KR19990050952A - Socket for semiconductor device inspection - Google Patents

Abstract

A socket for semiconductor device inspection is proposed, which has a lead extending laterally for mounting the device on a mounting sheet of the socket body, whereby troublesome steps such as soldering are omitted, thereby greatly improving the productivity of the inspection process. The socket is

(a) a socket body mountable on a circuit board by positioning with a mounting sheet for a body of a semiconductor device in a form that can be freely separated;

(b) a circuit board having a resilient contact shoe extending outwardly in a mounting sheet of the socket body and having a resilient contact shoe extending between the socket body and the contact shoe when the semiconductor device is mounted on the mounting sheet; A lead frame in contact with the lead of the, and

(c) consisting of an anisotropic electrically conductive stretchable connector sheet inserted between the lead board and the circuit board to be contacted with the contact terminals of the electrode terminals of the circuit board on one surface and the contact shoes of the lead frame on the other surface; .

Description

Socket for semiconductor device inspection

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to sockets for testing semiconductor devices, and in particular, to a plurality of leads on aspects such as quad flat package (QFP), small outline package (SOP), plastic lead chip carrier (PLCC) and leadless chip carrier (LCC). A test socket for a surface mountable semiconductor package having a.

Performing a burn-in test on a semiconductor package is a conventional method using an IC socket to electrically connect between an electrode terminal of a semiconductor package and an electrode terminal of a testing circuit board. Known types of IC sockets include an IC body provided with a mounting sheet that can be mounted to a semiconductor package, pins or a plurality of leads fixed to the mounting sheet where the electrode terminals are connected to the side and bottom surfaces of the socket body having lead wiring, and the mounting sheet. It consists of a covering member rotatable up and down with a main shaft to open and close the upper opening of the.

When the covering member is moved to a position for closing the upper opening of the mounting sheet, the above-described covering member pressurizes the semiconductor package mounted on the mounting sheet in the downward direction so that the electrode terminal of the conductor package and the lid or the inside of the mounting sheet are pressed. The covering member provides a resilient cushioning member using a rubber pad or a spring to the lower surface of the covering member to uniformly apply the contact pressure between the above-mentioned contact points, while the pin of the socket in which the socket is visible is brought into contact with pressure. It is common to do IC sockets of this type can be soldered to the electrode terminals of the circuit board when the leads are provided on the sides of the socket body, or through the through holes of the circuit board when the pins are provided on the bottom of the socket body. It is mounted on a circuit board by inserting.

Since a plurality of electrode terminals are provided on the mounting sheet of the socket body and a number of leads or pins must be provided on the outer surface of the socket body, the above-described conventional IC socket increases the number of necessary parts and therefore has many problems in assembly work. There is a disadvantage that occurs.

This type of conventional IC socket complicates the design of the circuit board because the soldering work is included in the assembly work on the circuit board, thereby increasing the number of process steps, and especially when a pin is provided, a through hole must be formed in the circuit board. .

The object of the present invention is not only to have a simple structure that can be assembled into a relatively small number of parts in view of the above-described problems of the conventional socket, but also to provide an improved semiconductor device inspection socket having excellent high frequency characteristics and easy design of a circuit board. To provide.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a socket for inspecting a semiconductor device of the present invention separated by parts together with a semiconductor package and a circuit board.

2 is a vertical cross-sectional view of a socket for inspecting a semiconductor device of the present invention separated by parts;

3 is a plan view of the socket body;

4 is an enlarged schematic partial cross-sectional view of a socket for inspecting a semiconductor device of the present invention.

Fig. 5 is a partial bottom view of a lead frame of a socket for inspecting a semiconductor device of the present invention.

6A-6E are enlarged partial cross-sectional views of respective lead frames of different embodiments in the socket for semiconductor device inspection of the present invention.

7 is a schematic partial cross-sectional view of the stretchable connecting sheet in the socket for semiconductor device inspection of the present invention.

8A-8C are schematic partial cross-sectional views of respective stretchable connection sheets of different embodiments in a socket for semiconductor device inspection.

9 is an enlarged schematic partial cross-sectional view of an alternate embodiment of a socket for semiconductor device inspection.

