate is
Arranged in a grid pattern on the intermediate holding plate projection surface,
Second contact support positions of the second support pins with respect to the intermediate holding plate are arranged in a grid pattern on the intermediate holding plate projection surface,
In the intermediate holding plate projection surface, one second abutment support position is disposed in a unit lattice region composed of four adjacent first abutment support positions, and
In the intermediate holding plate projection surface, one first abutment support position is arranged in a unit lattice area composed of four adjacent second abutment support positions. And

Further, the circuit board inspection apparatus of the present invention comprises:
The relay pin unit is
A plurality of intermediate holding plates disposed at a predetermined interval between the first insulating plate and the second insulating plate;
A holding plate support pin disposed between the adjacent intermediate holding plates;
With
In at least one of the intermediate holding plates, a contact support position of the holding plate support pin that contacts the intermediate holding plate from one surface side with respect to the intermediate holding plate;
The first support pin that contacts the intermediate holding plate from the other surface side, the second support pin, or the contact support position of the holding plate support pin with respect to the intermediate holding plate,
The intermediate holding plate is disposed at different positions on the intermediate holding plate projection surface projected in the thickness direction.

Further, the circuit board inspection apparatus of the present invention comprises:
In all the intermediate holding plates,
A contact support position of the support plate support pin that contacts the intermediate support plate from one side with respect to the intermediate support plate;
The first support pin that contacts the intermediate holding plate from the other surface side, the second support pin, or the contact support position of the holding plate support pin with respect to the intermediate holding plate,
The intermediate holding plate is disposed at different positions on the intermediate holding plate projection surface projected in the thickness direction.

Further, the circuit board inspection apparatus of the present invention comprises:
The first anisotropic conductive sheet is
A plurality of conductive path forming portions extending in the thickness direction;
An insulating part that insulates these conductive path forming parts from each other;
The conductive particles are contained only in the conductive path forming portion, whereby the conductive particles are dispersed non-uniformly in the plane direction, and the conductive path forming portion protrudes on one side of the sheet. And

Further, the circuit board inspection apparatus of the present invention comprises:
The fifth anisotropic conductive sheet is
A plurality of conductive path forming portions extending in the thickness direction;
An insulating part that insulates these conductive path forming parts from each other;
The conductive particles are contained only in the conductive path forming portion, whereby the conductive particles are dispersed non-uniformly in the plane direction, and the conductive path forming portion protrudes on one side of the sheet. And

Further, the circuit board inspection apparatus of the present invention comprises:
The plurality of conductive pins are:
A rod-shaped central portion shorter than the distance between the first insulating plate and the second insulating plate;
It consists of a pair of end portions that are formed on both ends of the center portion and have a diameter smaller than that of the center portion,
Each of the pair of end portions is inserted into a through hole having a diameter smaller than the center portion formed in the first insulating plate and the second insulating plate and larger than the pair of end portions,
Thus, the conductive pin is supported so as to be movable in the axial direction.

Further, the circuit board inspection apparatus of the present invention comprises:
Between the first insulating plate and the intermediate holding plate, between the second insulating plate and the intermediate holding plate, or between the intermediate holding plates,
A bending holding plate having a through hole through which the conductive pin is inserted is provided;
The plurality of conductive pins are:
A through hole formed in the first insulating plate and the second insulating plate;
A through hole formed in the bent holding plate;
The fulcrum is pressed laterally in opposite directions and bent at the position of the through hole of the bent holding plate, whereby the conductive pin is supported so as to be movable in the axial direction.

Further, the circuit board inspection apparatus of the present invention comprises:
The electrodes to be inspected on both surfaces of the substrate to be inspected are solder ball electrodes.

Further, the circuit board inspection method of the present invention comprises:
A circuit board inspection method using the circuit board inspection apparatus according to any one of the above,
The electrical inspection is performed by sandwiching both surfaces of the circuit board to be inspected between the inspection jigs by the pair of first inspection jig and the second inspection jig.

  According to the circuit board inspection apparatus and the circuit board inspection method using the circuit board side connector of the present invention, even if the circuit board has a large number of electrodes to be inspected having a large area and a small size, the electrodes to be inspected The electrical connection of both the inspection core electrode and the ring electrode can be reliably achieved.

  Further, according to the present invention, since the inspection core electrode and the ring-shaped electrode are electrically independent from each other, one of the inspection core electrode and the ring-shaped electrode electrically connected to the electrode to be inspected Is used as a current supply electrode, and the other is used as a voltage measurement electrode, whereby the electrical resistance of the circuit board to be inspected can be measured with high accuracy.

  Further, according to the present invention, even if the circuit board to be inspected whose electrical resistance is to be measured has a large area and a large number of small electrodes to be inspected, the required electrical connection to the circuit board to be inspected can be achieved. It can be reliably achieved, and the electrical resistance can be reliably measured with high accuracy, and can be manufactured at a lower cost.

  Further, according to the present invention, even with respect to the height variation of the inspected electrode of the circuit board to be inspected, the followability with respect to the height is good and no conduction failure occurs, and an accurate inspection is performed. be able to.

Furthermore, according to the present invention, a highly reliable circuit board can be electrically inspected even when the circuit board to be inspected has minute electrodes with a fine pitch.
In addition, according to the present invention, even with respect to the height variation of the electrode to be inspected of the circuit board to be inspected, the followability with respect to the height is good, and there is no conduction failure, and an accurate inspection is performed. Is possible.

Furthermore, according to this invention, the stress concentration at the time of the test | inspection with respect to an anisotropic conductive sheet is disperse | distributed favorably, and the repeated use durability can be improved.
Further, according to the present invention, there is little drilling work by drilling a through hole in the insulating plate holding the conductive pin, and the cost can be reduced.

  Further, according to the present invention, it is possible to perform an accurate inspection particularly on a substrate to be inspected in which the electrodes to be inspected on both sides are solder ball electrodes.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In the following description, the symbol “a” is used to collectively refer to a pair of identical components (for example, the circuit board connector 21a and the circuit board connector 21b) in the first inspection jig and the second inspection jig. , “B” may be omitted (for example, the circuit board connector 21a and the circuit board connector 21b may be collectively referred to as “circuit board connector 21”).
<Inspection device>
FIG. 1 is a cross-sectional view illustrating an embodiment of the inspection apparatus of the present invention, and FIG. 2 is a cross-sectional view illustrating a stacked state when the inspection apparatus of FIG. 1 is used for inspection.

  This inspection apparatus performs an electrical inspection of a circuit board to be inspected by measuring an electrical resistance between electrodes to be inspected in a circuit board 1 to be inspected such as a printed circuit board for mounting an integrated circuit or the like. Is.

  1 and 2, the inspection apparatus includes a first inspection jig 11a disposed on the upper surface side of the circuit board 1 to be inspected and a second inspection jig disposed on the lower surface side. 11b are arranged so as to face each other vertically.

Since the first inspection jig 11a and the second inspection jig 11b have the same configuration, detailed description of the second inspection jig 11b is omitted.
The first inspection jig 11a includes a circuit board side connector 21a, a relay pin unit 31a, and a tester side connector 41a.

  The circuit board-side connector 21a is disposed on the circuit board side to be inspected of the first anisotropic conductive sheet 71a and the first anisotropic conductive sheet 71a, and the electrode pitch is set between one side of the board and the other side. A pitch conversion board 72a to be converted, a second anisotropic conductive sheet 73a arranged on the circuit board side to be inspected of the pitch conversion board 72a, and a circuit board side of the second anisotropic conductive sheet 73a to be inspected A relay substrate 76a made of an insulating support sheet having an inspection core electrode 7 electrically connected to the ring electrode 13 and a connection core electrode 60 electrically connected to the relay electrode 14, and a relay substrate 76a A third anisotropic conductive sheet 75a having a plurality of through-holes 19 according to a pattern corresponding to the electrode to be inspected of the circuit board 1 to be measured, the electrical resistance of which is to be measured; Conductivity A plurality of through holes 12 are provided on the circuit board side of the circuit board 75a in accordance with a pattern corresponding to the electrode to be inspected of the circuit board 1 to be measured, and a plurality of rings are provided so as to surround the through hole 12 A flexible electrode sheet 74a having a relay electrode electrically connected to the ring electrode 13 on the back surface, and a fourth anisotropic conductive material provided on the circuit board side of the electrode sheet 74a. Sheet 77a.

  The relay pin unit 31a includes a plurality of conductive pins 32a arranged at a predetermined pitch, a pair of spaced apart first insulating plates 34a and second insulating plates 35a that support the conductive pins 32a so as to be movable in the axial direction, An intermediate holding plate 36a disposed between the first insulating plate 34a and the second insulating plate 35a, a first support pin 33a disposed between the first insulating plate 34a and the intermediate holding plate 36a, and a second And a second support pin 37a disposed between the insulating plate 35a and the intermediate holding plate 36a.

Further, the tester-side connector 41a includes a connector board 43a for electrically connecting the tester and the relay pin unit 31a, a fifth anisotropic conductive sheet 42a disposed on the relay pin unit 31a side of the connector board 43a, a connector A base plate 46a disposed on the opposite side of the substrate 43a from the relay pin unit 31a.

The circuit board 1 to be inspected has an inspected electrode 2 to be inspected 2 formed on the upper surface, and an inspected electrode 3 on the other surface formed on the lower surface thereof, which are electrically connected to each other. ing.
The one-surface-side inspected electrode 2 and the other-surface-side inspected electrode 3 are not particularly limited, but in this embodiment, the one-surface-side inspected electrode 2 and the other-surface-side inspected electrode are inspected. It is assumed that the circuit board 1 to be inspected using a solder ball electrode as the electrode 3 is used.
<Pitch conversion substrate 72>
3 is a diagram showing the surface of the pitch conversion substrate 72 on the circuit board side, FIG. 4 is a diagram showing the surface of the pitch conversion substrate 72 on the pin side, and FIG. 5 is a diagram showing the pitch conversion substrate 72 and the relay substrate. FIG. 7 is a partial cross-sectional view showing a state in which 76 and a circuit board 1 to be inspected are stacked.

As shown in FIG. 3, one surface (inspected circuit board 1 side) of the pitch conversion substrate 72 is connected to one surface-side inspected electrode 2 and other surface-side inspected electrode 3 on the inspected circuit board 1. A plurality of connection electrodes 25 to be electrically connected are formed.

These connection electrodes 25 are arranged so as to correspond to the patterns of the one-surface-side inspected electrode 2 and the other-surface-side inspected electrode 3 of the circuit board 1 to be inspected.
The connection electrode 25 is a pair of spaced apart current terminal electrodes 27 and voltage terminal electrodes that are connected to one single-surface-side inspection electrode 2 (other-surface-side inspection electrode 3) of the circuit board 1 under inspection. 28.

On the other hand, a plurality of terminal electrodes 24 that are electrically connected to the conductive pins 32 of the relay pin unit 31 are formed on the other surface of the pitch conversion substrate 72 as shown in FIG.
These terminal electrodes 24 have, for example, a pitch of 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, 0.3 mm or 0.2 mm. They are arranged on lattice points having a constant pitch, and the pitch is the same as the arrangement pitch of the conductive pins 32a and 32b of the relay pin unit.

  Further, as shown in FIG. 5, each connection electrode 25 is electrically connected to the corresponding terminal electrode 24 of FIG. 4 by the wiring 52 of FIG. 3 and the internal wiring 53 penetrating in the thickness direction of the insulating substrate 51. Has been.

  The pitch conversion substrate 72 includes an insulating layer 54 formed so that each connection electrode 25 is exposed on the surface of the insulating substrate. The thickness of the insulating layer 54 is preferably 5 to 100 μm, more preferably 10 to 60 μm. It is.

When this thickness is excessive, it may be difficult to electrically connect the connection electrode 25 and the anisotropic conductive sheet.
As a material for forming the insulating layer 54 of the pitch conversion substrate 72, a material generally used as a base material of a printed circuit board can be used.

Specific examples include polyimide resins, glass fiber reinforced polyimide resins, glass fiber reinforced epoxy resins, and glass fiber reinforced bismaleimide triazine resins. <Method for Manufacturing Pitch Conversion Substrate 72>
The pitch conversion substrate 72 can be manufactured as follows.

  First, a laminated material in which thin metal layers are laminated on both sides of a flat insulating substrate is prepared, and this laminated material penetrates in the thickness direction of the laminated material corresponding to the pattern corresponding to the terminal electrode to be formed. A plurality of through holes are formed by a numerically controlled drilling apparatus, a photo etching process, a laser processing process, or the like.

Next, electroless plating and electrolytic plating are performed in the through holes formed in the laminated material to form via holes connected to the thin metal layers on both sides of the substrate.
Thereafter, a photoetching process is performed on the thin metal layer to form a wiring pattern and connection electrodes on the surface of the insulating substrate, and to form terminal electrodes on the opposite surface.

  Then, the insulating layer 54 is formed on the surface of the insulating substrate so that the connection electrodes 25 are exposed, and the terminal electrodes 24 are exposed on the surface on the opposite side, whereby the pitch conversion substrate 72 is obtained.

The thickness of the insulating layer 54 is preferably 5 to 100 μm, more preferably 10 to 60 μm.
<Electrode sheet 74>
6 is an enlarged plan view showing the main part of the electrode sheet 74, and FIG. 7 is an explanatory sectional view showing the main part of the electrode sheet 74 in an enlarged manner.

  As shown in FIGS. 6 and 7, the electrode sheet 74 is a flexible insulation having a plurality of through holes 12 formed in accordance with a pattern corresponding to the pattern of the electrode to be inspected in the circuit board 1 to be inspected. The adhesive sheet 11 is included.

  On the surface of the insulating sheet 11, a plurality of ring electrodes 13 are formed so as to surround each of the through holes 12. A plurality of relay electrodes 14 are formed on the back surface of the insulating sheet 11 according to an appropriate pattern.

