JP2006053138A - Device and method for inspection of circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and method for inspection of a circuit board capable of performing a highly reliable inspection even for the objective circuit board having electrodes with minute pitch. <P>SOLUTION: The inspection device is constituted as follows: a relay pin unit is provided with an intermediate retaining plate 36, a first support pin 33 arranged between a first insulation plate 34 and the intermediate retaining pin 36, and a second support pin 37 arranged between a second insulation plate 35 and the intermediate retaining plate 36; a first abutting support position of the first support pin 33 to the intermediate retaining plate 36, and the second abutting support position of the second support pin 37 to the intermediate retaining plate 36 are projected in a thickness direction of the intermediate retaining plate 36 on the projection surface of the intermediate retaining plate and arranged at the differen positions; and the relay board 29 is provided for relaying the electric connection of the pitch conversion board 23 and the inspection circuit board 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  According to the present invention, a circuit board (hereinafter referred to as “circuit board to be inspected”) to be inspected for electrical inspection is clamped from both sides by a pair of first inspection jig and second inspection jig. The present invention relates to a circuit board inspection apparatus and a circuit board inspection method for inspecting the electrical characteristics of a circuit board to be inspected in a state where electrodes formed on both surfaces of the circuit board to be inspected are electrically connected to a tester.

  A printed circuit board for mounting an integrated circuit or the like is inspected for electrical characteristics in order to confirm that the wiring pattern of the circuit board has a predetermined performance before mounting the integrated circuit or the like.

In this electrical inspection, for example, an inspection head is incorporated into an inspection tester having a circuit board transport mechanism, and different circuit boards are inspected by exchanging the inspection head portion.
For example, as disclosed in Patent Document 1, a method using an inspection jig having a structure in which a metal inspection pin that is in electrical contact with an inspection target electrode of a circuit board to be inspected is implanted on the substrate is proposed. ing.

  In addition, as disclosed in Patent Document 2, there is a method using an inspection jig in which an inspection head having a conductive pin, a circuit board for pitch conversion called an off-grid adapter, and an anisotropic conductive sheet are combined. Are known.

  However, in the method using an inspection jig in which a metal inspection pin is brought into direct contact with an inspected electrode of a circuit board to be inspected as in Patent Document 1, the electrode of the inspected circuit board is damaged by contact with a conductive pin made of metal. there's a possibility that.

  In particular, in recent years, circuit circuit boards have been miniaturized and densified, and when inspecting such a printed circuit board, in order to bring a large number of conductive pins into conductive contact simultaneously with the electrodes to be inspected of the circuit board to be inspected. It is necessary to press the inspection jig with a high pressure, and the electrode to be inspected is easily damaged.

  In such an inspection jig for inspecting a miniaturized and high-density printed circuit board, it is becoming technically difficult to implant a large number of high-density metal pins on the board. In addition, the manufacturing cost is expensive, and it is difficult to repair or replace some of the metal pins when they are damaged.

  On the other hand, as in Patent Document 2, in an inspection jig using an anisotropic conductive sheet, the electrode to be inspected of the circuit board to be inspected is in contact with the electrode of the substrate for pitch conversion through the anisotropic conductive sheet. Therefore, there is an advantage that the electrode to be inspected of the circuit board to be inspected is hardly damaged. In addition, since a substrate that performs pitch conversion is used, inspection pins to be implanted on the substrate can be implanted at a pitch wider than the pitch of the electrode to be inspected on the circuit substrate to be inspected, so that inspection is performed at a fine pitch. There is an advantage that the manufacturing cost of the inspection jig can be saved without having to plant pins.

  However, in this inspection jig, since it is necessary to create a pitch conversion board and an inspection jig in which an inspection pin is implanted for each circuit board to be inspected, the circuit board to be inspected The same number of inspection jigs as the printed circuit board is required.

For this reason, in the case where a plurality of printed circuit boards are produced, there is a problem that a plurality of inspection jigs must be held correspondingly. In particular, in recent years, the product cycle of electronic devices has been shortened, and the production period of printed circuit boards used in products has been shortened. With this, inspection jigs cannot be used for a long time, There is a problem that an inspection jig must be produced each time the production of a printed circuit board is switched.

As a countermeasure against such a problem, for example, as in Patent Documents 3 to 5, an inspection apparatus using a so-called universal type inspection jig using a relay pin unit has been proposed.
FIG. 42 is a cross-sectional view of an inspection apparatus using such a universal type inspection jig. The inspection apparatus includes a pair of a first inspection jig 111a and a second inspection jig 111b, which include circuit board side connectors 121a and 121b, relay pin units 131a and 131b, Tester side connectors 141a and 141b are provided.

  The circuit board side connectors 121a and 121b have pitch conversion boards 123a and 123b and anisotropic conductive sheets 122a, 122b, 126a and 126b arranged on both sides thereof.

  The relay pin units 131a and 131b have a large number of conductive pins 132a and 132b (for example, 5000 pins) arranged on lattice points at a constant pitch (for example, 2.54 mm pitch), and the conductive pins 132a and 132b can be moved up and down. It has a pair of insulating plates 134a and 134b to support.

  The tester-side connectors 141a and 141b include connector boards 143a and 143b that electrically connect the tester and the conductive pins 132a and 132b when the circuit board 101 to be inspected is clamped by the inspection jigs 111a and 111b. 143a, 143b has anisotropic conductive sheets 142a, 142b disposed on the conductive pins 132a, 132b side, and base plates 146a, 146b.

  The inspection jig using the relay pin unit only needs to replace the circuit board side connectors 121a and 121b with those corresponding to the circuit board 101 to be inspected when inspecting a printed circuit board which is a different object to be inspected. The relay pin units 131a and 131b and the tester side connectors 141a and 141b can be used in common.

  By the way, the printed wiring board which is the circuit board 101 to be inspected has been multi-layered and densified. Actually, in the thickness direction, for example, the height variation due to the inspected electrodes 102 and 103 such as solder ball electrodes such as BGA, The substrate itself is warped. Therefore, in order to achieve electrical connection to the electrodes 102 and 103 to be inspected, which are inspection points on the circuit board 101 to be inspected, the first inspection jig 111a and the second inspection jig 111b are moved at a high pressure. It is necessary to deform the circuit board 101 to be inspected flatly by applying pressure. In addition, for the height variations of the electrodes 102 and 103 to be inspected, it is necessary to follow the heights of the electrodes 102 and 103 to be inspected by the first inspection jig 111a and the second inspection jig 111b.

  In such a conventional universal type inspection jig, in order to ensure followability with respect to the height of the electrodes 102 and 103 to be inspected, the conductive pins 132a and 132b are followed by movement in the axial direction. Since the amount of movement in the axial direction of 132a and 132b is also limited, the following ability to the height of the electrodes 102 and 103 to be inspected may not be good, and a continuity failure occurs and accurate inspection cannot be performed. Become.

Further, in such a universal type inspection jig, the press pressure when the circuit board 101 to be inspected is clamped by the first inspection jig 111a and the second inspection jig 111b is different in the upper and lower directions. Conductive sheets 122a, 122b, 126a, 126b, 142a, 142b
It absorbs at.

  Therefore, in such a universal type inspection jig, it is necessary to arrange the conductive pins 132a and 132b at regular intervals in order to support the pitch conversion substrates 123a and 123b and disperse the press pressure.

  Further, in the conventional universal type inspection jig, the press pressure is received by the conductive pins 132a and 132b, so that it is necessary to arrange a large number of conductive pins 132a and 132b at regular intervals.

  For this reason, in response to the miniaturization of the electrodes of the circuit board 101 to be inspected, for example, when forming the insulating plates 134a and 134b having 10,000 or more through holes at a pitch of 0.75 mm, the substrates of the insulating plates 134a and 134b If the thickness of the insulating plate 134 is thin, the strength becomes low, and it may crack when bent. Therefore, it is necessary to make the insulating plates 134a and 134b thicker.

  However, when the diameter of the through hole to be formed becomes as fine as, for example, about 0.5 mm, and the thickness of the insulating plates 134a and 134b is 5 mm or more, when trying to form the through hole by one drilling process, Due to the strength of the drill blade, there are many cases where the drill blade is broken or broken and fails to process the insulating plate.

  For this reason, the insulating plate is processed by drilling from one side of the insulating plate to about half the thickness, and further forming the through hole by drilling the same part from the other side. There is a problem that a drilling operation twice as many as the number of through holes formed in the insulating plate is required, and the processing step becomes complicated.

  Further, in such a conventional universal type inspection jig, as the anisotropic conductive sheets 122a and 122b constituting the circuit board side connector, a plurality of conductive path forming portions extending in the thickness direction and these conductive path forming portions are mutually connected. An unevenly anisotropic anisotropic conductive sheet comprising an insulating part that insulates, in which conductive particles are contained only in the conductive path forming part and are dispersed unevenly in the plane direction, and the conductive path forming part protrudes on one side of the sheet Was used. This anisotropic conductive sheet deteriorates the resistance of the conductive path due to repeated use in inspection (increases in resistance value), and when replacing the anisotropic conductive sheet, the anisotropic conductive sheet and pitch conversion each time it is replaced Alignment with the substrate and alignment between the circuit board side connector and the relay pin unit are necessary, and this alignment operation is complicated and causes a reduction in inspection efficiency.

  Further, when the electrodes of the circuit board to be inspected have a minute pitch of, for example, 200 μm or less, when the inspection is continuously performed on a plurality of circuit boards to be inspected using the anisotropic conductive sheet as described above, Repeated contact with the inspection circuit board tends to cause misalignment of the anisotropic conductive sheet. Then, the conductive path forming part of the anisotropic conductive sheet and the electrode position of the circuit board to be inspected do not coincide with each other, and an excellent electrical connection cannot be obtained. The printed circuit board to be misidentified as a defective product tends to be erroneously determined.

  Conventionally, in order to solve such a problem, a terminal electrode having a connection electrode arranged on a surface according to a pattern corresponding to an electrode to be inspected on a circuit board to be inspected and arranged on a back surface according to a grid point position There has been proposed an adapter device composed of a pitch conversion substrate having an anisotropic conductive elastomer sheet integrally provided on the surface of the pitch conversion substrate (Patent Document 6 and Patent Document 7).

According to such an adapter device, in the electrical inspection of the circuit board, it is not necessary to align the anisotropic conductive elastomer sheet, and it is also good against environmental changes such as thermal history due to temperature changes. The electrical connection state is maintained stably, and thus high connection reliability is obtained.

  However, as shown in FIG. 43, when the pitch P1 between the electrodes to be inspected 102 (103) is 100 μm or less, the separation distance S1 between the electrodes to be inspected 102 (103) is 50 μm or less. . Therefore, as shown in FIG. 44, the separation distance between the connection electrodes 125 of the pitch conversion substrate 123 also needs to be 50 μm or less, as is the separation distance S1 between the electrodes to be inspected 102 (103). is there.

  Accordingly, the width of the insulating portions that insulate the conductive path forming portions of the anisotropic conductive sheet 122 from each other is also set to 50 μm or less, similarly to the separation distance S1 between the electrodes to be inspected 102 (103). There is a need.

  However, when obtaining an unevenly distributed anisotropic conductive elastomer sheet for inspecting a circuit board in which the electrodes to be inspected are arranged at a narrow pitch such that the distance between the electrodes to be inspected is 100 μm or less, as described above. In the conventional method of manufacturing a sheet by molding, it is necessary to form an insulating portion that insulates adjacent conductive path forming portions from each other. It is difficult to form an insulating portion of 50 μm or less due to the magnetic field action.

  For this reason, in the uneven distribution type anisotropically conductive elastomer sheet by this conventional manufacturing method, although it depends on the thickness of the sheet, the lower limit for the inspection of the distance between the electrodes of the circuit board is about 60 to 80 μm.

  For this reason, the unevenly anisotropic anisotropic conductive elastomer sheet for inspecting a circuit board in which the inspected electrode separation distance is 50 μm or less and the inspected electrodes are arranged at a small pitch can be formed by a mold method. Since it is extremely difficult, it is not practically obtained.

  Also, as an adapter device, after forming a conductive elastomer layer on the surface of the pitch conversion substrate, each part of the pitch conversion substrate is connected by removing a part of the conductive elastomer layer by laser processing. There has been proposed one in which conductive path forming portions independent from each other are formed on a working electrode (Patent Document 8).

According to such an adapter device, since each of the conductive path forming portions is formed in an independent state, the required insulation can be reliably obtained between the adjacent conductive path forming portions.
However, in this adapter device, since each of the conductive path forming portions is supported only by the connection electrodes of the pitch conversion board, there is a problem in that the adapter path easily drops off from the pitch conversion board and has low durability.

Further, when the conductive path forming portion is formed, there is a problem that the pitch conversion substrate may be damaged by laser processing.
On the other hand, in a so-called dispersive anisotropic conductive elastomer sheet in which conductive particles are arranged in the thickness direction and uniformly dispersed in the plane direction, high resolution can be obtained by reducing the thickness. By setting the distance to about 30 μm, it is possible to inspect a circuit board having a separation distance of electrodes to be inspected of 50 μm or less as its resolution.

However, in the thin dispersion type anisotropic conductive elastomer sheet whose thickness is about 30 μm, one of the characteristics of the anisotropic conductive elastomer sheet is the ability to absorb mechanical shock due to the elasticity of the sheet body, Since the ability to achieve electrical connection by soft contact between electrodes is almost lost, anisotropic conductivity is required when connecting a circuit board to be inspected that has many electrodes to be inspected, including variations in height. It is difficult to connect a large number of electrodes to be inspected at the same time due to the lowering of the leveling ability of the elastomer sheet.

  For example, in a circuit board on which a large number of electrodes are formed by plating, the height variation of each electrode is about 20 μm. The dispersion type anisotropic conductive elastomer sheet has a compression ratio of about 20% or less that can stably achieve electrical conduction when compressed in the thickness direction. For example, if the compression exceeds 20%, the electrical conduction in the lateral direction is increased and the anisotropy of conduction is impaired, and permanent deformation of the elastomer as the base material occurs, making repeated use difficult. For this reason, when inspecting a circuit board having an electrode including a height variation of about 20 μm, it is necessary to use a dispersed anisotropic conductive elastomer sheet having a thickness of 100 μm or more.

  However, when a dispersed anisotropic conductive elastomer sheet having a thickness of 100 μm or more is used, it is substantially impossible to inspect a circuit board in which electrodes to be inspected are arranged at a small pitch of 50 μm or less because resolution is impaired. There was a problem that would be possible.

  Furthermore, the dispersion-type anisotropic conductive elastomer sheet with a small thickness has a low ability to absorb mechanical shock because the elasticity of the sheet body is low, and when a circuit board is repeatedly inspected using an adapter for circuit board inspection. The anisotropic conductive elastomer sheet is rapidly deteriorated, and therefore, the dispersed anisotropic conductive elastomer sheet must be frequently replaced. Therefore, the replacement work becomes complicated and the inspection efficiency of the circuit board is lowered.

  From the above, the circuit board inspection adapter using the anisotropic conductive elastomer sheet for inspecting the circuit board in which the electrodes to be inspected are arranged at a small pitch of 50 μm or less, the resolution, the step absorption capacity, the repeated use A product satisfying all the durability was not obtained.

  As shown in FIG. 44, when the pitch P1 between the electrodes to be inspected 102 (103) is 100 μm, the separation distance between the connection electrodes 125 of the pitch conversion substrate 123 is the inspected electrode 102 (103). Similarly to the separation distance S1 between them, it may be 50 μm. However, when performing a four-terminal inspection in order to detect a potential electrical defect of a circuit board with high accuracy, as shown in FIG. 45, one of the electrodes 102 (103) to be inspected on the circuit board to be inspected. On the other hand, the two electrodes (the current supply electrode 127 and the voltage measurement electrode 128) of the pitch conversion substrate 123 are connected.

  Therefore, the separation distance S2 between the current supply electrode 127 and the voltage measurement electrode 128 on the pitch conversion substrate 123 is further reduced. For example, when the pitch P1 between the electrodes to be inspected 102 (103) of the pitch conversion substrate 123 is 200 μm, the diameter R of the electrodes to be inspected 102 (103) is about 100 μm, and the electrodes to be inspected 102 (103 having a diameter of about 100 μm are formed. ), The current supply electrode 127 and the voltage measurement electrode 128 on the pitch conversion substrate 123 are connected together, so that the separation distance S2 between the current supply electrode 127 and the voltage measurement electrode 128 is as shown in FIG. As shown in FIG. 45, only about 30 to 40 μm can be provided.

  However, as described above, conventionally, when any of the unevenly distributed anisotropic conductive elastomer sheet and the dispersed anisotropic conductive elastomer sheet is used, the separation distance S2 of the connection electrodes on the pitch conversion substrate is 30. At present, no adapter device having a diameter of ˜40 μm has been obtained.

As described above, in a conventional circuit board inspection apparatus using an unevenly distributed anisotropic conductive sheet or a distributed anisotropic conductive sheet, the resolution required when inspecting a circuit board having a large number of electrodes to be inspected. In terms of step absorbability, cushioning properties and durability, no satisfactory performance was obtained in all of them.
JP-A-6-94768 Japanese Patent Laid-Open No. 5-159821 JP 7-248350 A Japanese Patent Application Laid-Open No. 8-271469 JP-A-8-338858 JP-A-4-151564 JP-A-6-82531 Japanese Patent Laid-Open No. 10-229270

  The present invention relates to a circuit board inspection apparatus and circuit board capable of performing a highly reliable electrical inspection of a circuit board even if the circuit board to be inspected has microelectrodes with a fine pitch. The purpose is to provide an inspection method.

