JP7287849B2 - Inspection jig for electrical characteristics - Google Patents

Description

The present technology relates to a jig for inspecting electrical characteristics of electronic components such as wafers, chips, and packages.

Currently, wafer-level electrical property evaluation of semiconductor devices is performed by directly contacting probes to conductive pads and bumps formed on the front and rear surfaces of a wafer using a probe card (see, for example, Patent Documents 1).

This method enables inspection before packaging and before three-dimensional mounting.

However, in order to remove the oxide film on the surface of the pad of the wafer, the surface is scratched and the probe inspection is carried out. Therefore, after the products that passed the inspection are mounted, the products that pass the inspection are damaged due to the inspection, resulting in the generation of rejected products. Sometimes. In addition, as the pad size becomes smaller, the influence of scratches during inspection, which causes problems during bump formation and mounting, increases. In particular, in recent years, semiconductor chips are becoming increasingly fine-pitched, so scratches during inspection become a more and more serious problem.

Bare chips and packages are handler tested using rubber connectors. As a rubber connector that serves as an inspection probe sheet, for example, an anisotropic conductive sheet in which magnetically oriented conductive particles are arranged so as to pass through an elastomer sheet in the thickness direction has been proposed (see, for example, Patent Document 2). .

In the inspection probe sheet described in Patent Document 2, when the conductive particles are magnetically oriented in the rubber elastic elastomer resin, the conductive particles are connected in the in-plane direction, so it is difficult to deal with fine pitch. In addition, although the frame is attached to surround the periphery for the purpose of improving durability, the elastomer resin inside the frame is a material that easily expands and contracts due to thermal expansion, so there is a problem of reduced durability and contact misalignment ( misalignment) may cause inspection failure. In particular, misalignment in a heat cycle test or the like is fatal, and it will be difficult to deal with further finer pitches in the future.

In addition, it is generally difficult to manufacture a fine-pitch rubber connector in which a conductive material is placed in an elastomer resin. For this reason, the actual situation is that the package after assembly is inspected, and as a result, the yield is extremely deteriorated, which is also a factor that makes it impossible to reduce the price.

As a method for solving these problems, in Patent Document 3, as shown in FIG. However, by using the inspection probe sheet 100 in which the conductive elastomer 120 is arranged in the recesses 112, it is possible to inspect the electrical characteristics even when oxide films are formed on the pads and bumps formed at fine pitches. Are listed.

However, in the method described in Patent Document 3, although it is possible to inspect electrodes formed at fine pitches, since the electrodes are in direct contact with the conductive elastomer portion, the conductive elastomer portion gradually deteriorates as the inspection is repeated. In some cases, the conductive particles and binder were detached and damaged, and the resistance value increased. Moreover, in these inspections, a minimum of 10,000 repetitive use is usually required, but the method described in Patent Document 3 can only last less than 1,000 times.

Japanese Patent Application Laid-Open No. 2009-042008 JP 2006-024580 A JP 2018-141652 A

The present technology is intended to solve the above-described problems, and provides an electrical property inspection jig having excellent durability for inspecting the electrical properties of pads and bumps formed with a fine pitch.

As a result of intensive studies, the inventors of the present technology have found that the recesses of the first flexible sheet and the recesses of the second flexible sheet are filled with a thermally conductive resin, and the surface of the first flexible sheet having the recesses It has been found that by connecting the second flexible sheet to the surface having the concave portions, excellent durability can be obtained in the inspection of the electrical characteristics of pads and bumps formed at fine pitches.

That is, the electrical property inspection jig according to the present technology includes a first flexible sheet having a plurality of through electrodes having recesses, a second flexible sheet having a plurality of through electrodes having recesses, and the first flexible sheet. A conductive resin that fills the recesses and the recesses of the second flexible sheet and connects the surface of the first flexible sheet having the recesses and the surface of the second flexible sheet having the recesses.

