WO2006009104A1

WO2006009104A1 - Inspection equipment of circuit board and inspection method of circuit board

Info

Publication number: WO2006009104A1
Application number: PCT/JP2005/013139
Authority: WO
Inventors: Kiyoshi Kimura; Sugiro Shimoda; Satoshi Suzuki; Fujio Hara
Original assignee: Jsr Corporation
Priority date: 2004-07-16
Filing date: 2005-07-15
Publication date: 2006-01-26
Also published as: TW200619647A

Abstract

Inspection equipment and an inspection method of a circuit board capable of performing highly reliable electrical inspection even if a circuit board to be inspected has electrodes arranged at a fine pitch. An interconnection pin unit (31) is provided with an intermediate holding plate (36), a first supporting pin (33) arranged between a first insulation plate (34) and the intermediate holding plate (36), and a second supporting pin (37) arranged between a second insulation plate (35) and the intermediate holding plate (36), wherein the first butting/supporting position of the first supporting pin to the intermediate holding plate is located differently from a second butting/supporting position of the second supporting pin to the intermediate holding plate on the projection plane of the intermediate holding plate in the thickness direction thereof. A first anisotropic conductive sheets (22) consisting of conduction path forming parts formed by laser machining and a part insulating these conduction path forming parts from each other is integrated on a pitch conversion substrate (23) side to constitute a pitch conversion adaptor body (60). Alternatively, an interconnection substrate (29) having an insulating part (62) and a conduction path forming part (61) penetrating the insulating part (62) in the thickness direction is arranged in a plurality of through holes formed in a substrate (73), and electrical connection of the pitch conversion substrate (23) and a circuit board (1) to be inspected is interconnected.

Description

Specification

Circuit board inspection apparatus and circuit board inspection method

Technical field

The present invention relates to a circuit board (hereinafter referred to as “circuit board to be inspected”) to be inspected for electrical inspection from both sides with a pair of first inspection jig and second inspection jig. A circuit board inspection apparatus and circuit board inspection device that inspects the electrical characteristics of the circuit board to be inspected by clamping the electrodes so that the electrodes formed on both surfaces of the circuit board to be inspected are electrically connected to the tester. Regarding the method.

Background art

[0002] Prior to mounting an integrated circuit or the like, a printed circuit board for mounting an integrated circuit or the like is inspected for electrical characteristics to confirm that the wiring pattern of the circuit board has a predetermined performance.

In this electrical inspection, for example, an inspection head is incorporated into an inspection tester having a circuit board transport mechanism, and different circuit boards are inspected by exchanging the inspection head portion.

[0003] For example, as disclosed in Patent Document 1, an inspection jig having a structure in which a metal inspection pin that is in electrical contact with an inspection target electrode of a circuit board to be inspected is implanted on the substrate is provided. A method of use has been proposed.

Also, as disclosed in Patent Document 2, a method of using an inspection jig in which an inspection head having a conductive pin, a circuit board for pitch conversion called an off-axis adapter, and an anisotropic conductive sheet are combined. Is known.

However, as described in Patent Document 1, in the method using an inspection jig in which a metal inspection pin is brought into direct contact with an inspection target electrode of a circuit board to be inspected, contact with a conductive pin having a metal force is not possible. Further, there is a possibility that the electrode of the circuit board to be inspected is damaged.

In particular, in recent years, circuit boards have been miniaturized and densified, and when inspecting such a printed circuit board, in order to bring a large number of conductive pins into conductive contact with the inspected electrodes of the inspected circuit board at the same time. Needs to pressurize the inspection jig with high pressure, The electrode to be inspected is easily damaged.

[0005] With such an inspection jig for inspecting a miniaturized and high-density printed circuit board, it becomes technically difficult to implant a large number of metal pins on the board at a high density. There is one. In addition, the manufacturing cost is high, and it is difficult to repair or replace some of the metal pins when they are damaged.

On the other hand, as in Patent Document 2, in the inspection jig using the anisotropic conductive sheet, the electrode to be inspected of the circuit board to be in contact comes into contact with the electrode of the substrate for pitch conversion through the anisotropic conductive sheet. Therefore, there is an advantage that the electrode to be inspected of the circuit board to be inspected is hardly damaged. In addition, since a substrate that performs pitch conversion is used, the inspection pins to be implanted on the substrate can be implanted with a pitch wider than the pitch of the electrodes to be inspected on the circuit board to be inspected. It is possible to save the manufacturing cost of inspection jigs that do not require the installation of inspection pins at the pitch.

[0006] However, with this inspection jig, it is necessary to create a pitch conversion board and an inspection jig in which an inspection pin is implanted for each circuit board to be inspected. The same number of inspection jigs as the printed circuit board that is the circuit board to be inspected are required.

For this reason, when a plurality of printed circuit boards are produced, there is a problem that a plurality of inspection jigs must be held correspondingly. In particular, in recent years, the product cycle of electronic equipment has been shortened, and the production period of printed circuit boards used in products has been shortened. With this, inspection jigs cannot be used for a long time, The problem arises that inspection jigs must be produced each time printed circuit board production switches.

[0007] As a countermeasure against such a problem, for example, as in Patent Documents 3 to 5, an inspection apparatus using a so-called universal type inspection jig using a relay pin unit has been proposed.

FIG. 62 is a cross-sectional view of an inspection apparatus using such a universal type inspection jig. This inspection apparatus includes a pair of first inspection jig 11 la and second inspection jig 11 lb. These inspection jigs include circuit board side connectors 121a and 121b and relay pin units 131a and 131b. And tester side connectors 141a and 141b. [0008] The circuit board side connectors 121a and 121b include pitch conversion boards 123a and 123b, and anisotropic conductive sheets 122a, 122b, 126a, and 126b arranged on both sides thereof.

The relay pin units 131a and 131b have a large number of conductive pins 132a and 132b (for example, 5000 pins) arranged on a lattice point at a constant pitch (for example, 2.54 mm pitch), and the conductive pins 132a and 132b can be moved up and down. It has a pair of insulating plates 134a, 134b to support.

[0009] The tester side connectors 141a and 141b are connector boards 143a and 143a that electrically connect the tester and the conductive pins 132a and 132b when the circuit board 101 to be inspected is clamped by the inspection jigs 11 la and 111b. 143b, anisotropic conductive sheets 142a and 142b placed on the conductive pins 132a and 132bftlJ of the connector boards 143a and 143b, and base plates 146a and 146b.

[0010] In this inspection jig using the relay pin unit, when inspecting a printed circuit board which is a different object to be inspected, the circuit board side connectors 121a and 121b are replaced with ones corresponding to the circuit board 101 under inspection. The relay pin unit 13 la, 13 lb and the tester side connectors 141a, 141b can be used in common.

By the way, the printed circuit board 101 which is the circuit board 101 to be inspected has been multi-layered and densified. Actually, for example, the height variation due to the electrodes 102 and 103 to be inspected, such as solder ball electrodes such as BGA, in the thickness direction. Or the substrate itself is warped. Therefore, in order to achieve electrical connection to the electrodes 102 and 103 to be inspected on the circuit board 101 to be inspected, the first inspection jig 11 la and the second inspection jig 11 lb are used. It is necessary to deform the circuit board 101 to be inspected flatly by applying high pressure. In addition, for the variations in the height of the electrodes 102 and 103 to be inspected, the first inspection jig 11 la and the second inspection jig 11 lb need to follow the height of the electrodes 102 and 103 to be inspected. It becomes.

[0011] In such a conventional universal type inspection jig, the force followed by the axial movement of the conductive pins 132a and 132b in order to ensure followability to the height of the electrodes 102 and 103 to be inspected. Since the amount of movement of the conductive pins 132a and 132b in the axial direction is also limited, the followability to the height of the electrodes 102 and 103 to be inspected may not be good. It will not be possible.

[0012] In such a universal type inspection jig, the press pressure when the circuit board 101 to be inspected is clamped by the first inspection jig 11la and the second inspection jig 111b is the same. It is absorbed by the upper and lower anisotropic conductive sheets 122a, 122b, 126a, 126b, 142a, 142b.

Therefore, in such a universal type inspection jig, it is necessary to arrange the conductive pins 132a and 132b at regular intervals in order to support the pitch conversion substrates 123a and 123b and disperse the press pressure.

[0013] Further, in the conventional universal type inspection jig, since the press pressure is received by the conductive pins 132a and 132b, it is necessary to arrange a large number of conductive pins 132a and 132b at regular intervals.

Therefore, in response to the miniaturization of the electrodes of the circuit board 101 to be inspected, for example, when the insulating plates 134a and 134b having 10,000 or more through holes are formed with a 0.75 mm pitch, the insulating plates 134a and 134b If the thickness of the substrate is thin, the strength is low, and it may crack when bent. Therefore, it was necessary to increase the thickness of the insulating plates 134a and 134b.

[0014] When the diameter of the through-hole to be formed becomes fine, for example, about 0.5 mm, and the insulating plates 134a and 134b have a thickness of 5 mm or more, the through-hole is formed by a single drilling process. When doing so, the drill blades are often broken or broken due to the strength of the drill blades, and the insulation plate processing often fails.

For this reason, the insulation plate is processed by drilling the half-thickness of the insulation plate to about half the thickness, and further forming a through hole by drilling the same part from the other side. In this case, a drilling operation twice as many as the number of through-holes formed in the insulating plate is required, and the processing process becomes complicated.

[0015] Further, in such a conventional universal type inspection jig, as the anisotropic conductive sheets 122a and 122b constituting the circuit board side connector, a plurality of conductive path forming portions extending in the thickness direction, and these conductive paths are provided. It consists of an insulating part that insulates the forming part from each other, and the conductive particles are contained only in the conductive path forming part and dispersed unevenly in the plane direction, and the conductive path forming part protrudes on one side of the sheet. A conductive sheet was used. This anisotropic conductive sheet deteriorates the conductive path formation part (increase in resistance value) by repeated use in inspection, and when changing the anisotropic conductive sheet, the pitch of the anisotropic conductive sheet is changed every time it is replaced. It is necessary to align with the circuit board, and align the circuit board connector with the relay pin unit. As a result, this alignment work is complicated and causes a reduction in inspection efficiency.

[0016] Further, when the electrodes of the circuit board to be inspected have a minute pitch of, for example, 200 μm or less, the inspection is continuously performed on the plurality of circuit boards to be inspected using the anisotropic conductive sheet as described above. In this case, the anisotropic conductive sheet is likely to be displaced due to repeated contact with the circuit board to be inspected. As a result, the conductive path forming part of the anisotropic conductive sheet and the electrode position of the circuit board to be inspected do not match, and an excellent electrical connection cannot be obtained, so an excessive resistance value is measured. The printed circuit board should be mistaken for a defective product.

Conventionally, in order to solve such a problem, a connection electrode arranged according to a pattern corresponding to a test target electrode of a circuit board to be inspected is provided on the front surface, and a lattice point position is provided on the rear surface. There has been proposed an adapter device comprising a pitch conversion substrate having terminal electrodes arranged thereon and an anisotropic conductive elastomer sheet integrally provided on the surface of the pitch conversion substrate (patent). Reference 6 and Patent reference 7).

[0018] According to such an adapter device, it is not necessary to align the anisotropic conductive elastomer sheet in the electrical inspection of the circuit board, and it is possible to cope with environmental changes such as thermal history due to temperature changes. However, a good electrical connection state is stably maintained, and thus high connection reliability can be obtained.

However, as shown in FIG. 63, when the pitch P1 between the electrodes 102 (103) to be inspected is 100 m or less, the separation distance S1 between the electrodes 102 (103) to be inspected is 50 m or less. End up. For this reason, as shown in FIG. 64, the separation distance between the connection electrodes 125 of the pitch conversion substrate 123 is also set to 50 m or less, which is the same as the separation distance S1 between the electrodes to be inspected 102 (103). There is a need.

[0019] Therefore, the width of the insulating portions that insulate the conductive path forming portions of the anisotropic conductive sheet 122 from each other is also the same as the separation distance S1 between the electrodes 102 (103) to be inspected. Must be less than m.

However, an unevenly distributed anisotropic conductive elastomer sheet for inspecting a circuit board in which the electrodes to be inspected are arranged at a narrow pitch such that the distance between the electrodes to be inspected is 100 m or less is obtained. In this case, as described above, insulation that insulates between adjacent conductive path forming portions from each other Force that needs to be formed so that the width of the part is 50 m or less In the conventional method of producing a sheet by mold forming, an insulating part of 50 m or less is formed due to the magnetic field action with the adjacent mold magnetic pole. It becomes difficult.

[0020] For this reason, in the unevenly distributed anisotropic conductive elastomer sheet according to this conventional manufacturing method, the lower limit for inspecting the distance between the electrodes of the circuit board is approximately 60 to 80 / ζ πι, depending on the thickness of the sheet. In the meantime.

Therefore, an unevenly anisotropic anisotropic conductive elastomer sheet for inspecting a circuit board in which the electrodes to be inspected are separated by 50 m or less and the electrodes to be inspected are arranged at a small pitch is formed by a mold method. Since it is extremely difficult to do so, it is virtually impossible to obtain.

[0021] Further, as an adapter device, after a conductive elastomer layer is formed on the surface of the pitch conversion substrate, laser processing is performed on the conductive elastomer layer and a part thereof is removed to thereby remove the pitch conversion substrate. There has been proposed a structure in which conductive path forming portions independent of each other are formed on each of the connection electrodes (Patent Document 8).

According to such an adapter device, since each of the conductive path forming portions is formed in an independent state, the required insulation can be reliably obtained between adjacent conductive path forming portions.

[0022] However, in this adapter device, since each of the conductive path forming portions is supported only by the connection electrodes of the pitch conversion board, the pitch conversion board force easily falls off and has low durability. There is a problem.

Further, when the conductive path forming portion is formed, there is a problem that the pitch conversion substrate may be damaged by laser processing.

On the other hand, in a so-called dispersion-type anisotropic conductive elastomer sheet in which conductive particles are arranged in the thickness direction and uniformly dispersed in the plane direction, high resolution can be obtained by reducing the thickness. Therefore, for example, by setting the thickness to about 30 m, it is possible to inspect a circuit board having a separation distance of electrodes to be inspected of 50 m or less as the resolution.

However, the thin dispersion-type anisotropic conductive elastomer sheet whose thickness is about 30 m is one of the characteristics of the anisotropic conductive elastomer sheet, which is the elasticity of the sheet body. Since the ability to absorb mechanical shock due to electrical contact and the ability to achieve electrical connection by soft contact between electrodes are almost lost, a circuit board to be inspected that has electrodes to be inspected with numerous height variations can be used as an inspection device. In the case of connection, it becomes difficult to connect a large number of electrodes to be inspected at the same time due to the lowering of the step-level collection ability of the anisotropic conductive elastomer sheet.

[0024] For example, in a circuit board on which a large number of electrodes are formed by the measurement, the variation in height of each electrode is about 20 m. In the case of a dispersed anisotropic conductive elastomer sheet, the compression rate at which stable electrical conduction can be achieved when compressed in the thickness direction is about 20% or less. For example, if compression exceeds 20%, the electrical conduction in the lateral direction increases, and if the anisotropy of conduction is impaired, permanent deformation of the elastomer that becomes the base material by force occurs, making repeated use difficult. It becomes. For this reason, when inspecting a circuit board having an electrode including a height variation of about 20 m, it is necessary to use a distributed anisotropic conductive elastomer sheet having a thickness of 100 m or more.

However, when a dispersed anisotropic conductive elastomer sheet having a thickness of 100 μm or more is used, it is impossible to inspect a circuit board in which electrodes to be inspected are arranged at a small pitch of 50 m or less. Therefore, there is a problem that it becomes substantially impossible.

In addition, the dispersion-type anisotropic conductive elastomer sheet with a small thickness is used when a circuit board is repeatedly inspected by using it as an adapter for circuit board inspection, which has a low ability to absorb mechanical shocks due to the low elasticity of the sheet body. In addition, the anisotropic conductive elastomer sheet deteriorates quickly, so that the distributed anisotropic conductive elastomer sheet must be frequently replaced. This makes the replacement work complicated and reduces the inspection efficiency of the circuit board.

[0026] Based on the above, in the circuit board inspection adapter using an anisotropic conductive elastomer sheet for inspecting a circuit board in which the electrodes to be inspected are as small as 50 μm or less and arranged at a pitch, A product that satisfies all of the resolution, step-absorbing ability, and durability for repeated use was not obtained.

As shown in FIG. 64, when the pitch P1 between the electrodes 102 (103) to be inspected is 100 m, the separation distance between the connection electrodes 125 of the pitch conversion substrate 123 is as follows. It should be 50 / zm which is the same as the separation distance S1 between 03). With high accuracy When performing a four-terminal inspection to detect potential electrical defects on the road board, as shown in Fig. 65, the pitch of one of the inspected electrodes 102 (103) on the circuit board to be inspected is Two electrodes (current supply electrode 127 and voltage measurement electrode 128) of conversion substrate 123 are connected.

Therefore, the separation distance S2 between the current supply electrode 127 and the voltage measurement electrode 128 on the pitch conversion substrate 123 is further reduced. For example, if the pitch P1 between the electrodes to be inspected 102 (103) of the pitch conversion substrate 123 is 200 m, the diameter R force S of the electrode 102 (103) to be inspected is about 100 m. Since both the current supply electrode 127 and the voltage measurement electrode 128 on the pitch conversion substrate 123 are connected to the inspection electrode 102 (103), the current supply electrode 127 and the voltage measurement electrode 128 are connected to each other. As shown in FIG. 65, the separation distance S2 can be provided only about 30 to 40 m.

[0028] However, as described above, in the related art, in the case of using either an unevenly distributed anisotropic conductive elastomer sheet or a distributed anisotropic conductive elastomer sheet, At present, no adapter device has been obtained in which the distance S2 between the connecting electrodes is 30 to 40 μm.

As described above, in the conventional circuit board inspection apparatus using the unevenly distributed anisotropic conductive sheet or the distributed anisotropic conductive sheet, the resolution required when inspecting a circuit board having a large number of electrodes to be inspected. In terms of step absorbability, cushioning, and durability, all of them had sufficient performance and were strong.

Patent Document 1 Japanese Patent Application Laid-Open No. 6-94768

Patent Document 2 Japanese Patent Laid-Open No. 5-159821

Patent Document 3 Japanese Patent Laid-Open No. 7-248350

Patent Document 4 JP-A-8-271569

Patent Document 5 JP-A-8-338858

Patent Document 6 JP 4-151564 A

Patent Document 7 JP-A-6-82531

Patent Document 8 JP 10-229270 A

Disclosure of the invention Problems to be solved by the invention

[0029] The present invention provides a circuit board inspection apparatus capable of performing a highly reliable electrical inspection of a circuit board even if the circuit board to be inspected has minute electrodes with a fine pitch. And it aims at providing the inspection method of a circuit board.

Further, the present invention provides a circuit board having a good followability to the height variation of the inspected electrode of the inspected circuit board to be inspected, causing no poor conduction, and capable of performing an accurate inspection. It is an object of the present invention to provide an inspection apparatus and a circuit board inspection method.

[0030] In addition, the present invention does not require the conductive pins to be arranged at regular intervals, so that the cost of drilling through holes in the insulating plate holding the conductive pins by drilling is reduced. It is an object of the present invention to provide a circuit board inspection apparatus and a circuit board inspection method that can be used.

Further, the present invention provides a method for continuously inspecting a plurality of circuit boards that require less correction of misalignment of the anisotropic conductive sheet when repeatedly inspecting circuit boards to be inspected. Another object of the present invention is to provide a circuit board inspection apparatus and a circuit board inspection method capable of smoothly performing inspection work.

[0031] Further, the present invention is capable of inspecting with high resolution, absorbs a step due to the inspected electrode of the inspected circuit board, and has a circuit board inspection apparatus excellent in repeated use durability. An object of the present invention is to provide a circuit board inspection method.

Means for solving the problem

[0032] The circuit board inspection apparatus of the present invention includes a pair of first inspection jig and second inspection jig, and both surfaces of the circuit board to be inspected between the inspection jigs. A circuit board inspection device that performs electrical inspection by sandwiching

The first inspection jig and the second inspection jig are respectively

A pitch converting substrate for converting an electrode pitch between one surface side and the other surface side of the substrate; a first anisotropic conductive sheet disposed on the circuit board to be inspected side of the pitch converting substrate;

A second anisotropic conductive sheet disposed on the opposite side to the circuit board to be inspected of the pitch conversion board; A circuit board-side connector with

A plurality of conductive pins arranged at a predetermined pitch;

A pair of spaced apart first and second insulating plates that support the conductive pins movably in the axial direction;

«I-pin unit with

A connector board for electrically connecting the tester and the relay pin unit;

A third anisotropic conductive sheet arranged on the relay pin unit side of the connector board; and a base plate arranged on the opposite side of the connector board on the relay pin unit; With

The relay pin unit is

An intermediate holding plate disposed between the first insulating plate and the second insulating plate;

A first support pin disposed between the first insulating plate and the intermediate holding plate;

A second support pin disposed between the second insulating plate and the intermediate holding plate;

With

The first abutting support position of the first support pin with respect to the intermediate holding plate and the second abutting support position of the second support pin with respect to the intermediate holding plate are in the thickness direction of the intermediate holding plate. It is placed at different positions on the projected intermediate holding plate projection surface,

The first anisotropic conductive sheet includes a plurality of conductive path forming portions extending in the thickness direction and insulating portions that insulate the conductive path forming portions from each other, and the conductive particles are only in the conductive path forming portions. Contained, whereby the conductive particles are non-uniformly dispersed in the surface direction, and the conductive path forming portion protrudes on one side of the sheet,

The first anisotropic conductive sheet constitutes a pitch conversion adapter integrated with the pitch conversion substrate and the first anisotropic conductive sheet and the pitch conversion substrate. Features.

With this configuration, when electrical inspection is performed by clamping both surfaces of the circuit board to be inspected between the first inspection jig and the second inspection jig, In the initial stage, the relay pin unit is moved in the thickness direction by the conductive pins, the first anisotropic conductive sheet, the second anisotropic conductive sheet, and the third anisotropic conductive sheet rubber. Pressure by elastic compression By absorbing the force, it is possible to absorb some variation in the height of the electrodes to be inspected on the circuit board to be inspected.

[0034] The first contact support position of the first support pin with respect to the intermediate support plate and the second contact support position of the second support pin with respect to the intermediate support plate are the thickness of the intermediate support plate. Since the intermediate holding plate projection surface projected in the vertical direction is arranged at different positions, the circuit board to be inspected is further pressurized between the first inspection jig and the second inspection jig. In addition to the rubber elastic compression of the first anisotropic conductive sheet, the second anisotropic conductive sheet, and the third anisotropic conductive sheet, the first insulating plate of the relay pin unit Due to the panel elasticity of the second insulating plate and the intermediate holding plate disposed between the first insulating plate and the second insulating plate, the height variation of the electrodes to be inspected of the circuit board to be inspected, for example, solder ball electrodes The pressure concentration can be dispersed to avoid local stress concentration for the height variation. That.

[0035] Accordingly, stable electrical contact is ensured for each of the electrodes to be inspected of the circuit board to be inspected having a height variation, and stress concentration is further reduced, so that the anisotropic conductive sheet Local damage is suppressed. As a result, the durability of repeated use of the anisotropic conductive sheet is improved, so that the number of replacements of the anisotropic conductive sheet is reduced and the inspection work efficiency is improved.

Further, since there is no need to arrange the conductive pins at regular intervals, the cost of drilling through holes in the insulating plate holding the conductive pins by drilling can be reduced.

[0036] Further, the first anisotropic conductive sheet is composed of a conductive path forming part and an insulating part, and the conductive particles are contained only in the conductive path forming part and are non-uniformly dispersed in the plane direction. Since an unevenly distributed anisotropic conductive sheet with a conductive path forming part projecting on one side is used, the applied pressure and impact due to the pressing of the inspection jig are absorbed by this sheet, and the circuit board electrodes, etc. The breakage will not be damaged.

[0037] Further, since the first anisotropic conductive sheet and the pitch conversion substrate side are integrated to form an integrated adapter for pitch conversion, these are different when performing repeated continuous inspections. This eliminates the need to correct the misalignment of the conductive sheet and improves the workability of the inspection.In addition, a good electrical connection is maintained stably against environmental changes such as thermal history due to temperature changes. High connection reliability can be obtained. [0038] Furthermore, regardless of the arrangement pattern of the electrodes to be inspected of the circuit board to be inspected, the required electrical inspection can be reliably performed on the circuit board to be inspected, and the circuit board to be inspected is inspected. Even if the electrodes are arranged with a small pitch and a high density, the required electrical inspection can be reliably performed on the circuit board to be inspected. In the circuit board inspection apparatus of the present invention, the first anisotropic conductive sheet constituting the pitch conversion adapter is integrated,

The releasable support plate is obtained by laser processing a conductive elastomer layer supported on a releasable support plate and dispersed in an elastic polymer material in a state where conductive particles exhibiting magnetism are oriented in the thickness direction. Forming a conductive path forming portion arranged in accordance with a predetermined pattern on the top;

An insulating material layer formed of a material that is cured to become an elastic polymer substance is formed between these conductive path forming portions, and then an insulating portion is formed by curing with It is characterized by that.