* Description of the symbols for the main parts of the drawings *

10 semiconductor package 20 circuit board

30: socket body 31: mounting sheet

33: positioning pin 40: lead frame

42: contact sheet 43: electrical conductive layer

50: connector sheet 51: matrix sheet

52: filament 60: presser member

70: covering member

Accordingly, the present invention provides a socket for semiconductor device inspection, and in particular, to inspect a semiconductor device having electrode terminals or leads on the outer surface of the main body of the device by electrically connecting the leads or electrode terminals to the electrode terminals of the circuit board. For

(a) a socket main body having a mounting sheet for a main body of a semiconductor device in a form that can be freely separated, and which can be mounted on a circuit board by positioning;

(b) a leadframe inserted between a socket body and a circuit board having a contact shoe extending outward from the mounting sheet of the socket body, wherein the contact shoe is a semiconductor when the semiconductor device is mounted on the mounting sheet; An ideal lead frame in contact with the electrode terminal or lead of the apparatus, and

(c) an anisotropic electrically conductive stretchable connector sheet inserted between the circuit board and the lead frame such that it contacts the electrode terminals of the circuit board on one surface and the contact points of the contact shoes of the lead frame on the other surface. Is done.

In particular, the above-mentioned anisotropic electrically conductive stretchable connector sheet is a sheet member composed of a matrix of rubbery elastomer and a plurality of electrically conductive filament-shaped bodies inserted in parallel with each other through the matrix sheet from one surface to the other surface. Preferably, the rubbery elastomer is in the range of 20 ° H to 60 ° H in accordance with JIS K 6301, which is a type A rubber hardness, and the metallic filament has a volume resistivity not exceeding 10 ⁻¹ ohm · cm and 20 to 90 μm. It has a diameter within the range of. These metallic filaments are inserted into an insulating matrix sheet keeping a distance of 10 to 125 [mu] m from adjacent filaments, each filament being metallic in a direction inclined by an offset in the plane of the sheet and not exceeding half the thickness of the matrix sheet. Penetrate the sheet.

Moreover, the above-mentioned lead frame is a circuit board which can be bent and made of a base film made of an insulating resin penetrating one surface.

The above-mentioned contact shoes of the lead frame are each formed of an elastic metallic material such as phosphor bronze and beryllium copper, and the inside of the mounting sheet can be elastically bent in the form of an arch.

The contact point of the contact shoe of the lead frame has a rough surface and a sharp point so that it is possible to scratch and remove the contact film on the contact surface.

As described above, the socket for semiconductor device inspection provided by the invention, as an essential part, is inserted between the socket body as the element (a), the lead frame as the element (b), and between the element (a) and the element (b). As element (c), it consists of an elastic connection sheet. This socket is particularly suitable for the inspection of various types of semiconductor packages such as QFT, SOP, PLCC and LCC having lead and electrode terminals on the side of the apparatus main body.

Hereinafter, each element of the socket of the present invention will be described in detail with reference to the accompanying drawings.

The socket body 30 may be equipped with the semiconductor device 10 by accurate positioning and the socket body 30 in material and design so that it is possible to repeat mounting and detaching the semiconductor device 10 with a large number of times. Has high durability. The socket body 30 is subjected to adverse working conditions within a temperature of -60 to + 150 ° C such as epoxy resin, acrylic acid resin, polyester resin, polyphenylene sulfide resin, polyether sulfone resin and polyether imide resin. It is formed of synthetic resin which can withstand and the surface smoothness is good. The socket body can be formed by mechanical processing of resin blocks or by injecting these resins into a mold. Since the socket body is mounted on the circuit board by accurate positioning, positioning, such as positioning pin 33, as a means for enabling the socket body 30 to be freely mounted on the circuit board 20 and enabling separation. Preferably, a means is provided in the socket body 30. The mounting sheet 31 of the socket body 30 is an openwork or cavity having a shape and a size for fixing a molded part or a mounting substrate of the body 11 of the semiconductor package 10, and if necessary, positioning for the semiconductor package. Have the means.