  In addition, the present invention is a circuit board inspection that has good followability to the height variation of the inspection target electrode of the circuit board to be inspected, does not cause poor conduction, and can perform an accurate inspection. It is an object of the present invention to provide an apparatus and a circuit board inspection method.

  In addition, the present invention does not require the conductive pins to be arranged at regular intervals. Therefore, there is little drilling work by drilling through holes in the insulating plate holding the conductive pins, and the circuit can reduce costs. It is an object of the present invention to provide a substrate inspection apparatus and a circuit board inspection method.

  In addition, the present invention can inspect with high resolution, absorbs a step due to the inspected electrode of the circuit board to be inspected, and also has excellent repeated use durability and circuit board inspection apparatus and circuit board inspection It aims to provide a method.

The circuit board inspection apparatus of the present invention performs electrical inspection by sandwiching both surfaces of the circuit board to be inspected between the two inspection jigs by a pair of first inspection jig and second inspection jig. A circuit board inspection apparatus for performing
The first inspection jig and the second inspection jig are respectively
A pitch conversion substrate that converts the electrode pitch between one surface side and the other surface side of the substrate;
An insulating part made of an elastic polymer material and an insulating material made of an elastic polymer material containing conductive particles in a plurality of through holes formed in the substrate, which are arranged on the circuit board side to be inspected of the pitch conversion substrate. A relay board that relays the electrical connection between the substrate for pitch conversion and the circuit board to be inspected by the conductive path forming part formed with a conductive path forming part penetrating the part in the thickness direction;
A second anisotropic conductive sheet disposed on the opposite side of the pitch conversion substrate from the relay substrate;
A circuit board-side connector with
A plurality of conductive pins arranged at a predetermined pitch;
A pair of spaced apart first and second insulating plates for supporting the conductive pins movably in the axial direction;
A relay pin unit with
A connector board for electrically connecting the tester and the relay pin unit;
A third anisotropic conductive sheet disposed on the relay pin unit side of the connector board;
A base plate disposed on the side opposite to the relay pin unit of the connector board;
A tester-side connector with
The relay pin unit is
An intermediate holding plate disposed between the first insulating plate and the second insulating plate;
A first support pin disposed between the first insulating plate and the intermediate holding plate;
A second support pin disposed between the second insulating plate and the intermediate holding plate;
With
A first abutment support position of the first support pin with respect to the intermediate holding plate and a second abutment support position of the second support pin with respect to the intermediate holding plate are projected in the thickness direction of the intermediate holding plate. The intermediate holding plate is disposed at different positions on the projection plane.

  With this configuration, when electrical inspection is performed by sandwiching both surfaces of the circuit board to be inspected between the first inspection jig and the second inspection jig, initial pressure is applied. In the stage, the pressure is applied by rubber elastic compression of the relay pin unit in the thickness direction by the conductive pins, the elastic portion of the relay board, the second anisotropic conductive sheet, and the third anisotropic conductive sheet. It is possible to absorb to some extent the height variation of the electrodes to be inspected of the circuit board to be inspected.

  The first contact support position of the first support pin with respect to the intermediate holding plate and the second contact support position of the second support pin with respect to the intermediate support plate are in the thickness direction of the intermediate support plate. Since it is arranged at different positions on the projected intermediate holding plate projection surface, when the circuit board to be inspected is further pressurized between the first inspection jig and the second inspection jig, In addition to elastic elastic compression of the relay board, the second anisotropic conductive sheet, and the third anisotropic conductive sheet, the first insulating plate of the relay pin unit, the second insulating plate, Due to the spring elasticity of the intermediate holding plate disposed between the first insulating plate and the second insulating plate, the height variation of the inspected electrode of the circuit board to be inspected, for example, the height variation of the solder ball electrode, The pressure concentration can be distributed to avoid local stress concentration.

  As a result, stable electrical contact is ensured for each of the electrodes to be inspected on the circuit board to be inspected having a height variation, and further, stress concentration is reduced. Damage is suppressed. As a result, since the repeated use durability of the relay board is improved, the number of times of replacement of the relay board is reduced, and the inspection work efficiency is improved.

Moreover, since there is no need to arrange the conductive pins at regular intervals, there is little drilling work by drilling through holes in the insulating plate holding the conductive pins, and the cost can be reduced.
Further, in the present invention, since the relay board provided with each of the plurality of through holes formed in the board by the elastic portion composed of the conductive path forming part and the surrounding insulating part is arranged, the pressing of the inspection jig The pressing force and impact due to the are absorbed by this elastic portion, and the electrodes of the circuit board to be inspected are not damaged or damaged.

  Furthermore, regardless of the arrangement pattern of the electrodes to be inspected on the circuit board to be inspected, the required electrical inspection can be reliably performed on the circuit board to be inspected. Even if the pitch is very small and densely arranged, the required electrical inspection can be reliably performed on the circuit board to be inspected.

In the circuit board inspection apparatus according to the present invention, the relay board includes:
By conducting laser processing on the conductive elastomer layer supported on the first releasable support plate and dispersed in the elastic polymer material in a state where the conductive particles exhibiting magnetism are oriented in the thickness direction, first processing is performed. Forming a conductive path forming portion arranged according to a predetermined pattern on the releasable support plate of
An uncured insulating material layer made of a material that is supported on the second releasable support plate and cured to become an elastic polymer substance is formed on both side surfaces of the substrate and inside the through-hole. Overlying the substrate, the first releasable support plate on which the conductive path forming portion is formed so that the conductive path forming portion is located in the through hole of the substrate,
In this state, the insulating part material layer is cured to form an insulating part, and then the first and second releasable support plates are removed to obtain the insulating part.

Thus, since the conductive path forming portion is formed by laser processing the conductive elastomer layer, the conductive path forming portion has the desired good conductivity.
Also, a plurality of conductive path forming portions arranged in accordance with a predetermined pattern are formed, and an insulating portion material layer made of a material that is cured and becomes an elastic polymer substance is formed between the conductive path forming portions. Since the insulating part is formed by the curing process, no conductive particles are present in the insulating part.

In addition, it is not necessary to use a mold in which a large number of ferromagnetic parts used to manufacture a conventional anisotropic conductive sheet are arranged.
Therefore, regardless of the arrangement pattern of the electrodes to be inspected on the circuit board to be inspected to be connected, the required electrical connection is reliably achieved for each of the electrodes. Further, even when the electrodes to be connected are arranged with a small pitch and a high density, the required electrical connection is reliably achieved for each of the electrodes. Moreover, the relay board can be manufactured at a low cost.

  Furthermore, since the anisotropic conductive sheet is not manufactured by conventional mold molding, there is no influence of the magnetic field action between adjacent mold magnetic poles, and the distance between the conductive path forming parts is small. For example, the conductive path forming part An insulating part having a width of 50 μm or less is obtained.

Therefore, it is possible to inspect a circuit board to be inspected in which the electrodes to be inspected are 50 μm or less and the electrodes to be inspected are arranged at a small pitch.
Furthermore, when performing a four-terminal inspection, two inspection electrodes (for voltage and current) of the pitch conversion substrate are connected to one inspection electrode of the circuit substrate to be inspected. Although the separation distance is reduced, even in such a case, since the relay substrate having the sufficiently small separation distance of the conductive path forming portion is provided, the electrical inspection can be surely performed.

In the circuit board inspection apparatus of the present invention, the conductive elastomer layer is
On the releasable support plate, a conductive elastomer material layer containing conductive particles exhibiting magnetism in a liquid elastomer material that is cured to become an elastic polymer substance is formed,
According to the pattern of the conductive path forming portion to be formed on the surface of the material layer for the conductive elastomer, a metal mask made of a metal exhibiting magnetism is formed,
By applying a magnetic field in the thickness direction to the conductive elastomer material layer, the conductive particles are oriented in the thickness direction, and then the conductive material is applied in a state where the magnetic field is applied or in a state where the magnetic field is stopped. It is obtained by carrying out the hardening process of the material layer for an elastic elastomer.

  In this way, by applying a magnetic field to the conductive elastomer material layer in the thickness direction using a metal mask made of a metal exhibiting magnetism, the dispersed conductive particles are concentrated on the metal mask portion. Oriented in the thickness direction in the state.

  Thereby, the density of the electroconductive particle of the part in which the metal mask in the material layer for electroconductive elastomer is not formed becomes small. Therefore, the formation of the conductive path forming portion by laser processing becomes easy. Furthermore, since the laser processing of the thick conductive elastomer layer is facilitated, a thick conductive path forming portion can be obtained with certainty.

  The inspection apparatus of the present invention using the relay substrate obtained by such a manufacturing method makes a necessary electrical connection to each of the electrodes regardless of the arrangement pattern of the electrodes to be inspected of the circuit board to be inspected. Can be achieved reliably. Further, even when the electrodes to be connected are arranged with a small pitch and a high density, the required electrical connection can be reliably achieved for each of the electrodes.

  In the inspection apparatus of the present invention described above, in at least some of the conductive path forming portions of the relay substrate, the distance between the adjacent conductive path forming portions is preferably 50 μm or less, more preferably 10 to 50 μm. .

By doing so, it is possible to inspect a circuit board to be inspected in which the electrodes to be inspected are 50 μm or less and in which the electrodes to be inspected are arranged at a fine pitch.
Furthermore, when performing a four-terminal inspection, since two inspection electrodes (for voltage and current) of the pitch conversion substrate are connected to one inspection electrode of the circuit substrate to be inspected, the separation distance between the inspection electrodes However, even in such a case, the electrical inspection can be surely performed.

A first anisotropic conductive sheet in which conductive particles are arranged in the thickness direction and uniformly dispersed in the plane direction may be disposed on one side or both sides of the relay substrate.
The circuit board inspection apparatus according to the present invention includes:
When the both sides of the circuit board to be inspected are clamped between the two inspection jigs by the pair of the first inspection jig and the second inspection jig,
The intermediate holding plate bends in the direction of the second insulating plate around the first contact support position of the first support pin with respect to the intermediate holding plate, and
The intermediate holding plate bends in the direction of the first insulating plate around the second contact support position of the second support pin with respect to the intermediate holding plate.

  By configuring in this way, the intermediate holding plate bends in opposite directions with the first contact support position and the second contact support position as the center, so the first inspection jig and the second inspection plate When the circuit board to be inspected is further pressed between the inspection jigs, the spring elastic force of the intermediate holding plate is further exerted, and the height of the electrode to be inspected of the circuit board to be inspected With respect to the variation, the pressure concentration can be dispersed to avoid the local stress concentration, and the local breakage of the elastic portion of the relay board is suppressed. As a result, since the repeated use durability of the relay board is improved, the number of times of replacement of the relay board is reduced, and the inspection work efficiency is improved.

In the circuit board inspection apparatus of the present invention, the first contact support positions of the first support pins with respect to the intermediate holding plate are arranged in a grid pattern on the intermediate holding plate projection surface,
Second contact support positions of the second support pins with respect to the intermediate holding plate are arranged in a grid pattern on the intermediate holding plate projection surface,
In the intermediate holding plate projection surface, one second abutment support position is disposed in a unit lattice region composed of four adjacent first abutment support positions, and
In the intermediate holding plate projection surface, one first abutment support position is arranged in a unit cell region composed of four adjacent second abutment support positions.

  With this configuration, the first abutment support position and the second abutment support position are arranged in a grid pattern, and the grid points of the first abutment support position and the second abutment support position are arranged. The positions are all arranged at positions shifted.

  Accordingly, the intermediate holding plate bends in opposite directions around the first contact support position and the second contact support position, and the first inspection jig and the second inspection jig. When the circuit board to be inspected is pressed between the two, the spring elastic force of the intermediate holding plate is further exerted, and the pressure against the height variation of the electrode to be inspected of the circuit board to be inspected The concentration can be distributed to further avoid local stress concentrations. Therefore, local breakage of the elastic portion of the relay board is suppressed, and as a result, the repeated use durability of the anisotropic conductive sheet is improved, so that the number of times of replacement of the relay board is reduced and the inspection work efficiency is improved.

In the circuit board inspection apparatus of the present invention, the relay pin unit is
A plurality of intermediate holding plates disposed at a predetermined interval between the first insulating plate and the second insulating plate;
Holding plate support pins arranged between adjacent intermediate holding plates;
With
In at least one intermediate holding plate, a holding support position of the holding plate support pin that contacts the intermediate holding plate from one surface side with respect to the intermediate holding plate, and a first surface that contacts the intermediate holding plate from the other surface side. The support support position of the first support pin, the second support pin, or the holding plate support pin with respect to the intermediate holding plate is arranged at a different position on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate. It is characterized by being.

  With this configuration, the spring elasticity is further exhibited by the plurality of intermediate holding plates, and the pressure concentration is dispersed with respect to the height variation of the inspected electrode of the inspected circuit board. Local stress concentration can be further avoided, and local breakage of the elastic portion of the relay board is suppressed. As a result, since the repeated use durability of the relay board is improved, the number of times of replacement of the relay board is reduced, and the inspection work efficiency is improved.

  Further, the circuit board inspection apparatus according to the present invention includes a contact support position of the support plate support pin that contacts the intermediate support plate from one surface side with respect to the intermediate support plate, and the intermediate support plate. A contact support position of the first support pin, the second support pin, or the holding plate support pin that contacts the holding plate from the other surface side with respect to the intermediate holding plate is in the thickness direction of the intermediate holding plate. It is arranged at different positions on the projected intermediate holding plate projection surface.

  As a result, the abutting support position of the holding plate support pin with the intermediate holding plate is shifted between the adjacent intermediate holding plates, so that the spring elasticity of the plurality of intermediate holding plates is further exhibited. As a result, the pressure concentration can be dispersed with respect to the height variation of the inspected electrode of the circuit board to be inspected, and the local stress concentration can be further avoided, and the elastic portion of the relay substrate is locally damaged. It is suppressed. As a result, since the repeated use durability of the relay board is improved, the number of times of replacement of the relay board is reduced, and the inspection work efficiency is improved.

  In the circuit board inspection apparatus according to the present invention, the second anisotropic conductive sheet includes a plurality of conductive path forming portions extending in a thickness direction and insulating portions that insulate the conductive path forming portions from each other. The conductive particles are contained only in the conductive path forming portion, whereby the conductive particles are dispersed non-uniformly in the surface direction, and the conductive path forming portion protrudes on one side of the sheet. .

  In the circuit board inspection apparatus of the present invention, the third anisotropic conductive sheet includes a plurality of conductive path forming portions extending in a thickness direction and insulating portions that insulate these conductive path forming portions from each other. The conductive particles are contained only in the conductive path forming portion, whereby the conductive particles are dispersed non-uniformly in the surface direction, and the conductive path forming portion protrudes on one side of the sheet. .

  As described above, the second anisotropic conductive sheet and the third anisotropic conductive sheet are composed of the conductive path forming portion and the insulating portion, and the conductive particles are contained only in the conductive path forming portion and are in the plane direction. By using the unevenly anisotropic anisotropic conductive sheet that is unevenly distributed and the conductive path forming part protrudes on one side of the sheet, the pressure and impact due to the pressing of the inspection jig are absorbed by these sheets, Thereby, deterioration of the elastic part of the relay substrate is suppressed.

In one aspect of the present invention, the plurality of conductive pins are formed on a rod-shaped central portion that is shorter than the distance between the first insulating plate and the second insulating plate, and on both ends of the central portion. It consists of a pair of end portions having a smaller diameter than the central portion,
The pair of end portions are respectively inserted through through-holes having a diameter smaller than that of the central portion formed in the first insulating plate and the second insulating plate and larger than that of the pair of end portions. Thus, the conductive pin is supported so as to be movable in the axial direction.

With such a configuration, the conductive pin can be held between the first insulating plate and the second insulating plate so as to be movable in the axial direction and not to drop off.
In another aspect of the present invention, the conductive pin is inserted between the first insulating plate and the intermediate holding plate, between the second insulating plate and the intermediate holding plate, or between the intermediate holding plates. A bent holding plate in which a through hole is formed is provided,
The plurality of conductive pins are pressed laterally in opposite directions from each other with a through hole formed in the first and second insulating plates and a through hole formed in the bent holding plate as fulcrums. It is bent at the position of the through hole of the holding plate, and thereby the conductive pin is supported so as to be movable in the axial direction.

  With such a configuration, the conductive pin can be held between the first insulating plate and the second insulating plate so as to be movable in the axial direction and not to drop off. Furthermore, since the pin having a simple structure having a cylindrical shape can be used as the conductive pin, the cost of the conductive pin and the member holding the conductive pin as a whole can be suppressed.

The circuit board inspection method of the present invention is a circuit board inspection method using the circuit board inspection apparatus described above,
The electrical inspection is performed by sandwiching both surfaces of the circuit board to be inspected between the two inspection jigs by the pair of the first inspection jig and the second inspection jig.

  According to the present invention, a circuit board with high reliability can be obtained even if the circuit board to be inspected has fine electrodes with a fine pitch such that the distance between the electrodes to be inspected is 50 μm or less. It is possible to perform electrical inspection.

In addition, the followability to the height variation of the inspected electrode of the inspected circuit board to be inspected is good, and no continuity failure occurs, and an accurate inspection can be performed.
Moreover, since there is no need to arrange the conductive pins at regular intervals, there is little drilling work by drilling through holes in the insulating plate holding the conductive pins, and the cost can be reduced.

