TW202406240A - Anisotropic conductive connector, anisotropic conductive connector with frame and inspection device - Google Patents

Abstract

An objective of the present invention is to provide an anisotropic conductive connector, an anisotropic conductive connector with frame and an inspection device, which enable narrow pitch arrangement corresponding to miniaturized electrical or electronic parts, and have excellent stability in connection of electrodes, and by which the electrodes of the electrical or electronic parts to be connected are not easily damaged, and the accumulation of oxidized foreign substances can be reduced so that the increase in resistance value can be suppressed, and exchange of which is easy when conduction failures occur in use. The anisotropic conductive connector of the present invention includes a strip-shaped insulator and a plurality of silver wires, the strip-shaped insulator being formed of an insulating elastic material, the plurality of silver wires penetrating from the first side to the second side of the insulator in the thickness direction and being arranged at a constant pitch along the length direction of the insulator, wherein the plurality of silver wires are respectively provided to be inclined to the thickness direction of the insulator.

Description

Different-square conductive connector, different-square conductive connector with frame and inspection device

The present invention relates to a different-square conductive connector, a different-square conductive connector with a frame, and an inspection device.

In the past, electronic device parts and modules including semiconductor devices such as BGA (Ball Grid Array), QFN (Quad Flat No Lead), SOP (Small Outline Package), QFP (Quad Flat Package), CSP (Chip Size Package), etc. When electrically inspecting parts and the like, a socket equipped with a pogo pin (Patent Document 1) is used as an inspection device.

Furthermore, as a conductive connector that connects a liquid crystal panel and a circuit board, a conductive connector with silver wires is known (Patent Document 2).

[Prior technical literature]

[Patent Document]

Patent Document 1: Japanese Invention Publication No. 2019-125421

Patent Document 2: Japanese Utility Model Publication No. Sho 61-184283

In recent years, with the space saving of electrical and electronic parts, in addition to the appearance of electronic device parts and module parts, the size of electrodes (width × length) and pitch have also been reduced, making probes corresponding to this in inspection equipment Pin configuration becomes difficult.

In addition, it is well known that the surface of solder ball electrodes of BGA, CSP, etc., and flat electrodes of QFN, etc. are all plated with tin. Over time, an oxide film will be formed on the surface of the electrode, causing the resistance value to increase. . Therefore, when inspecting such a semiconductor device, a probe pin having a crown-shaped front end portion is used, and the front end portion is used to poke and press the electrode of the inspection target to destroy the oxide film to ensure conduction. However, with this inspection method, oxidized foreign matter such as solder chips and tin plating chips generated by the electrodes accumulate on the tip of the probe pin, causing the resistance value to increase.

In addition, in an inspection device equipped with probe pins, a plurality of probe pins are generally held in a resin holder. When only a specific probe pin has a conduction failure, it is difficult to replace only the probe that has a conduction failure. Pin job. Furthermore, the probe pins are expensive, so it is not cost-effective to replace all the probe pins in the entire holder.

The object of the present invention is to provide a different-square conductive connector, a frame-attached different-square conductive connector, and an inspection device, which can be arranged in a narrow spacing with miniaturized electrical and electronic parts, and have excellent connection stability and connection to electrodes. The target electrode is not easily damaged, can reduce the accumulation of oxidized foreign matter and suppress the increase in resistance value, and can be easily replaced even if conduction failure occurs during use.

The present invention includes the following structures.

[1] An anisotropic conductive connector, which is provided with a strip-shaped insulating part and a plurality of silver wires; the strip-shaped insulating part is made of an insulating elastic material, and the plurality of silver wires are formed from the insulating part. The first surface in the thickness direction penetrates to the second surface, and is arranged at a certain spacing along the longitudinal direction of the insulating portion;

The plurality of silver wires are respectively arranged perpendicularly or obliquely with respect to the second surface of the insulating part.

[2] The dissimilar conductive connector according to [1], wherein the tensile strength of the silver wire measured in accordance with Japanese Industrial Standard JIS Z 2241 is 200 N/mm ² or more and 380 N/mm ² or less.

[3] The dissimilar conductive connector according to [1] or [2], wherein a gold plating film is formed on the side of the silver wire.

[4] The dissimilar conductive connector according to any one of [1] to [3], wherein the insulating portion has a compression set of 20% or less.

[5] A frame-attached heterogonal conductive connector, in which a positioning frame is coupled to at least a part of the periphery of the heterogonal conductive connector according to any one of [1] to [4].

[6] An inspection device for inspecting electrical and electronic parts, the inspection device being provided with: a circuit board having electrode terminals, the opposite conductive connector according to any one of [1] to [4], and a holder ;

At least part of the outer peripheral portion of the opposite-square conductive connector is fixed to the circuit board by the holder;

The electrode terminal is in contact with an end of the silver wire on the circuit board side in the opposite conductive connector;

During the inspection, the electrical and electronic parts are crimped to the area of the surface of the opposite-side conductive connector opposite to the circuit board that is not in contact with the holder, so that the electrodes of the electrical and electronic parts are in contact with the opposite-side conductive connector. The end of the silver wire in the conductive connector that is opposite to the circuit board side is in contact with the silver wire.

[7] An inspection device for inspecting electrical and electronic components. The inspection device is provided with: a circuit board having electrode terminals, the framed opposite conductive connector described in [5], and a holder;

At least part of the frame portion of the aforementioned frame-attached dissimilar conductive connector is fixed to the aforementioned circuit substrate by the aforementioned retainer;

The electrode terminal is in contact with an end of the silver wire on the circuit board side in the frame-attached opposite conductive connector;

During the inspection, the electrical and electronic parts are crimped to the area of the opposite side of the frame-attached opposite conductive connector that is opposite to the circuit board that is not in contact with the holder, so that the electrodes of the electrical and electronic parts are connected to In the frame-attached dissimilar conductive connector, the end of the silver wire on the side opposite to the circuit board side is in contact with the silver wire.