If necessary, the socket body 30 is attached with a presser member 60 and a covering member 70. The presser member 60 is a semiconductor package (in the direction in which the contact shoes 42 of the lead 12 and the lead frame 40 are brought into contact with each other by the weight of the main body or by a spring or rubber member provided separately. 10) or a structure that pressurizes its leads. The covering member 70 is rotatable about a hinge around the hinge body along the side line of the socket body 30, is fixedly engaged with the socket body 30, and the covering member 70 is separated from the socket body 30. If so, it has a structure that is fixedly engaged with the socket body 30 by a claw. The covering member 70 may be formed of the same synthetic resin as the synthetic resin constituting the socket body 30. The covering body 70 directly presses the semiconductor package 10 downward, and indirectly presses the semiconductor package 10 downward by a rubber pad adhered to the lower surface of the covering member 70. Or pressurizing the semiconductor package downward from the top of the covering member 70 such that the lead 12 of the semiconductor package 10 and the contact shoe 42 of the lead frame 40 are brought into contact under an appropriate contact load. Is assembled to the socket body 30 by elastic means such as a spring.

The lead frame 40 is formed from a base sheet or plate made of synthetic resin, on one surface formed such that a plurality of contact shoes 42 are exposed. The contact shoe 42 preferably extends to the mounting seat 31 of the socket body 30 in an arcuate bent form. As a specific embodiment, the lead frame 40 may be a bendable substrate having contact shoes 42 made of a metal with good electrical conductivity, such as copper, which is patterned entirely on one side of the base sheet made of synthetic resin. . Since the lead frame 40 is almost the same as the requirement for the socket body 30, it can be formed of the same synthetic resin as the socket body 30. The contact shoes 42 of the lead frame 40 each have a size of 0.15 mm in thickness and 0.2 mm in width, respectively, and are formed of a flexible metal-containing material suitable for springs such as phosphor bronze and beryllium copper.

Optionally, the electrically conductive layer 43 is formed on the surface of the base sheet of the lead frame 40 against the contact shoe 42, and the electrically conductive layer 43 is grounded to shield against external electromagnetic waves. Indicates. Moreover, the electrically conductive layer 43 is connected to the power supply line through the chip capacitor, so that the influence of the flow of the power supply voltage is reduced and the impedance is easy to set. As a specific embodiment, the impedance of lead frame 40 is set to about 50 ohms relative to the high frequency signal for inspection. The contact shoes 42 are preferably provided with a plate layer made of gold or silver. For example, first, a lower plate layer made of nickel having a thickness of 0.5 to 3 mu m is formed on the contact shoes 42, and then an upper plate layer made of gold having a thickness of 0.05 to 5 mu m is formed. Moreover, the contact surface of the contact shoe 42 is roughened by sand blasting and a sharp tip projection is provided so that the oxidized surface film on the lid 12 of the semiconductor package 10 is scratched by this surface film destruction means. Can be destroyed.

The anisotropic electrically conductive stretchable connector sheet 50 has elasticity such as silicone rubber, stretchable thermosetting resin such as epoxy resin, synthetic rubber, and thermoplastic resin such as polyethylene resin, polyurethane resin, ABS resin and plastic polyvinyl chloride resin. It is a synthetic body composed of a matrix sheet 51 of polymeric material, and the micro metallic filaments 52 are inserted into the matrix sheet 51 in parallel with each other by passing the matrix sheet 51 from one surface to the other surface.

The matrix sheet 51 has a thickness in the range of 0.3 to 2.0 mm and a volume resistivity of at least 10 ¹² ohmcm. The stretchable polymer forming the matrix sheet 51 of the connector 50 has an A-type hardness in the range of 20 to 60 ° H, preferably has a hardness in the range of 30 to 60 ° H described in JIS K 6301. The fine metallic filament 52 has a diameter in the range of 20 to 90 μm, preferably has a diameter in the range of 20 to 70 μm, and the metallic material forming the filament 52 has a volume not increasing by 10 ⁻¹ ohm · cm. Have a resistance. The distribution density of the metallic filaments 52 sandwiched in parallel to the matrix sheet 51 is in the range of 70 to 1000 filaments per mm ² in the surface area of the matrix sheet 51 which keeps a distance of 10 to 125 μm from the adjacent filaments, Preferably it is the range of 100-1000 filaments. Each end of the metallic filament 52 should project 5 to 50 [mu] m out of the surface of the matrix sheet 51, preferably 5 to 30 [mu] m. Furthermore, each of the metallic filaments 52 runs perpendicular to the surface of the matrix sheet 51, but does not exceed half of the thickness of the matrix sheet 51 in the plane of the sheet surface x (shown in FIG. 7). Can be tilted to

As mentioned above, the socket for semiconductor device inspection of this invention consists of the socket body 30, and the lead frame 40 mounted on the circuit board 20 by accurate positioning by the positioning pin 33, In the lead frame 40, an anisotropic electrically conductive stretchable connector sheet 50 is inserted between the electrode terminal 21 on the circuit board and the contact shoes 42 of the lead frame 40. Therefore, the design of the circuit board 20 is simple because the socket has a simple structure composed of a small number of parts and can be assembled without soldering or other difficult means, and furthermore, no through-hole or other openwork needs to be formed in the circuit board 20. Becomes easier.