Further, the relay electrode 14 is disposed so as to be positioned in the middle between the through holes 12 of the insulating sheet 11.
Each of the relay electrodes 14 is electrically connected to the ring-shaped electrode 13 via a short-circuit portion 15 extending through the insulating sheet 11 in the thickness direction and a wiring portion 16B formed on the surface of the insulating sheet 11. It is connected.

As a material constituting the insulating sheet 11, a resin material having high mechanical strength is preferably used, and examples thereof include a liquid crystal polymer and polyimide.
Moreover, as a material which comprises the ring-shaped electrode 13, the relay electrode 14, the short circuit part 15, and the wiring part 16B, copper, nickel, gold | metal | money, the laminated body of these metals, etc. can be used.

Although the thickness of the insulating sheet 11 will not be specifically limited if the insulating sheet 11 has a softness | flexibility, Preferably it is 5-50 micrometers, More preferably, it is 8-25 micrometers.
The diameter of the through-hole 12 of the insulating sheet 11 may be a size that allows the inspection core electrode 7 of the relay board 76 described later to be movably inserted, and is preferably 1.05 to the diameter of the inspection core electrode 7. It is 2 times, more preferably 1.1 to 1.7 times.

  The inner diameter of the ring-shaped electrode 13 is set according to the diameter of the electrode to be inspected that is electrically connected, and the electrical connection to the electrode to be inspected can be reliably achieved. It is preferably ˜110%, more preferably 70 to 100%.

In addition, the inner diameter of the ring electrode 13 is preferably 1.1 to 2 times the diameter of the inspection core electrode 7 from the viewpoint of ensuring insulation with the inspection core electrode 7 in the relay substrate 76 described later. More preferably, it is 1.2 to 1.7 times.
<Method for Manufacturing Electrode Sheet 74>
The electrode sheet 74 can be manufactured as follows.

  First, as shown in FIG. 8A, a laminated material 10A in which a metal layer 16A is formed on the surface of the insulating sheet 11 is prepared, and the laminated material 10A is prepared as shown in FIG. 8B. A plurality of through holes 10H that penetrate each of the insulating sheet 11 and the metal layer 16A in the thickness direction are formed according to the pattern of the short-circuit portion 15 of the electrode sheet 74 to be formed.

  Next, as shown in FIG. 8C, the relay electrode 14 is formed on the back surface of the insulating sheet 11 by performing photolithography and plating on the laminated material 10A in which the through holes 10H are formed. The short-circuit portion 15 extending in the thickness direction of the insulating sheet 11 that electrically connects the relay electrode 14 and the metal layer 16A is formed.

Thereafter, a part of the metal layer 16A is subjected to photolithography and etching to remove a part thereof, so that the ring-shaped electrode 13 and the wiring portion are formed on the surface of the insulating sheet 11 as shown in FIG. 16B is formed.

Then, by performing laser processing on the insulating sheet 11 using the ring-shaped electrode 13 as a mask, the through holes 12 are formed in the insulating sheet 11, and the electrode sheet 74 is obtained.
<First Anisotropic Conductive Sheet 71 (Fifth Anisotropic Conductive Sheet 42)>
FIG. 9A is a partial cross-sectional view of the first anisotropic conductive sheet 71.

  Since the first anisotropic conductive sheet 71 and the fifth anisotropic conductive sheet 42 are basically the same, the description of the fifth anisotropic conductive sheet 42 is the description of the first anisotropic conductive sheet 71. Therefore, the detailed description is omitted.

  As shown in FIG. 9A, the first anisotropic conductive sheet 71 disposed on the pitch conversion substrate 23 on the relay pin unit 31 side includes a large number of conductive particles in an insulating elastic polymer material. Reference numeral 80 denotes a conductive path forming portion 79 formed by being arranged in the thickness direction, and an insulating portion 78 that separates each conductive path forming portion 79.

As described above, the conductive particles 80 are unevenly dispersed in the surface direction only in the conductive path forming portion 79.
The thickness of the conductive path forming portion 79 is preferably 0.1 to 2 mm, more preferably 0.2 to 1.5 mm.

  When this thickness is less than 0.1 mm, the absorption capacity for pressurization in the thickness direction is low, the absorption of the applied pressure by the inspection jig during inspection is reduced, and the effect of reducing the impact on the circuit board connector 21 is reduced. Decrease. For this reason, it becomes difficult to suppress the deterioration of the second anisotropic conductive sheet 73, the third anisotropic conductive sheet 75, and the fourth anisotropic conductive sheet 77, and these anisotropic characteristics during the repeated inspection of the circuit board 1 to be inspected. The number of times the conductive sheet is replaced increases, and the inspection efficiency decreases.

On the other hand, when this thickness exceeds 2 mm, the electrical resistance in the thickness direction tends to increase, and electrical inspection may be difficult.
The thickness of the insulating part 78 is preferably substantially the same as or smaller than the thickness of the conductive path forming part 79. In this way, the thickness of the insulating portion 78 is made smaller than the thickness of the conductive path forming portion 79 so that the conductive path forming portion 79 forms a protruding portion 87 that protrudes from the insulating portion 78, thereby preventing pressure in the thickness direction. The conductive path forming portion 79 can be easily deformed, and the ability to absorb pressure is increased.

Thereby, the applied pressure of the inspection jig can be absorbed at the time of inspection, and the impact on the circuit board side connector can be reduced.
When magnetic conductive particles are used for the conductive particles 80 constituting the first anisotropic conductive sheet 71, the number average particle diameter is preferably 5 to 200 μm, more preferably 5 to 150 μm, and still more preferably 10 to 100 μm. It is.

Here, the “number average particle diameter of the magnetic conductive particles” means that measured by a laser diffraction scattering method.
When the number average particle diameter of the magnetic conductive particles is 5 μm or more, the pressure deformation of the conductive path forming portion 79 of the first anisotropic conductive sheet 71 is facilitated.

  Further, when the magnetic conductive particles are oriented by a magnetic field orientation process in the manufacturing process, the magnetic conductive particles are easily oriented. When the number average particle diameter of the magnetic conductive particles is 200 μm or less, the elasticity of the conductive path forming portion 79 of the anisotropic conductive sheet is good and the pressure deformation is easy.

The ratio W / D between the thickness W (μm) of the conductive path forming portion 79 and the number average particle diameter D (μm) of the magnetic conductive particles is preferably 1.1-10.
When the ratio W / D is less than 1.1, since the diameter of the magnetic conductive particles is equal to or larger than the thickness of the conductive path forming portion 79, the elasticity of the conductive path forming portion 79 is reduced, The absorption capability of the applied pressure in the thickness direction is reduced.

  For this reason, the ability to absorb the applied pressure of the inspection jig at the time of inspection is reduced, and the effect of mitigating the impact on the circuit board side connector 21 is reduced. Therefore, the second anisotropic conductive sheet 73 and the third anisotropic It becomes difficult to suppress the deterioration of the conductive sheet 75 and the fourth anisotropic conductive sheet 77. As a result, the number of times these anisotropic conductive sheets are replaced during the repeated inspection of the circuit board 1 to be inspected increases, and the inspection efficiency is improved. It tends to decrease.

  On the other hand, when the ratio W / D exceeds 10, a large number of conductive particles are arranged in the conductive path forming portion 79 to form a chain, and there are a large number of contacts between the conductive particles. Value tends to be high.

  The elastic polymer that is the base material of the conductive path forming portion 79 preferably has a durometer hardness measured by a type A durometer of 15 to 60, more preferably 20 to 50, and even more preferably 25 to 45.

  When the durometer hardness of the elastic polymer is less than 15, the compression and deformation of the sheet when pressed in the thickness direction is large, and a large permanent distortion occurs. Tends to be difficult.

When the durometer hardness of the elastic polymer is larger than 60, the deformation when pressed in the thickness direction becomes small, so that the absorption capacity for the pressing force in the thickness direction becomes small.
The elastic polymer serving as the base material of the conductive path forming portion 79 is not particularly limited as long as it exhibits the durometer hardness described above, but silicone rubber is preferably used from the viewpoint of processability and electrical characteristics.

The insulating portion 78 of the first anisotropic conductive sheet 71 is formed of an insulating material that does not substantially contain conductive particles.
As the insulating material, for example, an insulating polymer material, an inorganic material, a metal material whose surface is insulated, etc. can be used. If the same material as the elastic polymer used for the conductive path forming portion is used, the insulating material can be produced. Is easy.

When an elastic polymer is used as the material for the insulating portion, it is preferable to use a material having a durometer hardness in the above range.
As the magnetic conductive particles, the same conductive particles as those used for the second anisotropic conductive sheet 73, the third anisotropic conductive sheet 75, and the fourth anisotropic conductive sheet 77 described later can be used.
<Method for Manufacturing First Anisotropic Conductive Sheet 71 (Fifth Anisotropic Conductive Sheet 42)>
The first anisotropic conductive sheet 71 can be manufactured by the following method.

  First, each of the overall shapes is substantially flat, and consists of an upper mold and a lower mold that correspond to each other, while applying a magnetic field to the material layer filled in the molding space between the upper mold and the lower mold. An anisotropic conductive sheet molding die having a configuration capable of heat-curing the material layer is prepared.

In this anisotropic conductive sheet molding die, an iron is used to generate a strength distribution in the magnetic field in the mold in order to form a portion having conductivity at an appropriate position by applying a magnetic field to the material layer. A substrate having a mosaic layer in which ferromagnetic portions made of nickel and the like and nonmagnetic portions made of non-magnetic metal such as copper or resin are alternately arranged is used.

The ferromagnetic portions are arranged corresponding to the pattern of the conductive path forming portion to be formed.
The molding surface of the upper mold is flat, and the molding surface of the lower mold is slightly uneven corresponding to the conductive path forming portion 79 of the first anisotropic conductive sheet 71 to be formed.

  Next, molding is performed by injecting a molding material containing conductive particles 80 exhibiting magnetism into a polymer material that is cured to become an elastic polymer substance into the molding space of the anisotropic conductive sheet molding die. A material layer is formed.

  Then, by using the upper and lower ferromagnet portions and the nonmagnetic portion, and applying a magnetic field having an intensity distribution in the thickness direction to the formed molding material layer, the conductive particles 80 are formed. Then, the conductive particles 80 are assembled so as to be aligned between the ferromagnetic part in the upper die and the ferromagnetic part in the lower die located immediately below the upper die so as to be aligned in the thickness direction.

Then, by curing the molding material layer in this state, the first anisotropic conductive sheet 71 in which the plurality of columnar conductive path forming portions 79 are insulated from each other by the insulating portion 78 is manufactured.
<Second anisotropic conductive sheet 73>
As shown in FIG. 9B, the second anisotropic conductive sheet 73 is basically the first except that the thickness of the insulating portion 78 is substantially the same as the thickness of the conductive path forming portion 79. The configuration is the same as that of the anisotropic conductive sheet 71 (the fifth anisotropic conductive sheet 42).
<Method for Manufacturing Second Anisotropic Conductive Sheet 73>
The manufacturing method of the second anisotropic conductive sheet 73 is basically the same as that of the first anisotropic conductive sheet except that the anisotropic conductive sheet molding die used is not provided with irregularities corresponding to the conductive path forming portion 79. This is the same as the manufacturing method of the anisotropic conductive sheet 71 (the fifth anisotropic conductive sheet 42).
<Fourth anisotropic conductive sheet 77>
FIG. 10 is an explanatory sectional view showing a part of the fourth anisotropic conductive sheet 77 in an enlarged manner.

  The fourth anisotropic conductive sheet 77 is a conductive particle in a state in which the conductive particles P exhibiting magnetism are aligned in the thickness direction in the insulating elastic polymer substance to form a chain. The chain by P is contained in a state dispersed in the plane direction.

As the elastic polymer material forming the fourth anisotropic conductive sheet 77, a polymer material having a crosslinked structure is preferable.
Various materials can be used as the curable polymer substance-forming material that can be used to obtain such an elastic polymer substance.

  Specific examples thereof include conjugated diene rubbers such as polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber, hydrogenated products thereof, and styrene-butadiene-diene block. Copolymer rubber, block copolymer rubber such as styrene-isoprene block copolymer and hydrogenated products thereof, chloroprene, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, ethylene -Propylene-diene copolymer rubber etc. are mentioned.

In these, it is preferable to use a silicone rubber from a viewpoint of durability, a moldability, and an electrical property.
As the silicone rubber, those obtained by crosslinking or condensing liquid silicone rubber are preferable.

The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10 ⁻¹ sec, and may be any of a condensation type, an addition type, a vinyl group or a hydroxyl group. Good.

Specific examples include dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, methyl phenyl vinyl silicone raw rubber, and the like.
The silicone rubber preferably has a molecular weight Mw (referred to as a standard polystyrene equivalent weight average molecular weight; the same shall apply hereinafter) of 10,000 to 40,000.

  Moreover, since favorable heat resistance is obtained in the obtained 4th anisotropic conductive sheet 77, the value of molecular weight distribution index (ratio Mw / Mn of standard polystyrene conversion weight average molecular weight Mw and standard polystyrene conversion number average molecular weight Mn) The same shall apply hereinafter) is preferably 2 or less.

  As the conductive particles P contained in the fourth anisotropic conductive sheet 77, the conductive particles P exhibiting magnetism are used because the particles can be easily oriented in the thickness direction by a method described later.

  Examples of such conductive particles P include magnetic metal particles such as iron, cobalt and nickel, alloy particles thereof, particles containing these metals, or core particles using these particles as core particles. On the surface of the core particle, the surface is plated with a metal having good conductivity such as gold, silver, palladium, rhodium, or non-magnetic metal particles or inorganic particles such as glass beads or polymer particles. Examples include those plated with a conductive magnetic metal such as nickel and cobalt.