According to the present invention, a different-square conductive connector, a frame-attached different-square conductive connector, and an inspection device can be provided, which can be arranged in a narrow spacing with miniaturized electrical and electronic parts, and have excellent connection stability for electrodes, and the connection The target electrode is not easily damaged, can reduce the accumulation of oxidized foreign matter and suppress the increase in resistance value, and can be easily replaced even if conduction failure occurs during use.

1,2,3: Differential conductive connector

4: Different-square conductive connector with frame

5,6: Inspection device

10,10A: Conductive part

12: Conductive tape part

14:The next part

16:Insulation Department

16a,24a: Side one

16b:Second side

18:Silver line

20:Insulation Department

22: Attachment Department

24:Insulation Department

26: Next layer

30:Frame parts

32:Following material

34:Through hole

50,60:Circuit substrate

52,62: retainer

52a: Notch part

53,63:Screw

54,64:Plate

100:Substrate

110: First insulation layer

110a,118a: Upper surface

112: Second insulation layer

114:chip

116: Next layer

118: Laminated body

200: Electrical and electronic parts

210: Flexible printed wiring board

θ:tilt angle

FIG. 1 is a plan view showing the schematic structure of a different-square conductive connector according to one embodiment.

FIG. 2 is an A-A cross-sectional view of the different-square conductive connector of FIG. 1 .

3 is a perspective view showing an example of manufacturing steps of the dissimilar conductive connector according to the embodiment.

4 is a perspective view showing an example of manufacturing steps of the dissimilar conductive connector according to the embodiment.

FIG. 5 is a perspective view showing an example of manufacturing steps of the dissimilar conductive connector according to the embodiment.

6 is a plan view showing the schematic structure of a different-square conductive connector according to another example of the embodiment.

7 is a plan view showing the schematic structure of a different-square conductive connector according to another example of the embodiment.

8 is a plan view showing the schematic structure of a framed dissimilar conductive connector according to an example of the embodiment.

FIG. 9 is a perspective view showing the schematic structure of an inspection device according to an example of the embodiment.

FIG. 10 is a perspective view showing the schematic structure of an inspection device according to another example of the embodiment.

FIG. 11 is a graph showing the evaluation test results of the initial connectivity of the dissimilar conductive connector of Experimental Example 1.

FIG. 12 is a graph showing the evaluation test results of the initial connectivity of the different-square conductive connector of Experimental Example 2.

FIG. 13 is a graph showing the evaluation test results of the repeated compression characteristics (durability) of the different-square conductive connector of Experimental Example 3.

FIG. 14 is a graph showing the evaluation test results of the repeated compression characteristics (durability) of the different-square conductive connector of Experimental Example 4.

Hereinafter, an example of an embodiment of the present invention will be described based on the drawings.

Here, the dimensions and the like of the drawings illustrated in the following description are only examples, and the present invention is not necessarily limited to these dimensions and can be implemented with appropriate changes within the scope that does not change the gist of the invention.

Furthermore, the numerical range represented by "~" in this specification and the patent application scope includes the lower limit and upper limit of the numerical range.

〔Other conductive connector〕

As shown in FIGS. 1 and 2 , a different-square conductive connector 1 according to one embodiment is provided with a sheet-shaped conductive portion 10 , and the conductive portion 10 includes a plurality of rows of conductive strip portions 12 . In the conductive portion 10 , a plurality of rows of conductive tape portions 12 are arranged in parallel, and adjacent conductive tape portions 12 are connected via a bonding portion 14 . Here, the direction in which the conductive tape portions 12 of the plurality of rows extend in parallel is referred to as the longitudinal direction (the X direction in FIGS. 1 and 2 ), and the direction in which the conductive tape portions 12 of the plurality of rows are arranged via the joint portion 14 is referred to as the width direction. direction (Y direction in FIGS. 1 and 2 ), and the direction perpendicular to both the longitudinal direction and the width direction is defined as the thickness direction (Z direction in FIGS. 1 and 2 ).

The conductive strip portion 12 includes a strip-shaped insulating portion 16 and a plurality of silver wires 18 . The insulating portion 16 is made of an insulating elastic material. The plurality of silver wires 18 penetrate from the first surface 16a to the second surface 16b in the thickness direction (Z direction) of the insulating portion 16, and are spaced at certain intervals. The pitches are arranged along the longitudinal direction (X direction) of the insulating portion 16 . Here, the silver wire also includes conductive wires made of silver alloy.

The thickness of the insulating portion 16 can be appropriately set depending on the use, and can be, for example, 0.07 mm or more and 2.0 mm or less. The thickness of the insulating portion 16 can be determined by measuring the average of the thickness values at ten arbitrarily selected thickness values of the cross section of the insulating portion 16 in the thickness direction using a magnifying observation means such as a measuring microscope.

The length and width of the strip-shaped insulating portion 16 are not particularly limited and can be set appropriately. The length of the insulating portion 16 can be, for example, 2 mm or more and 50 mm or less. The width of the insulating portion 16 can be, for example, 0.03 mm or more and 0.25 mm or less. The length and width of the insulating portion 16 can be obtained from the average of the values measured at ten arbitrarily selected locations.

The material constituting the insulating portion 16 is an insulating elastic material, and examples thereof include: polyurethane rubber, isoprene rubber, ethylene propylene rubber, natural rubber, triethylene propylene rubber, styrene-butadiene rubber, polysiloxane rubber, etc. Elastomers. From the perspective of smaller compression permanent deformation, silicone rubber is preferred. The polysilicone rubber may be a condensation polysilicone rubber or an addition polysilicone rubber. The elastic material constituting the insulating portion 16 may also contain additives such as silane coupling agents, adhesion assistants, antioxidants, dyes, pigments, fillers, and equalizing agents.