  In addition, the inspection can be performed with high resolution, and the step due to the inspection target electrode of the circuit board to be inspected can be absorbed well, and the repeated use durability is also high.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, a pair of identical components in the first inspection jig and the second inspection jig (for example, the circuit board connector 21a and the circuit board connector 21b, the first anisotropic conductive sheet 22a). And the first anisotropic conductive sheet 22b, etc., the symbols “a” and “b” may be omitted (for example, the first anisotropic conductive sheet 22a and the first anisotropic conductive sheet 22b). The directionally conductive sheet 22b is sometimes collectively referred to as “first anisotropically conductive sheet 22”).

FIG. 1 is a cross-sectional view showing an embodiment of the inspection apparatus of the present invention, and FIG. 2 is a cross-sectional view showing a laminated state when the inspection apparatus of FIG. 1 is used for inspection.
This inspection apparatus performs an electrical inspection of a circuit board to be inspected by measuring an electrical resistance between electrodes to be inspected in a circuit board 1 to be inspected such as a printed circuit board for mounting an integrated circuit or the like. Is.

  In this inspection apparatus, as shown in FIGS. 1 and 2, the first inspection jig 11a disposed on the upper surface side of the circuit board 1 to be inspected and the second inspection jig disposed on the lower surface side. The jig 11b is disposed so as to face each other vertically.

  The first inspection jig 11a includes a circuit board side connector 21a provided with a relay board 29a and an anisotropic conductive sheet 26a on both sides thereof, and a relay pin unit 31a. The first inspection jig 11a includes a tester-side connector 41a including a connector substrate 43a on which the third anisotropic conductive sheet 42a is disposed on the relay pin unit 31a side and a base plate 46a. Yes.

  The second inspection jig 11b is configured similarly to the first inspection jig 11a, and includes a circuit board side connector 21b having a relay board 29b and an anisotropic conductive sheet 26b on both sides thereof, and a relay pin unit 31b. I have. The second inspection jig 11b includes a tester-side connector 41b including a connector substrate 43b on which the anisotropic conductive sheet 42b is disposed on the relay pin unit 31b side and a base plate 46b.

An electrode 2 to be inspected is formed on the upper surface of the circuit board 1 to be inspected, and an electrode 3 to be inspected is also formed on the lower surface thereof, and these are electrically connected to each other.
The circuit board-side connectors 21a and 21b include pitch conversion boards 23a and 23b, relay boards 29a and 29b arranged on one side thereof, and second anisotropic conductive sheets 26a arranged on the other side. 26b.

  3 is a diagram showing the surface of the pitch conversion board on the circuit board side to be inspected, FIG. 4 is a diagram showing the surface on the relay pin unit side, and FIG. 5 is a diagram showing the pitch conversion board, relay board, and board to be tested. It is sectional drawing which showed the state which laminated | stacked the test circuit board.

  On one surface of the pitch conversion substrate 23, that is, on the circuit board 1 side to be inspected, as shown in FIG. An electrode 25 is formed. These connection electrodes 25 are arranged so as to correspond to the patterns of the electrodes 2 and 3 to be inspected of the circuit board 1 to be inspected.

  On the other hand, the other surface of the pitch conversion board 23, that is, the side opposite to the circuit board 1 to be inspected, is electrically connected to the conductive pins 32a and 32b of the relay pin unit 31, as shown in FIG. A plurality of terminal electrodes 24 are formed. These terminal electrodes 24 are, for example, 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, 0.3 mm or 0.2 mm. They are arranged on lattice points having a constant pitch, and the pitch is the same as the arrangement pitch of the conductive pins 32a and 32b of the relay pin unit.

  Each connection electrode 25 in FIG. 3 is electrically connected to the corresponding terminal electrode 24 in FIG. 4 by a wiring 52 and an internal wiring 53 (see FIG. 5) penetrating in the thickness direction of the insulating substrate 51.

  For example, as shown in FIG. 5, the insulating portion on the surface of the pitch conversion substrate 23 includes an insulating layer 54 formed on the surface of the insulating substrate 51 so that the connection electrodes 25 are exposed. The thickness of the insulating layer 54 is preferably 5 to 100 μm, more preferably 10 to 60 μm. When this thickness is too small, it may be difficult to form an insulating layer having a small surface roughness. On the other hand, if this thickness is excessive, it may be difficult to electrically connect the connection electrode 25 and the conductive path forming portion of the relay substrate 29.

  As a material for forming the insulating substrate 51 of the pitch conversion substrate, a material generally used as a base material of a printed circuit board can be used. Specific examples include polyimide resins, glass fiber reinforced polyimide resins, glass fiber reinforced epoxy resins, glass fiber reinforced bismaleimide triazine resins, and the like.

  As a material for forming the insulating layers 54 and 55 in FIG. 5, a polymer material that can be formed into a thin film can be used. Specific examples thereof include an epoxy resin, an acrylic resin, a phenol resin, a polyimide resin, a polyamide resin, a mixture thereof, and a resist material.

  The pitch conversion substrate 23 can be manufactured, for example, as follows. First, a laminated material in which a thin metal layer is laminated on both sides of a flat insulating substrate is prepared, and a plurality of layers that penetrates in the thickness direction of the laminated material corresponding to the pattern of terminal electrodes to be formed with respect to this laminated material. The through hole is formed by a numerically controlled drilling apparatus, a photo etching process, a laser processing process, or the like.

  Next, electroless plating and electrolytic plating are performed in the through holes formed in the laminated material to form via holes connected to the thin metal layers on both sides of the substrate. Thereafter, a photoetching process is performed on the thin metal layer to form a wiring pattern and connection electrodes on the surface of the insulating substrate, and to form terminal electrodes on the opposite surface.

  Then, as shown in FIG. 5, the insulating layer 54 is formed on the surface of the insulating substrate 51 so that the connection electrodes 25 are exposed, and the terminal electrodes 24 are exposed on the opposite surface. The pitch conversion substrate 23 is obtained by forming the insulating layer 55 on the substrate. The thickness of the insulating layer 55 is preferably 5 to 100 μm, more preferably 10 to 60 μm.

  6A is a cross-sectional view of the relay substrate, FIG. 6B is a partially enlarged cross-sectional view thereof, and FIG. 6C is a partial top view thereof. The substrate 73 of the relay substrate 29 has a number of through holes in which the conductive path forming portions 61 are arranged according to the electrode pattern of the pitch conversion substrate 23. An insulating portion 62 is formed by embedding an elastic polymer material in the through hole, and the conductive path forming portion 61 is formed so as to be surrounded by the insulating portion 76. The insulating portion 76 is integrally formed on both side surfaces of the substrate 73 and is continuous with the plurality of through holes.

The conductive path forming portion 61 contains conductive particles exhibiting magnetism in an insulating elastic polymer material in an aligned state in the thickness direction.
On the other hand, the insulating portion 62 is formed of an elastic polymer material that does not contain conductive particles. The elastic polymer material constituting the conductive path forming portion 61 and the elastic polymer material constituting the insulating portion 62 may be of the same type or different types.

  As a material for forming the substrate 73 of the relay substrate, specifically, a composite resin material such as a glass fiber reinforced polyimide resin, a glass fiber reinforced epoxy resin, a glass fiber reinforced bismaleimide triazine resin, a polyimide resin, Polyester resin, polyaramid resin, polyamide resin, bismaleimide / triazine resin, resin material with high mechanical strength such as liquid crystal polymer, metal material such as stainless steel, fluorine resin fiber, aramid fiber, polyethylene fiber, polyarylate fiber, nylon fiber, Examples thereof include meshes made of organic fibers such as polyester fibers and liquid crystal polymer fibers, nonwoven fabrics, and metal meshes. The thickness of the substrate 73 is preferably 20 to 200 μm, more preferably 30 to 100 μm, although it depends on the forming material.

  A conductive path forming portion 61 corresponding to the connection electrode 25 is disposed in each of a large number of through holes formed in the substrate 73. For example, a pair of conductive path forming portions 61 corresponding to the voltage supply electrode 27 and the voltage measurement electrode 28 in the four-terminal inspection is disposed in each of the through holes. The number of conductive path forming portions 61 arranged in one through hole is not particularly limited, but is preferably 1 to 4, and each of the substrates 73 corresponding to the connection electrodes 25 of the pitch conversion substrate 23 is provided. The number of conductive path forming portions 75 may be different for each through hole.

  In the example shown in the drawing, on both surfaces of the relay substrate 29, a protruding portion 61 a in which the conductive path forming portion 61 protrudes from the surface of the insulating portion 62 is formed. By forming the projecting portion 61a in this way, the degree of compression by pressurization on the conductive path forming portion 61 is larger than that on the insulating portion 62, and therefore the conductive path forming portion 61 has a sufficiently low resistance value. A path is reliably formed, and a change in resistance value with respect to a change in pressure can be reduced. As a result, even if the pressure applied to each conductive path forming portion 61 of the relay substrate 29 is not uniform, it is possible to prevent variation in conductivity between the conductive path forming portions 61.

  As the elastic polymer material constituting the conductive path forming portion 61 and the insulating portion 62, a polymer material having a crosslinked structure is preferable. Specific examples of the curable polymer substance-forming material that can be used to obtain such an elastic polymer substance include polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, and acrylonitrile-butadiene. Conjugated diene rubber such as copolymer rubber and hydrogenated products thereof, block copolymer rubber such as styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer and hydrogenated products thereof, chloroprene , Urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, and the like.

When the weather resistance is required for the relay substrate 29, it is preferable to use a material other than the conjugated diene rubber, and it is particularly preferable to use a silicone rubber from the viewpoint of moldability and electrical characteristics. As the silicone rubber, those obtained by crosslinking or condensing liquid silicone rubber are preferable. The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10 ⁻¹ sec, and is any of a condensation type, an addition type, a vinyl group or a hydroxyl group-containing one. Also good. Specific examples include dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, methyl phenyl vinyl silicone raw rubber, and the like.

  The silicone rubber preferably has a molecular weight Mw (referred to as a standard polystyrene equivalent weight average molecular weight) of 10,000 to 40,000. From the viewpoint of heat resistance, the molecular weight distribution index (referred to as the ratio Mw / Mn between the standard polystyrene equivalent weight average molecular weight Mw and the standard polystyrene equivalent number average molecular weight Mn) is preferably 2 or less.

  As the conductive particles P contained in the conductive path forming portion 61, conductive particles exhibiting magnetism are used because the conductive particles can be easily aligned in the thickness direction by a method described later.

  Specific examples of such conductive particles include magnetic metal particles such as iron, cobalt and nickel, alloy particles thereof, particles containing these metals, or particles containing these metals as core particles. The surface of the particles is plated with a metal having good conductivity such as gold, silver, palladium, rhodium, or non-magnetic metal particles or inorganic particles such as glass beads or polymer particles. Examples thereof include a surface plated with a conductive magnetic metal such as nickel or cobalt.

Among these, it is preferable to use nickel particles as core particles and the surfaces thereof plated with gold having good conductivity.
Examples of the method for coating the surface of the core particles with the conductive metal include chemical plating and electrolytic plating.

  When using a conductive particle coated with a conductive metal on the surface of the core particle, the conductive metal coverage on the particle surface (the conductive metal relative to the surface area of the core particle is obtained from the point that good conductivity is obtained. Is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.

  The coating amount of the conductive metal is preferably 0.5 to 50% by mass of the core particles, more preferably 2 to 30% by mass, further preferably 3 to 25% by mass, and particularly preferably 4 to 20% by mass. It is. When the conductive metal to be coated is gold, the coating amount is preferably 0.5 to 30% by mass of the core particles, more preferably 2 to 20% by mass, and further preferably 3 to 15%. % By mass.

The particle diameter of the conductive particles is preferably 1 to 100 μm, more preferably 2 to 50 μm, still more preferably 3 to 30 μm, and particularly preferably 4 to 20 μm.
The particle size distribution (Dw / Dn) of the conductive particles P is preferably 1 to 10, more preferably 1.01 to 7, still more preferably 1.05 to 5, particularly preferably 1.1 to 4. It is.

  By using the conductive particles satisfying such conditions, the obtained conductive path forming part 61 can be easily deformed under pressure, and the conductive path forming part 61 can have sufficient electrical conductivity between the conductive particles. Contact is obtained.

  The shape of the conductive particles is not particularly limited, but spherical particles, star-shaped particles, or secondary particles in which these particles are aggregated in that they can be easily dispersed in the polymer substance-forming material. Preferably there is.

  Further, as the conductive particles, particles whose surfaces are treated with a coupling agent such as a silane coupling agent or a lubricant can be appropriately used. By treating the particle surface with a coupling agent or a lubricant, the durability of the anisotropic conductive sheet is improved.

  Such conductive particles are preferably contained in the conductive path forming part in a volume fraction of 15 to 45%, more preferably 20 to 40%. If this ratio is too small, the conductive path forming part 61 having a sufficiently small electric resistance value may not be obtained. On the other hand, when this ratio is excessive, the obtained conductive path forming part 61 is likely to be fragile, and the elasticity required for the conductive path forming part 61 may not be obtained.

  The thickness of the conductive path forming part 61 is preferably 20 to 250 μm, more preferably 30 to 200 μm. When this thickness is too small, the absorption capability with respect to the pressurization of the thickness direction becomes low. On the other hand, when the thickness is excessive, good conductivity may not be obtained.

The protruding height of the protruding portion 61a in the conductive path forming portion 61 is preferably 5 to 70% of the thickness of the conductive path forming portion 61, and more preferably 10 to 60%.
Below, an example of the manufacturing method of the relay substrate 29 is demonstrated. First, the conductive path forming part 61 is formed.
1. Formation of Conductive Elastomer Layer First, a conductive elastomer material in which conductive particles exhibiting magnetism are dispersed in a liquid elastomer material that is cured to become an elastic polymer substance is prepared. Then, as shown in FIG. 7, the conductive elastomer material layer 61 </ b> A is formed by applying the conductive elastomer material on the releasable support plate 65 for forming the conductive path forming portion. Here, as shown in FIG. 8, the conductive elastomer material layer 61 </ b> A contains conductive particles P exhibiting magnetism in a randomly dispersed state.

  Next, by applying a magnetic field to the conductive elastomer material layer 61A in the thickness direction, the conductive particles P dispersed in the conductive elastomer material layer 61A as shown in FIG. The conductive elastomer material layer 61A is aligned in the thickness direction.

  Then, after continuing the action of the magnetic field on the conductive elastomer material layer 61A or after stopping the action of the magnetic field, the curing process of the conductive elastomer material layer 61A is performed, as shown in FIG. The conductive elastomer layer 61B, which is contained in the elastic polymer material in a state in which the conductive particles P are aligned in the thickness direction, is formed in a state of being supported on the releasable support plate 65.

As a material constituting the releasable support plate 65, metals, ceramics, resins, composite materials thereof, and the like can be used.
As a method for applying the conductive elastomer material, a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.

The thickness of the conductive elastomer material layer 61A is set according to the thickness of the conductive path forming portion to be formed.
As means for applying a magnetic field to the conductive elastomer material layer 61A, an electromagnet, a permanent magnet, or the like can be used.

The strength of the magnetic field applied to the conductive elastomer material layer 61A is preferably 0.2 to 2.5 Tesla.
The curing process of the conductive elastomer material layer 61A is usually performed by a heating process. The specific heating temperature and heating time are appropriately set in consideration of the type of elastomer material constituting the conductive elastomer material layer 61A, the time required to move the conductive particles, and the like.

A plurality of conductive path forming portions 61 are formed from the conductive elastomer layer 61B according to a pattern corresponding to the connection electrode 25 of the pitch conversion substrate 23 as follows. (FIGS. 11-14)
2. Formation of Conductive Path Forming Unit 61 As shown in FIG. 11, a thin metal layer 66 for a plating electrode is formed on the surface of the conductive elastomer layer 61B supported on the releasable support plate 65.

  Then, as shown in FIG. 12, a plurality of conductive path forming portions to be formed on the thin metal layer 66 according to a predetermined pattern corresponding to the pattern of the conductive path forming portion to be formed, that is, the pattern of the electrode to be connected. The resist layer 67 having the openings 67a is formed.

  Thereafter, as shown in FIGS. 13, 15A and 16A, the metal thin layer 66 is used as a plating electrode, and the portion exposed from the opening 67a of the resist layer 67 in the metal thin layer 66 is subjected to an electrolytic plating process. As a result, a metal mask 68 is formed in the opening 67 a of the resist layer 67.

  Next, the conductive elastomer layer 61B, the metal thin layer 66, and the resist layer 67 are subjected to laser processing, thereby forming the metal mask 68 as shown in FIGS. 15B and 16B. The peripheral resist layer 67, the metal thin layer 66, and the conductive elastomer layer 61B are removed. Thereby, the several conductive path formation part 61 arrange | positioned according to a predetermined pattern is formed in the state supported on the releasable support plate 65. FIG.

  Thereafter, the conductive elastomer layer 61B other than the conductive path forming portion 61 is peeled and removed, so that the conductive material is formed on the releasable support plate 65 as shown in FIGS. 14, 15 (c) and 16 (c). Only the path forming unit 61 is left. Then, the remaining thin metal layer 66 and the metal mask 68 are peeled off from the surface of the conductive path forming portion 61.

Thereby, the several conductive path formation part 61 arrange | positioned according to a predetermined pattern is formed in the state supported on the releasable support plate 65. FIG.
As a method of forming the thin metal layer 66 on the surface of the conductive elastomer layer 61B, an electroless plating method, a sputtering method, or the like can be used.