Among these, it is preferable to use nickel particles as core particles and the surfaces thereof plated with gold having good conductivity.
As means for coating the surface of the core particles with the conductive metal, for example, chemical plating or electrolytic plating, sputtering, vapor deposition or the like is used.

  In the case where the conductive particle P is one in which the surface of the core particle is coated with a conductive metal, good conductivity can be obtained, and therefore the coverage of the conductive metal on the particle surface (relative to the surface area of the core particle). The ratio of the conductive metal coating area) is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.

  Further, the coating amount of the conductive metal is preferably 0.5 to 50% by mass of the core particle, more preferably 2 to 30% by mass, further preferably 3 to 25% by mass, and particularly preferably 4 to 20% by mass. %.

  Further, when the conductive metal to be coated is gold, the coating amount is preferably 0.5 to 30% by mass of the core particle, more preferably 2 to 20% by mass, and further preferably 3 to 15%. % By mass.

Moreover, it is preferable that the number average particle diameter of the electroconductive particle P is 3-20 micrometers, More preferably, it is 5-15 micrometers.
When this number average particle diameter is too small, it may be difficult to orient the conductive particles P in the thickness direction in the production method described later.

On the other hand, when the number average particle diameter is excessive, it may be difficult to obtain the fourth anisotropic conductive sheet 77 with high resolution.
Moreover, it is preferable that the particle diameter distribution (Dw / Dn) of the electroconductive particle P is 1-10, More preferably, it is 1.01-7, More preferably, it is 1.05-5, Most preferably, it is 1.1- 4.

  Further, the shape of the conductive particles P is preferably spherical, star-shaped, or secondary particles in which they are aggregated in that they can be easily dispersed in the polymer substance-forming material.

  Further, as the conductive particles P, those whose surfaces are treated with a coupling agent such as a silane coupling agent or a lubricant can be appropriately used. By treating the particle surface with a coupling agent or a lubricant, the durability of the obtained fourth anisotropic conductive sheet 77 is improved.

Such conductive particles P are preferably contained in the fourth anisotropic conductive sheet 77 at a volume fraction of 10 to 40%, particularly 15 to 35%.
When this ratio is too small, the fourth anisotropic conductive sheet 77 having sufficiently high conductivity in the thickness direction may not be obtained.

On the other hand, if this ratio is excessive, the obtained fourth anisotropic conductive sheet 77 tends to be fragile and the necessary elasticity may not be obtained.
Moreover, it is preferable that the thickness of the 4th anisotropic conductive sheet 77 is 20-100 micrometers, More preferably, it is 25-70 micrometers.

When this thickness is too small, sufficient unevenness absorbing ability may not be obtained. On the other hand, if this thickness is excessive, high resolution may not be obtained.
<Method for Manufacturing Fourth Anisotropic Conductive Sheet 77>
The fourth anisotropic conductive sheet 77 can be manufactured as follows.

  First, as shown in FIG. 11 (a), an opening having a shape suitable for the planar shape of the sheet-like one-side molding member 30 and the other-side molding member 62 and the target fourth anisotropic conductive sheet 77, respectively. A frame-shaped spacer 63 having a thickness corresponding to the thickness is prepared.

Further, a conductive sheet material 17B is prepared in which conductive particles are contained in a liquid polymer substance-forming material that is cured to become an elastic polymer substance.
Then, as shown in FIG. 11B, a spacer 63 is arranged on the molding surface (the upper surface in FIG. 11B) of the other surface side molding member 62, and on the molding surface of the other surface side molding member 62. The prepared conductive sheet material 17B is applied to the opening 32K of the spacer 63, and the one-surface side molded member 30 is electrically conductive on the conductive sheet material 17B on its molding surface (the lower surface in FIG. 11B). It arrange | positions so that the sheet | seat material 17B may be contact | connected.

In the above, as the one side molding member 30 and the other side molding member 62, resin sheets made of polyimide resin, polyester resin, acrylic resin, or the like can be used.
Moreover, it is preferable that the thickness of the 1st surface side molded member 30 and the other surface side molded member 62 is 50-500 micrometers, More preferably, it is 75-300 micrometers.

If this thickness is less than 50 μm, the strength required for the molded member may not be obtained.
On the other hand, when this thickness exceeds 500 micrometers, it may become difficult to make a magnetic field of required intensity act on the material layer for conductive sheets mentioned below.

  Next, as shown in FIG. 12, the conductive sheet material 17 </ b> B is clamped by the one-side molding member 30 and the other-side molding member 62 using the pressure roll device 67 including the pressure roll 65 and the support roll 66. Thus, the conductive sheet material layer 17 </ b> A having a required thickness is formed between the one-side molding member 30 and the other-side molding member 62.

In the conductive sheet material layer 17A, as shown in an enlarged view in FIG. 13A, the conductive particles P are contained in a uniformly dispersed state.
Thereafter, a pair of electromagnets are arranged on the back surface of the one-surface-side molded member 30 and the back surface of the other-surface-side molded member 62, and by operating this electromagnet, a parallel magnetic field acts in the thickness direction of the conductive sheet material layer 17A. Let

  As a result, as shown in FIG. 13B, the conductive particles P dispersed in the conductive sheet material layer 17A are arranged in the thickness direction while maintaining the state of being dispersed in the plane direction. Orient.

Thereby, the chain | strand by the some electroconductive particle P each extended in the thickness direction is formed in the state disperse | distributed to the surface direction.
Then, by curing the conductive sheet material layer 17A, the conductive particles P are oriented in the thickness direction in the elastic polymer substance, and the chain of the conductive particles P is dispersed in the plane direction. The 4th anisotropic conductive sheet 77 contained by this is manufactured.

In the above, the curing process of the conductive sheet material layer 17A can be performed with the parallel magnetic field applied, but can also be performed after the parallel magnetic field is stopped.
The intensity of the parallel magnetic field applied to the conductive sheet material layer 17A is preferably 0.02 to 2.5 Tesla on average.

The curing process of the conductive sheet material layer 17A is appropriately selected depending on the material to be used, but is usually performed by a heating process.
The specific heating temperature and heating time are appropriately selected in consideration of the type of polymer material constituting the conductive sheet material layer 17A, the time required to move the conductive particles P, and the like. <Third anisotropic conductive sheet 75>
FIG. 14 is an explanatory cross-sectional view showing an enlarged main part of the third anisotropic conductive sheet 75.

  The third anisotropic conductive sheet 75 is formed by the conductive particles P in a state where the conductive particles P exhibiting magnetism are oriented in the thickness direction in the insulating elastic polymer substance to form a chain. The chain is contained in a state dispersed in the plane direction, and has the same configuration as the fourth anisotropic conductive sheet 77 except that a plurality of through holes 19 penetrating in the thickness direction are formed. is there.

The through hole 19 of the third anisotropic conductive sheet 75 is formed according to a pattern corresponding to the pattern of the electrode to be inspected on the circuit board to be inspected.
The diameter of the through hole 19 of the third anisotropic conductive sheet 75 may be a size that allows the inspection core electrode 7 of the relay substrate 76 described later to be movably inserted. 1.1 to 2 times, preferably 1.2 to 1.7 times.
<Method for Manufacturing Third Anisotropic Conductive Sheet 75>
The third anisotropic conductive sheet 75 is obtained by manufacturing the same method as the fourth anisotropic conductive sheet 77 and then forming the through hole 19 by performing laser processing or punching processing.
<Relay board 76>
FIG. 15 is an explanatory cross-sectional view showing an enlarged main part of the relay board 76.

  The relay board 76 is arranged according to a pattern corresponding to the pattern of the relay electrode 14 in the electrode sheet 74 and the plurality of inspection core electrodes 7 arranged according to the pattern corresponding to the pattern of the electrode to be inspected of the circuit board 1 to be inspected. The plurality of connecting core electrodes 60, and the insulating support sheet 9 that supports each of the inspection core electrode 7 and the connecting core electrode 60.

  A plurality of through holes 4 extending in the thickness direction are formed in the insulating support sheet 9 according to a pattern corresponding to the pattern of the inspected electrode of the circuit board to be inspected and a pattern corresponding to the pattern of the relay electrode 14 in the electrode sheet 74. ing.

In each through hole 4 of the insulating support sheet 9, the inspection core electrode 7 and the connecting core electrode 60 are arranged so as to protrude from both surfaces of the insulating support sheet 9.
Each of the inspection core electrodes 7 includes a cylindrical body portion 25a inserted through the through hole 4 of the insulating support sheet 9, and an insulating support formed integrally connected to both ends of the body portion 25a. It is comprised by the terminal part 25b exposed to the surface of the sheet | seat 9. As shown in FIG.

  The length of the body portion 25a in the core electrode for inspection 7 is larger than the thickness of the insulating support sheet 9, and the diameter of the body portion 25a is smaller than the diameter of the through hole 4 of the insulating support sheet 9. Thus, the inspection core electrode 7 is movable in the thickness direction of the insulating support sheet 9.

Further, the diameter of the terminal portion 25 b in the inspection core electrode 7 is larger than the diameter of the through hole 4 of the insulating support sheet 9.
Each of the connection core electrodes 60 is also formed in the same manner as the inspection core electrode 7 and includes a body portion 61 and a terminal portion 26b.

  As a material constituting the insulating support sheet 9, resin materials such as liquid crystal polymer, polyimide resin, polyester resin, polyaramid resin, polyamide resin, glass fiber reinforced epoxy resin, glass fiber reinforced polyester resin, glass fiber reinforced polyimide A fiber reinforced resin material such as a resin, a composite resin material containing an inorganic material such as alumina or poron nitride as a filler in an epoxy resin or the like can be used.

Moreover, it is preferable that the thickness of the insulating support sheet 9 is 10-200 micrometers, More preferably, it is 15-100 micrometers.
Furthermore, the diameter of the through-hole 4 of the insulating support sheet 9 is preferably 20 to 80 μm, more preferably 30 to 60 μm.

  As a material constituting the inspection core electrode 7 and the connection core electrode 60, a metal material having rigidity can be suitably used. In particular, in the manufacturing method described later, a thin metal layer formed on the insulating support sheet 9 It is preferable to use a material that is more difficult to etch.

Specific examples of such a metal material include simple metals such as nickel, cobalt, gold, and aluminum, or alloys thereof.
The diameter of the body portions 25a and 61 in each of the inspection core electrode 7 and the connection core electrode 60 is preferably 18 μm or more, and more preferably 25 μm or more.

When this diameter is too small, the strength required for the inspection core electrode 7 and the connection core electrode 60 may not be obtained.
Further, the difference between the diameter of the through hole 4 of the insulating support sheet 9 and the diameter of the body portions 25a and 60 in each of the inspection core electrode 7 and the connection core electrode 60 is preferably 1 μm or more. Is 2 μm or more.

If this difference is too small, it may be difficult to move the inspection core electrode 7 and the connection core electrode 60 in the thickness direction of the insulating support sheet 9.
The diameters of the terminal portions 25b and 26b in each of the inspection core electrode 7 and the connection core electrode 60 are preferably 70 to 150% of the diameter of the electrode to be inspected. Further, the difference between the diameters of the terminal portions 25b and 26b of the inspection core electrode 7 and the connecting core electrode 60 and the diameter of the through hole 4 is preferably 5 μm or more, more preferably 10 μm or more.

If this difference is too small, the inspection core electrode 7 and the connecting core electrode 60 may fall off the insulating support sheet 9.
The movable distance of each of the inspection core electrode 7 and the connection core electrode 60 in the thickness direction of the insulating support sheet 9, that is, the length of the body portions 25 a and 61 in each of the inspection core electrode 7 and the connection core electrode 60 The difference from the thickness of the insulating support sheet 9 is preferably 5 to 50 μm, more preferably 10 to 40 μm.

If these movable distances are too small, it may be difficult to obtain sufficient irregularity absorbing ability.
On the other hand, when these movable distances are excessive, the lengths of the body 25a of the inspection core electrode 7 and the body 61 of the connecting core electrode 60 exposed from the through hole 4 of the insulating support sheet 9 are long. There is a possibility that the body 25a of the inspection core electrode 7 and the body 61 of the connecting core electrode 60 may be buckled or damaged when used for inspection.
<Method for Manufacturing Relay Substrate 76>
The relay board 76 can be manufactured as follows.

  As shown in FIG. 16A, a laminate material 20B is prepared in which an easily etchable metal layer 23A is integrally laminated on one surface of the insulating support sheet 9, and the metal layer 23A in the laminate material 20B is prepared. On the other hand, an etching process is performed to remove a part thereof.

As a result, as shown in FIG. 16B, a plurality of openings 23K are formed according to a pattern corresponding to the pattern of the electrodes to be connected to the metal layer 23A.
Next, as shown in FIG. 16 (c), through holes 4 that extend in the thickness direction are formed in the insulating support sheet 9 in the laminated material 20B and communicate with the openings 23K of the metal layer 23A.

And as shown to Fig.17 (a), the easily etchable cylindrical metal thin layer 23B is formed so that the inner wall surface of the through-hole 4 of the insulating support sheet 9 and the opening edge of the metal layer 23A may be covered.
In this way, the insulating support sheet 9 having a plurality of through holes 4 extending in the thickness direction and the through holes 4 of the insulating support sheet 9 laminated on one surface of the insulating support sheet 9 are communicated. An easily-etchable metal layer 23A having a plurality of openings 23K, and an easily-etchable metal thin layer 23B formed so as to cover the inner wall surface of the through hole 4 of the insulating support sheet 9 and the opening edge of the metal layer 23A. The composite laminate material 20A having the above is manufactured.

As a method of forming the through hole 4 of the insulating support sheet 9, a laser processing method, a drill processing method, an etching processing method, or the like can be used.
Copper, nickel, or the like can be used as an easily-etchable metal material constituting the metal layer 23A and the metal thin layer 23B.