When inspecting the semiconductor package 10 using the socket of the present invention, the contact shoe 42 is electrically connected to the electrode terminal 21 on the circuit board 20 via the flexible connector sheet 50. The semiconductor package 10 is mounted on the mounting sheet 31 of the socket body 10 by accurate positioning, and the lead 12 or the electrode terminal of the semiconductor package 10 is connected to the contact shoes of the lead frame 40 ( 42) to allow electrical conduction. That is, each electrode terminal 12 of the semiconductor package 10 alternately electrically conducts with the metallic filament 52 of the connector sheet 50 in contact with the electrode terminal 21 on the circuit board 20. Contact shoes of the lead frame 40 having elasticity in order for the arcuate bent tip shoes 42 to electrically conduct between the contact shoes 42 of the 40 and the electrode terminals 12 of the semiconductor package 10. Contact with (42). The advancing direction of the metallic filament 52 in the matrix sheet 51 of the connector sheet 50 is a direction inclined by the offset x, not a direction perpendicular to the surface of the sheet, and the electrode terminal 12 of the semiconductor package 10 The position of and the position of the electrode terminal 21 on the circuit board 20 are located apart from each other by a distance corresponding to the offset x.

In the embodiment where the lead frame 40 is in the form of a bendable circuit board, the lead frame 40 can be designed using the versatile design rules applied to the bendable circuit board so that excellent high frequency characteristics can be achieved. have.

Since the contact shoes 42 of the lead frame 40 made of an elastic copper alloy are used, the lead 12 and the contact shoes 42 of the semiconductor package 10 with excellent durability with excellent reliability are very reliable. There is an advantage that can be obtained from.

When the surface film destruction means described above is provided at each contact shoe 42 of the lead frame 40 at the contact point, the electrical conductivity between the contact shoe 42 and the lead of the semiconductor package 10 is excellent, because This is because the surface film is effectively removed even when the contact surface of the lid 12 is covered with the oxidized surface film.

Moreover, the above-mentioned demand for the flexible connector sheet 50, which is anisotropic electrically conductive, is important for ensuring reliable electrical conductivity between the semiconductor package 10 and the lead frame 40 with respect to the proper elasticity and excellent durability of the sheet. Do. In addition, when the two or more terminal electrodes 21 on the circuit board 20 can be connected to the single contact shoes 42 of the lead frame using the appropriate connector sheet 50, the inspection of the semiconductor package 10. An advantage can be obtained by using different modes of test signals through different sets of electrode terminals 21 on the circuit board 20 so that the efficiency of the inspection process is greatly improved.

Hereinafter, the socket for a semiconductor device inspection of the present invention will be described in more detail with reference to the accompanying drawings.

Fig. 1 is a perspective view showing a socket of the present invention consisting of a socket body 30, a lead frame 40, and a connector sheet, separated into parts, together with a circuit board, and the QFP type semiconductor package 10 is a square plane, covering. And a presser member 60 inserted between the member 70 and the semiconductor package 10 and the covering member 70. In particular, the semiconductor package 10 has a plurality of lead arrays 12 extending out of four sides of the mold body 11 arranged at a standard pitch and a mold body 11 in the form of a square plate. Each lead 12 has a curved configuration like an arch.

The circuit board 20 is an electrode terminal arranged at a standard pitch along four sides of a square or rectangular area corresponding to the openwork of the socket body 30 provided as the mounting sheet 31 for receiving the semiconductor package 10. A group of 21 is provided on the surface of the circuit board. The circuit board 20 is provided with a mounting hole 22 proximate each corner in a square or rectangular area and two positioning holes 23 at almost the center point of two opposite sides of the square or rectangular area described above. As will be described later, since each of the mounting holes 22 corresponds to one of the mounting holes 32 of the socket body 30, the socket body 30 and the circuit board 20 have a set of mounting holes 22 and 32. ) May be tightened together by bolts and nuts (not shown). The positioning holes 23 correspond to the positioning pins on the lower surface of the socket body 30, and each positioning pin is inserted into the corresponding positioning hole 23. As shown in FIG.