The compression set of the insulating portion 16 is preferably 20% or less, and more preferably 18% or less. If the compression set of the insulating portion 16 is below the upper limit, compression due to crimping of electrical and electronic components during inspection, expansion and contraction due to changes in environmental conditions such as temperature and humidity can be easily followed. , thus ensuring a more stable connection. Furthermore, the amount of compression in the thickness direction of the dissimilar conductive connector 1 during use can be set in a wide range. The lower limit of the compression set of the insulating portion 16 is not particularly limited, and the smaller the limit, the better.

Here, the compression set of the insulating portion 16 is measured in accordance with Japanese Industrial Standard JIS K 6262 (85° C. × 24 hr, 25% compression).

In the conductive strip portion 12 , a plurality of silver wires 18 are arranged at constant intervals along the longitudinal direction (X direction) of the strip-shaped insulating portion 16 . The pitch of the silver wires 18 (that is, the distance between the centers of the silver wires 18 when viewed from the first surface 16 a of the insulating portion 16 ) is not particularly limited, and can be arbitrarily set according to the impedance simulation results, for example. For example, the pitch of the silver wires 18 can be set to 5 μm or more and 100 μm or less. The pitch of the silver wires 18 can be obtained by measuring the average value of the distance between the centers of ten arbitrarily selected groups of adjacent silver wires 18 .

In the example shown in FIG. 2 , the silver wire 18 is provided obliquely with respect to the second surface 16 b of the insulating portion 16 .

Compared with the configuration in which the silver wires 18 are perpendicular to the second surface 16b of the insulating part 16, the heteroconductive connector 1 in which the silver wires 18 are inclined relative to the second surface 16b of the insulating part 16 is superior to repeated compression in the thickness direction. It is particularly suitable for inspection of electrical and electronic parts such as electronic device parts and module parts.

Here, the use of the anisotropic conductive connector 1 is not limited to inspection of electrical and electronic components. For example, it can also be used for electrical connection between electrodes between substrates of electronic device components, module components, etc., and can also be used for electrical and electronic components. The so-called surface mounting of parts.

The inclination angle θ of the silver wire 18 with respect to the second surface 16 b of the insulating portion 16 is preferably 50 degrees or more, more preferably 55 degrees or more, and more preferably 60 degrees or more. If the inclination angle θ of the silver wire 18 is equal to or greater than the above-mentioned lower limit, buckling (plastic deformation) of the silver wire during compression can be easily suppressed. The inclination angle θ of the silver wire 18 is preferably 75 degrees or less, more preferably 70 degrees or less, and more preferably 65 degrees or less. When the inclination angle θ of the silver wire 18 is equal to or less than the above-mentioned upper limit, initial connectivity during compression is improved. silver The desired lower limit and upper limit of the inclination angle θ of the line 18 can be combined arbitrarily. For example, 50 to 75 degrees is preferred, 55 to 70 degrees is preferred, and 60 to 65 degrees is preferred. The inclination angle θ of the silver wire 18 can be obtained from the average of the inclination angles of ten arbitrarily selected silver wires 18 .

Here, the inclination angle θ of the silver wire 18 with respect to the second surface 16 b of the insulating part 16 is the minor angle of the angle between the second surface 16 b of the insulating part 16 and the central axis of the silver wire 18 (0<θ<90 ).

Compared with conventional conductive wires such as copper alloy wire and brass wire, silver wire 18 is softer. Since the soft silver wire 18 is used as the conductive wire, the silver wire can be connected to the electrodes of the electrical and electronic parts with low resistance and low load during inspection of electrical and electronic parts, surface mounting of electrical and electronic parts, etc. Thereby, the electrode to be inspected is less likely to be damaged, the accumulation of oxidized foreign matter is suppressed to a minimum, and an increase in resistance value over time can be suppressed. Moreover, when the dissimilar conductive connector 1 is compressed, the silver wire 18 is not easily buckled and easily follows the deformation of the insulating part 16. The front end of the silver wire 18 in contact with the electrode is not easy to sink into the insulating part 16, and the electrical property between the electrodes is reduced. The connection is therefore stable. Furthermore, due to the use of silver wires 18, even for miniaturized electrical and electronic components, the silver wires 18 can be easily arranged into a narrow spacing according to the electrode shape, spacing, etc., and multiple silver wires 18 can be brought into contact with one electrode. The connection stability is therefore better.

The tensile strength of the silver wire 18 is preferably 200 N/mm ² or more, and more preferably 220 N/mm ² or more. If the tensile strength of the silver wire 18 is equal to or higher than the lower limit of the above range, the silver wire 18 can easily follow the deformation of the surrounding insulating portion 16 . Furthermore, the tensile strength of the silver wire 18 is preferably 380 N/mm ² or less, and more preferably 360 N/mm ² or less. When the tensile strength of the silver wire 18 is equal to or less than the upper limit of the above range, the silver wire 18 is less likely to buckle and sink into the insulating portion 16 , thereby making the connection stable. The lower limit and upper limit of the tensile strength of the silver wire 18 can be combined arbitrarily, and for example, it is preferably 200 N/mm ² or more and 380 N/mm ² or less.

Here, the tensile strength of the silver wire 18 is obtained, for example, using a tensile testing machine in accordance with JIS Z 2241, specifically, a tensile universal material testing machine using a stress sensor model UR-10N-D. RTI-1225 (manufactured by A&D Co., Ltd.), etc., perform a tensile test with a sample length (distance between upper and lower clamps) of 100 mm and a tensile speed of 20 mm/min. Divide the maximum value of the test force applied to the sample. It is determined based on the value obtained from the cross section of the sample.

The breaking point elongation of the silver wire 18 is preferably 0.90% or more, more preferably 1.00% or more, and even more preferably 1.10% or more. Furthermore, the breaking point elongation of the silver wire 18 is preferably 1.30% or less, more preferably 1.25% or less, and more preferably 1.20% or less. If the breaking point elongation of the silver wire 18 is within the range indicated by the lower limit and the upper limit, deformation of the silver wire can be easily suppressed during the product cutting step described below. The desired lower limit and upper limit of the breaking point elongation of the silver wire 18 can be combined arbitrarily. For example, 0.90 to 1.30% is preferred, 1.00 to 1.25% is preferred, and 1.10 to 1.20% is preferred.