[0039] As described above, since the conductive path forming portion is formed by laser processing of the conductive elastomer layer, the conductive path forming portion has the desired good conductivity.

Further, a plurality of conductive path forming portions arranged according to a predetermined pattern are formed, and an insulating material layer made of a material that is cured to become an elastic polymer material is formed between the conductive path forming portions. Since the insulating part is formed by the curing process, there are no conductive particles in the insulating part.

[0040] In addition, it is not necessary to use a mold in which a large number of ferromagnetic parts used to manufacture a conventional anisotropic conductive sheet are arranged.

Therefore, regardless of the arrangement pattern of the electrodes to be inspected on the circuit board to be inspected to be connected, the required electrical connection can be reliably achieved for each of the electrodes. Further, even when the electrodes to be connected are arranged with a small pitch and a high density, the required electrical connection is reliably achieved for each of the electrodes. In addition, the first anisotropic conductive sheet can be manufactured at low cost.

[0041] In the circuit board inspection apparatus of the present invention, the adapter for pitch conversion is integrated,

A state in which conductive particles which are supported on a releasable support plate and exhibit magnetism are oriented in the thickness direction Then, the conductive elastomer layer dispersed in the elastic polymer material is laser processed to form a conductive path forming portion arranged according to a predetermined pattern on the releasable support plate,

The releasable support plate on which the conductive path forming portion is formed is a pin having an uncured insulating portion material layer made of a material that is cured to become an elastic polymer substance on the surface on the connection electrode side. Overlaid on the substrate for the touch conversion,

As a result, each connection electrode on the pitch conversion substrate is brought into contact with the corresponding conductive path forming portion,

In this state, the insulating part material layer is cured to form an insulating part, and then the mold release support plate is removed to obtain the insulating part.

[0042] Thus, since the conductive path forming portion is formed by laser processing one conductive elastomer layer, the conductive path forming portion may have the desired good conductivity.

[0043] Further, since the entire first anisotropic conductive sheet in which each of the conductive path forming portions and the insulating portion are formed in a body is integrally supported by the pitch conversion substrate, it is supported. In addition, the conductive path forming portion force S pitch conversion substrate force does not fall off.

In addition, since the formation process of the conductive path forming portion by laser processing is performed on the releasable support plate, the surface of the pitch conversion substrate is not damaged in forming the anisotropic conductive sheet.

Therefore, the required electrical connection can be reliably achieved for each of the electrodes to be inspected regardless of the arrangement pattern of the electrodes to be inspected of the circuit board to be inspected. In addition, even if the electrodes to be inspected are arranged with a small pitch and a high density, it is possible to reliably achieve the required electrical connection to each of the electrodes to be inspected. In addition, manufacturing costs can be reduced. Furthermore, high durability is obtained.

[0045] Furthermore, since it is not a method of manufacturing an anisotropic conductive sheet by conventional mold molding, The first anisotropic conductive sheet having a small separation distance between the conductive path forming portions that is not affected by the magnetic field action with the mold magnetic pole to be processed, for example, the width of the insulating portion between the conductive path forming portions is 50 m or less is provided. An integrated adapter for pitch conversion in a state integrated with the substrate for pitch conversion is obtained. Therefore, it is possible to inspect a circuit board to be inspected in which the electrodes to be inspected are 50 m or less and the electrodes to be inspected are arranged at a small pitch.

[0046] Further, when performing a four-terminal inspection, two inspection electrodes (for voltage and current) of the pitch conversion substrate are connected to one inspection electrode of the circuit substrate for inspection, Although the separation distance between the inspection electrodes is small, even in such a case, the first anisotropic conductive sheet with a sufficiently small separation distance of the conductive path forming portion is provided, so electrical inspection is surely performed. Can be implemented.

[0047] In the circuit board inspection apparatus of the present invention, the conductive elastomer layer comprises:

A conductive elastomer material layer containing conductive particles exhibiting magnetism in a liquid elastomer material that is cured to become an elastic polymer substance is formed on a releasable support plate, and the conductive elastomer A metal mask made of a metal exhibiting magnetism is formed on the surface of the material layer according to the pattern of the conductive path forming portion to be formed,

By applying a magnetic field in the thickness direction to the conductive elastomer material layer, the conductive particles are oriented in the thickness direction, and then the magnetic field is applied or the magnetic field is stopped. It is obtained by curing the material layer for conductive elastomer.

[0048] In this way, the conductive particles dispersed by applying a magnetic field in the thickness direction to the conductive elastomer material layer using a metal mask made of a metal exhibiting magnetism are obtained as follows. The film is oriented in the thickness direction while concentrated on the mask portion.

As a result, a metal mask in the conductive elastomer material layer is formed, and the density of the conductive particles in that portion is reduced. This facilitates the formation of the conductive path forming portion by laser processing. Furthermore, since a thicker conductive elastomer layer can be easily processed by laser, a thick conductive path forming portion can be obtained with certainty.

[0049] The inspection apparatus according to the present invention using the first anisotropic conductive sheet obtained by such a manufacturing method is suitable for the electrodes regardless of the arrangement pattern of the electrodes to be inspected on the circuit board to be inspected. The required electrical connection can be reliably achieved for each. Further, even when the electrodes to be connected are arranged with a small pitch and a high density, the required electrical connection can be reliably achieved for each of the electrodes.

[0050] In the inspection apparatus of the present invention described above, in at least some of the conductive path forming portions in the first anisotropic conductive sheet, the distance between adjacent conductive path forming portions may be 50 m or less. More preferably, it is 10 to 50 μm.

By doing so, it is possible to inspect a circuit board to be inspected in which the distance to be inspected is 50 m or less and the electrodes to be inspected are arranged at a fine pitch.

[0051] Further, when performing a four-terminal inspection, two inspection electrodes (for voltage and current) of the pitch conversion substrate are connected to one inspection electrode of the circuit substrate for inspection, so that the inspection electrode The distance between them is small, but even in such a case, electrical inspection can be performed reliably.

The circuit board inspection apparatus of the present invention sandwiches both surfaces of the circuit board to be inspected between the two inspection jigs by a pair of the first inspection jig and the second inspection jig. A circuit board inspection device that performs electrical inspection

The first inspection jig and the second inspection jig are respectively

A pitch conversion substrate for converting the electrode pitch between one surface side and the other surface side of the substrate, and a plurality of through holes formed on the substrate, arranged on the circuit board side to be inspected of the pitch conversion substrate. The conductive path forming section includes an insulating section formed of a polymer substance and a conductive path forming section formed of an elastic polymer material containing conductive particles and penetrating the insulating section in the thickness direction. A relay board for relaying the electrical connection between the pitch conversion board and the circuit board to be inspected;

A second anisotropic conductive sheet disposed on the opposite side of the pitch conversion substrate from the relay substrate;

A circuit board-side connector with

A plurality of conductive pins arranged at a predetermined pitch;

A pair of spaced apart first and second insulating plates that support the conductive pins movably in the axial direction; «I-pin unit with

A connector board that electrically connects the tester and the relay pin unit; a third anisotropic conductive sheet disposed on the relay pin unit side of the connector board; and a side opposite to the relay pin unit of the connector board A base plate disposed on a tester 佃 j connector with

The relay pin unit is

A first support pin disposed between the first insulating plate and the intermediate holding plate, and a second support pin disposed between the second insulating plate and the intermediate holding plate, and

The first abutting support position of the first support pin with respect to the intermediate holding plate and the second abutting support position of the second support pin with respect to the intermediate holding plate are in the thickness direction of the intermediate holding plate. It is arranged at different positions on the projected intermediate holding plate projection surface.

[0052] With this configuration, when electrical inspection is performed by sandwiching both surfaces of the circuit board to be inspected between the first inspection jig and the second inspection jig, In the initial stage of pressurization, the relay pin unit is moved in the thickness direction by the conductive pin, and the elastic portion of the relay substrate, the second anisotropic conductive sheet, and the third anisotropic conductive sheet are elastically compressed by rubber. The pressure can be absorbed at, and the height variation of the electrode to be inspected on the circuit board to be inspected can be absorbed to some extent.

[0053] The first abutting support position of the first support pin with respect to the intermediate holding plate and the second abutting support position of the second support pin with respect to the intermediate holding plate are the thickness of the intermediate holding plate. Since the intermediate holding plate projection surface projected in the vertical direction is arranged at different positions, the circuit board to be inspected is further pressurized between the first inspection jig and the second inspection jig. In addition to the elastic elastic compression of the relay board, the second anisotropic conductive sheet, and the third anisotropic conductive sheet, the first insulating plate of the relay pin unit and the second Panel insulation between the first insulating plate and the first insulating plate and the second insulating plate, the variation in height of the electrodes to be inspected on the circuit board to be inspected, for example, the variation in the height of the solder ball electrodes On the other hand, local stress concentration can be avoided by distributing pressure concentration. [0054] Accordingly, stable electrical contact is ensured for each of the electrodes to be inspected of the circuit board to be inspected having a height variation, and further, the stress concentration is reduced. Local damage is suppressed. As a result, since the repeated use durability of the relay board is improved, the number of times of replacement of the relay board is reduced, and the inspection work efficiency is improved.

[0055] Further, in the present invention, the relay substrate is provided in which each of the plurality of through holes formed in the substrate has an elastic portion including the conductive path forming portion and the surrounding insulating portion. The pressing force and impact due to the pressing of the tool are absorbed by this elastic part, and the electrodes on the circuit board to be inspected will not be damaged.

Furthermore, regardless of the arrangement pattern of the electrodes to be inspected on the circuit board to be inspected, the required electrical inspection can be reliably performed on the circuit board to be inspected. Even when the pitch is very small and densely arranged, the required electrical inspection can be reliably performed on the circuit board to be inspected.

[0056] In the circuit board inspection apparatus of the present invention, the relay board includes:

By conducting laser processing on the conductive elastomer layer supported on the first releasable support plate and dispersed in the elastic polymer material in a state where the conductive particles exhibiting magnetism are oriented in the thickness direction, Forming a conductive path forming portion arranged according to a predetermined pattern on the first releasable support plate;

An uncured insulating material layer made of a material that is supported on the second releasable support plate and cured to become an elastic polymer substance is formed on both side surfaces of the substrate and inside the through holes. In addition, the first releasable support plate on which the conductive path forming portion is formed is superimposed on the substrate so that the conductive path forming portion is located in the through hole of the substrate. It is obtained by removing the first and second releasable support plates after forming the insulating part by curing the material layer

As described above, since the conductive path forming portion is formed by laser processing of the conductive elastomer layer, the conductive path forming portion may have the desired good conductivity. Further, a plurality of conductive path forming portions arranged according to a predetermined pattern are formed, and an insulating material layer made of a material that is cured to become an elastic polymer material is formed between the conductive path forming portions. Since the insulating part is formed by the curing process, there are no conductive particles in the insulating part.

[0058] With regard to the force, it is not necessary to use a mold in which a large number of ferromagnetic parts used to manufacture a conventional anisotropic conductive sheet are arranged.

Therefore, regardless of the arrangement pattern of the electrodes to be inspected on the circuit board to be inspected to be connected, the required electrical connection can be reliably achieved for each of the electrodes. Further, even when the electrodes to be connected are arranged with a small pitch and a high density, the required electrical connection is reliably achieved for each of the electrodes. In addition, the relay board can be manufactured at a low cost.

[0059] Further, since the anisotropic conductive sheet is not manufactured by conventional mold molding, the separation distance between the conductive path forming portions that is not affected by the magnetic field action between adjacent mold magnetic poles is small. An insulating part with a width of 50 m or less between the path forming parts is obtained.

Therefore, it is possible to inspect a circuit board to be inspected in which the electrodes to be inspected are 50 m or less and the electrodes to be inspected are arranged at a small pitch.

[0060] Furthermore, when performing a four-terminal inspection, two inspection electrodes (for voltage and current) of the pitch conversion substrate are connected to one inspection electrode of the circuit substrate for inspection, Although the separation distance between the inspection electrodes becomes small, even in such a case, the separation distance of the conductive path forming portion is sufficiently small and the relay board is provided, so that the electrical inspection should be performed reliably. Can do.

In the circuit board inspection apparatus of the present invention, the conductive elastomer layer is

By applying a magnetic field in the thickness direction to the conductive elastomer material layer, the conductive particles are oriented in the thickness direction, and then the magnetic field is applied, or It is obtained by curing the material layer for conductive elastomer with the magnetic field stopped.

[0061] Thus, the conductive particles dispersed by applying a magnetic field in the thickness direction to the material layer for the conductive elastomer using a metal mask made of a metal exhibiting magnetism are obtained as follows. The film is oriented in the thickness direction while concentrated on the mask portion.

As a result, a metal mask in the conductive elastomer material layer is formed, and the density of the conductive particles in that portion is reduced. This facilitates the formation of the conductive path forming portion by laser processing. Further, since laser processing of a thick conductive elastomer layer becomes easy, a thick conductive path forming portion can be obtained with certainty.

[0062] The inspection apparatus of the present invention using the relay substrate obtained by such a manufacturing method is necessary for each of the electrodes regardless of the arrangement pattern of the electrodes to be inspected on the circuit board to be inspected. An electrical connection can be reliably achieved. Further, even if the electrodes to be connected are arranged with a small pitch and a high density, it is possible to reliably achieve the required electrical connection to each of the electrodes.

In the inspection apparatus of the present invention described above, in at least some of the conductive path forming portions of the relay substrate, the separation distance between adjacent conductive path forming portions is preferably 50 m or less, and more preferably 10 to 50. / ζ πι.

In this way, it is possible to inspect a circuit board to be inspected in which the distance to be inspected is 50 m or less and the electrodes to be inspected are arranged at a fine pitch.

In addition, when performing 4-terminal inspection, two inspection electrodes (for voltage and current) on the pitch conversion substrate are connected to one inspection electrode on the circuit substrate to be inspected. Although the distance becomes smaller, even in such a case, it is possible to perform electrical inspections reliably.

[0064] Note that a first anisotropic conductive sheet in which conductive particles are arranged in the thickness direction and uniformly dispersed in the plane direction may be disposed on one side or both sides of the relay substrate. The circuit board inspection apparatus according to the present invention includes:

When the both sides of the circuit board to be inspected are clamped between the two inspection jigs by the pair of the first inspection jig and the second inspection jig, Centering on the first abutting support position of the first support pin with respect to the intermediate holding plate, the intermediate holding plate is sandwiched in the direction of the second insulating plate, and

The intermediate holding plate is sandwiched in the direction of the first insulating plate with the second contact support position of the second support pin with respect to the intermediate holding plate as a center.

With this configuration, the intermediate holding plate is held in opposite directions around the first contact support position and the second contact support position, so that the first inspection is performed. When the circuit board to be inspected is further pressed between the jig and the second inspection jig, the panel elastic force of the intermediate holding plate is further exerted. With respect to the variation in the height of the inspection electrode, the pressure concentration can be dispersed to avoid the local stress concentration, and the local breakage of the anisotropic conductive sheet is suppressed. As a result, the durability of repeated use of the anisotropic conductive sheet is improved, so that the number of replacements of the anisotropic conductive sheet is reduced and the inspection work efficiency is improved.

In the circuit board inspection apparatus of the present invention, the first contact support positions of the first support pins with respect to the intermediate holding plate are arranged in a grid pattern on the intermediate holding plate projection surface,

Second contact support positions of the second support pins with respect to the intermediate holding plate are arranged in a grid pattern on the intermediate holding plate projection surface,

On the intermediate holding plate projection surface, one second abutment support position is arranged in a unit lattice region that also has four adjacent first abutment support position forces, and

In the intermediate holding plate projection surface, one first abutment support position is disposed in a unit lattice region that also has four adjacent second abutment support position forces.

With this configuration, the first contact support position and the second contact support position are arranged in a lattice pattern, and the first contact support position and the second contact support position are arranged. The positions of the grid points are all shifted.

Therefore, the intermediate holding plate is pinched in opposite directions around the first contact support position and the second contact support position, and the first inspection jig and the second inspection jig The panel elastic force of the intermediate holding plate is further exerted when the circuit board to be inspected is pressed between the two, and the height of the electrodes to be inspected on the circuit board to be inspected The pressure concentration can be distributed to further avoid local stress concentrations. Therefore, anisotropic conduction As a result, localized damage of the anisotropic conductive sheet is suppressed, and as a result, the durability of repeated use of the anisotropic conductive sheet is improved, so that the number of times the anisotropic conductive sheet is replaced is reduced and the inspection work efficiency is improved.

[0068] Further, in the circuit board inspection apparatus of the present invention, the relay pin unit includes:

A plurality of intermediate holding plates disposed at a predetermined distance between the first insulating plate and the second insulating plate;

Holding plate support pins arranged between adjacent intermediate holding plates;

With

At least one of the intermediate holding plates is in contact with the intermediate holding plate from one surface side. The holding support position of the holding plate support pin with respect to the intermediate holding plate, and the second contact surface with respect to the intermediate holding plate from the other surface side. The contact support position of the first support pin, the second support pin, or the holding plate support pin with respect to the intermediate holding plate is located on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate. Are arranged at different positions.

[0069] With this configuration, the panel elasticity is further exhibited by the plurality of intermediate holding plates, and the pressure concentration is reduced with respect to the height variation of the electrodes to be inspected on the circuit board to be inspected. Dispersion can further avoid local stress concentration, and local breakage of the anisotropic conductive sheet is suppressed. As a result, the durability of repeated use of the anisotropic conductive sheet is improved, so that the number of replacements of the anisotropic conductive sheet is reduced and the inspection work efficiency is improved.

[0070] Further, in the circuit board inspection apparatus according to the present invention, in all the intermediate holding plates, the holding plate supporting pins that are in contact with the intermediate holding plate by one surface side force are in contact with the intermediate holding plate. A contact support position of the first support pin, the second support pin, or the holding plate support pin that contacts the intermediate holding plate with respect to the intermediate holding plate. It is characterized by being arranged at different positions on the intermediate holding plate projection surface projected in the thickness direction.

[0071] Thereby, since the contact support position of the holding plate support pin with the intermediate holding plate is shifted between the adjacent intermediate holding plates, the panel elasticities of the plurality of intermediate holding plates are elastic. Will be further exerted, resulting in variations in the height of the electrodes to be inspected on the circuit board to be inspected. On the other hand, the pressure concentration can be dispersed to further avoid the local stress concentration, and the local breakage of the anisotropic conductive sheet is suppressed. As a result, the durability of repeated use of the anisotropic conductive sheet is improved, so that the number of replacements of the anisotropic conductive sheet is reduced and the inspection work efficiency is improved.

[0072] Further, in the circuit board inspection apparatus according to the present invention, the second anisotropic conductive sheet includes a plurality of conductive path forming portions extending in a thickness direction, and insulation that insulates the conductive path forming portions from each other. The conductive particles are contained only in the conductive path forming portion, whereby the conductive particles are unevenly dispersed in the surface direction, and the conductive path forming portion protrudes on one side of the sheet. It is characterized by that.

In the circuit board inspection apparatus of the present invention, the third anisotropic conductive sheet includes a plurality of conductive path forming portions extending in a thickness direction, and an insulating portion that insulates the conductive path forming portions from each other. The conductive particles are contained only in the conductive path forming portion, whereby the conductive particles are dispersed unevenly in the surface direction, and the conductive path forming portion protrudes on one side of the sheet. And

[0073] Thus, the second anisotropic conductive sheet and the third anisotropic conductive sheet are composed of the conductive path forming part and the insulating part, and the conductive particles are contained only in the conductive path forming part. By using an unevenly anisotropic anisotropic conductive sheet that is unevenly distributed in the surface direction and the conductive path forming part protrudes on one side of the sheet, the applied pressure and impact due to the pressing of the inspection jig are applied to these sheets. This suppresses the deterioration of the first anisotropic conductive sheet.

[0074] In one aspect of the present invention, the plurality of conductive pins include a bar-shaped central portion that is shorter than the interval between the first insulating plate and the second insulating plate, and both end sides of the central portion. Formed with a diameter larger than the central portion and a pair of end portions,

Each of the pair of end portions passes through a through-hole having a diameter larger than that of the central portion formed in the first insulating plate and the second insulating plate and larger than that of the pair of end portions. Thus, the conductive pin is supported so as to be movable in the axial direction.

[0075] With this configuration, the conductive pin can be held between the first insulating plate and the second insulating plate so as to be movable in the axial direction and without falling off. .

In another aspect of the present invention, the second insulating plate is interposed between the first insulating plate and the intermediate holding plate. A bent holding plate having a through hole through which the conductive pin is inserted is provided between the insulating plate and the intermediate holding plate, or between the intermediate holding plates.

The plurality of conductive pins are laterally pressed in opposite directions from each other around a through hole formed in the first and second insulating plates and a through hole formed in the bent holding plate. It is bent at the position of the through hole of the holding plate, and thereby the conductive pin is supported so as to be movable in the axial direction.

With this configuration, the conductive pin can be held between the first insulating plate and the second insulating plate so as to be movable in the axial direction and not to drop off. Furthermore, since a pin having a simple structure having a cylindrical shape can be used as the conductive pin, the cost of the conductive pin and the member holding it can be reduced.

The circuit board inspection method of the present invention is a circuit board inspection method using the circuit board inspection apparatus described above,

The electrical inspection is performed by sandwiching both surfaces of the circuit board to be inspected between the inspection jigs by the pair of the first inspection jig and the second inspection jig.

The invention's effect

[0077] According to the present invention, even if the circuit board to be inspected has a microelectrode with a fine pitch such that the distance between the electrodes to be inspected is 50 m or less, the circuit board is reliable. It is possible to perform an electrical inspection of a highly functional circuit board.

Further, the followability to the height variation of the inspected electrode of the inspected circuit board to be inspected is good, and there is no conduction failure, and an accurate inspection can be performed.

[0078] Further, since it is not necessary to arrange the conductive pins at regular intervals, it is possible to reduce the cost of the drilling work by drilling the through hole in the insulating plate holding the conductive pin. In addition, when performing repeated continuous inspections on circuit boards to be inspected, the inspection work is also performed when continuously inspecting multiple circuit boards where there is little need to correct the misalignment of the anisotropic conductive sheet. It can be done smoothly.

[0079] In addition, inspection can be performed with high resolution, and a step due to the inspected electrode of the circuit board to be inspected can be absorbed well, and durability for repeated use is also high.

Brief Description of Drawings FIG. 1 is a cross-sectional view showing an embodiment of an inspection apparatus according to the present invention.

2 is a cross-sectional view showing a stacked state when the inspection apparatus of FIG. 1 is used for inspection.

[FIG. 3] FIG. 3 is a diagram showing a surface of a pitch conversion board on the circuit board side.

FIG. 4 is a view showing a pin side surface of a pitch conversion substrate.

FIG. 5 is a cross-sectional view of the first anisotropic conductive sheet.

FIG. 6 is a cross-sectional view showing an integrated adapter for pitch conversion.

FIG. 7 is a cross-sectional view showing a state in which a conductive elastomer material layer is formed on a releasable support plate.

FIG. 8 is an enlarged cross-sectional view of a conductive elastomer material layer.

FIG. 9 is a cross-sectional view showing a state after a magnetic field is applied to the conductive elastomer material layer in the thickness direction.

FIG. 10 is a cross-sectional view showing a state where a conductive elastomer layer is formed on a releasable support plate.

FIG. 11 is a cross-sectional view showing a state in which a thin metal layer is formed on one conductive elastomer layer.

FIG. 12 is a cross-sectional view showing a state in which a resist layer having an opening is formed on a thin metal layer.

FIG. 13 is a cross-sectional view showing a state in which a metal mask is formed in the opening of the resist layer.

FIG. 14 is a cross-sectional view showing a state in which a plurality of conductive path forming portions are formed according to a specific pattern on a releasable support plate.

FIG. 15 is a cross-sectional view showing a process of forming a conductive path forming portion by laser processing.

FIG. 16 is a top view showing a process of forming a conductive path forming portion by laser processing.

FIG. 17 is a cross-sectional view showing a laminate in which a resist layer in which openings are formed in a thin metal layer is laminated. FIG. 18 is a cross-sectional view of a composite film in which a metal mask is formed in the opening of the resist layer in FIG.

FIG. 19 is a cross-sectional view showing a state in which a conductive elastomer material layer is formed on a releasable support plate.

FIG. 20 is a cross-sectional view showing a state in which a composite film is superimposed on a conductive elastomer material layer.

FIG. 21 is a cross-sectional view showing a state after a magnetic field is applied in the thickness direction to the laminate shown in FIG.

FIG. 22 is a cross-sectional view showing a state where a conductive elastomer layer is formed on a releasable support plate.

FIG. 23 is a cross-sectional view showing a state after the thin metal layer in FIG. 22 is removed.