  The thickness of the metal layer 23A is set in consideration of the movable distance between the target inspection core electrode 7 and the connection core electrode 60, and is preferably 5 to 25 μm, more preferably 8 to 20 μm.

  Further, the thickness of the thin metal layer 23B takes into consideration the diameter of the through-hole 4 of the insulating support sheet 9 and the diameters of the body portions 25a and 61 in each of the inspection core electrode 7 and the connection core electrode 60 to be formed. Is set.

Furthermore, as a method of forming the metal thin layer 23B, an electroless plating method or the like can be used.
The composite laminated material 20 </ b> A is subjected to a photoplating process to form the inspection core electrode 7 and the connection core electrode 60 in each of the through holes 4 of the insulating support sheet 9.

  Specifically, as shown in FIG. 17B, the inspection core to be formed on each of the surface of the metal layer 23 </ b> A formed on one surface of the insulating support sheet 9 and the other surface of the insulating support sheet 9. According to the pattern corresponding to the pattern of the terminal portions 25b and 26b in the electrode 7 and the connecting core electrode 60, the resist film 6 is formed in which a plurality of pattern holes 24K communicating with the through holes 4 of the insulating support sheet 9 are formed.

  Next, electrolytic plating is performed using the metal layer 23A as a common electrode to deposit metal on the exposed portion of the metal layer 23A and the surface of the metal thin layer 23B, and in the through holes 4 of the insulating support sheet 9 and the resist film 6. By filling the pattern holes 24K with metal, as shown in FIG. 17C, the inspection core electrode 7 and the connection core electrode 60 that extend in the thickness direction of the insulating support sheet 9 are formed.

  After forming the inspection core electrode 7 and the connecting core electrode 60 in this way, the resist film 6 is removed from the surface of the metal layer 23A, thereby exposing the metal layer 23A as shown in FIG. Let

And the relay board | substrate 76 as shown in FIG. 15 is obtained by performing an etching process and removing the metal layer 23A and the metal thin layer 23B.
<Connection with Circuit Board 1 to be Inspected by Circuit Board Connector 21>
In the circuit board-side connector 21, as shown in FIG. 19, each inspection core electrode 7 in the circuit board-side connector 21 is provided on one surface of the circuit board 1 to be inspected. It arrange | positions so that it may be located on the test | inspection electrode 2, and the circuit board side connector 21 is further pressed by an appropriate means.

  In this state, as shown in FIG. 20, each of the ring-shaped electrodes 13 in the electrode sheet 74 is formed on the one-surface-side inspected electrode 2 of the circuit board 1 to be inspected via the fourth anisotropic conductive sheet 77. Each is electrically connected.

  In addition, each of the inspection core electrodes 7 on the relay substrate 76 enters the through hole 19 of the third anisotropic conductive sheet 75 and the through hole 12 of the electrode sheet 74 and passes through the fourth anisotropic conductive sheet 77. The circuit board 1 to be inspected is electrically connected to each of the electrodes to be inspected 2 on one side.

Further, each of the connecting core electrodes 60 of the relay substrate 76 is electrically connected to the relay electrode 14 in the electrode sheet 74 via the third anisotropic conductive sheet 75.
At this time, since the ring-shaped electrode 13 in the electrode sheet 74 is formed so as to surround the through hole 12 of the insulating sheet 11, as shown in FIG. 21, the inspection that enters the through hole 12 of the insulating sheet 11. Even if the center position of the core electrode for inspection 7 is displaced from the center position of the one-surface-side inspected electrode 2, if the inspection core electrode 7 is electrically connected to the one-surface-side inspected electrode 2, the ring The electrode 13 is always electrically connected to the inspected electrode 2 on the one surface side.

  In such a state, the inspection core electrode 7 and the ring-shaped electrode 13 that are electrically connected to one single-surface-side inspected electrode 2 among the plural one-surface-side inspected electrodes 2 in the circuit board 1 to be inspected. One of them is used as a current supply electrode and the other is used as a voltage measurement electrode, whereby the electrical resistance of the designated one-surface-side inspected electrode 2 is measured.

  Here, as the circuit board to be inspected 1, as shown in FIG. 22A, the circuit 8 a has only one surface-side inspected electrode 2 formed on one surface and is formed between the one surface-side inspected electrodes 2. 22B, as shown in FIG. 22B, the one-surface-side inspected electrode 2 formed on one surface and the other-surface-side inspected electrode 3 formed on the other surface, 2 having only the circuit 8b formed between the other surface side inspection electrode 3 and the one surface side inspection electrode 2 formed on one surface and the other surface as shown in FIG. 22 (c). A circuit 8 a formed between the one-surface-side inspected electrode 2 and a circuit 8 b formed between the one-surface-side inspected electrode 2 and the other-surface-side inspected electrode 3. Any of those having both.

  According to the circuit board side connector 21 configured as described above, the insulating sheet 11 in the electrode sheet 74 is formed with the through hole 12 into which the inspection core electrode 7 in the relay board 76 enters, and around the through hole 12. Since the ring-shaped electrode 13 is formed so as to surround the through-hole 12, the position where at least a part of the inspection core electrode 7 is located on the one-surface-side inspection electrode 2 in the circuit board 1 to be inspected. If combined, at least a part of the ring-shaped electrode 13 comes to be positioned on the one-surface-side inspected electrode 2.

  Therefore, even if the circuit board 1 to be inspected has a large number of single-surface-side inspected electrodes 2 having a large area and a small size, both the inspection core electrode 7 and the ring-shaped electrode 13 for the one-surface-side inspected electrode 2 are used. An electrical connection can be reliably achieved.

  Moreover, since the inspection core electrode 7 and the ring-shaped electrode 13 are electrically independent from each other, one of the inspection core electrode 7 and the ring-shaped electrode 13 electrically connected to the one-surface-side inspected electrode 2 is connected. By using the current supply electrode and the other as the voltage measurement electrode, the electrical resistance of the circuit board 1 to be inspected can be measured with high accuracy.

Further, since the electrode sheet 74 and the relay substrate 76 have a simple structure, the entire circuit board connector 21 can be manufactured at a low cost. Accordingly, the inspection cost can be reduced.
<Relay pin unit 31>
1, 2 and 23 (FIG. 23 shows the relay pin unit 31a for convenience of description) and FIGS. 29 to 32, the relay pin unit 31 is arranged in parallel so as to face in the vertical direction. In addition, a large number of conductive pins 32a and 32b provided at a predetermined pitch are provided.

  The relay pin unit 31 is provided on both ends of the conductive pins 32a and 32b, and includes first insulating plates 34a and 34b disposed on the circuit board 1 side to be inspected to insert and support the conductive pins 32a and 32b. Two insulating plates 35a and 35b are provided on the side opposite to the inspection circuit board 1 side.

As shown in FIG. 24, the conductive pin 32 includes a central portion 82 having a large diameter and end portions 81a and 81b having a smaller diameter.
The first insulating plate 34 and the second insulating plate 35 are formed with through holes 83 into which the end portions 81 of the conductive pins 32 are inserted. The diameter of the through-hole 83 is formed larger than the diameter of the end portions 81a and 81b of the conductive pin 32 and smaller than the diameter of the central portion 82, so that the conductive pin 32 is held so as not to drop off.

  The first insulating plate 34 and the second insulating plate 35 are fixed by the first support pin 33 and the second support pin 37 of FIG. 1 so that the distance between them is longer than the length of the central portion 82 of the conductive pin 32. Thus, the conductive pin 32 is held so as to be movable up and down.

  The length of the end portion 81 of the conductive pin 32 is formed so as to be longer than the thickness of the first insulating plate 34 and the second insulating plate 35, whereby at least one of the first insulating plate 34 and the second insulating plate 35. The conductive pin 32 protrudes from one side.

  The relay pin unit has a large number of conductive pins of 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, 0.3 mm, and 0.2 mm. It is arranged on the lattice point of the pitch.

  By making the arrangement pitch of the conductive pins 32 of the relay pin unit 31 the same as the arrangement pitch of the terminal electrodes 24 provided on the pitch conversion board 72, the pitch conversion board 72 is connected to the tester side via the conductive pins 32. It is designed to be connected electrically.

  As shown in FIGS. 1 and 23, intermediate holding plates 36a and 36b are arranged in the relay pin unit 31 between the first insulating plates 34a and 34b and the second insulating plates 35a and 35b. Yes.

  The first support pins 33a and 33b are disposed between the first insulating plates 34a and 34b and the intermediate holding plates 36a and 36b, whereby the first insulating plates 34a and 34b and the intermediate holding plates 36a and 36b It is fixed between.

  Similarly, second support pins 37a and 37b are arranged between the second insulating plates 35a and 35b and the intermediate holding plates 36a and 36b, whereby the second insulating plates 35a and 35b and the intermediate holding plates 36a and 36b are arranged. It is fixed between.

As the material of the first support pin 33 and the second support pin 37, a metal such as brass or stainless steel is used.
Note that the distance L1 between the first insulating plate 34 and the intermediate holding plate 36 and the distance L2 between the second insulating plate 35 and the intermediate holding plate 36 in FIG. 23 are the first insulating plate as will be described later. 34, considering the absorbability of the height variation of the one-surface-side inspected electrode 2 and the other-surface-side inspected electrode 3 in the circuit board 1 to be inspected due to the elasticity of the intermediate holding plate 36 and the second insulating plate 35, 2 mm or more Preferably, it is 2.5 mm or more.

  As shown in FIG. 23, the first abutment support position 38A of the first support pin 33 with respect to the intermediate holding plate 36, the second abutment support position 38B of the second support pin 37 with respect to the intermediate holding plate 36, Are arranged at different positions on the intermediate holding plate projection plane A obtained by projecting the inspection apparatus in the thickness direction of the intermediate holding plate (from the upper side to the lower side in FIG. 1).

  In this case, as different positions, the first contact support position 38A and the second contact support position 38B are formed on the lattice on the intermediate holding plate projection surface A as shown in FIG. preferable.

Specifically, one second abutment support position 38B is arranged in a unit cell region R1 composed of four first abutment support positions 38A adjacent on the intermediate holding plate projection surface A.
Further, on the intermediate holding plate projection surface A, one first contact support position 38A is arranged in the unit lattice region R2 composed of four adjacent second contact support positions 38B. In FIG. 28,
The first contact support position 38A is indicated by a black circle, and the second contact support position 38B group is indicated by a white circle.

  In addition, one second abutment support position 38B is disposed at the center of the diagonal line Q1 of the unit lattice region R1 at the first abutment support position 38A, and the unit lattice region at the second abutment support position 38B. One first abutting support position 38A is arranged at the center of the diagonal line Q2 of R2.

  However, these relative positions are not particularly limited, and may be arranged at different positions on the intermediate holding plate projection plane A obtained by projecting the inspection apparatus in the thickness direction of the intermediate holding plate 36.

  That is, when not arranged in a grid pattern, it is not constrained by such a relative positional relationship, and is arranged at different positions on the intermediate holding plate projection surface A obtained by projecting the inspection device in the thickness direction of the intermediate holding plate. It only has to be.

  In this case, the separation distance between the first contact support positions 38A adjacent to each other and the separation distance between the second contact support positions 38B are preferably 10 to 100 mm, more preferably 12 to 70 mm. Preferably it is 15-50 mm.

  As the forming material of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35, a flexible material is used. The flexibility of these plates is such that when both ends of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 are horizontally arranged with 10 cm intervals, the pressure is 50 kgf from above. It is preferable that the bending caused by pressurizing with a pressure of 0.02% or less of these widths is such that destruction and permanent deformation do not occur even when pressurized with a pressure of 200 kgf from above.

As materials for the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35, an insulating material having a specific resistance of 1 × 10 ¹⁰ Ω · cm or more, such as polyimide resin, polyester resin, polyamide resin, phenol resin, Polyacetal resin, polybutylene terephthalate resin, polyethylene terephthalate resin, syndiotactic polystyrene resin, polyphenylene sulfide resin, polyether ethyl ketone resin, fluorine resin, polyether nitrile resin, polyether sulfone resin, polyarylate resin, polyamide imide Glass fiber types such as resin materials with high mechanical strength such as resin, glass fiber reinforced epoxy resin, glass fiber reinforced polyester resin, glass fiber reinforced polyimide resin, glass fiber reinforced phenolic resin, glass fiber reinforced fluororesin Carbon fiber reinforced epoxy resin, carbon fiber reinforced polyester resin, carbon fiber reinforced polyimide resin, carbon fiber reinforced phenol resin, carbon fiber reinforced fluororesin, etc., carbon fiber composite resin, epoxy resin, phenol Examples thereof include a composite resin material in which an inorganic material such as silica, alumina, or boron nitride is filled in a resin, or a composite resin material in which a mesh is contained in an epoxy resin, a phenol resin, or the like.

Moreover, the composite board material etc. which were comprised by laminating | stacking two or more board | plate materials which consist of these materials can also be used.
Although the thickness of the 1st insulating board 34, the intermediate | middle holding board 36, and the 2nd insulating board 35 is suitably selected according to the kind of material to comprise, Preferably it is 1-10 mm.

For example, a glass fiber reinforced epoxy resin having a thickness of 2 to 5 mm can be used.
As a method of movably supporting the conductive pins 32 on the first insulating plate 34 and the second insulating plate 35, the methods shown in FIGS. 25 to 27 can be cited in addition to the method shown in FIG.

In this example, a bent holding plate 84 is provided between the first insulating plate 34 and the second insulating plate 35.
As the conductive pins 32, cylindrical metal pins are used.

The bent holding plate 84 is formed with a through hole 85 through which the conductive pin 32 is inserted.
The conductive pins 32 are opposite to each other with a through hole 83a formed in the first insulating plate 34 and a through hole 83b formed in the second insulating plate 35 and a through hole 85 formed in the bent holding plate 84 as fulcrums. Is bent at the position of the through hole 85 of the bending holding plate 84, thereby supporting the conductive pin 32 so as to be movable in the axial direction.