The above elongation at break point is a value measured in accordance with JIS Z 2241.

The maximum point load of the silver wire 18 is preferably 0.14N or more, more preferably 0.15N or more, and even more preferably 0.16N or more. Furthermore, the maximum point load of the silver wire 18 is preferably 0.20N or less, more preferably 0.18N or less, and more preferably 0.17N or less. If the maximum point load of the silver wire 18 is within the range shown by the lower limit and the upper limit, damage to the electrodes of the electrical and electronic components to be inspected can be easily suppressed. The desired lower limit and upper limit of the maximum point load of the silver wire 18 can be combined arbitrarily, for example, 0.14~0.20N is better, 0.15~0.18N is better, and 0.16~0.17N is better.

The above maximum point load is a value measured in accordance with JIS Z 2241.

The 0.2% endurance load of the silver wire 18 is preferably 0.12N or more, 0.13N or more is better, and 0.14N or more is even better. Furthermore, the 0.2% endurance load of the silver wire 18 is preferably 0.18N or less, more preferably 0.17N or less, and more preferably 0.16N or less. 0.2% endurance load of Silver Line 18 The desired lower limit and upper limit can be combined arbitrarily, for example, 0.12~0.18N is better, 0.13~0.17N is better, and 0.14~0.16N is better.

The above 0.2% endurance load is a value measured in accordance with JIS Z 2241.

The maximum point load and 0.2% endurance load of the silver wire depend on the wire diameter of the silver wire. Therefore, the maximum point load and 0.2% endurance load of the silver wire can be adjusted by adjusting the wire diameter of the silver wire.

The silver wire 18 may also have a coating layer formed on its side. Examples of the material of the coating layer include gold, nickel, copper, and the like. The covering layer may be one layer or more than two layers.

From the viewpoint that unlike copper alloy wires such as brass wires and beryllium copper wires, the gold-plated silver wire does not form an oxide film and is a stable material, and also has good adhesion to the surrounding insulating portion 16, which will be described later. The experimental example uses a layer of gold-plated silver wire.

The cross-sectional shape in the direction orthogonal to the longitudinal direction of the silver wire 18 is not particularly limited, and examples thereof include a substantially circular shape, a substantially elliptical shape, and a substantially rectangular shape.

The wire diameter of the silver wire 18 can be, for example, 5 μm or more and 50 μm or less. The wire diameter of the silver wire 18 refers to the diameter of the smallest circle including a cross section orthogonal to the longitudinal direction of the silver wire 18 . When the side surface of the silver wire 18 has a coating layer, the wire diameter of the silver wire 18 also includes the coating layer.

The cross-sectional shapes and wire diameters of the plurality of silver wires 18 provided in the heterogeneous conductive connector 1 may be the same as each other or may be different from each other.

The end of the silver wire 18 on the first surface 16 a side of the insulating part 16 may protrude from the first surface 16 a of the insulating part 16 . Similarly, the end of the silver wire 18 on the second surface 16 b side of the insulating part 16 may protrude from the second surface 16 b of the insulating part 16 . The length of the portion of the silver wire 18 protruding from the first surface 16 a or the second surface 16 b of the insulating portion 16 can be, for example, 1 μm or more and 60 μm or less.

The adhesive forming the adhesive portion 14 is not particularly limited, and an example thereof is a conventional hardening adhesive. The adhesive forming the adhesive portion 14 may be a single type or two or more types.

The length and thickness of the bonding portion 14 can be set to a range that can sufficiently bond the adjacent conductive tape portions 12 to each other. For example, the length and thickness of the bonding portion 14 can be set to be the same as the length and thickness of the insulating portion. The width of the connecting portion 14 is not particularly limited, and may be, for example, 0.01 mm or more and 0.05 mm or less. The thickness, length and width of the connecting portion 14 can be obtained from the average of the values measured at ten randomly selected places.

In this example, the shape of the anisotropic conductive connector 1 when viewed in plan is a rectangle, but is not limited to a rectangle, and may also be a circle, an ellipse, a rectangle, a polygon, etc. The size of the anisotropic conductive connector 1 can be appropriately set according to the use. For example, it can be a rectangle with a length of 5 mm to 50 mm and a width of 5 mm to 100 mm.

The arrangement pattern of the silver wires 18 when viewing the different-sided conductive connector 1 from the thickness direction (Z direction) is not particularly limited. For example, a plurality of silver wires 18 arranged along the longitudinal direction (X direction) of each strip-shaped insulating portion 16 can be exemplified. The silver wires 18 are also arranged linearly in a two-dimensional array shape along the width direction (Y direction) of the insulating portion 16 . At this time, the pitch of the silver wires 18 arranged in the width direction (Y direction) of the insulating portion 16 may be the same as the pitch of the silver wires 18 arranged in the longitudinal direction (X direction) of the strip-shaped insulating portion 16 . Alternatively, the arrangement pattern of the silver wires 18 may also be staggered and offset.

When viewing the heterogeneous conductive connector 1 from the thickness direction, the wiring density of the silver wires 18 in the conductive portion 10 can be appropriately set according to the use. For example, it can be set to 10 wires/mm ² or more and 1,100 wires/mm ² or less. The wiring density of the silver wires 18 can be adjusted by adjusting the pitch of the silver wires 18 in the longitudinal direction of the insulating portion 16, the width of the insulating portion 16, the width of the bonding portion 14, and the like.

[Method for manufacturing anisotropic conductive connector]

The manufacturing method of the dissimilar conductive connector 1 will be described below.