FIG. 24 is a cross-sectional view showing a state in which a plurality of conductive path forming portions are formed according to a specific pattern on the releasable support plate.

FIG. 25 is a cross-sectional view of a pitch conversion substrate.

[26] FIG. 26 is a cross-sectional view showing a state in which an insulating material layer is formed on the surface of the pitch conversion substrate.

FIG. 27 is a cross-sectional view showing a state in which a releasable support plate on which a conductive path forming portion is formed is superimposed on a pitch conversion substrate on which an insulating material layer is formed. is there.

FIG. 28 is a cross-sectional view showing a state in which an insulating portion is formed between adjacent conductive path forming portions.

FIG. 29 is a cross-sectional view showing an integrated adapter for pitch conversion.

FIG. 30 is a cross-sectional view showing another example of an integrated pitch conversion adapter.

FIG. 31 is an enlarged sectional view of the pitch conversion adapter integrated in FIG.

FIG. 32 is a cross-sectional view showing a pitch conversion board constituting the pitch conversion adapter integrated body of FIG. 30.

FIG. 33 is a cross-sectional view of a second anisotropic conductive sheet.

FIG. 34 is a cross-sectional view of the relay pin unit.

[FIG. 35] FIG. 35 shows a part of the conductive pin, intermediate holding plate and insulating plate of the relay pin unit. FIG.

FIG. 36 is a cross-sectional view similar to FIG. 35, showing another example of the relay pin unit.

FIG. 37 is a cross-sectional view showing a process until a conductive pin is arranged between the first insulating plate and the second insulating plate in the configuration of FIG. 36.

FIG. 38 is a cross-sectional view of a relay pin unit in which a bent holding plate is arranged.

FIG. 39 is a partially enlarged view of the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate of the relay pin unit.

FIG. 40 is a partial cross-sectional view showing an embodiment of an inspection apparatus of the present invention.

FIG. 41 is a cross-sectional view illustrating the usage state of the inspection apparatus of the present invention.

FIG. 42 is a cross-sectional view illustrating a usage state of the relay pin unit in the inspection apparatus of the present invention.

FIG. 43 is a cross-sectional view illustrating the usage state of the inspection apparatus of the present invention.

FIG. 44 is a partial cross-sectional view similar to FIG. 40, showing another embodiment of the inspection apparatus of the present invention.

FIG. 45 is a cross-sectional view of the relay pin unit in the embodiment of FIG. 44.

FIG. 46 is a cross-sectional view showing an embodiment of the inspection apparatus of the present invention.

FIG. 47 is a cross-sectional view showing a stacked state when the inspection apparatus of FIG. 46 is used for inspection.

FIG. 48 is a cross-sectional view showing a state in which a pitch conversion board, a relay board, and a circuit board to be inspected are stacked.

FIG. 49 (a) is a partial sectional view of a relay board, FIG. 49 (b) is an enlarged view thereof, and FIG. 49 (c) is a partial top view of the relay board.

FIG. 50 is a cross-sectional view illustrating a manufacturing step of the relay board.

FIG. 51 is a cross-sectional view illustrating a manufacturing step for a relay board.

FIG. 52 is a partial cross-sectional view showing a state in which a pitch conversion substrate, a relay substrate, and a circuit board to be inspected are stacked via a first anisotropic conductive sheet.

FIG. 53 is a partial cross-sectional view of the first anisotropic conductive sheet. FIG. 54 is a partial cross-sectional view showing an embodiment of the inspection apparatus of the present invention.

FIG. 55 is a cross-sectional view illustrating the usage state of the inspection apparatus of the present invention.

FIG. 56 is a cross-sectional view for explaining the usage state of the relay pin unit in the inspection apparatus of the present invention.

FIG. 57 is a cross-sectional view illustrating the usage state of the inspection apparatus of the present invention.

FIG. 58 is a partial cross-sectional view similar to FIG. 54, showing another embodiment of the inspection apparatus of the present invention.

FIG. 59 is a cross-sectional view of the relay pin unit in the embodiment of FIG. 58.

FIG. 60 is a diagram showing an evaluation test method for insulation resistance between paired connection electrodes in the pitch conversion adapter.

FIG. 61 is a diagram showing an insulation resistance evaluation test method in a comparative example.

FIG. 62 is a cross-sectional view of a conventional circuit board inspection apparatus.

FIG. 63 is a diagram showing the relationship between the pitch of the electrodes to be inspected on the circuit board to be inspected and the electrode separation distance.

FIG. 64 is a diagram showing the relationship between the pitch of the electrodes to be inspected on the circuit board to be inspected, the electrode separation distance, and the connection electrodes on the pitch conversion board.

[FIG. 65] FIG. 65 is a diagram showing the relationship between the pitch of the electrodes to be inspected of the circuit board to be inspected, the electrode separation distance, and the connection electrodes of the substrate for pitch conversion in the case of four-terminal inspection. Explanation of symbols

1 Circuit board to be inspected

2 Inspected electrode

3 Inspected electrode

11a First inspection jig

l ib Second inspection jig

21a, 21b Circuit board connector

22a, 22b First anisotropic conductive sheet

23a, 23b Pitch conversion board

24a, 24b terminal electrode a, 25b Connecting electrode

a, 26b Second anisotropic conductive sheet a, 27b Current supply electrode a, 28b Voltage measurement electrode a, 29b Relay board

a, 31b Relay pin unit a, 32b Conductive pin

a, 33b First support pin a, 34b First insulating plate

a, 35b Second insulation plate

a, 36b Intermediate holding plate

a, 37b Second support pin

A First abutment support position

B Second contact support position

Holding plate support pin

A Contact support position

a, 41b Tester side connector a, 42b Third anisotropic conductive sheet a, 43b Connector board

a, 44b Tester side electrode a, 45b Pin side electrode

a, 46b Base plate

a, 49b Support pin

Insulating substrate

Wiring

Internal wiring

Insulation layer

Insulation layer Pitch conversion adapter integrated conductive path forming part

a Protrusion

A Material layer for conductive elastomer B Conductive elastomer layer Insulation part

A Insulation material layer

Sheet base material

Metal film

Releasable support plate

Thin metal layer

Resist layer

a opening

Metal mask

Composite film

Conductive path forming part

a Protrusion

Insulation

Substrate

Through hole

Glass epoxy substrate Dispersed anisotropic conductive sheet a, 81b Edge

Center

, 83a, 83b Through hole

Bent holding plate

Through hole

Through hole 101 Circuit board under test

102 Inspected electrode

103 Inspected electrode

11 1a First inspection jig

111b Second inspection jig

121a ゝ 121b Circuit board side connector

122a, 122b First anisotropic conductive film

123a, 123b Pitch conversion board

124a, 124b terminal electrode

125a, 125b connection electrode

126a, 126b Second anisotropic conductive film

127a, 127b Electrode for current supply

128a, 128b Voltage measurement electrode

131a, 131b Relay pin unit

132a, 132b Conductive pin

133a, 133b Support pin

134a, 134b Insulation plate

141a, 141b Tester side connector

142a, 142b 3rd anisotropic conductive film

143a, 143b Connector, Kuta board

144a, 144b Tester side electrode

145a, 145b Pin side electrode

146a, 146b Base plate

A Intermediate holding plate projection surface

P conductive particles

L1 distance

L2 distance

Q1 diagonal Q2 Diagonal

Rl unit cell region

R2 unit cell region

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, a pair of identical components in the first inspection jig and the second inspection jig (for example, the circuit board connector 21a and the circuit board connector 21b, the first anisotropic conductivity) When the sheet 22a and the first anisotropic conductive sheet 22b are collectively referred to, the symbols “a” and “b” may be omitted (for example, the first anisotropic conductive sheet 22a and the first anisotropic conductive sheet 22a). The first anisotropic conductive sheet 22b may be collectively referred to as “first anisotropic conductive sheet 22”).

FIG. 1 is a cross-sectional view showing an embodiment of the inspection apparatus of the present invention, and FIG. 2 is a cross-sectional view showing a stacked state when the inspection apparatus of FIG. 1 is used for inspection.

This inspection apparatus measures the electrical resistance of a circuit board to be inspected by measuring the electrical resistance between electrodes to be inspected on a circuit board 1 to be inspected 1 such as a printed circuit board for mounting an integrated circuit. The inspection is to be performed.

Then, in this inspection apparatus, as shown in FIGS. 1 and 2, the first inspection jig 11a disposed on the upper surface side of the circuit board 1 to be inspected and the lower surface side are disposed. The second inspection jig l ib and force are arranged so as to face each other vertically.

The first inspection jig 11a includes a circuit board side connector 21a including anisotropic conductive sheets 22a and 26a on both sides thereof, and a relay pin unit 31a. The first inspection jig 11a includes a tester side connector 41a including a connector base plate 43a in which the third anisotropic conductive sheet 42a is disposed on the relay pin unit 3la side and a base plate 46a. Prepare and speak.

[0085] The second inspection jig l ib is also configured in the same manner as the first inspection jig 11a, and includes a circuit board side connector 21b having anisotropic conductive sheets 22b and 26b on both sides thereof, and a relay pin. Unit 31b is provided. Further, the second inspection jig l ib includes a tester side connector 41b including a connector board 43b on which an anisotropic conductive sheet 42b is arranged on the relay pin unit 3 lb side and a base plate 46b. Yes.

[0086] On the upper surface of the circuit board 1 to be inspected, an electrode 2 to be inspected is formed, and the lower surface thereof is also inspected. The electrode 3 is formed so as to be electrically connected to each other.

The circuit board side connectors 21a and 21b have pitch conversion boards 23a and 23b, and first anisotropic conductive sheets 22a and 22b and second anisotropic conductive sheets 26a and 26b arranged on both sides thereof. ing.

[0087] FIG. 3 is a diagram showing the surface of the pitch conversion board on the circuit board side to be inspected, FIG. 4 is a diagram showing the surface on the relay pin unit side, and FIG. FIG. 5 is a cross-sectional view showing a pitch conversion adapter integrated with a first anisotropic conductive sheet.

On one surface of the pitch conversion board 23, that is, the circuit board 1 side to be inspected, a plurality of connections electrically connected to the electrodes 2 and 3 of the circuit board 1 to be inspected as shown in FIG. A working electrode 25 is formed. These connection electrodes 25 are arranged so as to correspond to the patterns of the electrodes 2 and 3 to be inspected on the circuit board 1 to be inspected.

On the other hand, on the other surface of the pitch conversion board 23, that is, on the side opposite to the circuit board 1 to be inspected, as shown in FIG. 4, the conductive pins 32a and 32b of the relay pin unit 31 are electrically connected. A plurality of terminal electrodes 24 to be connected are formed. These terminal electrodes 24 are, for example, 2.5 4 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.4 mm, 0.3 mm or 0.2 mm. The pitch is the same as the pitch of the conductive pins 32a and 32b of the relay pin unit.

[0089] Each connection electrode 25 in FIG. 3 is electrically connected to the corresponding terminal electrode 24 in FIG. 4 by an internal wiring 53 (see FIG. 6) that penetrates the wiring 52 and the insulating substrate 51 in the thickness direction. Has been.

For example, as shown in FIG. 6, the insulating portion on the surface of the pitch conversion substrate 23 is composed of an insulating layer 54 formed on the surface of the insulating substrate 51 so that the connection electrodes 25 are exposed. The thickness of the insulating layer 54 is preferably 5 to: L00 μm, more preferably 10 to 60 m. If this thickness is too small, it may be difficult to form an insulating layer having a small surface roughness. On the other hand, if the thickness is excessive, it may be difficult to electrically connect the connection electrode 25 and the first anisotropic conductive sheet 22.

[0090] As a material for forming the insulating substrate 51 of the pitch conversion substrate, a material generally used as a base material of a printed circuit board can be used. Specifically, for example, polyimide And glass fiber reinforced polyimide resin, glass fiber reinforced epoxy resin, and glass fiber reinforced bismaleimide triazine resin.

As a material for forming the insulating layers 54 and 55 in FIG. 6, a polymer material that can be formed into a thin film can be used. Specific examples thereof include an epoxy resin, an acrylic resin, a phenol resin, a polyimide resin, a polyamide resin, a mixture thereof, and a resist material.

[0091] The pitch conversion substrate 23 can be manufactured, for example, as follows. First, a laminated material in which a thin metal layer is laminated on both sides of a flat insulating substrate is prepared, and a composite material penetrating in the thickness direction of the laminated material corresponding to the pattern of the terminal electrode to be formed is prepared for this laminated material. A number of through-holes are formed by a numerically controlled drilling device, a photo etching process, a laser processing process, or the like.

[0092] Next, by applying electroless plating and electrolytic plating in the through holes formed in the laminated material, a no hole connected to the thin metal layers on both sides of the substrate is formed. Thereafter, the metal thin layer is subjected to a photo-etching process to form wiring patterns and connection electrodes on the surface of the insulating substrate, and terminal electrodes on the opposite surface. Then, as shown in FIG. 6, an insulating layer 54 is formed on the surface of the insulating substrate 51 so that each connection electrode 25 is exposed, and each terminal electrode 24 is exposed on the opposite surface. Thus, the pitch conversion substrate 23 is obtained by forming the insulating layer 55. o The thickness of the insulating layer 55 is preferably 5 to: LOO m, more preferably 10 to 60 m.

As shown in FIG. 6, the pitch converting substrate 23 is integrated with the first anisotropic conductive sheet 22. The first anisotropic conductive sheet 22 and the pitch conversion board 23 constitute a pitch conversion adapter integrated 60.

As shown in FIG. 5, the first anisotropic conductive sheet 22 integrated with the pitch conversion circuit board 23 has a large number of conductive particles P in the thickness direction in an insulating elastic polymer material. Conductive path forming portions 61 formed in an array, insulating portions 62 separating the respective conductive path forming portions 61, and force are also configured.

[0094] The conductive particles P are contained only in the conductive path forming portion 61, and thus, non-uniform in the surface direction. Are distributed.

The pattern of the conductive path forming portion 61 corresponds to the pattern of the electrode to be inspected on the circuit board to be inspected which is an electrode to be connected.

In the conductive path forming part 61, the conductive elastic particles P are contained in the insulating elastic polymer substance so as to be aligned in the thickness direction. In contrast, the insulating portion 62 does not contain any conductive particles P and is made of an elastic polymer material. The elastic polymer material constituting the conductive path forming portion 61 and the elastic polymer material constituting the insulating portion 62 may be of different types or the same type.

[0095] As shown in FIG. 5, on the surface of the first anisotropic conductive sheet 22 on the side in contact with the circuit board to be inspected, a protruding portion 61a in which the conductive path forming portion 61 protrudes also from the surface force of the insulating portion 62. Is formed.

By providing the protrusion 61a in this way, the degree of compression by the pressurization in the conductive path forming part 61 is larger than that of the insulating part 62, so that the resistance value is sufficiently low and the conductive path is ensured. Formed in 61. Thereby, the change in resistance value can be reduced with respect to the change in applied pressure. As a result, even if the applied pressure applied to the first anisotropic conductive sheet 22 is not uniform, it is possible to prevent variation in conductivity between the respective conductive path forming portions 61.

[0096] As the elastic polymer substance constituting the conductive path forming part 61 and the insulating part 62, a polymer substance having a crosslinked structure is preferable. Specific examples of the curable polymer material-forming material that can be used to obtain such an elastic polymer material include polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, acrylonitrile-butene. Conjugated gen rubbers such as gen copolymer rubber and hydrogenated products thereof, block copolymer rubbers such as styrene butadiene gen block copolymer rubber, styrene isoprene block copolymer, and hydrogenated products thereof. Examples include mouth-prene, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, and ethylene propylene copolymer rubber.

[0097] When the first anisotropic conductive sheet 22 is required to have weather resistance, it is preferable to use a material other than the conjugated-gen rubber, particularly from the viewpoint of moldability and electrical properties. It is preferable to use rubber. The silicone rubber is preferably one obtained by crosslinking or condensing liquid silicone rubber. The liquid silicone rubber has a viscosity of 10 ⁵ poise or less at a strain rate of 10 ^_1 sec, either a condensation type, an addition type, or a butyl group or a hydroxyl group-containing one. May be. Specifically, for example, dimethyl silicone raw rubber, methyl beer silicone raw rubber, methyl ferrule silicone raw rubber and the like can be mentioned.

[0098] In addition, the silicone rubber has a molecular weight Mw (referred to as a standard polystyrene conversion weight average molecular weight) force of 0000 to 40,000. From the viewpoint of heat resistance, the molecular weight distribution index (the ratio of the standard polystyrene-converted weight average molecular weight Mw to the standard polystyrene-converted number average molecular weight Mn) is preferably 2 or less.

As the conductive particles P contained in the conductive path forming part 61, conductive particles exhibiting magnetism are used because the conductive particles can be easily aligned in the thickness direction by a method described later.

[0099] Specific examples of such conductive particles include particles of a metal having magnetism such as iron, cobalt and nickel, particles of these alloys, particles containing these metals, or these particles. Core particles with a surface of the core particles coated with a metal with good conductivity such as gold, silver, noradium or rhodium, or non-magnetic metal particles or inorganic particles or polymers such as glass beads For example, the core particle may be a core particle, and the surface of the core particle may be coated with a conductive magnetic metal such as nickel or cobalt.

[0100] Among these, it is preferable to use a nickel particle as a core particle and a surface thereof provided with gold metal having good conductivity.

Examples of the method for coating the surface of the core particle with the conductive metal include mechanical plating and electrolytic plating.

When using a conductive particle coated with a conductive metal on the surface of the core particle, the conductive metal coverage on the particle surface (the conductive metal relative to the surface area of the core particle) is obtained because good conductivity is obtained. The ratio of the coating area is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.

[0101] The coating amount of the conductive metal is more preferably 0.5 to 50% by mass of the core particles. 2 to 30% by mass, more preferably 3 to 25% by mass, and particularly preferably 4 to 20% by mass. When the conductive metal to be coated is gold, the coating amount is preferably 0.5 to 30% by mass of the core particles, more preferably 2 to 20% by mass, and still more preferably 3 to 15% by mass.

[0102] The particle size of the conductive particles is preferably 1-100 μm, more preferably 2-50.

μm, more preferably 3 to 30 μm, particularly preferably 4 to 20 μm.

The particle size distribution (DwZDn) of the conductive particles P is preferably 1 to 10, more preferably 1.01 to 7, more preferably 1.05 to 5, particularly preferably 1.1 to 4.

[0103] By using conductive particles satisfying such conditions, the obtained conductive path forming part 61 can be easily deformed under pressure, and in the conductive path forming part 61, between the conductive particles. Sufficient electrical contact is obtained.

The shape of the conductive particles is not particularly limited, but spherical particles, star-shaped particles, or secondary particles in which these particles are aggregated can be easily dispersed in the polymer material-forming material. Is preferred to be.

[0104] As the conductive particles, particles whose surfaces are treated with a coupling agent such as a silane coupling agent or a lubricant can be appropriately used. By treating the particle surface with a coupling agent or a lubricant, the durability of the anisotropic conductive sheet is improved.

Such conductive particles are contained in the conductive path forming portion in a proportion of preferably 15 to 45%, more preferably 20 to 40% in terms of volume fraction. If this ratio is too small, the conductive path forming part 61 having a sufficiently small electric resistance value may not be obtained. On the other hand, when this ratio is excessive, the obtained conductive path forming part 61 becomes fragile, and the necessary elasticity as the conductive path forming part 61 may not be obtained immediately.

[0105] The thickness of the conductive path forming rod 61 is ί, preferably ί 20-250 μm, and more preferably ί 30-200 μm. When this thickness is too small, the absorption capability with respect to the pressurization of the thickness direction becomes low. On the other hand, when the thickness is excessive, good conductivity may not be obtained.

The protrusion height of the protrusion 61a in the conductive path forming portion 61 is preferably 5 to 70% of the thickness of the conductive path forming portion 61, more preferably 10 to 60%.

[0106] In the following, a pipe in which the first anisotropic conductive sheet 22 is integrated on the pitch conversion substrate 23 side will be described. An example of a method for manufacturing the H conversion adapter integrated 60 will be described. First, the conductive path forming portion 61 in the first anisotropic conductive sheet 22 is formed.

1. Formation of conductive elastomer layer

First, a conductive elastomer material is prepared in which conductive particles exhibiting magnetism are dispersed in a liquid elastomer material that is cured to become an elastic polymer substance. Then, as shown in FIG. 7, a conductive elastomer material layer 61A is formed by applying a conductive elastomer material on a releasable support plate 65 for forming a conductive path forming portion. . Here, in the conductive elastomer material layer 61A, as shown in FIG. 8, the conductive particles P exhibiting magnetism are contained in a randomly dispersed state.

Next, by applying a magnetic field to the conductive elastomer material layer 61A in the thickness direction, the conductive elastomer material layer 61A was dispersed in the conductive elastomer material layer 61A as shown in FIG. The conductive particles P are aligned in the thickness direction of the conductive elastomer material layer 61A.

Then, while continuing the action of the magnetic field on the conductive elastomer material layer 61A, or after stopping the action of the magnetic field, the conductive elastomer material layer 61A is cured to obtain the structure shown in FIG. As shown, a conductive elastomer layer 61B containing conductive particles P in an elastic polymer material oriented in the thickness direction is formed in a state where it is supported on a releasable support plate 65. Is done.

[0108] As a material constituting the releasable support plate 65, metals, ceramics, resin, and composite materials thereof can be used.

As a method of applying the conductive elastomer material, a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.

The thickness of the conductive elastomer material layer 61A is set in accordance with the thickness of the conductive path forming portion to be formed.

[0109] As a means for applying a magnetic field to the conductive elastomer material layer 61A, an electromagnet, a permanent magnet, or the like can be used.

The strength of the magnetic field applied to the conductive elastomer material layer 61A is preferably 0.2 to 2.5 Tesla. The curing process of the conductive elastomer material layer 61A is usually performed by a heating process. The specific heating temperature and heating time are appropriately set in consideration of the type of the elastomer material constituting the conductive elastomer material layer 61A, the time required for the movement of the conductive particles, and the like.

[0110] From the conductive elastomer layer 61B, a plurality of conductive path forming portions 61 are formed according to a pattern corresponding to the connection electrode 25 of the pitch conversion substrate 23 as follows. (Fig. 1 1 to 14)

2.Formation of conductive path forming part 61

As shown in FIG. 11, a thin metal layer 66 for a plating electrode is formed on the surface of the conductive elastomer layer 61B supported on the releasable support plate 65.

Next, as shown in FIG. 12, a predetermined pattern corresponding to the pattern of the conductive path forming portion to be formed, that is, the pattern of the electrode to be connected, is formed on this thin metal layer 66 by a photolithography method. According to the pattern, a resist layer 67 having a plurality of openings 67a is formed.

Thereafter, as shown in FIG. 13, FIG. 15 (a) and FIG. 16 (a), the metal thin layer 66 is used as a plating electrode, and electrolytic plating treatment is performed on the portion of the metal thin layer 66 exposed from the opening 67a of the resist layer 67. As a result, a metal mask 68 is formed in the opening 67a of the resist layer 67.

Next, as shown in FIGS. 15 (b) and 16 (b), the conductive elastomer layer 61B, the thin metal layer 66, and the resist layer 67 are subjected to laser processing. The resist layer 67 around the metal mask 68, the thin metal layer 66, and the conductive elastomer layer 61B are removed. As a result, a plurality of conductive path forming portions 61 arranged according to a predetermined pattern are formed in a state of being supported on the releasable support plate 65.

[0113] After that, by removing and removing the conductive elastomer layer 61B other than the conductive path forming portion 61, as shown in FIGS. 14, 15 (c) and 16 (c), the releasable support plate Only the conductive path forming part 61 is left on the 65. Then, the metal thin layer 66 and the metal mask 68 which also have the surface force of the conductive path forming part 61 are peeled off.

As a result, a plurality of conductive path forming portions 61 arranged according to a predetermined pattern are formed in a state of being supported on the releasable support plate 65. [0114] As a method of forming the thin metal layer 66 on the surface of the conductive elastomer layer 61B, an electroless plating method, a snotter method, or the like can be used.

As a material constituting the metal thin layer 66, copper, gold, aluminum, rhodium, or the like can be used.

The thickness of the thin metal layer 66 is preferably 0.05 to 2 m, more preferably 0.1 to 1 / z m. If this thickness is too small, a uniform thin layer may not be formed, which may be inappropriate as a plating electrode. On the other hand, if this thickness is excessive, it may be difficult to remove by laser processing.

[0115] The thickness of the resist layer 67 is set according to the thickness of the metal mask 68 to be formed.

As a material constituting the metal mask 68, copper, iron, aluminum, gold, rhodium or the like can be used.

The thickness of the metal mask 68 is preferably 2 μm or more, more preferably 5 to 20 μm. If this thickness is too small, it may be unsuitable as a mask for the laser.

[0116] The laser processing is preferably performed using a carbon dioxide laser or an ultraviolet laser, so that the conductive path forming portion 61 having a desired form can be reliably formed.

In addition to the method described above, the conductive path forming part 61 in the first anisotropic conductive sheet 22 can be formed by the following method.