The intermediate holding plate 36 is formed with a through hole 86 having a diameter large enough not to contact the conductive pin 32, and the conductive pin 32 is inserted into the through hole 86.
The conductive pins 32 are supported by the first insulating plate 34 and the second insulating plate 35 in the procedure shown in FIGS. 26 (a) to 26 (c).

  As shown in FIG. 26 (a), the through hole 83a of the first insulating plate 34 and the through hole 83b formed in the second insulating plate 35 and the through hole 85 of the bent holding plate 84 are aligned in the axial direction. The bent holding plate 84 is arranged at the position.

Next, as shown in FIG. 26 (b), the conductive pin 32 is inserted from the through hole 83 a of the first insulating plate 34 to the through hole 83 b of the second insulating plate 35 through the through hole 85 of the bent holding plate 84.
Further, as shown in FIG. 26 (c), the bending holding plate 84 is moved in the lateral direction (horizontal direction) perpendicular to the axial direction of the conductive pins 32, and the position of the bending holding plate 84 is fixed by appropriate means.

  As a result, the conductive pin 32 is laterally opposite to each other with the through hole 83b formed in the first insulating plate 34 and the second insulating plate 35 and the through hole 85 of the bent holding plate 84 as fulcrums. It is pressed and bent at the position of the through hole 85 of the bending holding plate 84, whereby the conductive pin 32 is supported so as to be movable in the axial direction.

  With this configuration, the conductive pin 32 can be held between the first insulating plate 34 and the second insulating plate 35 so as to be movable in the axial direction so as not to fall off. Since a cylindrical pin having a simple structure can be used, the cost of the conductive pin 32 and the member holding it can be reduced.

Note that the position where the bent holding plate 84 is disposed may be between the first insulating plate 34 and the intermediate holding plate 36.
In the inspection apparatus of this embodiment configured as described above, as shown in FIG. 2, the inspected electrode 2 on the one surface side of the circuit board 1 to be inspected is the fourth anisotropic conductive sheet 77, the electrode sheet 74, the third Anisotropic conductive sheet 75, relay board 76, second anisotropic conductive sheet 73, pitch conversion board 72, first anisotropic conductive sheet 71, conductive pins 32, fifth anisotropic conductive sheet 42, connector board The base plate 46 disposed on the outermost side is pressed with a predetermined pressure by a tester's pressurizing mechanism via a tester 43a, and is electrically connected to a tester (not shown). Electrical inspection such as electrical resistance measurement is performed.

The pressure pressed from the upper and lower first inspection jigs 11a and the second inspection jig 11b against the circuit board 1 to be inspected at the time of measurement is, for example, 100 to 250 kgf.
<Description of pressure absorbing action and pressure dispersing action by inspection jig>
Hereinafter, with reference to FIGS. 29 to 32 (for convenience, only the second inspection jig 11b is shown), the circuit board 1 to be inspected is between the first inspection jig 11a and the second inspection jig 11b. The pressure absorbing action and the pressure dispersing action when both surfaces are clamped will be described.

  As shown in FIG. 30, when performing electrical inspection by clamping both surfaces of the circuit board 1 to be inspected between the first inspection jig 11a and the second inspection jig 11b, In the initial stage, the relay pin unit 31 moves in the thickness direction of the conductive pins 32, and the first anisotropic conductive sheet 71, the second anisotropic conductive sheet 73, the third anisotropic conductive sheet 75, and the fourth anisotropic. The pressure is absorbed by the rubber elastic compression of the conductive sheet 77 and the fifth anisotropic conductive sheet 42, and the height variation of the electrodes to be inspected of the circuit board 1 to be inspected can be absorbed to some extent.

  A first abutment support position 38A of the first support pin 33 with respect to the intermediate holding plate 36 and a second abutment support position 38B of the second support pin 37 with respect to the intermediate holding plate 36 constitute the intermediate holding plate 36. Since they are arranged at different positions on the projection plane of the intermediate holding plate projected in the thickness direction, a force acts in the vertical direction as shown by the arrow in FIG. 31, and as shown in FIG. 32, the first inspection treatment is performed. When the circuit board 1 to be inspected is further pressed between the tool 11a and the second inspection jig 11b, the first anisotropic conductive sheet 71, the second anisotropic conductive sheet 73, the third different In addition to the rubber elastic compression of the anisotropic conductive sheet 75, the fourth anisotropic conductive sheet 77, and the fifth anisotropic conductive sheet 42, the first insulating plate 34 and the second insulating plate 35 in the relay pin unit 31; Located between the first insulating plate 34 and the second insulating plate 35 Due to the spring elasticity of the holding plate 36, the pressure concentration can be dispersed and the local stress concentration can be avoided with respect to the height variation of the electrodes to be inspected of the circuit board 1 to be inspected (for example, the height variation of the solder ball electrodes). it can.

  That is, as shown in FIGS. 31 and 32, the intermediate holding plate 36 is directed in the direction of the second insulating plate 35 around the first contact support position 38 </ b> A of the first support pin 33 with respect to the intermediate holding plate 36. The intermediate holding plate 36 bends in the direction of the first insulating plate 34 around the second abutting support position 38B of the second support pin 37 with respect to the intermediate holding plate 36 while being bent (see the portion E in FIG. 32). (Refer to part D in FIG. 32).

Here, “bend” and “bend direction” refer to the bend so that the intermediate holding plate 36 protrudes in a convex direction and the protruding direction thereof.
In this way, the intermediate holding plate 36 bends in opposite directions around the first contact support position 38A and the second contact support position 38B, so the first inspection jig 11a and the second inspection jig When the circuit board 1 to be inspected is further pressurized with the intermediate holding plate 11b, the spring elastic force of the intermediate holding plate 36 is exhibited.

  32, the height of the conductive pin 32 is absorbed by the compression of the protruding portion of the conductive path forming portion in the first anisotropic conductive sheet 71, but the compression of the protruding portion absorbs the height of the conductive pin 32. Pressure that cannot be absorbed is applied to the first insulating plate 34.

  Therefore, as shown in part C of FIG. 32, the first insulating plate 34 and the second insulating plate 35 are also bent in opposite directions at the contact positions of the first support pin 33 and the second support pin 37. When the circuit board 1 to be inspected is further pressed between the first inspection jig 11a and the second inspection jig 11b, the spring elastic force of the first insulating plate 34 and the second insulating plate 35 Will be demonstrated.

  As a result, stable electrical contact is ensured with respect to each of the electrodes to be inspected of the circuit board 1 to be inspected having a height variation, and further, stress concentration is reduced, so that the second anisotropic conductive sheet 73, Local breakage of the third anisotropic conductive sheet 75 and the fourth anisotropic conductive sheet 77 is suppressed.

As a result, the use durability of the second anisotropic conductive sheet 73, the third anisotropic conductive sheet 75, and the fourth anisotropic conductive sheet 77 is improved, so that the number of replacements is reduced and the inspection work efficiency is improved.
FIG. 33 is a sectional view similar to FIG. 29 for explaining another embodiment of the inspection apparatus of the present invention (only the second inspection jig is shown for convenience), and FIG. 34 is an enlarged view of the relay pin unit. It is sectional drawing. This inspection apparatus has basically the same configuration as the inspection apparatus shown in FIG. 1, and the same reference numerals are assigned to the same components.

  In this inspection apparatus, as shown in FIGS. 33 and 34, a plurality of (three in this embodiment) intermediate holding plates 36 are provided at a predetermined interval between the first insulating plate 34 and the second insulating plate 35. The holding plate support pins 39 are arranged so as to be spaced apart from each other and between the adjacent intermediate holding plates 36.

  In this case, in at least one intermediate holding plate 36b, the holding support position of the holding plate support pin 39b that comes into contact with the intermediate holding plate 36b from one surface side with respect to the intermediate holding plate 36b, and the other surface with respect to the intermediate holding plate 36b. The intermediate support plate projection in which the contact support position of the first support pin 33b, the second support pin 37b, or the support plate support pin 39b contacting the intermediate support plate 36b from the side is projected in the thickness direction of the intermediate support plate 36b. It is necessary to arrange them at different positions on the surface.

  Most preferably, in all of the intermediate holding plates 36b, the holding plate support pins 39b that come into contact with the intermediate holding plate 36b from one surface side are in contact with the intermediate holding plate 36b, and the other surface with respect to the intermediate holding plate 36b. The intermediate support plate projection in which the contact support position of the first support pin 33b, the second support pin 37b, or the support plate support pin 39b contacting the intermediate support plate 36b from the side is projected in the thickness direction of the intermediate support plate 36b. Arranged at different positions in the plane.

  In this case, the “different position” means the first contact support position 38A between the first support pin 33 and the intermediate holding plate 36, and the second position between the second support pin 37 and the intermediate holding plate 36 in the above-described embodiment. It is possible to have the same arrangement as the relative position described in relation to the contact support position 38B.

  In the present embodiment, in the upper intermediate holding plate 36b among the three intermediate holding plates 36b, the holding support position 39A of the holding plate support pin 39b that comes into contact with the intermediate holding plate 36b from one surface side with respect to the intermediate holding plate 36b, In the intermediate holding plate projection surface, the first support pin 33b that comes into contact with the intermediate holding plate 36b from the other surface side and the contact support position 38A with respect to the intermediate holding plate 36b is projected in the thickness direction of the intermediate holding plate 36b. They are located at different positions.

  Further, in the middle intermediate holding plate 36b among the three intermediate holding plates 36b, the holding support position 39A of the holding plate support pin 39b that comes into contact with the intermediate holding plate 36b from one side and the intermediate holding plate 36b, and the intermediate holding plate The holding support position 39A of the holding plate support pin 39b that is in contact with the plate 36b from the other surface side with respect to the intermediate holding plate 36b is at a different position on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate 36b. Has been placed.

  Further, in the lower intermediate holding plate 36b among the three intermediate holding plates 36b, the holding support position 39A of the holding plate support pin 39b that comes into contact with the intermediate holding plate 36b from one surface side with respect to the intermediate holding plate 36b, The contact support position 38B of the second support pin 37b that contacts the holding plate 36b from the other surface side with respect to the intermediate holding plate 36b is different on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate 36b. Placed in position.

With this configuration, the spring elasticity is further exhibited by the plurality of intermediate holding plates 36, and the pressure concentration is distributed with respect to the height variation of the electrodes to be inspected of the circuit board 1 to be inspected. Therefore, local stress concentration can be further avoided, local damage from the anisotropic conductive sheet is suppressed, and durability is improved, so the number of times of anisotropic conductive sheet replacement is reduced and inspection is performed. Work efficiency is improved.

The number of intermediate holding plates 36 is not particularly limited as long as it is plural.
Further, when the above-described bent holding plate 84 for holding the conductive pins 32 is used, the first insulating plate 34 and the intermediate holding plate 36 may be provided between the second insulating plate 35 and the intermediate holding plate 36 depending on the case. Or between the two intermediate holding plates 36.

As mentioned above, although embodiment of this invention was described, this invention is not limited to these embodiment, In the range which does not deviate from the summary, various deformation | transformation and change are possible.
For example, the circuit board 1 to be inspected may be a semiconductor integrated circuit device such as a package IC, MCM, or CSP other than a printed circuit board, or a circuit device formed on a wafer.

Further, the printed circuit board may be a single-sided printed circuit board as well as a double-sided printed circuit board.
The first inspection jig 11a and the second inspection jig 11b do not necessarily have to be the same in materials used, member structures, and the like, and they may be different.

The tester-side connector 41 may be configured by laminating a plurality of circuit boards such as connector boards and anisotropic conductive sheets.
In the above embodiment, as the first anisotropic conductive sheet 71 and the fifth anisotropic conductive sheet 42, a plurality of conductive path forming portions extending in the thickness direction, and insulating portions that insulate these conductive path forming portions from each other, The conductive particles are contained only in the conductive path forming portion, whereby the conductive particles are dispersed non-uniformly in the plane direction, and the conductive path forming portion protrudes on one side of the sheet. However, it is not necessarily limited to this.

Further, as shown in FIGS. 1, 2, and 29 to 32, support pins 49 may be disposed between the connector board 43 and the base plate 46 in the tester-side connector 41.
By these support pins 49, the first support pin 33 and the second support pin 37 (in FIG. 33 and FIG. 34, the first support pin 33, the second support pin 37 and the holding plate support pin 39) have the same effect. It is also possible to give an effect of dispersing the surface pressure.

In order to give this surface pressure dispersion action, it is preferable to arrange these so that the position of the support pin 49 and the position of the second support pin 37 are different from each other in the surface direction.
In the circuit board inspection apparatus of the present invention, it is desirable to use the relay pin unit 31 as described above, but by using the circuit board side connector 21 of the present invention, a circuit to be inspected having a large number of inspection electrodes. In the case where sufficient cushioning and durability can be ensured so that the substrate 1 can be inspected satisfactorily, a conventional relay pin unit as shown in FIG. Can be inspected.
<Examples and Comparative Examples>
Specific examples and comparative examples of the present invention are shown below.
[Example 1]
An inspection device for inspecting the following circuit board for evaluation as shown in FIG. 1, which is suitable for an inspection part of a rail conveyance type automatic circuit board inspection machine (manufactured by Nidec Reed, product name: STARREC V5) Produced.
(1) Circuit board 1 to be inspected
A circuit board 1 to be inspected having the following specifications was prepared.