In addition, a method for manufacturing an inspection jig according to the present technology includes a filling step of filling conductive resin into concave portions of through electrodes of a first flexible sheet and a second flexible sheet; a connecting step of bonding the resin-filled surface and the conductive resin-filled surface of the second flexible sheet to connect the conductive resin.

In addition, an electrical characteristic inspection method according to the present technology includes a first flexible sheet having a plurality of through electrodes having recesses and a second flexible sheet having a plurality of through electrodes having recesses on an electrode surface of an object to be inspected. , a conductive material that fills the recesses of the first flexible sheet and the recesses of the second flexible sheet and connects the surface having the recesses of the first flexible sheet and the surface having the recesses of the second flexible sheet a bonding step of attaching one surface of an inspection probe sheet comprising a flexible resin and contacting the through electrode with the electrode of the inspection object; pressing the probe against the through electrode from the other surface of the inspection probe sheet, and an inspection step for inspecting characteristics.

According to the present technology, it is possible to obtain excellent durability for inspection of electrical characteristics of pads and bumps formed at fine pitches.

FIG. 1 is a cross-sectional view showing an example of an inspection probe sheet according to this embodiment. FIG. 2 is a cross-sectional view showing an example of a flexible sheet having a plurality of through electrodes having recesses. FIG. 3 is a cross-sectional view schematically showing an inspection process for inspecting electrical characteristics using an inspection probe sheet according to the present technology. FIG. 4 is a cross-sectional view showing an example of a conventional inspection probe sheet.

Hereinafter, embodiments of the present technology will be described in detail in the following order.
1. Inspection jig for electrical characteristics 2 . Manufacturing method of inspection jig 3 . Electrical property inspection method

<1. Inspection jig for electrical characteristics>
An electrical property inspection jig according to the present technology includes a first flexible sheet having a plurality of through electrodes having recesses, a second flexible sheet having a plurality of through electrodes having recesses, a recess of the first flexible sheet and a first It is a so-called inspection probe sheet comprising a conductive resin that fills the recesses of two flexible sheets and connects the surface having the recesses of the first flexible sheet and the surface having the recesses of the second flexible sheet. By contacting the pads and bumps of the object to be inspected with the through electrodes on one side and contacting the wire probes with the through electrodes on the other side, the electrical characteristics of the fine-pitch pads and bumps can be inspected. Excellent durability can be obtained.

FIG. 1 is a cross-sectional view showing an example of an inspection probe sheet according to this embodiment, and FIG. 2 is a cross-sectional view showing an example of a flexible sheet having a plurality of through electrodes having recesses. The inspection probe sheet 1 according to the present embodiment includes a first flexible sheet 10 having a plurality of through electrodes 14 having concave portions 12 on the first surface 11a and convex portions 13 on the second surface 11b; A second flexible sheet 20 having a plurality of through electrodes 24 having recesses 22 on the second surface 21b and protrusions 23 on the second surface 21b; A conductive resin 30 connecting the first surface 11a of the sheet and the first surface 21a of the second flexible sheet is provided.

The first and second flexible sheets 10 and 20 are preferably made of a material that has flexibility, insulation, a low coefficient of thermal expansion, and high heat resistance. Examples of materials for the first and second flexible sheets 10 and 20 include polyimide, polyamide, polyethylene naphthalate, biaxially oriented polyethylene terephthalate, and liquid crystal polymer. These materials are preferable because they have better dimensional stability than elastic elastomers, are less likely to cause conduction failure due to misalignment in thermal cycle tests, and are excellent in durability. Among them, polyimide having excellent heat resistance is preferably used.

The thickness of the first and second flexible sheets 10 and 20 is preferably 5 μm or more, more preferably 10 μm or more, and even more preferably 20 μm or more, because if the thickness is too thin, the durability is poor. The thickness of the flexible sheet 11 is preferably 500 μm or less, more preferably 100 μm or less, and even more preferably 50 μm or less, because if it is too thick, it becomes difficult to form the through electrodes.