As a material constituting the metal thin layer 66, copper, gold, aluminum, rhodium, or the like can be used.
The thickness of the metal thin layer 66 is preferably 0.05 to 2 μm, more preferably 0.1 to 1 μm. When this thickness is too small, a uniform thin layer is not formed, which may be inappropriate as a plating electrode. On the other hand, if this thickness is excessive, it may be difficult to remove by laser processing.

The thickness of the resist layer 67 is set according to the thickness of the metal mask 68 to be formed.
As a material constituting the metal mask 68, copper, iron, aluminum uni, gold, rhodium, or the like can be used.

  The thickness of the metal mask 68 is preferably 2 μm or more, more preferably 5 to 20 μm. If this thickness is too small, it may be unsuitable as a mask for the laser.

The laser processing is preferably performed using a carbon dioxide laser or an ultraviolet laser, whereby the conductive path forming portion 61 having a desired form can be reliably formed.
In addition to the method described above, the conductive path forming portion 61 in the first anisotropic conductive sheet 22 can be formed by the following method.
1. Formation of Composite Film As shown in FIG. 17, a predetermined pattern corresponding to the pattern of the conductive path forming portion to be formed, that is, the pattern of the electrode to be connected, is formed on the thin metal layer 66 for the plating electrode by a photolithography technique. A resist layer 67 having a plurality of openings 67a is formed according to the pattern.

  After that, as shown in FIG. 18, by using the metal thin layer 66 as a plating electrode, a portion of the metal thin layer 66 exposed from the opening 67a of the resist layer 67 is subjected to electrolytic plating treatment, whereby the inside of the opening 67a of the resist layer 67 A metal mask 68 is formed on the substrate. Thereby, the composite film 69 is obtained.

  Here, as the thin metal layer 66, a metal foil, a metal plate, or the like can be used. Further, a metal foil integrated with a resin film, a thin metal layer formed on the resin film by an electroless plating method, a sputtering method, or the like can be used.

As a material of the metal thin layer 66, copper, gold, aluminum, rhodium, or the like can be used.
The thickness of the metal thin layer 66 is preferably 0.05 to 2 μm, more preferably 0.1 to 1 μm. When this thickness is too small, a uniform thin layer is not formed, which may be inappropriate as a plating electrode. On the other hand, if this thickness is excessive, it may be difficult to remove by laser processing.

The thickness of the resist layer 67 is set according to the thickness of the metal mask 68 to be formed.
As a material constituting the metal mask 68, a metal exhibiting magnetism is used. Specific examples thereof include nickel, cobalt, and alloys thereof.

The thickness of the metal mask 68 is preferably 2 μm or more, more preferably 5 to 20 μm. If this thickness is too small, it may be unsuitable as a mask for the laser.
2. Formation of Conductive Elastomer Layer First, a conductive elastomer material in which conductive particles exhibiting magnetism are dispersed in a liquid elastomer material that is cured to become an elastic polymer substance is prepared. Then, as shown in FIG. 19, a conductive elastomer material layer 61A is formed by applying a conductive elastomer material on a releasable support plate 65 for forming a conductive path forming portion. Here, the conductive elastomer material layer 61A contains the conductive particles P exhibiting magnetism in a randomly dispersed state.

Next, the composite film 69 is laminated so that the surface on which the metal thin layer 66 is not formed is in contact with the conductive elastomer material layer 61A.
Thereafter, by applying a magnetic field in the thickness direction to the conductive elastomer material layer 61A, as shown in FIG. 21, the dispersed conductive particles P are converted into a metal mask 68 made of a metal exhibiting magnetism. And are aligned so as to be aligned in the thickness direction. Due to the action of the metal mask 68 made of a metal exhibiting magnetism, the strength of the magnetic field in the region of the metal mask 68 is increased, so that the conductive particles P are oriented while concentrating on the metal mask 68 portion. Thereby, in the conductive elastomer material layer 61A, the density of the conductive particles P in the portion of the metal mask 68 is high, and the density of the conductive particles is low in the portion where the metal mask 68 is not formed.

  Then, while continuing the action of the magnetic field on the conductive elastomer material layer 61A or after stopping the action of the magnetic field, the curing process of the conductive elastomer material layer 61A is performed, as shown in FIG. The conductive elastomer layer 61B, which is contained in the elastic polymer material in a state in which the conductive particles P are aligned in the thickness direction, is formed in a state of being supported on the releasable support plate 65.

  The material constituting the releasable support plate 65, the method of applying the conductive elastomer material, the thickness of the conductive elastomer material layer 61A, the conditions for applying a magnetic field to the conductive elastomer material layer 61A, etc. are as described above. This is as described in the method for forming the conductive path forming portion.

Thereafter, as shown in FIG. 23, the thin metal layer 66 integrated on the surface of the conductive elastomer layer 61B is removed. The metal thin layer 66 can be removed by etching, mechanical peeling, mechanical polishing, or the like.
2. Formation of Conductive Path Forming Unit 61 From the conductive elastomer layer 61B, a plurality of conductive path forming units 61 are formed according to a pattern corresponding to the connection electrode 25 of the pitch conversion substrate 23 in accordance with the method described above. That is, by performing laser processing on the conductive elastomer layer 61B and the resist layer 67, the resist layer 67 and the conductive elastomer layer 61B around the metal mask 68 are removed. Thereby, the several conductive path formation part 61 arrange | positioned according to a predetermined pattern is formed in the state supported on the releasable support plate 65. FIG.

  Thereafter, the conductive elastomer layer 61B other than the conductive path forming portion 61 is peeled and removed, so that only the conductive path forming portion 61 is left on the releasable support plate 65 as shown in FIG. Then, the remaining metal mask 68 is peeled off from the surface of the conductive path forming portion 61.

The laser processing is preferably performed using a carbon dioxide laser or an ultraviolet laser, whereby the conductive path forming portion 61 having a desired form can be reliably formed.
The relay substrate 29 is obtained by the following steps using the plurality of conductive path forming portions 61 formed on the releasable support plate 65 obtained as described above. First, as shown in FIG. 25A, a releasable support plate 70 is prepared, and a liquid insulating portion that is cured to become an insulating elastic polymer material on the surface of the releasable support plate 70. The material layer 62A is formed by a printing method or the like.

  Next, as shown in FIG. 25B, a substrate 73 having a through hole is placed on the insulating material layer 62A. Then, from the upper surface side of the substrate 73, a liquid elastomer material that is cured and becomes an insulating elastic polymer substance is filled into the through holes 75 of the substrate 73 by a printing method or the like. Further, by applying an elastomer material to the surface of the substrate 73, an insulating portion material layer 62A integrally formed on both side surfaces of the substrate 73 and the through holes 75 is obtained as shown in FIG.

  Next, as shown in FIG. 26A, the releasable support plate 65 on which the plurality of conductive path forming portions 61 are formed is placed on the substrate 73, and the insulating portions are provided on both side surfaces and in the through holes 75. Each of the conductive path forming portions 61 is brought into contact with the releasable support plate 70 by being superimposed on the releasable support plate 70 on which the material layer 62A is formed. As a result, the insulating material layer 62 </ b> A is formed around the conductive path forming portion 61.

  Next, as shown in FIG. 26B, the conductive path forming portion 61 is compressed by pressurizing the releasable support plate 65, and the insulating portion material layer 62A is cured. After the curing treatment, both ends of the conductive path forming portion 61 are released by releasing the pressure from the releasable support plate 65 and the releasable support plate 70 and releasing from the releasable support plate 65 and the releasable support plate 70. The part protrudes from the insulating part 62. As a result, as shown in FIG. 26C, an insulating portion 62 that insulates a pair of adjacent conductive path forming portions 61, 61 from each other is formed integrally with the conductive path forming portion 61, thereby forming a conductive path. The relay substrate 29 in which the part 61 protrudes from the surface of the insulating part 62 is obtained.

  As shown in FIG. 26D, a metal film 64 may be formed at the tip of the conductive path forming portion 61. The metal film 64 may be formed at the tip portions on both sides of the conductive path forming portion 61 as shown in the figure, or may be formed at the tip portion on one side of the conductive path forming portion 61. Such a metal film can be formed by various known methods such as a metal plating method, a vapor deposition method using a sputtering method, or a method in which a metal plate is attached to the tip of the conductive path forming unit 61 with an adhesive.

As a material constituting the releasable support plate 70, the same material as the releasable support plate 65 for forming the conductive path forming portion 61 can be used.
Examples of the method for applying the elastomer material used for the insulating portion material layer 62A include a printing method such as screen printing, a roll coating method, and a blade coating method.

The thickness of the insulating part material layer 62A is set according to the thickness of the insulating part 62 to be formed.
The insulating part material layer 62A curing process is usually performed by heat treatment. The specific heating temperature and heating time are appropriately set in consideration of the type of elastomer material constituting the insulating portion material layer 62A.

The through hole of the substrate 73 can be formed by a numerically controlled drilling apparatus, a photo etching process, a laser processing process, or the like.
According to the relay substrate manufacturing method described above, laser processing is performed on the conductive elastomer layer 61A dispersed in a state where the conductive particles P are aligned in the thickness direction, and a part thereof is removed. Thus, the conductive path forming portion 61 having a desired shape is formed.

Therefore, it is possible to reliably obtain the relay substrate 29 filled with the required amount of the conductive particles P and having the conductive path forming portion 61 having the desired conductivity.
Further, by applying a magnetic field orientation method to the conductive elastomer material layer 61A using a metal mask made of metal exhibiting magnetism, the density of the conductive particles in the portion where the metal mask is not formed is reduced. Become. Therefore, the formation of the conductive path forming portion by laser processing becomes easy. Furthermore, since the laser processing of the conductive elastomer layer 61B having a large thickness is facilitated, the conductive path forming portion 61 having a large thickness can be reliably obtained.

  In addition, a plurality of conductive path forming portions 61 arranged on the releasable support plate 65 are formed according to a predetermined pattern corresponding to the connection electrodes 25 of the pitch conversion substrate 23, and the space between these conductive path forming portions 61 is formed. Further, the insulating portion 62 is formed by forming an uncured elastomer material layer 62A and performing a curing process.

Thereby, the 1st anisotropic conductive sheet 22 in which the insulating part 62 in which the electroconductive particle P does not exist at all was formed can be obtained reliably.
And the expensive metal mold | die with which many ferromagnetic parts were used which was used in order to manufacture the conventional anisotropic conductive sheet is unnecessary.

  Therefore, according to the relay substrate 29 obtained by such a method, the required electrical connection can be reliably made to each of the electrodes to be inspected regardless of the arrangement pattern of the inspection electrodes of the circuit board to be inspected. Can be achieved.

  Further, even when the electrodes to be inspected are arranged in a small pitch and at a high density, it is possible to reliably achieve the required electrical connection to each of the electrodes to be inspected, and to manufacture the electrodes. Costs can be reduced and higher durability can be obtained.

  FIG. 5 is a cross-sectional view showing a state in which a pitch conversion substrate, a relay substrate, and a circuit board to be inspected are stacked. In the figure, an example in which a four-terminal inspection is performed is shown. As shown in the figure, a relay board 29 is arranged between the circuit board 1 to be inspected and the pitch conversion board 23.

  On the surface of the pitch conversion substrate 23, current supply electrodes 27 for current supply and voltage measurement electrodes 28 for voltage measurement, which are spaced apart from each other and electrically connected to the same electrode to be inspected, respectively. The connecting electrode 25 is formed.

  A pair of conductive path forming portions 61 are formed in one through hole of the relay substrate 29 corresponding to the current supply electrode 27 and the voltage measurement electrode 28 of the pitch conversion substrate 23. The pair of conductive path forming portions 61 and 61 are electrically connected to the current supply electrode 27 and the voltage measurement electrode 28 on one end side, and electrically connected to the test electrode 2 on the circuit board 1 to be tested on the other end side. The electrical inspection is performed in this state.

  A dispersive anisotropic conductive sheet may be disposed on one side or both sides of the relay substrate 29. In the present invention, since the relay substrate 29 is provided, local stress concentration due to the electrodes of the circuit board 1 to be inspected is sufficiently relieved even if a thin dispersed anisotropic conductive sheet that does not impair the resolution is used. FIG. 27 is a cross-sectional view showing an example in which a dispersive anisotropic conductive sheet is arranged. In FIG. 27A, the dispersive anisotropic conductive sheet is disposed between the pitch conversion substrate 23 and the relay substrate 29. The first anisotropic conductive sheet 22 is disposed, the current supply electrode 27 and the voltage measurement electrode 28 of the pitch conversion substrate 23, and the pair of conductive path forming portions 61 and 61 of the relay substrate 29, The first anisotropic conductive sheet 22 is electrically connected.

  In FIG. 27 (b), the first anisotropic conductive sheets 22 and 22 which are dispersive anisotropic conductive sheets are arranged on both sides of the relay substrate 29, and the current supply electrodes 27 of the pitch conversion substrate 23 and The voltage measuring electrode 28 and the pair of conductive path forming portions 61 and 61 of the relay substrate 29 are electrically connected via the first anisotropic conductive sheet 22 and the circuit board 1 to be inspected is inspected. The electrode 2 and the pair of conductive path forming portions 61 and 61 of the relay substrate 29 are electrically connected via the first anisotropic conductive sheet 22.

  As shown in FIG. 28, the first anisotropic conductive sheet 22 constituting the circuit board side connector 21 and disposed adjacent to the relay board 29 is a sheet base material made of an insulating elastic polymer material. 63 contains a large number of conductive particles P dispersed in the plane direction and arranged in the thickness direction.

  The thickness of the first anisotropic conductive sheet 22 is preferably 20 to 200 μm, more preferably 30 to 100 μm. When the minimum thickness is less than 20 μm, the mechanical strength of the first anisotropic conductive sheet 22 tends to be low, and the required durability may not be obtained. On the other hand, when the thickness of the first anisotropic conductive sheet 22 exceeds 200 μm, the electric resistance in the thickness direction tends to increase, and when the pitch of electrodes to be connected is small, it is formed by pressurization. In some cases, the required insulation cannot be obtained between the conductive paths, and an electrical short circuit occurs between the electrodes to be inspected, making it difficult to electrically inspect the circuit board to be inspected.

The elastic polymer material constituting the sheet base 63 of the first anisotropic conductive sheet 22 preferably has a durometer hardness of 30 to 90, more preferably 35 to 80, and still more preferably 40 to 70. is there. Here, “durometer hardness” means that measured by a type A durometer based on the durometer hardness test of JIS K6253.

  When the durometer hardness of the elastic polymer material is less than 30, the anisotropic conductive sheet is compressed and deformed greatly when pressed in the thickness direction, and a large permanent distortion occurs. It becomes difficult to use for inspection due to deterioration and durability tends to be lowered.

  On the other hand, when the durometer hardness of the elastic polymer material is more than 90, when the anisotropic conductive sheet is pressed in the thickness direction, the deformation amount in the thickness direction becomes insufficient, so that good connection reliability is obtained. This is likely to cause a connection failure.

  The elastic polymer material constituting the base material of the first anisotropic conductive sheet 22 is not particularly limited as long as it exhibits the durometer hardness described above. From the viewpoint of forming processability and electrical properties, silicone rubber Is preferably used.

The first anisotropic conductive sheet 22 has a ratio W ₁ / D ₁ of 1.1 to ₁₀ between its thickness W ₁ (μm) and the number average particle diameter D ₁ (μm) of the magnetic conductive particles. It is preferable. Here, the “number average particle diameter of the magnetic conductive particles” means that measured by a laser diffraction scattering method. When the ratio W ₁ / D ₁ is less than 1.1, the diameter of the magnetic conductive particles is equal to or larger than the thickness of the anisotropic conductive sheet. For this reason, the circuit board to be inspected is easily damaged when the anisotropic conductive sheet is disposed on the circuit board to be inspected side.

On the other hand, when the ratio W ₁ / D ₁ exceeds 10, since a large number of conductive particles are arranged in the thickness direction to form a chain, there are contacts between the large number of conductive particles, and the electrical resistance The value tends to be high.

The magnetic conductive particles preferably have a saturation magnetization of 0. 0 because the magnetic conductive particles can be easily moved by the action of a magnetic field in the sheet molding material for forming the anisotropic conductive sheet. 1 Wb / m ² or more, more preferably 0.3Wb / m ² or more, and especially preferably 0.5 Wb / m ² or more.

Since the saturation magnetization is 0.1 Wb / m ² or more, the magnetic conductive particles can be reliably moved by the action of a magnetic field in the production process to obtain a desired orientation state. When used, a chain of magnetic conductive particles can be formed.

  Specific examples of magnetic conductive particles include particles of metals such as iron, nickel, cobalt, etc., particles of alloys thereof, particles containing these metals, or particles containing these metals as core particles. Composite particles with a highly conductive metal coated on the surface, or non-magnetic metal particles or inorganic substance particles such as glass beads or polymer particles were used as core particles, and the surface of the core particles was plated with a highly conductive metal. Examples include composite particles or composite particles in which core particles are coated with both a conductive magnetic material such as ferrite and an intermetallic compound and a highly conductive metal.

Here, the “high conductivity metal” refers to a metal having an electrical conductivity at 0 ° C. of 5 × 10 ⁶ Ω ⁻¹ m ⁻¹ or more. Specifically, gold, silver, rhodium, platinum, chromium, and the like can be used as such a highly conductive metal. Among these, gold is chemically stable and has high conductivity. Is preferably used.