Dimensions: 100mm (length) x 100mm (width) x 0.8mm (thickness)
Number of electrodes to be inspected on the upper surface side: 3600 Diameters of electrodes to be inspected on the upper surface side: 0.1 mm
Minimum arrangement pitch of electrodes on the upper surface side: 0.225 mm
Number of electrodes to be inspected on the lower surface side: 2600 Diameter of electrodes to be inspected on the lower surface side: 0.1 mm
Minimum arrangement pitch of electrodes to be inspected on the lower surface side: 0.225 mm
(2) Circuit board side connector 21
The first anisotropic conductive sheet 71a and the first anisotropic conductive sheet 71a are arranged on one side of the pitch conversion board 72 on the circuit board side to be inspected. A pitch converting substrate 72a for converting the electrode pitch between the second anisotropic conductive sheet 73a disposed on the circuit board to be inspected side of the pitch converting substrate 72a, and an inspection of the second anisotropic conductive sheet 73a A relay substrate 76a made of an insulating support sheet, which is disposed on the circuit board side and has a test core electrode 7 electrically connected to the ring electrode 13 and a connection core electrode 60 electrically connected to the relay electrode 14. A third anisotropic conductive sheet 75a having a plurality of through-holes 19 according to a pattern corresponding to the electrode to be inspected of the circuit board 1 to be inspected, which is disposed on the circuit board to be inspected of the relay board 76a. And third A plurality of through holes 12 are provided on the side of the circuit board to be inspected of the conductive sheet 75a in accordance with a pattern corresponding to the electrode to be inspected of the circuit board 1 to be measured, and a plurality of the through holes 12 are surrounded. A flexible electrode sheet 74a having a relay electrode electrically connected to the ring electrode 13 on the back surface and a fourth different electrode provided on the circuit board side of the electrode sheet 74a. The circuit board side connector 21 is provided with a conductive sheet 77a.

The first anisotropic conductive sheet 71 has the shape shown in FIG. 9, and specifically, the following configuration was used.
[First anisotropic conductive sheet 71]
Dimensions: 110mm x 150mm
Thickness of conductive path forming part: 0.6 mm
Outside diameter of conductive path forming part: 0.35 mm
Projection height of conductive path forming part: 0.05mm
Conductive particles: material: nickel particles subjected to gold plating treatment, average particle diameter: 35 μm, content of conductive particles in the conductive path forming portion: 30% by volume
Elastic polymer material: material; silicone rubber, hardness: 30
(W / D = 17)
The second anisotropic conductive sheet 73 has a shape shown in FIG. 9B, and specifically, a sheet having the following configuration was used.
[Second anisotropic conductive sheet 73]
Dimensions: 110mm x 110mm
Conductive path forming part thickness: 0.12 mm
Outside diameter of conductive path forming part: 0.08 mm
Projection height of conductive path forming part: 0 mm
Conductive particles: material: nickel particles subjected to gold plating treatment, average particle diameter: 20 μm, content of conductive particles in the conductive path forming portion: 30% by volume
Elastic polymer material: material; silicone rubber, hardness: 30
[Fourth anisotropic conductive sheet 77]
The following fourth anisotropic conductive sheet 77 in which conductive particles are arranged in the thickness direction and uniformly dispersed in the plane direction was produced.
Dimensions: 110mm x 110mm, thickness 0.05mm
Conductive particles: material: nickel particles subjected to gold plating, average particle size: 20 μm, content: 18% by volume
Elastic polymer material: material; silicone rubber (hardness 40)
Further, the third anisotropic conductive sheet 75 has the same configuration as that of the fourth anisotropic conductive sheet 77, and a plurality of third anisotropic conductive sheets 75 are arranged at positions corresponding to the positions of the electrodes to be inspected by the UV laser processing. Penetration was formed.
[Third anisotropic conductive sheet 75]
Dimensions: 100mm (length) x 100mm (width) x 0.3mm (thickness)
Third anisotropic conductive sheet 75a on the upper surface side
Number of through-holes: 3600 (formed at the position of the electrode to be inspected on the upper surface side of the circuit board 1 to be inspected)
Through hole diameter: 65 μm
Third anisotropic conductive sheet 75b on the lower surface side
Number of through-holes: 2600 (formed at the position of the electrode to be inspected on the lower surface side of the circuit board 1 to be inspected)
Through hole diameter: 65 μm
[Pitch conversion substrate 72]
A laminated material (Matsushita Electric Works, product name: R-1766) in which a thin metal layer made of copper having a thickness of 18 μm is formed on both surfaces of a 0.5 mm thick insulating substrate made of glass fiber reinforced epoxy resin, A total of 7200 circular through-holes with a diameter of 0.1 mm, each penetrating in the thickness direction of the laminated material, were formed by a numerically controlled drilling apparatus.

  In this case, two through holes are formed as a set, one is formed at a position corresponding to the electrode to be inspected on the upper surface side of the evaluation circuit board, and the other through hole is separated by a center-to-center distance of 160 μm. Formed in position.

  Thereafter, the laminated material in which the through holes are formed is subjected to an electroless plating process using an EDTA type copper plating solution, thereby forming a copper plating layer on the inner wall of each through hole. By using the electrolytic copper plating treatment, a cylindrical via hole having a thickness of about 10 μm was formed in each through hole to electrically connect the thin metal layers on the surface of the laminated material to each other.

  Next, a dry film resist (product name: FP-225, manufactured by Tokyo Ohka Kogyo Co., Ltd.) having a thickness of 25 μm is laminated on the metal thin layer on the surface of the laminated material to form a resist layer, and the metal on the other side of the laminated material A protective seal was placed on the thin layer.

  A photomask film is disposed on the resist layer, and the resist layer is subjected to an exposure process using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), followed by a development process, whereby a resist pattern for etching is formed. Formed.

  Then, by etching the thin metal layer on the surface on which the resist pattern is formed, 7200 connection electrodes having a diameter of 60 μm, and each connection electrode and via hole are formed on the surface of the insulating substrate. A pattern wiring portion having a line width of 100 μm for electrical connection was formed, and then the resist pattern was removed.

  Next, a dry film resist (product name: FP-225, manufactured by Tokyo Ohka Kogyo Co., Ltd.) having a thickness of 25 μm is laminated on the surface on which the connection electrode and the pattern wiring portion of the laminated material are formed to form a resist layer. A photomask film is placed on the layer, and the resist layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), and then developed to expose the respective connection electrodes. 7200 circular openings having a diameter of 60 μm were formed.

Then, using the copper sulfate plating solution, the thin metal layer on the other side of the laminated material was used as a common electrode, and 7200 connection electrodes were formed by subjecting each connection electrode to electrolytic copper plating.

Next, the resist pattern was removed.
Further, the protective seal on the thin metal layer on the other side of the laminated material is removed, and a dry film resist (product name: FP-225, manufactured by Tokyo Ohka Kogyo Co., Ltd.) having a thickness of 25 μm is laminated on the thin metal layer on this side. A resist layer was formed.

  Thereafter, a photomask film is disposed on the resist layer, and the resist layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.). A resist pattern for etching was formed on the thin layer.

  Next, a protective seal is applied to the surface on which the connection electrode of the laminated material is formed, and then an etching process is performed to electrically connect 7200 terminal electrodes, each terminal electrode, and the via hole to the back surface of the insulating substrate. The pattern wiring part to be connected was formed, and the resist pattern was removed.

  Next, an insulating layer is formed by laminating a dry film solder resist (made by Nichigo Morton, product name: conform mask 2015) having a thickness of 38 μm on the back surface of the insulating substrate on which the terminal electrode and the pattern wiring portion are formed. A photomask film is disposed on the insulating layer, and then the insulating layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.). 7200 openings were formed.

As described above, the pitch conversion substrate 72 was produced.
The pitch conversion substrate 72 has a vertical and horizontal dimension of 120 mm × 160 mm, a thickness of 0.5 mm, a dimension of a portion exposed from the insulating layer surface of the connection electrode 25 having a diameter of about 60 μm, and a protrusion from the insulating layer surface of the connection electrode 25. The height was about 30 μm, the distance between the paired connection electrodes 25 was 160 μm (center-to-center distance), the diameter of the terminal electrodes 24 was 0.4 mm, and the arrangement pitch of the terminal electrodes 24 was 0.75 mm.

  In the same manner as described above, a pitch conversion substrate 72b for the second inspection jig 11b having 5200 connection electrodes 25 on the front surface and 5200 terminal electrodes 24 on the back surface was produced.

The pitch conversion substrate 72b has a vertical and horizontal dimension of 120 mm × 160 mm, a thickness of 0.5 mm, a diameter of a portion exposed on the surface of the insulating layer in the connection electrode 25 of about 60 μm, and a distance from the surface of the insulating layer in the connection electrode 25. The protrusion height is about 30 μm, the distance between the paired connection electrodes is 160 μm (center-to-center distance), the diameter of the terminal electrodes 24 is 0.4 mm, and the arrangement pitch of the terminal electrodes 24 is 0.75 mm.
[Relay board 76]
First, the relay substrate 76a for the first inspection jig 11a having 7200 electrode structures was manufactured as follows.

  A laminated material 20B in which a metal layer 23A made of copper having a thickness of about 40 μm is integrally laminated on one surface of an insulating support sheet 9 made of a liquid crystal polymer having a thickness of 50 μm (“Espanex LC18-” manufactured by Nippon Steel Chemical Co., Ltd.). 50-00NE "(18-μm thick copper layer was plated with copper to obtain a copper layer having a thickness of about 40 μm) (see FIG. 16A), and a dry film was formed on the metal layer 23A in the laminated material 20B. A resist film was formed by laminating the resist.

Next, by performing exposure processing and development processing on the formed resist film, a circular pattern hole having a diameter of 40 μm is formed in the resist film in accordance with a pattern corresponding to the upper-surface-side inspected electrode in the above evaluation circuit device 3600. In addition to the formation of 3 pieces, 3600 pieces of pattern holes separated from the pattern holes by a center-to-center distance of 160 μm were formed.

  Then, by performing an etching process on the metal layer 23A, an opening 23K having the same pattern as the pattern hole of the resist film is formed in the metal layer 23A, and then the resist film is removed (see FIG. 16B). .

Thereafter, the insulating support sheet 9 in the laminated material 20B is subjected to laser processing using a CO ₂ laser processing machine through the opening 23K formed in the metal layer 23A.
A through hole 4 communicating with the opening 23K of the metal layer 23A was formed (see FIG. 16C).

  The inner wall surface of the through hole 4 of the insulating support sheet 9 is subjected to electroless copper plating, and further subjected to electrolytic copper plating using the metal layer 23A as a common electrode, whereby the through hole 4 of the insulating support sheet 9 is formed. A cylindrical metal thin layer 23B made of copper having a thickness of 5 μm was formed so as to cover the inner wall surface and the opening edge of the metal layer 23A, and a composite laminated material 20A as shown in FIG.

Here, the diameter of the through-hole 4 after forming the metal thin layer 23B was about 30 μm.
Next, a dry film resist having a thickness of 25 μm is laminated on each of both surfaces of the composite laminate material 20A (the surface of the metal layer 23A formed on one surface of the insulating support sheet 9 and the other surface of the insulating support sheet 9). By performing the exposure process and the development process, a circular pattern having a diameter of 50 μm according to the pattern of the terminal portions 25b and 26b in the inspection core electrode 7 and the connection core electrode 60 to be formed as shown in FIG. A resist film 6 in which the holes 24K were formed was formed.

  Thereafter, by performing an electrolytic plating process using a plating solution in which nickel sulfamate is dissolved using the metal layer 23A as a common electrode, as shown in FIG. 17C, the test core electrode 7 made of nickel and the connection are connected. A core electrode 60 was formed.

  Then, by polishing the surfaces of the terminal portions 25b and 26b of the inspection core electrode 7 and the connecting core electrode 60, these surfaces are flattened and the thicknesses of the terminal portions 25b and 26b match the thickness of the resist film 6. I let you.

  Next, after removing the resist film 6 from both surfaces of the composite laminate material 20A, the composite laminate material 20A is subjected to an etching process at 60 ° C. for 3 hours using an etching solution in which ferric chloride is dissolved. Thus, the metal layer 23A and the metal thin layer 23B were removed, and the relay substrate 76a was manufactured.

  The obtained relay substrate 76a is made of a liquid crystal polymer, the vertical and horizontal dimensions are 190 mm × 130 mm, the thickness d is 50 μm, the diameter r1 of the through hole 4 is 40 μm, the total number of the inspection core electrodes 7 and the connection core electrodes 60 is 7200. The diameter r2 of the body portions 25a and 61 is 30 μm, the diameter r3 of the terminal portions 25b and 26b is 50 μm, the length L of the body portions 25a and 61 is 95 μm, and the moving distance of the inspection core electrode 7 and the connection core electrode 60 (Ld) is 45 μm, and the distance between the inspection core electrode 7 and the connecting core electrode 60 that make a pair is 160 μm.

Similarly to the above, a relay substrate 76b for the second inspection jig 11b having 5200 inspection core electrodes 7 and connection core electrodes 60 was manufactured.
The obtained relay substrate 76b is made of a liquid crystal polymer, the vertical and horizontal dimensions are 190 mm × 130 mm, the thickness d is 50 μm, the diameter r1 of the through hole 4 is 40 μm, and the total number of inspection core electrodes 7 and connection core electrodes 60 is 7200. The diameter r2 of the body portions 25a and 61 is 30 μm, the diameter r3 of the terminal portions 25b and 26b is 50 μm, the length L of the body portions 25a and 61 is 95 μm, and the moving distance of the inspection core electrode 7 and the connection core electrode 60 (Ld) is 45 μm, and the distance between the inspection core electrode 7 and the connecting core electrode 60 that make a pair is 160 μm.
(3) Relay pin unit 31
The material of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 is made of an insulating material having a specific resistance of 1 × 10 ¹⁰ Ω · cm or more and a glass fiber reinforced epoxy resin. A 9 mm one was used.