The through electrodes 14 and 24 exist independently, are insulated from adjacent through electrodes, and may be formed in advance in accordance with the positions of the pads and bumps of the inspection object. may be formed of

The through electrodes 14, 24 are formed in the thickness direction of the first and second flexible sheets 10, 20, and are recessed portions 12, 22 recessed in the first surfaces 11a, 21a of the first and second flexible sheets 10, 20. have The lower limit of the depth of the recesses 12, 22 is preferably 20% or more, more preferably 40% or more, still more preferably 60% or more of the thickness of the first and second flexible sheets 10, 20. The upper limit of the depth of the recesses 12, 22 is preferably 90% or less, more preferably 80% or less, still more preferably 70% or less of the thickness of the first and second flexible sheets 10, 20. As a result, since the thickness of the conductive resin 30 can be increased, the amount of movement when the inspection probe sheet 1 is pushed down can be increased, and variations in the heights of the pads and bumps can be followed. can.

Further, the surfaces of the concave portions 12, 22 of the through electrodes 14, 24 are preferably plated with Ni/Au plating, Ni/Pd plating, Ni/Pd/Au plating, or the like, and covered with a metal plating film. As a result, the anchor effect of the recesses 12 and 22 can improve adhesion with the conductive resin 30 and improve durability, and the conductivity with the conductive resin 30 can be improved.

Further, the through electrodes 14 and 24 have projections 13 and 23 projecting from the second surfaces 11b and 21b of the first and second flexible sheets 10 and 20, respectively. The lower limit of the height of the projections 13, 23 is preferably 10% or more, more preferably 20% or more, and still more preferably 30% or more of the thickness of the first and second flexible sheets 10, 20. The upper limit of the height of the projections 13 and 23 is preferably 60% or less, more preferably 50% or less, and even more preferably 40% or less of the thickness of the first and second flexible sheets 10 and 20. Further, the surfaces of the protrusions 13, 23 of the through electrodes 14, 24 are preferably plated with Ni/Au plating, Ni/Pd plating, Ni/Pd/Au plating, or the like, and covered with a metal plating film. . As a result, excellent durability can be obtained with respect to the tip of the wire probe and the pads and bumps of the test object.

The through electrodes 14 and 24 are made of a conductive metal or alloy, and preferably made of a metal or alloy such as copper or nickel. Also, the through electrodes 14, 24 have a so-called "tapered shape" in which the diameter increases from the first surfaces 11a, 21a of the first and second flexible sheets 10, 20 toward the second surfaces 11b, 21b. is preferred. This makes it possible to make the diameter of the tip of the wire probe larger than the size of the pad or bump of the inspection object.

The conductive resin 30 fills the recesses 12, 22 of the through electrodes 14, 24 to connect the first surface 11a of the first flexible sheet and the first surface 21a of the second flexible sheet. The lower limit of the thickness of the conductive resin 30 between the concave portions 12, 22 of the through electrodes 14, 24 is preferably 20 μm or more, more preferably 30 μm or more, and still more preferably 50 μm or more, and the upper limit of the thickness of the conductive resin 30 is , preferably 60 μm or less, more preferably 50 μm or less, still more preferably 40 μm or less.

Examples of the conductive resin 30 include a conductive elastomer in which conductive particles are dispersed in an elastic resin, and a conductive binder in which conductive particles are dispersed in a thermoplastic resin.

The elastic resin should have rubber elasticity, and preferably has heat resistance. Preferred examples of elastic resins include silicone resins, polyurethane resins, and acrylic resins.

Thermoplastic resins include so-called engineering plastics that soften at high temperatures and have excellent moldability. Examples of such thermoplastic resins include polyamide (nylon), liquid crystalline polymer, polyacetal, and polyethylene terephthalate.

The total content of the elastic resin and the conductive particles in the conductive resin 30 and the total content of the thermoplastic resin and the conductive particles in the conductive resin 30 are preferably 85 wt% or more, more preferably 90 wt% or more, and even more preferably. is 95 wt% or more. Thereby, the conductive resin 30 can have the properties of an elastic resin or a thermoplastic resin.