Among the above magnetic conductive particles, composite particles in which nickel particles are used as core particles and the surfaces thereof are plated with a highly conductive metal such as gold or silver are preferable.
As a means for coating the surface of the core particles with a highly conductive metal, for example, an electroless plating method can be used.

  The magnetic conductive particles preferably have a coefficient of variation in number average particle diameter of 50% or less, more preferably 40% or less, still more preferably 30% or less, and particularly preferably 20% or less. Here, the “coefficient of variation of the number average particle diameter” is an expression: (σ / Dn) × 100 (where σ represents the value of the standard deviation of the particle diameter, and Dn represents the number average particle diameter of the particles. Is required).

  When the coefficient of variation of the number average particle diameter of the magnetic conductive particles is 50% or less, the degree of unevenness of the particle diameter is reduced, so that the partial conductivity variation in the anisotropically conductive sheet obtained is reduced. be able to.

  Such magnetic conductive particles can be obtained by making a metal material into particles by a conventional method, or preparing commercially available metal particles and subjecting the particles to a classification treatment. The particle classification treatment can be performed by, for example, a classification device such as an air classification device or a sonic sieving device. Specific conditions for the classification treatment are appropriately set according to the number average particle diameter of the target conductive metal particles, the type of the classification device, and the like.

Although the specific shape of the magnetic conductive particles is not particularly limited, for example, secondary particles in which a plurality of spherical primary particles are integrally connected are preferably used.
When using composite particles (conductive composite metal particles) in which the surface of the core particles is coated with a highly conductive metal as the magnetic conductive particles, good conductivity can be obtained. The coverage of the highly conductive metal (ratio of the coated area of the highly conductive metal to the surface area of the core particles) is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.

  The coating amount of the highly conductive metal is preferably 2.5 to 50% by mass, more preferably 3 to 45% by mass, still more preferably 3.5 to 40% by mass, particularly the weight of the core particles. Preferably it is 5-30 mass%.

  An anisotropic conductive sheet containing a large number of conductive particles dispersed in the surface direction and arranged in the thickness direction in such an insulating elastic polymer material is disclosed in, for example, JP-A-2003-77560. As shown, a fluid molding material containing conductive particles exhibiting magnetism is prepared in a polymer material that is cured to become an elastic polymer material, and a molding material layer made of this molding material is prepared. The molding material layer is formed between the one-surface-side molded member that contacts one surface of the molding material layer and the other-surface-side molding member that contacts the other surface of the molding material layer, and a magnetic field acts on the molding material layer in the thickness direction. And can be produced by a method of curing the molding material layer.

  As shown in FIG. 29, the second anisotropic conductive sheet 26 arranged on the pitch conversion substrate 23 on the relay pin unit 31 side has a large number of conductive particles P in an insulating elastic polymer material. The conductive path forming portions 71 are arranged in the thickness direction, and the insulating portions 72 are provided to separate the conductive path forming portions 71 from each other. As described above, the conductive particles P are non-uniformly dispersed in the surface direction only in the conductive path forming portion 71.

  The thickness of the conductive path forming portion 71 is preferably 0.1 to 2 mm, more preferably 0.2 to 1.5 mm. When this thickness is too small, the absorption capacity for pressurization in the thickness direction is low, absorption of the applied pressure by the inspection jig during inspection is reduced, and the effect of reducing the impact on the circuit board side connector 21 is reduced. For this reason, it becomes difficult to suppress the deterioration of the elastic portion in the relay substrate 29. As a result, the number of replacements of the relay substrate 29 during the repeated inspection of the circuit board 1 to be inspected increases, and the inspection efficiency decreases. On the other hand, if this thickness is excessive, the electrical resistance in the thickness direction tends to increase and electrical inspection may be difficult.

  The thickness of the insulating part 72 is preferably substantially the same as or smaller than the thickness of the conductive path forming part 71. As shown in FIG. 29, the thickness of the insulating portion 72 is made smaller than the thickness of the conductive path forming portion 71, and the conductive path forming portion 71 forms a protruding portion 71 a that protrudes from the insulating portion 72. Since the conductive path forming portion 72 is easily deformed by pressurization and the pressure absorption capacity is increased, the pressure applied by the inspection jig is absorbed during the inspection, and the impact of the circuit board connector 21 is reduced. can do.

When magnetic conductive particles are used for the conductive particles P constituting the second anisotropic conductive sheet 26, the number average particle diameter is preferably 5 to 200 μm, more preferably 5 to 150 μm, and still more preferably 10 ˜100 μm. Here, the “number average particle diameter of the magnetic conductive particles” means that measured by a laser diffraction scattering method. When the number average particle diameter of the magnetic conductive particles is 5 μm or more, the pressure deformation of the conductive path forming portion of the anisotropic conductive sheet becomes easy. Further, when the magnetic conductive particles are oriented by a magnetic field orientation process in the manufacturing process, the magnetic conductive particles are easily oriented. When the number average particle diameter of the magnetic conductive particles is 200 μm or less, the elasticity of the conductive path forming portion 71 of the anisotropic conductive sheet is good and the pressure deformation is easy.

The ratio W ₂ / D ₂ between the thickness W ₂ (μm) of the conductive path forming portion 71 and the number average particle diameter D ₂ (μm) of the magnetic conductive particles is preferably 1.1-10.
When the ratio W ₂ / D ₂ is less than 1.1, the diameter of the magnetic conductive particles is equal to or larger than the thickness of the conductive path forming portion 71, and therefore the elasticity of the conductive path forming portion 71 is low. Thus, the ability to absorb the pressure in the thickness direction is reduced. Since the absorption of the pressure applied by the inspection jig during inspection is reduced and the effect of mitigating the impact on the circuit board side connector 21 is reduced, it is difficult to suppress the deterioration of the elastic portion in the relay board 29. When the circuit board 1 to be inspected is repeatedly inspected, the number of times the relay substrate 29 is replaced increases, and the inspection efficiency tends to be lowered.

On the other hand, when the ratio W ₂ / D ₂ exceeds 10, a large number of conductive particles are arranged in the conductive path forming portion 71 to form a chain, and there are a large number of contacts between the conductive particles. The electrical resistance value tends to be high.

  The elastic polymer substance that is the base material of the conductive path forming portion 71 preferably has a durometer hardness measured by a type A durometer of 15 to 60, more preferably 20 to 50, and even more preferably 25 to 45.

  When the durometer hardness of the elastic polymer is less than 15, the compression and deformation of the sheet when pressed in the thickness direction is large, and a large permanent distortion occurs. Tends to be difficult. When the durometer hardness of the elastic polymer is larger than 60, the deformation when pressed in the thickness direction becomes small, so the ability to absorb pressure in the thickness direction becomes small. For this reason, it becomes difficult to suppress the deterioration of the elastic part in the relay substrate 29. As a result, the number of times of replacement of the relay substrate 29 is increased during the repeated inspection of the circuit board 1 to be inspected, and the inspection efficiency tends to decrease.

  The elastic polymer serving as the base material of the conductive path forming portion 71 is not particularly limited as long as it exhibits the durometer hardness described above, but it is preferable to use silicone rubber from the viewpoint of workability and electrical characteristics.

  The insulating portion 72 of the second anisotropic conductive sheet 26 is formed of an insulating material that does not substantially contain conductive particles. As the insulating material, for example, an insulating polymer material, an inorganic material, a metal material with an insulating surface can be used, and the same material as the elastic polymer used for the conductive path forming portion is used. Easy to produce. When an elastic polymer is used as the material for the insulating portion, it is preferable to use a material having a durometer hardness in the above range.

As the magnetic conductive particles, the conductive particles used in the conductive path forming portion of the relay substrate 29 described above can be used.
The second anisotropic conductive sheet 26 can be manufactured, for example, as follows. First, each of the overall shapes is substantially flat, and consists of an upper mold and a lower mold that correspond to each other, while applying a magnetic field to the material layer filled in the molding space between the upper mold and the lower mold. An anisotropic conductive sheet molding die having a configuration capable of heat-curing the material layer is prepared.

In this anisotropic conductive sheet molding die, a magnetic field is applied to the material layer to form a conductive portion at an appropriate position. Therefore, both the upper die and the lower die are made of strong iron or nickel. On a substrate made of a magnetic material, a ferromagnetic part made of iron, nickel or the like for generating an intensity distribution in the magnetic field in the mold and a nonmagnetic part made of nonmagnetic metal or resin such as copper are mutually connected. It has a structure having mosaic layers alternately arranged so as to be adjacent to each other, and the ferromagnetic portion is
They are arranged according to a pattern corresponding to the conductive path forming portion to be formed.

Here, the molding surface of the upper mold is flat, and the molding surface of the lower mold has slight irregularities corresponding to the conductive path forming portion of the anisotropic conductive sheet to be formed.
And an anisotropic conductive sheet is manufactured as follows using said anisotropic conductive sheet shaping die. First, molding is performed by injecting a molding material containing conductive particles exhibiting magnetism into a polymer material that is cured and becomes an elastic polymer substance in the molding space of the anisotropic conductive sheet molding die. A material layer is formed.

  Next, by using a ferromagnetic part and a non-magnetic part in each of the upper mold and the lower mold, a magnetic field having an intensity distribution in the thickness direction is applied to the formed molding material layer to thereby obtain the magnetic force. As a result, the conductive particles are gathered between the ferromagnetic part in the upper mold and the ferromagnetic part in the lower mold located immediately below it, and the conductive particles are aligned in the thickness direction. Let And the anisotropically conductive sheet which has the structure by which a some columnar conductive path formation part is mutually insulated by the insulation part by hardening-processing a molding material layer in the state is manufactured.

  On the other hand, as shown in FIG. 1, the tester side connectors 41a and 41b include third anisotropic conductive sheets 42a and 42b, connector boards 43a and 43b, and base plates 46a and 46b. As the third anisotropic conductive sheet 42a, 42b, the same material as the second anisotropic conductive sheet 26 described above is used. That is, as shown in FIG. 29, a conductive path forming part in which a large number of conductive particles are arranged in the thickness direction in an insulating elastic polymer material, and insulation that separates each conductive path forming part. An anisotropic conductive sheet composed of a portion is used.

The connector substrates 43a and 43b include an insulating substrate, and pin-side electrodes 45a and 45b are formed on the surface thereof on the relay pin unit 31 side as shown in FIGS.
These pin side electrodes 45 are, for example, 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, 0.3 mm or 0.2 mm. It is arranged on lattice points with a constant pitch, and the arrangement pitch is the same as the arrangement pitch of the conductive pins 32 of the relay pin unit 31.

  Each pin-side electrode 45 is electrically connected to the tester-side electrodes 44a and 44b by a wiring pattern formed on the surface of the insulating substrate and an internal wiring formed therein.

  1, 2 and 30 (FIG. 30 shows the relay pin unit 31a for convenience of explanation) and FIGS. 36 to 39 so that the relay pin unit 31 faces in the vertical direction. Are provided with a plurality of conductive pins 32a and 32b provided at a predetermined pitch. Further, the relay pin unit 31 is provided on both ends of the conductive pins 32a and 32b, and is provided with first insulating plates 34a and 34b disposed on the circuit board 1 side to be inspected for inserting and supporting the conductive pins 32a and 32b. The second insulating plates 35a and 35b are provided on the opposite side of the circuit board 1 to be inspected.

  For example, as shown in FIG. 31, the conductive pin 32 includes a central portion 82 having a large diameter and end portions 81a and 81b having a smaller diameter. The first insulating plate 34 and the second insulating plate 35 are formed with through holes 83 into which the end portions 81 of the conductive pins 32 are inserted. The diameter of the through hole 83 is formed larger than the diameter of the end portions 81a and 81b of the conductive pin 32 and smaller than the diameter of the central portion 82, thereby holding the conductive pin 32 so as not to drop off. .

  The distance between the first insulating plate 34 and the second insulating plate 35 is longer than the length of the central portion 82 of the conductive pin 32 by the first support pin 33 and the second support pin 37 of FIG. Thus, the conductive pin 32 is held so as to be movable up and down. The length of the end portion 81 of the conductive pin 32 is formed to be longer than the thickness of the insulating plate 34, so that the conductive pin 32 protrudes from at least one of the insulating plates 34.

  The relay pin unit has a large number of conductive pins, for example, 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, 0.3 mm or 0. It is arranged on a grid point with a pitch of 2 mm.

  By making the arrangement pitch of the conductive pins 32 of the relay pin unit 31 the same as the arrangement pitch of the terminal electrodes 24 provided on the pitch conversion board 23, the pitch conversion board 23 is connected to the tester side via the conductive pins 32. It is designed to be connected electrically.

  Further, as shown in FIGS. 1 and 30, the relay pin unit 31 includes intermediate holding plates 36a and 36b between the first insulating plates 34a and 34b and the second insulating plates 35a and 35b. Has been placed.

  The first support pins 33a and 33b are arranged between the first insulating plates 34a and 34b and the intermediate holding plates 36a and 36b, whereby the first insulating plates 34a and 34b and the intermediate holding plate are arranged. The space between 36a and 36b is fixed.

  Similarly, second support pins 37a and 37b are disposed between the second insulating plates 35a and 35b and the intermediate holding plates 36a and 36b, whereby the second insulating plates 35a and 35b and the intermediate holding plates 36a and 36b are intermediately held. The space between the plates 36a and 36b is fixed.

As a material of the first support pin 33 and the second support pin 37, for example, a metal such as brass or stainless steel is used.
Note that the distance L1 between the first insulating plate 34 and the intermediate holding plate 36 and the distance L2 between the second insulating plate 35 and the intermediate holding plate 36 in FIG. 30 are not particularly limited. However, as will be described later, the height variation of the electrodes 2 and 3 to be inspected on the circuit board 1 to be inspected due to the elasticity of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 is absorbed. In consideration, 2 mm or more is preferable, and 2.5 mm or more is more preferable.

  Then, as shown in FIG. 30, the first contact support position 38 </ b> A of the first support pin 33 with respect to the intermediate holding plate 36 and the second contact support of the second support pin 37 with respect to the intermediate holding plate 36. The position 38B is arranged at a different position on the intermediate holding plate projection surface A obtained by projecting the inspection apparatus in the thickness direction of the intermediate holding plate (from the upper side to the lower side in FIG. 1).

  In this case, the different positions are not particularly limited, but the first abutting support position 38A and the second abutting support position 38B are, as shown in FIG. It is preferably formed on the lattice on A.

  Specifically, as shown in FIG. 35, on the intermediate holding plate projection surface A, one second contact is formed in the unit lattice region R1 composed of four adjacent first contact support positions 38A. The contact support position 38B is arranged. Further, on the intermediate holding plate projection surface A, one first contact support position 38A is arranged in a unit lattice region R2 composed of four adjacent second contact support positions 38B. In FIG. 35, the first contact support position 38A is indicated by a black circle, and the second contact support position group 38B is indicated by a white circle.

  Here, one second abutment support position 38B is disposed at the center of the diagonal line Q1 of the unit lattice region R1 of the first abutment support position 38A, and the second abutment support position 38B. One first abutment support position 38A is arranged at the center of the diagonal line Q2 of the unit lattice region R2. However, these relative positions are not particularly limited, and are arranged at different positions on the intermediate holding plate projection plane A obtained by projecting the inspection apparatus in the thickness direction of the intermediate holding plate as described above. Just do it. That is, when not arranged in a grid pattern, it is not constrained by such a relative positional relationship, and as described above, on the intermediate holding plate projection surface A obtained by projecting the inspection device in the thickness direction of the intermediate holding plate. As long as they are arranged at different positions.

  In this case, the separation distance between the first contact support positions 38A adjacent to each other and the separation distance between the second contact support positions 38B are preferably 10 to 100 mm, more preferably 12 to 70 mm. Especially preferably, it is 15-50 mm.

  As the forming material of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35, a flexible material is used. The flexibility of these plates is 50 kgf from above when both ends of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 are horizontally arranged with 10 cm intervals. The deflection caused by pressurizing at a pressure of 0.02% or less of the width of these insulating plates is such that destruction and permanent deformation do not occur even when pressurizing at a pressure of 200 kgf from above. preferable.

Specifically, the material of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 is an insulating material having a specific resistance of 1 × 10 ¹⁰ Ω · cm or more, such as a polyimide resin or a polyester resin. , Polyamide resin, phenol resin, polyacetal resin, polybutylene terephthalate resin, polyethylene terephthalate resin, syndiotactic polystyrene resin, polyphenylene sulfide resin, polyether ethyl ketone resin, fluorine resin, polyether nitrile resin, polyether sulfone resin Resin materials with high mechanical strength such as polyarylate resin and polyamide-imide resin, glass fiber reinforced epoxy resin, glass fiber reinforced polyester resin, glass fiber reinforced polyimide resin, glass fiber reinforced phenolic resin, glass fiber reinforced fluorine resin Glass fiber type composite resin material, carbon fiber reinforced epoxy resin, carbon fiber reinforced polyester resin, carbon fiber reinforced polyimide resin, carbon fiber reinforced phenol resin, carbon fiber reinforced fluorocarbon resin, etc., Examples thereof include a composite resin material in which an inorganic material such as silica, alumina, or boron nitride is filled in an epoxy resin or a phenol resin, or a composite resin material in which a mesh is contained in an epoxy resin or a phenol resin. Moreover, the composite board material etc. which were comprised by laminating | stacking two or more board | plate materials which consist of these materials can also be used.