The first support pin is set such that the distance L1 between the first insulating plate 34 and the intermediate holding plate 36 is 36.3 mm, and the distance L2 between the second insulating plate 35 and the intermediate holding plate 36 is 3 mm. 33 (diameter 2 mm, length 36.3 mm) and the second support pin 37 (diameter 2 mm, length 3 mm), and between the first insulating plate 34 and the second insulating plate 35 The conductive pin 32 shown in FIG. 25 having the following configuration was arranged in the through hole 83 (diameter 0.4 mm) so as to be movable.
[Conductive pin]
Material: Gold end plated brass end 81a Dimensions: Outer diameter 0.35mm, Overall length 2.1mm
Central part 64 dimension outer diameter 0.45mm, total length 41mm
Dimensions of base end 81b: outer diameter 0.35mm, total length 2.1mm
In this case, a first contact support position 38A of the first support pin 33 with the intermediate holding plate 36 and a second contact support position 38B of the second support pin 37 with the intermediate holding plate 36 are shown in FIG. Arranged in a grid as shown.

The separation distance between the first contact support positions 38A adjacent to each other and the separation distance between the second contact support positions 38B were set to 17.5 mm.
(4) Tester side connector 41
As shown in FIG. 1, the tester-side connector 41 is composed of a fifth anisotropic conductive sheet 42, a connector substrate 43, and a base plate 46.

The fifth anisotropic conductive sheet 42 was the same as the first anisotropic conductive sheet 71 described above.
Performance test Measurement of minimum press pressure Set the created inspection device in the inspection section of the rail transport type circuit board automatic inspection machine “STARCREC V5”, set the circuit board to be inspected 1 prepared for the inspection device, and set the rail transport type circuit. For changing the press pressure of the automatic substrate inspection machine “STARCREC V5” stepwise within the range of 100 to 210 kgf, for supplying current to the inspected electrode of the circuit board 1 to be inspected 10 times for each press pressure condition. The conduction resistance value when a current of 1 milliampere was applied through the electrode was measured with a voltage measuring electrode.

  An inspection point having a measured conduction resistance value of 10Ω or more (hereinafter referred to as “NG inspection point”) is determined as a continuity failure, and a ratio of NG inspection points to the total inspection points (hereinafter referred to as “NG inspection point ratio”). The lowest press pressure at which the NG inspection point ratio was 0.01% or less was defined as the minimum press pressure.

  In the measurement of the conduction resistance value, after the measurement of one conduction resistance value is completed, the press pressure related to the measurement is released to return the inspection apparatus to the non-pressurized state, and the next measurement of the conduction resistance value is performed again in a predetermined manner. Was performed by applying a pressing pressure of a magnitude of.

  The NG inspection point ratio is 3600 points for the upper surface inspection electrode and 2600 points for the lower surface inspection electrode of the circuit board 1 to be inspected. Since the measurement was performed 10 times under each press pressure condition, the expression (3600 + 2600) ) × 10 = the ratio of NG inspection points to 62,000 inspection points calculated by 62000.

In this case, “the minimum press pressure is small” means that the circuit board to be inspected can be electrically inspected with a low press pressure.
In the inspection apparatus, if the pressurization pressure at the time of inspection can be set low, the deterioration of the circuit board to be inspected, the anisotropic conductive sheet and the circuit board for inspection due to the pressurization pressure at the time of inspection can be suppressed, and the configuration of the inspection apparatus Since it becomes possible to use a component with low durability strength as a member, the structure of the inspection apparatus can be made small and compact.

As a result, since the durability of the inspection device is improved and the cost of manufacturing the inspection device is reduced, the minimum press pressure is preferably small.
The measurement results of the minimum press pressure are shown in Table 1.
2. Measurement of Durability of Anisotropic Conductive Sheet Set the created inspection device in the inspection section of the rail transport circuit board automatic inspection machine “STARCREC V5”, and set the circuit board 1 to be inspected prepared for the inspection device. The press pressure condition of the rail conveyance type automatic circuit board inspection machine “STARCREC V5” is set to 110 kgf, and after pressurizing a predetermined number of times, the electrode to be inspected of the circuit board 1 to be inspected is subjected to the press pressure of 110 kgf. Measure the conduction resistance value when applying a current of 1 milliampere through the current supply electrode 10 times, then pressurize a predetermined number of times, and similarly measure the conduction resistance value 10 times with the voltage measurement electrode Was repeated.

An inspection point (NG inspection point) having a measured conduction resistance value of 10Ω or more was determined as a continuity failure, and a ratio of NG inspection points to the total inspection points (NG inspection point ratio) was calculated.
Next, the anisotropic conductive sheet in the inspection apparatus is replaced with a new one, and pressurization is performed a predetermined number of times under the same conditions as above except that the press pressure condition is changed to 130 kfg. The point ratio was calculated.

  In the measurement of the conduction resistance value regarding the durability of the anisotropic conductive sheet, after the measurement of one conduction resistance value is completed, the press pressure related to the measurement is released and the inspection apparatus is returned to the non-pressurized state. The measurement of the conduction resistance value was performed again by applying a press pressure having a predetermined magnitude.

In this inspection apparatus, the NG inspection point ratio is required to be 0.01% or less for practical use.
That is, when the NG inspection point ratio exceeds 0.01%, an erroneous inspection result that is a defective product with respect to a non-defective circuit board to be inspected may be obtained, so that the reliability is high. There is a possibility that the electrical inspection of the circuit board cannot be performed.

Table 2 shows the results of measuring the durability of the anisotropic conductive sheet.
3. Evaluation of insulation The insulation resistance between the connection electrodes 25 (current terminal electrode 27 and voltage terminal electrode 28) forming a pair of the pitch conversion board 72 in the circuit board side connector 21 was evaluated as follows.

For the evaluation of the insulation between the connecting electrodes, a glass epoxy substrate having a length of 100 mm, a length of 100 mm in the horizontal direction, and a thickness of 0.8 mm and having a surface coated with an insulating coating was used.
The prepared inspection apparatus is set in the inspection section of the rail conveyance type automatic circuit board inspection machine “STARCREC V5”, the glass epoxy board is set on the inspection apparatus, and the rail conveyance type automatic circuit board inspection machine “STARREC V5” is set. The press pressure of "" is changed stepwise within the range of 100 to 210 kgf, and the connection forming the respective pairs provided on the pitch conversion substrate 72a for the first inspection jig 11a is performed 10 times for each press pressure condition. The insulation resistance between the electrodes 25 was measured.

  Specifically, the insulation resistance value was obtained by measuring the conduction resistance value of the pair of connection electrodes 25 while applying a current of 1 milliampere through the terminal electrode 24 corresponding to the pair of connection electrodes 25.

  A pair of connection electrodes having a measured insulation resistance value of 100Ω or more is determined to have good insulation, and a ratio of points determined to have good insulation with respect to the total number of inspection points (hereinafter referred to as “insulation passing point ratio”) is calculated. did.

  The number of connection electrodes 25 of the pitch conversion substrate 72a in the first inspection jig 11a is 7600, and 3600 pairs. That is, since there are 3600 pairs of connection electrodes and 10 measurements were performed under each press pressure condition, the insulating passing point ratio is specifically calculated by the equation (3600) × 10 = 36000. The ratio of NG inspection points to 36000 inspection points was shown.

In this inspection apparatus, it is necessary that the insulating passing point ratio is 99.9% or more in practice.
That is, when the insulating pass score ratio is less than 99.9%, a leakage current flows from the connection electrode used as the current supply electrode to the connection electrode used as the voltage measurement electrode at the time of inspection. There is a case where an erroneous inspection result that a certain circuit board to be inspected is defective is obtained.

For this reason, there is a possibility that electrical inspection of a highly reliable circuit board cannot be performed.
The results of the insulation evaluation are shown in Table 3.
[Comparative Example 1]
Instead of the pitch conversion substrate 72 described above,
A laminated material (Matsushita Electric Works, product name: R-1766) in which a thin metal layer made of copper having a thickness of 18 μm is formed on both surfaces of a 0.5 mm thick insulating substrate made of glass fiber reinforced epoxy resin, A total of 7200 circular through-holes with a diameter of 0.1 mm, each penetrating in the thickness direction of the laminated material, were formed by a numerically controlled drilling apparatus.

  In this case, the two through holes are formed as a set at a position corresponding to the electrode to be inspected on the upper surface side of the evaluation circuit board, and the set of through holes is formed with a gap of 0.1 mm. (That is, it means that the gap between the through hole A = 0.1 mm and the through hole B = 0.1 mm is set to be 0.1 mm).

Otherwise, the pitch conversion substrate for the comparative example was manufactured in the same manner as the pitch conversion substrate of Example 1.
The pitch conversion substrate 72 has a vertical and horizontal dimensions of 120 mm × 160 mm, a thickness of 0.5 mm, a dimension of a portion exposed from the insulating layer surface of the connection electrode 25 is 60 μm × 30 μm, and a protrusion from the insulating layer surface of the connection electrode 25. The height was about 30 μm, the distance between the paired connection electrodes 25 was 30 μm, the diameter of the terminal electrodes 24 was 0.4 mm, and the arrangement pitch of the terminal electrodes 24 was 0.75 mm.

Similarly to the above, 5200 connection electrodes 25 are provided on the front surface, and 52
A pitch conversion substrate 72b for the second inspection jig 11b having 00 terminal electrodes 24 was produced.

  The pitch conversion substrate 72b has a vertical and horizontal dimension of 120 mm × 160 mm, a thickness of 0.5 mm, a dimension of a portion exposed on the surface of the insulating layer in the connection electrode 25 is 60 μm × 30 μm, and from the surface of the insulating layer in the connection electrode 25 The projecting height of the terminal electrode is about 30 μm, the distance between the paired connection electrodes is 30 μm, the diameter of the terminal electrodes 24 is 0.4 mm, and the arrangement pitch of the terminal electrodes 24 is 0.75 mm.

  Then, the same as in Example 1 except that the circuit board side connector 21b is formed by laminating only the second anisotropic conductive sheet and the thickness of 50 μm on the first anisotropic conductive sheet 71b and the pitch converting substrate 72b. An inspection apparatus having a configuration was manufactured.

About the produced comparative test | inspection apparatus, with the method similar to Example 1, durability of the minimum press pressure and an anisotropically conductive sheet was measured.
Table 1 shows the measurement results of the minimum press pressure, Table 2 shows the measurement results of the durability of the anisotropic conductive sheet, and Table 3 shows the results of the insulation evaluation.

As apparent from Tables 1 and 2, the inspection apparatus of Example 1 had a lower minimum press pressure and the durability of the anisotropic conductive sheet was significantly improved as compared with the inspection apparatus of the comparative example.
As is apparent from the results in Table 3, the inspection apparatus of Example 1 has almost no leakage current between the connection electrodes.

  Therefore, a highly reliable circuit board can be electrically inspected.