Among these, as the conductive resin 30, it is preferable to use a conductive elastomer in which conductive particles are dispersed in an elastic resin from the viewpoint of stroke property. The electrodes to be inspected usually have a height variation of ±several μm, but by filling the concave portions 12 and 22 of the first and second flexible sheets 10 and 20 with conductive elastomer, a stroke value of 5 μm or more can be achieved. It is possible to follow variations in the height of pads and bumps within the surface of a semiconductor wafer or chip. Note that the conventional inspection probe sheet has a single layer of flexible sheet, and the thickness of the conductive elastomer can only be formed from 10 to 20 μm, so the stroke value is limited to 2 to 3 μm.

The conductive particles are linked from the bottom of the recess 12 of the first flexible sheet 10 to the bottom of the recess 22 of the second flexible sheet 20, and penetrate the through electrode 14 of the first flexible sheet 10 and the second flexible sheet 20. It electrically connects with the electrode 24 .

The conductive particles need only be conductive, and it is preferable to use magnetic metal particles such as nickel, cobalt, iron, etc., and particles in which a resin core or an inorganic core particle is plated with a magnetic metal. Also, the conductive particles may be plated with Ni/Au plating, Ni/Pd plating, Ni/Pd/Au plating, or the like, and coated with a metal plating film. When the conductive particles contain a magnetic metal, by applying a magnetic field when filling the recesses 12 and 22 of the first and second flexible sheets 10 and 20 with the conductive resin 30, the conductive particles can be easily chained. can be made

Since the smaller the average particle size of the conductive particles, the more minute the pads and bumps can be handled, the upper limit of the average particle size of the conductive particles is preferably 15 μm or less, more preferably 8 μm or less, and even more preferably 4 μm or less. Therefore, the lower limit of the average particle size of the conductive particles is preferably 1 µm or more, more preferably 2 µm or more, and still more preferably 3 µm or more.

The shape of the conductive particles may be spherical, polygonal, or spike-like. When the shape of the conductive particles is polygonal or spike-like, the conductive particles can be linked more easily.

In the inspection probe sheet described above, the through electrodes 14 and 24 have the protrusions 13 and 23 that protrude from the second surfaces 11b and 21b of the first and second flexible sheets 10 and 20. However, the second surfaces 11b and 21b of the first and second flexible sheets 10 and 20 may have concave portions. The penetrating electrodes 14, 24 have recesses in the second surfaces 11b, 21b of the first and second flexible sheets 10, 20, so that the tips of the wire probes fit in the recesses, and the through electrodes of the wire probes can be prevented from falling off.

<2. Inspection jig manufacturing method>
A method for manufacturing an inspection jig according to the present technology includes a filling step of filling recesses of through electrodes of a first flexible sheet and a second flexible sheet with a conductive resin; and a connecting step of bonding the surface filled with the conductive resin of the second flexible sheet to the surface of the second flexible sheet and connecting the conductive resin. As a result, it is possible to obtain an inspection probe sheet having excellent durability for inspecting the electrical characteristics of pads and bumps formed with a fine pitch.

Next, a more specific method for manufacturing an inspection probe sheet will be described with reference to FIGS. 1 and 2. FIG. First, a through hole is formed in a flexible sheet by laser processing, and a through electrode is half-formed in the through hole by electroplating to form a concave portion. Moreover, it is preferable that the through electrode and the side surface of the concave portion are plated with Ni/Au plating, Ni/Pd plating, Ni/Pd/Au plating, or the like, and covered with a metal plating film.