1. Formation of composite film

As shown in FIG. 17, on the thin metal layer 66 for the plating electrode, according to a predetermined pattern corresponding to the pattern of the conductive path forming portion to be formed, that is, the pattern of the electrode to be connected, by a photolithography technique. A resist layer 67 having a plurality of openings 67a is formed.

Then, as shown in FIG. 18, by using the thin metal layer 66 as a plating electrode, an electrolytic plating treatment is performed on the exposed portion of the resist layer 67 in the thin metal layer 66 from the opening 67a. A metal mask 68 is formed in the opening 67 a of the layer 67. As a result, a composite film 69 is obtained.

Here, as the thin metal layer 66, a metal foil, a metal plate, or the like can be used. Also 榭 A metal foil integrated with an oil film, a thin metal layer formed on a resin film by an electroless plating method, a sputtering method, or the like can be used.

[0118] As a material of the metal thin layer 66, copper, gold, aluminum, rhodium, or the like can be used.

The thickness of the resist layer 67 is set according to the thickness of the metal mask 68 to be formed.

As a material constituting the metal mask 68, a metal exhibiting magnetism is used. Specific examples thereof include nickel, conolate, and alloys thereof.

2. Formation of one layer of conductive elastomer

First, a conductive elastomer material is prepared in which conductive particles exhibiting magnetism are dispersed in a liquid elastomer material that is cured to become an elastic polymer substance. Then, as shown in FIG. 19, the conductive elastomer material layer 61A is formed by applying a conductive elastomer material on the releasable support plate 65 for forming the conductive path forming portion. Form. Here, the conductive elastomer material layer 61A contains the conductive particles P exhibiting magnetism in a randomly dispersed state.

[0120] Next, the composite film 69 is laminated so that the surface on which the metal thin layer 66 is not formed is in contact with the conductive elastomer material layer 61A.

Thereafter, by applying a magnetic field in the thickness direction to the conductive elastomer material layer 61A, the dispersed conductive particles P are made of a metal exhibiting magnetism, as shown in FIG. The metal mask 68 is concentrated so that it is aligned in the thickness direction. Due to the action of the metal mask 68, which also has a metal force that exhibits magnetism, the strength of the magnetic field in the region of the metal mask 68 increases, so that the conductive particles P are concentrated on the portion of the metal mask 68. An orientation is made. As a result, in the conductive elastomer material layer 61A, the density of the conductive particles P in the portion of the metal mask 68 increases, and the density of the conductive particles in the portion V, where the metal mask 68 is not formed, decreases.

[0121] Then, by continuing the action of the magnetic field on the conductive elastomer material layer 61A or after stopping the magnetic field action, the conductive elastomer material layer 61A is hardened. As shown in FIG. 22, a conductive elastomer layer 61B contained in an elastic polymer substance in a state in which conductive particles P are aligned in the thickness direction was supported on a releasable support plate 65. Formed in a state.

[0122] Material constituting releasable support plate 65, method of applying material for conductive elastomer, thickness of material layer 61A for conductive elastomer, magnetic field applied to material layer 61A for conductive elastomer The conditions at the time are as described in the method for forming the conductive path forming portion.

Thereafter, as shown in FIG. 23, the thin metal layer 66 integrally formed on the surface of the conductive elastomer layer 61B is removed. The thin metal layer 66 can be removed by etching, mechanical peeling, mechanical polishing, or the like.

2.Formation of conductive path forming part 61

From the conductive elastomer layer 61B, a plurality of conductive path forming portions 61 are formed according to a pattern corresponding to the connection electrode 25 of the pitch conversion substrate 23 in accordance with the method described above. That is, by performing laser processing on the conductive elastomer layer 61B and the resist layer 67, the resist layer 67 and the conductive elastomer layer 61B around the metal mask 68 are removed. As a result, a plurality of conductive path forming portions 61 arranged according to a predetermined pattern are formed in a state of being supported on the releasable support plate 65.

[0123] Thereafter, the conductive elastomer layer 61B other than the conductive path forming portion 61 is peeled off to leave only the conductive path forming portion 61 on the releasable support plate 65, as shown in FIG. Then, the remaining metal mask 68 is peeled off from the surface of the conductive path forming portion 61.

The laser processing is preferably performed using a carbon dioxide laser or an ultraviolet laser, so that the conductive path forming part 61 having a desired form can be reliably formed.

[0124] A plurality of conductive path forming portions formed on the releasable support plate 65 obtained as described above. 61 is used to obtain the integrated adapter 60 for pitch conversion through the following steps. First, a liquid elastomer material that is cured to become an insulating elastic polymer material is applied to the surface of the pitch conversion substrate 23 shown in FIG. 25, thereby uncured as shown in FIG. The insulating part material layer 62A in the state is formed.

Next, as shown in FIG. 27, the releasable support plate 65 on which the plurality of conductive path forming portions 61 are formed is overlaid on the pitch conversion substrate 23 on which the insulating portion material layer 62A is formed. In addition, each of the connection electrodes 25 of the pitch conversion substrate 23 and the corresponding conductive path forming portion 61 are brought into contact with each other. As a result, the insulating material layer 62A is formed between the adjacent conductive path forming portions 61.

[0126] Thereafter, in this state or in a state where the releasable support plate 65 is pressed and the conductive path forming portion 61 is elastically compressed, the insulating material layer 62A is cured to perform the process. As shown in FIG. 28, between the adjacent conductive path forming portions 61, an insulating portion 62 that insulates them from each other is formed integrally with the conductive path forming portion 61 and the pitch conversion substrate 23.

Then, the first anisotropic conductive sheet 22 is formed in a body-like manner on the surface of the pitch conversion substrate 23 by releasing from the releasable support plate 65. The configuration shown in FIG. The integrated adapter for pitch conversion 60 is obtained.

Note that, as shown in FIG. 29 (b), a metal film 64 may be formed at the tip of the conductive path forming portion 61. Such a metal film can be formed by various known methods such as a metal plating method, a vapor deposition method using a sputtering method, and a method in which a metal plate is attached to the tip of the conductive path forming unit 61 with an adhesive.

As a method of applying the elastomer material, a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.

[0128] The thickness of the insulating part material layer 62A is set according to the thickness of the insulating part 62 to be formed. The curing process of the insulating part material layer 62A is usually performed by heat treatment. The specific heating temperature and heating time are appropriately set in consideration of the type of the elastomer material constituting the insulating part material layer 62A.

According to the pitch conversion adapter integrated 60 manufacturing method described above, the conductive particles P The conductive path forming portion 61 having a desired shape is formed by performing laser processing on the conductive elastomer layer 61A dispersed in an aligned state in the thickness direction and removing a part thereof.

Accordingly, it is possible to reliably obtain the first anisotropic conductive sheet 22 filled with a required amount of the conductive particles P and having the conductive path forming portion 61 having the desired conductivity.

In addition, using a metal mask that exhibits magnetism, the material layer for conductive elastomer 61

By applying the magnetic field orientation method to A, the density of the conductive particles in the portion where the metal mask is not formed is reduced. This facilitates the formation of the conductive path forming portion by laser processing. Further, since the laser processing of the thick conductive elastomer layer 61B becomes easy, the conductive path forming portion 61 having a large thickness can be obtained with certainty.

[0130] Further, a plurality of conductive path forming portions 61 arranged on the releasable support plate 65 are formed according to a predetermined pattern corresponding to the connection electrodes 25 of the pitch conversion substrate 23, and these conductive path forming portions are formed. An insulating part 62 is formed by forming an uncured elastomer material layer 62A between 61 and performing a curing process.

As a result, the first anisotropic conductive sheet 22 formed with the insulating part 62 in which the conductive particles P are not present can be obtained with certainty.

[0131] In addition, an expensive mold in which a large number of ferromagnetic parts are arranged, which has been used for manufacturing a conventional anisotropic conductive sheet, is unnecessary.

In addition, each of the conductive path forming portions 61 and the insulating portion 62 are integrally formed and are supported by the pitch conversion substrate 23, so that the conductive path formation portion 61 is removed from the pitch conversion substrate 23. There is nothing to do.

[0132] In addition, since the formation process of the conductive path forming portion 61 by laser processing is performed on the releasable support plate 65, the pitch conversion substrate is formed when the first anisotropic conductive sheet 22 is formed. No damage to the 23 surface.

Therefore, according to the integrated adapter 60 for pitch conversion obtained by such a method, a required electrical circuit is provided for each of the electrodes to be inspected regardless of the arrangement pattern of the inspection electrodes of the circuit board to be inspected. Connection can be reliably achieved.

[0133] Further, even when the electrodes to be inspected are arranged with a small pitch and a high density, The required electrical connection can be reliably achieved for each of the electrodes to be inspected. However, the manufacturing cost can be reduced, and higher durability can be obtained.

FIG. 30 is a cross-sectional view showing another configuration of the pitch conversion adapter, FIG. 31 is an enlarged cross-sectional view thereof, and FIG. 32 is a cross-sectional view showing the pitch conversion substrate.

[0134] This pitch conversion adapter integrated 60 is used for, for example, a circuit device such as a printed circuit board to perform an electrical resistance measurement test of each wiring pattern, and also has a multilayer wiring board force. A pitch conversion substrate 23 is provided.

On the surface of the pitch conversion substrate 23 (upper surface in FIGS. 30 to 32), current supply electrodes for supplying current that are electrically connected to the same electrode to be inspected and spaced apart from each other are provided. A connection electrode 25 comprising 27 and a voltage measurement electrode 28 for voltage measurement is formed.

[0135] These connection electrodes 25 are arranged in accordance with the pattern of the electrode to be inspected of the circuit board to be inspected.

On the back surface of the pitch conversion substrate 23, for example, a plurality of terminal electrodes 24 are arranged according to lattice point positions of pitches of 0.8 mm, 0.75 mm, 1.5 mm, 1.8 mm, and 2.54 mm.

Each of current supply electrode 27 and voltage measurement electrode 28 is electrically connected to terminal electrode 24 by internal wiring 53.

On the surface of the pitch conversion substrate 23, a first anisotropic conductive sheet 22 is formed on the connection electrode 25 in a state of being physically adhered or closely adhered. In the example of FIG. 30, the first anisotropic conductive sheet 22 is formed so as to cover the entire surface of the pitch conversion substrate 23.

The first anisotropic conductive sheet 22 includes a plurality of conductive path forming portions 61 that are arranged in accordance with the pattern of the connection electrodes 25 on the pitch conversion substrate 23 and extend in the thickness direction. That is, each of the conductive path forming portions 61 is disposed on each of the current supply electrode 27 and the voltage measurement electrode 28 in the pitch conversion substrate 23. In addition, between these adjacent conductive path forming portions 61, the conductive path forming portions 61 formed in a state of being integrally bonded to each of the conductive path forming portions 61 are insulated to insulate the conductive path forming portions 61 from each other. Part 62 is provided.

[0138] The conductive path forming portion 61 and the insulating portion 62 of the first anisotropic conductive sheet 22 are basically the same as the first anisotropic conductive sheet 22 in the pitch conversion adapter integral 60 shown in FIG. The configuration is the same.

As shown in FIG. 33, the second anisotropic conductive sheet 26 disposed on the relay pin unit 31 side of the pitch conversion substrate 23 is composed of a large number of conductive particles P in an insulating elastic polymer material. Are formed of conductive path forming portions 71 arranged in the thickness direction and insulating portions 72 that separate the respective conductive path forming portions 71. As described above, the conductive particles P are nonuniformly dispersed in the plane direction only in the conductive path forming portion 71.

[0139] The thickness of the conductive path forming portion 71 is preferably 0.1 to 2 mm, more preferably 0.2 to 1.5 mm. If this thickness is too small, the absorption of the applied pressure by the inspection jig will be reduced at the time of inspection when the absorption capacity for pressure in the thickness direction is low, and the effect of mitigating the impact on the circuit board connector 21 will be reduced. . For this reason, it becomes difficult to suppress the deterioration of the first anisotropic conductive sheet 22, resulting in an increase in the number of replacements of the first anisotropic conductive sheet 22 during the repeated inspection of the circuit board 1 to be inspected. Decreases the efficiency. On the other hand, if this thickness is excessive, the electrical resistance in the thickness direction tends to increase and electrical inspection may be difficult.

[0140] It is preferable that the thickness of the insulating portion 72 is substantially the same as or smaller than the thickness of the conductive path forming portion 71. As shown in FIG. 33, the thickness of the insulating portion 72 is made smaller than the thickness of the conductive path forming portion 71, and the conductive path forming portion 71 forms a protruding portion 71a protruding from the insulating portion 72. Because the deformation of the conductive path forming part 72 becomes easier and the capacity to absorb the applied pressure increases, the applied pressure of the inspection jig is absorbed at the time of inspection, and the circuit board side connector 21 Impact can be mitigated.

[0141] When magnetic conductive particles are used as the conductive particles P constituting the second anisotropic conductive sheet 26, the number average particle diameter thereof is preferably 5 to 200 μm, more preferably 5 to 150 m, more preferably 10: LOO m. Here, the “number average particle diameter of the magnetic conductive particles” means that measured by a laser diffraction scattering method. When the number average particle diameter of magnetic conductive particles is 5 m or more, pressure deformation of the conductive path forming part of the anisotropic conductive sheet is easy. Become. Further, when the magnetic conductive particles are oriented by magnetic field orientation treatment in the manufacturing process, the magnetic conductive particles can be easily oriented. When the number average particle size force S of the magnetic conductive particles is 200 m or less, the elasticity of the conductive path forming portion 71 of the anisotropic conductive sheet is good and the caloric pressure deformation becomes easy.

[0142] The thickness W m) of the conductive path forming part 71 and the number average particle diameter D (μm) of the magnetic conductive particles

The ratio W ZD to 2 2 is preferably 1.1 to 10.

twenty two

When the ratio W ZD is less than 1.1, the magnetic

twenty two

Since the diameter of the conductive particles is equal to or larger than that, the elasticity of the conductive path forming portion 71 is reduced, and the absorption capability of the applied pressure in the thickness direction is reduced. Since the absorption of the pressure applied by the inspection tool during inspection is reduced and the effect of mitigating the impact on the circuit board connector 21 is reduced, the deterioration of the first anisotropic conductive sheet 22 is suppressed. As a result, during the repeated inspection of the circuit board 1 to be inspected, the first anisotropic conductive sheet 22, that is, the first anisotropic conductive sheet 22 was integrated on the pitch converting substrate 23 side. The number of replacements of the pitch conversion adapter 60 is increased, and the inspection efficiency tends to decrease.

[0143] On the other hand, when the ratio W ZD exceeds 10, a large number of conductive particles are present in the conductive path forming portion 71.

twenty two

As a result of the arrangement, a chain is formed, and there are a large number of contacts between the conductive particles, so that the electrical resistance value tends to be high.

The elastic polymer (elastomer) that is the base material of the conductive path forming part 71 preferably has a durometer hardness measured by a type A durometer of 15 to 60, more preferably 20 to 50, still more preferably. 25-45.

[0144] When the durometer hardness of the elastic polymer is smaller than 15, the sheet shape is deformed early when the sheet is pressed in the thickness direction. The electrical connection is likely to be difficult. If the durometer hardness of the elastic polymer is greater than 60, the deformation force when pressed in the thickness direction becomes small, so the ability to absorb pressure in the thickness direction becomes small. Therefore, the deterioration of the first anisotropic conductive sheet 22 is suppressed, and as a result, the first anisotropic conductive sheet 22, that is, the first anisotropic conductive sheet 22, during the repeated inspection of the circuit board 1 to be inspected. The anisotropic conductive sheet 22 of the pitch conversion adapter integrated with the pitch conversion board 23 is increased, and the number of replacements of the pitch conversion adapter 60 is increased. The rate tends to decrease.

[0145] The elastic polymer serving as the base material of the conductive path forming portion 71 is not particularly limited as long as it exhibits the durometer hardness described above, but from the viewpoint of workability and electrical characteristics, silicone rubber may be used. preferable.

The insulating portion 72 of the second anisotropic conductive sheet 26 is formed of an insulating material that does not substantially contain conductive particles. As the insulating material, for example, an insulating polymer material, an inorganic material, a metal material whose surface is insulated, etc. can be used, but the same material as the elastic polymer used for the conductive path forming portion is used. When used, production is easy. When an elastic polymer is used as the material for the insulating portion, it is preferable to use a material having a durometer hardness in the above range.

[0146] As the magnetic conductive particles, the conductive particles used in the first anisotropic conductive sheet described above can be used.

The second anisotropic conductive sheet 26 can be manufactured, for example, as follows. First, the overall shape is substantially a flat plate shape, each consisting of an upper mold and a lower mold that correspond to each other, and a magnetic field is applied to the material layer filled in the molding space between the upper mold and the lower mold. An anisotropic conductive sheet molding die having a configuration capable of heat-curing the material layer is prepared.

[0147] This anisotropic conductive sheet molding die has a magnetic field applied to the material layer to form a portion having conductivity at an appropriate position. On a substrate made of a ferromagnetic material such as nickel, a ferromagnetic material portion made of iron, nickel or the like for generating an intensity distribution in the magnetic field in the mold, and a non-magnetic metal such as copper or non-coating made of resin. The magnetic material portions have mosaic layers alternately arranged so as to be adjacent to each other, and the ferromagnetic material portions are arranged according to a pattern corresponding to the conductive path forming portion to be formed. ing.

[0148] Here, the molding surface of the upper mold is flat, and the molding surface of the lower mold has slight irregularities corresponding to the conductive path forming portion of the anisotropic conductive sheet to be formed.

Then, using the anisotropic conductive sheet molding die, an anisotropic conductive sheet is manufactured as follows. First, in the molding space of the mold for forming an anisotropic conductive sheet, conductive particles exhibiting magnetism are contained in a polymer material that is cured to become an elastic polymer material. The molding material thus formed is injected to form a molding material layer.

Next, a magnetic field having an intensity distribution in the thickness direction is applied to the formed molding material layer using the ferromagnetic part and the non-magnetic part in each of the upper mold and the lower mold. Due to the action of the magnetic force, the conductive particles are aggregated between the ferromagnetic part in the upper mold and the ferromagnetic part in the lower mold located immediately below it, and the conductive particles are further thickened. Orient to align in the direction. Then, by hardening the molding material layer in this state, an anisotropic conductive sheet having a configuration in which a plurality of columnar conductive path forming portions are insulated from each other by an insulating portion is manufactured.

On the other hand, as shown in FIG. 1, the tester-side connectors 41a and 41b include third anisotropic conductive sheets 42a and 42b, connector boards 43a and 43b, and base plates 46a and 46b. Prepare and speak. As the third anisotropic conductive sheet 42a, 42b, the same one as the second anisotropic conductive sheet 26 described above is used. That is, as shown in FIG. 33, the conductive path forming portions formed by arranging a large number of conductive particles in the insulating elastic polymer material in the thickness direction are separated from the respective conductive path forming portions. An anisotropic conductive sheet composed of an insulating part is used.

[0151] The connector boards 43a and 43b are provided with an insulating board, and pin-side electrodes 45a and 45b are formed on the surface thereof on the relay pin unit 31 side, as shown in FIGS.

These pin side electrodes 45 are, for example, 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.775 mm, 0.5 mm, 0.45 mm, 0.3 mm or 0.2 mm. They are arranged on lattice points with a constant pitch, and the arrangement pitch is the same as the arrangement pitch of the conductive pins 32 of the relay pin unit 31.

[0152] Each pin-side electrode 45 is electrically connected to the tester-side electrodes 44a, 44b by a wiring pattern formed on the surface of the insulating substrate and an internal wiring formed therein.

As shown in FIGS. 1, 2, and 34 (FIG. 34 shows the relay pin unit 31a for convenience of explanation) and FIGS. 40 to 43, the relay pin unit 31 is A large number of conductive pins 32a and 32b provided at a predetermined pitch are provided in parallel so as to face each other. Further, the relay pin unit 31 is provided on both ends of the conductive pins 32a and 32b, and the first insulating plates 34a and 34a disposed on the circuit board 1 side to be inspected to support the conductive pins 32a and 32b. 34b And two insulating plates 35a and 35b disposed on the opposite side of the circuit board 1 to be inspected.

[0153] As shown in Fig. 35, for example, the conductive pin 32 includes a central portion 82 having a large diameter and end portions 81a and 81b having a smaller diameter. The first insulating plate 34 and the second insulating plate 35 are formed with through holes 83 into which the end portions 81 of the conductive pins 32 are inserted. The diameter of the through hole 83 is formed to be larger than the diameter of the end portions 81a and 81b of the conductive pin 32 and smaller than the diameter of the central portion 82, whereby the conductive pin 32 is held so as not to drop off. Speak.

[0154] The first insulating plate 34 and the second insulating plate 35 are separated from each other by the first support pin 33 and the second support pin 37 in FIG. The conductive pin 32 is held so as to be movable up and down. The length of the end 81 of the conductive pin 32 is formed so as to be longer than the thickness of the insulating plate 34, whereby the conductive pin 32 protrudes from at least one of the insulating plates 34.

[0155] The relay pin unit has a large number of conductive pins, for example, 2.54mm, 1.8mm, 1.27mm, 1.06mm, 0.8mm, 0.75mm, 0.5mm, 0.45mm, 0.5. It is placed on a grid point with a pitch of 3mm or 0.2mm.

By making the arrangement pitch of the conductive pins 32 of the relay pin unit 31 the same as the arrangement pitch of the terminal electrodes 24 provided on the pitch conversion board 23, the pitch conversion board 23 is connected to the tester via the conductive pins 32. It is designed to be electrically connected to the side.

Further, as shown in FIGS. 1 and 34, the relay pin unit 31 includes an intermediate holding plate 36a between the first insulating plates 34a and 34b and the second insulating plates 35a and 35b. 36b force ^ 酉 is placed! /, And the first support pins 33a, 33b are arranged between the first insulating plates 34a, 34b and the intermediate holding plates 36a, 36b. Therefore, the space between the first insulating plates 34a and 34b and the intermediate holding plates 36a and 36b is fixed.

[0157] Similarly, second support pins 37a and 37b are arranged between the second insulating plates 35a and 35b and the intermediate holding plates 36a and 36b, whereby the second insulating plates The space between 35a, 35b and the intermediate holding plate 36a, 36b is fixed.

Examples of the material of the first support pin 33 and the second support pin 37 include brass and stainless steel. Such metals are used.

Note that the distance L1 between the first insulating plate 34 and the intermediate holding plate 36 and the distance L2 between the second insulating plate 35 and the intermediate holding plate 36 in FIG. 34 are particularly limited. However, as will be described later, the height of the electrodes 2 and 3 on the circuit board 1 to be inspected varies due to the elasticity of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35. Considering the absorbency, the thickness is preferably 2 mm or more, more preferably 2.5 mm or more.

Then, as shown in FIG. 34, the first contact support position 38A of the first support pin 33 with respect to the intermediate holding plate 36, and the second contact pin 38 of the second support pin 37 with respect to the intermediate holding plate 36 The abutting support position 38B is arranged at a different position on the intermediate holding plate projection surface A on which the inspection device is projected in the thickness direction of the intermediate holding plate (from the upper side to the lower side in FIG. 1). . In this case, the different positions are not particularly limited, but the first abutting support position 38A and the second abutting support position 38B are projected on the intermediate holding plate as shown in FIG. It is preferable that the surface A is formed on the lattice and is formed on the surface A.

Specifically, as shown in FIG. 39, on the intermediate holding plate projection plane A, one unit cell region R1 composed of four adjacent first contact support positions 38A has one first 2 abutment support positions 38B are arranged. Further, on the intermediate holding plate projection surface A, one first abutting support position 38A is arranged in a unit lattice region R2 composed of four adjacent second abutting support positions 38B. In FIG. 39, the first contact support position 38A is indicated by a black circle, and the second contact support position group 38B is indicated by a white circle!

[0161] Here, one second contact support position 38B is arranged at the center of the diagonal Q1 of the unit lattice region R1 of the first contact support position 38A, and the second contact support position is also provided. One first abutting support position 38A is arranged at the center of the diagonal line Q2 of the unit lattice region R2 at the position 38B. However, as described above, the relative positions of these are different positions on the intermediate holding plate projection plane A obtained by projecting the inspection apparatus in the thickness direction of the intermediate holding plate as described above. It suffices if they are arranged. That is, when not arranged in a grid pattern, the inspection apparatus is projected on the intermediate holding plate projection surface A as projected in the thickness direction of the intermediate holding plate as described above. It is sufficient that they are arranged at different positions. [0162] In this case, the separation distance between the first contact support positions 38A adjacent to each other and the separation distance between the second contact support positions 38B are preferably 10 to: LOOmm, more preferably It is 12 to 70 mm, particularly preferably 15 to 50 mm.

As the forming material of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35, a flexible material is used. The flexibility of these plates is determined from above when both ends of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 are horizontally arranged with 10 cm intervals. Stagnation force generated by pressurizing at a pressure of 50 kgf It is less than 0.02% of the width of these insulating plates, and destruction and permanent deformation do not occur even when pressurizing with a pressure of 200 kgf from above. I prefer to be there.