There is no particular restriction on the manufacturing method of the different-square conductive connector 1. Except for using silver wire as the conductive wire, other conventional methods can be used. The manufacturing method of the dissimilar conductive connector 1 of this embodiment includes, for example, a chip forming step, a lamination step, and a cutting step described below.

(Chip formation step)

As shown in FIG. 3 , the first insulating layer 110 is formed on the surface of the base material 100 by using an insulating elastic material used to form the insulating portion 16 , and is parallel to the upper surface 110 a of the first insulating layer 110 at a certain distance. A plurality of silver wires 18 are arranged on the ground. There is no particular limitation on the base material 100 as long as the first insulating layer 110 can be formed on the surface thereof. Examples thereof include planar members such as resin sheets, metal plates, and glass plates.

As shown in FIG. 4 , a second insulating layer 112 is formed on the surface of the first insulating layer 110 using an insulating elastic material used to form the insulating portion 16 to cover the silver wire 18 to obtain a chip 114 .

(Layering step)

After the plurality of chips 114 are produced through the same steps, the unnecessary base material 100 is removed, and as shown in FIG. 5 , a chip laminate 118 in which the plurality of chips 114 are stacked via the adhesive layer 116 is produced. The adhesive used for the adhesive layer 116 is an adhesive that forms the adhesive portion 14 . In the chip laminated body 118, the longitudinal directions of the silver wires 18 included in the respective chips 114 are aligned.

(cutting step)

The cutter is cut from the upper surface 118 a side of the sheet laminated body 118 in a direction oblique to the longitudinal direction of each silver wire 18 to cut the sheet laminated body 118 , thereby obtaining a sheet-shaped heterogonal conductive connector 1 with a desired thickness. .

As described above, in the heterogeneous conductive connector 1 of the present invention, the flexible silver wire is provided obliquely to the thickness direction of the insulating portion. Therefore, even if, for example, repeated compression is performed during inspection of electrical and electronic parts, or when surface-mounted electrical and electronic parts repeatedly expand and contract due to changes in environmental conditions such as temperature and humidity, the electrodes in contact with the silver wire are less likely to produce wear marks. Reduces the accumulation of oxidized foreign matter and suppresses the increase in resistance value over time.

In addition, the heterogonal conductive connector of the present invention using silver wires is prone to thickness changes depending on the coplanarity of the electrodes to be connected.

Furthermore, if silver wires are used, they can be arranged at a narrow pitch corresponding to the impedance simulation results for high-frequency applications, etc. In addition, for electronic devices and module parts that are used for high-frequency characteristics, the thickness of the non-conductive connector can be thinned so that the conductive path can be the same thickness as surface-mounted solder. Therefore, it can be used in the same manner as when surface-mounted. Check the properties.

In addition, the different-square conductive connector of the present invention is not limited to the above-mentioned different-square conductive connector 1.

For example, the structure is not limited to the configuration in which the plurality of silver wires are respectively arranged to be inclined with respect to the second surface of the insulating part. The plurality of silver wires may be respectively arranged to be perpendicular to the second surface of the insulating part.

When the silver wire is perpendicular to the second surface of the insulating part, the repeated compression characteristics (durability) are worse than when the silver wire is arranged at an angle. However, the conduction path is formed as the shortest distance of the film thickness, so compared to the probe with a longer conduction path. Pin pins have a tendency to significantly suppress the attenuation of high-frequency characteristics. Furthermore, in surface mounting applications such as high-frequency devices such as LGA (Land Grid Array) and module parts, compared with ACF (Anisotropic Conductive Molding) and surface mounting with solder, it is easier to repair defects in the device. Replace.

In addition, the different-square conductive connector of the present invention may also have a conductive part that further includes an insulating part without a silver wire. Specifically, for example, the dissimilar conductive connector 2 illustrated in FIG. 6 may be used. The same parts in FIG. 6 as in FIG. 1 are denoted by the same symbols, and descriptions thereof are omitted.

The dissimilar conductive connector 2 includes a conductive portion 10A, which includes conductive strip portions 12 and strip-shaped insulating portions 20 that are alternately arranged in parallel along the width direction (Y direction) through the connecting portion 14 . The conductive strip portion 12 is provided with a plurality of silver wires 18 in a strip-shaped insulating portion 16 . The insulating part 20 is not provided with the silver wire 18 . In this way, the conductive part may also include a conductive tape part in which a plurality of silver wires are provided in the insulating part, and an insulating part in which no silver wires are provided.

The thickness and length of the insulating part 20 can be appropriately set according to the use. For example, the thickness and length of the insulating part 20 can be the same as those of the insulating part 16 . The width of the insulating portion 20 can be appropriately set depending on the wiring density of the silver wires 18 and the like, and can be, for example, 0.1 mm or more and 0.5 mm or less. An example of the material constituting the insulating portion 20 is an elastic material having the same insulating properties as the material constituting the insulating portion 16 , and the desired aspect is also the same.

For the same reason as the compression set of the insulating portion 16 , the compression set of the insulating portion 20 is preferably 20% or less, and more preferably 18% or less.

The different-square conductive connector of the present invention may also be a different-square conductive connector 3 as shown in FIG. 7 . The same parts in FIG. 7 as those in FIGS. 1 and 6 are denoted by the same reference numerals, and descriptions thereof are omitted.

The dissimilar conductive connector 3 has the same structure as the dissimilar conductive connector 2 except that it is provided with an attachment portion 22 in addition to the conductive portion 10A. The attachment portion 22 is attached to the side of the insulating portion 16 of the conductive portion 10A in the width direction (Y direction) through the bonding portion 14 .

The attachment portion 22 includes an insulating portion 24 that is rectangular in plan view, and an adhesive layer 26 provided on the first surface 24 a side of the insulating portion 24 in the thickness direction.