Next, using a screen printer, the conductive resin 30 is evenly printed on the concave portions 12 and 22 of the first and second flexible sheets 10 and 20 . Alternatively, the conductive resin 30 may be evenly applied to the concave portions 12, 22 of the first and second flexible sheets 10, 20 using a microdispenser. The conductive resin 30 protrudes from the first surfaces 11a, 21a of the first and second flexible sheets 10, 20. As shown in FIG. If the protrusion height of the conductive resin 30 is too low, the amount of movement when the through electrodes 14 and 24 of the inspection probe sheet 1 are pushed down becomes small, making it difficult to follow variations in the heights of the pads and bumps. becomes. Therefore, the lower limit of the protrusion height of the conductive resin 30 is preferably 50% or more, more preferably 100% or more, and still more preferably 150% or more of the average particle diameter of the conductive particles. In addition, the upper limit of the protrusion height of the conductive resin 30 is preferably 400% or less, more preferably 300% or more, and further preferably 250% of the average particle diameter of the conductive particles, because if the protrusion is too high, the protrusion will break. It is below. Further, the specific lower limit of the protrusion height of the conductive resin 30 is preferably 5 μm or more, more preferably 8 μm or more, and the upper limit of the protrusion height of the conductive resin 30 is preferably 20 μm or less, more preferably It is 15 μm or less.

Next, the side of the first flexible sheet 10 on which the conductive resin 30 is printed and the side of the second flexible sheet 20 on which the conductive resin 30 is printed are made to face each other so that the through electrodes 14 and 24 overlap each other. After alignment, the flexible sheets are attached and a magnetic field is applied. As a result, when the conductive particles contain a magnetic metal, the conductive particles can easily be linked to each other, and the through electrodes 14 and 24 can be electrically connected to each other.

Next, with the conductive particles fixed by applying a magnetic field, they are heated in an oven at a temperature of 100 to 200° C. for 0.5 to 3 hours, and further heated at a temperature of 150 to 250° C. for 1 to 4 hours. As a result, the conductive resin 32 is filled in the concave portions 12, 22 of the first and second flexible sheets 10, 20, and the connected inspection probe sheets can be obtained.

<3. Method for inspecting electrical characteristics>
An electrical characteristic inspection method to which the present technology is applied includes a first flexible sheet having a plurality of through electrodes having recesses on an electrode surface of an object to be inspected; a second flexible sheet having a plurality of through electrodes having recesses; A conductive resin that fills the recesses of the first flexible sheet and the recesses of the second flexible sheet and connects the surface of the first flexible sheet with the recesses and the surface of the second flexible sheet with the recesses. Attaching step (A) of attaching one surface of the inspection probe sheet and contacting the through electrode with the electrode of the object to be inspected, and pressing the probe against the through electrode from the other surface of the inspection probe sheet to inspect electrical characteristics. and an inspection step (B). As a result, it is possible to exhibit excellent durability in the inspection of the electrical characteristics of pads and bumps formed at fine pitches.

An example of an inspection object is a semiconductor device. A semiconductor device may be any one of a wafer level formed on a wafer, a chip level separated into pieces, and a package level after packaging. In the following, regarding a method for inspecting electrical characteristics at the chip level of a semiconductor device, the attaching process (A), the inspection process (B), and the peeling process (C) for peeling the inspection probe sheet from the semiconductor device after the inspection process will be described. . Since the inspection probe sheet is the same as the inspection probe sheet described above, the description thereof is omitted here.

[Attachment step (A)]
In the attaching step (A), an inspection probe sheet is attached to the electrode surface of the semiconductor device, and the through electrodes and the bumps of the semiconductor device are brought into contact with each other. Moreover, in the sticking step (A), it is preferable to press the inspection probe sheet. Thereby, even if an oxide film is formed on the bump of the semiconductor device, the through electrode breaks through the oxide film, so that the electrical characteristics can be inspected.

[Inspection step (B)]
FIG. 3 is a cross-sectional view schematically showing an inspection process for inspecting electrical characteristics using an inspection probe sheet according to the present technology.

As shown in FIG. 3 , in the inspection step (B), the wire probe 50 is pressed against the protrusion 13 of the through electrode 14 of the first flexible sheet 10 , and the protrusion 23 of the through electrode 24 of the second flexible sheet 20 is inspected. are brought into contact with the bumps 41 of the semiconductor device 40 to inspect the electrical characteristics. Since the conductive resin 30 is compressed when the wire probe 50 is pressed against it, excellent stroke performance can be obtained.