  The thicknesses of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 are in accordance with the types of materials constituting the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35. Although it selects suitably, Preferably it is 1-10 mm. For example, a glass fiber reinforced epoxy resin having a thickness of 2 to 5 mm can be used.

  As a method of movably supporting the conductive pins 32 on the first insulating plate 34 and the second insulating plate 35, the methods shown in FIGS. 32 to 34 can be cited in addition to the method shown in FIG. it can. In this example, as illustrated as the conductive pins 32, in this example, a bent holding plate 84 is provided between the first insulating plate 34 and the second insulating plate 35.

In addition, a cylindrical metal pin is used as the conductive pin 32.
As shown in FIG. 32, the bent holding plate 84 is formed with a through hole 85 through which the conductive pin 32 is inserted. The conductive pin 32 has a through hole 83a formed in the first insulating plate 34, a through hole 83b formed in the second insulating plate 35, and a through hole 85 formed in the bent holding plate 84 as fulcrums. They are pressed laterally in opposite directions and bent at the position of the through hole 85 of the bending holding plate 84, whereby the conductive pin 32 is supported so as to be movable in the axial direction.

The intermediate holding plate 36 is formed with a through hole 86 having a diameter large enough not to contact the conductive pin 32, and the conductive pin 32 is inserted into the through hole 86.
The conductive pin 32 is supported by the first insulating plate 34 and the second insulating plate 35 in the procedure shown in FIGS. 33 (a) to 33 (c). As shown in FIG. 33A, the through hole 83a of the first insulating plate 34 and the through hole 83b formed in the second insulating plate 35 and the through hole 85 of the bent holding plate 84 are in the axial direction. The bending holding plate 84 is disposed at the aligned position.

  Next, as shown in FIG. 33 (b), the conductive pin 32 extends from the through hole 83 a of the first insulating plate 34 to the through hole 83 b of the second insulating plate 35 through the through hole 85 of the bent holding plate 84. insert.

  Next, as shown in FIG. 33 (c), the bending holding plate 84 is moved in the lateral direction (horizontal direction) perpendicular to the axial direction of the conductive pin 32, and the position of the bending holding plate 84 is adjusted by an appropriate means. Fix it. As a result, the conductive pins 32 are opposite to each other with the through hole 83 b formed in the first insulating plate 34 and the second insulating plate 35 and the through hole 85 of the bent holding plate 84 as fulcrums. It is pressed in the lateral direction and bent at the position of the through hole 85 of the bending holding plate 84, whereby the conductive pin 32 is supported so as to be movable in the axial direction.

  By being configured in this way, the conductive pin 32 can be held between the first insulating plate 34 and the second insulating plate 35 so as to be movable in the axial direction and not to fall off, Since the pin having a simple structure having a cylindrical shape can be used as the conductive pin 32, the cost of the conductive pin 32 and the member holding it can be suppressed as a whole.

The position where the bent holding plate 84 is disposed may be between the first insulating plate 34 and the intermediate holding plate 36.
In the inspection apparatus of the present embodiment configured as described above, as shown in FIG. 2, the electrodes 2 and 3 of the circuit board 1 to be inspected are connected to the relay boards 29a and 29b, the pitch conversion boards 23a and 23b, the first The base plates 46a and 46b arranged on the outermost side through the two anisotropic conductive sheets 26a and 26b, the conductive pins 32a and 32b, the third anisotropic conductive sheets 42a and 42b, and the connector boards 43a and 43b By pressing the tester with a predetermined pressure, the tester is electrically connected to a tester (not shown), and electrical inspection such as electrical resistance measurement between electrodes of the circuit board 1 to be inspected is performed.

The pressure pressed from the upper and lower first inspection jigs 11a and 11b against the circuit board to be inspected at the time of measurement is, for example, 100 to 250 kgf.
Hereinafter, the circuit board to be inspected between the first inspection jig 11a and the second inspection jig 11b with reference to FIGS. 36 to 39 (for convenience, only the second inspection jig 11b is shown). A pressure absorbing action and a pressure dispersing action when both surfaces of 1 are clamped will be described.

  As shown in FIG. 37, when electrical inspection is performed by sandwiching both surfaces of the circuit board 1 to be inspected between the first inspection jig 11a and the second inspection jig 11b. In the initial stage of pressure, the relay pin unit 31 moves in the thickness direction of the conductive pins 32, the elastic portion of the relay substrate 29, the second anisotropic conductive sheet 26, and the third anisotropic conductive sheet 42. The pressure can be absorbed by the rubber elastic compression, and the height variation of the inspected electrode of the inspected circuit board 1 can be absorbed to some extent.

A first contact support position between the first support pin and the intermediate holding plate and a second contact support position between the second support pin and the intermediate holding plate are in the thickness direction of the intermediate holding plate. Since they are arranged at different positions on the projected intermediate holding plate projection surface, a force acts in the vertical direction as shown by the arrows in FIG. 38, and as shown in FIG. 39, the first inspection jig 11a. When the circuit board 1 to be inspected is further pressed between the second inspection jig 11b and the second inspection jig 11b, the elastic portion of the relay substrate 29, the second anisotropic conductive sheet 26, and the third In addition to the rubber elastic compression of the anisotropic conductive sheet 42, the first insulating plate 34, the second insulating plate 35, and between the first insulating plate 34 and the second insulating plate 35 of the relay pin unit 31. Variation of the electrodes to be inspected of the circuit board 1 to be inspected due to the spring elasticity of the intermediate holding plate 36 disposed in For example, it is possible to solder ball electrodes with respect to height variation, by dispersing pressure concentration, to avoid local stress concentration.

  That is, as shown in FIGS. 38 and 39, the intermediate holding plate 36 has the second insulating plate 35 centered on the first support pin 33 and the first contact support position 38 </ b> A with respect to the intermediate holding plate 36. The intermediate holding plate 36 is bent around the second contact support position 38B between the second support pin 37 and the intermediate holding plate 36, as shown in FIG. It bends in the direction of the first insulating plate 34 (see the portion D surrounded by the one-dot chain line in FIG. 39). Here, “bend” and “bend direction” refer to the bend so that the intermediate holding plate 36 protrudes in a convex direction and the protruding direction thereof.

  As described above, the intermediate holding plate 36 bends in the opposite directions around the first contact support position 38A and the second contact support position 38B, so that the first inspection jig 11a and the second inspection jig 11a When the circuit board 1 to be inspected is further pressurized with the inspection jig 11b, the spring elastic force of the intermediate holding plate 36 is exerted.

  39, the height of the conductive pin 32b is absorbed by the compression of the protruding portion of the conductive path forming portion of the second anisotropic conductive sheet 26, as indicated by the B portion surrounded by the one-dot chain line in FIG. The pressure that cannot be absorbed by the compression of the protrusion is applied to the first insulating plate 34b.

  Therefore, as shown by a portion C surrounded by a one-dot chain line in FIG. 39, the first insulating plate 34 and the second insulating plate 35 are also in contact with the first support pin 33 and the second support pin 37. When the circuit board 1 to be inspected is further pressed between the first inspection jig 11a and the second inspection jig 11b, the first and second inspection jigs 11b are bent. The spring elastic force of the insulating plate 34 and the second insulating plate 35 is exhibited.

  As a result, stable electrical contact is ensured with respect to each of the electrodes to be inspected of the circuit board 1 to be inspected having a height variation, and further, stress concentration is reduced, so that the elastic portion of the relay substrate 29 is locally localized. Damage is suppressed. As a result, since the repeated use durability of the relay substrate 29 is improved, the number of times of replacement is reduced, and the inspection work efficiency is improved.

  40 is a cross-sectional view similar to FIG. 36 for explaining another embodiment of the inspection apparatus of the present invention (only the second inspection jig is shown for convenience), and FIG. 41 is an enlarged view of the relay pin unit. It is sectional drawing. This inspection apparatus has basically the same configuration as the inspection apparatus shown in FIG. 1, and the same reference numerals are assigned to the same components. In this inspection apparatus, as shown in FIGS. 40 and 41, a plurality (three in this embodiment) of intermediate holding plates 36 are provided between the first insulating plate 34 and the second insulating plate 35. The holding plate support pins 39 are arranged between the adjacent intermediate holding plates 36 while being spaced apart from each other by a predetermined distance.

In this case, in at least one intermediate holding plate 36b, the holding support position of the holding plate support pin 39b that comes into contact with the intermediate holding plate 36b from one surface side with respect to the intermediate holding plate 36b, and the other surface with respect to the intermediate holding plate 36b. The intermediate support projected from the contact position of the first support pin 33b, the second support pin 37b, or the holding plate support pin 39b with respect to the intermediate holding plate 36b in the thickness direction of the intermediate holding plate 36b. It is necessary that they are arranged at different positions on the plate projection surface.

  Most preferably, in all of the intermediate holding plates 36b, the holding plate support pins 39b that come into contact with the intermediate holding plate 36b from one surface side are in contact with the intermediate holding plate 36b, and the other surface of the intermediate holding plate 36b. The intermediate support projected from the contact position of the first support pin 33b, the second support pin 37b, or the holding plate support pin 39b with respect to the intermediate holding plate 36b in the thickness direction of the intermediate holding plate 36b. They are arranged at different positions on the plate projection plane.

  In this case, although not described in detail, the “different positions” means the first contact support position 38A between the first support pin 33 and the intermediate holding plate 36 and the second support pin 37 in the above-described embodiment. And the relative position described with respect to the relationship between the intermediate holding plate 36 and the second contact support position 38B.

  In the present embodiment, in the upper intermediate holding plate 36b among the three intermediate holding plates 36b, the holding support position 39A of the holding plate support pin 39b that comes into contact with the intermediate holding plate 36b from the one surface side with respect to the intermediate holding plate 36b; The intermediate support plate projection surface projected from the contact support position 38A of the first support pin 33b that contacts the intermediate support plate 36b from the other side with respect to the intermediate support plate 36b in the thickness direction of the intermediate support plate 36b. Are arranged at different positions.

  Further, in the middle intermediate holding plate 36b among the three intermediate holding plates 36b, the holding support position 39A of the holding plate support pin 39b that comes into contact with the intermediate holding plate 36b from one side and the intermediate holding plate 36b, and the intermediate holding plate The holding support position 39A of the holding plate support pin 39b that is in contact with the plate 36b from the other surface side with respect to the intermediate holding plate 36b is at a different position on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate 36b. Is arranged.

  Further, in the lower intermediate holding plate 36b among the three intermediate holding plates 36b, the holding support position 39A of the holding plate support pin 39b that comes into contact with the intermediate holding plate 36b from one surface side with respect to the intermediate holding plate 36b, The contact support position 38B of the second support pin 37b that contacts the holding plate 36b from the other surface side with respect to the intermediate holding plate 36b is different on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate 36b. Placed in position.

  With this configuration, the spring elasticity is further exhibited by the plurality of intermediate holding plates 36, and the pressure concentration is distributed with respect to the height variation of the electrodes to be inspected of the circuit board 1 to be inspected. Thus, local stress concentration can be further avoided, and local breakage of the elastic portion of the relay board 29 is suppressed. As a result, the repeated use durability of the relay board 29 is improved. The number of replacements is reduced and inspection work efficiency is improved.

The number of intermediate holding plates 36 is not particularly limited as long as it is plural.
As mentioned above, although embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range which does not deviate from the summary.

  For example, the circuit board 1 to be inspected may be a semiconductor integrated circuit device such as a package IC, MCM, or CSP, or a circuit device formed on a wafer, in addition to a printed circuit board. Further, the printed circuit board may be a single-sided printed circuit board as well as a double-sided printed circuit board.

The first inspection jig 11a and the second inspection jig 11b are not necessarily the same in materials used, member structures, and the like, and they may be different.
The tester-side connector may be configured by laminating a plurality of circuit boards such as connector boards and anisotropic conductive sheets.

  In the above embodiment, as the second anisotropic conductive sheet 26 and the third anisotropic conductive sheet 42, a plurality of conductive path forming portions extending in the thickness direction and insulation that insulates these conductive path forming portions from each other. And the conductive particles are contained only in the conductive path forming part, whereby the conductive particles are dispersed unevenly in the surface direction, and the conductive path forming part protrudes on one side of the sheet However, the present invention is not necessarily limited to this.

  Further, as shown in FIGS. 1, 2, 36, 37, 39, and 40, support pins 49 may be arranged between the connector board 43 and the base plate 46 in the tester side connector 41. Good. These support pins 49 have the same action as the first support pin 33 and the second support pin 37 (the first support pin 33, the second support pin 37, and the holding plate support pin 39 in FIG. 40). Thus, it is possible to provide an effect of dispersing the surface pressure. In order to give this surface pressure dispersion action, it is preferable to arrange these so that the position of the support pin 49 and the position of the second support pin 37 are different from each other in the surface direction.

Specific examples and comparative examples of the present invention are shown below.
[Example 1]
A circuit board inspection for inspecting the following evaluation circuit board as shown in FIG. 1, which is suitable for an inspection section of a rail conveyance type automatic circuit board inspection machine (manufactured by Nidec Reed, product name: STARREC V5). A device was made.
(1) Circuit board for evaluation 1
An evaluation circuit board 1 having the following specifications was prepared.
Dimensions: 100mm (length) x 100mm (width) x 0.8mm (thickness)
Number of electrodes to be inspected on the upper surface side: 3600 Diameters of electrodes to be inspected on the upper surface side: 0.2 mm
Minimum arrangement pitch of the electrodes to be inspected on the upper surface side: 0.4 mm
Number of electrodes to be inspected on the lower surface side: 2600 Diameters of electrodes to be inspected on the lower surface side: 0.2 mm
Minimum arrangement pitch of the electrodes to be inspected on the lower surface side: 0.4 mm
(2) Pitch conversion substrate 23
A laminated material (Matsushita Electric Works, product name: R-1766) in which a thin metal layer made of copper having a thickness of 18 μm is formed on both surfaces of an insulating substrate made of glass fiber reinforced epoxy resin and having a thickness of 0.5 mm, A total of 7200 circular through-holes with a diameter of 0.1 mm, each penetrating in the thickness direction of the laminated material, were formed by a numerically controlled drilling apparatus.

  In this case, the two through holes are formed as a set at a position corresponding to the electrode to be inspected on the upper surface side of the evaluation circuit board, and the set of through holes is formed with a gap of 0.1 mm. (That is, it means that the gap between the through hole A = 0.1 mm and the through hole B = 0.1 mm is set to be 0.1 mm).

  Thereafter, the laminated material in which the through holes are formed is subjected to an electroless plating process using an EDTA type copper plating solution, thereby forming a copper plating layer on the inner wall of each through hole. By using the electrolytic copper plating treatment, a cylindrical via hole having a thickness of about 10 μm was formed in each through hole to electrically connect the thin metal layers on the surface of the laminated material to each other.

Next, a dry film resist (product name: FP-225, manufactured by Tokyo Ohka Kogyo Co., Ltd.) having a thickness of 25 μm is laminated on the metal thin layer on the surface of the laminated material to form a resist layer, and the metal on the other side of the laminated material A protective seal was placed on the thin layer. A photomask film is disposed on the resist layer, and the resist layer is subjected to an exposure process using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), followed by a development process, whereby a resist pattern for etching is formed. Formed. Then, by applying an etching process to the thin metal layer on the surface on which the resist pattern is formed, 7200 connection electrodes having a rectangular shape of 60 μm wide and 120 μm long, and each connection electrode and via hole are formed on the surface of the insulating substrate. A pattern wiring portion having a line width of 100 μm for electrically connecting the two was formed, and then the resist pattern was removed.

  Next, a dry film resist (product name: FP-225, manufactured by Tokyo Ohka Kogyo Co., Ltd.) having a thickness of 25 μm is laminated on the surface of the laminated material on which the connection electrode and the pattern wiring portion are formed, and a resist layer is formed. A photomask film is placed on the layer, and the resist layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), and then developed to expose the respective connection electrodes. 7200 rectangular openings having a horizontal direction of 60 μm and a vertical direction of 120 μm were formed.

  Then, using the copper sulfate plating solution, the thin metal layer on the other side of the laminated material was used as a common electrode, and 7200 connection electrodes were formed by subjecting each connection electrode to electrolytic copper plating. Next, the resist pattern was removed.

  Next, the protective seal on the thin metal layer on the other side of the laminated material is removed, and a dry film resist (product name: FP-225, manufactured by Tokyo Ohka Kogyo Co., Ltd.) having a thickness of 25 μm is laminated on the thin metal layer on this side. A resist layer was formed. Thereafter, a photomask film is disposed on the resist layer, and the resist layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.). A resist pattern for etching was formed on the thin layer.

  Next, a protective seal is applied to the surface on which the connection electrode of the laminated material is formed, and then an etching process is performed to electrically connect 7200 terminal electrodes, each terminal electrode, and the via hole to the back surface of the insulating substrate. The pattern wiring part to be connected was formed, and the resist pattern was removed.

  Next, an insulating layer is formed by laminating a dry film solder resist (made by Nichigo Morton, product name: conform mask 2015) having a thickness of 38 μm on the back surface of the insulating substrate on which the terminal electrode and the pattern wiring portion are formed. A photomask film is placed on the surface, and then the insulating layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.) and then developed to provide an electrode with a diameter of 0.4 mm. 7200 openings were formed.