Since the dissimilar conductive connector 3 has the attachment portion 22, it can be directly attached to the side of the circuit board with the electrode terminals, electronic device parts, module parts and other electrical electronics in the inspection device through the adhesive layer 26. The side of the circuit board in the part where the electrodes are located. In addition, since the dissimilar conductive connector 3 can be integrated when attached to the circuit board, it can be easily applied to automatic manufacturing using machinery for electrical and electronic parts, inspection devices, and the like.

In recent years, electronic device parts and module parts have been miniaturized to save space in electronic equipment, and dummy electrodes (hold downs) are used for the purpose of improving surface mounting strength, so the number of electrodes is also large. Positioning of electrodes relative to each other is difficult. Furthermore, in electrical and electronic parts, inspection equipment, etc. that require multiple electrodes, it is very troublesome to rework if there is a defect. However, if it is a different-shaped conductive connector 3 attached through the adhesive layer 26, positioning is easier than surface mounting with soldering, and replacement during rework is also easy.

The shape and size of the insulating portion 24 can be set appropriately, and for example, it can be a rectangle with a length of 2 mm to 50 mm and a width of 5 mm to 100 mm.

An example of the material constituting the insulating portion 24 is an elastic material having the same insulating properties as the material constituting the insulating portion 16 , and the desired aspect is also the same.

The adhesive forming the adhesive layer 26 is not particularly limited, and an example thereof is a conventional hardening adhesive. The adhesive forming the adhesive layer 26 may be a single type or two or more types.

The thickness of the subsequent layer 26 can be set to a range that can stably attach the dissimilar conductive connector 3 to the substrate, for example, it can be set to 0.01 mm or more and 0.04 mm or less. The thickness of layer 26 can then be determined from the average of the values measured at ten arbitrarily selected locations.

〔Other conductive connector with frame〕

The heterogonal conductive connector of the present invention may incorporate a frame for positioning around it.

FIG. 8 shows the schematic structure of an example of a framed dissimilar conductive connector.

The frame-attached heterogonal conductive connector 4 is a ring-shaped frame member 30 coupled to the entire circumference of the heterogonal conductive connector 1 .

The central area of the frame member 30 is punched into a rectangular shape, and the different-square conductive connector 1 is combined with the adhesive material 32 in this area. The upper surface of the heterogeneous conductive connector 1 and the upper surface of the frame member 30 are substantially parallel to each other.

The frame member 30 is provided with a plurality of through holes 34 . When the framed dissimilar conductive connector 4 is surface mounted on a substrate or the like, for example, positioning pins are passed through the through holes 34 of the frame member 30 to fix the connector 4, thereby making it easy to surface mount the connector 4 on the substrate or the like.

In the example shown in FIG. 8 , the frame 30 has a rectangular shape when viewed from above, but it is not limited to this. The frame member 30 is not limited to an annular shape surrounding the entire circumference of the different-square conductive connector 1 , and may be partially coupled to one or a plurality of locations around the different-square conductive connector 1 .

The size of the frame member 30 can be appropriately designed according to the surface mounting target of the heterogeneous conductive connector 1 .

The material of the frame 30 is not particularly limited, and may be, for example, a resin frame, a metal frame, or the like.

The adhesive material 32 is a hardened product of the adhesive, and is selected to have heat resistance and cold resistance that can stably maintain the hardened state in the operating temperature range of the dissimilar conductive connector 1 . Specific examples thereof include acrylic resin, polysilicone, acrylic-modified polysilicone, and cyanoacrylate resin.

The bonding surface of the bonding material 32 of the frame member 30 may also be treated with a bonding aid in advance to improve the bonding strength.

The manufacturing method of the framed heterogonal conductive connector is not particularly limited. In addition to using the heterogonal conductive connector of the present invention, conventional manufacturing methods can be used.

Here, if the different-square conductive connector with a frame of the present invention is provided with the different-square conductive connector of the present invention, it is not limited to the different-square conductive connector 4 with a frame described above, and may be adapted according to the inspection device to be applied, Electrical and electronic parts, etc., change the design appropriately.

[Inspection device]

The anisotropic conductive connector of the present invention can be used in an inspection device for inspecting electrical and electronic parts such as electronic device parts and module parts.

FIG. 9 is a perspective view showing an example of an inspection device equipped with the different-square conductive connector of the present invention.

The inspection apparatus 5 of the example shown in FIG. 9 is equipped with the circuit board 50 which has an electrode terminal, the opposite conductive connector 1, the holder 52, and the plate 54.

The circuit board 50 may be a circuit board provided with electrode terminals, and for example, a printed wiring board may be used. In this example, the circuit substrate 50 is arranged on the board 54, but it is not limited to this aspect.

The material of the plate 54 is not particularly limited and may be made of resin or metal.

The holder 52 is a member for fixing the outer peripheral portion of the opposite conductive connector 1 to the circuit board 50 . The holder 52 in this example has a C-shape with a partially missing notch portion 52a on one side of the rectangular frame. In addition, the shape of the holder 52 is not limited to the shape of this example, and may be a frame shape without a notch, for example.

The material of the retainer 52 is not particularly limited and may be made of resin or metal.

In the inspection device 5 , the opposite conductive connector 1 is disposed on the circuit board 50 , and with the holder 52 further disposed thereon, the screws 53 are screwed into the screw holes of the holder 52 . Thereby, the outer peripheral part of the opposite-side conductive connector 1 is sandwiched between the circuit board 50 and the holder 52 , so that the opposite-side conductive connector 1 is fixed on the circuit board 50 . In this state, the electrode terminal provided on the circuit board 50 is in contact with the end of the silver wire 18 in the opposite conductive connector 1 on the circuit board 50 side.

For example, when inspecting the electrical and electronic components 200 including the circuit board with the flexible printed wiring board 210 as the inspection target, the flexible printed wiring board 210 is embedded in the opposite side conductive connector 1 on the circuit board 50 side. The T-shaped area on the opposite side to the area not in contact with the holder 52 is crimped there. Then, the electrode provided on the flexible printed wiring board 210 of the electrical and electronic component 200 is brought into contact with the end of the silver wire 18 in the opposite conductive connector 1 of the inspection device 5 on the side opposite to the circuit board 50 side.