The wire probe 50 is a probe for inspecting electrical characteristics, and is preferably erected perpendicularly to the electrode surface of the through electrode as shown in FIG. The wire probe 50 may have a plurality of pins arranged. The tip shape of the wire probe 50 is not particularly limited, and may be a spherical surface, a flat surface, a concave surface, a serrated surface, or the like. When the through electrode does not protrude, the tip diameter of the wire probe 50 is preferably smaller than the width of the electrode. I do not care.

The inspection of electrical characteristics is performed by measuring the characteristics of, for example, transistors, resistors (electrical resistance), capacitors, and the like.

[Peeling step (C)]
In the peeling step (C), the inspection probe sheet is peeled off from the semiconductor device. Also, the semiconductor device may be cleaned after the inspection probe sheet is peeled off. Also, the peeled inspection probe sheet can be used multiple times.
<3. Example>

Hereinafter, examples according to the present technology will be described. In this example, an electric property inspection jig was produced and used to carry out continuity inspection of bare chips. Then, the presence or absence of pad damage, durability, and stroke value after the continuity test were evaluated. Note that the present technology is not limited to these examples.

[Evaluation of the presence or absence of pad scratches]
The presence or absence of scratches on the solder bumps after the continuity test was visually confirmed.

[Evaluation of durability]
As a durability test, the conduction test was repeated 10,000 times, and the initial test resistance value and the test resistance value after the durability test were measured.

[Evaluation of stroke value]
An automatic load tester (manufactured by Nippon Keisoku System Co., Ltd.) was used to measure the stroke value when the electrode surface of the inspection probe sheet was brought into contact with a wire of 30 μmφ with a load of 5 gg/pin. It is desirable that the stroke value is 3 μm or more.
<Example 1>

[Preparation of flexible sheet having through electrodes]
Through-holes with a diameter of 30 μm were drilled at grid intervals of 60 μmP by laser processing in a sheet in which copper was laminated on both sides of a polyimide sheet (trade name: Esperflex, copper thickness 8 μm, polyimide thickness 25 μm, manufactured by Sumitomo Metal Mining Co., Ltd.). A copper-plated through electrode was formed in the through hole by electroplating. The through electrodes were half-formed, in which recesses of grooves of 15 μm were formed in the thickness direction from the surface of the sheet. Next, after plating with nickel and gold, the copper layers on the front and back sides were removed by etching to create a flexible sheet. The nickel-gold plating was also formed on the polyimide surface on the side surface of the recess.

[Preparation of conductive elastomer]
Conductive particles were produced by applying a gold plating layer to the surface of Ni/Ag-plated resin core particles (manufactured by Sekisui Chemical Co., Ltd.) having an average particle size of 3 μm by electroless displacement plating. As an elastomer, two-component liquid silicone (YE5822A/B, manufactured by Momentive Co., Ltd.) A and B are blended at a ratio of 10:1, and 200 parts by mass of conductive particles are mixed with 100 parts by mass of this silicone resin. to obtain a conductive elastomer.

[Preparation of inspection probe sheet]
Using a screen printer (manufactured by Newlong Seimitsu Kogyo Co., Ltd.), the conductive elastomer dispersion was evenly printed on the concave portions of the through electrodes of the flexible sheet so that the conductive elastomer protruded from the sheet surface by 10 μm. The two flexible sheets were placed so that the printed side of the conductive elastomer faced each other and aligned so that the electrodes overlapped with each other. In this state, the flexible sheet was placed on a permanent magnet, heated in an open space at a temperature of 120° C. for 1 hour, and further heated at a temperature of 200° C. for 2 hours to prepare an inspection probe sheet.

[Continuity test]
As a bare chip for evaluation, a 6 mm square bare chip (Dexerials evaluation base) in which copper pillar bumps with solder caps (hereinafter referred to as solder bumps) with a height of 20 μm and 30 μm diameter are arranged at 60 μmP was used, and a 30 μm diameter wire probe (manufactured by Tespro) was used. was used to conduct a conduction resistance test. More specifically, as shown in FIG. 3, the circuit surface of the paired chip for evaluation and one electrode surface of the inspection probe sheet are aligned and pressed, and the wire probe is attached to the opposite electrode surface of the inspection probe sheet. Contact was made with a load of 5 g/pin, and a conduction test was conducted.