  As described above, the pitch conversion substrate 23a for the first inspection jig 11a was produced. This substrate 23a for pitch conversion has a vertical and horizontal dimension of 120 mm × 160 mm, a thickness of 0.5 mm, and the dimension of the portion exposed from the insulating layer surface of the connection electrode 25 is about 60 μm in the horizontal direction and about 120 μm in the vertical direction The protrusion height of the electrode 25 from the insulating layer surface is about 30 μm, the distance between the paired connection electrodes 25 is 30 μm, the diameter of the terminal electrode 24 is 0.4 mm, and the arrangement pitch of the terminal electrodes 24 is 0.75 mm. Met.

  Further, in the same manner as described above, a pitch conversion substrate 23b for the second inspection jig 11b having 5200 connection electrodes 25 on the front surface and 5200 terminal electrodes 24 on the back surface was produced.

The pitch converting substrate 23b has a vertical and horizontal dimension of 120 mm × 160 mm and a thickness of 0.5 mm.
mm, about 60 μm in the lateral direction of the portion of the connecting electrode 25 exposed on the surface of the insulating layer, about 120 μm in the vertical direction, and about 30 μm in the protruding height from the surface of the insulating layer in the connecting electrode 25, for paired connection The distance between the electrodes 25 is 30 μm, the diameter of the terminal electrodes 24 is 0.4 mm, and the arrangement pitch of the terminal electrodes 24 is 0.75 mm.
(3) Relay board 29
1. Manufacturing of substrate Etching is performed on a liquid crystal polymer copper clad laminate (Nippon Steel Chemical Co., Ltd .: Espanex LB18-25-18NEP) having a thickness of 25 μm with copper foil on both sides, and removing the copper foil on both sides A liquid crystal polymer sheet having a thickness of 25 μm was obtained.

  This liquid crystal polymer sheet is laminated with a metal mask for laser processing made of copper having a thickness of 18 μm and having an opening corresponding to the through-hole to be formed. A predetermined through-hole was formed in the liquid crystal polymer sheet by irradiating with laser light.

  In the above, the laser processing by the carbon dioxide laser device uses the carbon dioxide laser processing machine “ML-605GTX” (manufactured by Mitsubishi Electric Corporation), under the conditions of a laser beam diameter of 60 μm and a laser output of 0.8 mJ, This was performed by irradiating one processing point with 10 shots of a laser beam.

The dimensions of the obtained substrate 73, the number of through holes, and the diameter are as follows.
[Substrate 73a for Upper Relay Board 29a]
Dimensions: 90mm (length) x 90mm (width) x 25μm (thickness)
Number of through holes: 3600 Diameter of through hole: 0.3 mm
[Substrate 73b for Lower Relay Board 29b]
Dimensions: 90mm (length) x 90mm (width) x 25μm (thickness)
Number of through holes: 2600 Diameter of through holes: 0.3 mm
2. Formation of conductive elastomer layer In 100 parts by weight of addition-type liquid silicone rubber, 400 parts by weight of conductive particles (the ratio of gold to the core particles is 2% by weight) in which core particles of nickel are coated are dispersed. Thus, a conductive elastomer material was prepared. By applying this conductive elastomer material to the surface of a releasable support plate 65 made of stainless steel having a thickness of 5 mm by screen printing, a conductive material having a thickness of 0.05 mm is formed on the releasable support plate 65. An elastomer material layer 61A was formed (FIG. 7).

Next, the conductive elastomer material layer 65 is subjected to a curing process at 120 ° C. for 1 hour while applying a magnetic field of 2 Tesla in the thickness direction by an electromagnet, thereby forming the material layer 65 on the releasable support plate 65. A supported conductive elastomer layer 65B having a thickness of 0.05 mm was formed (FIG. 10).
3. Formation of conductive path forming portion By performing electroless plating on the surface of conductive elastomer layer 65B supported on releasable support plate 65, metal thin layer 66 made of copper having a thickness of 0.3 μm is formed. Then, a resist layer 67 having a thickness of 25 μm, in which 7200 rectangular openings having a width of 60 μm and a length of 120 μm were formed by photolithography, was formed on the thin metal layer 66 (FIG. 12). . Thereafter, the surface of the metal thin layer 66 was subjected to electrolytic plating, thereby forming a metal mask 68 made of copper having a thickness of about 20 μm in the opening of the resist layer 67 (FIG. 13). In this state, the conductive elastomer layer 65B, the metal thin layer 66, and the resist layer 67 around the metal mask 68 are subjected to laser processing with a carbon dioxide gas laser device, whereby the releasable support plate 65 is covered. 7200 conductive path forming portions 61 supported on the substrate (FIG. 15B), and then the remaining conductive elastomer layer obtained by cutting the conductive path forming portion 61 by laser processing is peeled off, so that FIG. Only the conductive path forming part 61 was left on the releasable support plate 65 as shown in FIG. Thereafter, the remaining thin metal layer 66 and metal mask 68 were removed from the surface of the conductive path forming portion 61 by etching.

In the above, the laser processing by the carbon dioxide laser device uses the carbon dioxide laser processing machine “ML-605GTX” (manufactured by Mitsubishi Electric Corporation), under the conditions of a laser beam diameter of 60 μm and a laser output of 0.8 mJ, This was performed by irradiating one processing point with 10 shots of a laser beam.
4). Formation of Insulating Portion An additional liquid silicone rubber was applied to the surface of the releasable support plate 70 to provide a silicone rubber layer having a thickness of 15 μm (FIG. 25 (a)).

  A substrate 73 made of a liquid crystal polymer sheet is placed on the surface of the releasable support plate 70 via the silicone rubber layer (FIG. 25 (b)), and the additional liquid silicone rubber is placed in the through hole of the substrate 73. By application, an insulating part material layer 62A having a total thickness of 0.05 mm is formed (FIG. 25C), and 7200 conductive path forming parts 61 are formed on the insulating part material layer 62A. The released releasable support plates 65 were aligned and overlapped (FIG. 26 (a)).

  Then, by applying a pressure of 20 kgf to the releasable support plate 65, the thickness of the conductive path forming portion 61 is elastically compressed from 0.05 mm to 0.04 mm, and in this state, the condition of 120 ° C. for 1 hour Then, the insulating portion 62 is formed between the adjacent conductive path forming portions 61 by curing the insulating portion material layer 62 (FIG. 26B), and then released from the releasable support plate. Thus, the relay substrate 29a for the first inspection jig 11a was manufactured (FIG. 26C).

  The thus-prepared relay substrate 29a for the first inspection jig 11a has a size of the substrate 73a of 90 mm (vertical) × 90 mm (horizontal) × 25 μm (thickness), and the number of conductive path forming portions 61a is 7200. The dimension of the conductive path forming portion 61a is 60 μm wide, 120 μm long, the thickness is approximately 0.05 mm, the thickness of the insulating portion 62a is approximately 0.03 mm, the width of the insulating portion 62a between the adjacent conductive path forming portions 61a is 30 μm, The total projecting height of the conductive path forming portion 61a from the insulating portion 62a was about 0.02 mm.

Further, the relay substrate 29b for the second inspection jig 11b was created by the same process as the relay substrate 29a for the first inspection jig 11a. In this relay substrate 29b, the number of conductive path forming portions 61b is 5200, the size of the conductive path forming portions 61b is 60 μm wide, 120 μm long, the thickness is approximately 0.05 mm, and the thickness of the insulating portion 62b is approximately 0.03 mm. The width of the insulating part 62b between the conductive path forming parts 61b to be performed was 30 μm, and the total projecting height of the conductive path forming part 61b from the insulating part 62b was about 0.02 mm.
(4) Circuit board side connector 21
The relay substrate 29 is disposed on one surface side of the pitch conversion substrate 23, and on the back surface side, a plurality of conductive path forming portions extending in the thickness direction and insulating portions that insulate them from each other are formed. The circuit board-side connector 21 was formed by arranging a second anisotropic conductive sheet 26 made of an unevenly distributed anisotropic conductive sheet with a projecting portion protruding.

Note that the second anisotropic conductive sheet 26 disposed between the pitch conversion substrate 23 and the relay pin unit 31 has the shape shown in FIG. 29, and specifically uses the following configuration. did.
[Second anisotropic conductive sheet 26]
Dimensions: 110mm x 150mm
Thickness of conductive path forming part: 0.6 mm
Outside diameter of conductive path forming part: 0.35 mm
Projection height of conductive path forming part: 0.05mm
Conductive particles: material: nickel particles subjected to gold plating treatment, average particle diameter: 35 μm, content of conductive particles in the conductive path forming portion: 30% by volume
Elastic polymer material: material; silicone rubber, hardness: 30
(5) Relay pin unit 31
The material of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 is made of an insulating material having a specific resistance of 1 × 10 ¹⁰ Ω · cm or more and a glass fiber reinforced epoxy resin. A 1.9 mm one was used.

The distance L1 between the first insulating plate 34 and the intermediate holding plate 36 is 36.3 mm, and the distance L2 between the second insulating plate 35 and the intermediate holding plate 36 is 3 mm. The first support pin 33 (diameter 2 mm, length 36.3 mm) and the second support pin 37 (diameter 2 mm, length 3 mm) are fixedly supported, and the first insulating plate 34 and the second The conductive pin 32 having the following configuration was disposed in the through hole 83 (diameter 0.4 mm) between the insulating plate 35 and the insulating plate 35.
[Conductive pin]
Material: Brass tip 81a with gold plating treatment Dimensions: Outer diameter 0.35mm, Overall length 2.1mm
Center part 32 dimension outer diameter 0.45mm, total length 41mm
Dimensions of base end 81b: outer diameter 0.35mm, total length 2.1mm
The first contact support position 38A of the first support pin 33 with respect to the intermediate holding plate 36 and the second contact support position 38B of the second support pin 37 with respect to the intermediate support plate 36 are shown in FIG. As shown, they were arranged in a grid. The separation distance between the first contact support positions 38A adjacent to each other and the separation distance between the second contact support positions 38B were set to 17.5 mm.
(6) Tester side connector 41
As shown in FIG. 1, the tester-side connector 41 is composed of a third anisotropic conductive sheet 42, a connector substrate 43, and a base plate 46. In addition, the 3rd anisotropic conductive sheet 42 used the thing similar to the 2nd anisotropic conductive sheet 26 mentioned above.
Performance test Measurement of minimum press pressure The prepared inspection apparatus was set in an inspection section of a rail transport type automatic circuit board inspection machine “STARREC V5”, and the prepared evaluation circuit board 1 was set for the inspection apparatus.

  Then, the press pressure of the rail conveyance type automatic circuit board inspection machine “STARCREC V5” is changed stepwise within the range of 100 to 210 kgf, and 10 times each for each press pressure condition, For the inspection electrode, the conduction resistance value was measured when a current of 1 milliampere was passed through the connection electrode for supplying current.

  An inspection point having a measured conduction resistance value of 10Ω or more (hereinafter referred to as “NG inspection point”) is determined as a continuity failure, and a ratio of NG inspection points to the total inspection points (hereinafter referred to as “NG inspection point ratio”). The lowest press pressure at which the NG inspection point ratio was 0.01% or less was defined as the minimum press pressure.

  In this inspection apparatus, in practice, the NG inspection point ratio is required to be 0.01% or less, and when the NG inspection point ratio exceeds 0.01%, the circuit to be inspected is a good product. Since an erroneous inspection result that the board is defective may be obtained, there is a possibility that a highly reliable electrical inspection of the circuit board cannot be performed.

  In the measurement of the conduction resistance value, after the measurement of one conduction resistance value is completed, the press pressure related to the measurement is released to return the inspection device to the non-pressurized state, and the next measurement of the conduction resistance value is performed again. This was performed by applying a pressing pressure of a predetermined magnitude.

  The number of the upper surface inspected electrodes and the number of the lower surface inspected electrodes of the evaluation circuit board 1 were 2600 points, and the measurement was performed 10 times under each press pressure condition. Therefore, the NG inspection point ratio was expressed by the equation (3600 + 2600). ) × 10 = 62000 indicates the ratio of NG inspection points to 62,000 inspection points.

The measurement results are shown in Table 1.
Note that “the minimum press pressure is small” means that the circuit board to be inspected can be electrically inspected with a low press pressure. If the pressurization pressure at the time of inspection can be set low, it is possible to suppress deterioration of the circuit board to be inspected, the anisotropic conductive sheet, and the pitch conversion substrate due to the pressurization pressure at the time of inspection.

And since it becomes possible to use components with low durability strength as a structural member of a test | inspection apparatus, the structure of a test | inspection apparatus can be made small and compact.
As a result, it is possible to improve the durability of the inspection device and reduce the cost of manufacturing the inspection device.
2. Measurement of durability of relay board The prepared inspection apparatus was set in an inspection section of a rail conveyance type automatic circuit board inspection machine “STARREC V5”.

  The evaluation circuit board 1 prepared for the inspection apparatus was set, and the press pressure condition of the rail transport type circuit board automatic inspection machine “STARCREC V5” was set to 130 kgf, and pressurization was performed a predetermined number of times.

  Thereafter, for the electrode to be inspected on the evaluation circuit board 1, the conduction resistance value is measured 10 times when a current of 1 milliampere is applied to the inspection electrode under the condition of the press pressure of 130 kgf, and the predetermined number of pressurizations are performed. Similarly, the operation of measuring the conduction resistance value 10 times was repeated.

An inspection point (NG inspection point) having a measured conduction resistance value of 10Ω or more was determined as a continuity failure, and a ratio of NG inspection points to the total inspection points (NG inspection point ratio) was calculated.
Next, the relay board of the inspection apparatus is replaced with a new one, and pressurization is performed a predetermined number of times under the same conditions as above except that the press pressure condition is changed to 150 kgf, and the NG inspection point ratio is determined by the same method as above. Calculated.

  After the measurement of one conduction resistance value is completed, the press pressure related to the measurement is released to return the inspection device to the non-pressurized state, and the next measurement of the conduction resistance value is performed with a press pressure of a predetermined magnitude. This was done by reacting again.

The measurement results are shown in Table 2.
3. Evaluation of insulation The insulation resistance between the connecting electrodes forming a pair in the adapter body composed of the pitch conversion substrate 23 and the relay substrate 29 was evaluated as follows.

For the evaluation of the insulation resistance between the connecting electrodes, a glass epoxy substrate having a surface of 100 mm, a width of 100 mm, and a thickness of 0.8 mm and having a surface coated with an insulating coating was used.
The created inspection apparatus was set in an inspection section of a rail transport type circuit board automatic inspection machine “STARREC V5”, and the glass epoxy substrate was set on the inspection apparatus.

And press pressure of rail transport type circuit board automatic inspection machine “STARREC V5”
It was changed stepwise within the range of 100 to 210 kgf. Then, the insulation resistance between each pair of inspection electrodes 25 provided on the adapter body for the first inspection jig 11a was measured 10 times for each press pressure condition.

Specifically, the conduction resistance value of the pair of test electrodes 25 was measured while applying a current of 1 milliampere through the terminal electrode 24 corresponding to the pair of connection electrodes 25.
By this method, the insulation resistance value between the paired connection electrodes 25, that is, the insulation resistance value of the insulation part 62 between the paired conductive path forming parts 61 in the relay substrate 29 was measured.

  A connection electrode pair having a measured insulation resistance value of 100Ω or more is determined to have good insulation, and a ratio of points determined to have good insulation with respect to the total number of inspection points (hereinafter referred to as “insulation passing point ratio”) is calculated. did.

  As for the connection electrodes 25 in the adapter body for the first inspection jig 11a, 7200 are 3600 pairs, that is, there are 3600 connection electrode pairs, and 10 times in each press pressure condition. Since the measurement was performed, the insulating passing point ratio indicates the ratio of the NG inspection points to the 36,000 inspection points calculated by the equation (3600) × 10 = 36000.

  In this inspection apparatus, in practice, it is required that the insulating passing point ratio is 99.9% or more. When the insulating passing point ratio is less than 99.9%, at the time of inspection, A leakage current flows from the connection electrode used as the current supply electrode to the connection electrode used as the voltage measurement electrode.

  As a result, an erroneous inspection result may be obtained for a circuit board to be inspected, which is a non-defective circuit board to be inspected, so that a highly reliable circuit board electrical inspection is performed. There is a risk that it will not be possible.

The evaluation results are shown in Table 3.
[Comparative Example 1]
Instead of the relay pin unit 31 of the first embodiment, conventional relay pin units 131a and 131b as shown in FIG. 42 are used. That is, a large number (8000 pins) of conductive pins 132a and 132b arranged on lattice points at a constant pitch (2.54 mm pitch), and insulating plates 134a and 134b that support the conductive pins 132a and 132b so as to be movable up and down. The thing which has was used. Other than that, the inspection apparatus for comparison was manufactured in the same configuration as in Example 1.

With respect to the manufactured inspection apparatus for comparison, the minimum press pressure and the durability of the relay substrate were measured in the same manner as in Example 1.
The measurement results of the minimum press pressure are shown in Table 1, and the measurement results of durability are shown in Table 2.
[Comparative Example 2]
In the inspection apparatus of Example 1, instead of the relay substrate 29, a distributed anisotropic conductive sheet having a thickness of 100 μm was disposed between the pitch conversion substrate 23 and the evaluation circuit substrate 1.

With respect to the adapter body composed of the pitch conversion substrate and the dispersive anisotropic conductive sheet in the produced comparative inspection apparatus, the insulation was evaluated by the method described above. The insulating evaluation results are shown in Table 3.
[Comparative Example 3]
The dispersed anisotropic conductive sheet having a thickness of 100 μm used in Comparative Example 2 was replaced with a dispersed anisotropic conductive sheet having a thickness of 40 μm.