[0163 first insulator plate 34, the intermediate holding plate 36, as the material of the second insulating plate 35, specifically, resistivity 1 X 1Ο ¹⁰ Ω 'cm or more insulating materials, such as polyimide榭Resin, polyester resin, polyamide resin, phenol resin, polyacetal resin, polybutylene terephthalate resin, polyethylene terephthalate resin, syndiotactic 'polystyrene resin, polyethylene disulfide resin, poly Ethereal ketone resin, fluorine resin, polyether-tolyl resin, polyethersulfone resin, polyarylate resin, polyamideimide resin, and other high mechanical strength resin materials, glass fiber reinforced epoxy Resin, glass fiber reinforced polyester resin, glass fiber reinforced polyimide resin, glass fiber reinforced phenol resin, glass fiber reinforced fluorine resin, etc. Carbon fiber reinforced epoxy resin, carbon fiber reinforced epoxy resin, carbon fiber reinforced polyester resin, carbon fiber reinforced polyimide resin, carbon fiber reinforced phenol resin, carbon fiber reinforced fluorine resin, etc. Fiber composite resin, epoxy resin, phenol resin, etc. containing silica, alumina, boron nitride and other inorganic materials, composite resin material, epoxy resin, phenol resin, etc. contain mesh Examples include composite resin materials. Further, a composite plate material formed by laminating a plurality of plate materials having these material forces can also be used.

[0164] The thicknesses of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 are the types of materials constituting the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35. The force appropriately selected according to the pressure is preferably 1 to: LOmm. For example, a glass fiber reinforced epoxy resin having a thickness of 2 to 5 mm can be used. As a method for movably supporting the conductive pin 32 on the first insulating plate 34 and the second insulating plate 35, the method shown in FIGS. 36 to 38 can be cited in addition to the method shown in FIG. it can. In this example, as illustrated as the conductive pin 32, in this example, a bent holding plate 84 is provided between the first insulating plate 34 and the second insulating plate 35.

[0165] Further, as the conductive pins 32, cylindrical metal pins are used.

As shown in FIG. 36, the bent holding plate 84 is formed with a through hole 85 through which the conductive pin 32 is inserted. The conductive pin 32 has a through hole 83a formed in the first insulating plate 34, a through hole 83b formed in the second insulating plate 35, and a through hole 85 formed in the bent holding plate 84 as fulcrums. They are pressed laterally in opposite directions and bent at the position of the through hole 85 of the bending holding plate 84, whereby the conductive pin 32 is supported so as to be movable in the axial direction.

[0166] The intermediate holding plate 36 is formed with a through hole 86 having a diameter large enough not to contact the conductive pin 32, and the conductive pin 32 is passed through the through hole 86.

The conductive pin 32 is supported by the first insulating plate 34 and the second insulating plate 35 in the procedure shown in FIGS. 37 (a) to 37 (c). As shown in FIG. 37 (a), the through hole 83a of the first insulating plate 34 and the through hole 83b formed in the second insulating plate 35 and the through hole 85 of the bent holding plate 84 are in the axial direction. The bending holding plate 84 is disposed at a position aligned with the position of the bending holding plate 84.

Next, as shown in FIG. 37 (b), the conductive pin 32 passes through the second insulating plate 35 from the through hole 83a of the first insulating plate 34 through the through hole 85 of the bent holding plate 84. Insert up to hole 83b. Next, as shown in FIG. 37 (c), the bending holding plate 84 is moved in the lateral direction (horizontal direction) perpendicular to the axial direction of the conductive pin 32, and the position of the bending holding plate 84 is adjusted by an appropriate means. Fix it. Accordingly, the conductive pins 32 are opposite to each other with the through hole 83b formed in the first insulating plate 34 and the through hole 83b formed in the second insulating plate 35 and the through hole 85 of the bent holding plate 84 as fulcrums. It is pressed laterally in the direction and bent at the position of the through hole 85 of the bending holding plate 84, whereby the conductive pin 32 is supported so as to be movable in the axial direction.

[0168] With this configuration, the conductive pin 32 can be held between the first insulating plate 34 and the second insulating plate 35 so as to be movable in the axial direction and not fallen off. In addition, since a cylindrical pin having a simple structure can be used as the conductive pin 32, the overall cost of the conductive pin 32 and the member holding it can be suppressed. The position where the bent holding plate 84 is disposed may be between the first insulating plate 34 and the intermediate holding plate 36.

In the inspection apparatus of the present embodiment configured as described above, as shown in FIG. 2, the electrode 2 and the electrode 3 of the circuit board 1 to be inspected are the first anisotropic conductive sheets 22a, 22b. , Pitch conversion boards 23a, 23b, second anisotropic conductive sheet 26a, 26b, conductive pins 32a, 32b, third anisotropic conductive sheet 42a, 42b, connector boards 43a, 43b The base plates 46a and 46b arranged on the outside are electrically connected to a tester (not shown) by pressing them with a tester's pressurizing mechanism, and the electrical connection between the electrodes of the circuit board 1 to be inspected. Electrical tests such as resistance measurements are performed.

[0170] The pressure pressed from the upper and lower first inspection jigs 11a and the second inspection jig l ib with respect to the circuit board to be inspected during measurement is, for example, 100 to 250 kgf.

Hereinafter, referring to FIGS. 40 to 43 (for the sake of convenience, only the second inspection jig l ib is shown), the first inspection jig 1 la and the second inspection jig 1 lb are covered. A pressure absorbing action and a pressure dispersing action when both surfaces of the inspection circuit board 1 are clamped will be described.

As shown in FIG. 41, electrical inspection is performed by sandwiching both surfaces of the circuit board 1 to be inspected between the first inspection jig 11a and the second inspection jig l ib. At the initial stage of pressurization, the relay pin unit 31 moves in the thickness direction of the conductive pin 32, the first anisotropic conductive sheet 22, the second anisotropic conductive sheet 26, and the like. The pressure is absorbed by the rubber elastic compression of the third anisotropic conductive sheet 42, and the height variation of the inspected electrode of the inspected circuit board 1 can be absorbed to some extent.

[0172] The first abutment support position between the first support pin and the intermediate holding plate and the second abutment support position between the second support pin and the intermediate holding plate are the intermediate holding plate. As shown by the arrows in FIG. 42, the force acts in the vertical direction, as shown in FIG. 43. When the circuit board 1 to be inspected is further pressed between the first inspection jig 11a and the second inspection jig l ib, the first anisotropic conductive sheet 22 and In addition to the rubber elastic compression of the second anisotropic conductive sheet 26 and the third anisotropic conductive sheet 42, the first insulating plate 34 of the relay pin unit 31 and the second insulating plate 35 Panel elasticity of the intermediate holding plate 36 disposed between the first insulating plate 34 and the second insulating plate 35 Accordingly, it is possible to disperse the pressure concentration with respect to the height variation of the electrode to be inspected of the circuit board 1 to be inspected, for example, the height variation of the solder ball electrode, and to avoid the local stress concentration.

That is, as shown in FIGS. 42 and 43, the first holding pin 33 and the first holding support position 38A with respect to the intermediate holding plate 36 have the intermediate holding plate 36 as the second holding center. Hold in the direction of the insulating plate 35 (see the portion E surrounded by the one-dot chain line in FIG. 43), and hold the second support pin 37 and the intermediate holding plate 36 around the second contact support position 38B. The plate 36 is sandwiched in the direction of the first insulating plate 34 (see the portion D surrounded by the one-dot chain line in FIG. 43). Here, “squeeze” and “stagnation direction” refer to the squeezing so that the intermediate holding plate 36 protrudes in the convex direction and the protruding direction.

In this way, the intermediate holding plate 36 is sandwiched in the opposite directions around the first contact support position 38A and the second contact support position 38B, so the first inspection jig When the circuit board 1 to be inspected is further pressed between the 11a and the second inspection jig l ib, the panel elastic force of the intermediate holding plate 36 is exhibited.

Further, as shown by the portion B surrounded by the one-dot chain line in FIG. 43, the height of the conductive pin 32b is absorbed by the compression of the protruding portion of the conductive path forming portion of the second anisotropic conductive sheet 26. , The pressure force that cannot be absorbed by the compression of this protruding part, will be applied to the first insulating plate 34b

Therefore, as shown by the portion C surrounded by the one-dot chain line in FIG. 43, the first insulating plate 34 and the second insulating plate 35 are also composed of the first support pin 33 and the second support pin 37. In other words, the circuit board 1 to be inspected is further pressurized between the first inspection jig 11a and the second inspection jig l ib. At this time, the panel elastic force of the first insulating plate 34 and the second insulating plate 35 is exhibited.

[0176] This ensures stable electrical contact with each of the electrodes to be inspected 1 of the circuit board 1 to be inspected having a height variation, and further reduces the stress concentration. Local breakage of the conductive sheet 22 is suppressed. As a result, the repeated use durability of the first anisotropic conductive sheet 22 is improved, so that the number of replacements is reduced and the inspection work efficiency is improved. 44 is a cross-sectional view similar to FIG. 40 for explaining another embodiment of the inspection apparatus of the present invention (only the second inspection jig is shown for convenience), and FIG. 45 is a relay thereof. It is an expanded sectional view of a pin unit. This inspection apparatus has basically the same configuration as the inspection apparatus shown in FIG. 1, and the same reference numerals are assigned to the same components. In this inspection device, as shown in FIGS. 44 and 45, a plurality (three in this embodiment) of intermediate holdings are provided between the first insulating plate 34 and the second insulating plate 35. The plates 36 are spaced apart from each other by a predetermined distance, and the holding plate support pins 39 are arranged between the adjacent intermediate holding plates 36.

In this case, in at least one intermediate holding plate 36b, the holding support position of the holding plate support pin 39b that also contacts the intermediate holding plate 36b with one side side force with respect to the intermediate holding plate 36b, and the intermediate holding plate 36b The contact position of the first support pin 33b, the second support pin 37b, or the holding plate support pin 39b with which the other side force abuts against the intermediate holding plate 36b is the thickness direction of the intermediate holding plate 36b. It is necessary to arrange them at different positions on the projection surface of the intermediate holding plate projected onto the screen.

[0179] Most preferably, in all the intermediate holding plates 36b, the holding plate support pins 39b that are in one-side force contact with the intermediate holding plate 36b are in contact with and supported by the intermediate holding plate 36b and the intermediate holding plate 36b. The abutment support position of the first support pin 33b, the second support pin 37b, or the holding plate support pin 39b with which the other side force also abuts against the intermediate holding plate 36b is in the thickness direction of the intermediate holding plate 36b. They are arranged at different positions on the projected intermediate holding plate projection surface.

[0180] In this case, although not described in detail, in the above-described embodiment, the "different position" refers to the first contact support position 38A between the first support pin 33 and the intermediate holding plate 36, and the second position. An arrangement similar to the relative position described in relation to the relationship between the support pin 37 and the second contact support position 38B of the intermediate holding plate 36 can be made.

In the present embodiment, of the three intermediate holding plates 36b, the upper intermediate holding plate 36b is in contact with the intermediate holding plate 36b by the holding plate support pin 39b that also contacts the intermediate holding plate 36b with one surface side force. The support position 39A and the contact support position 38A with respect to the intermediate holding plate 36b of the first support pin 33b that also contacts the intermediate holding plate 36b with the other side force are projected in the thickness direction of the intermediate holding plate 36b. The intermediate holding plate is arranged at different positions on the projection surface. [0181] Further, in the middle intermediate holding plate 36b among the three intermediate holding plates 36b, the holding plate support pin 39b that comes into contact with the intermediate holding plate 36b from one surface side is in contact with and supported by the intermediate holding plate 36b 39A. The intermediate support plate projection projected in the thickness direction of the intermediate support plate 36b is the contact support position 39A with respect to the intermediate support plate 36b of the support plate support pin 39b that also contacts the intermediate support plate 36b with the other side force. Placed in different positions across the surface.

[0182] Further, in the lower intermediate holding plate 36b among the three intermediate holding plates 36b, the holding plate support pins 39b that come into contact with the intermediate holding plate 36b from one surface side are in contact with the intermediate holding plate 36b. The intermediate holding projected by 39A and the abutment support position 38B of the second support pin 37b that comes into contact with the intermediate holding plate 36b from the other surface side with respect to the intermediate holding plate 36b is projected in the thickness direction of the intermediate holding plate 36b. They are arranged at different positions on the plate projection plane.

[0183] With this configuration, the spring property is further exhibited by the plurality of intermediate holding plates 36, and with respect to the height variation of the electrodes to be inspected of the circuit board 1 to be inspected, Dispersion of pressure concentration can further avoid local stress concentration, and local breakage of the anisotropic conductive sheet can be suppressed. As a result, the repeated use durability of the anisotropic conductive sheet can be reduced. As a result, the number of times of anisotropic conductive sheet replacement is reduced and inspection work efficiency is improved.

[0184] The number of intermediate holding plates 36 is not particularly limited as long as it is plural.

46 is a cross-sectional view showing another embodiment of the inspection apparatus of the present invention, and FIG. 47 is a cross-sectional view showing a stacked state when the inspection apparatus of FIG. 46 is used for inspection.

As shown in FIGS. 46 and 47, the inspection apparatus of the present embodiment includes a first inspection jig 11a disposed on the upper surface side of the circuit board 1 to be inspected and a second inspection disposed on the lower surface side. The jig 11b is arranged so as to face each other vertically.

[0185] The first inspection jig 11a includes a circuit board-side connector 21a having a relay board 29a and an anisotropic conductive sheet 26a on both sides thereof, and a relay pin unit 31a. The first inspection jig 1 la is a tester-side connector 41 a provided with a connector board 43 a on which the third anisotropic conductive sheet 42 a is arranged on the relay pin unit 3 la side and a base plate 46 a. It is equipped with. [0186] The second inspection jig l ib is also configured in the same manner as the first inspection jig 11a, and includes a circuit board side connector 21b having a relay board 29b and an anisotropic conductive sheet 26b on both sides thereof, It has 3 lb of relay pin unit. Further, the second inspection jig l ib includes a tester side connector 4 lb provided with a connector board 43b on which the anisotropic conductive sheet 42b is arranged on the relay pin unit 3 lb side and a base plate 46b. Yes.

[0187] An electrode 2 to be inspected is formed on the upper surface of the circuit board 1 to be inspected, and an electrode 3 to be inspected is also formed on the lower surface thereof, and these are electrically connected to each other. Talk!

The circuit board side connectors 21a and 21b are composed of the pitch converting boards 23a and 23b, the relay boards 29a and 29b arranged on one side thereof, and the second anisotropic conductive sheet 26a arranged on the other side. , 26b.

The configuration of the pitch conversion board 23 is the same as that of the embodiment of FIG. 1, and the surface on the circuit board side to be inspected and the surface on the side of the relay pin unit are as shown in FIG. 3 and FIG. It is configured. FIG. 48 is a cross-sectional view showing a state in which a pitch conversion board, a relay board, and a circuit board to be inspected are stacked.

On the other hand, on the other surface of the pitch conversion board 23, that is, on the side opposite to the circuit board 1 to be inspected, electrically conductive pins 32a and 32b of the relay pin unit 31 are electrically connected as shown in FIG. A plurality of terminal electrodes 24 to be connected are formed. These terminal electrodes 24 are, for example, 2.5 4 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.4 mm, 0.3 mm or 0.2 mm. The pitch is the same as the pitch of the conductive pins 32a and 32b of the relay pin unit.

[0190] Each connection electrode 25 in FIG. 3 is electrically connected to the corresponding terminal electrode 24 in FIG. 4 by the internal wiring 53 (see FIG. 48) penetrating in the thickness direction of the wiring 52 and the insulating substrate 51. Has been.

Fig. 49 (a) is a cross-sectional view of the relay board, Fig. 49 (b) is a partially enlarged cross-sectional view, and Fig. 49 (c) is FIG. The substrate 73 of the relay substrate 29 is formed with a number of through holes in which the conductive path forming portions 61 are arranged according to the electrode pattern of the pitch conversion substrate 23. An insulating part 62 is formed by embedding an elastic polymer substance in the through hole, and the conductive path forming part 61 is formed so as to be surrounded by the insulating part 76. The insulating part 76 is integrally formed on both side surfaces of the substrate 73 and is continuous with the plurality of through holes.

[0191] The conductive path forming part 61 contains conductive particles exhibiting magnetism in an insulating elastic polymer substance in an aligned state in the thickness direction.

On the other hand, the insulating portion 62 is formed of an elastic polymer material that does not contain conductive particles. The elastic polymer substance constituting the conductive path forming part 61 and the elastic polymer substance constituting the insulating part 62 may be of the same type or different types.

[0192] Specific examples of the material for forming the substrate 73 of the relay substrate include glass fiber reinforced polyimide resin, glass fiber reinforced epoxy resin, glass fiber reinforced bismaleimide triazine resin, and the like. Composite resin materials, polyimide resins, polyester resins, polyaramid resins, polyamide resins, bismaleimide 'triazine resins, liquid crystal polymers and other high mechanical strength materials, stainless steel and other metal materials, fluorine resins Examples thereof include meshes made of organic fibers such as fibers, aramid fibers, polyethylene fibers, polyarylate fibers, nylon fibers, polyester fibers, and liquid crystal polymer fibers, nonwoven fabrics, and metal meshes. The thickness of the substrate 73 is a force depending on the forming material, preferably 20 to 200 μm, more preferably 30 to LOO μm.

In each of a large number of through holes formed in this substrate 73, a conductive path forming portion 61 corresponding to the connection electrode 25 is disposed. For example, a pair of conductive path forming portions 61 corresponding to the voltage supply electrode 27 and the voltage measurement electrode 28 in the four-terminal inspection is arranged in each of the through holes. The number of conductive path forming portions 61 arranged in one through hole is not particularly limited, but is preferably 1 to 4, and corresponds to the connection electrode 25 of the pitch conversion substrate 23 and corresponds to the substrate 73. The number of conductive path forming portions 75 may be different for each through hole.

In the illustrated example, on both surfaces of the relay substrate 29, the protruding portions 61a in which the conductive path forming portion 61 protrudes from the surface force of the insulating portion 62 are formed. Forming the protrusion 61a in this way As a result, the degree of compression by pressurizing the conductive path forming part 61 is greater than that for the insulating part 62, so that a conductive path having a sufficiently low resistance value is reliably formed in the conductive path forming part 61, and the applied pressure is increased. The change of the resistance value with respect to the change of can be reduced. As a result, even if the pressure applied to each conductive path forming portion 61 of the relay substrate 29 is not uniform, it is possible to prevent variation in conductivity between the conductive path forming portions 61.

[0195] As the elastic polymer substance constituting the conductive path forming part 61 and the insulating part 62, a polymer substance having a crosslinked structure is preferred. Specific examples of the curable polymer material-forming material that can be used to obtain such an elastic polymer material include polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, acrylonitrile-butene. Conjugated gen rubbers such as gen copolymer rubber and hydrogenated products thereof, block copolymer rubbers such as styrene butadiene gen block copolymer rubber, styrene isoprene block copolymer, and hydrogenated products thereof. Examples include mouth-prene, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, and ethylene propylene copolymer rubber.

[0196] When the weather resistance is required for the relay substrate 29, it is preferable to use a material other than the conjugated-gen rubber. In particular, silicone rubber is used from the viewpoint of molding cacheability and electrical characteristics. It is preferable. As the silicone rubber, those obtained by crosslinking or condensing liquid silicone rubber are preferable. The liquid silicone rubber has a viscosity of 10 ⁵ poise at a strain rate of 10- ^ ec and is preferably a condensation type, an addition type, a vinyl group or a hydroxyl group-containing one. May be. Specifically, for example, dimethyl silicone raw rubber, methyl beer silicone raw rubber, methyl ferrule silicone raw rubber and the like can be mentioned.

[0197] In addition, the silicone rubber has a molecular weight Mw (referred to as a standard polystyrene equivalent weight average molecular weight) force of 0000 to 40,000. From the viewpoint of heat resistance, the molecular weight distribution index (the ratio of the standard polystyrene-converted weight average molecular weight Mw to the standard polystyrene-converted number average molecular weight Mn) is preferably 2 or less.

As the conductive particles P contained in the conductive path forming part 61, the conductive particles can be easily aligned in the thickness direction by the method described later, and therefore, the conductive particles P exhibiting magnetism. Sex particles are used.

[0198] Specific examples of such conductive particles include particles of metals having magnetism such as iron, cobalt and nickel, particles of alloys thereof, particles containing these metals, or these particles. Core particles, and the surface of the core particles is coated with a metal with good conductivity such as gold, silver, noradium, rhodium, or non-magnetic metal particles or inorganic particles such as glass beads or polymer particles And the like, and the surface of the core particle is coated with a conductive magnetic metal such as -keckle or cobalt.

[0199] Among these, it is preferable to use a nickel particle as a core particle and a surface having a gold mesh with good conductivity.

[0200] The coating amount of the conductive metal is preferably 0.5 to 50% by mass of the core particles, more preferably 2 to 30% by mass, further preferably 3 to 25% by mass, and particularly preferably 4 to 20% by mass. When the conductive metal to be coated is gold, the coating amount is preferably 0.5 to 30% by mass of the core particles, more preferably 2 to 20% by mass, and still more preferably 3 to 15% by mass.

[0201] The particle size of the conductive particles is preferably 1-100 μm, more preferably 2-50 μm, even more preferably 3-30 μm, and particularly preferably 4-20 μm. m.

[0202] By using conductive particles satisfying such conditions, the obtained conductive path forming part 61 is easily deformed under pressure, and in the conductive path forming part 61, the conductive particles are formed between the conductive particles. Sufficient electrical contact is obtained.

The shape of the conductive particles is not particularly limited, but in the polymer material forming material From the viewpoint of being easily dispersible, spherical particles, star-shaped particles, or secondary particles in which these particles are aggregated are preferable.

[0203] As the conductive particles, particles whose surfaces are treated with a coupling agent such as a silane coupling agent or a lubricant can be appropriately used. By treating the particle surface with a coupling agent or a lubricant, the durability of the anisotropic conductive sheet is improved.

Such conductive particles are contained in the conductive path forming portion in a proportion of preferably 15 to 45%, more preferably 20 to 40% in terms of volume fraction. If this ratio is too small, the conductive path forming part 61 having a sufficiently small electric resistance value may not be obtained. On the other hand, when this ratio is excessive, the obtained conductive path forming part 61 becomes fragile and the necessary elasticity as the conductive path forming part 61 may not be obtained immediately.

[0204] The thickness of the conductive path forming portion 61 is preferably 20 to 250 μm, more preferably 30 to 200 μm. When this thickness is too small, the absorption capability with respect to the pressurization of the thickness direction becomes low. On the other hand, when the thickness is excessive, good conductivity may not be obtained.

[0205] Hereinafter, an example of a method for manufacturing the relay substrate 29 will be described. First, the conductive path forming part 61 is formed. The conductive path forming portion 61 can be formed by the method shown in FIGS. 7 to 16 or the method shown in FIGS. Using the plurality of conductive path forming portions 61 formed on the releasable support plate 65, the relay substrate 29 is obtained by the following process. As shown in FIG. 50 (a), a releasable support plate 70 is prepared, and on the surface of the releasable support plate 70, a liquid insulating material layer that is cured to become an insulating elastic polymer substance. 62A is formed by a printing method or the like.

[0206] Next, as shown in Fig. 50 (b), a substrate 73 having a through hole is placed on the insulating part material layer 62A. Then, from the upper surface side of the substrate 73, a liquid elastomer material that is cured to become an insulating elastic polymer material is filled into the through holes 75 of the substrate 73 by a printing method or the like. Further, by applying an elastomer material to the surface of the substrate 73, as shown in FIG. 50 (c), an insulating material layer 62A integrally formed on both side surfaces of the substrate 73 and the through holes 75 is obtained. .

Next, as shown in FIG. 51 (a), the releasability support in which a plurality of conductive path forming portions 61 are formed. By superposing the holding plate 65 on the releasable support plate 70 on which the substrate 73 is placed and the insulating material layer 62A is formed in both side surfaces and through holes 75, the conductive path forming portion 6 1 Each is brought into contact with the releasable support plate 70. Thus, the insulating material layer 62A is formed around the conductive path forming portion 61.

Next, as shown in FIG. 51 (b), the conductive path forming part 61 is compressed by pressurizing the releasable support plate 65, and the insulating part material layer 62A is cured. After the curing process, release the pressure from the releasable support plate 65 and the releasable support plate 70 and release them from the releasable support plate 65 and the releasable support plate 70, so that both ends of the conductive path forming part 61 The part protrudes from the insulating part 62. As a result, as shown in FIG. 51 (c), the insulating portion 62 that insulates the pair of adjacent conductive path forming portions 61 and 61 from each other is formed integrally with the conductive path forming portion 61, and the conductive path The relay substrate 29 in which the forming part 61 protrudes from the surface of the insulating part 62 is obtained.