The socket body 30, which is square or rectangular in shape, is formed by injection molding or from blocks of resins such as epoxy resins, acrylic resins, polyester resins, polyphenylene sulfine resins, polyether sulfone resins or polyether imide resins. It is formed by machining. The socket body 30 has an open work or unprotected opening cavity to serve as a mounting sheet 31 for the semiconductor package 10, and on the lower surface four of the square or rectangular regions against the mounting sheet 31. Along the lateral line a mounting cavity 39 (shown in FIG. 4) is provided. Each of these mounting cavities 39 is provided such that the lead frame 40 and the flexible connecting sheet 50 are positioned and mounted and tightened by screws. Further, the form of the mounting sheet 31 is in the form of a square or a rectangle corresponding to the mold body 11 of the semiconductor package 10 which can be inserted into and mounted in the mounting sheet 31. Positioning bank 35 is provided at each corner of mounting sheet 31 to facilitate mounting of semiconductor package 10 to mounting sheet 31 accurately and quickly, and connecting cavity 36 is provided with positioning bank 35 ( It is formed on the lower surface of the (shown in Figure 2).

Each positioning bank 35 is a slope 35A facing the adjacent positioning bank 35 at the corner of the mounting seat 31 and a vertical plane 35B parallel to the vertical plane 35B of the positioning bank 35 at the corner. As well as a positioning notch 35C that has a right-angle planar row. Each inclined surface 35A is inclined such that the lead of the semiconductor package 10 mounted on the mounting sheet 31 is guided to the connection cavity 36. The lead 12 on the connection cavity 36 is approximately equal in length to the length of the array of leads 12 on one side of the semiconductor package 10 facing each other near the corner. Define the position of. The distance between the diagonally facing positioning notches 35C is approximately equal to the diagonal length of the mold body 11 of the semiconductor package 10, which serves to position the mold body 11.

The socket body 30 is provided with a positioning pin 33 on each bottom surface facing the circuit board 20, which positioning pin is embedded in a position proximate to one of the back circumferences of the body 30. A recess 37 is formed on the other side to engage and a mounting through hole 32 is formed near four corners of the socket body 30. When the socket body 30 is mounted on the circuit board 20, each positioning pin 33 is inserted into and fixed to one of the positioning holes 23 of the circuit board 20, and the mounting hole of the socket body 30 ( 32 and the mounting holes 22 of the circuit board 20 are penetrated together by bolts and tightened by nuts (not shown in the figure). After mounting the semiconductor package 10 to the mounting sheet of the socket body 30, the compactor member 60 is mounted on the semiconductor package 10 and the cupping member 70 is placed thereon and the socket body 30 is placed thereon. ) Is fastened to the socket body 30 by the engaging means of the engaging recess 37 and the engaging claw 71.

As shown in Fig. 4, the lead frame 40 has a plurality of contact shoes 42 bonded to and insulated in a standard interval arrangement on the lower surface of the base film 41 made of an insulating resin such as a polyimide resin and a polyester resin. The upper surface of the resin film 41 is covered with an electrically conductive layer 43 made of, for example, an electrically grounded copper foil. Each contact shoe 42 is adhered to the base film 41 on the contact point 42A, and the other end of the contact shoe extends in a cantilever form and bent arcuately to form a comb-tooth arrangement. An electrically conductive layer 43 is connected to the electrical power source via the chip capacitor to reduce the effects caused by the flow of the voltage source. The lead frame 40 can be prepared by a conventionally known printed circuit board manufacturing method by using a patterning technique, for example.

The contact shoe 42 is an elastic spring member made of elastic metallic material such as phosphor bronze and beryllium copper and made in the form of a fine ribbon 0.2 mm wide and 0.15 mm thick. An end portion of the contact shoe 42 against the contact point 42A attached to the lower surface of the base film 41 extends over the contact hole 36 in a form that allows elastic bending. As shown in a plan view in FIG. 5, the ends of the contact points 42A of each contact shoe 42 are formed to have a curved outline having a diameter larger than the width of the shoe itself so as to have good adhesion to the base film 41. These circular ends of the contact shoes 42 are arranged in a zigzag or staggered manner, making it possible to make the arrangement pitch even finer.