  And about the produced comparison test | inspection apparatus, by the method similar to Example 1, the measurement of the minimum press pressure, the measurement of durability of an anisotropic conductive sheet, and the evaluation of insulation were performed. Table 1 shows the measurement results of the minimum press pressure, Table 2 shows the measurement results of the durability, and Table 3 shows the measurement results of the insulation properties of the substrate for pitch conversion.

The dispersed anisotropic conductive sheets used in Comparative Example 2 and Comparative Example 3 were obtained as follows.
<Manufacture of dispersive anisotropic conductive sheet>
25 parts by volume of conductive particles having an average particle diameter of 20 μm were added to and mixed with 100 parts by volume of a mixture obtained by mixing A liquid and B liquid of two-pack type addition type liquid silicone rubber in equal proportions. .

  Then, the material for electroconductive elastomers was prepared by performing the defoaming process by pressure reduction. As the conductive particles, nickel particles were used as core particles, and the core particles were subjected to electroless gold plating (average coating amount: an amount corresponding to 5% by weight of the weight of the core particles).

  Two polyester resin sheets having a glossy surface (surface roughness of 0.04 μm) and a non-glossy back surface and a thickness of 0.1 mm (product name “Mattle Mirror S10”) were prepared. Then, a frame-shaped spacer having a rectangular opening of 120 mm × 200 mm and a thickness of 100 μm was disposed on the surface of one polyester resin sheet.

  The prepared conductive elastomer material was applied into the opening of the spacer, and the other polyester resin sheet was disposed on the conductive elastomer material so that the surface thereof was in contact with the conductive elastomer material.

  Then, using the pressure roll apparatus which consists of a pressure roll and a support roll, the material layer for conductive elastomers having a thickness of 100 μm was formed by sandwiching the material for conductive elastomers with two polyester resin sheets.

  Next, an electromagnet is disposed on the back surface of each of the two polyester resin sheets, and a parallel magnetic field of 0.3 T is applied to the conductive elastomer material layer in the thickness direction at 120 ° C. for 30 minutes. A rectangular conductive elastomer sheet having a thickness of 100 μm was manufactured by performing a curing treatment on the molding material layer. The ratio of the conductive particles in the obtained conductive elastomer sheet was 12% in terms of volume fraction.

This conductive elastomer sheet was cut into 110 mm × 110 mm to obtain a dispersed anisotropic conductive elastomer sheet used in Comparative Example 2.
Moreover, in the above, the thickness of the spacer was changed to 40 μm, and the dispersion type anisotropic conductive elastomer sheet having a thickness of 40 μm used in Comparative Example 3 was obtained in the same manner.

FIG. 1 is a cross-sectional view showing an embodiment of the inspection apparatus of the present invention. FIG. 2 is a cross-sectional view showing a stacked state when the inspection apparatus of FIG. FIG. 3 is a diagram showing the surface of the pitch conversion board on the circuit board side. FIG. 4 is a diagram showing the pin side surface of the pitch conversion substrate. FIG. 5 is a cross-sectional view showing a state in which a pitch conversion substrate, a relay substrate, and a circuit board to be inspected are stacked. 6A is a partial cross-sectional view of the relay board, FIG. 6B is an enlarged view thereof, and FIG. 6C is a partial top view of the relay board. FIG. 7 is a cross-sectional view showing a state in which a conductive elastomer material layer is formed on a releasable support plate. FIG. 8 is an enlarged cross-sectional view of the conductive elastomer material layer. FIG. 9 is a cross-sectional view showing a state after a magnetic field is applied to the conductive elastomer material layer in the thickness direction. FIG. 10 is a cross-sectional view showing a state in which a conductive elastomer layer is formed on a releasable support plate. FIG. 11 is a cross-sectional view showing a state in which a thin metal layer is formed on the conductive elastomer layer. FIG. 12 is a cross-sectional view showing a state in which a resist layer having an opening is formed on a thin metal layer. FIG. 13 is a cross-sectional view showing a state in which a metal mask is formed in the opening of the resist layer. FIG. 14 is a cross-sectional view showing a state in which a plurality of conductive path forming portions are formed according to a specific pattern on the releasable support plate. FIG. 15 is a cross-sectional view showing a process of forming a conductive path forming portion by laser processing. FIG. 16 is a top view illustrating a process of forming a conductive path forming portion by laser processing. FIG. 17 is a cross-sectional view showing a laminate in which a resist layer having an opening formed in a thin metal layer is laminated. 18 is a cross-sectional view of a composite film in which a metal mask is formed in the opening of the resist layer in FIG. FIG. 19 is a cross-sectional view showing a state in which a conductive elastomer material layer is formed on a releasable support plate. FIG. 20 is a cross-sectional view showing a state in which the composite film is overlaid on the conductive elastomer material layer. FIG. 21 is a cross-sectional view showing a state after a magnetic field is applied to the laminated body of FIG. 20 in the thickness direction. FIG. 22 is a cross-sectional view showing a state where a conductive elastomer layer is formed on a releasable support plate. FIG. 23 is a cross-sectional view showing a state after the metal thin layer in FIG. 22 is removed. FIG. 24 is a cross-sectional view showing a state where a plurality of conductive path forming portions are formed according to a specific pattern on the releasable support plate. FIG. 25 is a cross-sectional view illustrating the manufacturing process of the relay board. FIG. 26 is a cross-sectional view illustrating the manufacturing process of the relay board. FIG. 27 is a partial cross-sectional view illustrating a state in which a pitch conversion substrate, a relay substrate, and a circuit board to be inspected are stacked via a first anisotropic conductive sheet. FIG. 28 is a partial cross-sectional view of the first anisotropic conductive sheet. FIG. 29 is a cross-sectional view of a second anisotropic conductive sheet. FIG. 30 is a cross-sectional view of the relay pin unit. FIG. 31 is a cross-sectional view showing a part of the conductive pin, the intermediate holding plate, and the insulating plate of the relay pin unit. FIG. 32 is a cross-sectional view similar to FIG. 31 showing another example of the relay pin unit. FIG. 33 is a cross-sectional view showing a process until a conductive pin is arranged between the first insulating plate and the second insulating plate in the configuration of FIG. FIG. 34 is a cross-sectional view of a relay pin unit having a bent holding plate. FIG. 35 is a partially enlarged view of the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate of the relay pin unit. FIG. 36 is a partial cross-sectional view showing an embodiment of the inspection apparatus of the present invention. FIG. 37 is a cross-sectional view for explaining the use state of the inspection apparatus of the present invention. FIG. 38 is a cross-sectional view illustrating a usage state of the relay pin unit in the inspection apparatus of the present invention. FIG. 39 is a cross-sectional view illustrating a use state of the inspection apparatus of the present invention. FIG. 40 is a partial cross-sectional view similar to FIG. 40 showing another embodiment of the inspection apparatus of the present invention. 41 is a cross-sectional view of the relay pin unit in the embodiment of FIG. FIG. 42 is a cross-sectional view of a conventional circuit board inspection apparatus. FIG. 43 is a diagram showing the relationship between the pitch of the electrodes to be inspected on the circuit board to be inspected and the electrode separation distance. FIG. 44 is a diagram illustrating the relationship among the pitch of the electrodes to be inspected on the circuit board to be inspected, the electrode separation distance, and the connection electrodes on the pitch conversion substrate. FIG. 45 is a diagram showing the relationship among the pitch of the electrodes to be inspected on the circuit board to be inspected, the electrode separation distance, and the connection electrodes on the pitch conversion board in the case of four-terminal inspection.

Explanation of symbols

29a, 29b Relay boards 31a, 31b Relay pin units 32a, 32b Conductive pins 33a, 33b First support pins 34a, 34b First insulating plates 35a, 35b Second insulating plates 36a, 36b Intermediate holding plates 37a, 37b First Second support pin 38A First contact support position 38B Second contact support position 39 Holding plate support pin 39A Contact support position 41a, 41b Tester side connectors 42a, 42b Third anisotropic conductive sheets 43a, 43b Connector boards 44a and 44b Tester side electrodes 45a and 45b Pin side electrodes 46a and 46b Base plates 49a and 49b Support pins 51 Insulating board 52 Wiring 53 Internal wiring 54 Insulating layer 55 Insulating layer 61 Conductive path forming part 61a Protruding part 61A Conductive elastomer Material layer 61B Conductive elastomer layer 62 Insulating part 62A Insulating part material layer 63 sheet base 64 metal film 65 releasable support plate 66 metal thin layer 67 resist layer 67a opening 68 metal mask 69 releasable support plate 71 conductive path forming part 72 insulating part 72a projecting part 73 substrate 75 through hole 81a, 81b End portion 82 Central portion 83, 83a, 83b Through hole 84 Bending holding plate 85 Through hole 86 Through hole 101 Circuit board 102 Inspected electrode 103 Inspected electrode 111a First inspection jig 111b Second inspection Jigs 121a and 121b Circuit board side connectors 122a and 122b First anisotropic conductive sheets 123a and 123b Pitch conversion boards 124a and 124b Terminal electrodes 125a and 125b Connection electrodes 126a and 126b Second anisotropic conductive sheets 127 Current supply electrode 128 Voltage measurement electrodes 131a and 131b Relay pin unit 13 2a, 132b Conductive pins 133a, 133b Support pins 134a, 134b Insulating plates 141a, 141b Tester side connectors 142a, 142b Third anisotropic conductive sheets 143a, 143b Connector boards 144a, 144b Tester side electrodes 145a, 145b Pin side electrodes 146a , 146b Base plate A Intermediate holding plate projection plane P Conductive particle L1 Distance L2 Distance Q1 Diagonal line Q2 Diagonal line R1 Unit lattice region R2 Unit lattice region

Claims (15)

A circuit board inspection apparatus that performs electrical inspection by sandwiching both surfaces of a circuit board to be inspected between a pair of first inspection jigs and a second inspection jig between the inspection jigs. ,
The first inspection jig and the second inspection jig are respectively
A pitch conversion substrate that converts the electrode pitch between one surface side and the other surface side of the substrate;
An insulating part made of an elastic polymer material and an insulating material made of an elastic polymer material containing conductive particles in a plurality of through holes formed in the substrate, which are arranged on the circuit board side to be inspected of the pitch conversion substrate. A relay board that relays the electrical connection between the substrate for pitch conversion and the circuit board to be inspected by the conductive path forming part formed with a conductive path forming part penetrating the part in the thickness direction;
A second anisotropic conductive sheet disposed on the opposite side of the pitch conversion substrate from the relay substrate;
A circuit board-side connector with
A plurality of conductive pins arranged at a predetermined pitch;
A pair of spaced apart first and second insulating plates for supporting the conductive pins movably in the axial direction;
A relay pin unit with
A connector board for electrically connecting the tester and the relay pin unit;
A third anisotropic conductive sheet disposed on the relay pin unit side of the connector board;
A base plate disposed on the side opposite to the relay pin unit of the connector board;
A tester-side connector with
The relay pin unit is
An intermediate holding plate disposed between the first insulating plate and the second insulating plate;
A first support pin disposed between the first insulating plate and the intermediate holding plate;
A second support pin disposed between the second insulating plate and the intermediate holding plate;
With
A first abutment support position of the first support pin with respect to the intermediate holding plate and a second abutment support position of the second support pin with respect to the intermediate holding plate are projected in the thickness direction of the intermediate holding plate. An inspection apparatus for circuit boards, wherein the inspection apparatus is arranged at different positions on the intermediate holding plate projection surface. The relay board is
By conducting laser processing on the conductive elastomer layer supported on the first releasable support plate and dispersed in the elastic polymer material in a state where the conductive particles exhibiting magnetism are oriented in the thickness direction, first processing is performed. Forming a conductive path forming portion arranged according to a predetermined pattern on the releasable support plate of
An uncured insulating material layer made of a material that is supported on the second releasable support plate and cured to become an elastic polymer substance is formed on both side surfaces of the substrate and inside the through-hole. Overlying the substrate, the first releasable support plate on which the conductive path forming portion is formed so that the conductive path forming portion is located in the through hole of the substrate,
In this state, the insulating layer is obtained by removing the first and second releasable support plates after forming the insulating portion by curing the insulating portion material layer. Item 4. The circuit board inspection apparatus according to Item 1. The conductive elastomer layer is
On the releasable support plate, a conductive elastomer material layer containing conductive particles exhibiting magnetism in a liquid elastomer material that is cured to become an elastic polymer substance is formed,
According to the pattern of the conductive path forming portion to be formed on the surface of the material layer for the conductive elastomer, a metal mask made of a metal exhibiting magnetism is formed,
By applying a magnetic field in the thickness direction to the conductive elastomer material layer, the conductive particles are oriented in the thickness direction, and then the conductive material is applied in a state where the magnetic field is applied or in a state where the magnetic field is stopped. 3. The circuit board inspection apparatus according to claim 2, wherein the circuit board inspection apparatus is obtained by curing a material layer for a conductive elastomer.   4. The circuit board inspection apparatus according to claim 1, wherein in at least some of the conductive path forming portions of the relay substrate, a distance between adjacent conductive path forming portions is 50 μm or less. 5. .   5. The circuit board inspection apparatus according to claim 4, wherein in at least some of the conductive path forming portions of the relay substrate, a distance between adjacent conductive path forming portions is 10 to 50 μm.   The first anisotropic conductive sheet in which conductive particles are arranged in the thickness direction and uniformly dispersed in the surface direction is disposed on one side or both sides of the relay substrate. The circuit board inspection apparatus according to any one of? When the both sides of the circuit board to be inspected are clamped between the two inspection jigs by the pair of the first inspection jig and the second inspection jig,
The intermediate holding plate bends in the direction of the second insulating plate around the first contact support position of the first support pin with respect to the intermediate holding plate, and
The intermediate holding plate bends in the direction of the first insulating plate around the second contact support position of the second support pin with respect to the intermediate holding plate. The circuit board inspection apparatus according to any one of the above. A first contact support position of the first support pin with respect to the intermediate holding plate is arranged in a lattice shape on the intermediate holding plate projection surface;
Second contact support positions of the second support pins with respect to the intermediate holding plate are arranged in a grid pattern on the intermediate holding plate projection surface,
In the intermediate holding plate projection surface, one second abutment support position is disposed in a unit lattice region composed of four adjacent first abutment support positions, and
2. The first abutment support position is arranged in a unit lattice region composed of four adjacent second abutment support positions on the intermediate holding plate projection surface. The circuit board inspection apparatus according to any one of? The relay pin unit is
A plurality of intermediate holding plates disposed at a predetermined interval between the first insulating plate and the second insulating plate;
Holding plate support pins arranged between adjacent intermediate holding plates;
With
In at least one intermediate holding plate, a holding support position of the holding plate support pin that contacts the intermediate holding plate from one surface side with respect to the intermediate holding plate, and a first surface that contacts the intermediate holding plate from the other surface side. The support support position of the first support pin, the second support pin, or the holding plate support pin with respect to the intermediate holding plate is arranged at a different position on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate. The circuit board inspection apparatus according to claim 1, wherein the circuit board inspection apparatus is provided.   In all of the intermediate holding plates, the holding plate supporting pins that come into contact with the intermediate holding plate from one surface side are in contact with and supported by the intermediate holding plate, and the intermediate holding plate comes into contact with the intermediate holding plate from the other side The support support position of the first support pin, the second support pin, or the holding plate support pin with respect to the intermediate holding plate is arranged at a different position on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate. The circuit board inspection apparatus according to claim 9, wherein the circuit board inspection apparatus is provided.   The second anisotropic conductive sheet includes a plurality of conductive path forming portions extending in the thickness direction and insulating portions that insulate the conductive path forming portions from each other, and the conductive particles are only in the conductive path forming portions. 11. The circuit according to claim 1, wherein the conductive particles are dispersed non-uniformly in a plane direction, and a conductive path forming portion protrudes on one side of the sheet. Board inspection equipment.   The third anisotropic conductive sheet is composed of a plurality of conductive path forming portions extending in the thickness direction and insulating portions that insulate these conductive path forming portions from each other, and the conductive particles are only in the conductive path forming portions. 12. The circuit according to claim 1, wherein the conductive particles are dispersed non-uniformly in a plane direction, and a conductive path forming portion protrudes on one side of the sheet. Board inspection equipment. The plurality of conductive pins are formed in a bar-shaped central portion that is shorter than the distance between the first insulating plate and the second insulating plate, and are formed on both ends of the central portion, and have a smaller diameter than the central portion. Consisting of a pair of ends,
The pair of end portions are respectively inserted through through-holes having a diameter smaller than that of the central portion formed in the first insulating plate and the second insulating plate and larger than that of the pair of end portions. The circuit board inspection apparatus according to claim 1, wherein the conductive pin is supported so as to be movable in an axial direction. A through hole through which the conductive pin is inserted is formed between the first insulating plate and the intermediate holding plate, between the second insulating plate and the intermediate holding plate, or between the intermediate holding plates. A bent holding plate is provided,
The plurality of conductive pins are pressed laterally in opposite directions from each other with a through hole formed in the first and second insulating plates and a through hole formed in the bent holding plate as fulcrums. 13. The circuit board inspection apparatus according to claim 1, wherein the circuit board inspection device is bent at a position of a through hole of the holding plate, whereby the conductive pin is supported so as to be movable in an axial direction. A circuit board inspection method using the circuit board inspection apparatus according to claim 1,
A circuit board comprising: a pair of a first inspection jig and a second inspection jig, wherein both sides of a circuit board to be inspected are sandwiched between the inspection jigs to perform an electrical inspection. Inspection method.

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