Note that, as shown in FIG. 51 (d), the metal film 64 may be formed at the tip of the conductive path forming portion 61. The metal film 64 may be formed at the tip portions on both sides of the conductive path forming portion 61 as shown in the figure, or may be formed at the tip portion on one side of the conductive path forming portion 61. Such a metal film can be formed by various known methods such as a metal plating method, vapor deposition by a sputtering method, and a method of attaching a metal plate to the tip of the conductive path forming portion 61 with an adhesive.

[0210] As a material constituting the releasable support plate 70, the same material as the releasable support plate 65 for forming the conductive path forming portion 61 can be used.

Examples of methods for applying the material for the elastomer used for the insulating material layer 62A include printing methods such as screen printing, roll coating methods, blade coating methods, etc. The thickness of the insulating material layer 62A is as follows. Is set according to the thickness of the insulating part 62 to be formed

[0211] The insulating part material layer 62A is normally cured by heat treatment. The specific heating temperature and heating time are appropriately set in consideration of the type of elastomer material constituting the insulating material layer 62A.

The through-hole in the board 73 is a numerically controlled drilling device, photoetching process, laser processing It can be formed by a process.

[0212] The cross-sectional view of FIG. 48 shows an example of performing a four-terminal inspection. As shown in the figure, a relay board 29 is disposed between the circuit board 1 to be tested and the pitch conversion board 23. On the surface of the pitch conversion substrate 23, there are a current supply electrode 27 for current supply and a voltage measurement electrode 28 for voltage measurement, which are electrically connected to the same electrode to be inspected and spaced apart from each other. The connecting electrode 25 is formed.

In correspondence with the current supply electrode 27 and the voltage measurement electrode 28 of the pitch conversion substrate 23, a pair of conductive path forming portions 61 are formed in one through hole of the relay substrate 29. The pair of conductive path forming portions 61 and 61 are electrically connected to the current supply electrode 27 and the voltage measurement electrode 28 on one end side, and the test electrode 2 of the circuit board 1 to be tested on the other end side. Electrical inspection is performed in this state.

[0214] On one side or both sides of the relay substrate 29, a dispersive anisotropic conductive sheet may be disposed. In the present invention, since the relay substrate 29 is provided, local stress concentration due to the electrodes of the circuit board 1 to be inspected can be sufficiently relaxed even if a thin dispersive anisotropic conductive sheet that does not impair the resolution is used. . 52 (a) and 52 (b) are cross-sectional views showing an example in which a dispersive anisotropic conductive sheet is arranged. In FIG. 52 (a), between the pitch conversion board 23 and the relay board 29, FIG. A first anisotropic conductive sheet 22, which is a distributed anisotropic conductive sheet, is arranged to form a pair of conductive paths for the current supply electrode 27 and voltage measurement electrode 28 of the pitch conversion board 23 and the relay board 29. The parts 61 and 61 are electrically connected via the first anisotropic conductive sheet 22.

[0215] In FIG. 52 (b), the first anisotropic conductive sheets 22, 22 which are distributed anisotropic conductive sheets are arranged on both sides of the relay substrate 29, and the current for the pitch conversion substrate 23 is supplied. The electrode 27 and the voltage measuring electrode 28 and the pair of conductive path forming portions 61 and 61 of the relay substrate 29 are electrically connected via the first anisotropic conductive sheet 22 and the circuit under test is also connected. Electrically connect the electrode to be inspected 2 of the substrate 1 and the pair of conductive path forming portions 61 and 61 of the relay substrate 29 via the first anisotropic conductive sheet 22! /

[0216] The first anisotropic conductive sheet 22 constituting the circuit board side connector 21 and arranged adjacent to the relay board 29 has an insulating elastic polymer material force as shown in FIG. Sheet base The material 63 contains a large number of conductive particles P dispersed in the plane direction and arranged in the thickness direction.

The thickness of the first anisotropic conductive sheet 22 is preferably 20 to 200 μm, more preferably 30 to 100 m. When the minimum thickness is less than 20 m, the mechanical strength of the first anisotropic conductive sheet 22 is low and the required durability may not be obtained. On the other hand, when the thickness of the first anisotropic conductive sheet 22 exceeds 200 / zm, the electrical resistance in the thickness direction tends to increase, and when the pitch of the electrodes to be connected is small, the pressure is increased. As a result, the required insulation cannot be obtained between the conductive paths formed by the above, and an electrical short circuit may occur between the electrodes to be inspected, making it difficult to electrically inspect the circuit board to be inspected.

[0217] The elastic polymer substance constituting the sheet base 63 of the first anisotropic conductive sheet 22 preferably has a durometer hardness of 30 to 90, more preferably 35 to 80, and still more preferably. 4 0-70. “Du-mouth meter hardness” here refers to the value measured with a type A durometer based on the JIS K6253 durometer hardness test.

When the durometer hardness of the elastic polymer material is less than 30, when the anisotropic conductive sheet is pressed in the thickness direction, the anisotropic conductive sheet is greatly compressed and deformed, resulting in a large permanent distortion. It becomes difficult to use for inspection due to deterioration and durability tends to be lowered.

[0218] On the other hand, when the durometer hardness of the elastic polymer material exceeds 90, the amount of deformation in the thickness direction becomes insufficient when the anisotropic conductive sheet is pressed in the thickness direction. Reliability is not obtained and connection failure is likely to occur.

The elastic polymer material constituting the base material of the first anisotropic conductive sheet 22 is not particularly limited as long as it exhibits the above-mentioned durometer hardness. However, from the viewpoint of forming workability and electrical properties. It is preferable to use silicone rubber!

[0219] The first anisotropic conductive sheet 22 has a thickness W m) and a number average particle size of magnetic conductive particles.

1

The ratio W ZD to the diameter D m) is preferably 1.1 to 10. Here, “magnetic conduction

1 1 1

The “number average particle diameter of the functional particles” means that measured by a laser diffraction scattering method. If the ratio W ZD is less than 1.1, the magnetic conductivity with respect to the thickness of the anisotropic conductive sheet

1 1

Since the diameter of the particles is the same or larger, this anisotropic conductive sheet is less elastic, so when this anisotropic conductive sheet is placed on the circuit board to be inspected. In addition, the circuit board to be inspected is easily damaged.

[0220] On the other hand, when the ratio W ZD exceeds 10, many conductive particles are arranged in the thickness direction.

1 1

As a result, a chain is formed, and there are many contact points between the conductive particles, and the electrical resistance value tends to be high.

The magnetic conductive particle is a saturated magnetic layer because the magnetic conductive particle can be easily moved by the action of a magnetic field in the sheet molding material for forming the anisotropic conductive sheet. is preferably 0. lWb / m ² or more, more preferably 0. 3Wb / m ² or more on, particularly preferably 0. 5Wb / m ² or more ones are used.

[0221] Since the saturation magnetization is 0.1 lWbZm ² or more, the magnetically conductive particles can be surely moved by the action of a magnetic field in the production process to obtain a desired orientation state. When used, a chain of magnetic conductive particles can be formed.

Specific examples of magnetic conductive particles include particles of metals such as iron, nickel and cobalt, particles of alloys thereof, particles containing these metals, or particles containing these metals as core particles. Composite particles with the surface of core particles coated with highly conductive metal, or inorganic substance particles such as non-magnetic metal particles or glass beads, or polymer particles are used as core particles. And composite particles in which core particles are coated with both a conductive magnetic material such as ferrite and an intermetallic compound and a highly conductive metal.

Here, “highly conductive metal” refers to a metal having a conductivity of 5 × 10 ⁶ Ω— ¹ !!! — ¹ or higher at 0 ° C. Specifically, gold, silver, rhodium, platinum, chromium, and the like can be used as such a highly conductive metal. Among these, gold is chemically stable and has high conductivity. Is preferred to use.

Among the above magnetic conductive particles, composite particles in which nickel particles are used as core particles and the surface thereof is plated with a highly conductive metal such as gold or silver are preferable.

[0223] As a means for coating the surface of the core particles with a highly conductive metal, for example, an electroless plating method can be used!

The magnetic conductive particles preferably have a coefficient of variation of the number average particle diameter of 50% or less. More preferably, it is 40% or less, more preferably 30% or less, and particularly preferably 20% or less. Here, “the coefficient of variation of the number average particle diameter” is an expression: (σ ZDn) X 100 (where σ indicates the value of the standard deviation of the particle diameter, and Dn indicates the number average particle diameter of the particle) )).

[0224] When the coefficient of variation of the number average particle diameter of the magnetic conductive particles is 50% or less, the degree of unevenness of the particle diameter is reduced, so that the partial conductivity of the anisotropic conductive sheet obtained is reduced. Variations can be reduced.

Such magnetic conductive particles can be obtained by making a metal material into particles by a conventional method, or preparing commercially available metal particles and classifying the particles. The particle classification treatment can be performed, for example, by a classification device such as an air classification device or a sonic sieving device. Specific conditions for the classification treatment are appropriately set according to the number average particle diameter of the target conductive metal particles, the type of the classification device, and the like.

[0225] The specific shape of the magnetic conductive particles is not particularly limited! However, for example, secondary particles in which a plurality of spherical primary particles are integrally connected are preferably used.

When using composite particles in which the surface of the core particle is coated with a highly conductive metal (conductive composite metal particles) as the magnetic conductive particles, good conductivity can be obtained. The coverage of the highly conductive metal on the surface (ratio of the coated area of the highly conductive metal to the surface area of the core particles) is preferably 40% or more, more preferably 45% or more, particularly preferably 47 to 95. %.

[0226] Further, the coating amount of the highly conductive metal is preferably 2.5 to 50 mass%, more preferably 3 to 45 mass%, still more preferably 3.5 to 40 mass% of the weight of the core particles. % By mass, particularly preferably 5 to 30% by mass.

An anisotropic conductive sheet containing a large number of conductive particles dispersed in the surface direction and arranged in the thickness direction in such an insulating elastic polymer material is disclosed in, for example, Japanese Patent Application Laid-Open No. 2003-77560. As shown in the official gazette, a flowable molding material containing conductive particles exhibiting magnetism in a polymer material that is cured to become an elastic polymer substance is prepared, and a molding made of this molding material is prepared. The material layer is formed between the one-surface-side molded member that contacts one surface of the molding material layer and the other-surface-side molded member that contacts the other surface of the molding material layer. It can be manufactured by a method of applying a magnetic field to the shape material layer in the thickness direction and hardening the molding material layer.

[0227] The second anisotropic conductive sheet 26 arranged on the side of the relay pin unit 31 of the pitch conversion board 23 is composed of a large number of conductive materials in an insulating elastic polymer material as shown in FIG. 1 is composed of conductive path forming portions 71 formed by arranging the conductive particles P in the thickness direction, and insulating portions 72 that separate the respective conductive path forming portions 71, the details of which are shown in the embodiment of FIG. Same as the case.

[0229] The connector boards 43a and 43b are provided with an insulating board, and pin-side electrodes 45a and 45b are formed on the surface thereof on the relay pin unit 31 side as shown in FIGS. These pin side electrodes 45 are, for example, 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.775 mm, 0.5 mm, 0.45 mm, 0.3 mm or 0.2 mm. They are arranged on lattice points with a constant pitch, and the arrangement pitch is the same as the arrangement pitch of the conductive pins 32 of the relay pin unit 31.

[0230] Each pin-side electrode 45 is electrically connected to the tester-side electrodes 44a, 44b by a wiring pattern formed on the surface of the insulating substrate and an internal wiring formed therein.

The relay pin unit 31 is configured in the same manner as that shown in FIGS. The specific details are as described above.

[0231] Hereinafter, referring to FIGS. 54 to 57 (for convenience, only the second inspection jig l ib is shown), the first inspection jig 1 la and the second inspection jig 1 lb A pressure absorbing action and a pressure dispersing action when both surfaces of the circuit board 1 to be inspected are sandwiched between them will be described.

As shown in Fig. 55, the object to be inspected between the first inspection jig 1 la and the second inspection jig 1 lb When electrical inspection is performed by clamping both sides of the circuit board 1 to be inspected, the relay pin unit 31 moves in the thickness direction of the relay pin unit 31 and the elastic portion of the relay board 29 at the initial stage of pressurization. The pressure is absorbed by the rubber elastic compression of the second anisotropic conductive sheet 26 and the third anisotropic conductive sheet 42, and there is some variation in the height of the electrodes to be inspected on the circuit board 1 to be inspected. Can be absorbed.

[0232] The first contact support position between the first support pin and the intermediate holding plate and the second contact support position between the second support pin and the intermediate support plate are the intermediate support plate. As shown by the arrows in Fig. 56, the force acts in the vertical direction as shown in Fig. 57. Thus, when the circuit board 1 to be inspected is further pressurized between the first inspection jig 11a and the second inspection jig l ib, the elastic portion of the relay board 29 and the first In addition to the elastic compression of the second anisotropic conductive sheet 26 and the third anisotropic conductive sheet 42, the first insulating plate 34, the second insulating plate 35 and the first insulating plate 34 of the relay pin unit 31 The panel holding elasticity of the intermediate holding plate 36 disposed between the insulating plate 34 and the second insulating plate 35 causes variations in the height of the electrodes to be inspected of the circuit board 1 to be inspected, for example, solder ball electrodes The height variation, by dispersing pressure concentration, as possible out to avoid local stress concentration.

That is, as shown in FIG. 56 and FIG. 57, the intermediate holding plate 36 has the second support center 33 about the first support pin 33 and the first holding support position 38A with respect to the intermediate holding plate 36. While holding in the direction of the insulating plate 35 (see the portion E surrounded by the one-dot chain line in FIG. 57), hold the second support pin 37 and the intermediate holding plate 36 around the second contact support position 38B. The plate 36 crawls in the direction of the first insulating plate 34 (see the portion D surrounded by the one-dot chain line in FIG. 57). Here, “squeeze” and “stagnation direction” refer to the squeezing so that the intermediate holding plate 36 protrudes in the convex direction and the protruding direction.

[0234] In this way, the intermediate holding plate 36 is sandwiched in opposite directions around the first contact support position 38A and the second contact support position 38B, so the first inspection jig When the circuit board 1 to be inspected is further pressed between the 11a and the second inspection jig l ib, the panel elastic force of the intermediate holding plate 36 is exhibited.

In addition, as shown by a portion B surrounded by a one-dot chain line in FIG. 57, the second anisotropic conductive sheet 26 The height of the conductive pin 32b is absorbed by the compression of the protruding portion of the conductive path forming portion, but the pressure force that cannot be absorbed by the compression of the protruding portion is applied to the first insulating plate 34b.

Therefore, as shown by the portion C surrounded by the one-dot chain line in FIG. 57, the first insulating plate 34 and the second insulating plate 35 are also composed of the first support pin 33 and the second support pin 37. In other words, the circuit board 1 to be inspected is further pressurized between the first inspection jig 11a and the second inspection jig l ib. At this time, the panel elastic force of the first insulating plate 34 and the second insulating plate 35 is exhibited.

[0236] This ensures stable electrical contact with each of the electrodes to be inspected of the circuit board 1 to be inspected having variations in height, and further reduces the stress concentration. Local damage of the part is suppressed. As a result, the durability of repeated use of the relay board 29 is improved, so that the number of replacements is reduced and the inspection work efficiency is improved. FIG. 58 is a cross-sectional view similar to FIG. 54 for explaining another embodiment of the inspection apparatus of the present invention (only the second inspection jig is shown for convenience), and FIG. 59 is a diagram of the relay pin unit. It is an expanded sectional view. This inspection apparatus has basically the same configuration as the inspection apparatus shown in FIG. 46, and the same reference numerals are assigned to the same components. In this inspection device, as shown in FIGS. 58 and 59, a plurality of (three in this embodiment) intermediate holdings are provided between the first insulating plate 34 and the second insulating plate 35. The plates 36 are spaced apart from each other by a predetermined distance, and the holding plate support pins 39 are arranged between the adjacent intermediate holding plates 36.

[0238] Most preferably, in all the intermediate holding plates 36b, the holding plate support pins 39b that are in one-side force contact with the intermediate holding plate 36b are in contact with and supported by the intermediate holding plate 36b and the intermediate holding plate 36b. The first support pin 33b, the second support pin 37b, Alternatively, the holding support position of the holding plate support pin 39b with respect to the intermediate holding plate 36b is arranged at a different position on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate 36b.

[0239] In this case, although not described in detail, the "different position" refers to the first contact support position 38A between the first support pin 33 and the intermediate holding plate 36 and the second position in the above-described embodiment. An arrangement similar to the relative position described in relation to the relationship between the support pin 37 and the second contact support position 38B of the intermediate holding plate 36 can be made.

In the present embodiment, of the three intermediate holding plates 36b, the upper intermediate holding plate 36b is in contact with the intermediate holding plate 36b by the holding plate support pin 39b that also contacts the intermediate holding plate 36b with one surface side force. The support position 39A and the contact support position 38A with respect to the intermediate holding plate 36b of the first support pin 33b that also contacts the intermediate holding plate 36b with the other side force are projected in the thickness direction of the intermediate holding plate 36b. The intermediate holding plate is arranged at different positions on the projection surface.

[0240] Further, in the middle intermediate holding plate 36b among the three intermediate holding plates 36b, the holding plate support pin 39b that comes into contact with the intermediate holding plate 36b from one surface side is in contact with and supported by the intermediate holding plate 36b 39A. The intermediate support plate projection projected in the thickness direction of the intermediate support plate 36b is the contact support position 39A with respect to the intermediate support plate 36b of the support plate support pin 39b that also contacts the intermediate support plate 36b with the other side force. Placed in different positions across the surface.

[0241] Further, in the lower intermediate holding plate 36b among the three intermediate holding plates 36b, the holding plate support pins 39b that come into contact with the intermediate holding plate 36b from one surface side are in contact with the intermediate holding plate 36b. The intermediate holding projected by 39A and the abutment support position 38B of the second support pin 37b that comes into contact with the intermediate holding plate 36b from the other surface side with respect to the intermediate holding plate 36b is projected in the thickness direction of the intermediate holding plate 36b. They are arranged at different positions on the plate projection plane.

[0242] With this configuration, the spring property is further exhibited by the plurality of intermediate holding plates 36, and the variation in the height of the electrodes to be inspected on the circuit board 1 to be inspected Dispersion of pressure concentration can further avoid local stress concentration, and local breakage of the elastic part of the relay board 29 is suppressed, and as a result, repeated use durability of the relay board 29 is improved. As a result, the number of replacements of the relay board 29 is reduced, and the inspection work efficiency is improved. [0243] The number of intermediate holding plates 36 is not particularly limited as long as it is plural.

Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes can be made without departing from the scope of the present invention.

For example, the circuit board 1 to be inspected may be a semiconductor integrated circuit device such as a knock IC, MCM, or CSP, or a circuit device formed on a wafer, in addition to a printed circuit board. The printed circuit board may be a single-sided printed circuit board as well as a double-sided printed circuit board.

[0244] The first inspection jig 11a and the second inspection jig Lib need not necessarily be the same in materials used, member structures, and the like, and they may be different.

The tester side connector may be configured by stacking a plurality of anisotropic conductive sheets and a circuit board such as a connector board.

In the above embodiment, as the second anisotropic conductive sheet 26 and the third anisotropic conductive sheet 42, a plurality of conductive path forming portions extending in the thickness direction and these conductive path forming portions are insulated from each other. It consists of an insulating part, and the conductive particles are contained only in the conductive path forming part, whereby the conductive particles are unevenly distributed in the surface direction, and the conductive path forming part protrudes on one side of the sheet. The force using what is used is not necessarily limited to this.

[0245] As shown in Fig. 1, Fig. 2, Fig. 40, Fig. 41, Fig. 43, Fig. 44, Fig. 54, Fig. 55, Fig. 57, and Fig. 58, the connector board 43 and the base plate in the tester side connector 41 A support pin 49 may be arranged between the pin 46 and the pin 46. These support pins 49 provide the first support pin 33 and the second support pin 37 (the first support pin 33, the second support pin 37, and the holding plate support pin 39 in FIGS. 44 and 58). In the same manner as the action, it is possible to give an action of dispersing the surface pressure. In order to provide this surface pressure dispersion action, it is preferable to arrange them so that the position of the support pin 49 and the position of the second support pin 37 are different from each other in the surface direction.

[0246] Specific examples and comparative examples of the present invention are shown below.

[Example 1] Circuit board inspection to inspect the following circuit board for evaluation as shown in Fig. 1, which is suitable for the inspection section of rail transport type automatic circuit board inspection machine (product name: STARREC V5) A device was made.

(1) Circuit board for evaluation 1

An evaluation circuit board 1 having the following specifications was prepared.

Dimensions: 100mm (length) X 100mm (width) X O. 8mm (thickness)

Number of electrodes on top side: 3600

Diameter of the electrode to be inspected on the upper surface side: 0.2 mm

Minimum pitch of electrodes to be inspected on the upper surface side: 0.4 mm

Number of electrodes on the bottom side: 2600

Diameter of the electrode to be inspected on the bottom side: 0.2 mm

Minimum pitch of electrodes to be inspected on the bottom side: 0.4 mm

(2) Pitch conversion board 23

Numerically controlled drilling on a laminated material (product name: R-1766, manufactured by Matsushita Electric Industrial Co., Ltd.) in which a thin metal layer made of copper with a thickness of 18 m is formed on both surfaces of an insulating substrate made of glass fiber reinforced epoxy resin. A total of 7200 circular through-holes with a diameter of 0.2 mm, each penetrating in the thickness direction of the laminated material, were formed by the apparatus.

[0247] Next, an electroless plating process is performed on the laminated material in which the through holes are formed using an EDTA type copper plating solution, thereby forming a copper plating layer on the inner wall of each through hole. By applying an electrolytic copper plating process using a copper sulfate plating solution, a cylindrical via having a thickness of about 10 m is electrically connected to each thin metal layer on the surface of the laminated material in each through hole. A hole was formed.

[0248] Next, a 25 μm thick dry film resist (Tokyo Ohka, product name: FP-225) is laminated on the thin metal layer on the surface of the laminated material to form a resist layer. A protective seal was placed on the thin metal layer on the other side. A photomask film is placed on the resist layer, and the resist layer is subjected to an exposure process using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), followed by a development process, whereby a resist pattern for etching is formed. Formed. Then, the thin metal layer on the surface on which the resist pattern is formed is etched. As a result, 7 200 connecting electrodes of 60 m in the horizontal direction and 120 m in the vertical direction are formed on the surface of the insulating substrate, and the line width for electrically connecting each connecting electrode and the via hole is 100 m. A pattern wiring portion was formed, and then the resist pattern was removed.

[0249] A protective seal was applied to the surface of the insulating substrate on which the connection electrode and the pattern wiring portion were formed. Next, the protective seal on the thin metal layer on the other side of the laminated material was removed, and a dry film resist (product name: FP-225, 25 m thick) was applied on the thin metal layer on this side. Lamination was performed to form a resist layer. Thereafter, a photomask film is disposed on the resist layer, and the resist layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.). A resist pattern for etching was formed on the thin metal layer. Next, by performing an etching process, 7200 terminal electrodes and a pattern wiring portion for electrically connecting each terminal electrode and via hole were formed on the back surface of the insulating substrate, and the resist pattern was removed.

[0250] Next, a 38 μm thick dry film solder resist (product name: Congo Mask 2 015) was laminated on the back surface of the insulating substrate on which the terminal electrodes and the pattern wiring portion were formed. An insulating layer is formed, a photomask film is disposed on the insulating layer, and then the insulating layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing) and then developed. 7200 openings with a diameter of 0.4 mm were formed to expose the electrodes.

[0251] As described above, the pitch conversion substrate 23a for the first inspection jig 11a was produced. This pitch conversion board 23a has a vertical and horizontal dimension of 120mm x 160mm, a thickness of 0.5mm, and the connection electrodes are rectangular with a horizontal dimension of 60m and a vertical dimension of 120m. The width of the insulating part between the electrodes) 30 μm, the terminal electrode diameter is 0.4 mm, the terminal electrode placement pitch is 0.45 mm, and the surface roughness of the insulating layer on the side where the connection electrode is formed is It was 0.02 μm.

[0252] Further, in the same manner as described above, a pitch conversion substrate 23b for the second inspection jig ib having 5200 connection electrodes on the front surface and 5200 terminal electrodes on the back surface was produced. This pitch conversion board 23b has a vertical and horizontal dimension of 120 mm x 160 mm, a thickness of 0.5 mm, a connection electrode of 60 m in the horizontal direction and a rectangle of 120 m in the vertical direction. Distance (insulation width between electrodes) 30 m, terminal electrode diameter 0.4 mm, terminal electrode placement pitch 0.45 mm, insulation layer on the surface (surface on which connection electrodes are formed) side The surface roughness is 0.02 m.

(3) Integrated adapter for pitch conversion 60

The first anisotropic conductive sheet 22 was integrated with the surface side of the pitch conversion substrate 23 by the method shown in FIGS. 7 to 16 to obtain a pitch conversion adapter integrated 60.