As shown in FIG. 6A, since the cantilevered extension end of the contact shoe 42 is in contact with one of the leads 12 of the semiconductor package 10, it is not necessary, but not necessarily, oxidized on the surface of the lead 12. Forming a sharp contact point 42B at or near the extended end provided as a surface film breaking point to break the surface film by scratching prevents electrical conductivity therebetween even when the surface of the lid 12 is covered with an insulating oxide film. It is an advantage that makes it good. The contact shoe 42 preferably has such elasticity that the elastic displacement of the end point is in the range of 0.3 to 0.5 mm when a load of 30 gF is applied to the end point.

6B-6E illustrate alternative embodiments relating to the contact state between the contact shoes 42 and the leads 12 of the semiconductor package 10, respectively. In the embodiment shown in FIG. 6B, a rivet head-shaped hemisphere protrusion 42F is provided on the contact surface of the contact shoe 42 or the protrusion will be a conical or pyramidal protrusion 42G with a sharp vertex shown in FIG. 6C. Can be. Moreover, as shown in Figs. 6D and 6E, the contact shoe 42 can be brought into contact with the lead 12 at the edge end sharply formed by cutting. Of course, it is also effective when the contact shoes are in contact with the leads 12 of the semiconductor package 10 when the contact shoes have a contact surface that is roughened by sandblasting.

Furthermore, the contact shoes 42 is provided with a plating layer made of an expensive metal such as gold on at least the contact surface of the lid 12 of the semiconductor package 10 to lower the contact resistance and increase the corrosion resistance for reliable electrical conductivity. It is desirable to. A metal plating layer having a thickness of 0.03 to 1.0 mu m, for example 0.5 mu m, is formed on the lower plating layer made of nickel having a thickness of 2 to 6 mu m, for example 3 mu m.

Hereinafter, the flexible connector sheet 50 to be fitted between the socket body 30 or the lead frame 40 and the circuit board 20 will be described. As shown in partial sectional view in FIG. 7, the flexible connector sheet 50 is made of an insulating matrix sheet 51 made of rubber and a plurality of fine filaments 52 made of a metallic material respectively inserted in parallel to the insulating matrix sheet 51. The end points of each filament are exposed on each surface of the matrix sheet 51 and protrude out, so that when the connector sheet 50 is sandwiched between two electrode terminals under an appropriate compressive load, the electrode The terminals travel in a direction substantially parallel to the thickness of the connector sheet 50 and are electrically connected through the conductive filaments 52 of the connector sheet 50. In the inspection socket of the present invention, the flexible connector sheet 50 is placed in the groove 39 or the mounting cavity of the socket body 30 and glued with an adhesive, so that the connector sheet 42A has a lead on one surface thereof. The array of contact points 42A of the frame 40 is in contact, and on the other surface the electrode terminals 21 on the circuit board 20 are in contact.

The insulating matrix sheet 51 of the connector sheet 50 has, for example, a thickness of 0.3 to 2.0 mm and the rubbery material forming the matrix sheet 51 has a volume resistivity of at least 10 ¹² ohm · cm and 20 ° H. To a rubber hardness of from 60 ° H., preferably to A type hardness according to JIS K 6301. The rubbery material forming the matrix sheet 51 may include, but is not particularly limited to, thermosetting rubbery polymers such as silicone rubber, epoxy rubber and other synthetic rubbers, and polyethylene resins, polyurethane resins, ABS resins and plastic polyvinyl chloride resins. Likewise selected from the stretchable thermoplastic resin, silicone rubber is not only good for high durability and heat resistance to withstand the environmental adverse conditions, but also excellent in electrical properties.

The metallic fine filaments 52 have a diameter in the range of 20 to 90 μm, preferably in the range of 20 to 70 μm, and exceed 0.1 ohm cm as pure gold, gold-based alloys, solder alloys, copper and copper alloys. It is made of a metallic material with a volume resistance that does not, and if desired, has a plated layer of gold or solder alloy. Typically, the insertion density of the metallic filament 52 of the insulating matrix sheet 51 is in the range of 70 to 1000 filaments per mm ² , preferably in the range of 70 to 1000 filaments per mm ² , with each filament being 10 from the adjacent filaments. To a distance of from 125 μm, preferably from 50 to 100 μm. The advancing direction of the metal filament is basically perpendicular to the surface plane of the matrix sheet 51, but as shown in FIG. 7, an offset value x between two end points of the filament 52 in the surface of the matrix sheet 51. Can be inclined at an angle that does not exceed half of the thickness of the matrix sheet 51.