Thereby, the electrode terminals of the circuit board 50 in the inspection device 5 and the electrodes of the flexible printed wiring board 210 to be inspected can be electrically connected via the silver wires 18 of the opposite conductive connector 1 to perform inspection.

The manufacturing method of the inspection device 5 is not particularly limited. In addition to using the different-square conductive connector of the present invention, a conventional method can be used.

In addition, if the inspection device of the present invention is equipped with the heterogeneous conductive connector of the present invention, the inspection device is not limited to the above-described inspection device 5, and the design can be appropriately changed according to the electronic device parts, module parts, etc. to which it is applied.

For example, the inspection device (socket) 6 illustrated in FIG. 10 may be used. The inspection device 6 includes a circuit board 60 having electrode terminals, an opposite conductive connector 1 , a holder 62 , and a plate 64 .

The circuit board 60 may be a circuit board provided with electrode terminals, and for example, a printed wiring board may be used. In this example, the circuit substrate 60 is arranged on the board 64, but it is not limited to this aspect.

The material of the plate 64 is not particularly limited and may be made of resin or metal.

The holder 62 is a member for fixing the outer peripheral portion of the different-square conductive connector 1 to the circuit board 50 and has a rectangular frame shape.

The material of the retainer 62 is not particularly limited and may be made of resin or metal.

In the inspection device 6 , the opposite conductive connector 1 is disposed on the circuit board 60 , and with the holder 62 further disposed thereon, the screws 63 are screwed into the screw holes of the holder 62 . Thereby, the entire outer circumference of the opposite-side conductive connector 1 is sandwiched between the circuit board 60 and the holder 62 , so that the opposite-side conductive connector 1 is fixed to the circuit board 60 . In this state, the electrode terminal provided on the circuit board 60 is in contact with the end of the silver wire 18 in the opposite conductive connector 1 on the circuit board 60 side.

During inspection, for example, a semiconductor device such as BGA, QFN, SOP, QFP, or CSP is embedded inside the holder 62 and pressed against the side of the opposite conductive connector 1 opposite to the circuit board 60 side. Then, the electrode of the semiconductor device is brought into contact with the end of the silver wire 18 in the opposite conductive connector 1 of the inspection device 6 on the side opposite to the circuit board 60 side.

Thereby, the electrode terminals of the circuit board 60 in the inspection device 6 and the electrodes of the semiconductor device can be electrically connected through the silver wires 18 of the opposite conductive connector 1 to perform inspection.

The manufacturing method of the inspection device 6 is not particularly limited. In addition to using the different-square conductive connector of the present invention, a conventional method can be used.

The inspection device of the present invention may also be provided with a frame-attached dissimilar conductive connector. More specifically, the inspection device can also fix the different-shaped conductive connector attached to the frame to the circuit board through positioning pins, holders, etc., and press-bond the circuit board of the electrical and electronic component to be inspected to the frame. The opposite side of the conductive connector is on the side opposite to the circuit board side.

Hereinafter, the present invention will be described in detail using examples, but the present invention is not limited to the following description.

[Initial connectivity evaluation test]

Using the following experimental equipment, place the heterogonal conductive connector on a gold-plated flat electrode, and measure the load value and resistance value when the heterogonal conductive connector is compressed by using a gold-plated pin electrode installed on the front end of the stress sensor. .

(test equipment)

Testing machine: Automatic load testing machine (MAX-1KN-M, manufactured by Japan Instrumentation System Co., Ltd.)

Stress sensor: JLC-M50N (50N)

Measuring electrode: Φ0.14mm gold-plated pin electrode, gold-plated flat electrode

Resistance meter: RM3545-02 (manufactured by HIOKI E.E.CORPORATION)

Measurement conditions: compression amount control (50% relative to the thickness of the non-conductive conductive connector)

Test speed: 1mm/min

[Experimental example 1]

A coating film (first insulating layer) with a thickness of approximately 0.025 mm made of unhardened polysiloxane rubber (manufactured by Shin-Etsu Chemical Co., Ltd.) was formed on the polyester film (base material), and Gold-plated beryllium copper wires (wire diameter 23 μm, breaking point elongation: 1.29%, maximum point load: 0.58N, 0.2% endurance load: 0.35N) are arranged in parallel on the film at intervals of about 0.05mm as conductive wires. A coating film (second insulating layer) with a thickness of approximately 0.025 mm covering these conductive lines is formed from polysilicone rubber and heated and hardened to obtain a chip. A plurality of chips are produced through the same steps, and the plurality of chips are laminated using an adhesive so that the longitudinal directions of each other's conductive lines are aligned in parallel to obtain a chip laminate.

The above-mentioned sheet laminate is cut into sheets so that the distance between the conductive lines in the longitudinal direction (X direction) and the width direction (Y direction) of the insulating part is both 0.05 mm, and the inclination angle θ of the conductive lines is 63.4 degrees. Anisotropic conductive connector with a thickness of 0.15mm.

An initial connectivity evaluation test was performed on the obtained heterogonal conductive connector. The evaluation test results are shown in Figure 11.

[Experimental example 2]

A gold-plated silver wire (wire diameter 25 μm, breaking point elongation: 1.17%, maximum point load: 0.17N, 0.2% endurance load: 0.15N) was used as a conductive wire, and anisotropic conductive wires were produced in the same manner as in Experimental Example 1. connector, and conduct initial connectivity evaluation tests. The evaluation test results are shown in Figure 12 .

As shown in Figures 11 and 12, the different-square conductive connector of Experimental Example 2 using silver wires has a smaller compression of about 0.005mm compared to the different-square conductive connector of Experimental Example 1 using brass wires. amount, the resistance value also becomes smaller. In this way, the anisotropic conductive connector of Experimental Example 2 using silver wires can connect the silver wires to the electrodes with low resistance and low load.