(i) Formation of conductive elastomer layer 61B

Conductive particles are dispersed by dispersing 400 parts by weight of conductive particles in which gold is coated on nickel core particles in 100 parts by weight of addition-type liquid silicone rubber (the ratio of gold to core particles is 2% by weight). An elastomeric material was prepared. This conductive elastomer material was applied to the surface of a releasable support plate 65 made of stainless steel having a thickness of 5 mm by screen printing.

[0253] Thus, a conductive elastomer material layer 61A having a thickness of 0.05 mm was formed on the releasable support plate 65 (Figs. 7 and 8).

Next, the conductive elastomer material layer 61A was subjected to a curing treatment at 120 ° C. for 1 hour while applying a magnetic field of 2 Tesla in the thickness direction by an electromagnet. As a result, a conductive elastomer layer 61B having a thickness of 0.05 mm supported on the support plate 65 was formed (FIGS. 9 and 10).

(ii) Formation of the conductive path forming part 61

A thin metal layer 66 made of copper having a thickness of 0.3 m was formed by subjecting the surface of the conductive elastomer layer 61B supported on the releasable support plate 65 to electroless mesh treatment.

[0254] Then, on this thin metal layer 66, a rectangle of 60 m x 120 μm in size is formed at a position corresponding to the connection electrode 25a provided on the pitch conversion substrate 23a by one photolithography technique. Thus, a resist layer 67 having a thickness of 25 μm was formed (FIG. 12).

Thereafter, an electrolytic plating process was performed on the surface of the thin metal layer 66 to form a metal mask 68 made of copper having a thickness of 20 μm in the opening 67a of the resist layer 67 (FIG. 13).

[0255] In this state, the conductive elastomer layer 61B, the thin metal layer 66, and the resist layer 67 On the other hand, laser processing was performed with a carbon dioxide laser device (Fig. 15 (b) and Fig. 16 (b)) _G

As a result, 7200 conductive path forming portions 61 each supported on the releasable support plate 65 were formed, and then the conductive elastomer layer 61B other than the conductive path forming portion 61 was peeled and removed (FIG. 14, FIG. 15 (c) and FIG. 16 (c)), and thereafter, the metal thin layer 66 remaining from the surface of the conductive path forming portion 61 and the metal mask 68 were removed by etching.

[0256] In addition, the laser processing uses a carbon dioxide laser processing machine "ML-605GTX" (manufactured by Mitsubishi Electric Corporation), and the laser beam diameter is 60 m and the laser output is 0.8 mJ. This was done by irradiating the processing point with 10 shots of laser beam.

(iii) Formation of insulating part 62

By applying addition-type liquid silicone rubber to the surface of the pitch conversion substrate 23a, an insulating material layer 62A having a thickness of 0.05 mm was formed. Then, on this insulating part material layer 62A, the releasable support plate 65 on which 7200 conductive path forming parts 61 are formed is aligned and overlapped to connect the pitch converting substrate 23a. Each of the electrodes 25 and the corresponding conductive path forming part 61 were brought into contact with each other.

[0257] Then, by applying a pressure of 20 kgf to the releasable support plate 65, the thickness of the insulating part material layer 62A is set to 0.04 mm, and the thickness of the conductive path forming part 61 is set to 0.0. 05mm force was compressed to 0.04mm inertia.

In this state, the insulating portion 62 was formed between the adjacent conductive path forming portions 61 by curing the insulating portion material layer 62A under the conditions of 120 ° C. and 1 hour.

[0258] After that, by releasing from the releasable support plate 65, a pitch conversion adapter integrated 60a for the first inspection jig 11a was manufactured.

The anisotropic conductive sheet 22a of this pitch conversion adapter integrated 60a has 7200 number of force of the conductive path forming part 61, the thickness of the conductive path forming part 61 is 0.05 mm, the thickness of the insulating part 62 is 0.04 mm, The width of the insulating part between the adjacent conductive path forming parts 61 forming a pair is 30 m, and the projecting height force of the conductive path forming part 61 is 62 mm.

[0259] In the same manner as the pitch conversion adapter integrated 60a for the first inspection jig 11a, the number of conductive path forming parts 61 is 5200, the thickness of the conductive path forming part 61 is 0.05 mm, and the insulating part 62 Thickness is 0 04mm, the width of the insulating part between the adjacent conductive path forming parts 61 forming a pair is 30 / zm. The second inspection treatment in which the projecting height of the conductive path forming part 61 from the insulating part 62 is 0. Olmm. A pitch conversion adapter integrated 60b for the tool l ib was produced.

(4) Circuit board connector 21

On the back side of this pitch conversion adapter integrated unit 60, there are a plurality of conductive path forming parts extending in the thickness direction and insulating parts that insulate them from each other. The circuit board side connector 21 was obtained by arranging the second anisotropic conductive sheet 26 made of a conductive sheet.

[0260] The second anisotropic conductive sheet 26 disposed between the pitch conversion board 23 and the relay pin unit 31 has the shape shown in FIG. 33, and specifically has the following configuration. The ones used were used.

[Second anisotropic conductive sheet 26]

Dimensions: 11 Omm X 150mm

Thickness of conductive path forming part: 0.6mm

Outside diameter of conductive path forming part: 0.35mm

Projection height of conductive path forming part: 0.05 mm

Conductive particles: Material: Nickel particles plated with gold, average particle diameter; 35; ζ ΐη, content of conductive particles in the conductive path forming part; 30% by volume

Elastic polymer material: Material; Silicone rubber, Hardness; 30

(5) Relay pin unit 31

The material of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 is made of an insulating material having a specific resistance of IX 10 ¹⁰ Ω'cm or more, and a glass fiber reinforced epoxy resin. 1. A 9mm one was used.

[0261] The distance L1 between the first insulating plate 34 and the intermediate holding plate 36 is 36.3 mm, and the distance L2 between the second insulating plate 35 and the intermediate holding plate 36 is 3 mm. The first support pin 33 (diameter 2 mm, length 36.3 mm) and the second support pin 37 (diameter 2 mm, length 3 mm) are fixedly supported and the first insulating plate Between the pin 34 and the second insulating plate 35, the conductive pin 32 having the following constituent force is arranged in the through hole 83 (0.4 mm in diameter) so that it can move freely. And produced.

[Conductive pin]

Material: Brass plated with gold

Tip 81a dimensions: outer diameter 0.35mm, total length 2. lmm

Center part 32 dimension outer diameter 0.45mm, total length 41mm

Base end 8 lb dimensions: OD 0.35mm, total length 2. lmm

The first contact support position 38A of the first support pin 33 with the intermediate holding plate 36 and the second contact support position 38B of the second support pin 37 with the intermediate holding plate 36 are shown in FIG. As shown in Fig. 1, they were arranged in a grid pattern. The separation distance between the first contact support positions 38A adjacent to each other and the separation distance between the second contact support positions 38B were 17.5 mm.

(6) Tester side connector 41

As shown in FIG. 1, the tester-side connector 41 is composed of a third anisotropic conductive sheet 42, a connector board 43, and a base plate 46. The third anisotropic conductive sheet 42 was the same as the second anisotropic conductive sheet 26 described above.

performance test

1.Evaluation of insulation of pitch conversion adapter

The insulation resistance between the connecting electrodes forming a pair of pitch conversion adapters 60 was evaluated as follows.

[0262] In order to evaluate the insulation resistance between the connecting electrodes, the vertical direction is 100 mm, the horizontal direction is 100 mm, and the thickness is 0.

An 8 mm glass epoxy substrate with an insulating coating on the surface was used.

The created inspection device was set in the inspection section of the rail transport type circuit board automatic inspection machine “STARREC V5”, and the glass epoxy board 76 was set on the inspection device (see FIG. 60).

[0263] Then, the press pressure of the rail conveyance type automatic circuit board inspection machine rSTARREC V5j was changed stepwise within a range of 100 to 210 kgf. Then, the insulation resistance between each pair of inspection electrodes 25 provided in the integrated pitch conversion adapter 60a for the first inspection jig 11a was measured 10 times for each press pressure condition.

Specifically, through the terminal electrode 24 corresponding to the connecting electrode 25 that makes a pair, While applying a pair of currents, the conduction resistance value of the connection electrode 25 forming a pair was measured.

[0264] With this method, the insulation resistance value between the paired test electrodes 25, that is, the insulation part 62 between the paired conductive path forming parts 61 in the first anisotropically conductive sheet 21 provided integrally. The insulation resistance value of was measured.

The ratio of the electrode pair of the connection electrode for which the measured insulation resistance value was 100 Ω or more was judged to be good insulation, and the point judged to be good insulation with respect to the total number of inspection points (hereinafter referred to as the “insulation pass point ratio”). ) Was calculated.

[0265] The connection electrode 25 in the pitch conversion adapter integrated 60a for the first inspection jig 11a is 7

There are 600 pairs of 200 forces, that is, there are 3600 connecting electrode pairs, and 10 measurements were performed under each press pressure condition.

00) Indicates the percentage of NG inspection points in the 36000 inspection points calculated by X 10 = 36000.

[0266] In this inspection device, it is necessary for practical use that the insulating passing score ratio is 99.9% or more, and if the insulating passing score ratio is less than 99.9%, an inspection is required. Occasionally, a leakage current flows from the connection electrode used as the current supply electrode to the connection electrode used as the voltage measurement electrode.

As a result, an erroneous test result may be obtained for a circuit board to be inspected, which is a non-defective product, and a highly reliable circuit board electrical inspection is performed. There is a risk that it will not be possible.

[0267] The measurement results are shown in Table 1.

2.Measurement of minimum press pressure

The created inspection device was set in the inspection section of the rail transport type automatic circuit board inspection machine rSTARREC V5J, and the evaluation circuit board 1 prepared for the inspection device was set.

And press pressure of rail conveyance type automatic circuit board inspection machine “STARREC V5”, 1

Change the voltage stepwise within the range of 00 to 210 kgf, and apply a current of 1 mA to the connection electrode for current supply for the electrode to be inspected on the evaluation circuit board 1 for each press pressure condition 10 times. The conduction resistance value was measured.

[0268] The inspection point (hereinafter referred to as “NG inspection point”) where the measured conduction resistance value is 10 Ω or more. The NG inspection point ratio (hereinafter referred to as “NG inspection point ratio”) in the total inspection points is calculated as the continuity failure, and the lowest press pressure at which the NG inspection point ratio is 0.01% or less is calculated. The minimum pressing pressure was used.

For this inspection device, the NG inspection point ratio is required to be 0.01% or less for practical use. If the NG inspection point ratio exceeds 0.01%, the product to be inspected is a good product. There is a possibility that an erroneous inspection result that the circuit board is defective may be obtained, so that it may not be possible to perform a reliable electrical inspection of the circuit board.

[0269] In the measurement of the conduction resistance value, after the measurement of one conduction resistance value is completed, the press pressure related to the measurement is released to return the inspection apparatus to the non-pressurized state, and the next conduction resistance value is measured. The determination was performed again by applying a press pressure of a predetermined magnitude.

The number of electrodes to be inspected on the upper surface of the evaluation circuit board 1 is 3600 points, and the number of electrodes to be inspected on the bottom surface is 2600 points. Since the measurement was performed 10 times under each press pressure condition, + 2600) X 10 = 62000 [62000, calculated by this, [Indicating the percentage of NG inspection points occupied.

[0270] The measurement results are shown in Table 2.

“Low minimum press pressure” means that the circuit board to be inspected can be electrically inspected with a low press pressure. If the pressurized pressure at the time of inspection can be set low, deterioration of the circuit board to be inspected, the anisotropic conductive sheet, and the substrate for pitch conversion due to the pressurized pressure at the time of inspection can be suppressed.

In addition, since it is possible to use a component having low durability as a component of the inspection apparatus, the structure of the inspection apparatus can be made small and compact.

As a result, the durability of the inspection device can be improved and the cost of manufacturing the inspection device can be reduced.

3.Measurement of durability of anisotropic conductive sheet

The created inspection device was set in the inspection section of the rSTARREC V5J rail transport type automatic circuit board inspection machine.

Set the evaluation circuit board 1 prepared for the inspection device, set the press pressure condition of the rail transport type circuit board automatic inspection machine “STARREC V5” to 130 kgf, and apply a predetermined number of pressurizations. went.

[0272] Then, for the electrode to be inspected on the circuit board for evaluation 1, the conduction resistance value was measured 10 times when a current of 1 milliampere was applied to the electrode for inspection under the condition of a press pressure of 130 kgf.

Then, a predetermined number of times of pressurization was performed, and the work of measuring the conduction resistance value 10 times was repeated. The inspection points (NG inspection points) where the measured conduction resistance value was 10 Ω or more were judged as continuity defects, and the ratio of NG inspection points to the total inspection points (NG inspection point ratio) was calculated.

[0273] Next, the anisotropic conductive sheet of the inspection device is replaced with a new one, and the press pressure condition is 1

Except for changing to 50 kgf, pressurization was performed a predetermined number of times under the same conditions as above, and the NG inspection point ratio was calculated using the same method as above.

After the measurement of one conduction resistance value is completed, the press pressure related to the measurement is released and the inspection device is returned to the non-pressurized state, and the next measurement of the conduction resistance value is a press pressure of a predetermined magnitude. Was performed again.

[0274] Table 3 shows the measurement results.

4.Evaluation of continuity failure of circuit board under test

Then, the press pressure condition of the rail conveyance type automatic circuit board inspection machine “STARREC V5” is 150 kgf, and the electrodes to be inspected on the evaluation circuit board 1 are connected electrodes for current supply under the condition of the press pressure of 150 kgf. When the current of 1 milliampere was supplied, the conduction resistance value was measured 10 times with the connection electrode for voltage measurement.

[0275] As a result, the inspection point where a conduction resistance value greater than the set conduction resistance value (100 Ω) was detected (

NG inspection points) were judged as poor continuity, and the ratio of NG inspection points to the total inspection points (NG inspection point ratio) was calculated.

Then, for the same evaluation circuit board 1, the setting of the conduction resistance value determined as the NG inspection point is changed stepwise to a resistance value lower than 100 Ω, and the evaluation circuit board is set for each set resistance value. A rating of 1 was made.

[0276] Table 4 shows the measurement results.

[Comparative Example 1] As shown in FIG. 61, in the inspection apparatus of Example 1, the pitch conversion adapter integrated 60 is changed to the pitch conversion board 23, and a thickness of 100 is provided between the pitch conversion board 23 and the evaluation circuit board 1. A μm dispersed anisotropic conductive sheet 77 was disposed.

[0277] Then, with respect to the manufactured comparative inspection device, the same method as in Example 1 was used to measure the insulation with the pitch conversion adapter, measure the minimum press pressure, and check the durability of the anisotropic conductive sheet. Measurement and evaluation of poor conduction of the circuit board to be inspected were performed. Table 1 shows the measurement results of insulation, Table 2 shows the measurement results of the minimum press, Table 3 shows the measurement results of the durability of the anisotropic conductive sheet, and Table 4 shows the results of evaluation of the continuity failure of the circuit board under test. It was shown to.

[0278] As shown in FIG. 61, the evaluation of the insulation was performed according to the evaluation of the insulation of the pitch conversion adapter integrated with the inspection apparatus of Example 1.

[Comparative Example 2]

The dispersed anisotropic conductive elastomer sheet having a thickness of 100 / z m used in Comparative Example 1 was replaced with a dispersed anisotropic conductive sheet 77 having a thickness of 40 m.

[0279] Then, for the manufactured comparative inspection device, the same method as in Example 1 was used to measure the insulation with the pitch conversion adapter, measure the minimum press pressure, and check the durability of the anisotropic conductive sheet. Measurement and evaluation of poor conduction of the circuit board to be inspected were performed. Table 1 shows the measurement results of the insulation, Table 2 shows the measurement results of the minimum press, Table 2 shows the measurement results of the durability of the anisotropic conductive sheet, and Table 3 shows the results of the evaluation of the continuity failure of the circuit board under test. Table 4 shows.

[0280] As shown in FIG. 61, the evaluation of the insulation was performed according to the evaluation of the insulation integrated with the pitch conversion adapter for the inspection apparatus of Example 1.

The dispersed anisotropic conductive sheets used in Comparative Example 1 and Comparative Example 2 were obtained as follows.

25 parts by volume of conductive particles with an average particle size of 20 m are added to 100 parts by volume of a mixture of two liquid type addition type liquid silicone rubbers A and B mixed in equal proportions. And mixed.

[0281] Thereafter, a defoaming treatment by reduced pressure was performed to prepare a conductive elastomer material. As conductive particles, nickel particles are used as core particles, and electroless gold plating is applied to these core particles. (Average coating amount: an amount that is 5% by weight of the weight of the core particles) was used.

A polyester resin sheet (product name: “Mattle Mirror S 10”, manufactured by Torayen Earth) with a glossy surface (surface roughness of 0.04 / zm) and a backside of non-glossy surface and a thickness of 0.1 mm. Two sheets were prepared. A frame-shaped spacer having a thickness of 100 μm and having a rectangular opening of 120 mm × 200 mm was disposed on the surface of one polyester resin sheet.

[0282] The prepared conductive elastomer material is applied in the opening of the spacer, and the other polyester resin sheet is applied to the conductive elastomer material on the surface thereof. The material was placed in contact with the material for use.

After that, by using a pressure roll device consisting of a pressure roll and a support roll, the conductive elastomer material is sandwiched between two polyester resin sheets, and the thickness of the conductive elastomer is 100 μm. A material layer was formed.

[0283] Next, an electromagnet was placed on the back surface of each of the two polyester resin sheets, and a 0.3 T parallel magnetic field was applied to the conductive elastomer material layer in the thickness direction.

A rectangular conductive elastomer sheet having a thickness of 100 m was manufactured by curing the molding material layer at 0 ° C. for 30 minutes. The proportion of conductive particles in the obtained conductive elastomer sheet was 12% in terms of volume fraction.

[0284] This conductive elastomer sheet was cut to 110 mm x 110 mm to obtain a dispersed anisotropic conductive elastomer sheet used in Comparative Example 1.

In addition, in the above, the thickness of the spacer was changed to 40 / zm, and a 40 μm thick dispersed anisotropic conductive sheet used in Comparative Example 2 was obtained in the same manner.

[0285] [Table 1]

[0286] [Table 2] NG inspection point ratio (%) Minimum press r-less pressure 100 110 130 150 180 210 Pressure

(kg £) (kg £) Example 1 0.52 0.14 0 0 0 0 130 Comparative Example 2 0.48 0.11 0 0 0 0 130

[0287] [Table 3]

[0288] [Table 4]

[0289] As is apparent from Table 1 to Table 4, according to the inspection apparatus of the present invention, the anisotropic conductive sheet having good electrical insulation between the connection electrodes and low minimum pressing pressure is obtained. It can be seen that it is superior in durability, has little strength, and generates very little conduction failure.

[Example 2]

Circuit board for inspecting the following evaluation circuit board as shown in Fig. 46, which conforms to the inspection part of rail transport type automatic circuit board inspection machine (product name: STARREC V5). An inspection device was produced.

(1) Circuit board for evaluation 1

An evaluation circuit board 1 having the following specifications was prepared.

Dimensions: 100mm (length) X 100mm (width) X O. 8mm (thickness)

Number of electrodes on top side: 3600 Diameter of the electrode to be inspected on the upper surface side: 0.2 mm

Minimum pitch of electrodes to be inspected on the upper surface side: 0.4 mm

Number of electrodes on the bottom side: 2600

Diameter of the electrode to be inspected on the bottom side: 0.2 mm

Minimum pitch of electrodes to be inspected on the bottom side: 0.4 mm

(2) Pitch conversion board 23

A laminated material (made by Matsushita Electric Industrial Co., Ltd., product name: R-1766) in which a thin metal layer made of copper is formed on both sides of a 0.5mm thick insulating substrate made of glass fiber reinforced epoxy resin. In addition, a total of 7200 circular through-holes with a diameter of 0.1 mm each penetrating in the thickness direction of the laminated material were formed by a numerically controlled drilling apparatus.

[0290] In this case, the two through holes are formed as a set at a position corresponding to the electrode to be inspected on the upper surface side of the circuit board for evaluation, and the set of through holes is provided with a gap of 0.1 mm. (That is, setting the gap between the through hole A = 0. 1 mm and the through hole B = 0. 1 mm to be 0.1 mm).

Thereafter, an electroless plating treatment is performed on the laminated material in which the through-holes are formed using an EDTA type copper plating solution to form a copper plating layer on the inner wall of each through-hole, and further, a copper sulfate plating solution. By using electrolytic copper plating treatment, a cylindrical via hole having a thickness of about 10 m was formed in each through hole to electrically connect the thin metal layers on the surface of the laminated material to each other.

[0291] Next, a 25 μm thick dry film resist (Tokyo Ohka, product name: FP-225) is laminated on the thin metal layer on the surface of the laminated material to form a resist layer. A protective seal was placed on the thin metal layer on the other side. A photomask film is placed on the resist layer, and the resist layer is subjected to an exposure process using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), followed by a development process, whereby a resist pattern for etching is formed. Formed. Then, by etching the thin metal layer on the surface where the resist pattern is formed, 7200 connecting electrodes with a rectangular width of 60 / ζ πι and a height of 120 m are formed on the surface of the insulating substrate, and each connection is made. A pattern wiring portion having a line width of 100 m for electrically connecting the electrode and the via hole was formed, and then the resist pattern was removed. [0292] Next, a 25 µm thick dry film resist (product name: FP-225) was laminated on the side of the laminated material where the connection electrode and pattern wiring part were formed, and the resist layer was laminated. After forming the photomask film on the resist layer and subjecting the resist layer to an exposure process using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), a development process is performed. Then, 7200 rectangular openings of 60 m in the horizontal direction and 120 m in the vertical direction were formed to expose the respective connection electrodes.

[0293] Then, using a copper sulfate plating solution, the thin metal layer on the other side of the laminated material was used as a common electrode, and 7200 connection electrodes were obtained by subjecting each connection electrode to an electrolytic copper plating process. Formed. Next, the resist pattern was removed.

Next, the protective seal on the thin metal layer on the other side of the laminated material was removed, and a dry film resist (product name: FP-225), 25 m thick, was applied on the thin metal layer on this side. A resist layer was formed by minating. After that, a photomask film is placed on the resist layer, and the resist layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.). A resist pattern for etching was formed on the thin layer.

[0294] Next, after applying a protective seal to the surface on which the connection electrode of the laminated material was formed, and then performing an etching treatment, 7200 terminal electrodes and each terminal electrode were formed on the back surface of the insulating substrate. A pattern wiring part was formed to electrically connect the pole and the via hole, and the resist pattern was removed.

Next, an insulating layer is formed by laminating a dry film solder resist (product name: Congo Mask 2 015) with a thickness of 38 μm on the back surface of the insulating substrate on which the terminal electrode and the pattern wiring portion are formed. Then, a photomask film is placed on the insulating layer, and then the insulating layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), and then developed to expose the electrode. 7200 openings with a diameter of 0.4 mm were formed.

[0295] As described above, the pitch conversion substrate 23a for the first inspection jig 11a was produced. This pitch conversion substrate 23a has a vertical and horizontal dimension of 120mmX160mm, a thickness of 0.5mm, and the dimensional force of the exposed part of the insulating layer surface of the connection electrode 25. About 120 / ζ πι, the protruding height of the connection electrode 25 from the surface of the insulating layer is about 30 / zm, the separation distance between the connection electrodes 25 is 30 m, the diameter of the terminal electrode 24 is 0.4 mm, The arrangement pitch of the terminal electrodes 24 was 0.75 mm.

[0296] Further, in the same manner as described above, the pitch conversion substrate 23b for the second inspection jig l ib has 5200 connection electrodes 25 on the front surface and 5 200 terminal electrodes 24 on the back surface. Was made.

The pitch conversion substrate 23b has a vertical and horizontal dimension of 120mm x 160mm, a thickness of 0.5mm, and the connection electrode 25 exposed at the surface of the insulating layer is approximately 60 / zm in the horizontal direction and approximately 120m in the vertical direction. The protruding height of the surface force of the insulating layer in the connection electrode 25 is about 30 μm, the distance between the pair of connection electrodes 25 is 30 / ζ πι, the diameter of the terminal electrode 24 is 0.4 mm, the terminal electrode The 24 pitch is 0.75mm.

(3) Relay board 29

1.Manufacture of substrates

Etch the liquid crystal polymer copper-clad laminate with a thickness of 25 μm with copper foil on both sides (Nippon Chemical Engineering: Espanex LB18-25-18NEP) to remove the copper foil on both sides A liquid crystal polymer sheet having a thickness of 25 μm was obtained from Tsujiko.

[0297] On this liquid crystal polymer sheet, a metal mask for laser processing made of copper having a thickness of 18 m having an opening corresponding to the through hole to be formed was laminated, and the metal mask for laser processing was formed by a carbon dioxide gas laser processing machine. A predetermined through-hole was formed in the liquid crystal polymer sheet by irradiating laser light through the opening.