8A to 8C show, respectively, in a vertical cross-sectional view, different embodiments of the connector sheet 50 for changing the end point of the metallic filament 52. FIG. 8A shows that the end of the filament 52 is bent and cut sharply to have an effect of breaking the oxide surface film on the electrode terminal to which the end point 52A is in contact in order to ensure a reliable electrical connection of the end point 52A. The example which formed the edge part 52A is shown.

In the embodiment shown in FIG. 8B, the end of the filament 52 is in the form of a ball point 52B having a diameter larger than the diameter of the filament 52 itself, and in the embodiment shown in FIG. 8C, the hemisphere bump 52c ) Is formed on the end surface of the filament 52 by a gold plating technique. The connector sheet 50 shown in Figs. 8A to 8C has the advantage of being formed between the surface of the electrode terminal and the metal filament 52 so that the reliability of the electrical connection is improved.

The compactor member 60 (shown in FIG. 1) consists of a square or rectangular rigid substrate and faces the semiconductor package 10 at a position corresponding to one of the leads 12 of the semiconductor package 10. Four pressure bars 62 are respectively provided on the one side of the side line of the substrate 61. The substrate 61 and the pressure bar 62 may be formed by molding the same synthetic resin as the socket body 30 as a whole. The presser member 60 is mounted on the semiconductor package 10 to the mounting sheet 31 of the socket body 30 in such a manner that four pressure bars 62 are in contact with one of the arrays of leads 12. The lead 12 against the contact shoe 42 of 40 is to be pressurized downward. The presser substrate 61 has a guide hole 63 for guiding the guide pin 73 of the covering member 70 which is inserted in a form that can be freely slid when the covering member 70 is mounted on the presser member 60. Is provided.

In addition, the covering member 70 is in the form of a square or rectangular substrate, and two engagement claws 71 are provided on opposite sides of the substrate. The interlocking claws 71 are supported in a major axis at approximately intermediate heights by support pins (not shown in the figure) in recesses notched on the side of a square or rectangular substrate in a freely rotatable form. The engagement claw 71 has a claw edge 71A protruding therein along the lower end line, the covering member 70 is mounted on the socket body 30 together with the semiconductor package 10, and the press member 60. ) Are sandwiched therebetween, and the claw edge 71A is recessed in the notch of the socket body 30 to be tightened with respect to the socket body 30 by a torsion spring (not shown) provided around one of the support pins. In engagement with 37, the covering member 70 and the socket body 30 are tightened together by holding the semiconductor package 10 and the presser member 60 under a suitable pressure load. Engaging claw 71 is provided along the upper periphery with a raised rib 71B which serves as an anti-slip member to facilitate hand gestures for releasing engagement.

Moreover, the covering member 70 is provided with four spring pins 72 each penetrating the substrate by screwing in such a way that the protruding length protruding out of the lower surface of the substrate is adjustable. Two guide pins 73 are inserted so as to project out of the lower surface of the substrate along one of the opposite sides of the substrate at a position corresponding to the guide opening 63 of the press member 60.

The spring pin 73 has a structure consisting of a shell body having a hexagonal opening to be fitted into the substrate of the covering member 70 by screwing and a plunger stored in the shell body and tightened downward by a spring. When the covering member 70 is mounted on the press member 60, the plunger projecting out of the lower surface of the covering member 70 comes into contact with the upper surface of the press member 60 and the contact pressure therebetween is such as a wrench. Proper adjustment can be made by rotating the shell body using an adjustment tool.

Preferably, the guide pin 73 is made of a metallic material. By protruding out of the lower surface of the covering member 70 in a symmetrical position corresponding to the guide hole 63 of the compactor member 60, the covering member 70 is adapted to move the compactor member 60 up and down. When mounted on 60), each guide pin 73 passes through the guide hole 63.

The covering member 70 is not an essential part of the socket for inspection of the semiconductor package, in which a suitable contact load is ensured between the lead 12 of the semiconductor package 10 and the contact shoe 42 of the lead frame 40. In other words, a good contact state is associated with one of the leads 12 by appropriately selecting the body weight of the compactor member 60, which allows for omission of the covering member 70, for example, so that a sufficient contact load can be obtained. About 30 gf contact load per single pair of one of the contact shoes 42 can be obtained.