FIG. 1 is a cross-sectional view illustrating an embodiment of an inspection apparatus of the present invention. FIG. 2 is a cross-sectional view showing a stacked state when the inspection apparatus of FIG. 1 is used for inspection. FIG. 3 is a diagram showing the surface of the pitch conversion board on the circuit board side. FIG. 4 is a diagram showing the pin side surface of the pitch conversion substrate. FIG. 5 is a partial cross-sectional view showing a state in which a pitch conversion substrate, a relay substrate, and a circuit board to be inspected are stacked. FIG. 6 is an enlarged plan view showing the main part of the electrode sheet in the circuit board-side connector shown in FIG. FIG. 7 is an explanatory cross-sectional view showing an enlarged main part of the electrode sheet in the circuit board side connector shown in FIG. FIG. 8 is a schematic cross-sectional view illustrating a method for manufacturing an electrode sheet. FIG. 9A is a partial cross-sectional view of the first anisotropic conductive sheet (fifth anisotropic conductive sheet), and FIG. 9B is a partial cross-sectional view of the second anisotropic conductive sheet. FIG. 10 is an explanatory cross-sectional view showing an enlarged main part of the fourth anisotropic conductive sheet. FIG. 11 is a schematic cross-sectional view illustrating a method for manufacturing the fourth anisotropic conductive sheet. FIG. 12 is a schematic cross-sectional view illustrating a method for manufacturing the fourth anisotropic conductive sheet. FIG. 13 is a schematic cross-sectional view illustrating a fourth anisotropic conductive sheet. FIG. 14 is a schematic cross-sectional view showing an enlarged main part of the third anisotropic conductive sheet. FIG. 15 is a schematic cross-sectional view showing an enlarged main part of the relay board. FIG. 16 is a schematic cross-sectional view illustrating a method for manufacturing a relay board. FIG. 17 is a schematic cross-sectional view illustrating a method for manufacturing a relay board. FIG. 18 is a schematic cross-sectional view illustrating a method for manufacturing a relay board. FIG. 19 is a schematic cross-sectional view illustrating a state in which the circuit board-side connector of the present invention is disposed on one surface of the circuit board to be inspected. FIG. 20 is a schematic cross-sectional view illustrating a state where the circuit board-side connector of the present invention is pressed. FIG. 21 is an explanatory view showing a state in which a positional deviation has occurred between the electrode to be inspected and the connection electrode pair. FIG. 22 is a cross-sectional view illustrating the configuration of the circuit board to be inspected. FIG. 23 is a cross-sectional view of the relay pin unit. FIG. 24 is a cross-sectional view showing a part of the conductive pin, the intermediate holding plate, and the insulating plate of the relay pin unit. FIG. 25 is a cross-sectional view similar to FIG. 24 showing another example of the configuration of the relay pin unit. FIG. 26 is a cross-sectional view showing steps until a conductive pin is arranged between the first insulating plate and the second insulating plate in the configuration of FIG. FIG. 27 is a cross-sectional view of a relay pin unit in which a bent holding plate is arranged. FIG. 28 is a partially enlarged view of the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate of the relay pin unit. FIG. 29 is a partially enlarged sectional view for explaining an embodiment of the inspection apparatus of the present invention. FIG. 30 is a partially enlarged cross-sectional view for explaining a use state of the inspection apparatus according to the embodiment of the present invention. FIG. 31 is a partially enlarged cross-sectional view for explaining the usage state of the relay pin unit in the inspection apparatus of the present invention. FIG. 32 is a partially enlarged cross-sectional view for explaining a use state of the inspection apparatus in one embodiment of the present invention. FIG. 33 is a cross-sectional view similar to FIG. 29 for explaining another embodiment of the inspection apparatus of the present invention. FIG. 34 is an enlarged cross-sectional view of the relay pin unit of FIG. FIG. 35 is a cross-sectional view for explaining another embodiment of the inspection apparatus of the present invention. FIG. 36 is a cross-sectional view of a conventional inspection apparatus. FIG. 37 is a configuration diagram of a conventional apparatus for measuring electrical resistance between electrodes on a circuit board. FIG. 38 is a schematic diagram for explaining a conventional inspection apparatus. FIG. 39 is a schematic diagram for explaining a conventional inspection apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Circuit board to be inspected 2 ... One side inspection electrode 3 ... Other side inspection electrode 4 ... Through-hole 6 ... Resist film 7 ... Core electrode for inspection 8a ... Circuit 8b ... Circuit 9 ... Insulating support sheet 10A ... Laminated material 10H ... Through hole 11 ... Insulating sheet 11a ... First inspection jig 11b ... Second inspection jig 12 ... Through hole 13 ... Ring electrode 14 ... Relay electrode 15 ... Short-circuit part 16A ... Metal layer 16B ... Wiring part 17A ... Conductive sheet material layer 17B ... Conductive sheet material 19 ...・ ・ Through hole 20A ・ ・ Composite laminated material 20B ・ ・ Laminated material 21 ・ ・ ・ Circuit board side connector 21a ・ ・ Circuit board side connector 21b ・ ・ Circuit board side connector 23A ・ ・ Metal layer 23K ・ ・ Opening 23B ・ ・ Metal Thin layer 24... Terminal electrode 24 ··· Pattern hole 25 ··· Connection electrode 25a · · Body portion 25b · · Terminal portion 26b · · · Terminal portion 27 · · · Terminal electrode for current 28 · · · Terminal electrode for voltage 30 · · · One side molding member 31 ... Relay pin unit 31a ... Relay pin unit 31b ... Relay pin unit 32 ... Conductive pin 32a ... Conductive pin 32b ... Conductive pin 32K ... Opening 33 ... First support pin 33a ... 1 support pin 33b ... first support pin 34 ... first insulating plate 34a ... first insulating plate 34b ... first insulating plate 35 ... second insulating plate 35a ... second insulating plate 35b ... 2nd insulating plate 36 ... intermediate holding plate 36a ... intermediate holding plate 36b ... intermediate holding plate 37 ... second support pin 37a ... second support pin 37b ... second support pin 38A ... first Abutting support position 38B ・Second contact support position 39... Holding plate support pin 39 b .. holding plate support pin 41... Tester side connector 41 a .. tester side connector 41 b .. tester side connector 42. Sheet 42a ... fifth anisotropic conductive sheet 42b ... fifth anisotropic conductive sheet 43 ... connector board 43a ... connector board 43b ... connector board 46 ... base plate 49 ... support pin DESCRIPTION OF SYMBOLS 51 ... Insulating substrate 52 ... Wiring 53 ... Internal wiring 54 ... Insulating layer 60 ... Connection core electrode 61 ... Body part 62 ... Other side molding member 63 ... Spacer 64... Central portion 65... Press roll 66. Support roll 67. Press roll apparatus 71... First anisotropic conductive sheet 71 a .. First anisotropic conductive sheet 71 b ..First difference Conductive sheet 72 ... Pitch conversion substrate 72a ... Pitch conversion substrate 72b ... Pitch conversion substrate 73 ... Second anisotropic conductive sheet 73a ... Second anisotropic conductive sheet 73b ... 2. Anisotropic conductive sheet 74 ... Electrode sheet 74a ... Electrode sheet 74b ... Electrode sheet 75 ... Third anisotropic conductive sheet 75a ... Third anisotropic conductive sheet 75b ... Third anisotropic Conductive sheet 76 ... Relay board 76a ... Relay board 76b ... Relay board 77 ... Fourth anisotropic conductive sheet 77a ... Fourth anisotropic conductive sheet 77b ... Fourth anisotropic conductive sheet 78 ... Insulating part 79 ... Conducting path forming part 80 ... Conductive particles 81 ... End part 81a ... End part 81b ... Base end part 82 ... Center part 83 ... Through hole 83a..Through hole 83b..Through hole 84.・ Bending holding plate 85... Through hole 86... Through hole 87... Projecting portion 90 A .. Laminate material 90 B... Composite laminate material 91. Electrode 92a .. Body 92b .. Terminal part 93A .. Metal layer 93B .. Metal thin layer 93K .. Opening 94 ... Resist film 94H ... Pattern hole 101 ... Circuit board 102 to be inspected ... Inspection electrode 111a ··· Inspection jig 111b · · Inspection jig 121a · · Circuit board side connector 122a · · An anisotropic conductive sheet 123a · · Pitch conversion substrate 131a · · Relay pin unit 132a · · Conductive pin 134a · · · Insulating plate 141a ... Tester side connector 142a ... Anisotropic conductive sheet 143a ... Connector board 146a ... Base board 200 ... Circuit board 202 to be inspected ... Inspection electrode 206 ... Power supply device 208 ... Electric signal processing device 300 ... Inspected electrode 302 ... Current supply electrode 304 ... Voltage measurement electrode A ... Intermediate holding plate projection surface B・ ・ Through hole D ・ ・ ・ Separation distance L ・ ・ ・ Diameter L1 ・ ・ Distance L2 ・ ・ Distance P ・ ・ ・ Conductive particles PA ・ ・ ・ Current supply probe PB ・ ・ ・ Voltage measurement probe PC ・ ・ ・Voltage measurement probe PD ... Current supply probe Q1 ··· Diagonal Q2 ·· Diagonal R1 ··· Unit cell region R2 · · Unit cell region r1 · · Diameter r2 · · Diameter r3 · · Diameter

Claims (15)

A circuit board inspection apparatus that performs an electrical inspection by sandwiching both surfaces of a circuit board to be inspected between a pair of first inspection jigs and a second inspection jig.
The first inspection jig and the second inspection jig are respectively
A first anisotropic conductive sheet;
A pitch converting substrate that is disposed on the circuit board side to be inspected of the first anisotropic conductive sheet and converts the electrode pitch between one surface side and the other surface side of the substrate;
A second anisotropic conductive sheet disposed on the circuit board side to be inspected of the pitch conversion board;
Insulating having a test core electrode electrically connected to the ring electrode and a connection core electrode electrically connected to the relay electrode, disposed on the circuit board side to be inspected of the second anisotropic conductive sheet A relay board made of a support sheet;
A third anisotropic conductive sheet disposed on the inspected circuit board side of the relay board and having a plurality of through holes according to a pattern corresponding to the inspected electrode of the inspected circuit board whose electrical resistance is to be measured;
The third anisotropically conductive sheet has a plurality of through holes on the side of the circuit board to be inspected according to a pattern corresponding to the electrode to be inspected of the circuit board to be measured for electrical resistance, and surrounds the through hole. A flexible electrode sheet having a plurality of the ring-shaped electrodes formed thereon and the relay electrodes electrically connected to the ring-shaped electrodes on the back surface;
A fourth anisotropic conductive sheet provided on the inspected circuit board side of the electrode sheet;
A circuit board-side connector with
A plurality of conductive pins arranged at a constant pitch;
An insulating plate that supports the conductive pin so as to be movable up and down;
A relay pin unit with
A connector board for electrically connecting the tester and the relay pin unit;
A fifth anisotropic conductive sheet disposed on the relay pin unit side of the connector board;
A base plate disposed on the side opposite to the relay pin unit of the connector board;
A tester side connector with
A circuit board inspection apparatus comprising: The inspection core electrode and the connection core electrode in the relay board of the circuit board side connector,
The circuit board inspection device according to claim 1, wherein the inspection device is provided so as to be movable in a thickness direction of the insulating support sheet. The circuit board side connector is
Each of the electrodes to be inspected on both sides of the circuit board to be inspected can be measured by simultaneously electrically connecting the ring electrode of the electrode sheet and the core electrode for inspection of the relay board on the circuit board side connector. State,
In this measurable state, one of the inspection core electrode and the ring-shaped electrode electrically connected to one designated electrode to be inspected is used as a current supply electrode, and the other is used as a voltage measurement electrode. 3. The circuit board inspection apparatus according to claim 1, wherein the measurement of the electrical resistance of the specified one electrode to be inspected is performed by using the circuit board. The relay pin unit is
A plurality of the conductive pins arranged at a predetermined pitch; and
A pair of spaced apart first and second insulating plates for supporting the conductive pins movably in the axial direction;
An intermediate holding plate disposed between the first insulating plate and the second insulating plate;
A first support pin disposed between the first insulating plate and the intermediate holding plate;
A second support pin disposed between the second insulating plate and the intermediate holding plate;
The circuit board inspection apparatus according to claim 1, wherein the circuit board inspection apparatus comprises: The relay pin unit is
A first contact support position of the first support pin with respect to the intermediate holding plate;
A second contact support position of the second support pin with respect to the intermediate holding plate;
5. The circuit board inspection apparatus according to claim 4, wherein the circuit board inspection apparatus is arranged at different positions on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate. When sandwiching both surfaces of the circuit board to be inspected between the inspection jigs by the pair of first inspection jig and the second inspection jig,
The intermediate holding plate bends in the direction of the second insulating plate around the first contact support position of the first support pin with respect to the intermediate holding plate, and
6. The intermediate holding plate is configured to bend in the direction of the first insulating plate around a second contact support position of the second support pin with respect to the intermediate holding plate. The circuit board inspection apparatus as described. The first contact support position of the first support pin with respect to the intermediate holding plate is
Arranged in a grid pattern on the intermediate holding plate projection surface,
Second contact support positions of the second support pins with respect to the intermediate holding plate are arranged in a grid pattern on the intermediate holding plate projection surface,
In the intermediate holding plate projection surface, one second abutment support position is disposed in a unit lattice region composed of four adjacent first abutment support positions, and
In the intermediate holding plate projection surface, one first abutment support position is arranged in a unit lattice area composed of four adjacent second abutment support positions. The circuit board inspection apparatus according to claim 5 or 6. The relay pin unit is
A plurality of intermediate holding plates disposed at a predetermined interval between the first insulating plate and the second insulating plate;
A holding plate support pin disposed between the adjacent intermediate holding plates;
With
In at least one of the intermediate holding plates, a contact support position of the holding plate support pin that contacts the intermediate holding plate from one surface side with respect to the intermediate holding plate;
The first support pin that contacts the intermediate holding plate from the other surface side, the second support pin, or the contact support position of the holding plate support pin with respect to the intermediate holding plate,
8. The circuit board inspection apparatus according to claim 5, wherein the circuit board inspection apparatus is disposed at different positions on an intermediate holding plate projection surface projected in a thickness direction of the intermediate holding plate. 9. In all the intermediate holding plates,
A contact support position of the support plate support pin that contacts the intermediate support plate from one side with respect to the intermediate support plate;
The first support pin that contacts the intermediate holding plate from the other surface side, the second support pin, or the contact support position of the holding plate support pin with respect to the intermediate holding plate,
9. The circuit board inspection apparatus according to claim 8, wherein the circuit board inspection apparatus is disposed at different positions on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate. The first anisotropic conductive sheet is
A plurality of conductive path forming portions extending in the thickness direction;
An insulating part that insulates these conductive path forming parts from each other;
The conductive particles are contained only in the conductive path forming portion, whereby the conductive particles are dispersed non-uniformly in the plane direction, and the conductive path forming portion protrudes on one side of the sheet. The circuit board inspection apparatus according to claim 1. The fifth anisotropic conductive sheet is
A plurality of conductive path forming portions extending in the thickness direction;
An insulating part that insulates these conductive path forming parts from each other;
The conductive particles are contained only in the conductive path forming portion, whereby the conductive particles are dispersed non-uniformly in the plane direction, and the conductive path forming portion protrudes on one side of the sheet. The circuit board inspection apparatus according to claim 1. The plurality of conductive pins are:
A rod-shaped central portion shorter than the distance between the first insulating plate and the second insulating plate;
It consists of a pair of end portions that are formed on both ends of the center portion and have a diameter smaller than that of the center portion,
Each of the pair of end portions is inserted into a through hole having a diameter smaller than the center portion formed in the first insulating plate and the second insulating plate and larger than the pair of end portions,
12. The circuit board inspection apparatus according to claim 1, wherein the conductive pin is supported so as to be movable in an axial direction. Between the first insulating plate and the intermediate holding plate, between the second insulating plate and the intermediate holding plate, or between the intermediate holding plates,
A bending holding plate having a through hole through which the conductive pin is inserted is provided;
The plurality of conductive pins are:
A through hole formed in the first insulating plate and the second insulating plate;
A through hole formed in the bent holding plate;
And a conductive pin is supported so as to be movable in the axial direction by being pressed at the positions of the through holes of the bent holding plate. 13. The circuit board inspection apparatus according to any one of items 1 to 12.   14. The circuit board inspection apparatus according to claim 1, wherein the electrodes to be inspected on both surfaces of the substrate to be inspected are solder ball electrodes. A circuit board inspection method using the circuit board inspection apparatus according to claim 1,
A circuit board inspection method characterized in that electrical inspection is performed by sandwiching both sides of a circuit board to be inspected between a pair of first inspection jigs and a second inspection jig. .

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