Table 1 shows the presence or absence of scratches on the solder bumps after the continuity test, the continuity resistance values before and after the durability test, and the stroke values. As shown in Table 1, in Example 1, there was no solder bump damage, the initial conduction resistance value of the durability test was 0.20 Ω, the conduction resistance value after the durability test was 0.30 Ω, and the stroke value was It was 5.5 μm.

<Comparative Example 1>
In the preparation of the inspection probe sheet of Example 1, one flexible sheet was placed on a permanent magnet, heated in an open space at a temperature of 120° C. for 1 hour, and further heated at a temperature of 200° C. for 2 hours, as shown in FIG. A conduction test was performed in the same manner as in Example 1, except that a test probe sheet was prepared.

Table 1 shows the presence or absence of scratches on the solder bumps after the continuity test, the continuity resistance values before and after the durability test, and the stroke values. As shown in Table 1, in Comparative Example 1, there was no damage to the solder bumps, the conduction resistance value at the beginning of the durability test was 0.15 Ω, the conduction resistance value after the durability test was 1.00 Ω or more, and the stroke value was , 2.1 μm.

In Comparative Example 1, the damage of the solder bump could not be visually confirmed, and the continuity test could be performed. However, a large increase in resistance was observed in the durability test. This is probably because the conductive elastomer in the concave portion of the through electrode was damaged by the load during repeated inspection. Also, the stroke value was a small value.

On the other hand, in Example 1, the flaws of the solder bumps could not be visually confirmed, and the continuity test could be performed. Further, even after the durability test, a large increase in resistance value was not observed, and the stroke value was larger than that of Comparative Example 1. Therefore, it was confirmed that the inspection probe sheet of the present technology has good durability.

Reference Signs List 1 inspection probe sheet 10 first flexible sheet 11a first surface 11b second surface 12 concave portion 13 convex portion 14 through electrode 20 second flexible sheet 21a first surface 21b second surface , 22 concave portion, 23 convex portion, 24 through electrode, 30 conductive resin, 40 semiconductor device, 41 bump, 50 wire probe

Claims (5)

a first flexible sheet having a plurality of through electrodes having recesses;
a second flexible sheet having a plurality of through electrodes having recesses;
A conductive material that fills the recesses of the first flexible sheet and the recesses of the second flexible sheet and connects the surface of the first flexible sheet having the recesses and the surface of the second flexible sheet having the recesses. An electrical property inspection jig comprising a resin and . 2. The jig for inspecting electrical characteristics according to claim 1, wherein said conductive resin contains an elastic resin and conductive particles. 3. The jig for inspecting electrical characteristics according to claim 1, wherein the thickness of the conductive resin between the concave portion of the first flexible sheet and the concave portion of the second flexible sheet is 20 [mu]m or more and 60 [mu]m or less. A filling step of filling conductive resin into recesses of the through electrodes of the first flexible sheet and the second flexible sheet;
a connecting step of bonding the surface filled with the conductive resin of the first flexible sheet and the surface filled with the conductive resin of the second flexible sheet to connect the conductive resin; A method for manufacturing an electrical property inspection jig. A first flexible sheet having a plurality of through electrodes having recesses, a second flexible sheet having a plurality of through electrodes having recesses, and the recesses of the first flexible sheet and the second flexible sheet. One surface of the inspection probe sheet provided with a conductive resin that fills the recesses of the flexible sheet and connects the surface having the recesses of the first flexible sheet and the surface having the recesses of the second flexible sheet affixing, affixing step of contacting the through electrode and the electrode of the inspection object;
and an inspection step of inspecting electrical characteristics by pressing probes against the through electrodes from the other surface of the inspection probe sheet.

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