First, upon mounting the socket of the invention on the circuit board 20, the lead frame 40 is mounted to the socket body 30 by accurate positioning in accordance with the mounting of the flexible connector sheet 50. That is, the lead frame 40 is mounted to have a contact shoe 42 extending over the contact opening 36 of the socket body 30. The contact point 42A of the contact shoe 42 is in contact with the surface of the flexible connector sheet 50. Next, the positioning pin 33 of the socket body 30 is inserted into each positioning hole 23 of the circuit board 20, and the circuit board 20 and the socket body 30 are mounted on the socket body 30. It is fastened together by the bolt which penetrates the hole 32 and the mounting hole 22 of the circuit board 20, respectively. Therefore, the assembly of the socket body 30 and the circuit board 20 can be performed without soldering. Moreover, the lead frame 40 and the flexible connector sheet 50 are removed from the circuit board 20 so that any contaminants by soldering remain so that the circuit board 20 can be repeatedly used in case of deterioration or damage. Can be easily separated.

The burn-in test of the semiconductor package 10 can be easily performed with the socket of the present invention by mounting the semiconductor package 10 on the mounting sheet 31 of the socket body 30, and the socket body 30 is a semiconductor package 10. ) And together to ensure a suitable contact load of about 30 g between one pair of contact shoes 42 and one of the leads 12 for a reliable electrical connection between the electrode terminals 21 on the circuit board 20. It can be stabilized in position by the covering member 70 and the compactor member 60 which are tightened and mounted.

FIG. 9 is a diagram showing a modified embodiment of the socket of the present invention mounted on the circuit board 20 by the partial enlarged vertical cross-sectional view. In this embodiment, the circuit board 20 is provided with two sets of electrode terminals 21A and 21B, each set serving as a different testing mode from the other set, and one and the second set of the first set terminals 21A. Since one of the terminals 21B is brought into contact with the single contact shoe 42 at the same time by the insertion of the flexible connector sheet 50, the semiconductor package is inspected in two different testing modes by switching the operating sets 21A to 21B of the terminals. It can be a test.

According to the above description, the present invention has a lead extending laterally for mounting the device on the mounting sheet of the socket body, thereby greatly improving the productivity of the inspection process since troublesome steps such as soldering are omitted, In view of the above-described problems of the conventional socket, not only has a simple structure that can be assembled into a relatively small number of parts, but also has excellent high frequency characteristics and facilitates the design of a circuit board.

Claims (5)

A socket for inspecting a semiconductor device having a lead on the upper surface of the main body of the device by electrically connecting the lead to an electrode terminal of the circuit board for inspection, (a) a socket main body having a mounting sheet for a main body of a semiconductor device in a form that can be freely separated, and which can be mounted on a circuit board by positioning; (b) a contact shoe inserted between the socket body and the circuit board and extending outwardly from the mounting sheet of the socket body against the circuit board, wherein the contact shoe is connected to the mounting sheet by the semiconductor device. A lead frame in contact with the lead of the semiconductor device when mounted, and (c) an anisotropic electrical conducting contact between the electrode terminal of the circuit board on one surface and the contact point of the contact shoe of the lead on the other surface and inserted between the circuit board and the lead frame A socket for testing a semiconductor device, comprising an adult stretchable connector sheet. The sheet of claim 1, wherein the anisotropic electrically conductive stretchable connector sheet is comprised of a matrix of electrically insulating rubber elastomer and a plurality of electrically conductive filaments inserted parallel to each other through one of the surfaces of the matrix from one surface to the other. A socket for a semiconductor device inspection, which is a member. 3. The electrically insulating rubber elastomer forming the matrix of the anisotropic electrically conductive stretchable connector sheet has an A-type hardness specified by JIS K 6301 in the range of 20 ° H to 60 ° H. Socket for semiconductor device inspection. The socket for semiconductor device inspection according to claim 1, wherein the contact point of the contact shoe of the lead frame has a rough surface or a sharp point to make it possible to scratch and remove the surface film on the contacted surface. 2. A press member according to claim 1, further comprising a presser member mountable on said socket body for separating said lead of a heat shield device mounted on said mounting sheet of said socket body with a contact load against said contact shoe of said lead frame. A socket for a semiconductor device inspection, characterized in that.