[Evaluation test of repeated compression characteristics (durability)]

Using the following test equipment, an evaluation aid consisting of a backing plate is placed in a load testing machine, and an evaluation substrate, an anisotropic conductive connector, and a PKG guide (where "PKG" means PACKAGE (abbreviation for package). A gold-plated pin electrode with a commercially available dummy PKG installed on the front end was placed on the front end of the stress sensor. The dummy PKG was repeatedly pressed against the opposite conductive connector with a load value of 20N at a time, and the resistance value was measured.

(test equipment)

Testing machine: Automatic load testing machine (MAX-1KN-M, manufactured by Japan Instrumentation System Co., Ltd.)

Stress sensor: JLC-M50N (50N)

Virtual PKG: WLP64T.3C-DC088D (pitch: 0.3mm, solder ball: Φ0.2mm)

Measuring electrode: Φ1mm gold-plated pin electrode, evaluation substrate for WLP64 (daisy chain connection)

Resistance meter: RM3545-02 (manufactured by HIOKI E.E.CORPORATION)

Measurement conditions: Load control (20N)

Test speed: 6mm/min

Measurement interval: 25 times each (stop for 1 second during measurement)

Virtual PKG exchange frequency: every 5,000 times (repeated compression feature only)

[Experimental example 3]

A gold-plated beryllium copper wire (wire diameter: 23 μm, breaking point elongation: 1.29%, maximum point load: 0.58N, 0.2% endurance load: 0.35N) was used as the conductive wire, and the other side was produced in the same manner as in Experimental Example 1. conductive connectors, and conduct evaluation tests for repeated compression characteristics (durability). The evaluation test results are shown in FIG. 13 .

[Experimental example 4]

A gold-plated silver wire (wire diameter 25 μm, breaking point elongation: 1.17%, maximum point load: 0.17N, 0.2% endurance load: 0.15N) was used as a conductive wire, and anisotropic conductive wires were produced in the same manner as in Experimental Example 1. sexual connector, and conduct evaluation tests for repeated compression characteristics (durability). The evaluation test results are shown in FIG. 14 .

Here, Figures 13 and 14 summarize the data at the first compression just after the virtual PKG has been replaced every 5,000 times.

As shown in Figures 13 and 14, it can be seen that the resistance value of the non-directional conductive connector of Experimental Example 4 using silver wires almost did not increase until the number of compressions was about 45,000 times. Compared with the experiment using beryllium copper wires, The anisotropic conductive connector of Example 3 can fully suppress the increase in resistance value during continuous use.

[Experimental example 5]

Use gold-plated silver wire (wire diameter 25 μm, breaking point elongation: 1.17%, maximum point load: 0.17N, 0.2% endurance load: 0.15N, gold-plated layer directly formed on the silver wire) as the conductive wire, and the inclination angle is set to 90 That is, except that the silver wire was arranged perpendicular to the second surface, a different-square conductive connector was manufactured in the same manner as Experimental Example 1, and an initial connectivity evaluation test was performed.

As a result, the initial connectivity and repeated compression characteristics (durability) were slightly worse than the evaluation test results in FIGS. 12 and 14 because buckling of the conductive wire occurred.

1: Different square conductive connector

10: Conductive part

12: Conductive tape part

14:The next part

16:Insulation Department

16a: Side 1

18:Silver line

Claims (7)

An anisotropic conductive connector with: The strip-shaped insulating part is composed of insulating elastic material; and A plurality of silver wires penetrate from the first surface to the second surface in the thickness direction of the insulating part and are arranged at certain intervals along the longitudinal direction of the insulating part; The plurality of silver wires are respectively arranged perpendicularly or obliquely with respect to the second surface of the insulating part. The dissimilar conductive connector according to claim 1, wherein the tensile strength of the silver wire measured in accordance with Japanese Industrial Standard JIS Z 2241 is 200 N/mm ² or more and 380 N/mm ² or less. The dissimilar conductive connector according to claim 1, wherein a gold-plated film is formed on the side of the silver wire. The dissimilar conductive connector according to claim 1, wherein the compression permanent deformation of the insulating portion is 20% or less. A frame-attached heterogonal conductive connector is provided, in which a positioning frame is combined with at least a part of the periphery of the heterogonal conductive connector according to any one of claims 1 to 4. An inspection device for inspecting electrical and electronic parts. The inspection device is equipped with: The circuit substrate has electrode terminals; The dissimilar conductive connector described in any one of claims 1 to 4; and retainer; At least part of the outer peripheral portion of the opposite-square conductive connector is fixed to the circuit board by the holder; The electrode terminal is in contact with an end of the silver wire on the circuit board side in the opposite conductive connector; During the inspection, the electrical and electronic components are crimped to the area of the surface of the opposite-side conductive connector opposite to the circuit board that is not in contact with the holder, so that the electrodes of the electrical and electronic components are in contact with the opposite-side conductive connector. The end of the silver wire in the conductive connector that is opposite to the circuit board side is in contact with the silver wire. An inspection device for inspecting electrical and electronic parts. The inspection device is equipped with: The circuit substrate has electrode terminals; The framed dissimilar conductive connector described in claim 5; and retainer; At least part of the frame portion of the aforementioned frame-attached dissimilar conductive connector is fixed to the aforementioned circuit substrate by the aforementioned retainer; The electrode terminal is in contact with an end of the silver wire on the circuit board side in the frame-attached opposite conductive connector; During the inspection, the electrical and electronic parts are crimped to the area of the opposite side of the frame-attached opposite conductive connector that is opposite to the circuit board that is not in contact with the holder, so that the electrodes of the electrical and electronic parts are connected to In the frame-attached dissimilar conductive connector, the end of the silver wire on the side opposite to the circuit board side is in contact with the silver wire.

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