In the above, laser processing with a carbon dioxide laser device uses a carbon dioxide laser processing machine “ML-605GTX” (manufactured by Mitsubishi Electric Corporation) under the conditions of a laser beam diameter of 60 m and a laser output of 0.8 mJ. This was done by irradiating a single processing point with a laser beam for 10 shots.

[0298] The dimensions, number of through-holes, and diameter of the obtained substrate 73 are as follows.

[Substrate 73a for upper relay substrate 29a]

Dimensions: 90mm (vertical) X 90mm (horizontal) X 25m (thickness)

Number of through holes: 3600 Through-hole diameter: 0.3 mm

[Substrate 73b for lower relay substrate 29b]

Dimensions: 90mm (vertical) X 90mm (horizontal) X 25m (thickness)

Number of through holes: 2600

Through-hole diameter: 0.3mm

2. Formation of one layer of conductive elastomer

Conductive particles are dispersed by dispersing 400 parts by weight of conductive particles in which gold is coated on nickel core particles in 100 parts by weight of addition-type liquid silicone rubber (the ratio of gold to core particles is 2% by weight). An elastomeric material was prepared. This conductive elastomer material is applied to the surface of a releasable support plate 65 made of stainless steel having a thickness of 5 mm by screen printing, whereby a thickness of 0.05 mm is formed on the releasable support plate 65. A material layer 61 A for conductive elastomer was formed (FIG. 7).

Next, a releasable support plate is obtained by subjecting the conductive elastomer material layer 65 to curing at 120 ° C. for 1 hour while applying a magnetic field of 2 Tesla in the thickness direction by an electromagnet. A conductive elastomer layer 65B with a thickness of 0.05 mm supported on 65 was formed (Fig. 10).

3.Formation of conductive path forming part

A thin metal layer 66 made of copper having a thickness of 0.3 m is formed on the surface of the conductive elastomer layer 65B supported on the releasable support plate 65 by performing an electroless mesh treatment (Fig. 11). On the thin metal layer 66, a resist layer 67 having a thickness of 25 μm and having 7200 rectangular openings of 60 m in width and 120 m in length formed by a photolithographic technique (FIG. 12). ). Thereafter, an electrolytic plating process was performed on the surface of the thin metal layer 66 to form a metal mask 68 made of copper having a thickness of about 20 m in the opening of the resist layer 67 (FIG. 13). Then, in this state, the conductive elastomer layer 65B, the metal thin layer 66, and the resist layer 67 around the metal mask 68 are subjected to laser processing by a carbon dioxide gas laser device, so that the releasable support plate 65 7200 conductive path forming parts 61 supported on the upper surface are formed (FIG. 15B), and then the remaining conductive elastomer layer obtained by cutting the conductive path forming part 61 by laser processing is peeled off to form a figure. 15 As shown in (c), only the conductive path forming part 61 is releasable. It remained on the support plate 65. Thereafter, the remaining thin metal layer 66 and metal mask 68 were removed from the surface of the conductive path forming portion 61 by etching.

[0300] In the above, the laser processing by the carbon dioxide laser device uses the carbon dioxide laser processing machine “ML-605GTX” (manufactured by Mitsubishi Electric Corporation), the laser beam diameter is 60 m, and the laser output is 0.8 mJ. Under these conditions, a laser beam was irradiated for 10 shots at one processing point.

4. Formation of insulation

An additional liquid silicone rubber was applied to the surface of the releasable support plate 70 to provide a silicone rubber layer having a thickness of 15 m (FIG. 50 (a)).

[0301] A substrate 73 made of a liquid crystal polymer sheet is placed on the surface of the releasable support plate 70 via the above-mentioned silicone rubber layer (Fig. 50 (b)), and the additional liquid is placed in the through hole of the substrate 73. By applying silicone rubber, an insulating material layer 62A with a total thickness of 0.05 mm was formed (Fig. 50 (c)), and 7200 conductive paths were formed on this insulating material layer 62A. The releasable support plate 65 on which the part 61 was formed was aligned and overlapped (FIG. 51 (a)).

[0302] Then, by applying a pressure of 20 kgf to the releasable support plate 65, the thickness of the conductive path forming portion 61 is inertially compressed to 0.05 mm force and 0.04 mm, and in this state, 120 ° C The insulating part 62 is cured between the adjacent conductive path forming parts 61 by curing the insulating part material layer 62 under the condition of one hour (FIG. 51 (b)), and then the mold release property By releasing from the support plate, a relay substrate 29a for the first inspection jig 1la was manufactured (FIG. 51 (c)).

[0303] The relay board 29a for the first inspection jig 11a created in this way has a dimensional force S90mm (length) X 90mm (width) X 25 m (thickness) of the board 73a, and the conductive path forming portion 61a 7200, the dimension of the conductive path forming part 61a is 60 m wide, 120 / zm long, the thickness is about 0.05 mm, the thickness of the insulating part 62a is about 0.03 mm, and between the adjacent conductive path forming parts 61a The width of the insulating part 62a was 30 m, and the total projecting height of the conductive path forming part 61a from the insulating part 62a was about 0.02 mm.

[0304] Further, a relay board 29b for the second inspection jig l ib was produced by the same process as the relay board 29a for the first inspection jig 11a. This relay substrate 29b has a number of forces of the conductive path forming part 61b ^ 5200, a dimensional force of the conductive path forming 咅 lb S width 60 μm, length 120 μm, thickness force S about 0.05 m m, the thickness of the insulating part 62b is about 0.03 mm, the width of the insulating part 62b between the adjacent conductive path forming parts 61b is 30 m, and the protruding height of the conductive path forming part 61b from the insulating part 62b It was about 0.02 mm.

(4) Circuit board connector 21

The relay board 29 is arranged on one side of the pitch conversion board 23, and a plurality of conductive path forming parts extending in the thickness direction on the back side and insulating parts that insulate them from each other. The circuit board side connector 21 was formed by arranging a second anisotropic conductive sheet 26 made of an unevenly distributed anisotropic conductive sheet with a projecting portion protruding.

[0305] The second anisotropic conductive sheet 26 arranged between the pitch conversion board 23 and the relay pin unit 31 has the shape shown in FIG. 33, and specifically has the following configuration. The ones used were used.

[Second anisotropic conductive sheet 26]

Dimensions: 11 Omm X 150mm

Thickness of conductive path forming part: 0.6mm

Outside diameter of conductive path forming part: 0.35mm

Projection height of conductive path forming part: 0.05 mm

Elastic polymer material: Material; Silicone rubber, Hardness; 30

(5) Relay pin unit 31

[0306] The distance L1 between the first insulating plate 34 and the intermediate holding plate 36 is 36.3 mm, and the distance L2 between the second insulating plate 35 and the intermediate holding plate 36 is 3 mm. The first support pin 33 (diameter 2 mm, length 36.3 mm) and the second support pin 37 (diameter 2 mm, length 3 mm) are fixedly supported and the first insulating plate Between the pin 34 and the second insulating plate 35, the conductive pin 32 having the following constituent force is arranged in the through hole 83 (0.4 mm in diameter) so as to be movable did.

[Conductive pin]

Material: Brass plated with gold

Tip 81a dimensions: outer diameter 0.35mm, total length 2. lmm

Center part 32 dimension outer diameter 0.45mm, total length 41mm

Base end 8 lb dimensions: OD 0.35mm, total length 2. lmm

The first contact support position 38A of the first support pin 33 with respect to the intermediate holding plate 36 and the second contact support position 38B of the second support pin 37 with respect to the intermediate support plate 36 are shown in FIG. As shown, they were arranged in a grid. The distance between the first contact support positions 38A adjacent to each other and the distance between the second contact support positions 38B were set to 17.5 mm.

(6) Tester side connector 41

As shown in FIG. 46, the tester-side connector 41 includes a third anisotropic conductive sheet 42, a connector board 43, and a base plate 46. The third anisotropic conductive sheet 42 was the same as the second anisotropic conductive sheet 26 described above.

performance test

1.Minimum press pressure measurement

[0307] Then, the pressure of the rail conveyance type automatic circuit board inspection machine rSTARREC V5j is changed stepwise within the range of 100 to 210 kgf, and the evaluation circuit board 1 is repeated 10 times for each press pressure condition. For the electrodes to be inspected, the conduction resistance value was measured when a current of 1 milliampere was passed through the connection electrode for supplying current.

Inspection points with a measured conduction resistance value of 10 Ω or more (hereinafter referred to as “NG inspection points”) are judged as continuity defects, and the ratio of NG inspection points to the total inspection points (hereinafter referred to as “NG inspection point ratio”). The lowest press pressure at which the NG inspection point ratio was 0.01% or less was determined as the minimum press pressure.

[0308] In this inspection device, the NG inspection point ratio is required to be 0.01% or less for practical use. If the NG inspection point ratio exceeds 0.01%, it is a non-defective product. Inspected times Since there is a case where an erroneous inspection result that the road board is defective is obtained, there is a possibility that a highly reliable electric inspection of the circuit board cannot be performed.

In the measurement of the conduction resistance value, after the measurement of one conduction resistance value is completed, the press pressure related to the measurement is released to return the inspection device to the non-pressurized state, and the next measurement of the conduction resistance value is Again, a press pressure of a predetermined magnitude was applied.

[0309] The number of test electrodes on the upper surface of the evaluation circuit board 1 was 3600, and the number of test electrodes on the lower surface was 2600. Since the measurement was performed 10 times under each press pressure condition, the ratio of NG test points was Formula (3600 + 2600) X 10 = 62000 [62000, calculated by this, [The percentage of NG inspection points occupied].

The measurement results are shown in Table 5.

[0310] Note that "the minimum press pressure is small" means that the circuit board to be inspected can be electrically inspected with a low press pressure. If the pressurized pressure at the time of inspection can be set low, deterioration of the circuit board to be inspected, the anisotropic conductive sheet, and the substrate for pitch conversion due to the pressurized pressure at the time of inspection can be suppressed.

[0311] As a result, the durability of the inspection device can be improved and the cost of manufacturing the inspection device can be reduced.

2.Measurement of durability of relay board

An evaluation circuit board 1 prepared for the inspection device was set, and the press pressure condition of the rail transport type circuit board automatic inspection machine “STARREC V5” was set to 130 kgf, and pressurization was performed a predetermined number of times.

[0312] Then, for the electrode to be inspected on the evaluation circuit board 1, the conduction resistance value was measured 10 times when a current of 1 milliampere was applied to the inspection electrode under the condition of a press pressure of 130 kgf. The operation of measuring the conduction resistance value 10 times in the same manner under pressure was repeated. An inspection point (NG inspection point) with a measured conduction resistance value of 10 Ω or more is judged as a continuity failure. The ratio of NG inspection points to the total inspection points (NG inspection point ratio) was calculated.

[0313] Next, except that the relay board of the inspection device was replaced with a new one, and the press pressure condition was changed to 150 kgf, pressurization was performed a predetermined number of times under the same conditions as above, and NG inspection was performed using the same method as above. The point ratio was calculated.

[0314] Table 6 shows the measurement results.

3. Evaluation of insulation

In the following manner, the insulation resistance between the connecting electrodes forming a pair in the adapter integrated with the pitch conversion board 23 and the relay board 29 was evaluated.

For the evaluation of the insulation resistance between the connecting electrodes, a glass epoxy substrate having a surface of 100 mm in the vertical direction, 100 mm in the horizontal direction and 0.8 mm in thickness and having an insulating coating on the surface was used.

[0315] The created inspection apparatus was set in the inspection section of the rail transport type automatic circuit board inspection machine rSTARREC V5j, and the glass epoxy board was set on the inspection apparatus.

The press pressure of the rail conveyance type automatic circuit board inspection machine “STARREC V5” was changed stepwise within the range of 100 to 210 kgf. Then, the insulation resistance between each pair of inspection electrodes 25 provided integrally with the adapter for the first inspection jig 11a was measured 10 times for each press pressure condition.

[0316] Specifically, the conduction resistance value of the pair of test electrodes 25 was measured while applying a current of 1 milliampere through the terminal electrode 24 corresponding to the pair of connection electrodes 25.

By this method, the insulation resistance value between the paired connection electrodes 25, that is, the insulation resistance value of the insulation part 62 between the paired conductive path forming parts 61 in the relay substrate 29 was measured.

The connection electrode pair whose measured insulation resistance value was 100 Ω or more was judged as good insulation, and the ratio of points judged as good insulation with respect to the total number of inspection points (hereinafter referred to as the “insulation pass point ratio”). Was calculated.

[0317] The connection electrode 25 in the above-mentioned adapter integrated for the first inspection jig 11a has 7200 pairs of 3600 pieces, that is, 3600 connection electrode pairs exist, and each press pressure Since the measurement was performed 10 times under the conditions, the insulating passing point ratio indicates the ratio of NG inspection points to 36000 inspection points calculated by the formula (3600) X 10 = 36000

[0318] In this inspection device, it is necessary for practical use that the insulating passing score ratio is 99.9% or more. If the insulating passing score ratio is less than 99.9%, Occasionally, a leakage current flows from the connection electrode used as the current supply electrode to the connection electrode used as the voltage measurement electrode.

[0319] The evaluation results are shown in Table 7.

[Comparative Example 3]

Instead of the relay pin unit 31 of the first embodiment, conventional relay pin units 131a and 131b as shown in FIG. 62 were used. That is, a large number (8000 pins) of conductive pins 132a and 132b arranged on a lattice point at a constant pitch (2.54 mm pitch), and insulating plates 134a and 134b that support the conductive pins 132a and 132b so as to be movable up and down. The thing which has was used. Other than that, an inspection apparatus for comparison was manufactured in the same configuration as in Example 2.

[0320] With respect to the manufactured comparative inspection apparatus, the minimum press pressure and the durability of the relay substrate were measured in the same manner as in Example 2.

Table 5 shows the measurement results of the minimum press pressure, and Table 6 shows the measurement results of the durability.

[Comparative Example 4]

In the inspection apparatus of Example 2, instead of the relay substrate 29, a distributed anisotropic conductive sheet having a thickness of 100 μm was disposed between the pitch conversion substrate 23 and the evaluation circuit substrate 1.

[0321] With respect to the integrated adapter having the force for the pitch conversion substrate and the dispersed anisotropic conductive sheet in the manufactured comparative inspection apparatus, the insulation was evaluated by the method described above. Table 7 shows the results of the insulation evaluation.

[Comparative Example 5]

The dispersion-type anisotropic conductive sheet having a thickness of 100 m used in Comparative Example 4 The m was replaced with a dispersed anisotropic conductive sheet.

[0322] With respect to the produced comparative inspection apparatus, the minimum pressure was measured, the durability of the anisotropic conductive sheet was measured, and the insulation was evaluated in the same manner as in Example 2. Table 5 shows the minimum press pressure measurement results, Table 6 shows the durability measurement results, and Table 7 shows the insulation evaluation results.

In Comparative Example 4 and Comparative Example 5, the dispersed anisotropic conductive sheet used in the above was obtained as follows.

[0323] Thereafter, a defoaming treatment by reduced pressure was performed to prepare a conductive elastomer material. As the conductive particles, nickel particles were used as core particles, and the core particles were subjected to electroless gold plating (average coating amount: an amount corresponding to 5% by weight of the weight of the core particles).

[0324] The prepared conductive elastomer material is applied into the opening of the spacer, and the other polyester resin sheet is applied to the conductive elastomer material on the surface thereof. The material was placed in contact with the material for use.

[0325] Next, an electromagnet was placed on the back of each of the two polyester resin sheets, and a 0.3 T parallel magnetic field was applied to the conductive elastomer material layer in the thickness direction. A rectangular conductive elastomer sheet having a thickness of 100 m was manufactured by curing the molding material layer at 0 ° C. for 30 minutes. In the obtained conductive elastomer sheet The ratio of conductive particles in the volume fraction was 12%.

[0326] This conductive elastomer sheet was cut into 110 mm x 110 mm to obtain a dispersed anisotropic conductive elastomer sheet used in Comparative Example 2.

Also, in the above, the thickness of the spacer was changed to 40 / zm, and a dispersion type anisotropic conductive elastomer sheet having a thickness of 40 μm used in Comparative Example 3 was obtained in the same manner. .

[0327] [Table 5]

[0328] [Table 6]

[0329] [Table 7] Insulation pass grade ratio (%) Insulation evaluation Less pressure 100 110 130 150 180 210

(k _g 0

Example 2 99.9 <99.9 <99.9 <99.9 + 99.9 <99.9 <Good insulation Comparative example 4 <93 <93 <93 <93 <93 Measurement impossible Comparative example 5 98.5 98.2 97.6 96.3 96,1 95.4 Low reliability

Claims

The scope of the claims

A circuit board inspection apparatus for performing an electrical inspection by sandwiching both surfaces of a circuit board to be inspected between a pair of first inspection jig and a second inspection jig. ,

The first inspection jig and the second inspection jig are respectively

A second anisotropic conductive sheet disposed on the opposite side to the circuit board to be inspected of the pitch conversion board;

A circuit board-side connector with

A plurality of conductive pins arranged at a predetermined pitch;

«I-pin unit with

The relay pin unit is

With

The first anisotropic conductive sheet includes a plurality of conductive path forming portions extending in a thickness direction, and these The conductive path forming part is insulated from each other, and the conductive particles are contained only in the conductive path forming part, whereby the conductive particles are unevenly dispersed in the surface direction, and the sheet one side The conductive path forming part protrudes into

The first anisotropic conductive sheet constitutes a pitch conversion adapter integrated with the pitch conversion substrate and the first anisotropic conductive sheet and the pitch conversion substrate. A circuit board inspection device.

[2] The first anisotropic conductive sheet constituting the pitch conversion adapter is as follows:

An insulating material layer formed of a material that is cured to become an elastic polymer substance is formed between these conductive path forming portions, and then an insulating portion is formed by curing with The circuit board inspection device according to claim 1, wherein

[3] The integrated adapter for pitch conversion is

2. The circuit according to claim 1, wherein the circuit is obtained by removing the releasable support plate after forming the insulating portion by curing the material layer for the insulating portion in this state. Board inspection equipment.

[4] The conductive elastomer layer A conductive elastomer material layer containing conductive particles exhibiting magnetism in a liquid elastomer material that is cured to become an elastic polymer substance is formed on a releasable support plate, and the conductive elastomer A metal mask made of a metal showing magnetism is formed on the surface of the material layer according to the pattern of the conductive path forming portion to be formed,

By applying a magnetic field in the thickness direction to the conductive elastomer material layer, the conductive particles are oriented in the thickness direction, and then the magnetic field is applied or the magnetic field is stopped. 4. The circuit board inspection device according to claim 2, wherein the circuit board inspection device is obtained by curing the material layer for conductive elastomer.

[5] The at least part of the conductive path forming portions in the first anisotropic conductive sheet has a separation distance of adjacent conductive path forming portions of 50 m or less. 5. The circuit board inspection apparatus according to any one of 4 above.

6. In at least some of the conductive path forming portions in the first anisotropic conductive sheet, the distance between adjacent conductive path forming portions is 10 to 50 m. Circuit board inspection device according to claim 1.

[7] Circuit board inspection apparatus that performs electrical inspection by sandwiching both surfaces of the circuit board to be inspected between the two inspection jigs by a pair of first inspection jig and second inspection jig Because

The first inspection jig and the second inspection jig are respectively

A circuit board-side connector with A plurality of conductive pins arranged at a predetermined pitch;

«I-pin unit with

The relay pin unit is

The first abutting support position of the first support pin with respect to the intermediate holding plate and the second abutting support position of the second support pin with respect to the intermediate holding plate are in the thickness direction of the intermediate holding plate. A circuit board inspection apparatus, wherein the circuit board inspection apparatus is arranged at different positions on the projected intermediate holding plate projection surface.

The relay board is

An uncured insulating material layer made of a material that is supported on the second releasable support plate and cured to become an elastic polymer substance is formed on both side surfaces of the substrate and inside the through holes. In addition, the first releasable support plate on which the conductive path forming portion is formed is superimposed on the substrate so that the conductive path forming portion is located in the through hole of the substrate. It is obtained by removing the first and second releasable support plates after forming the insulating part by curing the material layer The circuit board inspection apparatus according to claim 7.

[9] The conductive elastomer layer comprises

By applying a magnetic field in the thickness direction to the conductive elastomer material layer, the conductive particles are oriented in the thickness direction, and then the magnetic field is applied or the magnetic field is stopped. 9. The circuit board inspection apparatus according to claim 8, wherein the circuit board inspection apparatus is obtained by curing the material layer for conductive elastomer.

[10] The method according to any one of claims 7 to 9, wherein in at least some of the conductive path forming portions of the relay substrate, a distance between adjacent conductive path forming portions is 50 μm or less. The circuit board inspection apparatus as described.

[11] The circuit board inspection according to [10], wherein in at least a part of the conductive path forming portions of the relay substrate, a distance between adjacent conductive path forming portions is 10 to 50 μm. apparatus.

[12] The first anisotropic conductive sheet in which the conductive particles are arranged in the thickness direction and uniformly dispersed in the plane direction is arranged on one side or both sides of the relay substrate. The circuit board inspection apparatus according to claim 7, wherein the circuit board inspection apparatus is misaligned.

[13] When the both sides of the circuit board to be inspected are clamped between the two inspection jigs by the pair of the first inspection jig and the second inspection jig,

Centering on the first abutting support position of the first support pin with respect to the intermediate holding plate, the intermediate holding plate is sandwiched in the direction of the second insulating plate, and

13. The intermediate holding plate is sandwiched in the direction of the first insulating plate, with the second contact support position of the second support pin with respect to the intermediate holding plate as a center. of

V, inspection device for circuit boards as described in the gap.

[14] The first contact support position of the first support pin with respect to the intermediate holding plate is arranged in a grid pattern on the intermediate holding plate projection surface, Second contact support positions of the second support pins with respect to the intermediate holding plate are arranged in a grid pattern on the intermediate holding plate projection surface,

The one first abutment support position is arranged in a unit lattice region having four adjacent second abutment support position forces on the intermediate holding plate projection surface. The circuit board inspection apparatus according to any one of 1 to 13.

[15] The relay pin unit is

With

At least one of the intermediate holding plates is in contact with the intermediate holding plate from one surface side. The holding support position of the holding plate support pin with respect to the intermediate holding plate, and the second contact surface with respect to the intermediate holding plate from the other surface side. Positions at which the support pin 1, the second support pin, or the holding plate support pin abuts on the intermediate holding plate are different on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate. 13. The circuit board inspection device according to claim 1, wherein the circuit board inspection device is disposed in a gap.

[16] In all the intermediate holding plates, the holding plate supporting pins that come into contact with the intermediate holding plate on the one surface side with respect to the intermediate holding plate, and the other surface side with respect to the intermediate holding plate The contact position of the first support pin, the second support pin, or the holding plate support pin with which the force abuts against the intermediate holding plate is projected on the intermediate holding plate projection surface in the thickness direction of the intermediate holding plate. 16. The circuit board inspection apparatus according to claim 15, wherein the circuit board inspection apparatus is arranged at different positions.

[17] The second anisotropic conductive sheet includes a plurality of conductive path forming portions extending in a thickness direction and insulating portions that insulate these conductive path forming portions from each other, and the conductive particles are formed as conductive path forming portions. The conductive path forming portion protrudes on one side of the sheet, and the conductive particles are dispersed non-uniformly in the plane direction due to being contained only in the inside. The circuit board inspection device according to any one of the above.

[18] The third anisotropic conductive sheet includes a plurality of conductive path forming portions extending in a thickness direction and insulating portions that insulate these conductive path forming portions from each other, and the conductive particles are formed as conductive path forming portions. The conductive path forming portion protrudes on one side of the sheet, and the conductive particles are unevenly dispersed in the surface direction due to being contained only in the inside. Circuit board inspection device according to claim 1.

[19] The plurality of conductive pins are formed in a bar-shaped central portion that is shorter than the distance between the first insulating plate and the second insulating plate, and on both ends of the central portion, and are formed on the both sides of the central portion. It consists of a pair of ends with a small diameter,

Each of the pair of end portions passes through a through-hole having a diameter larger than that of the central portion formed in the first insulating plate and the second insulating plate and larger than that of the pair of end portions. 19. The circuit board inspection apparatus according to claim 1, wherein the conductive pin is supported so as to be movable in an axial direction.

[20] A through-hole through which the conductive pin is inserted between the first insulating plate and the intermediate holding plate, between the second insulating plate and the intermediate holding plate, or between the intermediate holding plates. A bent holding plate with holes is provided,

The plurality of conductive pins are laterally pressed in opposite directions from each other around a through hole formed in the first and second insulating plates and a through hole formed in the bent holding plate. 19. The circuit board inspection apparatus according to claim 1, wherein the circuit board inspection device is bent at a position of a through hole of the holding plate, whereby the conductive pin is supported so as to be movable in the axial direction.

[21] A circuit board inspection method using the circuit board inspection apparatus according to any one of claims 1 to 20,

A circuit board comprising: a pair of a first inspection jig and a second inspection jig, wherein both sides of the circuit board to be inspected are sandwiched between the inspection jigs to perform an electrical inspection. Inspection method.